US20060201074A1

Movatterモバイル変換

Info

Publication number: US20060201074A1
Application number: US11/366,831
Authority: US
Inventors: Shinichi Kurita; Wendell Blonigan; Makoto Inagawa
Original assignee: Individual
Current assignee: Applied Materials Inc
Priority date: 2004-06-02
Filing date: 2006-03-01
Publication date: 2006-09-14

Abstract

In a first aspect, a first multi-piece chamber is provided. The first multi-piece chamber includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include openings in the top of the pieces and flat mounting surfaces for coupling the pieces together. Numerous other aspects are provided.

Description

The present application is a continuation-in-part of and claims priority from U.S. patent application Ser. No. 11/145,003, filed Jun. 2, 2005 and titled “ELECTRONIC DEVICE MANUFACTURING CHAMBER AND METHODS OF FORMING THE SAME” (Attorney Docket No. 8840), which is hereby incorporated by reference herein in its entirety for all purposes. The present application is also related to U.S. patent application Ser. No. 11/214,475, filed Aug. 29, 2005 and titled “ELECTRONIC DEVICE MANUFACTURING CHAMBER AND METHODS OF FORMING THE SAME” (Attorney Docket No. 8840/P01), which is hereby incorporated by reference herein in its entirety for all purposes.

FIELD OF THE INVENTION

The present invention relates generally to flat panel display and/or electronic device manufacturing, and more particularly to an electronic device manufacturing chamber and methods of forming the same.

BACKGROUND OF THE INVENTION

As substrates used in flat panel displays increase in size, the dimensions of electronic device manufacturing chambers (e.g., processing and/or transfer chambers) used to manufacture the larger flat panel displays also must increase in size. However, the difficulty of manufacturing and transporting such chambers also increases with chamber size due to the overall dimensions and/or weight of the chambers. As such, a need exists for improved electronic device manufacturing chambers used for manufacturing large flat panel displays, as well as for improved methods of transporting such chambers.

SUMMARY OF THE INVENTION

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes a central piece having (1) a first open side; (2) a second open side opposite the first open side; (3) a first facet, between the first open side and the second open side, adapted to couple to a chamber and having an opening sized to allow a substrate to pass through the opening; and (4) a second facet opposite the first facet and between the first open side and the second open side. The second facet is adapted to couple to a chamber and has at least two vertically stacked openings each sized to allow a substrate to pass through the opening. The multi-piece chamber also includes (1) a first side piece adapted to couple with the first open side of the central piece and having at least a first facet with an opening sized to allow a substrate to pass through the opening; and (2) a second side piece adapted to couple with the second open side of the central piece and having at least a first facet with an opening sized to allow a substrate to pass through the opening. The opening of the first facet of the first side piece, the opening of the first facet of the second side piece and a first opening of the second facet of the central piece are at substantially the same elevation when the first side piece, the second side piece and the central piece are coupled together. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a first piece; and (2) at least a second piece coupled to the first piece so as to form the multi-piece chamber. The dimensions of each of the pieces comply with at least one of ground and air transportation regulations, and an overall dimension of the third multi-piece chamber does not comply with at least one of ground and air transportation regulations. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side, a second side and a bottom having a domed portion; (2) a first side piece adapted to couple with the first side of the central piece; and (2) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes a central piece having a first side, a second side and a bottom having a domed portion and a flat portion. The flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness. The multi-piece chamber also includes (1) a first side piece adapted to couple with the first side of the central piece; and (2) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes a central piece having (1) a first side; (2) a second side; (3) a first facet that includes at least one opening sized to allow a substrate to pass through the opening; and (4) a second facet that includes at least three openings each sized to allow a substrate to pass through the opening. The multi-piece chamber also includes (1) a first side piece adapted to couple with the first side of the central piece; and (2) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The first side of the central piece includes at least a first notch adapted to allow a substrate to be rotated within the multi-piece chamber and to be transferred from the multi-piece chamber to a chamber coupled to the first side piece of the multi-piece chamber. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece and having at least one fin structure adapted to reduce movement of a side wall of the first side piece; and (3) a second side piece adapted to couple with the second side of the central piece. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; and (2) a first side piece adapted to couple with the first side of the central piece. The first side piece includes at least one support structure adapted to reduce movement of a side wall of the first side piece. The multi-piece chamber also includes a second side piece adapted to couple with the second side of the central piece. The second side piece includes at least one support structure adapted to reduce movement of a side wall of the second side piece. Further, the central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; (3) a second side piece adapted to couple with the second side of the central piece; and (4) a lid adapted to cover at least the central piece. The lid includes a flat portion and a plurality of support members adapted to reduce movement of the flat portion in a vertical direction. The pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a multi-piece chamber is provided that includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; (3) a second side piece adapted to couple with the second side of the central piece; and (4) a lid adapted to cover at least the central piece. The lid comprises at least one hatch adapted to provide access to an inner region of the multi-piece chamber without requiring the lid to be removed. The side pieces may each include sealable openings in the top of the side pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a method for manufacturing a multi-piece electronic device manufacturing chamber is provided that includes (1) determining one or more overall dimensions of an electronic device manufacturing chamber; (2) determining how to divide the electronic device manufacturing chamber into a plurality of pieces such that a dimension of each of the plurality of pieces complies with at least one of ground and air transportation regulations; and (3) manufacturing the plurality of pieces. The overall dimensions of the multi-piece chamber do not comply with at least one of ground and air transportation regulations. The plurality of pieces may each include sealable openings in the top of the pieces and flat mounting surfaces for coupling the pieces together.

In certain embodiments, a method of transporting a multi-piece chamber is provided that includes (1) transporting a first piece of a plurality of chamber pieces via one of ground and air transportation; (2) transporting a second piece of the plurality of chamber pieces via one of ground and air transportation; and (3) complying with necessary transportation regulations while transporting the first and second pieces. The overall dimensions of the multi-piece chamber violate at least one of ground and air transportation regulations. The plurality of pieces may each include flat mounting surfaces for coupling the pieces together.

In certain embodiments, a method of transporting a multi-piece chamber having a central piece, a first side piece and a second side piece is provided. The method includes (1) placing at least a portion of a vacuum robot in the central piece of the chamber; (2) transporting the central piece via one of ground and air transportation; (3) coupling the first side piece to the second side piece; (4) transporting the first and second side pieces together via one of ground and air transportation; and (5) complying with necessary transportation regulations while transporting the central, first side and second side pieces. The overall dimensions of the multi-piece chamber violate at least one of ground and air transportation regulations. The plurality of pieces may each include flat mounting surfaces for coupling the pieces together.

In certain embodiments, an apparatus is provided that includes a unit having (1) a central piece of a multi-piece chamber adapted to couple to a first side piece and a second side piece so as to form the multi-piece chamber; (2) a vacuum robot positioned within the central piece; and (3) a base frame for the central piece coupled to the central piece. Dimensions of the unit comply with at least one of ground and air transportation regulations. The pieces may each include flat mounting surfaces for coupling the pieces together. The pieces may each include sealable openings in the top of the pieces.

