US20110132484A1 - Valve Assemblies Including Electrically Actuated Valves - Google Patents

Abstract

A valve chip may include a substrate having first and second faces and openings between the first and second faces, and a plurality of flexible valve flaps on one of the faces of the substrate with each flexible valve flap being associated with at least one of the openings. The valve chip may be packaged by forming a frame having an opening therein, and securing the valve chip in the opening of the frame. More particularly, the valve chip may be secured in the opening so that central portions of the first and second faces of the substrate are exposed through the opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate. Related valves, valve assemblies, and methods are also discussed.

Description

RELATED APPLICATIONS
• This application claims the benefit of priority as a divisional of U.S. application Ser. No. 12/247,081 filed Oct. 7, 2008, which is a divisional of U.S. application Ser. No. 11/188,294 filed Jul. 22, 2005, which claims the benefit of priority to U.S. Provisional Application No. 60/590,483 filed Jul. 23, 2004, and to U.S. Provisional Application No. 60/590,669 filed Jul. 23, 2004. The disclosures of U.S. application Ser. Nos. 12/247,081, 11/188,294, 60/590,483, and 60/590,669 are hereby incorporated herein in their entirety by reference. This application is also related to U.S. Utility application Ser. No. 11/188,139 filed Jul. 22, 2005, and entitled “Methods Of Operating Microvalve Assemblies And Related Structures and Devices”, the disclosure of which is hereby incorporated herein in its entirety by reference.
FIELD OF THE INVENTION
• The present invention relates to the field of valves, and more particularly to microvalves and microvalve assemblies and related methods.
BACKGROUND
• A conventional solenoid driven pneumatic valve may be used to control a fluid flow. When electrically energized or de-energized, a solenoid driven pneumatic valve may cut off and/or permit one or more fluid flows. An actuator of a solenoid driven pneumatic valve is an electromagnet. When the valve is energized, a magnetic field builds up to pull and/or push a plunger against the action of a spring. When de-energized, the plunger returns to its original position by action of the spring. Solenoid driven pneumatic valves are discussed, by way of example, in the reference “Technical Principles Of Valves” (omega.com, One Omega Drive, Stamford, Conn., 06907, J-3 to J-7), the disclosure of which is hereby incorporated herein in its entirety by reference.
• A flow of air (or other fluid) through a valve may be a function of a number of controlled port connections and a number of switching positions. Directional valve functionalities may be described by referring to them as a combination of “ways” and “positions”, such as, for example, a 4-way 2-position valve also referred to as a 4/2-way valve. The term “way” defines a number of controlled flow paths the valve has (indicated by arrows in ISO symbology). With respect to the term “position”, a pneumatic directional valve may have two or three switching positions (indicated by squares in ISO symbology).
• In a conventional 5-way, 2-position solenoid driven pneumatic valve (a 5/2 valve), fluid flows may be controlled between first and second actuator ports, first and second exhaust ports, and an air supply port. When the solenoid is energized, the 5/2 valve may provide fluid coupling between the air supply port and the first actuator port, and between the second actuator port and the second exhaust port. When the solenoid is de-energized, the 5/2 valve may provide fluid coupling between the air supply port and the second actuator port, and between the first actuator port and the first exhaust port. A 5/2 valve may thus be used to control operation of a pneumatic actuator coupled to the actuator ports.
• A solenoid driven pneumatic valve, however, may be subject to mechanical wear that may reduce a useful life thereof. In addition, functionalities provided by a solenoid driven pneumatic valve may be limited. Moreover, a solenoid driven pneumatic valve may be unable to maintain an energized position in the event of a loss of power.
SUMMARY
• According to some embodiments of the present invention, a valve assembly may include a main housing defining five chambers, four valves, and a controller. A first chamber may be coupled to a low pressure exhaust port, a second chamber may be coupled to a first actuator port, a third chamber may be coupled to a high pressure supply port, a fourth chamber may be coupled to a second actuator port, and a fifth chamber may be coupled to a low pressure exhaust port. Moreover, a first valve may be between the first and second chambers wherein the first valve allows or substantially blocks fluid communication between the first chamber and the second chamber responsive to a first electrical signal; a second valve may be between the second and third chambers wherein the second valve allows or substantially blocks fluid communication between the second chamber and the third chamber responsive to a second electrical signal; a third valve may be between the third and fourth chambers wherein the third valve allows or substantially blocks fluid communication between the third chamber to the fourth chamber responsive to a third electrical signal; and a fourth valve may be between the fourth and fifth chambers wherein the fourth valve allows or substantially blocks fluid communication between the fourth chamber and the fifth chamber responsive to a fourth electrical signal.
• Moreover, the controller may be configured to generate the first, second, third, and fourth electrical signals for the respective valve assemblies, and the controller may be configured to advance the valves through a sequence of conditions. In a first condition, the second and fourth valves may be opened and the first and third valves may be closed so that fluid communication is allowed between the second and third chambers and between the fourth and fifth chambers and so that fluid communication is substantially blocked between the first and second chambers and between the third and fourth chambers. In a second condition after the first condition, the second valve may be opened and the first, third, and fourth valves may be closed so that fluid communication is allowed between the second and third chambers and so that fluid communication is substantially blocked between the first and second chambers, between the third and fourth chambers, and between the fourth and fifth chambers. In a third condition after the second condition, the second and third valves may be opened and the first and fourth valves may be closed so that fluid communication is allowed between the second and third chambers and between the third and fourth chambers and so that fluid communication is substantially blocked between the first and second chambers and between the fourth and fifth chambers. In a fourth condition after the third condition, the third valve may be opened and the first, second, and fourth valves may be closed so that fluid communication is allowed between the third and fourth chambers and so that fluid communication is substantially blocked between the first and second chambers, between the second and third chambers, and between the fourth and fifth chambers. In a fifth condition after the fourth condition, the first and third valves may be opened and the second and fourth valves may be closed, so that fluid communication is allowed between the first and second chambers and between the third and fourth chambers and so that fluid communication is substantially blocked between the second and third chambers and between the fourth and fifth chambers.
• According to additional embodiments of the present invention, a valve assembly may include a housing having a first chamber coupled to a low pressure exhaust port, a second chamber coupled to a first actuator port, a third chamber coupled to a high pressure supply port, a fourth chamber coupled to a second actuator port, and a fifth chamber coupled to a low pressure exhaust port. The valve assembly may also include a first valve between the first and second chambers, a second valve between the second and third chambers, a third valve between the third and fourth chambers, and a fourth valve between the fourth and fifth chambers.
• The second and fourth valves may be opened and the first and third valves may be closed to provide a first condition so that fluid communication is allowed from the third chamber to the second chamber and from the fourth chamber to the fifth chamber and so that fluid communication is substantially blocked between the first and second chambers and between the third and fourth chambers. After the first condition, the second valve may be opened and the first, third, and fourth valves may be closed to provide a second condition so that fluid communication is allowed from the third chamber to the second chamber and so that fluid communication is substantially blocked between the first and second chambers, between the third and fourth chambers, and between the fourth and fifth chambers. After the second condition, the second and third valves may be opened and the first and fourth valves may be closed to provide a third condition so that fluid communication is allowed from the third chamber to the second chamber and from the third chamber to the fourth chamber and so that fluid communication is substantially blocked between the first and second chambers and between the fourth and fifth chambers.
• After the third condition, the third valve may be opened and the first, second, and fourth valves may be closed to provide a fourth condition so that fluid communication is allowed from the third chamber to the fourth chamber and so that fluid communication is substantially blocked between the first and second chambers, between the second and third chambers, and between the fourth and fifth chambers. After the fourth condition, the first and third valves may be opened and the second and fourth valves may be closed to provide a fifth condition so that fluid communication is allowed from the second chamber to the first chamber and from the third chamber to the fourth chamber and so that fluid communication is substantially blocked between the second and third chambers and between the fourth and fifth chambers.
• According to yet additional embodiments of the present invention, a valve may include a substrate having first and second opposing faces, a plurality of holes through the substrate between the first and second faces, and a pair of input pads thereon. A plurality of flexible valve flaps may be provided on the substrate with each flexible valve flap being associated with at least one respective hole in the substrate, and the flexible valve flaps may be configured to open or substantially block respective holes responsive to an electrical signal applied to the pair of input pads. In addition, a frame may surround and support the substrate at edges thereof so that central portions of the first and second faces of the substrate are exposed through an opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate.
• According to more embodiments of the present invention, a valve chip may include a substrate having first and second faces and openings between the first and second faces, and a plurality of flexible valve flaps on one of the faces of the substrate with each flexible valve flap being associated with at least one of the openings. A frame may be formed having an opening therein, and the valve chip may be secured in the opening of the frame. More particularly, central portions of the first and second faces of the substrate may be exposed through the opening in the frame and a fluid seal may be provided between the frame and edges of the substrate.
• According to still more embodiments of the present invention, a valve assembly may include a main housing defining first, second, and third chambers, and defining a first valve enclosure between the first and second chambers and a second valve enclosure between the second and third chambers. First, second, third, and fourth electrical housing leads may be provided in the main housing with portions of each of the first and second electrical housing leads being exposed in the first valve enclosure and with portions of the third and fourth electrical housing leads being exposed in the second valve enclosure.
• A first valve in the first valve enclosure may be electrically coupled with the first and second electrical housing leads wherein the first valve is configured to allow or substantially block fluid communication between the first and second chambers responsive to electrical signals provided on the first and second electrical housing leads. A second valve in the second valve enclosure may be electrically coupled with the third and fourth electrical housing leads wherein the second valve is configured to allow or substantially block fluid communication between the second and third chambers responsive to electrical signals provided on the third and fourth electrical housing leads. Moreover, a controller may be electrically coupled to the first, second, third, and fourth electrical housing leads, and the controller may be configured to generate the electrical signals to allow or substantially block fluid communication between the first and second chambers and between the second and third chambers.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a cross-sectional view of an electro-statically actuated valve according to some embodiments of the present invention.
• FIG. 2 is a plan view of a valve chip including an array of electro-statically actuated valves according to some embodiments of the present invention.
• FIG. 3 is a schematic diagram of a valve assembly according to some embodiments of the present invention, depicted here controlling a pneumatic actuator.
• FIGS. 4A-F are schematic diagrams illustrating sequences of operations of valve assemblies according to some embodiments of the present invention.
• FIG. 5 is a front view of a packaging frame for a valve chip according to some embodiments of the present invention.
• FIG. 6 is a plan view of a packaged valve chip according to some embodiments of the present invention.
• FIG. 7 is a front view of a packaging frame for a valve chip according to some embodiments of the present invention.
• FIG. 8 is a plan view of a packaged valve chip according to some embodiments of the present invention.
• FIG. 9 is a plan view of electrical leads for a packaging frame according to some embodiments of the present invention.
• FIG. 10 is an exploded view of a main housing according to some embodiments of the present invention.
• FIG. 11 is a back perspective view of the main housing ofFIG. 10 shown assembled according to some embodiments of the present invention.
• FIG. 12 is a front perspective view of the main housing ofFIG. 10 shown assembled according to some embodiments of the present invention.
• FIG. 13 is a bottom perspective view of the main housing ofFIG. 10 according to some embodiments of the present invention.
• FIG. 14 is a perspective view of an electronics sub-assembly according to some embodiments of the present invention.
• FIG. 15 is a front perspective view of a printed circuit board of the electronics sub-assembly ofFIG. 14 according to some embodiments of the present invention.
• FIG. 16 is a transparent view of the electronics sub-assembly ofFIG. 14 according to some embodiments of the present invention.
• FIG. 17 is a back perspective view of a printed circuit board of the electronics sub-assembly ofFIG. 14 according to some embodiments of the present invention.
• FIG. 18 is a perspective view of a base of a valve assembly according to some embodiments of the present invention.
• FIG. 19 is a front perspective view of a valve assembly according to some embodiments of the present invention with encapsulation of the electronics sub-assembly shown transparent.
• FIG. 20 is a perspective view of the valve assembly ofFIG. 19 according to some embodiments of the present invention with non-metallic portions of the main housing excluded to show an orientation of leads of the main housing relative to valve chip assemblies.
• FIG. 21 is a bottom perspective view of the main housing ofFIG. 19 with packaged valve chip assemblies inserted in enclosures thereof.
• FIG. 22 is a back perspective view of the valve assembly ofFIG. 19 assembly according to some embodiments of the present invention with encapsulation of the electronics sub-assembly shown transparent.
• FIG. 23 is a front view of a baffle according to some embodiments of the present invention.
• FIGS. 24 and 25 are plan views from different sides of a packaged valve chip according to some embodiments of the present invention.
• FIG. 26 is an exploded view of packaged valve chips according to some embodiments of the present invention.
• FIG. 27 is a plan view of electrical leads for a packaging frame according to embodiments of the present invention.
• FIG. 28 is an exploded view of a main housing according to some embodiments of the present invention.
• FIG. 29 is a back perspective view of an assembled main housing according to some embodiments of the present invention.
• FIG. 30 is a front perspective view of an assembled main housing according to some embodiments of the present invention.
• FIG. 31 is a bottom perspective view of a main housing according to some embodiments of the present invention.
• FIG. 32 is an enlarged cross-sectional view of an enclosure of a main housing and a packaged valve chip taken along portions of section line I-I′ ofFIGS. 29 and 30 according to some embodiments of the present invention.
• FIG. 33 is a perspective view of a valve assembly according to some embodiments of the present invention with non-metallic portions of the main housing excluded to show an orientation of leads of the main housing relative to the valve chip assemblies.
• FIG. 34 is a cross-sectional view of a valve assembly taken along section line I-I′ ofFIGS. 29 and 30 including filters according to some embodiments of the present invention.
• FIGS. 35 and 36 are perspective views of an electronics sub-assembly with a battery cover respectively closed and open according to some embodiments of the present invention.
• FIGS. 37 and 38 are top and bottom perspective views of a base for valve assemblies according to some embodiments of the present invention.
• FIGS. 39 and 40 are perspective views of valve assemblies according to some embodiments of the present invention.
• FIG. 41 is a block diagram illustrating functionalities of a custom circuit such as an Application Specific Integrated Circuit (ASIC) for electronic sub-assemblies according to some embodiments of the present invention.
• FIG. 42 is a schematic diagram of electronic sub-assemblies including a custom circuit according to some embodiments of the present invention.
• FIG. 43 is a table illustrating logic relationships between inputs and outputs of custom circuits according to some embodiments of the present invention.
• FIG. 44 is a table illustrating sequences for state transitions and polarity reversals according to some embodiments of the present invention.
• FIGS. 45A and 45B are tables illustrating pin definitions for custom circuits according to some embodiments of the present invention.
• FIGS. 46A and 46B are tables illustrating design parameters for custom circuits according to some embodiments of the present invention.
• FIGS. 47A and 47B are front and back perspective views of a valve assembly including a valve housing, a base, and an electronics sub-assembly according to some embodiments of the present invention.
• FIG. 48 is a perspective view of a common base configured to receive a plurality of valve housings and electronics sub-assemblies according to some embodiments of the present invention.
• FIGS. 49A and 49B are schematic diagrams illustrating a valve assembly for vacuum applications according to some embodiments of the present invention.
• FIG. 50A and 50B are perspective and cross-sectional views of an integrated pneumatic valve and cylinder assembly according to embodiments of the present invention.
DETAILED DESCRIPTION
• The present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
• In the drawings, thickness and/or widths of layers, regions, and/or lines are exaggerated for clarity. It will also be understood that when an element such as a layer, region or substrate is referred to as being on another element, it can be directly on the other element or intervening elements may also be present. In contrast, if an element such as a layer, region or substrate is referred to as being directly on another element, then no other intervening elements are present. Similarly, an element is referred to as being “connected to” or “coupled to” another element, it can be directly connected to or coupled to the other element or intervening elements may also be present. In contrast, when an element is referred to as being directly connected to or directly coupled to another element, then no other intervening elements are present. As used herein, the term and/or includes any and all combinations of one or more of the associated listed items.
• Furthermore, relative terms, such as beneath, over, under, upper, and/or lower may be used herein to describe one element's relationship to another element as illustrated in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as below other elements would then be oriented above the other elements. The exemplary term below, can therefore, encompasses both an orientation of above and below.
