US20090108382A1 - Transducer for use in harsh environments - Google Patents

Abstract

A pressure sensor for use in a harsh environment including a substrate and a sensor die directly coupled to the substrate by a bond frame positioned between the substrate and the sensor die. The sensor die includes a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross. The sensor further includes a piezoelectric or piezoresistive sensing element at least partially located on the diaphragm such that the sensing element provides an electrical signal upon flexure of the diaphragm. The sensor also includes an connecting component electrically coupled to the sensing element at a connection location that is fluidly isolated from the diaphragm by the bond frame. The bond frame is made of materials and the connecting component is electrically coupled to the sensing element by the same materials of the bond frame.

Description

• This application is a continuation-in-part of U.S. application Ser. No. 11/120,885 entitled SUBSTRATE WITH BONDING METALLIZATION and filed on May 3, 2005, the entire contents of which is hereby incorporated by reference.
• The present invention is directed to transducer for use in harsh environments, and more particularly, to a transducer, such as a sensor or actuator, which is configured to withstand high temperatures and corrosive environments.
BACKGROUND
• Transducers, such as sensor or actuators, are often used in harsh environments, such as high temperature and corrosive environments. For example, it may be desired to place a microphone or dynamic pressure sensor in or adjacent to the combustion zone of a turbine, aircraft engine or internal combustion engine to detect dynamic pressure changes inside the turbine or engine. The dynamic pressure data can then be analyzed to track the efficiency and performance of the turbine or engine. The dynamic pressure sensor may also be utilized to track the acoustic characteristics of the turbine or engine (i.e., noise output).
• However, such a transducer must be able to withstand high operating temperatures and pressures, wide ranges of temperature and pressure, and the presence of combustion byproducts. When the transducer is a MEMS (microelectromechanical system) device, the MEMS transducer may be susceptible to damage due to its inherent materials of manufacture, thereby requiring additional protection.
• The transducer is typically electrically connected to an external device, controller or the like. The associated connections must also therefore be protected from the harsh environment to ensure proper operation of the transducer. Accordingly, there is a need for an improved transducer which can withstand such harsh environments.
SUMMARY
• In one embodiment the present invention is a transducer which can withstand harsh environments. For example, in one case the transducer includes electrical connections that are fluidly isolated to protect the electrical connection from the surrounding harsh environment. More particularly, in one embodiment the invention is a transducer for use in a harsh environment including a substrate and a transducer die directly coupled to the substrate by a bond frame positioned between the substrate and the transducer die. The transducer die includes a transducer element which provides an output signal related to a physical characteristic to be measured, or which receives an input signal and responsively provides a physical output. The transducer further includes a connecting component electrically coupled to the transducer element at a connection location that is fluidly isolated from the transducer element by the bond frame. The bond frame is made of materials and the connecting component is electrically coupled to the sensing element by the same materials of the bond frame.
• In another embodiment the invention is a pressure sensor for use in a harsh environment including a substrate and a sensor die directly coupled to the substrate by a bond frame positioned between the substrate and the sensor die. The sensor die includes a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross. The sensor further includes a piezoelectric or piezoresistive sensing element at least partially located on the diaphragm such that the sensing element provides an electrical signal upon flexure of the diaphragm. The sensor also includes a connecting component electrically coupled to the sensing element at a connection location that is fluidly isolated from the diaphragm by the bond frame. The bond frame is made of materials and the connecting component is electrically coupled to the sensing element by the same materials of the bond frame.
• In yet another embodiment the invention is a method for forming a transducer including the step of providing a semiconductor-on-insulator wafer including first and second semiconductor layers separated by an electrically insulating layer. The method further includes depositing or growing a piezoelectric or piezoresistive film on the wafer and depositing or growing an electrically conductive material on the piezoelectric or piezoresistive film to form at least one electrode. The method also includes the step of depositing or growing a bonding layer including an electrical connection portion that is located on or is electrically coupled to the electrode. The method further includes providing a ceramic substrate having a bonding layer located thereon, wherein the bonding layer includes an electrical connection portion and is patterned in a manner to match the bonding layer of the semiconductor-on-insulator wafer. The method includes causing the bonding layer of the semiconductor-on-insulator wafer and the bonding layer of the substrate to bond together to thereby mechanically and electrically couple the semiconductor-on-insulator wafer and the substrate to form the sensor, wherein the electrical connection portions of the semiconductor-on-insulator wafer and the substrate are fluidly isolated from the surrounding environment by the bonding layers.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a side cross section of one embodiment of the pressure sensor of the present invention;
• FIG. 2 is a top view taken along line2-2 ofFIG. 1;
• FIG. 3 is a bottom view of the sensor die ofFIG. 1, taken along line3-3 ofFIG. 1;
• FIG. 4 is a side cross section of the sensor die ofFIG. 3, taken along line4-4;
• FIG. 5 is a bottom view of an alternate embodiment of the sensor die;
• FIG. 6 is a side cross section of an alternate embodiment of the pressure sensor of the present invention;
• FIG. 7A is a bottom view of another sensor die;
• FIG. 7B is a side view of the sensor die ofFIG. 7A;
• FIGS. 8-17 are a series of side cross sections illustrating a process for forming a sensor die;
• FIG. 18 is a detail view of the area indicated inFIG. 11;
• FIG. 19 illustrates the structure ofFIG. 18 after annealing;
• FIG. 20 is a detail view of the area indicated inFIG. 11, shown after annealing;
• FIG. 21 illustrates the structure ofFIG. 19, with bonding materials deposited thereon;
• FIG. 22 illustrates the sensor die and substrate ofFIG. 1 spaced apart and ready to be coupled together;
• FIG. 23 is a detail view of the area indicated inFIG. 22;
• FIG. 24 illustrates the components ofFIG. 23 pressed together;
• FIG. 25 is a detail view of the area indicated inFIG. 24;
• FIGS. 26-30 illustrate various layers formed during the bonding process;
• FIG. 31 illustrates the components ofFIG. 24 after the bonding process is complete;
• FIG. 32 is a eutectic diagram for germanium/gold alloys;
• FIG. 33 illustrates the substrate and ring ofFIG. 1, exploded away from each other;
• FIG. 34 illustrates the substrate ofFIG. 33 positioned in the ring ofFIG. 33 with a braze material deposited thereon;
• FIG. 35 illustrates the substrate and ring ofFIG. 34 coupled together, with metallization and bonding layers deposited thereon and a sensor die positioned thereabove;
• FIG. 36 illustrates a pin and substrate exploded away from each other;
• FIGS. 37(a)-37(g) illustrate a series of steps for attaching the pin and substrate ofFIG. 36 together and coupling the resultant assembly to the sensor die;
• FIGS. 38(a)-38(g) illustrate a series of steps for coupling the pin and substrate ofFIG. 36 together;
• FIG. 39 illustrates the pressure sensor ofFIG. 1, with an alternate external connector, and the sheath in its retracted position;
• FIG. 40 illustrates the pressure sensor ofFIG. 39, with the sheath in its closed position;
• FIG. 41 illustrates the connector ofFIGS. 39 and 40 utilized with an electronics module;
• FIG. 42 is a side cross section of a first embodiment of a piezoresistive pressure sensor of the present invention;
• FIG. 43 is a top view of the sensor ofFIG. 42, with the capping wafer removed;
• FIG. 44 is a schematic top view of a layout of the resistors of the sensor die ofFIG. 43;
• FIG. 45 is a schematic representation of another layout of the resistors of the sensor die ofFIG. 43;
• FIGS. 46-56 are a series of side cross sections illustrating a process for forming the sensor die ofFIG. 42;
• FIG. 57 is a side cross section of a pedestal assembly which may be used with the sensor ofFIG. 42;
• FIG. 58 is a side cross section of a sensor die of a second embodiment of the piezoresistive pressure sensor of the present invention;
• FIG. 59 is a top perspective view of the sensor die ofFIG. 58;
• FIG. 60 is a side cross section of the second embodiment of the piezoresistive pressure sensor of the present invention;
• FIG. 61 is a side cross section of a third embodiment of the piezoresistive pressure sensor of the present invention;
• FIG. 62 is a top view of the sensor die of the pressure sensor ofFIG. 61;
• FIG. 63 is a bottom view of the substrate of the pressure sensor ofFIG. 61;
• FIG. 64 illustrates the sensor die ofFIG. 62 aligned with the substrate ofFIG. 63 for bonding;
• FIG. 65 illustrates the sensor die and substrate ofFIG. 64 coupled together; and
• FIG. 66 is a side cross section of another embodiment of the piezoresistive pressure sensor of the present invention.
DETAILED DESCRIPTIONOverviewPiezoelectric Sensor
• As shown inFIG. 1, one embodiment of the transducer takes the form of apressure sensor10, such as a dynamic pressure sensor or microphone which can be used to sense rapid pressure fluctuations in the surrounding fluid. Thepressure sensor10 may be configured to be mounted in or adjacent to the combustion cavity of an engine, such as a turbine, aircraft engine or internal combustion engine. In this case, thepressure sensor10 may be configured to withstand relatively high operating temperatures, wide temperature ranges, high operating pressure, and the presence of combustion byproducts (such as water, CO, CO₂, NO_x, and various nitrous and sulfurous compounds).
• The illustratedsensor10 includes a transducer die or sensor die12 electrically and mechanically coupled to anunderlying substrate14. The sensor die12 includes a diaphragm/membrane16 and is configured to measure dynamic differential pressure across thediaphragm16. The materials of the sensor die12 andsubstrate14 will be discussed in detail below, but in one embodiment the sensor die12 includes or is made of a semiconductor-on-insulator wafer or a silicon-on-insulator (“SOI”) wafer. Thesubstrate14 may be a generally disk-shaped ceramic material that is compression mounted inside a thinwalled metal ring18. Thering18 is, in turn, mounted to a header, header plate, base orpedestal20 which provides support to thering18 and structure and protection to thesensor10 as a whole. Thediaphragm16 can be made of a variety of materials, such as semiconductor materials, but in one case is made of nearly any non-metallic material.
• Apin22, also termed a connecting component, is electrically coupled to the sensor die12 at one end of thepin22, and is electrically coupled to awire24 at the other end thereof. Thewire24 can then be connected to an external controller, processor, amplifier, charge converter or the like to thereby communicate the output of the sensor die12. Ascreen26 may be provided across the upper opening of the base20 to provide some mechanical protection to the sensor die12, and also to provide protection from fluidic and thermal spikes.
Piezoelectric Sensor Die Structure
• The operation and configuration of the sensor die12 will now be discussed in greater detail. As can be seen inFIG. 4, the sensor die12 may be made of or include aSOI wafer30. Thewafer30 includes a base or handle layer ofsilicon32, an upper or device layer ofsilicon34, and an oxide or electrically insulatinglayer36 positioned between thedevice layer34 andbase layer32. Thedevice layer34 may be an electrically conductive material such as doped silicon. However, as will be described in greater detail below, theSOI wafer30/device layer34 may be made of various other materials besides silicon. Portions of thebase layer32 and theoxide layer36 are removed to expose portions of thedevice layer34 to thereby form thediaphragm16 which can flex in response to differential pressure thereacross.
• Thesensor10 includes a piezoelectric sensing element, generally designated40, which includes apiezoelectric film42 located over thedevice layer34/diaphragm16. A set ofelectrodes44,46 are positioned on thepiezoelectric film42. If desired, a dielectric orpassivation layer48 may be located over theelectrodes44,46 andpiezoelectric film42 to protect those components.
• FIG. 3 illustrates one configuration for the electrodes wherein the sensor die12 includes acenter electrode44 and anouter electrode46 located generally about thecenter electrode44, with agap49 positioned between theelectrodes44,46. Thecenter electrode44 is configured to be located over areas of tensile surface strain of thediaphragm16 when thediaphragm16 is deflected (i.e., due to differential pressure), and theouter electrode46 is positioned to be located over areas of compressive surface strain of thediaphragm46 when thediaphragm46 is deflected. Thegap49 between thecenter44 and outer46 electrodes is located on a region of minimal or no strain when thediaphragm16 is flexed.
• The sensor die12 ofFIG. 3 includes a pair ofoutput contacts50,52, with eachoutput contact50,52 being directly electrically coupled to one of theelectrodes44,46. For example, lead56 extends from thecenter electrode44 to theoutput contact50 to electrically connect those components, and lead58 extends from theouter electrode46 to theoutput contact52 to electrically connect those components. Both leads56,58 may be “buried” leads that are located between thedielectric layer48 and the piezoelectric film42 (i.e., seelead58 ofFIG. 4). If thepiezoelectric film42 does not entirely coat the sensor die12, an insulating layer (not shown) may be deposited on thesensor12 and positioned between theleads56,58 and thedevice layer34 to electrically isolate theleads56,58 from thedevice layer34.
• The sensor die12 may also include areference contact60 which extends through thepiezoelectric film42 to directly contact the device layer34 (seeFIG. 4). In this manner, thereference contact60 provides a reference or “ground” voltage which can be compared to voltages measured at thecontacts50,52. However, if desired thereference contact60 may be omitted in which case the induced piezoelectric charge relative to theelectrodes44,46 is measured using a charge converter or charge amplifier.
• In operation, when the sensor die12 is exposed to differing pressures across thediaphragm16, thediaphragm16 is bowed either upwardly or downwardly from the position shown inFIG. 4. For example, downward deflection of thediaphragm16 occurs when a relatively higher pressure is located on the top side of thediaphragm16, thereby causing tensile strain to be induced in portions of thepiezoelectric film42 located adjacent to thecenter electrode44. Simultaneously, a compressive strain is induced in the portions of thepiezoelectric film42 located adjacent to theouter electrode46. The induced stresses cause change in the electric characteristics (i.e. potential or charge) of thepiezoelectric film42 that is communicated to thecenter44 and outer46 electrodes, and to the associatedelectrical contacts50,52. In one embodiment, as shown inFIG. 6, if desired thesubstrate14 may include a depression62 formed on an upper surface thereof to accommodate downward deflection of thediaphragm16. However, the depression62 is optional and may be omitted if desired.
• The electrical differential between thecontacts50,52, as sensed with respect to thereference contact60, provides an output indicative of the pressure differential across thediaphragm16. In other words, theelectrodes44,46 and leads56,58 accumulate and transmit the induced piezoelectric charge to thecontacts50,52. From there thecontacts50,52 allow the charge to be transmitted (viapins22 and wires24) to a charge converter or charge amplifier, and ultimately a controller, processor or the like which can process the output to determine the sensed pressure/pressure change. Thepiezoelectric film42 provides a very fast response time and therefore is useful in measuring vibration and other high frequency phenomenon. Thepiezoelectric film42 is typically used in sensing dynamic or A/C or high-frequency pressure changes. The utility of piezoelectric film to sense static or D/C or low-frequency pressure changes is typically limited due to leakback effects related to dielectric leakage through the piezoelectric film.