In certain embodiments, an apparatus is provided that includes a unit having (1) a first side piece of a multi-piece chamber; and (2) a second side piece of the multi-piece chamber. The first and second side pieces are adapted to couple to a central piece so as to form the multi-piece chamber. The unit also includes (1) a first base frame piece coupled to the first side piece; (2) a second base frame piece coupled to the second side piece. Dimensions of the unit comply with at least one of ground and air transportation regulations. The pieces may each include flat mounting surfaces for coupling the pieces together. The pieces may each include sealable openings in the top of the pieces. Numerous other aspects are provided in accordance with these and other aspects of the invention.

Other features and aspects of the present invention will become more fully apparent from the following detailed description, the appended claims and the accompanying drawings.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a top view of a first exemplary multi-piece electronic device manufacturing chamber in accordance with some embodiments of the present invention.

FIG. 2A is an exploded isometric view of the first exemplary multi-piece electronic device manufacturing chamber in accordance with some embodiments of the present invention.

FIG. 2B is an isometric view of the first chamber ofFIG. 2A when assembled.

FIG. 2C is a top view of the first chamber ofFIG. 2A.

FIG. 2D is a side view of the first chamber ofFIG. 2A.

FIG. 2E is an isometric view of the first chamber ofFIG. 2A employing an alternative lid design.

FIG. 3 is an isometric view of a second exemplary multi-piece electronic device manufacturing chamber in accordance with some embodiments of the present invention.

FIG. 4 is an exploded isometric view of the second exemplary multi-piece electronic device manufacturing chamber in accordance with some embodiments of the present invention.

FIG. 5 is a side view of a first piece of the second exemplary multi-piece electronic device manufacturing chamber, shown in a container, in accordance with some embodiments of the present invention.

FIG. 6 is a side view of a second piece of the second exemplary multi-piece electronic device manufacturing chamber, shown in a container, in accordance with some embodiments of the present invention.

FIG. 7 is an isometric view of an electronic device manufacturing chamber support in accordance with some embodiments of the present invention.

FIG. 8 is an isometric view of an exemplary electronic device manufacturing chamber support in accordance with some embodiments of the present invention.

FIG. 9 is an isometric view of the exemplary electronic device manufacturing chamber support ofFIG. 8 in accordance with some embodiments of the present invention.

FIG. 10 is an isometric view of the exemplary electronic device manufacturing chamber support ofFIG. 9, shown supporting an electronic device manufacturing chamber.

FIG. 11 is an isometric view of an exemplary base frame/central chamber piece assembly that may be transported as a unit.

FIG. 12 is an isometric view of a side piece/base frame assembly that may be transported as a unit.

FIG. 13 is isometric view of an example embodiment of a chamber side piece with openings in the top surface of the side piece wherein one opening is covered with a lid.

FIG. 14 is isometric view of an example embodiment of a chamber side piece with openings in the top surface of the side piece wherein each opening is covered with a lid.

FIG. 15 is a top plan view of an exemplary portion of a chamber side piece with an opening covered by a lid.

DETAILED DESCRIPTION

With regard to a central transfer chamber, both machining a central transfer chamber “on-site” from a single aluminum block and breaking down a central transfer chamber into a number of elements have been discussed as possible approaches to further scaling transfer chambers. See, for example, “LCD Large-Area Substrate Issues, Substrate Enlargement: Where is the Size Limitation?”, Flat Panel Display 2003 (panel discussion), in which I. D. Kang of Applied Komatsu Technologies (AKT) states:

One equipment alternative would be, if the transfer chamber is further enlarged, to have the machining of a single aluminum block done locally in Asia . . . Another option is to break down the central transfer chamber into a number of elements. Although machining a chamber from a single block of aluminum does guarantee vacuum conditions, it would be possible to make a large transfer chamber composed of elements made from several aluminum blocks and to assemble the structure on site.

A first aspect of the present methods and apparatus relates to an improved method and apparatus for addressing the scalability of large electronic device manufacturing chambers, such as transfer chambers. A second aspect of the present methods and apparatus relates to dynamically supporting an electronic device manufacturing chamber.

Electronic Device Manufacturing Chamber

FIG. 1 is a top view of a first exemplary multi-piece electronic device manufacturing chamber in accordance with some embodiments of the present invention. With reference toFIG. 1, the multi-piece electronicdevice manufacturing chamber101 is a transfer chamber for transporting substrates during electronic device manufacturing. The transfer chamber is coupled to one or more processing chambers and/orload locks103 during electronic device manufacturing. The transfer chamber may include anend effector105 for transporting asubstrate107 among the processing chambers and/orload locks103 during electronic device manufacturing. Asubstrate107 may include, for example, a glass plate, a polymer substrate, a semiconductor wafer or the like.

In accordance with some embodiments of the invention, thetransfer chamber101 may include multiple pieces which are coupled together. More specifically, thetransfer chamber101 may include a first piece109 (e.g., a first side piece) and a second piece111 (e.g., a second side piece) coupled to a third piece113 (e.g., a center piece). Thefirst piece109 andsecond piece111 may each be coupled to thethird piece113 via an O-ring (not separately shown). Thefirst piece109 andsecond piece111 may each be secured to thethird piece113 using securing means, such as screws, bolts, or the like. Although, the multi-piece electronicdevice manufacturing chamber101 ofFIG. 1 includes three pieces, the multi-piece electronic device manufacturing chamber may include a larger or smaller number of pieces (e.g., 2, 4, 5, 6, etc.).

The width of conventional transfer chambers (e.g., one-piece transfer chambers) is generally limited to about 3 m or less by ground and/or air transportation regulations, transport capacity or building design. For example, a transfer chamber larger than about 3 m may be barred by local regulation from transport in most normal capacity 747 freight airplanes and may be too large to fit through entrance doorways in a standard electronic device fabrication facility. In contrast, in one or more embodiments of the present invention, the width W1 of the multi-piece transfer chamber, when assembled (e.g., the overall width), is 4.2 meters. Therefore, the present electronicdevice manufacturing chamber101 can accommodate a larger substrate than can conventional, one-piece transfer chambers. The electronicdevice manufacturing chamber101 may be of a larger or smaller width than 4.2 meters.

The shape of the exemplary multi-piece electronicdevice manufacturing chamber101 when assembled (e.g., the overall shape) is hexagonal. However, the multi-piece electronicdevice manufacturing chamber101 may have other overall shapes (e.g., octagonal if eight chambers are to be coupled to thetransfer chamber101, in which case the first and

second pieces

109,111 may be trapezoidally shaped rather then triangularly shaped as shown).

FIG. 2A is an exploded isometric view of the first exemplary multi-piece electronicdevice manufacturing chamber101 in accordance with some embodiments of the present invention. Each of the first through third pieces109-113 may be coupled horizontally to form the multi-piece electronicdevice manufacturing chamber101. The length of thefirst piece109 is represented by LS1 and the width of thefirst piece109 is represented by WS1. The length ofsecond piece111 is represented by LS2 and the width of thesecond piece111 is represented by WS2. The length of thethird piece113 is represented by LC1 and the width of thethird piece113 is represented by WC1.

