US20070256299A1 - Approach for fabricating cantilever probes - Google Patents

Abstract

An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.

Description

RELATED APPLICATION DATA
• This application claims the benefit of, and priority to, U.S. Provisional Patent Application No. 60/775,633, entitled Probe Element And Method of Forming The Same, filed Feb. 22, 2006, the contents of which are incorporated by reference for all purposes as if fully set forth herein.
FIELD OF THE INVENTION
• This invention relates generally to the fabrication of cantilever probes for probe card assemblies.
BACKGROUND
• In the testing of wafer-based semiconductor devices, probe cards are typically used to provide electrical interconnection between a testing system and the semiconductor wafer. Such probe cards may, for example, include a Printed Circuit Board (PCB), a probe substrate and an interposer (e.g., a pogo pin or spring pin based interposer) that provides electrical interconnection between the PCB and the probe substrate. Resilient probe elements are supported by the probe substrate. For example, in certain probe cards, the probe elements may be held in a “floating” configuration within a probe head adjacent the probe substrate. In other probe cards, the probe elements may be fixed at one end to a conductive region (e.g., a conductive trace, a terminal, a lead, a contact pad, etc.) of the probe substrate.
• The probe elements may have different configurations depending upon the testing application. For example, cantilever style probes are sometimes used in the testing of memory devices. Such cantilever probes may include (a) a post adjacent a conductive region of the probe substrate, (b) a cantilever beam bonded to the post, and (c) a tip portion positioned adjacent an end of the cantilever beam and configured to probe a contact pad (or the like) of the semiconductor device being tested. There is difficulty in assembling probe cards with probes of these and other types. For example, it may be difficult to achieve a desired planarity with cantilever probes.
BRIEF DESCRIPTION OF THE DRAWINGS
• In the figures of the accompanying drawings like reference numerals refer to similar elements.
• FIG. 1A depicts a probe panel that includes a plurality of probe elements, according to an embodiment of the invention.
• FIG. 1B depicts a cutting tool cutting a probe element from the probe panel depicted inFIG. 1A, according to an embodiment of the invention.
• FIG. 1C depicts a singulated probe element that has been rotated 90 degrees from its orientation of formation after being cut from the probe panel depicted inFIG. 1A, according to an embodiment of the invention.
• FIG. 1D depicts a tool bonding the singulated probe element depicted inFIG. 1C to a carrier structure, according to an embodiment of the invention.
• FIG. 1E depicts a portion of a clamping mechanism for holding a plurality of probe elements in position with respect to the carrier structure depicted inFIG. 1D, according to an embodiment of the invention.
• FIG. 1F depicts a cutting tool cutting the remainder of a probe element from the TAB bonded portion, in conjunction with a tool picking up the remainder of the probe element, according to an embodiment of the invention.
• FIG. 1G depicts bonding the remainder of the probe element to a conductive region adjacent a surface of probe substrate using a tool, according to an embodiment of the invention.
• FIG. 2A depicts a carrier plate having an active width and an active depth Y, according to an embodiment of the invention.
• FIG. 2B depicts that the carrier plate ofFIG. 2A defines dam walls, a pocket and a surface, according to an embodiment of the invention.
• FIG. 3 depicts a probe element after being removed from the carrier plate depicted inFIG. 2A, according to an embodiment of the invention.
DETAILED DESCRIPTION
• An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.
• FIGS. 1A-1G are various schematic illustrations depicting a process of making probe elements according to various embodiments of the invention.
• FIG. 1A depictsprobe panel100 including a plurality ofprobe elements102. Eachprobe element102 includes twopost portions102aand102b(the purpose of which is explained herein) and a raisedplatform portion102c. As depicted inFIG. 1A,probe elements102 are formed as part ofprobe panel100 through a process such as, for example, plating using masking techniques (e.g., using lithographic techniques such as photolithography, stereolithography, X-ray lithography, etc.); however, the present invention is not limited thereto, and other methods of forming probe panel100 (e.g., stamping, etching, laser ablation, etc.) may be used.
• FIG. 1B depicts cutting tool104 (e.g., a chopping tool configured to work in conjunction with conventional wire bonding machines) cutting aprobe element102 fromprobe panel100. InFIG. 1C, the singulatedprobe element102 is rotated 90 degrees from its orientation of formation (i.e., its orientation as part of plated probe panel100) after being cut fromprobe panel100. InFIG. 1D, tool106 (e.g., a vacuum bonding tool) is used to bond (e.g., via TAB bonding) the singulatedprobe element102 tocarrier structure108. More specifically,probe element102 is TAB bonded tocarrier structure108 viapost portion102a.
