US20070169333A1 - Microstructured arrays for cortex interaction and related methods of manufacture and use - Google Patents

Abstract

A brain implant system consistent with embodiments of the present invention includes an electrode array having a plurality of electrodes for sensing neuron signals. A method for manufacturing the electrode array includes machining a piece of an electrically conductive substance to create a plurality of electrodes extending from a base member. Each electrode also has a corresponding base section. A nonconductive layer is provided around at least a portion of the base section of each electrode to support the plurality of electrodes. The base section of the electrodes are then cut to separate the base member from the plurality of electrodes supported by the nonconductive support layer. The present invention also includes a complete brain implant system using the above electrode array.

Description

GOVERNMENT SUPPORT
• The U.S. Government has certain rights in this invention as provided for by the terms of grant No. NS25074 and contract No. NO1-NS-9-2322 from N.I.N.D.S.
BACKGROUND OF THE INVENTION
• Recent advances in neurophysiology have allowed researchers to study the activity of groups of neurons with high temporal resolution and in specific locations in the brain. These advances create the possibility for brain-machine interfaces allowing an amputee to control a prosthetic limb in much the same way that person would control a natural limb. Although noninvasive sensors, such as multichannel electroencephalogram (EEG), have shown some promise as simple interfaces to computers, they do not currently offer the spatial resolution needed for prosthetic control. Current research into the electrical activity of small groups of neurons has thus been done primarily with arrays of microelectrodes inserted into the brain.
• Current intra-cortical microelectrode recording systems can record electrical signals from groups of neurons. These systems typically use a microscopic tapered conductive element, insulated except at its tip, to record the neuron signals. Other conductor designs, such as blunt cut wires, may record single neurons, but have sub-optimal recording characteristics. Further, nearly all recording systems rely on arrays of fixed electrodes connected to data acquisition systems through long wiring or cable harnesses. The percutaneous connectors associated with these cables present a potential source of infection that limits the useful life of these systems. The cables themselves also present additional problems in the design of a prosthesis that must continue to function over many years and not interfere with the patient's daily life. For instance, the cables limit the patient's mobility by being tethered to a signal processing device. Relatively long cables may also present a source of electrical interference and may break after repetitive use.
• The current microelectrode systems for recording single neurons can be grouped into two broad classes: those having microdrive mechanisms and those having fixed electrode arrays. Systems with microdrive mechanisms allow one to vertically position the electrodes in the brain tissue. Thus, a user can actively search for neurons of interest and accurately position the electrode tip near the soma of the neuron to improve the signal-to-noise ratio. These systems, however, have their disadvantages. First, even individual microdrive systems are bulky and cannot be fully implanted in a human. Second, microdrive systems typically cannot use more than a few dozen electrodes due to space limitations and the time it takes to independently position each electrode near a neuron.
• Fixed electrode array systems overcome some of these problems, but have their own problems as well. Once placed in the brain, fixed electrode arrays can not be repositioned, so they rely on chance proximity to neurons. The most basic fixed electrode arrays record neural activity using multiple micro-wires or hatpin-like electrodes individually inserted into the brain. Because it can take a relatively significant amount of time to insert each electrode, however, these systems have not been widely used. More recently, wire bundles have been developed which are inserted into the cortex as a unit, but they lack features of ideal recording electrodes, such as tip shape, overall size, and impedance. In particular, the common square tip of such microwires can damage the cortex and can have difficulty penetrating the tough cerebral membranes, as well as brain tissue.
• A major disadvantage of these fixed array systems is that they do not offer the ability to actively hunt for neurons since the electrode tips cannot be easily placed near the soma of the neurons. To help overcome this, large numbers of electrodes are inserted to increase the chance that the electrodes are positioned in close proximity to neurons. The input impedances of the electrodes may also be lowered to enhance their ability to record distant signals. Lowering the input impedance, however, also lowers the signal-to-noise ratio.
• Accordingly, there is a need for a fixed microelectrode array system that may have numerous electrodes providing a high signal-to-noise ratio. Further, there is a need for a fixed array system that has a flexible design and that does not rely upon percutaneous cabling systems to communicate with a data acquisition system.
SUMMARY OF THE INVENTION
• According to a first aspect of the invention, a method of manufacturing an electrode array system is disclosed. The method includes machining a work piece of an electrically conductive substance to create a plurality of electrodes extending from a base member. Each electrode has a corresponding base section. A nonconductive layer is provided around at least a portion of the base sections of the plurality of electrodes. The base member is removed from the plurality of electrodes, such that the plurality of electrodes are supported by the nonconductive layer.