In one or more embodiments, the width WC1 of thethird piece113 is about 2.4 m and the length LC1 of thethird piece113 is about 4.2 meters. Larger or smaller lengths and/or widths may be employed for thethird piece113. In the embodiment shown, the length LC1 of thethird piece113 serves as the overall width W1 of thechamber101. As shown, the length LS1 of thefirst piece109 and the length LS2 of thesecond piece111 are equal to the length LC1 of thethird piece113. However, the length LS1 of thefirst piece109 and/or the length LS2 of thesecond piece111 may be different. In one embodiment the width WS1 of thefirst piece109 and/or the width WS2 of thesecond piece111 is about 1.2 meters. However, the width WS1 of thefirst piece109 and/or the width WS2 of thesecond piece111 may be different (e.g., larger or smaller). (In one particular embodiment, thethird piece113 may have a width that is approximately equal to or less than the width of thefirst piece109 plus the width of thesecond piece111, although other relationships between the widths of the first, second and

third pieces

109,111 and113 may be employed). Each piece109-113 of the multi-piece electronicdevice manufacturing chamber101 may be made of, for example, aluminum, stainless steel, or any practicable, relatively inert material suitable for use as a transfer chamber.

Although the overall dimensions of the multi-piece electronicdevice manufacturing chamber101 do not comply with ground and/or air transportation regulations, the dimensions of each piece109-113 of the multi-piece electronicdevice manufacturing chamber101 do comply with ground and/or air transportation regulations. More specifically, in the example described above, the overall width W1 of the multi-piece electronicdevice manufacturing chamber101 is 4.2 m, which does not comply with ground and/or air transportation regulations. However, the width WS1 of thefirst piece109 and the width WS2 of thesecond piece111 are 1.2 m and the width WC1 of thethird piece113 is 2.4 m, each of which complies with ground and/or air transportation regulations. (In another embodiment, the width WC1 of thethird piece113 may be about 3 to 3.2 m and the widths WS1, WS2 of the first and

second pieces

109,111 may be about 1.5 to 1.6 m.)

Additional features of the first multi-piece electronicdevice manufacturing chamber101 will now be described with reference toFIG. 2A, as well as toFIGS. 2B-2D in whichFIG. 2B is an isometric view of thefirst chamber101 when assembled;FIG. 2C is a top view of thefirst chamber101; andFIG. 2D is a side view of the first chamber101 (illustrating a facet of thefirst chamber101 adapted to couple to a triple substrate stacked load lock chamber as described further below).

With reference toFIGS. 2A-2B, thefirst chamber101 includes a plurality of facets201a-f(FIG. 2C). In the embodiment shown, six facets are provided, although a larger or smaller number of facets may be provided (as described previously).

Each facet201a-fprovides a flat sidewall to which a processing chamber, load lock chamber or other chamber may be sealingly coupled (e.g., via an o-ring or other sealing member) as shown, for example, inFIG. 1 with reference to thechambers103. Despite the presence of the facets201a-f, the overall structure of thefirst chamber101 is substantially cylindrical. For example, as shown inFIGS. 2A-2C, the first (side)piece109 includes acylindrical wall203 into which facets201b,201care formed, and the second (side)piece111 includes acylindrical wall205 into whichfacets201e,201fare formed. The third (central)piece113 has substantially flat opposing

side walls

207,209 as shown (FIG. 2A) that serve as facets201a,201d, respectively.

Because of the

cylindrical walls

203,205 of the first and

second pieces

109,111, the interior region of thefirst chamber101 is substantially cylindrical (see, for example,FIG. 2A andFIG. 2C). A cylindrical configuration reduces the interior volume of thefirst chamber101 while allowing free rotation of a vacuum robot (FIG. 7) located within thefirst chamber101. Such rotation may occur, for example, when the robot rotates to transfer substrates between the various chambers coupled to the first chamber101 (FIG. 1).

To accommodate rotations of a vacuum robot through the third (central)piece113 of thechamber101, thethird piece113 includes notchedregions211a-d(seeFIG. 2A in which onlynotches211a-care shown). Thenotches211a-dalso provide additional clearance during substrate transfers through openings (e.g., slit openings) formed in respective facets of the first and the

second side pieces

109,111. That is, thenotches211a-dmay provide additional clearance during substrate transfers through

openings

213,215,217,219, respectively, which correspond tofacets201f,201e,201c,201b(as shown inFIGS. 2A and 2B).

Whilefacets201b,201c,201e,201fare shown as having only one opening, each facet may include additional openings (e.g., 2, 3, 4 or more openings). Likewise, the facet201aof the third (central)piece113 is shown having a single opening221 (FIG. 2A), but may include additional openings (e.g., 2, 3, 4, etc.). The facet201dof thethird piece113 includes three vertically stackedopenings223a-c(FIG. 2A andFIG. 2C), but may include another number of openings (e.g., 1, 2, 4, 5, etc.). In at least one embodiment of the invention, the bottom opening223cof the facet201dof the third (central)piece113 is vertically aligned with theopening215 of thefacet201eof thesecond side piece111 and with theopening217 of the facet201cof the first side piece109 (as shown inFIG. 2D). Note that each opening213-223cis sized to allow a substrate to pass therethrough. Other configurations may be employed.

Referring again toFIG. 2A-2C, the first and

second side pieces

109,111 include a plurality offin structures225, each adapted to provide structural integrity to thefirst chamber101. For example, thefin structures225 may reduce deflection of the cylindrical side/top walls of the first and

second side pieces

109,111 due to pressure differentials between an interior region of thefirst chamber101 and any processing chamber coupled thereto, and/or the environment outside of thefirst chamber101. Further, the use of thefin structures225 allows the wall thicknesses of the first and

second pieces

109,111 to be reduced, and reduces the overall weight of thefirst chamber101. In one embodiment, thefin structures225 have a thickness of about 0.55 inches near the outer side/top walls of the first and

second side pieces

109,111 and of about 1.3 inches near the sealing surfaces of the first and

second side pieces

109,111 that contact the central piece113 (for stainless steel), although other materials and/or thicknesses may be used.

As further shown inFIG. 2A, abottom227 of the third (central)piece113 of thefirst chamber101 includes aflat portion229 and a domed portion231 (see alsoFIG. 2D). Thedomed portion231 provides improved strength to the bottom227, because of its domed shape, and reduces the material thickness requirements for the bottom227. In one exemplary embodiment, thedomed portion231 may have a thickness of about ⅜″ or less while theflat portion227 may have a thickness of about ¾-1″ or less when stainless steel is employed. Other materials and/or thickness values and/or thickness differences between theflat portion229 and thedomed portion231 may be used. To further increase the strength of thedomed portion231, fins orsimilar support structures233 may be formed below thedomed portion231 as shown inFIG. 2D. The use of thefins233 may reduce, for example, vertical deflections of thedomed portion231.

FIGS. 2B-2C andFIG. 8 illustrate atop lid235 that may be employed with thefirst chamber101. For example, thelid235 may be adapted to seal the third (central)piece113 of the first chamber (by employing an o-ring or similar sealing element between thelid235 and the third piece113).

With reference toFIGS. 2B-2C andFIG. 8, thetop lid235 includes aflat sealing portion237 that is reinforced with a plurality of support structures, such asbeams239 as shown. The sealingportion237 may have a thickness similar to that of the flat portion229 (FIG. 2A) of the bottom227 of thechamber101, and thebeams239 provide additional structural support (allowing the thickness and weight of thelid235 to be reduced). Thelid235 may include aconnection location241 that may be used for lifting and/or lowering thelid235 relative to the first chamber101 (e.g., via a crane or the like).

