US20060185378A1 - Liquid-cooling heat dissipation assembly - Google Patents
Liquid-cooling heat dissipation assemblyDownload PDFInfo
- Publication number
- US20060185378A1 US20060185378A1US11/060,414US6041405AUS2006185378A1US 20060185378 A1US20060185378 A1US 20060185378A1US 6041405 AUS6041405 AUS 6041405AUS 2006185378 A1US2006185378 A1US 2006185378A1
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- United States
- Prior art keywords
- liquid
- cooling
- module
- heat dissipation
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- 238000001816coolingMethods0.000titleclaimsabstractdescription94
- 230000017525heat dissipationEffects0.000titleclaimsabstractdescription42
- 239000007788liquidSubstances0.000claimsabstractdescription78
- 239000000110cooling liquidSubstances0.000claimsabstractdescription15
- XLYOFNOQVPJJNP-UHFFFAOYSA-NwaterSubstancesOXLYOFNOQVPJJNP-UHFFFAOYSA-N0.000description23
- 238000012986modificationMethods0.000description2
- 230000004048modificationEffects0.000description2
- 238000007789sealingMethods0.000description2
- 238000006467substitution reactionMethods0.000description2
- 230000002411adverseEffects0.000description1
- 238000010276constructionMethods0.000description1
- 125000004122cyclic groupChemical group0.000description1
- 238000001914filtrationMethods0.000description1
- 230000000717retained effectEffects0.000description1
Images
Classifications
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
Definitions
- the present inventionrelates to a liquid-cooling heat dissipation assembly, and more particularly to a liquid-cooling heat dissipation assembly used for heat emitting device such as a CPU.
- the compassare developed with more powerful function and computation speed. Beside performance issue, the product appearance, the construction and motherboard connection ways are also under extensive exploited. As downsize of form factor and increasing of processing speed, the heat dissipation for central processing unit (CPU) is also an important issue to solve.
- CPUcentral processing unit
- FIG. 1shows a perspective view of a prior art liquid-cooling heat dissipation system 100 a .
- the liquid-cooling heat dissipation system 100 acomprises a heat dissipation stage 10 a , a water outlet 101 a and a water inlet 102 a on both ends of the heat dissipation system stage 10 a , respectively, a duct 103 a connected between the water inlet 102 a and a water outlet 201 a of a water pump 20 a , a duct 104 a connected between the water outlet 101 a and a water inlet 301 a of a cooling stage 30 a , which is composed of a plurality of heat-dissipating fins 303 a.
- the cooling stage 30 acomprises a water outlet 302 a connected to a water inlet 401 a of a water tank 40 a through a duct 402 a .
- the water tank 40 acomprises a water outlet connected to the water inlet 202 a of the water pump 20 a , thus forming the liquid-cooling heat dissipation system 100 a .
- the water pump 20 aconveys cool water to the heat dissipation stage 10 a for heat exchanging into hot water.
- hot waterflows to the cooling stage 30 a through the duct 104 a for heat exchanging into cool water there and cool water flows back to the water tank 40 a through the duct 304 a .
- the above operationsare repeated for cyclic heat exchange.
- liquid-cooling heat dissipation system 100 ais composed of separate heat dissipation stage 10 a , water pump 20 a , cooling stage 30 a and water tank 40 a and ducts 103 a , 104 a , 304 a and 402 a interconnecting between above devices.
- the liquid-cooling heat dissipation system 100 a thus formedis bulky and hard to assemble. This is adverse to the compact trend of computer.
- the present inventionprovides a liquid-cooling heat dissipation assembly, which comprises a liquid cooling array module, a liquid driving module and a cooling plate module integrated into an assembly.
- a through runnerkeeps the cooling liquid to flow continuously.
- the heat exchange cyclecan be speeded up and the heat dissipation efficiency can be enhanced.
- the liquid-cooling heat dissipation assemblyincludes a liquid cooling array module with a plurality of heat dissipating fins, an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively, a liquid driving module driving the cooling liquid and assembled to the upper cover of the liquid cooling array module, a cooling plate module assembled with the lower cover of the liquid cooling array module.
