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US20070256957A1 - Sub-rack with housing for receiving plug-in modules - Google Patents

Sub-rack with housing for receiving plug-in modules
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Publication number
US20070256957A1
US20070256957A1US11/799,582US79958207AUS2007256957A1US 20070256957 A1US20070256957 A1US 20070256957A1US 79958207 AUS79958207 AUS 79958207AUS 2007256957 A1US2007256957 A1US 2007256957A1
Authority
US
United States
Prior art keywords
sub
plug
rack
liquid distributor
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/799,582
Inventor
Ralf Herrmann
Michael Joist
Heinz Kempf
Adam Pawlowski
Liane Rheinschmitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schroff GmbH
Original Assignee
Schroff GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schroff GmbHfiledCriticalSchroff GmbH
Assigned to SCHROFF GMBHreassignmentSCHROFF GMBHASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: RHEINSCHMITT, LIANE, KEMPF, HEINZ, HERRMANN, RALF, JOIST, MICHAEL, PAWLOWSKI, ADAM
Publication of US20070256957A1publicationCriticalpatent/US20070256957A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A sub-rack (1) for plugging and unplugging electronic plug-in modules (3) includes a housing (2) which has a front cover plate (5). Each plug-in module includes a cooling device including a heat sink (19). A liquid distributor (12) is mounted on the cover plate and in flow connection with each of the heat sinks via a feed line (10) and a return line (11), and the liquid distributor is arranged on the outside of and in the front region (4) of the sub-rack.

Description

Claims (20)

US11/799,5822006-05-062007-05-02Sub-rack with housing for receiving plug-in modulesAbandonedUS20070256957A1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
DE202006007275.62006-05-06
DE202006007275UDE202006007275U1 (en)2006-05-062006-05-06Sub-rack with housing for receiving plug-in modules, has liquid distributor joined to heat-sink via forward- and return-line

Publications (1)

Publication NumberPublication Date
US20070256957A1true US20070256957A1 (en)2007-11-08

Family

ID=37026749

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US11/799,582AbandonedUS20070256957A1 (en)2006-05-062007-05-02Sub-rack with housing for receiving plug-in modules

Country Status (5)

CountryLink
US (1)US20070256957A1 (en)
EP (1)EP1853101B1 (en)
JP (1)JP2007300107A (en)
DE (2)DE202006007275U1 (en)
RU (1)RU2364058C2 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20080212265A1 (en)*2007-01-232008-09-04Paul MazuraSwitchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger
US20130025818A1 (en)*2011-07-272013-01-31Coolit Systems, Inc.Modular heat-transfer systems
US20130299232A1 (en)*2012-05-112013-11-14Raytheon CompanyElectronics enclosures with high thermal performance and related system and method
US20140085821A1 (en)*2012-09-252014-03-27Liquidcool Solutions, Inc.Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US9468131B2 (en)2014-04-162016-10-11Raytheon CompanyMonolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
US9943014B2 (en)2013-03-152018-04-10Coolit Systems, Inc.Manifolded heat exchangers and related systems
US20180320982A1 (en)*2015-10-152018-11-08Nec Platforms, Ltd.Cooling device and cooling system
CN109690763A (en)*2016-10-202019-04-26西门子股份公司 Switchgear with closed enclosure and cooling
US10365667B2 (en)2011-08-112019-07-30Coolit Systems, Inc.Flow-path controllers and related systems
US10364809B2 (en)2013-03-152019-07-30Coolit Systems, Inc.Sensors, multiplexed communication techniques, and related systems
US10765030B2 (en)2015-10-302020-09-01Vapor IO Inc.Adapters for rack-mounted computing equipment
US20220046827A1 (en)*2020-08-102022-02-10Beijing Silicon Based Voyage Technology Co., Ltd.Server
US20220124944A1 (en)*2019-02-052022-04-21Nec Platform, Ltd.Pipe protection device and cooling device
US11395443B2 (en)2020-05-112022-07-19Coolit Systems, Inc.Liquid pumping units, and related systems and methods
US11452243B2 (en)2017-10-122022-09-20Coolit Systems, Inc.Cooling system, controllers and methods
US11473860B2 (en)2019-04-252022-10-18Coolit Systems, Inc.Cooling module with leak detector and related systems
US20220338384A1 (en)*2021-04-202022-10-20Dell Products, LpModular horizontal rack manifold for liquid cooling
US11662037B2 (en)2019-01-182023-05-30Coolit Systems, Inc.Fluid flow control valve for fluid flow systems, and methods
US20240381584A1 (en)*2023-05-102024-11-14Bae Systems Information And Electronic Systems Integration Inc.Coolant flow partition for cooling 3u boards in 6u chassis
US12188733B2 (en)2021-05-202025-01-07Coolit Systems, Inc.Modular fluid heat exchange systems
US12200914B2 (en)2022-01-242025-01-14Coolit Systems, Inc.Smart components, systems and methods for transferring heat
US12366870B2 (en)2013-03-152025-07-22Coolit Systems, Inc.Flow-path controllers and related systems

