US20080225498A1 - Adapter for a memory card and a memory card - Google Patents

Abstract

An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.

Description

CROSS-REFERENCE TO RELATED APPLICATION
• The present application claims priority from Japanese patent application No. 2005-053684 filed on Feb. 28, 2005, the content of which is hereby incorporated by reference into this application.
BACKGROUND OF THE INVENTION
• The present invention relates to a technique on an adapter for a memory card and a memory card. Particularly, the present invention is concerned with a technique applicable effectively to an adapter for a memory card still smaller than a small-sized memory card such as a reduced-size MMC, as well as the memory card.
• Such memory cards as a multi-media card (there is a standard established by Multi-Media Card Association; hereinafter referred to as MMC) and an SD card (there is a standard established by SD Card Association) are one of storage devices which store information in a semiconductor memory chip disposed in the interior thereof. In the memory cards in question, an access of information is made directly and electrically to a non-volatile memory formed in the semiconductor memory chip and thus there is no control of a mechanical system, so that the memory cards in question have such excellent characteristics as the read time being high and the replacement of a storage medium being easy in comparison with other storage devices. Besides, since the outline is relatively small-sized and light-weight, the memory cards in question are used mainly as auxiliary storage devices in devices required to be portable such as portable personal computers, portable telephones and digital cameras.
• An MMC is a small-sized and light-weight memory card having a weight of 1.5 g, outline dimensions of 32 mm×24 mm and a thickness of 1.4 mm. It is provided with a thin plate-like cap of a generally quadrangular shape in plan having a largely chamfered corner portion and is also provided with a memory body fitted in a recess formed in a parts-accommodating surface. The memory body includes a wiring substrate, a semiconductor chip mounted on a main surface of the wiring substrate, and a resin sealing member for sealing the semiconductor chip. The semiconductor chip is electrically connected through wiring lines formed on the wiring substrate to plural external terminals formed on a back surface of the wiring substrate. The plural external terminals are exposed to the exterior and are connected electrically to an electronic device in which the MMC is incorporated.
• A reduced-size MMC (Reduced Size MMC, hereinafter referred to as RSMMC) is a memory card (weight 0.8 g, outline dimensions 18 mm×24 mm, thickness 1.4 mm) of a size about half the size of the above MMC. An external terminal structure of the RSMMC has compatibility with the MMC and can be used as an MMC by using an adapter for a memory card.
• Further, the above SD card is a memory card having a weight of 3 g, outline dimensions of 32 mm×24 mm and a thickness of 2.1 mm. It is the same in shape as the MMC though different in weight and thickness. The SD card is provided with two thin plate-like cases of a quadrangular shape in plan having a largely chamfered corner portion and is also provided with a memory body sandwiched in between the two cases. Plural apertures are formed in a back surface of one case in the SD card, plural external terminals formed on a back surface of the memory body are exposed from the apertures, and the external terminals of the SD card and an electronic device in which the SD card is incorporated are electrically connected with each other through the apertures. The foregoing MMC is also employable in most of electronic devices insofar as the electronic devices are configured so as to permit the use of the SD card.
• As to the adapter for a memory card, a related description is found, for example, in Japanese Unexamined Patent Publication No. 2004-348557 (Patent Literature 1), in which there is disclosed a configuration of an adapter for converting such a small-sized memory card as RSMMC into an ordinary MMC size.
• Further, for example in Japanese Unexamined Patent Publication No. 2004-133516 (Patent Literature 2) there is disclosed a configuration wherein a sealing portion which covers an IC body is provided in the exterior of such a memory card as MMC and the IC body is held firmly while being sandwiched in between a memory card case and the sealing portion.
• [Patent Literature 1]
• Japanese Unexamined Patent Publication No. 2004-348557
• [Patent Literature 2]
• Japanese Unexamined Patent Publication No. 2004-133516
SUMMARY OF THE INVENTION
• Recently, with the reduction in size of electronic devices incorporated into memory cards, an extremely small-sized memory card somewhat thinner than the foregoing MMC and SD card and smaller in planar size than the RSMMC has been being commercialized. In this case, it is an important subject in what manner such an extremely small-sized memory card is to be made employable in a corresponding larger-size device such as MMC, SD card or RSMMC.
• It is an object of the present invention to provide a technique which can improve the versatility of an extremely small-sized memory card.
• The above and other objects and novel features of the present invention will become apparent from the following description and the accompanying drawings.
• The following is an outline of typical modes of the present invention as disclosed herein.
• In one aspect of the present invention there is provided an adapter for a memory card, the adapter having the same planar size as that of a memory card of a first size and having a space capable of receiving therein a memory card of a second size smaller than the first size, wherein the thickness of a region within the space of the adapter where internal terminals are disposed is made larger than that of a region of the adapter where plural external terminals are disposed.
• In another aspect of the present invention there is provided a memory card comprising a semiconductor chip mounted on a first surface of a wiring substrate and having a memory circuit which contributes to the storage of information, an electronic part mounted on a second surface on the side opposite to the first surface of the wiring substrate, and a plurality of external terminals disposed on the second surface of the wiring substrate at a position spaced away from the electronic part and connected electrically to both the semiconductor chip and the electronic part, wherein the thickness of a region of the memory card where the electronic part is mounted is made larger than that of a region of the memory card where the plural external terminals are disposed.
• The following is a brief description of effects obtained by the typical modes of the present invention as disclosed herein.
• Since the adapter for a memory card has the same planar size as that of a memory card of a first size and has a space able to receive therein a memory card of a second size smaller than the first size and the thickness of a region within the space of the adapter where internal terminals are disposed is made larger than that of a region of the adapter where plural external terminals are disposed, a memory card of an extremely small size can be changed to a memory card of a larger size and therefore it is possible to improve the versatility of the extremely small-sized memory card.
• Since the thickness of the electronic part mounted region of the memory card is made larger than that of the external terminals-disposed region of the memory card, it is possible to improve the performance of the memory card.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is an entire perspective view of an adapter for a memory card according to an embodiment of the present invention as seen from an upper surface side;
• FIG. 2 is an entire perspective view of the adapter ofFIG. 1 as seen from a back surface side;
• FIG. 3 is an entire plan view of the upper surface of the adapter;
• FIG. 4 is an entire plan view of the back surface of the adapter;
• FIG. 5 is a front view of the adapter as seen in the direction of arrow A inFIG. 3;
• FIG. 6 is a side view of the adapter as seen in the direction of arrow B inFIG. 3;
• FIG. 7 is a rear view of the adapter as seen in the direction of arrow C inFIG. 3;
• FIG. 8 is an entire perspective view of the adapter as seen from the upper surface (first surface) side in a state in which a memory card of an extremely small size is being loaded into the adapter;
• FIG. 9 is an entire perspective view of the adapter as seen from the back surface (second surface) side after loading of the extremely small-sized memory card;
• FIG. 10 is an entire plan view of an upper surface of the extremely small-sized memory card shown inFIG. 8;
• FIG. 11 is an entire plan view of a back surface of the extremely small-sized memory card shown inFIG. 10;
• FIG. 12 is a front view of the extremely small-sized memory card as seen in the direction of arrow A inFIG. 10;
• FIG. 13 is a side view of the extremely small-sized memory card as seen in the direction of arrow B inFIG. 10;
• FIG. 14 is a rear view of the extremely small-sized memory card as seen in the direction of arrow C inFIG. 10;
• FIG. 15 is an entire plan view of the upper surface of the adapter after loading of the extremely small-sized memory card;
• FIG. 16 is an entire plan view of the back surface of the adapter after loading of the extremely small-sized memory card;
• FIG. 17 is a sectional view taken on line X1-X1 inFIG. 15;
• FIG. 18 is an explanatory diagram of dimensions in the thickness direction of the adapter;
• FIG. 19 is an entire plan view of the back surface of the adapter shown inFIG. 1;
• FIG. 20 is an entire plan view showing an example of an inserted state of the adapter ofFIG. 1 into a socket of an electronic device;
• FIG. 21 is a side view of the adapter shown inFIG. 20;
• FIG. 22 is an entire plan view of a back surface of an adapter for a memory card according to another embodiment of the present invention;
• FIG. 23 is an explanatory diagram of a test work performed in a state in which a memory card is incorporated into the adapter ofFIG. 22;
• FIG. 24 is a side view of the adapter shown inFIG. 23;
