US20100193162A1 - Heat dissipation device - Google Patents
Heat dissipation deviceDownload PDFInfo
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- US20100193162A1 US20100193162A1US12/534,846US53484609AUS2010193162A1US 20100193162 A1US20100193162 A1US 20100193162A1US 53484609 AUS53484609 AUS 53484609AUS 2010193162 A1US2010193162 A1US 2010193162A1
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- United States
- Prior art keywords
- heat dissipation
- fins
- fin assembly
- dissipation device
- turbulence generating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present inventionrelates generally to a heat dissipation device, and more particularly to a heat dissipation device which includes heat dissipation fins designed to generate a desired heat dissipation airflow field.
- a motherboard inside a computer hostincludes a plurality of electronic components mounted thereon.
- a part of the electronic componentssuch as a central processing unit (CPU), a pulse width modulator (PWM) and a north bridge generate a considerable amount of heat during operation. If the heat cannot be timely removed such that the heat is continuously accumulated on the electronic components, the temperature of the electronic components will gradually rise and exceed their normal operating temperature. As a result, the electronic components cannot operate stably, thereby causing a crash of the computer host. In addition, if the temperature is unduly high, the electronic components may be damaged, thus causing a permanent failure.
- CPUcentral processing unit
- PWMpulse width modulator
- a conventional heat dissipation devicegenerally includes a heat dissipation base, a fan, fins, and an airflow guide plate.
- the airflow generated by the fancan enter the heat dissipation base via an air inlet of the heat dissipation base and escape through an air outlet of the heat dissipation base to dissipate the heat of the electronic components.
- the airflow guide plate disposed below the finscan guide a portion of the airflow toward a surface of the circuit board to dissipate the heat of the electronic components around the heat dissipation base.
- the airflow generated by the fanmust be guided by the airflow guide plate coupled to the heat dissipation base to dissipate the heat of the electronic components on the surface of the circuit board. Therefore, the design of the heat dissipation device may be complicated. Furthermore, extra components are required to assemble the heat dissipation base and the airflow guide plate, which not only increases the manufacturing cost of the heat dissipation device, but also reduces the reliability of the heat dissipation device due to the manufacturing tolerance or assembly tolerance.
- the present inventionis directed to a heat dissipation device which can generate a desired cooling airflow field to provide an improved performance of dissipating the heat of a heat source.
- the present inventionprovides a heat dissipation device adapted for dissipating heat of a heat source.
- the heat dissipation deviceincludes a base and a heat dissipation fin assembly.
- the baseis adapted to be disposed on the heat source.
- the heat dissipation fin assemblyis disposed on the base and includes a plurality of fins.
- the heat dissipation fin assemblyhas opposite air inlet side and air outlet side.
- a turbulence generating structureis formed by at least a part of the fins or holes at the air inlet side or the air outlet side.
- the fins or holesare disposed on one side of a centerline of the heat, dissipation fin assembly, and the number of the fins or holes gradually increases in the direction toward or away from the heat source.
- the turbulence generating structureis formed by reducing the size of at least a part of the fins at the air outlet side.
- the turbulence generating structurecomprises a plurality of projections or recesses on surfaces of the fins.
- the turbulence generating structureis formed by downwardly bending at least a part of the fins at the air outlet side.
- the fins or holes for forming the turbulence generating structureare disposed below a middle height line of the heat dissipation fin assembly and are uniformly distributed.
- the turbulence generating structurecomprises a plurality of projections or recesses on surfaces of the fins.
- the turbulence generating structureis formed by downwardly bending at least a part of the fins at the air outlet side.
- the turbulence generating structurescan redirect the airflow flowing through the heat dissipation device, thereby cooling the heat sources below the heat dissipation device and at the air outlet side.
- the turbulence generating structurescan increase the longitudinal turbulence intensity of the airflow at the air outlet/inlet sides and change the longitudinal press gradient of the airflow, thus improving the cooling performance of the heat dissipation device.
- FIG. 1illustrates one embodiment of the heat dissipation device disposed on a circuit board.
- FIG. 2is a top view of the heat dissipation device disposed on the circuit board of FIG. 1 .
- FIG. 3illustrates one embodiment of the heat dissipation fin assembly disposed on the circuit board.
