US20110006680A1 - Light-emitting module and lighting apparatus - Google Patents
Light-emitting module and lighting apparatusDownload PDFInfo
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- US20110006680A1 US20110006680A1US12/867,134US86713409AUS2011006680A1US 20110006680 A1US20110006680 A1US 20110006680A1US 86713409 AUS86713409 AUS 86713409AUS 2011006680 A1US2011006680 A1US 2011006680A1
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- light
- substrate
- emitting
- emitting elements
- mounting surface
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Definitions
- the present inventionrelates to a light-emitting module in which a light-emitting element such as LED is arranged, and also relates to a lighting apparatus provided with the light-emitting module.
- a lighting equipmentincluding an LED module having a power feeding terminal and mounted with an LED chip disposed thereon and an apparatus body provided with a holding member for detachably holding the LED module (refer to Patent Document 1).
- a lighting equipmentalso including a terminal for connecting a power feeding line directly to the LED module so as to easily exchange the LED module or to use the LED module in various equipments (refer to Patent Document 2).
- Patent Document 1Japanese Patent Laid-Open Publication No. 2003-68129
- Patent Document 2Japanese Patent Laid-Open Publication No. 2003-59330
- Patent Document 1fails to disclose any technical idea performing excellent distribution of light radiated from the LED chip, and moreover, the rear surface of the LED module is not positively used as a heat dissipating surface. Furthermore, it is evident from the configuration of the power feeding terminal and the holding member that the disclosed LED module has a specific structure for attachment and connection, which requires a specified adaptor, thus lacking versatility.
- Patent Document 2In the equipment disclosed in Patent Document 2, LED chips and circuit components are similarly disposed on a surface of the LED module in a mixed manner. Therefore, Patent Document 2 also fails to disclose any specific technical idea performing excellent distribution of light radiated from the LED chip.
- the present inventionhas been made in view of the above circumstances, and has an object to provide a light-emitting module having excellent light emission efficiency and excellent light distribution characteristics and also provide a lighting apparatus using the light-emitting module.
- a light-emitting module of the present inventionincludes: a substrate having a front surface side constituted as a component mounting surface and a rear surface side constituted as a heat dissipating surface flat in shape; a plurality of light-emitting elements mounted at a central portion of a component mounting surface of the substrate in a manner protruding therefrom and emitting light at least in an upper surface direction and in a direction along the component mounting surface; a lighting circuit component which is electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged on a peripheral edge side of the substrate than the light emitting elements, on the component mounting surface of the substrate; and a connector for connecting with a power supply, which is arranged on the peripheral edge side of the substrate than the light emitting elements, on the component mounting surface of the substrate, and which is electrically connected to the lighting circuit component.
- a light emitting module having wide applicable rangecan be provided with excellent light distribution characteristics and made optimized. Moreover, heat dissipation effects can be promoted and the wiring pattern on the substrate can be shortened and simplified, thus being effective.
- the plurality of light-emitting elementsare arranged at even intervals in rotational symmetry except at a central point of the central portion of the component mounting surface of the substrate. According to this arrangement, since the plurality of light emitting elements are arranged, it becomes possible to perform heat radiation in a concentrated manner from a portion near the center point of the substrate toward the rear surface side thereof, thus realizing substantially even light distribution characteristics in the horizontal direction.
- the light-emitting elementsare arranged so as to satisfy a dimensional relationship of b ⁇ c ⁇ 4a. According to this arrangement, the light-emitting module having suppressed luminance irregularity is obtainable, thus providing excellent light emission efficiency.
- the lighting apparatusis desirable to be provided with an apparatus body, and the light-emitting module according to any one of claims 1 to 3 .
- the “lighting apparatus”may include a light source having a cap, and lighting equipment used indoors or outdoors.
- the lighting apparatus provided with the light-emitting modulecan achieve the effects obtainable by the light-emitting module.
- FIG. 1is a plan view illustrating a first embodiment of a light-emitting module according to the present invention.
- FIG. 2is a partial side view, in an enlarged scale, illustrating the light-emitting module according to the present invention.
- FIG. 3is a circuit diagram of the light-emitting module according to the present invention.
- FIG. 4is a schematic diagram illustrating a structure of a first embodiment of a lighting apparatus according to the present invention.
- FIG. 5is a schematic diagram illustrating a structure of a second embodiment of the lighting apparatus according to the present invention.
- FIG. 6is a schematic diagram illustrating a structure of a third embodiment of the lighting apparatus of the present invention.
- FIG. 7is a plan view illustrating a modification of the light-emitting module according to the first embodiment.
- FIG. 8is a plan view ( 8 ( a ) and a side view 8 ( b )) illustrating the light-emitting element (LED package) according to the first embodiment of the light-emitting module.
- FIG. 9is a graph showing a directional pattern of radiant light of the light-emitting element.
- FIG. 10is a plan view illustrating an arrangement of the light-emitting elements.
- FIG. 11is a schematic view showing illuminance distribution on a floor surface when the light-emitting module is lightened.
- FIG. 12is a graph representing luminance irregularity and light emitting efficiency relative to the interval between the light-emitting elements.
- FIG. 13is an explanatory view illustrating an example of another application of the light-emitting element.
- FIG. 1is a plan view illustrating a light-emitting module
- FIG. 2is a partial enlarged side view illustrating a light-emitting element
- FIG. 3is a circuit diagram of the light-emitting module.
- a light-emitting module 1includes a disc-shaped substrate 2 , light-emitting elements 3 mounted on the substrate 2 , a lighting circuit components 4 , and a connector 5 for power source connection.
- the substrate 2is made of aluminum, which is formed into a disc plate shape, and having a thickness of about 1.5 mm and a diameter of about 70 mm.
- a front surface side 2 ais used as a component mounting surface
- a rear surface side 2 bis used as a flat-shaped heat dissipating surface.
- eight light-emitting elements 3are mounted in a manner concentrated in the central portion of the component mounting surface in a pattern spaced with a predetermined interval from each other.
- the substrate 2is made of metal, it is preferred to use a material such as aluminum or copper which is excellent in heat conductivity and heat dissipation characteristics.
- the substrate 2when an insulating material is used for the substrate 2 , a synthetic resin material or a ceramic material containing thermal conduction filler, which has relatively excellent heat dissipation characteristics and excellent durability, may be utilized.
- the substrate 2may be formed of glass epoxy resin or the like. Further, the shape of the substrate 2 is not limited to circle and may be quadrangle or polygon.
- the light-emitting elements 3are a surface-mounted LED package and are mainly constituted of a main body 3 a formed of ceramic, an LED chip mounted on the main body and a translucent resin 3 b for mold use, such as epoxy resin or silicon resin, which seals the LED chip (refer to FIG. 2 ).
- a pair of lead terminals, not shown, connected to the LED chipprojects from the main body 3 a in a horizontal direction.
