US20080067662A1 - Modularized Die Stacking System and Method - Google Patents

Abstract

An IC die and a flexible circuit structure are integrated into a lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. A die is positioned above the surface of portions of a pair of flex circuits. Connection is made between the die and the flex circuitry. A protective layer is formed to protect the flex-connected die and its connection to the flex. Connective elements are placed along the flex circuitry to create an array of module contacts along the second side of the flex circuitry. The flex circuitry is positioned above the body-protected die to create an integrated lower stack element. The integrated lower stack element may be stacked either with iterations of the integrated lower stack element or with a pre-packaged IC to create a multi-element stacked circuit module.

Description

RELATED APPLICATIONS
• This application is a continuation of U.S. application Ser. No. 10/435,192, filed May 9, 2003, which is a continuation-in-part of U.S. application Ser. No. 10/005,581, filed Oct. 26, 2001, now U.S. Pat. No. 6,576,992, both of which are hereby incorporated by reference for all purposes.
TECHNICAL FIELD
• The present invention relates to aggregating integrated circuits and, in particular, to stacking integrated circuits.
BACKGROUND OF THE INVENTION
• A variety of techniques are used to stack integrated circuits. Some methods require special packages, while other techniques stack conventional packages and still others stack multiple die within a single package. In some stacks, the leads of the packaged integrated circuits are used to create a stack, while in other systems, added structures such as rails provide all or part of the interconnection between packages. In still other techniques, flexible conductors with certain characteristics are used to selectively interconnect packaged integrated circuits. In yet other methods, one IC is connected to another within a single plastic body from which leads or contacts emerge.
• The predominant package configuration employed during the past decade has encapsulated an integrated circuit (IC) in a plastic surround typically having a rectangular configuration. The enveloped integrated circuit is connected to the application environment through leads emergent from the edge periphery of the plastic encapsulation. Such “leaded packages” have been the constituent elements most commonly employed by techniques for stacking packaged integrated circuits.
• Leaded packages play an important role in electronics, but efforts to miniaturize electronic components and assemblies have driven development of technologies that preserve circuit board surface area. Because leaded packages have leads emergent from peripheral sides of the package, leaded packages occupy more than a minimal amount of circuit board surface area. Consequently, alternatives to leaded packages have recently gained market share.
• One family of alternative packages is identified generally by the term “chip scale packaging” or CSP. CSP refers generally to packages that provide connection to an integrated circuit through a set of contacts (often embodied as “bumps” or “balls”) arrayed across a major surface of the package. Instead of leads emergent from a peripheral side of the package, contacts are placed on a major surface and typically emerge from the planar bottom surface of the package.
• The goal of CSP is to occupy as little area as possible and, preferably, approximately the area of the encapsulated IC. Therefore, CSP leads or contacts do not typically extend beyond the outline perimeter of the package. The absence of “leads” on package sides renders most stacking techniques devised for leaded packages inapplicable for CSP stacking.
• CSP has enabled reductions in size and weight parameters for many applications. For example, micro ball grid array for flash and SRAM and wirebond on tape or rigid laminate CSPs for SRAM or EEPROM have been employed in a variety of applications. CSP is a broad category including a variety of packages from near chip scale to die-sized packages such as the die sized ball grid array (DSBGA) recently described in proposed JEDEC standard 95-1 for DSBGA. To meet the continuing demands for cost and form factor reduction with increasing memory capacities, CSP technologies that aggregate integrated circuits in CSP technology have recently been developed. For example, Sharp, Hitachi, Mitsubishi and Intel support what are called the S-CSP specifications for flash and SRAM applications. Those S-CSP specifications describe, however, stacking multiple die within a single chip scale package and do not describe stacking integrated circuits that are individually modularized in plastic, either as BGA's or other common CSP packages. Stacking integrated circuits within a single package requires specialized technology that includes reformulation of package internals and significant expense with possible supply chain vulnerabilities.
• There are several known techniques for stacking packages articulated in chip scale technology. For example, the assignee of the present invention has developed previous systems for aggregating micro-BGA packages in space saving topologies. The assignee of the present invention has systems for stacking BGA packages on a DIMM in a RAMBUS environment.
• In U.S. Pat. No. 6,205,654 B1 owned by the assignee of the present invention, a system for stacking ball grid array packages that employs lead carriers to extend connectable points out from the packages is described. Other known techniques add structures to a stack of BGA-packaged ICs. Still others aggregate CSPs on a DIMM with angular placement of the packages. Such techniques provide alternatives, but require topologies of added cost and complexity.
• U.S. Pat. No. 6,262,895 B1 to Forthun (the “Forthun patent”) purports to disclose a technique for stacking chip scale packaged ICs. The Forthun patent discloses a “package” that exhibits a flex circuit wrapped partially about a CSP. The flex circuit is said to have pad arrays on upper and lower surfaces of the flex.
