US20080240178A1 - Method and apparatus for material processing - Google Patents

Abstract

An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit which irradiates an interaction region with laser light, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head includes a containment plenum which confines and removes material from the interaction region. The containment plenum includes a rubber seal which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region, and providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller transmits control signals to the laser base unit in response to user input.

Description

CLAIM OF PRIORITY
• This application is a continuation of U.S. patent application Ser. No. 11/205,290, filed Aug. 16, 2005, which claims the benefit under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application No. 60/601,816, filed Aug. 16, 2004, and which is a continuation-in-part from U.S. patent application Ser. No. 10/803,272 filed Mar. 18, 2004, which is a continuation-in-part from U.S. patent application Ser. No. 10/690,983, filed Oct. 22, 2003, which claims benefit under 35 U.S.C. § 119(e) to U.S. Provisional Patent Application No. 60/456,043, filed Mar. 18, 2003, to U.S. Provisional Patent Application No. 60/471,057, filed May 16, 2003, and to U.S. Provisional Patent Application No. 60/496,460, filed Aug. 20, 2003. Each of U.S. patent application Ser. Nos. 11/205,290, 10/803,272, 10/690,983, and U.S. Provisional Patent Application Nos. 60/601,816, 60/456,043, 60/471,057, and 60/496,460 is incorporated in its entirety by reference herein.
RELATED APPLICATIONS
• This application is related to U.S. patent application Ser. Nos. 10/690,833, 10/690,975, 10/691,481, and 10/691,444, each of which were filed on Oct. 22, 2003 and each of which is incorporated in its entirety by reference herein. This application is also related to U.S. patent application Ser. Nos. 10/803,243 and 10/803,267, both of which were filed on Mar. 18, 2004, and are incorporated in their entireties by reference herein. This application is also related to U.S. patent application Ser. Nos. 11/401,114 and 11/401,116, both of which were filed on Apr. 10, 2006, U.S. patent application Ser. No. 11/653,081, filed Jan. 12, 2007, U.S. patent application Ser. No. 11/363,805, filed Feb. 28, 2006, and U.S. patent application Ser. Nos. 11/861,184 and 11/861,193, both of which were filed Sep. 25, 2007.
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
• This invention was funded, in part, by the Federal Emergency Management Agency as part of the Robert T. Stafford Disaster Relief and Emergency Assistance Act (42 U.S.C. § 5121 et seq.).
BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• The present invention relates to the field of material processing, particularly, to an apparatus and method for drilling, cutting, and surface processing of materials using energy waves.
• 2. Description of the Related Art
• Those in the wide ranging materials processing industries have long recognized the need for non-disruptive material processing. In the past, virtually all material processing, including drilling, cutting, scabbling, and the like have included numerous disruptive aspects (e.g., noise, vibration, dust, vapors, and fumes). Material processing generally includes mechanical technologies such as drilling, hammering, and other power assisted methods, and water jet based technologies. Demonstrative of the problems of material processing, U.S. Pat. No. 5,085,026 is highly illustrative. The '026 device requires mechanical drilling of materials such as concrete or other masonry, and generates all the disruptive aspects noted above.
SUMMARY OF THE INVENTION
• In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit comprising a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises a laser manipulation system. The laser manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure. The laser manipulation system further comprises a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head. The laser manipulation system is adapted to controllably adjust the position of the laser head relative to the structure. The apparatus further comprises a controller electrically coupled to the laser base unit and the laser manipulation system. The controller is adapted to transmit control signals to the laser base unit and to the laser manipulation system in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The apparatus comprises means for generating laser light. The apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure. The apparatus further comprises means for confining the material and removing the material from the interaction region. The apparatus further comprises means for controllably adjusting a position of the interaction region relative to the surface of the structure. The apparatus further comprises means for controlling the laser light and the position of the interaction region in response to user input.
• In certain embodiments, a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The method comprises remotely generating laser light. The method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure. The method further comprises confining the material and removing the material from the interaction region. The method further comprises controllably adjusting a position of the interaction region relative to the surface of the structure. The method further comprises controlling the laser light and the position of the interaction region in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit comprises a generator and a head coupled to the generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises a manipulation system. The manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure. The manipulation system further comprises a positioning mechanism coupled to the anchoring mechanism and coupled to the head. The manipulation system is adapted to controllably adjust the position of the head relative to the structure. The apparatus further comprises a controller electrically coupled to the base unit and the manipulation system. The controller is adapted to transmit control signals to the base unit and to the manipulation system in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit comprising a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further comprises a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The apparatus comprises means for generating laser light. The apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure. The apparatus further comprises means for confining the material and removing the material from the interaction region. The apparatus further comprises means for controlling the laser light in response to user input.
• In certain embodiments, a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The method comprises remotely generating laser light. The method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure. The method further comprises confining the material and removing the material from the interaction region. The method further comprises controlling the laser light in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a base unit adapted to provide energy waves to an interaction region, the energy waves removing material from the structure. The base unit comprises a generator and a head coupled to the generator. The head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further comprises an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the head. The apparatus further comprises a controller electrically coupled to the base unit. The controller is adapted to transmit control signals to the base unit in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure. The apparatus comprises a laser base unit which irradiates an interaction region with laser light, the laser light removing material from the structure. The laser base unit comprises a laser generator and a laser head coupled to the laser generator. The laser head comprises a containment plenum which confines and removes material from the interaction region. The containment plenum comprises a rubber seal which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region and providing reduced disruption to activities within the structure. The apparatus further comprises an anchoring mechanism releasably coupled to the structure and releasably coupled to the laser head. The apparatus further comprises a controller electrically coupled to the laser base unit. The controller transmits control signals to the laser base unit in response to user input.
• In certain embodiments, an apparatus processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The apparatus comprises means for generating laser light. The apparatus further comprises means for providing the laser light to an interaction region of the structure to remove material from the structure. The apparatus further comprises means for confining the material and removing the material from the interaction region. The confining means comprises a rubber seal which substantially surrounds the interaction region. The apparatus further comprises means for controlling the laser light in response to user input.
• In certain embodiments, a method processes a surface of an inhabitable structure with reduced disruption to activities within the structure. The method comprises remotely generating laser light. The method further comprises providing the laser light to the surface, the laser light interacting with the structure in an interaction region to remove material from the structure. The method further comprises confining the material and removing the material from the interaction region. The material is confined by a rubber seal which substantially surrounds the interaction region. The method further comprises controlling the laser light in response to user input.
• For purposes of summarizing the present invention, certain aspects, advantages and novel features of the present invention have been described herein above. It is to be understood, however, that not necessarily all such advantages may be achieved in accordance with any particular embodiment of the present invention. Thus, the present invention may be embodied or carried out in a manner that achieves or optimizes one advantage or group of advantages as taught herein without necessarily achieving other advantages as may be taught or suggested herein.
BRIEF DESCRIPTION OF THE DRAWINGS
• Without limiting the scope of the present invention as claimed below and referring now to the drawings and figures:
• FIG. 1 schematically illustrates an embodiment of an apparatus for processing a surface of a structure;
• FIG. 2 schematically illustrates a laser base unit compatible with embodiments described herein;
• FIG. 3A schematically illustrates a laser head in accordance with embodiments described herein;
• FIGS. 3B and 3C schematically illustrate two alternative embodiments of the laser head;
• FIG. 4 schematically illustrates a cross-sectional view of a containment plenum in accordance with embodiments described herein;
• FIG. 5 schematically illustrates a laser head comprising a sensor adapted to measure the relative distance between the laser head and the interaction region;
• FIGS. 6A and 6B schematically illustrate two opposite elevated perspectives of an embodiment in which the laser manipulation system comprises an anchoring mechanism adapted to be releasably coupled to the structure and a positioning mechanism coupled to the anchoring mechanism and coupled to the laser head;
• FIG. 7 schematically illustrates an embodiment of an attachment interface of the anchoring mechanism;
• FIG. 8 schematically illustrates an exploded view of one embodiment of the positioning mechanism along with the attachment interfaces of the anchoring mechanism;
• FIG. 9 schematically illustrates an embodiment of a first-axis position system;
• FIG. 10 schematically illustrates an embodiment of a second-axis position system;
• FIGS. 11A and 11B schematically illustrate an embodiment of an interface in two alternative configurations;
• FIG. 12 schematically illustrates an embodiment of a laser head receiver;
• FIG. 13 schematically illustrates an embodiment of a support structure coupled to the other components of the apparatus;
• FIG. 14A schematically illustrates an embodiment of a suspension-based support system coupled to the apparatus;
• FIG. 14B schematically illustrates an embodiment of the apparatus comprising suspension-based support connectors;
• FIG. 15 schematically illustrates an embodiment of a controller comprising a control panel, a microprocessor, a laser generator interface, a positioning system interface, a sensor interface, and a user interface;
• FIG. 16 schematically illustrates a control pendant comprising a screen and a plurality of buttons;
• FIG. 17A illustrates an exemplary “MAIN SCREEN” display of the control pendant;
• FIG. 17B illustrates an exemplary “SELECT OPERATION SCREEN” display of the control pendant;
• FIG. 17C illustrates an exemplary “CIRCLE SETUP/OPERATION SCREEN” display of the control pendant;
• FIG. 17D illustrates an exemplary “PIERCE SETUP/OPERATION SCREEN” display of the control pendant;
• FIG. 17E illustrates an exemplary “CUT SETUP/OPERATION SCREEN” display of the control pendant;
• FIG. 17F illustrates an exemplary “SURFACE KEYING SETUP/OPERATION SCREEN” display of the control pendant;
• FIG. 17G illustrates an exemplary “FAULT SCREEN” display of the control pendant;
• FIG. 17H illustrates an exemplary “MAINTENANCE SCREEN” display of the control pendant;
• FIG. 18A schematically illustrates a detector compatible with embodiments described herein;
• FIG. 18B schematically illustrates a computer system adapted to analyze the resulting spectroscopic data;
• FIG. 19 shows a graph of the light spectrum of wavelengths detected upon irradiating concrete with laser light and the light spectrum detected upon irradiating concrete with embedded rebar;
• FIG. 20 schematically illustrates an exemplary compact configuration of a laser head in accordance with embodiments described herein;
• FIGS. 21A-21C schematically illustrate various anchoring mechanisms in accordance with embodiments described herein;
• FIG. 21D illustrates an exemplary compact configuration of a laser head and an anchoring mechanism in accordance with embodiments described herein;
• FIG. 22A schematically illustrates a lightweight configuration of a laser head in accordance with embodiments described herein;
• FIG. 22B illustrates another exemplary lightweight configuration of a laser head and an anchoring mechanism in accordance with embodiments described herein;
• FIG. 22C schematically illustrates a containment plenum coupled to the laser head ofFIG. 22B; and
• FIG. 23 is a flowchart of an exemplary method for determining a spectral ratio in accordance with embodiments described herein.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
• Reducing the disruptive aspects of material processing has long been a goal of those in materials processing industries, particularly in industries that require materials processing within or near occupied structures, such as is common in renovation and many other applications. Such long-felt needs have been particularly prevalent in seismically active areas of the earth, where there is a pressing need for an effective and economical means of retrofitting occupied structures to increase the safety of these structures.
• Prior technologies are plagued by disruptive characteristics, thereby making them virtually unsuitable for retrofitting occupied structures. Additionally, such material processing technologies often present dangerous and costly “cut through” dangers. “Cut through” dangers include instances such as a worker unintentionally cutting an embedded object while drilling through the subject material. For example, a construction worker drilling a hole in an existing concrete wall may accidentally encounter reinforcing steel or rebar, or embedded utilities, such as live electrical conduit and conductors. Such an incident may result in costly damage to tools or the subject material, as well as potentially deadly consequences (e.g., electrocution) for workers. Traditional drilling methods also can include “punch through” dangers of unexpectedly punching through the material drilled and damaging structures or personnel on the opposite side of the material.
• In addition, traditional material processing equipment has been extremely burdensome to operate. Handheld power drilling and hammering devices commonly weigh in excess of fifty pounds and are often required to be held overhead by the operator for extended period of time. Conventional devices also typically produce jarring forces that the operator must absorb while holding the device. Besides the potentially injurious jarring forces, sustained heavy lifting, and “cut through” dangers, the operator and those in the vicinity of the device may be exposed to falling or projectile debris, as well as dust, fumes, vapors, vibration, and noise. This level of noisome activity is unsuitable in general for occupied structures, and is entirely unsuitable for structures used as hospitals, laboratories, and the like, where noise and vibration can be completely unacceptable.