• However, rather than using apiezoelectric film42, thesensing element40 may use a piezoresistive film. The piezoresistive film can accurately sense static or D/C or low-frequency pressure changes. In this case the piezoresistive film is patterned in a serpentine shape as shown inFIG. 43 in the well known manner on thediaphragm16 and electrically coupled to thecontacts50,52 in a well known manner. The serpentine pattern may form a Wheatstone bridge configuration whereby two legs of the Wheatstone bridge are located over thediaphragm16. The deflection of thediaphragm16 is then measured through a change in resistance of the piezoresistive film in a well known manner.
• It should be understood that thepiezoelectric sensing element40 may have a variety of shapes and configurations different from that specifically shown herein. For example, if desired, thediaphragm16,center electrode44 andouter electrode46 may each have a circular shape or other shapes in top view, rather than a square or rectangular shape. In addition, as shown inFIGS. 5 and 6, if desired only asingle sensing electrode44 may be utilized. In this case, thesingle electrode44 may be located over only the inner (or outer, if desired) portion of thediaphragm16. In this embodiment the sensitivity of thesensor10 may be somewhat reduced since a differential electrical measurement is not provided. However, this embodiment provides for a much smaller sensor die12 (and sensor10) and simplified electrical connections.
• As can be seen from the bottom view of the sensor die12 provided inFIG. 3, abond frame70 is located on the sensor die12 and forms an enclosure around the underside of thediaphragm16. Thebond frame70 extends around the perimeter of the sensor die12, and also includes abulkhead72 extending laterally across the sensor die12. Thebulkhead72 provides environmental isolation of thecontacts50,52,60. When thesensor10 is used in an engine combustion chamber or the like, the chamber may operate at 600 psig or higher and the pressure fluctuations of interest can be as low as 0.1 psig at frequencies as low as 50 Hz (and as high as 1000 Hz). Accordingly, it may be desired to provide some pressure relief across thebond frame70 to provide hydrostatic balance across thediaphragm16 and allow athinner diaphragm16, thereby increasing the sensitivity of thesensor10.
• As shown inFIG. 1, in one embodiment asmall opening74 is formed in thesubstrate14 and below thebond frame70 to allow pressure equalization across thediaphragm16 to provide hydrostatic balance. Theopening74 is relatively small (i.e., having a cross sectional area of a few tenths of a millimeter or less) such that any pressure fluctuations on the upper side of thediaphragm16 are damped or attenuated as they travel through theopening74. In other words, A/C fluctuations are not transmitted to the lower side of thediaphragm16, and only lower frequency, static or large scale pressure fluctuations pass through theopening74. In this manner, the opening74 forms a low pass frequency filter. As will be described in greater detail below, other methods for providing hydrostatic balance may be provided.
• Thebulkhead72 provides a sealed cavity76 (FIG. 3) around thecontacts50,52,60. The sealedcavity76 is formed by thebond frame70 andbulkhead72 around the perimeter thereof, the sensor die12 on the top side and the substrate on the bottom side14 (seeFIG. 1). The sealedcavity76 isolates the electrical portion of the device (i.e., thecontacts50,52,60) from the pressure portion (i.e., the diaphragm16) to ensure that the pressure medium does not invade and contaminate/corrode the electrical elements or components, and also protects the electrical elements and components from high pressures.
• Thus, each lead56,58 electrically connects to acontact50,52, and/or eachcontact50,52 is electrically connected to apin22, at aconnection location57, and the connection location(s) are located in the sealedcavity76 to provide protection. Eachlead56,58 may pass under, over or through thebulkhead72 using well known surface micromachining methods to enter the sealedcavity76 without compromising the isolation of the sealedcavity76. Eachcontact50,52 and eachpin22 may be electrically isolated from thebond frame70.
• At the point where each lead56,58 passes under or through thebulkhead72, each lead56,58 is positioned directly between theframe70,bulkhead72 and the body of the sensor die12. At this point an electrically insulating material may be positioned between each lead56,58 and the metal layers of thebulkhead72 to electrically isolate those component and to prevent theleads56,58 from shorting to theframe70 orbulkhead72. In an alternate embodiment the bulkhead72 (and indeed the entire frame70) is positioned on top of thedielectric layer42, and in this case thedielectric layer42 electrically isolates theleads56,58 from thebulkhead72.
• However thebulkhead72 may not necessarily be included if the sensor is to be used in a relatively benign environment. For example,FIG. 7A illustrates an embodiment of the sensor die12 that does not include thebulkhead72. In addition, any of the embodiments described and shown herein may include or not include thebulkhead72, as desired. In the embodiment shown inFIGS. 7A and 7B, thebond frame70 forms a generallyserpentine path78 to allow pressure equalization across thediaphragm16 as shown by the arrows ofFIG. 7A. The body of the sensor die12 may also have a matchingserpentine cavity80 formed therein. In this case, the opening74 (i.e., ofFIG. 1) is not required, and hydrostatic balance is instead provided by theserpentine cavity78. Theserpentine cavity78 may provide greater attenuation of the pressure fluctuations on the underside of themembrane16, depending upon the frequency of the fluctuations. In addition, if desired the embodiment shown inFIG. 7A may utilize abulkhead72 to form a sealedcavity76 around thecontacts50,52,60.
• Further alternately, as shown inFIG. 5, rather than forming anopening74 in thesubstrate14 or providing theserpentine channel78, a relativelysmall opening82 may be formed in the bond frame70 (i.e. alongend wall70′) to allow pressure equalization. As will be described in greater detail below thebond frame70 is reflowed during the manufacturing/assembly process. Accordingly, certain channels or other flow control measures (such as placing a void in the dielectric layer48) may be utilized to ensure that theopening82 remains open and is not sealed by reflowed material.
• It should be understood that the sensor die12 need not necessarily include any channels or paths to provide pressure equalization, and in this case the two sides of thediaphragm16 may be fluidly isolated from each other. It should be further understood that any of the various structures for providing pressure balance (i.e. theopening74 formed in thesubstrate14; theopening82 formed in thebond frame70; or the serpentine channel78) can be used in any of the embodiments disclosed herein, or, alternately, no pressure balance structure may be provided.
Piezoelectric Sensor Die Manufacturing
• One process for forming the sensor die(s)12 ofFIGS. 1-7 is shown inFIGS. 8-17 and described below, although it should be understood that different steps may be used in the process, or an entirely different process may be used without departing from the scope of the invention. Thus, the manufacturing steps illustrated here are only one manner in which the sensor die12 may be manufactured, and the order and details of each step described herein may vary, or other steps may be used or substituted with other steps that are well known in the art. A number of sensor dies12 may be simultaneously formed on a single wafer, or on a number of wafers, in a batch manufacturing process. However, for clarity of illustration,FIGS. 8-17 illustrate only a single sensor die12 being formed.
• It should be understood that when a layer or component is referred to as being located “on” or “above” another layer, component or substrate, this layer or component may not necessarily be located directly on the other layer, component or substrate, and intervening layers, components, or materials could be present. Furthermore, when a layer or component is referred to as being located “on” or “above” another layer, component or substrate, that layer or component may either fully or partially cover the other layer, component or substrate.
• It should also be noted that although, in general, the shading of the various layers of the drawings is maintained in a generally consistent manner throughout the drawings ofFIGS. 8-17 and elsewhere, due to the large number of components and materials the shading for a material or layer may differ between the various figures. In addition,FIGS. 8-17 represent a schematic cross-section of the wafer during manufacturing, and the location of certain components may not necessarily correspond to a true cross section.
• As shown inFIG. 8, the process begins with theSOI wafer30, such as a double sided, polished 3 inch or 4 inch (or larger) diameter wafer. In one embodiment, thedevice layer34 of thewafer30 is silicon and is about 30 microns thick (8 microns thick in another embodiment), although thedevice layer34 may have a variety of thicknesses from about 1 micron to about 60 microns, or from about 3 microns to about 60 microns, or from about 3 microns to about 300 hundred microns, about or less than about 60 microns, or less than about 300 microns, or less than about 200 microns or greater than about 1 micron, or greater than about 3 microns, or have other thicknesses as desired (it should be understood that the thickness of the various layers shown in the drawings are not necessarily to scale).
• Thedevice layer34 may be doped (either n-doped or p-doped) silicon and may have a (111) crystal orientation to aid in subsequent deposition of thepiezoelectric film42. If desired, thedevice layer34 can be made of other materials besides silicon, such as sapphire, gallium nitride, silicon nitride, silicon carbide, or high temperature-resistant materials or ceramics. Although thedevice layer34 may be made of silicon carbide, in one embodiment of the present invention thedevice layer34 is made of non-silicon carbide semiconductor materials.
• The responsiveness of the sensor die12 to a range of pressure fluctuations is directly related to the thickness of thediaphragm16. In most cases the thickness of thedevice layer34 will ultimately determine the thickness of thediaphragm16, and thus the thickness of thedevice layer34 should be carefully selected. However, if desired the thickness of thedevice layer34 could be reduced during later processing steps to tailor the responsiveness of thediaphragm16 to pressure ranges and fluctuations of interest.
• Thebase layer32 may also be made of silicon or other materials listed above, and can have a variety of thicknesses, such as between about 100 microns and about 1,000 microns, or greater than 1000 microns, and more particularly, about 500 microns. Thebase layer32 should be of sufficient thickness to provide structural support to the sensor die12. In one embodiment, thebase layer32 is single crystal silicon having a (100) crystal orientation to allow easy etching thereof.
• The insulatinglayer36 can be of any variety of materials, and is typically silicon dioxide. The insulatinglayer36 acts as an etch stop, and also provides electrical isolation to thewafer30. The insulatinglayer36 may have a variety of thicknesses, such as between about 0.5 microns and about 4 microns, and is typically about 1 or 2 microns thick. In addition, a lower insulating layer84 (such as a 0.3 micron thick layer of silicon dioxide) may be deposited or grown on thewafer30. The lower insulatinglayer84 may have the same properties as the insulatinglayer36. Alternately, the lower insulatinglayer84 may be deposited or grown after thepiezoelectric film42 is deposited, as described below and shown inFIG. 9.
• As shown inFIG. 9, after thewafer30 is provided, thepiezoelectric film42 is deposited on top of thedevice layer34. Thepiezoelectric film42 may coat all of thedevice layer34. Alternately, thepiezoelectric film42 may cover only part of the device layer34 (i.e. only thediaphragm16, or only where theelectrodes44,46 will be located). The material of thepiezoelectric film42 is selected based on its operating temperature range, electrical resistivity, piezoelectric coefficient, and coupling coefficient. Aluminum nitride remains piezoactive up to 1,100° C., and thus may be useful for the piezoelectric film. However, various other materials, including but not limited to gallium nitride, gallium orthophosphate (GaPO₄), lanthanum titanate (which can take the form of La₂Ti₂O₇) or langasite (which can take the form of several compositions, typically including lanthanum and gallium, such as La₃Ga₅SiO₁₄, La₃Ga_5.5Ta_0.5O₁₄, or La₃Ga_5.5Nb_0.5O₁₄) may be used. In addition, any other piezoelectric material may be utilized as thefilm42, depending upon the operating temperature.
• When thedevice layer34 of thewafer30 is (111) silicon, aluminum nitride can be epitaxially grown on thedevice layer34 due to the hexagonal structure of aluminum nitride and the closely corresponding structure of (111) silicon. Further alternately, thepiezoelectric film42 can be deposited using metal organic chemical vapor deposition (“MOCVD”), molecular beam epitaxy (“MBE”), vapor phase epitaxy (“VPE”) or any other deposition process which can provide epitaxial growth of thepiezoelectric film42. Further alternately, thepiezoelectric film42 can be sputter deposited in either nanocrystalline or amorphous form. In this case thedevice layer34 need not necessarily be of (111) silicon, and instead a thin film of metal, such as platinum, may be deposited on thedevice layer34 prior to deposition of thepiezoelectric film42 to act as an electrode during the piezoelectric film sputtering process. If the metal electrode is utilized during the sputtering process, thedevice layer34 need not necessarily be doped, as the metal film could instead provide the desired electrical conductivity to thedevice layer34. Thepiezoelectric film42 can have a variety of thicknesses, such as between about 0.2 and about 2 microns.
• As shown inFIG. 10, part of thepiezoelectric film42 is then patterned and removed at86 to expose part of thedevice layer34 therebelow. Thepiezoelectric film42 can be etched/patterned by any acceptable method, such as a high density plasma etching (i.e. inductively coupled plasma (“ICP”) etching).
• As shown inFIG. 11, ametallization layer88 is then selectively deposited, such as by sputtering and photo patterning, to form or contribute materials to thecenter electrode44,outer electrode46, leads56,58 (not shown inFIG. 11),reference contact60,output contacts50,52 andbond frame70. Themetallization layer88 provides good ohmic contact to theactive layer34 and also operates as a diffusion barrier, as will be described in greater detail below. The materials and process for depositing themetallization layer88 will be described in greater detail below, but in one embodiment themetallization layer88 includes a layer of tantalum located on thewafer30, with a layer of tantalum silicide located on the tantalum layer, and a layer of platinum located on the tantalum silicide layer.
• Thecenter electrode44,outer electrode46,reference contact60,output contacts50,52 and leads56,58 can have a variety of shapes and sizes. In one embodiment (with reference toFIG. 3) thecenter electrode44 has dimensions of about 3900×3900 microns; theouter electrode46 has outer dimensions of about 6000×6000 microns; thereference contact60 has dimensions of about 2000×1000 microns; eachoutput contact50,52 has dimensions of about 600×600 microns; and each lead56,58 has a width of between about 50 and about 150 microns.
• As shown inFIG. 12, thepassivation layer48, if utilized, is then deposited on thewafer30 and over the metallization layers88 andpiezoelectric film42. In one embodiment thepassivation layer48 is SiO_xN_yand is deposited by plasma enhanced chemical vapor deposition (“PECVD”) to a thickness of about 1 micron (0.3 microns in another embodiment). However, thepassivation layer48 can be made of any of a wide variety of protective/insulating materials. As noted above thepassivation layer48 may be omitted if the additional protection/insulation is not needed. However, for the remainder of this process flow it is assumed thepassivation layer48 is utilized.
• As shown inFIG. 13, portions of thepassivation layer48 are then removed to expose themetallization portion88 of thereference contact60,output contacts50,52 andbond frame70. Themetallization layer88 forming theelectrodes44,46 and leads56,58 remains buried. Next, as shown inFIG. 14, abonding material90 is deposited on the exposed metallization layers88 to add further structure to thecontacts50,52,60 andbond frame70. The materials for, and deposition of, thebonding materials90 will be described in greater detail below, but in one embodiment includes gold and germanium.