• FIG. 25 is an entire perspective view of an adapter for a memory card according to a further embodiment of the present invention as seen from a back surface side;
• FIG. 26 is an entire perspective view of the adapter ofFIG. 25 as seen from a rear side;
• FIG. 27 is an entire perspective view of an adapter for a memory card according to a still further embodiment of the present invention as seen from a back surface side;
• FIG. 28 is an entire perspective view of an adapter for a memory card as seen from a back surface side which adapter is a modification of the adapter ofFIG. 27;
• FIG. 29 is an entire perspective view of an adapter for a memory card according to a still further embodiment of the present invention as seen from an upper surface side;
• FIG. 30 is an entire perspective view of the adapter ofFIG. 29 as seen from the upper surface side after loading of a memory card thereto;
• FIG. 31 is a rear view thereof;
• FIG. 32 is a sectional view taken on line X2-X2 inFIG. 30;
• FIG. 33 is an entire perspective view of a memory card according to a still further embodiment of the present invention as seen from a back surface side;
• FIG. 34 is an entire perspective view of an adapter for a memory card as seen from a back side of which adapter is a modification of the adapter ofFIG. 33;
• FIG. 35 is a side view on a memory card insertion side of the adapters ofFIGS. 33 and 34;
• FIG. 36 is a side view on a memory card insertion side of the adapters according to a modification ofFIG. 35;
• FIG. 37 is an entire perspective view of an adapter for a memory card as seen from an upper surface side which adapter is a modification of the adapters ofFIGS. 33 and 34;
• FIG. 38 is an entire perspective view of an adapter for a memory card as seen from an upper surface side according to a still further embodiment of the present invention;
• FIG. 39 is an entire perspective view of an adapter for a memory card as seen from an upper surface side of which adapter is a modification of the adapter ofFIG. 38;
• FIG. 40 is an entire plan view of an upper surface of an adapter for a memory card according to a still further embodiment of the present invention;
• FIG. 41 is an entire plan view of a back surface thereof;
• FIG. 42 is a front view of the adapter as seen in the direction of arrow A inFIG. 40;
• FIG. 43 is a side view of the adapter as seen in the direction of arrow B inFIG. 40;
• FIG. 44 is a rear view of the adapter as seen in the direction of arrow C inFIG. 40;
• FIG. 45 is an entire plan view of the upper surface of the adapter after loading thereto a memory card of an extremely small size;
• FIG. 46 is an entire plan view of the back surface of the adapter after loading thereto the extremely small-sized memory card;
• FIG. 47 is a sectional view taken on line X3-X3 inFIG. 45;
• FIG. 48 is a plan view of the adapter, showing an example of layout of connector wiring within the adapter;
• FIG. 49 is an entire perspective view of an adapter for a memory card as seen from an upper side according to a still further embodiment of the present invention;
• FIG. 50 is an entire perspective view of the adapter ofFIG. 49 as seen from the upper surface side after loading of a memory card thereto;
• FIG. 51 is a sectional view of a memory card according to a still further embodiment of the present invention as cut in parallel with a side face thereof;
• FIG. 52 is a sectional view of the memory card ofFIG. 51 as cut in parallel with a rear face thereof;
• FIG. 53 is a sectional view of a memory card according to a still further embodiment of the present invention as cut in parallel with a side face thereof;
• FIG. 54 is a sectional view of the memory card ofFIG. 53 as cut in parallel with a rear face thereof;
• FIG. 55 is a sectional view of a memory card according to a still further embodiment of the present invention as cut in parallel with a side face thereof;
• FIG. 56 is an enlarged sectional view of a principal part of a second portion on a back surface side of the memory card ofFIG. 55; and
• FIG. 57 is a sectional view of a memory card according to a still further embodiment of the present invention as cut in parallel with a side face thereof.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
• Where required for convenience's sake, the following embodiments will each be described in a divided manner into plural sections of embodiments, but unless otherwise mentioned, they are not unrelated to each other, but are in a relation such that one is a modification or a detailed or supplementary explanation of part or the whole of the other. In the following embodiments, when reference is made to the number of elements (including the number, numerical value, quantity and range), no limitation is made to the number referred to, but numerals above and below the number referred to will do as well unless otherwise mentioned and except the case where it is basically evident that limitation is made to the number referred to. Further, it goes without saying that in the following embodiments their constituent elements (including constituent steps) are not always essential unless otherwise mentioned or in the case where they are considered obviously essential in principle. Likewise, it is to be understood that when reference is made to the shapes and positional relation of constituent elements in the following embodiments, those closely similar to or resembling such shapes, etc. are also included unless otherwise mentioned or in the case where a negative answer obviously results in principle. This is also true of the foregoing numerical value and range. Moreover, in all of the drawings for illustrating the following embodiments, portions having the same functions are identified by like reference numerals, and repeated explanations thereof will be omitted if possible. Embodiments of the present invention will be described in detail hereinunder with reference to the accompanying drawings.
First Embodiment
• FIG. 1 is an entire perspective view of an adapter for a memory card according to a first embodiment of the present invention as seen from an upper surface (first surface) side,FIG. 2 is an entire perspective view of the adapter ofFIG. 1 as seen from a back surface (second surface) side,FIG. 3 is an entire plan view of the upper surface of the adapter ofFIG. 1,FIG. 4 is an entire plan view of the back surface of the adapter ofFIG. 1,FIG. 5 is a front view of the adapter as seen in the direction of arrow A inFIG. 3,FIG. 6 is a side view of the adapter as seen in the direction of arrow B inFIG. 3, andFIG. 7 is a rear view of the adapter as seen in the direction of arrow C inFIG. 3.
• An adapter for a memory card, (hereinafter referred to simply as “adapter”),1A according to a first embodiment of the present invention is constituted, for example, by a small thin plate of a rectangular planar shape having a large chamfered portion CA1 for index formed at one corner, for example. Theadapter1A has the same planar size (standardized) as that of a full-size MMC (a memory card of a first size or IC (Integrated Circuit) card), e.g., 24 mm in width W1 and 32 mm in length L1. Theadapter1A has a card receiving space able to receive therein a memory card (a memory card of a second size or IC card) of an extremely small size to be described later which is smaller than the MMC. Illustrated is one which functions as an adapter for HS (High Speed) MMC. When the extremely small-sized memory card is received into the card receiving space of theadapter1A, it becomes possible to use theadapter1A as an auxiliary storage device of MMC size in any of various portable electronic devices, including information processors such as portable computers, image processors such as digital cameras, and communication devices such as portable telephones.
• The size (standardized) of the thickness of theadapter1A according to the first embodiment is different from the standard of MMC and theadapter1A has a first portion which is relatively thin and a second portion which is relatively thick. The first portion which is relatively thin has a thickness D1 of, say, 1.4 mm equal to the ordinary thickness size (standardized) of MMC.
• In the first portion which is relatively thin, a terminal region and guide rail regions GR are disposed on a back surface of theadapter1A. In the terminal region, for example, thirteen external terminals (first external terminals)2 are arranged in two rows in the longitudinal direction of theadapter1A (in the longitudinal direction of the extremely small-sized memory card or in a direction of insertion of the same memory card into theadapter1A) in an exposed state to the exterior.
• The guide rail regions GR are regions retreated inwards by a length L2 (e.g., 0.8 mm or more) from side ends of theadapter1A and corresponding to guide rail regions of MMC. That is, when installing theadapter1A which incorporates the memory card into any of the foregoing electronic devices, guide rails for the memory card provided on the electronic device side are combined with the guide rail regions GR of theadapter1A. If the guide rail regions GR of theadapter1A are thick, it becomes impossible to install theadapter1A which incorporates the memory card into the electronic device. Therefore, the guide rail regions GR are formed in the first portion which is relatively thin.
• On the other hand, in the second portion relatively thicker than the first portion, there is formed a protuberant portion H somewhat protruding in a direction away from the back surface of theadapter1A. The thickness D2 of the second portion which is relatively thick is set at, say, about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm). The protuberant portion H in the second portion which is relatively thick is formed in such a manner that an outer periphery thereof is spaced by a length of L3 away from an outer periphery of theexternal terminals2. The length L3 is set to at least, say, 0.8 mm or more, preferably 1.0 mm or so, taking an overstroke into account when taking out the adapter with the memory card incorporated therein from the electronic device by a push-push method. That is, in theadapter1A of this first embodiment, the protuberant portion H in the second portion which is relatively thick is formed up to a rear face of theadapter1A from the position spaced by the length L3 from the outer periphery of theexternal terminals2. In the illustrated example, the protuberant portion H in the second portion which is relatively thick is present not only behind (toward the rear face of theadapter1A) theexternal terminals2 arranged in the second row (rear row) from a front face side of theadapter1A but also between the adjacent innermostexternal terminals2 in the aforesaid second row (rear row).