• What continues to be needed but missing from this field of art is a non-disruptive material processing technology that overcomes the drawbacks illustrated above. In certain embodiments described herein, energy waves are directed toward the surface to be processed to overcome some or all of such drawbacks. The energy waves of certain embodiments are electromagnetic waves (e.g., laser light, microwaves), while in other embodiments, they are acoustic waves (e.g., ultrasonic waves). However, in certain embodiments, such cutting units can be as bulky and often are as difficult to maneuver as their mechanical counterparts. The speed at which a laser cuts or drills through concrete can be dependent on the type, size, and concentration of aggregate in the concrete. In addition, lasers can be subject to the same “cut through” dangers as described above, wherein objects hidden within the matrix of the material to be processed can be inadvertently damaged. Lasers can also pose additional dangers of “punch through” with danger to persons or objects in the path of the laser beam. Lasers can also present complexities in removing drilled material from a cut or a drilled hole. In certain embodiments, the laser system would incorporate a remote laser generator communicating with a portable processing head that incorporates numerous non-disruptive and safety features allowing the system to be utilized within or near occupied structures.
• Certain embodiments of the present invention provide fast material processing while addressing many of the shortcomings of prior technologies and allowing for heretofore unavailable benefits (e.g., reduced disruption to activities within the structure). In certain embodiments, the method and apparatus utilize fiber connections between elements such that noisy, bulky, and heavy elements can operate at a significant distance from the actual work area. Certain embodiments are low in both noise and vibration during operation, and effectively remove dust and debris. Certain embodiments include a detection system to reduce the dangers of “cut through” or “punch through.” Certain embodiments enhance worker safety by allowing workers to be located away from the work area during material processing. Certain embodiments are separable into man-portable pieces (e.g., less than 50 pounds) to facilitate transportation to locations in proximity to or within the structure being processed by providing easy and fast portability and set-up.
• Certain embodiments of the present invention provide a method and apparatus for processing fragile structures which may be damaged by conventional processing techniques. For example, using conventional saws for processing concrete grain silos as part of a retrofit or refurbishment process may result in vibrations damaging to other portions of the silo. Using a laser to process the fragile structure can reduce the collateral damage done to the structure during processing. Furthermore, certain embodiments described herein are easily assembled/disassembled, so they can be used in otherwise inaccessible portions of the structures. While embodiments described herein are disclosed in terms of processing man-made structures, in still other embodiments, the present invention can be useful for processing natural formations (e.g., as part of a mining or drilling operation).
• The method and apparatus described herein represent a significant advance in the state of the art. Various embodiments of the apparatus comprise new and novel arrangements of elements and methods that are configured in unique and novel ways and which demonstrate previously unavailable but desirable capabilities. In particular, certain embodiments of the present invention provide a material processing method that is quiet, substantially vibration-free, and less likely to exude dust, debris, or noxious fumes. Additionally, certain embodiments allow a higher rate of material processing than do conventional technologies.
• The detailed description set forth below in connection with the drawings is intended merely as a description of various embodiments of the present invention, and is not intended to represent the only form in which the present invention may be constructed or utilized. The description sets forth illustrated embodiments of the designs, functions, apparatus, and methods of implementing the invention. It is to be understood, however, that the same or equivalent functions and features may be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of the invention.
• FIG. 1 schematically illustrates an embodiment of anapparatus50 for processing a structure having a surface. Theapparatus50 comprises alaser base unit300, alaser manipulation system100, and acontroller500. Thelaser base unit300 is adapted to provide laser light to an interaction region and includes alaser generator310 and alaser head200 coupled to thelaser generator310. Thelaser head200 is adapted to remove the material from the interaction region. Thelaser manipulation system100 includes ananchoring mechanism110 adapted to be releasably coupled to the structure and apositioning mechanism121 coupled to theanchoring mechanism110 and coupled to thelaser head200. Thelaser manipulation system100 is adapted to controllably adjust the position of thelaser head200 relative to the structure. Thecontroller500 is electrically coupled to thelaser base unit300 and thelaser manipulation system100. Thecontroller500 is adapted to transmit control signals to thelaser base unit300 and to thelaser manipulation system100 in response to user input.
• In certain embodiments, thelaser head200 is releasably coupled to thelaser generator310 and is releasably coupled to thepositioning mechanism121. In certain embodiments, thepositioning mechanism121 is releasably coupled to theanchoring mechanism110, and thecontroller500 is releasably coupled to thelaser base unit300 and thelaser manipulation system100. Such embodiments can provide anapparatus50 which can be reversibly assembled and disassembled to facilitate transportation of theapparatus50 to locations in proximity to or within the structure being processed.
Laser Base Unit
• Certain embodiments of thelaser base unit300 are described below. While thelaser base unit300 is described below as comprising separate components, other embodiments can include combinations of two or more of these components in an integral unit.
• Laser Generator
• FIG. 2 schematically illustrates alaser base unit300 compatible with embodiments described herein. In certain embodiments, thelaser base unit300 comprises alaser generator310 and acooling subsystem320. Thelaser generator310 is coupled to a power source (not shown) which provides electrical power of appropriate voltage, phase, and amperage sufficient to power thelaser generator310. The power source can also be portable in certain embodiments, and can operate without cooling water, air, or power from the facility at which theapparatus50 is operating. Exemplary power sources include, but are not limited to, diesel-powered electric generators.
• In certain embodiments, thelaser generator310 preferably comprises an arc-lamp-pumped Nd:YAG laser, but may alternatively comprise a CO₂laser, a diode laser, a diode-pumped Nd:YAG laser, a fiber laser, a disk laser, or other types of laser systems. Thelaser generator310 can be operated in either a pulsed mode or a continuous-wave mode. Oneexemplary laser generator310 in accordance with embodiments described herein includes a Trumpf 4006D, 4000-watt, continuous-wave laser available from Trumpf Lasertechnik GmbH of Ditzingen, Germany. In other exemplary embodiments, a Yb-doped fiber laser or an Er-doped fiber laser can be used. Other types of lasers with other power outputs (e.g., 2000-watt) are compatible with embodiments described herein. Depending on the requirements unique to a given application of the method and apparatus described herein, one skilled in the art will be able to select the optimal laser for the purposes at hand.
• In certain embodiments, thelaser generator310 can be located within a shipping container for ease of transport and storage. Thelaser generator310 generates laser light which is preferably delivered through a glass fiber-optic cable from thelaser generator310 to the work location.
• In certain alternative embodiments, thelaser generator310 comprises a gas-based CO₂laser which generates laser light by the excitation of CO₂gas. Such lasers provide high power output (e.g., ˜100 W-50 kW) at high efficiencies (e.g., ˜5-13%), and are relatively inexpensive. The laser light generated by such gas-based CO₂lasers is typically delivered by mirrors and by using a system of ducts or arms to deliver the laser light around bends or corners.
• In certain alternative embodiments, thelaser generator310 comprises a diode laser. Such diode lasers are compact compared to gas and Nd:YAG lasers so they can be used in a direct delivery configuration (e.g., in close proximity to the work site). Diode lasers provide high power (e.g., ˜10 W-6 kW) at high power efficiencies (e.g., ˜25-40%). In certain embodiments, the laser light from a diode laser can be delivered via optical fiber, but with some corresponding losses of power.
• Embodiments using a Nd:YAG laser can have certain advantages over embodiments with CO₂lasers or diode lasers. There is long industrial experience with Nd:YAG lasers in the materials processing industry and they provide high power (e.g., ˜100 W-6 kW). Additionally, the laser light from a Nd:YAG laser can be delivered by optical fiber with only slight power losses (e.g., ˜12%) through a relatively small and long optical fiber. This permits the staging of thelaser generator310 and support equipment in locations relatively far (e.g., about 100 meters) from the work area. Maintaining thelaser generator310 at a distance from the surface being processed allows the remainder of theapparatus50 to be smaller and more portable.
• Arc-lamp-pumped Nd:YAG lasers use an arc lamp to excite a Nd:YAG crystal to generate laser light. Diode-pumped Nd:YAG lasers use diode lasers to excite the Nd:YAG crystal, resulting in an increase in power efficiency (e.g., 10-25%, as compared to less than 5% for arc-lamp-pumped Nd:YAG lasers). This increased efficiency results in the diode-pumped laser having a better beam quality, and requiring asmaller cooling subsystem320. An exemplary arc-lamp-pumped Nd:YAG laser is available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
• Nd:YAG and other solid state lasers (e.g., Nd:YLiF₄, Ti:Sapphire, Yb:YAG, etc.) compatible with embodiments described herein can be configured and pumped by a number of methods. These methods include, but are not limited to, flash and arc lamps, as well as diode lasers. Various configurations of the solid state media are compatible with embodiments described herein, including, but not limited to, rod, slab, and disk configurations. The advantages of the different configurations and pumping methods will impact various aspects of thelaser generator310, including, but not limited to, the efficiency, the beam quality, and the operational mode of thelaser generator310. For example, disk lasers are based on a diode-pumped wafer or “disk” that uses one of its reflective surfaces as a heat sink. In certain embodiments, such a disk laser permits high power output with low thermal impact, and can provide high efficiency (e.g., 20%) and high quality laser beams which can be injected into small diameter fibers. An exemplary diode-laser-pumped Nd:YAG disk laser is available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
• Fiber lasers use a doped (e.g., doped with ytterbium or erbium) fiber to produce a laser beam. The doped fiber can be pumped by other light sources including, but not limited to, arc lamps and diodes. The fiber laser can be coupled into a delivery fiber which carries the laser beam to the interaction location. In certain embodiments, a fiber laser provides an advantageous efficiency of approximately 15% to approximately 20%. Such high efficiencies make thelaser generator310 more mobile, since they utilize smaller chiller units. In addition, such highefficiency laser generators310 can be located closer to the processing area. An exemplary fiber laser compatible with embodiments described herein is YLR-4000, 4000-watt, continuous-wave (CW) ytterbium: yttrium-aluminum-garnet (Yb: YAG) fiber laser operating at a near-infrared wavelength of approximately 1070 nanometers, available from IPG Photonics of Oxford, Mass.
• Typically, the generation of laser light by thelaser generator310 creates excess heat which is preferably removed from thelaser generator310 by thecooling subsystem320 coupled to thelaser generator310. The amount of cooling needed is determined by the size and type of laser used, but can be about 190 kW of cooling capacity for a 4-kW Nd:YAG laser. Thecooling subsystem320 can utilize excess cooling capability at a job site, such as an existing process water or chilled water cooling subsystem. Alternatively, aunitary cooling subsystem320 dedicated to thelaser generator310 is preferably used.Unitary cooling subsystems320 may be air- or liquid-cooled.
• In certain embodiments, as schematically illustrated inFIG. 2, thecooling subsystem320 comprises aheat exchanger322 and awater chiller324 coupled to thelaser310 to provide sufficient circulatory cooling water to thelaser generator310 to remove the excess heat. Theheat exchanger322 preferably removes a portion of the excess heat from the water, and circulates the water back to thewater chiller324. Thewater chiller324 cools the water to a predetermined temperature and returns the cooling water to thelaser generator310.Exemplary heat exchangers322 andwater coolers324 in accordance with embodiments described herein are available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
• Laser Head
• In certain embodiments, thelaser head200 is coupled to thelaser generator310 and serves as the interface between theapparatus50 and the structure being irradiated. As schematically illustrated byFIG. 1, anenergy conduit400 couples thelaser head200 and thelaser generator310 and facilitates the transmission of energy from thelaser generator310 to thelaser head200. In certain embodiments, theenergy conduit400 comprises an optical fiber which transmits laser light from thelaser generator310 to thelaser head200. In other embodiments, theenergy conduit400 comprises conductors that may include fiber-optic, power, or control wiring cables. Anexemplary energy conduit400 comprises a 50-meter fiber. In certain embodiments, the surface being irradiated is within the inhabitable structure. As described more fully below, certain embodiments provide a relatively small, compact, and lightweight apparatus which can be transported to various places within the inhabitable structure and can be used within relatively small and enclosed spaces within the inhabitable structure.
• FIG. 3A schematically illustrates alaser head200 in accordance with embodiments described herein. Thelaser head200 comprises aconnector210, at least oneoptical element220, ahousing230, and acontainment plenum240. In certain embodiments, theconnector210 is coupled to thehousing230, is optically coupled to thelaser generator310 via theenergy conduit400, and is adapted to transmit laser light from thelaser generator310. Theoptical element220 can be located within theconnector210, thehousing230, or thecontainment plenum240.FIG. 3A illustrates an embodiment in which theoptical element220 is within thehousing230. In embodiments in which theconduit400 provides laser light to thelaser head200, the laser light is transmitted through theoptical element220 prior to impinging on the structure being irradiated.
• Laser Head: Extended Configuration
• FIG. 3B schematically illustrates one configuration of alaser head200 in accordance with embodiments described herein. Thehousing230 comprises adistal portion232, anangle portion234, and aproximal portion236. As used herein, the terms “distal” and “proximal” have their standard definitions, referring generally to the position of the portion relative to the interaction region. Theconnector210 is coupled to thedistal portion232, which is coupled to theangle portion234, which is coupled to theproximal portion236, which is coupled to thecontainment plenum240. Configurations such as that illustrated byFIG. 3B can be used for drilling and scabbling the surface of the structure (e.g., concrete wall). Various components of thelaser head200 are available from Laser Mechanisms, Inc. of Farmington Hills, Mich.
• In certain embodiments in which theenergy conduit400 comprises an optical fiber, theconnector210 receives laser light transmitted from thelaser generator310 through the optical fiber to thelaser head200. In certain such embodiments, theconnector210 comprises alens212 which collimates the diverging laser light emitted by theconduit400. Thelens212 can comprise various materials which are transmissive and will refract the laser light in a desired amount. Such materials include, but are not limited to, borosilicate crown glass (BK7), quartz (SiO₂), zinc selenide (ZnSe), and sodium chloride (NaCl). The material of thelens212 can be selected based on the quality, cost, and stability of the material. Borosilicate crown glass is commonly used for transmissive optics with Nd:YAG lasers, and zinc selenide is commonly used for transmissive optics with CO₂lasers.
• Thelens212 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of thelens212. In addition, the mounting of thelens212 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, thelens212 can provide additional modification of the beam profile (e.g., focussing, beam shape).
• The collimated laser light of certain embodiments is then transmitted through thelaser head200 via other optical elements within thelaser head200. In certain embodiments, thedistal portion232 comprises a generally straight first tube through which laser light propagates to theangle portion234, and theproximal portion236 comprises a generally straight second tube through which the laser light from theangle portion234 propagates. In certain embodiments, thedistal portion232 contains alens233, and theangle portion234 contains amirror235 which directs the light through theproximal portion236 and thecontainment plenum240 onto the structure. In other embodiments, other devices (e.g., a prism) can be used in theangle portion234 to direct the light through theproximal portion236 and thecontainment plenum240 onto the structure.