• As shown inFIG. 15, the lower insulatinglayer84 is then patterned to expose portions of thebase layer32 for etching. Next, as shown inFIG. 16, the exposed portions of thebase layer32 are removed to define acavity92, above which is located thediaphragm16, and to define a pair of dicinglanes94. The portions of theoxide layer36 located under thediaphragm16 may also be removed to reduce thermal stresses on thediaphragm16. Thediaphragm16 can have a variety of sizes, and in one embodiment has a surface area of between about 0.25 mm²and about 4 mm². This etch step ofFIG. 16 can be carried out by deep reactive ion etching (“DRIE”), a wet etch such as a KOH etch, or any of a variety of other etching methods. The sensor die12 is then singulated along the dicinglanes94, resulting in the final structure shown inFIG. 17.
Metallization Layer
• The structure of, and method for depositing, the metallization layer88 (referenced inFIG. 11 and the accompanying description) are now described in greater detail.FIGS. 18 and 19 illustrate the deposition of themetallization layer88 directly on the device layer34 (i.e. when forming the reference contact60). In the embodiment shown inFIG. 18, the metallization layer includes a first layer oradhesion layer102, a second layer or outwarddiffusion blocking layer104, and a third layer or inwarddiffusion blocking layer106. Theadhesion layer102 can be made of any of a variety of materials which adhere well to the wafer30 (i.e. silicon). Thus, the material of theadhesion layer102 can vary depending upon the material of thewafer30, although theadhesion layer102 is primarily selected based on its ability to bond strongly to thewafer30.
• Tantalum is one example of theadhesion layer102 because tantalum adheres well to a variety of materials. However, besides tantalum, various other materials such as chromium, zirconium, hafnium, or any element which reacts favorably with thewafer30 and forms compounds which bond strongly to thewafer30 may be utilized as theadhesion layer102.
• Theadhesion layer102 can have a variety of thicknesses, and can be deposited in a variety of manners. However, theadhesion layer102 should have sufficient thickness to ensure proper adhesion to thewafer30, but should not be so thick so as to add significant bulk to themetallization layer88. Theadhesion layer102 may be initially deposited to a thickness of between about 100 Angstroms and about 10,000 Angstroms, and may be deposited by plasma enhanced physical vapor deposition or other suitable deposition techniques known in the art.
• When theadhesion layer102 is tantalum, the presence of oxygen at the interface of theadhesion layer102 and thewafer30 can inhibit silicide formation which material is desired for its diffusion blocking properties. The presence of oxygen at the interface can also cause adverse metallurgical transformations in theadhesion layer102 to thereby create a highly stressed (i.e., weak)adhesion layer102.
• Accordingly, prior to depositing theadhesion layer102 on thedevice layer34, the upper surface of thedevice layer34 may be cleaned to remove oxides. This cleaning step may involve the removal of oxides through plasma sputter etching, or a liquid HF (hydrofluoric acid) solution or a dry HF vapor cleaning process or other methods known in the art. Theadhesion layer102 should be deposited on thedevice layer34 shortly after the cleaning step to ensure deposition thereon before oxides have the opportunity to redevelop on the device layer34 (i.e. due to oxidizing chemical reactions with oxygen in the surrounding environment).
• Outwardly diffusing materials (i.e. the silicon of the wafer30) may react with the materials of themetallization layer88 which can weaken themetallization layer88. Thus, thesecond layer104 is made of a material or materials which blocks the outward diffusion of the material of thewafer30. Although the second104 and third106 layers are designated as inward and outward diffusion blocking layers, respectively, it should be understood that the second104 and third106 layers may not, by themselves, necessarily block diffusion in the desired manner. Instead, each of thelayers104,106 may include or contribute a material which reacts to form a diffusion blocking layer upon sintering, annealing, chemical reactions, etc. of themetallization layer88, as will be described in greater detail below.
• Thesecond layer104 can be made of any of a wide variety of materials depending upon the materials of the wafer30 (the outward diffusion of which is desired to be blocked). In one embodiment, thesecond layer104 is tantalum silicide although a variety of other materials including but not limited to tantalum carbide and tungsten nitride may be utilized. Thesecond layer104 should have a thickness sufficient to prevent outward diffusion of thewafer material30, or to contribute sufficient materials to form a sufficient outward diffusion barrier layer after annealing. Thesecond layer104 may be initially deposited to a thickness of between about 100 Angstroms and about 10,000 Angstroms by plasma sputtering, or other suitable deposition techniques known in the art.
• When thesecond layer104 is made of compounds (for example, tantalum silicide) the tantalum silicide may be deposited directly in its form as tantalum silicide. Alternately, layers of tantalum and layers of silicon may be deposited such that the layers subsequently react to form the desired tantalum silicide. In this case alternating, thin (i.e. 5 to 20 Angstroms) discrete layers of the two basic materials (tantalum and silicon) are deposited on theadhesion layer102 in a co-deposition process. The number of alternating layers is not critical provided that the total thickness of the composite layer is between about 100 and about 10,000 Angstroms as described above. After the alternating layers of tantalum and silicon are deposited, the alternating layers are exposed to elevated temperatures during an annealing step, which is discussed in greater detail below. During the annealing step the alternating layers of tantalum and silicon diffuse or react to form a single layer of tantalum silicide.
• When using this method to deposit thetantalum silicide104, the relative thickness of the deposited layers of tantalum and silicon during the co-deposition process controls the ratio of tantalum and silicon in the resultanttantalum silicide layer104. Thus, the ability to control the relative thickness of the tantalum and silicon layers allows a silicon-rich or silicon-lean layer of tantalum silicide to be formed. For example, a relatively silicon-rich layer of tantalum silicide (i.e. tantalum silicide having an atomic composition of a few percentage points richer in silicon than stoichiometric tantalum silicide (TaSi₂)) may be preferred as theoutward diffusion barrier104 to enhance diffusion resistance.
• Thethird layer106 of themetallization layer88 is made of a material or materials that block or limit inward diffusion of undesired elements, compounds or gases. For example, the third layer can be made of materials which block the inward diffusion of gases such as nitrogen, oxygen or carbon dioxide in the surrounding environment, or which block the inward diffusion of solid elements or compounds located on themetallization layer88. These undesired elements, compounds or gases can adversely react with the other materials of themetallization layer88 or the materials ofwafer30.
• Thethird layer106 may be made of a variety of materials, such as platinum, although the materials of the third layer depends upon the materials of thewafer30 and the materials of theadhesion102 andsecond layer104, as well as the elements, compounds or gases which are desired to be blocked from diffusing inwardly. Thethird layer106 can be deposited to an initial thickness of between about 100 Angstroms and about 10,000 Angstroms by plasma sputtering or other suitable deposition methods known to those skilled in the art.
• In one embodiment thefirst layer102 includes a tantalum layer having a thickness of about 1500 Angstroms, thesecond layer104 includes tantalum silicide having a thickness of about 3000 Angstroms, and thethird layer106 is platinum having a thickness of about 10,000 Angstroms. The specific thickness tolerances of thevarious layer102,104,106 is determined by the need to create an effective adhesion layer and for the processed materials to diffuse and create effective inward and outward diffusion barriers, while leaving enough platinum available on the outer surface of themetallization layer88 for platinum-platinum wire bonding.
• FIG. 18 illustrates themetallization layer88 after deposition of the first layer102 (tantalum in the illustrated embodiment), second layer104 (tantalum silicide in the illustrated embodiment) and third layer106 (platinum in the illustrated embodiment). After the deposition of thelayers102,104 and106, themetallization layer88 is annealed (also termed sintering) to cause certain reactions and/or reaction byproducts. In particular, in one embodiment the structure shown inFIG. 18 is annealed for about 30 minutes at about 600° C. in a vacuum. The annealing process is carried out such that the layer oftantalum silicide104 is formed (if tantalum and silicide are deposited as alternating layers) or until the other desired reactions are complete.
• Alternately, rather than utilizing a single step anneal process, a two step anneal process may be utilized. The two step anneal process includes ramping to a temperature of about 450° C. by increasing temperature (from room temperature) about 6° C.-10° C. per minute. The first anneal step is then performed by holding the temperature at about 450° C. for about 1 hour. The temperature is slowly increased to about 600° C. over a period of about 15 minutes, and then the temperature is held at about 600° C. for about 1 hour for the second anneal step. Themetallization layer88 is then allowed to slowly cool.
• The two step anneal process improves adhesion of themetallization layer88 to thewafer30 and in particular improves adhesion of theadhesion layer102/108 to the piezoelectric film42 (FIG. 20). In addition, because a significant portion of the two step anneal process occurs at a relatively low temperature (i.e., below 600° C.), diffusion of platinum or tantalum through thepiezoelectric film42 and into thedevice layer34 is reduced, thereby reducing electrical leakage issues.
• FIG. 19 illustrates the structure ofFIG. 18 after the anneal step. It is noted that for discussion purposes the first, second and third layers may be referred to herein as the “tantalum layer102,” “tantalum silicide layer104” and “platinum layer106,” respectively. However, this convention is included for ease of discussion purposes only and is not intended to convey that thelayers102,104,106 are limited to those particular materials. Further, it is noted that various layers or materials other than those shown inFIG. 19 and discussed below may form in themetallization layer88 after annealing, andFIG. 19 merely illustrates the presence of the various, major layers which are expected to be present after annealing.
• In particular, when thewafer30 is a SOI wafer and the first102, second104 and third106 layers are tantalum, tantalum silicide and platinum, respectively, after annealing an innertantalum silicide layer108 is formed as a reaction product of theadhesion layer102 and thewafer30. The innertantalum silicide layer108 adheres well to thetantalum adhesion layer102 and to thewafer30, and therefore provides a high adhesion strength for themetallization layer88. In addition, because tantalum silicide generally blocks the outward diffusion of many materials (including silicon), the innertantalum silicide layer108 also acts as an outward diffusion-blocking layer for thesilicon wafer30. When thewafer30 is made of materials other than silicon, and tantalum is used as theadhesion layer102, various other diffusion-blocking tantalum compounds may be formed depending upon the material of thewafer30.
• As shown inFIG. 19, after annealing theupper platinum layer106 is converted to a layer ofplatinum silicide110 due to reactions between the platinum oflayer106 and the silicon of thewafer30 and/or the silicon of thetantalum silicide104. Theresultant platinum silicide110 acts as an inward diffusion-blocking layer, and in particular blocks the inward diffusion of oxygen and nitrogen. Theplatinum silicide layer110 may not be entirely platinum silicide, and may instead include a gradient of platinum and platinum silicide such that the upper surface of themetallization layer88 is at least about 90%, or at least about 99%, or at least about 99.99% platinum. It should also be noted that rather than using tantalum silicide as thesecond layer104 of themetallization layer88, tantalum nitride (i.e., having a thickness of about 500 angstroms or other thickness as desired) may be utilized as the second layer.
• When tantalum silicide is used as thesecond layer104 of themetallization layer88, the tantalum silicide effectively prevents oxygen from diffusing therethrough to form an oxide at the silicon/tantalum interface. However, at temperatures above about 700° C., silicon may diffuse upwardly through themetallization layer88 to form a silicon oxide layer on top of themetallization layer88, which makes subsequent bonding of wires thereto difficult.
• In contrast, when tantalum nitride is utilized as thesecond layer104, the tantalum nitride not only prevents oxygen from diffusing inwardly, but also prevents silicon from diffusing outwardly to protect the top surface of themetallization layer88. It is believed that the diffusion barrier effectiveness of tantalum base liners increases with higher nitrogen content, at least up to an N to Ta stoichiometry of 1:1. Thus, if desired, tantalum nitride can also be used as thesecond layer104.
• As noted above,FIG. 19 illustrates thepost-annealing metallization layer88 located directly on thedevice layer34 to form at least part of thereference contact60. However, as can be seen inFIG. 11metallization layers88 are also positioned on top of the piezoelectric film42 (i.e. to form theelectrodes44,46,contacts50,52, leads56,58 and part of the bond frame70). In this case themetallization film88 deposited on thepiezoelectric film42 inFIG. 11 can have the same structure and be deposited in the same manner as themetallization film88 ofFIG. 18 and described above. The post-annealing structure of themetallization film88 located on the piezoelectric film42 (shown inFIG. 20) may be the same as thepost-annealing metallization film88 shown inFIG. 19. Thus, themetallization layer88 providescontacts50,52,60,electrodes44,46, and leads56,58 and abond frame70 that are metallurgically stable at high temperatures and resist diffusion and chemical reactions.
Bonding Materials
• The application of the bonding material or bonding layer90 (referenced inFIG. 14 and the accompanying description) is now described in greater detail. As shown inFIG. 21, thebonding layer90 is located on themetallization layer88. Thebonding layer90 includes first120 and second122 bonding materials or layers that can form eutectics with each other. For example, thefirst bonding material120 can be gold, or any other element or material that can form a eutectic alloy with thesecond bonding material122. Thesecond bonding material122 may be germanium, tin, or silicon, or any element or material that can form a eutectic alloy with thefirst bonding material120. Representative examples of other materials of thebonding layer90 includes InCuAu, AuNi, TiCuNi, AgCu, AgCuZn, InCuAg, and AgCuSn.
• Both the first120 and second122 bonding materials may be deposited on the associatedmetallization layer88 by plasma sputtering or other suitable deposition techniques known to those skilled in the art. Further, the first120 and second122 bonding materials can be deposited in a variety of thicknesses. However, the thickness of thebonding materials120,122 should be selected to provide the desired ratio between the first120 and second122 bonding materials in the end product bond.
• In the illustrated embodiment thebonding layer90 includes acapping layer124 located on thesecond bonding material122. Thecapping layer124 caps and protects thesecond bonding material122 to prevent oxidation of thesecond bonding material122. Thecapping layer124 can be any of a wide variety of materials which resist oxidation, such as gold. In this case, thecapping layer124 can be the same material as thefirst bonding layer120 so that thecapping layer124 participates in the eutectic joining process. Thecapping layer124 may be quite thin, such as about 1000 Angstroms or less.
Sensor Die Attachment
• Once the sensor die12 as shown inFIG. 17 is provided, which sensor die12 includes themetallization layer88 andbonding layer90 located thereon, the sensor die12 is then desired to be coupled to thesubstrate14. As shown inFIG. 22, the sensor die12 is inverted from its position shown inFIG. 17 and aligned with thesubstrate14. Thesubstrate14 has themetallization layer88 andbonding material90 deposited thereon in generally the same manner as described above in the context of the sensor die12.