- the LED packagefour LED chips are mounted, which are connected in series between electrodes of the package, and accordingly, since eight LED packages each having four LED chips are arranged, totally, thirty two (32) LED chips are arranged. Needless to say, an LED package may also be used in which a single LED chip is mounted.
- the LED chipis a blue LED chip emitting blue light.
- the translucent resin 3 b for mold usecontains a fluorescent material which absorbs light emitted by the LED chip and generates yellow light.
- the LED chipis molded on an upper surface of the main body 3 a so as to form a flat plate with a predetermined thickness. Accordingly, light from the LED chip is irradiated from an upper surface and a side surface of the translucent resin 3 b of the LED package to the outside, and hence, the light from the LED chip has a white-base luminescent color such as white color or electric bulb color and has wide light distribution characteristics. That is, light is irradiated from the light-emitting elements 3 in a direction of the upper surface thereof and in a direction along the component mounting surface. Further, the LED package is about 3.5 mm in breadth, 3.5 mm in width and 1.5 mm in height and has a shape of a substantially rectangular solid.
- An insulating layeris formed on a surface of the substrate 2 , and on such insulating layer, a connection land connected to lead terminals of the surface-mounted components and a wiring pattern, not shown, are formed.
- the light-emitting elements 3are arranged at a predetermined interval (3 mm to 15 mm, preferably 5 mm to 10 mm) in rotational symmetry (in the present embodiment, being 45° symmetry relative to the light emission center of the light-emitting elements 3 ) around the central point along a direction of the front surface of the substrate 2 .
- the lighting circuit components 4are arranged and mounted in an outer peripheral edge side of the substrate 2 , and in this case, the lighting circuit components 4 are never mounted between the light-emitting elements 3 and 3 .
- the lighting circuit components 4are used for lighting control of the LED chip, and include a fuse F, a capacitor C, a rectifier REC, a constant voltage diode ZD, resistors R 1 and R 2 , and a transistor Q.
- a connector 5 for connecting with a power supplyis similarly arranged in a position around the light-emitting elements 3 .
- the connector 5is arranged so that a connection opening 5 a thereof faces the outer peripheral edge of the substrate 2 and is disposed close to the outer peripheral edge.
- the lighting circuit components 4 and the connector 5are disposed closer to the outer peripheral edge side of the substrate 2 than the light-emitting elements 3 , and arranged not in a dispersed manner but in a relatively concentrated manner (in a region disposed approximately 1 ⁇ 3 from the outer circumference of the substrate 2 ) to shorten the wiring pattern of the substrate 2 .
- a white resist having a high reflectivityis printed, and three screw through-holes 6 are formed on the mounting surface to be mounted onto an apparatus or the like.
- the light-emitting elements 3protrude from the mounting surface of the substrate 2 in a direction of height, and radiate, as indicated by the arrow in FIG. 2 , light in a radial pattern from a protruding portion of the translucent resin 3 b. Accordingly, not only the light LV radiated in a direction perpendicular (upper surface direction) to the mounting surface, but also the light LH radiated from the side surface of the translucent resin 3 b of the LED package along the component mounting surface can be used.
- the capacitor Cis connected via the fuse F across a commercial power supply AC.
- the full-wave rectifier RECis connected across the capacitor C, and in the output terminal of the full-wave rectifier REC, a series circuit of the resistor R 1 and the constant voltage diode ZD, and a series circuit of a plurality of the LED chips LED, the NPN transistor Q and the resistor R 2 are connected in parallel.
- a base of the transistor Qis connected to a connecting point between the resistor R 1 and the constant voltage diode ZD.
- four LED chipsare, as described above, connected in series, and hence, a series circuit of the transistor Q and the resistor R 2 may be constructed for each of the LED packages and then connected in parallel with each other.
- a constant current circuitis constituted by the circuit mentioned above, and a current supplied from the commercial power supply AC is converted to a DC current, and such DC current flows, as constant current IF, in the series circuit of the LED chips LED, the transistor Q and the resistor R 2 . More specifically, a base voltage VB of the transistor Q is kept constant by the constant voltage diode ZD so that current IC flowing into a collector of the transistor Q is kept constant, and as a result, the current IF flowing in the LED chip is made constant.
- the light-emitting elements 3are arranged in the central portion of the component mounting surface of the substrate 2 , and the lighting circuit components 4 and the connector 5 for connecting with power supply are arranged around the light-emitting elements 3 . Accordingly, the light LH radiated from the side surface of the light-emitting elements 3 , i.e., the LED packages, can be effectively used, making excellent light distribution and also optimizing light distribution.
- the lighting circuit components 4 and the connector 5 for connecting with power supplyare arranged in a mixed manner, particularly, the light LH radiated from the side surface of the LED package is interrupted by the lighting circuit components 4 and the like, thus lowering light extraction factor of the radiant light, not allowing effective use of the radiant light, lowering the lighting efficiency and adversely affecting the optimization of light distribution.
- the lowering of light extraction factor of the radiant light by the lighting circuit components 4 and the likeis reduced, and hence, the light LH radiated from the side surface can be effectively used.
- the radiant light LHmay be radiated in a direction of a surface to be irradiated.
- the light-emitting elements 3 , the lighting circuit components 4 and the connector 5 for connecting with power supplyare arranged in a concentrated manner, and as a result, the wiring pattern of the substrate 2 is shortened and simplified.
- the light-emitting elements 3 as the heat sourcesare not arranged at the central portion of the substrate 2 , and a rear surface side is formed as a flat heat dissipating surface, when the heat dissipating surface is in contact with another heat dissipating member, the heat is effectively transmitted from the central portion of the substrate 2 to the rear surface side, thereby easily realizing a configuration improving the heat dissipation effects.
- a lighting apparatuscan be provided merely by incorporating the substrate module 1 in the apparatus body and then connecting a commercial power supply to the connector 5 .
- the light-emitting module 1can be handled as a single common part having a wide applicable field.
- the connector 5is arranged so that the connection opening 5 a thereof is disposed close to the outer peripheral edge of the substrate 2 , the connection with a power line of a commercial power supply is readily made, and in addition, since the white resist is printed on the mounting surface of the substrate 2 , the excellent reflection efficiency can be provided.
- FIG. 4is an illustration showing schematic structure of a lighting apparatus.
- a lighting apparatus 10is, for example, a downlight and includes an apparatus body 11 . Included in the apparatus body 11 are a heat dissipating member 12 made of metal having heat dissipating fins, a light-emitting module 1 attached to the heat dissipating member 12 , and a reflector 13 .
- the light-emitting module 1is screwed to the heat dissipating member 12 so that a heat dissipating surface on a rear surface side 2 b of the substrate 2 is closely attached to the heat dissipating member 12 through a silicon rubber sheet.
- the reflector 13has a shape of a bowl having a gently curved surface and has an opening in its upper and lower ends. The upper end constitutes a mounting opening 13 a, and the lower end constitutes a radiating opening 13 b.