• In the rear face of theadapter1A is formed an opening (first opening)3 for inserting the extremely small-sized memory card from the exterior into the card receiving space formed in the interior of theadapter1A and for taking out the memory card from the card receiving space to the exterior. Theopening3 is formed by a slot (recess) formed in the rear face of theadapter1A. Theopening3 has a rectangular plane shape and has a width W2 of, say, about 10 to 15 mm which is larger than the width of the extremely small-sized memory card and smaller than the width W1 of theadapter1A. Further, theopening3 has a height D3 of, say, about 1.0 to 1.5 mm which is larger than the thickness of the extremely small-sized memory card and smaller than the thickness D2 of theadapter1A. That is, the thickness D2 of the second portion of theadapter1A is larger than the thickness D1 of the first portion. As will be described in detail later, theadapter1A is formed so that the thickness of its second portion is such a thickness D2 as to cover the sum of the thickness of thememory card5 and the height ofconnector lines10, whereby a space for the memory card indicated at5 and theconnector lines10 can be ensured within theadapter1A.
• FIG. 8 is an entire perspective view of the adapter as seen from the upper surface (first surface) side in a state in which the extremely small-sized memory card is being loaded into the adapter,FIG. 9 is an entire perspective view of the adapter as seen from the back surface (second surface) side after loading of the extremely small-sized memory card,FIG. 10 is an entire plan view of an upper surface of the extremely small-sized memory card shown inFIG. 8,FIG. 11 is an entire plan view of a back surface of the extremely small-sized memory card shown inFIG. 10,FIG. 12 is a front view of the extremely small-sized memory card as seen in the direction of arrow A inFIG. 10,FIG. 13 is a side view of the extremely small-sized memory card as seen in the direction of arrow B inFIG. 10, andFIG. 14 is a rear view of the extremely small-sized memory card as seen in the direction of arrow C inFIG. 10.
• As shown inFIGS. 8 and 9, the extremely small-sized memory card5 is received in the card receiving space of theadapter1A through theopening3 formed in the rear face of the adapter in a state in which pluralexternal terminals6 face the same direction as the plural external terminals of the adapter. Thememory card5 is smaller in outline size than the so-called RSMMC. For example, thememory card5 has a width W3 of 11 mm, a length L4 of 14 mm which is shorter than half of the length L1 in the longitudinal direction of theadapter1A, and a thickness D4 of about 1.0 to 1.2 mm. On a front-side back surface of thememory card5 are formed, say, eleven external terminals (second external terminals)6 in one row in an exposed state to the exterior.
• FIG. 15 is an entire plan view of the upper surface of the adapter after loading of the extremely small-sized memory card,FIG. 16 is an entire plan view of the back surface of the adapter after loading of the extremely small-sized memory card, andFIG. 17 is a sectional view taken on line X1-X1 inFIG. 15. InFIGS. 15 and 16, thememory card5 present within theadapter1A is shown in a see-through state. Broken lines shown inFIGS. 15 and 16 each represent the center in the longitudinal direction of theadapter1A (in the longitudinal direction of thememory card5, i.e., in the direction of insertion of thememory card5 into theadapter1A).
• Theadapter1A includes a first case (first housing)8aon the upper surface side of theadapter1A and a second case (second housing)8bon the back side of the adapter. Thefirst case8ahas an upper surface (first surface) and a back surface (second surface) which are positioned on mutually opposite sides in the thickness direction of theadapter1A. On the back surface of thefirst case8a, not only the pluralexternal terminals2 are disposed, but also thesecond case8bis joined to the back surface by a thermosonic wire bonding method for example.
• As shown inFIG. 17, the portion of thefirst case8aalone in theadapter1A is the first portion as a relatively thin portion having the thickness D1, while the joined portion between the first andsecond cases8a,8bis the second portion as a relatively thick portion having the thickness D2. That is, thesecond case8bforms the projecting portionH. Concave portions8a1 and8b1 formed respectively in opposed surfaces of the first andsecond cases8a,8boverlap each other in the joined portion between the first and second cases, whereby thecard receiving space9 is formed. Thecard receiving space9 is positioned centrally in the width direction (transverse direction) of theadapter1A. That is, vacant regions are present right and left of thecard receiving space9.
• From the standpoint of, for example, attaining the reduction of weight, easiness of machining and flexibility, the first andsecond cases8a,8bare formed of a thermoplastic resin such as, for example, polycarbonate, ABS (acrylonitrile butadiene styrene resin, PBT (polybutylene terephthalate, PPE (polyphenylene ether), nylon, LCP (liquid crystal polymer), PET (polyethylene terephthalate), or a mixture thereof. The first andsecond cases8a,8bmay each be formed by plural blocks. In this case, all of the plural blocks may be formed of resin, but a thin block portion may be formed of metal. By so doing it is possible to improve the mechanical strength of thethin adapter1A.
• Each of theexternal terminals2 is connected electrically to one end of the associated connector line (wiring line)10. Opposite ends of theconnector lines10 extend into thecard receiving space9 and are electrically connected tointernal terminals10awhich are integrally formed at extending ends of the connector lines10. Theinternal terminals10aare disposed within thecard receiving space9 so as to become electrically connected to theexternal terminals6 of thememory card5 upon insertion of the memory card into thecard receiving space9. The connections between theconnector lines10 and theinternal terminals10aare formed in a curved shape so as to operate as plate springs. With the curved connections, when thememory card5 is inserted into thecard receiving space9, theinternal terminals10aare urged toward theexternal terminals6 of thememory card5, press theexternal terminals6 and come into contact firmly with theexternal terminals6.
• FIG. 18 is an explanatory diagram of dimensions in the thickness direction of theadapter1A.
• The present inventors have studied fabrication of an adapter which permits a change in size of the extremely small-sized memory card5 into the MMC size. As described above, the thickness of MMC is 1.4 mm, while that of thememory card5 is about 1.0 to 1.2 mm, therefore, it follows that there remains only about 0.2 to 0.4 mm as the difference between both thicknesses. Assuming that the adapter is required to have a case thickness of at least 0.1 mm, the total thickness of upper and lower cases in the adapter thickness direction is 0.2 mm, thus giving rise to the problem that a portion for disposing theinternal terminals10acannot be ensured within the adapter.
• In this first embodiment, therefore, theadapter1A is formed with a second portion thicker than the first portion whose thickness is equal to the thickness of MMC, as noted above. More specifically, in theadapter1A, the thickness of at least the region where theinternal terminals10aare disposed is made larger than the thickness of the region where the pluralexternal terminals2 are disposed. As a result, a portion where theinternal terminals10aare to be disposed can be ensured within theadapter10aand hence it is possible to provide theadapter1A which permits a change of the extremely small-sized memory card5 to MMC. That, since the extremely small-sized memory card5 can be changed to the larger MMC by inserting it into theadapter1A, it is possible to improve the versatility of thememory card5.
• If a projection height D5 of each internal terminal10ais, say, about 0.1 mm and a height D6 necessary for constituting the plate spring of eachconnector line10 is, say, about 0.2 to 0.3 mm, a height (thickness of thesecond case8bor the height of the protuberant portion H) D7 necessary for installation of theinternal terminals10ais equal to height D5+height D6 and is therefore, say, about 0.3 to 0.4 mm. Given that the thickness D8 of thefirst case8ais 0.1 mm, the thickness D2 of the thick, second portion of theadapter1A becomes equal to the thickness D4 (1.2 mm) of the extremely small-sized memory card5+height D7+thickness D8 and is, say, about 1.6 to 1.7 mm. Since the socket of the electronic device for insertion therein of MMC has such dimensions as permit insertion therein of SD card (thickness 2.1 mm), an upper limit of the thickness D2 of the thick, second portion in theadapter1A is, say, 2.1 mm. That is, the thickness D2 of the thick, second portion is, say, 1.6 to 2.1 mm. Or, the height (thickness of thesecond case8bor the height of the protuberant portion H) D7 necessary for installation of theinternal terminals10ais, say, 0.3 to 0.7 mm.
Second Embodiment
• FIG. 19 is an entire plan view of the back surface of the adapter of the previous first embodiment,FIG. 20 is an entire plan view showing an example of an inserted state of the memory card-incorporated adapter into a socket of an electronic device,FIG. 21 is a side view of the adapter shown inFIG. 20,FIG. 22 is an entire plan view of a back surface of an adapter according to a second embodiment of the present invention,FIG. 23 is a diagram showing a state in which a memory card is being tested in an inserted condition thereof into the adapter shown inFIG. 22, andFIG. 24 is a side view showing an example in which the adapter ofFIG. 22 with the memory card incorporated therein is installed into a socket of an electronic device.
• The protuberant portion H described in the first embodiment has a convex shape in plan constituted by a front-side region RA and a rear-side region RB of theadapter1A, as shown inFIG. 19. In this second embodiment, reference will be made to a case where the projecting portion has a generally quadrangular shape in plan with the front-side region RA omitted.