• However, because thesubstrate14 may be made of different materials than the sensor die12, some of the materials of themetallization layer88 on thesubstrate14 may differ from those described above in the context of the sensor die12. For example, when thesubstrate14 is aluminum nitride (as contrasted with the silicon of the sensor die12), thelayer108 of themetallization layer88 may be or include materials other than tantalum silicide, such as tantalum nitride, tantalum aluminide or ternary compounds of tantalum, aluminum, and nitrogen. In addition, the material of theadhesion layer102 of themetallization layer88 can vary depending upon the materials of thesubstrate14.
• For the description below, it will be assumed that thesecond bonding materials122 of thebonding materials90 are germanium, and that thefirst bonding materials120 and cappingmaterials124 are gold to allow discussion of the specific properties of the gold/germanium eutectic alloy. However, this discussion is for illustrative purposes and it should be understood that various other materials may be utilized as thefirst bonding materials120,second bonding materials122, and cappingmaterials124.
• Thesubstrate14 and sensor die12 are aligned as shown inFIG. 22 in preparation of bonding, and either or both components may include self alignment features to aid in the alignment process. The metallization layers88/bonding layers90 of thesubstrate14 have a pattern matching the pattern of the metallization layers88/bonding layers90 of the sensor die12 such that, once joined, those materials match up to form/complete theelectrical contacts50,52,60 and thebond frame70 joining those components together. The sensor die12 andsubstrate14 are pressed together such that theirbonding layers90 contact each other, as shown inFIGS. 23 and 24. The materials of the bonding layers90 should be sufficiently flat such that during the eutectic bonding process (described below) the liquids formed during the bonding process fully fill any voids or gaps between the bonding layers90.
• The sensor die12 andsubstrate14 are next joined or bonded in a transient liquid phase bonding process which is well known in the art, but is outlined briefly below. To commence the transient liquid phase bonding a light pressure (e.g. a few pounds) is applied to press the sensor die12 andsubstrate14, and theirbonding layers90 together (FIG. 24). The bonding layers90 are then exposed to a temperature at or above the eutectic point or eutectic temperature of the bonding alloy, i.e. a gold/germanium alloy. For example, as can be seen inFIG. 32, the eutectic temperature of a gold/germanium alloy is about 361° C.
• In the illustrative example the bonding layers90 are exposed to a temperature of about 450° C. However, the actual bonding temperatures will depend upon the diffusion rate of thebonding materials90, the thickness of thebonding materials90 and the time available to complete the diffusion such that a uniform solid solution of the bonding alloy is achieved.
• Once the materials at the gold/germanium interfaces reach the eutectic temperature (i.e., 361° C.), zones of melted orliquid materials132 are formed at each interface (seeFIG. 25) due to the melting of materials. InFIG. 25, the entire capping layers124 have melted (due to the thinness of those layers) to form thecentral liquid zone130, and portions of the second bonding layers122 and first bonding layers120 have melted to form the top and bottomliquid zones132. Each zone ofliquid material130,132 has a composition that is at or near the eutectic composition.
• As the bonding layers90 continue to heat up and approach the ambient temperature (i.e., 450°), theliquid zones130,132 continue to grow and expand until all the material of the germanium layers122 melt and dissolve into theliquid zones130,132. Thus, the separate liquid zones ofFIG. 25 grow and ultimately combine to form a single larger liquid zone134 (FIG. 26). At the stage shown inFIG. 26, the last of the material of the germanium layers122 have been dissolved, and the liquid zone remains at composition A ofFIG. 32.
• Next, the materials of the gold layers120 adjacent to theliquid zone134 continue to liquefy as the surrounding materials approach the ambient temperature. As additional gold is melted and added to theliquid zone134, the germanium in theliquid zone134 is diluted and the percentage of germanium in theliquid zone134 is thereby reduced. Thus, the composition of theliquid zone134 moves up and to the left of point A along the liquidus line138 ofFIG. 32. As the melted gold continues to dilute the germanium, the liquid composition ultimately reaches the composition at point B ofFIG. 32 when theliquid zone134 reaches the ambient temperature of 450° C.
• FIG. 27 illustrates the bonding process wherein theliquid zone134 has grown and added gold such that the liquid zone is at composition B. At this stage theliquid zone134 has reached the ambient temperature of 450° C., and has a composition of about twenty four atomic percent germanium and seventy six atomic percent gold.
• Once the composition of the liquid zone reaches point B, the germanium in theliquid zone134 begins diffusing into the remainingsolid gold layer120 at the interface of theliquid zone134 and the gold layers122. As this occurs, the concentration of germanium in theliquid zone134 adjacent to the interface drops. Once the percentage of germanium at the interface drops sufficiently low (i.e., about three atomic percent germanium or less), the liquid zone at the interface forms into a solid solution phase140 (seeFIG. 28). The newly-formedsolids140 have a composition indicated at point C on the graph ofFIG. 32. As can be seen inFIG. 32, the point C is located on the solidus line142, which indicates the percentage of germanium at which solids will form for a given temperature. Thus the newly-formed solids have about three atomic percent germanium and about ninety-seven atomic percent gold.
• The ambient temperature continues to be held at 450° C. and remaining germanium in theliquid zone134 continues to diffuse outwardly, through the newly-formedsolids140 and into the predominantlygold layers120. As the germanium in theliquid zone134 continues to diffuse outwardly, more germanium-poor liquids at the interface of theliquid zone134 and thesolids140 are created and ultimately form intosolids140. In this manner thesolids140 grow inwardly until theentire liquid zone134 is consumed (FIG. 29). At this point the solid140 may be relatively germanium-rich (i.e., about three atomic percent germanium) and the surroundinggold layers120 may be relatively germanium-poor (i.e. less than about three atomic percent germanium). In this case the germanium continues to diffuse, through solid-state diffusion, from the solid140 into the gold layers120 until equilibrium is reached and both the solid140 and the gold layers120 all have the same composition (shown as solid140 inFIG. 30).
• The solid140 formed after solid state diffusion is a gold/germanium alloy or solid solution alloy having a composition of about three atomic percent germanium. However, the amount of available germanium may be limited by restricting the thickness of thegermanium layer122 to a relatively low percentage relative to the available gold. The amount of available germanium can also be reduced by scavenging (with a germanium scavenging material such as platinum, nickel and chromium) so that the resultant solid140 has a composition of less than about three atomic percent germanium (e.g., as low as about 0.5 atomic percent germanium or even lower). In either case, when the amount of germanium is restricted/reduced, the composition of the solid140 is located to the left of point C ofFIG. 32. With reference to the phase diagram ofFIG. 32, reducing the atomic percentage of germanium to lower than three atomic percent provides a solution located on the solidus line142 above and to the left of point C. Moving the composition to the left of point C provides a solid solution with a melting point above 450° C., up to a theoretical maximum of 1064° C.
• The transient liquid phase bonding method described above allows the joining of the silicon sensor die12 and theceramic substrate14 at a relatively low temperature (but above the eutectic temperature) which avoids damaging any temperature-sensitive components, yet results in a bond having a relatively high melting temperature. Theresultant bonding material140 is a hypoeutectic gold-germanium solid alloy having a relatively high melting temperature. Thesolid bonding material140 can also be a hypoeutectic gold-silicon solid alloy or a hypoeutectic gold-tin solid alloy depending upon the starting materials for the bonding layers90. The bonding process can also be performed using a eutectic die bonder with heated stage and ultrasonic energy for acceleration of the fusion process.
• FIG. 31 illustrates part of the sensor die12 andsubstrate14 after the bonding layers90 have been joined to form a single bondedlayer140. Thus,FIG. 31 illustrates the circled area “23” indicated inFIG. 22, after bonding.
• As described above themetallization film88 includes the inwarddiffusion blocking layer110 which blocks inward diffusion of materials into or through themetallization film88 during the bonding process. Similarly, layers104 and/or102 and/or108 block outward diffusion of materials of the sensor die12 and/orsubstrate14 during bonding. Thus, themetallization layer88 resists diffusion therethrough, adheres well to various substrates, and is thermodynamically stable, even at elevated temperatures for extended periods of time. Working together, themetallization layer88 andbonding materials90 allow low temperature bonding with robust high temperature operation.
Substrate Attachment
• As briefly described above, thesubstrate14 is positioned inside and coupled to thering18, and that attachment process is now described in greater detail and shown inFIGS. 33-35. However, although the attachment of thesubstrate14 andring18 are now described (after the attachment of the sensor die12 andsubstrate14 was described above), during actual assembly the order of operations may be reversed. More particularly, during assembly thesubstrate14 may first be attached to thering18, and the sensor die12 then attached to thesubstrate14/ring18 assembly. This order of operations ensures that the more sensitive electrical components of the sensor die12 are not exposed to high temperatures when thesubstrate14 is brazed to thering18.
• Thesubstrate14 may be made of a material which can withstand relatively high temperatures, resists oxidation, and has a thermal coefficient of expansion that matches that of the sensor die12 relatively well. Thus thesubstrate14 can be made of a variety of ceramic materials, such as monolithic silicon nitride, aluminum oxide or aluminum nitride (hot-pressed and sintered (i.e. polycrystalline aluminum nitride)).
• Thering18 may be made of a material which can withstand relatively high temperatures, resists oxidation, and has a thermal coefficient of expansion that matches that of thesubstrate14 relatively well. Thus thering18 can be made of a variety of metal alloys such as THERMO-SPAN® metal alloy, sold by CRS Holdings, Inc. of Wilmington, Del., or other metals with similar environmental resistance and physical properties.
• When joining a ceramic material, such as thesubstrate14, to a metallic material, such as thering18, the joining technique should be carefully selected, especially when the joint will be exposed to elevated temperatures and a wide temperature range. Brazing may be utilized to join theceramic substrate14 to themetal ring18, in which case thesubstrate14 will first need to be treated with a material, such as a thin film metallization, to aid in the brazing process.
• Themetallization layer88 described above and shown inFIGS. 18-20 may also be used in brazing thesubstrate12 to thering18. For example,FIG. 33 illustrates thepost-annealing metallization layer88, includingsublayers102,104,108,110 located on the end surface of thesubstrate14. As shown inFIG. 33, themetallization layer88 of thesubstrate14 is located on its circumferentialouter surface146. In this case, only thesubstrate14 has themetallization layer88 deposited thereon, and thering18 does not require any metallization due to its inherent metallic structure. However, in order to improve the brazing process and/or improve corrosion resistance, a thin layer of nickel (i.e. 10 microns) may be deposited on the brazing (inner) surface ofring18.
• In order to deposit the metallization88 (i.e., the first102, second104 and third106 layers ofFIG. 18) onto the circumferentialouter surface146, a cylindrical magnetron plasma sputter deposition system may be utilized. In such a sputter system, thesubstrate14 is placed on a rotating fixture inside the sputter chamber of the cylindrical magnetron. The cylindrical magnetron progressively deposits thefirst layer102, thesecond layer104 and thethird layer108 onto theouter surface146 of the substrate in a direction normal to theouter surface146. In this manner the cylindrical magnetron provides a sputtering flux that is normal to the curved surface (i.e. the direction of flow of the metal atoms during deposition is normal to theouter surface146 in a radially inward direction). It should be noted that cylindrical sputtering may be easier and more effective, but special fixtures and tools may be used in a conventional deposition system to obtain the same results and thus systems other than cylindrical sputtering may be used.
• The first102, second104 and third106 layers may be made of the materials described above and deposited in the manner described above in the context ofFIGS. 18-20. However, in one embodiment thepre-annealing metallization layer88 on theouter surface146 includes atantalum layer102 having a thickness of about 500 Angstroms; a silicon-richtantalum silicide layer104 having a thickness of about 5000 Angstroms; and aplatinum layer106 having a thickness of about 3000 Angstroms. After deposition, thelayers102,104,106 are annealed to provide thelayers108,102,104,110 shown inFIGS. 19 and 33. However, if desired the annealing step may be omitted as the subsequent brazing process described below may drive the same reactions.
• FIG. 33 illustrates thesubstrate14 spaced away from thering18, andFIG. 34 illustrates thesubstrate14 loosely fit into thering18. In order to carry out the braze process, a ductile braze material, braze slurry, braze alloy or brazepaste150 is deposited near or around the outer circumference of thesubstrate14 and in intimate contact with thering18 and themetallization layer88. Thus thebraze material150 is applied to the outer diameter of thesubstrate14 and/or the inner diameter of thering18. The particular type of braze material, braze slurry, braze alloy or brazepaste150 depends upon the type of materials of thesubstrate14 andring18 but can be any hightemperature braze material150 that can withstand high temperatures and corrosive environments, such as a gold/nickel braze material.
• Thebraze material150 may be deposited at room temperature and then exposed to an elevated temperature (e.g. about 980° C. for a gold/nickel braze) suitable to melt thebraze material150. The meltedbraze material150 is drawn into the gap between thesubstrate14 and thering18 by capillary action (shown inFIG. 35). If desired, the outer edges of thesubstrate14 may be chamfered (not shown) to provide an exposed area of themetallization88 and to “funnel” thebraze material150 into the gap between thesubstrate14 and thering18. The temperature is then reduced such that thebraze material150 cools and forms a strong bond in the well-known manner of standard brazing.FIG. 35 illustrates the sensor die12 positioned above the completed brazedring18/substrate12 assembly for subsequent joining in the process described above and shown inFIGS. 22-31.
• Thesubstrate14 and thering18 may be sized to form a mechanically robust joint. In particular, upon heating (i.e. during the brazing process), thering18 may expand to relatively loosely receive thesubstrate14 therein (shown inFIGS. 33 and 34). Because thering18 is metal, thering18 has a relatively large coefficient of thermal expansion relative to thesubstrate14. Upon cooling, themetal ring18 contracts around thesubstrate14, thereby placing thesubstrate14 in a state of radial compression which provides a more robust structure.
Pin Mounting
• As described above, the sensor die12 includes a plurality of contacts (threecontacts50,52 and60 in the embodiment shown inFIG. 3). Pins22 (only one of which is shown inFIG. 1) are electrically coupled to each of thecontacts50,52 or60 to provide an output of the sensor die12 to an external controller, processor, amplifier or the like. Thepins22 can be made of any of a variety of materials, such as an oxidation resistant metal which forms a tenacious oxide film and resists exfoliation due to expansion of the oxide. For example thepins22 can be made of nickel, stainless steel, HASTELLOY® alloys sold by Haynes International, Inc. of Kokomo, Ind., or KOVAR® alloy sold by CRS Holdings, Inc. of Wilmington, Del., depending upon the desired properties such as electrical conductivity, thermal expansion coefficient, or the like. Thepins22 may also take the form of a tube or other metallic component.