• Another aspect of the invention discloses an electrode array. The array includes a flexible nonconductive support layer and an array of electrodes. Each electrode has a base section and a tip section, where the base section of each electrode is inserted into the nonconductive layer, such that the electrodes are held together by the nonconductive layer. An electrical connection located on the base section of each electrode communicates with the respective electrode.
• In yet another aspect of the invention, a brain implant system comprises an electrode configured to be inserted in a brain and for sensing electrical signals generated by brain neurons. A flexible wiring circuit is connected to the electrode and adapted to receive the neuron electrical signals sensed by the electrode. A processing unit receives the neuron electrical signals from the flexible wiring circuit. The processing unit further includes a detection module for detecting the occurrence of a neuron spike in the received neuron electrical signals. The processing unit also includes a transmitter for transmitting data reflecting the occurrence of each detected neuron spike.
• In still another aspect of the invention, a method for operating a brain implant system, comprises: providing an electrode configured to be inserted in a brain and for sensing electrical signals generated by brain neurons; receiving the neuron electrical signals sensed by the electrode over a flexible wiring; receiving the neuron electrical signals from the flexible wiring and detecting the occurrence of a neuron spike in the received neuron electrical signals; and transmitting data reflecting the occurrence of each detected neuron spike.
• Both the foregoing general description and the following detailed description are exemplary and are intended to provide further explanation of the embodiments of the invention as claimed.
BRIEF DESCRIPTION OF THE DRAWINGS
• The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various embodiments of the present invention, and, together with the description, serve to explain the principles of the invention. In the drawings:
• FIG. 1 is a diagram illustrating an exemplary brain implant system consistent with an embodiment of the present invention;
• FIG. 2A is a block diagram of a neuron signal processing system consistent with an embodiment of the present invention;
• FIG. 2B is a block diagram of a power supply system consistent with an embodiment of the present invention;
• FIGS. 3A to3D illustrate exemplary process for making an electrode array consistent with an embodiment of the present invention;
• FIGS. 4A to4G illustrate an alternative, exemplary process for making an electrode array consistent with an embodiment of the present invention;
• FIGS. 5A and 5B illustrate an exemplary wiring, consistent with an embodiment of the present invention, for attachment to an electrode array; and
• FIG. 6 illustrates an exemplary method, consistent with an embodiment of the present invention, for connecting an electrode to a wiring.
DESCRIPTION OF THE EMBODIMENTS
• Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
• FIG. 1 generally illustrates a brain implant system consistent with an embodiment of the present invention. As shown inFIG. 1, the system includes anelectrode array110 inserted into a patient'scerebral cortex120 through an opening in theskull122.Array110 may include a plurality ofelectrodes112 for detecting electrical brain signals or impulses. WhileFIG. 1 showsarray110 inserted intocerebral cortex120,array110 may be placed in any location of a patient's brain allowing forarray110 to detect electrical brain signals or impulses.
• Eachelectrode112 may be connected to aprocessing unit114 viawiring116.Processing unit114 may be secured toskull122 by, for example, the use of an adhesive or screws, and may even be placed inside the skull if desired. Aprotective plate130 may then be secured toskull122 underneath the surface of the patient'sskin124. In one embodiment,plate130 may be made of titanium and screwed toskull120 usingscrews132. However, the invention may use any of a number of known protective plates, such as a biological material, and methods for attaching the same to a patient's skull. Further, processingunit114 and other surgically implanted components may be placed within a hermetically sealed housing to protect the components from biological materials.
• Electrode array110 serves as the sensor for the brain implant system. While the various figures in this specification illustrateelectrode array110 as having sixty-fourelectrodes112 arranged in an 8×8 matrix,array110 may include one or more electrodes having a variety of sizes, lengths, shapes, forms, and arrangements. Eachelectrode112 extends intobrain120 to detect the electrical neural signals generated from the neurons located in proximity to the electrode's placement within the brain. Neurons may generate such signals when, for example, the brain instructs a particular limb to move in a particular way.Electrode array110 is described in more detail with respect toFIGS. 3A to3D andFIGS. 4A to4G.
• Electrodes112 transfer the detected neural signals toprocessing unit114 overwiring116. As shown inFIG. 1,wiring116 may pass out of the opening inskull122 beneathprotective plate130. Wiring116 may then run underneath the patient'sskin124 to connect toprocessing unit114. Persons skilled in the art, however, will appreciate that arrangements other than the one shown inFIG. 1 may be used to connectarray110 toprocessing unit114 viawiring116. Wiring116 is described in more detail below with respect toFIGS. 5A and 5B.