• The flex circuit of the Forthun “package” has a pad array on its upper surface and a pad array centrally located upon its lower surface. On the lower surface of the flex there are third and fourth arrays on opposite sides from the central lower surface pad array. To create the package of Forthun, a CSP contacts the pad array located on the upper surface of the flex circuit. As described in the Forthun patent, the contacts on the lower surface of the CSP are pushed through “slits” in the upper surface pads and advanced through the flex to protrude from the pads of the lower surface array and, therefore, the bottom surface of the package. Thus, the contacts of the CSP serve as the contacts for the package. The sides of the flex are partially wrapped about the CSP to adjacently place the third and fourth pad arrays above the upper major surface of the CSP to create from the combination of the third and fourth pad arrays, a fifth pad array for connection to another such package. Thus, as described in the Forthun disclosure, a stacked module of CSPs created with the described packages will exhibit a flex circuit wrapped about each CSP in the module.
• The previous known methods for stacking CSPs apparently have various deficiencies including complex structural arrangements and thermal or high frequency performance issues. To increase dissipation of heat generated by constituent CSPs, the thermal gradient between the lower CSP and upper CSP in a CSP stack or module should be minimized. Prior art solutions to CSP stacking do not, however, address thermal gradient minimization in disclosed constructions.
• In other applications, module height concerns impact the utility of known solutions in integrated circuit aggregation. In some stacking solutions, the bad die problem is significant. Indigenous as well as processing-acquired defects can lead to unacceptably high failure rates for stacks created by aggregating IC elements before testing the constituent members of the assembly. For example, where stacking techniques employ one or more unpackaged die, there is typically not an opportunity for adequate preassembly test before the constituent ICs of the assembly are aggregated. Then, testing typically reveals bad stacks, it does not prevent their assembly and consequent waste of resources.
• What is needed, therefore, is a technique and system for stacking integrated circuits using a technology that provides a thermally efficient, reliable structure that performs well at higher frequencies, but does not add excessive height to the stack yet allows pre-stacking test of constituent stack elements with production at reasonable cost with readily understood and managed materials and methods.
SUMMARY OF THE INVENTION
• The present invention integrates an IC die and a flexible circuit structure into an integrated lower stack element that can be stacked with either further integrated lower stack element iterations or with pre-packaged ICs in any of a variety of package types. The present invention can be used to advantage where size minimization, thermal efficiency and or test before stacking are significant concerns. The present invention may be employed to stack similar or dissimilar integrated circuits and may be used to create modularized systems.
• In the present invention, an IC die is integrated with flex circuitry to create an integrated lower stack element. In a preferred embodiment, a die is positioned above the surface of portions of a pair of flex circuits. Connection is made between the die and the flex circuitry. A protective layer such as a molded plastic, for example, is formed to create a body that protects the flex-connected die and its connection to the flex. Connective elements are placed along the flex circuits to create an array of module contacts along the second side of the flex circuitry. Portions of the pair of flex circuits are positioned above the body to create an integrated lower stack element. The integrated lower stack element may be stacked either with further iterations of the integrated lower stack element or with pre-packaged ICS to create a multi-element stacked circuit module. The present invention may be employed to advantage in numerous configurations and combinations in modules provided for high-density memories or high capacity computing.
SUMMARY OF THE DRAWINGS
• FIG. 1 is an elevation view ofmodule10 devised in accordance with a preferred embodiment of the present invention.
• FIG. 2 depicts an exemplar connection of an integrated circuit die to one of two flex circuits in a preferred embodiment of the present invention.
• FIG. 3 depicts an elevation view of an integrated lower stack element in accordance with a preferred embodiment of the present invention.
• FIG. 4 depicts an exemplar integration of a die in a flip-chip configuration with flex circuitry in accordance with a preferred embodiment of the present invention.
• FIG. 5 depicts an exemplar construction details of an integrated lower stack element in accordance with a preferred embodiment of the present invention.
• FIG. 6 depicts an exemplar construction details of an integrated lower stack element in accordance with another preferred embodiment of the present invention.
• FIG. 7 depicts an exemplar conductive layer in a preferred flex circuitry employed in a preferred embodiment of the present invention.
DESCRIPTION OF PREFERRED EMBODIMENTS
• FIG. 1 is an elevation view ofmodule10 devised in accordance with a preferred embodiment of the present invention.Module10 is comprised of integratedlower stack element12 andupper IC element14.