- FIG. 4illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly of FIG. 3 .
- FIG. 5illustrates an alternative embodiment of a heat dissipation fin assembly disposed on a circuit board.
- FIG. 6illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly of FIG. 5 .
- FIG. 7illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board.
- FIG. 8illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board.
- FIG. 9illustrates still another embodiment of a heat dissipation fin assembly disposed on a circuit board.
- FIG. 1illustrates one embodiment of the heat dissipation device disposed on a circuit board.
- FIG. 2is a top view of the heat dissipation device disposed on the circuit board of FIG. 1 .
- the heat dissipation device 100includes a base 110 , a heat dissipation fin assembly 120 , and a fan 130 .
- the base 110is disposed on the circuit board 10 over a heat source 190 .
- the circuit board 10may be a motherboard and the heat source 190 may be a central processing unit (CPU).
- CPUcentral processing unit
- the heat dissipation fin assembly 120is disposed on the base 110 and includes a plurality of parallel fins 120 a .
- the heat dissipation fin assembly 120has an air inlet side 122 and an air outlet side 124 opposite to the air inlet side 122 .
- the fan 130is disposed at the air inlet side 122 . As the fan 130 rotates, the fan 130 drives an airflow to enter the heat dissipation fin assembly 120 from the air inlet side 122 and escape the heat dissipation fin assembly 120 through the air outlet side 124 .
- a turbulence generating structure 126is formed at the air outlet side 124 of the heat dissipation fin assembly 120 in order to control a field of the airflow through the heat dissipation fin assembly 120 . Therefore, when the airflow flows through-the air outlet side 124 of the heat dissipation fin assembly 120 , it flows through the turbulence generating structure 126 at the same time.
- FIG. 3illustrates one embodiment of the heat dissipation fin assembly disposed on the circuit board.
- FIG. 4illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly of FIG. 3 .
- the turbulence generating structure 226is formed on a part of the fins 220 a at the air outlet side 224 .
- a part of the fins 220 ahave the same configuration, and the rest of the fins 220 a form the turbulence generating structure 226 .
- the turbulence generating structure 226is formed by reducing the size of the part of the fins 220 a at the air outlet side 224 .
- the turbulent generating structure 226can change a longitudinal turbulence intensity as well as a longitudinal pressure gradient of the airflow at the air outlet side.
- the airflow flowing through the turbulence generating structurecan be disturbed to form the airflow field profile shown in FIG. 4 .
- the fins 220 a used for forming the turbulence generating structure 226are disposed adjacent the circuit board 20 and have their size gradually decreased in the direction toward the circuit board 20 .
- a higher longitudinal turbulence intensitycan be formed at the air outlet side 224 and the longitudinal press gradient can be changed under the influence of the turbulence generating structure 226 .
- the airflowcan be guided toward the surface of the circuit board 20 , thereby effectively dissipating the heat of the heat source 290 on the circuit board 20 and other components around the heat source 290 .
- FIG. 5illustrates an alternative embodiment of a heat dissipation fin assembly disposed on a circuit board.
- FIG. 6illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly of FIG. 5 .
- the heat dissipation fin assembly 320 of the present embodimentincludes a turbulence generating structure 326 formed on a part of the fins 320 a at the air outlet side 224 . More specifically, the turbulence generating structure 326 includes a plurality of holes through the surfaces of the fins 320 a .
- the holes 326 aare formed, for example, by stamping the fins 320 a , and the number of the holes 326 a in each fin gradually increases in the direction toward the circuit board 30 .
- the airflowflows through the holes 326 a before escaping the heat dissipation fin assembly 320 through the air outlet side 324 , and then flows toward the surface of the circuit board 30 .
- the turbulence generating structure 326can redirect the airflow, increase the longitudinal turbulence intensity as well as change the longitudinal press gradient, thereby improving the heat dissipation performance of the heat dissipation fin assembly 320 .
- FIG. 7illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board.
- the heat dissipation fin assembly 420 of the present embodimentis different from the above-described heat dissipation fin assembly 320 in that the holes 426 a are disposed at one side of a centerline of the heat dissipation fin assembly 420 and the number of the holes 426 a in each fin gradually decreases in the direction toward the circuit board 40 .