• Thelens233 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of thelens233. In addition, the mounting of thelens233 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, thelens233 focuses the light received from thelens212, while in other embodiments, thelens233 can provide additional modification of the beam profile (e.g., beam shape).Exemplary lenses233 include, but are not limited to, a 600-mm focal length silica plano-convex lens (e.g., Part No. PLCX-50.8-309.1-UV-1064 available from CV1 Laser Corp. of Albuquerque, N. Mex.). Thelens233 can comprise various materials which are transmissive and will refract the laser light in a desired amount. Such materials include, but are not limited to, borosilicate crown glass, quartz, zinc selenide, and sodium chloride. Exemplary lens mounting assemblies include, but are not limited to, Part Nos. PLALH0097 and PLFLH0119 available from Laser Mechanisms, Inc. of Farmington Hills, Mich.
• In the embodiment schematically illustrated byFIG. 3B in which thedistal portion232 is substantially perpendicular to theproximal portion236, themirror235 reflects the light through an angle of approximately 90 degrees. Other embodiments are configured to reflect the light through other angles. Themirror235 can be mounted on a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of themirror235. In addition, the mounting of themirror235 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, themirror235 can also have a curvature or otherwise be configured so as to focus the light beam or otherwise modify the beam profile (e.g., beam shape).Exemplary mirrors235 include, but are not limited to, metal mirrors such as copper mirrors (e.g., Part Nos. PLTRG19 and PLTRC0024 from Laser Mechanisms, Inc. of Farmington Hills, Mich.), and gold-coated copper mirrors (e.g., Part No. PLTRC0100 from Laser Mechanisms, Inc.). In other embodiments, dielectric-coated mirrors can be used.
• FIG. 3C schematically illustrates another configuration of alaser head200 in accordance with embodiments described herein. Thehousing230 comprises thedistal portion232, afirst angle portion234, asecond angle portion234′, and theproximal portion236. Theconnector210 is coupled to thedistal portion232, which is coupled to thefirst angle portion234, which is coupled to thesecond angle portion234′, which is coupled to theproximal portion236, which is coupled to thecontainment plenum240. Configurations such as that illustrated byFIG. 3C can be used for cutting the structure in spatially constrained regions (e.g., cutting off portions of a concrete wall near a corner or protrusion).
• As described above, in certain embodiments, theconnector210 comprises alens212 and thedistal portion232 is tubular and contains alens233. Thefirst angle portion234 of the embodiment illustrated byFIG. 3C contains afirst mirror235 which directs the light to thesecond angle portion234′ which contains asecond mirror235′. Thesecond mirror235′ directs the light through theproximal portion236, which can be tubular, and through thecontainment plenum240 onto the structure. In certain embodiments, as described more fully below with respect to thecontainment plenum240, the light is transmitted through awindow243 and anozzle244 to the interaction region. In certain embodiments, thelaser head200 comprises thewindow243 and thenozzle244, while in other embodiments, thewindow243 and thenozzle244 are components of thecontainment plenum240.
• In the embodiment schematically illustrated byFIG. 3C, thefirst mirror235 reflects the light through an angle of approximately 90 degrees and thesecond mirror235′ reflects the light through an angle of approximately −90 degrees such that theproximal portion236 is substantially parallel to thedistal portion232. In such embodiments, the light emitted by thecontainment plenum240 is substantially parallel to, but displaced from, the light propagating through thedistal portion232. Other embodiments have thefirst mirror235 and thesecond mirror235′ configured to reflect the light through other angles. Certain embodiments comprise a straight tubular portion between thefirst angle portion234 and thesecond angle portion234′ to provide additional displacement of the light emitted by thecontainment plenum240 from the light propagating through thedistal portion232.
• In certain embodiments, the coupling between thedistal portion232 and thefirst angle portion234 is rotatable. In certain other embodiments, the coupling between thefirst angle portion234 and thesecond angle portion234′ is rotatable. These rotatable couplings can comprise swivel joints which can be locked in position by thumbscrews. Such embodiments provide additional flexibility in directing the light emitted by thecontainment plenum240 in a selected direction. In certain embodiments, the selected direction is non-planar with the light propagating through thedistal portion232.
• As described above, one or both of thefirst mirror235 and thesecond mirror235′ can be mounted on a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement. In addition, the mountings of thefirst mirror235 and/or thesecond mirror235′ can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. In certain embodiments, one or both of thefirst mirror235 and thesecond mirror235′ can also have a curvature or otherwise be configured so as to focus the light beam or otherwise modify the beam profile (e.g., beam shape).
• In certain embodiments, one or more of theoptical elements220 within the laser head200 (e.g.,lens212,lens233,mirror235,mirror235′) are water-cooled or air-cooled. Cooling water can be supplied by a heat exchanger located near thelaser head200 and dedicated to providing sufficient water flow to thelaser head200. In certain such embodiments, the conduits for the cooling water for each of theoptical elements220 can be connected in series so that the cooling water flows sequentially in proximity to theoptical elements220. In other embodiments, the conduits are connected in parallel so that separate portions of the cooling water flow in proximity to the variousoptical elements220. Exemplary heat exchangers include, but are not limited to a Miller Coolmate™ 4, available from Miller Electric Manufacturing Co. of Appleton, Wis. The flow rate of the cooling water is preferably at least approximately 0.5 gallons per minute.
• Laser Head: Compact Configuration
• FIGS.20 and21A-21C schematically illustrate other configurations of alaser head1200 in accordance with embodiments described herein.FIG. 21D illustrates an exemplary compact configuration of alaser head1200 and ananchoring mechanism1110 in accordance with embodiments described herein. Certain embodiments of thelaser head1200 are adapted to be movable and placed in position relative to the surface to be irradiated by a single person. In certain such embodiments, the combination of thelaser head1200 and certain embodiments of theanchoring mechanism1110, discussed below, weighs less than fifty pounds. Certain such embodiments are advantageously used to drill holes in concrete up to approximately nine-and-one-half inches in depth.
• The embodiment illustrated byFIG. 20 is generally adapted for drilling holes in the surface to be irradiated, and is generally of smaller size and weight than the embodiments ofFIGS. 3B and 3C, thereby providing an apparatus which is adapted to access more constrained spaces. In addition, the embodiment ofFIG. 20 is generally more simple and more robust than the embodiments ofFIGS. 3B and 3C, thereby providing an apparatus which is adapted to withstand rough handling and non-ideal operating conditions.
• Thelaser head1200 in certain embodiments comprises a generallyrectangular housing1230. The other components of thelaser head1200 are positioned on thehousing1230 or within thehousing1230. Thehousing1230 of certain embodiments comprises a connection structure (not shown) which is adapted to be releasably coupled to ananchoring mechanism1110 which, as described further below, is adapted to position thelaser head1200 relative to the surface to be irradiated. In an exemplary embodiment, thehousing1230 has a length of approximately 12 inches, a height of approximately 8 inches, and a width of approximately 4 inches. Other shapes and dimensions of thehousing1230 are compatible with embodiments described herein.
• In certain embodiments, thelaser head1200 further comprises aconnector1210 which is adapted to be coupled to theconduit400 carrying laser light from thelaser generator310 to thelaser head1200. In certain embodiments, theconnector1210 comprises a lens (not shown) which collimates the diverging laser light emitted by theconduit400. In an exemplary embodiment, the lens has a focal length of approximately 23.6 inches (approximately 600 millimeters) and is located in an adjustable lens drawer. As described above in relation to the extended configuration, the lens of various embodiments can comprise various materials, can be removably mounted to thehousing1230, can be adjustably mounted to thehousing1230, and can provide additional modification of the beam profile.
• In certain embodiments, thelaser head1200 further comprises afirst mirror1235 adapted to reflect light from theconnector1210 through a first non-zero angle, and asecond mirror1235′ adapted to reflect light from thefirst mirror1235 through a second non-zero angle to anozzle1244 which is adapted to be coupled to thecontainment plenum240. In certain embodiments, as schematically illustrated inFIG. 20, the first non-zero angle is approximately equal to the negative of the second non-zero angle. Such two-mirror configurations are sometimes called “folded optics” configurations since reflecting the light between the mirrors effectively “folds” a propagation path having a length into a smaller space. Certain embodiments of thelaser head1200 comprise additional optical components adapted to modify the beam profile of the laser light.
• As described above in relation to the extended configuration, at least one of thefirst mirror1235 and thesecond mirror1235′ is mounted in thehousing1230 on a removable and adjustable assembly. In addition, at least one of thefirst mirror1235 and thesecond mirror1235′ of certain embodiments has a curvature or is otherwise configured to modify the beam profile. At least one of thefirst mirror1235 and thesecond mirror1235′ of certain embodiments is cooled by either air or water provided by cooling conduits. For example, in certain embodiments, water flow is provided to thelaser head1200 at a rate of at least approximately 0.5 gallons per minute. In certain embodiments, the cooling conduits are contained within thehousing1230, thereby facilitating transport and placement of thelaser head1200 by making thelaser head1200 less unwieldy and making thelaser head1200 more robust. Thelaser head1200 of certain embodiments further comprises anelectrical connector1215 which can be coupled to an electrical cord to supply power to thelaser head1200 and/or to provide sensor signals from thelaser head1200 to thecontroller500. In certain embodiments, thelaser head1200 further comprises one ormore status lights1217 which provide information regarding the status of thelaser head1200.
• In certain embodiments, as shown inFIGS. 21C and 21D, thelaser head1200 comprises alaser head handle1240 coupled to thehousing1230. Thelaser head handle1240 is adapted to facilitate transporting and positioning thelaser head1200 at a selected location. Other configurations of thelaser head handle1240 are compatible with other embodiments described herein. Thelaser head1200 of certain embodiments further comprises acoupler1250 adapted to releasably couple thelaser head1200 to theanchoring mechanism1110. Other configurations of thelaser head1200 are compatible with embodiments described herein.
• In certain embodiments, the compact configuration of the laser head (“compact laser head”)1200, such as shown inFIGS. 21A-21D, is advantageously used in certain applications rather than the extended configuration of the laser head (“extended laser head”)200 as shown inFIGS. 3B and 3C. For example, when drilling holes in the structure, there may be areas in which theextended laser head200 may not have access due to its length or other constraints (e.g., rigidity of the coupling between theenergy conduit400 and the connector210). Thecompact laser head1200 has a smaller volume, thereby allowing access to smaller areas.
• In addition, in certain embodiments, thecompact laser head1200 is used in conjunction with anenergy conduit400 comprising a pivotingcollimator head1250 adapted to provide a rotational coupling between theenergy conduit400 and theconnector1210 of thelaser head1200. In such embodiments, the pivoting collimator head provides additional flexibility by allowing thelaser head1200 to access smaller areas. The collimator head can be straight such that theenergy conduit400 points along the same direction in which laser light enters thelaser head1200, or can have an angle (e.g., 90 degrees) such that theenergy conduit400 points along a different direction, as illustrated inFIG. 21D. Using collimator heads with different orientations advantageously permits various orientations of theenergy conduit400 for providing access to constrained areas. Exemplary collimator heads compatible with embodiments described herein are available from Trumpf Lasertechnik GmbH of Ditzingen, Germany.
• Furthermore, in certain embodiments, thecompact laser head1200 also incorporates the various sensors, proximity switches, and flow meters of thelaser head1200 within thehousing1230. For example, thelaser head1200 can comprise one or more sensors which determine one or more of the following: whether thelaser head1200 is in contact with a surface of the inhabitable structure, whether thelaser head1200 is coupled to theanchoring mechanism1110, and whether thelaser generator310 is on or starting. Such embodiments are generally more simple and more robust than theextended laser head200, thereby providing an apparatus which is adapted to withstand rough handling and non-ideal operating conditions, and is less likely to be damaged.
• Laser Head Lightweight Configuration
• FIG. 22A schematically illustrates alightweight laser head2200 with ananchoring mechanism1110.FIG. 22B illustrates another exemplarylightweight laser head2200 andanchoring mechanism1110. As shown inFIG. 22B, thelightweight laser head2200 comprises aconnector2210 through which laser light is transmitted into thelaser head2200. Thelaser head2200 of certain embodiments further comprises anelectrical connector2215 which can be coupled to an electrical cord to supply power to thelaser head2200 and/or to provide sensor signals from thelaser head2200 to thecontroller500. In certain embodiments, thelaser head2200 further comprises one ormore status lights2217 which provide information regarding the status of thelaser head2200. In certain embodiments, thelaser head2200 is coupled to coolinglines2218 which can provide cooling water to the mirrors, lenses, or other optical elements within thelaser head2200.
• FIG. 22C illustrates acontainment plenum240 coupled to thelaser head2200 ofFIG. 22B. Thecontainment plenum240 comprises aplenum housing242 and aresilient interface246 configured to contact the surface being irradiated. In certain embodiments, thecontainment plenum240 is removable from and/or adjustable along thelaser head2200 to facilitate positioning of thelaser head2200 and thecontainment plenum240 for laser irradiation of the surface.
• In certain embodiments, thelaser head2200 has a 140-millimeter focal length and is commercially available, e.g., a D35 90-degree focus head with cooling and observation port available from Trumpf Lasertechnik GmbH of Ditzingen, Germany (Catalog No. 35902090). Thelaser head2200 of certain embodiments is adapted for drilling relatively shallow holes (e.g., up to approximately 65 millimeters in depth) with a diameter of approximately six millimeters. In certain embodiments, the laser head/anchoring mechanism combination weighs less than 10 pounds, while in other embodiments, the combination weighs approximately 8 pounds. In certain embodiments, thelaser head2200 comprises one or more sensors, proximity switches, or flow meters as described above.
• Laser Head: Containment Plenum
• In certain embodiments, thelaser head200 comprises acontainment plenum240 coupled to theproximal portion236 and which interfaces with the structure. In certain embodiments, thecontainment plenum240 is adapted to confine material (e.g., debris and fumes generated during laser processing) removed from the structure and remove the material from the interaction region. Thecontainment plenum240 can also be further adapted to reduce noise and light emitted from the interaction region out of the containment plenum240 (e.g., into the nominal hazard zone (“NHZ”) of the laser). One goal of thecontainment plenum240 can be to ensure that no laser radiation in excess of the accessible emission limit (“AEL”) or maximum-permissible exposure (“MPE”) limit reaches the eye or skin of any personnel.