• FIGS. 20 and 21 illustrate an inserted state of theadapter1A ofFIG. 19 into a socket of an electronic device. As shown inFIG. 20,terminals12 disposed within the socket of the electronic device extend from the front to the rear side of theadapter1A and come into contact withexternal terminals2 of the adapter.FIG. 21 is a sectional view (side view) ofFIG. 20, illustrating an inserted state of theadapter1A into the socket of the electronic device. As shown in these figures, it is seen that the front region RA of theadapter1A can be omitted.
• FIG. 22 illustrates a case where the front side of theadapter1A is omitted. As to a protuberant portion H, it is of the same structure as that in the first embodiment with respect to the rear side of theadapter1A and is present on only the rear side from the second row ofexternal terminals2. That is, the protuberant portion H is not formed in the first and second rows ofexternal terminals2. According to this structure, since the shape of the protuberant portion H is simple, it becomes possible to simplify the manufacturing process for theadapter1A.
• The present inventors have made a study about a configuration which permits the execution of a test work without taking out thememory card5 from theadapter1A in the event of malfunction of thememory card5. In more particular terms, the present inventors have made a study about an adapter structure which permits the execution of a test work using an existing test device for MMC in an inserted state of the memory card into theadapter1A on the assumption that the test cannot be performed by the existing test device in case of a change of thememory card5 into an extremely small-sized one.
• InFIG. 22, plural test terminals TEST are provided in a space formed by omission of the front-side region RA of theadapter1A. The plural test terminals TEST are each formed at a position spaced a distance L3 from the first and second rows ofexternal terminals2 so as to avoid contact thereof with theexternal terminals2. Thus, the test terminals TEST are spaced away from the external terminals lest they should contact the external terminals.
• For distinction from theexternal terminals12, each test terminal TEST is formed smaller in size than theexternal terminals12 and is formed in a different shape from the shape of the external terminals. As to the layout of the test terminals TEST, although in the illustrated example the test terminals TEST are arranged at equal intervals in both the direction of insertion of thememory card5 and a direction orthogonal to the card inserting direction, no limitation is made thereto. For example, they may be arranged in a zigzag fashion. In this case, it becomes possible to arrange a larger number of test terminals TEST than in the equally spaced layout. Further, although in the illustrated example the test terminals TEST are formed in a circular shape, no limitation is made thereto. For example, they may be formed in a semicircular, elliptic or polygonal shape.
• The plural test terminals TEST are electrically connected (not shown) to thememory card5 present within theadapter1A, so in the event a controller chip mounted within thememory card5 should become inoperable due to electrostatic breakdown for example, it is possible to make a direct access control for a non-volatile memory chip from the exterior through the test terminals if there remain data in the non-volatile memory chip.FIG. 23 shows a state in which a test is being conducted by applying an existing test device to the test terminals TEST. Although in the drawing a test probe is shown in a simplified form as the existing test device, no limitation is made thereto. Various other existing test devices are employable.
• Thus, in this embodiment the manufacturing process can be simplified by omitting the front-side region RA of theadapter1A. Moreover, since the plural test terminals TEST are provided in the space formed by omission of the front-side region RA, it is possible to conduct a test work for thememory card5 with use of an existing test device.
Third Embodiment
• FIG. 25 is an entire perspective view of an adapter according to a third embodiment of the present invention as seen from a back surface side andFIG. 26 is an entire perspective view of the adapter as seen from a rear side.
• In this third embodiment, guideportions13 are formed along both inner side faces of anopening3 and acard receiving space9 in anadapter1C. Theguide portions13 extend from theopening3 toward thecard receiving space9 and have not only a function of assisting a horizontal movement of thememory card5 at the time of inserting or taking out the memory card into or from the card receiving space but also a function of preventing insertion in an erroneous direction (reverse insertion) of thememory card5. Other constructional points of theadapter1C are common to theadapter1A of the first embodiment. In this third embodiment, theopening3 of theadapter1C is formed in a polygonal shape in plan. In the example shown inFIGS. 25 and 26, theopening3 is formed so as to have a region different in width in a direction orthogonal to the direction of insertion of thememory card5. More specifically, theopening3 is formed so that the width thereof on the back surface side of theadapter1C is longer than that on the upper surface side of the adapter.
• According to this third embodiment, since theopening3 has the above structure and theguide portions13 are provided, it is possible to prevent reverse insertion of thememory card5 and hence possible to prevent damage and deterioration ofinternal terminals10aandconnector lines10 within theadapter1C which are caused by the reverse insertion.
• Of course, the contents of this third embodiment may be combined with the previous second embodiment. In this case, it is possible to obtain the respective effects of both embodiments.
Fourth Embodiment
• FIG. 27 is an entire perspective view of an adapter according to a fourth embodiment of the present invention as seen from a back surface side andFIG. 28 is an entire perspective view of an adapter as seen from a back surface side which adapter is a modification of the adapter ofFIG. 27.
• In this fourth embodiment a description will be given aboutadapters1D and1E for the ordinary MMC which is not for HSMMC. For example, sevenexternal terminals2 are arranged in one row on a front back side of each of theadapters1D and1E. In the second portion which is relatively thick, a protuberant portion H is formed over a rear face of each of theadapter1D and1E from a position which is spaced away by the length L3 from a position corresponding to the second row in the case of theexternal terminals2 being arranged in two rows. Other constructional points are the same as those described above in the first to third embodiments.FIG. 27 shows an example in which the guide rails13 are not formed, whileFIG. 28 shows an example in which the guide rails13 are formed. In the latter case it is possible to obtain the same effects as in the third embodiment.
Fifth Embodiment
• FIG. 29 is an entire perspective view of an adapter according to a fifth embodiment of the present invention as seen from an upper surface side,FIG. 30 is an entire perspective view of the adapter ofFIG. 29 as seen from the upper surface side after loading of a memory card thereto,FIG. 31 is a rear view of the adapter ofFIG. 30, andFIG. 32 is a sectional view taken on line X2-X2 inFIG. 30.
• In this fifth embodiment, an opening (second opening)15 extending from theopening3 toward thecard receiving space9 is formed in an upper surface of theadapter1F. As in the first and second embodiments, theopening15 is formed by a slot (recess) formed in an upper surface of theadapter1F.
• Guide portions16 are provided at upper positions of both inner side faces of theopening15. Theguide portions16 are formed along side faces of the slot which forms theopening15 and are constituted by protruding portions (convex portions) protruding from the side faces. The protruding portions are formed at positions closer to the upper surface side of theadapter1F rather than the bottom side of the slot.
• Theguide portions16 have not only a function of assisting a horizontal movement of thememory card5 at the time of inserting or taking out the memory card into or from thecard receiving space9 and a function of preventing reverse insertion of thememory card5 but also a function of pressing thememory card5 to prevent the card from moving out of thecard receiving space9. In this case, as shown inFIG. 30, when thememory card5 is received into thecard receiving space9 of theadapter1F, the upper surface of the memory card assumes an exposed state to the exterior.
• Theguide portions16 extend continuously from the rear to the front side of theadapter1F. Also on side faces of thememory card5 there are formedguide portions5gas portions corresponding to theguide portions16. Further formed on the side faces of thememory card5 arestopper portions5sfor stopping movement of thememory card5 upon insertion of the card into theadapter1F. Other constructional points are the same as in the first to fourth embodiments. Theguide portions5gand thestopper portions5sare formed on side faces of thememory card5 and are constituted by protruding portions (convex portions) protruding from the side faces. Theguide portions5gextend from the front face (a face orthogonal to the direction of insertion of thememory card5 into theadapter1F) of thememory card5 toward the rear face of the card. The protruding portions do not extend up to the rear face of thememory card5 and thus thestopper portions5sare free of the protruding portions in the vicinity of the rear face of thememory card5.
• With such a configuration of thememory card5, as shown inFIG. 32, thememory card5 can be disposed upward by an amount corresponding to an upper surface portion of afirst case8aof theadapter1F. That is, a thickness corresponding to the thickness of the upper surface portion of thefirst case8acan be subtracted from the thickness of thememory card5, so that the thickness D2 of a relatively thick, second portion of theadapter1F can be made smaller than in the first to fourth embodiments.
