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US20060260674A1 - Nano ic - Google Patents

Nano ic
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Publication number
US20060260674A1
US20060260674A1US11/340,350US34035006AUS2006260674A1US 20060260674 A1US20060260674 A1US 20060260674A1US 34035006 AUS34035006 AUS 34035006AUS 2006260674 A1US2006260674 A1US 2006260674A1
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nano
elements
layer
substrate
array
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Abandoned
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US11/340,350
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Bao Tran
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Abstract

Systems and methods are disclosed to process a semiconductor substrate by fabricating a first layer on the substrate using semiconductor fabrication techniques; fabricating a second layer above the first layer having one or more NANO-bonding areas; self-assemblying one or more NANO-elements; and bonding the NANO-elements to the NANO-bonding areas.

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Claims (20)

US11/340,3502004-04-062006-01-26Nano icAbandonedUS20060260674A1 (en)

Priority Applications (1)

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US11/340,350US20060260674A1 (en)2004-04-062006-01-26Nano ic

Applications Claiming Priority (3)

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US56005304P2004-04-062004-04-06
US11/064,363US7019391B2 (en)2004-04-062005-02-23NANO IC packaging
US11/340,350US20060260674A1 (en)2004-04-062006-01-26Nano ic

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US11/064,363ContinuationUS7019391B2 (en)2004-04-062005-02-23NANO IC packaging

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US20060260674A1true US20060260674A1 (en)2006-11-23

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US11/064,363Expired - Fee RelatedUS7019391B2 (en)2004-04-062005-02-23NANO IC packaging
US11/340,349Expired - Fee RelatedUS7375417B2 (en)2004-04-062006-01-26NANO IC packaging
US11/340,350AbandonedUS20060260674A1 (en)2004-04-062006-01-26Nano ic

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US11/064,363Expired - Fee RelatedUS7019391B2 (en)2004-04-062005-02-23NANO IC packaging
US11/340,349Expired - Fee RelatedUS7375417B2 (en)2004-04-062006-01-26NANO IC packaging

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