• FIG. 1E depicts a portion of aclamping mechanism112 for holding a plurality ofprobe elements102 in position with respect tocarrier structure108. Tip forming tool110 (e.g., a capillary tool configured for use on a wire bonding machine) is bumping tips (not shown) on respective raisedplatform portions102c. For example, tips forprobe elements102 may be formed in accordance with the teachings of U.S. patent application Ser. No. 11/211,994 entitled “Stacked Tip Cantilever Electrical Connector,” which is hereby incorporated by reference in its entirety.Clamping mechanism112 is provided to holdprobe elements102 in place during the tip formation operation.
• FIG. 1F depicts cuttingtool104 cutting the remainder ofprobe element102 from the TAB bonded portion, in conjunction withtool106 picking up (e.g., using a vacuum) the remainder ofprobe element102. The remainder ofprobe element102 is bonded (e.g., TAB bonded viapost portion102b) to a conductive region116 (e.g., a conductive pad or trace) adjacent a surface ofprobe substrate114 usingtool106, as depicted inFIG. 1G. For example,probe substrate114 may be a multi-layer substrate (e.g., a multi-layer ceramic substrate, a multi-layer organic substrate, etc.), and may also be a space transformer. For example,probe substrate114 may be configured to be part of a probe card including other conventional components such as a PCB and an interposer (not depicted).
• FIGS. 2A-2B depictprobe elements202 that are held in place (e.g., for forming tip portions) according to an embodiment of the invention. Other aspects of the embodiment ofFIGS. 2A-2B may be according to the exemplary embodiment ofFIGS. 1A-1G, or according to other similar techniques.
• FIG. 2A depicts carrier plate200 (e.g., a re-usable metal carrier plate) having an active width X (e.g., the active width for a pick and place process on a wire bonder, where such process may include TAB bonding and/or tip forming) and an active depth Y. A detailed portion (i.e., the upper left hand portion) ofcarrier plate200 is depicted in the left hand portion ofFIG. 2A. This is an aerial side view of threeprobe elements202 arranged in a side-by-side configuration oncarrier plate200. Material204 (e.g., a polyimide material or another material that is acid dissolvable) is provided to holdprobe elements202 in place. This is more clearly depicted inFIG. 2B.
• As shown inFIG. 2B,carrier plate200 definesdam walls200a, apocket200band asurface200c. Probe element202 (also referred to as beam202) is positioned with respect tocarrier plate200 such that beam post202arests inpocket200b, and such that the lower surface ofpedestal feature202brests againstsurface200c. Thus,carrier plate200 acts as a platform for tip formation (e.g., a platform for stud bumping).
• Material204 (e.g., a polyimide material or another material that is acid dissolvable) is provided to holdprobe elements202 in place during formation (e.g., stud bumping) oftip portion202conpedestal feature202b. As shown inFIG. 2B,dam walls200acontainmaterial204, which may be applied in a liquid form.
• FIG. 3 depictsprobe element202 removed from carrier plate200 (e.g., aftermaterial204 has been dissolved using, for example, acid or the like).Probe element202 may be picked up (e.g., using a vacuum tool such astool106, and bonded (e.g., TAB bonded) using a tool (e.g., using a bonding tool such as tool106) to a conductive region of a probe substrate.
• The teachings of the present invention are particularly applicable to cantilever style probe elements used in the testing of certain memory devices. For example, by forming (e.g., plating) a probe element on its side, and then rotating it 90 degrees, more complex geometries can be accomplished in the plating operation. The 90 degree orientation of the probe elements (i.e., rotation after being cut from the probe panel) may be accomplished using, for example, a vibratory feed system, a shaker plate, a robotic tool, a vacuum tool, etc. (not depicted). Other rotation amounts may be used, depending upon a particular implementation and the invention is not limited to rotations of 90 degrees.
• The carrier structures discussed herein may be a re-usable metal structure which may be fabricated on using electrically controlled machining (e.g., a CNC machining process) to suit the specific probe elements. For example, pockets, apertures, and surfaces (e.g., seepocket200bandsurface200cinFIG. 2B) may be machined via an EDM (i.e., electro-discharge machining) process.
• According to the present invention, and alternatives thereof, operations including formation of probe elements, cutting the probe elements away from a probe panel, picking up of the probe elements, TAB bonding them to a carrier structure, stud bumping a tip structure, picking up the probe element including tip structure, and TAB bonding of the probe element to a probe substrate, may be automated.
• Although the invention is depicted and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims (20)

1. A method for fabricating a probe for a probe card assembly, the method comprising:

removing the probe from a probe panel having a plurality of probes attached thereto;

attaching the probe to a carrier structure;

while the probe is attached to the carrier structure, forming a tip on a raised platform portion of the probe;

removing the probe from the carrier structure; and

bonding the probe to a probe substrate.

