US20060108667A1 - Method for manufacturing a small pin on integrated circuits or other devices - Google Patents

Abstract

A method of forming a device comprises forming a structure with a side wall. A side wall spacer is formed on the side wall. The side wall spacer is etched according to a pattern to define the width of the side wall spacer. The width is sub-lithographic, including for example about 40 nanometers or less.

Description

RELATED APPLICATION DATA
• The benefit of U.S. Provisional Application No. 60/630,123; filed 22 Nov. 2004, entitled SIDE WALL ACTIVE PHASE CHANGE RAM AND MANUFACTURING METHOD, is hereby claimed.
PARTIES TO A JOINT RESEARCH AGREEMENT
• International Business Machines Corporation, a New York corporation; Macronix International Corporation, Ltd., a Taiwan corporation, and Infineon Technologies A.G., a German corporation, are parties to a Joint Research Agreement.
BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• The present invention relates to methods for manufacturing integrated circuits and other devices, and more particularly to methods for making very small pin-shaped structures.
• 2. Description of Related Art
• A need arises in integrated circuit manufacturing processes for making very small structures. For example, small elements comprising chalcogenide materials or other phase change materials can be caused to change phase by application of electrical current. This property has generated interest in using phase change materials to form nonvolatile memory circuits.
• One direction of development has been toward using small quantities of programmable resistive material, particularly in small pores. Patents illustrating development toward small pores include: Ovshinsky, “Multibit Single Cell Memory Element Having Tapered Contact,” U.S. Pat. No. 5,687,112, issued Nov. 11, 1997; Zahorik et al., “Method of Making Chalogenide [sic] Memory Device,” U.S. Pat. No. 5,789,277, issued Aug. 4, 1998; Doan et al., “Controllable Ovonic Phase-Change Semiconductor Memory Device and Methods of Fabricating the Same,” U.S. Pat. No. 6,150,253, issued Nov. 21, 2000.
• My U.S. Patent application Publication No. US-2004-0026686-A1 describes a phase change memory cell in which the phase change element comprises a side wall on an electrode/dielectric/electrode stack. Data is stored by causing transitions in the phase change material between amorphous and crystalline states using current. Current heats the material and causes transitions between the states. The change from the amorphous to the crystalline state is generally a lower current operation. The change from crystalline to amorphous, referred to as reset herein, is generally a higher current operation. It is desirable to minimize the magnitude of the reset current used to cause transition of phase change material from crystalline state to amorphous state. The magnitude of the reset current needed for reset can be reduced by reducing the size of the phase change material element in the cell and of the contact area between electrodes and the phase change material.
• Other applications for small structures arise in integrated circuit manufacturing, and it is desirable to provide new manufacturing techniques and structures satisfying this need.
SUMMARY OF THE INVENTION
• The present invention includes methods to form a narrow side wall spacer or pin. A method of forming a memory cell based on such a narrow side wall spacer or pin is described which comprises forming a stack comprising a first electrode, an insulating layer over the first electrode, and a second electrode over the insulating layer, with a side wall on at least the insulating layer of the stack. A side wall spacer comprising a programmable resistive material in electrical communication with the first and second electrodes is formed. The side wall spacer has a length extending from the first electrode to the second electrode along the side wall, a width generally orthogonal to the length, and a thickness determined by the thickness of a layer of programmable resistive material used to form the side wall spacer. The side wall spacer is formed by depositing a layer of programmable resistive material over the side wall of the stack, anisotropically etching the layer of programmable resistive material to remove it in areas away from the side wall, and selectively etching the programmable resistive material according to a pattern to define the width of the side wall spacer. In embodiments described herein, the width is less than 50 nanometers, and more preferably about 40 nanometers or less.
• In order to selectively etch the programmable resistive material according to a pattern to define a side wall spacer with such a narrow width, one technique includes forming an etch mask having a lithographic pattern to define a lithographic width, and then trimming the etch mask to provide a trimmed mask to define the pattern used for defining the width of the side wall spacer. In one example, the etch mask comprises a photoresist, which is etched anisotropically to form the trimmed mask using an oxygen based plasma etch. In another example, the etch mask comprises a hard mask defined using a lithographic process, which is etched to reduce its width to form the trimmed mask.
• The three dimensions that define the size of the active region in the phase change pin for the cell described herein are preferably less than 50 nanometers, and can all be less than the minimum feature size of the lithographic process applied to make the cell. The dimensions are defined in technology described herein, by the thin film thickness of phase change material, the inter-electrode dielectric thin film thickness, and the trimmed mask. As a result, the cell size (the volume of the phase change material) is very small (smaller than F³, where F is the minimum lithographic feature size for the process used to manufacture the memory cell). The resulting cell of phase change material comprises a narrow pin on the side wall of an electrode stack. The contact area between at least one of the top and bottom electrodes and the phase change material pin is also defined sub-lithographically by electrode layer thicknesses for the heights, and the photo-resist pattern trimming process for the width of the contacts. The small cell and small contact region allow implementation of a memory with very small reset current and low power consumption.
