US20080275326A1 - Sensor for monitoring a condition of a patient - Google Patents

Abstract

A sensor may include a substrate having a sensing portion defining a sensor thereon and a circuit mounting portion defining at least one electrically conductive pad that is electrically connected to the sensor. The sensor may be configured to produce a signal indicative of a condition of the patient. An anisotropic medium may be disposed on the circuit mounting portion and may be electrically conductive in a direction through the medium and electrically insulating in directions along the medium. An electrical circuit may be mechanically mounted to the circuit mounting portion of the first substrate via the anisotropic medium with at least one electrically conductive terminal juxtaposed over the at least one electrically conductive pad. The anisotropic medium may establish local electrical contact between the at least one electrically conductive terminal and the at least one electrically conductive pad.

Description

FIELD OF THE INVENTION
• The present invention relates generally to sensors for determining a condition of a patient, and more specifically to techniques for mating sensors of this type with electrical circuitry.
BACKGROUND
• It is generally known to use one or more sensors to monitor a condition of a patient. It is desirable to mount electrical circuitry to such sensors to control sensor operation and/or perform other functions.
SUMMARY
• The present invention may comprise one or more of the features recited in the attached claims, and/or one or more of the following features and combinations thereof. One embodiment of a sensor may comprise a first substrate, an anisotropic medium and an electrical circuit. The first substrate may have a sensing portion configured to be percutaneously inserted into a patient and an extracorporeal circuit mounting portion. The sensing portion may define a sensor thereon. The sensor may be configured to produce a signal indicative of a condition of the patient. The circuit mounting portion may have at least one electrically conductive pad formed thereon that is electrically connected to the sensor. The anisotropic medium may be disposed on the circuit mounting portion of the first substrate. The medium may be configured to be electrically conductive in a direction through the medium and electrically insulating in directions along the medium. The electrical circuit may have at least one electrically conductive terminal. The circuit may be mechanically mounted to the circuit mounting portion of the first substrate via the anisotropic medium with the at least one electrically conductive terminal juxtaposed over the at least one electrically conductive pad. The anisotropic medium may establish local electrical contact between the at least one electrically conductive terminal and the at least one electrically conductive pad. The first substrate may be a flexible substrate or a rigid substrate.
• The anisotropic medium may be an anisotropic tape configured to mechanically bond the electrical circuit to the circuit mounting portion of the first substrate. The anisotropic tape may be electrically insulating along a plane of the tape and electrically conductive through the tape in a direction generally perpendicular to the plane of the tape. The anisotropic medium may alternatively or additionally be an anisotropic elastomer configured to mechanically bond the circuit to the circuit mounting portion of the first substrate. The anisotropic elastomer may be electrically insulating along a plane generally parallel to opposing surfaces of the electrical circuit and the circuit mounting portion of the first substrate, and electrically conductive through the elastomer in a direction generally perpendicular to the plane.
• The first substrate may define a first number of electrically conductive pads on the circuit mounting portion thereof, and the electrical circuit may have a second number of electrical terminals. At least some of the second number of electrical terminals may align with at least some of the number of electrically conductive pads when the electrical circuit is mounted to the circuit mounting portion of the first substrate.
• The electrical circuit may comprise a second substrate defining the at least one electrical terminal. The second substrate may be a flexible substrate or a rigid substrate. A number of electrical components may be mounted to the second substrate and electrically interconnected to form a sensor control circuit. The sensor control circuit may be electrically connected to the at least one electrical terminal. The sensor control circuit may include a sensor operating circuit configured to operate the sensor. The sensor control circuit may additionally include a telemetry circuit configured to transmit or receive communication signals to or from a first remote electronic device. The sensor control circuit may alternatively or additionally include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. The sensor control circuit may be configured to determine the predefined event from the signal produced by the sensor. In such embodiments, the first remote electronic device may include a first telemetry circuit configured to transmit or receive wireless communication signals to or from the telemetry system of the sensor control circuit. The telemetry circuit of the sensor control circuit may be configured to transmit a wireless signal indicative of the predefined event to the first telemetry circuit of the first remote electronic device. The sensor control circuit may alternatively or additionally include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event. A second remote electronic device may be further included, as well as a means for establishing communications between the first and second remote electronic devices. For example, the first remote electronic device may include a second telemetry circuit configured to transmit or receive wireless communication signals to or from a second remote electronic device.
• The electrical circuit may define an outer periphery that is contained within an outer periphery of the circuit mounting portion of the first substrate when the electrical circuit is mounted thereto.
• Another embodiment of a sensor may comprise first, second and third substrates. The first substrate may have a sensing portion configured to be percutaneously inserted into a patient and an extracorporeal circuit mounting portion. The sensing portion may define a sensor thereon. The sensor may be configured to produce a signal indicative of a condition of the patient. The circuit mounting portion may have at least one electrically conductive pad defined thereon that is electrically connected to the sensor. The second substrate may be mounted to the first substrate and may define therethrough at least one passageway that is aligned with the at least one electrically conductive pad defined on the first substrate. The third substrate may be mounted to the second substrate and may define thereon at least one electrical terminal. The at least one electrical terminal may align with at least one passageway defined on the second substrate and with the at least one electrically conductive pad defined on the first substrate. A first number of electrical components may be mounted to the third substrate and may be electrically interconnected to form a sensor control circuit. The sensor control circuit may be electrically connected to the at least one electrical terminal defined on the third substrate. Means may be provided for establishing electrical contact through the at least one passageway between the at least one electrically conductive pad defined on the first substrate and the at least one electrical terminal defined on the third substrate, to thereby electrically connect the sensor to the sensor control circuit.
• The sensor control circuit may include a telemetry circuit configured to transmit or receive communication signals to or from a first remote electronic device. Alternatively or additionally, the sensor control circuit may include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. In such embodiments, the sensor control circuit may be configured to determine the predefined event from the signal produced by the sensor. Alternatively or additionally, the sensor control circuit may include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.
• In embodiments wherein the sensor control circuit includes a telemetry circuit, the first remote electronic device may include a first telemetry circuit configured to transmit or receive communication signals to or from the telemetry system of the sensor control circuit. The telemetry circuit of the sensor control circuit may be configured to transmit a signal indicative of the predefined event to the first telemetry circuit of the first remote electronic device. A second remote electronic device may be further included, as well as a means for establishing communications between the first and second remote electronic devices. For example, the first remote electronic device may include a second telemetry circuit configured to transmit or receive wireless communication signals to or from a second remote electronic device.
• The first substrate may define a first number of electrically conductive pads on the circuit mounting portion thereof. The third substrate may define a second number of electrical terminals thereon. The second substrate may define a corresponding second number of passageways therethrough. At least some of the second number of electrical terminals may align with at least some of the first number of electrically conductive pads through corresponding ones of the second number of passageways defined through the second substrate when the second substrate is mounted to the first substrate and the third substrate is mounted to the second substrate.
• The first substrate may be a flexible substrate or a rigid substrate. The second substrate may be a flexible substrate or a rigid substrate. The third substrate may be a flexible substrate or a rigid substrate.
• A second number of electrical components may be mounted to the second substrate. The second number of electrical components and the first number of electrical components may together form the sensor control circuit. Means may be provided for electrically connecting the second number of electrical components to the first number of electrical components. The second number of electrical components may include a sensor operating circuit configured to operate the sensor. Alternatively or additionally, the second number of electrical components may include a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device. Alternatively or additionally, the second number of electrical components may include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. Alternatively or additionally, the second number of electrical components may include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event. In one example embodiment, the second number of electrical components may include a sensor operating circuit configured to operate the sensor, and the first number of electrical components may include a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device. In this embodiment, the second number of electrical components may include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. In this embodiment, the second number of electrical components may alternatively or additionally include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.