• Upper IC element14 that is depicted inFIG. 1 may be any of a variety of types and configurations of CSP such as, for example, those that are die-sized, as well those that are near chip-scale as well as the variety of ball grid array packages known in the art. Typical CSPs, such as, for example, ball-grid-array (“BGA”), micro-ball-grid array (“μBGA”), and fine-pitch ball grid array (“FBGA”) packages have an array of connective contacts embodied, for example, as leads, bumps, solder balls, or balls that extend from a lower surface of a plastic casing in any of several patterns and pitches. An external portion of the connective contacts is often finished with a ball of solder. Collectively, these will be known herein as chip scale packaged integrated circuits (CSPs) and preferred embodiments will be described in terms of CSPs, but the particular configurations used in the explanatory figures are not, however, to be construed as limiting. For example, in the elevation view ofFIG. 1,upper IC element14 is depicted as a CSP of a particular profile known to those in the art, but it should be understood that the figures are exemplary only.Upper IC element14 need not be limited to traditional CSP packaging and as those of skill recognize the opportunity, the present invention is adaptable to future package configurations. The present invention is advantageously employed with memory circuits but may be employed to advantage with logic and computing circuits even where the constituent elements ofmodule10 are dissimilar.Upper IC element14 is shown withupper IC contacts19.
• Integratedlower stack element12 is shown withdie16 andconnections20 that connect die16 to flexcircuits18.Protective surround22 is disposed to protectconnections20 and die16. In a preferred embodiment,protective surround22 is a plastic surround. As aprotective surround22 is formed aboutdie16, abody23 is formed havinglateral sides21 and anupper surface25.Protective body23 will, in a preferred embodiment, surround portions of die16 that would otherwise be exposed to potential environmental damage.
• FIG. 2 depicts an exemplar connection of an integrated circuit die16 to one of twoflex circuits18 in a preferred embodiment of the present invention to create a die-flex combination. As the present description continues, those of skill will recognize that a die-flex combination in accordance with the present invention may be devised in a variety of particular manners including using one or two flex circuits to provide connection to die16, as well as using flex circuitry having one or more conductive layers. Preferably, the flex circuitry will articulate connective structures such as flex contacts and traces that will later be described.
• As shown inFIG. 2, diepads24 on die16 are connected to flexattachments26 offlex18 byconnections20 which, in the illustrated exemplar, are wire bonding connections. Diepads24 are just one type of die connective site that may be employed in the present invention. Other die connective sites such as flip-chip, tab and connective rings, balls, or pads may be employed. Die connective sites may also be construed to include combinations of such structures to provide a connective site for the die. Wire bonding is well known in the art and those of skill will appreciate that many other methods may be used to provideconnections20 betweendie16 and the flex circuitry employed for the invention. For example, tab or flip-chip or other attachment techniques known in the art can be profitably used to implementconnections20. Those of skill will also appreciate that diepads24 ofdie16 can be arranged in a variety of configurations across the IC. As is known in the art, through diepads24, die16 expresses data and instructions as well as ground and voltage connections.
• Flex18 may be configured to interconnect to die16 with other connective configurations. For example, as a variant on the flip-chip connectivity scheme,flex attachments26 may be placed on the side offlex circuits18 opposite that shown inFIG. 2 to place theflex attachments26 immediately adjacent to the surface ofdie16 to provide direct connection betweendie16 andflex circuitry18. It should also be understood that in the preferred embodiment shown inFIG. 1, twoflex circuits18 are employed but implementations of the invention can be devised using oneflex circuit18.
• FIG. 3 depicts an elevation view of an integratedlower stack element12 before its assembly into amodule10.Die16 is placed adjacent to flexcircuits18 and fixed in place withadhesive28. A variety of adhesive methods are known in the art and, in a preferred embodiment, an adhesive is used that has thermally conductive properties.
• With reference toFIG. 4, in a preferred embodiment, portions offlex circuits18A and18B are fixed to die16 by adhesive28 which may be a liquid or tape adhesive or may be placed in discrete locations across the package. When used, preferably, adhesive28 is thermally conductive. Adhesives that include a flux are used to advantage in some steps of assembly ofmodule10.Layer28 may also be a thermally conductive medium or body to encourage heat flow.
• As shown in this preferred embodiment,module contacts30 are fixed alongflex circuits18A and18B opposite the side of the flex circuits nearest to which die16 is adjacent. The shownpreferred module contacts30 are familiar to those in the art and may be comprised of eutectic, lead-free, solid copper, or other conductive materials. Other contact implementing structures may be used to createmodule contacts30 as long as the conductive layer or layers of the flex circuitry can be connected tomodule contacts30 to allow conveyance of the signals conducted inflex circuits18 to be transmitted to an environment external to integratedlower stack element12. Balls are well understood, but other techniques and structures such as connective rings, built-up pads, or even leads may be placed alongflex circuits18 to createmodule contacts30 to convey signals frommodule10 to an external environment. Any of the standard JEDEC patterns may be implemented withmodule contacts30 as well as custom arrays of module contacts for specialized applications.