- the mounting opening 13 a of the reflector 13is disposed so as to separate the light-emitting elements 3 from the lighting circuit components 4 and the connector 5 for connecting with power supply, arranged around the light-emitting elements 3 . That is, the light-emitting elements 3 are divided from the lighting circuit components 4 and the like by the reflector 13 .
- the light radiated from the light-emitting elements 3is not interrupted by the lighting circuit components 4 and the like and is reflected on the reflector 13 and radiated downward. Further, since the lighting circuit components 4 are not seen from the front surface side of the reflector 13 , the outer appearance of the lighting apparatus 10 can be also improved.
- the lighting apparatus 10capable of achieving more effective distribution of the radiant light from the light-emitting elements 3 in addition to the above described effects of the light-emitting module 1 .
- the lighting apparatusis not limited to the above embodiment, and the light-emitting module 1 may be mounted in a light source having a cap, or may be incorporated in lighting equipment used indoors or outdoors.
- a downlight type lighting apparatususing an electric-bulb shaped LED lamp as the light source, is shown.
- the lighting apparatus mounted on a ceiling surfaceincludes an apparatus body 10 and a light source 20 having a shape of an electric bulb, mounted to the apparatus body 10 .
- the light source 20includes: a light-emitting module 1 according to the first embodiment having the light-emitting elements 3 mounted thereon; a main body 21 thermally coupled to the light-emitting module 1 and working as a heat dissipating member; and a glove 22 attached, through an insulating member, to the main body 21 so as to cover, for example, a cap of E26 and the light-emitting module 1 .
- the apparatus body 10includes a. case 15 made of metal and having a box-shaped structure having an opening in formed in a lower surface thereof, and a reflector 16 made of metal fitted into the opening of the case 15 .
- the reflector 16is formed by a metal plate of aluminum or the like, for example, and a decorative frame 16 a is formed to a peripheral portion of the lower surface of the reflector 16 .
- a socket 17in which the cap of the light source 20 is screwed, is arranged at the center of an upper surface plate of the reflector 16 .
- the socket 17is attached to the case 15 via a support plate 18 secured to the inner side of the case 15 .
- a lighting apparatuswith an LED lamp in the shape of an electric bulb, which achieves the effects mentioned above with reference to the light-emitting module 1 .
- a third embodiment of the lighting apparatus according to the present inventionwill be described hereunder with reference to FIG. 6 .
- the like reference numeralsare applied to portions or elements corresponding to those of the second embodiment, and repeated explanation thereof is omitted herein.
- a lighting apparatusillustrated as a downlight, using a thin LED lamp, as a light source 20 , having thickness smaller in a height direction of height.
- the light-emitting module 1 of the first embodimentis mounted in the light source 20 in a similar manner, and a main body 21 functioning as a heat dissipating member is thermally coupled to the light-emitting module 1 .
- a capis provided with a connecting pin 25 formed into GX53-shape.
- a socket 17is mounted to a case 15 , and connecting pins 25 for the cap are electrically and mechanically connected to the socket 17 .
- a lighting apparatus with a thin-type LED lampcapable of achieving the effects of the light-emitting module 1 .
- FIG. 7is a plan view illustrating a light-emitting module.
- the like reference numeralsare added to portions or elements corresponding to those of the first embodiment, and repeated explanation thereof is omitted herein.
- Lighting circuit components 4are mounted on a component mounting surface of a substrate 2 in a manner concentrated in the central portion thereof.
- the lighting circuit components 4include a fuse F, a capacitor C, a rectifier REC, a constant voltage diode ZD, resistors R 1 and R 2 , and a transistor Q.
- the light-emitting elements 3are mounted around the lighting circuit components 4 in a pattern spaced with a predetermined interval from each other.
- a connector 5 for power supply connectionis arranged so that a connection opening 5 a thereof is disposed close to the outer peripheral edge of the substrate 2 .
- the connector 5 for the power supply connectionis disposed to a portion in the vicinity of the outer periphery of the substrate 2 , the connector may be arranged at the central portion together with the lighting circuit component 4 .
- the positional arrangement of the light-emitting elements 3 and the lighting circuit components 4 of the first embodimentare reversed, and since the mounting interval of the light-emitting elements 3 is greater than that of the first embodiment, light LH radiated from the side surface of the LED package can be effectively utilized as like as in the first embodiment, and in addition, by increasing the interval between the light-emitting elements 3 , 3 . . . , the heat of the light-emitting elements 3 can be transmitted and dissipated to the rear side of the substrate 2 by effectively utilizing the entire structure of the substrate 2 .
- the light-emitting elements 3constitute a surface-mounted LED package and are composed of a main body 3 a, an LED chip mounted on the main body 3 a, and a translucent resin 3 b for sealing the LED chip, and this translucent resin 3 b functions as a light-emitting unit L.
- the light-emitting unit Lis, as illustrated in FIG. 8( a ), formed so as to have a substantially quadrate shape which is 2.8 mm on a side (W) and about 4 mm on a diagonal (a).
- the light-emitting element 3 mounted on the substrate 2is 1.5 mm in height (b) from the mounting surface of the substrate 2 to an upper surface of the light-emitting unit L and is 0.7 mm in height (h) of the light-emitting unit L.
- FIG. 9is a graph showing a directional characteristics or pattern of the light-emitting elements 3 .
- the light-emitting element 3has a maximum illuminance in a direction perpendicular to the upper surface, i.e., at a radiation angle of 0°, and as for a direction of the side surface, has a illuminance 40 percent or greater relative to the maximum illuminance at a radiation angle of 80° and a illuminance 50 percent or greater relative to the maximum illuminance at a radiation angle of 70°, thus radiating a given amount of light in a direction along the component mounting surface.
- the light-emitting elements 3 having such configuration and characteristicswere arranged in a pattern spaced at a predetermined interval from each other as shown in FIG. 10 . Thereafter, luminance irregularity and light-emitting efficiency were measured and evaluated by changing the interval.
- character cdenotes a minimum distance between the light-emitting units L 1 and L 2
- character adenotes a width of the light-emitting units L 1 and L 2 on a line of the minimum distance c.
- the method of evaluating luminance irregularitywas made such that the light-emitting module 1 was made to glow at a height of 2.5 m from the floor surface to illuminate the floor surface, and the state of illumination on the floor was observed to perform visual evaluation. This visual evaluation was, as illustrated in FIG. 11 , performed by observing illuminance distribution on the floor. Further, FIG.
- FIG. 11is a figure that schematically illustrates, with the solid line, a boundary line at which illuminance difference appears, more specifically, an image of light-emitting pattern (mounting pattern image of the light-emitting elements 3 ) of the light-emitting elements 3 .
- the evaluationis ranked as follows.
- pattern Aluminance irregularity is not noticed at all
- pattern Bluminance irregularity is hardly noticed
- pattern Cluminance irregularity is noticed
- pattern Dluminance irregularity is clearly observed.