2. The method as recited inclaim 1, wherein the removing the probe from the probe panel includes removing the probe from the probe panel by cutting the probe.

3. The method as recited inclaim 1, wherein:

the probe includes a first post feature and a second post feature,

the attaching the probe to the carrier structure includes bonding the probe to the carrier structure via the first post feature, and

the bonding the probe to the probe substrate includes bonding the probe to the probe substrate via the second post feature.

4. The method as recited inclaim 3, wherein:

the removing the probe from the carrier structure includes cutting the probe into a first portion and a second portion and removing the second portion from the carrier structure, wherein the first portion includes the first post feature and the second portion includes the second post feature and the raised platform portion of the probe, and

the bonding the probe to the substrate via the second post feature includes bonding the second portion of the probe to the substrate via the second post feature.

5. The method as recited inclaim 3, wherein after removing the second portion from the carrier structure the first portion remains bonded to the carrier structure.

6. The method as recited inclaim 3, further comprising clamping the probe to the carrier structure.

7. The method as recited inclaim 1, further comprising after removing the probe from the probe panel having a plurality of probes attached thereto and prior to attaching the probe to a carrier structure, rotating the probe to a different orientation than the orientation of the probe prior to being removed from the probe panel.

8. The method as recited inclaim 1, wherein the attaching the probe to the carrier structure includes bonding the probe to the carrier structure using TAB bonding.

9. The method as recited inclaim 1, wherein the attaching the probe to the carrier structure includes clamping the probe to the carrier structure.

10. The method as recited inclaim 1, wherein:

the substrate includes a conductive region, and

the bonding the probe to the substrate includes bonding the probe to the conductive region of the substrate.

11. The method as recited inclaim 1, wherein the bonding the probe to the conductive region of the substrate includes bonding the probe to the conductive region of the substrate using TAB bonding.

12. The method as recited inclaim 1, wherein the substrate comprises one or more of a multi-layer ceramic, an organic substrate or a space transformer.

13. The method as recited inclaim 1, wherein:

the removing the probe from the carrier structure includes removing the probe from the carrier structure using a tool that utilizes a vacuum, and

the method further comprises prior to bonding the probe to the probe substrate, using the tool that utilizes the vacuum to position the probe in contact with the probe substrate.

14. The method as recited inclaim 1, wherein the forming a tip on a raised platform portion of the probe includes using a tip forming tool to create a stacked tip on the raised platform portion of the probe.

15. A method for fabricating a cantilever probe for a probe card assembly, the method comprising:

affixing the cantilever probe to a carrier structure, wherein the cantilever probe includes a first end and a second end, a post element at the first end of the cantilever probe and a tip pedestal feature at the second end of the cantilever probe, and wherein the carrier structure includes a pocket feature shaped to receive the post element and a surface for supporting the second end of the cantilever probe;

while the probe is affixed to the carrier structure, forming a tip on the tip pedestal feature at the second end of the cantilever probe; and

removing the cantilever probe from the carrier structure.

16. The method as recited inclaim 15, wherein:

the affixing the cantilever probe to the carrier structure includes applying a layer of material on the carrier structure and substantially around and in contact with the cantilever probe, and

the method further comprises prior to removing the removing the cantilever probe from the carrier structure, removing at least a portion of the material.

17. The method as recited inclaim 15, wherein:

the layer of material is applied to the carrier structure in liquid form, and

the carrier structure includes one or more wall features for containing the layer of material when applied to the carrier structure in liquid form.

18. The method as recited inclaim 15, wherein the removing at least a portion of the material includes removing at least a portion of the material by dissolving the at least a portion of the material.

19. The method as recited inclaim 15, wherein the material is a polymide.

20. The method as recited inclaim 15, wherein the forming a tip on the tip pedestal feature at the second end of the cantilever probe includes using a tip forming tool to create a stacked tip on the tip pedestal feature at the second end of the cantilever probe.

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