• Yet another embodiment of a sensor may comprise first, second and third substrates. The first substrate may have a sensing portion configured to be percutaneously inserted into a patient and an extracorporeal circuit mounting portion. The sensing portion may define a sensor thereon. The sensor may be configured to produce a signal indicative of a condition of the patient. The circuit mounting portion may have at least one electrically conductive pad defined thereon that is electrically connected to the sensor. The second substrate may be mounted to the first substrate and may define thereon a first number of electrically conductive pads. At least one of the first number of electrically conductive pads may be aligned with the at least one electrically conductive pad defined on the first substrate and at least another of the first number of electrically conductive pads defined on the second substrate may be electrically connected to the at least one of the first number of electrically conductive pads defined on the second substrate. Means may be provided for establishing electrical contact between the at least one electrically conductive pad defined on the first substrate and the at least one of the first number of electrically conductive pads defined on the second substrate. The third substrate may be mounted to the second substrate and may define thereon the at least one electrical terminal. A first number of electrical components may be mounted to the third substrate and may be electrically interconnected to form a sensor control circuit. The sensor control circuit may be electrically connected to the at least one electrical terminal defined on the third substrate. Means may be provided for establishing electrical contact between the at least another of the first number of electrically conductive pads defined on the second substrate and the at least one electrical terminal defined on the third substrate to thereby electrically connect the sensor to the sensor control circuit.
• The sensor control circuit may include a telemetry circuit configured to transmit or receive communication signals to or from a first remote electronic device. Alternatively or additionally, the sensor control circuit may include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. In such embodiments, the sensor control circuit may be configured to determine the predefined event from the signal produced by the sensor. Alternatively or additionally, the sensor control circuit may include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.
• In embodiments wherein the sensor control circuit includes a telemetry circuit, the first remote electronic device may include a first telemetry circuit configured to transmit or receive communication signals to or from the telemetry system of the sensor control circuit. The telemetry circuit of the sensor control circuit may be configured to transmit a signal indicative of the predefined event to the first telemetry circuit of the remote electronic device. A second remote electronic device may be further included, as well as a means for establishing communications between the first and second remote electronic devices. For example, the first remote electronic device may include a second telemetry circuit configured to transmit or receive wireless communication signals to or from a second remote electronic device.
• The first substrate may be a flexible substrate or a rigid substrate. The second substrate may be a flexible substrate or a rigid substrate. The third substrate may be a flexible substrate or a rigid substrate.
• The first substrate may define a second number of electrically conductive pads on the circuit mounting portion thereof. At least some of the first number of electrically conductive pads defined on the second substrate may align with corresponding ones of the second number of electrically conductive pads defined on the circuit mounting portion of the first substrate when the second substrate is mounted to the first substrate. The third substrate may define a third number of electrical terminals thereon. At least others of the first number of electrically conductive pads defined on the second substrate may align with corresponding ones of the third number of electrical terminals defined on the third substrate. Alternatively or additionally, means may be provided for electrically connecting at least others of the first number of electrically conductive pads defined on the second substrate to corresponding ones of the third number of electrical terminals defined on the third substrate.
• A second number of electrical components may be mounted to the second substrate. The second number of electrical components and the first number of electrical components may together form the sensor control circuit. Means may be provided for electrically connecting the second number of electrical components to the first number of electrical components. The second number of electrical components may include a sensor operating circuit configured to operate the sensor. Alternatively or additionally, the second number of electrical components may include a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device. Alternatively or additionally, the second number of electrical components may include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. Alternatively or additionally, the second number of electrical components may include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event. In one example embodiment, the second number of electrical components may include a sensor operating circuit configured to operate the sensor, and the first number of electrical components may include a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device. In this embodiment, the second number of electrical components may include a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event. In this embodiment, the second number of electrical components may alternatively or additionally include an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1A is an assembly view of one embodiment of a sensor module including a sensor and an electrical circuit mountable thereto.
• FIG. 1B is a cross-sectional view of the sensing portion of the module ofFIG. 1A taken alongsection lines1B-1B.
• FIG. 2 is an assembled view of the sensor module ofFIGS. 1A and 1B.
• FIG. 3 is a cross-sectional view of the sensor module ofFIG. 2 taken along section lines3-3.
• FIG. 4 is a block diagram illustrating one embodiment of the electrical circuit illustrated generally inFIGS. 1A,2 and3.
• FIG. 5 is an assembly view of another embodiment of a sensor module including a sensor and an electrical circuit mountable thereto.
• FIG. 6 is an assembled view of the sensor module ofFIG. 5.
• FIG. 7 is a cross-sectional view of the sensor module ofFIG. 6 taken along section lines7-7.
• FIG. 8 is a block diagram illustrating one embodiment of the electrical circuit illustrated generally inFIGS. 5 and 6.
• FIG. 9 is an assembly view of yet another embodiment of a sensor module including a sensor and an electrical circuit mountable thereto.
• FIG. 10 is an assembled view of the sensor module ofFIG. 9.
• FIG. 11A is a cross-sectional view of one embodiment of the sensor module ofFIG. 10 taken alongsection lines11A,B-11A,B.
• FIG. 11B is a cross-sectional view of another embodiment of the sensor module ofFIG. 10 taken alongsection lines11A,B-11A,B.
• FIG. 12 is a block diagram illustrating one embodiment of the electrical circuit illustrated generally inFIGS. 9,10,11A and11B.
• FIG. 13 is a block diagram illustrating another embodiment of the electrical circuit illustrated generally inFIGS. 9,10,11A and11B.
• FIG. 14 is a block diagram illustrating yet another embodiment of the electrical circuit illustrated generally inFIGS. 9,10,11A and11B.
DESCRIPTION OF THE ILLUSTRATIVE EMBODIMENTS
• For the purposes of promoting an understanding of the principles of the invention, reference will now be made to a number of illustrative embodiments shown in the attached drawings and specific language will be used to describe the same.
• Referring now toFIGS. 1A,1B and2, one illustrative embodiment of asensor module10 is shown that includes a sensor-carryingsubstrate12 having anelectrical circuit32 mountable thereto. In the illustrated embodiment, thesubstrate12 includes asensing portion14 that is configured for percutaneous insertion into a patient (e.g., into tissue, vein or artery) and an extracorporealcircuit mounting portion16.
• The sensingportion14 of thesubstrate12 includes a sensor in the form of at least one workingelectrode18A and at least oneauxiliary electrode18B formed thereon adjacent to aninsertion tip15 of thesensing portion14. Theauxiliary electrode18B may be, depending upon the application, part of the workingelectrode18A, another working electrode separate from the workingelectrode18A, a counter electrode or a reference electrode. It will be understood that thesensor18A,B may alternatively include additional or fewer electrodes formed on any side of thesensing portion14 of thesubstrate12, and that any such sensor electrodes may be located anywhere along the sensingportion14. Alternatively still, theauxiliary electrode18B and/or one or more additional electrodes associated with thesensor18A,B may be formed on a different structure that is implanted within, inserted into or otherwise in contact with the patient.
• Thesensor electrodes18A and18B are formed using electricallyconductive traces20A and20B respectively that are disposed on thesubstrate12 in a conventional manner. A sensing layer may be formed on, over or near eitherelectrode18A or18B, or on, over or near bothelectrodes18A and18B, and in the illustrated embodiment asensing layer24A is formed over theelectrode18A. The sensingend15 of thesensing portion14 may be configured, as illustrated inFIGS. 1A and 2, to facilitate percutaneous insertion of thesensing portion14 into a patient.
• In the illustrated embodiment, the workingelectrode18A is covered near theinsertion end15 of thesensing portion14 of thesubstrate12 with asensing layer24A. Thesensing layer24A may be formed using conventional materials that facilitate the electrochemical detection of an analyte or other condition of the patient's body when the analyte or other condition cannot be otherwise electrolyzed at a specified rate and/or with a specified accuracy using only the underlying workingelectrode18A. Illustratively, thesensing layer24A may include a conventional electron transfer agent that transfers electrons directly or indirectly between an analyte and the workingelectrode18A. Thesensing layer24A may also contain a conventional catalyst to catalyze a reaction of the analyte. In other embodiments, the workingelectrode18A may have asensing layer24A that does not contain either an electron transfer agent.
• In the illustrated embodiment, thesensing layer24A is disposed directly on the electricallyconductive portion20A of the workingelectrode18A. In other embodiments, thesensing layer24A may be spaced apart from the electricallyconductive portion20A of the workingelectrode18A by one or more conventional separation layers (not shown). Such separation layers typically include one or more membranes or films, and in addition to separating the electricallyconductive portion20A of the workingelectrode18A from thesensing layer24A, the one or more separation layers may also act as a conventional mass transport limiting layer or a conventional interferent eliminating layer. In other embodiments, thesensing layer24A may comprise two or more conventional sensing layers (not shown). The sensing layer orlayers24A may additionally include other operationally enhancing materials and/or layers including, but not limited to, a biocompatible layer, and/or other optional layers and/or components. In still other embodiments, the workingelectrode18A may not include asensing layer24A.