- the interval between the light-emitting units L of the light-emitting elements 3is small, the luminance irregularity may be eliminated, the adjacent light-emitting elements 3 interrupt the radiant light, thus lowering light emission efficiency.
- the interval between the light-emitting units Lis wide, the light emission efficiency becomes high, but the luminance irregularity tends to occur.
- the abscissaindicates interval c between the light-emitting units L of the light-emitting elements 3
- the ordinateindicates luminance irregularity evaluation and measurement values of light emission efficiency.
- the interval c between the light-emitting elements 3was preferably greater than b and smaller than 4a (b ⁇ c ⁇ 4a). Furthermore, it was resulted that the optimum range in the above range for further enhancing luminance irregularity evaluation and improving the light emission efficiency was a range of 2b ⁇ c ⁇ 3a. Still furthermore, in order to suppress effect due to heat generation between the light-emitting elements 3 , an optimum arrangement pattern was a ⁇ c. In the case of a ⁇ c, the temperature of the light-emitting elements 3 during glowing could be suppressed from rising.
- a lower limit value of the above interval cmay also be represented by height h of the light-emitting unit L, and when this height h is used, a relationship of approximately 2h ⁇ c, preferably, 4h ⁇ c will be obtained.
- the present embodimentwas described with reference to as an example by considering the relationship between the light-emitting units L 1 and L 2 of the light-emitting elements 3 illustrated in FIG. 10 .
- the dimensional relationship of the interval c in the light-emitting units L 2 and L 3is similar to that of the light-emitting units L 1 and L 2 .
- the dimensions, the directional characteristics and the like of the light-emitting elements 3are not limited to the specific dimensions and characteristics described with reference to this embodiment.
- the mounting pattern of the light-emitting elements 3is not limited to the pattern in which light-emitting elements 3 are, as illustrated in FIG. 10 , arranged on the circumference, and it may be sufficient that minimum distance c between the light-emitting elements 3 falls into the above prescribed range.
- the light-emitting elements 3may be arranged in a matrix pattern.
- a light-emitting element 30 illustrated in FIG. 13may also be used as the light-emitting element.
- This light-emitting element 30is a surface-mounted LED package, and this LED package is composed of a main body 30 a formed of ceramics, a reflector 30 d arranged on the main body 30 a, an LED chip 30 c mounted in a recess defined by the main body 30 a and the reflector 30 d, and a silicon resin 30 e for sealing the LED chip 30 c.
- This silicon resin 30 efunctions as the light-emitting unit L, and light is radiated from the light-emitting unit L in a radial pattern which is similar, as a whole, to the directional characteristics illustrated in FIG. 9 , including an upper surface direction and a direction along the component mounting surface.
- a light-emitting modulehaving a wide applicable scope and improving and optimizing the distribution of light radiated from the light-emitting element.
- the heat dissipation effectscan be raised, and an effect of shortening and simplifying a wiring pattern on a substrate can be also achieved.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Led Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
Description
- The present invention relates to a light-emitting module in which a light-emitting element such as LED is arranged, and also relates to a lighting apparatus provided with the light-emitting module.
- Conventionally, there has been provided a lighting equipment including an LED module having a power feeding terminal and mounted with an LED chip disposed thereon and an apparatus body provided with a holding member for detachably holding the LED module (refer to Patent Document 1). There is also provided a lighting equipment also including a terminal for connecting a power feeding line directly to the LED module so as to easily exchange the LED module or to use the LED module in various equipments (refer to Patent Document 2).
- Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-68129
- Patent Document 2: Japanese Patent Laid-Open Publication No. 2003-59330
- In the equipment disclosed in
Patent Document 1, however, though not specifically described, at least LED chips and circuit components are disposed on a surface of the LED module in a mixed manner. Therefore, thePatent Document 1 fails to disclose any technical idea performing excellent distribution of light radiated from the LED chip, and moreover, the rear surface of the LED module is not positively used as a heat dissipating surface. Furthermore, it is evident from the configuration of the power feeding terminal and the holding member that the disclosed LED module has a specific structure for attachment and connection, which requires a specified adaptor, thus lacking versatility. - In the equipment disclosed in
Patent Document 2, LED chips and circuit components are similarly disposed on a surface of the LED module in a mixed manner. Therefore,Patent Document 2 also fails to disclose any specific technical idea performing excellent distribution of light radiated from the LED chip. - The present invention has been made in view of the above circumstances, and has an object to provide a light-emitting module having excellent light emission efficiency and excellent light distribution characteristics and also provide a lighting apparatus using the light-emitting module.
- A light-emitting module of the present invention includes: a substrate having a front surface side constituted as a component mounting surface and a rear surface side constituted as a heat dissipating surface flat in shape; a plurality of light-emitting elements mounted at a central portion of a component mounting surface of the substrate in a manner protruding therefrom and emitting light at least in an upper surface direction and in a direction along the component mounting surface; a lighting circuit component which is electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged on a peripheral edge side of the substrate than the light emitting elements, on the component mounting surface of the substrate; and a connector for connecting with a power supply, which is arranged on the peripheral edge side of the substrate than the light emitting elements, on the component mounting surface of the substrate, and which is electrically connected to the lighting circuit component.
- According to the present invention, a light emitting module having wide applicable range can be provided with excellent light distribution characteristics and made optimized. Moreover, heat dissipation effects can be promoted and the wiring pattern on the substrate can be shortened and simplified, thus being effective.
- Furthermore, in the present invention of the above aspect, it may be desired that the plurality of light-emitting elements are arranged at even intervals in rotational symmetry except at a central point of the central portion of the component mounting surface of the substrate. According to this arrangement, since the plurality of light emitting elements are arranged, it becomes possible to perform heat radiation in a concentrated manner from a portion near the center point of the substrate toward the rear surface side thereof, thus realizing substantially even light distribution characteristics in the horizontal direction.
- Furthermore, in the present invention of the above aspect, it may be desired that when it is supposed that a minimum distance between light-emitting portions of the plurality of the light-emitting elements arranged is c, a width of the light-emitting portion on a line of the minimum distance c is a, and a height from the mounting surface of the substrate to an upper surface of the light-emitting portion is b, the light-emitting elements are arranged so as to satisfy a dimensional relationship of b<c<4a. According to this arrangement, the light-emitting module having suppressed luminance irregularity is obtainable, thus providing excellent light emission efficiency.
- Still furthermore, in the present invention, the lighting apparatus is desirable to be provided with an apparatus body, and the light-emitting module according to any one of
claims 1 to3. Here, the “lighting apparatus” may include a light source having a cap, and lighting equipment used indoors or outdoors. - According to the above structure, the lighting apparatus provided with the light-emitting module can achieve the effects obtainable by the light-emitting module.