• In the case of a configuration wherein only the rear side portion of thememory card5 is exposed, there sometimes is a case where it is difficult to take out thememory card5 because of a small size of the memory card. On the other hand, in this fifth embodiment, thememory card5 can be taken out easily because the upper surface of thememory card5 received in thecard receiving space9 of theadapter1F is also exposed to the exterior.
Sixth Embodiment
• FIG. 33 is an entire perspective view of an adapter according to a sixth embodiment of the present invention as seen from a back surface side thereof,FIG. 34 is an entire perspective view of an adapter as seen from a back surface side which adapter is a modification of the adapter ofFIG. 33,FIG. 35 is a side view on a memory card insertion side of the adapters ofFIGS. 33 and 34,FIG. 36 is a side view on a memory card insertion side of the adapters according to a modification ofFIG. 35, andFIG. 37 is an entire perspective view of an adapter as seen from an upper surface side which adapter is a modification of the adapters ofFIGS. 33 and 34.
• In this sixth embodiment, anopening3 for inserting and taking out thememory card5 into and from thecard receiving space9 is formed in a side face of each ofadapters1G and1H.
• In the case where anopening3 is formed in a rear face of an adapter, the rear face of the adapter is exposed from a card take-out opening of the associated electronic device and the rear face of thememory card5 is also in an exposed state, so there is a fear that thememory card5 may be pulled out by mistake.
• In this sixth embodiment, theopening3 is formed in a side face of each of theadapters1G and1H, so even if the rear face of each of theadapters1G and1H is exposed from the card take-out opening formed on the associated electronic device side, there is no fear of thememory card5 being pulled out by mistake, because the rear face of thememory card5 is not exposed.
• FIG. 33 shows an example of an adapter for HSMMC having thirteen external terminals andFIG. 34 shows an example of an adapter for the ordinary MMC having sevenexternal terminals2. InFIGS. 33 and 34 there is illustrated amemory card5 in which, say, twentyexternal terminals6 are arranged in two rows.FIG. 35 shows an example anopening3 free of guide portions, whileFIG. 36 shows an example of anopening3 havingguide portions13. Theopenings3 are each formed by a slot (recess) formed in a side face of each of theadapters1G and1H. As to theadapter1G, as shown inFIG. 35, its sectional and planar shapes are the same as in the first embodiment. As to theadapter1H, as shown inFIG. 36, its sectional and planar shapes are the same as in the third embodiment. With the guide portions, it is possible to obtain the same effects as in the third embodiment. Further,FIG. 37 shows an example in which anopening15 is formed in an upper surface of each of theadapters1G and1H as in the fifth embodiment. In this case, it is possible to obtain the same effects as in the fifth embodiment.
Seventh Embodiment
• FIG. 38 is an entire perspective view of an adapter according to a seventh embodiment of the present invention as seen from an upper surface side andFIG. 39 is an entire perspective view of an adapter as seen from an upper surface side which adapter is a modification of the adapter ofFIG. 38. In the drawings there is illustrated amemory card5 in which, say, twentyexternal terminals6 are arranged in two rows.
• In this seventh embodiment, anopening3 for inserting and taking out thememory card5 into and from thecard receiving space9 is formed in an upper surface of each ofadapters1J and1K. Theopening3 can be opened and closed with alid20. Thelid20 is formed of resin or metal for example and is supported on the upper surface side of each of theadapters1J and1K in a state in which it can be opened and closed with a hinge portion.
• In theadapter1J ofFIG. 38, aconvex retaining portion20ais integrally formed at an end of thelid20. When thelid20 is closed, the retainingportion20ais positioned on the rear side of thememory card5 present within thecard receiving space9 and functions to prevent thememory card5 from falling out of theadapter1J against the will of the user. With the retainingportion20a, there is no fear of occurrence of such an inconvenience of thememory card5 is pulled out by mistake from the interior of theadapter1J. On a side face of a slot which constitutes theopening3 of theadapter1J there is formed a protrudingportion3a. The protrudingportion3ais provided to determine the position (height from the bottom of the slot which constitutes the opening3) of thememory card5 when the memory card is inserted into theopening3. Therefore, thememory card5 can be fixed stably upon insertion thereof. Although only one protrudingportion3ais provided in the illustrated example, plural such protrudingportions3 may be provided, whereby thememory card5 can be fixed in a more stable manner.
• Arecess8b2 is formed in the bottom of the slot which constitutes theopening3. Upon insertion of thememory card5, therecess8b2 comes into fitting engagement with the retainingportion20aof thelid20, whereby thememory card5 can be loaded stably to theadapter1J.
• Thelid20 has recesses (slots)20bformed in sides different from the side where the retainingportion20ais provided. Further, protrudingportions3bseparate from the protrudingportion3aare formed on side faces of the slot which constitutes theopening3. The protrudingportions3bare each formed at a position closer to the surface of theadapter1J with respect to the protrudingportion3a. When thememory card5 is inserted into the adapter, the protrudingportions3aand3bare fitted in the memory card, whereby the memory card can be loaded to theadapter1J in a more stable manner. Thus, since the retainingportion20aand therecesses20bare formed on different sides of thelid20, there are obtained three support points upon insertion of thelid20 into theadapter1J. Consequently, thememory card5 can be loaded in a much more stable manner than in the case of the retainingportion20aalone with only one support point. Although in the illustrated example therecesses20band the protrudingportions3bare each formed at two positions, it goes without saying that a more stable loading of the memory card can be effected by providing each of them in a larger number than two.
• In theadapter1K ofFIG. 39, a retainingplate21 is provided on the rear side of theadapter1K. A recess21ais formed centrally in the transverse direction of the retainingplate21. When thelid20 is closed, the retainingportion20aof thelid20 is fitted in the recess21aof the retainingplate21 in a satisfactory manner. According to such a configuration, also in the case of theadapter1K, there is no fear of occurrence of an inconvenience such that thememory card5 present within theadapter1K is pulled out by mistake. Like theadapter1J, theadapter1K is also provided with the protrudingportions3a,3band recesses20b, whereby it is possible to obtain the same effects as in the case of theadapter1J described above.
Eighth Embodiment
• FIG. 40 is an entire plan view of an upper surface of an adapter according to an eighth embodiment present invention,FIG. 41 is an entire plan view of a back surface of the adapter ofFIG. 40,FIG. 42 is a front view of the adapter as seen in the direction of arrow A inFIG. 40,FIG. 43 is a side view of the adapter as seen in the direction of arrow B inFIG. 40, andFIG. 44 is a rear view of the adapter as seen in the direction of arrow C inFIG. 40.
• Anadapter1L according to this eighth embodiment has the same planar size (standardized) as that of the so-called RSMMC (a memory card of the first size or IC card), e.g., 24 mm in width W1 and 18 mm in length L5 and has a card receiving space which can receive therein the foregoing extremely small-sized memory card (a memory card of the second size or IC card) smaller than the RSMMC. The illustrated adapter is one which functions as an adapter especially for HSMMC among RSMMCs. By inserting the extremely small-sized memory card into the card receiving space of theadapter1L, the adapter becomes employable as an auxiliary storage device in any of various portable electronic devices, including the foregoing information processors, image processors and communication devices.
• Also in this eighth embodiment the thickness size (standardized) of theadapter1L is different from the standardized size of RSMMC, and theadapter1L has a first portion which is relatively thin and a second portion which is relatively thick.
• The first portion which is relatively thin has a thickness D1 of, say, 1.4 mm which is the same as the thickness size (standardized) of the ordinary RSMMC. As in the first embodiment, a terminal region and guide rail regions GR are arranged on a back surface of theadapter1L. For example, thirteenexternal terminals2 are arranged in two rows in the transverse direction of theadapter1L (in the longitudinal direction of the extremely small-sized memory card or in the direction of insertion of the extremely small-sized memory card into theadapter1L) in an exposed state to the exterior. The guide rail regions GR are the same as in the first embodiment.
• On the other hand, in the relatively thick, second portion thicker than the first portion, a protuberant portion H is formed on the back surface of theadapter1L. The thickness D2 of the relatively thick, second portion is the same as in the first embodiment. A planar layout of the protuberant portion H in the relatively thick, second portion is the same as in the second embodiment. That is, in theadapter1L of this eighth embodiment, the protuberant portion H in the relatively thick, second portion is formed over the rear face of theadapter1L from a position spaced a length L3 from the outer periphery of the second row (rear row) ofexternal terminals2. A planar layout of the protuberant portion H may be such a layout as in the first embodiment. Further, anopening3 is formed in the rear face of theadapter1L. The shape and size of theopening3 are the same as in the first embodiment.