• It will be understood that although the terms first, second, third, etc. are used herein to describe various regions, layers, sections and/or steps, these regions, layers, sections and/or steps should not be limited by these terms. These terms are only used to distinguish one region, layer, section, or step from another region, layer, section, or step. Thus, a first region, layer, section, or step discussed below could be termed a second region, layer, section, or step, and similarly, a second region, layer, section, or step could be termed a first region, layer, section, or step without departing from the teachings of the present invention. Like numbers refer to like elements throughout.
• The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
• Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
• In a pneumatic actuator, two actuator chambers are separated by a piston, and pressure differentials in the actuator chambers are used to move the piston. A rod can be used to transfer movement of the piston to a device being actuated outside the actuator. Valve assemblies according to some embodiments of the present invention can be used to control air flow into and out of one or both actuator chambers of a pneumatic actuator.
• Valve assemblies according to some embodiments of the present invention may include a plurality of arrays of valves with each array of valves provided on a separate substrate. Each valve may include a valve orifice(s) through a substrate and an electro-statically actuated flexible valve flap used to gate the valve orifice(s). More particularly, each flexible valve flap may be anchored to the substrate at a first end and free at all other edges. In addition, the free end of each flexible valve flap may curl away from the substrate so that each flexible valve flap is normally open in the absence of an applied electro-static force. Valve flaps may be provided on a top surface of the substrate, and flow through an open valve orifice(s) may be from a high pressure on the bottom surface of the substrate to a low pressure on the top surface of the substrate.
• The structure of an individual valve according to some embodiments of the present invention is illustrated inFIG. 1. As shown inFIG. 1, thevalve100 may include a substrate101 (such as a silicon substrate), a fixedelectrode105 provided between first and second insulatinglayers103 and107 on a top surface of thesubstrate101, and aflexible electrode111 provided between third and fourth insulatinglayers109 and115. The fixed andflexible electrodes105 and111, for example, may each include a layer of a metal such as Ti, Cr, Au, Al, Cu, W, Pt, and/or other flexible conductive material such as a conductive polymer (e.g., polyanniline) and/or conductive oxide film (e.g., ITO). When using certain conductive metal films (e.g., Au, Ag, Al, Cu, and/or Pt), a thin adhesion layer (e.g., Ti and/or Cr) may be provided on upper and/or lower surfaces of the conductive metal film to provide proper adhesion to the insulating layers of the flexible flap. One or more of the insulatinglayers103,107,109, and115 may be layers of a polymer material, such as a polyimide or other photosensitive polymer. In alternative embodiments, one of the second insulatinglayer107 or the third insulatinglayer109 may be omitted, and/or the first insulatinglayer103 may be omitted. In addition or in an alternative, insulatinglayer107 and/or insulatinglayer109 may include a ceramic dielectric such as silicon oxide (SiO2).
• The third and fourth insulatinglayers109 and115 and theflexible electrode111 define aflexible valve flap117 adjacent a respective valve-orifice(s)119 through thesubstrate101. The valve hole may be formed by wet chemical etching and/or by deep reactive ion etching through the substrate. Theflexible valve flap117 may be configured to curl away from the top surface of the substrate to a normally open position in the absence of an attractive electro-static force between the fixed andflexible electrodes105 and111 to allow fluid passage from a bottom surface of thesubstrate101 through the valve-orifice(s)119 and past theflexible valve flap117 on the top surface of thesubstrate101. Thevalve100 may be closed by creating an attractive electro-static force between the fixed andflexible electrodes105 and111 so that theflexible valve flap117 blocks the valve orifice(s)119. More particularly, thevalve flap117 can be made to curl to the normally open position away from the top of thesubstrate101 by fabricating the insulatinglayers109 and115 to have predetermined stresses therein. Microelectromechanical electrostatic valve devices are discussed, for example, in U.S. Pat. No. 6,590,267 to Scott H. Goodwin-Johansson et al., entitled “Microelectromechanical Flexible Membrane Electrostatic Valve Devices And Related Fabrication Methods,” the disclosure of which is hereby incorporated herein in its entirety by reference. Electro-statically actuated valves may be provided according to embodiments of the present invention using valve flaps as discussed above with respect toFIG. 1 or using other moveable valve members such as micromachined diaphragms.
• An array ofvalves100_1-x,1-ymay be provided on the top surface of a single substrate to provide thevalve chip131 shown inFIG. 2. As shown inFIG. 2, a plurality ofvalves100_1-x,1-ymay be arranged in rows and columns on thechip131, with eachvalve100_1-x,1-yincluding a respective valve orifice(s)119 (or hole(s)) and flexible valve flap117 (as shown inFIG. 1). Moreover, the fixedelectrodes105 of eachvalve100_1-x,1-y, on thevalve chip131 may be electrically connected to each other, and theflexible electrodes111 of eachvalve100_1-x,1-yon thechip131 may be electrically connected to each other so that a voltage potential can be provided between the fixed and flexible electrodes to create an electro-static attraction there between. While a plurality of valves (with each valve including one valve flap and one orifice) are illustrated inFIG. 2, other arrangements may be provided for valve chips according to embodiments of the present invention. For example, a valve chip according to some embodiments of the present invention may include a single valve with a single valve flap and a single orifice. In an alternative, a valve chip may include one or more valves with at least one valve including a single valve flap used to open and close a plurality of orifices.
• Accordingly, the array ofvalves100_1-x,1-ycan be opened and closed in unison. More particularly, a closing electrical potential can be applied between the fixedelectrodes105 of the array and theflexible electrodes111 of the array to create an attractive electro-static force so that all of the flexible valve flaps117 close all of thevalve orifices119 on thevalve chip131. Similarly, an opening electrical potential can be applied between the fixedelectrodes105 of the array and theflexible electrodes111 to remove the attractive electro-static force so that all of the flexible valve flaps117 open all of thevalve orifices119 on thechip131. By providing the array of commonly actuatedvalves100_1-x,1-yon thechip131, thevalve chip131 can regulate a greater flow of fluid than would otherwise be possible with a single valve. Valve chips of different flow sizes (Cv) may thus be provided with flow sizes of up to 1.0 Cv. Flow sizes, for example, in the range of approximately 0.001 Cv to approximately 10 Cv may be provided. (As used herein, the flow coefficient Cv is based on the imperial units system and is defined as the flow of water through a valve at 60° F. in US gallon/minute at a pressure drop of 1 lb/in².) Flow sizes may be determined, for example, by a number of valves, a size of valve orifices, etc. A larger valve chip may thus provide a greater flow size. In an alternative, valves on a same chip could be individually addressed and operated separately.
• A schematic diagram ofvalve assemblies141 according to some embodiments of the present invention is illustrated inFIG. 3. As shown inFIG. 3, fourvalve chips131a-dseparate five chambers143a-eof thevalve assembly141. More particularly,valve chip131aseparates chambers143aand143b;valve chip131bseparateschambers143band143c;valve chip131cseparateschambers143cand143d; andvalve chip131dseparateschambers143dand143e. Thechambers143aand143eare coupled to respective lowpressure exhaust ports142aand142b; thechambers143band143dare coupled throughports146aand146btorespective chambers163aand163b(separated by moveable piston165) of thepneumatic actuator161; and thechamber143cis coupled to a highpressure supply port144c. Accordingly, thevalve chip131ais configured to allow or block fluid flow fromchamber143btochamber143a. Thevalve chip131bis configured to allow or block fluid flow fromchamber143ctochamber143b. Thevalve chip131cis configured to allow or block fluid flow fromchamber143ctochamber143d. Thevalve chip131dis configured to allow or block fluid flow fromchamber143dtochamber143e.
• According to some embodiments of the present invention, thevalve assembly141 and the pneumatic actuator161 (also referred to as a cylinder) may be produced separately and then coupled together. A customer may thus separately purchase valve assemblies and pneumatic actuators from the same or different vendors. According to other embodiments of the present invention, the valve assembly may be embedded (or integrated) in the pneumatic actuator so that the two are produced and/or sold as one unit.
• Sequential conditions of operation of thevalve assembly141 ofFIG. 3 are discussed in greater detail below with respect toFIGS. 4A-F according to some embodiments of the present invention. In one possible startup condition illustrated inFIG. 4A, valve flaps of allvalves100a-don thevalve chips131a-dare closed in a first condition at startup. The valves are maintained closed by applying attractive electrostatic forces to the valve flaps of the valves. In this startup condition, there is gauge pressure in thesupply chamber143conly, and there is no gauge pressure in any of the other chambers143a-band143d-e. During operations after startup, gauge pressure will be present in thesupply chamber143cand at least one ofchambers143bor143d. Thepiston165 androd167 are shown in the retracted position at startup by way of example.
• In a second condition ofFIG. 4B, valve flaps ofvalves100band100donvalve chips131band131dare opened while valve flaps onvalves100aand100cofvalve chips131aand131care closed. Because of the pressure differentials fromchamber143cto143band fromchamber143dto143e, valve flaps ofvalves100aand100ccan be opened by reducing/eliminating attractive electrostatic forces applied thereto so that the valve flaps curl to the normally open position. Accordingly, the pressure ofchambers143band163arises, thepiston165 androd167 extend, andchambers163band143dare exhausted throughchamber143eandexhaust port142b.
• In a third condition ofFIG. 4C, a sufficient equilibrium between the pressures ofchambers143dand143emay be achieved so that the valve flaps ofvalves100dofvalve chip131dcan be closed, and an attractive electrostatic force on the valve flaps is used to close thevalves100dofvalve chip131d. In a fourth condition ofFIG. 4D, valve flaps ofvalves100ccan be opened becausechamber143dwas previously exhausted in the condition ofFIG. 4C. An electrostatic force used to close valve flaps ofvalves100cis removed so thatvalves100care opened as valve flaps thereof curl to the normally open position as shown inFIG. 4D while thevalves100bare maintained open. By openingvalves100cbefore thepiston165 is fully extended, an increasing pressure inchambers143dand163bmay slow the piston motion.
• In a fifth condition ofFIG. 4E, an equilibrium can be achieved betweenchambers143band143cand the valve flaps ofvalves100bonvalve chip131bcan be closed by applying an attractive electrostatic force. Moreover, a pressure ofchamber143bcan be increased relative to that ofchamber143a.
• In a sixth condition ofFIG. 4F after increasing a pressure ofchamber143brelative to that ofchamber143a, the valve flaps ofvalves100aonvalve chip131acan be opened by removing an electrostatic force used to close the valve flaps ofvalves100aso that the valve flaps curl to the normally open position. Accordingly, thepneumatic actuator chamber163ais coupled to lowpressure exhaust port142athroughchambers143aand143b, and thepneumatic actuator chamber163bis coupled to highpressure supply port144cthroughchambers143cand143d. In the condition ofFIG. 4F, thepiston165 androd167 retract. Once pressures inchambers143cand143dequalize and pressures inchambers143aand143bequalize, thevalves100aand100cofvalve chips131aand131ccan be closed by applying attractive electrostatic forces to the valve flaps thereof and operations ofFIGS. 4A-4F can be repeated to extend and retract thepiston165 androd167.
• According to some embodiments of the present invention, thevalve chips131a-dof thevalve assembly141 may sequence through the conditions ofFIG. 4B toFIG. 4C toFIG. 4D toFIG. 4E toFIG. 4F to move thepiston165 androd167 from an extended position to a retracted position. Thevalve chips131a-dof thevalve assembly141 may sequence through the conditions ofFIG. 4F toFIG. 4E toFIG. 4D toFIG. 4C toFIG. 4B to move thepiston165 androd167 from a retracted position to an extended position.
• Sequencing operations discussed above with respect toFIGS. 4A-F may thus be used to extend and retract thepiston165. It will be understood, however, that not every command to extend the piston will result in extension or complete extension of the piston, and that not every command to retract the piston will result in retraction or complete retraction of the piston. For example, a next command may be received/initiated before a previous extension/retraction has been completed. More particularly, a next command may be received/initiated before a previous extension/retraction has been completed, for example, if a fault condition is detected, if a safety sensor is tripped, and/or if a power outage is detected.
• In an alternative, the valve chips of the valve assembly may sequence from the condition ofFIG. 4F to the condition ofFIG. 4D withvalve chips131aand131dclosed and with thevalve chips131band131copened. In another alternative, the valve chips of the valve assembly sequence from the condition ofFIG. 4F to a condition with thevalve chips131band131cclosed and the valve chips131aand131dopened.
• Sequencing techniques discussed above with respect toFIGS. 4A-F may increase a maximum pressure against which the valve assembly can operate to extend and retract the actuator. Any inherent operational restrictions to opening the valves in an array can be reduced because a higher pressure is present on the bottom surfaces of the valve chips. Restrictions may occur when closing a valve with a force from air pressure approximating an electro-static closing force of the valve. The valves may thus be selectively opened and closed to allow reduction of pressure differentials between adjacent chambers. By reducing pressure differentials between adjacent chambers, a condition can be created whereby valve flaps of a valve chip can be closed against a significantly lower pressure differential than was originally present. A relatively small delay of time (for example, on the order of about 100 microseconds) may be sufficient to reduce the pressure differential when closing valve flaps of a valve chip in a state where a relatively high pressure differential may have otherwise been present.
• Microelectromechanical valves are discussed, for example, in: U.S. Pat. No. 6,590,267 to Scott H. Goodwin-Johansson et al., entitled “Microelectromechanical Flexible Membrane Electrostatic Valve Devices And Related Fabrication Methods”; U.S. Pat. No. 6,236,491 to Scott H. Goodwin-Johansson et al., entitled Micromachined Electrostatic Actuator With Air Gap”; and/or International Publication No. WO 02/22492. The disclosures of each of these patents and publications is hereby incorporated herein in its entirety by reference.
• Moreover, a valve chip may be packaged using a frame according to some embodiments of the present invention as illustrated, for example, inFIGS. 5-9. Alternative embodiments of a packaged valve chip (each including avalve chip131 as discussed above with respect toFIG. 2) are illustrated inFIGS. 6 and 8. Corresponding embodiments of packaging frames without valve chips are illustrated inFIGS. 5 and 7, and embodiments of electrical leads without a frame are illustrated inFIG. 9.
• As shown, for example, inFIG. 5, apackaging frame211aaccording to some embodiments of the present invention may include abody213a, agasket215a, and electrical leads217. Theframe211ahas awindow219atherein and a recessedledge221asurrounding thewindow219a. In addition, atrough223amay surround theledge221a. A combined width of theledge221aandtrough223amay be in the range of approximately 0.025 inches to approximately 0.060 inches. More particularly, a combined width of theledge221aandtrough223amay be in the range of approximately 0.050 inches to approximately 0.060 inches. The electrical leads217 may be formed of stamped metal, and theelectrical leads217 may be plated with tin (approximately 150 micro inches) and then plated with gold (approximately 40 micro-inches). Thebody213amay be formed of injection molded insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof), and thegasket215amay be formed of an injection molded flexible sealing material such as rubber, viton, and/or silicone. Thegasket215amay provide a static fluid seal with respect to a main housing of a valve assembly.
• More particularly, thebody213amay be formed by injection molding insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) with theelectrical leads217 being provided as inserts in the mold. Moreover, thegasket215amay be formed together with thebody213ausing a two-shot molding process and/or an overmolding process. Theledge221amay be recessed relative to a surrounding portion of thebody213aso that a valve chip can be supported at edges thereof on one side by the ledge with top and bottom surfaces of the valve chip exposed for fluid communication therethrough. In addition, theledge221amay be sufficiently recessed so that a subsequently placed valve chip is also recessed within thebody213a. Moreover, portions of theelectrical leads217 are exposed adjacent thewindow219afor electrical connection (such as by wire bonding, solder bumping, conductive epoxy, or other means known to those having skill in the art) to a subsequently placed valve chip. In addition,notches225ain thebody213amay be provided adjacent portions of theledge221ato allow room for a tool to place a valve chip on the ledge with other portions of thebody213afitting more closely to the valve chip. Portions of thebody213asurrounding theleads217 may be angled (for example, at approximately 30 degrees) to provide wire bonding tip clearance. While injection molding is discussed herein by way of example, other molding techniques such as insert molding and/or blow molding may be used.
• An adhesive can then be provided in thetrough223a, and avalve chip131 can be placed on theledge221a, with thetrough223aproviding for placement, retention, and/or control of spreading of the adhesive until it is fully cured. More particularly, an adhesive bead having a width of approximately 0.015 inches may be used. The valve chip may be placed on theledge221awith accuracy of approximately 0.005 inches using optical sensor equipment. Accordingly, indication marks may be molded into thebody213aof the packaging frame. More particularly, indication marks may be molded to include perpendicular intersecting lines having an appearance similar to that of an “L”, a “T”, a “+”, or other similar characters. Moreover, the indication marks may have a depth of approximately 0.010 inches.
• An adhesive used to secure thevalve chip131 on theledge221amay be cured at approximately 150 degrees C. (302 degrees F.) for approximately 1 hour. In an alternative, the adhesive may be cured for a longer time at a lower temperature. Polycarbonate, for example, may be used for thebody213aand polycarbonate may have a melting temperature in the range of approximately 430 degrees F. to approximately 480 degrees F. To reduce deformation of thebody213a, however, adhesive cure temperatures may be maintained in the range of approximately 125 degrees F. to approximately 200 degrees F. In an alternative, a UV cured epoxy may be used as an adhesive.
• Portions229 of thebody213amay be deformed around the exposed edges of thevalve chip131 to provide the structure illustrated inFIG. 6. The adhesive may provide a fluid seal between thevalve chip131 and thebody213a, and thedeformed portions229 may secure the valve chip within thebody213a. More particularly,portions229 of thebody213amay be deformed using a heated tool (such as a heat stake) to retain thevalve chip131 within thebody213a. Accordingly, edges of thevalve chip131 may be supported on one side by theledge221aand on the other side by thedeformed portions229 of thebody213a. Moreover, a surface of thevalve chip131 adjacent theleads217 may be recessed approximately 0.010 inches relative to theleads217 and approximately 0.030 inches relative to a surface of thebody213asurrounding thenotches225a,ledge221a, andtrough223a.
• On thevalve chip131 all fixed electrodes may be electrically connected to a first input pad (such as a first gold bond pad), and all flexible electrodes may be electrically connected to a second input pad (such as a second gold bond pad), and the input pads may be electrically connected (e.g., via wire bonding such as gold wire bonding, solder bumping, conductive epoxy, or other means known to those having skill in the art) to exposed portions of respectiveelectrical leads217 adjacent thewindow219a. A glob-top potting231acan be used to protect the electrical connection between the input pads of thevalve chip131 and the electrical leads217. Portions of theelectrical leads217 are exposed on an edge of the body213 for electrical coupling to a main housing of a valve assembly.
• According to alternate embodiments shown, for example, inFIG. 7, a packaging frame211baccording to some embodiments of the present invention may include abody213b, ahousing gasket215b, and electrical leads217. The frame211bhas awindow219b(also referred to as a through hole) therein and a recessedledge221bsurrounding thewindow219b. In addition, achip gasket216bmay be provided on theledge221b.