- [
FIG. 1 ] is a plan view illustrating a first embodiment of a light-emitting module according to the present invention. - [
FIG. 2 ] is a partial side view, in an enlarged scale, illustrating the light-emitting module according to the present invention. - [
FIG. 3 ] is a circuit diagram of the light-emitting module according to the present invention. - [
FIG. 4 ] is a schematic diagram illustrating a structure of a first embodiment of a lighting apparatus according to the present invention. - [
FIG. 5 ] is a schematic diagram illustrating a structure of a second embodiment of the lighting apparatus according to the present invention. - [
FIG. 6 ] is a schematic diagram illustrating a structure of a third embodiment of the lighting apparatus of the present invention. - [
FIG. 7 ] is a plan view illustrating a modification of the light-emitting module according to the first embodiment. - [
FIG. 8 ] is a plan view (8(a) and a side view8(b)) illustrating the light-emitting element (LED package) according to the first embodiment of the light-emitting module. - [
FIG. 9 ] is a graph showing a directional pattern of radiant light of the light-emitting element. - [
FIG. 10 ] is a plan view illustrating an arrangement of the light-emitting elements. - [
FIG. 11 ] is a schematic view showing illuminance distribution on a floor surface when the light-emitting module is lightened. - [
FIG. 12 ] is a graph representing luminance irregularity and light emitting efficiency relative to the interval between the light-emitting elements. - [
FIG. 13 ] is an explanatory view illustrating an example of another application of the light-emitting element. - A first embodiment of the present invention will be described below with reference to
FIGS. 1 to 3 .FIG. 1 is a plan view illustrating a light-emitting module,FIG. 2 is a partial enlarged side view illustrating a light-emitting element, andFIG. 3 is a circuit diagram of the light-emitting module. - Referring to
FIG. 1 , a light-emitting module 1 includes a disc-shaped substrate 2, light-emitting elements 3 mounted on thesubstrate 2, alighting circuit components 4, and aconnector 5 for power source connection. - The
substrate 2 is made of aluminum, which is formed into a disc plate shape, and having a thickness of about 1.5 mm and a diameter of about 70 mm. In thesubstrate 2, afront surface side 2ais used as a component mounting surface, and arear surface side 2bis used as a flat-shaped heat dissipating surface. On the component mounting surface, eight light-emittingelements 3 are mounted in a manner concentrated in the central portion of the component mounting surface in a pattern spaced with a predetermined interval from each other. When thesubstrate 2 is made of metal, it is preferred to use a material such as aluminum or copper which is excellent in heat conductivity and heat dissipation characteristics. On the other hand, when an insulating material is used for thesubstrate 2, a synthetic resin material or a ceramic material containing thermal conduction filler, which has relatively excellent heat dissipation characteristics and excellent durability, may be utilized. In the case of using the synthetic resin material, thesubstrate 2 may be formed of glass epoxy resin or the like. Further, the shape of thesubstrate 2 is not limited to circle and may be quadrangle or polygon. - The light-emitting
elements 3 are a surface-mounted LED package and are mainly constituted of amain body 3aformed of ceramic, an LED chip mounted on the main body and atranslucent resin 3bfor mold use, such as epoxy resin or silicon resin, which seals the LED chip (refer toFIG. 2 ). A pair of lead terminals, not shown, connected to the LED chip projects from themain body 3ain a horizontal direction. In the LED package, four LED chips are mounted, which are connected in series between electrodes of the package, and accordingly, since eight LED packages each having four LED chips are arranged, totally, thirty two (32) LED chips are arranged. Needless to say, an LED package may also be used in which a single LED chip is mounted. - The LED chip is a blue LED chip emitting blue light. The
translucent resin 3bfor mold use contains a fluorescent material which absorbs light emitted by the LED chip and generates yellow light. The LED chip is molded on an upper surface of themain body 3aso as to form a flat plate with a predetermined thickness. Accordingly, light from the LED chip is irradiated from an upper surface and a side surface of thetranslucent resin 3bof the LED package to the outside, and hence, the light from the LED chip has a white-base luminescent color such as white color or electric bulb color and has wide light distribution characteristics. That is, light is irradiated from the light-emittingelements 3 in a direction of the upper surface thereof and in a direction along the component mounting surface. Further, the LED package is about 3.5 mm in breadth, 3.5 mm in width and 1.5 mm in height and has a shape of a substantially rectangular solid. - An insulating layer is formed on a surface of the
substrate 2, and on such insulating layer, a connection land connected to lead terminals of the surface-mounted components and a wiring pattern, not shown, are formed. In the central portion of thesubstrate 2 except at a central point thereof, the light-emitting elements 3 are arranged at a predetermined interval (3 mm to 15 mm, preferably 5 mm to 10 mm) in rotational symmetry (in the present embodiment, being 45° symmetry relative to the light emission center of the light-emitting elements3) around the central point along a direction of the front surface of thesubstrate 2. Further, thelighting circuit components 4 are arranged and mounted in an outer peripheral edge side of thesubstrate 2, and in this case, thelighting circuit components 4 are never mounted between the light-emitting elements lighting circuit components 4 are used for lighting control of the LED chip, and include a fuse F, a capacitor C, a rectifier REC, a constant voltage diode ZD, resistors R1 and R2, and a transistorQ. A connector 5 for connecting with a power supply is similarly arranged in a position around the light-emitting elements 3. Theconnector 5 is arranged so that a connection opening5athereof faces the outer peripheral edge of thesubstrate 2 and is disposed close to the outer peripheral edge. This is for the purpose of facilitating the connection with a power line of commercial power supply. Thelighting circuit components 4 and theconnector 5 are disposed closer to the outer peripheral edge side of thesubstrate 2 than the light-emittingelements 3, and arranged not in a dispersed manner but in a relatively concentrated manner (in a region disposed approximately ⅓ from the outer circumference of the substrate2) to shorten the wiring pattern of thesubstrate 2. On the mounting surface of thesubstrate 2, a white resist having a high reflectivity is printed, and three screw through-holes 6 are formed on the mounting surface to be mounted onto an apparatus or the like. - The light-emitting
elements 3 protrude from the mounting surface of thesubstrate 2 in a direction of height, and radiate, as indicated by the arrow inFIG. 2 , light in a radial pattern from a protruding portion of thetranslucent resin 3b.Accordingly, not only the light LV radiated in a direction perpendicular (upper surface direction) to the mounting surface, but also the light LH radiated from the side surface of thetranslucent resin 3bof the LED package along the component mounting surface can be used. - Referring to the circuit diagram of
FIG. 3 , the capacitor C is connected via the fuse F across a commercial power supply AC. The full-wave rectifier REC is connected across the capacitor C, and in the output terminal of the full-wave rectifier REC, a series circuit of the resistor R1 and the constant voltage diode ZD, and a series circuit of a plurality of the LED chips LED, the NPN transistor Q and the resistor R2 are connected in parallel. A base of the transistor Q is connected to a connecting point between the resistor R1 and the constant voltage diode ZD. In the LED package, four LED chips are, as described above, connected in series, and hence, a series circuit of the transistor Q and the resistor R2 may be constructed for each of the LED packages and then connected in parallel with each other. - A constant current circuit is constituted by the circuit mentioned above, and a current supplied from the commercial power supply AC is converted to a DC current, and such DC current flows, as constant current IF, in the series circuit of the LED chips LED, the transistor Q and the resistor R2. More specifically, a base voltage VB of the transistor Q is kept constant by the constant voltage diode ZD so that current IC flowing into a collector of the transistor Q is kept constant, and as a result, the current IF flowing in the LED chip is made constant.