• Processing unit114 may preprocess the received neural signals (e.g., impedance matching, noise filtering, or amplifying), digitize them, and further process the neural signals to extract neural information that it may then transmit to an external computing device (not shown). For example, the external device may decode the received neural information into motor control signals for controlling a motorized prosthetic device or analyze the neural information for a variety of other purposes.Processing unit114 is described in further detail with respect toFIG. 2A.
• FIG. 2A is a block diagram of aprocessing unit114 consistent with an embodiment of the present invention. As shown inFIG. 2A, processingunit114 may further include an analog-to-digital (A/D)interface210, adetection module220, abuffer230, acontroller240, and atransceiver250. In an exemplary embodiment,interface210,module220, and buffer230 each may be implemented by a common field programmable gate array (FPGA), although other embodiments are possible. For instance, alternative embodiments may include dedicated hardware or software components for implementingsubcomponents210,220, or230, such as by using a microprocessor.
• A/D interface210 may include a plurality of A/D converters, each of which may receive the analog output from acorresponding electrode112 or group ofelectrodes112. Each A/D converter may amplify, digitize, and multiplex the signals received from the corresponding electrode(s)112. In one exemplary embodiment, an amplification stage of A/D interface210 may be implemented using a CMOS-based two-stage operational amplifier known to those skilled in the art, and selected to have a bandwidth of approximately 300-10 kHz and a gain of about 5000. However, processing units consistent with the present invention may also process other electrical neural signals, such as those in the 0-100 Hz range, for example.
• For the exemplary embodiment ofarray110 comprising an 8×8 matrix of electrodes, A/D interface210 may include eight 12-bit, 37.5 kHz A/D converters, each of which receives the analog outputs from eight corresponding electrodes. In such a case, each A/D converter may multiplex the electrode channel signals received from a corresponding row or column ofarray110. A/D interface210 may, however, multiplex other groupings of the electrode channels using any number of A/D converters. For instance, A/D interface210 may include one A/D converter that receives the analog outputs from all of the electrode channels to multiplex those signals into one signal. Alternatively, A/D interface210 may simply convert the electrode channels into digital signals without multiplexing. In either case,interface210 may then provide the digital signals todetection module220.
• Detection module220 detects when a neuron has fired. The signal from a single neuron essentially comprises a series of electrical spikes. The brain encodes information according to the frequency or firing rate of these spikes, which is typically between 0 to 300 Hz. The spike itself may last about 1.5 ms and may have a peak-to-peak voltage of about 100 μV. In systems consistent with an embodiment of this invention,detection module220 may detect the time a spike occurs since the neural information content is encoded in the timing between the spikes. Alternatively, module may detect the spike count over a predetermined time period or may detect instantaneous neural frequencies. In either event, by removing the inter-spike data and reducing the waveform to a time spike representation,module220 may optimize the wireless communication bandwidth and minimize the storage requirements of the brain implant system. Buffer230 may, however, also record information sufficient to determine the shape of the spike. The ability to determine the spike's shape may be needed in certain applications, such as when sorting which spikes come from which neurons.
• To detect a spike,detection module220 may detect whether the channel signal from A/D interface210 meets a triggering event. Spike detection may be based on time, amplitude, or other aspects of the shape of the waveform. For example,module220 may detect when the rising edge of a neural signal detected with aparticular electrode112 exceeds a predetermined threshold value in amplitude or time, or a combination of the two. Since the spike amplitude may vary among neurons,module220 may vary the threshold value for eachelectrode112 based on the particular neuron(s) being detected by that electrode. In an exemplary embodiment,detection module220 may include a programmable 12-bit threshold for setting the threshold level(s).
• Buffer230 may be implemented by using a pre-trigger and a post-trigger buffer memory. For instance, a small ring buffer may temporarily pre-store the digital data of a channel prior to a triggering event detected bydetection module220. The pre-trigger buffer memory may thus store those samples corresponding to the spike's shape or other features (e.g., spike slope), prior to the triggering event. Buffer230 may also include a separate pre-trigger buffer for each channel orelectrode112, which may store the samples from each channel, according to an exemplary embodiment. Channel data obtained after the triggering event may then be stored directly in the post-trigger buffer memory to record the time each spike occurs and/or the spike shape. In one exemplary embodiment, buffer230 stores 1.65 ms of recorded data per spike.