• Theauxiliary electrode18B may be formed using a suitably conductive material, and example of which may be, but should not be limited to, silver/silver chloride. Alternatively, theelectrode18B may be coated with or bound to a suitable material, at or near theinsertion end15 of thesensing portion14 that enhances operation of theelectrode18B another working electrode, counter electrode or reference electrode. It is desirable for the surface of theelectrode18B to be non-corroding to facilitate accurate sensor operation.
• Thesubstrate12 may be formed using any one or combination of conventional, electrically non-conducting materials that are by themselves, or that may be further processed to be, suitable for in-vivo use. In one embodiment, thesubstrate12 is flexible, and in one specific embodiment thesubstrate12 is made of Melinex® polyester film (e.g., polyethylene terephthalate). Other suitable materials for aflexible substrate12 include, for example, but are not limited to, electrically insulating plastic or polymeric materials such as polycarbonates, other polyesters such as Mylar®, polyvinyl chloride, polyurethanes, polyethers, polyimides, or copolymers of thermoplastics, such as glycol-modified polyethylene terephthalate, and/or other electrically non-conducting, flexible, deformable materials. In other embodiments, thesubstrate12 is rigid, and may be made using conventional electrically non-conducting materials. Examples of such rigid, electrically non-conducting materials include, but are not limited to, ceramics, such as aluminum oxide and silicon dioxide, and the like. Combinations of flexible and non-flexible materials are also contemplated.
• Thesubstrate12 is sized so that at least a portion of thetip15 of thesensing portion14 can be percutaneously inserted into a patient, such that the one or more sensor electrodes, e.g.,18A and/or18B, are suitably positioned to monitor a condition, e.g., an analyte such as blood glucose, temperature, blood pressure, or the like, of the patient, and while thecircuit mounting portion16 remains extracorporeal. Thecircuit mounting portion16 is sized to accommodate the mounting of anelectrical circuit32 thereto as will be described in greater detail hereinafter. Thecircuit mounting portion16 is also sized to accommodate placement thereon of a number of electrically conductive pads that are each electrically connected to a corresponding one of the sensor electrodes. In the illustrated embodiment, for example, wherein twosuch sensor electrodes18A and18B are shown, two corresponding electricallyconductive pads22A and22B are formed on thecircuit mounting portion16 of thesubstrate12. The electricallyconductive pad22A is electrically connected to thesensor electrode18A via an electricallyconductive trace20A formed on the sensing andcircuit mounting portions14 and16 respectively, and the electricallyconductive pad20B is electrically connected to thesensor electrode18B via another electricallyconductive trace20B formed on the sensing andcircuit mounting portions14 and16 respectively. It will be understood, however, that thesubstrate12 may include more or fewer sensor electrode, electrically conductive pad and interconnecting trace combinations.
• The electrically conductive traces, e.g.,20A and20B, and the electrically conductive pads, e.g.,22A and22B, may be formed on thesubstrate12 by any of a variety of conventional techniques. Examples of conventional techniques for forming such electrically conductive traces and electrically conductive pads include, but are not limited to, laser ablation, photolithography, screen printing, wet or dry etching of deposited conductive material, or other conventional techniques. Examples of electrically conductive materials used to form the electrically conductive traces and pads include, but are not limited to, carbon, e.g., graphite, conductive polymers, metals or alloys, metallic compounds, or the like. The formation of films of carbon, conductive polymer, metal, alloy, or metallic compound are well-known and include, for example, but are not limited to, chemical vapor deposition (CVD), physical vapor deposition, sputtering, reactive sputtering, printing, coating, and painting. It will be understood that the electrically conductive pads, e.g.,22A and22B, may, but need not, be formed of the same material used to form the electrically conductive traces, e.g.,20A and20B.
• Theelectrical circuit32 defines one or more electrical terminals that align with one or more corresponding electrically conductive pads formed on thecircuit mounting portion16 of thesubstrate12 when theelectrical circuit32 is juxtaposed over thecircuit mounting portion16. The one or more electrical terminals are electrically connected to sensor control circuitry carried by, formed on, or otherwise defined by theelectrical circuit32. The one or more electrical terminals may be variously shaped and/or sized, and in one embodiment are provided in the form of one or more electrically conductive pads. In the illustrated embodiment, for example, theelectrical circuit32 defines two such electricallyconductive pads34A and34B which align with the electricallyconductive pads22A and22B respectively on thecircuit mounting portion16 of thesubstrate12 when theelectrical circuit32 is juxtaposed over thecircuit mounting portion16 as shown inFIGS. 2 and 3. It will be understood that the number of electrically conductive pads formed on thecircuit mounting portion16 of thesubstrate12 may be equal to, less than or greater than the number of electrical terminals defined by theelectrical circuit32. In any of these cases, however, at least one of the electrical terminals defined by theelectrical circuit32 aligns with at least one of the electrically conductive pads formed on thecircuit mounting portion16 of thesubstrate12 when theelectrical circuit32 is juxtaposed over thecircuit mounting portion16 so that electrical connected may be established therebetween. At least some of the number of electrically conductive pads defined on thecircuit mounting portion16 of thesubstrate12 may be arranged to form a pattern, e.g., a bit pattern, that contains identification information and/or other information relating to thesensor18A,B,substrate12 or combination thereof. Such a bit pattern is then detectable by theelectrical circuit32 when electrical connection is established between the electrically conductive pads that define the bit pattern and corresponding ones of the electrical terminals defined by theelectrical circuit32. In this embodiment, theelectrical circuit32 may thus determine information relating to thesensor18A,B, thesubstrate12 and or the combination thereof based only on the pattern of electrical connections therebetween. Theelectrical circuitry32 may be configured to activate on-board notification circuitry and/or to wirelessly transmit signals to a remote electronic device, that are indicative of the information contained in the bit pattern and/or that are the result of further processing of this information.
• Ananisotropic medium30 is disposed between theelectrical circuit32 and thecircuit mounting portion16 of thesubstrate12. Theanisotropic medium30 has adhesive properties which serve to mechanically attach or mount theelectrical circuit32 to thecircuit mounting portion16 of thesubstrate12. Theanisotropic medium32 is also electrically conductive in a direction through the medium but is electrically insulating in a direction along or across the medium. By suitably positioning the one or more electrically conductive pads, e.g.,pads22A and22B on thecircuit mounting portion16 of thesubstrate12 and/or by suitably positioning the one or more electrical terminals on theelectrical circuit32 so that one or more of the electrical terminals align with one or more of the electrically conductive pads when thecircuit32 is juxtaposed over thecircuit mounting portion16 of thesubstrate12, local electrical contact is established therebetween when thecomponents16,30 and32 are assembled as illustrated inFIGS. 2 and 3.
• In one embodiment, theanisotropic medium30 may be provided in the form of a conventional anisotropic electrically conductive adhesive tape. The tape in this embodiment is a flexible adhesive matrix filled with electrically conductive particles that provide electrical connectivity in a direction through the plane of the tape, but which are spaced sufficiently far apart so that the tape is electrically insulating in directions along the plane of the tape. The anisotropicadhesive tape30 is disposed between thecircuit mounting portion16 of thesubstrate12 and theelectrical circuit32, as shown inFIGS. 2 and 3. When theelectrical circuit32 is pressed into thetape30 with theelectrical terminals34A and34B aligned with the electricallyconductive pads22A and22B, local electrical contact is established through thetape30, in a direction that is generally perpendicular to the plane of thetape30, between theelectrical terminals34A,34B and corresponding electricallyconductive pads22A,22B. Alternatively, theanisotropic medium30 may be provided in the form of an anisotropic electrically conductive elastomer, such as an adhesive film, having the same properties just described with respect to the anisotropic electrically conductive adhesive tape. In this embodiment, theelastomer30 defines a plane generally parallel to opposing surfaces of theelectrical circuit32 and thecircuit mounting portion16 of thesubstrate12, and theelastomer30 is electrically insulating in directions along or parallel to the plane and electrically conductive in a direction generally perpendicular to the plane.
• One example of the anisotropic electrically conductive medium30 may be or include one or more anisotropic conductive film adhesives that are commercially available from 3M™ Electronics of St. Paul, Minn. Examples include, but are not limited to, 3M™ products 7303, 7313, 8794, 5460R, 5552R, 7373 and 9703. Some such products, e.g., 9703, are available in the form of anisotropic, electrically-conductive adhesive transfer tape, which is a pressure sensitive tape that does not require thermal bonding. Generally, 9703 is a flexible tape that is randomly loaded with electrically conductive particles. When force is applied to the tape along its Z-axis, the conductive particles contact one another in the area of the force. In the bonding of electrical circuitry, the result is that the tape becomes electrically conductive along the Z-axis at the bonding areas, but is electrically insulating along the plane of the tape. The remaining products described above are available in the form of anisotropic (electrically) conductive film (ACF) adhesives, where are heat-bondable, Z-axis conductive films containing thermoplastic and thermoset adhesives randomly loaded with electrically conductive particles. Electrical contact is made in the same manner described with respect to the anisotropic, electrically-conductive adhesive transfer tape, and the product is cured to form a permanent bond by applying heat during the bonding process.
• In one experimental setup, one of the 3M™ ACF adhesives was used to bondFR4 circuit boards32 of thickness 1.6 mm toMelinex® substrates12 forming part of a sensor as shown inFIGS. 1 and 2. In this experiment,circuit boards32 were successfully bonded tosubstrates12, with electrical contact established between thecontacts22A/34A and22B/34B, by forcing a flat surface of a brass block, heated to 135° C., perpendicularly onto theMelinex® film12 using a linear guide supported on ball bearings. A spring, k=2 kg/mm, was used to apply a force of 11.7 kg to the brass block. The spring travel was set to 5.6 mm, and the brass block was forced against thesubstrate12 for approximately 50 seconds, after which thesubstrate12 was slightly displaced, and the brass block was again forced against thesubstrate12 for another 20-30 seconds. It will be understood that the results of this experiment are provided only for illustrative purposes, and should not be considered to be limiting in any way.