Because of the weight of thelid235, it may be desirable to provide one or more access hatches or other openings within thelid235 so that theentire lid235 need not be removed from thefirst chamber101 to gain access to the interior of the first chamber101 (e.g., for maintenance or other servicing).FIG. 2E is an isometric view of thefirst chamber101 employing analternative lid design235′ that includes twoaccess hatches243a-b. Eachaccess hatch243a-bmay be opened to provide access to the interior region of thefirst chamber101 without requiring theentire lid235′ to be removed from thefirst chamber101. Other numbers of access hatches may be used (e.g., 1, 3, 4, etc.).

FIG. 3 is an isometric view of a second exemplary multi-piece electronicdevice manufacturing chamber301 in accordance with some embodiments of the present invention. The second exemplary multi-piece electronicdevice manufacturing chamber301 includes a first through fifth piece303-311 coupled together. The second exemplary multi-piece electronicdevice manufacturing chamber301, however, may include a larger or smaller number of pieces. In contrast to the first exemplary multi-piece electronicdevice manufacturing chamber101, each of the pieces of the second exemplary multi-piece electronicdevice manufacturing chamber301 may be coupled vertically to form the second exemplary multi-piece electronicdevice manufacturing chamber301.

FIG. 4 is an exploded isometric view of the second exemplary multi-piece electronicdevice manufacturing chamber301 in accordance with some embodiments of the present invention. Afirst piece303 of the second exemplary multi-piece electronicdevice manufacturing chamber301 is a domed top lid. The diameter D1 of the domedtop lid303 may be about 4.2 meters, for example. The domedtop lid303 may be made of stainless steel or other materials, and may be manufactured using spinning or another technique.

The domedtop lid303 is coupled to thesecond piece305, which is coupled to thethird piece307, which is coupled to thefourth piece309 of the second exemplary multi-piece electronicdevice manufacturing chamber301. The second through fourth pieces305-309 of the second exemplary multi-piece electronicdevice manufacturing chamber301 form a main body of the second exemplary multi-piece electronicdevice manufacturing chamber301. The width W2 of each of the second through fourth pieces305-309 may be about 4.2 meters, for example. Each of the widths of the second305, third307 and/orfourth piece309 may be different, and although each of the second through fourth305-309 pieces is shown as hexagonal-shaped, other shapes may be employed. In one aspect, each of the second through fourth pieces305-309 is aluminum, although other materials may be employed. Additionally, a single piece may be employed for the main body.

Thefifth piece311 is a domed bottom lid for the second exemplary multi-piece electronicdevice manufacturing chamber301. Thefifth piece311 is coupled to the bottom of thefourth piece309. Similar to the-domed top lid, the diameter D2 of the domed bottom lid may be about 4.2 meters, for example. Other sizes may be used.

To manufacture the multi-piece electronic

device manufacturing chamber

101,301, a user, such as a manufacturer, may employ the inventive method described below. According to the inventive method, one or more overall dimensions of the electronic device manufacturing chamber is determined. More specifically, a manufacturer may need to manufacture a substrate of a required size. Based on the required size, the manufacturer may determine (e.g., design) one or more overall dimensions of an electronic device manufacturing chamber capable of manufacturing such a substrate. If the required substrate size is large enough, the overall dimensions of the chamber will not comply with at least one of ground and air transportation regulations.

Thereafter, the manufacturer, for example, may determine how to divide the electronic device manufacturing chamber into a plurality of pieces such that the dimensions of each of the plurality of pieces complies with at least one of ground and air transportation regulations and at the same time, the structural integrity of the chamber when assembled will be sufficient to perform manufacturing operations. For example, the manufacturer may divide the designed multi-piece electronic device manufacturing chamber into pieces using vertical sectioning, such as with the electronicdevice manufacturing chamber101 shown inFIGS. 1-2 or using horizontal sectioning, such as with the electronicdevice manufacturing chamber301 shown inFIGS. 3-4. The manufacturer may decide to divide the electronic device manufacturing chamber into pieces using sectioning having other orientations or combinations of orientations.

Thereafter, the plurality of pieces are manufactured. For example, the manufacturer may employ a machining center or shop to fabricate the plurality of pieces. In this manner, the multi-piece electronic

device manufacturing chamber

101,301 is manufactured.

Once the electronic

device manufacturing chamber

101,301 is manufactured, the electronic

device manufacturing chamber

101,301 may be transported, for example, to a customer site. To transport a multi-piece electronic

device manufacturing chamber

101,301, the manufacturer may employ a method of transporting such a chamber in accordance with one or more embodiments of the present invention. For example, a first piece of a plurality of electronic device manufacturing chamber pieces may be transported via one of ground and air transportation. The first piece may be placed in a container that complies with transportation regulations such that the first piece forms an angle with a side (such as a bottom side) of the container. Thus, the first piece may have an actual height or width dimension larger than permitted if it was not placed in the container at such an angle, yet may still fit within a container that complies with transportation regulations. The ability to ship larger pieces allows the inventive multi-piece chamber to be formed from fewer pieces. Therefore, placing the pieces at an angle within the shipping container is preferred, though not required. In some embodiments it may be preferred to manufacture a multi-piece chamber such that a main or central piece is as large as possible and still capable of being fit into a standard size shipping container while the remaining pieces are smaller or as small as possible so that assembly is easier.

FIG. 5 is a first piece of the second exemplary multi-piece electronic device manufacturing chamber, shown in acontainer301, in accordance with some embodiments of the present invention. With reference toFIG. 5, the width W3 of acontainer501 may be, for example, 3 meters, which complies with most ground and/or air transportation regulations. A container of a smaller width may be used. The first piece303 (e.g., the domed top lid) may be placed in thecontainer501 such that thefirst piece303 forms an angle A of about 50 degrees with aside503, (e.g., a bottom), of thecontainer501. Thefirst piece303 may form a larger or smaller angle with theside503 of thecontainer501. In one embodiment, thefirst piece303 forms an angle A greater than or equal to 50° and less than or equal to 90° with theside503 of thecontainer501. Consequently, although the width of thefirst piece303 is 4.2 meters, thefirst piece303 fits in a container of a smaller width. Thereafter, thecontainer501 is transported via ground or air transportation. In this manner, the necessary transportation regulations are complied with while transporting the first piece.

Similarly, thesecond piece305 of the electronicdevice manufacturing chamber301 is transported via one of ground and air transportation. Thesecond piece305 is placed in a container that complies with transportation regulations such that thesecond piece305 forms an angle with the bottom of the container. For example,FIG. 6 is a side view of thesecond piece305 of the second exemplary multi-piece electronicdevice manufacturing chamber301 in acontainer501 in accordance with at least one embodiment of the present invention. With reference toFIG. 6, thesecond piece305 is placed in thecontainer501 in manner similar to thefirst piece303.

The overall dimensions of the assembled multi-piece electronicdevice manufacturing chamber301 violate at least one of ground and air transportation regulations. For example, the overall width of the electronicdevice manufacturing chamber301 is not less than 3 meters, and therefore, does not comply with ground and/or air transportation regulations. Therefore, the first and/or the second pieces are transported separately, for example, incontainers501.

In this manner, a multi-piece electronic

device manufacturing chamber

101,301 may be manufactured at a machining center or shop without the disadvantages (e.g., cost) of manufacturing a similarly-dimensioned one-piece electronic device manufacturing chamber. Further, the multi-piece electronic

device manufacturing chamber

101,301 may be transported to a customer site without the disadvantages (e.g., cost, time, etc.) of transporting a similarly-dimensioned one-piece electronic device manufacturing chamber.