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
DE102007048640A1 (en)2007-03-142008-09-25SCHäFER WERKE GMBH Control cabinet for receiving electronic system components
DE102009006924B3 (en)*2009-02-022010-08-05Knürr AG Operating method and arrangement for cooling electrical and electronic components and modular units in equipment cabinets
CN101873781B (en)*2010-06-282012-01-04华为技术有限公司Plug-in mechanism, finished board with same and plug-in frame

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US6828675B2 (en)*2001-09-262004-12-07Modine Manufacturing CompanyModular cooling system and thermal bus for high power electronics cabinets
US20050133214A1 (en)*2003-12-192005-06-23Teradyne, Inc.Modular rackmount chiller
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US7097047B2 (en)*2003-09-302006-08-29Dell Products L.P.Cable management flip tray assembly
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US20080212265A1 (en)*2007-01-232008-09-04Paul MazuraSwitchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger
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US7450385B1 (en)*2007-06-152008-11-11International Business Machines CorporationLiquid-based cooling apparatus for an electronics rack
US7457118B1 (en)*2003-12-192008-11-25Emc CorporationMethod and apparatus for dispersing heat from high-power electronic devices

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JPS5580399A (en)*1978-12-131980-06-17Fujitsu LtdElectronic device cooling structure
GB9215442D0 (en)*1992-07-211992-09-02British AerospaceCooling of electronic components
DE4327444A1 (en)*1993-08-141995-02-16Indramat GmbhCooling device for a switching cabinet (electronics cabinet)
RU2088059C1 (en)*1995-05-101997-08-20Центральный научно-исследовательский институт "Электроприбор"Radio electron equipment cabinet
DE202004010204U1 (en)*2004-06-302004-09-16Schroff GmbhRectangular housing for modular electronic building blocks, has top and bottom flat members accommodating manifolds for distributing and collecting cooling fluid supplied to individual building blocks