• A memory device is also described that includes a stack including a first electrode, an inter-electrode insulating member over the first electrode, and a second electrode over the inter-electrode insulating member. The stack has a side wall over at least the insulating member. A spacer comprising programmable resistive material on the side wall is in electrical communication with the first and second electrodes. The spacer has a length extending from the first electrode to the second electrode along the side wall on the insulating layer, which is generally orthogonal to the length and a thickness. The width and thickness of the spacer are less than 40 nanometers in embodiments of the technology described herein. The programmable resistive material comprises a phase change material, which is reversibly programmable.
• The method described herein for formation of the phase change material pin can be used to make a very small pin for other nano-technology uses on an integrated circuit or other device, using materials other than phase change materials, like metals, dielectrics, organic materials, semiconductors, and so on. The small dimension side wall pin can be formed on structures other than that used for the phase change memory cell described herein, such as structures comprising other types of stacks of thin films, such as stacks of thin film dielectrics, with and without an electrode layer for contact to the pin.
• Other aspects and advantages of the technology described herein can be understood with reference to the figures and the detailed description which follow.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 illustrates an embodiment of a side wall active pin phase change memory element.
• FIG. 2 is a schematic diagram for a memory array comprising phase change memory elements.
• FIG. 3 is a block diagram of an integrated circuit device including a thin film fuse phase change memory array and other circuitry.
• FIG. 4 is a cross-section of the final array structure for an embodiment of the invention.
• FIG. 5 is a cross-section of the structure after front-end-of-line processing and formation of electrode stack thin film layers.
• FIG. 6A andFIG. 6B show top and cross-sectional views respectively after electrode stack etching the structure fromFIG. 5.
• FIG. 7 shows phase change material thin film deposition on the structure ofFIG. 6B.
• FIG. 8A andFIG. 8B show top and cross-sectional views respectively after GST thin film spacer etching.
• FIG. 9 shows a cross-sectional view after dielectric fill layer formation.
• FIG. 10 shows a cross-sectional view after chemical mechanical polishing for planarization and exposure of the phase change material side wall.
• FIG. 11 shows a top view after formation of a photoresist pattern, and trimming for definition of phase change side wall pin width.
• FIG. 12A andFIG. 12B show top and cross-sectional views respectively after selective etching of the phase change material side wall to define a phase change side wall pin width dimension.
• FIG. 13 shows a top view after removal of the photoresist, with the resulting phase change material side wall pin.
• FIG. 14 shows a cross-sectional view after filling in the small seam left by removal of the phase change material side wall, and subsequent oxide deposition.
• FIG. 15 shows top and cross-sectional views after via formation and metallization for definition of the bit lines.
• FIG. 16 illustrates an embodiment in which the thin film phase change material side wall is partially etched.
• FIG. 17 illustrates a first stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 18 illustrates a second stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 19 illustrates a third stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 20 illustrates a fourth stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIGS. 21 and 22 illustrate cross-section and perspective views, respectively, of a fifth stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 23 illustrates a sixth stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 24 illustrates a seventh stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 25 illustrates an eighth stage in a representative process for manufacturing a small pin on an integrated circuit.
• FIG. 26 illustrates a small pin on made as described herein.
DETAILED DESCRIPTION
• The following detailed description is made with reference to the figures. Preferred embodiments are described to illustrate the present invention, not to limit its scope, which is defined by the claims. Those of ordinary skill in the art will recognize a variety of equivalent variations on the description that follows.
• FIG. 1 is a perspective view of a side wall activepin memory cell10. The cell includes a narrow side wall spacer, referred to as apin5 on a side wall of an electrode stack that includes athin film electrode6, and athin film electrode7 separated by an inter-electrodedielectric layer8. A dielectric9 overlies the electrode stack in the illustrated embodiment. Thepin5 consists of a programmable resistive material, such as a phase change material. Thepin5 has an active region, within which the phase change is confined, with a length L between afirst electrode6 and asecond electrode7 which is determined by the thickness of the inter-electrodedielectric layer8. The active region of thepin5 has a thickness T determined by the thickness of a thin film formed on the side wall of the electrode stack. The electrode stack is made using a photolithographic process or other type of lithographic process so that its width is about equal to the minimum feature size specified for the lithographic process. For advanced lithographic processes the width W of the electrode stack may be on the order of 90 nanometers. The active region of thepin5 has a width which is less than the minimum feature size for the lithographic process used to define the electrode stack. In embodiments described herein, the width of the active region of thepin5 is about 40 nanometers or less.
• As illustrated, the active region of thepin5 has a length L defined by a thin film thickness of theinter-electrode dielectric8, which in embodiments of the invention can range between about 20 and 50 nanometers. Likewise, the active region of thepin5 has a thickness T which is defined by the thin film thickness of the material used to form the side wall pin, which in embodiments of the invention can range between about 10 and 50 nanometers. Accordingly, all three dimensions of thepin5 are less than 50 nanometers in embodiments of the present invention, and more preferably about 40 or less nanometers.