Supporting an Electronic Device Manufacturing Chamber

FIG. 7 is an isometric view of an electronic devicemanufacturing chamber support701 in accordance with the present invention. With reference toFIG. 7, the electronic devicemanufacturing chamber support701 includes abase frame703. One or more portions of thebase frame703 may be attached to a floor (e.g., fixedly via a floor anchor704).

Note that in a conventional manufacturing chamber support, one or more portions of a base are attached (e.g., fixedly) to the bottom of an electronic device manufacturing chamber. In contrast to a conventional manufacturing chamber support, the electronic devicemanufacturing chamber support701 in accordance with some embodiments of the present invention, additionally or alternatively, may include one or more slidingmechanisms705 for providing dynamic support at the bottom707 of an electronicdevice manufacturing chamber709. The one or more slidingmechanisms705 may include a slide-able bearing, such as a polytetrafluoroethylene (PTFE)-coated bearing, and an elastomer mount including a load bearing rubber or the like. Other suitable materials may be employed for the one or more slidingmechanisms705.

Alternatively, the one or more slidingmechanisms705 may include rollers in place of, or in addition to, sliding bearings. In some embodiments, the electronicdevice manufacturing chamber709 may be suspended by vertical, diagonal, and/or horizontal flexible lines such that any expansion may be accommodated by the flexible lines which may have an expansion capacity in excess of the maximum possible expansion of the electronicdevice manufacturing chamber709.

The one or more slidingmechanisms705 are adapted to accommodate thermal or other expansion of the electronicdevice manufacturing chamber709. For example, during electronic device manufacturing, heat from adjacent process chambers may cause the temperature of the electronic

device manufacturing chamber

101,301 to exceed 200 or 300 degrees Celsius, which may cause the electronicdevice manufacturing chamber709 to expand. The slidingmechanism705 prevents the electronicdevice manufacturing chamber709 from shifting out of position on the electronic device manufacturing chamber support701 (e.g., on the base frame703). A slidingmechanism705 is effective for accommodating any possible amount of electronic device manufacturing chamber expansion, thereby preventing the electronicdevice manufacturing chamber709 from shifting off of the electronic devicemanufacturing chamber support701 or even just shifting out of position.

FIG. 8 is an isometric view of an exemplary electronic devicemanufacturing chamber support801 in accordance with some embodiments of the present invention. With reference toFIG. 8, the exemplary electronic devicemanufacturing chamber support801 may be a multi-piece support. More specifically, the exemplary electronic devicemanufacturing chamber support801 may include amulti-piece base frame803. For example, thebase frame803 may include afirst piece805, asecond piece807 and athird piece809. Thebase frame803 may include a larger or smaller number of pieces. The pieces of the exemplary electronic devicemanufacturing chamber support801 may correspond to the pieces (e.g.,109-113) of a multi-piece electronicdevice manufacturing chamber101 supported by the exemplary electronic devicemanufacturing chamber support801.

In the example shown inFIG. 8, the third piece809 (e.g., a center piece) of thebase frame803 includes eight slidingmechanisms705. Thethird piece809 may include a larger or smaller number of slidingmechanisms705. As shown inFIG. 7, one or more of the slidingmechanisms705 may be aligned with (e.g., directly above) afloor anchor704. However, the slidingmechanisms705 may be positioned differently. Similarly, the first and

second pieces

805,807 of thebase frame803 may include a plurality of slidingmechanisms705. Although a multi-piece electronic devicemanufacturing chamber support801 is described above, the exemplary electronic devicemanufacturing chamber support801 may be a one-piece support.

Note that if thermal expansion causes one or more slidingmechanisms705 to reach the edge of their individual range, in some embodiments, the other slidingmechanisms705 will begin to accommodate any further thermal expansion directed at the original slidingmechanisms705. In other words, once the force applied to move a slidingmechanism705 to the limit of its individual range encounters a stop frame (described below), the expansion force will be redirected in the opposite direction to be accommodated by other slidingmechanisms705.

FIG. 9 is a close-up isometric view of the details of a portion of an exemplary electronic devicemanufacturing chamber support801 in accordance with some embodiments of the present invention. With reference toFIG. 9, the exemplary electronic devicemanufacturing chamber support801 includes one or more slidingmechanisms705 that may include aslide bearing905 and anelastomer mount907.

Theslide bearing905 may include a shaft or threadedrod903 attached to a foot orslip disk901. Theslip disk901 may sit in arecess904 that is coated with, for example, a low friction fluoropolymer resin such as Teflon™ made by the Dupont Corporation. The recess or “stop frame”904 may be square or round or any suitable shape to accommodate a desired range of horizontal motion of theslip disk901. Likewise, theslip disk901 may be square or round or any suitable shape to accommodate a desired range of horizontal motion within therecess904. Theslide bearing905 may be made of steel or any suitable material. In some embodiments, the lower and side surfaces of theslip disk901 may also be coated with a low-friction fluoropolymer resin such as Teflon® to enable theslide bearing905 to move freely within therecess904. Further, theslip disk901 may include rollers or ball bearings instead of, or in addition to, a low-friction coating. In some embodiments, any suitable moveable bearing may be used in place of theslide bearing905.

The shaft or threadedrod903 attached to theslip disk901 may also be attached to the bottom707 (FIG. 7) of the electronicdevice manufacturing chamber709. The threadedrod903 may be screwed into a threaded recess in thebottom707 of the electronicdevice manufacturing chamber709 or be attached using any suitable fastening device such as a pin or other fastener.

Anelastomer mount907 may include a flexible material, such as load bearing vulcanized rubber, sandwiched between, and attached to, mounting plates908a-b. Other suitable flexible materials including metal springs may be used. The mounting plates may be made of steel or any suitable material and may include holes to allow the mounting plates to be attached to thebottom707 of the electronicdevice manufacturing chamber709 and abracket909 portion of thebase frame803, respectively.

In operation, theslide bearings905 may carry the weight of the electronicdevice manufacturing chamber709 and also allow the electronicdevice manufacturing chamber709 to move within an acceptable range as it expands. At the same time, theelastomer mount907 may act to effectively bias the electronicdevice manufacturing chamber709 toward an ideal position on the electronic devicemanufacturing chamber support801. As indicated above, the acceptable range of motion of the electronicdevice manufacturing chamber709 may be defined by the sizes of theslip disks901 and therecesses904 in which they sit. The position and geometry of the recesses may also effect the range of motion. In some embodiments, theelastomer mount907 may additionally or alternatively limit the range of motion of the electronicdevice manufacturing chamber709.

To further illustrate the invention, example dimensions are provided. Note however, that the following dimensions are merely illustrative of particular embodiments and are merely intended to convey an example of appropriate relative sizes. In some embodiments, the diameter D3 of theslip disk901 is approximately 100 mm, therecess904 is approximately 125 mm across, the height h1 of theslip disk901 is approximately 25 mm, the shaft or threadedrod903 diameter D4 is approximately 25 mm and the threadedrod903 height h2 is approximately 137 mm. In some embodiments an M25 bolt (ISO 965-1, Sect. 5, metric fastener size designation) may be used as the threadedrod903. The slidingmechanism705 may be shaped and/or dimensioned differently than pictured. In some embodiments, theelastomer mount907 may deflect or stretch up to approximately 15 mm. Theelastomer mount907 may be shaped and/or dimensioned differently than pictured.