• FIG. 4 schematically illustrates a cross-sectional view of acontainment plenum240 in accordance with embodiments described herein. Thecontainment plenum240 ofFIG. 4 comprises aplenum housing242, awindow243, anozzle244, aresilient interface246, anextraction port248, and acompressed gas inlet249. Theplenum housing242 can be coupled to a source of laser light (e.g., theproximal portion236 of the laser head200) and can provide structural support for the other components of thecontainment plenum240. Exemplary materials for theplenum housing242 include, but are not limited to, metals (e.g., aluminum, steel) which can be in the form of thin flexible sheets, ceramic materials, glass or graphite fibers, and fabric made from glass or graphite fibers. In certain embodiments, theplenum housing242 is either air-cooled or water-cooled to reduce heating of theplenum housing242. Coolant conduits for theplenum housing242 can be coupled in series or in parallel with the coolant conduits for other components of thelaser head200.
• Thewindow243 of certain embodiments is positioned upstream of thenozzle244 and within the propagation path of the laser light from theproximal portion236 to the structure. As used herein, the terms “downstream” and “upstream” have their ordinary meanings referring to the propagation direction of the laser light and to the direction opposite to the propagation direction of the laser light, respectively. In such embodiments, the light propagating through thecontainment plenum240 reaches thewindow243 prior to reaching thenozzle244. In such embodiments in which the light propagates downstream through thewindow243, thewindow243 is substantially transparent to the laser light. Thewindow243 can be mounted within theplenum housing242 to transmit the laser light in the downstream direction. Thewindow243 can have a number of shapes, including, but not limited to, square and circular.Exemplary windows243 include, but are not limited to, a silica window (e.g., Part No. W2-PW-2037-UV-1064-0 available from CVI Laser Corp. of Albuquerque, N. Mex.).
• Dust and/or dirt on the optical elements of thelaser head200 can absorb an appreciable fraction of the laser light, resulting in nonuniform heating which can damage the optical elements. In certain embodiments, thewindow243 is mounted within theplenum housing242 to provide a barrier to the upstream transport of dust, smoke, or other particulate matter generated by the interaction of the laser light and the structure. In this way, thewindow243 can facilitate protection of the upstream optical elements within the other portions of thelaser head200.
• Thewindow243 can be mounted in a removable assembly in certain embodiments to facilitate cleaning, maintenance, and replacement of thewindow243. In certain embodiments, thewindow243 focuses the light received from theproximal portion236, while in other embodiments, thewindow243 can provide additional modification of the beam profile (e.g., beam shape). In such embodiments, the mounting of thewindow243 can be adjustable (e.g., using thumbscrews or Allen hex screws) so as to optimize the alignment and focus of the light beam. Exemplary window mounting assemblies include, but are not limited to, Part Nos. PLALH0097 and PLFLH0119 available from Laser Mechanisms, Inc. of Farmington Hills, Mich. In certain embodiments, thewindow243 is either air-cooled or water-cooled.
• The laser light transmitted through thewindow243 is emitted through thenozzle244 towards the interaction region of the structure. The laser light can be focussed near the opening of thenozzle244. Exemplary materials for thenozzle244 include, but are not limited to metals (e.g., copper). In certain embodiments, thenozzle244 is either air-cooled or water-cooled to reduce heating of thenozzle244. Coolant conduits for thenozzle244 can be coupled in series or in parallel with the coolant conduits for other components of thelaser head200.
• The laser light propagating through thenozzle244 preferably does not impinge the nozzle244 (termed “clipping”) to avoid excessively heating and damaging thenozzle244. Improper alignment of the laser light through thelaser head200 can cause clipping. The opening of thenozzle244 can be sufficiently large so that the laser light does not appreciably interact with thenozzle244. In certain embodiments, thenozzle244 is approximately 0.3 inches in diameter.
• In certain embodiments, theresilient interface246 of thecontainment plenum240 is adapted to contact the structure and to substantially surround the interaction region, thereby facilitating confinement and removal of material from the interaction region. In addition, theresilient interface246 can facilitate blocking light and/or sound from escaping outside thecontainment plenum240. Exemplaryresilient interfaces246 include, but are not limited to, a wire brush or a rubber seal (e.g., a bulb seal). The wire brush comprises a metal material which can withstand exposure to the heat, light, molten materials, and other environmental aspects of the interaction region. The rubber seal comprises a rubber material which can withstand exposure to the heat, light, molten materials, and other environmental aspects of the interaction region. In view of the disclosure herein, persons skilled in the art are able to select appropriate materials for theresilient interface246 in accordance with embodiments described herein.
• In certain embodiments, theextraction port248 of thecontainment plenum240 is adapted to extract an appreciable portion of the material (e.g., gas, vapor, dust, and debris) generated within the interaction region during operation. Theextraction port248 can be coupled to a vacuum generator (not shown) which creates a vacuum to pull material (e.g., airborne particulates, gases, and vapors) from the interaction region. In this way, theextraction port248 can provide a pathway for removal of the material from thecontainment plenum240.
• In certain embodiments, the compressedgas inlet249 is adapted to provide compressed gas (e.g., air) to thecontainment plenum240. In certain embodiments, the compressedgas inlet249 is fluidly coupled to thenozzle244 which is adapted to direct a compressed gas stream to the interaction region. In certain embodiments, compressed gas flows coaxially with the laser light through thenozzle244. Thewindow243 of certain embodiments provides a surface against which the compressed gas exerts pressure. In this way, the compressed gas can flow through thenozzle244 to the interaction region at a selected pressure and velocity.
• The compressed gas flowing from the compressedgas inlet249 through thenozzle244 can be used to deter dust, debris, smoke, and other particulate matter from entering thenozzle244. In this way, the compressed gas can facilitate protection of thewindow243 from such particulate matter. In addition, the compressed gas can be directed by thenozzle244 to the interaction region so as to facilitate removal of material from the interaction region and/or to cool the interaction region. Thenozzle244 can be used in this manner in embodiments in which the structure includes concrete with a high percentage of Si, so that the resultant glassy slag is sufficiently viscous and more difficult to remove from the interaction region.
• In certain embodiments, the compressed air is substantially free of oil, moisture, or other contaminants to avoid contaminating the surface of thewindow243 and potentially damaging thewindow243 by nonuniform heating. An exemplary source of instrument quality (“IQ”) compressed air is the 300-IQ air compressor available from Ingersoll-Rand Air Solutions Group of Davidson, N.C. The source of compressed air preferably provides air at a sufficient flow rate determined in part by the length of the hose delivering the air, and the number of components using the air and their requirements.
• In certain embodiments, the air compressor can be located hundreds of feet away from thelaser head200. In such embodiments, the source of compressed air can comprise an air dryer to reduce the amount of moisture condensing in the air conduits or hoses between the air compressor and thelaser head200. An exemplary air dryer in accordance with embodiments described herein is the 400 HSB air dryer available from Zeks Compressed Air Solutions of West Chester, Pa.
• In certain embodiments, as schematically illustrated inFIG. 5, thelaser head200 comprises asensor250 adapted to measure the relative distance between thelaser head200 and the interaction region.FIG. 5 schematically illustrates an embodiment in which thecontainment plenum240 comprises thesensor250, although other locations of thesensor250 are also compatible with embodiments described herein. As material is removed from the structure, the interaction region extends into the structure. Thesensor250 then provides a measure of the depth of the interaction region from the surface of the structure. Thesensor250 can use various technologies to determine this distance, including, but not limited to, acoustic sensors, infrared sensors, tactile sensors, and imaging sensors. In certain embodiments in which laser scabbling or machining is performed, asensor250 comprising a diode laser and utilizing triangulation could be used to determine the distance between thelaser head200 and the surface being processed. Such asensor250 can also provide a measure of the amount of material removed from the surface.
• In certain embodiments, thesensor250 is coupled to thecontroller500, and thecontroller500 is adapted to transmit control signals to thelaser base unit300 in response to signals from thesensor250. Thelaser base unit300 can be adapted to adjust one or more parameters of the laser light in response to the control signals. In this way, the depth information from thesensor250 can be used in real-time to adjust the focus or other parameters of the laser light.
• In other embodiments, thecontroller500 is adapted to transmit control signals to thelaser manipulation system100 in response to signals from thesensor250. Thelaser manipulation system100 is adapted to adjust the relative distance between thelaser head200 and the interaction region in response to the control signals. In addition, thelaser manipulation system100 can be adapted to adjust the position of thelaser head200 along the surface of the structure in response to the control signals. In this way, the depth information from thesensor250 at a first location can be used in real-time to move the laser light to another location along the surface once a desired depth at the first location is achieved.
• In other embodiments, thesensor250 is used in conjunction with statistical methods to determine the depth of the interaction region. In such embodiments, thesensor250 is first used in a measurement phase to develop statistical data which correlates penetration depths with certain processing parameters (e.g., material being processed, light intensity). During the measurement phase, selected processing parameters are systematically varied for processing a test or sample surfaces indicative of the surfaces of the structure to be processed. Thesensor250 is used in the measurement phase to determine the depth of the interaction region corresponding to these processing parameters. In certain such embodiments, thesensor250 can be separate from thelaser head200, and can be used during the processing of the structure or during periods when the processing has been temporarily halted in order to measure the depth of the interaction region.Exemplary sensors250 compatible with such embodiments include, but are not limited to, calipers or other manual measuring devices which are inserted into the resultant hole to determine the depth of the interaction region.
• In certain embodiments, thecontroller500 contains this resulting statistical data regarding the correlation between the processing parameters and the depth of the interaction region. During a subsequent processing phase, the structure is processed, but rather than using thesensor250 at this time, thecontroller500 can be adapted to determine the relative distance by accessing the statistical data corresponding to the particular processing parameters being used. Such an approach represents a reliable and cost-effective approach for determining the depth of the interaction region while processing the structure.
• In alternative embodiments, thesensor250 is adapted to provide a measure of the distance between thelaser head200 and the surface of the structure. In such embodiments, thesensor250 can be adapted to provide a fail condition signal to thecontroller500 upon detection of the relative distance between thelaser head200 and the structure exceeding a predetermined distance. Such a fail condition may result from theapparatus50 inadvertently becoming detached from the structure. Thecontroller500 can be adapted to respond to the fail condition signal by sending appropriate signals to thelaser base unit300 to halt the transmission of energy between thelaser base unit300 and thelaser head200. In certain embodiments, the transmission is preferably halted when thelaser head200 is further than one centimeter from the surface of the structure. In this way, theapparatus50 can utilize thesensor250 to insure that laser light is not emitted unless thecontainment plenum240 is in contact with the structure. In certain embodiments, thesensor250 comprises a proximity switch which contacts the surface of the structure while theapparatus50 is attached to the structure.
Laser Manipulation System (LMS)LMS: Combined Anchoring Mechanism and Positioning Mechanism
• In certain embodiments, thelaser manipulation system100 serves to accurately and repeatedly position thelaser head200 in relation to the structure so as to provide articulated robotic motion generally parallel to the surface to be processed. To do so, thelaser manipulation system100 can be releasably affixed to the structure to be processed, and can then accurately move thelaser head200 in proximity to that surface.FIGS. 6A and 6B schematically illustrate two opposite elevated perspectives of an embodiment in which thelaser manipulation system100 comprises ananchoring mechanism110 adapted to be releasably coupled to the structure and apositioning mechanism121 coupled to theanchoring mechanism110 and coupled to thelaser head200. In certain embodiments, thelaser manipulation system100 can be advantageously disassembled and reassembled for transport, storage, or maintenance.
• Anchoring Mechanism
• Certain embodiments of thelaser manipulation system100 comprise ananchoring mechanism110 to releasably affix thelaser manipulation system100 to the structure to be processed. Theanchoring mechanism110 can be adapted to be releasably coupled to the structure and can comprise one or more attachment interfaces111.
• In certain embodiments, theanchoring mechanism110 is releasably coupled to a surface within the inhabitable structure. Certain such embodiments advantageously allow the apparatus to be used to process a surface within the inhabitable structure. In certain embodiments, theanchoring mechanism110 is releasably coupled to the surface being irradiated by laser light. Certain such embodiments advantageously allow the apparatus to be used in relatively small, enclosed spaces within or external to the inhabitable structure.
• In the embodiment schematically illustrated inFIG. 6B, theanchoring mechanism110 comprises a pair of attachment interfaces111. Eachattachment interface111 comprises at least oneresilient vacuum pad112, at least oneinterface mounting device114, at least onevacuum conduit116, at least one mountingconnector118, and acoupler119 adapted to couple theattachment interface111 of theanchoring mechanism110 to thepositioning mechanism121. While the embodiment schematically illustrated inFIGS. 6A and 6B have twovacuum pads112 for each of the twoattachment interfaces111, other embodiments utilize any configuration or number of attachment interfaces111 andvacuum pads112.
• In the embodiment illustrated byFIG. 7, twovacuum pads112 are coupled to theinterface mounting device114. In certain embodiments, eachvacuum pad112 comprises a circular rubber pad which forms an effectively air-tight region when placed on the structure. Eachvacuum pad112 is fluidly coupled to at least one vacuum generator (not shown) via a vacuum conduit116 (e.g., a flexible hose). The vacuum generator may use fluid power (e.g., compressed air) to generate the vacuum, or it may use an external vacuum source. The vacuum generator draws air out from the air-tight region between thevacuum pad112 and the structure via thevacuum conduit116, thereby creating a vacuum within the air-tight region. Atmospheric pressure provides a force which reversibly affixes thevacuum pad112 to the structure.
• Theinterface mounting device114 comprises a rigid metal support upon which is mounted thevacuum pads112, the mountingconnector118, and thecoupler119. In certain embodiments, the mountingconnector118 can comprise a ground-basedsupport connector118aadapted to be releasably attached to a ground-basedsupport system700, as described more fully below. In other embodiments, the mountingconnector118 can comprise at least one suspension-basedsupport connector118badapted to be releasably attached to a suspension-basedsupport system800, as described more fully below. Thecoupler119 is adapted to releasably couple theinterface mounting device114 to thepositioning mechanism121. In certain embodiments, thecoupler119 comprises at least one protrusion which is connectable to at least one corresponding recess in thepositioning mechanism121.
• In alternative embodiments, theanchoring mechanism110 can comprise other technologies for anchoring theapparatus50 to the structure to be processed. These other technologies include, but are not limited to, a winch, suction devices (e.g., cups, gekkomats, or skirts) affixed to theapparatus50 or on quasi-tank treads, mobile scaffolding suspended from the structure, and a rigid ladder. These technologies can also be used in combination with one another in certain embodiments of theanchoring mechanism110.
• Positioning Mechanism