• Thepins22 must be properly located in thesubstrate14 so that thepins22 align with the associatedcontacts50,52,60 on the sensor die12. The mounting process described below may be utilized to precisely mount thepins22 into thesubstrate14, and in a manner such that thepins22 and associated attachment structures can withstand harsh environments.
• FIGS. 36-38 below, which describe a process for mounting thepins22, illustrate only asingle pin22, but it should be understood that any desired number ofpins22 can be mounted in this manner.FIG. 36 illustrates thesubstrate14 having a pair ofopposed surfaces154,156, with anopening158 extending from the first154 to the second156 surface and defining anattachment surface160. Thesubstrate14 can have a variety of thicknesses, such as between about 0.60 and about 0.006 inches, and has a thickness of about 0.060 inches in one embodiment.
• As shown inFIG. 37(a)-(e), in one embodiment, theopening158 takes the form of a stepped bore opening (FIG. 37(a)). The stepped bore opening158 can be formed by ultrasonic drilling or by other acceptable methods. In order to braze thepin22 to thesubstrate14, anactive metal braze162 is deposited on thesubstrate14 adjacent to or into the opening158 (FIG. 37(b)). Theactive braze162 is then reflowed, in a vacuum, such that theactive braze162 flows downwardly in its liquid state, coats theside walls160 of theopening158 and fills the smaller diameter. As theactive braze162 flows downwardly, it chemically reacts with thesubstrate14 to allow subsequent wetting of thesubstrate14. Thus theactive metal braze162 coats theside walls160, preparing the substrate for subsequent brazing with conventional braze alloys that are the same as or similar to thebraze alloys 150 described above.
• As shown inFIG. 37(c) theactive metal braze162 fills and plugs the smaller diameter portion of theopening158. The plug formed by the activemetal braze material162 provides a continuous metal onside156 of thesubstrate14 such that after grinding, lapping or other finishing methods a flat and uninterrupted metal contact, that is coplanar with thesubstrate14, is provided. Accordingly, the smaller diameter of the steppedopening158 and the materials and quantity ofactive metal braze162 should be selected such that theactive metal braze162 can plug the smaller diameter portion of theopening158.
• Next, as shown inFIG. 37(d), thepin22 is inserted into the larger diameter portion of theopening158 until thepin22 bottoms out on theactive braze material162. Asecond braze material164 is then introduced into the remaining volume of the larger diameter portion of theopening158 such that thesecond braze material164 surrounds thepin22 and secures/brazes thepin22 to theactive metal braze162/substrate14. As shown inFIG. 37(e), the opposed surface of thesubstrate14 is then planarized, such as by grinding and polishing, to sufficient flatness for the subsequent bonding step of the sensor die12. In one embodiment, thesubstrate assembly14 and associated metallizations are planarized to within 1 micron, or more particularly, 0.5 microns. The planarization ensures that themetallization film88 andbonding film90 can be located thereon, and thesubstrate14 can be attached to the sensor die12. Thus, the multiple braze, or “step-braze” process shown inFIGS. 37(a)-37(e) can be utilized to join thepin22 andsubstrate14 wherein theactive braze162 acts as a premetallization and thesecond braze material164 creates the joint.
• Thebrazing materials162,164 can be any of a variety of braze metals which can be utilized to braze thepin22 to thesubstrate14 of interest. In one embodiment, theactive metal braze162 may be a titanium activated braze, such as titanium/copper, titanium/nickel, titanium/gold, titanium/nickel/gold, and the like. Thesecond braze material164 can be any standard braze, or high temperature braze material, such as gold/nickel, or copper/nickel with a eutectic ratio of copper/nickel, which can withstand relatively high temperatures (i.e., up to 600-700° C.) and provide corrosion resistance.
• As shown inFIG. 37(f), after thepin22 is brazed in place and the surface is planarized themetallization film88 andbonding material90 are deposited on thesubstrate14 such that the depositedmetallization film88/bonding materials90 are generally aligned with, or electrically coupled to, theactive braze material162. Thus the depositedmetallization film88/bonding materials90 are electrically coupled to thepin22 through thebraze materials162,164. Thebonding material90 of the substrate is then bonded to the sensor die12 (FIG. 37(g)), as described above and shown inFIGS. 22-31, to complete electrical contact between the conductor pin(s)22 and thecontacts50,52,60. Thus themetallization film88/bonding materials90 not only mechanically couple the sensor die12 andsubstrate14, but also electrically couple the sensor die12 andpin22.
• FIGS. 38(a)-(f) illustrates an alternative method for brazing thepin22 to thesubstrate14. More particularly, in this embodiment the substrate includes a non-stepped bore opening, such as a straight-walled opening158 (FIG. 38(a)) or a slightly tapered opening158 (FIG. 38(b)). Theopening158 ofFIG. 38(a) or (b) may be drilled ultrasonically, by a waterjet, laser, electronic discharge ablation, or otherwise, and may have a diameter accommodating (i.e. slightly larger than) the diameter of thepin22. For example, thepin22/opening158 may have an opening of around 0.020 inches, or around 0.030 inches, or larger. The use of a waterjet may be less expensive, but may result in an opening having a slight taper as shown inFIG. 38(b). However, so long as the taper is slight (i.e. less than a few thousands of an inch throughout the thickness of thesubstrate12 having a thickness of about 0.060 inches, or up to 0.125 inches, or greater) the taper has no adverse effects.
• Theopening158 ofFIGS. 38(a) and38(b) can each be formed by a single step, in contrast with the stepped opening158 ofFIG. 37(a) which must be formed in two steps, and which requires greater precision. In addition, forming a stepped bore requires the use of ultrasonic drilling or the like, which is more expensive than waterjet drilling which can be used in the opening(s) ofFIG. 38.
• Once theopening158 of eitherFIG. 38(a) or38(b) is formed, theactive metal braze162 is applied and reflowed in largely the same manner as described above, as shown inFIGS. 38(c) and38(d). If theopening158 has a taper (FIG. 38(b)), theactive metal braze162 can be applied to the larger diameter end of the opening158 (i.e., the upper end inFIG. 38(b)) such that as theactive braze162 flows downwardly, it thins out to ensure even coating on theside walls160.
• Once theactive braze162 is deposited (FIG. 38(c)) and reflowed (FIG. 38(d)), thepin22 is then inserted into theopening158 and thesecond braze164 applied (FIG. 38(e)). As shown inFIG. 38(e), if desired thepin22 may extend completely through thesubstrate14 to ensure it is inserted to a sufficient depth. Next, one or theother side154,156 of the substrate can be planarized (i.e., by grinding and polishing (FIG. 38(f)). Themetallization film88 andbonding materials90 may then be deposited and the bonding process can be carried out as described above.
• As a third alternative, as shown inFIG. 38(g) a solid metal plug, formed of thebraze materials162/164 may be formed in thehole158. In this case thepin22 may be butt-welded to the plug or attached by various other means. This simple metal filling method may also be utilized where wirebonds or other electrical connections, instead of thepin22, are desired.
• As a fourth alternative, thehole158 may be filled with a conductive cofired metallization in a manner well known in the industry, which results in an appearance similar toFIG. 38(g). Thepin22 may be attached to the cofired metallization with a braze or other well known methods.
Assembly
• In order to assemble the structure shown inFIGS. 1 and 6, in one embodiment thesubstrate14 is provided and theopenings158 are formed in the substrate. The pre-metallization layer162 (described immediately above and shown inFIGS. 37 and 38) is then deposited on or adjacent to theopenings158, and themetallization88 andbonding layers90 are deposited on circumferential surfaces of the substrate14 (described in the section entitled “Substrate Attachment” and shown inFIG. 33). Thesubstrate14 is then brazed to the ring18 (described in the section entitled “Substrate Attachment” and shown inFIGS. 34 and 35). Thepins22 are brazed to thesubstrate14 bybraze material158, as shown inFIGS. 37 and 38 either before, after or, at the same time that thesubstrate14 is brazed to thering18.
• The sensor die12 (formed in the section entitled “Sensor Die Manufacturing” and shown inFIG. 17) is then attached to thesubstrate14, as in the section entitled “Sensor Die Attachment” and shown inFIG. 35. After the sensor die12 andsubstrate14 are coupled, electrical connections are then completed to thepins22 and the resultant assembly is then packaged in thebase20 and ring18 (FIGS. 1 and 6).
• In the embodiment ofFIG. 1, thebase20 includes abacking portion170 which is located below a substantial portion of thesubstrate14 to provide support thereto, and ensures that thesubstrate14 can withstand relatively high pressures. If desired, thespace171 between the backingportion170 and thepin22 may be filled with a high temperature potting compound. If further desired, thebacking portion170 may be entirely replaced with a high temperature potting compound that substantially fills the space in themetal ring18 and abuts thelower surface156 of thesubstrate14. In contrast, in the embodiment ofFIG. 6, thebase20 does not include the backing support portion since thesubstrate14 is significantly smaller, and therefore presents less surface area. In addition, in the embodiment ofFIG. 6 themetal ring18 includes a relativelywide foot172 to allow the ring18 (and substrate14) to be securely coupled to thebase20.
• In either case, the portions of the ring18 (radially) surrounding thesubstrate14 may have a relatively small thickness, such that thering18 has some compliance and can flex during temperature fluctuations to accommodate any mismatch of the thermal coefficient of expansion between thesubstrate14 andring18. The flexion of thering18 may also provide additional compliance to tolerate thermal expansion and contraction of thebase20. The thickness of the portion of thering18 receiving thesubstrate14 is determined by the residual stress on thesubstrate14 and the amount of stress isolation required between thesubstrate14 and thebase20, but in one embodiment is about 0.010 inches thick.
• Thering18 should have a relatively low coefficient of thermal expansion to match, as closely as possible, the coefficient of thermal expansion of thesubstrate14. For example, thering18, and other materials of the packaging, having a coefficient of thermal expansion in a given direction that is within about 50%, or about 100%, or about 150% of a coefficient of thermal expansion of thesubstrate14 and/or sensor die12 in the same direction. The materials and shape of thering18 are determined based upon the following factors, including but not limited to: relative thermal environment during operation, start-up and cool-down; thermal coefficients of expansion of thebase20 andsubstrate14; vibration limits; and the expected maximum and operational pressures and pressure fluctuations. Thering18 isolates the sensor die12 andsubstrate14 from the base20 in a cantilever manner such that any stresses applied to or caused by thebase20 are generally not transmitted to thesubstrate14.
• In one embodiment, thebase20 andring18 may each be made of THERMO-SPAN® metal alloy, sold by CRS Holdings, Inc. of Wilmington, Del., which is a controlled expansion alloy which also shows good corrosion resistance. However, if desired thebase20 and/orring18 may be made of stainless steel, INVAR® alloy, a trademark of Imphy S.A. of Paris, France, KOVAR® alloy, NI-SPAN-C® alloy, a trademark of Huntington Alloys Corporation of Huntington, W. Va., or other material with relatively low coefficients of thermal expansion and corrosion resistance suitable to the environment in which this system will operate. Thering18 is welded to the base20 (i.e., atweldments176 shown inFIGS. 1 and 6). Care should be taken during the welding to be sure not to compromise the corrosion resistance of the packaging. In addition, rather than welding the components of the base20 may be coupled by threaded or bolted attachments, and thering18 can be coupled tobase20 by a threaded or bolted attachment.
External Connection
• In order to communicate the electrical signals to an external controller, processor, amplifier or the like, a wire24 (one of which is shown inFIGS. 1 and 6) is coupled to each of thepins22 at a coupling location. Eachwire24 can be made of a variety of materials, such as NiCr or platinum with an electrically insulating sheathing. A tip of eachwire24 may be wrapped around the lower end of the associatedpin22, and coupled thereto by a braze attachment. The opposite end of thewire24 passes through a thermoconductive and electrically insulatedmaterial180, such as a chopped filler material (i.e., NEXTEL® thermal barrier made by 3M of St. Paul, Minn. or other refractory material) allowing flexibility in thewire assembly190.
• In another embodiment, the thermoconductive and electrically insulatingmaterial180 is a high temperature ceramic or glass potting compound.
• A metal (such as nickel or stainless steel)conduit182 inFIG. 1 is located around the electrically and/or thermally insulatingmaterial180 to provide EMI shielding to the wire(s)24 located therein. Themetal conduit182 is coupled to alower port184 of the base20 by abraze material186. Eachwire24 may pass through asingle conduit182, or alternately, eachwire24 may pass through its owndedicated conduit182. Eachwire24 may be coated with an electrically insulating material and held in place by the insulatingmaterial180. Eachconduit182 may take the form of a rigid conduit, or could take the form of a flexible material such as braided metal wires or the like. When theconduit182 is a flexible material thebraze material186 may not be utilized, and some other acceptable attachment means would instead be used.
• The assembly shown inFIGS. 39 and 40 illustrates an assembly for electrically connecting thepins22 to thewires24. As shown inFIG. 39, a number of wires24 (i.e., three in the illustrated embodiment) are contained within ametal conduit190. Eachwire24 is individually covered in a thermally and electrically insulating sheathing, with the end of eachwire24 being exposed for electrical connection to the associatedpin22. Anouter sheath192 is slidably located on theconduit190 and flares outwardly from alower end194 which is swaged about theconduit190, to a relativewide mouth196 which is shaped to mate with the underside of thebase20.
• In order to complete the electrical connections, the exposed portion of eachwire24 is brazed to the associated pin22 (only one of which is shown inFIG. 39). Thesheath192 is then slid upwardly along theconduit20 until it mates with thebase20, and is then secured to the base, such as by welding198 (FIG. 40). Thesheath192 is secured, at its opposite end, to theconduit190 by abraze200 or the like. The space inside thesheath192 may be purged with an inert gas, just before sealing, to minimize oxidation.
• Thus, the assembly method ofFIGS. 39 and 40 provides hermetically sealed electrical connection between thepins22 andwires24 with high temperature capability. The assembly also provides a relatively compact packing which allows considerable size reduction in the overall size of the sensor package. The opposite end of thewires24/conduit190 may have asecond sheath192 mounted thereon (not shown) to provide protection to the output electrical connections thereof (i.e. connections to a processor or the like).
• If desired, the attachment method shown inFIGS. 39 and 40 can be applied to an electronics module as well. For example, as shown inFIG. 41, anelectronics assembly202 can be encapsulated in ametal shell204, with asheath196 located at either end thereof. This arrangement permits the electrical connection of two assemblies in a hermetically enclosed metal sheath assembly.
Field of Use
• As described above, thesensor10 and packaging may be used to form a microphone for detecting high frequency pressure fluctuations. However, it should be understood that the packaging structure disclosed herein can be used with or as part of any high temperature sensor (dynamic or otherwise) including, but not limited to, acceleration, temperature, radiation or chemical sensors. For example, thesensor10 and packaging may be used to form a chemical detector to detect an analyte present in an environment using either or both electro-chemical sensing or vibration sensing. Such a vibration sensor can, in turn, be used as a component which measures a change in resonance in a variety of manners to detect the presence of ice, contaminants, chemicals, deposition of materials, microorganisms, density of fluids, etc.