• In embodiments of the invention, the programmable resistive material comprises a phase change material, such as Ge₂Sb₂Te₅or other materials described below. The volume of material within thepin5, in which the phase change is induced in the structure illustrated inFIG. 1, is therefore very small. For embodiments in which the length L, the width W and the thickness T of the active region of thepin5 are less than 40 nanometers, the volume of the active region is less than 64×10⁻²⁴m³. Accordingly, the magnitude of the reset current required for changing the phase is very small.
• Embodiments of the memory cell include phase change based memory materials, including chalcogenide based materials and other materials, for theside wall pin5. Chalcogens include any of the four elements oxygen (O), sulfur (S), selenium (Se), and tellurium (Te), forming part of group VI of the periodic table. Chalcogenides comprise compounds of a chalcogen with a more electropositive element or radical. Chalcogenide alloys comprise combinations of chalcogenides with other materials such as transition metals. A chalcogenide alloy usually contains one or more elements from column six of the periodic table of elements, such as germanium (Ge) and tin (Sn). Often, chalcogenide alloys include combinations including one or more of antimony (Sb), gallium (Ga), indium (In), and silver (Ag). Many phase change based memory materials have been described in technical literature, including alloys of: Ga/Sb, In/Sb, In/Se, Sb/Te, Ge/Te, Ge/Sb/Te, In/Sb/Te, Ga/Se/Te, Sn/Sb/Te, In/Sb/Ge, Ag/In/Sb/Te, Ge/Sn/Sb/Te, Ge/Sb/Se/Te and Te/Ge/Sb/S. In the family of Ge/Sb/Te alloys, a wide range of alloy compositions may be workable. The compositions can be characterized as Te_aGe_bSb_100−(a+b), where a and b represent atomic percentages that total 100% of the atoms of the constituent elements. One researcher has described the most useful alloys as having an average concentration of Te in the deposited materials well below 70%, typically below about 60% and ranged in general from as low as about 23% up to about 58% Te and most preferably about 48% to 58% Te. Concentrations of Ge were above about 5% and ranged from a low of about 8% to about 30% average in the material, remaining generally below 50%. Most preferably, concentrations of Ge ranged from about 8% to about 40%. The remainder of the principal constituent elements in this composition was Sb (Ovshinsky '112 patent, cols 10-11). Particular alloys evaluated by another researcher include Ge₂Sb₂Te₅, GeSb₂Te₄and GeSb₄Te₇(Noboru Yamada, “Potential of Ge—Sb—Te Phase-Change Optical Disks for High-Data-Rate Recording”, SPIE v.3109, pp. 28-37 (1997).) More generally, a transition metal such as chromium (Cr), iron (Fe), nickel (Ni), niobium (Nb), palladium (Pd), platinum (Pt) and mixtures or alloys thereof may be combined with Ge/Sb/Te to form a phase change alloy that has programmable resistive properties. Specific examples of memory materials that may be useful are given in Ovshinsky '112 at columns 11-13, which examples are hereby incorporated by reference.
• Phase change materials are capable of being switched between a first structural state in which the material is in a generally amorphous solid phase, and a second structural state in which the material is in a generally crystalline solid phase in its local order in the active channel region of the cell. These phase change materials are at least bistable. The term amorphous is used to refer to a relatively less ordered structure, more disordered than a single crystal, which has the detectable characteristics such as higher electrical resistivity than the crystalline phase. The term crystalline is used to refer to a relatively more ordered structure, more ordered than in an amorphous structure, which has detectable characteristics such as lower electrical resistivity than the amorphous phase. Typically, phase change materials may be electrically switched between different detectable states of local order across the spectrum between completely amorphous and completely crystalline states. Other material characteristics affected by the change between amorphous and crystalline phases include atomic order, free electron density and activation energy. The material may be switched either into different solid phases or into mixtures of two or more solid phases, providing a gray scale between completely amorphous and completely crystalline states. The electrical properties in the material may vary accordingly.
• Phase change materials can be changed from one phase state to another by application of electrical pulses. It has been observed that a shorter, higher amplitude pulse tends to change the phase change material to a generally amorphous state. A longer, lower amplitude pulse tends to change the phase change material to a generally crystalline state. The energy in a shorter, higher amplitude pulse is high enough to allow for bonds of the crystalline structure to be broken and short enough to prevent the atoms from realigning into a crystalline state. Appropriate profiles for pulses can be determined empirically, without undue experimentation, specifically adapted to a particular phase change alloy.
• In following sections of the disclosure, the phase change material is referred to as GST, and it will be understood that other types of phase change materials can be used. A material useful for implementation of a memory cell as described herein is Ge₂Sb₂Te₅.
• Useful characteristics of the programmable resistive material, like a phase change material include the material having a resistance which is programmable, and preferably in a reversible manner, such as by having at least two solid phases that can be reversibly induced by electrical current. These at least two phases include an amorphous phase and a crystalline phase. However, in operation, the programmable resistive material may not be fully converted to either an amorphous or crystalline phase. Intermediate phases or mixtures of phases may have a detectable difference in material characteristics. The two solid phases should generally be bistable and have different electrical properties. The programmable resistive material may be a chalcogenide material. A chalcogenide material may include GST. Alternatively, it may be one of the other phase change materials identified above.