• Certain embodiments of thelaser manipulation system100 comprise apositioning mechanism121 to accurately move thelaser head200 while in proximity to the structure to be processed.FIG. 8 schematically illustrates an exploded view of one embodiment of thepositioning mechanism121 along with the attachment interfaces111 of theanchoring mechanism110. Thepositioning mechanism121 ofFIG. 8 comprises a first-axis position system130, a second-axis position system150, aninterface140, and alaser head receiver220. The first-axis position system130 is releasably coupled to the attachment interfaces111 of theanchoring mechanism110 by at least onecoupler132. The interface140 (comprising afirst piece140aand asecond piece140bin the embodiment ofFIG. 8) releasably couples the second-axis position system150 to the first-axis position system130. Thelaser head receiver220 is releasably coupled to the second-axis position system150, and is adapted to be releasably coupled to thehousing230 of thelaser head200.
• In certain embodiments, the first-axis position system130 comprises at least onecoupler132 having a recess which is releasably connectable to at least one corresponding protrusion of thecoupler119 of theanchoring mechanism110. Such embodiments are advantageously disassembled and reassembled for transport, storage, or maintenance of thepositioning mechanism121. Other embodiments can have the first-axis position system130 fixedly coupled to theanchoring mechanism110.
• In certain embodiments, the first-axis position system130 moves thelaser head200 in a first direction substantially parallel to the surface of the structure. In the embodiment schematically illustrated byFIG. 9, the first-axis position system130 further comprises afirst rail134, afirst drive136, and afirst stage138. Thefirst stage138 is movably coupled to thefirst rail134 under the influence of thefirst drive136. Thefirst piece140aof theinterface140 is fixedly coupled to thefirst stage138 so that thefirst drive136 can be used to move theinterface140 along thefirst rail134. In certain embodiments, the first-axis position system130 further comprises sensors, limit switches, or other devices which provide information regarding the position of thefirst stage138 along thefirst rail134. This information can be provided to thecontroller500, which is adapted to transmit control signals to thefirst drive136 or other components of thelaser manipulation system100 in response to this information.
• Exemplaryfirst drives136 include, but are not limited to, hydraulic drives, pneumatic drives, electromechanical drives, screw drives, and belt drives.First rails134,first drives136, andfirst stages138 compatible with embodiments described herein are available from Tol-O-Matic, Inc. of Hamel, Minn. Other types and configurations offirst rails134,first drives136, andfirst stages138 are also compatible with embodiments described herein.
• In certain embodiments, the second-axis position system150 moves thelaser head200 in a second direction substantially parallel to the surface of the structure. The second direction in certain embodiments is substantially perpendicular to the first direction of the first-axis position system130. In the embodiment schematically illustrated byFIG. 10, the second-axis position system150 comprises asecond rail152, asecond drive154, and asecond stage156. In certain embodiments, the first-axis position system130 and the second-axis position system150 provide linear movements of thelaser head200. In other embodiments, the first-axis position system130 and the second-axis position system150 provide circular and axial movements of thelaser head200, respectively.
• In certain embodiments, thesecond stage156 is movably coupled to thesecond rail152 under the influence of thesecond drive154. Thelaser head receiver220 is releasably coupled to thesecond stage156 so that thesecond drive154 can be used to move thelaser head receiver220 along thesecond rail152. In certain embodiments, the second-axis position system150 further comprises sensors, limit switches, or other devices which provide information regarding the position of thesecond stage156 along thesecond rail152. This information can be provided to thecontroller500, which is adapted to transmit control signals to thesecond drive154 or other components of thelaser manipulation system100 in response to this information.
• Exemplarysecond drives154 include, but are not limited to, hydraulic drives, pneumatic drives, electromechanical drives, screw drives, and belt drives.Second rails152,second drives154, andsecond stages156 compatible with embodiments described herein are available from Tol-O-Matic, Inc. of Hamel, Minn. Other types and configurations ofsecond rails152,second drives154, andsecond stages156 are also compatible with embodiments described herein.
• In certain embodiments, thesecond rail152 is fixedly coupled to thesecond piece140bof theinterface140. Thesecond piece140bcan comprise at least one recess which is releasably connectable to at least one corresponding protrusion of thefirst piece140aof theinterface140. Such embodiments are advantageously disassembled and reassembled for transport, storage, or maintenance of thepositioning mechanism121. In other embodiments, theinterface140 can be made of a single piece which is releasably coupled to one or both of thefirst stage138 and thesecond rail152. Other embodiments are not configured for convenient disassembly (e.g., having aninterface140 made of a single piece and that is fixedly coupled to both thefirst stage138 and the second rail152).
• In certain embodiments, theinterface140 comprises atilt mechanism144 to adjust the relative orientation between thefirst rail134 and thesecond rail152. As schematically illustrated inFIG. 11A, thefirst piece140aof theinterface140 is coupled to thefirst stage138 on thefirst rail134, and comprises a pair ofprotuberances142 adapted to couple with corresponding recesses of thesecond piece140bof theinterface140. Thetilt mechanism144 comprises afirst plate145, ahinge146, asecond plate147, and a pair of support braces148. Thefirst plate145 is fixedly mounted to thefirst stage138 and is substantially parallel to the surface upon which theanchoring mechanism110 is mounted. Thesecond plate147 is pivotally coupled to thefirst plate145 by thehinge146, and can be locked in place by the support braces148.
• InFIG. 11A, thetilt mechanism144 is configured so that thefirst plate145 and thesecond plate147 are substantially parallel to one another. In this configuration, the plane of movement defined by the first direction and the second direction of thelaser head200 is substantially parallel to the surface upon which theanchoring mechanism110 is coupled. InFIG. 11B, thetilt mechanism144 is configured so that thesecond plate147 is at a non-zero angle (e.g., 90 degrees) relative to thefirst plate145. In this configuration, the plane of movement defined by the first direction and the second direction of thelaser head200 is at a non-zero angle relative to the surface upon which theanchoring mechanism110 is coupled.
• In certain embodiments, thelaser head receiver220 is releasably coupled thehousing230 of thelaser head200.FIG. 12 schematically illustrates alaser head receiver220 compatible with embodiments described herein. Thelaser head receiver220 is coupled to thesecond stage156 and comprises areleasable clamp222 and a third-axis position system224. Theclamp222 is adapted to hold thehousing230 of thelaser head200. The third-axis position system224 is adapted to adjust the relative distance between thelaser head200 and the structure being processed. In certain embodiments, the third-axis position system224 comprises a screw drive which moves theclamp222 substantially perpendicularly to thesecond rail152. In certain embodiments, as schematically illustrated byFIG. 12, the screw drive is manually actuated by ahandle226, which can be rotated to move theclamp222. In other embodiments, the screw drive is automatically controlled by equipment responsive to control signals from thecontroller500.
• Ground-Based Support System
• In certain embodiments, theapparatus50 can be utilized with a ground-basedsupport system700 which is releasably coupled to theapparatus50. Theinterface mounting devices114 can each comprise a ground-basedsupport connector118aadapted to releasably couple to the ground-basedsupport system700. The ground-basedsupport system700 advantageously attaches to various types of external boom systems, such as commercially-available lifting- or positioning-type systems, which can support some of the weight of theapparatus50, thereby reducing the weight load supported by theanchoring mechanism110. The ground-basedsupport system700 can be used to facilitate use of theapparatus50 on substantially vertical surfaces (e.g., walls) or on substantially horizontal surfaces (e.g., ceilings).
• In certain embodiments, the ground-basedsupport system700 includes a support structure710 such as that schematically illustrated inFIG. 13. The support structure710 ofFIG. 13 comprises aboom connector712, arotational mount714, aspreader member716, a pair ofprimary posts718, and a pair ofauxiliary posts720. Theboom connector712 is adapted to attach to a selected external boom system. Therotational mount714 is adapted to be rotatably coupled to theboom connector712 and fixedly coupled to thespreader member716 so that theboom connector712 can be advantageously rotated relative to the support structure710.
• Theprimary posts718 are coupled to thespreader member716 and are substantially parallel to one another. Each of theprimary posts718 is adapted to be coupled to one of the ground-basedsupport connectors118aof theinterface mounting devices114. Theprimary posts718 can each be coupled to thespreader member716 at various positions so that they are aligned with the ground-basedsupport connectors118a. Eachprimary post718 is also coupled to, and is substantially perpendicular to, anauxiliary post720. In such embodiments, rather than having theprimary posts718 coupled to the ground-basedsupport connectors118a, theauxiliary posts720 can be coupled to the ground-basedsupport connectors118a, thereby effectively rotating the support structure710 by 90 degrees relative to theanchoring mechanism110. Such embodiments advantageously provide adjustability for processing various configurations of structures and to permit alternative configurations best suited for particular applications.
• Suspension-Based Support System
• Alternatively, theapparatus50 can be utilized with a suspension-basedsupport system800 which is releasably coupled to theapparatus50. Theinterface mounting devices114 can each comprise at least one suspension-basedsupport connector118badapted to releasably couple to the suspension-basedsupport system800. The suspension-basedsupport system800 advantageously supports some of the weight of theapparatus50, thereby reducing the weight load supported by theanchoring mechanism110. The suspension-basedsupport system800 can be used to facilitate use of theapparatus50 on substantially vertical surfaces (e.g., outside walls).
• In certain embodiments, as schematically illustrated inFIG. 14A, the suspension-basedsupport system800 comprises awinch810, aprimary cable812, and a pair ofsecondary cables814. Thewinch810 is positioned on the roof or other portion of a structure to be processed. Thewinch810 is coupled to theprimary cable812, which is coupled to thesecondary cables814. Thesecondary cables814 are each coupled to a suspension-basedsupport connector118bof theinterface mounting device114 of theanchoring mechanism110.FIG. 14B schematically illustrates one embodiment of the apparatus having the suspension-basedsupport connectors118b. Theapparatus50 can then be lowered or raised by utilizing thewinch810 to shorten or lengthen the working length of theprimary cable814. In alternative embodiments, the ground-basedsupport connectors118acan be configured to serve also as the suspension-basedsupport connectors118b.
LMS: Simplified Anchoring Mechanism
• FIGS. 21A-21D schematically illustrateother anchoring mechanisms1110 in accordance with embodiments described herein. Theanchoring mechanism1110 comprises aresilient vacuum pad1112 adapted to be releasably coupled to the structure, acoupler1114 adapted to be releasably attached to thelaser head1200, and ahandle1116. Rather than the above-describedlaser manipulation system100 which comprises a four-vacuum-pad anchoring mechanism110 and a multiple-axis positioning mechanism121, theanchoring mechanism1110 provides a simplified mechanism to releasably hold thelaser head1200 ofFIG. 20 at a selected position in relation to the structure being irradiated.
• In certain embodiments, thevacuum pad1112 comprises a circular rubber membrane (not shown) which forms an effectively air-tight region when placed on the structure. Thevacuum pad1112 is fluidly coupled to at least one vacuum generator (not shown) via avacuum conduit1113, shown inFIG. 21D. Exemplary materials for thevacuum conduit1113 include, but are not limited to, flexible rubber hose. By drawing air out from the air-tight region between the rubber membrane and the structure via the vacuum conduit, the vacuum generator creates a vacuum within the air-tight region. Atmospheric pressure provides a force which reversibly affixes theanchoring mechanism1110 to the structure. In certain embodiments, thevacuum pad112 is configured to hold thelaser head1200 in any orientation against gravitational forces. For example, in the embodiment schematically illustrated byFIG. 21D, theanchoring mechanism1110 supports thelaser head1200 to be in contact with a substantially vertical concrete surface. Removal of theanchoring mechanism1110 from the surface is achieved by allowing air back into the air-tight region between the rubber membrane and the structure.Vacuum pads1112 compatible with embodiments described herein are available from a variety of sources. Anexemplary vacuum pad1112 is provided by the 376281-DD-CR-1 Complete Core Rig Stand from Hilti Corporation of Schaan in the Principality of Liechtenstein.
• In certain embodiments, thecoupler1114 comprises a structure which mates with a correspondinglaser head coupler1250 of thelaser head1200. For theanchoring mechanism1110 schematically illustrated byFIG. 21A, thecoupler1114 comprises at least oneprotrusion1115 which is attached to thevacuum pad1112. Thecoupler1114 is connectable to thelaser head coupler1250 which comprises at least onecorresponding recess1116. In other embodiments, thecoupler1114 comprises a recess and thelaser head coupler1250 comprises a corresponding protrusion. In still other embodiments, thecoupler1114 comprises acollar1117 which is adapted to hold thelaser head2200, as schematically illustrated byFIG. 22A.
• As schematically illustrated byFIG. 21C, in still other embodiments, theconnector1114 comprises at least onerod1118 and thecoupler1250 of thelaser head1200 comprises at least onecollar1119. In the exemplary embodiment ofFIG. 21C, thecoupler1114 comprises tworods1118a,1118band thelaser head coupler1250 comprises twocollars1119a,1119b. Eachcollar1119 is releasably coupled to thecorresponding rod1118 such that thelaser head1200 can be adjustably positioned at various locations along the length of therod1118. In certain such embodiments, thecollar1119 can be adjustably rotated with respect to therod1118 to allow thelaser head1200 to be rotated about therod1118. For example, in the embodiment schematically illustrated byFIG. 21C, onecollar1119acan be detached from itscorresponding rod1118a, and the other collar119bcan be rotated about itscorresponding rod1118b. Such embodiments provide the capability to rotate thelaser head1200 away from its drilling position so that visual inspection can be made of the hole being drilled. Once visual inspection has been made, thelaser head1200 can then be replaced back into the drilling position by rotating thelaser head1200 back and recoupling thecollar1119ato itscorresponding rod1118a.
• In certain embodiments, thehandle1116 is adapted to facilitate transporting and positioning theanchoring mechanism1110 at a desired location. Other configurations of thehandle1116 besides that schematically illustrated byFIGS. 21A-21D are compatible with other embodiments described herein.
• Suchsimplified anchoring mechanisms1110, as described above, can be used when the apparatus is used to only drill or pierce holes into the structure. In certain such embodiments, theanchoring mechanism1110 can be releasably affixed to the structure so that thelaser head1200 is positioned to irradiate the structure to drill a hole at a selected location. To drill a second hole at a second selected location in such embodiments, theanchoring mechanism1110 is removed from the structure and moved so that thelaser head1200 is repositioned to irradiate the structure at the second selected location. By simplifying the anchoring mechanism1110 (as compared to theanchoring mechanism110 ofFIGS. 6A,6B,7, and8) and avoiding the use of apositioning mechanism121, such simplified embodiments provide a lighter weight alternative which is movable and positionable by a single person. In addition, such simplified embodiments are more robust than those described in relation toFIGS. 6A,6B,7, and8.
Controller
• In certain embodiments, thecontroller500 is electrically coupled to thelaser base unit300 and is adapted to transmit control signals to thelaser base unit300. In other embodiments, thecontroller500 is electrically coupled to both thelaser base unit300 and thelaser manipulation system100, and is adapted to transmit control signals to both thelaser base unit300 and thelaser manipulation system100.FIG. 15 schematically illustrates an embodiment of acontroller500 in accordance with embodiments described herein. Thecontroller500 comprises acontrol panel510, amicroprocessor520, alaser generator interface530, apositioning system interface540, asensor interface550, and auser interface560.
• In certain embodiments, thecontrol panel510 includes a main power supply, main power switch, emergency power off switch, and various electrical connectors adapted to couple to other components of thecontroller500. Thecontrol panel510 is adapted to be coupled to an external power source (not shown inFIG. 15) and to provide power to various components of theapparatus50.
• In certain embodiments, themicroprocessor520 can comprise a Programmable Logic Controller microprocessor (PLC). PLCs are rugged, reliable, and easy-to-configure, and exemplary PLCs are available from Rockwell Automation of Milwaukee, Wis., Schneider Electric of Palatine, Ill., and Siemens AG of Munich, Germany. In alternative embodiments, themicroprocessor520 comprises a personal computer microprocessor, or PC/104 embedded PC modules which provide easy and flexible implementation. Themicroprocessor520 can be adapted to respond to input signals from the user (via the user interface560), as well as from various sensors of the apparatus50 (via the sensor interface550), by transmitting control signals to the other components of the apparatus50 (via thelaser generator interface530 and the positioning system interface540) to achieve the desired cutting or drilling pattern.
• Themicroprocessor520 can be implemented in hardware, software, or a combination of the two. When implemented in a combination of hardware and software, the software can reside on a processor-readable storage medium. In addition, themicroprocessor520 of certain embodiments comprises memory to hold information used during operation.
• In certain embodiments, thelaser generator interface530 is coupled to thelaser base unit300 and is adapted to transmit control signals from themicroprocessor520 to various components of thelaser base unit300. For example, thelaser generator interface530 can transmit control signals to thelaser generator310 to set desired operational parameters, including, but not limited to, laser power output levels and laser pulse profiles and timing. In addition, thelaser generator interface530 can transmit control signals to thecooling subsystem320 to set appropriate cooling levels, the source of compressed gas coupled to the compressedgas inlet249 of thecontainment plenum240, or to the vacuum generator coupled to theextraction port248.
• In certain embodiments, thepositioning system interface540 is coupled to thepositioning mechanism121 of thelaser manipulation system100 and is compatible with the first-axis position system130 and second-axis position system150, as described above. In certain such embodiments, thepositioning system interface540 comprises servo-drivers for the first-axis position system130 and the second-axis position system150. The servo-drivers are preferably responsive to control signals from themicroprocessor520 to generate driving voltages and currents for thefirst drive136 and thesecond drive154. In this way, thecontroller500 can determine how thelaser head200 is scanned across the surface of the structure. In certain embodiments, the servo-drivers receive their power from thecontrol panel510 of thecontroller500. In embodiments in which thepositioning mechanism121 further comprises a third-axis position system, thepositioning system interface540 further comprises an appropriate servo-driver so that thecontroller500 can determine the relative distance between thelaser head200 and the structure surface being processed.
• In certain embodiments, thesensor interface550 is coupled to various sensors (not shown inFIG. 15) of theapparatus50 which provide data upon which operation parameters can be selected or modified. For example, as described above, thelaser head200 can comprise asensor250 adapted to measure the relative distance between thelaser head200 and the interaction region. Thesensor interface550 of such embodiments receives data from thesensor250 and provide this data to themicroprocessor520. Themicroprocessor520 can then adjust various operational parameters of thelaser base unit300 and/or thelaser manipulation system100, as appropriate, in real-time. Other sensors which can be coupled to thecontroller500 via thesensor interface550 include, but are not limited to, proximity sensors to confirm that thelaser head200 is in position relative to the surface being processed, temperature or flow sensors for the various cooling, compressed air, and vacuum systems, and rebar detectors (as described more fully below).
• In certain embodiments, theuser interface560 adapted to provide information regarding theapparatus50 to the user and to receive user input which is transmitted to themicroprocessor520. In certain embodiments, theuser interface560 comprises acontrol pendant570 which is electrically coupled to themicroprocessor520. As schematically illustrated inFIG. 16, in certain embodiments, thecontrol pendant570 comprises ascreen572 and a plurality ofbuttons574. In certain other embodiments, thecontrol pendant570 comprises a plurality ofbuttons574 and is separate from ascreen572.
• Thescreen572 can be used to display status information and operational parameter information to the user.Exemplary screens572 include, but are not limited to, liquid-crystal displays. Thebuttons574 can be used to allow a user to input data which is used by themicroprocessor520 to set operational parameters of theapparatus50. Other embodiments can use other technologies for communicating user input to theapparatus50, including, but not limited to, keyboard, mouse, touchpad, and potentiometer knobs and/or dials. In certain embodiments, thecontrol pendant570 is hard-wired to theapparatus50, while in other embodiments, thecontrol pendant570 communicates remotely (e.g., wirelessly) with theapparatus50.
• In certain embodiments, thecontrol pendant570 further comprises an emergency stop button and a cycle stop button. Upon pressing the emergency stop button, theapparatus50 immediately ceases all movement and the laser irradiation is immediately halted. Upon pressing the cycle stop button, theapparatus50 similarly ceases all movement and halts laser irradiation corresponding to the cutting sequence being performed, but the user is then provided with the option to return to the beginning of the cutting sequence or to re-start cutting at the spot where the cutting sequence was stopped. In certain embodiments, thecontrol pendant570 further comprises a “dead man switch,” which must be manually actuated by the user for theapparatus50 to perform. Such a switch provides a measure of safety by ensuring that theapparatus50 is not run without someone actively using thecontrol pendant570.
• FIGS. 17A-17H illustrate a set of exemplary screen displays of thecontrol pendant570. The function of each of thebuttons574 along the left and right sides of thescreen572 is dependent on the operation mode of theapparatus50. Each of the screen displays provides information regarding system status along with relevant information regarding the current operation mode.
• The “MAIN SCREEN” display ofFIG. 17A comprises a “Machine Status” field, a “System Status” field, and label fields corresponding to the functions of some or all of thebuttons574 of thecontrol pendant570. The “Machine Status” field includes a text message which describes what theapparatus50 is doing and what the user may do next. The “System Status” field includes a box which shows the operational mode of theapparatus50. In the example illustrated byFIG. 17A, the apparatus is in “maintenance mode.” The “System Status” field also includes a plurality of status boxes which indicate the status of various components of theapparatus50, including, but not limited to, thevacuum pads112 of theanchoring system110, the air or vacuum pressure, the first-axis position system130, and the second-axis position system150. The “System Status” field also indicates whether there are any faults sensed with thelaser base unit300. In certain embodiments, nominal status of a component is shown with the corresponding status box as green. The ready state of theapparatus50 is illustrated by having all the system status boxes appear as green. If the status of one of these components is outside operational parameters, the corresponding status box is shown as red, and the system interlocks are enabled, preventing operation of theapparatus50. Upon startup, the system interlocks are enabled and must be cleared prior to operation of theapparatus50. The text messages of the “Machine Status” field provide information regarding the actions to be performed to place theapparatus50 within operational parameters and to clear the system interlocks. Upon clearing all the system interlocks, the “Machine Status” field will indicate that theapparatus50 is ready to be used.
• The “SELECT OPERATION SCREEN” display ofFIG. 17B comprises the “Machine Status” field, the “System Status” field, and the label fields corresponding to the functions of some or all of thebuttons574. The “System Status” field includes information regarding the position of thelaser head200 along the first-axis position system130 (referred to as the long axis) and the second-axis position system150 (referred to as the short axis). Some of thebuttons574 are configured to enable various operations. For example, fourbuttons574 are configured to enable four different operations: circle, pierce, straight cut, and surface keying, as illustrated inFIG. 17B.
• FIG. 17C shows a “CIRCLE SETUP/OPERATION SCREEN” display which provides information regarding the circle operation of theapparatus50 in which thelaser head200 moves circularly to cut a circular pattern to a desired depth into the surface of the structure to be processed. In certain embodiments, the circle operation can be used for “trepanning,” whereby a solid circular core is cut and removed from the surface, leaving a circular hole.
• A “Circle Status” field provides information regarding the status of the circle operation and corresponding instructions to the user. The starting position of thelaser head200 along the first-axis position system130 and the second-axis position system150 are provided in the “System Status” field. A “Circle Parameters” field provides information regarding various parameters associated with the cutting of a circular pattern, including, but not limited to, the number of revolutions around the circular pattern, the diameter, time period that the cutting will be performed, the speed of motion of thelaser head200 around the circle, and the laser base unit (LBU) program number. In certain embodiments, the LBU program number corresponds to operational parameters of thelaser head200 including, but not limited to, beam focus and intensity.
• In certain embodiments, the various parameters can be changed by touching the parameter on thescreen572, upon which a numerical keypad will pop up on thescreen572 so that a new value can be entered. For each parameter, the “set point” value corresponds to the value currently in memory and the last value that was entered. The “status” value corresponds to the current value being selected. Upon saving the new parameter value, the “status” and “set point” values are the same. Pressing the button574alabeled “Auto/Dry Run” will initiate the circular movement of thelaser head200 without activating the laser beam, to ensure the desired motion. Pressing the button574blabeled “Cycle Start” will initiate the cutting of the circular pattern, including both the movement of thelaser head200 and the activation of the laser beam. Pressing the button574clabeled “Cycle Stop” will halt or pause the cutting and movement, with the option to re-start the cutting and movement where it was halted. Pressing the button574dlabeled “Machine Reset” will place theapparatus50 in a neutral condition. Pressing the button574elabeled “Next” upon completion of the cutting will return to the “SELECT OPERATION SCREEN.”
• FIG. 17D shows a “PIERCE SETUP/OPERATION SCREEN” display which provides information regarding the pierce operation of theapparatus50 in which thelaser head200 drills a hole to a desired depth into the surface of the structure to be processed. A “Pierce Status” field provides information regarding the status of the pierce operation and corresponding instructions to the user. The starting position of thelaser head200 along the first-axis position system130 and the second-axis position system150 are provided in the “System Status” field. A “Pierce Parameters” field provides information regarding various parameters associated with the drilling of a hole. The laser parameters can include, but are not limited to, the laser power, the laser spot size, and the time period for drilling (each of which can influence the diameter of the resultant hole which is formed in the structure), and the LBU program number. The parameters can be changed as described above. Thebuttons574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above.
• FIG. 17E shows a “CUT SETUP/OPERATION SCREEN” display which provides information regarding the straight cutting operation of theapparatus50 in which thelaser head200 makes a straight cut to a desired depth in the surface of the structure to be processed. The straight cut is preferably along one of the axes of theapparatus50. A “Cut Status” field provides information regarding the status of the cut operation and corresponding instructions to the user. The starting position of thelaser head200 along the first-axis position system130 and the second-axis position system150 are provided in the “System Status” field. A “Cut Parameters” field provides information regarding various parameters associated with the cutting, including, but not limited to, the speed of motion of thelaser head200, the length of the cut to be made, and the LBU program number. The parameters can be changed as described above. The buttons574f,574glabeled “Long Axis” and “Short Axis” are used to select either the first axis or the second axis respectively as the axis of motion of thelaser head200. Thebuttons574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above.
• FIG. 17F shows a “SURFACE KEYING SETUP/OPERATION SCREEN” display which provides information regarding the surface keying operation of theapparatus50 in which thelaser head200 cuts an indentation or key into the surface of the structure to be processed. The surface keying operation includes scanning the laser beam across the surface to create an indentation or “key” in the surface with a desired depth and with a generally rectangular area. In certain embodiments, the surface keying operation can be used to perform “scabbling” of the surface, whereby the surface is roughened by interaction with the laser beam across an area (e.g., rectangular).
• A “Surface Keying Status” field provides information regarding the status of the surface keying operation and corresponding instructions to the user. The starting position of thelaser head200 along the first-axis position system130 and the second-axis position system150 are provided in the “System Status” field. A “Surface Keying Parameters” field provides information regarding various parameters associated with the cutting, including, but not limited to, the speed of motion of thelaser head200, the length of the key to be made along the first axis and along the second axis, the offset length that theapparatus50 will increment between movement along the first axis and the second axis, and the LBU program number. The parameters can be changed as described above. The buttons574f,574glabeled “Long Axis” and “Short Axis” are used to select either the first axis or the second axis respectively as the axis of motion of thelaser head200. Thebuttons574 labeled “Auto/Dry Run,” “Cycle Start,” “Cycle Stop,” “Machine Reset,” and “Next” operate as described above.
• FIG. 17G shows a “FAULT SCREEN” display which provides information regarding detected operation faults. A fault occurs when a sensor (e.g., flowmeters, temperature sensors, safety switches, emergencies stops) of the monitored systems detects a non-operational condition, and can occur while theapparatus50 is any of the operational modes and while any of the screens are being displayed. When a fault occurs, a scrolling message indicating the fault is preferably provided at the bottom of the current screen being displayed. In addition, the “Machine Status” field will indicate to the user to clear the faults. The “FAULT SCREEN” can be accessed from any of the other screens by pressing anappropriate button574. As illustrated inFIG. 17G, in certain embodiments, the “FAULT SCREEN” displays the detected faults in a table with the relevant data, including, but not limited to, the date and the type of fault. To prepare theapparatus50 for operation, the detected faults are preferably cleared by the user. After clearing the detected faults, the user can press an appropriate button574 (e.g., “Acknowledge All”) to acknowledge the faults. If the faults are not cleared, the user can press an appropriate button574 (e.g., “Machine Reset”) to return to the screen being displayed when the fault occurred. Pressing the “Machine Reset”button574 again will return the user to the “MAIN SCREEN” from where theapparatus50 can be reset.
• FIG. 17H shows a “MAINTENANCE SCREEN” display which provides information regarding theapparatus50. The maintenance mode can be accessed from the “MAIN SCREEN” display by pressing anappropriate button574. In the maintenance mode, the system interlocks are bypassed, therefore the user preferably practices particular care to avoid damaging theapparatus50 or people or materials in proximity to theapparatus50. The “MAINTENANCE SCREEN” can display an appropriate warning to the user.