• In any case, a substantial portion of thecircuit mounting portion16 of thesubstrate12 and theelectrical circuit32 are covered by theanisotropic medium30, thereby resulting in a strong mechanical attachment of theelectrical circuit32 to thesubstrate12. In the illustrated embodiment, for example, theelectrical circuit32 defines an outer periphery that is contained within an outer periphery of thecircuit mounting portion16 of thesubstrate12 when theelectrical circuit32 is mounted thereto. In this embodiment, one entire surface of theelectrical circuit32 is thus covered by the anisotropic medium. The present disclosure contemplates other embodiments wherein the outer periphery of theelectrical circuit32 extends to or beyond at least a portion of the outer periphery of thecircuit mounting portion16 of thesubstrate12.
• Referring now toFIG. 4, a block diagram of one illustrative embodiment of theelectrical circuit32 is shown. In the illustrated embodiment, theelectrical circuit32 is a sensor control circuit that includes asensor operating circuit40 having aconventional memory unit42. Thesensor operating circuit40 includes a number of inputs that are each electrically connected to a corresponding one of the number of electrically conductive terminals defined by theelectrical circuit32. In the illustrated embodiment, for example, the sensor operating circuit includes two such inputs. A first input is electrically connected to the electricallyconductive terminal34A via asignal path38A, and a second input is electrically connected to the electrically conductive terminal34B via anothersignal path38B.
• Thesensor operating circuit40 includes conventional circuitry for operating thesensor18A,18B such as by, for example, providing appropriate voltages across thesensor electrodes18A and18B and collecting signals produced by thesensor18A,18B. Thesensor control circuit40 may also be configured to process the signals produced by thesensor18A,18B, and to then control one or more electrical circuits on-board theelectrical circuit32 and/or external to theelectrical circuit32. In one embodiment, thesensor control circuit40 is microprocessor-based, and is operable to execute one or more software algorithms stored in thememory unit42 to control operation of thesensor18A,18B and/or additional circuitry on-board and/or external to theelectrical circuit32.
• Thesensor control circuit32 may illustratively include aconventional telemetry circuit44 that is electrically connected to thesensor operating circuit42. Thetelemetry circuit44 may be configured to wirelessly transmit signals to a remoteelectronic device50, and/or to receive signals from the remoteelectronic device50. Thetelemetry circuit44 may be controlled by thesensor operating circuit40 to transmit and/or receive specified information, or may alternatively be controlled by thesensor operating circuit40 only to transmit information and to be responsive to signals transmitted by the remoteelectronic device50 to receive information. In any case, thetelemetry circuit44 may be configured to conduct wireless communication using any conventional wireless communication techniques. Examples of such conventional wireless communications techniques include, but are not limited to, infrared (IR) communications, radio frequency (RF) communications, inductively coupled communications, or the like.
• Thesensor control circuit32 may also illustratively include a conventionalevent notification circuit46 that is electrically connected to thesensor operating circuit42. Theevent notification circuit46 is configured to provide a notification of a specified event, and may accordingly include any one or more conventional visual, audible and/or tactile indication devices. Theevent notification circuit46 is configured to be responsive to an event notification signal to activate the one or more visual, audible and/or tactile indication devices according to any desired indication pattern. The event that triggers activation of the one or more visual, audible and/or tactile indication devices of theevent notification circuit46 generally results from information provided by thesensor18A,18B. In the illustrated embodiment, thesensor operating circuit40 is operable to process all information produced by thesensor18A,18B, and is accordingly operable to determine the event that triggers activation of theevent notification circuit46 from the signals produced by thesensor18A,18B. Upon determining such an event, thesensor operating circuit40 is then operable to control activation of theevent notification circuit46. Alternatively, thesensor operating circuit40 may be operable, upon determining such an event, to control thetelemetry circuit44 transmit a wireless event signal, which may be received by asensor telemetry circuit52 that forms part of the remoteelectronic device50.
• Thesensor control circuit32 may also illustratively include an acknowledgecircuit48 that is electrically connected to thesensor operating circuit40. The acknowledgecircuit48 is configured to be responsive to user activation thereof to produce an acknowledgement signal, and to provide the acknowledgement signal to thesensor operating circuit40. Generally, the acknowledgecircuit48 is provided as a mechanism for the user to acknowledge production of the visual, audible or tactile indication of the predefined event. In this regard, the acknowledgecircuit48 may include any conventional user activation mechanism including, for example, but not limited to, a user activated button, switch or the like.
• Thesensor control circuit32 may be implemented in any of a variety of conventional forms. In one embodiment, for example, thesensor control circuit32 may be a single, monolithic integrated circuit configured to include at least thesensor operating circuit40, and to optionally include any one or more of thetelemetry circuit44, theevent notification circuit46 and theacknowledgement circuit48. In this embodiment, the one or more electrical terminals comprise one or more electrically conductive circuit terminals or leads extending from a hermetically sealed integrated circuit package containing the integrated circuit. In this embodiment, thestructure33 thus represents a packaged integrated circuit. In another embodiment, for example, thesensor control circuit32 may include a sensor control circuit substrate having at least thesensor operating circuit40, and optionally any one or more of thetelemetry circuit44, theevent notification circuit46 and theacknowledgement circuit48, mounted thereto. In this embodiment, thestructure33 illustrated inFIG. 4 represents the sensor control circuit substrate. Thesubstrate33 may be flexible or rigid, and the one or more electrical terminals may take the form of one or more electrically conductive pads formed on the underside of thesubstrate33, one or more circuit traces formed on the underside of thesubstrate33 or one or more electrical conductors extending from the underside of thesubstrate33. In this embodiment, thesensor operating circuit40, and optionally any one or more of thetelemetry circuit44, theevent notification circuit46 and theacknowledgement circuit48, is mounted to a top side of thesubstrate33, and the one or more electrical terminals defined on the underside of thesubstrate33 are electrically connected to corresponding electrical terminals or circuit traces defined on the top side of thesubstrate33 in a conventional manner. An example of this is illustrated inFIG. 3 where theelectrical terminal34A defined on the bottom surface of thesensor control circuit32 is electrically connected via anelectrical conductor35 to anelectrical terminal34A′ defined on the top surface of thesensor control circuit32. The twoelectrical terminals34A and34A′ may be electrically connected using conventional techniques including, for example, but not limited to, plated-though hole technology, using multiple layers of conductors interconnected by vias, wrapping electrically conductive circuit traces around the substrate from the top surface to the bottom surface, and the like. Examples of suitable flexible materials that may be used to implement thesubstrate33 in flexible form include, but are not limited to, Melinex® polyester film (e.g., polyethylene terephthalate), other polyesters such as Mylar®, polyvinyl chloride, electrically insulating plastic or polymeric materials such as polycarbonates, polyurethanes, polyethers, polyimides, or copolymers of thermoplastics, such as glycol-modified polyethylene terephthalate, and/or other electrically non-conducting, flexible, deformable materials. Examples of suitable rigid materials that may be used to implement thesubstrate33 in rigid form include, but are not limited to, ceramics, such as aluminum oxide and silicon dioxide, conventional printed circuit boards, conventional multi-layer printed circuit boards, and the like. Combinations of flexible and non-flexible materials are also contemplated.
• As described hereinabove, a remoteelectronic device50 may include asensor telemetry circuit52 configured to wirelessly transmit signals to and/or receive signals from thetelemetry circuit44 of thesensor control circuit32. The remoteelectronic device50 may further include aconventional processor circuit54, which may be implemented in the form of a conventional microprocessor that is electrically connected to thesensor telemetry circuit52 and to aninput device56. Aninput device56 may be or include a keyboard, key pad, touch screen display device, voice-activated device or the like, and may be used in a conventional manner to supply theprocessor54 with information that may include, for example, commands to execute a desired function or process. Aconventional display57 may be included as part of theelectronic device50, and may be controlled by theprocessor54 in a conventional manner to display messages, alerts and/or warnings in the form of one or more of a visual, audible or tactile form. In embodiments wherein thesensor operating circuit40 of the electrical circuit36 is operable to control thetelemetry circuit44 to transmit a wireless event signal, as described hereinabove, thetelemetry circuit52 of theelectronic device50 is operable to receive the wireless event signal and provide this signal to theprocessor54. Theprocessor54 is, in turn, responsive to the wireless event signal to activate thedisplay57 to display, in visual, audible and/or tactile form, an indicator of the event.
• Theelectronic device50 may further include anauxiliary telemetry circuit58 that is configured to transmit and/or receive wireless signals to and/or from atelemetry circuit60 of another remote or auxiliaryelectronic device62. Alternatively, theremote device50 may include an input/output port66, the remote orauxiliary device62 may also include an input/output port68, and a suitable wiredconnection69 may electrically connect the input/output ports66 and68. Communication between the remoteelectronic device50 and the remote or auxiliaryelectronic device62 may be carried out using any conventional techniques and according to any conventional communications protocols.