• Upon triggering, buffer230 may then output the data of both the pre-trigger and post-trigger buffer memories totransceiver250. Ifbuffer230 outputs neural information faster thantransceiver250 may transmit that information, then buffer230 may temporarily store the outputted data in a transmit buffer (not shown). Further,transceiver250 may also transmit only the time of the triggered event of each detected neuron signal to increase the transmission rate.
• Controller240 may act as an interface betweentransceiver250 and A/D interface210,detection module220, andbuffer230.Controller240 may also perform certain other control functions, such as setting the trigger threshold level ofmodule220 or setting the size of pre-trigger or post-trigger buffers ofbuffer230. In addition,controller240 may be used to select particular electrode channels for processing and outputting bytransmitter250.Controller240 may also manage the power resources of the electrode array system100. To each of these ends,controller240 may include an I/O interface allowing a user toprogram controller240 to perform the above or other control functions. A user may thus programcontroller240 by transmitting control signals from an external control device (not shown) totransceiver250, which may then forward the control information tocontroller240.
• Transceiver250 provides a wireless communication link betweenprocessing unit114 and an external device (not shown). In particular,transceiver250 receives the pre-trigger and post-trigger data stored inbuffer230 for transmission to the external device for further processing and storage.Transceiver250 may transmit the data using “Bluetooth” technology or according to any other type of wireless communication standard, including, for example, code division multiple access (CDMA), wireless application protocol (WAP), or infrared telemetry.Transceiver250 may also receive control information using either of the above communication techniques.
• Processing unit114 may also include a power supply (not shown inFIG. 2A) for the brain implant system.FIG. 2B is a block diagram of an exemplary power supply system consistent with an embodiment of the present invention. While the power supply system ofFIG. 2B allows the implanted power supply to be recharged, other power supply systems may be used (such as a typical battery source) that need to be replaced when their power is exhausted. As shown inFIG. 2B, a power supply system consistent with the invention may include apower supply260, anamplifier262, an outside coil orinductor264, an inside coil orinductor266, arectifier circuit268, abattery recharging circuit270, and abattery272.Components260,262, and264 are located outside of the patient's body (i.e., outside skin124) andcomponents266,268,270, and272 are located inside the patient's body.
• While each of the components of the power supply system ofFIG. 2B are individually known to those skilled in the art, the particular hardware chosen to implementcomponents266,268,270, and272 may be advantageously chosen based on size, heat requirements, and biocompatibility. For instance, a preferred embodiment would implementcomponents266,268,270, and272 by using hardware having a small size, low heat dissipation, and a high biocompatibility with the natural tissue inside the patient.
• Power supply260 may be any AC power supply, such as a standard 120 volt AC power source.Amplifier262 receives an AC voltage signal fromsupply260, amplifies it, and applies the amplified AC voltage signal toinductor264. Wheninductor264 is activated and placed in close proximity toinductor266,inductor264 will induce a current ininductor266. The induced current then creates an AC voltage on the output terminals ofinductor266, which is then applied torectifier circuit268.Rectifier268 then converts the induced AC voltage signal to a DC voltage signal in a manner known to those skilled in the art.FIG. 2B further shows anoptional capacitor269 for filtering the rectified voltage signal. In particular,capacitor269 may further limit any AC voltage signal levels that may still be present on the rectified output signal and thereby present a cleaner DC voltage signal.Battery recharging circuit270 then receives the DC voltage signal for chargingbattery272 located inside the patient. In an exemplary embodiment,battery272 is a lithium-polymer 3.6 V battery.
• FIGS. 3A to3G illustrate exemplary manufacturing processing steps for preparing an electrode array consistent with an embodiment of the present invention. In particular,FIG. 3A shows a work piece or block of electricallyconductive material310 including a plurality ofelectrodes112. While an exemplary embodiment includes using titanium asmaterial310, a number of other conductive materials may be used, including, for example, stainless steel, steel, titanium nitride, a titanium-aluminum-vanadium alloy, tungsten carbide, copper, or doped silicon.Electrodes112 may be formed frommaterial310 by applying a wire electrical discharge machining (wire EDM) technique known to those skilled in the art. In particular, wire EDM may be used to precisely machine a raw block of electricallyconductive material310 to formelectrodes112.Array110 may be formed by performing a wire EDM cut through one plane, rotatingarray110 ninety degrees, and then performing a second wire EDM cut through a second plane. Other known manufacturing methods may, however, be used to micro-machineconductive material310, such as by using a laser or a diamond saw.
• Further, a chemical etching process may also be applied tofurther machine electrodes112. For instance, the machined array ofFIG. 3A may be placed in an etching bath to further etch the electrode surfaces. Whenmaterial310 is titanium, for example, a heated hydrochloric or hydrofluoric acid bath may be used to etch the electrode surfaces. By an etching process,electrodes112 of finer widths may be obtained. This process also removes the oxide layer from the electrode surfaces and smoothes those surfaces, a desirable step before forming additional coatings onarray110.