• FIG. 2 is a schematic illustration of a memory array, which can be implemented as described herein. In the schematic illustration ofFIG. 2, acommon source line28, aword line23 and aword line24 are arranged generally parallel in the Y-direction.Bit lines41 and42 are arranged generally parallel in the X-direction. Thus, a Y-decoder and a word line driver inblock45 are coupled to the word lines23,24. An X-decoder and a set of sense amplifiers inblock46 are coupled to the bit lines41 and42. Thecommon source line28 is coupled to the source terminals ofaccess transistors50,51,52 and53. The gate ofaccess transistor50 is coupled to theword line23. The gate ofaccess transistor51 is coupled to theword line24. The gate ofaccess transistor52 is coupled to theword line23. The gate ofaccess transistor53 is coupled to theword line24. The drain ofaccess transistor50 is coupled to thebottom electrode member32 for side wallpin memory cell35, which hastop electrode member34. Thetop electrode member34 is coupled to thebit line41. Likewise, the drain ofaccess transistor51 is coupled to thebottom electrode member33 for side wallpin memory cell36, which hastop electrode member37. Thetop electrode member37 is coupled to thebit line41.Access transistors52 and53 are coupled to corresponding side wall pin memory cells as well onbit line42. It can be seen that thecommon source line28 is shared by two rows of memory cells, where a row is arranged in the Y-direction in the illustrated schematic. In other embodiments, the access transistors can be replaced by diodes, or other structures for controlling current flow to selected devices in the array for reading and writing data.
• FIG. 3 is a simplified block diagram of an integrated circuit according to an embodiment of the present invention. Theintegrated circuit74 includes a memory array55 implemented using side wall active pin phase change memory cells, on a semiconductor substrate. Arow decoder56 is coupled to a plurality ofword lines62, and arranged along rows in the memory array55. A column decoder63 is coupled to a plurality ofbit lines64 arranged along columns in the memory array55 for reading and programming data from the side wall pin memory cells in the array55. Addresses are supplied onbus58 to column decoder63 androw decoder56. Sense amplifiers and data-in structures in block59 are coupled to the column decoder63 viadata bus67. Data is supplied via the data-inline71 from input/output ports on theintegrated circuit75 or from other data sources internal or external to theintegrated circuit75, to the data-in structures in block59. In the illustrated embodiment, other circuitry is included on the integrated circuit, such as a general purpose processor or special purpose application circuitry, or a combination of modules providing system-on-a-chip functionality supported by the thin film fuse phase change memory cell array. Data is supplied via the data-outline72 from the sense amplifiers in block59 to input/output ports on theintegrated circuit75, or to other data destinations internal or external to theintegrated circuit75.
• A controller implemented in this example using biasarrangement state machine69 controls the application of biasarrangement supply voltages68, such as read, program, erase, erase verify and program verify voltages. The controller can be implemented using special-purpose logic circuitry as known in the art. In alternative embodiments, the controller comprises a general-purpose processor, which may be implemented on the same integrated circuit, which executes a computer program to control the operations of the device. In yet other embodiments, a combination of special-purpose logic circuitry and a general-purpose processor may be utilized for implementation of the controller.
• FIG. 4 depicts a cross-section of a plurality of side wall active pin phase change random access memory cells100-103. The cells100-103 are formed on asemiconductor substrate110. Isolation structures such as shallow trench isolation STIdielectric trenches111 and112 isolate pairs of rows of memory cell access transistors. The access transistors are formed bycommon source region116 in thesubstrate110, and drainregions115 and117 in thesubstrate110. Polysilicon word lines113 and114 forms the gates of the access transistors. Thedielectric fill layer118 is formed over the polysilicon word lines113,114.Contact plug structures141 and120 contact individual access transistor drains, andcommon source line119 contacts source regions along a row in the array. Thecommon source line119 contacts thecommon source region116. Theplug structure120 contacts abottom electrode121 ofcell101. Thecell101, likecells100,102 and103, includes a thinfilm bottom electrode121, a thin filminter-electrode dielectric layer122, a thinfilm top electrode123, and aside wall pin124 comprising GST or another phase change material. Adielectric fill layer127 overlies the cells100-103. Tungsten plug126 contacts thetop electrode123. A patterned metallayer providing contacts129,130,131,132 overlies thedielectric fill layer127. Typically the contacts129-132 are part of a single bit line extending to decoding circuits as can be seen with reference toFIG. 2. Athin oxide layer125 is shown overlying thetop electrode123. Thelayer125 is used for process margin as described below.
• In representative embodiments, the patterned metal layer (contacts129-132) comprises copper metallization. Other types of metallization, including aluminum and aluminum alloys, could be utilized as well. The top and bottom electrodes (e.g.121,123) comprise TiN or TaN with a thickness of 10 to 30 nm. Alternatively, the electrodes may be TiAlN or TaAlN, or may comprise one or more elements selected from the group consisting of Ti, W, Mo, Al, Ta, Cu, Pt, Ir, La, Ni, Ru and O. The inter-electrode insulating layer may be silicon oxide, silicon oxynitride, silicon nitride, Al₂O₃, other low K dielectrics, or an ONO or SONO multi-layer structure. Alternatively, the inter-electrode insulating layer may comprise one or more elements selected from the group consisting of Si, Ti, Al, Ta, N, O, and C. The inter-electrode thickness may be 10 to 200 nm, and more preferably 50 nanometers or less. The second electrode may be TiN or TaN.