• Next,FIG. 45 is an entire plan view of the upper surface of the adapter after loading thereto of an extremely small-sized memory card,FIG. 46 is an entire plan view of the back surface of the adapter after loading thereto of the extremely small-sized memory card,FIG. 47 is a sectional view taken on line X3-X3 inFIG. 45, andFIG. 48 is a plan view of the adapter, showing an example of layout of connector wiring within the adapter. InFIGS. 45,46 and48, the memory card present within theadapter1L is shown in a see-through state. Broken lines inFIGS. 45 and 46 each represent the center in the transverse direction of theadapter1L (in the longitudinal direction of thememory card5 or in the direction of insertion of thememory card5 into theadapter1L).
• The configuration of thememory card5 is the same as in the first to seventh embodiments. In this case, the length in the longitudinal direction of thememory card5 is larger than half of the length in the transverse direction of theadapter1L. Thememory card5 is inserted with its rear side ahead into theadapter1L. The reason is that, in the case of RSMMC, the length in the direction of insertion of thememory card5 is shorter than MMC and that therefore, if thememory card5 is inserted with its front side ahead into theadapter1L, theexternal terminals6 of thememory card5 are positioned in the layout region (terminal region) of theexternal terminals2 of theadapter1L, thus making it impossible to arrange therein theinternal terminals10aof theadapter1L.
• Theadapter1L includes a first case (first housing)8con its upper surface side and a second case (second housing)8don its back surface side. Thefirst case8chas an upper surface (first surface) and a back surface (second surface) which are positioned on mutually opposite sides in the thickness direction of theadapter1L. The pluralexternal terminals2 are arranged on the back surface of thefirst case8cand thesecond case8dis joined to the back surface of the first case.
• In theadapter1L, the portion of only thefirst case8cis the relatively thin, first portion having the thickness D1, while the joined portion between the first andsecond cases8c,8dis the relatively thick, second portion having the thickness D2. That is, thesecond portion8dforms the protuberantportion H. Recesses8c1 and8d1 formed respectively in the opposed surfaces of the first andsecond cases8c,8doverlap each other to form thecard receiving space9. Thecard receiving space9 is positioned centrally in the width direction (longitudinal direction) of theadapter1L. The material and configuration of the first andsecond cases8c,8dare the same as those of the first andsecond cases8a,8bdescribed above.
• Theexternal terminals2 are electrically connected respectively to one ends of connector lines (wiring lines)10. Opposite ends of theconnector lines10 extend into thecard receiving space9 and are electrically connected tointernal terminals10awhich are formed integrally at extending ends of the connector lines10. The configuration of theconnector lines10 and that of theinternal terminals10aare the same as those described in the first embodiment. Of theplural connector lines10,predetermined connector lines10 are disposed in right and left vacant regions (especially in the relatively thick, second portion) in the width direction (transverse direction) of thememory card5, as shown inFIG. 48, whereby theconnector lines10 can be disposed within a thin and small area of theadapter1L. That is, the thickness of the second portion of theadapter1L is set to such a thickness D2 as covers the sum of both thickness of thememory card5 and height of theconnector lines10, whereby the space for bothmemory card5 andconnector lines10 can be ensured within theadapter1A.
Ninth Embodiment
• FIG. 49 is an entire perspective view of an adapter according to a ninth embodiment of the present invention as seen from an upper surface side andFIG. 50 is an entire perspective view of the adapter ofFIG. 49 as seen from the upper surface side after loading of a memory card thereto.
• In this ninth embodiment, as in the fifth embodiment, etc., an opening (second opening)15 is formed in an upper surface of anadapter1M for RSMMC so as to extend from theopening3 toward thecard receiving space9. Theguide portions16 described above are formed at upper positions of both inner side faces of theopening15. Also in this case, as shown inFIG. 50, When amemory card5 is inserted into thecard receiving space9, its upper surface assumes an exposed state to the exterior. Also in this ninth embodiment it is possible to obtain the same effects as in the fifth embodiment.
• Since thememory card5 is inserted in the reverse direction, the stopper portion described above is not formed on the rear face of thememory card5. Other constructional points are the same as in the first to eighth embodiments.
Tenth Embodiment
• FIG. 51 is a sectional view of a memory card according to a tenth embodiment of the present invention as cut in parallel with a side face thereof andFIG. 52 is a sectional view of the memory card ofFIG. 51 as cut in parallel with a rear face thereof.
• A memory card (semiconductor device or IC card)25A according to this tenth embodiment is employable as an auxiliary storage device in any of various portable electronic devices, including image processors such as digital cameras and communication devices such as portable telephones.
• Thememory card25A is constituted by a small thin plate of a rectangular plane shape having a large chamfered portion CA1 for index at one corner for example. It outline dimensions are, for example, 24 mm in width W1, 32 mm in length L1, and 1.4 mm in thickness D1. Thememory card25A has the same planar size and function as those of the so-called full-size MMC. An upper surface (first surface) of thememory card25A is the same as inFIG. 3, while a back surface (second surface) of thememory card25A is the same as inFIGS. 4 and 22. Length L10 is, say, about 6.5 mm and length L11 is, say, about 24.7 mm.
• However, the thickness size (standardized) of thememory card25A of this tenth embodiment is different from the standardized size of MMC and thememory card25A includes a first portion which is relatively thin and a second portion which is relatively thick.
• In the relatively thin, first portion, a terminal region and guide rail regions GR are disposed on the back surface of thememory card25A. Theexternal terminals2 described above are disposed in the terminal region in an exposed state to the exterior. The layout of theexternal terminals2 is the same as in the first to ninth embodiments. The guide rail regions GR are also the same as in the first embodiment. On the other hand, in the relatively thick, second portion which is thicker than the first portion there is formed a protuberant portion H which protrudes slightly in a direction away from the back surface of thememory card25A. The thickness D2 of the relatively thick, second portion is set at, say, about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm).
• Thememory card25A includes a first case (first housing)8e, a second case (second housing)8fand amemory body26.
• Thememory body26 includes awiring substrate27, plural semiconductor chips (hereinafter referred to simply as chips)28amounted on a main surface (first surface) of thewiring substrate27, a sealing portion (first resin sealing body)29awhich seals thechips28a, a chip (electronic part)28bmounted on a back surface (second surface) of thewiring substrate27, and a sealing portion (second resin sealing body)29bwhich seals thechip28b.
• Thewiring substrate27 which constitutes thememory body26 includes the main surface (first surface) and the back surface (second surface) which are opposite to each other in the thickness direction of the wiring substrate. Thewiring substrate27 is constituted by, for example, one or two or more multiple metal wiring layers (wiring lines) disposed within an insulator such as, for example, glass fabric-based epoxy resin. Wiring lines on the main surface (first surface) of thewiring substrate27 are electrically connected via through holes to the wiring lines on the back surface (second surface) of thewiring substrate27 and the pluralexternal terminals2. Theexternal terminals2 are for electric connection between the memory card25 and the electronic device, with terminals of the electronic device being brought into contact with theexternal terminals2.
• Flash memory circuits which contribute to the storage of information are formed respectively on theplural chips28aprovided on the main surface of thewiring substrate27, providing a total memory capacity of, say, 16 M bytes (128M bits), 32 M bytes (256M bits), or 64 M bytes (512M bits). In the illustrated example, theplural chips28afor memory are stacked in the thickness direction of thewiring substrate27, whereby a large capacity can be ensured at a small occupied area. Of course, a desired memory capacity may be obtained by arranging theplural chips28afor memory on the main surface of thewiring substrate27. Thechips28aare electrically connected respectively to the wiring lines of thewiring substrate27 through bonding wires (hereinafter referred to simply as wires)30aand are thereby further connected electrically to thechip28band theexternal terminals2. For example, thewires30aare gold (Au) wires.
• The sealingportion29awhich seals theplural chips28ais formed using a thermosetting resin such as, for example, an orthocresol novolak type epoxy resin or a biphenyl type epoxy resin and it is one of principal objects thereof to seal thechips28aand thewires30ain a satisfactory manner. Within the sealingportion29aare included plural fine fillers of quartz glass, e.g., silicon dioxide (SiO₂), harder than the resin for improving the mechanical strength, low hygroscopicity and moldability and for adjusting (lowering) the thermal expansion coefficient with respect to the sealingportion29afor example. Further included in the sealingportion29aare an accelerator (a catalyst for accelerating the reaction of the resin), a mold release agent, a flame retardant and a colorant. As the colorant there are used carbon grains. Thefirst case8eis joined over the whole main surface of thewiring substrate27 so as to cover the sealingportion29a. The material of thefirst case8eis the same as that of thefirst case8a.