• A width of theledge221bmay be in the range of approximately 0.025 inches to approximately 0.060 inches. More particularly, a width of theledge221bmay be in the range of approximately 0.050 inches to approximately 0.060 inches. The electrical leads217 may be formed of stamped metal, and theelectrical leads217 may be plated with tin (approximately 150 micro inches) and then plated with gold (approximately 40 micro-inches). Thebody213bmay be formed of injection molded insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof), and thegaskets215band216bmay be formed of an injection molded flexible sealing material such as rubber, viton, and/or silicone. Thegasket215bmay provide a static fluid seal with respect to a main housing. Thegasket216bmay provide a static fluid seal with respect to a valve chip placed thereon.
• More particularly, thebody213bmay be formed by injection molding insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) with theelectrical leads217 being provided as inserts in the mold. Moreover, thegaskets215band216bmay be formed together with thebody213busing a two-shot molding process and/or an overmolding process. Theledge221bmay be recessed relative to a surrounding portion of thebody213bso that a valve chip can be supported at edges thereof on one side by theledge221band thegasket216bwith top and bottom surfaces of the valve chip exposed for fluid communication therethrough. In addition, theledge221bmay be sufficiently recessed so that a subsequently placed valve chip is also recessed within thebody213b. Moreover, portions of theelectrical leads217 are exposed adjacent thewindow219bfor electrical connection (such as by wire bonding, solder bumping, conductive epoxy, or other means known to those having skill in the art) to a subsequently placed valve chip. In addition,notches225bin thebody213bmay be provided adjacent portions of theledge221bto allow room for a tool to place a valve chip on the ledge with other portions of thebody213bfitting more closely to the valve chip. Portions of thebody213bsurrounding theleads217 may be angled (for example, at approximately 30 degrees) to provide wire bonding tip clearance.
• Avalve chip131 can be placed on thegasket216b, with thegasket216bproviding a static fluid seal with respect to a valve chip placed thereon. In an alternative to thegasket216bor in addition, a stamped adhesive tape may be used to secure the valve chip to the ledge. The valve chip may be placed on thegasket216bwith accuracy of approximately 0.005 inches using optical sensor equipment. Accordingly, indication marks may be molded into thebody213bof the packaging frame. More particularly, indication marks may be molded to include perpendicular intersecting lines having an appearance similar to that of an “L”, a “T”, a “+”, or other similar character. Moreover, the indication marks may have a depth of approximately 0.010 inches.
• Portions229 of thebody213bmay be deformed around the exposed edges of thevalve chip131 to provide the structure illustrated inFIG. 8. Thedeformed portions229 may secure the valve chip against thegasket216bwithin thebody213b. More particularly,portions229 of thebody213bmay be deformed using a heated tool (such as a heat stake) to retain thevalve chip131 within thebody213b. Accordingly, edges of thevalve chip131 may be supported on one side by theledge221bandgasket216band on the other side by thedeformed portions229 of thebody213b. Moreover, a surface of thevalve chip131 adjacent theleads217 may be recessed approximately 0.010 inches relative to theleads217 and approximately 0.030 inches relative to a surface of thebody213bsurrounding thenotches225bandledge221b.
• Moreover, thevalve chip131 may be packaged before releasing the valve flaps117. More particularly, the valve flaps117 may be formed on a sacrificial oxide, and the sacrificial oxide may be maintained while thevalve chip131 is being assembled in the packaging frame. The sacrificial oxide may then be removed using a dry (vapor) HF (hydrofluoric acid) release without significantly damaging the packaging frame. More particularly, the packaging frame may be formed of viton and/or other materials which may be resistant to damage from a dry (vapor) HF release. While sacrificial oxide layers are discussed by way of example, other sacrificial layers (such as sacrificial metal layers) may be used with other suitable vapor and/or wet chemical etchants.
• In an alternative, valve flaps of a valve chip may be released by removing sacrificial oxide using a wet HF acid etch either before dicing from a wafer including a plurality of valve chips, after dicing but before packaging, or after packaging. More particularly, the sacrificial oxide layer may be removed from the valve chip using a 49% HF solution for approximately 10 minutes, and the wet etch may be followed by a de-ionized (DI) water rinse, an isopropyl alcohol rinse, and first and second methanol rinses for 20 minutes each to remove any residual HF and/or water. After the wet processing, the valve chip with the released valve flaps may be primed with methanol for a supercritical dry cycle to reduce any surface tension that may otherwise result in stiction between valve flaps and the substrate.
• More particularly, the valve chip may be loaded into a dryer chamber and covered with methanol, and liquid CO₂is then used to displace the methanol from the chamber at a pressure of approximately 1200 psig. Once all of the methanol is displaced, the chamber is heated past the supercritical point (approximately 31 degrees C.) to transition the CO₂from the liquid to gas phase, and the pressure is released to vent the system of CO₂vapor. Because supercritical CO₂has extremely low surface tension, CO₂is less likely to pull the valve flaps down as it transitions from liquid to gas. Commercially available and/or custom supercritical dryers may be used.
• Visual inspection can be used to determine that an acceptable number of the valve flaps on a valve chip are successfully released. In particular, a surface of the valve chip has a different color than exposed silicon under the flappers which is visible when the valve flaps are released and the valve chip is unpowered, and the color variations could be inspected. In an alternative, light can be projected through the wafer after release, and an optical detector could detect light differences between the powered (closed) and unpowered (open) valve chip. In either example, machine vision systems could be used to perform the inspections.
• On thevalve chip131 all fixed electrodes may be electrically connected to a first input pad (such as a first gold bond pad), and all flexible electrodes may be electrically connected to a second input pad (such as a second gold bond pad), and the input pads may be electrically connected to exposed portions of respectiveelectrical leads217 adjacent thewindow219b, for example, using wire bonding such as gold wire bonding, solder bumping, conductive epoxy, or other means known to those having skill in the art. A glob-top potting231bcan be used to protect the electrical connections between the input pads of thevalve chip131 and the electrical leads217. Portions of theelectrical leads217 are exposed on an edge of thebody213bfor electrical coupling to a main housing.
• Moreover, tooling used to mold packaging frames according to some embodiments of the present invention illustrated inFIGS. 5-8 may be adaptable so that packaging frames with the same outer dimensions are molded with different window dimensions using substantially the same mold tooling. For example, a same mold base could be used to form different packaging frames with different mold lids being used to provide different window sizes, shapes, and/or locations. Accordingly, packaging frames may be efficiently fabricated for valve chips of different sizes. More particularly, a smaller window may be provided for a smaller valve chip for an application requiring a lower fluid flow capacity, and the smaller window may be provided adjacent the electrical leads (instead of being centered) to provide proximity for wire bonding. By providing the packaging frames with the same outer dimensions for different valve chip sizes, a same main housing may receive packaged valve chips of different capacities/sizes to provide different operating characteristics.
• In addition, a baffle may be provided on the body (213aor213b) of the frame (211aor211b) to deflect pressure spikes and/or reduce stress on the electrostatic valve flaps of thevalve chip131. More particularly, the baffle may be provided on the body (213aor213b) within the gasket (215aor215b) adjacent the side of thevalve chip131 including the flexible valve flaps and input pads. Moreover, the baffle may be provided as a plate that is secured to the body (213aor213b) with an adhesive.
• An example of abaffle971 is illustrated inFIG. 23. As shown, thebaffle971 includes anorifice973 there through, and dimensions of thebaffle971 may be such that the baffle is slightly longer and wider than thevalve chip131 but slightly less than interior dimensions of the gasket (215aor215b). Accordingly, thebaffle971 may be secured adjacent and spaced apart from thevalve chip131 and within the gasket (215aor215b). Moreover, a recess may be provided in the body (213aor213b) of the frame in which thebaffle971 can be placed, and the recess may define a spacing between thebaffle971 and thevalve chip131. Moreover, thebaffle971 may be placed such that theorifice973 is adjacent a portion of thevalve chip131 most distant from the electrical leads217. By including thebaffle971, valve flaps of thevalve chip131 may be protected during handling and subsequent assembly. In addition, thebaffle971 may provide a more laminar flow though thevalve chip131, and/or increase the speed of sequencing a valve assembly including packaged valve chips with the baffle. In an alternative, use of the baffle may eliminate the need for sequencing. While thebaffle971 is illustrated with a single elongate orifice, different shapes, configurations, and/or orientations may be provided, and/or a plurality of orifices may be provided.
• The use of a baffle may provide a baffle chamber between the baffle and the associated valve chip with the valve flaps of the valve chip physically protected in the baffle chamber during handling and/or assembly. Moreover, an orifice(s) in the baffle may sufficiently restrict fluid flow so that a maximum force applied to the valve flaps of the valve chip may be reduced. In addition, a volume of the baffle chamber may be sufficiently small relative to the associated chamber of the valve housing so that a laminar fluid flow through the valve chip can be attained more quickly and so that fatigue of the valve flaps can be reduced. Baffles and sequencing operations (as discussed with respect toFIGS. 4A-F) can thus be used separately or in combination to increase pressures against which the valve chips can operate, to reduce fatigue, to improve flows, etc.
• Moreover, baffles with orifices of different sizes may be provided for different valve chips in a same valve assembly. A 5-way valve, for example, with baffles providing greater flows into actuator ports and more restricted flows out of actuator ports may provide relatively smooth piston motion and maximum piston velocities may be reduced.
• The packaged valve chips can be plugged in and out of a main housing as discussed in greater detail with respect toFIGS. 13 and 21. Accordingly, a valve assembly including one or more packaged valve chips may be repairable and/or adaptable. A valve assembly with a malfunctioning valve chip may thus be repaired by removing the packaged valve chip that is not working and inserting a new packaged valve chip. In addition, functionality of a valve assembly may be changed by replacing original packaged valve chips with new packaged valve chips having a different characteristic (such as different flow capacity and/or size of valve chip).
• A main housing according to some embodiments of the present invention is illustrated inFIGS. 10-13. More particularly, an exploded view of amain housing401 and associated components is illustrated inFIG. 10, and a bottom perspective view of the main housing is illustrated inFIG. 13. As shown in the bottom view ofFIG. 13, themain housing401 defines the valve assembly chambers143a-ediscussed above with respect to FIGS.3 and4A-F. Themain housing401 also includes enclosures403a-dconfigured to receive packaged valve chips (such as discussed above with respect toFIGS. 6 and 8) perpendicular to a length of the main housing. In addition,main housing401 includes conductive leads405 therein used to transmit signals to metal leads217 of the packaged valve chips in enclosures403a-d. In addition, abase gasket407 may be included to provide a fluid seal with respect to a base of the assembly (illustrated inFIG. 18), and aPCB gasket409 may be included to provide a seal for an external connection to theleads405 of the main housing.
• Themain housing401 may be formed by injection molding an insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) withconductive leads405 insert molded therein, and thegaskets407 and/or409 may be formed of a flexible sealing material using a two-shot molding process and/or an overmolding process. More particularly, the molding tool creates the five separate chambers143a-efor high pressure air supply and low pressure exhaust as discussed above with respect to FIGS.3 and4A-F. When injection molding the main housing, ahole411 may be included in the outside of the housing to accommodate formation of interior holes between chambers143a-e. Thehole411 in the outside of the housing may be sealed with aplug413 that may be glued, welded or otherwise affixed to seal thehole411. In addition, baffles may be provided adjacent valve chips to deflect pressure spikes and/or reduce stress on the electrostatic valve flaps. Baffles, for example, may be provided as plates in themain housing401 adjacent low pressure sides of the valve chips131. As discussed above, baffles may be provided on packaging frames used to package the valve chips before insertion into the main housing. Baffles may provide a more laminar flow though the valve chips, a speed of sequencing a valve assembly including baffles may be increased, and/or baffles may eliminate a need for sequencing.
• Themain housing401 may also have banjo fittings415a-b, O-rings417a-b, and collets419a-b(also referred to as quick connect fittings and/or cartridges) affixed thereto. More particularly, the collets419a-bmay be push-in style cartridges. More particularly, the banjo fittings415a-bmay be affixed to themain housing401, for example, using ultrasonic welding and/or an adhesive, and the banjo fittings415a-bare in fluid communication with thechambers143band143dof the valve assembly. The O-rings417a-band the collets419a-bmay then be inserted in the banjo fittings415a-bfor retention of air-tubes providing fluid communication with the pneumatic actuator chambers163a-b(shown inFIG. 3). Themain housing401 can be used to provide either a three-way valve or a five-way valve depending on the number of packaged devices used and locations thereof to control fluid flow by placing theplug413 at either the outermost edge of the fifth chamber (5-way) or between the third and fourth chambers (3-way).
• As discussed above, a microelectromechanical systems (MEMS)valve chip131 may be packaged in a frame to provide a packaged valve chip as illustrated, for example, inFIGS. 6 and/or8. Packaged valve chips may be plugged in and out of respective enclosures403a-dof themain housing401 so that the valve assembly is adaptable and/or repairable. Thegasket215aor215bof the packaged valve chip provides a fluid seal with the respective enclosure403a-dso that fluid communication between enclosures is only provided through openings in respective valve chips. Moreover, thevalve chip131 in a packaged valve chip is directional and thegasket215aor215bshould mate with a predetermined side of the particular enclosure so that the packaged valve chip is oriented in themain housing401 to provide the fluid flows between chambers143a-ediscussed above with respect toFIGS. 4A-F.
• In some embodiments of the present invention, it may be desirable to provide different fluid flows through different flow paths of the valve assembly. For example, different enclosures403a-dof themain housing401 may be populated with packaged valve chips providing different flow characteristics. More particularly, some of the enclosures403a-dmay be populated with packaged valve chips with relatively fewer and/or smaller valve orifices (holes), others of the enclosures may be populated with packaged valve chips with relatively more and/or larger valve orifices (holes), and all of the packaged valve chips may have the same exterior dimensions. In addition, packaged valve chips with relatively fewer and/or smaller valve orifices (holes) may be provided with baffles having relatively fewer and/or smaller baffle orifices (holes), and packaged valve chips with relatively more and/or larger orifices (holes) may be provided with baffles having relatively more and/or larger baffle orifices (holes). In an alternative, different flows may be provided by different packaged valve chips having the same number and sizes of valve orifices (holes) by providing baffles having different numbers and/or sizes of baffle orifices (holes).
• As discussed above, an interior dimension of a window of a frame used to package a valve chip can be varied to accommodate valve chips of different sizes without varying outer dimensions of the packaged valve chip assembly. A samemain housing401 may thus receive packaged valve chip assemblies in enclosures403a-dhaving different flow capacity characteristics. Stated in other words, the size of a MEMS valve chip may be varied to provide different flow characteristics (for example, in the range of approximately 0.001 Cv to approximately 10 Cv) while maintaining a same envelope geometry of the packaged valve chip.
• In addition, exposed portions of the metal leads217 on an edge of the packaged valve may mate with corresponding leads of themain housing401 to provide communication of electrical signals from outside the main housing with fixed and flexible electrodes of the valve chips plugged into enclosures403a-dof themain housing401.
• While not shown inFIGS. 10-13, filters may be provided in one or more of the chambers143a-eto protect the microvalves. For example, a filter inchamber143cmay protect microvalves from particles and/or other debris from a high pressure supply, and filters inchambers143band143dmay protect microvalves from particles and/or other debris introduced from the actuator during the exhaust cycle.
• An electronics sub-assembly501 for valve assemblies according to some embodiments of the present invention is illustrated inFIGS. 14-17. More particularly, a printedcircuit board503 may include electronic circuitry and/or software and/or firmware used to control operations of the valve chips131 included in themain housing401. For example, the printedcircuit board503 may include electronic circuitry and/or software to control and/or drive thevalve chips131 in accordance with operations discussed above with respect toFIGS. 4A-F as instructed by a remote device such as a programmable logic controller (PLC).
• The printed circuit board may includeintegrated circuit chips505, resistors, capacitors, and/or inductors thereon. In addition, leads507 on the printedcircuit board503 may provide electrical coupling with leads of themain housing401, and one or more connectors509 (such as Molex connectors) may provide electrical connection to a remote controller such as a PLC. The printed circuit board may be configured to provide a plurality of different operating characteristics with one particular programming characteristic being selected usingjumpers511 or other means such as a dip switch(es), shunt(s)510, etc. More particularly, the printed circuit board may include one or more custom circuits (for example, including application specific integrated circuit ASIC devices) as discussed below with respect toFIGS. 41-44,45A-B, and46A-B. Additional operations of valve assemblies and/or electronic sub-assemblies thereof are discussed in the U.S. Provisional Application No. 60/590,699 to Kevin Douglas et al., entitled “Methods Of Operating Electrostatically Actuated Microvalve Assemblies And Related Structures” and filed Jul. 23, 2004 (hereinafter “Douglas et al.”). The disclosure of this provisional application is hereby incorporated herein in its entirety by reference.
• During normal operation, the printedcircuit board503 may receive operating power along with control signals through connector(s)509. An alternate power source such as abattery513 may also be provided so that the printed circuit board can sequence thevalve chips131 to a predetermined default condition in the event of a power outage. While a battery is shown inFIG. 15, other alternate power sources (such as a capacitive storage device and/or a fuel cell) could be used. The printedcircuit board503 may also include a high voltage drive circuit (such as a multiple stage charge pump) used to drive the valve chip electrodes. For example, a 24V external power supply may be provided through theconnector509, and a high voltage drive circuit may generate a 150V output used to drive the valve chip electrodes throughleads507, leads405, and leads217. The printed circuit board may also include a transient voltage suppression (TVS) device517 (such as a pair of serially connected and opposing zener diodes).
