US20060133042A1 - Electronic module for system board with pass-thru holes - Google Patents

Abstract

Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.

Description

BACKGROUND
• Some electronic systems utilize several printed circuit boards with many different electronic components interconnected to the circuit boards. As these electronic systems decrease in size and increase in performance, packing density, heat dissipation, and power distribution architecture become increasingly important.
• One way to increase packing density and reduce the actual size of an electronic device is to more closely position the electrical components together. Electrical components within a circuit board, however, are generally already tightly confined, and additional space may not be readily available. If, however, electrical components can be positioned to reduce the overall size of the electronic device, then significant savings and advantages can be realized.
• As electrical components are more densely packed together and as performance of these components increases, heat dissipation can become a more significant factor in many electronic systems. Circuit boards may include a plurality of heat-generating devices that must be cooled in order to operate within a specified operating temperature. If these heat-generating devices are not sufficiently cooled, then the devices can exhibit a decrease in performance or even permanently fail. Further, if the heat-generating devices are closely packed together, then heat from one device could effect the performance of an adjacent device.
• The design and layout of printed circuit board components can be quite complex and challenging. Designers must consider many factors, such as packing density and heat dissipation, to name a few examples. Improvements in these areas can realize significant benefits for electronic systems and devices.
SUMMARY
• Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.
• In another exemplary embodiment, a method comprises connecting a first portion of an electronic module to one side of a printed circuit board (PCB) having at least one pass-thru hole; and connecting a second portion of the electronic module to a second, opposite side of the PCB such that a thermal dissipation device disposed between the first and second portions extends through the at least one pass-thru hole.
• Other embodiments and variations of these embodiments are shown and taught in the accompanying drawings and detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is an exploded side view of a block diagram of an electronic assembly in accordance with an exemplary embodiment of the present invention.
• FIG. 2 is a side view of the electronic assembly ofFIG. 1 with the electronic assembly being assembled together.
• FIG. 3 is an end view ofFIG. 2.
• FIG. 4A is an exploded perspective view of a thermal dissipation device with a PCB having pass-thru holes.
• FIG. 4B is an exploded perspective view of another exemplary embodiment of a thermal dissipation device with a PCB having pass-thru holes.
• FIG. 4C is an exploded perspective view of yet another exemplary embodiment of a thermal dissipation device with a PCB having a pass-thru hole.
• FIG. 5 is a side view of an exemplary embodiment of an electronic assembly being assembled together.
• FIG. 6 is an end view ofFIG. 5.
• FIG. 7 is an exploded side view of a block diagram of an electronic assembly in accordance with another exemplary embodiment of the present invention
• FIG. 8 is a side view of the electronic assembly ofFIG. 7 with the electronic assembly being assembled together.
• FIG. 9A is an exemplary embodiment of a thermal dissipation device.
• FIG. 9B is another exemplary embodiment of a thermal dissipation device.
• FIG. 9C is another exemplary embodiment of a thermal dissipation device.
• FIG. 9D is another exemplary embodiment of a thermal dissipation device.
DETAILED DESCRIPTION
• FIGS. 1-3 show an electronic system orassembly100 in accordance with an exemplary embodiment of the present invention. Theelectronic assembly100 includes two printed circuit boards (PCB) or printed wiring boards (PWB)102 and104. ThePCBs102 and104 can have a variety of configurations and still be within embodiments in accordance with the invention. By way of example, the PCBs can include power module circuit boards, voltage regulation module (VRM) circuit boards, controller boards (such as a special type of expansion board that contains a controller for a peripheral device), expansion boards (such as any board that plugs into an expansion slot of a computer), or modules. As another example, the PCB102 can be a motherboard, and the PCB104 can be a daughterboard.
• A motherboard is a printed circuit board that can be used in a personal computer, server, or other electronic device. The motherboard (also known as a main board or system board) can provide attachment points for processors, graphics cards, sound cards, controllers, memory, integrated circuits (ICs), modules, PCBs, and many other electronic components and devices in a computing system. The daughterboard can be utilized as an extension of the motherboard or other card or board. The daughterboard can have plugs, sockets, pins, connectors, or other attachments for the motherboard or other boards.Connectors106A and106B, for example, can be used to electrically couple thePCB102 to thePCB104. Connectors106 provide a mechanical and electrical interface or connection between the PCBs and may include, for example, a removably connectable plug (male) and socket (female). Alternatively, a single connector can be used to connect thePCBs102 and104. Further, a connection mechanism betweenPCBs102 and104 can be located at various positions, such as, but not limited to, the sides and/or ends of the PCBs. Further yet, soldering can be used in place of or in conjunction with any connection.
