US20100020519A1 - Emi shielding device - Google Patents

Abstract

An EMI shielding device is set in an electronic device. The electronic device includes a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device includes a middle board and a shielding cover. The middle board is set inside the electronic device. The shielding cover is set on the middle board and covers an outside of the electrical component. Thus, the EMI shielding device is structured. The material of the shielding cover is widely used, so the cost of the material is markedly reduced. After the shielding cover is opened, it is easy to restore the shielding state. The shielding cover is set inside the electronic device via the middle board, so assembly is easy and it is not limited by changes in the shape or the structure of the shell, so applicability is improved.

Description

CROSS REFERENCE TO RELATED APPLICATION
• This present application is a divisional application (specifically upon objects depicted inFIGS. 4-5) of U.S. application Ser. No. 11/705,016, which was filed Feb. 12, 2007 now pending. This application is incorporated in its entirety by reference herein.
BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• The present invention relates to an EMI shielding device, and more specifically to an EMI shielding device that shield s electrical components, such as a chip or a CPU, from EMI.
• 2. Description of the Prior Art
• A shielding cover is used to shield electrical components from EMI (Electromagnetic Interference) and prevents electrical components set on the circuit board of an electronic device (such as a mobile phone, a PDA, or a computer) from the effects of EMI. The electrical component may be a chip or a CPU, etc. The shielding cover covers the outside of the electrical component set on a circuit board to shield the electrical components from EMI.
• However, the shielding cover must be welded onto the circuit board by an SMT (surface mount technology) process, thus, the material of the shielding cover must be a certain welding material. However, the cost of such material is high. Moreover, when the electronic device needs to be repaired, the top board of the shielding cover must be lifted away, and another top board is needed after the repair to place the EMI shield, further increasing costs.
• Hence, the inventors of the present invention believe that these shortcomings above are able to be improved upon and suggest the present invention which is of a reasonable design and is an effective improvement based on deep research and thought.
SUMMARY OF THE INVENTION
• An object of the present invention is to provide an EMI shielding device, of which the material of the shielding cover is widely used, so that the cost of the material is reduced. Thereby, after the shielding cover has been opened, it is easy to restore the shielding state, and another cover doesn't need to replace the original shield.
• Another object of the present invention is to provide an EMI shielding device, in which the assembling of the shielding cover is easy, the surface of which is flat, and which is not limited by changes in the shape or the structure of the shell, so applicability is improved.
• To achieve the above-mentioned objects, an EMI shielding device is disclosed. The shielding device is set in an electronic device and comprises a shell, a circuit board set in the shell, and an electrical component set on the circuit board. The shielding device comprises a middle board and a shielding cover. The middle board is set inside the electronic device and the shielding cover is set on the middle board and covers the outside of the electrical component.
• The advantages of the present invention are that the shielding cover of the present invention doesn't need to be welded on the circuit board; the material of the shielding cover is widely used, so the material's cost is reduced; to repair the electrical component, the middle board and the circuit board can be separated to open the shielding cover; after repairing, the middle board can be fixed inside the electronic device to cover the shielding cover over the electrical component to restore the shield. Moreover, the shielding cover is set inside the electronic device by the middle board, so assembly is easy, the surface is flat, and the shield is not limited by changes in the shape or the structure of the shell, so applicability is improved.
• To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the drawings are only to be used as references and explanations, and not to limit the present invention.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a plan view of a first embodiment of the present invention;
• FIG. 2 is an explored isometric view of the first embodiment of the present invention;
• FIG. 3 is a cutaway view of the first embodiment of the present invention;
• FIG. 4 is an explored isometric view of a second embodiment of the present invention;
• FIG. 5 is a cutaway view of the second embodiment of the present invention;
• FIG. 6 is an explored isometric view of a third embodiment of the present invention;
• FIG. 7 is a cutaway view of the third embodiment of the present invention;
• FIG. 8 is an explored isometric view of a fourth embodiment of the present invention;
• FIG. 9 is a cutaway view of the fourth embodiment of the present invention;
• FIG. 10 is an isometric view of a fifth embodiment of the present invention;
• FIG. 11 is a cutaway view of a sixth embodiment of the present invention;
• FIG. 12 is an isometric view of a shielding cover of a seventh embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
• Referring toFIGS. 1-3, an EMI shielding device of the present invention is set in an electronic device, the device's number being unlimited. The electronic device includes ashell4 and acircuit board5 set in theshell4 and anelectrical component6 set on thecircuit board5. Theshell4 includes anupper shell41 and a lower shell42. Theupper shell41 and the lower shell42 are assembled or opened by catches or locking screws. The shielding device includes amiddle board1, ashielding cover2, and aspring component3. Themiddle board1 is made of metal, rubber or other materials. Themiddle board1 is also known as an inner board. The shape of the middle board is unlimited. A plurality offixing holes11 are set on the edge of themiddle board1 to fix the locking screws inside the electronic device. Themiddle board1 is locked onto thecircuit board5 or theshell4.
• Themiddle board1 of the embodiment is fixed on thecircuit board5 or theshell4 via locking screws, but the fixing method is unlimited. Themiddle board1 of the embodiment is fixed on thecircuit board5 or theshell4 inside the electronic device by methods such as hot melting, riveting, spot welding, clamp-jointing or screw-jointing, etc. A plurality ofconnectors12 are set on themiddle board1, and the plurality ofconnectors12 are in-molded on themiddle board1 or assembled thereon. In the present embodiment, theconnectors12 are made of hot-melting material.