FIG. 10 is an isometric view of the exemplary electronic devicemanufacturing chamber support801 ofFIG. 9 that is shown supporting an electronicdevice manufacturing chamber101. With reference toFIG. 10, theelastomer mount907 and the slide bearing905 of eachsupport801 are coupled to the bottom of an electronicdevice manufacturing chamber101.

To support an electronic device manufacturing chamber a method for supporting the electronic device manufacturing chamber in accordance with some embodiments of the present invention may be employed. More specifically, the electronic device manufacturing chamber is coupled to one or more slidingmechanisms705 of an electronic devicemanufacturing chamber support801. The one or more slidingmechanisms705 are employed to accommodate electronic device manufacturing chamber expansion, thereby preventing the electronic device manufacturing chamber from shifting out of position or falling off the electronic devicemanufacturing chamber support801. For example, the elastomer mounts907 of the slidingmechanisms705 may be stretched or compressed to accommodate electronic device manufacturing chamber expansion.

The foregoing description discloses only exemplary embodiments of the invention. Modifications of the above disclosed apparatus and methods which fall within the scope of the invention will be readily apparent to those of ordinary skill in the art. For instance, although some of the embodiments described above relate to a transfer chamber, the present methods and apparatus may be employed for other types of electronic device manufacturing chambers, such as processing chambers for PVD, CVD or the like. Further, in one or more embodiments, a robot may be inserted (e.g., assembled) into a piece of the multi-piece electronic

device manufacturing chamber

101,301 before the piece is transported to the customer site. For example, a bottom portion of a vacuum robot may be installed in the third (central) piece809 (FIG. 8) of theframe803, such as in abase ring811 of theframe803, and a top portion of the vacuum robot may be installed in the third (central)piece113 of thechamber101. Thethird piece113 of thechamber101 then may be coupled to thethird piece809 of thebase frame803, and the base frame/central chamber piece assembly may be transported as a unit.FIG. 11 is an isometric view of an exemplary base frame/centralchamber piece assembly1101 that may include a vacuum robot (not shown) and that is ready to be transported. In at least one embodiment, prior to shipment, cover units1103a-bare installed over the open sides of the third (central)piece113 of thechamber101, andcover units1105 are installed over the openings of any facets of thethird piece113. The cover units1103a-b,1105 may be formed from aluminum or any other suitable material and may protect the inside of thechamber101, and/or any components installed therein, during shipment.

In one or more embodiments of the invention, theassembly1101 is dimensioned to comply with at least one of ground and air transportation regulations. For example, theassembly1101 may have a height of about 3 m or less.

In another embodiment of the invention, the first and second

side chamber pieces

109,111 and the first and second

base frame pieces

807,805 may be assembled and/or transported together as a unit. For example,FIG. 12 is an isometric view of a side piece/base frame assembly1201 that may be transported as a unit. Theassembly1201 may be formed, for example, by coupling thefirst side piece109 of thechamber101 to thebase frame piece807, by coupling thesecond side piece111 of thechamber101 to thebase frame piece805, and by placing the side piece/base frame assemblies together as shown. Theassembly1201 then may be transported as a unit.Cover units1203 similar to thecover units1105 ofFIG. 11 may be used to cover any facet openings prior to shipment (e.g., to protect the interior of the chamber pieces).

In one or more embodiments of the invention, theassembly1201 is dimensioned to comply with at least one of ground and air transportation regulations. For example, theassembly1201 may have a height of about 3 m or less.

The pieces of the

chambers

101,103 and/or thebase frame803 may be transported using any suitable method. In at least one embodiment, the

side pieces

109,111 of thechamber101 may be transported using a first mode of transportation (e.g., land, boat, air, etc.), and thecentral piece113 of thechamber101 may be transported using a second mode of transportation (e.g., land, boat, air, etc.). As another example, the first and/or

second side piece

109,111 may be transported via a first truck, and thecentral piece113 may be transported using a second truck.

In at least one embodiment of the invention, the vacuum robot may employ a floating seal to isolate the robot from movement of the chamber bottom as shown inFIG. 7 (e.g., by mounting the robot onto the frame of the chamber using a bellows seal) in a manner similar to that described in U.S. patent application Ser. No. 10/601,185, filed Jun. 20, 2003, which is hereby incorporated by reference herein in its entirety.

As shown inFIGS. 2A-2E, the

side pieces

109,111 of thefirst chamber101 are each single piece units that do not require a separate lid or bottom. Separate lids and/or bottoms may be employed for one or both of the

side pieces

109,111, but require additional sealing interfaces that may degrade and/or leak.

While the present invention has been described primarily with regard to flat panel displays, it will be understood that the inventive multi-piece chamber may be used to transfer, process and/or manufacture any type of substrate, and may be used to transfer, process and/or manufacture any type of device (e.g., flat panel displays, solar panels and/or cells, etc.).

It will be understood that transportation regulations may vary from country to country (e.g., U.S., Japan, Korea, Taiwan, China, etc.). For example, size limitations or other relevant transportation parameters may vary from country to country. However, the present invention may be adapted/modified to accommodate the particular transportation regulations of any country (and still fall within the spirit and scope of the invention).

In at least one embodiment of the invention, a method of processing a substrate is provided. The method includes the steps of (1) transferring the substrate from a load lock chamber to a multi-piece transfer chamber that includes a central piece, a first side piece, and a second side piece; (2) transferring the substrate from the multi-piece transfer chamber into a processing chamber; (3) depositing at least one film over the substrate; and (4) transferring the substrate to the load lock chamber. The step of transferring the substrate from the multi-piece transfer chamber into a processing chamber may include rotating the substrate through a notch in a sidewall of the central piece of the transfer chamber (as previously described, for example, with reference toFIG. 2A).

The step of transferring the substrate from the load lock chamber to the multi-piece transfer chamber may include elevating or lowering the substrate. For example, if the load lock chamber is adapted to support at least two vertically stacked substrates, the central piece may include a facet having two or more vertically stacked openings (FIG. 2A). A vacuum robot of the transfer chamber may need to raise or lower to transfer substrates to or from the load lock chamber. Likewise, if the load lock chamber is adapted to support at least three vertically stacked substrates, the central piece may include a facet having three or more vertically stacked openings (FIG. 2A). A vacuum robot of the transfer chamber may need to raise or lower to transfer substrates to or from the load lock chamber.

The step of depositing at least one film over the substrate may include depositing at least one film over the substrate by using chemical vapor deposition, physical vapor deposition or any other suitable technique.

As mentioned above with respect toFIGS. 2B, 2C and8, atop lid235 may be employed with thechamber101. For example, thelid235 may be adapted to seal a top portion of a third (central)piece113 of the chamber101 (by employing an o-ring or similar sealing element between thelid235 and the third piece113). As shown in FIGS.13 to15, the first piece109 (e.g., the first side piece) and the second piece111 (e.g., the second side piece) may also include one or more

top lids

1201,1203. For example, the

lids

1201,1203 may be adapted to sealopenings1205 in a top portion of either or both of first (side)piece109 and the second (side)piece111 of the chamber101 (by employing an o-ring or similar sealing element between the

lids

1201,1203 and the top portions of the first (side)piece109 and/or the second (side) piece111).FIG. 13 depicts an example of a first (side)piece109 with onelid1201 in place and oneopening1205 that is uncovered.FIG. 14 depicts an example of a first (side)piece109 with two

lids

1201,1203 in place.FIG. 15 is a close-up top view of a portion of an example of a first (side)piece109 with onelid1203 in place.