• The transducer and packaging may also be used with or as part of a variety of other types of sensors, such as sensors utilizing piezoresistive or capacitive sensing elements, temperature sensing elements, or the like. The structure shown herein may also be used as a passive structure which can be used, for example, to measure mechanical inputs (i.e., acceleration or vibration) or for use in energy harvesting (i.e., converting vibrations to electrical charge to charge a battery or the like). The thermal protection and isolations features of the actuator packaging described herein lends itself to use in a wide variety of applications and environments, and can be used with a variety of transducers.
Piezoresistive TransducerFIRST EMBODIMENT
• The present invention may also take the form of various piezoresistive transducers, embodiments of which are described in greater detail below. As best shown inFIG. 42, in a first embodiment the piezoresistive transducer of the present invention is in the form of a pressure sensor, generally designated210. Thesensor210 includes a wafer stack or sensor die212 (also termed a substrate herein) which includes abase wafer214, a cap or cappingwafer216 and adevice wafer218 positioned between thebase wafer214 and cappingwafer216. Thewafer stack212 is coupled to a pedestal, header plate, base orheader219, and a frame, cover, package base, pressure case, fitting, or220 is coupled to theheader plate219 such that theframe220 andheader plate219 generally encapsulate thewafer stack212 therein. The lower portion of theframe220 is often termed a pressure case, and the upper portion of theframe220 is often termed a vacuum case.
• Theheader plate219 includes apressure port222 formed therein with aconduit224 coupled to thepressure port222. Thepressure port222 andconduit224 allows the fluid of interest to exert pressure on a diaphragm226 (on a first surface of the wafer stack212) of thedevice wafer218. The cappingwafer216 seals the opposite side of the diaphragm226 (on a second, opposite surface of the wafer stack212) to provide a reference pressure (or a vacuum) on the opposite surface of thediaphragm226. A differential pressure across thediaphragm226 causes thediaphragm226 to deflect, which deflection is detected by asensing component230 located thereon. The output of thesensing component230 is communicated to an external processor, controller, amplifier or the like via a set ofoutput contacts232 which are electrically coupled to a set ofpins234. Thepins234 extend through theheader plate219 to thereby communicate the output signals of thesensing component230 to the processor, controller, amplifier, or the like.
• As shown inFIG. 43, thesensing component230 may include a set ofresistors240 connected together in a Wheatstone bridge configuration. Theresistors240 are coupled to each other, and to the set ofoutput contacts232, by a set of leads242. Theresistors240 are positioned on thediaphragm226 such that tworesistors240 primarily experience mechanical tension when thediaphragm226 is deflected in a given direction, and the other tworesistors240 primarily experience mechanical compression when thediaphragm226 is deflected in the given direction. Thus, the two pairs of resistors exhibit resistance changes opposite to each other in response to a deflection of thediaphragm226. The resistance change is then amplified in the well-known manner of a Wheatstone bridge. The two pairs of resistors may exhibit opposite resistance changes due to their positioning on thediaphragm226, or due to their orientation of directional dependent resistance characteristics thereof.
• Theresistors240 may be made of doped silicon, such as p-doped or n-doped single crystal silicon. When theresistors240 are made of p-doped silicon, the configuration shown inFIGS. 43 and 44 may be utilized. When theresistors240 are formed of n-doped silicon, the configuration shown inFIG. 45 may be utilized, wherein theresistors240 are rotated about 45 degrees from their positions inFIG. 44 due to differing directional sensitivity of n-doped silicon as compared to p-doped silicon. Because theresistors240 ofFIG. 45 are rotated 45 degrees, theresistors240 ofFIG. 45 may be more difficult to form when using photolithography. In addition, p-type resistors are typically less temperature dependent than n-type resistors and therefore p-type resistors may be desired to be utilized. If desired, theoutput contacts232 and leads242, or parts thereof, may be formed of the same material as the resistors240 (i.e., doped silicon).
• Atemperature sensor231, such as a temperature-sensitive resistor, may be located on thedevice wafer218, with a pair ofoutput contacts232 coupled via leads to opposite sides of thetemperature sensor231. Thetemperature sensor231 allows the controller, processor amplifier to use temperature-compensating techniques when analyzing the output of thesensing component230.
• One process for forming thewafer stack212 ofFIG. 42 is shown inFIGS. 46-56 and described below, although it should be understood that different steps may be used in the process, or an entirely different process may be used without departing from the scope of the invention. Thus, the manufacturing steps illustrated here are only one manner in which thewafer stack212 may be manufactured, and the order and details of each step described herein may vary, or other steps may be used or substituted with other steps that are well known in the art. A batch manufacturing process may be utilized, but for clarity of illustration,FIGS. 46-56 illustrate only asingle wafer stack212 being formed.
• It should also be noted that although, in general, the shading of the various layers of the drawings is maintained in a generally consistent manner throughout the drawings ofFIGS. 46-56 and elsewhere, due to the large number of components and materials the shading for a material or layer may differ between the various figures. In addition,FIGS. 46-56 represent a schematic cross-section of a wafer during manufacturing, and the location of certain components may not necessarily correspond to a true cross section.
• As shown inFIG. 46, the process begins with a semiconductor-on-insulator wafer244 such as a double sided polished three inch or four inch diameter (or larger) semiconductor-on-insulator or silicon-on-insulator wafer. TheSOI wafer244 includes a base orbulk layer246 and adevice layer248, with an electrically insulatinglayer250 positioned therebetween. In one embodiment, thedevice layer248 is single crystal silicon having a thickness of about 0.34 microns, although thedevice layer248 may have a variety of thicknesses, such as between about 0.05 microns and about 1 microns, or less than about 1 micron, or less than about 1.5 microns, or, or less than about 0.5 microns, or greater than about 0.05 microns. Because the thickness of thedevice layer248 will ultimately determine the thickness of theresistors240, the thickness of thedevice layer248 should be carefully selected (although the thickness of thedevice layer248 could be reduced during later processing steps, if desired).
• Thedevice layer248 may have a (100) crystal orientation. If desired, thedevice layer248 can be made of other materials that are piezoresistive or can be made piezoresistive, such as polysilicon or silicon carbide. When thedevice layer248 is made of single crystal semiconductor materials (i.e., silicon), as opposed to polysilicon, defects in thedevice layer248 caused by grain growth and doping segregation in the grain boundaries are avoided.
• When thedevice layer248 is sufficiently thin (i.e., less than about 0.5 microns, or less than about 1.5 microns, or less than about 5 microns), specific techniques for forming the device layer may be utilized. For example, the thin device layer may be formed from a thicker, starting wafer (not shown) by bombarding the face of the thicker wafer with ions to define a sub-layer of gaseous microbubbles. The thicker wafer is then separated along the line of microbubbles to provide thethin device layer248, which is then deposited on the insulatinglayer250 to form theSOI wafer244. Such a process is outlined in U.S. Pat. No. 5,374,564 to Bruel, the entire contents of which are hereby incorporated herein. Such a process is also provided under the trademark SMART CUTS provided by S.O.I. TEC Silicon On Insulator Technologies S.A. of Bernin, France. Thus thedevice layer248 may be formed or provided by hydrogen ion delamination of the thicker wafer. This method of forming thewafer244 provides adevice layer248 having a uniform thickness, which increases product yield. This method of forming the wafer also provides excellent doping uniformity and allows the use of silicon which has improved high temperature thermal stability as compared to, for example, polysilicon.
• Thebase layer246 can be made of a variety of materials, such as silicon or the other materials listed above for thedevice layer248. Thebase layer246 can have a variety of thicknesses such as between about 100 microns and about 1,000 microns, and more particularly, about 500 microns. Thebase layer246 should be of sufficient thickness to provide structural support to thewafer244. In one embodiment, thebase layer246 is single crystal silicon having a (100) crystal orientation to allow easy etching thereof.
• The insulatinglayer250 can be of any variety of materials, and is typically silicon dioxide. The insulatinglayer250 primarily acts as an etch stop and also provides electrical isolation to thewafer244. The insulatinglayer250 also enables thesensor210 to function at very high temperatures without leakage effects associated with the p-n junction type devices (i.e. due to current passing through the base layer246). The insulatinglayer250 may have a variety of thicknesses, such as between about 0.5 microns and about 1.5 microns, and is typically about 1 micron thick.
• After thewafer244 is provided, athermal oxide252, such as a 200 Angstroms thick thermal oxide layer, is deposited or grown on top of thedevice layer248 and on the bottom of the wafer244 (FIG. 47) to aid in subsequent doping. Thedevice layer248 is then doped (schematically shown by arrows inFIG. 47) by either p-doping or n-doping, although p-doping may provide certain benefits as outlined above. Thedevice layer248 may be doped to its highest level of solubility, and the doping may be carried out by a variety of methods, such as by high-dose ion implantation or boron diffusion. In one embodiment thedevice layer248 may have a post-doping resistance of between about 14 and about 30 ohm-cm.
• Thewafer244 is then annealed to complete the doping process. In one embodiment, thewafer244 is annealed at a temperature of about 1050° C. in an atmosphere of N₂for about 15 minutes. Next, as shown inFIG. 48, the thermal oxide layers252 are removed and amask material254, such as silicon nitride, is deposited on both sides of thewafer244 by low pressure chemical vapor deposition (“LPCVD”) or other suitable deposition process. Thesilicon nitride254 can have a variety of thicknesses, and in one embodiment is about 1500 Angstroms thick. The upper layer ofsilicon nitride254 is then patterned (or deposited in a patterned shape) in the desired shape of theresistors240,output contacts232, and leads242 as schematically shown inFIG. 49. The exposed portions of thedevice layer248 are then removed. The upper layer ofsilicon nitride254 is then removed to expose the remaining portions of thedevice layer248 as shown inFIG. 50.
• As shown inFIG. 51, asilicon dioxide258 is then coated on top of thewafer244, such as by PECVD. Portions of thesilicon dioxide258 are then removed (FIG. 52) to expose part of theoutput contacts232 lying below such thatoutput contacts232 can be completed. Portions of thesilicon dioxide258 and the insulatinglayer250 are also removed at the area indicated231 to expose thebase layer246 to provide a location for a substrate contact260 (seeFIGS. 42 and 53). Thesubstrate contact260 provides an electrical contact to thebase layer246 to avoid voltage build-ups on thewafer244/sensor die212, thereby reducing noise.
• A metallization layer is then deposited in the openings of thesilicon dioxide258 to form/complete thesubstrate contact260 andoutput contacts232. The metallization layer may be thesame metallization layer88 described above in the section entitled “Metallization Layer.” Thus in one embodiment themetallization layer88, as deposited, includes a lower layer of tantalum, with a layer of tantalum nitride located on the tantalum layer, and a top layer of platinum located on the tantalum nitride layer. Themetallization layer88 may be patterned by a lift-off resist (“LOR”) or by a shadow masking sputter technique.
• Themetallization layer88 provides a surface which can withstand elevated temperatures and can still be welded to after such exposure to elevated temperatures. For example, themetallization layer88 may be exposed to elevated temperatures when thebase wafer214,device wafer218 and cappingwafer216 are coupled together, and when thewafer stack212 is coupled to theheader plate219. However, the make-up of themetallization layer88 allows it to remain sufficiently conductive, retain its adhesive strength, and remain metallugically stable after exposure to such temperatures, and when exposed to elevated temperatures during operation of thesensor210.
• Next, as shown inFIG. 54, thethermal oxide252 on the bottom of thewafer244 is patterned to expose a portion of thebase layer246 located below theresistors240. The exposed portion of thebase layer246 is then etched to define thediaphragm226 and acavity262 located below the diaphragm (FIG. 55). This etching step can be carried out by DRIE, a KOH etch, or any of a variety of other etching methods. The bottom layerthermal oxide252 is then removed.
• Thediaphragm226 can have a variety of shapes, such as circular or square in top view, and in one embodiment has a surface area of between about 0.25 mm²and about 9 mm². Thediaphragm226 may be etched to a thickness of between about 1 micron and about 200 microns, or less than about 200 microns, or greater than about 1 micron, or greater than about 8 microns, or greater than about 30 microns, or less than about 150 microns.
• As shown inFIG. 55A, in an alternate embodiment thewafer244 includes an additionalburied oxide layer264. The buriedoxide layer264 may be utilized as an etch stop during the etching of thebase layer246 to form thediaphragm226. In this manner, the buriedoxide layer264 helps to ensure aconsistent diaphragm226 thickness. Although not shown inFIG. 55A, if desired the exposed portions of theoxide layer264 may be removed to reduce thermal stresses imposed on thediaphragm226 by theoxide layer264.
• After thedevice wafer218 is formed, thebase wafer214 is then provided (FIG. 56). Thebase wafer214 may be a 800 micron-thick silicon wafer that is KOH etched to form a through-hole265. The cappingwafer216 is also provided, and may be a silicon wafer that is KOH or DRIE etched to form acavity266. Thewafer stack212 is then formed by coupling thebase wafer214,device wafer218 and cappingwafer216 together. Thewafers214,216,218 are aligned and are coupled together using a glass frit attachment layer221 (FIG. 56) or other acceptable joining methods. Glass frit attachment provides a well tested and predictable attachment method. Plasma enhanced fusion bonding may also be utilized to bond thewafer stack212. Plasma enhanced fusion bonding allows thewafer stack212 to be formed at a temperature as low as 300° C., which can reduces damage to the electronics/piezoresistive materials.
• Once thewafer stack212 is formed, thestack212 is coupled to theheader plate219, such as by an InCuAg brazing material270 (seeFIG. 42) formed at a bonding temperature of about 750° C. Rather than using the InCuAg brazing material, other high temperature braze materials may be utilized, such as other eutectic bonding materials (i.e. a gold/germanium eutectic), or a conductive glass transfer tape having a firing temperature of 440° C. or higher, nonconductive glass frit with a firing temperature of 600° C. or higher, or an InCuAg alloy based brazing preform with a eutectic liquid temperature of 705° C. or higher. A L10102 glass frit with a curing temperature of between 600° C. and 650° C. may also be used. The material attaching thestack212 to the pedestal may be able to withstand more than 800 psig at 500° C.
• The glass transfer tape used asattachment material270 may be of a standard sandwich-type construction including a bottom polyethylene carrier strip, a glass layer located on tope of the carrier, an organic adhesive layer on top of the glass layer, and a top layer of release paper. Thus thebond270 may be formed at a curing temperature between about 600° C. and about 650° C., and has stable mechanical properties at about 400° C., or about 500° C. or at about 550° C.