• A controller of the electronic sub-assembly may be configured to monitor the external power supply, and upon detecting interruption of the external power supply, to advance thevalve chips131a-dto a predetermined default condition and to hold that default condition using energy provided from the alternate power source. Upon detecting interruption of the external power supply, for example, the current condition of thevalve chips131a-dmay be maintained. In an alternative, upon detecting interruption of the external power supply, the controller may close thevalve chips131a-dso that fluid communication is blocked between each of the chambers143a-e. In another alternative, upon detecting interruption of the external power supply, the controller may closevalve chips131b-candopen valve chips131aand131d. In still another alternative, upon detecting interruption of the external power supply, the controller may closevalve chips131aand131dandopen valve chips131b-c.
• The electronics sub-assembly501 including the printedcircuit board503 and thebattery513 may be encapsulated in an insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) as illustrated inFIGS. 14 and 16, for example, using an over-molding process. More particularly, an epoxy may be used that can be cured at a relatively low temperature and pressure to protect the electronics therein. An external geometry of the encapsulated electronics sub-assembly may be provided that fits on themain housing401 so that theleads507 of the printedcircuit board503 mate with theleads405 of themain housing401.
• In an alternative, a battery or other electrical power storage device may be removable from the electronics sub-assembly and/or a battery may be provided outside the encapsulation of the electronics sub-assembly. Accordingly, the battery may be more easily replaced. For example, a battery may be provided in a cable used to supply power and/or control signals to the electronics sub-assembly. Moreover, the electronics sub-assembly may include circuitry configured to charge the battery during normal operations using externally provided power. Accordingly, a life of a battery may be extended.
• Abase601 for valve assemblies according to some embodiments of the present invention is illustrated inFIG. 18. The base601 may be formed using a metal casting process. More particularly, thebase601 may be formed of a metal such as aluminum or stainless steel, and the exhaust ports142a-band thesupply port144cmay be threaded tapped holes. Additional screw tapped holes603a-bmay be used to secure themain housing401 onto thebase601. In addition, clearance and/or mounting holes605 (perpendicular to and/or parallel with the ports) may be provided in the base for mounting the valve assembly.
• By using a cast metal as the base, an integrity of the threads in the holes may be more easily maintained. Moreover, an epoxy finish may be provided on a cast aluminum base for protection and/or aesthetic purposes. In an alternative, thebase601 may be formed from an injection molded material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) using metallic inserts at threaded locations.
• The valve assembly may be completed by plugging packaged valve chips (such as illustrated inFIGS. 6 and 8) into enclosures in the bottom of the main housing401 (as shown inFIG. 21); securing the main housing (including the packaged valve chips therein) to the base601 usingscrews701; and plugging the electronics sub-assembly onto the main housing as shown in FIGS.19 and21-22.FIG. 20 illustrates the valve assembly with non-metallic portions of the main housing not shown so that leads of the main housing are visible, and so that interconnections ofleads217,405, and507 are visible.
• The same main housing, base, and electronics sub-assembly can be configured for either 5-way or 3-way valve operations. For 5-way operations, as discussed above with respect toFIGS. 4A-F, four packaged valve chips may be plugged into respective enclosures in the bottom of the main housing as shown, for example, inFIG. 21. For 3-way valve operations, a packaged valve chip may be plugged into each of the two enclosures most distant from the electronics sub-assembly, and a sealingplug413 may be plugged into the two enclosures closest to the electronics sub-assembly so thatchambers143d-eare permanently sealed. As discussed above, a same electronics sub-assembly may be configured to provide one of a plurality of modes of operation defined in memory (such as ROM, PROM, EPROM, EEPROM, etc.) depending on a selection made using a jumper(s), a switch(es), a shunt(s), a fuse(s), or other selection device that can be set during and/or after manufacture. For example, a same electronics sub-assembly can be used to control either 5-way, 4-way, 3-way, or 2-way operations depending on a switch, shunt, fuse, and/or jumper setting. For example, 3-way and 5-way valve operations are discussed in Douglas et al.
• In further alternatives, a main housing, base, and electronics sub-assembly can be configured for 4-way and/or 2-way valve operations. For 4-way operations, the base may be modified so that fluid coupling is provided betweenexhaust chambers143aand143eand a same exhaust port. Otherwise, 4-way operations may be provided with four valve chips as discussed above with respect toFIGS. 4A-F. In an alternative, 2-way operations may be provided using a single valve chip to provide a unidirectional on/off flow device. A 2-way device could be provided using the components ofFIGS. 10-13 with one valve chip and plugs substituted for other valve chips. In an alternative, a 2-way device could be provided using a smaller housing with one input port, one output port, and one enclosure for a single valve chip.
• According to some embodiments of the present invention, air paths can be independently controlled between each of the five chambers143a-ein a valve assembly configured for 5-way operations, so that the same valve assembly may function as an “All Cylinder Ports Exhausted” valve, as an “All Cylinder Ports Blocked” valve, or as an “All Cylinder Ports Energized” valve. A valve assembly according to some embodiments of the present invention may thus replicate the functionality of any commercially available valve type based on programming of the electronics sub-assembly, selection of a program of the electronics sub-assembly, and/or insertion of packaged valve chip assemblies and/or sealing plugs into enclosures of the main housing.
• Moreover, valve assemblies according to some embodiments of the present invention may provide independent control of airflow so that novel valve types may be implemented. With a back-up power source such as a battery, for example, a unique functionality may be provided when system power is lost. More particularly, the valve and pneumatic actuator may retain a last position during a power failure (as opposed to assuming a default condition).
• In addition, circuits, such as custom integrated circuit devices (e.g., application specific integrated circuit devices), for the electronics sub-assembly may provide different programs allowing the same physical valve assembly (including valve chips main housing, base, electronics sub-assembly, etc.) to provide functionality of any valve type. One of a plurality of programs of the electronics sub-assembly may be selected, for example, by pulling input pins to specific voltage levels, by programming a chip(s) of the electronic sub-assembly using an interface (such as a serial interface), selectively destroying fusible links, cutting and/or maintaining one or more jumpers, placing and/or omitting a shunt between two or more pins, selecting a position of a switch(es), etc.
• Valve assemblies according to additional embodiments of the present invention may use pulse width modulation to control a flow of fluid through the electro-statically actuated valves. For example, pulse width modulation may be used to open and close electro-statically actuated valve flaps at a predetermined frequency with a duty-cycle being used to determine a fluid flow through the valve. For example, a 100% duty cycle may provide a full flow, a 50% duty cycle may provide half flow, and 0% duty cycle may provide no flow. By using pulse width modulation to actuatevalve chips131a-d, for example, a speed at which therod167 extends and retracts may be controlled. Moreover, an acceleration and/or deceleration of therod167 may be controlled as the rod extends and/or retracts by varying the duty cycle as the rod extends or retracts. For example, respective valve chips may be actuated at a greater duty cycle at the beginning of extending and/or retracting to overcome inertia, and the respective valve chips may be actuated at a reduced duty cycle as the rod approaches the fully extended and/or retracted positions.
• Moreover, one or more filters may be provided in valve assemblies according to some embodiments of the present invention. Filters may be provided, for example, at highpressure supply port144cand/oractuator ports146aand146b. In addition or in an alternative, filters may be provided atexhaust ports142aand142b. Filters atsupply port144cand/orexhaust ports142aand142bmay be provided on and/or in thebase601 ofFIG. 18. Filters atactuator ports146aand146bmay be provided inside or outside themain housing401, inside oroutside banjo fittings415aand415b, and/or atcollets419aand419b. The use of filters may protect the valve assemblies from contaminants such as dust, oil, and/or water that may degrade operation of the valve assemblies by plugging valve orifices and/or reducing a seal between valve flaps and respective orifices when a valve is closed.
• Additional embodiments of a packaged valve chip (including avalve chip131 as discussed above with respect toFIG. 2) with a wedge shapedbaffle741, aframe711, and leads717, are illustrated inFIGS. 24-26. Electrical leads717 according to some embodiments of the present invention are illustrated inFIG. 27 separate from theframe711.
• As shown, for example, inFIGS. 24-26, apackaging frame711 according to some embodiments of the present invention may include abody713, agasket715, and electrical leads717. Theframe711 may have a window therein, a recessed ledge surrounding the window, and a trough may surround the ledge as discussed above with regard toFIGS. 5-6 and/or7-8. A combined width of the ledge and trough may be in the range of approximately 0.025 inches to approximately 0.060 inches. More particularly, a combined width of the ledge and trough may be in the range of approximately 0.050 inches to approximately 0.060 inches. The electrical leads717 may be formed of stamped metal, and theelectrical leads717 may be plated with tin (approximately 150 micro inches) and then plated with gold (approximately 40 micro-inches). Thebody713 may be formed of an injection molded insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof), and thegasket715 may be formed of an injection molded flexible sealing material such as rubber, viton, and/or silicone. Thegasket715 may provide a static fluid seal with respect to a main housing of a valve assembly.
• More particularly, thebody713 may be formed by injection molding an insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) with theelectrical leads717 being provided as inserts in the mold. Moreover, thegasket715 may be formed together with thebody713 using a two-shot molding process and/or an overmolding process. The ledge may be recessed relative to a surrounding portion of thebody713 so that a valve chip can be supported at edges thereof on one side by the ledge with top and bottom surfaces of the valve chip exposed for fluid communication therethrough. In addition, the ledge may be sufficiently recessed so that a subsequently placed valve chip is also recessed within thebody713. Moreover, portions of theelectrical leads717 are exposed adjacent the window for electrical connection (such as by wire bonding, solder bumping, conductive epoxy, or other means known to those having skill in the art) to a subsequently placed valve chip. In addition,notches725 in thebody713 may be provided adjacent portions of the ledge to allow room for a tool to place a valve chip on the ledge with other portions of thebody713 fitting more closely to the valve chip. Portions of thebody713 surrounding theleads717 may be angled (for example, at approximately 30 degrees) to provide wire bonding tip clearance.
• An adhesive can then be provided in the trough of thebody713, and avalve chip131 can be placed on the ledge of thebody713 surrounding the window, with the trough providing for placement, retention, and/or control of spreading of the adhesive until it is fully cured. More particularly, an adhesive bead having a width of approximately 0.015 inches may be used. The valve chip may be placed on the ledge of thebody713 with accuracy of approximately 0.005 inches using optical sensor equipment. Accordingly, indication marks may be molded into thebody713 of the packaging frame. More particularly, indication marks may be molded to include perpendicular intersecting lines having an appearance similar to that of a “L”, “T”, “+”, or other similar character. Moreover, the indication marks may have a depth of approximately 0.010 inches.
• An adhesive used to secure thevalve chip131 on the ledge of thebody713 may be cured at approximately 150 degrees C. (302 degrees F.) for approximately 1 hour. In an alternative, the adhesive may be cured for a longer time at a lower temperature. Polycarbonate, for example, may be used for thebody713 and polycarbonate may have a melting temperature in the range of approximately 430 degrees F. to approximately 480 degrees F. To reduce deformation of thebody713, however, adhesive cure temperatures may be maintained in the range of approximately 125 degrees F. to approximately 200 degrees F. In an alternative, a UV cured epoxy may be used as an adhesive.
• Portions729 of thebody713 may be deformed around the exposed edges of thevalve chip131 to provide the structure illustrated inFIG. 26. The adhesive may provide a fluid seal between thevalve chip131 and thebody713, and thedeformed portions729 may secure the valve chip within thebody713. More particularly,portions729 of thebody713 may be deformed using a heated tool (such as a heat stake) to retain thevalve chip131 within thebody713. Accordingly, edges of thevalve chip131 may be supported on one side by the ledge of thebody713 and on the other side by thedeformed portions729 of thebody713. Moreover, a surface of thevalve chip131 adjacent theleads717 may be recessed approximately 0.010 inches relative to theleads717 and approximately 0.030 inches relative to a surface of thebody713 surrounding thenotches725, ledge, and trough.
• On thevalve chip131, all fixed electrodes may be electrically connected to a first input pad (such as a first gold bond pad), and all flexible electrodes may be electrically connected to a second input pad (such as a second gold bond pad), and the input pads may be electrically connected (e.g., via wire bonding such as gold wire bonding, solder bumping, conductive epoxy, or other means known to those having skill in the art) to exposed portions of respectiveelectrical leads717 adjacent the window through thebody713. A glob-top potting731 can be used to protect the electrical connection between the input pads of thevalve chip131 and the electrical leads717. Portions of theelectrical leads717 are exposed on an edge of thebody713 for electrical coupling to a main housing of a valve assembly.
• According to alternate embodiments, thepackaging frame711 may use a chip gasket similar to that discussed above with regard toFIGS. 7 and 8 to provide a fluid seal between thevalve chip131 and the body of the packaging frame. As before, thebody713 may be formed of injection molded insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof), and thegasket715 discussed above and the additional chip gasket may be formed of an injection molded flexible sealing material such as rubber, viton, and/or silicone. Thegasket715 may provide a static fluid seal with respect to a main housing, and the chip gasket may provide a static fluid seal with respect to a valve chip placed thereon. Moreover, thegasket715 and the chip gasket may be formed together with thebody713 using a two-shot molding process and/or an overmolding process. In an alternative to a chip gasket or in addition, a stamped adhesive tape may be used to secure the valve chip to the ledge.
• Moreover, thevalve chip131 may be packaged before releasing the valve flaps117. More particularly, the valve flaps117 may be formed on a sacrificial oxide, and the sacrificial oxide may be maintained while thevalve chip131 is being assembled in the packaging frame. The sacrificial oxide may then be removed using a dry (vapor) HF release without significantly damaging the packaging frame. More particularly, the packaging frame may be formed of viton and/or other materials which may be resistant to damage from a dry (vapor) HF release.
• In an alternative, valve flaps of a valve chip may be released by removing sacrificial oxide using a wet HF acid etch either before dicing from a wafer including a plurality of valve chips, after dicing but before packaging, or after packaging. More particularly, the sacrificial oxide layer may be removed from the valve chip using a 49% HF solution for approximately 10 minutes, and the wet etch may be followed by a de-ionized (DI) water rinse, an isopropyl alcohol rinse, and first and second methanol rinses for 20 minutes each to remove any residual HF and/or water. After the wet processing, the valve chip with the released valve flaps may be primed with methanol for a supercritical dry cycle to reduce any surface tension that may otherwise result in stiction between valve flaps and the substrate.
• More particularly, the valve chip may be loaded into a dryer chamber and covered with methanol, and liquid CO₂may then be used to displace the methanol from the chamber at a pressure of approximately 1200 psig. Once all of the methanol is displaced, the chamber is heated past the supercritical point (approximately 31 degrees C.) to transition the CO₂from the liquid to gas phase, and the pressure is released to vent the system of CO₂vapor. Because supercritical CO₂has extremely low surface tension, CO₂is less likely to pull the valve flaps down as it transitions from liquid to gas. Commercially available and/or custom supercritical dryers may be used.
• Visual inspection can be used to determine that an acceptable number of the valve flaps on a valve chip are successfully released. In particular, a surface of the valve chip has a different color than exposed silicon under the flappers which is visible when the valve flaps are released and the valve chip is unpowered, and the color variations could be inspected. In an alternative, light can be projected through the wafer after release, and an optical detector could detect light differences between the unreleased (closed) and released (open) valve chip. In either example, machine vision systems could be used to perform the inspections.
• Moreover, tooling used to mold packaging frames according to some embodiments of the present invention illustrated inFIGS. 24-26 may be adaptable so that packaging frames with the same outer dimensions are molded with different window dimensions using substantially the same mold tooling. For example, a same mold base could be used to form different packaging frames with different mold lids being used to provide different window sizes, shapes, and/or locations. Accordingly, packaging frames may be efficiently fabricated for valve chips of different sizes. More particularly, a smaller window may be provided for a smaller valve chip for an application requiring a lower fluid flow capacity, and the smaller window may be provided adjacent the electrical leads (instead of being centered) to provide proximity for wire bonding. By providing the packaging frames with the same outer dimensions for different valve chip sizes, a same main housing may receive packaged valve chips of different capacities/sizes to provide different operating characteristics.
• As further shown inFIGS. 24-26, a wedge shapedbaffle741 may be provided on thebody713 of theframe711 to deflect pressure spikes and/or reduce stress on the electrostatic valve flaps of thevalve chip131. More particularly, thebaffle741 may be provided on thebody713 adjacent the side of thevalve chip131 including the flexible valve flaps and input pads. By including thebaffle741, valve flaps117 of thevalve chip131 may be protected during handling and subsequent assembly. In addition, thebaffle741 may provide a more laminar flow though thevalve chip131, increase a speed of sequencing a valve assembly including packaged valve chips with the baffle, and/or eliminate a need for sequencing. While thebaffle741 is illustrated with four generallycircular orifices743, different shapes, configurations, and/or orientations may be provided, and/or lesser numbers of orifices such as a single orifice may be provided.
• Thebaffle741 may attach to thebody713 of theframe711 using four pins745a-band747a-band a heat stake operation. More particularly, the pins745a-bmay be molded onto thebody713 of theframe711 and configured to mate with through holes749a-bmolded into thebaffle741. The pins747a-bmay be molded onto thebaffle741 and configured to mate with through holes751a-bmolded into thebody713 of theframe711. By arranging the pins745a-band747a-band through holes749a-band751a-bas illustrated inFIGS. 24-26, a desired orientation of thebaffle741 relative to thebody713 can be provided thereby reducing assembly errors. In other words, the placement of pins and holes illustrated inFIGS. 24-26 can facilitate that a relatively thin portion of the wedge shapedbaffle741 is arranged adjacent theelectrical leads717, and a relatively wide portion of the wedge shapedbaffle741 is arranged distant from the electrical leads717. Thebaffle741 may be molded from a same material used for thebody713, or a different material may be used.
• The through holes749a-bin thebaffle741 may be provided with counter-bores (i.e., wider portions) opposite thebody713, and the through holes751a-bin thebody713 may be provided with counter-bores opposite thebaffle741. Accordingly, the pins745a-band747a-bmay be mated with respective through holes749a-band751a-b, and a heat stake operation on the pins may be used to secure thebaffle741 to thebody713. By providing counter-bores for the through holes, room for movement of heat staked material from the pins may be provided so that outside faces of thebaffle741 and/or thebody713 are not significantly deformed as a result of the heat stake operation.