• Referring now toFIGS. 5-8, one illustrative embodiment of anothersensor module70 is shown. Thesensor module70 includes some of the same structural components as thesensor module10 ofFIGS. 1-4, and like numbers are therefore used to identify like components. In the illustrated embodiment, anintermediate substrate80 is introduced between thecircuit mounting portion16 of thesubstrate12 and theelectrical circuit32. Theintermediate substrate80 may be flexible or rigid, and in either case thesubstrate80 defines therethrough one or more passageways that align with one or more corresponding electrically conductive pads defined on thecircuit mounting portion16 of thesubstrate12 when thesubstrate80 is mounted to thecircuit mounting portion16 of thesubstrate12. In the illustrated embodiment, for example, theintermediate substrate80 defines therethrough twosuch passageways82A and82B that align with corresponding electricallyconductive pads22A and22B defined on thecircuit mounting portion16 of thesubstrate12, and that are juxtaposed over the corresponding electricallyconductive pads22A and22B when thesubstrate80 is mounted to thecircuit mounting portion16 of thesubstrate12. Thesubstrate80 may be attached to thecircuit mounting portion16 of thesubstrate12 via a conventional attachment medium, and in the embodiment illustrated inFIG. 7 thesubstrate80 is shown being attached or mounted to the mountingportion16 of thesubstrate12 via aconventional adhesive84. Examples of other suitable attachment mechanisms include, but are not limited to, conventional epoxies or other formable or settable mediums, conventional adhesives including adhesive tapes, or the like. Examples of suitable flexible materials that may be used to implement thesubstrate80 in flexible form include, but are not limited to, Melinex® polyester film (e.g., polyethylene terephthalate), other polyesters such as Mylar®, polyvinyl chloride, electrically insulating plastic or polymeric materials such as polycarbonates, polyurethanes, polyethers, polyimides, or copolymers of thermoplastics, such as glycol-modified polyethylene terephthalate, and/or other electrically non-conducting, flexible, deformable materials. Examples of suitable rigid materials that may be used to implement thesubstrate80 in rigid form include, but are not limited to, ceramics, such as aluminum oxide and silicon dioxide, conventional printed circuit boards, conventional multi-layer printed circuit boards, and the like. Combinations of flexible and non-flexible materials are also contemplated.
• The one or more electrical terminals defined by theelectrical circuit32 also align with the one or more passageways defined through theintermediate substrate80. In the illustrated embodiment, for example, theelectrical terminals34A and34B align with thepassageways82A and82B respectively so that theterminals34A and34B are juxtaposed over the electricallyconductive pads22A and22B when theelectrical circuit32 is mounted to theintermediate substrate80 and theintermediate substrate80 is also mounted to thecircuit mounting portion16 of thesubstrate12, as illustrated inFIGS. 6 and 7. Electrical connection between the electricallyconductive terminals34A and34B and the corresponding electricallyconductive pads22A and22B respectively is made using conventional electrical interconnection techniques. Examples of such electrical interconnection techniques include, but are not limited to, curable solder paste, solder bumps, electrically conductive adhesive, an electrically conductive formable medium such as an electrically conductive resin, or the like. In the illustrated embodiment, the electrical connection is shown as taking the form of a formablemetallic conductor86, e.g., solder, that forms an electrical and mechanical bond to the electricallyconductive terminal34A and to the electricallyconductive pad22A. This mechanical connection may serve also as the mechanical attachment mechanism for mounting theelectrical circuit32 to theintermediate substrate80, as illustrated inFIG. 7, or a conventional attachment medium may alternatively be used to attach or mount theelectrical circuit32 to thesubstrate80. Examples of such conventional attachment mechanisms include, but are not limited to, conventional epoxies or other formable or settable mediums, conventional adhesives including adhesive tapes, or the like.
• Theelectrical circuit32 may take any of the forms described hereinabove with respect toFIG. 4, and may be configured as described hereinabove to communicate with a remoteelectronic device50. Thedevice50 may also be configured to communicate with an auxiliaryelectronic device62. Details of the remoteelectronic device50, the auxiliaryelectronic device62 and operation thereof are provided hereinabove. In some embodiments, aportion32′ of theelectrical circuit32 may be mounted to a suitable flexible orrigid substrate88 that is itself attached to thesubstrate80, and a remainder of theelectrical circuit32 may be mounted to and carried by thesubstrate80. In the illustrated embodiment, for example, theevent notification circuit46 is shown as being mounted to and carried by thesubstrate80 while aremainder32′ of thesensor control circuitry40,43,44 and48 is mounted to a sensorcontrol circuit substrate88. It will be understood that in this embodiment, any one or more of the sensor control circuit components may be mounted to thesubstrate80, and that theevent notification circuit46 is shown mounted to thesubstrate80 only by way of example. In any case, any portion of thesensor control circuit32 that is mounted to thesubstrate80 is electrically connected to a remainder of thesensor control circuit32′ that is mounted to the sensorcontrol circuit substrate88 using conventional electrical connection structures and techniques. In the illustrated embodiment, for example, thesubstrate88 defines an electrically conductive pad or terminal90 on a top side of thereof that is electrically connected to thesensor operating circuit40 via an electricallyconductive trace92. Thesubstrate80 likewise defines an electrically conductive pad or terminal94 on the top side thereof that is electrically connected to theevent notification circuit46 via an electricallyconductive trace96. The electrically conductive pads orterminals90 and94 are electrically connected together in a conventional manner to electrically connect theevent notification circuit46 to thesensor operating circuit40.
• In an alternative embodiment, as illustrated in phantom inFIG. 8, thesubstrate88 defines an electricallyconductive pad98 on the bottom surface thereof that aligns with, and is juxtaposed over, an electricallyconductive pad99 formed on the top surface of thesubstrate80 when thesubstrate88 is mounted to thesubstrate80. Electrical interconnection therebetween may be made using conventional techniques, or by interposing an anisotropic electrically conductive medium, such as the anisotropic electrically conductive medium30 illustrated and described hereinabove, between thesubstrates80 and88 at least between the electricallyconductive pads98 and99. Examples of suitable flexible materials that may be used to implement thesubstrate88 in flexible form include, but are not limited to, Melinex® polyester film (e.g., polyethylene terephthalate), other polyesters such as Mylar®, polyvinyl chloride, electrically insulating plastic or polymeric materials such as polycarbonates, polyurethanes, polyethers, polyimides, or copolymers of thermoplastics, such as glycol-modified polyethylene terephthalate, and/or other electrically non-conducting, flexible, deformable materials. Examples of suitable rigid materials that may be used to implement thesubstrate88 in rigid form include, but are not limited to, ceramics, such as aluminum oxide and silicon dioxide, conventional printed circuit boards, conventional multi-layer printed circuit boards, and the like. Combinations of flexible and non-flexible materials are also contemplated.
• In an alternative embodiment, as another example, thetelemetry circuit44 may be mounted to and carried by thesubstrate88 while theremainder32′ of thesensor control circuitry40,43,44 and/or46 is mounted to and carried by thesubstrate80. In this embodiment, thetelemetry circuit44 is electrically connected to a remainder of thesensor control circuit32′ that is mounted to thesubstrate80 using conventional electrical connection structures and techniques of the type just described.
• Referring now toFIGS. 9-14, one illustrative embodiment of yet anothersensor module100 is shown. Thesensor module100 includes some of the same structural components as thesensor module10 ofFIGS. 1-4, and like numbers are therefore used to identify like components. In the illustrated embodiment, anintermediate substrate110 is introduced between thecircuit mounting portion16 of thesubstrate12 and anelectrical circuit132. Theintermediate substrate110 may be flexible or rigid, and in either case thesubstrate110 defines one or more electrically conductive pads on the bottom surface thereof that align with one or more of the number of electrically conductive pads defined on thecircuit mounting portion16 of thesubstrate12 when thesubstrate110 is mounted to thecircuit mounting portion16 of thesubstrate12. In the illustrated embodiment, for example, theintermediate substrate110 defines two such electricallyconductive pads112A and112B on the bottom surface thereof that align with corresponding electricallyconductive pads22A and22B defined on thecircuit mounting portion16 of thesubstrate12. In the illustrated embodiment, thesubstrate110 is attached to thecircuit mounting portion16 of thesubstrate12 via an anisotropic electrically conductive medium30 as described hereinabove with respect toFIGS. 1-3. In this embodiment, theanisotropic medium30 also establishes local electrical connections between the electricallyconductive pads22A and112A and between the electricallyconductive pads22B and112B as described hereinabove. Alternatively, thesubstrate110 may be attached to thecircuit mounting portion16 of thesubstrate12 via any conventional attachment medium, and electrical connections between the electricallyconductive pads22A and112A and between the electricallyconductive pads22B and112B may be established via any conventional electrical connection structure or technique. Examples of suitable flexible materials that may be used to implement thesubstrate110 in flexible form include, but are not limited to, Melinex® polyester film (e.g., polyethylene terephthalate), other polyesters such as Mylar®, polyvinyl chloride, electrically insulating plastic or polymeric materials such as polycarbonates, polyurethanes, polyethers, polyimides, or copolymers of thermoplastics, such as glycol-modified polyethylene terephthalate, and/or other electrically non-conducting, flexible, deformable materials. Examples of suitable rigid materials that may be used to implement thesubstrate110 in rigid form include, but are not limited to, ceramics, such as aluminum oxide and silicon dioxide, conventional printed circuit boards, conventional multi-layer printed circuit boards, and the like. Combinations of flexible and non-flexible materials are also contemplated.
• Thesubstrate110 also defines a number of electrically conductive pads on the top surface thereof, at least some of which are electrically connected to corresponding electrically conductive pads defined on the bottom surface of thesubstrate110, and one or more of which align with a corresponding one or more electrically conductive pads defined on the bottom surface of theelectrical circuit132 when theelectrical circuit132 is mounted to thesubstrate110. In the illustrated embodiment, for example, a pair of electricallyconductive pads114A and114B are defined on the top surface of thesubstrate110. The electrically conductive pad114A defined on the top surface of thesubstrate110 is electrically connected to the electricallyconductive pad112A defined on the bottom surface of thesubstrate110 by an electrical conductor or electricallyconductive trace116A, and the electricallyconductive pad114B defined on the top surface of thesubstrate110 is likewise electrically connected to the electricallyconductive pad112B defined on the bottom surface of thesubstrate110 by an electrical conductor or electricallyconductive trace116B. The electrical conductors or electricallyconductive traces116A and116B may be formed using conventional electrical connection technology, examples of which include, but are not limited to, plated-though hole technology, using multiple layers of conductors interconnected by vias, wrapping electrically conductive circuit traces around the substrate from the top surface to the bottom surface, and the like.