• FIG. 4 depicts the integration ofdie16 devised in a flip-chip configuration with twoflex circuits18A and18B in accordance with a preferred embodiment of the present invention. Those of skill will understand that the depiction ofFIG. 4 is not drawn to scale. Die16 exhibits diepads24 along a lower surface of the die. Attached to diepads24 aredie connectors32 which, in the depicted embodiment, are flip-chip balls or connectors. As shown,flex circuits18A and18B havemodule contacts30.
• Any flexible or conformable substrate with a conductive pattern may be used as a flex circuit in the invention. The preferred flex circuitry will employ more than one conductive layer, but the invention may be implemented with flex circuitry that has only a single conductive layer.
• Even though single conductive layer flex circuitry may readily be used in the invention,flex circuit18 is preferably a multi-layer flexible circuit structure that has at least two conductive layers. This is particularly appropriate where frequencies to be encountered are higher. Preferably, the conductive layers are metal such as copper alloy 110 although any conductive material may be employed in this role. The use of plural conductive layers provides advantages such as the creation of a distributed capacitance acrossmodule10 intended to reduce noise or bounce effects that can, particularly at higher frequencies, degrade signal integrity, as those of skill in the art will recognize.
• The entire flex circuit may be flexible or, as those of skill in the art will recognize, a PCB structure made flexible in certain areas to allow conformability aroundbody23 and rigid in other areas for planarity along surfaces may be employed as an alternative flex circuitry in the present invention. For example, structures known as rigid-flex may be employed.
• Flex circuits18A and18B shown inFIG. 4 are comprised of multiple layers. Depictedflex circuits18A and18B have a firstouter surface36 and a secondouter surface38. The depictedpreferred flex circuits18A and18B have two conductive layers interior to first and secondouter surfaces36 and38. In the depicted preferred embodiment, firstconductive layer40 and secondconductive layer42 are interior to first and secondouter surfaces36 and38, respectively. Intermediate support layer44 lies between firstconductive layer40 and secondconductive layer42. There may be more than one intermediate layer, but an intermediate layer of polyimide is preferred. Preferably, the intermediate layer provides mechanical support for the flex circuitry.
• It should be understood that in some embodiments of the invention, there will be fewer layers employed inflex circuit18. For example, aflex circuit18 may be devised for use in the present invention that lacks firstouter surface36 and/or secondouter surface38. In such a case, firstconductive layer40 will be on the surface of theparticular flex circuit18. Where there is a first outer surface, to make contact with firstconductive layer40 as shown inFIG. 4, dieconnectors32 pass throughwindows46 to reach firstconductive layer40. Similarly, where there is a secondouter surface38,module contacts30 pass throughwindows48 in secondouter surface38 to reach secondconductive layer42.
• In a preferred embodiment, firstconductive layer40 is employed as a ground plane, while secondconductive layer42 provides the functions of being a signal conduction layer and a voltage conduction layer. Thus, secondconductive layer42 is employed to implement signal connections between integratedlower stack element12 andupper IC element14, while firstconductive layer40 is employed to implement ground connections between integratedlower stack element12 andupper IC element14. Those of skill will note that roles of the first and second conductive layers may be reversed. This may be implemented by flex layer design or by attendant use of interconnections. As is understood, thermal management is typically related to conductive layer materials and mass as well as the proximity between the die and the conductive layer.
• Selective connections between first and secondconductive layers40 and42 may be implemented with vias such as the via indicated inFIG. 4 byreference50. There are, however, many other alternative methods to provide any needed connections between the conductive layers. For example, appropriate connections may be implemented by any of several well-known techniques such as plated holes or solid lines or wires. Thus, the connections need not literally be implemented with vias.
• As will be illustrated in later figures, traces are delineated in conductive layers to convey, where needed, signals between selectedmodule contacts30 andparticular die connectors32 in the case of flip-chip style die16 or betweenmodule contacts30 andflex connectors26 in the case where wire-bond connections20 are implemented or between upper and lower flex contacts as will be described herein. Those of skill will recognize that traces can be implemented in a variety of configurations and manners and where die connectors are positioned coincident with module contact placement, trace use is minimized. For example, in some cases, if the die connectors32 (illustrated as flip-chip connectors) are placed appropriately on die16, a via50 may be used to directly connect a selecteddie connector32 to a selectedmodule contact30 without intermediate lateral conveyance between the two through a trace. Where a single conductive layer flex circuitry is employed in an embodiment, there will be no need for a via if adie connector32 is positioned coincident with amodule contact30 to implement connection through alower flex contact62 such as is depicted inFIG. 5.
• FIG. 5 illustrates an exemplar construction of an integratedlower stack element12 in accordance with an alternative preferred embodiment of the present invention that employs flex circuitry having a single conductive layer. As shown, die16 is appended to flexcircuits18A and18B with adhesive28. The depicted embodiment also exhibits optional inter-flex connective51 that passes through the part ofprotective surround22 that lies betweenflex circuit18A andflex circuit18B. The inter-flex connective may consist of one or more wires or other connective structures such as may be implemented in wire bond, lead frame or other form.