- the holes 426 aare disposed at one side of the centerline of the heat dissipation fin assembly 420 and the number of the holes 426 in each fin gradually increases along the direction away from the heat source 490 .
- FIG. 8illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board.
- the heat dissipation fin assembly 520 of the present embodimentis different from the above-described heat dissipation fin assembly 420 in that the holes 526 a are disposed at one side of a centerline of the heat dissipation fin assembly 520 and the number of the holes 526 a in each fin maintains the same in the direction toward the circuit board 50 .
- FIG. 9illustrates still another embodiment of a heat dissipation fin assembly disposed on a circuit board.
- the heat dissipation fin assembly 620 of the present embodimentis different from the above-described heat dissipation fin assembly 320 in that the turbulence generating structure 626 includes a plurality of bending portions 626 a on the surface of the fins 620 a .
- the bending portions 626 aare formed by and downwardly bending at least a part of the fins 620 a at the air outlet side, such as by stamping portions of the fins downwardly, and the number of the bending portions on each fin gradually decreases in the direction toward the circuit board 60 .
- these bending portions 626 acan also be replaced with projections.
- the turbulence generating structureare only formed on a part of the fins and in locations adjacent the motherboard in the foregoing embodiments. It should be understood, however, that the turbulence generating structure can be formed on all fins or fins in other positions without departing the spirit and scope of the present invention.
- the number, shape or distribution of the projections or holescan be varied according to actual requirements. More specifically, the number or size of the projections or holes is not limited to any particular embodiments described herein, and the holes can also be replaced with recesses. In addition, different than the above-described distribution of the projections or holes that the number of the projections or holes gradually decreases or increases in the direction toward the motherboard, the projections or holes can be distributed in another manner according to actual requirements of the airflow field.
- the turbulence generating structurescan redirect the airflow flowing through the heat dissipation device, thereby cooling the heat sources below the heat dissipation device and at the air outlet side.
- the turbulence generating structurescan increase the longitudinal turbulence intensity and change the longitudinal press gradient of the airflow at the air outlet side, thus improving the cooling performance of the heat dissipation device.
- the heat dissipation device of the present inventioncan eliminate the guide plate, thereby reducing the manufacturing cost. At the same time, because the guide plate is not needed, the design of the heat dissipation device can be simplified and the heat dissipation device can thus have an improved reliability.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- This application claims the priority benefit of Taiwan application serial no. 98103668, filed on Feb. 5, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of specification.
- 1. Field of the Invention
- The present invention relates generally to a heat dissipation device, and more particularly to a heat dissipation device which includes heat dissipation fins designed to generate a desired heat dissipation airflow field.
- 2. Description of Related Art
- In general, a motherboard inside a computer host includes a plurality of electronic components mounted thereon. A part of the electronic components such as a central processing unit (CPU), a pulse width modulator (PWM) and a north bridge generate a considerable amount of heat during operation. If the heat cannot be timely removed such that the heat is continuously accumulated on the electronic components, the temperature of the electronic components will gradually rise and exceed their normal operating temperature. As a result, the electronic components cannot operate stably, thereby causing a crash of the computer host. In addition, if the temperature is unduly high, the electronic components may be damaged, thus causing a permanent failure.
- A conventional heat dissipation device generally includes a heat dissipation base, a fan, fins, and an airflow guide plate. As the fan operates, the airflow generated by the fan can enter the heat dissipation base via an air inlet of the heat dissipation base and escape through an air outlet of the heat dissipation base to dissipate the heat of the electronic components. In addition, the airflow guide plate disposed below the fins can guide a portion of the airflow toward a surface of the circuit board to dissipate the heat of the electronic components around the heat dissipation base.
- However, in this heat dissipation device, the airflow generated by the fan must be guided by the airflow guide plate coupled to the heat dissipation base to dissipate the heat of the electronic components on the surface of the circuit board. Therefore, the design of the heat dissipation device may be complicated. Furthermore, extra components are required to assemble the heat dissipation base and the airflow guide plate, which not only increases the manufacturing cost of the heat dissipation device, but also reduces the reliability of the heat dissipation device due to the manufacturing tolerance or assembly tolerance.