• As further shown inFIGS. 24-26, thebaffle741 may include a plurality oforifices743 therethrough. Moreover, thebaffle741 may be provided adjacent a flapper side of thevalve chip131, and thegasket715 may be provided adjacent a backside of thevalve chip131. A backside of thevalve chip131 may thus communicate with a high pressure environment (such as a chamber), theorifices743 of thebaffle741 may communicate with a relatively low pressure environment (such as a chamber), and thevalve chip131 may allow or block flow from the high pressure environment through the valve chip and through theorifices743 in thebaffle741 to the low pressure environment. Accordingly, thebaffle741 may protect the flapper side of thevalve chip131 during handling and/or subsequent assembly.
• In addition, thebaffle741 may control a pressure differential across thevalve chip131, so that the flappers of thevalve chip131 are not required to open and/or close against sonic air flow and/or against full input pressure. By providing thebaffle741, a reservoir is provided between thebaffle741 and thevalve chip131 so that a flow may be restricted and/or so that a pressure against which the valves must close may be reduced. Stated in other words, a total pressure drop across the packaged valve chip may be split between a first pressure drop across thevalve chip131 and a second pressure drop across thebaffle741 so that the total pressure drop is not felt across thevalve chip131. Because thebaffle741 may allow valve flaps of thevalve chip131 used in a valve assembly to open and/or close in relative short periods of time (e.g., in less than 100 microseconds) against a reduced pressure, fluid flow through thevalve chip131 may be directed “at will” without requiring particular sequencing steps as discussed above, for example, with regard toFIGS. 4A-F. In other embodiments, sequencing operations ofFIGS. 4A-F may be used together withvalve chips131 packaged withbaffles741 to provide operation at even higher pressures.
• Sizes, locations, and numbers of theorifices743 may be used to control back pressures and fluid flows thorough thevalve chip131 and assembly. As shown inFIGS. 24-26, theorifices743 may be provided adjacent outside corners of thevalve chip131, but other orientations, positions, shapes, etc. oforifices743 may be provided. With thebaffle741, valve flappers of thevalve chip131 may open and/or close against only a fraction of a total pressure across the assembly including thebaffle741 and thevalve chip131, and periods of turbulent flow may be reduced. Accordingly, response times to open and/or close the valve flaps may be reduced, improved functionality may be provided, and/or reliability may be improved. Moreover, a need for sequencing may be eliminated.
• The wedge shape of thebaffle743 may also facilitate assembly of the packaged valve chip into a main housing. More particularly, the wedge shape may allow the packaged valve chip to be inserted approximately ¾ (i.e., 75%) of the way into a corresponding wedge shaped enclosure of a valve housing before thegasket715 begins to compress. Accordingly, damage to thegasket715 during subsequent assembly may be reduced.
• As shown inFIGS. 24-26, thegasket715 may be provided on a side of thebody713 adjacent the backside of thevalve chip131 and opposite thebaffle741. Thegasket715 may thus be protected from adhesives, heat stake operations, etc. used to secure thevalve chip131 in thebody713 during assembly. By placing thegasket715 as shown inFIGS. 24-26, interference between thegasket715 and thebaffle741 may be reduced.
• Moreover, theelectrical leads717 may be formed as shown inFIG. 27 so thatwire bond portions717aof the leads are substantially parallel to thevalve chip131 and so thatexternal portions717bof the leads are substantially perpendicular with respect to thevalve chip131. Moreover, dimples717cmay be provided on theexternal portions717bof the leads to improve interconnection with leads of a main housing.
• The packaged valve chips ofFIGS. 24-26 can be plugged in and out of a main housing as discussed in greater detail with respect toFIGS. 28-34. Accordingly, a valve assembly including one or more packaged valve chips may be repairable and/or adaptable. A valve assembly with a malfunctioning valve chip may thus be repaired by removing the packaged valve chip that is not working and inserting a new packaged valve chip. In addition, functionality of a valve assembly may be changed by replacing original packaged valve chips with new packaged valve chips having a different characteristic (such as different flow capacity and/or size of valve chip).
• Amain housing801 according to some embodiments of the present invention is illustrated inFIGS. 28-31. More particularly, an exploded view of amain housing801 and associated components is illustrated inFIG. 28, and a bottom perspective view of the main housing is illustrated inFIG. 31. As shown in the bottom view ofFIG. 31, themain housing801 defines valve assembly chambers143a-ediscussed above with respect to FIGS.3 and4A-F. Themain housing801 also includes enclosures803a-dconfigured to receive packaged valve chips (such as discussed above with respect toFIGS. 24-27) perpendicular to a length of the main housing. In addition,main housing801 includes conductive leads805 therein used to transmit signals to metal leads717 of the packaged valve chips in enclosures803a-d. Aperimeter base gasket807 may be included to provide a fluid seal with respect to a base of the assembly (illustrated, for example inFIGS. 37 and 38), and aPCB gasket809 may be included to provide a seal for an external connection to theleads805 of the main housing.
• Themain housing801 may be formed by injection molding an insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) withconductive leads805 insert molded therein, and thegaskets807 and/or809 may be formed of a flexible sealing material using a two-shot molding process and/or an overmolding process. More particularly, the molding tool creates the five separate chambers143a-efor high pressure air supply and low pressure exhaust as discussed above with respect to FIGS.3 and4A-F. When injection molding the main housing, a hole may be included in the outside of the housing to accommodate formation of interior holes between chambers143a-e, and the hole in the outside of the housing may be sealed with a plug that may be glued, welded or otherwise affixed to seal the hole.
• As shown inFIGS. 28-30, themain housing801 may also have banjo fittings815a-b, O-rings817a-b, and collets819a-b(also referred to as quick connect fittings and/or cartridges) affixed thereto. More particularly, the collets819a-bmay be push-in style cartridges. More particularly, the banjo fittings815a-bmay be affixed to themain housing801, for example, using ultrasonic welding and/or an adhesive, and the banjo fittings815a-bare in fluid communication with thechambers143band143dof the valve assembly. The O-rings817a-band the collets819a-bmay then be inserted in the banjo fittings815a-bfor retention of air-tubes providing fluid communication with the pneumatic actuator chambers163a-b(shown inFIG. 3). Themain housing801 can be used to provide either a three-way valve or a five-way valve depending on the number of packaged devices used and locations thereof to control fluid flow.
• As discussed above, a microelectromechanical systems (MEMS)valve chip131 may be packaged in a frame to provide a packaged valve chip as illustrated, for example, inFIGS. 24-26. Packaged valve chips may be selectively plugged in and out of respective enclosures803a-dof themain housing801 so that the valve assembly is adaptable and/or repairable. Thegasket715 of the packaged valve chip provides a fluid seal with the respective enclosure803a-dso that fluid communication between enclosures is only provided through openings in respective valve chips. Moreover, thevalve chip131 in a packaged valve chip is directional and thegasket715 should mate with a predetermined side of the particular enclosure so that the packaged valve chip is oriented in themain housing801 to provide the fluid flows between chambers143a-ediscussed above with respect toFIGS. 4A-F.
• As shown inFIG. 32, each of the enclosures803a-d(shown inFIG. 31) may have a wedge shaped profile to accept a respective packaged valve chip including a wedge shapedbaffle741 as discussed above with regard toFIGS. 24-27. More particularly, each of the enclosures803a-dmay have a profile that is relatively wide adjacent abase851 for thehousing801 and that becomes more narrow as the enclosure extends away from thebase851. Accordingly, each of the enclosures803a-dmay be configured to receive a respective packaged valve chip (including a wedge shaped baffle741) with a narrow portion of the packaged valve chip and leads717 extending into the housing and with a wide portion of the packaged valve chip adjacent thebase851 for thehousing801.
• The possibility that a packaged valve chip is incorrectly inserted into the housing can be reduced because a wide portion of the wedge shaped package cannot be inserted into the housing first. For example, the wedge shape of the enclosure may reduce the possibility that the wedge shaped chip assembly can be inserted upside down or sideways. Moreover, complete insertion may not be possible if the wedge shaped chip assembly is inserted into the enclosure backwards so that the base851 may not properly mate and/or form a seal with thehousing801.
• In addition, the wedge shaped package may be inserted a significant portion (e.g., greater than 50%, and frequently as much as 75%) of the way into the respective wedge shaped enclosure before thegasket715 of the package begins to compress. Accordingly, damage to thegasket715 can be reduced, and/or an improved fluid seal may be provided between the wedge shaped package and the wedge shaped enclosure.
• As discussed above, an interior dimension of a window of a frame used to package a valve chip can be varied to accommodate valve chips of different sizes without varying outer dimensions of the packaged valve chip assembly. A samemain housing801 may thus receive packaged valve chip assemblies in enclosures803a-dhaving different flow capacity characteristics. Stated in other words, the size of a MEMS valve chip may be varied to provide different flow characteristics (for example, in the range of approximately 0.001 Cv to approximately 10 Cv) while maintaining a same envelope geometry of the packaged valve chip.
• In addition, exposed portions of the metal leads717 on an edge of the packaged valve chip may mate withcorresponding leads805 of themain housing801 to provide communication of electrical signals from outside the main housing with fixed and flexible electrodes of the valve chips plugged into enclosures803a-dof themain housing801.
• FIG. 33 illustrates a valve assembly including four packaged valve chips, anelectronics sub-assembly1001, and a base851 with non-metallic portions of themain housing801 omitted. Accordingly, theelectrical leads805 of themain housing801 are visible, and a coupling of theelectrical leads805 of the main housing and theelectrical leads717 of the packaged valve assemblies is also visible.
• As shown inFIG. 33, a bend may be provided in each of theelectrical leads805 so that portions (or tabs) of theelectrical leads805 making contact with theleads717 of the packaged chip assembly may be provided parallel with respect to a length of the leads805 (and parallel with respect to a length of the main housing801). Accordingly, the portions of theelectrical leads805 making contact with theleads717 may be supported on both ends thereof for added strength. Moreover, as the packaged chip assembly is inserted into the enclosure of the main housing, theleads717 of the packaged chip assembly may slide back and/or forth along the tabs of theleads805 as thegasket715 is compressed during insertion. A reliability of electrical coupling between theleads717 and805 can thus be improved.
• In addition, filters may be provided in one or more of the chambers143a-eto protect the microvalves. For example,exhaust filters1041 may be provided inchambers143band143c, andinput filter1043 may be provided inchamber143c, as shown inFIG. 34. A filter inchamber143cmay protect microvalves from particles and/or other debris from a high pressure supply, and filters inchambers143band143dmay protect microvalves from particles and/or other debris introduced from ports to the actuator. Thefilters1041 and/or1043 may be manufactured integrally with thehousing801, and/or thefilters1041 and/or1043 may be manufactured separately from thehousing801. One or more of the filters, for example, may be porous plastic filters, porous metal filters, paper filters, desiccant filters, coalescing filters, fiber filters, membrane filters, mesh filters/separators, mist separators, vane separators, cyclonic separators, down flow separators, rain out separators, vertical flow separators, and/or horizontal separators.
• Theinput filter1043 may be used to filter a high pressure supply provided by the customer. While the high pressure supply may be filtered outside thehousing801, damaging particles may be introduced into the high pressure supply during valve installation, and/or particles may otherwise be introduced downstream from any external filtering. By way of example, theinput filter1043 may be configured to catch materials such as particles of Teflon® tape, pipe sealant, and/or other particles that may be in a high pressure supply pipe downstream from the customer's high pressure supply filter/regulator. Accordingly, damage to valve chips in supply paths may be reduced. Moreover, theinput filter1043 may be configured to allow air flow in all directions. Accordingly, if one area of a filter becomes clogged with contaminants, air can flow through adjacent areas of the filter without significantly limiting flow. While thesupply filter1043 is shown in thehousing801, other filters may be provided in place of and/or in addition to thesupply filter1043. For example, a supply filter may be provided in thebase851, and/or in a supply line coupled to the base.
• The exhaust filters1041 may be used to filter actuator exhaust that may include particles generated as a result of actuation. Actuator exhaust, for example, may include minute particles of dried lubricant, seal, rod bearing, and/or actuator body material. By filtering any such particles from the actuator, damage to the valve chips in exhaust paths can be reduced. Moreover, theexhaust filters1041 may be configured to allow air flow in all directions. Accordingly, if one area of a filter becomes clogged with contaminants, air can flow through adjacent areas of the filter without significantly limiting flow. While theexhaust filters1041 are shown in thehousing801, other filters may be provided in place of and/or in addition to the exhaust filters1041. For example, exhaust filters may be provided in banjo fittings815a-b, in collets819a-b, and/or in the pneumatic actuator.
• The use of abaffle741 may provide a baffle chamber between the baffle and the associated valve chip with the valve flaps of the valve chip physically protected in the baffle chamber during handling and/or assembly. Moreover, an orifice(s) in the baffle may sufficiently restrict fluid flow so that a maximum force applied to the valve flaps of the valve chip may be reduced. In addition, a volume of the baffle chamber may be sufficiently small relative to the associated chamber of the valve housing so that a laminar fluid flow through the valve chip can be attained more quickly and so that fatigue of the valve flaps can be reduced. Baffles and sequencing operations (as discussed with respect toFIGS. 4A-F) can thus be used separately or in combination to increase pressures against which the valve chips can operate, to reduce fatigue, to improve flows, etc.
• Moreover, baffles with orifices of different sizes may be provided for different valve chips in a same valve assembly. The 5-way valve ofFIG. 34, for example, may be provided withbaffles741b-cproviding greater flows into actuator ports and withbaffles741aand741dproviding more restricted flows out of actuator ports. Relatively smooth piston motion may be provided, and/or maximum piston velocities may be reduced.
• An electronics sub-assembly1001 for valve assemblies according to some embodiments of the present invention is illustrated inFIGS. 35-36. More particularly, a printed circuit board within the electronics sub-assembly1001 may include electronic circuitry and/or software and/or firmware used to control operations of the valve chips131 included in themain housing801. For example, the printed circuit board may include electronic circuitry and/or software to control and/or drive thevalve chips131 in accordance with operations discussed above with respect toFIGS. 4A-F as instructed by a remote device such as a programmable logic controller (PLC).
• The printed circuit board may include integrated circuit chips, resistors, capacitors, and/or inductors thereon. In addition, leads on the printed circuit board may provide electrical coupling withleads805 of themain housing801, and a connector1005 (such as a 5-pin Molex connector) may provide electrical connection to a remote controller such as a PLC. The electronics sub-assembly may be configured to provide a plurality of different operating characteristics defined in memory (such as ROM, PROM, EPROM, EEPROM, etc.) with one particular programming characteristic being selected using means such as a jumper(s), a dip switch(es), shunt(s), etc. More particularly, the printed circuit board may include one or more custom circuits (for example, including one or more application specific integrated circuit ASIC devices) as discussed below with respect toFIGS. 41-44,45A-B, and46A-B. Additional operations of valve assemblies and/or electronic sub-assemblies thereof are discussed in the U.S. Provisional Application No. 60/590,699 to Kevin Douglas et al., entitled “Methods Of Operating Electrostatically Actuated Microvalve Assemblies And Related Structures” and filed Jul. 23, 2004 (hereinafter “Douglas et al.”). The disclosure of this provisional application is hereby incorporated herein in its entirety by reference.
• During normal operation, the electronics sub-assembly1001 may receive operating power along with control signals throughconnector1005. An alternate power source such as abattery1013 may also be provided so that the electronics sub-assembly can sequence thevalve chips131 to a predetermined default condition in the event of a power outage. While a battery is shown inFIGS. 35 and 36, other alternate power sources (such as a capacitive storage device and/or a fuel cell) could be used. As shown inFIGS. 35 and 36, thebattery1013 may be provided in a hingedcompartment cover1015 so that the battery may be replaced.Hinges1017 may provide that the compartment cover opens and closes, andgasket1019 may protect thebattery1013 from contamination and/or moisture outside the battery compartment. The battery compartment may be formed using a two-shot process to provide anintegral cover1015 andgasket1019. With a disk type battery,terminals1021 may provide electrical coupling between electronics of the sub-assembly1001 and thebattery1013. Moreover, the electronics sub-assembly may include circuitry configured to charge the battery during normal operations using externally provided power. Accordingly, a life of a battery may be extended.
• Moreover, indicator lights1023 (such as light emitting diodes) may provide indication of a current mode of operation, an external power supply status, a battery status, etc. In addition, pairs ofmanual override contacts1025 may be used to manually drive an associated actuator to either the extended or retracted position. For example, a first pair of manual override contacts may be electrically shorted with the tip of a screwdriver or other tool to manually drive the associated actuator to a retracted position, and a second pair of manual override contacts may be electrically shorted with the tip of a screwdriver (or other tool) to manually drive the associated actuator to an extended position.
• The electronics sub-assembly1001 may also include a high voltage drive circuit (such as a multiple stage charge pump) used to drive the valve chip electrodes. For example, a 24V external power supply may be provided through theconnector1005, and a high voltage drive circuit may generate a 150V output used to drive the valve chip electrodes throughleads805 of thehousing801 and leads717 of the valve chips. The printed circuit board may also include a transient voltage suppressor (TVS) such as a pair of serially connected and opposing zener diodes.
• A controller of the electronics sub-assembly may be configured to monitor the external power supply, and upon detecting interruption of the external power supply, to advance thevalve chips131a-dto a predetermined default condition and to hold that default condition using energy provided from the alternate power source. Upon detecting interruption of the external power supply, for example, the current condition of thevalve chips131a-dmay be maintained. In an alternative, upon detecting interruption of the external power supply, the controller may close thevalve chips131a-dso that fluid communication is blocked between each of the chambers143a-e. In another alternative, upon detecting interruption of the external power supply, the controller may closevalve chips131b-candopen valve chips131aand131d. In still another alternative, upon detecting interruption of the external power supply, the controller may closevalve chips131aand131dandopen valve chips131b-c.