To aid in the sealing of theopenings1205, a flat surface may be machined into the top portion of the

side pieces

109,111 around theopenings1205. For example, for a 20 mm thick chamber top portion such as on an a Model 40Ki/A transfer chamber manufactured by Applied Materials, an approximately 2 mm deep flat surface may be provided in the top portion of the

side pieces

109,111 for an o-ring to create a sealing flange around the periphery of theopenings1205 which may be approximately 12 inches by 25 inches at the widest/longest points. The flange thickness T may be approximately 1.2 inches with an approximately 0.015 inch o-ring groove clearance for lid rubbing. M6×9 mm fasteners may be used to securely attach the

lids

1201,1203 to the

side pieces

109,111. Note that these sizes are provided merely as examples; other dimensions and component sizes are possible.

In some embodiments, theopenings1205 may be as large as possible without compromising the structural integrity of the chamber, particularly when the chamber is under vacuum pressure. More than two openings may be provided. Theopenings1205 may be located generally in the center of each half of the top portion of the

side pieces

109,111 as shown in the drawings. Other locations are possible. Theopenings1205 may be generally shaped to match the general shape of the part of the top portion of the

side pieces

109,111 within which theopenings1205 are located. However, other shapes are possible. Theopenings1205 may be suitable to provide access and/or a view into the chamber without having to disassemble the chamber. Theopenings1205 and corresponding

lids

1201,1203 may have any shape that is practicable. Theopenings1205 may be useful for cleaning the chamber, retrieving an object that may have inadvertently been deposited in the chamber, and/or for monitoring or viewing activity within the chamber.

In the example shown, the

lids

1201,1203 are approximately 13 inches by 26 inches at the widest/longest points and approximately 1.2 inches thick. However other sizes are possible. The lids may be made from Aluminum or any practicable material. In some embodiments, the

lids

1201,1203 may include a sealed window or may be made from a transparent material. In some embodiments, the lids may be curved or have a domed shape (as opposed to the

flat lids

1201,1203 depicted) to improve the structural strength of the lids.

As shown inFIGS. 13 and 14, the

chamber side pieces

109,111 may include aflat mounting surface1207 for attaching the

side pieces

109,111 to the center piece113 (FIG. 8). Theflat mounting surface1207 may be disposed on a strengthening rib of the

side pieces

109,111 such that theflat mounting surfaces1207 surround the portion of the

side pieces

109,111 that face thecenter piece113 when the chamber is assembled. Note that thecenter piece113 may also include corresponding flat mounting surfaces for mating the

side pieces

109,111 and thecenter piece113. Theflat mounting surface1207 may be dimensioned to facilitate a strong and reliable seal between the

pieces

109,111,113 that equals or exceeds the strength and reliability of a chamber manufactured entirely from a single piece of material. For example, by providing an suitably sizedflat mounting surface1207 to coupled the

pieces

109,111,113 together, the resulting chamber may be able to withstand a wider range of pressure and heat variations than a comparably sized chamber manufactured entirely from a single piece of material. For example, referring toFIG. 2A, in some embodiments, the flat mountingsurface area1207A may be 35% (or more) of the total cross-section of the side of thecenter piece113 including the area of the opening to the

side pieces

109,111. Likewise, in some embodiments, the corresponding flat mountingsurface area1207B may be 35% (or more) of the total cross-section of the side of the

side pieces

109,111 including the area of the opening to thecenter piece113. In other embodiments, the flat mounting

surface areas

1207A,1207B may be 40% or more of the total cross-sectional area of the sides of the

pieces

109,111,113 including the area of the respective openings. In some embodiments, the larger ratio of the mounting

surface area

1207A,1207B to the respective opening may allow taller (or otherwise larger) chambers to have improved structural integrity despite the larger size. A taller chamber facilitates the use ofmultiple loadport openings223A,223B,223C (e.g., vertically stacked) on a single facet201D of the chamber as depicted inFIG. 2D. In yet other embodiments, a mounting surface that includes interlocking features may be provided. For example, the mounting surfaces may not be flat but rather include mating grooves and/or alignment features.

Accordingly, while the present invention has been disclosed in connection with exemplary embodiments thereof, it should be understood that other embodiments may fall within the spirit and scope of the invention, as defined by the following claims.

Claims

1. A multi-piece chamber comprising:

a central piece having a first side and a second side;

a first side piece adapted to couple with the first side of the central piece; and

a second side piece adapted to couple with the second side of the central piece;

wherein the central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together, and

wherein the first side piece includes a top portion having at least one opening.

2. The multi-piece chamber ofclaim 1 wherein central piece, the first side piece and the second side piece form a transfer chamber when coupled together.

3. The multi-piece chamber ofclaim 1 wherein the central piece has a substantially rectangular shape.

4. The multi-piece chamber ofclaim 1 wherein the central piece has a length of about 3 meters or greater.

5. The multi-piece chamber ofclaim 4 wherein the central piece has a width of about 2.4 meters or greater.

6. The multi-piece chamber ofclaim 1 wherein the central piece includes a bottom having a domed portion.

7. The multi-piece chamber ofclaim 6 wherein the domed portion is adapted to accommodate a vacuum robot.

8. The multi-piece chamber ofclaim 6 wherein the domed portion includes at least one support fin adapted to reduce movement of the domed portion in a vertical direction.

9. The multi-piece chamber ofclaim 8 wherein the domed portion includes a plurality of support fins, each support fin adapted to reduce movement of the domed portion in a vertical direction.

10. The multi-piece chamber ofclaim 6 wherein the bottom of the central piece includes a flat portion.

11. The multi-piece chamber ofclaim 10 wherein the flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness.

12. The multi-piece chamber ofclaim 11 wherein the first thickness is about 0.75 to 1.0 inches or less and the second thickness is about 0.375 inches or less.

13. The multi-piece chamber ofclaim 11 wherein both the flat portion and domed portion are formed from stainless steel.

14. The multi-piece chamber ofclaim 1 wherein the central piece has a first facet and a second facet, and wherein:

the first facet includes at least one opening sized to allow a substrate to pass through the opening; and

the second facet includes at least two openings each sized to allow a substrate to pass through the opening.

15. The multi-piece chamber ofclaim 14 wherein the second facet includes at least three openings each sized to allow a substrate to pass through the opening.

16. The multi-piece chamber ofclaim 14 wherein the first facet is adapted to sealingly couple to a processing chamber.

17. The multi-piece chamber ofclaim 16 wherein the second facet is adapted to sealingly couple to a load lock chamber.

18. The multi-piece chamber ofclaim 17 wherein the second facet is adapted to sealingly to couple to a load lock chamber that stores at least three substrates stacked vertically, and wherein the second facet has:

a first opening sized to allow a substrate to pass between the central piece and the load lock chamber at a first elevation;

a second opening sized to allow a substrate to pass between the central piece and the load lock chamber at a second elevation; and

a third opening sized to allow a substrate to pass between the central piece and the load lock chamber at a third elevation.