• ThePCBs102 and104 include a plurality of electronic components or devices. For example, the PCB104 includes a plurality of heat-generating components ordevices110. These heat-generating devices include any electronic component that generates heat during operation. For example, heat-generating devices include, but are not limited to, electronic power circuits, integrated circuits (ICs) or chips, digital memory chips, application specific integrated circuits (ASICs), processors (such as a central processing unit (CPU) or digital signal processor (DSP)), discrete electronic devices (such as field effect transistors (FETs)), other types of transistors, or devices that require heat to be thermally dissipated from the device for the device to operate properly or within a specified temperature range. An ASIC can comprise an integrated circuit or chip that has functionality customized for a particular purpose or application. ThePCBs102 and104 and/orpower system130 can also include a plurality of electronic components or device that may or may not generate heat, that may generate low or insignificant amounts of heat, or that may generate heat but not require the generated heat to be thermally dissipated from the device for the device to operate properly or within a specified temperature range. Examples of such devices include, but are not limited to, resistors, capacitors, transistors, diodes, memories, etc.
• Theelectronic assembly100 includes at least one thermal solution orthermal dissipation device120. Thermal dissipation devices include, but are not limited to, heat spreaders, cold plates or thermal-stiffener plates, refrigeration (evaporative cooling) plates, heat pipes, mechanical gap fillers (such as a plurality of rods, pins, etc.), thermal pads, or other devices adapted to dissipate heat. Further, thermal dissipation devices include thermal compounds and thermal interface material that can be used to form a thermally conductive layer on a substrate, between electronic components, or within a finished component. For example, thermally conductive resins, tapes, molded thermoplastic compounds, adhesives, gap pads, and greases can be used between a heat-generating device and thermal dissipating device to improve heat dissipation and/or heat transfer. Further, thermal dissipation devices include heatsinks. A heatsink is a component designed to reduce the temperature of a heat-generating device or component, such as heat-generatingcomponents110. A heatsink, for example, can dissipate heat in a direct or indirect heat exchange with the electronic components, the heat being dissipated into surrounding air or surrounding environment. Numerous types of heatsinks can be utilized with embodiments in accordance with the present invention. For example, embodiments can include heatsinks without a fan (passive heatsinks) or heatsinks with a fan (active heatsink). Other examples of heatsinks include extruded heatsinks, folded fin heatsinks, cold-forged heatsinks, bonded/fabricated heatsinks, and skived fin heatsinks. Further, the thermal dissipation device, including heatsinks, can use liquids or phase change material. For example, the thermal dissipation device can conduct heat from heat generating devices to a heatsink that is liquid or air cooled. Furthermore, liquid pipes or liquid loops can be used to evacuate or transfer heat from the thermal dissipation device or module to an external location that is remote from the thermal dissipation device or module.
• Theelectronic assembly100 also includes at least one power supply orpower system130. Electrical connectors orpower coupling devices140 connect therespective power system130 to thePCB104.FIGS. 1-3 show oneconnector140 located at an end or corner of thePCB104 and/orpower system130. Although oneconnector140 is shown, embodiments in accordance with the invention are not limited to a particular number, type, or location of connectors. For example, multiple connectors can be used to couple thepower system130 to thePCB104. Alternatively, the connectors can be located at various positions, such as, but not limited to, the sides, middle, and/or ends of thePCB104 and/orpower system130. Further yet, such connectors can pass through a hole or opening142 in thePCB102 or pass around or adjacent thePCB102 to establish a connection between thePCB104 andpower system130.
• Thepower system130 can include numerous embodiments for providing power to electronic components (such as heat-generating components110) and/or PCBs (such as the PCB104) within theelectronic assembly100. For example, the power system can be a factorized power architecture (FPA) module, a power converter, such as a direct current (DC) converter or DC-DC converter, DC linear regulator, AC-DC converter, DC switching regulator, or DC charge pump.
• Thepower system130 can be configured as PCBs, power module assemblies, power circuit cards/boards, and/or power module PCBs. As shown inFIGS. 1-3, thepower system130 is disposed in a parallel and vertically stacked-up relationship with thethermal dissipation device120 andPCBs102 and104.
• ThePCB102 includes a plurality of pass-thru holes150. Pass-thru holes are holes or openings that extend through something (example, the PCB102). Each pass-thruhole150 is adapted or shaped to receive a portion of thethermal dissipation device120 such that the portion extends through the hole or opening.
• As best shown inFIGS. 1 and 2, thethermal dissipation device120 includes a plurality of extensions orprotrusions160 that extends outwardly from a body orbase162 of thethermal dissipation device120. Theextensions160 are adapted and shaped to fit through corresponding pass-thruholes150 of thePCB102 and contact, abut, or come in close proximity with a top outer surface of heat-generatingdevices110.