• As those of skill will recognize, die16 is connected to flexcircuits18A and18B throughdie pads24 and dieconnectors32.Flex circuits18A and18B are depicted with first and secondouter layers36 and38, respectively.Support layer54 provides structure forflex circuits18A and18B andconductive layer52 provides conductivity betweendie connectors32 andmodule contacts30.Conductive layer52 also provides conductivity between integratedlower stack element12 and added elements such as another integratedlower stack element12 orupper IC element14 that may be aggregated to createmodule10.
• Those of skill will recognize that in the depicted embodiment,conductive layer52 is disposed closer tomodule contacts30 than issupport layer54. This relative placement is preferred but not required. Such persons will also recognize thatsupport layer54 provides a support function similar to that provided by intermediate layer44 in multi-layer flex circuitry embodiments such as those earlier described herein.
• Demarcation gap56 depicted inFIG. 5 provides selective isolation oflower flex contact62 ofconductive layer52 from areas ofconductive layer52 that may provide other functions or other interconnections between different ones ofdie connectors32 andmodule contacts30 or other interconnections to other elements ofmodule10. For example, in the embodiment ofFIG. 5,flex circuits18A and18B are shown as having one conductive layer (i.e., layer52). Therefore, in the depicted alternative embodiment, that oneconductive layer52 is intended to provide interconnectivity functions formodule10. Consequently, particular interconnection features should be isolated from each other to allow rational connections to be implemented inmodule10 where conductive layer structures are used. This is depicted bydemarcation gap56, but those of skill will understand thatdemarcation gap56 is merely exemplary and assorted gaps and traces may be used inconductive layer52 just as they may (but need not necessarily) be used in conductive layers in multi-conductive layer flex embodiments to provide rational interconnectivity features formodule10. However, as those of skill will recognize, the present invention may be implemented with a flex circuitry that exhibits a dedicated connective network of individual traces and/or interconnections.
• With continuing reference toFIG. 5, a signal may be conveyed from die16 throughdie pad24 thoughdie connector32 throughlower flex contact62 atconductive layer52 tomodule contact30. Such connection paths may convey voltage, ground or data or instruction signal connections in and out ofdie16.
• In the depicted embodiment ofFIG. 5,lower flex contacts62 provide connection betweendie16 andmodule contacts30 as well as participating in selected connections betweendie16 and the circuit ofupper IC element14. However, in addition, a set of flex contacts such as those identified in laterFIG. 7 as upper flex contacts with respect to a secondconductive layer42 shown inFIG. 7, may, in the single conductive layer embodiment ofFIG. 5, participate in the connection between the circuit ofupper IC element14 and the flex circuitry employed in the particular embodiment.
• FIG. 6 depicts an alternative preferred embodiment of the present invention. In the embodiment as depicted inFIG. 6, die16 is disposed above firstouter surface36 while die connective sites which, in this instance, aredie pads24 are connected tolower flex contacts62 at the level ofconductive layer52 withwire bond connections20 throughwindows46.Body23 is formed about the depicted die-flex combination and, in the preferred embodiment, is formed employingprotective surround22.Module contacts30 are connected to thelower flex contacts62 to express the appropriate set of signals emanating fromdie16. As those of skill will understand as to the preferred embodiment ofFIG. 6, when integratedlower stack element12 is incorporated into amodule10, a set of upper contacts are articulated in theconductive layer52 to provide connective facility for anupper IC element14 or another integratedlower stack element12. Further, traces64 may be employed to provide connections between those upper flex contacts and the lower flex contacts andappropriate module contacts30. Those of skill will recognize that in some instances, there may bemodule contacts30 that are connected only to an upper element in aparticular module10.
• FIG. 7 illustrates an exemplar secondconductive layer42 as may be implemented inflex circuits18A and18B of a preferred embodiment. Also shown is a depiction ofdie16 and its underside17. Identified inFIG. 7 areupper flex contacts60 andlower flex contacts62 that are at the level of secondconductive layer42 offlex circuits18A and18B.Upper flex contacts60 andlower flex contacts62 are conductive material and, preferably, are solid metal. Only some ofupper flex contacts60 andlower flex contacts62 are identified with reference numerals inFIG. 7 to preserve clarity of the view.
• Each offlex circuits18A and18B in the depicted preferred embodiment have bothupper flex contacts60 andlower flex contacts62. Depending upon the contact pattern ofdie16 andupper IC element14, some embodiments may exhibit only lower or only upper flex contacts inflex circuits18A or18B.
• In the preferred embodiment depicted inFIG. 7,lower flex contacts62 are employed withmodule contacts30 to provide connective facility for integratedlower stack element12 inmodule10. Thus, in a preferred embodiment,module contacts30 are connected tolower flex contacts62 as shown in exemplar fashion inFIG. 4 and inFIG. 5 in which figure atrace64 is shown in the connective path between via50 andlower flex contact62. However, as those of skill will recognize, traces between selected upper and lower flex contacts provide a connective path betweenupper IC element14 and integratedlower stack element12 and/or directly tomodule contacts30.