• In the illustrated embodiment, theelectrical circuit132 defines a pair of electrically conductive terminals in the form of electricallyconductive pads134A and134B on the bottom surface thereof, which align with, and are juxtaposed over, corresponding ones of the electricallyconductive pads114A and114B defined on the top surface of thesubstrate110 when theelectrical circuit132 is mounted to thesubstrate110. In one embodiment, as illustrated inFIG. 11A, theelectrical circuit132 is attached to thesubstrate110 via aconventional attachment medium124, examples of which include, but are not limited to, conventional epoxies or other formable or settable mediums, conventional adhesives including adhesive tapes, or the like. Electrical connection between the electricallyconductive terminals134A and134B and the corresponding electricallyconductive pads114A and114B respectively is made using conventional electrical interconnection techniques. Examples of such electrical interconnection techniques include, but are not limited to, curable solder paste, solder bumps, electrically conductive adhesive, an electrically conductive formable medium such as an electrically conductive resin, or the like. In the illustrated embodiment, the electrical connection is shown as taking the form of aformable metal126, e.g., solder, that forms an electrical and mechanical bond to the electricallyconductive pad134B and to the electricallyconductive pad114B. In some embodiments, this mechanical connection may serve also as the mechanical attachment mechanism for mounting theelectrical circuit132 to thesubstrate110. In an alternate embodiment, as illustrated inFIG. 11B, theelectrical circuit132 is attached to thesubstrate110 via an anisotropic electricallyconductive medium130, which may be identical to the anisotropic electrically conductive medium30 described hereinabove with respect toFIGS. 1-3. In this embodiment, theanisotropic medium130 also establishes local electrical connections between the electricallyconductive pads134A and114A and between the electricallyconductive pads134B and114B as described hereinabove.
• Theelectrical circuit132 may take any of the forms described hereinabove with respect to the description of theelectrical circuit32, and may be configured as described hereinabove to communicate with a remoteelectronic device50. Thedevice50 may also be configured to communicate with an auxiliaryelectronic device62. Details of the remoteelectronic device50, the auxiliaryelectronic device62 and operation thereof are provided hereinabove.
• In one embodiment, as illustrated inFIG. 12, for example, thesensor operating circuit40 is mounted to a top surface of a flexible orrigid substrate133 that is attached to thesubstrate110 as described hereinabove with respect toFIGS. 11A or11B. Thesensor operating circuit40 has a first input that is electrically connected to the electricallyconductive pad134A via an electrical conductor or electricallyconductive trace138A, and a second input that is electrically connected to the electricallyconductive pad134B via an electrical conductor or electricallyconductive trace138B. Optionally, atelemetry circuit44, anevent notification circuit46 and/or an acknowledgecircuit48 may also be mounted to thesubstrate133 and electrically interconnected as described hereinabove. In this embodiment, thesensor operating circuit40, and optionally any one or more of thetelemetry circuit44, theevent notification circuit46 and theacknowledgement circuit48, is mounted to a top side of thesubstrate133, and the one or more electrical terminals defined on the bottom surface of thesubstrate133 are electrically connected to corresponding electrical terminals or circuit traces defined on the top side of thesubstrate33 in a conventional manner. This is illustrated inFIGS. 11A and 11B where theelectrical terminal134B defined on the bottom surface of thesensor control circuit32 is electrically connected via anelectrical conductor135 to an electrical terminal134B′ defined on the top surface of thesensor control circuit32. The twoelectrical terminals134B and134B′ may be electrically connected using conventional techniques including, for example, but not limited to, plated-though hole technology, using multiple layers of conductors interconnected by vias, wrapping electrically conductive circuit traces around the substrate from the top surface to the bottom surface, and the like.
• In an alternative embodiment, as illustrated inFIG. 13, for example, aportion132′ of theelectrical circuit132 may be mounted to a modifiedsubstrate133′ that is itself attached to a modifiedsubstrate110′, and a remainder of theelectrical circuit132 may be mounted to and carried by thesubstrate110′. In the illustrated embodiment, for example, thetelemetry circuit44 is shown as being mounted to and carried by thesubstrate110′ while aremainder132′ of thesensor control circuitry40,42,46 and48 is mounted to thesubstrate133′. It will be understood that in this embodiment, any one or more of the sensor control circuit components may be mounted to thesubstrate110′, and that thetelemetry circuit44 is shown mounted to thesubstrate110′ only by way of example. In any case, any portion of thesensor control circuit132 that is mounted to thesubstrate110′ is electrically connected to a remainder of thesensor control circuit132′ that is mounted to thesubstrate133′ using conventional electrical connection structures and techniques. In the illustrated embodiment, for example, thesubstrate110′ is modified, relative to thesubstrate110 ofFIG. 12, to define an electricallyconductive pad114C on a top side of thereof that is electrically connected to thetelemetry circuit44 via an electricallyconductive trace116C. Thesubstrate133′ is likewise modified, relative to thesubstrate133, to define an electricallyconductive pad134C on the bottom surface thereof that is electrically connected to an input of thesensor operating circuit40 via an electricallyconductive trace138C. The electricallyconductive pads114C and134C are electrically connected together as described hereinabove with respect toFIGS. 11A or11B. In the embodiment illustrated inFIG. 13, the electricallyconductive pads112A and112B defined on the bottom surface of thesubstrate110′ are shown offset from the center of thesubstrate110′ to illustrate that the electrically conductive pads may be defined anywhere on the bottom surface of thesubstrate110′, and this is generally true of any of the electrically conductive pads and/or electrical terminals illustrated and described herein.
• In another alternative embodiment, as illustrated inFIG. 14, for example, aportion132′ of theelectrical circuit132 may again be mounted to another modifiedsubstrate133″ that is itself attached to another modifiedsubstrate110″, and a remainder of theelectrical circuit132 may be mounted to and carried by thesubstrate110″. In the illustrated embodiment, for example, the acknowledgecircuit48 is shown as being mounted to and carried by thesubstrate110″ while aremainder132′ of thesensor control circuitry40,42,44 and48 is mounted to thesubstrate133″. It will be understood that in this embodiment, any one or more of the sensor control circuit components may be mounted to thesubstrate110″, and that the acknowledgecircuit48 is shown mounted to thesubstrate110″ only by way of example.
• Thesubstrate110″ is modified, relative to thesubstrates110 and110′ ofFIGS. 12 and 13 respectively, to define a number of electricallyconductive terminals114A′,114B′ and114C′ in place of the electricallyconductive pads114A,114B and114C, that may or may not be implemented in the form of electrically conductive pads, that may be defined on the top or bottom surface of thesubstrate110″ and that may or may not align with corresponding electrical terminals defined on the modifiedsubstrate133″. Theelectrical terminal114A′ is electrically connected to the electricallyconductive pad112A via thecircuit trace116A, theelectrical terminal114B′ is electrically connected to the electricallyconductive pad112B via thecircuit trace116B, and theelectrical terminal114C′ is electrically connected to the acknowledgecircuit48 via thecircuit trace116C. Thesubstrate133″ is likewise modified to define a number of electricallyconductive terminals134A′,134B′ and134C′ in place of the electricallyconductive pads134A,134B and134C, that may or may not be implemented in the form of electrically conductive pads, that may be defined on the top or bottom surface of thesubstrate133″ and that may or may not align with corresponding electrical terminals defined on the modifiedsubstrate110″. Theelectrical terminals134A′,134B′ and134C′ are electrically connected to separate inputs of thesensor operating circuit40.
• In the embodiment illustrated inFIG. 14, theelectrical terminals114A′,114B′ and114C′ defined on thesubstrate110′ are electrically connected to corresponding ones of theelectrical terminals134A′,134B′ and134C′ defined on thesubstrate133′ using electrical connection structures and techniques including, for example, but not limited to, various soldering techniques, clamping techniques and the like. In any of the embodiments illustrated inFIGS. 12-14, examples of suitable flexible materials that may be used to implement thesubstrates110,110′,110″,133,133′ and133″ in flexible form include, but are not limited to, Melinex® polyester film (e.g., polyethylene terephthalate), other polyesters such as Mylar®, polyvinyl chloride, electrically insulating plastic or polymeric materials such as polycarbonates, polyurethanes, polyethers, polyimides, or copolymers of thermoplastics, such as glycol-modified polyethylene terephthalate, and/or other electrically non-conducting, flexible, deformable materials. Examples of suitable rigid materials that may be used to implement thesubstrates110,110′,110″,133,133′ and133″ in rigid form include, but are not limited to, ceramics, such as aluminum oxide and silicon dioxide, conventional printed circuit boards, conventional multi-layer printed circuit boards, and the like. Combinations of flexible and non-flexible materials are also contemplated.
• In an alternative embodiment, as another example, thetelemetry circuit44 may be mounted to and carried by thesubstrate133 or133′ while theremainder132′ of thesensor control circuitry40,43,44 and/or46 is mounted to and carried by thesubstrate110,110′ or110″. In this embodiment, thetelemetry circuit44 is electrically connected to a remainder of thesensor control circuit132′ that is mounted to thesubstrate110,110′ or110″ using conventional electrical connection structures and techniques of the type just described.
• While the invention has been illustrated and described in detail in the foregoing drawings and description, the same is to be considered as illustrative and not restrictive in character, it being understood that only illustrative embodiments thereof have been shown and described and that all changes and modifications that come within the spirit of the invention are desired to be protected.