• Thepower system130 may be modular and replaceable. In some embodiments, thepower system130 is an independently-operable unit or module that can be constructed with standardized units or dimensions for flexibility and replaceability for use in theelectronic assembly100. Further, thepower system130 can be connected to or removed from the electronic assembly (example, the PCB104) without connecting, removing, or replacing other components in the electronic assembly100 (example, the heat-generating components110). As such, thepower system130 can be serviced (example, replaced or repaired) independently of thePCB102 or thePCB104 and/orheat generating components110. By way of illustration, suppose for example thatpower system130 fails or otherwise needs replaced or upgraded. Thepower system130 can be disconnected and removed from thePCB104 without removing or replacing the heat-generatingcomponents110 and/or thePCBs102 and104. Alternatively, thethermal dissipation device120 could be simultaneously removed with thepower system130.
• ThePCB104 may be modular and replaceable. In some embodiments, thePCB104 is an independently-operable unit or module that can be constructed with standardized units or dimensions for flexibility and replaceability for use in theelectronic assembly100. Further, thePCB104 can be connected to or removed from the electronic assembly (example, thePCB102 and/or power system130) without connecting, removing, or replacing other components in the electronic assembly100 (example, the power system130). As such, thePCB104 can be serviced (example, replaced or repaired) independently of thePCB102 or thepower system130 and/orthermal dissipation device120. By way of illustration, suppose for example that thePCB104 fails or otherwise needs replaced or upgraded. ThePCB104 can be disconnected and removed from thePCB102 and/orpower system130 while thepower system130 andthermal dissipation device120 remain connected to thePCB102. Once thePCB104 is removed, heat-generatingcomponents110 could, for example, be repaired or replaced, and thePCB104 then re-attached or re-connected to thePCB102 and thepower system130.
• Once connected, thePCB102 is sandwiched between thePCB104 and thepower system130. Further, thePCBs102 and104 andpower system130 are spaced apart, parallel, and mechanically and electrically connected to form a vertical stacked-up configuration. As shown inFIGS. 1-3, theelectronic assembly100 comprises at least three different vertically stacked layers, with each layer being separated from the other layers. A first or top layer includes thePCB104; a second or middle layer includes thePCB102; and a third or bottom layer includes thepower system130. Thethermal dissipation device120 is disposed between the second and third layers and can, in some embodiments, form part of the third layer.
• In one exemplary embodiment, thethermal dissipation device120 substantially fills a volume of space that extends above a top surface of the heat-generatingcomponents110 and that extends underneath thepower system130 and above thePCB102. As shown for example inFIGS. 1 and 2, a portion of thetop side166 of thethermal dissipation device120 extends along all of or substantially all of the surface area (length x width) of anunderside168 of thepower system130.
• AlthoughFIGS. 1-3 illustrate thePCB104,power system130, andthermal dissipation device120 as being one-piece, embodiments in accordance with the invention are not limited to being one-piece, integrally formed, or the like. ThePCB104,power system130, and thermal dissipation device can be formed as separate, distinct units or pieces that, for example, couple together or that electrically and/or mechanically communicate with each other.
• Thethermal dissipation device120 can directly or indirectly attach to or contact with various layers and/or electrical components (such as thepower system130, the heat-generatingcomponents110, and/orPCBs102 and104). For example, thethermal dissipation device120 can directly contact thepower system130 so as to directly transfer or dissipate heat away from the power system. For example, heat can transfer from theunderside168 of thepower system130 to thetop side166 of thethermal dissipation device120. Further, thethermal dissipation device120 can directly contact the heat-generatingcomponents110 so as to directly transfer or dissipate heat away from the heat-generating components.
• As best shown inFIGS. 1 and 2,thermal dissipation device120 comprises a unitary or single member. Embodiments in accordance with the invention, though, can utilize a wide variety of types and number of thermal dissipation devices. For example, thethermal dissipation device120 can comprise a plurality of individual, separate members. Some examples of various embodiments that can be utilized in conjunction with theelectronic assembly100 are shown inFIGS. 4A-4C.
• FIG. 4A shows an exemplary embodiment of aPCB102A and athermal dissipation device120A. ThePCB102A has plural (three shown) pass-thruholes150A, and the thermal dissipation device has plural (three shown)extensions160A. The pass-thru holes150A are shaped and sized to receive theextensions160A such that the extensions can pass through thePCB102A to contact heat-generating components (shown inFIGS. 1-3). As shown, the number, size, and shape of theextensions160A correspond to the number, size, and shape of pass-thru holes150A. In one exemplary embodiment, oneextension160A and one corresponding pass-thruhole150A can be provided for each heat-generating device (for example, each heat-generatingdevice110 onPCB104 shown inFIGS. 1-3).
• FIG. 4B shows another exemplary embodiment of aPCB102B and athermal dissipation device120B. ThePCB102B has plural (four shown) pass-thruholes150B, and thethermal dissipation device120B has plural (four shown)extensions160B. Theextensions160B are separate and removable from a body portion180B of thethermal dissipation device120B. The pass-thruholes150B are shaped and sized to receive theextensions160B such that the extensions can pass through thePCB102B to contact heat-generating components (shown inFIGS. 1-3). As shown, the number, size, and shape of theextensions160B correspond to the number, size, and shape of pass-thruholes150B. In one exemplary embodiment, oneextension160B and one corresponding pass-thruhole150B can be provided for each heat-generating device (for example, each heat-generatingdevice110 onPCB104 shown inFIGS. 1-3).