• The electronics sub-assembly1001 including a printed circuit board may be encapsulated in an insulating material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) as illustrated inFIGS. 35 and 36, for example, using an over-molding process. More particularly, an epoxy may be used that can be cured at a relatively low temperature and pressure to protect the electronics therein. An external geometry of the encapsulated electronics sub-assembly may be provided that fits on themain housing801 so that the leads of the electronics sub-assembly mate with theleads805 of themain housing801.
• The fivepin connector1005, for example, may provide an electrical power (Vcc) input connection, a ground (GND) input connection, A and B input control connections, and a power status output connection. Moreover, each pair ofmanual override contacts1025 may be recessed in the over-molded housing to reduce the possibility of accidental contact therewith. In addition, the pairs of manual override contacts may be respectively labeled “2” and “4” on adjacent portions of the battery cover to correspond with actuator port numbers of the housing.
• In addition, anextension888 of the over-mold may be configured to guide placement of the electronics sub-assembly1001 with respect to a base and a housing during subsequent assembly. More particularly, theextension888 may mate with a corresponding slot of a base discussed below with respect toFIGS. 37-38. Moreover, thegrooves885 of the electronics sub-assembly1001 may be configured to mate with a retaining clip as discussed with respect toFIGS. 39 and 40.
• Abase851 for valve assemblies according to some embodiments of the present invention is illustrated inFIGS. 37 and 38. The base851 may be formed using a metal casting process. More particularly, thebase851 may be formed of a metal such as aluminum or stainless steel, and the exhaust ports142a-band thesupply port144cmay be threaded tapped holes. Additional screw tapped holes853a-bmay be used to secure themain housing801 onto thebase851. In addition, clearance and/or mounting holes855 (perpendicular to and/or parallel with the ports) may be provided in the base for mounting the valve assembly. Moreover,communication slots857 provide relatively narrow openings between the screw tapped holes and the respective chambers in themain housing801.
• By using a cast metal as the base, an integrity of the threads in the holes may be more easily maintained. Moreover, an epoxy finish may be provided on a cast aluminum base for protection and/or aesthetic purposes. In an alternative, thebase851 may be formed from injection molded material (such as a plastic material, an elastomeric material, a polymer, a co-polymer, and/or derivatives thereof) using metallic inserts at threaded locations. As shown inFIG. 37, agroove889 may be formed in a tang of thebase851, and thegroove889 may be configured to receive theextension888 of theelectronics sub-assembly1001.Grooves887 may also be formed in the base851 to couple with a retaining clip as discussed below with respect toFIGS. 39 and 40.
• Moreover, the exhaust ports142a-band thesupply port144cmay be flat bottom tap drilled and then tapped. In addition, thecommunication slots857 for the exhaust ports142a-bmay be formed off-center. Accordingly, a length of the valve assembly may be reduced because the exhaust ports do not need to be centered relative to the respective valve chambers.
• The valve assembly may be completed by plugging packaged valve chips (such as illustrated inFIGS. 24-26) into enclosures in the bottom of the main housing801 (as shown inFIGS. 31 and 32); securing the main housing (including the packaged valve chips therein) to the base851 usingscrews861; and attaching the electronics sub-assembly1001 onto themain housing801 andbase851 using aU-shaped retaining clip881 as shown inFIGS. 39 and 40. More particularly, theU-shaped retaining clip881 may be configured to couple withgrooves883 of themain housing801, withgrooves885 of theelectronics sub-assembly1001, and withgrooves887 of the base851 to fasten the components together. Moreover, theextension888 of the electronics sub-assembly1001 may be configured to mate with theslot889 of the base851 to provide alignment therebetween.
• The same main housing, base, and electronics sub-assembly can be configured for 5-way, 4-way, 3-way, or 2-way valve operations. For 5-way operations, as discussed above with respect toFIGS. 4A-F, four packaged valve chips may be plugged into respective enclosures in the bottom of the main housing as shown, for example, inFIG. 34. For 3-way valve operations, a packaged valve chip may be plugged into each of the two enclosures most distant from the electronics sub-assembly, and a sealing plug may be plugged into the two enclosures closest to the electronics sub-assembly so thatchambers143d-eare permanently sealed. As discussed above, a same electronics sub-assembly may be configured to provide one of a plurality of modes of operation defined in memory (such as ROM, PROM, EPROM, EEPROM, etc.) depending on a selection made using a jumper(s), a switch(es), a shunt(s), a fuse(s), or other selection device that can be set during and/or after manufacture. For example, a same electronics sub-assembly can be used to control either 5-way, 4-way, 3-way, or 2-way operations depending on a switch, shunt, fuse, and/or jumper setting. For example, 3-way and 5-way valve operations are discussed in Douglas et al.
• In further alternatives, a main housing, base, and electronics sub-assembly can be configured for 4-way and/or 2-way valve operations. For 4-way operations, the base may be modified so that fluid coupling is provided betweenexhaust chambers143aand143eand a same exhaust port. Otherwise, 4-way operations may be provided with four valve chips as discussed above with respect toFIGS. 4A-F. In an alternative, 2-way operations may be provided using a single valve chip to provide a unidirectional on/off flow device. A 2-way device could be provided using the components ofFIGS. 28-31 with one valve chip and plugs substituted for other valve chips. In an alternative, a 2-way device could be provided using a smaller housing with one input port, one output port, and one enclosure for a single valve chip.
• According to some embodiments of the present invention, electrical functionalities of the electronics sub-assemblies discussed above with regard toFIGS. 14-17 and/or35-36 may be provided using a custom circuit (for example, including one or more Application Specific Integrated Circuits also referred to as ASICs).FIG. 41 is a block diagram illustrating functional blocks of acircuit2001 according to some embodiments of the present invention, andFIG. 42 is a schematic diagram illustrating elements of a printed circuit board including thecircuit2001 ofFIG. 41.
• As shown inFIG. 41, thecircuit2001 may include a power regulation/control circuit2011, a highvoltage generation circuit2013, a battery detect/control circuit2015, a deglitch/debounce logic circuit2017, a sequence controller (state machine)circuit2019, a high voltage (HV) outputlevel shifter circuit2021, aconfiguration circuit2023, a reversal timing/control circuit2025, and a light emitting diode (LED)driver circuit2027. As shown, the power regulation/control circuit2011 may receive external power supply VDD and ground GND signals through respective ones of theconnectors509 ofFIGS. 14-17, or through respective ones of theconnectors1005 ofFIGS. 35-36. Similarly, the deglitch/debounce logic circuit2017 may receive input controls signals A and B through respective ones of theconnectors509 ofFIGS. 14-17, or through respective ones of theconnectors1005 ofFIGS. 35-36. The battery detect/control circuit2015 may receive the battery power supply VBat and ground GBat signals from a battery (such asbattery513 ofFIGS. 14-17 orbattery1013 ofFIGS. 35 and 36).
• The outputs F1-F4 and HComO and HComE of the HV outputlevel shifter circuit2021 are used to drive the valve chips of the valve assembly with the outputs F1-F4 and HComO and HComE being coupled to respective valve chips through leads of the main housing (such as throughleads405 ofFIGS. 13 and 20 or throughleads805 ofFIGS. 31 and 33). More particularly, the valve chips of the valve assemblies may be identified as first (most distant from the electronics sub-assembly) through fourth (closest to the electronics sub-assembly) with the high voltage outputs F1 to F4 being respectively applied to the first through fourth valve chips, with the High Voltage Common Odd HComO signal being applied to the first and third valve chips, and with the High Voltage Common Even HComE signal being applied to the second and fourth valve chips.
• Theconfiguration logic circuit2023 may receive configuration select signals C1-C3 which may be either grounded or floating. As shown inFIG. 42, thecircuit2001 may be provided on a printed circuit board with each of the configuration select signals/pins C1-C3 either coupled to ground through a respective jumper J1-J3 or floating (by removing the respective jumper). In an alternative, traces to ground for respective configuration select signals/pins C1-C3 may be either maintained or cut before packaging to provide that respective configuration select signals/pins are either grounded or floating. Moreover, theLED driver circuit2027 outputs LED-A and LED-B may driverespective LEDs1023.
• The custom circuit ofFIGS. 41 and 42 may be configured so that the resulting valve assembly can be used as a drop-in replacement for a conventional solenoid driven valve. Accordingly, the physical and electrical interfaces for the electronics sub-assembly may conform to physical and electrical interfaces used for conventional solenoid driven valves. For example, the deglitch/debounce logic circuit2017 may be configured to receive input controls signals A and B used for solenoid driven valves. As shown inFIGS. 41 and 42, four separate high voltage output signals F1-F4 may be provided, and each valve chip load can effectively be modeled as a capacitor VC1-VC4 with hysteresis. The capacitors VC1-VC4 thus represent valve chips provided in a main valve housing as opposed to elements provided on a printed circuit board in an electronics sub-assembly. Moreover, the high actuation voltages may be generated using charge pumps, inductor circuits, and/or combinations thereof, and/or other circuits known to those having skill in the art.
• The highvoltage generation circuit2013 may be configured to convert a low voltage source (such as a 24 Volt external power supply signal VDD and/or a 3 Volt battery power supply signal VBat) to a high voltage signal, such as a 200 Volt DC signal. TheHV generation circuit2013, for example, may include a series of charge pumps provided on thecircuit2001. In addition or in an alternative as illustrated inFIGS. 41 and 42, external inductor coils LL and LH may be provided in parallel with external resistors RL and RH to provide one or more boost converters used to generate high voltage signals while reducing a size and/or cost of thecircuit2001. Moreover, an absolute value of the high voltage(s) thus generated may be adjusted to accommodate different actuation voltages used for different applications and/or to accommodate variations in characteristics of different circuits (such as ASICs) resulting from manufacturing variations. The resulting high voltages may be adjusted using a resistor HVAR as part of a divider used with a comparator of theHV generation circuit2013 to control when the highvoltage generation circuit2013 is active.
• Upon loss of the primary power source (e.g., upon loss of the external power supply signal VDD), an electronic sub-assembly including thecircuit2001 may be configured to provide that the valve assembly can maintain a state or transition to a desired state. Accordingly, the electronic sub-assembly including the circuit may be configured to provide sufficient energy from a battery (such asbattery513 ofFIGS. 15-17,battery1013 ofFIG. 36, and/orbattery3013 ofFIG. 42) to overcome leakage through the electrostatically actuated valve chips while maintaining the valve chips in a desired state for an indefinite period during loss of the external power supply signal VDD (which may be a 24 Volt supply).
• Upon detection of a power loss, energy may also be needed to switch the high voltage output signals F1-F4 to a predefined condition, depending upon a particular application and state of the inputs at the time of the power loss. A relatively low-cost 3 Volt lithium primary battery may be used to provide energy to maintain high voltage output signals F1, F2, F3, and/or F4 when the DC external power supply signal VDD is lost and/or interrupted. In an alternative, a rechargeable lithium ion battery having a voltage output in the range of 3.0 to 4.2 Volts may be used, with thecircuit2001 being configured to recharge the battery when the external power supply signal VDD is present.
• During normal operation with the external power supply signal VDD available, the deglitch/debounce logic circuit2017 may receive and/or filter the input control signals A and B, and the deglitch/debounce circuit2017 may provide the input control signals A and B to thesequence controller2019. With the external power supply signal VDD available, thesequence controller circuit2019 directs operation of the HV outputlevel shifter circuit2021 in accordance with the input control signals A and B and in accordance with a circuit configuration defined by the configuration signals C1-C3. During loss of the external power supply signal VDD, the battery detect/control circuit2015 may detect the power loss, and a power loss signal may be generated by the detect/control circuit2015 and provided to thesequence controller circuit2019. During loss of the external power supply signal VDD, thesequence controller circuit2019 directs operation of the HV outputlevel shifter circuit2021 in accordance with a power loss mode defined by the configuration signals C1-C3 (without regard to the input control signals A and B).
• Operation during loss of the external power supply signal VDD may impact operations of the various components of thecircuit2001 because of the limited energy available from the battery. Stated in other words, one or more of the components of thecircuit2001 may be configured to operate in a low power mode during loss of the signal VDD to extend life of the battery. For example, the HV outputlevel shifter circuit2021 may be configured to provide low leakage operation, high voltage generation oscillators of theHV generation circuit2013 may be operated on an “as-needed” basis during loss of the signal VDD, and/or theLED driver circuit2027 may be configured to provide a leakage-only mode during loss of the signal VDD. By reducing current drawn from the battery, a period of time can be extended over which the battery can be used during loss of the signal VDD.
• In addition, the battery detect/control circuit2015 may be configured to detect a low battery voltage and to indicate the need for a replacement battery, for example, by flashing one or both of theLEDs1023. More particularly, the battery detect/control circuit2015 may periodically sample the battery voltage under a nominal load, and the battery detect/control circuit2015 may indicate that a replacement battery is needed when the battery voltage signal VBat falls to approximately 2 Volts (to accommodate different battery types). For example, the battery detect/control circuit2015 may sample the battery voltage using a nominal load of at least approximately 10 M-ohms.
• Logical relationships between inputs and outputs (of electronic sub-assemblies including thecircuit2001 illustrated inFIGS. 41 and 42) are provided in Table 1 ofFIG. 43. An exponential rise and fall (a capacitor charged and discharged through a transistor) may be sufficient to drive the electrostatically actuated valve chips. Wave shaping (such as an intentional overshoot and settling voltage), however, may be provided according to some embodiments of the present invention. In Table 1 ofFIG. 43, X denotes a “don't care” condition for the respective signal. Where a “don't care” condition is indicated for one or both of the input control signals A and/or B, however, the input control signal may be driven to a high or low voltage at all times.
• As shown in Table 1 ofFIG. 43, a 5-way, 3-position, cylinder ports exhausted configuration may be provided by providing that the configuration signals C1 and C2 are grounded (indicated as 0). During normal operations when the signal VDD is present, the high voltage output signals F1-F4 (with 0 indicating valve open and with 1 indicating valve closed) and the LED output signals LED-A and LED-B (with 0 indicating off and 1 indicating on) may be driven responsive to the input control signals A and B as indicated. When the configuration signal C3 is grounded and the signal VDD is interrupted, the HV output signals F1-F4 may be driven to the “00” state such that the first and fourth valve chips are opened and the second and third valve chips are closed (i.e., both cylinder ports are exhausted) without regard to the conditions of the input signals A and B. When the configuration signal C3 is floating (indicated as 1) and the signal VDD is interrupted, the HV output signals F1-F4 may be held in their last state at the time of the power interruption without regard to the conditions of the input signals A and B.
• A 5-way, 3-position, all ports blocked configuration may be provided by providing that the configuration signal C1 is grounded (indicated as 0) and that the configuration signal C2 is floating (indicated as 1). During normal operations when the signal VDD is present, the high voltage output signals F1-F4 (with 0 indicating valve open and with 1 indicating valve closed) and the LED output signals LED-A and LED-B (with 0 indicating off and 1 indicating on) may be driven responsive to the input control signals A and B as indicated. When the configuration signal C3 is grounded and the signal VDD is interrupted, the HV output signals F1-F4 may be driven to the “00” state such that all of the valve chips are closed (i.e., both cylinder ports are isolated from high pressure and exhaust ports) without regard to the conditions of the input signals A and B. When the configuration signal C3 is floating (indicated as 1) and the signal VDD is interrupted, the HV output signals F1-F4 may be held in their last state at the time of the power interruption without regard to the conditions of the input signals A and B.
• A 5-way, 3-position, cylinder ports energized configuration may be provided by providing that the configuration signal C1 is floating (indicated as 1) and that the configuration signal C2 is grounded (indicated as 0). During normal operations when the signal VDD is present, the high voltage output signals F1-F4 (with 0 indicating valve open and with 1 indicating valve closed) and the LED output signals LED-A and LED-B (with 0 indicating off and 1 indicating on) may be driven responsive to the input control signals A and B as indicated. When the configuration signal C3 is grounded and the signal VDD is interrupted, the HV output signals F1-F4 may be driven to the “00” state such that the first and fourth valve chips are closed and the second and third valve chips are opened (i.e., both actuator ports are energized) without regard to the conditions of the input signals A and B. When the configuration signal C3 is floating (indicated as 1) and the signal VDD is interrupted, the HV output signals F1-F4 may be held in their last state at the time of the power interruption without regard to the conditions of the input signals A and B.
• A 5-way, 2-position configuration may be provided by providing that the configuration signals C1 and C2 are floating (indicated as 1). Here, only one input control signal B is used, and the input control signal A is thus in a “don't care” condition. During normal operations when the signal VDD is present, the high voltage output signals F1-F4 (with 0 indicating valve open and with 1 indicating valve closed) and the LED output signals LED-A and LED-B (with 0 indicating off and 1 indicating on) may be driven responsive to the input control signal B as indicated. When the configuration signal C3 is grounded and the signal VDD is interrupted, the HV output signals F1-F4 may be driven to the “0” state such that the first and third valve chips are opened and the second and fourth valve chips are closed without regard to the conditions of the input signals A and B. When the configuration signal C3 is floating (indicated as 1) and the signal VDD is interrupted, the HV output signals F1-F4 may be held in their last state at the time of the power interruption without regard to the conditions of the input signals A and B.
• When a voltage is applied to an electrostatically actuated valve chip continuously for a sufficient period of time, charge build-up may cause deactivation delays. As applications according to some embodiments of the present invention may require that a given state be maintained for days or even weeks, charge build-up may need to be reduced. By periodically reversing the polarity of the applied voltage in this situation, residual charges can be reduced thereby reducing charge build-up and associated actuation delays. Because the valve chip is electrostatic, the polarity of the applied voltage does not matter. Moreover, if the polarity can be reversed before the valve chip can fully open, physical operation of the device may not be significantly affected.
• Accordingly, the circuit may be configured to periodically reverse the polarity of a HV output signal (e.g., F1, F2, F3, and/or F4) applied to a valve chip being held closed for a significant period of time to thereby reduce charge build-up. With an on-chip oscillator used in the highvoltage generation circuit2013, a signal can be derived for timing of the polarity switching. An absolute period of the oscillation may not be critical for any of the functions of the high voltage generation circuit.