• As those of skill will recognize, interconnection of respective contacts ofupper IC element14 and integratedlower stack element12 will also preferably provide a thermal path between the twoelements12 and14 to assist in moderation of thermal gradients throughmodule10. Those of skill will notice that between first and secondconductive layers40 and42, there is at least one intermediate layer44 that, in a preferred embodiment, is a polyimide. Placement of such an intermediate layer between ground-conductive firstconductive layer40 and signal/voltage conductive secondconductive layer42 provides, in the combination, a distributed capacitance that assists in mitigation of ground bounce phenomena to improve high frequency performance ofmodule10.
• With continuing reference toFIG. 7, depicted are various types ofupper flex contacts60, various types oflower flex contacts62, and traces64.Lower flex contacts62A are connected to corresponding selectedupper flex contacts60A with signal traces64. To enhance the clarity of the view, only exemplarindividual flex contacts62A and60A and traces64 are literally identified inFIG. 7.
• To improve high frequency performance, signal traces64 may be devised to exhibit path routes determined to provide substantially equal signal lengths betweencorresponding flex contacts60A and62A. For example, such relatively equal length traces are illustrated in U.S. patent application Ser. No. 10/005,581 which is incorporated by reference into this application.
• As shown in the depicted preferred embodiment ofFIG. 7, traces64 are separated from the larger surface area of secondconductive layer42 that is identified asVDD plane66.VDD plane66 may be in one or more delineated sections but, preferably is contiguous perflex circuit18. Further, other embodiments may lackVDD plane66.
• Lower flex contacts62B andupper flex contacts60B provide connection toVDD plane66. In a preferred embodiment,upper flex contacts60B andlower flex contacts62B selectively connectupper IC element14 and integratedlower stack element12, respectively, toVDD plane66.
• Lower flex contacts62 that are connected to firstconductive layer40 byvias50 are identified aslower flex contacts62C. To enhance the clarity of the view, only exemplar individuallower flex contacts62C are literally identified inFIG. 7.Upper flex contacts60 that are connected to firstconductive layer40 byvias50 are identified asupper flex contacts60C.
• In some embodiments, as shown in incorporated U.S. patent application Ser. No. 10/005,581,module10 will exhibit an array ofmodule contacts30 that has a greater number of contacts than the constituent elements ofmodule10 individually exhibit. In such embodiments, some of themodule contacts30 may contactlower flex contacts62 that do not make contact with one of thedie contacts24 of integratedlower stack element12 but are connected toupper IC contacts19 ofupper IC element14. This allowsmodule10 to express a wider datapath than that expressed by constituent integratedlower stack element12 orupper IC element14.
• Amodule contact30 may also be in contact with alower flex contact62 to provide a location through which different levels of constituent elements of the module may be enabled when no unused contacts are available or convenient for that purpose.
• Those of skill will recognize that asflex circuitry18 is partially wrapped aboutlateral side21 of integratedlower stack element12, firstconductive layer40 becomes, on the part offlex18 disposed aboveupper surface23 of integratedlower stack element12, the lower-most conductive layer offlex18 from the perspective ofupper IC element14. In the depicted embodiment, those upperIC element contacts19 ofupper IC element14 that provide ground (VSS) connections are connected to the firstconductive layer40. Firstconductive layer40 lies beneath, however, secondconductive layer42 in that part offlex18 that is wrapped abovelower stack element12. Consequently, in the depicted preferred embodiment, thoseupper flex contacts60 that are in contact with ground-conveying upperIC element contacts25 ofupper IC element14 have vias that route through intermediate layer44 to reach firstconductive layer40. These vias may preferably be “on-pad” or coincident with theflex contact60 to which they are connected.
• As those of skill will recognize, there may be embodiments of the present invention that may profitably employ off-pad vias such as are described in previously cited U.S. application Ser. No. 10/005,581, filed Oct. 26, 2001, (the “'581 application) pending, which is incorporated by reference herein.
• Those of skill who refer to the '581 application will note that the figures in that application will be instructive in teaching details concerning a flex circuitry construction for preferred embodiments of the present invention. Further, as those of skill will recognize, the details on location and relationships between upper and lower flex contacts as described in the '581 application are useful to preferred embodiments of the present invention as modified to fit the particulars of the considered embodiment. Further, alternative embodiments depicted in the '581 application are instructive in understanding alternatives available for embodiments of the present invention. For example, the '581 application provides teachings that are descriptive of features that may be employed to advantage in preferred embodiments in accordance with the present invention wheremodule10 expresses a datapath that is wider than that of the constituent circuits of either integratedlower stack element12 orupper IC element14 or where differential enablement of the respective elements ofmodule10 is desired as those skilled in the field will understand.
• Although the present invention has been described in detail, it will be apparent to those skilled in the art that the invention may be embodied in a variety of specific forms and that various changes, substitutions and alterations can be made without departing from the spirit and scope of the invention. The described embodiments are only illustrative and not restrictive and the scope of the invention is, therefore, indicated by the following claims.