• FIG. 4 C shows another exemplary embodiment of aPCB102C and athermal dissipation device120C. ThePCB102C has a single pass-thruhole150C, and thethermal dissipation device120C has asingle extension160C. Theextension160C could be integral with abody portion180C or separate and removable from thebody portion180C of thethermal dissipation device120C. The pass-thruhole150C is shaped and sized to receive theextension160C such that the extension can pass through thePCB102C to contact heat-generating components (shown inFIGS. 1-3). As shown, the number, size, and shape of theextension160C correspond to the number, size, and shape of pass-thruholes150C. In one exemplary embodiment, oneextension160C and one corresponding pass-thruhole150C can be large enough to cover plural adjacent heat-generating devices (for example, plural heat-generatingdevices110 onPCB104 shown inFIGS. 1-3).
• Embodiments in accordance with the present invention are not limited a specific location, number, size, or shape of pass-thru holes. For example, the pass-thru holes can be provided on a periphery or edge of a PCB or power system.
• Various different electronic components, layers, and PCBs can be combined into different embodiments in accordance with the invention.FIGS. 5 and 6 illustrate one such exemplary embodiment aselectronic assembly500. In this figure, the processor circuit board can include (among other electrical components) processors, memories, and ASICs. For example, the processor circuit board can have numerous electronic heat-generating components, such as plural processors, an ASIC, and memory, to name a few examples. The processor circuit board is coupled, via a connector, to a system board. The system board is sandwiched between a power board and the processor circuit board in a vertical stacked-up configuration. A thermal solution is positioned between the power and system boards and directly above one surface of the power board to dissipate heat away from the power board. The thermal solution has a plurality of feet or extensions that extend through pass-thru holes in the system board. These feet contact the processors, ASIC, and memory to conduct and dissipate heat, via direct heat exchange, from the processors, ASIC, and memory. A power connector extends through a pass-thru in the system board to connect the power board to the processor circuit board. The power board can include power controls that can, for example, provide power control functionality for the power board.
• FIGS. 7 and 8 show another embodiment of anelectronic assembly700 wherein like reference numerals are used with common elements fromFIGS. 1-3.Electronic assembly700 includes apower system730 disposed between a firstthermal dissipation device120 and a secondthermal dissipation device720. Thepower system730 includes at least one pass-thruhole750. Further, the secondthermal dissipation device720 includes at least one protrusion orextension760 that is shaped and size to pass through the pass-thruhole750 and contact thethermal dissipation device120. Exemplary embodiments for pass-thru holes and extensions are discussed in connection withFIGS. 1-3 and4A-4C.
• AlthoughFIGS. 7 and 8 illustrate two separatethermal dissipation devices120,720, embodiments in accordance with the invention are not limited to two separate devices. For example, thethermal dissipation devices120,720 could be combined into one single thermal dissipation device. As an illustration, thethermal dissipation device120 could extend through the pass-thruhole750 of thepower system730. As another example, thethermal dissipation devices120,720 could be formed from numerous separate components.
• Heat can be conducted, exchanged, and dissipated through plural layers, devices, components, and/or modules in a variety of embodiments in accordance with the invention. For illustrations purposes, some of these exemplary embodiments are discussed in connection withFIGS. 7 and 8.
• As one example, heat can be evacuated or dissipated for a module or layer from a common exit location or common surface area. As shown inFIGS. 7 and 8, heat generated by the heat-generatingcomponents110 can be vertically conducted or transferred through the pass-thruholes150 of both thePCB102 and pass-thruhole750 of thepower system730 and thereafter dissipated into the air or environment at a top surface of the electronic assembly. For instance, as heat is generated from heat-generatingcomponents110, the generated heat is transferred from a top surface of the heat-generatingcomponents110 toextensions160 ofthermal dissipation device120. This heat travels through theextensions160, into thebody162, throughextension760, and exits asurface770 ofthermal dissipation device720. In this manner, heat is transferred from one end or side of theelectronic assembly100 to another end or side of the electronic assembly.
• Thesurface770 of thethermal dissipation device720 can be enhanced to facilitate heat dissipate and/or heat exchange. For example, thesurface770 can include fins, rods, pins, or other features. Further yet, the surface of any thermal dissipation device can be formed as a separate body or unit that mounts to the body of the thermal dissipation device.