• FIG. 5 illustrates astructure99 after front-end-of-line processing, forming the standard CMOS components in the illustrated embodiment corresponding to the word lines, the source line, and the access transistors in the array shown inFIG. 2. InFIG. 5,source line119 overlies dopedregion116 in the semiconductor substrate, where the dopedregion116 corresponds with the source terminal of a first access transistor on the left in the figure, and of a second access transistor on the right in the figure. In this embodiment, thesource line119 extends to the top surface of thestructure99. In other embodiments the source line does not extend all the way to the surface.Doped region115 corresponds with the drain terminal of the first access transistor. A wordline including polysilicon113, and silicide cap (not shown), acts as the gate of the first access transistor.Dielectric layer118 overlies thepolysilicon word line113. Plug120 contacts dopedregion115, and provides a conductive path to the surface of thestructure99 for contact to a memory cell electrode as described below. The drain terminal of the second access transistor is provided by dopedregion117. A word line includingpolysilicon line114, and the silicide cap (not shown) acts as the gate for the second access transistor. Plug141 contacts dopedregion117 and provides a conductive path to the top surface of thestructure99 for contact to a memory cell electrode as described below.Isolation trenches111 and112 separate the two-transistor structure coupled to theplugs120 and141, from adjacent two-transistor structures. Thestructure99 illustrated inFIG. 5 provides a substrate for formation of memory cell components, as described in more detail below.
• After formation of theplugs120,141 andsource line119 for thestructure99, a multilayer, thin film structure is formed including bottom electrodethin film150, top electrodethin film152,inter-electrode dielectric151, and protective top dielectric153. Thebottom electrode film150 has a thickness less than 50 nanometers, and preferably in the range of 10 to 30 nanometers. Thetop electrode film152 has a thickness less than 50 nanometers, and preferably in the range of 10 to 30 nanometers, and can be different than that of the bottom electrode film. For example, the thickness of thetop electrode film152 can be slightly greater than that of the bottom electrode, in order to improve process margin for reliable contacts using tungsten plug technology and the like. The top dielectric153 provides process margin for use of chemical mechanical polishing for planarization, variations in side wall spacer etching, and the like. Alternative embodiments without the top dielectric153 might be implemented.
• FIG. 6A shows a mask pattern in top view including afirst rectangle155 and asecond rectangle156 for etching the multilayer thin film structure ofFIG. 5, to form the electrode stacks60,65, as shown in cross-section inFIG. 6B. Theelectrode stack60 includes thebottom electrode121,inter-electrode dielectric122, and thetop electrode123. Theelectrode stack60 hasside wall61. Likewise, theelectrode stack65 hasside wall66. Reactive ion etching REI is utilized in order to establishside walls61,66 as vertical as possible. Although not shown in the diagram, the reactive ion etching RIE may over-cut into thedielectric fill layer118. In a representative process the over-cut is about 20 nanometers. BCl₃and/or Cl₂based recipes for the processes can be used.
• FIG. 7 illustrates a structure after depositing, by sputtering for example, aconformal layer170 of GST, or other programmable resistive material, over thestacks60,65. GST can be deposited using sputtering without collimation at about 250 degrees C. This results in a thin film having a thickness on the top of the electrode stacks of about 60 to 80 nanometers, a thickness on the side walls of about 20 to 30 nanometers, and a thickness between the stacks of about 60 to 80 nanometers, when using Ge₂Sb₂Te₅as the phase change material. Various embodiments of the process can sputter the entire wafer to thickness of 40 to 100 nanometers on the flat surfaces.
• FIG. 8A illustrates the results of side wall etching in plan view, by an etching processes which remove the GST layer from the flat surfaces, and leaveside walls171 onstack60 andside walls172 onstack65, completely surrounding thestacks60,65. Anisotropic Cl₂and/or BCl₃recipe RIE processes can be used.FIG. 8B shows theside walls171 and172 in cross-section. The side walls have tops slightly below the surface of thetop dielectric layer160, due to slight over-etching to ensure total removal from thesurface173 of thestructure99.
• FIG. 9 illustrates a dielectric fill-in process. The process involves formation of a low-temperature liner oxide, a silicon nitride layer or silicon oxide layer (not shown), using a process temperature less than about 200 degrees C., over the phase change material side walls. One suitable process is to apply silicon dioxide using plasma enhanced chemical vapor deposition PECVD. After formation of the liner, thedielectric fill180 is implemented using a higher temperature process such as high-density plasma HDP CVD of silicon dioxide or other similar material.
• As illustrated inFIG. 10, an oxide chemical mechanical polishing CMP process is applied to planarize the structure, and to expose the tops181,182 of theGST side walls171,172. The top dielectric layer on the electrode stack ensures that the CMP does not touch the top electrode material, such as TiN, and protects it from following RIE processes or other etching steps.
• FIG. 11 illustrates photoresist pattern trimming for the purpose of forming a sub-lithographic mask to trim theside walls171,172. A photo resist pattern is formed using lithographic techniques involving transferring a pattern from a mask or set of masks to the photoresist layer, including arectangular extension185 over thestack60 and arectangular extension186 over thestack65 as shown in dotted line outline. The width W1 of theextensions185,186 after development of the photoresist, is close to the minimum feature size for the lithographic process utilized to form thepattern extension185,186. Next, the width W1 of theextensions185,186 is reduced to sub-lithographic width W2 by photoresist trimming to leave a narrow trimmedmask187,188. For example, the photoresist is etched anisotropically using an oxide plasma to trim the width and thickness of the patterned photoresist, down to a width W2 less than 50 nanometers in exemplary embodiments, and to width W2 of for example about 40 nanometers in a 0.2 micron (200 nanometer) minimum feature size lithographic process environment.