- the cooling plate modulehas a heat absorbing face on bottom thereof and in contact with electronic device.
- a liquid passagewayis defined through the liquid cooling array module, the liquid driving module and the cooling plate module The cooling liquid flows along the liquid passageway to circulate through those modules when the liquid driving module operates.
- the liquid cooling array modulecomprises a retaining frame with an upper cover and a lower cover on top and bottom sides.
- a plurality of heat dissipating finsis provided at center of the retaining frame and runners are defined between the plurality of heat dissipating fins. Both ends of the runner are communicated with the upper cover and the lower cover.
- the hot liquid in the lower coverflows to the upper cover by the driving force of the liquid driving module and then heat exchanges with the plurality of heat dissipating fins to become cooling liquid again. Afterward the cooling liquid flows back to the upper cover for repeated heat dissipation.
- the liquid driving modulecomprises a main body win an inner space separated into an upper compartment and a lower compartment.
- the main bodycomprises a liquid inlet communicated with the lower compartment.
- the upper compartmentcontains a coil stage and an upper cap
- the lower compartmentcontains a guiding stage with a runner defined on bottom face thereof.
- An impeller stageis pivotally arranged on bottom of the guiding stage. The impeller stage is placed at the upper cover of the box when the liquid driving module is mounted on the liquid cooling array module.
- the liquidis injected to the lower compartment through the liquid inlet when the liquid is insufficient.
- the liquidflows into the upper cover through the runner of the guiding stage and the impeller stage.
- FIG. 1shows a perspective view of a prior art liquid-cooling heat dissipation system.
- FIG. 2shows an exploded view of the liquid-cooling heat dissipation assembly according to the present invention.
- FIG. 3shows an exploded view of the liquid-cooling heat dissipation assembly according to the present invention.
- FIG. 4shows another exploded view of the liquid-cooling heat dissipation assembly according to the present invention.
- FIG. 5shows a perspective view of the liquid-cooling heat dissipation assembly to be assembled with retaining frame and fan.
- FIG. 6shows a perspective view of the liquid-cooling heat dissipation assembly already assembled with retaining frame and fan.
- FIG. 7shows a sectional view of the liquid-cooling heat dissipation assembly.
- the liquid-cooling heat dissipation assembly according to the present inventionis used for heat dissipation of a CPU 20 shown in FIG. 7 .
- the liquid-cooling heat dissipation assembly according to the present inventioncomprises, from bottom to top order, a cooling plate module 1 , a liquid cooling array module 2 , a liquid driving module 3 and runners define among those modules.
- the liquid cooling array module 2comprises a box 21 with an upper cover 22 and a lower cover 23 on top and bottom sides, respectively.
- a plurality of heat-dissipating fins 24are provided at center of the box 21 and runners 25 are defined between the heat-dissipating fins 24 . Both ends of the runner 25 are communicated with the upper cover 22 and the lower cover 23 .
- the cool liquid in the upper cover 22is conveyed to the lower cover 23 through the two runners 25 at center portion; the cool liquid in the lower cover 23 is conveyed to the upper cover 22 through the two runners 25 at side portion, as shown in FIG. 7 .
- the liquid driving module 3comprises a main body 31 win an inner space separated into an upper compartment 311 and a lower compartment 312 .
- the main body 31comprises a liquid inlet 32 communicated with the lower compartment 312 .
- the upper compartment 311contains a coil stage 33 and an upper cap 34
- the lower compartment 312contains a guiding stage 35 with a runner 351 defined on bottom face thereof.
- An impeller stage 36is pivotally arranged on bottom of the guiding stage 35 .
- the impeller stage 36is placed at the upper cover 22 of the box 21 when the liquid driving module 3 is mounted on the liquid cooling array module 2 .
- the liquidis injected to the lower compartment 312 through the liquid inlet 32 when the liquid is insufficient.