• AlthoughFIGS. 7 and 8 illustrate heat conduction or direct heat exchange to dissipate heat (example, heat being transferred from the heat-generatingcomponents110, vertically through thePCB102 andpower system730 and through the twothermal dissipation devices120,720 and exiting through a surface of the thermal dissipation device720), heat can be dissipated in other ways as well. For example, one or both of thethermal dissipation devices120,720 can be an active device that produces an airflow. For purposes of illustration only, theelectronic assembly700 is shown with an airflow direction as indicated with arrows (the airflow being into the page and indicated with a circle and “X”). The airflow can be provided, for example, with a fan or other device positioned within theelectronic assembly700 or within or proximate thethermal dissipation devices120,720. For example, the airflow can be generated from a system fan. The airflow is directed in a pathway that is parallel to thePCBs102 and104 andpower system730. Airflow, however, is not limited to any particular direction. In some embodiments, for example, the airflow can be directed in a perpendicular direction with respect to thePCB102,PCB104,power system130, and/or heat-generatingcomponents110. A primary airflow can thus be directed at, above, or below thePCBs102 and104, the heat-generatingcomponents110, thepower system730, and/or thethermal dissipation devices120,720. Further, the primary airflow can be simultaneously directed to several different components/layers (such as thePCBs102 and104, the heat-generatingcomponents110, thepower system730, and/or thethermal dissipation devices120,720) or exclusively at individual components/layers. Thus, the same airflow can be used to cool or dissipate heat simultaneously from multiple layers and/or components or solely from a single layer and/or component.
• The airflow can be utilized to assist or augment heat transfer or dissipation. In this regard, theelectronic assembly700 can utilize one or both of heat conduction and/or an airflow pathway to dissipate heat. The combinations of heat conduction and airflow to dissipate heat are numerous. By way of illustration, thethermal dissipation device120 can directly contact the heat-generatingcomponents110 to conduct heat away from these components. At the same time, either or boththermal dissipation devices120,720 could generate or be exposed to an airflow that is directed at both thePCBs102,104 and the thermal dissipation devices. For example, this airflow could be utilized to cool the PCB104 (including heat-generating components) and thethermal dissipation device120 as the thermal dissipation device conducts and dissipates heat away from the heat-generatingcomponents110. Thus, the same thermal dissipation device simultaneously dissipates heat away fromPCBs102 and104, heat-generatingcomponents110, andpower system730.
• Thermal dissipation devices can utilize a remote heat exchanger (RHE). An RHE enables the thermal dissipation device to be remote from the heat-generating device (such asPCB104, heat-generatingcomponents110, and/or power system730). For example, heat can be transferred from the heat-generating device to an attachment block having a heat pipe. Further, the heat pipe can be integral to the module or any portion of the electronic system (example, the thermal dissipation device) and extend outwardly from the electronic system to a remote heatsink. Alternatively, the heat pipe can attach to a surface of the module or system (example a surface of a thermal dissipation device) and then extend to a remote heatsink. The heat pipe, for instance, can be a hollow copper pipe containing a fluid and wicking material. Through a process of vaporization and re-condensation, heat travels through the heat pipe to a heat exchanger, such as a finned heat sink. Localized airflow can be used to evacuate the heat to the environment.
• Looking toFIGS. 7 and 8 as examples, thethermal dissipation device720 could be a cold-plate and/or utilize heat dissipation via heat pipes or liquids. The “In” and “Out” arrows signify liquid-in and liquid-out, respectively. As such, thethermal dissipation device720 can be coupled to a pump and/or a heat exchanger to circulate a cooling liquid through the thermal solution to cool any one or combination of PCBs, heat-generating components, power system, etc. Thethermal dissipation device720 can be utilized in conjunction with one or both of the heat conduction and/or airflow cooling techniques discussed herein. As one example, thethermal dissipation device120 ofFIGS. 1-3 can include a separate piece or unit on the top surface166 (such as thethermal dissipation device720 discussed in connection withFIGS. 7 and 8). This separate piece could be a liquid cold plate, evaporator, refrigerator, heatsink, or other device or technology known in the art.
• As discussed herein, the thermal dissipation device can comprise numerous different embodiments in accordance with the invention.FIGS. 9A to9D illustrate further examples of thermal dissipation devices that can be utilized in conjunction with the electronic assembly. These examples illustrate a single airflow, but multiple airflows with various directions are within embodiments in accordance with the invention.
• FIG. 9A shows athermal dissipation device900A having a plurality ofopenings910A. Theopenings910A extend through both abase portion920A andplural extensions930A. Further, theopenings910A can have a variety of configurations and/or shapes and include slots, holes, etc. and can be formed from adjacent pins, rods, fins, etc. Theopenings910A enable an airflow (the airflow being into the page and indicated with a circle and “X”) to pass through thethermal dissipation device900A.
• FIG. 9B shows another example of athermal dissipation device900B having a plurality ofopenings910B. The openings extend through both abase portion920B andplural extensions930B. As shown, theextensions930B are separate and removable from thebase portion920B. Further, theopenings910B can have a variety of configurations and/or shapes and include slots, holes, etc. and can be formed from adjacent pins, rods, fins, etc. Theopenings910B enable an airflow (the airflow being into the page and indicated with a circle and “X”) to pass through thethermal dissipation device900B.