Claims (61)

1. A sensor comprising:

a first substrate having a sensing portion configured to be percutaneously inserted into a patient and an extracorporeal circuit mounting portion, the sensing portion defining a sensor thereon and the circuit mounting portion having at least one electrically conductive pad formed thereon that is electrically connected to the sensor, the sensor configured to produce a signal indicative of a condition of the patient,

an anisotropic medium disposed on the circuit mounting portion, the medium configured to be electrically conductive in a direction through the medium and electrically insulating in directions along the medium,

an electrical circuit having at least one electrically conductive terminal, the circuit being mechanically mounted to the circuit mounting portion of the first substrate via the anisotropic medium with the at least one electrically conductive terminal juxtaposed over the at least one electrically conductive pad, the anisotropic medium establishing local electrical contact between the at least one electrically conductive terminal and the at least one electrically conductive pad.

2. The sensor ofclaim 1 wherein the first substrate is one of a flexible substrate and a rigid substrate.

3. The sensor ofclaim 1 wherein the anisotropic medium is an anisotropic adhesive tape, the tape being configured to mechanically bond the electrical circuit to the circuit mounting portion of the first substrate, the tape further being electrically insulating along a plane of the tape and electrically conductive through the tape in a direction generally perpendicular to the plane of the tape.

4. The sensor ofclaim 1 wherein the anisotropic medium is an anisotropic elastomer configured to mechanically bond the circuit to the circuit mounting portion of the first substrate, the anisotropic elastomer being electrically insulating along a plane generally parallel to opposing surfaces of the electrical circuit and the circuit mounting portion of the first substrate, and electrically conductive through the elastomer in a direction generally perpendicular to the plane.

5. The sensor ofclaim 1 wherein the first substrate defines a first number of electrically conductive pads on the circuit mounting portion thereof, and the electrical circuit has a second number of electrical terminals,

and wherein at least some of the second number of electrical terminals align with at least some of the number of electrically conductive pads when the electrical circuit is mounted to the circuit mounting portion of the first substrate.

6. The sensor ofclaim 1 wherein the electrical circuit comprises:

a second substrate defining the at least one electrical terminal, and

a number of electrical components mounted to the second substrate and electrically interconnected to form a sensor control circuit, the sensor control circuit being electrically connected to the at least one electrical terminal.

7. The sensor ofclaim 6 wherein the sensor control circuit includes a sensor operating circuit configured to operate the sensor.

8. The sensor ofclaim 6 wherein the sensor control circuit includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

9. The sensor ofclaim 6 wherein the sensor control circuit includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

10. The sensor ofclaim 9 wherein the sensor control circuit includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

11. The sensor ofclaim 9 wherein the sensor control circuit is configured to determine the predefined event from the signal produced by the sensor.

12. The sensor ofclaim 11 wherein the sensor control circuit further includes a telemetry circuit configured to transmit or receive wireless communication signals to or from a first remote electronic device,

and wherein the first remote electronic device includes a first telemetry circuit configured to transmit or receive wireless communication signals to or from the telemetry system of the sensor control circuit.

13. The sensor ofclaim 12 wherein the telemetry circuit of the sensor control circuit is configured to transmit a wireless signal indicative of the predefined event to the first telemetry circuit of the first remote electronic device,

and wherein the first remote electronic device includes means for providing any of a visual, audible and tactile indication of the predefined event.

14. The sensor ofclaim 12 wherein the first remote electronic device further includes a second telemetry circuit configured to transmit or receive wireless communication signals to or from a second remote electronic device.

15. The sensor ofclaim 12 further including:

a second remote electronic device, and

means for establishing communications between the first and second remote electronic devices.

16. The sensor ofclaim 6 wherein the second substrate is one of a flexible substrate and a rigid substrate.

17. The sensor ofclaim 1 wherein the electrical circuit defines an outer periphery that is contained within an outer periphery of the circuit mounting portion of the first substrate when the electrical circuit is mounted thereto.