• In an alternative embodiment, a hard mask layer (not shown), such as a low temperature deposited layer of SiN or SiO₂, can be put between the photoresist pattern and the surface of thestacks60,65, to prevent etching damage of the cell, if the photoresist is not thick enough after the trimming process, or selective etching of the GST and the hard mask is improved by the hard mask.
• FIG. 12A illustrates side wall cell width etching in plan view according to the trimmedmask187,188, using for example a chlorine based reactive ion etch so that thedielectric fill180 is not etched. The etch removes the exposed GST, leaving a narrowside wall pin124 shown in cross-section inFIG. 12B, on the electrode stack. Aseam190 around thestack60 and thestack65 is left in thedielectric layer180, which preferably extends to thetop surface173 of thestructure99 with complete removal of the GST. In embodiments of the process, all the GST in theseam190 need not be removed. Rather it is sufficient that a significant portion of the GST in theseam190 is removed, so that current between the bottom and top electrodes is concentrated in a narrow pin on the inter-electrode dielectric layer of the stack.
• FIG. 13 illustrates the next step in the process in plan view, which involves removal of the trimmed photoresist mask (187,188) and hard mask layer (if any). Theside wall pin124 onstack60 andside wall pin124A onstack65 have a sub-lithographic width W on the order of 40 nanometers or less in embodiments of the process.
• FIG. 14 illustrates the small seam fill-in and oxide deposition step. The small seams190 (FIG. 13B) left by the removal of the side walls can be filled with electrical and/or thermally insulatingfills193,194, using atomic layer deposition. In representative embodiments, atomic layer deposition is used to deposit dielectric material such as AlO₂, HfO₂and the like. In other embodiments, the seams can be filled by spin coating silicon oxide using inorganic spin on glass or “low K” material. In an alterative, the seams are sealed to form a void that is substantially evacuated, to provide good thermal isolation for the cells. Next, a top oxide deposition covers the electrode stacks with alayer195 of dielectric, which is planarized in preparation for subsequent metallization. The top oxide layer is preferably formed by PECVD, or other lower temperature process.
• FIG. 15 shows via formation and metallization for bit lines and contacts to the memory cells. Vias are etched in thelayer195 and filled with tungsten or other conductor material to formplugs196 and197 making contact to thetop electrode layer123 instack60 andtop electrode layer123A instack65. A patternedmetal layer198 provides bit lines extending in the plane of the drawing to decoding circuits. As described above, theplugs120 and141 provide contacts between the respective bottom electrodes of thestacks60 and65, to thedrains115 and117 of the access transistors. The word lines113,114 are formed by the polysilicon gates on the access transistors. The common source dopedregion116, andsource line119, provides for sensing current flow from the bit lines through the memory cells, to the access transistor and down the common source line.
• FIG. 16 shows a cross-section of an electrode stack, such asstack60, after deposition of the GST layer side wall etching, in an alternative embodiment, in which the GST layer is only partially etched around the periphery of the electrode stack, leaving aresidual layer203 in the bottom of the seam (190, seeFIG. 12B) around the stack. In the embodiment ofFIG. 16, thepin201 has a sub-lithographic width where it contacts thetop electrode layer202, extending into the inter-electrode dielectric layer, so that current flow is concentrated in thenarrow region210 of the phase change material pin.
• The phase change material pin described above, and the process for making it, are representative of technologies using nano-scale structures as described herein.FIGS. 17-25 illustrate a sequence of stages in another representative process for making a small pin.FIG. 17 illustrates a substrate that comprises asilicon wafer300 having afirst layer301 of material and a second layer302 of material formed thereon. In the illustrated example, thefirst layer301 of material comprises “material B” and the second layer302 of material comprises “material A,” wherein the two materials are selected so that they can be selectively etched. Representative materials include silicon nitride and silicon dioxide in integrated circuit, flat panel display and related manufacturing processes. Representative thicknesses for thefirst layer301 of material range from about 50 to about 500 nanometers, and more specifically can be around 200 nanometers of the silicon nitride for the example shown. Representative thicknesses for the second layer302 of material likewise range from about 50 to about 500 nanometers in some practical examples, and more specifically can be about 220 nanometers of silicon dioxide for the example shown.
• FIG. 18 illustrates a second stage in the representative process. In this stage, the second layer302 of material is etched according to a pattern, down to thesurface307 of thefirst layer301 of material, leaving astructure303 with aside wall305 in the second layer302 of material and astructure304 with aside wall306 in the second layer302 of material.