• FIG. 9C shows another example of athermal dissipation device900C having a plurality ofopenings910C.Extensions930C extend upwardly from abase portion920C. Further, theopenings910C can have a variety of configurations and/or shapes and include slots, holes, etc. and can be formed from adjacent pins, rods, fins, etc. Theopenings910C enable an airflow (the airflow being into the page and indicated with a circle and “X”) to pass through thethermal dissipation device900C.
• FIG. 9D shows another example of athermal dissipation device900D having a plurality ofopenings910D.Extensions930D are separate and removable from abase portion920D. Theseextensions930D extend through holes oropenings940D in thebase portion920D. Theopenings910D can have a variety of configurations and/or shapes and include slots, holes, etc. and can be formed from adjacent pins, rods, fins, etc. Theopenings910D enable an airflow (the airflow being into the page and indicated with a circle and “X”) to pass through thethermal dissipation device900D.
• Embodiments in accordance with the present invention can utilize a modular connective architecture. If a particular electronic component (including PCBs) or device fails or otherwise needs to be replaced, the electronic component can be removed from the module or the electronic assembly and replaced with a new and/or different component. As such, the electronic assemblies can be constructed with standardized electronic components and/or dimensions to enable flexibility and variety of use and exchange of components. Looking toFIGS. 5 and 6 as an example, if the thermal solution fails or needs to be replaced, the thermal solution and power board can be disconnected and/or removed from the electronic assembly. Thereafter, a new and/or different thermal solution can be connected to the electronic assembly and the power board attached to the thermal solution. As another example, if the power board fails or needs to be replaced, the power board can be disconnected or uncoupled from the power connector and removed from the electronic assembly while the processor circuit board and system board remain mechanically connected. The thermal solution can be removed with the power board or remain connected to the electronic assembly. A new and/or different power circuit board can thereafter be connected to the power connector and utilized with the electronic assembly. As such, expensive heat-generating components (such as processors, memories, ASICs, etc.) can remain unchanged and do not need to be removed or replaced when the power board and/or thermal solution are removed or replaced.
• As used herein, the term “module” means a unit, package, or functional assembly of electronic components for use with other electronic assemblies or electronic components. A module may be an independently-operable unit that is part of a total or larger electronic structure or device. Further, the module may be independently connectable and independently removable from the total or larger electronic structure.
• The configuration or arrangement of electronic components, layers, and/or modules shown in the figures saves weight, space, and costs since the components and/or layers are efficiently spaced and additional thermal dissipation devices are not required. For example, embodiments in accordance with the present invention can utilize a variety of modules. Looking toFIGS. 1-3, thePCB104 can be a processor module that includes heat-generating components110 (such as plural separate processors, an ASIC, and memory all on the same board or card). As another example, thepower system130 can form a power system module that may or may not include thethermal dissipation device120. The power system module can vertically stack and connect or coupled, viaconnector140, to thePCB104. Thethermal dissipation device120 can be disposed on one surface of thepower system130. Together, the power system module, connector, processor module, and thermal dissipation device form a processor/power module that can be removably connected to, for example, thePCB102.FIGS. 1-3, for example, show such a processor/power module connected, viaconnectors106A and106B, toPCB102. Further, thepower system130 can provide a power source that is proximally close to the load (example the PCB104) in order to minimize noise and optimize step load performance.
• In one exemplary embodiment, the processor/power module can comprise two halves that mechanically and electrically connect or couple together. A first half includes the power system module, shown for example as190 inFIG. 1. The power system module can include thepower system130 with or without thethermal dissipation device120. A second half includes the processor module, shown for example as192 inFIG. 1. The processor module includes the heat-generatingcomponents110. In order to assemble the processor/power module, the first half (i.e., the power system module) is coupled or connected to a first side of thePCB102. A second half (i.e., the processor module) is coupled or connected to a second side (opposite the first side) of thePCB102. Various connectors can be used to couple the first and second halves to thePCB102. As best shown inFIGS. 1-3, thePCB102 is sandwiched between the processor/power module. Further, as shown, when the processor/power module is assembled, the heat-generatingcomponents110 are positioned inside a housing of the processor/power module itself. This configuration increases packing density of the module. Further, as noted herein, pass-thru holes in thePCB102 enable heat to transfer from the first half to the second half. Further, these pass-thru holes can enable the first and second halves to mechanically and electrically coupled or connect together.