• FIG. 3A showselectrodes112 as having a tapered shape at their tips. In an exemplary embodiment, eachelectrode112 may have a width of about 80 μm and taper to a point over the top 50 μm of its length. Further,FIG. 3A also shows that a base section ofelectrodes112 may have aplatform portion312.Portions312 may serve as a platform for securing a support layer, which is described below with respect toFIGS. 3B and 3C. Rather than havingplatforms312, however,electrodes112 may include a stepped lower base portion (e.g., as shown inFIG. 3A-1) or a rounded lower base portion (e.g., as shown inFIG. 3A-2), which may alternatively serve as a platform for supporting the support layer. Moreover,electrodes112 may have a variety of shapes, such as a continuous width shape (i.e., with no platform or stepped base section), a conical shape, a stepped-pyramidal shape, or a tapered shape different than that shown inFIG. 3A.Electrodes112 may also have a variety of cross-sectional shapes, such as a rounded cross-section (which may be formed by a chemical etching process) or a rectangular, square, or hexagonal cross-section (which may be formed by the wire EDM technique). Moreover, as used herein, an electrode's “base section” refers broadly to the end portion ofelectrode112 opposite the electrode's tip, without referring to the electrode's shape or width.
• Electrodes112 ofarray110 may also differ in length to sense particular neurons located at different depths incortex120. For instance,electrodes112 may increase in length from one side ofarray110 to the other.Electrodes112 may also vary in both length and width from other electrodes inarray110, such that a givenelectrode112 is either longer or shorter, or wider or narrower, than the electrode adjacent to it. For instance,array110 may include shorter electrodes between 0.1 mm to 8 mm in length and/or longer electrodes between 0.3 mm to 50 mm in length. Further, forelectrodes112 to record signals from common neurons, the spacing between electrodes may be less than 50 μm, while the spacing may be more than 400 μm whenelectrodes112 record signals from different neurons.
• Electrode arrays110 consistent with the invention may also arrangeelectrodes112 in a number of ways. For example,electrodes112 may be arranged in a one-dimensional or two-dimensional matrix, according to a predefined pattern, or in a random order. One exemplary pattern in whichelectrodes112 may be arranged is a honeycomb-like hexagonal pattern. As described above, however, any type of pattern or arrangement ofelectrodes112 may be used to formarray110.
• Depending upon the composition ofconductive material310,electrodes112 may be coated with a separate conductive layer (not shown). The conductive layer may only be necessary ifconductive material310 is not biocompatible with the neural tissue and cerebro-spinal fluid or if the electrical characteristics require a coating (e.g., to avoid junction potentials at the electrode tips). An exemplary embodiment may include coatingelectrodes112 with platinum by an electroplating process or other deposition method. The deposited layer may also improve the sensitivity of the electrode and may also prevent oxidation of the electrode.Electrode arrays110 consistent with the present invention may also use other conductor materials besides platinum, such as gold or titanium nitride, formed by electroplating or other types of formation processes, such as vapor deposition or electron beam deposition. Further, the entire structure ofFIG. 3A or just the tips ofelectrodes112 may be coated with the conductive material.
• An insulating layer (not shown) may also be applied toelectrodes112. Except for the electrode tip used to record the neural signals, the insulating layer may cover the whole electrode. The insulating layer may be removed from the electrode tips (e.g., by laser ablation, plasma etching, or chemical etching), or may be prevented from being formed on the tips (e.g., by a masking procedure). In this, way, conduction is allowed only through the tips and single neurons can be better isolated from one another. In the exemplary embodiment, all but the top 50 μm of eachelectrode112 are insulated with Paralene by a vapor deposition process. Other insulating materials, such as glass, silicon nitride, polyimide, an epoxy, or other plastics or ceramics, may be used instead.
• As shown inFIG. 3B, asupport layer320 may then be placed overelectrodes112 to electrically isolateelectrodes112 and to supportelectrodes112 during the cutting process described below with respect toFIG. 3C.Layer320 may have a number of corresponding openings for receipt ofelectrodes112.Support layer320 may slide down overelectrodes112 until, for example, it reaches thebottom platform sections312 of eachelectrode112. Each hole or opening inlayer320 may have a diameter sized to securely receive eachelectrode112, while compensating for any positional tolerances from a drilling or laser process when forming the holes. In the exemplary embodiment,support layer320 is a flexible material, such as polyimide, parylene, or silicone.Layer320 may also be formed using materials having a flexibility that changes over time or under some other condition (e.g., having a flexibility that changes in response to the brain's heat).
• An optional step may include applying an epoxy coating (not shown) toelectrodes112 andsupport layer320. The epoxy coating may, however, be applied afterelectrodes112 are cut as described below with respect toFIG. 3C. Aftersupport layer320 has been placed overelectrodes112, the bases ofelectrodes112 may be cut using a wire EDM technique to separateelectrodes112 fromblock310.FIG. 3C illustratesarray110 afterelectrodes112 have been cut or separated fromblock310.
