US20090159240A1 - Mobile cooling structure and machine case having the same - Google Patents

Abstract

A cooling structure, through a design of rail installed on an inner wall of a machine case, can be adjusted in corresponding to various electronic heating components disposed in the machine case, and freely moved to a position, where an electronic heating component is needed to conduct heat generated thereof to the machine case.

Description

BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• The present invention generally relates to a cooling technique, in particular, to a cooling structure, applicable to a machine case requiring cooling in a computer, and especially adaptable to a machine case in an industrial computer.
• 2. Description of Prior Art
• At present, cooling problem has become a crucial factor influencing the operation of current computer or relative multimedia computer host. Its importance is without mention, because computer requires an enhancing function day by day.
• Regarding to the cooling requirement for any heating source in a computer, the prior art is not only to provide a most basically needed cooling capability, but also to continuously research and develop toward the improvement of cooling efficiency. However, in terms of desktop computer or laptop computer, since they have an inevitable trend in standardized design, so their corresponding cooling structure or device also has a specifically disposing position and relationship. Therefore, they sometimes resort to redesign, only aiming to improve the cooling efficiency, without considering the match up of different interior structures in various computers at times. However, with respect to industrial computer, because the positions of electronic heating components disposed therein are sometimes changed according to different functions of various models, different cooling structures or devices must be customized according to different models, and thus the correspondingly disposing position and relationship may be then fulfilled. Accordingly, if a cooling structure capable of being adjusted in corresponding to different positions of heating sources is proposed, then it can be applied so comprehensively to any type of industrial computer that a large amount of human labor and material resource regarding to R&D may be saved.
• Accordingly, aiming to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has finally proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly.
SUMMARY OF THE INVENTION
• The invention is mainly to provide a mobile cooling structure and a machine case having the same through a special design of rail, by which the cooling structure may be freely adjusted to specific positions in corresponding to the disposing positions of the electronic heating components in various machine cases, and thus a more flexibility may be achieved.
• The invention is to provide a mobile cooling structure particularly arranged in a machine case to facilitate a heating component arranged therein for a heat conduction. The cooling structure includes: two rails, respectively arranged on two inner side faces of the machine case; a heat-conducting plate, arranged between two rails; at least one heat pipe, attached onto the heat-conducting plate; and a heat-conducting block. According to the present invention, the heat-conducting plate is glided, in cooperation with two rails, to a corresponding position, where an electronic heating component is intended to be cooled. Then, the heat-conducting block is engaged between the heat-conducting plate and the electronic heating component to undertake a heat-transferring contact, making the heat generated from the electronic heating component conducted to the heat-conducting plate and then extended toward the positioning direction of two rails in the heat-conducting plate through the heat pipe, thereby, the heat being able to be conducted to the machine case for facilitating a cooling effect.
• The invention is also to provide a machine case having the aforementioned cooling structure. According to the present invention, the machine case is to provide a motherboard disposed therein, on which an electronic heating component is arranged. Meanwhile, the machine case has two cooling lids interspaced in parallel to each other and a cooling structure therein. The cooling structure includes: two rails, respectively arranged on two inner side faces of the machine case; a heat-conducting plate, arranged between two rails; at least one heat pipe, attached onto the heat-conducting plate; and a heat-conducting block. According to the present invention, the heat-conducting plate is glided, in cooperation with two rails, to a corresponding position, where the electronic heating component is intended to be cooled. Then, the heat-conducting block is engaged between the heat-conducting plate and the electronic heating component to undertake a heat-transferring contact, making the heat generated from the electronic heating component conducted to the heat-conducting plate, and then extended toward the positioning direction of two rails in the heat-conducting plate through the heat pipe, thereby, the heat being able to be conducted to the machine case for facilitating a cooling effect.
BRIEF DESCRIPTION OF DRAWING
• The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself, however, may be best understood by reference to the following detailed description of the invention, which describes a number of exemplary embodiments of the invention, taken in conjunction with the accompanying drawings, in which:
• FIG. 1 is an explosive illustration for showing an interior of a machine case according to the present invention;
• FIG. 2 is an assembled illustration for showing an interior of a machine case according to the present invention;
• FIG. 3 is a cross-sectional illustration for showing an interior of a machine case according to the present invention;
• FIG. 4 is a cross-sectional illustration for showing a heat-conducting block in a machine case according to another embodiment of the present invention; and,
• FIG. 5 is an explosive illustration for showing an interior of a machine case according to a further embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
• In cooperation with attached drawings, the technical contents and detailed description of the present invention are described thereinafter according to a number of preferable embodiments, being not used to limit its executing scope. Any equivalent variation and modification made according to appended claims is all covered by the claims claimed by the present invention.