• The processor/power module can have various configurations. For illustration purposes (as shown inFIGS. 1-3), the processor/power module has a general rectangular configuration. A top surface is formed from one outer surface of thePCB104, and a bottom surface is formed from one outer surface of thepower system130. Theconnector140 forms one end of the module, whileconnectors106A,106B and an end portion of thethermal dissipation device120 forms another end of the module.
• The processor/power module is also adaptable to have various components and layers arranged inside the module. For example, the processor module could include a thermal dissipation device. In this embodiment, the processor thermal dissipation device would be disposed between thePCB102 and thePCB104. Further, this processor thermal dissipation device could extend through one or more pass-thru holes in thePCB102. A second thermal dissipation device could be disposed between thePCB102 and thepower system130. The processor thermal dissipation device and the second thermal dissipation device could exchange of conduct heat between the devices. Alternatively, the processor thermal dissipation device could also extend or be disposed between thePCB102 andpower system130. In yet another embodiment, the processor thermal dissipation device could extend through a pass-thru hole in the power system. One skilled in the art will appreciate that various other embodiments exist to arrange the components and layers within the module.
• In order to facilitate modularity within the electronic assembly, various removable connections between electronic components can be utilized. By way of example, such connections include, but are not limited to, land grid arrays (LGAs), pin grid arrays (PGAs), plugs (example, male), sockets (example, female), pins, connectors, soldering, or other removable or disconnectable attachments.
• A module can include a variety of different heat exchanging or heat transferring interfaces (such as the interface between two thermal dissipation devices or the interface between a thermal dissipation and a PCB or a heat-generating component). These interfaces can be adapted to enhance heat conduction or heat exchange. For example, the interfaces can include conductive resins, tapes, adhesives, gap pads, greases, or any other device or compound that facilitates or improves heat conduction.
• Embodiments in accordance with the invention can be utilized in a wide variety of different methods and embodiments. For example, embodiments in accordance with the present invention can utilize embodiments taught in U.S. patent application Ser. No. 10/800,837 filed Mar. 15, 2004, entitled “Multi-Processor Module” and incorporated herein by reference. As another example, an exemplary method can comprise connecting plural heat-generating components to a first circuit board. The heat-generating components can include plural separate processors (example processors formed on separate dies), ASICs, memories, and other devices. A power system can be connected in a vertical stacked-up configuration to the first circuit board. One or more power connectors can couple the power system to the first circuit board. A thermal dissipation device is disposed above or along one surface of the power system and between the power system and first circuit board. The thermal dissipation device thermally dissipates heat away from both the first circuit board (including the heat-generating components) and the power system. The thermal dissipation device can simultaneously dissipate heat (for example via a direct heat exchange) from both the first circuit board (including the heat-generating components) and the power system. Additionally, the thermal dissipation device can comprise, utilize, or generate a liquid exchange flow or a flow of air in an airflow pathway. The airflow pathway can be directed to any one of or any combination of the first circuit board, the power system, the thermal dissipation device, and/or the heat-generating components. Further, a liquid flow can be utilized to remove, dissipate, or transfer heat away from PCBs, the power system, or heat-generating components. Together, the power system, first circuit board, thermal dissipation device, and heat-generating components form a processor/power module. This module can be connected to a second circuit board (such as a system board or motherboard) and arranged, for example, in a vertically stacked-up configuration. For example, a first half of the processor/power module can connect or couple to one side of the second circuit board, and a second half of the processor/power module can connect or couple to a second side (opposite the first side) of the second circuit board. The second circuit board includes one or more pass-thru holes for receiving portions of the first and/or second halves. The processor/power module is removably connectable to the second circuit board. The pass-thru holes also enable heat to transfer through the second circuit board and from one half to the other half of the module. The components with in the processor/power module (such as the thermal dissipation device, the PCB, the processors, the memory, the ASIC, and/or the power system) can be individually or jointly repaired or replaced. The revised power/processor module can then be re-connected to the second circuit board.
• One skilled in the art will appreciate that a discussion of various methods should not be construed as steps that must proceed in a particular order. Additional steps may be added, some steps removed, or the order of the steps altered or otherwise changed.
• While the invention has been disclosed with respect to a limited number of embodiments, those skilled in the art will appreciate, upon reading this disclosure, numerous modifications and variations. It is intended that the appended claims cover such modifications and variations and fall within the true spirit and scope of the invention.