• After cuttingelectrodes112, wiring116 may then be placed over the cut ends ofelectrodes112, as shown inFIG. 3D, to connect electrodes toprocessing unit114. Likesupport layer320, wiring116 may have a number of corresponding openings for receipt ofelectrodes112. WhileFIG. 3 shows these openings as passing entirely throughwiring116, the openings may alternatively be formed as depressions inwiring116, such thatelectrodes112 may fit within the opening or depression, but not pass entirely throughwiring116. In either case, each hole or opening may have a diameter sized to securely receive eachelectrode112, while compensating for any positional tolerances from a drilling or laser process when forming the holes. Wiring116 may then slide overelectrodes112 until, for example, it reaches theplatform sections312 of eachelectrode112. Wiring116 may then be electrically connected toelectrodes112. Further, the cut array assembly may be placed in a holder (not shown) to holdelectrodes112 in place when aligning and loweringwiring116 overelectrodes112. In the exemplary embodiment, wiring116 may also be formed of a flexible material, such as polyimide, parylene, or silicone. Wiring116 is described in more detail below with respect toFIGS. 5A and 5B.
• FIGS. 4A to4G illustrate alternative, exemplary manufacturing processing steps, consistent with an embodiment of the present invention, for making an electrode array. In particular,FIG. 4A shows a block of electricallyconductive material310 including a plurality ofelectrodes112. The electrodes ofFIG. 4A may be formed using the processes described above with respect toFIG. 3A. As shown inFIG. 4A, however,electrodes112 have a stepped-pyramidal shape similar to that shown inFIG. 3A-1, in which theelectrodes112 have stepped decreases in width from bottom to top. In an exemplary embodiment, eachelectrode112 may have a taperedtip portion412 and steppedbase sections414,416, and418 of increasing widths. As described above, however,electrodes112 may have a variety of shapes, including continuous width shapes and stepped-pyramidal shapes having more or less than the three different width sections shown inFIG. 4A. Moreover, as stated above, an electrode's “base section” refers broadly to the end portion ofelectrode112 opposite the electrode's tip, without referring to the electrode's shape or width.
• As shown inFIG. 4B, wiring116 may then be placed overelectrodes112. As shown inFIG. 4B, and as described above with respect toFIG. 3D, wiring116 may have a number ofcorresponding openings420 for receipt ofelectrodes112. Wiring116 may slide down overelectrodes112 until, for example, it reaches thebottom base section418 of eachelectrode112.FIG. 4C illustrates wiring116 in its lowered position.
• FIG. 4D shows an optional step of applying anepoxy coating430 toelectrodes112 andwiring116.Epoxy coating430 may, however, be applied afterelectrodes112 are cut as described below with respect toFIG. 4F.FIG. 4E shows theepoxy coating430 lowered until it rests on top ofwiring116. WhileFIGS. 4D and 4E showepoxy coating430 as having a sheet-like form,epoxy430 may take a variety of forms, such as a more fluid-like form forcoating array110. After wiring116 andepoxy coating430 have been placed overelectrodes112,electrodes112 may be cut along dashedline440 shown inFIG. 4F by using a wire EDM technique. After cuttingelectrodes112, their cut ends formsquare connector pads442 which may then be soldered or otherwise electrically connected to the electrical contacts ofwiring116.FIG. 4G showselectrode array110 afterelectrodes112 have been cut.
• By fabricatingelectrode array110 according to the manufacturing methods discussed above with respect toFIGS. 3A-3D andFIGS. 4A-4G,array110 may have an improved degree of flexibility over conventional fixed electrode arrays. This improved flexibility may be created by supporting theelectrodes112 removed frombase310 with either-support layer320 orflexible wiring116. In particular,electrodes112 are essentially supported and held together by their being inserted into the openings ofsupport layer320 orflexible wiring116. Becauselayer320 andwiring116 can each be made flexible,array110 can also then be flexible. This flexibility is an important feature of the present invention since it allowsarray110 to better conform to the contours of the patient's brain and to be more compliant near blood vessels. However, systems and methods consistent with the invention may useelectrode arrays110 with limited flexibility.
• Moreover,electrode arrays110 consistent with the present invention may be manufactured by methods other than those discussed above with respect toFIGS. 3A-3D andFIGS. 4A-4G. For example, after fabricatingelectrodes112, the base section of each individual electrode may be attached directly to a surface ofwiring116. According to this alternative manufacturing method, wiring116 would not need any through-hole (e.g., opening420) for receivingelectrodes112. The end of eachelectrode112 may simply be placed on the surface ofwiring116 for attachment (e.g., by a bumping or soldering method).
• FIGS. 5A and 5B illustrate an exemplary embodiment of awiring116 consistent with the present invention. As shown inFIG. 5A, wiring116 may includeopenings420 for receivingelectrodes112 ofarray110. Aconductor510 is connected to eachopening420 for transferring the neural signals received from anelectrode112 inserted into the corresponding opening.Conductors510 may then connect toprocessing unit114 using, for example, fine-pitch surface mount connectors.