• Please refer toFIG. 1 andFIG. 2, which respectively are an explosive illustration and an assembled illustration for showing an interior of a machine case according to one preferable embodiment of the present invention. The invention is to provide a mobile cooling structure and a machine case having it. Themachine case1 may be a machine case of industrial computer and includes two coolinglids10 interspaced in parallel to each other, a supportingplate11 laid between two coolinglids10, and anouter shell12 accommodating the supportingplate11 therein.
• According to above description, two coolinglids10 are all constructed by metallic materials with excellent cooling quality and have a plurality of coolingfins100 arranged on outer side faces thereof. The supportingplate11 is horizontally connected between two inner side faces of two coolinglids10 in a lower position of themachine case1, such that amotherboard2 is fixedly disposed on the supportingplate11. Furthermore, theouter shell12 is assembled between two cooling lids, as shown inFIG. 2, making themotherboard2 accommodated in themachine case1.
• Please refer toFIG. 1 andFIG. 3 together. In this preferable embodiment, themotherboard2 has at least oneelectronic heating component20 arranged thereon, for example, CPU. The cooling structure of the invention is provided for undertaking a cooling process to theelectronic heating component20 on themotherboard2. Thecooling structure3 includes: tworails30; a heat-conductingplate31 capable of gliding on therails30; at least oneheat pipe32, attached on the heat-conductingplate31; and a heat-conductingblock33 thermally contacted under the heat-conductingplate31. In this case, tworails30 are respectively arranged on each inner side face of two coolinglids10 in an upper position of themachine case1. Tworails30 are arranged horizontally, corresponded to each other, and extended along a longitudinal direction of two coolinglids10, making the heat-conductingplate31 capable of being moved between two coolinglids10 horizontally, by arranging the heat-conductingplate31 along a longitudinal direction of tworails30. Tworails30 are respectively constructed by twoside plates300, which are formed aslong stripes300, interspaced to each other vertically, and arranged on the inner side faces of the coolinglids10.
• In this case, the heat-conductingplate31 includes: aplate body310, formed as a flat plate; and two glidingarms311 extended from theplate body310. Two glidingarms311 can be respectively cooperative with aforementioned tworails30, as shown inFIG. 3, making theplate body310 laid between tworails30. The heat-conductingplate31 can be displaced along a longitudinal direction of tworails30, by the cooperation between its glidingarms311 and therails30. In addition, the heat-conductingplate31 can be further arranged agroove312, which is extended from theplate body310 toward two glidingarms311, such that theheat pipe32 may be embedded in thegroove312 cooperatively.
• Accordingly, as shown inFIG. 3, the heat-conductingplate31 is firstly moved along tworails30, making theplate body310 of the heat-conductingplate31 moved to a position, which is above anelectronic heating component20 of amotherboard2, such that the heat-conductingblock33 is engaged between the heat-conductingplate31 and theelectronic heating component20. After the heat-conductingblock33 has contacted with theelectronic heating component20, the heat generated from theelectronic heating component20 may be transferred to the heat-conductingplate31 via the heat-conductingblock33. The heat absorbed by theheat pipe32 arranged on the heat-conductingplate31 is further transferred to at least onegliding arm311, which contacts with two coolinglids10, or the heat can be conducted to the coolinglids10 through twoside plates300. In thecooling lids10, the conducted heat may be dissipated to the ambience via a plurality of coolingfins100 arranged thereon.
• Thereby, according to aforementioned structural composition, a mobile cooling structure and a machine case having it of the present invention may be obtained.
• Furthermore, as shown inFIG. 4, regarding to the cooling requirement of a plurality ofelectronic heating components20, an extendingplate330 may be extended laterally from the bottom of the heat-conductingblock33 and contacted with other heat sources, such that the all heat generated from each heat sources on themotherboard2 may be conducted out via the heat-conductingblock33.
• In addition, as shown inFIG. 5, a specificaforementioned groove312 in the heat-conductingplate31 may be respectively corresponded to two glidingarms311. Since anaforementioned heat pipe32 is respectively embedded in thegroove312, twoheat pipes32 may be respectively corresponded to agliding arm311 to conduct heat.
• Therefore, a mobile cooling structure and a machine case having the cooling structure according to the present invention may be adjusted, in corresponding to the positions of theelectronic heating components20 in amachine case1, and particularly adaptable to an industrial computer. The positions of theelectronic heating components20 in an industrial computer are so frequently changed due to the differences of machine model that thecooling structure3 of the invention as aforementioned is indeed needed. Especially, the invention applies tworails30, which are capable of position adjusting function to fulfill the cooling requirement needed by the heat sources in each kind of industrial computers.
• Summarizing aforementioned description, the invention is an indispensable product of novelty indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts, and which extremely possesses the innovation and progressiveness to completely fulfill the applying merits of new type patent, according to which the invention is thereby applied. Please examine the application carefully and grant it as a formal patent for protecting the rights of the inventor.
• However, the aforementioned description is only a preferable embodiment according to the present invention, being not used to limit the patent scope of the invention, so equivalently structural variation made to the contents of the present invention, for example, description and drawings, is all covered by the claims claimed thereinafter.