- Accordingly, the present invention is directed to a heat dissipation device which can generate a desired cooling airflow field to provide an improved performance of dissipating the heat of a heat source.
- The present invention provides a heat dissipation device adapted for dissipating heat of a heat source. The heat dissipation device includes a base and a heat dissipation fin assembly. The base is adapted to be disposed on the heat source. The heat dissipation fin assembly is disposed on the base and includes a plurality of fins. The heat dissipation fin assembly has opposite air inlet side and air outlet side. A turbulence generating structure is formed by at least a part of the fins or holes at the air inlet side or the air outlet side.
- According to one embodiment of the present invention, the fins or holes are disposed on one side of a centerline of the heat, dissipation fin assembly, and the number of the fins or holes gradually increases in the direction toward or away from the heat source.
- According to one embodiment of the present invention, the turbulence generating structure is formed by reducing the size of at least a part of the fins at the air outlet side.
- According to one embodiment of the present invention, the turbulence generating structure comprises a plurality of projections or recesses on surfaces of the fins.
- According to one embodiment of the present invention, the turbulence generating structure is formed by downwardly bending at least a part of the fins at the air outlet side.
- According to one embodiment of the present invention, the fins or holes for forming the turbulence generating structure are disposed below a middle height line of the heat dissipation fin assembly and are uniformly distributed.
- According to one embodiment of the present invention, the turbulence generating structure comprises a plurality of projections or recesses on surfaces of the fins.
- According to one embodiment of the present invention, the turbulence generating structure is formed by downwardly bending at least a part of the fins at the air outlet side.
- In view of the foregoing, the turbulence generating structures can redirect the airflow flowing through the heat dissipation device, thereby cooling the heat sources below the heat dissipation device and at the air outlet side. In addition, the turbulence generating structures can increase the longitudinal turbulence intensity of the airflow at the air outlet/inlet sides and change the longitudinal press gradient of the airflow, thus improving the cooling performance of the heat dissipation device.
- In order to make the aforementioned and other features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.
FIG. 1 illustrates one embodiment of the heat dissipation device disposed on a circuit board.FIG. 2 is a top view of the heat dissipation device disposed on the circuit board ofFIG. 1 .FIG. 3 illustrates one embodiment of the heat dissipation fin assembly disposed on the circuit board.FIG. 4 illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly ofFIG. 3 .FIG. 5 illustrates an alternative embodiment of a heat dissipation fin assembly disposed on a circuit board.FIG. 6 illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly ofFIG. 5 .FIG. 7 illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board.FIG. 8 illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board.FIG. 9 illustrates still another embodiment of a heat dissipation fin assembly disposed on a circuit board.FIG. 1 illustrates one embodiment of the heat dissipation device disposed on a circuit board.FIG. 2 is a top view of the heat dissipation device disposed on the circuit board ofFIG. 1 . Referring toFIGS. 1 and 2 , theheat dissipation device 100 includes abase 110, a heatdissipation fin assembly 120, and afan 130. Thebase 110 is disposed on thecircuit board 10 over aheat source 190. In the present embodiment, for example, thecircuit board 10 may be a motherboard and theheat source 190 may be a central processing unit (CPU).- The heat
dissipation fin assembly 120 is disposed on thebase 110 and includes a plurality ofparallel fins 120a. The heatdissipation fin assembly 120 has anair inlet side 122 and anair outlet side 124 opposite to theair inlet side 122. Thefan 130 is disposed at theair inlet side 122. As thefan 130 rotates, thefan 130 drives an airflow to enter the heatdissipation fin assembly 120 from theair inlet side 122 and escape the heatdissipation fin assembly 120 through theair outlet side 124. In addition, in the present embodiment, aturbulence generating structure 126 is formed at theair outlet side 124 of the heatdissipation fin assembly 120 in order to control a field of the airflow through the heatdissipation fin assembly 120. Therefore, when the airflow flows through-theair outlet side 124 of the heatdissipation fin assembly 120, it flows through theturbulence generating structure 126 at the same time. FIG. 3 illustrates one embodiment of the heat dissipation fin assembly disposed on the circuit board.FIG. 4 illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly ofFIG. 