- According to the present embodiment described above, the light-emitting
elements 3 are arranged in the central portion of the component mounting surface of thesubstrate 2, and thelighting circuit components 4 and theconnector 5 for connecting with power supply are arranged around the light-emittingelements 3. Accordingly, the light LH radiated from the side surface of the light-emittingelements 3, i.e., the LED packages, can be effectively used, making excellent light distribution and also optimizing light distribution. That is, when the light-emittingelements 3, thelighting circuit components 4 and theconnector 5 for connecting with power supply are arranged in a mixed manner, particularly, the light LH radiated from the side surface of the LED package is interrupted by thelighting circuit components 4 and the like, thus lowering light extraction factor of the radiant light, not allowing effective use of the radiant light, lowering the lighting efficiency and adversely affecting the optimization of light distribution. - According to the present embodiment, the lowering of light extraction factor of the radiant light by the
lighting circuit components 4 and the like is reduced, and hence, the light LH radiated from the side surface can be effectively used. For example, when a reflector is used, the radiant light LH may be radiated in a direction of a surface to be irradiated. In addition, the light-emittingelements 3, thelighting circuit components 4 and theconnector 5 for connecting with power supply are arranged in a concentrated manner, and as a result, the wiring pattern of thesubstrate 2 is shortened and simplified. - Further, since the light-emitting
elements 3 as the heat sources are not arranged at the central portion of thesubstrate 2, and a rear surface side is formed as a flat heat dissipating surface, when the heat dissipating surface is in contact with another heat dissipating member, the heat is effectively transmitted from the central portion of thesubstrate 2 to the rear surface side, thereby easily realizing a configuration improving the heat dissipation effects. - Furthermore, since a modular structure including the
connector 5 for connecting with power supply is achieved, a lighting apparatus can be provided merely by incorporating thesubstrate module 1 in the apparatus body and then connecting a commercial power supply to theconnector 5. Thus, the light-emittingmodule 1 can be handled as a single common part having a wide applicable field. Furthermore, since theconnector 5 is arranged so that the connection opening5athereof is disposed close to the outer peripheral edge of thesubstrate 2, the connection with a power line of a commercial power supply is readily made, and in addition, since the white resist is printed on the mounting surface of thesubstrate 2, the excellent reflection efficiency can be provided. - Hereunder, a first embodiment of a lighting apparatus according to the present invention will be described with reference to
FIG. 4 . FIG. 4 is an illustration showing schematic structure of a lighting apparatus. Referring toFIG. 4 , alighting apparatus 10 is, for example, a downlight and includes anapparatus body 11. Included in theapparatus body 11 are aheat dissipating member 12 made of metal having heat dissipating fins, a light-emittingmodule 1 attached to theheat dissipating member 12, and areflector 13. The light-emittingmodule 1 is screwed to theheat dissipating member 12 so that a heat dissipating surface on arear surface side 2bof thesubstrate 2 is closely attached to theheat dissipating member 12 through a silicon rubber sheet. Needless to say, this mounting of the light-emittingmodule 1 may be made by means of bonding or the like, instead of screw fastening. Thereflector 13 has a shape of a bowl having a gently curved surface and has an opening in its upper and lower ends. The upper end constitutes a mountingopening 13a,and the lower end constitutes a radiatingopening 13b.- As for the positional relationship with the light-emitting
module 1, i.e., the positional relationship with the component mounting surface of thesubstrate 2, the mountingopening 13aof thereflector 13 is disposed so as to separate the light-emittingelements 3 from thelighting circuit components 4 and theconnector 5 for connecting with power supply, arranged around the light-emittingelements 3. That is, the light-emittingelements 3 are divided from thelighting circuit components 4 and the like by thereflector 13. Thus, the light radiated from the light-emittingelements 3 is not interrupted by thelighting circuit components 4 and the like and is reflected on thereflector 13 and radiated downward. Further, since thelighting circuit components 4 are not seen from the front surface side of thereflector 13, the outer appearance of thelighting apparatus 10 can be also improved. - According to the present embodiment, there is provided the
lighting apparatus 10 capable of achieving more effective distribution of the radiant light from the light-emittingelements 3 in addition to the above described effects of the light-emittingmodule 1. - The lighting apparatus is not limited to the above embodiment, and the light-emitting
module 1 may be mounted in a light source having a cap, or may be incorporated in lighting equipment used indoors or outdoors. - A second embodiment of the lighting apparatus according to the present invention will be described hereunder with reference to
FIG. 5 . - In this embodiment, a downlight type lighting apparatus, using an electric-bulb shaped LED lamp as the light source, is shown.
