US20060062445A1

Movatterモバイル変換

Info

Publication number: US20060062445A1
Application number: US11/226,698
Authority: US
Inventors: Gaurav Verma; Lance Glasser; Moshe Preil
Original assignee: KLA Tencor Technologies Corp
Current assignee: KLA Tencor Technologies Corp
Priority date: 2004-09-14
Filing date: 2005-09-14
Publication date: 2006-03-23
Also published as: JP2006085175A; JP4904034B2; US7689966B2

Abstract

Various computer-implemented methods are provided. One method for evaluating reticle layout data includes generating a simulated image using the reticle layout data as input to a model of a reticle manufacturing process. The simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process. The method also includes determining manufacturability of the reticle layout data using the simulated image. The manufacturability is a measure of how accurately the features will be formed on the reticle. Also provided are various carrier media that include program instructions executable on a computer system for performing a method for evaluating reticle layout data as described herein. In addition, systems configured to evaluate reticle layout data are provided. The systems include a computer system and a carrier medium that includes program instructions executable on the computer system for performing method(s) described herein.

Description

PRIORITY CLAIM

This application claims priority to U.S. Provisional Application No. 60/609,670 entitled “Methods, Systems, and Carrier Media for Evaluating Reticle Layout Data,” filed Sep. 14, 2004, which is incorporated by reference as if fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to methods, systems, and carrier media for evaluating reticle layout data. Certain embodiments relate to a computer-implemented method that includes determining manufacturability, inspectability, and/or printability of reticle layout data.

2. Description of the Related Art

The following description and examples are not admitted to be prior art by virtue of their inclusion in this section.

Designing an integrated circuit involves creating a schematic design that includes individual devices arranged and coupled to perform a particular function. As integrated circuits become increasingly complex, the design of the integrated circuits also increases in complexity. For example, integrated circuits are generally designed to have smaller dimensions and greater circuit density to improve the speed and other characteristics of the integrated circuits.

The integrated circuit design may be developed using any method or system known in the art such as electronic design automation (EDA), computer aided design (CAD), and other integrated circuit design software. Such methods and systems may be used to generate the circuit pattern database from the integrated circuit design. The circuit pattern database includes data representing a plurality of layouts for various layers of the integrated circuit. Data in the circuit pattern database may be used to determine layouts for a plurality of reticles. Reticles or “masks” are used in a lithography process to transfer a pattern to a resist on a wafer. The terms “reticle” and “mask” are used interchangeably herein.

A layout of a reticle generally includes a plurality of polygons that define features in a pattern on the reticle. Typically, these polygons can be generally defined by their size and placement of the reticle. Each reticle is used to fabricate one of the various layers of the integrated circuit. The layers of the integrated circuit may include, for example, a junction pattern in a semiconductor substrate, a gate dielectric pattern, a gate electrode pattern, a contact pattern in an interlevel dielectric, and an interconnect pattern on a metallization layer.

In particular, the reticle is used to pattern a resist in a lithography process step, then the patterned resist is used to form features of the integrated circuit on the wafer. Therefore, the patterned features that are formed on a reticle and are to be transferred to the wafer reflect the characteristics of the features that are included in the integrated circuit design. For example, the features that are formed on the reticle may be based on and are used to form individual components of the integrated circuits such as those described above. The complexity of the integrated circuit design, therefore, has a direct impact on the manufacture and inspection of reticles.

Accordingly, as the complexity of the integrated circuit design increases, successful reticle manufacture becomes more difficult. For instance, as the dimensions of the integrated circuit features and the spacings between the features decrease, the dimensions and spacings of features on the reticle also decrease. In this manner, it becomes more difficult to form these features on a reticle due to, for example, limitations of the reticle manufacturing process. In a similar manner, it becomes more difficult to inspect these features due to limitations of the reticle inspection processes. Furthermore, as is known in the art, the difficulty of successfully reproducing these features on wafers increases as the dimensions and spacings decrease.

In addition, as the dimensions of integrated circuit features approach the wavelength of the energy source used to print the reticle pattern on a wafer, reticle enhancement techniques (RET) such as optical proximity correction (OPC) features are increasingly relied upon to increase the accuracy of the transfer of the reticle features to the wafer. In particular, RET features cause the pattern printed on a wafer to differ significantly from the pattern physically formed on a reticle. Examples of reticle enhancing techniques include, but are not limited to, OPC features, phase shifting regions, polarization reticles, multiple exposures, off-axis illumination, illumination shapes, and dipole illumination.