3 . Referring toFIGS. 3 and 4 , theturbulence generating structure 226 is formed on a part of thefins 220aat theair outlet side 224. In the present embodiment, a part of thefins 220ahave the same configuration, and the rest of thefins 220aform theturbulence generating structure 226. More specifically, in the present embodiment, theturbulence generating structure 226 is formed by reducing the size of the part of thefins 220aat theair outlet side 224. Theturbulent generating structure 226 can change a longitudinal turbulence intensity as well as a longitudinal pressure gradient of the airflow at the air outlet side. Thus, the airflow flowing through the turbulence generating structure can be disturbed to form the airflow field profile shown inFIG. 4 .- In addition, in the present embodiment, the
fins 220aused for forming theturbulence generating structure 226 are disposed adjacent thecircuit board 20 and have their size gradually decreased in the direction toward thecircuit board 20. As such, when the airflow leaves the heatdissipation fin assembly 220 through theair outlet side 224, a higher longitudinal turbulence intensity can be formed at theair outlet side 224 and the longitudinal press gradient can be changed under the influence of theturbulence generating structure 226. As a result, the airflow can be guided toward the surface of thecircuit board 20, thereby effectively dissipating the heat of theheat source 290 on thecircuit board 20 and other components around theheat source 290. FIG. 5 illustrates an alternative embodiment of a heat dissipation fin assembly disposed on a circuit board.FIG. 6 illustrates a profile of the airflow field at the air outlet side of the heat dissipation fin assembly ofFIG. 5 . Referring toFIGS. 5 and 6 , the heatdissipation fin assembly 320 of the present embodiment includes aturbulence generating structure 326 formed on a part of thefins 320aat theair outlet side 224. More specifically, theturbulence generating structure 326 includes a plurality of holes through the surfaces of thefins 320a. In the present embodiment, theholes 326aare formed, for example, by stamping thefins 320a, and the number of theholes 326ain each fin gradually increases in the direction toward thecircuit board 30.- As such, the airflow flows through the
holes 326abefore escaping the heatdissipation fin assembly 320 through theair outlet side 324, and then flows toward the surface of thecircuit board 30. Theturbulence generating structure 326 can redirect the airflow, increase the longitudinal turbulence intensity as well as change the longitudinal press gradient, thereby improving the heat dissipation performance of the heatdissipation fin assembly 320. FIG. 7 illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board. Referring toFIG. 7 , the heatdissipation fin assembly 420 of the present embodiment is different from the above-described heatdissipation fin assembly 320 in that theholes 426aare disposed at one side of a centerline of the heatdissipation fin assembly 420 and the number of theholes 426ain each fin gradually decreases in the direction toward thecircuit board 40. In other words, in the present embodiment, theholes 426aare disposed at one side of the centerline of the heatdissipation fin assembly 420 and the number of the holes426 in each fin gradually increases along the direction away from theheat source 490.FIG. 8 illustrates another embodiment of a heat dissipation fin assembly disposed on a circuit board. Referring toFIG. 8 , the heatdissipation fin assembly 520 of the present embodiment is different from the above-described heatdissipation fin assembly 420 in that theholes 526aare disposed at one side of a centerline of the heatdissipation fin assembly 520 and the number of theholes 526ain each fin maintains the same in the direction toward thecircuit board 50.FIG. 9 illustrates still another embodiment of a heat dissipation fin assembly disposed on a circuit board. Referring toFIG. 9 , the heatdissipation fin assembly 620 of the present embodiment is different from the above-described heatdissipation fin assembly 320 in that theturbulence generating structure 626 includes a plurality of bendingportions 626aon the surface of the fins620a. In the present embodiment, the bendingportions 626aare formed by and downwardly bending at least a part of the fins620aat the air outlet side, such as by stamping portions of the fins downwardly, and the number of the bending portions on each fin gradually decreases in the direction toward thecircuit board 60. In an alternative embodiment, these bendingportions 626acan also be replaced with projections.- The foregoing embodiments describe various turbulence generating structures that are formed by changing the size of the fins or forming projections on the fins or holes in the fins. However, these embodiments should not be used to limit the scope of the present invention. It should be noted that location and distribution of the turbulence generating structures on the fins, and the number and shape of the turbulence generating structures can be varied to meet actual requirements.