Claims (40)

1. A circuit module comprising:

an upper IC element;

an integrated lower stack element comprising:

an integrated circuit die;

first and second flex circuits, disposed adjacent to and connected with the integrated circuit die to create a die-flex combination; and

a protective structure molded to the die-flex combination to create a body having an upper surface above which are placed portions of the first and second flex circuits; and

the upper IC element and the integrated lower stack element being in stacked conjunction with the upper IC element being disposed above the integrated lower stack element and the upper IC element and integrated lower stack element being connected through the first and second flex circuits.

2. The circuit module ofclaim 1 in which the first and second flex circuits each have first and second conductive layers.

3. The circuit module ofclaim 2 in which the connection of the upper IC element and integrated lower stack element through the first and second flex circuits is implemented through interconnections articulated at the first and second conductive layers of the first and second flex circuits.

4. The circuit module ofclaim 2 in which at least one of the first and second conductive layers of the first and second flex circuits have demarked upper and lower flex contacts.

5. An integrated lower stack element comprising:

an integrated circuit die;

first and second flex circuits, disposed adjacent to and connected with the integrated circuit die to create a die-flex combination; and

a protective structure molded to the die-flex combination to create a body having an upper surface above which are placed portions of the first and second flex circuits.

6. The integrated lower stack element ofclaim 5 in which the first and second flex circuits are connected with the integrated circuit die through wire bonds.

7. The integrated lower stack element ofclaim 5 in which the first and second flex circuits are connected with the integrated circuit die through flip-chip connections.

8. The integrated lower stack element ofclaim 5 further comprising a set of module contacts disposed along the first and second flex circuits.

9. The integrated lower stack element ofclaim 5 in which the first and second flex circuits each have first and second conductive layers.

10. A circuit module comprising:

(a) an integrated lower stack element comprising;

an integrated circuit die having a plurality of die connective sites;

a flexible circuit having first and second conductive layers, the flexible circuit being disposed in part beneath and affixed to and connected with the integrated circuit die to form a die-flex combination; and

a protective structure set about the die-flex combination to cover at least a portion of the die and at least a portion of the flexible circuit and create a body having an upper surface above which are placed portions of the flexible circuit; and

(b) an upper IC element having a plurality of upper IC contacts, the upper IC element being disposed in stacked conjunction with the integrated lower stack element, the upper IC element and integrated lower stack element being connected through the flexible circuit.

11. The circuit module ofclaim 10 in which a data signal connection between the upper IC element and the integrated lower stack element is implemented at the second conductive layer of the flex circuit.

12. The circuit module ofclaim 10 in which a data signal connection between the upper IC element and the integrated lower stack element is implemented at the first conductive layer of the flex circuit.

13. The circuit module ofclaim 10 in which:

a data set of the plurality of upper IC contacts expresses an n-bit datapath;

a data set of the plurality of die connective sites expresses an n-bit datapath; and

a set of module contacts expresses a 2n-bit datapath that combines the n-bit datapath of the data set of the plurality of upper IC contacts and the n-bit datapath of the data set of the plurality of die connective sites.

14. The circuit module ofclaim 10 in which the second conductive layer comprises at least one demarked voltage plane and a voltage set of upper flex contacts and a voltage set of lower flex contacts that connect voltage conductive die connective sites and voltage conductive upper IC contacts to one of the at least one voltage planes.

15. A flex circuit connecting an upper IC element and an integrated circuit die in a circuit module, the flex circuit comprising:

first and second outer layers; and

first and second conductive layers, between which there is an intermediate layer, the first and second conductive layers and the intermediate layer being interior to the first and second outer layers, the second conductive layer having demarked first and second flex contacts, the first flex contacts being accessible through first windows through the second outer layer and the second flex contacts being accessible through second windows through the first outer layer, the first conductive layer, and the intermediate layer, the first flex contacts in electrical connection with the upper IC element and the second flex contacts in electrical connection with the integrated circuit die;

wherein the flex circuit is disposed in part beneath and is combined with the integrated circuit die to form a die-flex combination and wherein a protective structure is set about the die-flex combination to cover at least a portion of the die and at least a portion of the flex circuit, the protective structure having an upper surface above which are placed portions of the flex circuit.

16. The flex circuit ofclaim 15 in which the second flex contacts are accessible through module windows through the second outer layer.

17. The flex circuit ofclaim 15 in which the first and second conductive layers are metal.

18. The flex circuit ofclaim 15 in which selected ones of the first flex contacts are connected to selected ones of the second flex contacts.

19. The flex circuit ofclaim 15 in which selected ones of the first flex contacts and selected ones of the second flex contacts are connected to the first conductive layer.

20. The flex circuit ofclaim 17 in which the metal of the first and second conductive layers is alloy 110.

21. The flex circuit ofclaim 18 in which the connected selected ones of the first and second flex contacts are connected with traces.

22. The flex circuit ofclaim 15 in which selected ones of the first flex contacts and selected ones of the second flex contacts are connected to the first conductive layer with vias.

23. A circuit module that employs the flex circuit ofclaim 15 to connect selected die contacts of an integrated circuit die to selected contacts of an upper IC element.

24. A circuit module comprising:

a first flex circuit devised in accordance withclaim 15;

a second flex circuit devised in accordance withclaim 15;

an integrated circuit die having a plurality of die connective sites, a set of the plurality of die connective sites of the integrated circuit die being in electrical communication with the first flex contacts of each of the first and second flex circuits;

an upper IC element having a plurality of upper IC contacts, a set of the plurality of upper IC contacts of the upper IC element being in electrical communication with the second flex contacts of each of the first and second flex circuits; and

a set of module contacts in electrical communication with the second flex contacts.