• The maintenance mode provides an opportunity for the user to check the operation of various components of theapparatus50 independent of the fault status of theapparatus50. For example, by pressingappropriate buttons574 in the maintenance mode, the vacuum system can be turned on and off, the compressed air can be turned on and off via a solenoid valve, and thefirst drive136 andsecond drive154 can be turned on and off. In addition, the default jog speed of the first axis and second axis can be changed by pressing thescreen572 to pop up a numerical keypad display, as described above.
• The “System Status” field also includes a plurality of status boxes which indicate the status of various components of theapparatus50, including, but not limited to, thevacuum pads112 of theanchoring system110, the air or vacuum pressure, the first-axis position system130, and the second-axis position system150. The “System Status” field also indicates whether there are any faults sensed with thelaser base unit300. In certain embodiments, nominal status of a component is shown with the corresponding status box as green. The ready state of theapparatus50 is illustrated by having all the system status boxes appear as green. If the status of one of these components is outside operational parameters, the corresponding status box is shown as red.
• The “MAINTENANCE SCREEN” can also provide the capability to move thelaser head200 along the first axis and second axis, as desired. A set of threebuttons574 are configured to move thelaser head200 along the first axis to a home position, in a forward direction, or in a backward direction, respectively. Similarly, another set of threebuttons574 are configured for similar movement of thelaser head200 along the second axis. The label field for these sets of buttons can include information regarding the position of thelaser head200 along these two axes.
• Detector
• In certain embodiments, thecontroller500 is coupled to adetector600 adapted to detect embedded material in the structure while processing the structure, and to transmit detection signals to thecontroller500. In certain embodiments, thecontroller500 is adapted to avoid substantially damaging the embedded material by transmitting appropriate control signals to thelaser base unit300 or to both thelaser base unit300 and thelaser manipulation system100. In certain embodiments, thedetector600 is adapted to utilize light emitted by the interaction region during processing to detect embedded material.
• Various technologies for detecting embedded material are compatible with embodiments of the present invention. Spectral analysis of the light emitted by the interaction region during processing can provide information regarding the chemical constituents of the material in the interaction region. By analyzing the wavelength and/or the intensity of the light, it is possible to determine the composition of the material being heated and its temperature. Using spectroscopic information, the detection of embedded materials in certain embodiments relies on monitoring changes in the light spectrum during processing. With the differences in composition of embedded materials, by way of example and not limitation, such as rebar (e.g., steel) embedded in concrete, variations in the melting and boiling temperatures for the diverse materials will produce noticeable changes in the amount of light, and/or the wavelength of the light when the laser light impinges and heats the embedded material.
• FIG. 18A schematically illustrates anexemplary detector600 compatible with embodiments described herein. Thedetector600 comprises acollimating lens610, anoptical fiber620, and aspectrometer630. Thespectrometer630 of certain embodiments comprises aninput slit631, anoptical grating632, acollection lens633, and alight sensor634. Thecollimating lens610 is positioned to receive light emitted from the interaction region, and to direct the light onto theoptical fiber620. Theoptical fiber620 then delivers the light to thespectrometer630, and the light is transmitted through the input slit631 to theoptical grating632 of thespectrometer630. Theoptical grating632 separates the light into a spectrum of wavelengths. The separated light having a selected range of wavelengths can then be directed through thecollection lens633 onto thelight sensor634 which generates a signal corresponding to the intensity of the light in the range of wavelengths.
• In certain embodiments, at least a portion of thedetector600 is mounted onto thelaser head200. In embodiments in which thecollimating lens610 is part of thelaser head200, thecollimating lens610 can be positioned close to the axis of the emitted laser light so as to receive light from the interaction region. In such embodiments, thecollimating lens610 can be behind thenozzle244 and protected by the compressed air from thecompressed air inlet249, as is thewindow243. In certain embodiments, thecollimating lens610 is coaxial with the laser beam, while in other embodiments, thecollimating lens610 is located off-axis. Exemplarycollimating lenses610 include, but are not limited to, UV-74 from Ocean Optics of Dunedin, Fla.
• In certain embodiments, theoptical fiber620 comprises a material selected to provide sufficiently low attenuation of the light intensity transmitted from thelaser head200 to thespectrometer630. Exemplary materials for theoptical fiber620 include, but are not limited to, silica and fused silica. In certain embodiments, theoptical fiber620 comprises a pure fused silica core, a doped fused silica cladding, and a polyimide buffer coating. In addition, theoptical fiber620 of certain embodiments is protected by an outer jacket (e.g., Teflon®, Tefzel®, Kevlar®, and combinations thereof) and a stainless steel sheath. In addition, theoptical fiber620 of certain embodiments is connectable to thelaser head200 using a right-angle fiber mount. Other types ofoptical fibers620 and mounting configurations are compatible with embodiments described herein. Exemplaryoptical fibers620 include, but are not limited to, P400-2-UV/VIS from Ocean Optics of Dunedin, Fla.
• In certain embodiments, thespectrometer630 comprises an adjustable input slit631. The input slit631 of certain embodiments has a height of approximately 1 millimeter and a width in a range between approximately 5 microns and approximately 200 microns. The input slit631 determines the amount of light entering thespectrometer630. The width of the input slit631 affects the resolution of thelight sensor634. For example, in certain embodiments, an input slit width of approximately 5 microns corresponds to a resolution of approximately 3 pixels, while an input slit width of approximately 200 microns corresponds to a resolution of approximately 24 pixels. The width of the input slit631 is advantageously selected to provide sufficient light transmittance as well as sufficient resolution.
• Theoptical grating632 of certain embodiments receives light from the input slit631 and diffracts the various wavelength components of the light by corresponding angles dependent on the wavelength of the light. In this way, theoptical grating632 separates the various wavelength components of the light. In certain embodiments, the angle between theoptical grating632 and the light from the input slit631 is scanned (e.g., by moving the optical grating632), thereby scanning the wavelength components which reach thelight sensor634.Exemplary spectrometers630 utilizing anoptical grating632 include, but are not limited to, USB2000(VIS/UV) from Ocean Optics of Dunedin, Fla.
• In certain embodiments, thecollection lens633 of thespectrometer630 is adapted to increase the light reception efficiency of thelight sensor634. In certain embodiments, thecollection lens633 comprises a cylindrical lens affixed onto thelight sensor634. Such embodiments of thecollection lens633 are advantageously useful with large diameter entrance apertures (limited by the width of the input slit631 or the size of the optical fiber620) and with low-light-level applications. In addition, in certain embodiments, thecollection lens633 improves the efficiency of thespectrometer630 by reducing the amount of stray light which reaches thelight sensor634.Other spectrometers630 with other configurations of the input slit631, theoptical grating632, and thecollection lens633 are compatible with embodiments described herein.
• In certain embodiments, thedetection system600 comprises acomputer system640 coupled to thespectrometer630, as schematically illustrated byFIG. 18B. Thecomputer system640 is adapted to analyze the resulting spectroscopic data. Thecomputer system640 of certain embodiments comprises amicroprocessor641, amemory subsystem642, and adisplay643. To provide more robustness to thecomputer system640, themicroprocessor641 and thememory subsystem642 can be mounted within a National Electrical Manufacturers Association (NEMA)-ratedenclosure644 with input and output power and signal connections on one or more side panels of the enclosure for easy access. In certain embodiments, thecomputer system640 is powered by 110 V from a wall outlet, while in certain embodiments, thecomputer system630 further comprises a battery backup power supply (not shown) to ensure functionality in the event of power loss.
• In certain embodiments, themicroprocessor641 comprises a Pentium-200 microprocessor chip, while in other embodiments, themicroprocessor641 comprises a Pentium-III 850-MHz microprocessor chip. In certain embodiments, thememory subsystem642 comprises a hard disk drive. Other types ofmicroprocessors641 andmemory subsystems642 are compatible with embodiments described herein.
• In certain embodiments, thedisplay643 comprises a thin-film-transistor (TFT) touch screen display. Besides being used to display spectroscopic results to a user, such a touch screen display can be used to provide user input to thedetector600 to modify various operation parameters.
• Thespectrometer630 can monitor specific wavelengths that are associated with various embedded materials in the structure. In certain embodiments, thespectrometer630 can monitor the relative intensity of the light at, or in spectral regions in proximity to, these wavelengths. Additionally, at least one neutral density filter may be employed to decrease the light reaching thespectrometer630 to improve spectral analysis performance.
• In certain embodiments, thespectrometer630 monitors the intensity at a specific wavelength and the intensities on both sides of this wavelength. Thespectrometer630 of certain embodiments also monitors the reduction of the intensities resulting from the increased depth of the hole being drilled.FIG. 19 shows an exemplary graph of the light spectrum detected upon irradiating concrete with laser light and the light spectrum detected upon irradiating an embedded rebar. The spectrum from concrete shows an emission peak at a wavelength of approximately 592 nanometers. The spectrum from rebar does not have this emission peak, but instead shows an absorption dip at approximately the same wavelength. Thus, the emission spectrum at about 592 nanometers can be used to provide a real-time indication of whether an embedded rebar is being cut by the laser light. For example, in certain embodiments in which thedetector600 assumes that either a valley or a peak exists in the spectrum at 592 nanometers, by sampling the emission spectrum at about 588.5 nanometers, 592 nanometers, and 593 nanometers, and calculating the ratio: (2×I₅₉₂)/(I₅₉₃+I_588.5), thedetector600 can determine whether the emission spectrum has a dip corresponding to concrete or a peak corresponding to embedded rebar. Other spectroscopic data can be used in other embodiments.
• In certain embodiments, thedetector600 examines a spectral region defined by an upper cutoff wavelength (e.g., 582 nanometers) and a lower cutoff wavelength (e.g., 600 nanometers) and determines a spectral ratio R characteristic of the detection or non-detection of embedded rebar.FIG. 23 is a flowchart of anexemplary method2500 for determining the spectral ratio R in accordance with embodiments described herein. Themethod2500 does not address changes in the light from the interaction region as the hole becomes deeper.
• In certain embodiments, themethod2500 comprises anoperational block2510 in which the data within the spectral region is compared to a selected amplitude range. If any of the data fall outside the amplitude range, the spectrum is deemed to correspond to non-detection of embedded rebar.
• In certain embodiments, themethod2500 further comprises analyzing the data of the spectral region to determine the existence of a valley and two peaks. In certain embodiments, this analysis comprises determining whether the data of the spectral region comprises a valley in anoperational block2520. If a valley is determined to exist, then a valley value V is calculated in anoperational block2530 and the spectral region is analyzed to determine whether the data of the spectral region comprises two peaks in anoperational block2540. In certain embodiments, the valley value V corresponds to the amplitude of the data at the valley. In certain other embodiments, calculating the valley value V comprises determining a minimum value of the data in a first portion of the spectral region. In certain embodiments, the first portion of the spectral region corresponds to a range of wavelengths between approximately 588 nanometers and approximately 594 nanometers.
• If the data of the spectral region is determined to contain two peaks, then a peak value P is calculated in theoperational block2550 and the spectral ratio R is calculated by dividing the valley value V by the peak value P in anoperational block2560. In certain embodiments, the peak value P is calculated by averaging the values of the two peaks. If the spectral ratio R is greater than or equal to one, then the spectrum is deemed to correspond to detection of embedded rebar.
• If the data of the spectral region is determined to not contain two peaks, then in certain embodiments, a first maximum value M1 is calculated from the data of a second portion of the spectral region in anoperational block2570 and a second maximum value M2 is calculated from the data of a third portion of the spectral region in anoperational block2580. In certain embodiments, the second portion of the spectral region corresponds to a range of wavelengths from approximately 582 nanometers to approximately 588 nanometers, and the third portion of the spectral region corresponds to a range of wavelengths from approximately 594 nanometers to approximately 600 nanometers. In certain embodiments, the first maximum value M1 corresponds to a maximum data amplitude in the second portion of the spectral region and the second maximum value M2 corresponds to a maximum data amplitude in the third portion of the spectral region. In certain embodiments, the peak value P is calculated by averaging the first maximum value M1 and the second maximum value M2 in anoperational block2590. In such embodiments, the spectral ratio R is calculated by dividing the valley value V by the peak value P in anoperational block2600. If the spectral ratio R is greater than or equal to one, then the spectrum is deemed to correspond to detection of embedded rebar.
• If a valley is determined to not exist in the data of the spectral region, a peak value P′ is calculated in anoperational block2610 and the peak value P′ is compared to a predetermined threshold value T in anoperational block2620. In certain embodiments in which the spectral region comprises one or more peaks, calculating the peak value P′ comprises averaging the intensity values of any peaks detected in the spectral region. If the peak value P′ is less than the threshold value T, then the spectrum is deemed to correspond to detection of embedded rebar.
• An alternative technology for detecting embedded materials uses high speed shutter monitoring. This approach utilizes advances in Coupled Capacitance Discharge (CCD) camera systems to monitor discrete changes in the interactions between the material to be processed and the laser light. Newer CCD cameras have systems that can decrease the time the shutter is open to about 0.0001 second. At this speed, it is possible to see many features of the interaction between the laser light and the material being processed. Additionally, neutral density filters may be employed to decrease the glare observed from the incandescent interaction of the laser light and the material to be processed and to better image the interaction region.
• Numerous alterations, modifications, and variations of the various embodiments disclosed herein will be apparent to those skilled in the art and they are all anticipated and contemplated to be within the spirit and scope of the instant invention. For example, although specific embodiments have been described in detail, those with skill in the art will understand that the preceding embodiments and variations can be modified to incorporate various types of substitute and/or additional or alternative materials, relative arrangement of elements, and dimensional configurations. Accordingly, even though only few variations of the present invention are described herein, it is to be understood that the practice of such additional modifications and variations and the equivalents thereof, are within the spirit and scope of the invention as defined in the following claims.
• The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or acts for performing the functions in combination with other claimed elements as specifically claimed.