- As to the location of the turbulence generating structures on the fins, the turbulence generating structure are only formed on a part of the fins and in locations adjacent the motherboard in the foregoing embodiments. It should be understood, however, that the turbulence generating structure can be formed on all fins or fins in other positions without departing the spirit and scope of the present invention.
- As to the projections on or the holes in the fins that are used to form the turbulence generating structures, the number, shape or distribution of the projections or holes can be varied according to actual requirements. More specifically, the number or size of the projections or holes is not limited to any particular embodiments described herein, and the holes can also be replaced with recesses. In addition, different than the above-described distribution of the projections or holes that the number of the projections or holes gradually decreases or increases in the direction toward the motherboard, the projections or holes can be distributed in another manner according to actual requirements of the airflow field.
- In summary, the turbulence generating structures can redirect the airflow flowing through the heat dissipation device, thereby cooling the heat sources below the heat dissipation device and at the air outlet side. In addition, the turbulence generating structures can increase the longitudinal turbulence intensity and change the longitudinal press gradient of the airflow at the air outlet side, thus improving the cooling performance of the heat dissipation device. The heat dissipation device of the present invention can eliminate the guide plate, thereby reducing the manufacturing cost. At the same time, because the guide plate is not needed, the design of the heat dissipation device can be simplified and the heat dissipation device can thus have an improved reliability.
- It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Claims (8)
1. A heat dissipation device adapted for dissipating heat of a heat source, the heat dissipation device comprising:
a base adapted to be disposed on the heat source; and
a heat dissipation fin assembly disposed on the base and comprising a plurality of fins, the heat dissipation fin assembly having opposite air inlet side and air outlet side, wherein a turbulence generating structure is formed by at least a part of the fins or holes at the air inlet side or the air outlet side.
2. The heat dissipation device according toclaim 1 , wherein the fins or holes are disposed on one side of a centerline of the heat dissipation fin assembly, and the number of the fins or holes gradually increases in the direction toward or away from the heat source.
3. The heat dissipation device according toclaim 1 , wherein the turbulence generating structure is formed by reducing the size of at least a part of the fins at the air outlet side.
4. The heat dissipation device according toclaim 1 , wherein the turbulence generating structure comprises a plurality of projections or recesses on surfaces of the fins.
5. The heat dissipation device according toclaim 1 , wherein the turbulence generating structure is formed by downwardly bending at least a part of the fins at the air outlet side.
6. The heat dissipation device according toclaim 1 , wherein the fins or holes for forming the turbulence generating structure are disposed below a middle height line of the heat dissipation fin assembly and are uniformly distributed.
7. The heat dissipation device according toclaim 6 , wherein the turbulence generating structure comprises a plurality of projections or recesses on surfaces of the fins.
8. The heat dissipation device according toclaim 6 , wherein the turbulence generating structure is formed by downwardly bending at least a part of the fins at the air outlet side.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98103668 | 2009-02-05 | ||
| TW098103668ATWI377333B (en) | 2009-02-05 | 2009-02-05 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20100193162A1true US20100193162A1 (en) | 2010-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/534,846AbandonedUS20100193162A1 (en) | 2009-02-05 | 2009-08-03 | Heat dissipation device |
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| Country | Link |
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| US (1) | US20100193162A1 (en) |
| TW (1) | TWI377333B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150090435A1 (en)* | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| US10993351B2 (en)* | 2018-04-18 | 2021-04-27 | Harman International Industries, Incorporated | One mixed heat sink fins for better thermal dissipation used on electrical products |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150090435A1 (en)* | 2013-09-29 | 2015-04-02 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| US11604035B2 (en)* | 2013-09-29 | 2023-03-14 | Huawei Technologies Co., Ltd. | Support plateheat dissipation apparatus |
| US10993351B2 (en)* | 2018-04-18 | 2021-04-27 | Harman International Industries, Incorporated | One mixed heat sink fins for better thermal dissipation used on electrical products |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI377333B (en) | 2012-11-21 |
| TW201030307A (en) | 2010-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment | Owner name:WISTRON CORPORATION, TAIWAN Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIANG, CHUAN-YI;WU, MING-CHANG;LIAO, CHIH-AN;REEL/FRAME:023104/0205 Effective date:20090728 | |
| STCB | Information on status: application discontinuation | Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |