US20060147202A1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a washing/development processing block, and an interface block. An exposure device is arranged adjacent to the interface block. A resist film is formed on a substrate by the resist film processing block. The substrate is washed and dried by the washing processing unit in the washing/development processing block before the substrate is subjected to the exposure processing by the exposure device.

Description

BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• The present invention relates to substrate processing apparatuses and substrate processing methods for applying processing to substrates.
• 2. Description of the Background Art
• A substrate processing apparatus is used to apply a variety of processing to substrates such as semiconductor substrates, substrates for use in liquid crystal displays, plasma displays, optical disks, magnetic disks, magneto-optical disks, photomasks, and other substrates.
• Such a substrate processing apparatus typically applies a plurality of successive processing to a single substrate. The substrate processing apparatus as described in JP 2003-324139 A comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to the interface block as an external device separate from the substrate processing apparatus.
• In the above-described substrate processing apparatus, a substrate is carried from the indexer block into the anti-reflection film processing block and the resist film processing block, where the formation of an anti-reflection film and resist film coating processing are applied to the substrate. The substrate is then carried to the exposure device through the interface block. After exposure processing has been applied to the resist film on the substrate by the exposure device, the substrate is transported to the development processing block through the interface block. In the development processing block, development processing is applied to the resist film on the substrate to form a resist pattern thereon, and the substrate is subsequently carried into the indexer block.
• With recent improvements in the density and integration of devices, making finer resist patterns have become very important. Conventional exposure devices typically perform exposure processing by providing reduction projection of a reticle pattern on a substrate through a projection lens. With such conventional exposure devices, however, the line width of an exposure pattern is determined by the wavelength of the light source of an exposure device, thus making it impossible to make a resist pattern finer than that.
• For this reason, a liquid immersion method is suggested as a projection exposure method allowing for finer exposure patterns (refer to, e.g., WO99/49504 pamphlet). In the projection exposure device according to the WO99/49504 pamphlet, a liquid is filled between a projection optical system and a substrate, resulting in a shorter wavelength of exposure light on a surface of the substrate. This allows for a finer exposure pattern.
• However, in the projection exposure device according to the aforementioned WO99/49504 pamphlet, exposure processing is performed with the substrate and the liquid being in contact with each other. Accordingly, part of the component of a resist applied on the substrate is eluted in the liquid. The resist component eluted in the liquid remains on a surface of the substrate, which may become the cause of a defect.
• The resist component eluted in the liquid contaminates the lens of the exposure device. This may cause a defective dimension and a defective shape of the exposure pattern.
SUMMARY OF THE INVENTION
• It is an object of the invention to provide a substrate processing apparatus and a substrate processing method capable of preventing a component of a photosensitive material on a substrate from being eluted in a liquid in an exposure device.
• (1)
• A substrate processing apparatus according to one aspect of the present invention that is arranged adjacent to an exposure device comprises a processing section for applying processing to a substrate, and an interface that is provided on one end of the processing section for exchanging the substrate between the processing section and the exposure device, wherein the processing section includes a first processing unit that forms a photosensitive film made of a photosensitive material on the substrate, a second processing unit that washes the substrate after the formation of the photosensitive film by the first processing unit and before the exposure processing by the exposure device, and a third processing unit that applies development processing to the substrate after the exposure processing by the exposure device.
• In the substrate processing apparatus, the photosensitive film made of a photo sensitive material is formed on the substrate by the first processing unit. Then, the substrate is subjected to washing processing by the second processing unit. After this, the substrate is transported to the exposure device from the processing section through the interface, where the substrate is subjected to exposure processing. The substrate after the exposure processing is transported to the processing section from the exposure device through the interface, and the substrate is subjected to the development processing in the third processing unit.
• In this way, the substrate is subjected to washing processing by the second processing unit before the exposure processing by the exposure device. Part of the component of the photosensitive film formed on the substrate by the first processing unit is thus eluted, and washed away. In this case, even if the substrate in contact with a liquid is subjected to the exposure processing by the exposure device, the component of the photosensitive material on the substrate is hardly eluted. This reduces contamination in the exposure device while preventing the component of the photosensitive material from remaining on a surface of the substrate. As a result, processing defects of the substrate that may be generated in the exposure device are reduced.
• (2)
• The processing section may comprise a first processing block that includes the first processing unit, a first thermal processing unit that thermally treats the substrate, and a first transport unit that transports the substrate; and a second processing block that includes the second processing unit, the third processing unit, a second thermal processing unit that thermally treats the substrate, and a second transport unit that transports the substrate.
• In this case, the photosensitive film is formed on the substrate by the first processing unit in the first processing block. Then, the substrate is transported to the first thermal processing unit by the first transport unit, where the substrate is subjected to given thermal treatment. The substrate is subsequently transported to an adjacent other processing block by the first transport unit.
• Next, in the second processing block, the substrate is subjected to washing processing by the second processing unit. Then, the substrate is transported to the exposure device from the processing section through the interface, where the substrate is subjected to exposure processing. The substrate after the exposure processing is transported to the processing section from the exposure device through the interface.
• Then, in the second processing block, the substrate is subjected to development processing in the third processing unit. After this, the substrate is transported to the second thermal processing unit by the second transport unit, where the substrate is subjected to given thermal treatment. The substrate is subsequently transported to an adjacent other processing block by the second transport unit.
• In the substrate processing apparatus, in the second processing block, the substrate before the exposure processing is subjected to washing processing and the substrate after the exposure processing is subjected to development processing. That is, in an existing substrate processing apparatus having the first and third processing units, the addition of the second processing unit to a processing block that includes the third processing unit makes it possible to apply washing processing to the substrate before the exposure processing and to apply development processing to the substrate after the exposure processing by a single processing block. As a result, processing defects of the substrate that may be generated in the exposure device can be reduced at low cost without increasing the footprint of the substrate processing apparatus.
• (3)
• The second processing block may be arranged adjacent to an exposure device.
• In this case, the washing processing can be applied to the substrate immediately before the exposure processing, and the development processing can be applied to the substrate immediately after the exposure processing. This prevents the attachment of particles and the like in the atmosphere to the substrate during the transport of the substrate from the second processing block to the exposure device and from the exposure device to the second processing block. As a result, processing defects of the substrate that may be generated during the exposure processing and the development processing can be reduced.
• (4)
• The processing section may further comprise a third processing block that includes a fourth processing unit that forms an anti-reflection film on the substrate before the formation of the photosensitive film by the first processing unit, a third thermal processing unit that thermally treats the substrate, and a third transport unit that transports the substrate.
• In this case, since the fourth processing unit forms the anti-reflection film on the substrate, potential standing waves and halation generated during the exposure processing can be reduced. As a result, processing defects of the substrate that may be generated during the exposure processing can be reduced more.
• (5)
• The substrate processing apparatus may further comprise an indexer that is arranged adjacent to another end of the processing section and carries in the substrate to the processing section and carries out the substrate from said processing section, wherein the third processing block may be arranged adjacent to the indexer.
• In this case, an anti-reflection film is formed in the third processing block immediately after the transporting of the substrate to the processing section, and then a photosensitive film can be formed in the first processing block subsequently. This enables the smooth formation of the anti-reflection film and the photosensitive film on the substrate.
• (6)
• The interface may further include a fifth processing unit that applies given processing to the substrate; a platform on which the substrate is temporarily mounted; a fourth transport unit that transports the substrate between the processing section, the fifth processing unit, and the platform; and a fifth transport unit that transports the substrate between the platform and the exposure device.
• In this case, the substrate is transported to the fifth processing unit from the processing section by the fourth transport unit. The substrate is subjected to the given processing by the fifth processing unit, and then transported to the platform by the fourth transport unit. After this, the substrate is transported to the exposure device from the platform by the fifth transport unit. The substrate is subjected to the exposure processing by the exposure device, and then transported to the platform from the exposure device by the fifth transport unit. After this, the substrate is transported to the processing section from the platform by the fourth transport unit.
• The disposition of the fifth processing unit in the interface and the transport of the substrate by the two transport units enable the addition of processing contents without increasing the footprint of the substrate processing apparatus.
• (7)
• The fourth transport unit may include first and second holders for holding the substrate, the fourth transport unit may hold the substrate with the first holder during the transport of the substrate before the exposure processing by the exposure device, and may hold the substrate with the second holder during the transport of the substrate after the exposure processing by the exposure device, the fifth transport unit may include third and fourth holders for holding the substrate, and the fifth transport unit may hold the substrate with the third holder during the transport of the substrate before the exposure processing by the exposure device, and may hold the substrate with the fourth holder during the transport of the substrate after the exposure processing by the exposure device.
• In this case, the first and third holders are used during the transport of the substrate to which no liquid is attached before the exposure processing, while the second and fourth holders are used during the transport of the substrate to which a liquid is attached after the exposure processing. This prevents a liquid from attaching to the first and third holders, which prevents the attachment of a liquid to the substrate before the exposure processing. This makes it possible to prevent contamination of the substrate due to the attachment of particles and the like in the atmosphere. As a result, it is possible to prevent the generation of processing defects due to degradation in the resolution performance or the like in the exposure device.
• (8)
• The second holder may be provided below the first holder, and the fourth holder may be provided below the third holder. This prevents a liquid that drops from the second and fourth holders and substrates held thereon from attaching to the first and third holders and substrates held thereon. This reliably prevents a liquid from attaching to the substrate before the exposure processing.
• (9)
• The fifth processing unit may include an edge exposure unit that subjects a peripheral portion of the substrate to exposure. In this case, the peripheral portion of the substrate is subjected to the exposure processing by the edge exposure unit.
• (10)
• The second processing unit may further dry the substrate after washing the substrate.
• This prevents the attachment of particles and the like in the atmosphere to the washed substrate. Also, if the washing liquid remains on the washed substrate, the component of the photosensitive material may be eluted in the residual washing liquid. Thus, by drying the washed substrate, it is possible to prevent the component of the photosensitive material on the substrate from being eluted in the washing liquid remaining on the substrate. It is therefore possible to reliably prevent a defective shape of the photosensitive film formed on the substrate and the contamination inside the exposure device. As a result of the foregoing, processing defects of the substrate are reliably prevented.
• (11)
• The second processing unit may comprise a substrate holding device that holds the substrate substantially horizontally, a rotation-driving device that rotates the substrate held on the substrate holding device about an axis vertical to the substrate, a washing liquid supplier that supplies a washing liquid onto the substrate held on the substrate holding device, and an inert gas supplier that supplies an inert gas onto the substrate after the washing liquid has been supplied onto the substrate by the washing liquid supplier.
• In the second processing unit, the substrate is held on the substrate holding device substantially horizontally, and the substrate is rotated about the axis vertical to the substrate by the rotation-driving device. Then, the washing liquid is supplied onto the substrate from the washing liquid supplier, followed by the supply of the inert gas from the inert gas supplier.
• In this case, since the substrate is rotated as the washing liquid is supplied onto the substrate, the washing liquid on the substrate is constantly moved toward the peripheral portion of the substrate by the centrifugal force, and splashed away. It is thus possible to prevent the component of the photosensitive material eluted in the washing liquid from remaining on the substrate. In addition, since the substrate is rotated as the inert gas is supplied onto the substrate, the washing liquid remaining on the substrate after the washing of the substrate is efficiently removed. This reliably prevents the component of the photosensitive material from remaining on the substrate and the substrate dried reliably. During the transport of the washed substrate to the exposure device, therefore, it is possible to reliably prevent the component of the photosensitive material on the substrate from being further eluted in the washing liquid remaining on the substrate. As a result, it is possible to reliably prevent a defective shape of the photosensitive film formed on the substrate and the contamination inside the exposure device.
• (12)
• The inert gas supplier may supply the inert gas so that the washing liquid supplied onto the substrate from the washing liquid supplier is removed from the substrate as the washing liquid moves outwardly from the center of the substrate.
• This prevents the washing liquid from remaining on the center of the substrate, which reliably prevents the generation of drymarks (dry stains) on the surface of the substrate. Also, during the transport of the washed substrate to the exposure device, it is possible to prevent the component of the photosensitive material from being further eluted in the washing liquid remaining on the substrate. It is thus possible to prevent processing defects of the substrate more reliably.
• (13)
• The second processing unit may further comprise a rinse liquid supplier that supplies a rinse liquid onto the substrate after the supply of the washing liquid from the washing liquid supplier and before the supply of the inert gas from the inert gas supplier.
• This allows the washing liquid to be reliably washed away by the rinse liquid, making it possible to prevent the component of the photosensitive material eluted in the washing liquid from remaining on the substrate more reliably.
• (14)
• The inert gas supplier may supply the inert gas so that the rinse liquid supplied onto the substrate from the rinse liquid supplier is removed from the substrate as the rinse liquid moves outwardly from the center of the substrate.
• This prevents the rinse liquid from remaining on the center of the substrate, which prevents the generation of dry marks on the surface of the substrate reliably. Also, during the transport of the washed substrate to the exposure device, it is possible to reliably prevent the component of the photosensitive material on the substrate from being further eluted in the rinse liquid remaining on the substrate. As a result of the foregoing, it is possible to prevent processing defects of the substrate more reliably.
• (15)
• The second processing unit may wash the substrate by supplying a fluid mixture containing a washing liquid and a gas onto the substrate from a fluid nozzle.
• Since the fluid mixture discharged from the fluid nozzle contains fine droplets, any contaminants attached on the surface of the substrate are stripped off, even if the surface has irregularities. Moreover, even if the film on the substrate has low wettability, the fine droplets strip off the contaminants on the substrate surface, so that the contaminants can be reliably removed from the substrate surface.
• Consequently, even if the solvent or the like in the film on the substrate is sublimated and the sublimates are attached to the substrate again before the exposure processing, the sublimates attached to the substrate can be reliably removed by the second processing unit. It is therefore possible to reliably prevent the contamination inside the exposure device. As a result of the foregoing, processing defects of the substrate can be reliably reduced.
• In addition, adjusting the flow rate of the gas allows adjustments to be easily made to the detergency in washing the substrate. Thus, when the film on the substrate is prone to damage, damage to the film on the substrate can be prevented by weakening the detergency. Tough contaminants on the substrate surface can also be removed reliably by strengthening the detergency. By adjusting the detergency in this way according to the properties of the film on the substrate and the degree of contamination, it is possible to prevent damage to the film on the substrate and wash the substrate reliably.
• (16)
• The gas may be an inert gas. In this case, it is possible to prevent a chemical influence upon the film on the substrate and the washing liquid while removing the contaminants on the substrate surface more reliably, even if a chemical solution is used as washing liquid.
• (17)
• The second processing unit may further dry the substrate after washing the substrate.
• This prevents the attachment of particles and the like in the atmosphere to the washed substrate. Also, if the washing liquid remains on the washed substrate, the component of the photosensitive film on the substrate may be eluted in the residual washing liquid. Thus, by drying the washed substrate, it is possible to prevent the component of the photosensitive film on the substrate from being eluted in the washing liquid remaining on the substrate. It is therefore possible to reliably prevent a defective shape of the photosensitive film formed on the substrate and the contamination inside the exposure device. As a result of the foregoing, processing defects of the substrate are reliably prevented.
• (18)
• The second processing unit may include an inert gas supplier that dries the substrate by supplying an inert gas onto the substrate. The use of the inert gas prevents a chemical influence upon the film on the substrate and the substrate is reliably dried.
• (19)
• The fluid nozzle may function as inert gas supplier. In this case, the inert gas is supplied onto the substrate from the fluid nozzle to apply drying processing to the substrate. This obviates the need to provide the inert gas supplier separately from the fluid nozzle. As a result, the washing and drying processing can be reliably applied to the substrate with a simple structure.
• (20)
• The second processing unit may further include a substrate holding device that holds the substrate substantially horizontally, and a rotation-driving device that rotates the substrate held on the substrate holding device about an axis vertical to the substrate.
• In the second processing unit, the substrate is held on the substrate holding device substantially horizontally, and the substrate is rotated about the axis vertical to the substrate by the rotation-driving device. Further, the fluid mixture is supplied onto the substrate from the fluid nozzle, followed by the supply of the inert gas from the inert gas supplier.
• In this case, since the substrate is rotated as the fluid mixture is supplied onto the substrate, the fluid mixture on the substrate moves toward the peripheral portion of the substrate by the centrifugal force and splashed away. This reliably prevents the deposits of particles and the like removed by the fluid mixture from remaining on the substrate. In addition, since the substrate is rotated as the inert gas is supplied onto the substrate, the fluid mixture remaining on the substrate after the washing of the substrate is efficiently removed. This reliably prevents the deposits of particles and the like from remaining on the substrate and the substrate dried reliably. As a result, processing defects of the substrate are prevented reliably.
• (21)
• The second processing unit may supply the inert gas so that the fluid mixture supplied onto the substrate from the fluid nozzle is removed from the substrate as the fluid mixture moves outwardly from the center of the substrate.
• This prevents the fluid mixture from remaining on the center of the substrate, thus reliably preventing the generation of dry marks on a surface of the substrate. Accordingly, processing defects of the substrate are prevented reliably.
• (22)
• The second processing unit may further include a rinse liquid supplier that supplies a rinse liquid onto the substrate, after the supply of the fluid mixture from the fluid nozzle and before the supply of the inert gas from the inert gas supplier.
• This allows the fluid mixture to be reliably washed away by the rinse liquid, thus reliably preventing the deposits of particles and the like from remaining on the substrate.
• (23)
• The fluid nozzle may function as the rinse liquid supplier. In this case, the rinse liquid is supplied from the fluid nozzle. This obviates the need to provide the rinse liquid supplier separately from the fluid nozzle. As a result, the washing and drying processing can be reliably applied to the substrate with a simple structure.
• (24)
• The second processing unit may supply the inert gas so that the rinse liquid supplied onto the substrate from the rinse liquid supplier is removed from the substrate as the rinse liquid moves outwardly from the center of the substrate.
• This prevents the rinse liquid from remaining on the center of the substrate, thus reliably preventing the generation of dry marks on the surface of the substrate. Accordingly, processing defects of the substrate are prevented reliably.
• (25)
• The fluid nozzle may have a liquid flow passage through which a liquid flows, a gas flow passage through which a gas flows, a liquid discharge port having an opening that communicates with the liquid flow passage, and a gas discharge port that is provided near the liquid discharge port and has an opening that communicates with the gas flow passage.
• In this case, the washing liquid flows through the liquid flow passage, and is discharged from the liquid discharge port, while the gas flows through the gas flow passage, and is discharged from the gas discharge port. The washing liquid and gas are mixed outside the fluid nozzle. A mist-like fluid mixture is thus generated.
• In this way, the fluid mixture is generated by mixing the washing liquid and the gas outside the fluid nozzle. This obviates the need to provide space for mixing the washing liquid and the gas inside the fluid nozzle. As a result, the size of the fluid nozzle can be reduced.
• (26)
• A substrate processing method according to another aspect of the present invention for processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and comprises a first processing unit, a second processing unit, and a third processing unit comprises the steps of forming a photosensitive film made of a photosensitive material on the substrate by the first processing unit before the exposure processing by said exposure device, washing the substrate after the formation of the photosensitive film by the first processing unit and before the exposure processing by the exposure device, and applying development processing to the substrate by the third processing unit after the exposure processing by the exposure device.
• In the substrate processing method, after the formation of the photosensitive film made of a photosensitive material on the substrate by the first processing unit, the substrate is subjected to washing processing by the second processing unit. After this, the substrate is subjected to exposure processing by the exposure device. After the exposure processing, the substrate is subjected to development processing in the third processing unit.
• In this way, the substrate is subjected to washing processing by the second processing unit before the exposure processing by the exposure device. Part of the component of the photosensitive film formed on the substrate by the first processing unit is thus eluted, and washed away. In this case, even if the substrate in contact with a liquid is subjected to the exposure processing by the exposure device, the component of the photosensitive material on the substrate is hardly eluted. This reduces contamination in the exposure device while preventing the component of the photosensitive material from remaining on a surface of the substrate. As a result, processing defects of the substrate that may be generated in the exposure device can be reduced.
• (27)
• The method may further comprise the step of drying the substrate by the second processing unit, after the step of washing the substrate by the second processing unit and before the step of exposure processing by the exposure device.
• In this case, the washed substrate is dried by the second processing unit, which prevents the attachment of particles and the like in the atmosphere on the washed substrate. Also, if the washing liquid remains on the washed substrate, the component of the photosensitive material may be eluted in the residual washing liquid. Thus, by drying the washed substrate, it is possible to prevent the component of the photosensitive material on the substrate from being eluted in the washing liquid remaining on the substrate. It is therefore possible to reliably prevent a defective shape of the photosensitive film formed on the substrate and the contamination inside the exposure device. As a result of the foregoing, processing defects of the substrate are reliably prevented.
• According to the invention, the substrate is subjected to washing processing by the second processing unit before the exposure processing by the exposure device. In this case, even if the substrate in contact with a liquid is subjected to the exposure processing by the exposure device, the component of the photosensitive material on the substrate is hardly eluted. This reduces contamination in the exposure device while preventing the component of the photosensitive material from remaining on a surface of the substrate. As a result, processing defects of the substrate that may be generated in the exposure device are reduced.
• The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the invention;
• FIG. 2 is a side view of the substrate processing apparatus inFIG. 1 that is seen from the +X direction;
• FIG. 3 is a side view of the substrate processing apparatus inFIG. 1 that is seen from the −X direction;
• FIG. 4 is a diagram for use in illustrating the configuration of the washing processing unit;
• FIGS.5(a),5(b), and5(c) are diagrams for use in illustrating the operation of the washing processing unit;
• FIG. 6 is a schematic diagram of a nozzle in which a nozzle for washing processing and a nozzle for drying processing are formed integrally;
• FIG. 7 is a schematic diagram showing another example of the nozzle for drying processing;
• FIGS.8(a),8(b), and8(c) are diagrams for use in illustrating a method of applying drying processing to a substrate using the nozzle inFIG. 7;
• FIG. 9 is a schematic diagram showing another example of the nozzle for drying processing;
• FIG. 10 is a schematic diagram showing another example of the washing processing unit;
• FIG. 11 is a diagram for use in illustrating a method of applying drying processing to the substrate using the washing processing unit inFIG. 10;
• FIG. 12 is a diagram for use in illustrating the configuration and operation of the interface transport mechanism;
• FIG. 13 is a longitudinal cross section showing an example of the internal structure of a two-fluid nozzle for use in washing and drying processing; and
• FIGS.14(a),14(b), and14(c) are diagrams for use in illustrating a method of applying washing and drying processing to the substrate using the two-fluid nozzle inFIG. 13.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
• A substrate processing apparatus according to embodiments of the invention will be described below with reference to the drawings. A substrate as used in the specification includes a semiconductor substrate, a substrate for a liquid crystal display, a substrate for a plasma display, a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, and a substrate for a photomask.
• FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the invention.
• FIG. 1 and each of the subsequent drawings is accompanied by the arrows that indicate X, Y, and Z directions perpendicular to one another, for clarification of positions. The X and Y directions are perpendicular to each other in a horizontal plane, and the Z direction corresponds to the vertical direction. In each of the directions, the direction toward an arrow is defined as + direction, and the opposite direction is defined as − direction. The rotation direction about the Z direction is defined as θ direction.
• As shown inFIG. 1, thesubstrate processing apparatus500 includes anindexer block9, an anti-reflectionfilm processing block10, a resistfilm processing block11, a washing/development processing block12, and aninterface block13. Anexposure device14 is arranged adjacent to theinterface block13. Theexposure device14 applies exposure processing to substrates W by a liquid immersion method.
• Each of theindexer block9, anti-reflectionfilm processing block10, resistfilm processing block11, washing/development processing block12, andinterface block13 will hereinafter be referred to as a processing block.
• Theindexer block9 includes a main controller (controller)30 for controlling the operation of each processing block, a plurality ofcarrier platforms60, and an indexer robot IR. The indexer robot IR has a hand IRH for receiving and transferring the substrates W.
• The anti-reflectionfilm processing block10 includesthermal processing groups100,101 for anti-reflection film, acoating processing group70 for anti-reflection film, and a first central robot CR1. Thecoating processing group70 is arranged opposite to thethermal processing groups100,101 with the first central robot CR1 therebetween. The first central robot CR1 has hands CRH1, CRH2 provided one above the other for receiving and transferring the substrates W.
• Apartition wall15 is arranged between theindexer block9 and the anti-reflectionfilm processing block10 for shielding an atmosphere. Thepartition wall15 has substrate platforms PASS1, PASS2 provided closely one above the other for receiving and transferring the substrates W between theindexer block9 and the anti-reflectionfilm processing block10. The upper substrate platform PASS1 is used in transferring the substrates W from theindexer block9 to the anti-reflectionfilm processing block10, and the lower substrate platform PASS2 is used in transferring the substrates W from the anti-reflectionfilm processing block10 to theindexer block9.
• Each of the substrate platforms PASS1, PASS2 has an optical sensor (not shown) for detecting the presence or absence of a substrate W. This enables a determination to be made whether or not a substrate W is on the substrate platform PASS1, PASS2. In addition, each of the substrate platforms PASS1, PASS2 has a plurality of support pins secured thereto. Note that each of substrate platforms PASS3 to PASS10 mentioned below similarly has such optical sensor and support pins.
• The resistfilm processing block11 includesthermal processing groups110,111 for resist film, acoating processing group80 for resist film, and a second central robot CR2. Thecoating processing group80 is arranged opposite to thethermal processing groups110,111 with the second central robot CR2 therebetween. The second central robot CR2 has hands CRH3, CRH4 provided one above the other for receiving and transferring the substrates W.
• Apartition wall16 is arranged between the anti-reflectionfilm processing block10 and the resistfilm processing block11 for shielding an atmosphere. Thepartition wall16 has substrate platforms PASS3, PASS4 provided closely one above the other for receiving and transferring the substrates W between the anti-reflectionfilm processing block10 and the resistfilm processing block11. The upper substrate platform PASS3 is used in transferring the substrates W from the anti-reflectionfilm processing block10 to the resistfilm processing block11. The lower substrate platform PASS4 is used in transferring the substrates W from the resistfilm processing block11 to the anti-reflectionfilm processing block10.
• The washing/development processing block12 includes athermal processing group120 for development, athermal processing group121 for post-exposure bake, adevelopment processing group90, awashing processing group95, and a third central robot CR3. Thethermal processing group121, adjacent to theinterface block13, has substrate platforms PASS7, PASS8 as described below. Thedevelopment processing group90 and thewashing processing group95 are arranged opposite to thethermal processing groups120,121 with the third central robot CR3 therebetween. The third central robot CR3 has hands CRH5, CRH6 provided one above the other for receiving and transferring the substrates W.
• Apartition wall17 is arranged between the resistfilm processing block11 and the washing/development processing block12 for shielding an atmosphere. Thepartition wall17 has substrate platforms PASS5, PASS6 provided closely one above the other for receiving and transferring the substrates W between the resistfilm processing block11 and the washing/development processing block12. The upper substrate platform PASS5 is used in transferring the substrates W from the resistfilm processing block11 to the washing/development processing block12, and the lower substrate platform PASS6 is used in transferring the substrates W from the washing/development processing block12 to the resistfilm processing block11.
• Theinterface block13 includes a fourth central robot CR4, a feed buffer unit SBF, an interface transport mechanism IFR, and edge exposure units EEW. A return buffer unit RBF and substrate platforms PASS9, PASS10 are provided under the edge exposure units EEW as described below. The fourth central robot CR4 has hands CRH7, CRH8 provided one above the other for receiving and transferring the substrates W.
• In thesubstrate processing apparatus500 of the embodiment, theindexer block9, the anti-reflectionfilm processing block10, resistfilm processing block11, washing/development processing block12, andinterface block13 are sequentially arranged in parallel along the Y direction.
• FIG. 2 is a side view of thesubstrate processing apparatus500 inFIG. 1 that is seen from the + X direction.
• Thecoating processing group70 in the anti-reflection film processing block10 (seeFIG. 1) includes a vertical stack of three coating units BARC. Each of the coating units BARC comprises aspin chuck71 for rotating a substrate W while holding the substrate W in a horizontal attitude by suction, and asupply nozzle72 for supplying coating liquid for an anti-reflection film to the substrate W held on thespin chuck71.
• Thecoating processing group80 in the resist film processing block11 (seeFIG. 1) includes a vertical stack of three coating units RES. Each of the coating units RES comprises aspin chuck81 for rotating a substrate W while holding the substrate W in a horizontal attitude by suction, and asupply nozzle82 for supplying coating liquid for a resist film to the substrate W held on thespin chuck81.
• The washing/development processing block12 includes a vertical stack of thedevelopment processing group90 and thewashing processing group95. Thedevelopment processing group90 includes a vertical stack of four development processing units DEV. Each of the development processing units DEV comprises aspin chuck91 for rotating a substrate W while holding the substrate W in a horizontal attitude by suction, and asupply nozzle92 for supplying development liquid to the substrate W held on thespin chuck91.
• Thewashing processing group95 includes a washing processing unit SOAK. The washing processing unit SOAK apply washing and drying processing to the substrates W. The washing processing unit SOAK will be described in detail below.
• Theinterface block13 includes a vertical stack of two edge exposure units EEW, a return buffer unit RBF and substrate platforms PASS9, PASS10, and also includes the fourth central robot CR4 (seeFIG. 1) and interface transport mechanism IFR. Each of the edge exposure units EEW comprises a spin chuck98 for rotating a substrate W while holding the substrate W in a horizontal attitude by suction, and a light irradiator99 for subjecting a peripheral edge of the substrate W held on the spin chuck98 to exposure.
• FIG. 3 is a side view of thesubstrate processing apparatus500 inFIG. 1 that is seen from the −X direction.
• In the anti-reflectionfilm processing block10, thethermal processing group100 includes a vertical stack of two cooling units (cooling plates) CP, and thethermal processing group101 includes a vertical stack of four heating units (hot plates) HP and two cooling units CP. Thethermal processing group100 also includes a local controller LC on top thereof for controlling the temperatures of the cooling units CP, and thethermal processing group101 also includes a local controller LC on top thereof for controlling the temperatures of the-heating units HP and the cooling plates CP.
• In the resistfilm processing block11, thethermal processing group110 includes a vertical stack of four cooling units CP, and thethermal processing group110 includes a vertical stack of five heating units HP. Thethermal processing group110 also includes a local controller LC on top thereof for controlling the temperatures of the cooling units CP, and thethermal processing group111 also includes a local controller LC on top thereof for controlling the temperatures of the heating units HP.
• In the washing/development processing block12, thethermal processing group120 includes a vertical stack of three heating units HP and four cooling units CP, and thethermal processing group121 includes a vertical stack of four heating units HP, substrate platforms PASS7, PASS8, and two cooling units CP. Thethermal processing group120 also includes a local controller LC on top thereof for controlling the temperatures of the heating units HP and the cooling units CP, and thethermal processing group121 also includes a local controller LC for controlling the temperatures of the heating units HP and the cooling units CP.
• Next, the operation of thesubstrate processing apparatus500 in this embodiment will be described.
• Carriers C for storing the substrates W in multiple stages are mounted on thecarrier platforms60, respectively, in theindexer block9. The indexer robot IR takes out a substrate W yet to be processed which is stored in a carrier C using the hand IRH. Then, the indexer robot IR moves in the ±X direction while rotating in the ±θ direction to transfer the unprocessed substrate W onto the substrate platform PASS1.
• Although FOUPs (Front Opening Unified Pods) are adopted as the carriers C in this embodiment, SMIF (Standard Mechanical Inter Face) pods or OCs (Open Cassettes) that expose stored substrates W to outside air may also be used, for example. In addition, although linear-type transport robots that move their hands forward or backward by sliding them linearly to a substrate W are used as the indexer robot IR, the first central robot CR1 to the fourth central robot CR4, and the interface transport mechanism IFR, multi-joint type transport robots that linearly move their hands forward and backward by moving their joints may also be used.
• The unprocessed substrate W that has been transferred onto the substrate platform PASS1 is received by the hand CRH1 of the first central robot CR1 in the anti-reflectionfilm processing block10. The first central robot CR1 carries the substrate W to thecoating processing group70 with the hand CRH1. Thecoating processing group70 forms a coating of an anti-reflection film on a substrate W using a coating unit BARC, in order to reduce potential standing waves and halation generated during exposure.
• After this, the first central robot CR1 takes out the substrate W after the coating processing fromcoating processing group70 with the hand CRH2, and carries the substrate W to thethermal processing group100 or101.
• The first central robot CR1 subsequently takes out the thermally treated substrate W from thethermal processing group100 or101 with the hand CRH1, and then transfers the substrate W onto the substrate platform PASS3.
• The substrate Won the substrate platform PASS3 is received by the hand CRH3 of the second central robot CR2 in the resistfilm processing block11. The second central robot CR2 carries the substrate W to thecoating processing group80 with the hand CRH3. Thecoating processing group80 forms a coating of a resist film over the substrate W coated with the anti-reflection film by a coating unit RES.
• After this, the second central robot CR2 takes out the substrate W after the coating processing from thecoating processing group80 with the handCRH4, and carries the substrate W to thethermal processing group110 or111.
• The second central robot CR2 subsequently takes out the thermally treated substrate W from thethermal processing group110 or111 with the hand CRH3, and transfers the substrate W onto the substrate platform PASS5.
• The substrate Won the substrate platform PASS5 is received by the hand CRH5 of the third central robot CR3 in the washing/development processing block12. The third central robot CR3 carries the substrate W to thewashing processing group95 with the hand CRH5. As described above, thewashing processing group95 applies washing and drying processing to the substrate W by a washing processing unit SOAK.
• After this, the third central robot CR3 takes out the processed substrate W from the washing processing unit SOAK with the hand CRH5, and transfers the substrate W onto the substrate platform PASS7. The substrate W on the substrate platform PASS7 is received by the upper hand CRH7 of the fourth central robot CR4 in theinterface block13. The fourth central robot CR4 transfers the substrate W to an edge exposure unit EEW. The edge exposure unit EEW applies exposure processing to the peripheral portion of the substrate W.
• Then, the fourth central robot CR4 takes out the substrate W after the edge exposure processing from the edge exposure unit EEW with the hand CRH7. After this, the fourth central robot CR4 transfers the substrate W onto the substrate platform PASS9 with the hand CRH7.
• The substrate W on the substrate platform PASS9 is carried into theexposure device14 by the hand H5 of the interface transport mechanism IFR. After exposure processing has been applied to the substrate W by theexposure device14, the interface transport mechanism IFR transports the substrate W onto the substrate platform PASS10 with hand H6. The interface transport mechanism IFR will be described below.
• The substrate W on the substrate platform PASS10 is received by the lower hand CRH8 of the fourth central robot CR4 in theinterface block13. The fourth central robot CR4 carries the substrate W into thethermal processing group121 in the washing/development processing block12 with the hand CRH8. The substrate W is subjected to a post-exposure bake (PEB) by thethermal processing group121. After this, the fourth central robot CR4 takes out the substrate W from thethermal processing group121 with the hand CRH8, and transfers the substrate W onto the substrate platform PASS8.
• The substrate Won the substrate platform PASS8 is received by the hand CRH6 of the third central robot CR3 in the washing/development processing block12. The third central robot CR3 carries the substrate W into thedevelopment processing group90 with the hand CRH6. Thedevelopment processing group90 applies development processing to the substrate W by the development processing unit DEV.
• After this, the third central robot CR3 takes out the substrate W after the development processing from thedevelopment processing group90 with the hand CRH5, and transfers the substrate W to thethermal processing group120.
• Then, the third central robot CR3 takes out the thermally treated substrate W from thethermal processing group120 with the hand CRH6, and transfers the substrate W onto the substrate platform PASS6.
• If thedevelopment processing group90 is temporarily not capable of applying development processing to the substrate W by, e.g., a failure, the substrate W may temporarily be stored in the return buffer unit RBF in theinterface block13 after the thermal treatment in thethermal processing group121.
• The substrate W on the substrate platform PASS6 is transferred onto the substrate platform PASS4 by the hand CRH4 of the second central robot CR2 in the resistfilm processing block11. The substrate W on the substrate platform PASS4 is transferred onto the substrate platform PASS2 by the hand CRH2 of the first central robot CR1 in the anti-reflectionfilm processing block10.
• The substrate W on the substrate platform PASS2 is stored in a carrier C by the indexer robot IR in theindexer block9. Each of the processing to the substrate W in the substrate processing apparatus is thus completed.
• The aforementioned washing processing unit SOAK is now described in detail with reference to the drawings.
• The configuration of the washing processing unit SOAK is first described.FIG. 4 is a diagram for use in illustrating the configuration of the washing processing unit SOAK.
• As shown inFIG. 4, the washing processing unit SOAK comprises aspin chuck621 for rotating a substrate W about the vertical rotation axis passing through the center of the substrate W while horizontally holding the substrate W.
• Thespin chuck621 is secured to an upper end of arotation shaft625, which is rotated via a chuck rotation-drive mechanism636. An air suction passage (not shown) is formed in thespin chuck621. With the substrate W being mounted on thespin chuck621, air inside the air suction passage is discharged, so that a lower surface of the substrate W is sucked onto thespin chuck621 by vacuum, and the substrate W is held in a horizontal attitude.
• Afirst rotation motor660 is arranged outside thespin chuck621. Thefirst rotation motor660 is connected to afirst rotation shaft661. Thefirst rotation shaft661 is coupled to afirst arm662, which extends in the horizontal direction, and whose end is provided with anozzle650 for washing processing.
• Thefirst rotation shaft661 is rotated by thefirst rotation motor660, so that thefirst arm662 swings. This causes thenozzle650 to move above the substrate W held on thespin chuck621.
• Asupply pipe663 for washing processing is arranged so as to pass through the inside of thefirst rotation motor660,first rotation shaft661, andfirst arm662. Thesupply pipe663 is connected to a washing liquid supply source R1 and a rinse liquid supply source R2 through a valve Va and a valve Vb, respectively. Controlling the opening and closing of the valves Va, Vb allows the selection of the processing liquid supplied to thesupply pipe663 and adjustments of the amount thereof. In the configuration ofFIG. 4, when the valve Va is opened, washing liquid is supplied to thesupply pipe663, and when the valve Vb is opened, rinse liquid is supplied to thesupply pipe663.
• The washing liquid or the rinse liquid is supplied to thenozzle650 through thesupply pipe663 from the washing liquid supply source R1 or the rinse liquid supply source R2. The washing liquid or the rinse liquid is thus supplied to a surface of the substrate W. Examples of the washing liquid may include pure water, a pure water solution containing a complex (ionized), or a fluorine-based chemical solution. Examples of the rinse liquid may include pure water, carbonated water, hydrogen water, electrolytic ionic water, and HFE (hydrofluoroether).
• Asecond rotation motor671 is arranged outside thespin chuck621. Thesecond rotation motor671 is connected to asecond rotation shaft672. Thesecond rotation shaft672 is coupled to asecond arm673, which extends in the horizontal direction, and whose end is provided with anozzle670 for drying processing.
• Thesecond rotation shaft672 is rotated by thesecond rotation motor671, so that thesecond arm673 swings. This causes thenozzle670 to move above the substrate W held on thespin chuck621.
• Asupply pipe674 for drying processing is arranged so as to pass through the inside of thesecond rotation motor671,second rotation shaft672, andsecond arm673. Thesupply pipe674 is connected to an inert gas supply source R3 through a valve Vc. Controlling the opening and closing of the valve Vc allows adjustments to be made to the amount of the inert gas supplied to thesupply pipe674.
• The inert gas is supplied to thenozzle670 through thesupply pipe674 from the inert gas supply source R3. The inert gas is thus supplied to the surface of the substrate W. Nitrogen gas (N₂), for example, may be used as the inert gas.
• When supplying the washing liquid or the rinse liquid onto the surface of the substrate W, thenozzle650 is positioned above the substrate. When supplying the inert gas onto the surface of the substrate W, thenozzle650 is retracted to a predetermined position.
• When supplying the washing liquid or the rinse liquid onto the surface of the substrate W, thenozzle670 is retracted to a predetermined position. When supplying the inert gas onto the surface of the substrate W, thenozzle670 is positioned above the substrate W.
• The substrate W held on thespin chuck621 is housed in aprocessing cup623. Acylindrical partition wall633 is provided inside theprocessing cup623. Adischarge space631 is formed so as to surround thespin chuck621 for discharging the processing liquid (i.e., washing liquid or rinse liquid) used in processing the substrate W. Also, aliquid recovery space632 is formed between theprocessing cup623 and thepartition wall633, so as to surround thedischarge space631, for recovering the processing liquid used in processing the substrate W.
• Thedischarge space631 is connected with adischarge pipe634 for directing the processing liquid to a liquid discharge processing device (not shown), while theliquid recovery space632 is connected with arecovery pipe635 for directing the processing liquid to a recovery processing device (not shown)
• Aguard624 is provided above theprocessing cup623 for preventing the processing liquid on the substrate W from splashing outward. Theguard624 is configured to be rotation-symmetric with respect to therotation shaft625. A liquiddischarge guide groove641 with a V-shaped cross section is formed in a circular shape inwardly of an upper end portion of theguard624.
• Also, aliquid recovery guide642 having an inclined surface that inclines down outwardly is formed inwardly of a lower portion of theguard624. A partitionwall housing groove643 for receiving thepartition wall633 in theprocessing cup623 is formed in the vicinity of the upper end of theliquid recovery guide642.
• Thisguard624 is provided with a guard lifting mechanism (not shown) composed of a ball screw mechanism or the like. The guard lifting mechanism lifts and lowers theguard624 between a recovery position in which theliquid recovery guide642 is positioned opposite to outer edges of the substrate W held on thespin chuck621 and a discharge position in which the liquiddischarge guide groove641 is positioned opposite to the outer edges of the substrate W held on thespin chuck621. When theguard624 is in the recovery position (i.e., the position of the guard shown inFIG. 4), the processing liquid splashed out from the substrate W is directed by theliquid recovery guide642 to theliquid recovery space632, and then recovered through therecovery pipe635. On the other hand, when theguard624 is in the discharge position, the processing liquid splashed out from the substrate W is directed by the liquiddischarge guide groove641 to thedischarge space631, and then discharged through thedischarge pipe634. With the above-described configuration, discharge and recovery of the processing liquid is performed.
• The processing operation of the washing processing unit SOAK having the above-described configuration is next described. Note that the operation of each component in the washing processing unit SOAK described below is controlled by themain controller30 inFIG. 1.
• When the substrate W is initially carried into the washing processing unit SOAK, theguard624 is lowered, and the third central robot CR3 inFIG. 1 places the substrate W onto thespin chuck621. The substrate W on thespin chuck621 is held by suction.
• Next, theguard624 moves to the aforementioned discharge position, and thenozzle650 moves above the center of the substrate W. Then, therotation shaft625 rotates, causing the substrate W held on thespin chuck621 to rotate. After this, the washing liquid is discharged onto the top surface of the substrate W from thenozzle650. The substrate W is thus washed, and part of the component of the resist on the substrate W is eluted in the washing liquid. During the washing, the substrate W is rotated as the washing liquid is supplied onto the substrate W. This causes the washing liquid on the substrate W to constantly move toward a peripheral portion of the substrate W by the centrifugal force, and splashed away. It is therefore possible to prevent the component of the resist eluted in the washing liquid from remaining on the substrate W. Note that the aforementioned resist component may be eluted with pure water being poured onto the substrate Wand kept thereon for a certain period. The supply of the washing liquid onto the substrate W may also be executed by a soft spray method using a two-fluid nozzle.
• After the elapse of a predetermined time, the supply of the washing liquid is stopped, and the rinse liquid is discharged from thenozzle650. The washing liquid on the substrate W is thus washed away. As a result, it is possible to reliably prevent the resist components eluted in the washing liquid from remaining on the substrate W.
• After the elapse of another predetermined time, the rotation speed of therotation shaft625 decreases. This reduces the amount of the rinse liquid that is shaken off by the rotation of the substrate W, resulting in the formation of a liquid layer L of the rinse liquid over the entire surface of the substrate W, as shown inFIG. 5(a). Alternatively, the rotation of therotation shaft625 may be stopped to form the liquid layer L over the entire surface of the substrate W.
• The embodiment employs the configuration in which thenozzle650 is used for supplying both the washing liquid and the rinse liquid, so as to supply both the washing liquid and the rinse liquid from thenozzle650. However, a configuration may also be employed in which nozzles are separately provided for supplying the washing liquid and the rinse liquid.
• In order to prevent the rinse liquid from flowing to the back surface of the substrate W during the supply of the rinse liquid, pure water may be supplied to the back surface of the substrate W from a back rinsing nozzle (not shown).
• Note that when using pure water as the washing liquid for washing the substrate W, it is not necessary to supply the rinse liquid.
• The supply of the rinse liquid is subsequently stopped, and thenozzle650 retracts to the predetermined position while thenozzle670 moves above the center of the substrate W. The inert gas is subsequently discharged from thenozzle670. This causes the rinse liquid around the center of the substrate W to move toward a peripheral portion of the substrate W, leaving the liquid layer L only on the peripheral portion, as shown inFIG. 5(b).
• Next, as the number of revolutions of the rotation shaft625 (seeFIG. 4) increases, thenozzle670 gradually moves from above the center of the substrate W to above the peripheral portion thereof, as shown inFIG. 5(c). This causes a great centrifugal force acting on the liquid layer L on the substrate W while allowing the inert gas to be sprayed toward the entire surface of the substrate W, thereby ensuring the removal of the liquid layer L on the substrate W. As a result, the substrate W can be reliably dried.
• Then, the supply of the inert gas is stopped, and thenozzle670 retracts to the predetermined position while the rotation of therotation shaft625 is stopped. After this, theguard624 is lowered, and the third central robot CR3 inFIG. 1 carries the substrate W out of the washing processing unit SOAK. The processing operation of the washing processing unit SOAK is thus completed.
• It is preferred that the position of theguard624 during washing and drying processing is suitably changed according to the necessity of the recovery or discharge of the processing liquid.
• Moreover, although the washing processing unit SOAK shown inFIG. 4 includes thenozzle650 for washing processing and thenozzle670 for drying processing separately, thenozzle650 and thenozzle670 may also be formed integrally, as shown inFIG. 6. This obviates the need to move each of thenozzle650 and thenozzle670 separately during the washing or drying processing to the substrate W, thereby simplifying the driving mechanism.
• Anozzle770 for drying processing as shown inFIG. 7 may also be used instead of thenozzle670 for drying processing.
• Thenozzle770 inFIG. 7 extends vertically downward, and also hasbranch pipes771,772 that extend obliquely downward from sides thereof. Agas discharge port770ais formed at the lower end of thebranch pipe771, agas discharge port770bis formed at the lower end of thenozzle770, and agas discharge port770cis formed at the lower end of thebranch pipe772, each for discharging an inert gas. Thedischarge port770bdischarges an inert gas vertically downward, and thedischarge ports770a,770ceach discharge an inert gas obliquely downward, as indicated by the arrows inFIG. 7. That is to say, thenozzle770 discharges the inert gas so as to increase the spraying area downwardly.
• Now, a washing processing unit SOAK using thenozzle770 for drying processing applies drying processing to the substrate W as will now be described.
• FIGS.8(a),8(b),8(c) are diagrams for use in illustrating a method of applying drying processing to the substrate W using thenozzle770.
• Initially, a liquid layer L is formed on the surface of the substrate W by the method as described inFIG. 5(a), and then thenozzle770 moves above the center of the substrate W, as shown inFIG. 8(a). After this, an inert gas is discharged from thenozzle770. This causes the rinse liquid on the center of the substrate W to move to the peripheral portion of the substrate W, leaving the liquid layer L only on the peripheral portion of the substrate W, as shown inFIG. 8(b). At the time, thenozzle770 is brought close to the surface of the substrate W so as to reliably move the rinse liquid present on the center of the substrate W.
• Next, as the number of revolutions of the rotation shaft625 (seeFIG. 4) increases, thenozzle770 moves upward as shown inFIG. 8(c). This causes a great centrifugal force acting on the liquid layer L on the substrate W while increasing the area to which the inert gas is sprayed on the substrate W. As a result, the liquid layer L on the substrate W is reliably removed. Note that thenozzle770 can be moved up and down by lifting and lowering thesecond rotation shaft672 via a rotation shaft lifting mechanism (not shown) provided to thesecond rotation shaft672 inFIG. 4.
• Alternatively, anozzle870 for drying processing as shown inFIG. 9 may be used instead of thenozzle770. Thenozzle870 inFIG. 9 has adischarge port870awhose diameter gradually increases downward. Thisdischarge port870adischarges an inert gas vertically downward and obliquely downward as indicated by the arrows inFIG. 9. That is, similarly to thenozzle770 inFIG. 7, thenozzle870 discharges the inert gas so as to increase the spraying area downwardly. Consequently, drying processing similar to that using thenozzle770 can be applied to the substrate W using thenozzle870.
• A washing processing unit SOAKa as shown inFIG. 10 may also be used instead of the washing processing unit SOAK shown inFIG. 4.
• The washing processing unit SOAKa inFIG. 10 is different from the washing processing unit SOAK inFIG. 4 as described below.
• The washing processing unit SOAKa inFIG. 10 includes above the spin chuck621 a disk-shapedshield plate682 having an opening through the center thereof. Asupport shaft689 extends vertically downward from around an end of anarm688, and theshield plate682 is mounted at a lower end of thesupport shaft689 so as to oppose the top surface of the substrate W held on thespin chuck621.
• Agas supply passage690 that communicates with the opening of theshield plate682 is inserted into the inside of thesupport shaft689. A nitrogen gas (N₂), for example, is supplied into thegas supply passage690.
• Thearm688 is connected with a shieldplate lifting mechanism697 and a shield plate rotation-drivingmechanism698. The shieldplate lifting mechanism697 lifts and lowers theshield plate682 between a position close to the top surface of the substrate W held on thespin chuck621 and a position upwardly away from thespin chuck621.
• During the drying processing to the substrate W in the washing processing unit SOAKa inFIG. 10, with theshield plate682 brought close to the substrate W as shown inFIG. 11, an inert gas is supplied to clearance between the substrate W and theshield plate682 from thegas supply passage690. This allows the inert gas to be efficiently supplied from the center of the substrate W to the peripheral portion thereof, thereby ensuring the removal of the liquid layer L on the substrate W.
• Although in the above-described embodiment, the substrate W is subjected to drying processing by spin drying in the washing processing unit SOAK, the substrate W maybe subjected to drying processing by other methods such as a reduced pressure drying method or an air knife drying method.
• Although in the above-described embodiment, the inert gas is supplied from thenozzle670 with the liquid layer L of the rinse liquid being formed, the following method may be applied when the liquid layer L of the rinse liquid is not formed or the rinse liquid is not used. That is, the liquid layer of washing liquid is shaken off once by rotating the substrate W, and an inert gas is then immediately supplied from thenozzle670 to thoroughly dry the substrate W.
• As described above, in thesubstrate processing apparatus500 according to the embodiment, the substrate W is subjected to the washing processing by the washing processing unit SOAK before the exposure processing by theexposure device14. During this washing processing, part of the component of the resist on the substrate W is eluted in the washing liquid or the rinse liquid, and washed away. Therefore, even if the substrate W is in contact with liquid in theexposure device14, the component of the resist on the substrate W is hardly eluted in the liquid. This reduces contamination in theexposure device14 while preventing the resist component from remaining on the surface of the substrate W. As a result, processing defects of the substrate W that may be generated in theexposure device14 can be reduced.
• In addition, the washing processing unit SOAK applies the drying processing to the substrate after the washing processing, which prevents the attachment of particles in the atmosphere to the substrate W during the transport of the substrate W after the washing processing. This prevents contamination of the substrate W.
• Moreover, the washing/development processing block12 is arrange adjacent to theinterface block13. In this case, the washing processing can be applied to the substrate W immediately before the exposure processing by theexposure device14, and the development processing can be applied to the substrate W immediately after the exposure processing by theexposure device14. This prevents the attachment of particles and the like in the atmosphere to the substrate W during the transport of the substrate W from the washing/development processing block12 to theexposure device14 and from theexposure device14 to the washing/development processing block12. As a result, processing defects of the substrate W that may be generated during the exposure processing and the development processing can be sufficiently reduced.
• In addition, the washing processing unit SOAK applies the drying processing to the substrate W by spraying the inert gas to the substrate W from the center to the peripheral portion thereof while rotating the substrate W. This reliably removes the washing liquid and the rinse liquid on the substrate W, which reliably prevents particles and the like in the atmosphere from attaching to the washed substrate W. This prevents contamination of the substrate W reliably while preventing the generation of dry marks on the surface of the substrate W.
• In addition, the washing liquid and the rinse liquid are reliably prevented from remaining on the washed substrate W, so that the resist components are reliably prevented from being eluted in the washing liquid and the rinse liquid during the transport of the substrate W from the washing processing unit SOAK to theexposure device14. This prevents a defective shape of the resist film and the contamination inside theexposure device14.
• As a result of the foregoing, processing defects of the substrate W can be reliably prevented.
• The interface transport mechanism IFR is next described.FIG. 12 is a diagram for use in illustrating the configuration and operation of the interface transport mechanism IFR.
• The configuration of the interface transport mechanism IFR is first described. As shown inFIG. 12, amovable base21 in the interface transport mechanism IFR is threadably mounted to a screwedshaft22. The screwedshaft22 is rotatably supported withsupport bases23 so as to extend in the X direction. One end of the screwedshaft22 is provided with a motor M1, which causes the screwedshaft22 to rotate and themovable base21 to horizontally move in the ±X direction.
• Ahand support base24 is mounted on themovable base21 so as to rotate in the ±θ direction while moving up and down in the ±Z direction. Thehand support base24 is coupled to a motor M2 in themovable base21 through arotation shaft25, and rotated by the motor M2. Two hands H5, H6 for holding the substrate W in a horizontal attitude are mounted to thehand support base24 one above the other so as to move forward and backward.
• The operation of the interface transport mechanism IFR is next described. The operation of the interface transport mechanism IFR is controlled by themain controller30 inFIG. 1.
• The interface transport mechanism IFR initially rotates thehand support base24 at the position A inFIG. 12 while lifting thehand support base24 in the +Z direction, to allow the upper hand H5 to enter the substrate platform PASS9. When the hand H5 has received the substrate W in the substrate platform PASS9, the interface transport mechanism IFR retracts the hand H5 from the substrate platform PASS9, and lowers thehand support base24 in the −Z direction.
• The interface transport mechanism IFR subsequently moves in the −X direction, and rotates thehand support base24 at the position B while allowing the hand H5 to enter asubstrate inlet14ain the exposure device14 (seeFIG. 1). After the hand H5 has carried the substrate W into thesubstrate inlet14a, the interface transport mechanism IFR retracts the hand H5 from thesubstrate inlet14a.
• Then, the interface transport mechanism IFR allows the lower hand H6 to enter asubstrate outlet14bin the exposure device14 (seeFIG. 1). When the hand H6 has received the substrate W after the exposure processing from thesubstrate outlet14b, the interface transport mechanism IFR retracts the hand H6 from thesubstrate outlet14b.
• After this, the interface transport mechanism IFR moves in the +X direction, and rotates thehand support base24 at the position A while lifting thehand support base24 in the +Z direction, to allow the hand H6 to enter the substrate platform PASS10 and transfer the substrate W onto the substrate platform PASS10.
• If theexposure device14 is not capable of receiving the substrate W during the transport of the substrate W from the substrate platform PASS9 to theexposure device14, the substrate W is temporarily stored in the feed buffer unit SBF.
• As described above, in this embodiment, the hand H5 of the interface transport mechanism IFR is used during the transport of the substrate W from the substrate platform PASS9 to theexposure device14, while the hand H6 is used during the transport of the substrate W from theexposure device14 to the substrate platform PASS10. That is, the hand H6 is used for transporting the substrate W to which a liquid is attached after the exposure processing, while the hand H5 is used for transporting the substrate W to which no liquid is attached. This prevents the liquid on the substrate W from attaching to the hand H5.
• Moreover, since the hand H6 is arranged below the hand H5, even if a liquid drops from the hand H6 and the substrate W held thereon, the liquid will not attach to the hand H5 and the substrate W held thereon.
• Furthermore, as described above, the fourth central robot CR4 also employs the lower hand CRH8 during the transport of the substrate W to which a liquid is attached after the exposure processing (between the substrate platform PASS10 and the thermal processing group121), and employs the upper hand CRH7 during the transport of the substrate W to which no liquid is attached before the exposure processing (between the substrate platform PASS7 and the edge exposure units EEW, and between the edge exposure units EEW and the substrate platform PASS9). This prevents a liquid from attaching to the substrate W before the exposure processing also in the fourth central robot CR4.
• As a result of the foregoing, a liquid is prevented from attaching to the substrate W before the exposure processing which prevents the contamination of the substrate W due to the attachment of particles and the like in the atmosphere. This prevents the generation of processing defects of the substrate W due to degradation in the resolution performance and the like in theexposure device14.
• Although in this embodiment, the single interface transport mechanism IFR is used for transporting the substrate W, a plurality of interface transport mechanisms IFR may also be used for transporting the substrate W.
• The operation and the configuration of the interface transport mechanism IFR may also be modified according to the positions of thesubstrate inlet14aand thesubstrate outlet14bof theexposure device14. For example, when thesubstrate inlet14aand thesubstrate outlet14bin theexposure device14 are positioned opposite to the position A inFIG. 12, the screwedshaft22 inFIG. 12 may be omitted.
• Furthermore, the numbers of the coating units BARC, RES, the development processing units DEV, the washing processing unit SOAK, the heating units HP, and the cooling units CP may suitably be changed according to the processing speed of each processing block.
• In addition, a two-fluid nozzle shown inFIG. 13 may also be used in the washing processing unit SOAK, instead of one or both thenozzle650 for washing processing and thenozzle670 for drying processing shown inFIG. 4
• FIG. 13 is a longitudinal cross section showing an example of the internal structure of the two-fluid nozzle950 for use in washing and drying processing. The two-fluid nozzle950 is capable of selectively discharging a gas, a liquid, and a fluid mixture of the gas and liquid.
• The two-fluid nozzle950 in this embodiment is so-called an external-mix type. The external-mix type two-fluid nozzle950 shown inFIG. 13 comprises aninner body portion311 and anouter body portion312. Theinner body portion311 is composed of, e.g., quartz, and theouter body portion312 is composed of a fluororesin such as PTFE (polytetrafluoroethylene).
• Acylindrical liquid passage311bis formed along the central axis of theinner body portion311. Theliquid passage311bis provided with thesupply pipe663 shown inFIG. 4 for washing processing. Washing liquid or rinse liquid supplied from thesupply pipe663 is thus introduced into theliquid passage311b.
• A liquid discharge port311athat communicates with theliquid passage311bis formed at a lower end of theinner body portion311. Theinner body portion311 is inserted into theouter body portion312. Upper ends of theinner body portion311 and theouter body portion312 are joined together, while lower ends thereof are not joined.
• Acylindrical gas passage312bis formed between theinner body portion311 and theouter body portion312. A gas discharge port312athat communicates with thegas passage312bis formed at the lower end of theouter body portion312. Thesupply pipe674 shown inFIG. 4 for drying processing is mounted to a peripheral wall of theouter body portion312, so as to communicate with thegas passage312b. An inert gas supplied from thesupply pipe674 is thus introduced into thegas passage312b.
• The diameter of thegas passage312bdecreases downward in the vicinity of the gas discharge port312a. As a result, the velocity of flow of the inert gas is accelerated, and the inert gas is discharged from the gas discharge port312a.
• The washing liquid discharged from the liquid discharge port311aand the inert gas discharged from the gas discharge port312aare mixed outside near the lower end of the two-fluid nozzle950 to generate a mist-like fluid mixture that contains fine droplets of the washing liquid.
• FIGS.14(a),14(b),14(c) are diagrams for use in illustrating a method of applying washing and drying processing to the substrate W using the two-fluid nozzle950 inFIG. 13.
• The substrate W is initially held on thespin chuck621 by suction, as shown inFIG. 4, and rotates together with the rotation of therotation shaft625. The rotation speed of therotation shaft625 is, e.g., about 500 rpm.
• In this state, as shown inFIG. 14(a), the two-fluid nozzle950 discharges the mist-like fluid mixture of the washing liquid and the inert gas onto the top surface of the substrate W while gradually moving from above the center of the substrate W to above the peripheral portion thereof. In this way, the fluid mixture is sprayed onto the entire surface of the substrate W from the two-fluid nozzle950 to wash the substrate W.
• Next, the supply of the fluid mixture is stopped, and the rotation speed of therotation shaft625 decreases while the rinse liquid is discharged from the two-fluid nozzle950 onto the substrate W, as shown inFIG. 14(b). The rotation speed of therotation shaft625 is, e.g., about 10 rpm. A liquid layer L of the rinse liquid is thus formed on the entire surface of the substrate W. Alternatively, the rotation of therotation shaft625 may be stopped to form the liquid layer L on the entire surface of the substrate W. When pure water is used as the washing liquid in the fluid mixture for washing the substrate W, the supply of the rinse liquid may be omitted.
• After the formation of the liquid layer L, the supply of the rinse liquid is stopped. Then, the inert gas is discharged onto the substrate W from the two-fluid nozzle950, as shown inFIG. 14(c). This causes the washing liquid on the center of the substrate W to move to the peripheral portion of the substrate W, leaving the liquid layer L only on the peripheral portion.
• Then, the rotation speed of therotation shaft625 increases. The rotation speed of therotation shaft625 is, e.g., about 100 rpm. This causes a great centrifugal force acting on the liquid layer L on the substrate W, allowing the removal of the liquid layer L on the substrate W. As a result, the substrate W is dried.
• The two-fluid nozzle950 may gradually move from above the center of the substrate W to above the peripheral portion thereof when removing the liquid layer L on the substrate W. This allows the inert gas to be sprayed to the entire surface of the substrate W, which ensures the removal of the liquid layer L on the substrate W. As a result, the substrate W can be reliably dried.
• As described above, in the two-fluid nozzle inFIG. 13, the fluid mixture discharged from the two-fluid nozzle950 contains fine droplets of the washing liquid. Therefore, even if the surface of the substrate W has irregularities, any contaminants attached on the surface of the substrate W can be stripped off. The contaminants on the surface of the substrate W can thus be reliably removed. Moreover, even if the films on the substrate W have low wettability, the fine droplets of the washing liquid strip off the contaminants on the surface of the substrate W, so that the contaminants can be reliably removed from the surface of the substrate W.
• As a result, even if the solvent or the like in a resist is sublimated in the heating units HP and the sublimates are attached to the substrate W again when thermal processing is applied to the substrate W by the heating units HP before the exposure processing, the sublimates attached to the substrate W can be reliably removed by the washing processing unit SOAK. It is therefore possible to reliably prevent the contamination inside theexposure device14.
• In addition, adjusting the flow rate of the inert gas allows adjustments to be easily made to the detergency in washing the substrate W. Thus, when the organic films (i.e., a resist film) on the substrate W are prone to damage, damage to the organic films on the substrate W can be prevented by weakening the detergency. Tough contaminants on the surface of the substrate W can also be removed reliably by strengthening the detergency. By adjusting the detergency in this way according to the properties of the organic films on the substrate W and the degree of contamination, it is possible to prevent damage to the organic films on the substrate W and wash the substrate W reliably.
• Moreover, the external-mix type two-fluid nozzle950 generates the fluid mixture by mixing the washing liquid and the inert gas outside the two-fluid nozzle950. The inert gas and the washing liquid flow through the separate flow passages, respectively, in the two-fluid nozzle950. This prevents the washing liquid from remaining in thegas passage312b, allowing the inert gas to be discharged independently from the two-fluid nozzle950. Also, the rinse liquid can be discharged independently from the two-fluid nozzle950 by supplying the rinse liquid from thesupply pipe663. This allows the fluid mixture, the inert gas, and the rinse liquid to be selectively discharged from the two-fluid nozzle950.
• Furthermore, the use of the two-fluid nozzle950 obviates the need to provide nozzles for supplying the washing liquid or the rinse liquid to the substrate W and for supplying the inert gas to the substrate W separately. This provides reliable washing and drying of the substrate W with a simple structure.
• Although, in this embodiment, the two-fluid nozzle950 is used to supply the rinse liquid to the substrate W, a separate nozzle may also be used for supplying the rinse liquid to the substrate W.
• Moreover, in this embodiment, although the two-fluid nozzle950 is used to supply the inert gas to the substrate W, a separate nozzle may also be used for supplying the inert gas to the substrate W.
• In this embodiment, the anti-reflectionfilm processing block10, the resistfilm processing block11, and the washing/development processing block12 correspond to a processing section; theinterface block13 corresponds to an interface; theindexer block9 corresponds to an indexer; the coating units RES correspond to a first processing unit; the resistfilm processing block11 corresponds to a first processing block; the washing processing units SOAK, SOAKa correspond to a second processing unit; the development processing units DEV correspond to a third processing unit; the washing/development processing block12 corresponds to a second processing block; the coating units BARC correspond to a fourth processing unit; the anti-reflectionfilm processing block10 corresponds to a third processing block; and the resist film corresponds to a photosensitive film.
• The heating units HP and the cooling units CP correspond to first to third thermal processing units; the second central robot CR2 corresponds to a first transport unit; the third central robot CR3 corresponds to a second transport unit; the first central robot CR1 corresponds to a third transport unit; the fourth central robot CR4 corresponds to a fourth transport unit; the interface transport mechanism IFR corresponds to a fifth transport unit; the hand CRH7 corresponds to a first holder; the hand CRH8 corresponds to a second holder; the hand H5 corresponds to a third holder; the hand H6 corresponds to a fourth holder; and the substrate platforms PASS9,10 correspond to a platform.
• Thespin chuck621 corresponds to a substrate holding device; therotation shaft625 and the chuck rotation-drive mechanism636 correspond to a rotation-drive device; thenozzle650 for washing processing corresponds to a washing liquid supplier and a rinse liquid supplier; and thenozzles670,770,870 for drying processing correspond to an inert gas supplier.
• The two-fluid nozzle950 corresponds to a fluid nozzle; theliquid passage311bcorresponds to a liquid flow passage; and thegas passage312bcorresponds to a gas flow passage.
• Although the present invention has been described and illustrated in detail, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, the spirit and scope of the present invention being limited only by the terms of the appended claims.

Claims (27)

1. A substrate processing apparatus that is arranged adjacent to an exposure device, comprising:

a processing section for applying processing to a substrate; and

an interface that is provided on one end of said processing section for exchanging the substrate between said processing section and said exposure device, wherein

said processing unit includes:

a first processing unit that forms a photosensitive film made of a photosensitive material on the substrate;

a second processing unit that washes the substrate after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device; and

a third processing unit that applies development processing to the substrate after the exposure processing by said exposure device.

2. The substrate processing apparatus according toclaim 1, wherein

said processing section comprises:

a first processing block that includes said first processing unit, a first thermal processing unit that thermally treats the substrate, and a first transport unit that transports the substrate; and

a second processing block that includes said second processing unit, said third processing unit, a second thermal processing unit that thermally treats the substrate, and a second transport unit that transports the substrate.

3. The substrate processing apparatus according toclaim 2, wherein

said second processing block is arranged adjacent to an exposure device

4. The substrate processing apparatus according toclaim 2, wherein

said processing section further comprises a third processing block that includes a fourth processing unit that forms an anti-reflection film on the substrate before the formation of said photosensitive film by said first processing unit, a third thermal processing unit that thermally treats the substrate, and a third transport unit that transports the substrate.

5. The substrate processing apparatus according toclaim 4, further comprising an indexer that is arranged adjacent to another end of said processing section and carries in the substrate to said processing section and carries out the substrate from said processing section, wherein

said third processing block is arranged adjacent to said indexer.

6. The substrate processing apparatus according toclaim 1, wherein

said interface further includes:

a fifth processing unit that applies given processing to the substrate;

a platform on which the substrate is temporarily mounted;

a fourth transport unit that transports the substrate between said processing section, said fifth processing unit, and said platform; and

a fifth transport unit that transports the substrate between said platform and said exposure device.

7. The substrate processing apparatus according toclaim 6, wherein

said fourth transport unit includes first and second holders for holding the substrate,

said fourth transport unit holds the substrate with said first holder during the transport of the substrate before the exposure processing by said exposure device, and holds the substrate with said second holder during the transport of the substrate after the exposure processing by said exposure device,

said fifth transport unit includes third and fourth holders for holding the substrate, and

said fifth transport unit holds the substrate with said third holder during the transport of the substrate before the exposure processing by said exposure device, and holds the substrate with said fourth holder during the transport of the substrate after the exposure processing by said exposure device.

8. The substrate processing apparatus according toclaim 7, wherein

said second holder is provided below said first holder, and said fourth holder is provided below said third holder.

9. The substrate processing apparatus according toclaim 6, wherein

said fifth processing unit includes an edge exposure unit that subjects a peripheral portion of the substrate to exposure.

10. The substrate processing apparatus according toclaim 1, wherein

said second processing unit further dries the substrate after washing the substrate.

11. The substrate processing apparatus according toclaim 10, wherein

said second processing unit comprises:

a substrate holding device that holds the substrate substantially horizontally;

a rotation-driving device that rotates the substrate held on said substrate holding device about an axis vertical to the substrate;

a washing liquid supplier that supplies a washing liquid onto the substrate held on said substrate holding device; and

an inert gas supplier that supplies an inert gas onto the substrate after the washing liquid has been supplied onto the substrate by said washing liquid supplier.

12. The substrate processing apparatus according toclaim 11, wherein

said inert gas supplier supplies the inert gas so that the washing liquid supplied onto the substrate from said washing liquid supplier is removed from the substrate as the washing liquid moves outwardly from the center of the substrate.

13. The substrate processing apparatus according toclaim 11, wherein

said second processing unit further comprises a rinse liquid supplier that supplies a rinse liquid onto the substrate after the supply of the washing liquid from said washing liquid supplier and before the supply of the inert gas from said inert gas supplier.

14. The substrate processing apparatus according toclaim 13, wherein

said inert gas supplier supplies the inert gas so that the rinse liquid supplied onto the substrate from said rinse liquid supplier is removed from the substrate as the rinse liquid moves outwardly from the center of the substrate.

15. The substrate processing apparatus according toclaim 1, wherein

said second processing unit washes the substrate by supplying a fluid mixture containing a washing liquid and a gas onto the substrate from a fluid nozzle.

16. The substrate processing apparatus according toclaim 15, wherein

said gas is an inert gas.

17. The substrate processing apparatus according toclaim 15, wherein

said second processing unit further dries the substrate after washing the substrate.

18. The substrate processing apparatus according toclaim 17, wherein

said second processing unit includes an inert gas supplier that dries the substrate by supplying an inert gas onto the substrate.

19. The substrate processing apparatus according toclaim 18, wherein

said fluid nozzle functions as said inert gas supplier.

20. The substrate processing apparatus according toclaim 18, wherein

said second processing unit further includes:

a substrate holding device that holds the substrate substantially horizontally; and

a rotation-driving device that rotates the substrate held on said substrate holding device about an axis vertical to the substrate.

21. The substrate processing apparatus according toclaim 18, wherein

said second processing unit supplies the inert gas so that the fluid mixture supplied onto the substrate from said fluid nozzle is removed from the substrate as the fluid mixture moves outwardly from the center of the substrate.

22. The substrate processing apparatus according toclaim 18, wherein

said second processing unit further includes a rinse liquid supplier that supplies a rinse liquid onto the substrate, after the supply of the fluid mixture from said fluid nozzle and before the supply of the inert gas from said inert gas supplier.

23. The substrate processing apparatus according toclaim 22, wherein

said fluid nozzle functions as said rinse liquid supplier.

24. The substrate processing apparatus according toclaim 22, wherein

said second processing unit supplies the inert gas so that the rinse liquid supplied onto the substrate from said rinse liquid supplier is removed from the substrate as the rinse liquid moves outwardly from the center of the substrate.

25. The substrate processing apparatus according toclaim 15, wherein

said fluid nozzle has a liquid flow passage through which a liquid flows, a gas flow passage through which a gas flows, a liquid discharge port having an opening that communicates with said liquid flow passage, and a gas discharge port that is provided near said liquid discharge port and has an opening that communicates with said gas flow passage.

26. A substrate processing method for processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and comprises a first processing unit, a second processing unit, and a third processing unit, comprising the steps of:

forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before the exposure processing by said exposure device;

washing the substrate after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device; and

applying development processing to the substrate by said third processing unit after the exposure processing by said exposure device.

27. The substrate processing method according toclaim 26, further comprising the step of drying the substrate by said second processing unit, after said step of washing the substrate by said second processing unit and before said step of exposure processing by said exposure device.

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