• Theshielding cover2 is made of metal and is cube-shaped and empty inside, however theshielding cover2 can be any other shape. Theshielding cover2 includes atop board21 andside boards22 extending downwards around the edge of thetop board21. Thetop board21 and theside boards22 forma containing space23. The containingspace23 is inside theshielding cover2 and can contain anelectrical component6. Theshielding cover2 covers theelectrical component6.
• Protrudingflanges24 extend outwards from four angles of thetop board21. Each protrudingflange24 defines a connectinghole25 thereon. Eachconnector12 can be inserted into thecorresponding connecting hole25. Theconnectors12 and the connectingholes25 are fixed and joined by hot-melting to make the shieldingcover2 join themiddle board1 corresponding to theelectrical component6. The jointing method of the shieldingcover2 and themiddle board1 is hot-melting, but the middle board can also be riveted, spot welded, clamp-jointed or screw-jointed, etc. The jointing methods are unlimited.
• A plurality of protrudingpoints34 are defined on thetop board21 of the shieldingcover2 by punching thereon to form aspring component3. The protruding points34 protrude out of thetop board21 and sustain the bottom of themiddle board1 to press down the shieldingcover2 befittingly. Thus, the bottom edge of the shieldingcover2 can sustain the topside of thecircuit board5 elastically to join the shieldingcover2 and thecircuit board5 firmly.
• When theshell4 is assembled and themiddle board1 is fixed inside the electronic device, the shieldingcover2 set on themiddle board1 covers an outside of theelectrical component6. Thus, the EMI effect on the operation of theelectrical component6 can be prevented by the shielding of the shieldingcover2. The EMI shielding device of the present invention is formed by the structure.
• To repair theelectrical component6, theshell4 of the electronic device is opened to separate themiddle board1 and thecircuit board5. The shieldingcover2 comes apart with theelectrical component6. Thus, theelectrical component6 is easy to open and repairing is convenient. After repairing, themiddle board1 is fixed inside the electronic device to make the shieldingcover2 cover theelectrical component6 thereby restoring the shielding state.
• Referring toFIGS. 4 and 5, thespring component3 of the embodiment contacts the bottom edge of theside boards22 of the shieldingcover2. Thespring component3 and the bottom edge of theside boards22 of the shieldingcover2 are in-molded or assembled. For the preferred embodiment, thespring component3 is arubber component31. When themiddle board1 is fixed inside the electronic device, the shieldingcover2 covers theelectrical component6. Therubber component31 is then injected with glue to join the bottom edge of theside boards22 of the shieldingcover2. Therubber component31 is set between the bottom edge of theside boards22 of the shieldingcover2 and thecircuit board5 to join the shieldingcover2 and thecircuit board5 together firmly. Thus, the EMI effect on the operation of theelectrical component6 can be prevented by the shielding of the shieldingcover2.
• To repair theelectrical component6, theshell4 of the electronic device is opened to separate themiddle board1, the shieldingcover2, thecircuit board5 and thespring component3. The shieldingcover2 is separated from theelectrical component6. Thus, theelectrical component6 is easy to open and repairing is convenient. After repairing, themiddle board1 is fixed inside the electronic device to make the shieldingcover2 cover theelectrical component6 to restore the shielding state.
• Please refer toFIGS. 6-9. The connectingholes25 of the preferred embodiment are defined on the top of the shieldingcover2, that is, the connectingholes25 are defined on thetop board21 of the shieldingcover2. Theconnectors12 and the connectingholes25 are fixed and joined by hot-melting to make the shieldingcover2 join themiddle board1 corresponding to theelectrical component6. Thespring component3 of the embodiment is a plurality ofspring plates32 and33 in-molded on the bottom edge of theside boards22 of the shieldingcover2. Thespring plate32 extends and bends outwards (as shown inFIGS. 6 and 7), thespring plate33 extends and bends inwards (shown asFIGS. 8,9). When themiddle board1 is fixed inside the electronic device, the shieldingcover2 covers theelectrical component6. Thespring plates32,33 sustain elastically the top of thecircuit board5, and thespring plates32,33 are set between the bottom edge of theside boards22 of the shieldingcover2 and thecircuit board5 to join the shieldingcover2 and thecircuit board5 firmly.
• Referring toFIG. 10, themiddle board1 and the shieldingcover2 are in-molded, that is, thetop board21 of the shieldingcover2 is in-molded onto themiddle board1. Fourside boards22 extend downwards around the edge oftop board21 by punching on themiddle board1. Thetop board21 and theside boards22 form a containingspace23. Themiddle board1 and the shieldingcover2 are in-molded, and a plurality of shielding covers2 can be set upon themiddle board1. Such a design reduces material usage, makes assembly convenient, and lowers costs.
• Referring toFIGS. 11 and 12, thespring component3 of the embodiment is a plurality ofspring bodies35. Thespring bodies35 contact the bottom edge of theside boards22 of the shieldingcover2. The bottom edge of theside boards22 of the shieldingcover2 extends and bends outwards. Thespring bodies35 are set at the extending and bending point of theside boards22. Thespring bodies35 sustain the top of thecircuit board5 elastically.
• Consequently, the shieldingcover2 of the present invention doesn't need to be welded on thecircuit board5 by a process of SMT. The material of the shieldingcover2 is widely used, so the cost of the material is markedly reduced. Moreover, to repair theelectrical component6, theshell4 is opened to separate themiddle board1, the shieldingcover2 and thecircuit board5 to make the shieldingcover2 open. After repairing, themiddle board1 is fixed inside the electronic device to make the shieldingcover2 cover theelectrical component6 to restore shielding. Shielding is restored easily and another cover isn't required.
• Also worth mentioning is that the shieldingcover2 of the present invention is set inside the electronic device by themiddle board1. Themiddle board1 can also be locked on thecircuit board5 or theshell4. Assembling is therefore easy, surface flatness of themiddle board1 is maintained and the shieldingcover2 is locked on theshell4 indirectly, so as not to be limited by changes in the shape or the structure of theshell4, thereby improving applicability.
• What is disclosed above are only the preferred embodiments of the present invention, and therefore it is intended that the present invention not be limited to the particular embodiment disclosed. It should be understood by those skilled in the art that various equivalent changes may be made depending on the specification and the drawings of present invention without departing from the scope of the present invention.

Claims (9)

1. An EMI shielding device, set in an electronic device, the electronic device comprising a shell, a circuit board set inside the shell and an electrical component set on the circuit board inside the shell, the shielding device comprising:

a middle board located inside the shell;

a shielding cover located between the middle board and the circuit board and engaged firmly with the middle, further having a plurality of side boards extending downward to circulate the electrical component on the circuit board; the side boards having respective bottom edges close to the circuit board; and

a spring component located between the bottom edges of the side boards and the circuit board to join together elastically the shield cover and the circuit board and to seal the electrical component inside a containing space between the shielding cover and the circuit board.

2. The EMI shielding device as claimed inclaim 1, wherein said spring component is a rubber component.

3. The EMI shielding device as claimed inclaim 2, wherein said rubber component is a product from a glue injection between said bottom edges and said circuit board.

4. The EMI shielding device as claimed inclaim 1, wherein said middle board defines a plurality of fixing holes thereon to be locked to said electronic device by screwing.

5. The EMI shielding device as claimed inclaim 1, wherein said middle board is fixed in said electronic device by a predetermined fastening method selected from the group of hot melting, riveting, spot welding, clamp-jointing, and screw-jointing.

6. The EMI shielding device as claimed inclaim 1, wherein a plurality of connectors is set on said middle board, a plurality of connecting holes is set on said shielding cover, and said connectors and said respective connecting holes are joined to fix firmly said middle board and said shielding cover.

7. The EMI shielding device as claimed inclaim 1, wherein said shielding cover is made of metal.

8. The EMI shielding device as claimed in claim11, wherein said spring component is in-molded on said shielding cover.

9. The EMI shielding device as claimed in claim11, wherein said spring component is assembled with said shielding cover.

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