Claims (20)

1. An apparatus for processing a surface of an inhabitable structure, the apparatus comprising:

a head adapted to provide energy waves to an interaction region, the energy waves removing material from the structure, the head comprising a containment plenum which confines and removes material from the interaction region, the containment plenum comprising an interface portion which contacts the structure and which substantially surrounds the interaction region, thereby facilitating confinement and removal of material from the interaction region and providing reduced disruption to activities within the structure; and

an anchoring mechanism releasably coupled to the structure and releasably coupled to the head.

2. The apparatus ofclaim 1, wherein the head comprises optical elements adapted to receive laser light from an energy wave generator and to direct laser light to the interaction region.

3. The apparatus ofclaim 1, wherein the containment plenum is further adapted to reduce noise and light emitted out of the containment plenum from the interaction region.

4. The apparatus ofclaim 1, wherein the containment plenum comprises an extraction port which provides a pathway for removal of the material from the containment plenum.

5. The apparatus ofclaim 1, wherein the interface portion comprises a seal.

6. The apparatus ofclaim 1, wherein the head comprises one or more sensors which senses one or more of the following: whether the head is in contact with a surface of the inhabitable structure, and whether the head is coupled to the anchoring mechanism.

7. The apparatus ofclaim 1, wherein the head comprises a nozzle fluidly coupled to a compressed gas supply, the nozzle adapted to direct a compressed gas stream to the interaction region.

8. The apparatus ofclaim 1, wherein the anchoring mechanism comprises one or more resilient vacuum pads coupled to at least one vacuum generator.

9. The apparatus ofclaim 1, further comprising a detector coupled to a controller and adapted to detect embedded material in the structure while processing the structure, and to transmit detection signals to the controller, the controller adapted to avoid substantially damaging the embedded material by transmitting appropriate control signals to the head.

10. The apparatus ofclaim 9, wherein the detector is adapted to detect embedded material by using light emitted by the interaction region during processing.

11. The apparatus ofclaim 1, wherein the anchoring mechanism is releasably coupled to a surface within the inhabitable structure.

12. The apparatus ofclaim 1, wherein the anchoring mechanism is releasably coupled to the surface being irradiated by the head.

13. The apparatus ofclaim 1, wherein the surface being irradiated is within the inhabitable structure.

14. An apparatus for processing a surface of an inhabitable structure with reduced disruption to activities within the structure, the apparatus comprising:

means for providing energy waves to an interaction region of the structure to remove material from the structure;

means for confining the material and removing the material from the interaction region, said confining means comprising an interface portion which substantially surrounds the interaction region; and

means for anchoring said apparatus, said anchoring means being releasably coupled to the structure and releasably coupled to said means for providing the energy waves.

15. The apparatus ofclaim 14, wherein the means for providing the energy waves to the interaction region comprises laser optical elements adapted to receive laser light and to direct said laser light to the interaction region.

16. The apparatus ofclaim 14, wherein the means for anchoring said apparatus comprises one or more resilient vacuum pads coupled to at least one vacuum generator.

17. The apparatus ofclaim 14, wherein the means for anchoring said apparatus is releasably coupled to a surface within the inhabitable structure.

18. A method of processing a surface of an inhabitable structure with reduced disruption to activities within the structure, the method comprising:

releasably coupling an anchoring mechanism to the structure and to a head;

providing energy waves from the head to the surface, the energy waves interacting with the structure in an interaction region to remove material from the structure; and

confining the material and removing the material from the interaction region.

19. The method ofclaim 18, wherein the confining and removing of material comprises providing a containment plenum which contacts the structure and which substantially surrounds the interaction region.

20. The method ofclaim 18, further comprising reversibly assembling and disassembling the anchoring mechanism with the head to facilitate transportation of the anchoring mechanism and the head to a location in proximity to or within the structure.

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