• On the other hand, a controller circuit for controlling the operation of the flash memory circuit of each of thechips28afor example is formed in thechip28bmounted on the back surface of thewiring substrate27. Thechip28bis electrically connected to wiring lines on thewiring substrate27 throughwires30band is electrically connected through the wiring lines to thechips28afor memory and theexternal terminals2. Thewires30bare formed of gold (Au) for example. Since thechip28bis disposed on the back surface of thewiring substrate27, it is possible to dispose a large number ofchips28afor memory on the main surface side of thewiring substrate27. Consequently, the memory capacity can be increased without changing the planar size of thememory card25A.
• Thechip28bmay be substituted, for example, by a dielectric antenna, a ferrite part for Blue Tooth, or a chip part (electronic part) having a passive element such as coil, capacitor or resistor (e.g., pull-up resistor). In this case, the passive element can be disposed closer to the flash memory circuit and control circuit and hence it is possible to improve electrical characteristics of thememory card25A.
• The sealingportion29bwhich seals thechip28bis formed of the same material as that of the sealingportion29aand it is one of main objects thereof to seal thechip28band thewires30bin a satisfactory manner. Thecase8fis joined to the back surface of thewiring substrate27 at a position spaced a length L3 from the second row (rear row) ofexternal terminals2 of thememory card29bso as to cover the sealingportion29b. The protuberant portion H is formed by thesecond case8f. The reason why the spacing from the second row ofexternal terminals2 is set at L3 is the same as that set forth in the first embodiment. The material of thesecond case8fis the same as that of thefirst case8a.
Eleventh Embodiment
• FIG. 53 is a sectional view of a memory card according to an eleventh embodiment of the present invention as cut in parallel with a side face thereof andFIG. 54 is a sectional view of the memory card ofFIG. 53 as cut in parallel with a rear face thereof.
• In amemory card25B of this eleventh embodiment, thesecond case8fdescribed above is not joined to a back surface of thememory card25B and a sealingportion29bis exposed to the exterior. In this case, a protuberant portion H corresponds to only the thickness of the sealingportion29b, so that the thickness D2 of the second portion can be made smaller than in the case of thememory card25A of the tenth embodiment. Since the sealingportion29bis exposed, there is a fear that constituent portions such as terminals and guide rails of the electronic device may be damaged or deteriorated by for example fillers contained in the sealingportion29b. In this case, it is preferable to make the amount of fillers contained in the sealingportion29bsmaller than that contained in the main surface-side sealing portion29aor use fillers smaller in particle diameter than the fillers contained in the sealingportion29a. Other constructional points are the same as in the tenth embodiment.
Twelfth Embodiment
• FIG. 55 is a sectional view of a memory card according to a twelfth embodiment of the present invention as cut in parallel with a side face thereof andFIG. 56 is an enlarged sectional view of a principal part of a second portion on a back surface side of the memory card ofFIG. 55.
• A memory card (semiconductor device or IC card) according to this twelfth embodiment has the same planar size and function as those of the so-called RSMMC, e.g., 24 mm in width W1 and 18 mm in length L5. An upper surface (first surface) of thememory card25C is the same as inFIG. 40 and a back surface (second surface) thereof is the same as inFIG. 41. Length L12 is, say, about 10.6 mm.
• Also in the case of thememory card25C of this embodiment, its thickness size (standardized) is different from the standard of RSMMC and thememory card25C includes a first portion which is relatively thin and a second portion which is relatively thick. The relatively thin, first portion has a thickness D1 equal to the thickness size (standardized) of the ordinary RSMMC, e.g., 1.4 mm.
• In the relatively thin, first portion, a terminal region and guide rail regions GR are disposed on the back surface of thememory card25C. As in the first to eleventh embodiments, external terminals are arranged in the terminal region in an exposed state to the exterior. The guide rail regions GR are also the same as in the first embodiment. On the other hand, in the relatively thick, second region which is thicker than the first region there is formed a protuberant portion H which slightly protrudes in a direction away from the back surface of thememory card25C. The relatively thick, second portion has a thickness D2 of, say, about 1.6 to 2.1 mm (preferably 1.6 to 1.7 mm).
• Thememory card25C includes a first case (first housing)8g, a second case (second housing)8h, and amemory body26.
• Thememory body26 includes awiring substrate27,plural chips28a,28bmounted on a main surface (first surface) of thewiring substrate27, a sealing portion (first resin sealing body)29afor sealing thechips28aand28b, a passive element (electronic part)31 mounted on a back surface (second surface) of thewiring substrate27, and a sealing portion (second resin sealing body)29bfor sealing thepassive element31. Thewiring substrate27,chips28a,28band sealingbodies29a,29bare the same as in the tenth and eleventh embodiments.
• It is one of principal objects of the sealingportion29bto seal thepassive element31 in a satisfactory manner. Also in thememory card25C, thesecond case8hdescribed above is jointed to the back surface of thewiring substrate27 so as to cover the sealingportion29bat a position spaced a distance L3 from the second row (rear row) ofexternal terminals2 of the memory card. The protuberant portion H is formed by thesecond case8h. The reason why the spacing is set at the length L3 is the same as that set forth in the first embodiment. The material of the first andsecond cases8g,8his the same as that of thefirst case8adescribed above.
• In the illustrated example, a pull-up resistor is shown as thepassive element31 which resistor is connected in series with anexternal terminal2 for signal to prevent the occurrence of ringing waveform of a high-speed signal. Thepassive element31 includeselectrodes31aspaced apart a desired distance from each other andcarbon paste31bwhich is deposited so as to bridge theelectrodes31a. Theelectrodes31aare formed, for example, by plating the surface of a copper (Cu) body with silver (Ag) and are connected electrically to the aforesaidexternal terminal2 andchips28a,28bthrough wiring lines of thewiring substrate27. A resistor (pull-up resistor) is formed by thecarbon paste31bpresent between theadjacent electrodes31a. For example, a printing method is used to form such a pull-up resistor. Thickness D1 is, say, about 100 μm.
• When the pull-up resistor is formed within a chip, there occur variations in resistance value due to a heat treatment which is performed during fabrication of the chip, and thus it is impossible to form within a chip a pull-up resistor for which a high accuracy is required. On the other hand, if the pull-up resistor is disposed on the electronic device side, it may be impossible to obtain satisfactory electrical characteristics because of a too long distance between memory circuit and control circuit. In this twelfth embodiment, it is possible to improve the resistance value setting accuracy in comparison with the case where the resistor is formed within a chip. Moreover, since thepassive element31 for the pull-up resistor is provided on the back surface of thememory card25C, it is possible to shorten the distance from thepassive element31 to thechips28afor memory and thechip28bfor control. As a result, it is possible to improve the electrical characteristics of thememory card25C. The pull-up resistor may be substituted by, for example, a dielectric antenna, a ferrite part for Blue Tooth, or anotherpassive element31 having a thickness falling under the range of the thickness D2 such as a coil or a capacitor.
Thirteenth Embodiment
• FIG. 57 is a sectional view of a memory card according to thirteenth embodiment of the present invention as cut in parallel with a side face thereof.
• In amemory card25D of this thirteenth embodiment, thesecond case8hdescribed above is not joined to a back surface of thememory card25D, but a sealingportion29bis exposed to the exterior. In this case, a protuberant portion H corresponds to only the thickness of the sealingportion29band therefore it is possible to make the thickness of the second portion D2 smaller than in thememory card25C of the twelfth embodiment. Since the sealingportion29bis exposed, there is a fear of damage or deterioration of terminals of the electronic device or such components as guide rails by for example fillers contained in the sealingportion29b. In this case, it is preferable to make the amount of fillers contained in the sealingportion29bsmaller than that of fillers contained in the main surface-side sealing portion29aor use fillers smaller in particle size than the fillers contained in the sealingportion29a. Other constructional points are the same as in the twelfth embodiment.
• Although the present invention has been described above concretely by way of embodiments thereof, it goes without saying that the invention is not limited to the above embodiments, but that various changes may be made within the scope not departing from the gist of the invention.
• For example, although in the tenth to thirteenth embodiments each chip and the wiring substrates are electrically connected with each other through wires, no limitation is made thereto. The chip and the wiring substrates may be electrically connected with each other through bump electrodes. In this case, the chip is mounted on the wiring substrate through bump electrodes in a state in which its main surface is opposed to the main surface of the wiring substrate. Components on the main surface of the chip are connected to wiring lines of the wiring substrate through bump electrodes and are further connected electrically to external terminals.
• Although the present invention has been described above mainly about the case where it is applied to a portable computer, a digital camera or a portable telephone as a background application field thereof, no limitation is made thereto. The present invention is applicable also to other mobile information processors such as, for example, PDA (Personal Digital Assistants).
INDUSTRIAL APPLICABILITY
• The present invention is applicable to the manufacturing industry of memory card adapters and memory cards.