• As noted above, themetallization layer88 has good adhesion to silicon and stable electrical properties at temperatures up to 600° C. and is able to withstand temperatures at least up to 725° or 750° C. Thus themetallization layer88 should be able to survive the attachment of thewafers214,216,218 together, as well as the attachment of thewafer stack212 to theheader plate219.
• However, in some cases, thewafer stack212 may be formed by joining thebase wafer214 anddevice wafer218 and/ordevice wafer218 and cappingwafer216, by relatively high temperature bonding processes. In this case, the bonding temperatures may be sufficiently high that themetallization layer88 or other sensitive components on thewafer stack212 cannot withstand the high temperature. In this case, themetallization layer88 may be deposited after thewafer stack212 is partially or completely formed (i.e., after thebase wafer214 anddevice wafer218, and/ordevice wafer218 and cappingwafers216 have been joined).
• As noted above and shown inFIG. 42, thesensor210 includes a plurality ofpins234, with eachpin234 being coupled to anoutput contact232 by awire272 to communicate the output of thesensor210. Thewires272 may be made of platinum and have a diameter of between about 25 and about 75 microns. Eachwire272 may be spot welded or wedge bonded (i.e. both considered “wire bonding” for the purposes of this application) to the platinum pins234 at one end, or to an associatedoutput contact232 at the other end thereof. Wedge bonding is a well known process and comprises pressing thewire272 onto the surface to be welded and applying ultrasonic energy to complete the bond.
• Thepins234 can be made of a variety of materials, such as platinum coated KOVAR® alloy or solid platinum. When thepins234 are solid platinum, instead of platinum plated, any diffusion of nickel, which can compromise the joint between thewire272 andpin234, is eliminated. In addition, when thewires272 are platinum, instead of the traditional gold material, platinum-to-platinum wire bonds can be utilized (since the top surface of themetallization88 may be primarily platinum due to a gradient of platinum silicide in the top layer110). If thewires272 were to be made of gold, the gold may migrate and form a gold-silicon eutectic which causes thewires272/output contacts232 to become brittle and fail at high temperatures. Thus the platinum-to-platinum wire bonds allows the connections to take advantage of the natural ability of platinum to withstand high temperatures and corrosive environments.
• A plurality ofpins234 are mounted in theheader plate219 and extend therethrough, and are held in place by ceramic, ceramic glass orglass frit material276 or other acceptable material. The use of ceramic or glass frit feed through276 provides materials which can withstand higher temperatures as contrasted with glass feed through material. In addition, glass frit orceramic feed throughs276 are more compatible with platinum than glass pin seals.
• Theheader plate219 and/orframe220 can be made of a variety of materials, such as stainless steel, INVAR® alloy, KOVAR® alloy, NI-SPAN-C® alloy, aluminum nitride, or other corrosion resistant materials with relatively low coefficients of thermal expansion. Theheader plate219 andframe220 can be welded or threaded together.
• As shown inFIG. 57, in an alternate version of this first embodiment of thepiezoresistive sensor210, theheader plate219 shown inFIG. 42 can be replaced with thepedestal assembly280 ofFIG. 57. Thepedestal assembly280 may include aceramic substrate282, which can be made of the materials described above for thesubstrate14. Thesubstrate282 may be compression mounted inside aring284, in the same manner described above in the section entitled “Substrate Attachment.” A set ofpins234 may be mounted in and through thesubstrate282. A variety of methods for mounting thepins234 may be utilized, but in one embodiment the mounting process described above in the section entitled “Pin Mounting” may be utilized. A conduit286 may be mounted in and through thesubstrate282 to communicate the pressure-conveying fluid to the underside of thediaphragm226. Theconduit282 can be mounted in and to thesubstrate282 in the same manner as thepins234, and its upper end is planarized and polished flat to allow the sensor die212 to be attached thereto. The sensor die212 can be attached to thepedestal assembly280 by, for example, glass frit or a gold-germanium (or other material) transient liquid phase bond.
• Once thepedestal assembly280 shown inFIG. 57 is provided, thewires272 ofFIG. 42 can be attached to thepins234, and thepedestal assembly280 can be coupled to theframe220 in the same or similar manners as the pedestal/header plate219 ofFIG. 42. Thepedestal assembly280 may be able to accommodate higher temperatures due to the use of aceramic substrate282, and may be easier to manufacture.
• As noted above, in the illustrated embodiment thesensing component230 is made of or includes piezoresistive material. However, rather than being made of piezoresistive material, thesensing component230 may be made of or include piezoelectric material, in the same or similar manner to thesensors10 described in detail above (i.e. inFIGS. 8-17 and the accompanying description) which results in a dynamic pressure sensor. In addition, the piezoresistive material in the embodiments described below (“Piezoresistive Transducer—Second Embodiment” and “Piezoresistive Transducer—Third Embodiment”) may also be replaced with piezoelectric material to result in piezoelectric transducers. However, the sensors/transducers described in these sections may have increased utility as piezoresistive sensors/transducers, rather than piezoelectric sensors/transducers, and thus the headings refer to those transducers as “piezoresistive” rather than “piezoelectric.”
Piezoresistive TransducerSECOND EMBODIMENT
• A second embodiment of the piezoresistive transducer is292 is shown inFIGS. 58-60. In this embodiment, as shown inFIG. 60, the sensor die290 is mounted on an opposite side of theheader plate219 relative to thepins234 and compared to the embodiment ofFIG. 42. In the embodiment ofFIG. 42, the pressure exerted on thediaphragm226 tends to pull the sensor die212 away from theheader plate219. In contrast, in the embodiment ofFIG. 60, pressure applied to the sensor die290 pushes the attachment joint270 in compression and thereby greatly increases the burst pressure of thepressure sensor292.
• The sensor die290 of the embodiment ofFIGS. 58-60 may have generally the same structure as, and be formed in the same manner as, the sensor die212 of the embodiment ofFIGS. 42-56. However, the sensor die290 ofFIGS. 58-60 may not include thebase wafer214. In addition, as can be seen inFIGS. 58 and 59, the cappingwafer216 may generally cover thedevice wafer218 and have a pair ofslots294 formed therethrough to provide access to theoutput contacts232. Eachwire272 also passes through anopening309 formed in theheader plate219 to access anoutput contact232.
• With reference toFIG. 60, a vacuum/inert gas or reference pressure may be sealed in thecavity266 between the cappingwafer216 and diewafer218. In addition, or alternately, a vacuum, inert gas or reference pressure may be sealed in thecavity300 located between the cappingwafer216 and theheader plate219. In this case, the cappingwafer216 may include an opening formed therein (not shown) such that the twocavities266,300 communicate. In addition, or further alternately, a vacuum, inert gas or reference pressure may be present in thecavity302 located between theframe220 and theheader plate219, and thiscavity302 could communicate with the other twocavities300,266.
• In the embodiment ofFIG. 60 thepins234 are mounted in holes in theheader plate219 that only extend partially therethrough. The blind mounting of thepins234 ensures that thecavity302 defined by theheader plate219 andframe220 is not compromised. Thepins234 may be attached by a glass frit or ceramic feed throughmaterial276 as in the embodiment ofFIG. 42. In the embodiment ofFIG. 60, thepressure port224 is on the bottom side of the sensor die290 and all electrical connections can be protected in the vacuum or nitrogen environment in thecavities206,300,302 to prevent contamination and/or oxidation of the sensor elements and electrical connections.
• Eachpin234 is electrically coupled to an associatedtubular feedthrough306 by aplatinum wire308 to communicate the output of thesensor292. Eachtubular feedthrough306 is coupled to the upper end of thecover220 and may be made of platinum. Thetubes306 may be positioned inside a larger tube or shell309 that is coupled to an upper end of theframe220 by brazing or the like. Theshell309 is filled with a ceramic material, or glass frit, or apotting compound310, and eachtube306 is coupled to thematerial310 by brazing or the like.
• Eachwire308 may be brazed to an associatedtube306 at an upper end of thatwire308 and to an associatedpin234 at the other end. Aplug material312, such as ceramic, may be inserted into eachtube306 to seal off thetubes306. Avacuum seal tube315 may be positioned adjacent to thetubes306 to allow thecavities302 and/or300 and/or266 to be evacuated to provide absolute pressure measurements. The vacuum seal tube is sealed to seal out the ambient environment. It should be noted thattube arrangement306 shown inFIG. 60 may be used with a variety of other sensors and packaging for providing an exit path of thewires308, for example, the tube arrangement can be used with piezoelectric sensors and associated packaging shown inFIGS. 1 and 6.
• Theheader plate219 can be made of a variety of materials, such as KOVAR®, AlN or other high temperature resistant, corrosion resistant materials as described above, and the material may be selected such that its thermal expansion coefficient (“TEC”) is relatively close to that of silicon. In addition, in the illustrated embodiment, a pair of stress isolator rings314 are located on either side of theheader plate219. The stress isolator rings314 can be made of a variety of materials, such as KOVAR®, stainless steel or other materials similar to theheader plate219. Each of the stress isolator rings314 may be received in a groove on the top or bottom surface of theheader plate219 and welded to thepressure case220. Eachstress isolator ring314 may have a relatively thin wall thickness (i.e., about 10 mils) to allow eachstress insulator ring314 to expand or flex to accommodate thermal mismatches in the sensor package/assembly. In extremely corrosive environments, the KOVAR® materials of theheader plate219 and/or rings314 could be replaced with THERMO-SPAN® or other controlled expansion, high temperature resistant material.
Piezoresistive TransducerTHIRD EMBODIMENT
• A third embodiment of the sensor of the present invention is shown inFIGS. 61-65. In this embodiment, thedevice wafer320, that is the same as or similar to thedevice wafer218 described above, may be utilized. Thedevice wafer320 may also be formed by the process shown inFIGS. 46-55 and the accompanying description. As shown inFIG. 61, thedevice wafer320 is mechanically and electrically coupled to anadjacent substrate322. Thedevice wafer320 is attached in an inverted configuration, as in the second embodiment described above, to improve the ability of thesensor324 to accommodate high pressures. A reference pressure or vacuum or inert gas may be located in thecavity325 positioned between thesubstrate322 and theframe220, and/or thecavity326 between thesubstrate322 and thedevice wafer320. Furthermore, if desired, anopening319 may be formed in thesubstrate322 to allow thecavities325,326 to communicate.
• As shown inFIG. 62, thedevice wafer320 includes aframe340 that extends around the perimeter thereof, as well as a pair ofbulkheads342 extending laterally across thedevice wafer320. Theframe340 andbulkheads342 may be made of themetallization material88 and thebonding layer90 described above. In this sense theframe340 andbulkheads342 may be made of the same material as theframe70 andbulkhead72 of the device wafer shown inFIG. 3.
• As shown inFIG. 63, thesubstrate322 includes aframe344 andbulkhead346 that generally match (in size and shape) theframe340 andbulkheads342 of thedevice wafer320 ofFIG. 62. Theframe344 andbulkheads346 can also be made of themetallization layer88 with thebonding layer90 on top thereof. Thesubstrate322 also includes a set ofcontacts348 that are configured to align with theoutput contacts232 of thedevice wafer320. In this sense thesubstrate322 is analogous to thesubstrate14 described and shown above.
• In order to join thedevice wafer320 andsubstrate322, they are aligned as shown inFIG. 64 such that theirframes340,344,bulkheads342,346, andcontacts232,348 are aligned. Thedevice wafer320 andsubstrate322 are then pressed into contact such that theframes340,344,bulkheads342,346 andcontacts332,348 contact each other. Thedevice wafer320 andsubstrate322 are next joined or bonded in a transient liquid phase bonding process which is described above in the section entitled “Sensor Die Attachment.” The resultant structure is shown inFIG. 65
• After thedevice wafer320 andsubstrate322 are joined together, theframe310,344 andbulkheads342,346 provide sealed cavities around thecontacts232,378. The sealed cavities isolate the electrical portion of the device (i.e., the contacts232) from the pressure portion (i.e., the diaphragm226) to ensure that the pressure medium does not invade and contaminate/corrode the electrical elements or components, and also protects the electrical elements and components from high pressures.
• Thesubstrate322 may be a generally disk-shaped ceramic material that is made of the same materials as thesubstrate14 described above. Thesubstrate322 may be compression mounted inside a thin walled metal ring18 (i.e., in the same manner as described above in the section entitled “Substrate Attachment”). Thering18 is, in turn, mounted to theframe220 which provides support to thering18 and structure and protection to thesensor324 as a whole.
• A set ofpins234 are electrically coupled to thedevice wafer320 at one end, and to an associatedwire308 at the other end thereof. Eachpin234 may be coupled to thesubstrate322 as described above in the section entitled “Pin Mounting” above. Eachwire308 is coupled to, or extends through, atube306 at the other end similar to the embodiment shown inFIG. 60. In the third embodiment shown inFIGS. 61-65, wire bonding to thecontact pads232 is eliminated. In its place a flip-chip process, which is more automated, controlled and predictable, is used to complete electrical connections to thecontact pads232 and pins234.
• FIG. 66 illustrates another embodiment that is somewhat of a “hybrid” between the sensor ofFIGS. 58-60 and the sensor ofFIGS. 61-65. In this sensor the sensor die290 may be similar to the sensor die290 of the embodiment ofFIGS. 58-60. Theheader plate219 can be made of a variety of materials, such as AlN, KOVAR®, or other high temperature resistant, corrosion resistant materials as described above. Theoutput contacts232 are coupled to thepins234 by (platinum)wires272. Theheader plate219 is compression mounted inside thering18, and thepins234 are planarized and brazed in place similar to thepins234 shown inFIG. 61. This embodiment combines the predictable technology of wire bonding with the advantages of a compression mounted,isolated header plate219.
• The first, second, third and hybrid embodiments of the piezoresistive sensor are quite robust and able to withstand high pressures, temperatures, and corrosive environments. More particularly, each embodiment may be designed to withstand a pressure up to 600 psig, or 800 psig. The first embodiment may be able to withstand a pressure of up to 600 psig and a temperature up to 500° C. The second, third and hybrid embodiments may be able to withstand a pressure of up to 4000 psig and a temperature up to 450° C. or up to 500° C. The sensor of the various embodiments may also be able to withstand corrosive environments—for example, direct exposure to combustion byproducts, for an extended period of time (i.e. up to 40 hours, or up to 400 hours, or up to 4,000 hours) and continue functioning such that the sensor can be used in or adjacent to a combustion zone.
• The various piezoresistive and piezoelectric pressure sensors disclosed herein may also, if desired, take the form of various other pressure sensors that are not limited to piezoresistive and/or piezoelectric sensing elements. In this case, the packaging, metallization, joining, pin mounting and other features disclosed herein may be utilized with such pressure sensors. In addition, the various features disclosed herein are not necessarily restricted to use with pressure sensors, and can be used with any of a wide variety of sensors and transducers as disclosed in, for example, the section entitled “Field of Use” described above.
• Having described the invention in detail and by reference to the various embodiments, it will be apparent that modifications and variations thereof are possible without departing from the scope of the invention.