• A minimum length of time (t_rev) to wait between polarity reversals may be determined based on characteristics of the valve chips being used. Since charge build-up may also occur when the battery is being used to hold the valve chip states during loss of the external power supply signal VDD, polarity reversals may also be provided throughout power interruptions. Accordingly, polarity reversals may be triggered when theHV generation circuit2013 is periodically activated during power outages so that continuous operation of oscillators of the HV generation circuit is not required during power outages. Moreover, if the input control signals A and B change state during a polarity reversal operation, the polarity reversal may be completed before responding to the new input control signal command.
• When switching from one state to another, product functionality may require that thesequence controller circuit2019 provide a controlled sequence of deactivations and/or activations during a transition from one operational state to the next as discussed above, for example, with respect toFIGS. 4A-F. In other words, a timed sequence of output states may be desired after a control input signal changes and/or after a power status changes. Moreover, polarity reversals may include sequencing through a series of intermediate states during execution thereof. More particularly, sequencing through intermediate states may provide that specific output combinations do not occur for even an instant, and that certain intermediate conditions are given sufficient time to settle.
• As shown in Table 1 ofFIG. 43, there may be 5 unique operational states of the HV output signals F1-F4 (0101, 1010, 1111, 0110 and 1001) and 14 different transition from one operational state to another. Examples of sequences for all 14 state changes are shown inFIG. 44 according to some embodiments of the present invention.FIG. 44 also illustrates sequences that may be used to execute the 5 polarity reversal transitions (for each of the five operational states). In addition, a minimum time delay (t_del) may be provided before switching to the states indicated in bold. In addition, the polarity reversal sequences ofFIG. 44 may occur during power loss modes. Accordingly, high voltage signal transitions may be required using battery power during power outages.
• A valve chip having its polarity reversed first goes through a state where zero volts is applied across it. These points of zero crossings are indicated with over-line (i.e., “0”) inFIG. 44. After thecircuit2001 achieves an over-lined state where both HV output signals of a pair (e.g., F1 and F3, or F2 and F4) are driven with zero potential difference relative to the respective shared common signal (e.g., HComO or HComE), the polarity of the shared common signal relative to the respective HV output signal pair can be reversed. If the HV output signals were initially at a high voltage potential relative to the respective shared common signal at the beginning of the polarity reversal operation, the pair of high voltage output signals and the respective shared common signal may all be pulled to the high voltage potential during the transition, and then the pair of high voltage output signals may be pulled to a low voltage potential relative to the respective shared common signal. If the HV output signals were initially at a low voltage potential relative to the respective shared common signal at the beginning of the polarity reversal operation, the pair of high voltage output signals and the respective shared common signal may all be pulled to the low voltage potential during the transition, and then the pair of high voltage output signals may be pulled to a high voltage potential relative to the respective shared common signal.
• FIGS. 45A-B provide a summary of input/output signals and/or pins of thecircuit2001. Multiple bond pads may be provided for some of these pins to accommodate potential current surges.
• Electrostatic Discharge (ESD) circuit protection may be provided within thecircuit2001 on all input/output pins of thecircuit2001 in compliance with IEC 61000-4-2, Compliance Level 2 (4 kV for contact). In addition, the input control signal pins (A and B) and the power supply pins (VDD and GND) may be provided with external Electrical Fast Transients (EFT) circuits per IEC 61000-4-4, toCompliance Level 4. In particular, a transient voltage suppressor TVS (for example, including two zener diodes) and/or a storage capacitor SC may be provided between the main power supply signal/pin VDD and the ground signal/pin GND. In addition, a diode RP1 may be provided between the external power supply Vcc and the main power supply signal/pin VDD. In addition, diodes RP2 and RP3 may be provided for the input control signals/pins A and B.FIGS. 46A-B provide design parameters for thecircuit2001 according to some embodiments of the present invention.
• A Transient Voltage Suppressor TVS may include a pair of zener diodes connected between the input power supply signal Vcc/VDD and ground GND. The zener diodes may be placed in series with their cathodes connected as shown inFIG. 42. The transient voltage suppressor TVS may provide over-voltage protection and may provide protection from relatively large, fast transients. The transient voltage suppressor TVS may be located relatively distant from thecircuit2001 on the printed circuit board for the electronics sub-assembly to facilitate reliable transient protection. Volumes, thicknesses, widths, lengths, and materials for traces of the printed circuit board from the electronics sub-assembly may be selected to provide effective signal paths for normal operations and also to provide transient protection at elevated temperatures.
• A reverse polarity diode RP1 may also be provided in series with thecircuit2001 between the power supply pin VDD and the external power supply Vcc (such as a 24 Volt DC external power supply), and the reverse polarity diode RP1 may provide reverse polarity protection for thecircuit2001. Additional diodes RP2 and RP3 may provide reverse polarity protection for input control signals/pins A and B. A storage capacitor SC may be provided in parallel with the transient voltage suppressor TVS, and the storage capacitor SC may provide low pass filtering. The storage capacitor SC may also act as a storage device to provide power to thecircuit2001 during loss of external power. After external power (i.e., Vcc) is lost, the storage capacitor SC may source sufficient electrical current so that thecircuit2001 may detect the power loss and/or begin transition to a power loss operational mode until the circuit can switch to thebattery3013.
• The highvoltage generation circuit2013 may generate the high voltage HVDD using resistors RL and/or RH and inductors LL and/or LH to create inductive kickback used to charge the storage capacitor HVSC. The resistors RL and/or RH may be used to limit a maximum kickback voltage, to thereby generate a sufficiently high voltage without damaging switching circuits of the highvoltage generation circuit2013.
• A rate of current change in an inductor is dependent on a voltage applied across it. A voltage across an inductor can be calculated using the equation: V=L (di/dt), and providing a voltage across an inductor may cause the current through the inductor to rise as a ramp. If a switch sourcing/sinking current to/from the inductor is opened, a voltage across the inductor will rise because the current through the inductor cannot change suddenly due to the inductor property that V=L di/dt. When the switch is opened, the voltage across the inductor will suddenly rise to a level sufficient to force current to flow. By providing the resistors RL and RH in parallel with the inductors LL and LH, a maximum current generated by the inductors can be limited and the possibility of damaging thecircuit2001 can be reduced. As shown inFIG. 41, the inductive kickback circuit including inductor LH and resistor RH may be used to charge the high voltage storage capacitor HVSC through the charging diode CD1. During power outages, the inductive kickback circuit including inductor LL and resistor RL may be used to charge the storage capacitor SC through the charging diode CD2.
• FIGS. 47A and 47B are front and back perspective views of a valve assembly including avalve housing801′, a base851′, and an electronics sub-assembly1001′ according to some embodiments of the present invention. In the assembly ofFIGS. 47A-B, all couplings to supply, exhaust, and actuator ports may be provided through the base851′. As shown, threadedcouplings146a′ and146b′ may provide actuator ports for a pneumatic cylinder, threadedcouplings142a′ and142b′ may provide exhaust ports; and threadedcoupling144c′ may provide a high pressure supply port. The valve assembly ofFIGS. 47A-B may thus provide the same functionalities as discussed above with respect to valve assemblies and components ofFIGS. 28-40. Moreover, the electronics sub-assembly1001′ may be identical to electronic sub-assemblies discussed above with respect toFIGS. 33,35-36, and39-40.
• Moreover, thevalve housing801′ may be identical to thevalve housings801 ofFIGS. 28-34 and39-40 with the exception that there are no ports (i.e., banjo fittings815a-bor collets819a-b) on the surface of thevalve housing801′ opposite the base851′. As shown inFIGS. 47A-B a surface of thevalve housing801′ opposite the base851′ may be flat with no openings therein. The interior of thevalve housing801′, however, may include chambers, valve enclosures, leads, etc. as discussed above with respect toFIGS. 28-34 and39-40.
• Thevalve housing801′ ofFIGS. 47A-B and thevalve housing801 ofFIGS. 28-34 and39-40 may be produced using some shared tooling. More particularly, a same lower molding tool may be used to mold lower portions of thevalve housings801 and801′, wherein the same lower molding tool defines the chambers and valve enclosures of thevalve housings801 and801′. Different upper molding tools may be used to mold different upper portions of thevalve housings801 and801′. More particularly, the same lower molding tool may be used together with a first upper molding tool to mold thevalve housing801 including the banjo fittings815a-b, and the same lower molding tool may be used together with a second upper molding tool to mold thevalve housing801′ without openings in the surface of thevalve housing801′ opposite the base851′.
• As shown inFIG. 48, an extrudedaluminum manifold base851″ may provide thesame supply port144c″ and exhaust ports144a-b′ for a plurality ofvalve housings801a′ to801c′ andelectronic sub-assemblies1001a′ to1001c′, with the valve housings and electronic sub-assemblies provided as discussed above with respect toFIGS. 47A-B. Moreover, themanifold base851″ may provide separate pairs of actuator ports146aato146afand146bato146bffor each valve housing. Fluid coupling may thus be provided between thesupply port144c″ and supply chambers of each of thevalve housings801a′ to810c′. Similarly, fluid coupling may be provided between theexhaust ports142a″ and142b″ and respective exhaust chambers of each of thevalve housings801a′ to810c′. In contrast, actuator ports146aaand146bamay be coupled to respective actuator chambers of thevalve housing801a′; actuator ports146aband146bbmay be coupled to respective actuator chambers of thevalve housing801b′; and actuator ports146acand146bcmay be coupled to respective actuator chambers of the valve housing801c′.
• Additional actuator ports146adto146afand146bdto146bfmay be provided for additional valve housings coupled to themanifold base851″. Themanifold base851″ illustrated inFIG. 48, for example, is configured to accept six valve assemblies. If fewer than six valve housings are used with themanifold base851″ ofFIG. 48, unused valve housing positions may be capped to reduce leakage from thesupply port144c″. As shown inFIG. 48, each valve housing position on themanifold base851″ includescouplings893 to the respective actuator ports and to the supply and exhaust ports. If a valve housing is not provided at a valve housing position of themanifold base851″, the couplings893 (or at least the coupling to thesupply port144c″) may be capped to reduce leakage(s). In addition, themanifold base851″ may be provided with a standard connector such as a connector for a DIN rail891 (according to the Deutsche Industrie Norm standard).
• Themanifold base851″, for example, may be may be machined from an extruded aluminum profile, and may be mounted on a DIN Rail. Thesupply port144c″ and theexhaust ports142a″ and142b″ may be formed by extrusion. The actuator ports146aato146afand146bato146bfmay be machined into themanifold base851″ from a direction perpendicular to the supply and exhaust ports. Thecouplings893 for the valve housings to the supply port, the exhaust ports, and the actuator ports may be machined into the manifold base from a direction perpendicular to the supply and exhaust ports and perpendicular to the actuator ports.
• Valve chips and/or valve assemblies according to embodiments of the present invention may also be used in vacuum applications. As shown inFIGS. 49A and 49B, for example, avalve assembly4141 may define three chambers4143a-cseparated by two valve chips4131a-bsupported in valve enclosures of the valve assembly. In addition, avacuum port4142 may be coupled to a vacuum pump, arelief port4144 may be coupled to a pressure relief source (such as the atmosphere), and theoutput port4146 may be coupled to a vacuum tool4148 (such as a vacuum wand used in microelectronics fabrication industries to handle microelectronic wafers).
• As shown inFIG. 49A, a vacuum may be applied by thevacuum tool4148 by opening valve flaps of thevalve chip4131awhile closing valve flaps of the valve chip4131bso that theoutput port4146 is coupled with thevacuum port4143athroughvalve chip4131a. As shown inFIG. 49B, a vacuum may be removed from thevacuum tool4148 by opening valve flaps of the valve chip4131bwhile closing valve flaps of thevalve chip4131aso that theoutput port4146 is coupled with therelief port4143bthrough valve chip4131b. While not shown inFIGS. 49A-B, the valve chips4131a-bmay be operated under control of a controller responsive to user and/or other inputs.
• Thevalve assembly4141 may be provided, for example, using thevalve housing801 ofFIGS. 28-30 with plugs used to sealvalve enclosures803c-dclosed. In an alternative, a three chamber valve assembly may be provided. Moreover, filters may be provided in one or more of the chambers4143a-cto protect the valve chips4131a-b. Moreover, the valve chips4131a-bmay be packaged as discussed above with respect toFIGS. 6-9 and/or24-27, and/or baffles may be provided with the valve chips4131a-bas discussed above with respect toFIGS. 23-26.
• According to some embodiments of the present invention, a valve assembly and associated controls may be operated using a relatively low power battery (such as abattery513 ofFIGS. 15-17,battery1013 ofFIG. 36, and/orbattery3013 ofFIG. 42) without an external power supply. Moreover, control signals can be provided via optical communication, radio frequency communication, and/or other wireless communication so that no electrical connections are required. Such a valve assembly may thus satisfy Intrinsically Safe (1S) requirement standards for IS applications.
• Moreover, microelectromechanical systems (MEMS) valves according to some embodiments of the present invention may operate with lower wear than conventional mechanical valves. MEMS valves according to some embodiments of the present invention may thus generate fewer particulates (resulting from wear). Accordingly, MEMS valves according to some embodiments of the present invention may be especially useful in applications that are most sensitive to contamination, such as in the semiconductor industry, the pharmaceutical industry, the medical industry, the bio-medical industry, etc.
• FIG. 50A is a perspective view of an integrated pneumatic valve andcylinder assembly5001 according to embodiments of the present invention, andFIG. 50B is a cross-sectional view of theassembly5001 ofFIG. 50A. Dimensions of elements ofFIGS. 50A-B may be exaggerated for clarity. More particularly, the assembly may include a cylinder tube5003 (such as a rigid metal cylindrical tube), first andsecond end caps5005 and5007, apiston5008 in thecylinder tube5003, and arod5009 coupled to thepiston5008 and extending through thefirst end cap5005. In addition, aspring5010 may be provided in thecylinder tube5003 to push thepiston5008 androd5009 to a retracted (default) position in an unpowered (i.e., an exhausted) state.
• As shown inFIG. 50B, thesecond end cap5007 may define first, second, and third valve chambers5015a-c. Thefirst valve chamber5015amay be configured to be coupled to ahigh pressure supply5011, thesecond valve chamber5015bmay be configured to be coupled to acavity5017 within thetube cylinder5003, and the third valve chamber may be configured to be coupled to alow pressure exhaust5019. In addition, electro-statically actuated valve chips5021a-bmay be provided in thesecond end cap5007. More particularly, thevalve chip5021amay be provided between the first andsecond valve chambers5015aand5015b, and thevalve chip5021amay be configured to allow fluid communication from thefirst valve chamber5015ato thesecond valve chamber5015bor to block fluid communication between the first andsecond valve chambers5015aand5015bresponsive to electrical signals applied thereto. Similarly, thevalve chip5021bmay be provided between the second andthird valve chambers5015band5015c, and thevalve chip5021bmay be configured to allow fluid communication from thesecond valve chamber5015bto the secondthird valve chamber5015cor to block fluid communication between the second andthird valve chambers5015band5015cresponsive to electrical signals applied thereto.
• Electrical signals may be provided to the first and second valve chips5021a-bvia acoupling5023 to anelectrical bus5025. For example, extend and retract signals may be received at thesecond end cap5007 from a programmable logic controller (PLC) over theelectronic bus5025 andcoupling5023 with a control circuit at thesecond end cap5007 generating the high voltage signals and/or providing logic for sequencing, power loss operations, polarity reversal, etc. In an alternative, some or all processing of extend and retract signals may occur outside thesecond end cap5007.
• Accordingly, the valve chips5021a-bmay provide 3-way valve functionality to control extension and retraction of thepiston5008 androd5009. In a first condition, thevalve chip5021amay be closed to substantially block fluid communication between the first and second valve chambers5015a-b, and thesecond valve chip5021bmay be opened to allow fluid communication between the second andthird valve chambers5015b-c. Accordingly, thecavity5017 may be coupled through thesecond valve chip5021bto thelow pressure exhaust5019 so that thespring5010 pushes thepiston5008 androd5009 to the retracted position.
• In a second condition, thevalve chip5021amay be opened to allow fluid communication between the first and second valve chambers5015a-b, and thesecond valve chip5021bmay be closed to substantially block fluid communication between the second andthird valve chambers5015b-c. Accordingly, thecavity5017 may be coupled through thefirst valve chip5021ato thehigh pressure supply5019 so that thepiston5008 androd5009 are pushed to the extended position thereby compressing thespring5010.
• Five-way valve functionality may be provided, for example, by similarly including two valve chips in thefirst end cap5005 to thereby control a coupling of supply and exhaust pressures to a second cavity of thecylinder tube5003 between thepiston5008 and thefirst end cap5005. Accordingly, electrical and pressure couplings may be provided at both end caps. In an alternative, 5-way operations may be provided using four valve chips provided at one of the end caps with a pneumatic coupling(s) provided between the two end caps. With five-way valve operations, thespring5010 may not be required.
• The end caps5005 and5007 and thecylinder tube5003 may be formed separately and then assembled. Ends of thecylinder tube5003, for example, may be threaded to receive female threads of therespective end caps5005 and5007, or the tube and end caps may be assembled by other means known to those having skill in the art.
• The valve chips5021a-bmay be provided and/or packaged as discussed above with respect toFIG. 1-2,5-9, and/or24-27, and theend cap5007 may be formed of a rigid material by molding, turning (e.g., on a lathe), machining and/or other means known to those having skill in the art. After forming theend cap5007 including the valve chambers5015a-c, the valve chips can be inserted into an opening(s) in theend cap5007, and a base can be secured to the opening(s) in theend cap5007 before securing the end cap5007 (with the valve chips and base) to thecylinder tube5008. Theend cap5007 may thus provide a rigid valve housing, the first and second valves5015a-bmay be provided in the rigid valve housing defined by theend cap5007, and the rigid valve housing defined by theend cap5007 may be mounted directly to thecylinder tube5003. Accordingly, a fluid seal may be provided between the valve housing defined by theend cap5007 and thecylinder tube5003.
• While embodiments of the present invention have been discussed above with valve assemblies used to control pneumatic actuators including rods, valve assemblies according to embodiments of the present invention can also be used to control pneumatic actuators including rodless cylinders such as magnetically coupled cylinders and/or rotary actuators. For example, therod5009 may be eliminated from the structure ofFIGS. 50A-B, and a magnet may be coupled to thepiston5008 inside thecylinder tube5003. Accordingly, movement of the magnet with thepiston5008 inside thecylinder tube5003 may be used to affect movement of a carriage outside thecylinder tube5003.
• While the present invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.