Claims (8)

1-15. (canceled)

16. A memory card comprising:

a wiring substrate having a first surface and a second surface which are disposed on mutually opposite sides in the thickness direction of the wiring substrate;

a semiconductor chip mounted on the first surface of the wiring substrate and having a memory circuit which contributes to the storage of information;

a first resin sealing body for sealing the semiconductor chip;

a first housing provided on the first surface side of the wiring substrate so as to cover the first surface of the wiring substrate and also cover the first resin body;

an electronic part mounted on the second surface of the wiring substrate;

a second resin sealing body for sealing the electronic part;

a plurality of external terminals formed on the second surface side of the wiring substrate at a position spaced away from the second resin sealing body and connected electrically to the semiconductor chip and the electronic part; and

a second housing provided on the second surface of the wiring substrate so as to cover the second resin sealing body at a position spaced away from the area where the plurality of the external terminals are disposed to let the external terminals be exposed to the exterior,

wherein the thickness of the memory card portion where the second housing is provided is larger than the thickness of the memory card portion where the plurality of the external terminals are disposed.

17. A memory card according toclaim 16, wherein the plurality of the external terminals are disposed in two rows in a direction of insertion of the memory card into an electronic device.

18. A memory card according toclaim 16, wherein the electronic part is a semiconductor chip, the semiconductor chip having a control circuit for controlling the operation of the semiconductor chip having the memory circuit which contributes to the storage of information.

19. A memory card according toclaim 16, wherein the electronic part is a passive element.

20. A memory card according toclaim 19, wherein the passive element is a pull-up resistor.

21. A memory card comprising:

a wiring substrate having a first surface and a second surface which are disposed on mutually opposite sides in the thickness direction of the wiring substrate;

a semiconductor chip mounted on the first surface of the wiring substrate and having a memory circuit which contributes to the storage of information;

a first resin sealing body for sealing the semiconductor chip;

a first housing provided on the first surface side of the wiring substrate so as to cover the first surface of the wiring substrate and also cover the first resin sealing body;

an electronic part mounted on the second surface of the wiring substrate;

a second resin sealing body for sealing the electronic part, the second resin sealing body being formed in an exposed state to the exterior; and

a plurality of external terminals formed on the second surface side of the wiring substrate at a position spaced away from the second resin sealing body and connected electrically to the semiconductor chip and the electronic part,

wherein the thickness of the memory card portion where the second resin sealing body is provided is larger than the thickness of the memory card portion where the plurality of the external terminals are disposed.

22. A memory card according toclaim 21, wherein the plurality of the external terminals are disposed in two rows in a direction of insertion of the memory card into an electronic device.

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