- the liquidflows into the upper cover 22 through the runner 351 of the guiding stage 35 and the impeller stage 36 .
- the cooling plate module 1is arranged in the lower cover 23 of the liquid cooling array module 2 and comprises a cooling plate 11 with a heat-absorbing face 12 on bottom center thereof (as shown in FIG. 7 ).
- the heat-absorbing face 12is attached to the CPU 20 and a plurality of heat-dissipating plates 13 are arranged in rows on top face of the cooling plate 11 .
- sealing tab 14is arranged between the bottom of the box 21 and the cooling plate 11 such that the liquid cooling array module 2 is arranged atop the cooling plate 11 and the heat-dissipating plates 13 are placed in the lower cover 23 .
- the cooling plate 11is locked to bottom of the lower cover 23 by bolt unit 15 and the cooling plate module 1 is arranged in a space in the lower cover 23 such that the cooling liquid flushes the heat dissipating plates 13 of the cooling plate 11 directly.
- sealing tab 37is provided between the top of the box 21 and the liquid driving module 3 such that the liquid driving module 3 is placed in the upper cover 22 and the impeller stage 36 is placed also in the upper cover 22 .
- the liquid driving module 3is locked to top face of the box 21 by bolt unit 38 , thus assembling the cooling plate module 1 , the liquid cooling array module 2 , and the liquid driving module 3 together.
- a liquid passagewayis defined by the runner 351 of the liquid driving module 3 , the runner 25 of the liquid cooling array module 2 and the runner between the heat-dissipating plates 13 (as indicated by arrows in FIG. 7 ). Therefore, the cooling liquid can be circulated among those modules.
- a retaining frame 4is locked to the bottom of the cooling plate module 1 and an opening 41 is defined at center of the retaining frame 4 such that the heat-absorbing face 12 on bottom of the cooling plate 11 exposes out of the opening 41 and is in contact with the CPU 20 .
- locking tabs 42extends from both sides of the retaining frame 4 and are locked to the CPU socket 201 as shown in FIG. 7 .
- a fan 5 and a filtering screen 51are assembled to lateral side of the liquid cooling array module 2 by bolt unit 26 .
- the fan 5operates to enhance the heat dissipation efficiency of the liquid cooling array module 2 .
- the liquid-cooling heat dissipation assembly 10is arranged atop the CPU 20 and the locking tabs 42 of the retaining frame 4 are locked to the CPU socket 201 by bolt unit 43 , whereby the liquid-cooling heat dissipation assembly 10 can be retained atop the CPU 20 .
- the cooling liquidflows downward to the lower cover 23 from two center runners 25 of the upper cover 22 and flushes directly the heat-dissipating plates 13 at the lower cover 23 for heat exchanging with the heat-dissipating plates 13 .
- the hot liquid after heat exchangeflows along the side runners 25 by the driving force of the liquid driving module 3 and then flows through the heat-dissipating fins 24 for heat exchanging to cooling liquid again. Afterward the cooling liquid flows back to the upper cover 22 for repeated heat dissipation.
- the liquid-cooling heat dissipation assembly 10is constructed by assembling the cooling plate module 1 , the liquid cooling array module 2 , and the liquid driving module 3 together and a through runner keeps the cooling liquid to flow continuously.
- the heat exchange cyclecan be speeded up and the heat dissipation efficiency can be enhanced.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Field of the Invention
- The present invention relates to a liquid-cooling heat dissipation assembly, and more particularly to a liquid-cooling heat dissipation assembly used for heat emitting device such as a CPU.
- 2. Description of Prior Art
- The compass are developed with more powerful function and computation speed. Beside performance issue, the product appearance, the construction and motherboard connection ways are also under extensive exploited. As downsize of form factor and increasing of processing speed, the heat dissipation for central processing unit (CPU) is also an important issue to solve.