Claims (50)

1. A pressure sensor for use in a harsh environment comprising:

a substrate;

a sensor die directly coupled to said substrate by a bond frame positioned between said substrate and said sensor die, said sensor die including a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross;

a piezoelectric or piezoresistive sensing element at least partially located on said diaphragm such that said sensing element provides an electrical signal upon flexure of said diaphragm; and

a connecting component electrically coupled to said sensing element at a connection location that is fluidly isolated from said diaphragm by said bond frame, wherein said bond frame is made of materials and said connecting component is electrically coupled to said sensing element by the same materials of said bond frame.

2. The sensor ofclaim 1 wherein said bond frame is located around said connection location such that said bond frame, said substrate and said sensor die form a generally sealed cavity about said connection location.

3. The sensor ofclaim 1 wherein said materials of said bond frame are formed at a bonding temperature and said materials of said bond frame, after formation do not melt when exposed to said bonding temperature.

4. The sensor ofclaim 1 wherein said materials of said bond frame are formed at a bonding temperature of less than 500 degrees Celsius, and said materials of said bond frame, after formation, do not melt when exposed to temperatures in excess of 600 degrees Celsius.

5. The sensor ofclaim 1 wherein said material of said bond frame includes a hypoeutectic alloy.

6. The sensor ofclaim 1 wherein said substrate is made of a ceramic material and said sensor die is a semiconductor-on-insulator material.

7. The sensor ofclaim 1 wherein said substrate includes an opening and said connecting component extends through opening and is directly coupled to said substrate at said opening.

8. The sensor ofclaim 7 wherein said substrate is ceramic and said connecting component is metal, and wherein said connecting component is brazed to said substrate at said opening.

9. The sensor ofclaim 1 wherein said sensing element includes a piezoelectric film located on said diaphragm, an electrode located on said piezoelectric film and said diaphragm, and a lead electrically coupled to said electrode at one end and electrically coupled to said connecting component at said connection location at another end thereof.

10. The sensor ofclaim 9 wherein at least part of said lead is positioned directly between said bond frame and said sensor die.

11. The sensor ofclaim 9 wherein said sensing element includes a reference contact which is electrically grounded, and wherein said sensor includes a supplemental connecting component electrically coupled to said reference contact at a supplemental connection location that is fluidly isolated from said diaphragm by said bond frame.

12. The sensor ofclaim 1 wherein said connecting component is electrically coupled to said sensing element by a connecting means, wherein said connecting means is formed by a transient liquid phase eutectic bonding process carried out at a first temperature, and wherein said connecting means does not melt when exposed to a second temperature that is greater than said first temperature.

13. The sensor ofclaim 1 wherein said connecting component is electrically and mechanically coupled to said sensing element at said connection location by a solid solution eutectic alloy.

14. The sensor ofclaim 13 wherein said solid solution eutectic alloy is hypoeutectic gold-germanium solid solution alloy, or a hypoeutectic gold-silicon solid solution alloy, or a hypoeutectic gold-tin solid solution alloy.

15. The sensor ofclaim 13 wherein a metallization layer is positioned on either side of said eutectic alloy and located immediately adjacent to said eutectic alloy.

16. The sensor ofclaim 15 wherein at least one metallization layer includes an adhesion layer selected from the group consisting of compounds that are the reaction product of the sensor die or substrate and a metal selected from the group consisting of tantalum, chromium, zirconium, and haffiium, a first diffusion blocking layer of a compound selected from the group consisting of tantalum silicide, tantalum carbide, tantalum nitride and tungsten nitride, and a second diffusion blocking layer of platinum silicide.

17. The sensor ofclaim 1 wherein said substrate is made of a ceramic material and is positioned inside a metal ring, and wherein said substrate is brazed to said ring by a braze joint, and wherein braze joint includes a metallization layer, said metallization layer including an adhesion layer selected from the group consisting of compounds that are the reaction product of the substrate and a metal selected from the group consisting of tantalum, chromium, zirconium, and hafnium, a first diffusion blocking layer of a compound selected from the group consisting of tantalum silicide, tantalum carbide, tantalum nitride and tungsten nitride, and a second diffusion blocking layer of platinum silicide.

18. The sensor ofclaim 1 wherein said substrate is made of a ceramic material and is positioned in a ring, and wherein said substrate is maintained in a state of compression inside said ring.

19. The sensor ofclaim 1 wherein said sensor die is a semiconductor-on-insulator material having a device layer of a semiconductor material located on a insulator layer, and wherein said device layer forms said diaphragm.

20. The sensor ofclaim 1 wherein said sensor die is silicon-on-insulator material having a device layer of silicon located on an insulator layer, and wherein said device layer is (111) silicon, and wherein said sensing element includes a piezoelectric film epitaxially grown on said device layer.

21. The sensor ofclaim 20 wherein said piezoelectric film is aluminum nitride.

22. The sensor ofclaim 1 wherein said sensor can withstand, and continue functioning when exposed to, a temperature of 600 degrees Celsius.

23. The sensor ofclaim 1 wherein said sensor includes packaging such that said sensor can withstand, and continue functioning when exposed to, a pressure of 600 psig.

24. The sensor ofclaim 1 wherein said diaphragm is generally exposed to the same static pressure on either side thereof such that said diaphragm is generally hydrostatically balanced.

25. The sensor ofclaim 1 wherein said diaphragm is made of silicon.

26. The sensor ofclaim 1 wherein said diaphragm has a thickness of between about 3 and about 300 microns.

27. The sensor ofclaim 1 wherein said substrate includes a pair of opposed sides, and wherein said sensor die and said connection location are both located on the same side of said substrate.

28. A pressure sensor for use in a harsh environment comprising:

a substrate;

a sensor die directly coupled to said substrate by a bond frame positioned between said substrate and said sensor die, said sensor die including a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross;

a piezoelectric or piezoresistive sensing element at least partially located on said diaphragm such that said sensing element provides an electrical signal upon flexure of said diaphragm; and

a connecting component electrically coupled to said sensing element, wherein said bond frame is made of an alloy material and said connecting component is electrically coupled to said sensing element by the same material of said bond frame.

29. A method for forming a transducer comprising the steps of:

providing a semiconductor-on-insulator wafer including first and second semiconductor layers separated by an electrically insulating layer;

depositing or growing a piezoelectric film or piezoresistive film on said wafer;

depositing or growing an electrically conductive material on said piezoelectric or piezoresistive film to form at least one electrode;

depositing or growing a bonding layer including an electrical connection portion that is located on or is electrically coupled to said electrode;

providing a ceramic substrate having a bonding layer located thereon, said bonding layer including an electrical connection portion and being patterned in a manner to generally match said bonding layer of said semiconductor-on-insulator wafer; and

causing said bonding layer of said semiconductor-on-insulator wafer and said bonding layer of said substrate to bond together to thereby mechanically and electrically couple said semiconductor-on-insulator wafer and said substrate to form said sensor, wherein the electrical connection portions of said bonding layers of said semiconductor-on-insulator wafer and said substrate are fluidly isolated from the surrounding environment by said bonding layers.

30. The method ofclaim 29 wherein said first depositing or growing step includes epitaxially growing said piezoelectric film on said wafer.

31. The method ofclaim 29 wherein said transducer formed after said causing step can withstand, and continue functioning when exposed to, a temperature of 600 degrees Celsius and a pressure of 600 psig.

32. The method ofclaim 29 wherein said bonding layers of said wafer and said substrate form a hypoeutectic alloy after said causing step.

33. The method ofclaim 29 wherein said semiconductor-on-insulator wafer is a silicon-on-insulator wafer, and wherein the method further comprises removing part of said silicon-on-insulator wafer to form a silicon diaphragm having a thickness of between about 3 and about 300 microns, and wherein said first depositing or growing step includes depositing or growing said piezoelectric or piezoresistive film on said diaphragm.

34. A transducer for use in a harsh environment comprising:

a substrate;

a transducer die directly coupled to said substrate by a bond frame positioned between said substrate and said transducer die, said transducer die including a transducer element which provides an output signal related to a physical characteristic to be measured, or which receives an input signal and responsively provides a physical output; and

a connecting component electrically coupled to said transducer element at a connection location that is fluidly isolated from said transducer element by said bond frame, wherein said bond frame is made of materials and said connecting component is electrically coupled to said sensing element by the same materials of said bond frame, and wherein said connecting component is electrically isolated from said bond frame.

35. A transducer comprising:

a silicon-on-insulator base, wherein an upper layer of said base has a (111) crystal orientation and forms a generally flexible diaphragm;

a piezoelectric film at least partially located on said diaphragm, wherein said piezoelectric film is epitaxially grown on said upper layer;

an electrode positioned on said piezoelectric element and said diaphragm; and

a connecting component electrically coupled to said piezoelectric film.

36. The transducer ofclaim 35 wherein said piezoelectric film is aluminum nitride.

37. The transducer ofclaim 35 wherein said connecting component is electrically coupled to said piezoelectric film at a connection location that is fluidly isolated from said diaphragm by a bond frame that couples said silicon-on-insulator base to a substrate.

38. A pressure sensor for use in a harsh environment comprising:

a substrate;

a sensor die directly coupled to said substrate by a bond frame positioned between said substrate and said sensor die, said sensor die including a generally flexible diaphragm configured to flex when exposed to a sufficient differential pressure thereacross, wherein said bond frame generally extends around said diaphragm; and

a piezoelectric or piezoresistive sensing element at least partially located on said diaphragm such that said sensing element provides an electrical signal upon flexure of said diaphragm; and

a connecting component electrically coupled to said sensing element at a connection location, wherein said bond frame is made of a hypoeutectic alloy and said connecting component is electrically coupled to said sensing element by the same hypoeutectic of said bond frame.

39. A method for coupling components comprising the steps of:

providing a ceramic component having an attachment surface;

providing a metallic component;

depositing an active braze material on said attachment surface;

positioning said metallic component adjacent to said attachment surface with said active braze material located thereon;

depositing an attachment braze material such that said attachment braze material contacts said active braze material and said metallic component to from a joint joining metallic component and said ceramic component; and

planarizing said metallic component or said joint such that said metallic component and said ceramic component are generally co-planar.

40. The method ofclaim 39 wherein said ceramic component has an opening formed therein, and wherein an inner surface of said opening constitutes said attachment surface.

41. The method ofclaim 40 wherein said opening is generally straight-walled or tapered.

42. The method ofclaim 40 wherein said opening is a stepped-bore hole.

43. The method ofclaim 40 wherein said opening is formed by waterjet drilling.

44. The method ofclaim 39 wherein said metallic component or said joint protrudes through said ceramic component prior to said planarizing step, and wherein said planarizing step removes said protruding portion of said metallic component or said joint.

45. The method ofclaim 39 wherein said planarizing step includes planarizing such that said ceramic component has a numerical flatness value of about 1 micron or less.

46. The method ofclaim 39 further comprising the steps of depositing a metallization layer and a bonding material on at least one of said ceramic material or said joint or said metallic component such that said metallization layer and bonding material are electrically coupled to said metallic component, and coupling said ceramic component to another component such that said metallization layer and said bonding material provides electrical connection between said metallic component and said another component.

47. A system comprising:

a ceramic substrate having a first and a second opposed surface, with an opening formed therethrough and extending from said first to said second surface; and

a metallic pin located in said opening and coupled to said substrate and extending away from said first surface, said pin being coupled to said substrate by a braze joint including an active braze material and an attachment braze material, wherein said second surface of said substrate has a numerical flatness value of about 1 micron or less.

48. The component system ofclaim 47 wherein said substrate includes a metallization layer and a bonding material located on said substrate or said joint or said pin such that said metallization layer and bonding material are electrically coupled to said pin, and wherein the component system further comprises another component coupled to said substrate by said metallization layer and said bonding material such that said another component is electrically coupled to said pin.

49. A transducer system comprising:

a transducer die including transducer element which provides an output signal related to a physical characteristic to be measured, or which receives an input signal and responsively provides a physical output, said transducer element being electrically coupled to an output component;

a metallic housing located about or adjacent to said transducer die to protect or support said transducer die;

an output wire electrically coupled to said output component at a coupling location to thereby electrically connect said transducer die to an external processor or controller, wherein said output wire is generally positioned in a conduit; and

a metal sleeve that is coupled to said conduit and said housing to protect said coupling location, wherein said sleeve is slidably coupled to said conduit when said sleeve is not coupled to said conduit and to said housing.

50. A method for forming a transducer comprising the steps of:

providing a semiconductor-on-insulator wafer including first and second semiconductor layers separated by an electrically insulating layer;

doping an upper layer of said semiconductor-on-insulator wafer to form a piezoresistive film;

etching said piezoresistive film to form at least one piezoresistor;

depositing or growing a bonding layer including an electrical connection portion that is located on or is electrically coupled to said piezoresistive film;

providing a ceramic substrate having a bonding layer located thereon, said bonding layer including an electrical connection portion and being patterned in a manner to generally match said bonding layer of said semiconductor-on-insulator wafer; and

causing said bonding layer of said semiconductor-on-insulator wafer and said bonding layer of said substrate to bond together to thereby mechanically and electrically couple said semiconductor-on-insulator wafer and said substrate to form said sensor, wherein the electrical connection portions of said bonding layers of said semiconductor-on-insulator wafer and said substrate are fluidly isolated from the surrounding environment by said bonding layers.

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