Claims (23)

1-23. (canceled)

24. A valve assembly comprising:

a main housing defining first, second, and third chambers, the main housing further defining a first valve enclosure between the first and second chambers and a second valve enclosure between the second and third chambers;

first, second, third, and fourth electrical housing leads in the main housing with portions of each of the first and second electrical housing leads being exposed in the first valve enclosure and with portions of the third and fourth electrical housing leads being exposed in the second valve enclosure;

a first valve in the first valve enclosure electrically coupled with the first and second electrical housing leads wherein the first valve is configured to allow or substantially block fluid communication between the first and second chambers responsive to electrical signals provided on the first and second electrical housing leads;

a second valve in the second valve enclosure electrically coupled with the third and fourth electrical housing leads wherein the second valve is configured to allow or substantially block fluid communication between the second and third chambers responsive to electrical signals provided on the third and fourth electrical housing leads; and

a controller electrically coupled to the first, second, third, and fourth electrical housing leads wherein the controller is configured to generate the electrical signals to allow or substantially block fluid communication between the first and second chambers and between the second and third chambers.

25. A valve assembly according toclaim 24 wherein the first valve comprises a first planar substrate having a plurality of holes through the first planar substrate, wherein the second valve comprises a second planar substrate having a plurality of holes through the second planar substrate.

26. A valve assembly according toclaim 25 wherein the first and second planar substrates are substantially parallel with respect to each other.

27. A valve assembly according toclaim 25 wherein the first valve comprises a plurality of flexible valve flaps on a surface thereof with the flexible valve flaps being configured to open or substantially block respective holes responsive to the electrical signals applied to the first and second electrical housing leads.

28. A valve assembly according toclaim 24 further comprising a filter in at least one of the first, second, and/or third chambers.

29. A valve assembly according toclaim 24 wherein the first valve comprises a planar substrate having a plurality of holes through the substrate, and a frame surrounding and supporting the planar substrate at edge portions thereof so that central portions of the planar substrate are exposed through an opening in the frame and so that a fluid seal is provided between the frame and edges of the substrate.

30. A valve assembly according toclaim 29 wherein the first valve further comprises a baffle on the frame so that the baffle, the frame, and the planar substrate define an enclosure, and wherein the baffle includes at least one opening therein.

31. A valve assembly according toclaim 29 wherein the first valve has a wedge shaped profile.

32. A valve assembly according toclaim 24, wherein the main housing further defines a fourth chamber and a third valve enclosure between the third and fourth chambers, the valve assembly further comprising:

a fifth electrical housing lead in the main housing with portions of each of the second and fifth electrical housing leads being exposed in the third valve enclosure; and

a third valve in the third valve enclosure electrically coupled with the fifth and second electrical housing leads wherein the third valve is configured to allow or substantially block fluid communication between the third and fourth chambers responsive to electrical signals provided on the fifth and second electrical housing leads;

wherein the controller is electrically coupled to the fifth electrical housing lead and wherein the controller is configured to generate the electrical signals to allow or substantially block fluid communication between the third and fourth chambers.

33. A valve assembly according toclaim 24 further comprising:

a first flexible gasket providing a fluid seal between the first valve and the first valve enclosure; and

a second flexible gasket providing a fluid seal between the second valve and the second valve enclosure.

34. A valve assembly comprising:

a valve housing defining first and second chambers;

a valve in the housing between the first and second chambers wherein the valve includes a planar substrate having a hole therethrough and a moveable valve member adjacent to the hole, and wherein the valve is configured to allow or substantially block fluid communication between the first and second chambers; and

a filter in the second chamber of the housing.

35. A valve assembly according toclaim 34 wherein the moveable valve member comprises a flexible valve flap.

36. A valve assembly according toclaim 34 wherein the valve housing further defines a third chamber, the valve assembly further comprising:

a second valve in the housing between the second and third chambers wherein the second valve is configured to allow or substantially block fluid communication between the second and third chambers.

37. A valve assembly according toclaim 36 further comprising:

a second filter in the third chamber of the housing.

38. A valve assembly according toclaim 36 wherein the valve housing further defines a fourth chamber, the valve assembly further comprising:

a third valve in the housing between the third and fourth chambers wherein the third valve is configured to allow or substantially block fluid communication between the third and fourth chambers.

39-63. (canceled)

64. A valve assembly comprising:

a valve housing defining first, second, and third chambers;

a first valve between the first and second chambers, the first valve comprising a first valve substrate, wherein the first valve is configured to allow or substantially block fluid communication between the first and second chambers; and

a second valve between the second and third chambers, the second valve comprising a second valve substrate, wherein the second valve is configured to allow or substantially block fluid communication between the second and third chambers and wherein the first and second substrates are separate.

65. A valve assembly according toclaim 64 wherein the first and second substrates are non-parallel.

66. A valve assembly according toclaim 64 wherein the first and second valves comprises first and second electro-statically actuated valves.

67. A valve assembly according toclaim 64 wherein the first substrate comprises a first hole therethrough and a first valve member adjacent the first hole with the first valve member being configured to open and close the first hole responsive to first electrical signals applied thereto, and wherein the second substrate comprises a second hole therethrough and a second valve member adjacent the second hole with the second valve member being configured to open and close the second hole responsive to second electrical signals applied thereto.

68. A valve assembly according toclaim 67 wherein the first and second valve members comprise respective first and second flexible valve flaps.

69-88. (canceled)

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