- Referring to
FIG. 5 , the lighting apparatus mounted on a ceiling surface includes anapparatus body 10 and alight source 20 having a shape of an electric bulb, mounted to theapparatus body 10. - The
light source 20 includes: a light-emittingmodule 1 according to the first embodiment having the light-emittingelements 3 mounted thereon; amain body 21 thermally coupled to the light-emittingmodule 1 and working as a heat dissipating member; and aglove 22 attached, through an insulating member, to themain body 21 so as to cover, for example, a cap of E26 and the light-emittingmodule 1. - The
apparatus body 10 includes a.case 15 made of metal and having a box-shaped structure having an opening in formed in a lower surface thereof, and areflector 16 made of metal fitted into the opening of thecase 15. Thereflector 16 is formed by a metal plate of aluminum or the like, for example, and adecorative frame 16ais formed to a peripheral portion of the lower surface of thereflector 16. Asocket 17, in which the cap of thelight source 20 is screwed, is arranged at the center of an upper surface plate of thereflector 16. Thesocket 17 is attached to thecase 15 via asupport plate 18 secured to the inner side of thecase 15. - According to the present embodiment, there is provided a lighting apparatus with an LED lamp in the shape of an electric bulb, which achieves the effects mentioned above with reference to the light-emitting
module 1. - A third embodiment of the lighting apparatus according to the present invention will be described hereunder with reference to
FIG. 6 . The like reference numerals are applied to portions or elements corresponding to those of the second embodiment, and repeated explanation thereof is omitted herein. - In this embodiment, there is provided a lighting apparatus illustrated as a downlight, using a thin LED lamp, as a
light source 20, having thickness smaller in a height direction of height. The light-emittingmodule 1 of the first embodiment is mounted in thelight source 20 in a similar manner, and amain body 21 functioning as a heat dissipating member is thermally coupled to the light-emittingmodule 1. A cap is provided with a connectingpin 25 formed into GX53-shape. Asocket 17 is mounted to acase 15, and connectingpins 25 for the cap are electrically and mechanically connected to thesocket 17. - According to the present embodiment described above, there is provided a lighting apparatus with a thin-type LED lamp capable of achieving the effects of the light-emitting
module 1. - A modification of the light-emitting module according to the first embodiment will be described hereunder with reference to
FIG. 7 .FIG. 7 is a plan view illustrating a light-emitting module. The like reference numerals are added to portions or elements corresponding to those of the first embodiment, and repeated explanation thereof is omitted herein. Lighting circuit components 4 are mounted on a component mounting surface of asubstrate 2 in a manner concentrated in the central portion thereof. Thelighting circuit components 4 include a fuse F, a capacitor C, a rectifier REC, a constant voltage diode ZD, resistors R1 and R2, and a transistor Q.- On the other hand, the light-emitting
elements 3 are mounted around thelighting circuit components 4 in a pattern spaced with a predetermined interval from each other. In aconnector 5 for power supply connection is arranged so that aconnection opening 5athereof is disposed close to the outer peripheral edge of thesubstrate 2. In consideration of the connection with a power line, although it is preferred that theconnector 5 for the power supply connection is disposed to a portion in the vicinity of the outer periphery of thesubstrate 2, the connector may be arranged at the central portion together with thelighting circuit component 4. - In this modified embodiment, the positional arrangement of the light-emitting
elements 3 and thelighting circuit components 4 of the first embodiment are reversed, and since the mounting interval of the light-emittingelements 3 is greater than that of the first embodiment, light LH radiated from the side surface of the LED package can be effectively utilized as like as in the first embodiment, and in addition, by increasing the interval between the light-emittingelements elements 3 can be transmitted and dissipated to the rear side of thesubstrate 2 by effectively utilizing the entire structure of thesubstrate 2. - Hereunder, there will be explained an embodiment, with reference to
FIGS. 8 to 13 , in which the interval between the plurality of light-emittingelements substrate 2, and degree of luminance irregularity and variation in light-emitting efficiency both dependent on the interval, have been studied with respect to the light-emittingmodule 1 according to the first embodiment. - Referring to
FIG. 8 , the light-emittingelements 3 constitute a surface-mounted LED package and are composed of amain body 3a,an LED chip mounted on themain body 3a,and atranslucent resin 3bfor sealing the LED chip, and thistranslucent resin 3bfunctions as a light-emitting unit L. - The light-emitting unit L is, as illustrated in
FIG. 8( a), formed so as to have a substantially quadrate shape which is 2.8 mm on a side (W) and about 4 mm on a diagonal (a). As illustrated inFIG. 8( b), the light-emittingelement 3 mounted on thesubstrate 2 is 1.5 mm in height (b) from the mounting surface of thesubstrate 2 to an upper surface of the light-emitting unit L and is 0.7 mm in height (h) of the light-emitting unit L. FIG. 9 is a graph showing a directional characteristics or pattern of the light-emittingelements 3. The light-emittingelement 3 has a maximum illuminance in a direction perpendicular to the upper surface, i.e., at a radiation angle of 0°, and as for a direction of the side surface, has a illuminance 40 percent or greater relative to the maximum illuminance at a radiation angle of 80° and a illuminance 50 percent or greater relative to the maximum illuminance at a radiation angle of 70°, thus radiating a given amount of light in a direction along the component mounting surface.- The light-emitting
elements 3 having such configuration and characteristics were arranged in a pattern spaced at a predetermined interval from each other as shown inFIG. 10 . Thereafter, luminance irregularity and light-emitting efficiency were measured and evaluated by changing the interval. - Here, it was supposed, as illustrated in
FIG. 10 , that character c denotes a minimum distance between the light-emitting units L1 and L2, and character a denotes a width of the light-emitting units L1 and L2 on a line of the minimum distance c. The method of evaluating luminance irregularity was made such that the light-emittingmodule 1 was made to glow at a height of 2.5 m from the floor surface to illuminate the floor surface, and the state of illumination on the floor was observed to perform visual evaluation. This visual evaluation was, as illustrated inFIG. 11 , performed by observing illuminance distribution on the floor. Further,FIG. 11 is a figure that schematically illustrates, with the solid line, a boundary line at which illuminance difference appears, more specifically, an image of light-emitting pattern (mounting pattern image of the light-emitting elements3) of the light-emittingelements 3. Thus, the evaluation is ranked as follows. In pattern A, luminance irregularity is not noticed at all, in pattern B, luminance irregularity is hardly noticed, in pattern C, luminance irregularity is noticed, and in pattern D, luminance irregularity is clearly observed. Roughly speaking, when the interval between the light-emitting units L of the light-emittingelements 3 is small, the luminance irregularity may be eliminated, the adjacent light-emittingelements 3 interrupt the radiant light, thus lowering light emission efficiency. On the other hand, when the interval between the light-emitting units L is wide, the light emission efficiency becomes high, but the luminance irregularity tends to occur. - As a result of the above evaluation and measurement, evaluation and measurement values were obtained as shown in
FIG. 12 . Referring toFIG. 12 , the abscissa indicates interval c between the light-emitting units L of the light-emittingelements 3, and the ordinate indicates luminance irregularity evaluation and measurement values of light emission efficiency. Further, it was found that as the interval c exceeded 4 mm, the luminance irregularity gradually lowered and deteriorated and that as the interval c increased, the light emission efficiency raised. However, when the interval c exceeded 8 mm, it was found that the light emission efficiency saturated. - In consideration of the above results, it was confirmed that the permissible range of luminance irregularity lied around rank C, and in consideration of the light emission efficiency, it was also confirmed that the interval c between the light-emitting
elements 3 was preferably greater than b and smaller than 4a (b<c<4a). Furthermore, it was resulted that the optimum range in the above range for further enhancing luminance irregularity evaluation and improving the light emission efficiency was a range of 2b≦c≦3a. Still furthermore, in order to suppress effect due to heat generation between the light-emittingelements 3, an optimum arrangement pattern was a<c. In the case of a<c, the temperature of the light-emittingelements 3 during glowing could be suppressed from rising. A lower limit value of the above interval c may also be represented by height h of the light-emitting unit L, and when this height h is used, a relationship of approximately 2h<c, preferably, 4h≦c will be obtained. - In the above, the present embodiment, was described with reference to as an example by considering the relationship between the light-emitting units L1 and L2 of the light-emitting
elements 3 illustrated inFIG. 10 . However, for example, the dimensional relationship of the interval c in the light-emitting units L2 and L3 is similar to that of the light-emitting units L1 and L2. The dimensions, the directional characteristics and the like of the light-emittingelements 3 are not limited to the specific dimensions and characteristics described with reference to this embodiment. The mounting pattern of the light-emittingelements 3 is not limited to the pattern in which light-emittingelements 3 are, as illustrated inFIG. 10 , arranged on the circumference, and it may be sufficient that minimum distance c between the light-emittingelements 3 falls into the above prescribed range. For example, the light-emittingelements 3 may be arranged in a matrix pattern. - A light-emitting
element 30 illustrated inFIG. 13 may also be used as the light-emitting element. This light-emittingelement 30 is a surface-mounted LED package, and this LED package is composed of amain body 30aformed of ceramics, areflector 30darranged on themain body 30a,anLED chip 30cmounted in a recess defined by themain body 30aand thereflector 30d,and asilicon resin 30efor sealing theLED chip 30c.Thissilicon resin 30efunctions as the light-emitting unit L, and light is radiated from the light-emitting unit L in a radial pattern which is similar, as a whole, to the directional characteristics illustrated inFIG. 9 , including an upper surface direction and a direction along the component mounting surface. - According to the present invention, there is provided a light-emitting module having a wide applicable scope and improving and optimizing the distribution of light radiated from the light-emitting element. In addition, the heat dissipation effects can be raised, and an effect of shortening and simplifying a wiring pattern on a substrate can be also achieved.