Patent Citations (42)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3481393A (en)*1968-01-151969-12-02IbmModular cooling system
US5285347A (en)*1990-07-021994-02-08Digital Equipment CorporationHybird cooling system for electronic components
US5343358A (en)*1993-04-261994-08-30Ncr CorporationApparatus for cooling electronic devices
US5740018A (en)*1996-02-291998-04-14The United States Of America As Represented By The Secretary Of The NavyEnvironmentally controlled circuit pack and cabinet
US5731954A (en)*1996-08-221998-03-24Cheon; KioanCooling system for computer
US5946191A (en)*1997-03-271999-08-31Nec CorporationElectronic device having a plug-in unit with a heat sink structure
US6016251A (en)*1997-11-272000-01-18Ando Electric Co., Ltd.Printed circuit board and cooling system therefor
US6747869B2 (en)*1999-06-022004-06-08Guangji DongMicrocomputer heat dissipation system
US6234240B1 (en)*1999-07-012001-05-22Kioan CheonFanless cooling system for computer
US6196003B1 (en)*1999-11-042001-03-06Pc/Ac, Inc.Computer enclosure cooling unit
US6166907A (en)*1999-11-262000-12-26Chien; Chuan-FuCPU cooling system
US6313990B1 (en)*2000-05-252001-11-06Kioan CheonCooling apparatus for electronic devices
US6407916B1 (en)*2000-06-122002-06-18Intel CorporationComputer assembly for cooling high powered microprocessors
US6563709B2 (en)*2000-07-212003-05-13Mitsubishi Materials CorporationLiquid-cooled heat sink and manufacturing method thereof
US20050250435A1 (en)*2001-05-162005-11-10Sharp Anthony CCooling airflow distribution device
US6657121B2 (en)*2001-06-272003-12-02Thermal Corp.Thermal management system and method for electronics system
US6536510B2 (en)*2001-07-102003-03-25Thermal Corp.Thermal bus for cabinets housing high power electronics equipment
US6828675B2 (en)*2001-09-262004-12-07Modine Manufacturing CompanyModular cooling system and thermal bus for high power electronics cabinets
US7024573B2 (en)*2002-02-052006-04-04Hewlett-Packard Development Company, L.P.Method and apparatus for cooling heat generating components
US7057893B2 (en)*2002-03-112006-06-06Rittal Gmbh & Co. KgCooling array
US20040008483A1 (en)*2002-07-132004-01-15Kioan CheonWater cooling type cooling system for electronic device
US6804117B2 (en)*2002-08-142004-10-12Thermal Corp.Thermal bus for electronics systems
US6807056B2 (en)*2002-09-242004-10-19Hitachi, Ltd.Electronic equipment
US6798660B2 (en)*2003-02-132004-09-28Dell Products L.P.Liquid cooling module
US7318322B2 (en)*2003-02-142008-01-15Hitachi, Ltd.Liquid cooling system for a rack-mount server system
US6763880B1 (en)*2003-06-262004-07-20Evserv Tech CorporationLiquid cooled radiation module for servers
US7013955B2 (en)*2003-07-282006-03-21Thermal Corp.Flexible loop thermosyphon
US7097047B2 (en)*2003-09-302006-08-29Dell Products L.P.Cable management flip tray assembly
US7012807B2 (en)*2003-09-302006-03-14International Business Machines CorporationThermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US20050133214A1 (en)*2003-12-192005-06-23Teradyne, Inc.Modular rackmount chiller
US7484552B2 (en)*2003-12-192009-02-03Amphenol CorporationModular rackmount chiller
US7457118B1 (en)*2003-12-192008-11-25Emc CorporationMethod and apparatus for dispersing heat from high-power electronic devices
US20070121287A1 (en)*2004-02-172007-05-31Doerrich MartinHousing arrangement
US7466549B2 (en)*2004-02-172008-12-16Rittal Gmbh & Co. KgCooling arrangement for server blades
US7011143B2 (en)*2004-05-042006-03-14International Business Machines CorporationMethod and apparatus for cooling electronic components
US7355852B2 (en)*2004-09-302008-04-08Amphenol CorporationModular liquid cooling of electronic assemblies
US7428151B2 (en)*2004-11-092008-09-23Rittal Res Electronic Systems Gmbh & Co. KgCooling arrangement
US7295436B2 (en)*2005-12-102007-11-13Kioan CheonCooling system for computer components
US20070274043A1 (en)*2006-05-262007-11-29Younes ShabanyLiquid-Air Hybrid Cooling in Electronics Equipment
US20080093054A1 (en)*2006-08-292008-04-24Tilton Charles LManifold for a Two-Phase Cooling System
US20080212265A1 (en)*2007-01-232008-09-04Paul MazuraSwitchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger
US7450385B1 (en)*2007-06-152008-11-11International Business Machines CorporationLiquid-based cooling apparatus for an electronics rack