25. The circuit module ofclaim 24 in which the first and second flex circuits are connected through an inter-flex circuit connective.

26. A circuit module comprising:

a first flex circuit devised in accordance withclaim 15;

a second flex circuit devised in accordance withclaim 15;

an integrated circuit having a plurality of die connective sites, a set of the plurality of die connective sites, the die contacts of the integrated being in electrical communication with the second flex contacts of each of the first and second flex circuits;

an upper IC element having a plurality of upper IC contacts, a set of the plurality of upper IC contacts of the upper IC element being in electrical communication with the first flex contacts of each of the first and second flex circuits; and

a set of module contacts in electrical communication with the first flex contacts.

27. The circuit module of claims24 or26 in which for the first and second flex circuits, the first conductive layer conveys ground, and the second conductive layer conveys voltage in a voltage plane and the intermediate layer is insulative to create a distributed capacitor in the first and second flex circuits.

28. A circuit module comprising:

a first CSP having first and second lateral sides and upper and lower major surfaces and a set of CSP contacts along the lower major surface;

an integrated circuit die having a set of die connective sites connected to a pair of flex circuits;

each of which pair of flex circuits having a first conductive layer and a second conductive layer, both said conductive layers being interior to first and second outer layers, and demarcated at the second conductive layer of each flex circuit there being upper and lower flex contacts, the upper flex contacts being connected to the set of CSP contacts of the first CSP and the lower flex contacts being connected to the die connective sites of the integrated circuit die and a set of module contacts.

29. The circuit module ofclaim 28 in which:

a chip-enable module contact is connected to an enable lower flex contact that is connected to a chip select CSP contact of the first CSP.

30. The circuit module ofclaim 29 in which the connection between the enable lower flex contact and the chip select CSP contact of the first CSP is through an enable connection at the first conductive layer.

31. The circuit module ofclaim 28 in which a body having first and second lateral sides and an upper major surface is set about the integrated circuit die and a first one of the flex circuit pair is partially wrapped about the first lateral side of said body and a second one of the flex circuit pair is partially wrapped about the second lateral side of said body to dispose the upper flex contacts above the upper major surface of said body and beneath the lower major surface of the first CSP.

32. The circuit module ofclaim 31 in which the first CSP expresses an n-bit datapath and the integrated circuit die expresses an n-bit datapath, each of the flex circuits of the flex circuit pair having supplemental lower flex contacts which, in combination with the lower flex contacts, provide connection for the set of module contacts and a set of supplemental module contacts to express a 2n-bit module datapath that combines the n-bit datapath expressed by the first CSP and the n-bit datapath expressed by the integrated circuit die.

33. A circuit module comprising:

a first CSP having first and second major surfaces with a plurality of CSP contacts along the first major surface;

an integrated lower stack element in accordance withclaim 5, the first CSP being disposed above the integrated lower stack element;

each of the pair of flex circuits of the integrated lower stack element having an outer layer and an inner layer and first and second conductive layers between which conductive layers there is an intermediate layer, the second conductive layer having demarked a plurality of upper and lower flex contacts and a voltage plane, a first set of said plurality of upper and lower flex contacts being connected to the voltage plane, a second set of said plurality of upper and lower flex contacts being connected to the first conductive layer, and a third set of said plurality of upper and lower flex contacts being comprised of selected ones of upper flex contacts that are connected to corresponding selected ones of lower flex contacts, the plurality of CSP contacts of the first CSP being in contact with the upper flex contacts; and

a set of module contacts in contact with the lower flex contacts.

34. The circuit module ofclaim 33 in which the first CSP and the integrated circuit die of the integrated lower stack element are memory circuits.

35. The circuit module ofclaim 33 in which the second set of said plurality of upper and lower flex contacts is connected to the first conductive layer with vias that pass through the intermediate layer.

36. The circuit module ofclaim 35 in which the second set of said plurality of upper and lower flex contacts is comprised of upper flex contacts connected to the first conductive layer with on-pad vias.

37. The circuit module ofclaim 35 in which the second set of said plurality of upper and lower flex contacts is comprised of lower flex contacts connected to the first conductive layer with off-pad vias.

38. The circuit module ofclaim 1 mounted on a board.

39. The circuit module of claims33 or34 in which between the first CSP and the integrated lower stack element there is a thermally conductive layer.

40. A method for assembling a circuit module, the method comprising the steps of:

acquiring an integrated circuit die;

acquiring a flex circuit devised in accordance withclaim 15;

disposing an adhesive on a selected area of the first outer surface of the flex circuit;

adhering the flex circuit to the integrated circuit die;

forming a connection between the flex circuit and the integrated circuit die;

protecting the integrated circuit die and the connection formed between the flex circuit and the integrated circuit die with a protective layer to form a body;

disposing a portion of the flex circuit above the body;

acquiring a CSP;

connecting the CSP to the flex circuit.

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