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US20090105868A1 - Method For Assembling A Customized Printed Circuit Board - Google Patents

Method For Assembling A Customized Printed Circuit Board
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Publication number
US20090105868A1
US20090105868A1US12/342,893US34289308AUS2009105868A1US 20090105868 A1US20090105868 A1US 20090105868A1US 34289308 AUS34289308 AUS 34289308AUS 2009105868 A1US2009105868 A1US 2009105868A1
Authority
US
United States
Prior art keywords
circuit board
printed circuit
canceled
assembling
predetermined information
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/342,893
Inventor
Neal H. Haarberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Milegon LLC
Original Assignee
Milegon LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Milegon LLCfiledCriticalMilegon LLC
Priority to US12/342,893priorityCriticalpatent/US20090105868A1/en
Publication of US20090105868A1publicationCriticalpatent/US20090105868A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A system and a method are provided for assembling a customized printed circuit board having at least one electrical component. The system includes an input device for allowing a user to input predetermined information on the customized printed circuit board to be assembled. A central processing unit is operatively connected to the input device by a communications network, such as the internet. The central processing unit receives the predetermined information and generates assembly instructions in response to the predetermined information. A machine is operatively connected to the central processing unit for assembling the customized printed circuit board in response to the assembly instructions

Description

Claims (24)

US12/342,8932004-08-312008-12-23Method For Assembling A Customized Printed Circuit BoardAbandonedUS20090105868A1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US12/342,893US20090105868A1 (en)2004-08-312008-12-23Method For Assembling A Customized Printed Circuit Board

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
US60602404P2004-08-312004-08-31
US11/216,304US7475472B2 (en)2004-08-312005-08-31System for assembling a customized printed circuit board
US12/342,893US20090105868A1 (en)2004-08-312008-12-23Method For Assembling A Customized Printed Circuit Board

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US11/216,304DivisionUS7475472B2 (en)2004-08-312005-08-31System for assembling a customized printed circuit board

Publications (1)

Publication NumberPublication Date
US20090105868A1true US20090105868A1 (en)2009-04-23

Family

ID=35997549

Family Applications (2)

Application NumberTitlePriority DateFiling Date
US11/216,304Active2026-03-04US7475472B2 (en)2004-08-312005-08-31System for assembling a customized printed circuit board
US12/342,893AbandonedUS20090105868A1 (en)2004-08-312008-12-23Method For Assembling A Customized Printed Circuit Board

Family Applications Before (1)

Application NumberTitlePriority DateFiling Date
US11/216,304Active2026-03-04US7475472B2 (en)2004-08-312005-08-31System for assembling a customized printed circuit board

Country Status (1)

CountryLink
US (2)US7475472B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20090326697A1 (en)*2006-11-172009-12-31Hejian Technology (Suzhou) Co., Ltd.Semiconductor manufacturing automation system and method for using the same
US20150066180A1 (en)*2012-05-092015-03-05Vayo (Shanghai) Technology Co., Ltd.Quick processing system and method for smt equipment

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070240095A1 (en)*2006-01-302007-10-11Inventec CorporationComputer product customized information programming method and system
US8145341B2 (en)*2006-02-272012-03-27Jaroszewski Brian BProduct based configuration and control of manufacturing equipment
KR20090023571A (en)*2006-06-072009-03-05파나소닉 주식회사Component data distribution method, component data distribution apparatus, and program thereof
TWI365023B (en)*2009-07-232012-05-21Wistron CorpMethod for assembling componets on a circuit board and related assembling system
US9268895B2 (en)*2013-11-062016-02-23Texas Instruments IncorporatedCircuit design synthesis tool with export to a computer-aided design format
WO2015103413A2 (en)*2013-12-312015-07-09Pcb:Ng, Inc.Method and system for verifying printed circuit board designs, and creating or verifying related electronic component placement data for printed circuit board fabrication and assembly
KR102074978B1 (en)*2015-11-192020-02-10한화정밀기계 주식회사Apparatus and method for providing arrangement pattern
CN106979759A (en)*2017-04-162017-07-25合肥芯碁微电子装备有限公司A kind of measurement apparatus and its measuring method of half tone plate-making silk screen angle
EP3483683A1 (en)*2017-11-092019-05-15Siemens AktiengesellschaftAutonomous system
CN109967995B (en)*2019-04-082020-02-18郑州工业应用技术学院 A computer circuit board assembly device
CN113806997B (en)*2020-06-152023-11-24英业达科技有限公司Method for producing printed circuit board assembly scheme
JP7124259B2 (en)*2020-11-172022-08-24株式会社Plmレボリューション IT for decision-making work that reflects all of the multiple decision-making materials and requirements
US12259715B2 (en)2021-10-272025-03-25Illinois Tool Works Inc.Open application interface for industrial equipment
WO2024084484A1 (en)*2022-10-182024-04-25Cybord Ltd.Pcb labeling