OPC features generally take the form of sub-resolution features that are formed on the reticle but which do not print on the wafer. Instead, the OPC features are designed to increase or decrease the amount of light incident on the wafer proximate certain portions of the features such as corners. The OPC features further complicate the design, manufacture, and inspection of the reticle. However, due to the assistance that these features provide in printing features with acceptable characteristics, almost all reticles today include OPC features or another type of RET features. Furthermore, optical effects such as mask error enhancement factor (MEEF) may cause additional distortion of the final image at the wafer level. MEEF may be generally defined as the ratio of the critical dimension of a feature printed in a resist to the critical dimension of a structure formed on a reticle.

Generally, prior to manufacturing a reticle, the reticle layout data that is generated from an integrated circuit design will be checked. The reticle layout data is generally checked using a design rule checking (DRC) technique and/or an optical rule checking (ORC) technique. A DRC tool checks a mask layout file for design rule violations and identifies any violations in an output file. Design rules can include, for example, minimum line spacings, minimum line widths, minimum gate widths, or other geometric layout parameters. The design rules are based on, for example, the manufacturing process to be used to manufacture the resulting design layout. An ORC tool generally analyzes the edge collection by simulating the performance expected on the wafer and determining whether the wafer structures will violate a set of fabrication tolerances. Therefore, the optical rules are based on the lithography process to be used to manufacture wafers with the reticle.

Many DRC and ORC techniques are known in the art, and the results of DRC and ORC are used to correct design rule or optical rule violations. For example, systems and methods for correcting design rule violations in a mask layout file are illustrated in U.S. Published Patent Application No. 2002/0144230 by Rittman, which is incorporated by reference as if fully set forth herein. One method described by Rittman includes correcting design rule violations in a mask layout file by comparing a feature dimension in a mask layout file with a design rule in a technology file. If the feature dimension is less than the design rule, a design rule violation is identified and automatically corrected in the mask layout file. The design rule violation in the mask layout file may be automatically corrected by adjusting the feature dimension until the feature dimension is approximately equal to or greater than a design rule in the technology file. The method is intended to automate correction of the mask layout file to eliminate new design rule violations that may be created when a layout designer manually corrects the mask layout file.

While this and other methods known in the art for correcting design rule violations in a mask layout file have proven to be somewhat successful, DRC and ORC systems currently in use suffer from several limitations. For example, typical systems generally operate entirely on the data as drawn by the layout and RET decoration programs without accounting for the changes that will occur to the data in the mask making and wafer printing processes. In many cases, the mask maker or “shop” will apply sizing corrections to the data of which the designer is unaware. These process biases may alter some of the features included in the design, especially sub-resolution OPC structures such as scattering bars, serifs, or small edge extensions such that they become so small that they disappear from the data entirely or become large enough to cause problems such as bridging in either the reticle or wafer printing process.

In a further example, the list of design rules becomes impractically long as processes become more complex. While the design rules several years ago could be written on a single piece of paper, current processes can have well over 1,000 design rules that need to be checked. Encoding the design rules into software and ensuring that they completely encompass all possible patterning errors that will reduce device yield is increasingly difficult. If the design rule developer fails to anticipate every possible violation that would impact device performance, these violations will pass through the DRC system undetected. Even ORC systems, while making use of more detailed simulation, still require manual input of long rule lists for the checking component.

DRC and ORC simulations also do not capture the details of the mask making process and offer no means of calibrating the patterns to reflect what will actually be written on the reticle. In another example, the existing checkers do not take into account the key question of whether the pattern as laid out by the design program can actually be written by the reticle processing tools. For example, the current state of the art integrated circuit designs can produce complex designs and layouts that pass the current rule checks, but cannot be manufactured either because the RET pattern is too complex to be written correctly on the reticle, inspected on the reticle, and/or printed at the wafer level. Even so called “correct by construction” approaches only optimize the original, pre-OPC layout to eliminate patterns with design rule violations. However, once the OPC structures are added, numerous design rule violations are still possible. Therefore, the existing rule checkers act on idealized data without addressing the key question of whether or not the design can be written and inspected to yield a manufacturable process from design to reticle to wafer levels.

