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US20070297885A1 - Product designed to be used with handling system - Google Patents

Product designed to be used with handling system
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Publication number
US20070297885A1
US20070297885A1US11/426,800US42680006AUS2007297885A1US 20070297885 A1US20070297885 A1US 20070297885A1US 42680006 AUS42680006 AUS 42680006AUS 2007297885 A1US2007297885 A1US 2007297885A1
Authority
US
United States
Prior art keywords
plateau
product
plate
handling system
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/426,800
Inventor
Jean Michel Processe
Florent Haddad
Alain Gaudon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RECIF TECHNOLOGIES Sas
Original Assignee
RECIF TECHNOLOGIES Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RECIF TECHNOLOGIES SasfiledCriticalRECIF TECHNOLOGIES Sas
Priority to US11/426,800priorityCriticalpatent/US20070297885A1/en
Assigned to RECIF TECHNOLOGIES SASreassignmentRECIF TECHNOLOGIES SASASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: HADDAD, FLORENT, PROCESSE, JEAN MICHEL, GAUDON, ALAIN
Priority to PCT/IB2007/002907prioritypatent/WO2008007223A2/en
Publication of US20070297885A1publicationCriticalpatent/US20070297885A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A product (Pr) can be used in the semiconductor, MEM, flat screen and/or solar cell industries, where the product is capable of being gripped by a handling system (Bm). The product can include: a plate (1) made of silicon, quartz, silicon carbide, silicon nitride, arsenic, and/or gallium arsenide, comprising one first (2) and one second (3) opposite faces, a plateau (4) defined by at least one face (5) opposite the plate, an attachment means (7) of the plate (1) on the plateau (4) so that the at least one face (5) of the plateau (4) is opposite the first (2) or second (3) face of the plate, and a first gripping means (11) mounted in association with the plateau (4), where these said first gripping means is able to cooperate and is removable with second gripping means (12) in addition to the first gripping means (11), the second additional gripping means belonging to the handling system (Bm). Another embodiment of the invention is directed to a system for handling the product.

Description

Claims (21)

10. The product ofclaim 1 wherein the first centering mechanism comprises at least one magnet having a generally annular shape, which is continuous or discontinuous, and whose internal and external circular faces, are respectively polarized North and South, South, wherein the annular magnet is mounted protrudingly on the face of the plateau opposite the face of the latter which is opposite the plate, so that the North-South polarization plane of the annular magnet is substantially parallel to the general plane of the face of the plateau that is opposite the plate, wherein the annular magnet is moreover disposed to be able to be plunged into an additional recess in the handling system, the additional recess comprising a magnetized ring according to one North-South polarization plane more or less the same as the North-South polarization plane of the annular magnet.
US11/426,8002006-06-272006-06-27Product designed to be used with handling systemAbandonedUS20070297885A1 (en)

Priority Applications (2)

Application NumberPriority DateFiling DateTitle
US11/426,800US20070297885A1 (en)2006-06-272006-06-27Product designed to be used with handling system
PCT/IB2007/002907WO2008007223A2 (en)2006-06-272007-06-27Product designed to be used with handling system

Applications Claiming Priority (1)

Application NumberPriority DateFiling DateTitle
US11/426,800US20070297885A1 (en)2006-06-272006-06-27Product designed to be used with handling system

Publications (1)

Publication NumberPublication Date
US20070297885A1true US20070297885A1 (en)2007-12-27

Family

ID=38873724

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US11/426,800AbandonedUS20070297885A1 (en)2006-06-272006-06-27Product designed to be used with handling system

Country Status (2)

CountryLink
US (1)US20070297885A1 (en)
WO (1)WO2008007223A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN111066138A (en)*2017-08-302020-04-24周星工程股份有限公司 Substrate placement unit and substrate processing equipment

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US4724619A (en)*1985-12-101988-02-16Recif (Societe Anonyme)Single wafer centrifugal dryer
US4736508A (en)*1985-12-101988-04-12Recif (Societe Anonyme)Process of manufacturing vacuum tips particularly for vacuum handling systems
US4744594A (en)*1985-12-101988-05-17Recif (Societe Anonyme)Vacuum handling especially for the use in handling silicon wafers
US4759675A (en)*1984-03-221988-07-26Sgs-Thomson Microelectronics, Inc.Chip selection in automatic assembly of integrated circuit
US4981315A (en)*1987-12-221991-01-01Recif, S.A.Tip for a vacuum pipette
US5280979A (en)*1991-06-201994-01-25Recif, S.A.Tip for a vacuum pipette with improved electrostatic discharge properties
US5917169A (en)*1996-07-291999-06-29Recif, S.A.Method and apparatus of identification of characters formed on a plurality of tablets of silicon
US6205745B1 (en)*1998-05-272001-03-27Lucent Technologies Inc.High speed flip-chip dispensing
US6420864B1 (en)*2000-04-132002-07-16Nanophotonics AgModular substrate measurement system
US6652216B1 (en)*1998-05-052003-11-25Recif, S.A.Method and device for changing a semiconductor wafer position
US20030219914A1 (en)*2002-01-292003-11-27Recif, S. A.Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark
US20040047714A1 (en)*2002-09-062004-03-11Recif, Societe AnonymeSystem for the conveying and storage of containers of semiconductor wafers, and transfer mechanism
US20040091483A1 (en)*2002-02-082004-05-13Thomas WeimbsSNAREs and methods of controlling cytokinesis
US20050063797A1 (en)*2002-12-132005-03-24Recif Societe AnonymeFOUP door transfer system
US6880560B2 (en)*2002-11-182005-04-19TechsonicSubstrate processing apparatus for processing substrates using dense phase gas and sonic waves
US7030401B2 (en)*2000-04-132006-04-18Nanophotonics AgModular substrate measurement system