FIG. 1 shows a perspective view of a prior art liquid-coolingheat dissipation system 100a. As shown in this figure, the liquid-coolingheat dissipation system 100acomprises aheat dissipation stage 10a, awater outlet 101aand awater inlet 102aon both ends of the heatdissipation system stage 10a, respectively, aduct 103aconnected between thewater inlet 102aand awater outlet 201aof awater pump 20a, aduct 104aconnected between thewater outlet 101aand awater inlet 301aof acooling stage 30a, which is composed of a plurality of heat-dissipatingfins 303a.- The
cooling stage 30acomprises awater outlet 302aconnected to awater inlet 401aof awater tank 40athrough aduct 402a. Thewater tank 40acomprises a water outlet connected to thewater inlet 202aof thewater pump 20a, thus forming the liquid-coolingheat dissipation system 100a. During operation, the water pump20aconveys cool water to theheat dissipation stage 10afor heat exchanging into hot water. Afterward, hot water flows to thecooling stage 30athrough theduct 104afor heat exchanging into cool water there and cool water flows back to thewater tank 40athrough theduct 304a. The above operations are repeated for cyclic heat exchange. - However, above-described prior art liquid-cooling
heat dissipation system 100ais composed of separateheat dissipation stage 10a,water pump 20a,cooling stage 30aandwater tank 40aandducts heat dissipation system 100athus formed is bulky and hard to assemble. This is adverse to the compact trend of computer. - The present invention provides a liquid-cooling heat dissipation assembly, which comprises a liquid cooling array module, a liquid driving module and a cooling plate module integrated into an assembly. A through runner keeps the cooling liquid to flow continuously. The heat exchange cycle can be speeded up and the heat dissipation efficiency can be enhanced.
- According to one aspect of the present invention, the liquid-cooling heat dissipation assembly includes a liquid cooling array module with a plurality of heat dissipating fins, an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively, a liquid driving module driving the cooling liquid and assembled to the upper cover of the liquid cooling array module, a cooling plate module assembled with the lower cover of the liquid cooling array module. The cooling plate module has a heat absorbing face on bottom thereof and in contact with electronic device. A liquid passageway is defined through the liquid cooling array module, the liquid driving module and the cooling plate module The cooling liquid flows along the liquid passageway to circulate through those modules when the liquid driving module operates.
- According to another aspect of the present invention, the liquid cooling array module comprises a retaining frame with an upper cover and a lower cover on top and bottom sides. A plurality of heat dissipating fins is provided at center of the retaining frame and runners are defined between the plurality of heat dissipating fins. Both ends of the runner are communicated with the upper cover and the lower cover. The hot liquid in the lower cover flows to the upper cover by the driving force of the liquid driving module and then heat exchanges with the plurality of heat dissipating fins to become cooling liquid again. Afterward the cooling liquid flows back to the upper cover for repeated heat dissipation.
- According to still another act of the present invention, the liquid driving module comprises a main body win an inner space separated into an upper compartment and a lower compartment. The main body comprises a liquid inlet communicated with the lower compartment. The upper compartment contains a coil stage and an upper cap, and the lower compartment contains a guiding stage with a runner defined on bottom face thereof. An impeller stage is pivotally arranged on bottom of the guiding stage. The impeller stage is placed at the upper cover of the box when the liquid driving module is mounted on the liquid cooling array module. The liquid is injected to the lower compartment through the liquid inlet when the liquid is insufficient. Moreover, the liquid flows into the upper cover through the runner of the guiding stage and the impeller stage.