Claims (4)
1. A light-emitting module comprising:
a substrate having a front surface side constituted as a component mounting surface and a rear surface side constituted as a heat dissipating surface flat in shape;
a plurality of light-emitting elements mounted at a central portion of a component mounting surface of the substrate in a manner protruding therefrom and emitting light at least in an upper surface direction and in a direction along the component mounting surface;
a lighting circuit component which is electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged on a peripheral edge side of the substrate than the light emitting elements, on the component mounting surface of the substrate; and
a connector for connecting with a power supply, which is arranged on the peripheral edge side of the substrate than the light emitting elements, on the component mounting surface of the substrate, and which is electrically connected to the lighting circuit component.
2. The light-emitting module according toclaim 1 , wherein the plurality of light-emitting elements are arranged at even intervals in rotational symmetry except at a central point of the central portion of the component mounting surface of the substrate.
3. The light-emitting module according toclaim 1 , wherein when it is determined that a minimum distance between light-emitting portions of the plurality of the light-emitting elements arranged is c, a width of the light-emitting portion on a line of the minimum distance c is a, and a height from the mounting surface of the substrate to an upper surface of the light-emitting portion is b, the light-emitting elements are arranged so as to satisfy a dimensional relationship of b<c<4a.
4. A lighting apparatus comprising:
an apparatus body; and
the light-emitting module according toclaim 1 incorporated in the apparatus body.
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| JP2008033673 | 2008-02-14 | ||
| JP2008-118292 | 2008-04-30 | ||
| JP2008118292AJP5288161B2 (en) | 2008-02-14 | 2008-04-30 | Light emitting module and lighting device |
| PCT/JP2009/052382WO2009102003A1 (en) | 2008-02-14 | 2009-02-13 | Light emitting module and illuminating apparatus |
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| PCT/JP2009/052382A-371-Of-InternationalWO2009102003A1 (en) | 2008-02-14 | 2009-02-13 | Light emitting module and illuminating apparatus |
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| US13/227,133DivisionUS20120063148A1 (en) | 2008-02-14 | 2011-09-07 | Light-emitting module and lighting apparatus |
| US13/587,225ContinuationUS9273838B2 (en) | 2008-02-14 | 2012-08-16 | Light-emitting module and lighting apparatus |
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| US20110006680A1true US20110006680A1 (en) | 2011-01-13 |
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| US13/587,298AbandonedUS20120306397A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,278AbandonedUS20120307497A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,235AbandonedUS20120306344A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,259AbandonedUS20120306353A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,225Expired - Fee RelatedUS9273838B2 (en) | 2008-02-14 | 2012-08-16 | Light-emitting module and lighting apparatus |
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|---|---|---|---|
| US13/227,133AbandonedUS20120063148A1 (en) | 2008-02-14 | 2011-09-07 | Light-emitting module and lighting apparatus |
| US13/587,298AbandonedUS20120306397A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,278AbandonedUS20120307497A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,235AbandonedUS20120306344A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,259AbandonedUS20120306353A1 (en) | 2008-02-14 | 2012-08-16 | Light-Emitting Module and Lighting Apparatus |
| US13/587,225Expired - Fee RelatedUS9273838B2 (en) | 2008-02-14 | 2012-08-16 | Light-emitting module and lighting apparatus |
Country Status (5)
| Country | Link |
|---|---|
| US (7) | US20110006680A1 (en) |
| EP (1) | EP2244001B1 (en) |
| JP (1) | JP5288161B2 (en) |
| CN (2) | CN104595815A (en) |
| WO (1) | WO2009102003A1 (en) |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9273838B2 (en) | 2008-02-14 | 2016-03-01 | Toshiba Lighting & Technology Corporation | Light-emitting module and lighting apparatus |
| US8604679B2 (en) | 2010-03-04 | 2013-12-10 | Panasonic Corporation | LED light source lamp having drive circuit arranged in outer periphery of led light source |
| US8710724B2 (en) | 2010-03-04 | 2014-04-29 | Panasonic Corporation | LED light source lamp having drive circuit arranged in outer periphery of LED light source |
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| US20160224273A1 (en)* | 2015-01-30 | 2016-08-04 | Fujitsu Limited | Controller and storage system |
| US11994261B1 (en)* | 2023-09-11 | 2024-05-28 | Fourstar Group Inc. | Color-changing LED bulb |
Also Published As
| Publication number | Publication date |
|---|---|
| US20120306353A1 (en) | 2012-12-06 |
| US20120306397A1 (en) | 2012-12-06 |
| EP2244001A4 (en) | 2013-01-23 |
| US20120306344A1 (en) | 2012-12-06 |
| CN101946118A (en) | 2011-01-12 |
| EP2244001B1 (en) | 2015-12-02 |
| JP2009218192A (en) | 2009-09-24 |
| US20120063148A1 (en) | 2012-03-15 |
| EP2244001A1 (en) | 2010-10-27 |
| US20120306352A1 (en) | 2012-12-06 |
| US9273838B2 (en) | 2016-03-01 |
| JP5288161B2 (en) | 2013-09-11 |
| CN104595815A (en) | 2015-05-06 |
| US20120307497A1 (en) | 2012-12-06 |
| WO2009102003A1 (en) | 2009-08-20 |
| CN101946118B (en) | 2016-08-03 |
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| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment | Owner name:KABUSHIKI KAISHA TOSHIBA, JAPAN Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TANAKA, TOSHIYA;SAITO, AKIKO;KAWANO, HITOSHI;REEL/FRAME:024833/0894 Effective date:20100802 Owner name:TOSHIBA LIGHTING & TECHNOLOGY CORPORATION, JAPAN Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TANAKA, TOSHIYA;SAITO, AKIKO;KAWANO, HITOSHI;REEL/FRAME:024833/0894 Effective date:20100802 | |
| STCB | Information on status: application discontinuation | Free format text:ABANDONED -- AFTER EXAMINER'S ANSWER OR BOARD OF APPEALS DECISION |