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JP2855046B2 (en)*1993-03-311999-02-10大日本スクリーン製造株式会社 Substrate rotation holding device for rotary substrate processing equipment
US4788994A (en)*1986-08-131988-12-06Dainippon Screen Mfg. Co.Wafer holding mechanism
DE3919611A1 (en)*1989-06-151990-12-20Wacker Chemitronic HOLDING DEVICE FOR RECEIVING DISC-SHAPED OBJECTS, IN PARTICULAR SEMICONDUCTOR DISC, AND METHOD FOR THEIR TREATMENT
US5224581A (en)*1989-12-141993-07-06Applied Materials, Inc.Magnetic semiconductor wafers with handling apparatus and method
JPH09213772A (en)*1996-01-301997-08-15Dainippon Screen Mfg Co LtdBoard holder
US5775000A (en)*1996-05-131998-07-07Ebara CorporationSubstrate gripper device for spin drying
JP3955659B2 (en)*1997-06-122007-08-08リンテック株式会社 Electronic component die bonding method and die bonding apparatus used therefor
US6126380A (en)*1997-08-042000-10-03Creative Design CorporationRobot having a centering and flat finding means
US6217034B1 (en)*1998-09-242001-04-17Kla-Tencor CorporationEdge handling wafer chuck
US6167893B1 (en)*1999-02-092001-01-02Novellus Systems, Inc.Dynamic chuck for semiconductor wafer or other substrate
US6827092B1 (en)*2000-12-222004-12-07Lam Research CorporationWafer backside plate for use in a spin, rinse, and dry module and methods for making and implementing the same
US6964276B2 (en)*2002-09-032005-11-15Nova Measuring Instruments Ltd.Wafer monitoring system
JP4137471B2 (en)*2002-03-042008-08-20東京エレクトロン株式会社 Dicing method, integrated circuit chip inspection method, and substrate holding apparatus
DE102004036435B4 (en)*2003-08-072007-08-30Nanophotonics Ag Holding device for disc-shaped objects

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4567584A (en)*1983-06-131986-01-28Kabushiki Kaisha ToshibaAutochanger type disc player
US4759675A (en)*1984-03-221988-07-26Sgs-Thomson Microelectronics, Inc.Chip selection in automatic assembly of integrated circuit
US4724619A (en)*1985-12-101988-02-16Recif (Societe Anonyme)Single wafer centrifugal dryer
US4736508A (en)*1985-12-101988-04-12Recif (Societe Anonyme)Process of manufacturing vacuum tips particularly for vacuum handling systems
US4744594A (en)*1985-12-101988-05-17Recif (Societe Anonyme)Vacuum handling especially for the use in handling silicon wafers
US4981315A (en)*1987-12-221991-01-01Recif, S.A.Tip for a vacuum pipette
US5280979A (en)*1991-06-201994-01-25Recif, S.A.Tip for a vacuum pipette with improved electrostatic discharge properties
US5917169A (en)*1996-07-291999-06-29Recif, S.A.Method and apparatus of identification of characters formed on a plurality of tablets of silicon
US6652216B1 (en)*1998-05-052003-11-25Recif, S.A.Method and device for changing a semiconductor wafer position
US20040091343A1 (en)*1998-05-052004-05-13Recif, Inc.Method and device for changing a semiconductor wafer position
US7108476B2 (en)*1998-05-052006-09-19Recif Technologies SasMethod and device for changing a semiconductor wafer position
US6205745B1 (en)*1998-05-272001-03-27Lucent Technologies Inc.High speed flip-chip dispensing
US6420864B1 (en)*2000-04-132002-07-16Nanophotonics AgModular substrate measurement system
US7030401B2 (en)*2000-04-132006-04-18Nanophotonics AgModular substrate measurement system
US6961639B2 (en)*2002-01-292005-11-01Recif, Societe AnonymeApparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark
US20030219914A1 (en)*2002-01-292003-11-27Recif, S. A.Apparatus and process for identification of characters inscribed on a semiconductor wafer containing an orientation mark
US20040091483A1 (en)*2002-02-082004-05-13Thomas WeimbsSNAREs and methods of controlling cytokinesis
US20040047714A1 (en)*2002-09-062004-03-11Recif, Societe AnonymeSystem for the conveying and storage of containers of semiconductor wafers, and transfer mechanism
US20050145263A1 (en)*2002-11-182005-07-07Recif, Societe AnonymeSubstrate processing apparatus for processing substrates using dense phase gas and sonic waves
US6880560B2 (en)*2002-11-182005-04-19TechsonicSubstrate processing apparatus for processing substrates using dense phase gas and sonic waves
US7033068B2 (en)*2002-11-182006-04-25Recif, Societe AnonymeSubstrate processing apparatus for processing substrates using dense phase gas and sonic waves
US20050063797A1 (en)*2002-12-132005-03-24Recif Societe AnonymeFOUP door transfer system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN111066138A (en)*2017-08-302020-04-24周星工程股份有限公司 Substrate placement unit and substrate processing equipment

Also Published As

Publication numberPublication date
WO2008007223A2 (en)2008-01-17
WO2008007223A3 (en)2008-05-02

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Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:RECIF TECHNOLOGIES SAS, FRANCE

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PROCESSE, JEAN MICHEL;HADDAD, FLORENT;GAUDON, ALAIN;REEL/FRAME:018344/0464;SIGNING DATES FROM 20060307 TO 20060629

Owner name:RECIF TECHNOLOGIES SAS, FRANCE

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PROCESSE, JEAN MICHEL;HADDAD, FLORENT;GAUDON, ALAIN;SIGNING DATES FROM 20060307 TO 20060629;REEL/FRAME:018344/0464

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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