18. A sensor comprising:

a first substrate having a sensing portion configured to be percutaneously inserted into a patient and an extracorporeal circuit mounting portion, the sensing portion defining a sensor thereon and the circuit mounting portion having at least one electrically conductive pad defined thereon that is electrically connected to the sensor, the sensor configured to produce a signal indicative of a condition of the patient,

a second substrate mounted to the first substrate and defining therethrough at least one passageway that is aligned with the at least one electrically conductive pad defined on the first substrate,

a third substrate mounted to the second substrate and defining thereon at least one electrical terminal, the at least one electrical terminal being aligned with at least one passageway defined on the second substrate and with the at least one electrically conductive pad defined on the first substrate,

a first number of electrical components mounted to the third substrate and electrically interconnected to form a sensor control circuit, the sensor control circuit being electrically connected to the at least one electrical terminal defined on the third substrate, and

means for establishing electrical contact through the at least one passageway between the at least one electrically conductive pad defined on the first substrate and the at least one electrical terminal defined on the third substrate, the sensor being thereby electrically connected to the sensor control circuit.

19. The sensor ofclaim 18 wherein the sensor control circuit includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

20. The sensor ofclaim 18 wherein the sensor control circuit includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

21. The sensor ofclaim 20 wherein the sensor control circuit includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

22. The sensor ofclaim 20 wherein the sensor control circuit is configured to determine the predefined event from the signal produced by the sensor.

23. The sensor ofclaim 22 wherein the sensor control circuit further includes a telemetry circuit configured to transmit or receive communication signals to or from a first remote electronic device,

and wherein the first remote electronic device includes a first telemetry circuit configured to transmit or receive communication signals to or from the telemetry system of the sensor control circuit.

24. The sensor ofclaim 23 wherein the telemetry circuit of the sensor control circuit is configured to transmit a wireless signal indicative of the predefined event to the first telemetry circuit of the remote electronic device,

and wherein the first remote electronic device includes means for providing any of a visual, audible and tactile indication of the predefined event.

25. The sensor ofclaim 23 wherein the first remote electronic device further includes a second telemetry circuit configured to transmit or receive wireless communication signals to or from a second remote electronic device.

26. The sensor ofclaim 23 further including:

a second remote electronic device, and

means for establishing communications between the first and second remote electronic devices.

27. The sensor ofclaim 18 wherein the first substrate is one of a flexible substrate and a rigid substrate.

28. The sensor ofclaim 18 wherein the second substrate is one of a flexible substrate and a rigid substrate.

29. The sensor ofclaim 18 wherein the third substrate is one of a flexible substrate and a rigid substrate.

30. The sensor ofclaim 18 further including:

a second number of electrical components mounted to the second substrate, the second number of electrical components and the first number of electrical components together forming the sensor control circuit, and

means for electrically connecting the second number of electrical components to the first number of electrical components.

31. The sensor ofclaim 30 wherein the second number of electrical components includes a sensor operating circuit configured to operate the sensor.

32. The sensor ofclaim 30 wherein the second number of electrical components includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

33. The sensor ofclaim 30 wherein the second number of electrical components includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

34. The sensor ofclaim 30 wherein the second number of electrical components includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

35. The sensor ofclaim 30 wherein the second number of electrical components includes a sensor operating circuit configured to operate the sensor,

and wherein the first number of electrical components includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

36. The sensor ofclaim 35 wherein the second number of electrical components includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

37. The sensor ofclaim 35 wherein the second number of electrical components includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

38. The sensor ofclaim 18 wherein the first substrate defines a first number of electrically conductive pads on the circuit mounting portion thereof, the third substrate defines a second number of electrical terminals thereon and the second substrate defines a corresponding second number of passageways therethrough,

and wherein at least some of the second number of electrical terminals align with at least some of the first number of electrically conductive pads through corresponding ones of the second number of passageways defined through the second substrate when the second substrate is mounted to the first substrate and the third substrate is mounted to the second substrate.

39. A sensor comprising:

a first substrate having a sensing portion configured to be percutaneously inserted into a patient and an extracorporeal circuit mounting portion, the sensing portion defining a sensor thereon and the circuit mounting portion having at least one electrically conductive pad defined thereon that is electrically connected to the sensor, the sensor configured to produce a signal indicative of a condition of the patient,

a second substrate mounted to the first substrate and defining thereon a first number of electrically conductive pads, at least one of the first number of electrically conductive pads being aligned with the at least one electrically conductive pad defined on the first substrate and at least another of the first number of electrically conductive pads defined on the second substrate being electrically connected to the at least one of the first number of electrically conductive pads defined on the second substrate

means for establishing electrical contact between the at least one electrically conductive pad defined on the first substrate and the at least one of the first number of electrically conductive pads defined on the second substrate,

a third substrate mounted to the second substrate and defining thereon the at least one electrical terminal,

a first number of electrical components mounted to the third substrate and electrically interconnected to form a sensor control circuit, the sensor control circuit being electrically connected to the at least one electrical terminal defined on the third substrate, and

means for establishing electrical contact between the at least another of the first number of electrically conductive pads defined on the second substrate and the at least one electrical terminal defined on the third substrate, the sensor being thereby electrically connected to the sensor control circuit.

40. The sensor ofclaim 39 wherein the sensor control circuit includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

41. The sensor ofclaim 39 wherein the sensor control circuit includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

42. The sensor ofclaim 41 wherein the sensor control circuit includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

43. The sensor ofclaim 41 wherein the sensor control circuit is configured to determine the predefined event from the signal produced by the sensor.

44. The sensor ofclaim 43 wherein the sensor control circuit further includes a telemetry circuit configured to transmit or receive communication signals to or from a first remote electronic device,

and wherein the first remote electronic device includes a first telemetry circuit configured to transmit or receive communication signals to or from the telemetry system of the sensor control circuit.

45. The sensor ofclaim 44 wherein the telemetry circuit of the sensor control circuit is configured to transmit a signal indicative of the predefined event to the first telemetry circuit of the remote electronic device,

and wherein the first remote electronic device includes means for providing any of a visual, audible and tactile indication of the predefined event.

46. The sensor ofclaim 44 wherein the first remote electronic device further includes a second telemetry circuit configured to transmit or receive wireless communication signals to or from a second remote electronic device.

47. The sensor ofclaim 44 further including:

a second remote electronic device, and

means for establishing communications between the first and second remote electronic devices.

48. The sensor ofclaim 39 wherein the first substrate is one of a flexible substrate and a rigid substrate.

49. The sensor ofclaim 39 wherein the second substrate is one of a flexible substrate and a rigid substrate.

50. The sensor ofclaim 39 wherein the third substrate is one of a flexible substrate and a rigid substrate.

51. The sensor ofclaim 39 further including:

a second number of electrical components mounted to the second substrate, the second number of electrical components and the first number of electrical components together forming the sensor control circuit, and

means for electrically connecting the second number of electrical components to the first number of electrical components.

52. The sensor ofclaim 51 wherein the second number of electrical components includes a sensor operating circuit configured to operate the sensor.

53. The sensor ofclaim 51 wherein the second number of electrical components includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

54. The sensor ofclaim 51 wherein the second number of electrical components includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

55. The sensor ofclaim 51 wherein the second number of electrical components includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

56. The sensor ofclaim 51 wherein the second number of electrical components includes a sensor operating circuit configured to operate the sensor,

and wherein the first number of electrical components includes a telemetry circuit configured to transmit or receive communication signals to or from a remote electronic device.

57. The sensor ofclaim 56 wherein the second number of electrical components includes a notification circuit configured to produce any of a visual, audible and tactile indication of a predefined event.

58. The sensor ofclaim 56 wherein the second number of electrical components includes an acknowledgement circuit responsive to user activation thereof to acknowledge production of the visual, audible or tactile indication of the predefined event.

59. The sensor ofclaim 39 wherein the first substrate defines a second number of electrically conductive pads on the circuit mounting portion thereof,

and wherein at least some of the first number of electrically conductive pads defined on the second substrate align with corresponding ones of the second number of electrically conductive pads defined on the circuit mounting portion of the first substrate when the second substrate is mounted to the first substrate.

60. The sensor ofclaim 59 wherein the third substrate defines a third number of electrical terminals thereon,

and wherein at least others of the first number of electrically conductive pads defined on the second substrate align with corresponding ones of the third number of electrical terminals defined on the third substrate.

61. The sensor ofclaim 59 wherein the third substrate defines a third number of electrical terminals thereon,

and further including means for electrically connecting at least others of the first number of electrically conductive pads defined on the second substrate to corresponding ones of the third number of electrical terminals defined on the third substrate.

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