- The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
FIG. 1 shows a perspective view of a prior art liquid-cooling heat dissipation system.FIG. 2 shows an exploded view of the liquid-cooling heat dissipation assembly according to the present invention.FIG. 3 shows an exploded view of the liquid-cooling heat dissipation assembly according to the present invention.FIG. 4 shows another exploded view of the liquid-cooling heat dissipation assembly according to the present invention.FIG. 5 shows a perspective view of the liquid-cooling heat dissipation assembly to be assembled with retaining frame and fan.FIG. 6 shows a perspective view of the liquid-cooling heat dissipation assembly already assembled with retaining frame and fan.FIG. 7 shows a sectional view of the liquid-cooling heat dissipation assembly.- As shown in
FIG. 2 , the liquid-cooling heat dissipation assembly according to the present invention is used for heat dissipation of aCPU 20 shown inFIG. 7 . The liquid-cooling heat dissipation assembly according to the present invention comprises, from bottom to top order, acooling plate module 1, a liquidcooling array module 2, aliquid driving module 3 and runners define among those modules. - The liquid
cooling array module 2 comprises abox 21 with anupper cover 22 and alower cover 23 on top and bottom sides, respectively. A plurality of heat-dissipating fins 24 are provided at center of thebox 21 andrunners 25 are defined between the heat-dissipating fins 24. Both ends of therunner 25 are communicated with theupper cover 22 and thelower cover 23. In the shown embodiment, the cool liquid in theupper cover 22 is conveyed to thelower cover 23 through the tworunners 25 at center portion; the cool liquid in thelower cover 23 is conveyed to theupper cover 22 through the tworunners 25 at side portion, as shown inFIG. 7 . - As shown in
FIGS. 2, 3 , and4, theliquid driving module 3 comprises amain body 31 win an inner space separated into anupper compartment 311 and alower compartment 312. Themain body 31 comprises aliquid inlet 32 communicated with thelower compartment 312. Theupper compartment 311 contains acoil stage 33 and anupper cap 34, and thelower compartment 312 contains a guidingstage 35 with arunner 351 defined on bottom face thereof. Animpeller stage 36 is pivotally arranged on bottom of the guidingstage 35. Theimpeller stage 36 is placed at theupper cover 22 of thebox 21 when theliquid driving module 3 is mounted on the liquidcooling array module 2. The liquid is injected to thelower compartment 312 through theliquid inlet 32 when the liquid is insufficient. Moreover, the liquid flows into theupper cover 22 through therunner 351 of the guidingstage 35 and theimpeller stage 36. - With reference to
FIG. 2 , thecooling plate module 1 is arranged in thelower cover 23 of the liquidcooling array module 2 and comprises acooling plate 11 with a heat-absorbingface 12 on bottom center thereof (as shown inFIG. 7 ). The heat-absorbingface 12 is attached to theCPU 20 and a plurality of heat-dissipating plates 13 are arranged in rows on top face of thecooling plate 11. - To assemble the liquid-cooling heat dissipation assembly according to the present invention, sealing
tab 14 is arranged between the bottom of thebox 21 and thecooling plate 11 such that the liquidcooling array module 2 is arranged atop thecooling plate 11 and the heat-dissipating plates 13 are placed in thelower cover 23. The coolingplate 11 is locked to bottom of thelower cover 23 bybolt unit 15 and thecooling plate module 1 is arranged in a space in thelower cover 23 such that the cooling liquid flushes theheat dissipating plates 13 of the coolingplate 11 directly. Moreover, sealingtab 37 is provided between the top of thebox 21 and theliquid driving module 3 such that theliquid driving module 3 is placed in theupper cover 22 and theimpeller stage 36 is placed also in theupper cover 22. Theliquid driving module 3 is locked to top face of thebox 21 by bolt unit38, thus assembling thecooling plate module 1, the liquidcooling array module 2, and theliquid driving module 3 together. - In the present invention, after the
cooling plate module 1, the liquidcooling array module 2, and theliquid driving module 3 are assembled together, a liquid passageway is defined by therunner 351 of theliquid driving module 3, therunner 25 of the liquidcooling array module 2 and the runner between the heat-dissipating plates13 (as indicated by arrows inFIG. 7 ). Therefore, the cooling liquid can be circulated among those modules. - With reference to