Claims (20)

1. An electronic module connectable to a system board with pass-thru holes, the electronic module comprising:

a first portion coupled to one side of the system board and having a printed circuit board (PCB) with plural processors; and

a second portion coupled to a second, opposite side of the system board, having a power system board electrically coupled to the first portion, and having thermal dissipation device,

wherein the thermal dissipation device extends through at least one of the pass-thru holes.

2. The electronic module ofclaim 1 wherein the PCB forms one side of the electronic module, and the power system board forms a second side of the electronic module.

3. The electronic module ofclaim 1 wherein each processor is aligned with one of the pass-thru hole to receive a portion of the thermal dissipation device that extends through the pass-thru hole.

4. The electronic module ofclaim 1 wherein the thermal dissipation device directly contacts the plural processors and the power system for dissipating heat directly away from the plural processors and the power system.

5. The electronic module ofclaim 1 wherein the thermal dissipation device has plural extensions that extend through plural pass-thru holes of the system board.

6. The electronic module ofclaim 5 wherein the extensions conduct heat away from the plural processors.

7. The electronic module ofclaim 1 wherein heat generated by the processors is conducted, via the thermal dissipation device, from the first portion to the second portion.

8. The electronic module ofclaim 1 wherein heat generated by the processors is conducted through the at least one pass-thru hole and exited from the electronic module.

9. The electronic module ofclaim 1 wherein the thermal dissipation device substantially fills a volume of space formed between the PCB and the power system board.

10. A method, comprising:

connecting a first portion of an electronic module to one side of a printed circuit board (PCB) having at least one pass-thru hole;

connecting a second portion of the electronic module to a second, opposite side of the PCB such that a thermal dissipation device disposed between the first and second portions extends through the at least one pass-thru hole; and

aligning plural heat-generating devices in the first portion with plural pass-thru holes in the PCB.

11. The method ofclaim 10 further comprising dissipating heat, with the thermal dissipation device, from plural heat-generating devices located in the first portion to the second portion.

12. The method ofclaim 10 further comprising conducting heat from plural processors in the first portion through the at least one pass-thru hole.

13. The method ofclaim 10 further comprising providing DC power from the second portion to the first portion.

14. The method ofclaim 10 further comprising:

conducting heat, generated from a processor in the first portion, from the first portion to the second portion;

dissipating the heat from the second portion using a liquid cold plate.

15. The method ofclaim 10 further comprising:

aligning plural extensions on the thermal dissipation device with the plural pass-thru holes and the plural heat-generating devices.

16. The method ofclaim 10 further comprising:

providing DC power, via a power board in the second portion, to the first portion;

providing processing functionality from the first portion to the PCB;

dissipating heat from the first portion and through the at least one pass-thru hole.

17. An electronic module connectable to a system board with a pass-thru hole, the electronic module, comprising:

a circuit board having plural separate processors;

a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board; and

a thermal dissipation device disposed between the circuit and power boards for dissipating heat away from the processors, wherein the electronic module extends through the pass-thru hole and connects on two opposite sides of the system board.

18. The electronic module ofclaim 17 wherein the thermal dissipation device extends through the pass-thru hole to conduct heat away from the processors.

19. The electronic module ofclaim 17 wherein:

the electronic module has a rectangular configuration;

the pass-thru holes extends above two processors;

the thermal dissipation device dissipates heat, via a direct heat exchange, away from both the power board and the two processors.

20. The electronic module ofclaim 17 wherein the circuit board forms one side of the electronic module, the power board forms another side of the electronic module, and the system board passes through the electronic module between the circuit and power boards.

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