• FIG. 19 illustrates a third stage in the representative process. In this stage, alayer308 of sidewall material is formed over thestructures303,304 and thesurface307 of thefirst layer301 of material, and conformal with theside walls305,306 in the second layer302 of material. The sidewall material comprises a phase change material as described above in one embodiment. In other embodiments, the sidewall material comprises a metal, such as aluminum, tungsten, copper, titanium, titanium nitride, tantalum, tantalum nitride, gold, and platinum and other metals, metal compounds and metal alloys. In other embodiments, the sidewall material comprises a semiconductor, such as silicon, germanium, gallium nitride, and other compounds. In other embodiments, the sidewall material comprises a non-metal, such as aluminum oxide, titanium oxide, hafnium oxide, or other high-K, and thermally and electrically insulating materials. Materials which can be used for the sidewall material include conductors, semiconductors, and insulators. Materials used for the side wall material can be crystalline, polycrystalline and amorphous materials. Materials used for the sidewall may be active materials such as used for memory elements, transistor gates, laser diodes, quantum well devices and the like. The thickness of thelayer308 of sidewall material depends on the particular application. In representative structures, the sidewall material on theside walls305,306 ranges from about 10 nanometers to about 50 nanometers. In other structures, greater or lesser thicknesses of the sidewall material may be applied.
• FIG. 20 illustrates a fourth stage in the representative process. In this stage, afill layer309 is formed over thelayer308 of the sidewall material. The material used for thefill layer309 may comprise “material A,” or silicon dioxide in this example. In alternative systems, the material used for thefill layer309 is different than “material A,” including for example a material that is the same as “material B.” The material used for thefill layer309 is preferably suitable for an etch back and planarization process used in subsequent processing as described below.
• FIGS. 21 and 22 illustrate a fifth stage in the representative process. In the fifth stage, the structure ofFIG. 20 is etched back and planarized, using a procedure such as chemical mechanical polishing. The resulting structure has a planar surface including asurface310 ofstructure303, thesurface312 of the sidewall material, thesurface314 of the fill material, thesurface313 of the sidewall material, and thesurface311 of thestructure304. As can be seen inFIG. 22, side walls on the ends of the trench filled bylayer309 havesurfaces315,316 which are flush with thesurface314 of the fill material, and with thesurfaces312,313 of the sidewall material, after the chemical mechanical polishing or other etch back and planarization steps.
• FIG. 23 shows a next stage in the representative procedure, in which a layer of photoresist is deposited, patterned and developed to form alithographic mask320 over at least one of the side wall spacers, such as the side wall spacer having exposedsurface313. Themask320 extends from over thesurface314 of thefill layer309, across thesurface313 of the sidewall spacer, over thestructure304. The width of thelithographic mask320 is defined using a lithographic process, such as a photolithographic process and preferably has the minimum feature size specified for the lithographic process utilized. For example, modern lithographic processes may have a minimum feature size ranging from about 90 to about 200 nanometers. Advanced lithographic processes may be applied to achieve small minimum feature sizes.
• FIG. 24 shows a seventh stage in the representative procedure. In the seventh stage, thelithographic mask320 is trimmed, using an anisotropic etching procedure such as oxygen based plasma etching applied to photoresist materials. As a result of the etching of thelithographic mask320, a sub-lithographic, trimmedmask321 is formed having a width which is less than the minimum feature size specified for the lithographic process. The width of the trimmedmask321 for a representative embodiment is about 40 nanometers or less, where the minimum feature size is about 200 nanometers or less. As illustrated inFIG. 24, both the width and thickness of thelithographic mask320 are trimmed, so that the trimmedmask321 is both more narrow, and thinner than the lithographic mask. In alternative systems, a hard mask material may be utilized along with or in place of the photoresist. For example, a layer of silicon nitride may be formed and patterned using the lithographic process to provide alithographic mask320 comprising silicon nitride. The silicon nitridelithographic mask320 may then be etched to form the trimmedmask321. After forming a trimmedmask321, the resulting structure is selectively etched to remove the sidewall material in regions not covered by the trimmedmask321. As a result of the selective etching, seams322 are left surrounding thefill layer309 having asurface314. In a preferred embodiment, the selective etching removes all of the fill material down to the surface (not shown) of thefirst layer301 of material, and results in apatch323 of sidewall material below thefill layer309 and continuous with thepin325 of sidewall material left on the sidewall between thestructure304 and thefill layer309.
• FIG. 25 shows an eighth stage in the procedure. In the eighth stage, the trimmedmask321 is removed leavingsmall pin325 and the seam between thefill layer309 and thestructure304. The length of the pin is determined by the thin film thickness after etch back of the second layer302 of material. The thickness of the pin is determined by the thin film thickness of the sidewall material on the sidewall of thestructure304. The width of the pin is determined by the sub-lithographic, trimmedmask321 and the etching process utilized to selectively etch according to the pattern defined by the trimmedmask321.
• FIG. 26 illustrates apin325 manufactured as described herein. Thepin325 consists of a narrow sidewall spacer on astructure330 that includes apatch323 of sidewall material, and a layer offill material309. The top326 of thepin325 is flush with thesurface314 of thefill layer309. In the illustrated structure, thepin325 is shown on the side of thestructure330 that comprises thefill layer309. In alternative systems, thefill layer309 may be removed, leaving thepin325 on the side of thestructure304 of the second layer302 of material.
• While the present invention is disclosed by reference to the preferred embodiments and examples detailed above, it is to be understood that these examples are intended in an illustrative rather than in a limiting sense. It is contemplated that modifications and combinations will readily occur to those skilled in the art, which modifications and combinations will be within the spirit of the invention and the scope of the following claims.