FIGS. 5 and 6 , a retaining frame4 is locked to the bottom of thecooling plate module 1 and anopening 41 is defined at center of the retaining frame4 such that the heat-absorbingface 12 on bottom of the coolingplate 11 exposes out of theopening 41 and is in contact with theCPU 20. Moreover, lockingtabs 42 extends from both sides of the retaining frame4 and are locked to theCPU socket 201 as shown inFIG. 7 . - Moreover, a
fan 5 and afiltering screen 51 are assembled to lateral side of the liquidcooling array module 2 bybolt unit 26. Thefan 5 operates to enhance the heat dissipation efficiency of the liquidcooling array module 2. - During the assembling of the present invention, the liquid-cooling
heat dissipation assembly 10 according to the present invention is arranged atop theCPU 20 and the lockingtabs 42 of the retaining frame4 are locked to theCPU socket 201 bybolt unit 43, whereby the liquid-coolingheat dissipation assembly 10 can be retained atop theCPU 20. - With reference again to
FIG. 7 , during operation of the present invention, the cooling liquid flows downward to thelower cover 23 from twocenter runners 25 of theupper cover 22 and flushes directly the heat-dissipatingplates 13 at thelower cover 23 for heat exchanging with the heat-dissipatingplates 13. The hot liquid after heat exchange flows along theside runners 25 by the driving force of theliquid driving module 3 and then flows through the heat-dissipatingfins 24 for heat exchanging to cooling liquid again. Afterward the cooling liquid flows back to theupper cover 22 for repeated heat dissipation. - In the present invention, the liquid-cooling
heat dissipation assembly 10 is constructed by assembling thecooling plate module 1, the liquidcooling array module 2, and theliquid driving module 3 together and a through runner keeps the cooling liquid to flow continuously. The heat exchange cycle can be speeded up and the heat dissipation efficiency can be enhanced. - Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have suggested in the foregoing description, and other will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Claims (6)
1. A liquid-cooling heat dissipation assembly used to dissipate heat from an electronic device by circulating a cooling liquid, comprising
a liquid cooling array module comprising a plurality of heat-dissipating fins, an upper cover and a lower cover on top and bottom sides of the liquid cooling array module, respectively;
a liquid driving module driving the cooling liquid and assembled to the upper cover of the liquid cooling array module;
a cooling plate module with a heat absorbing face on bottom thereof and in contact with the electronic device, the cooling plate module having a top side assembled with the lower cover of the liquid cooling array module; and
a liquid passageway defined through the liquid cooling array module, the liquid driving module and the cooling plate module, the cooling liquid flowing along the liquid passageway to circulate through the liquid cooling array module, the liquid driving module and the cooling plate module when the liquid driving module operates.
2. The liquid-cooling heat dissipation assembly as inclaim 1 , wherein the liquid driving module comprises a liquid inlet.
3. The liquid-cooling heat dissipation assembly as inclaim 1 , wherein the cooling plate module comprises a retaining frame.
4. The liquid-cooling heat dissipation assembly as inclaim 1 , wherein the liquid cooling array module comprises a fan.
5. The liquid-cooling heat dissipation assembly as inclaim 1 , wherein the cooling plate module comprises heat-dissipating plates on top face thereof.
6. The liquid-cooling heat dissipation assembly as inclaim 5 , wherein the heat-dissipating plates are arranged in a space defined by lower cover and the cooling plate module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/060,414US20060185378A1 (en) | 2005-02-18 | 2005-02-18 | Liquid-cooling heat dissipation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/060,414US20060185378A1 (en) | 2005-02-18 | 2005-02-18 | Liquid-cooling heat dissipation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20060185378A1true US20060185378A1 (en) | 2006-08-24 |
Family
ID=36911179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/060,414AbandonedUS20060185378A1 (en) | 2005-02-18 | 2005-02-18 | Liquid-cooling heat dissipation assembly |
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| US (1) | US20060185378A1 (en) |
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| US11460035B2 (en) | 2019-10-07 | 2022-10-04 | Cooler Master Co., Ltd. | Light emitting fan device and non-light emitting fan device |
| DE102021110297A1 (en) | 2021-01-27 | 2022-10-06 | Dongguan Hanxu Hardware Plastic Technology Co., Ltd. | INTEGRATED LIQUID COOLING RADIATOR |
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