• As described above, wiring116 may be flexible circuit board or micro-ribbon cable made of polyimide, parylene, or silicone. In one exemplary embodiment, wiring116 may comprise a single conductive layer of a polyimide-based flexible substrate having, for example, a thickness of up to approximately a 200 μm, and includeconductors510 having about a 25-50 μm diameter with a spacing of about 25-150 μm between adjacent conductors. This exemplary embodiment ofwiring circuit116 provides for a wiring connector having small dimensions and flexibility, while also having a good yield during manufacturing.Wiring circuits116 consistent with the invention are not limited to these sizes, however, and those skilled in the art will appreciate that other sizes and types of wiring circuits may be used to connectelectrode array110 toprocessing unit114.
• A milling or laser machining process may then be used to create correspondingopenings420 for eachconductor510. In the exemplary embodiment, each opening420 inwiring116 may have a diameter sized to securely receive eachelectrode112, while compensating for any positional tolerances from a drilling or laser process when forming the holes.
• As shown inFIG. 5B, wiring116 may also includeslits520 betweenconductors510 at various points along the length ofwiring116. As shown inFIG. 5B, slits520 may providecircuit116 with three-dimensional flexibility to help reduce tethering forces described below.Slits520 may be made by using a laser to make cuts onwiring116 between theparallel conductors510.Slits520 may run up to the length ofwiring116. To prevent excessive bending ofwiring116 near its attachment toelectrode array110, a stiffener may also be added towiring116. For instance, a hardening resin or epoxy may be applied to the area wherewiring116 attaches toelectrode array110, as also discussed above with respect toFIG. 4D.
• The flexibility betweenelectrode array110 andprocessing unit114 created by wiring116 offers several advantages. For instance, wiring116 may reduce tethering forces created when the brain moves relative to the skull. If not reduced, these tethering forces may cause the position ofelectrode array110 to move relative to the brain. To reduce these forces, an exemplary embodiment ofwiring116 has a horizontally flat shape where its width is much larger than its thickness. Wiring116 thus has a lower stiffness for up-down brain shifts. Accordingly, by makingslits520 of sufficient lengths, wiring116 may have minimum stiffness within the maximum expected range of motion. Wiring116 may then allowelectrode array110 to move with the brain as it shifts relative to the skull. In this way, brain implant systems of the present invention may sustain relative brain shifts of up to 2 mm, which may result from cardiac and respiratory rhythms or other mechanical perturbations. Further, as an alternative toslits520, wiring116 may be coiled along its length or bent into an accordion-style staircase.
• In an exemplary embodiment, a flip chip mounting method based on stud bumping or other bumping method may be used to connectwiring116 toelectrodes112 ofarray110.FIGS. 6A and 6B illustrate exemplary stud bumping mounting methods for the respective arrays manufactured according to the processing steps ofFIGS. 3A to3D and the processing steps ofFIGS. 4A to4G. Those skilled in the art will appreciate, however, thatFIGS. 6A and 6B are intended to be exemplary of how known bumping techniques may be used to connectwiring116 toarray110. Further, other, attachment methods may also be used to mountwiring112 to thearray110, such as by using a conductive epoxy.
• FIG. 6A shows anelectrode112 inserted through an opening ofsupport layer320, as described above with respect toFIGS. 3B and 3C. To mountwiring116,electrical contact pads610 may be formed onwiring116 near theopenings420 for receivingelectrodes112. Solder bumps612 may then be disposed onpads610. When wiring116 is then placed againstplatform portions312 ofelectrodes112, solder bumps612 are deformed and create an electrical connection betweenpads610 andplatform portions312 ofelectrodes112. WhileFIG. 6A showscontact pads610 andsolder bumps612 placed on the side ofwiring116 facingsupport layer320,pads610 andbumps612 may alternatively be placed on the other side ofwiring116 for connectingwiring116 toelectrodes112.
• In the exemplary embodiment ofFIG. 6B,electrode112 may be inserted through anopening420 ofwiring116 until, for example,platform portion312 ofelectrode112 makes contact withelectrical contact pads610 formed onwiring116 and mates withwiring116.Solder612, or other wire bonding methods or materials, may then be added to secure the electrical connection ofelectrode112 topads610 and hence towiring116. Abiocompatible polymer layer620 may then be added on top ofwiring116 and an epoxy630 may be applied to the space betweenelectrode112 and theopening420 inwiring116.Epoxy630 may holdelectrodes112 in place for the cutting process described above with respect toFIGS. 4F and4G. Further, this arrangement may cause any overflow ofepoxy630 from going betweenwiring116 and thebiocompatible polymer layer620. By doing so, this will prevent epoxy630 from leaking beyond the bottom ofwiring circuit116 and breaking the electrical contact betweenelectrode112 and thepads610.
• Accordingly, wireless brain implant systems and methods for using and manufacturing the same, have been described above. While this invention has been particularly shown and described with references to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims. For example,array110 may be used to supply electrical impulse signals tocortex120 in addition to sensing neural signals. Thus,array110 may be used with neural stimulation techniques and tools known to those skilled in the art.
• Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.