Claims (26)

1. A method of forming a small structure, comprising:

forming a structure having a side wall on a surface of a substrate;

forming a side wall spacer on the side wall, wherein forming the side wall spacer comprises depositing a layer of the side wall material on the side wall, and selectively etching the side wall material according to a pattern to define the width of the side wall spacer, the width being less than 40 nm.

2. The method ofclaim 1, wherein said selectively etching includes forming an etch mask having a lithographic pattern to define a lithographic width; and trimming the etch mask to provide a trimmed mask to define the pattern to define the width.

3. The method ofclaim 1, wherein said selectively etching includes forming an etch mask having a lithographic pattern to define a lithographic width; and anisotropically etching the etch mask to provide a trimmed mask to define the pattern to define the width.

4. The method ofclaim 1, including after said depositing, anisotropically etching the layer of side wall material to remove side wall material from regions other than the side wall of the structure.

5. The method ofclaim 1, including after said depositing,

applying a layer of fill material over the structure and layer of side wall material;

etching back the layer of fill material and layer of side wall material on top of the structure to leave a substantially planar surface and expose the side wall material on the side wall at the substantially planar surface.

6. The method ofclaim 5, wherein the etching back comprises chemical mechanical polishing.

7. The method ofclaim 1, wherein the structure has a thickness less than 1 micron and the side wall spacer has a length along the side wall less than 1 micron.

8. The method ofclaim 1, wherein the structure has a thickness less than 0.5 microns and the side wall spacer has a length along the side wall less than 0.5 microns.

9. The method ofclaim 1, wherein the structure comprises a plurality of layers, including at least one insulating layer and at least one conductive layer, and the side wall material comprises a conductive material in electrical communication with said at least one conductive layer.

10. The method ofclaim 1, wherein the structure comprises a plurality of layers, including at least one insulating layer and at least one conductive layer, and the side wall material comprises a semiconductive material in electrical communication with said at least one conductive layer.

11. A method of forming a small structure, comprising:

forming a structure having a side wall on a surface of a substrate using a lithographic process having a minimum lithographic feature size;

forming a side wall spacer on the side wall, wherein forming the side wall spacer comprises depositing a layer of the side wall material on the side wall, and selectively etching the side wall material according to a pattern to define the width of the side wall spacer, the width being less than the minimum lithographic feature size.

12. The method ofclaim 11, wherein said selectively etching includes forming an etch mask having a lithographic pattern to define a lithographic width; and trimming the etch mask to provide a trimmed mask to define the pattern to define the width.

13. The method ofclaim 11, wherein said selectively etching includes forming an etch mask having a lithographic pattern to define a lithographic width; and

anisotropically etching the etch mask to provide a trimmed mask to define the pattern to define the width.

14. The method ofclaim 11, including after said depositing, anisotropically etching the layer of side wall material to remove side wall material from regions other than the side wall of the structure.

15. The method ofclaim 11, including after said depositing,

applying a layer of fill material over the structure and layer of side wall material;

etching back the layer of fill material and layer of side wall material on top of the structure to leave a substantially planar surface and expose the side wall material on the side wall at the substantially planar surface.

16. The method ofclaim 15, wherein the etching back comprises chemical mechanical polishing.

17. The method ofclaim 11, wherein the structure has a thickness less than 1 micron and the side wall spacer has a length along the side wall less than 1 micron.

18. The method ofclaim 11, wherein the structure has a thickness less than 0.5 microns and the side wall spacer has a length along the side wall less than 0.5 microns.

19. The method ofclaim 11, wherein the structure comprises a plurality of layers, including at least one insulating layer and at least one conductive layer, and the side wall material comprises a conductive material in electrical communication with said at least one conductive layer.

20. The method ofclaim 11, wherein the structure comprises a plurality of layers, including at least one insulating layer and at least one conductive layer, and the side wall material comprises a semiconductive material in electrical communication with said at least one conductive layer.

21. A device, including:

a member having a side wall; and

a spacer along the side wall of the member the spacer having a length along the side wall, a width generally orthogonal to the length, and a thickness, and wherein the width and the thickness are less than 40 nm.

22. The device ofclaim 21, wherein the spacer has a thickness of 10 to 20 nm.

23. The device ofclaim 21, wherein the structure has a thickness less than 1 micron and the side wall spacer has a length along the side wall less than 1 micron.

24. The device ofclaim 21, wherein the structure has a thickness less than 0.5 microns and the side wall spacer has a length along the side wall less than 0.5 microns.

25. The device ofclaim 21, wherein the structure comprises a plurality of layers, including at least one insulating layer and at least one conductive layer, and the side wall material comprises a conductive material in electrical communication with said at least one conductive layer.

26. The device ofclaim 21, wherein the structure comprises a plurality of layers, including at least one insulating layer and at least one conductive layer, and the side wall material comprises a semiconductive material in electrical communication with said at least one conductive layer.

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