Many design databases take the initial physical design and add incredibly complex RETs which expand the design data by more than an order of magnitude. These huge layout files include tiny jogs, edge extrusions, and minute critical dimension (CD) variations that cannot possibly be reproduced by the mask writing tools. The resulting large data files lead to very long and expensive reticle writing times which are basically wasted since the pattern cannot be reproduced with all of the tiny CD variations and sub-resolution jogs.

In yet another example, the currently available DRC and ORC systems do not take into account whether or not the pattern can be adequately inspected. For example, even if the patterns could be written, no inspection tool is available that is capable of verifying the correct writing of such patterns and no exposure tool is believed to be available that could print such patterns. Therefore, the effort is wasted. Some of the small RET implementations may actually be counterproductive since in trying to write them on the reticle only a partial pattern can be defined, which can end up creating defects on the reticle and later on the wafer. Writing such large data files on a reticle is relatively expensive. As such, it is highly desirable to detect such problems in the data before the design is committed to the mask writing process thereby saving time and money.

Accordingly, it may be advantageous to develop methods, systems, and carrier media that can be used to evaluate reticle layout data to determine the manufacturability, inspectability, and/or printability of the reticle layout data while eliminating at least some of the disadvantages described above.

SUMMARY OF THE INVENTION

The following description of various embodiments of computer-implemented methods, carrier media, and systems is not to be construed in any way as limiting the subject matter of the appended claims.

An embodiment relates to a computer-implemented method for evaluating reticle layout data. The method includes generating a simulated image using the reticle layout data as input to a model of a reticle manufacturing process. The simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process. The method also includes determining manufacturability of the reticle layout data using the simulated image. The manufacturability is a measure of how accurately the features will be formed on the reticle.

In one embodiment, the manufacturability is determined by applying design rule checks to the simulated image. In another embodiment, the manufacturability is determined by comparing the simulated image to the reticle layout data. In yet another embodiment, the manufacturability is determined by analyzing different portions of the simulated image based on designer intent data associated with the different portions. In some embodiments, the method includes altering the reticle layout with reticle processing biases prior to generating the simulated image. In addition, the method may include altering the model using data measured on reticles fabricated using the reticle manufacturing process.

In some embodiments, the method also includes determining inspectability of the reticle layout data using the simulated image. Determining the inspectability may include determining an approximate signal-to-noise ratio that data produced by inspection of the reticle will have. Determining the inspectability may also or alternatively include determining a defect size that is the smallest that an inspection tool could detect on the reticle. In one embodiment, determining the inspectability includes analyzing different portions of the simulated image based on designer intent data associated with the different portions.

In another embodiment, the method includes performing generation of the simulated image for different parameters of the reticle manufacturing process. In such an embodiment, determining the inspectability may be performed for different simulated images generated with the different parameters. In one such embodiment, the different parameters include different reticle writing tools. In another such embodiment, the method includes selecting one of the different reticle writing tools that could produce reticles with higher inspectability than another of the different reticle writing tools. In a similar manner, the method may include selecting a reticle writing tool that could produce reticles with greater manufacturability than other reticle writing tools.

Some embodiments of the method include determining printability of the reticle layout data using the simulated image. In one such embodiment, determining the printability includes generating an additional simulated image that illustrates how the features of the reticle will be printed on a wafer by a lithography process. In some embodiments, determining the printability includes applying design rule checks to the additional simulated image. The printability of the reticle layout data may also be determined by applying optical rule checks to the additional simulated image. Furthermore, determining the printability may include comparing the additional simulated image to an ideal image of the features and locating errors in the additional simulated image by comparing edge placement of individual features in the additional simulated image to edge placement of corresponding features in the ideal image. In other embodiments, determining the printability includes analyzing different portions of the additional simulated image based on designer intent data associated with the different portions.

Some embodiments of the method include determining the printability by generating additional simulated images that illustrate how the features of the reticle will be printed on a wafer by a lithography process at different process parameters. In one such embodiment, the different process parameters include different types of lithography exposure tools. In additional embodiments, determining the printability includes generating an additional simulated image that illustrates how the features of the reticle will be printed on a wafer by a lithography process using the simulated image as input to a lithography process model. Such a method may also include altering the lithography process model using data measured on wafers printed using the lithography process.