Claims (22)

1-28. (canceled)

29. An electrode array, comprising:

a nonconductive layer;

an array of electrodes, each electrode having a base section and a tip section, wherein the base section of each electrode is inserted into the nonconductive layer, such that the electrodes are held together by the nonconductive layer; and

an electrical connection located on the base section of each electrode to communicate with the respective electrode.

30. The array ofclaim 29, wherein the nonconductive layer comprises a wiring layer.

31. The array ofclaim 30, wherein the wiring circuit further includes a nonconductive portion and a plurality of conductors supported by the nonconductive portion and for connecting to respective ones of the plurality of electrodes, and wherein the nonconductive portion supports the plurality of electrodes.

32. The array ofclaim 29, wherein the nonconductive layer is comprises an epoxy.

33. The array ofclaim 29, wherein the nonconductive layer is comprises glass.

34. The array ofclaim 29, wherein the nonconductive layer comprises a flexible material.

35. The array ofclaim 34, wherein the flexible material comprises at least one of polyimide, parylene, and silicone.

36. The array ofclaim 29, wherein the electrodes are arranged in a two-dimensional matrix pattern.

37. The array ofclaim 29, wherein the electrodes are arranged in a honeycomb-like hexagonal pattern.

38. The array ofclaim 29, wherein the distances between neighboring electrodes varies.

39. The array ofclaim 29, wherein the electrodes increase in length from one side of the array to another side of the array.

40. The array ofclaim 29, wherein the plurality of electrodes have varying lengths.

41. The array ofclaim 40, wherein a first electrode has a length different that than of its immediately neighboring electrodes.

42. The array ofclaim 40, wherein the lengths of the plurality of electrodes are random.

43. The array ofclaim 29, wherein the plurality of electrodes have varying widths.

44. The array ofclaim 43, wherein a first electrode has a width different than that of each of its immediately neighboring electrodes.

45. The array ofclaim 29, wherein the electrodes have a platform portion where the width of the electrode is enlarged.

46. The array ofclaim 45, wherein the nonconductive layer rests on the platform portion of each electrode after the base section of each electrode is inserted into the nonconductive section.

47. The array ofclaim 29, wherein the electrodes may apply an electrical stimulation signal.

48. The array ofclaim 29, wherein the electrodes may detect an electrical signal.

49-58. (canceled)

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