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US20030059964A1 (en)*2001-09-212003-03-27Fuji Machine Mfg. Co., Ltd.Electric-circuit fabricating method and system, and electric-circuit fabricating program
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US20030236864A1 (en)*2002-06-242003-12-25Culture.Com Technology (Macau) Ltd.File downloading system and method
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US20040172268A1 (en)*2003-01-142004-09-02Franklin Tresia AnnMethod for creating a human resources and benefits website
US20040254960A1 (en)*2003-06-102004-12-16Scaturro Paul E.System and method for delivering video and music files over network
US20050071996A1 (en)*2003-10-012005-04-07Integrated Ideas & Technologies, Inc.Solder paste stencil manufacturing system
US20060272141A1 (en)*2003-05-132006-12-07Dickory RudduckAssembly and disassembly method, system, and component
US7558829B1 (en)*2004-01-142009-07-07Rearden, LlcApparatus and method for filtering email using disposable email addresses

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US5809639A (en)*1991-12-231998-09-22Robodyne CorporationAutomated component placement apparatus
US5894571A (en)*1995-08-141999-04-13Dell U.S.A., L.P.Process for configuring software in a build-to-order computer system
US5933349A (en)*1995-12-291999-08-03Compaq Computer CorporationComponent placement
US20010025413A1 (en)*1997-02-042001-10-04Fuji Machine Mfg. Co. Ltd.Circuit-component mounting mehtod and circuit-component mounting system
US6378200B1 (en)*1997-09-182002-04-30Motorola, Inc.Dynamically reconfigurable assembly line for electronic products
US6110213A (en)*1997-11-062000-08-29Vlt CoporationFabrication rules based automated design and manufacturing system and method
US6080207A (en)*1998-06-042000-06-27Gateway 2000, Inc.System and method of creating and delivering software
US6775829B1 (en)*1998-06-042004-08-10Gateway, Inc.Method for configuring software for a build to order system
US6230067B1 (en)*1999-01-292001-05-08Bp MicrosystemsIn-line programming system and method
US6687986B2 (en)*1999-01-292004-02-10Bp MicrosystemsMethod of programming a programmable electronic device by an in-line programming system
US6983532B2 (en)*1999-01-292006-01-10Bp MicrosystemsIn-line program system for assembly printed circuit board
US6402028B1 (en)*1999-04-062002-06-11Visa International Service AssociationIntegrated production of smart cards
US20010044667A1 (en)*2000-05-162001-11-22Nec CorporationSystem of manufacturing semiconductor intergrated circuit
US20030059964A1 (en)*2001-09-212003-03-27Fuji Machine Mfg. Co., Ltd.Electric-circuit fabricating method and system, and electric-circuit fabricating program
US20030093556A1 (en)*2001-11-102003-05-15Toshiba Tec Kabushiki KaishaDocument service appliance
US20040165008A1 (en)*2002-05-082004-08-26Levine David BrettSystem and method for transferring personalization information among computer systems
US20030236864A1 (en)*2002-06-242003-12-25Culture.Com Technology (Macau) Ltd.File downloading system and method
US20040172268A1 (en)*2003-01-142004-09-02Franklin Tresia AnnMethod for creating a human resources and benefits website
US20040139111A1 (en)*2003-01-142004-07-15Schoettger Chad A.Methods and apparatus for data validation and transformation
US20060272141A1 (en)*2003-05-132006-12-07Dickory RudduckAssembly and disassembly method, system, and component
US20040254960A1 (en)*2003-06-102004-12-16Scaturro Paul E.System and method for delivering video and music files over network
US20050071996A1 (en)*2003-10-012005-04-07Integrated Ideas & Technologies, Inc.Solder paste stencil manufacturing system
US7003871B2 (en)*2003-10-012006-02-28Integrated Ideas & Technologies, Inc.Solder paste stencil manufacturing system
US7558829B1 (en)*2004-01-142009-07-07Rearden, LlcApparatus and method for filtering email using disposable email addresses

Cited By (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20090326697A1 (en)*2006-11-172009-12-31Hejian Technology (Suzhou) Co., Ltd.Semiconductor manufacturing automation system and method for using the same
US20150066180A1 (en)*2012-05-092015-03-05Vayo (Shanghai) Technology Co., Ltd.Quick processing system and method for smt equipment
US9791851B2 (en)*2012-05-092017-10-17Vayo (Shanghai) Technology Co., Ltd.Quick processing system and method for SMT equipment

Also Published As

Publication numberPublication date
US20060053341A1 (en)2006-03-09
US7475472B2 (en)2009-01-13

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Legal Events

DateCodeTitleDescription
STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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