19. The multi-piece chamber ofclaim 18 wherein:

the first side piece includes at least a first facet having an opening sized to allow a substrate to pass through the opening;

the second side piece includes at least a first facet having an opening sized to allow a substrate to pass through the opening; and

the opening of the first facet of the first side piece, the opening of the first facet of the second side piece and the first opening of the second facet of the central piece are at substantially the same elevation when the first side piece, the second side piece and the central piece are coupled together.

20. The multi-piece chamber ofclaim 1 wherein the first side of the central piece includes at least a first notch adapted to allow a substrate to be rotated within the multi-piece chamber and to be transferred from the multi-piece chamber to a chamber coupled to the first side piece of the multi-piece chamber.

21. The multi-piece chamber ofclaim 20 wherein the second side of the central piece includes at least a first notch adapted to allow a substrate to be rotated within the multi-piece chamber and to be transferred from the multi-piece chamber to a chamber coupled to the second side piece of the multi-piece chamber.

22. The multi-piece chamber ofclaim 1 wherein the first side piece and the second side piece have a first width, and the central piece has a second width that is approximately twice the first width or greater.

23. The multi-piece chamber ofclaim 1 wherein the first side piece comprises a substantially cylindrical side wall having a plurality of flat facets formed in the side wall.

24. The multi-piece chamber ofclaim 23 wherein the first side piece includes two facets, each having an opening sized to allow a substrate to pass through the opening.

25. The multi-piece chamber ofclaim 23 wherein the first side piece includes at least one fin structure adapted to reduce movement of the side wall of the first side piece.

26. The multi-piece chamber ofclaim 25 wherein the first side piece includes a plurality of fin structures adapted to reduce movement of the side wall of the first side piece.

27. The multi-piece chamber ofclaim 1 wherein the second side piece comprises a substantially cylindrical side wall having a plurality of flat facets formed in the side wall.

28. The multi-piece chamber ofclaim 1 further comprising a lid adapted to cover at least the central piece.

29. The multi-piece chamber ofclaim 28 wherein the lid comprises a flat portion and a plurality of support beams adapted to reduce movement of the flat portion in a vertical direction.

30. The multi-piece chamber ofclaim 29 wherein the flat portion has a thickness of about 0.75 to 1.0 inches or less.

31. The multi-piece chamber ofclaim 29 wherein the lid comprises at least one hatch adapted to provide access to an inner region of the multi-piece chamber without requiring the lid to be removed.

32. The multi-piece chamber ofclaim 31 wherein the lid comprises at least two hatches, each adapted to provide access to an inner region of the multi-piece chamber without requiring the lid to be removed.

33. A multi-piece chamber comprising:

a central piece having:

a first open side;

a second open side opposite the first open side;

a first facet between the first open side and the second open side, the first facet adapted to couple to a chamber and having an opening sized to allow a substrate to pass through the opening; and

a second facet opposite the first facet and between the first open side and the second open side, the second facet adapted to couple to a chamber and having at least two vertically stacked openings each sized to allow a substrate to pass through the opening;

a first side piece adapted to couple with the first open side of the central piece, the first side piece having at least a first facet with an opening sized to allow a substrate to pass through the opening; and

a second side piece adapted to couple with the second open side of the central piece, the second side piece having at least a first facet with an opening sized to allow a substrate to pass through the opening;

wherein the opening of the first facet of the first side piece, the opening of the first facet of the second side piece and a first opening of the second facet of the central piece are at substantially the same elevation when the first side piece, the second side piece and the central piece are coupled together, and

34. The multi-piece chamber ofclaim 33 wherein the opening of the first facet of the central piece is at substantially the same elevation as the first opening of the second facet of the central piece.

35. The multi-piece chamber ofclaim 33 wherein the central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together.

36. The multi-piece chamber ofclaim 33 wherein the central piece includes a bottom having a domed portion.

37. The multi-piece chamber ofclaim 36 wherein the domed portion is adapted to couple to a vacuum robot.

38. The multi-piece chamber ofclaim 36 wherein the domed portion includes at least one support fin adapted to reduce movement of the domed portion in a vertical direction.

39. The multi-piece chamber ofclaim 36 wherein the bottom of the central piece includes a flat portion.

40. The multi-piece chamber ofclaim 39 wherein the flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness.

41. A multi-piece chamber comprising:

a central piece having a first side, a second side and a bottom having a domed portion;

a first side piece adapted to couple with the first side of the central piece and including an opening in a top portion of the first side piece; and

a second side piece adapted to couple with the second side of the central piece.

42. The multi-piece chamber ofclaim 41 wherein the domed portion is adapted to accommodate a vacuum robot.

43. The multi-piece chamber ofclaim 41 wherein the domed portion includes at least one support fin adapted to reduce movement of the domed portion in a vertical direction.

44. The multi-piece chamber ofclaim 43 wherein the domed portion includes a plurality of support fins, each support fin adapted to reduce movement of the domed portion in a vertical direction.

45. The multi-piece chamber ofclaim 41 wherein the bottom of the central piece includes a flat portion.

46. The multi-piece chamber ofclaim 45 wherein the flat portion has a first thickness and the domed portion has a second thickness that is less than the first thickness.

47. The multi-piece chamber ofclaim 46 wherein the first thickness is about 0.75 to 1.0 inches or less and the second thickness is about 0.375 inches or less.

48. The multi-piece chamber ofclaim 41 wherein the first and second side pieces each include mounting surfaces adapted to facilitate coupling the first and second side pieces to the central piece, and

wherein the mounting surfaces each have an area that is 35% or more of a total cross-sectional area of each of the first and second side pieces where the side pieces couple to the central piece.

49. The multi-piece chamber ofclaim 41 wherein the first side piece includes a first face,

wherein the first face includes a first opening and a first mounting surface,

wherein the first face has a first total surface area that includes an area of the first opening and an area of the first mounting surface,

wherein the first mounting surface is adapted to facilitate coupling the first side piece to the central piece, and

wherein the area of the first mounting surface is 35% or more of the first total surface area.

50. The multi-piece chamber ofclaim 49 wherein the second side piece includes a second face,

wherein the second face includes a second opening and a second mounting surface,

wherein the second face has a second total surface area that includes an area of the second opening and an area of the second mounting surface,

wherein the second mounting surface is adapted to facilitate coupling the second side piece to the central piece,

wherein the area of the second mounting surface is 35% or more of the second total surface area.

51. The multi-piece chamber ofclaim 41 wherein the first and second side pieces each include two openings in a top portion of each of the first and second side pieces.

52. The multi-piece chamber ofclaim 51 further including lids adapted to seal the openings in the first and second side pieces.

53. The multi-piece chamber ofclaim 41 wherein the first and second side pieces each include mounting surfaces adapted to facilitate coupling the first and second side pieces to the central piece, and

wherein the mounting surfaces each have an area that is 40% or more of a total cross-sectional area of each of the first and second side pieces where the side pieces couple to the central piece.

54. The multi-piece chamber ofclaim 41 wherein the first side piece includes a first face,

wherein the first face includes a first opening and a first mounting surface,

wherein the area of the first mounting surface is 40% or more of the first total surface area.

55. The multi-piece chamber ofclaim 54 wherein the second side piece includes a second face,

wherein the area of the second mounting surface is 40% or more of the second total surface area.