Cited By (38)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20080212265A1 (en)*2007-01-232008-09-04Paul MazuraSwitchgear Cabinet for Accommodating Electronic Plug-In Modules with a Heat Exchanger
US9496200B2 (en)*2011-07-272016-11-15Coolit Systems, Inc.Modular heat-transfer systems
US20130025818A1 (en)*2011-07-272013-01-31Coolit Systems, Inc.Modular heat-transfer systems
US10820450B2 (en)2011-07-272020-10-27Coolit Systems, Inc.Modular heat-transfer systems
US12213289B2 (en)2011-07-272025-01-28Coolit Systems, Inc.Modular heat-transfer systems
US10365667B2 (en)2011-08-112019-07-30Coolit Systems, Inc.Flow-path controllers and related systems
US11714432B2 (en)2011-08-112023-08-01Coolit Systems, Inc.Flow-path controllers and related systems
US9107293B2 (en)*2012-05-112015-08-11Raytheon CompanyElectronics enclosures with high thermal performance and related system
US20130299232A1 (en)*2012-05-112013-11-14Raytheon CompanyElectronics enclosures with high thermal performance and related system and method
US9918408B2 (en)2012-09-252018-03-13Liquidcool Solutions, Inc.Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US9451726B2 (en)*2012-09-252016-09-20Liquidcool Solutions, Inc.Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US20140085821A1 (en)*2012-09-252014-03-27Liquidcool Solutions, Inc.Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US9943014B2 (en)2013-03-152018-04-10Coolit Systems, Inc.Manifolded heat exchangers and related systems
US11661936B2 (en)2013-03-152023-05-30Coolit Systems, Inc.Sensors, multiplexed communication techniques, and related systems
US10364809B2 (en)2013-03-152019-07-30Coolit Systems, Inc.Sensors, multiplexed communication techniques, and related systems
US12366870B2 (en)2013-03-152025-07-22Coolit Systems, Inc.Flow-path controllers and related systems
US9468131B2 (en)2014-04-162016-10-11Raytheon CompanyMonolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
US20180320982A1 (en)*2015-10-152018-11-08Nec Platforms, Ltd.Cooling device and cooling system
US10765030B2 (en)2015-10-302020-09-01Vapor IO Inc.Adapters for rack-mounted computing equipment
US10685902B2 (en)*2016-10-202020-06-16Siemens AktiengesellschaftSwitchgear cabinet comprising a closed housing and a cooling device
CN109690763A (en)*2016-10-202019-04-26西门子股份公司 Switchgear with closed enclosure and cooling
US11452243B2 (en)2017-10-122022-09-20Coolit Systems, Inc.Cooling system, controllers and methods
US11662037B2 (en)2019-01-182023-05-30Coolit Systems, Inc.Fluid flow control valve for fluid flow systems, and methods
US20220124944A1 (en)*2019-02-052022-04-21Nec Platform, Ltd.Pipe protection device and cooling device
EP3922865A4 (en)*2019-02-052022-10-26NEC Platforms, Ltd.Pipe protection device and cooling device
US12156373B2 (en)*2019-02-052024-11-26Nec Platforms, Ltd.Pipe protection device and cooling device
US12031779B2 (en)2019-04-252024-07-09Coolit Systems, Inc.Cooling module with leak detector and related systems
US11473860B2 (en)2019-04-252022-10-18Coolit Systems, Inc.Cooling module with leak detector and related systems
US11725890B2 (en)2019-04-252023-08-15Coolit Systems, Inc.Cooling module with leak detector and related systems
US12193193B2 (en)2020-05-112025-01-07Coolit Systems, Inc.Liquid pumping units, and related systems and methods
US11395443B2 (en)2020-05-112022-07-19Coolit Systems, Inc.Liquid pumping units, and related systems and methods
US20220046827A1 (en)*2020-08-102022-02-10Beijing Silicon Based Voyage Technology Co., Ltd.Server
US11877428B2 (en)*2021-04-202024-01-16Dell Products L.P.Modular horizontal rack manifold for liquid cooling
US20220338384A1 (en)*2021-04-202022-10-20Dell Products, LpModular horizontal rack manifold for liquid cooling
US12188733B2 (en)2021-05-202025-01-07Coolit Systems, Inc.Modular fluid heat exchange systems
US12200914B2 (en)2022-01-242025-01-14Coolit Systems, Inc.Smart components, systems and methods for transferring heat
US20240381584A1 (en)*2023-05-102024-11-14Bae Systems Information And Electronic Systems Integration Inc.Coolant flow partition for cooling 3u boards in 6u chassis
US12295122B2 (en)*2023-05-102025-05-06Bae Systems Information And Electronic Systems Integration Inc.Coolant flow partition for cooling 3U boards in 6U chassis

Also Published As

Publication numberPublication date
RU2007116855A (en)2008-11-20
RU2364058C2 (en)2009-08-10
EP1853101B1 (en)2008-10-29
DE202006007275U1 (en)2006-09-07
JP2007300107A (en)2007-11-15
DE502007000198D1 (en)2008-12-11
EP1853101A1 (en)2007-11-07

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Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:SCHROFF GMBH, GERMANY

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HERRMANN, RALF;JOIST, MICHAEL;KEMPF, HEINZ;AND OTHERS;REEL/FRAME:019415/0261;SIGNING DATES FROM 20070404 TO 20070412

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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