Claims (13)

1. A mobile cooling structure arranged in a machine case to facilitate an electronic heating component arranged therein for a heat conduction, the mobile cooling structure including:

two rails, respectively arranged on two inner side faces of the machine case;

a heat-conducting plate, arranged between each inner side face of the two rails, and moved along the two rails to generate a gliding motion;

a heat pipe, attached onto the heat-conducting plate, and extended toward at least one disposing direction of the two rails; and

a heat-conducting block, engaged between the heat-conducting plate and the electronic heating component to make a heat-transferring contact;

wherein, the heat-conducting plate is glided along the two rails to a corresponding position, where the electronic heating component is intended to be cooled, and wherein the heat-conducting block is contacted between the heat-conducting plate and the electronic heating component in a way, such that a heat generated from the electronic heating component is conducted to the machine case.

2. The mobile cooling structure according toclaim 1, wherein the two rails are respectively constructed by two side plates that are formed as two long stripes, which are interspaced in parallel to each other.

3. The mobile cooling structure according toclaim 2, wherein the two side plates are arranged on two inner side faces of the machine case.

4. The mobile cooling structure according toclaim 1, wherein the heat-conducting plate has a plate body and two gliding arms that are extended respectively from the plate body and matched with the two rails.

5. The mobile cooling structure according toclaim 4, wherein a groove is arranged on the heat-conducting plate and is extended from the plate body toward the two gliding arms; and the heat pipe is embedded along a direction of the groove.

6. The mobile cooling structure according toclaim 4, wherein two grooves respectively cooperated with the two gliding arms are arranged on the heat-conducting plate and embed the heat pipe therein.

7. A machine case with a mobile cooling structure to provide a motherboard disposed therein, on which an electronic heating component is arranged, having two cooling lids interspaced to each other, and being arranged the cooling structure therein, the cooling structure including:

two rails, respectively arranged on each inner side face of the two cooling lids;

a heat-conducting plate, arranged between each inner side face of two rails, and moved along the two rails to generate a gliding motion;

a heat pipe, attached onto the heat-conducting plate, and extended toward at least one disposing direction of two rails; and

a heat-conducting block, engaged between the heat-conducting plate and the electronic heating component to make a heat-transferring contact;

wherein, the heat-conducting plate is glided along the two rails to a corresponding position, where the electronic heating component is intended to be cooled, and wherein the heat-conducting block is contacted between the heat-conducting plate and the electronic heating component in a way, such that a heat generated from the electronic heating component is conducted to two cooling lids.

8. The machine case with mobile cooling structure according toclaim 7, wherein a plurality of cooling fins are arranged on each outer side face of the two cooling lids.

9. The machine case with mobile cooling structure according toclaim 7, wherein the two rails are respectively constructed by two side plates that are formed as two long stripes, which are interspaced in parallel to each other.

10. The machine case with mobile cooling structure according toclaim 9, wherein the two side plates are respectively arranged on an inner side face of the cooling lid.

11. The machine case with mobile cooling structure according toclaim 7, wherein the heat-conducting plate of the cooling structure has a plate body and two gliding arms that are extended respectively from the plate body and matched with the two rails.

12. The machine case with mobile cooling structure according toclaim 11, wherein a groove is arranged on the heat-conducting plate of the cooling structure and is extended from the plate body toward the two gliding arms; and the heat pipe is embedded along a direction of the groove.

13. The machine case with mobile cooling structure according toclaim 11, wherein two grooves respectively cooperated with the two gliding arms are arranged on the heat-conducting plate of the cooling structure and embed the heat pipe therein.

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