In one embodiment, the simulated image illustrates how all of the features of the reticle layout data will be formed on the reticle. The reticle layout data may include optical proximity correction (OPC) feature data, aberration correction feature data, phase shift feature data, or a combination thereof. In some embodiments, the method includes altering one or more parameters of the reticle manufacturing process to generate one or more revised reticle manufacturing processes. Such a method may also include generating simulated images for the one or more revised reticle manufacturing processes and determining the manufacturability of the reticle layout data for the one or more revised reticle manufacturing processes. In addition, the method may include determining which of the one or more revised reticle manufacturing processes provides the largest improvement in the manufacturability of the reticle layout data. In one such embodiment, the one or more parameters may include different types of mask writing tools.

In some embodiments, determining the manufacturability of the reticle layout data includes identifying defects in the reticle layout data based on the simulated image. One such embodiment includes allowing a user to review the defects and to alter the reticle layout data to correct the defects. In this manner, the method may be used for “manual” reticle layout data correction. In a different embodiment, the method includes altering the reticle layout data to correct the defects. As such, the method may include “automatic” or computer-implemented reticle layout data correction. Each of the embodiments of the method described above may include any other step(s) described herein.

Another embodiment relates to a carrier medium. The carrier medium includes program instructions executable on a computer system for performing a method for evaluating reticle layout data. The method includes generating a simulated image using the reticle layout data as input to a model of a reticle manufacturing process. The simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process. The method also includes determining manufacturability of the reticle layout data using the simulated image. The manufacturability is a measure of how accurately the features will be formed on the reticle. The method may include any other step(s) described herein. The carrier medium may be further configured as described herein.

An additional embodiment relates to a system configured to evaluate reticle layout data. The system includes a computer system. In addition, the system includes a carrier medium that includes program instructions executable on the computer system for generating a simulated image using the reticle layout data as input to a model of a reticle manufacturing process. The simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process. The program instructions are also executable on the computer system for determining manufacturability of the reticle layout data using the simulated image. The manufacturability is a measure of how accurately the features will be formed on the reticle. The system may be further configured as described herein.

BRIEF DESCRIPTION OF THE DRAWINGS

Further advantages of the present invention may become apparent to those skilled in the art with the benefit of the following detailed description of the preferred embodiments and upon reference to the accompanying drawings in which:

FIG. 1 is a flow chart illustrating one example of a computer-implemented method that has been used for reticle inspection;

FIGS. 2-5 are flow charts illustrating various embodiments of a computer-implemented method for evaluating reticle layout data; and

FIG. 6 is a schematic diagram illustrating a side view of one embodiment of a system that can be used to perform one or more of the computer-implemented methods described herein.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and may herein be described in detail. The drawings may not be to scale. It should be understood, however, that the drawings and detailed description thereto are not intended to limit the invention to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the present invention as defined by the appended claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The terms “reticle” and “mask” are used interchangeably herein. A reticle generally includes a transparent substrate such as glass, borosilicate glass, and fused silica having opaque regions formed thereon in a pattern. The opaque regions may be replaced by regions etched into the transparent substrate. Many different types of reticles are known in the art, and the term reticle as used herein is intended to encompass all types of reticles.

A process for manufacturing a reticle is similar to a wafer patterning process. For example, the goal of reticle manufacturing is generally to form a pattern in an opaque material such as a relatively thin chrome layer on a substantially transparent substrate such as glass. In addition, other appropriate opaque materials that may be used for reticle manufacturing include, but are not limited to, chromium, chromium oxide, chromium nitride, and molybdenum/silicon. Appropriate thicknesses for chrome layers may be approximately 1000 Å and may be deposited upon a glass substrate by sputtering. Additional appropriate transparent materials that may be used for reticle manufacturing include borosilicate glass or fused-silica (SiO₂, “quartz”), which have relatively stable dimensions and transmission properties for wavelengths of exposure systems. Additional materials may also be used for reticle manufacturing. For example, a film underlying an opaque material may act as an adhesion layer. Such an adhesion layer may include, for example, a mixture of chromium, nitrogen, and oxide. In addition, a film formed on top of the opaque material may act as an anti-reflective layer. An appropriate anti-reflective layer may be formed of, for example, a relatively thin layer of Cr₂O₃.

Reticle manufacturing may include a number of different steps such as pattern generation, which may include moving a glass substrate having a chrome layer and a resist layer formed thereon under a light source as shutters are moved and opened to allow precisely shaped patterns of light to shine onto the resist thereby creating the desired pattern. Alternatively, reticles may be made with laser or e-beam direct write exposure. Laser exposure allows the use of standard optical resists and is faster than e-beam direct write exposure. In addition, laser systems are also less expensive to purchase and operate. Direct write laser sources are turned on and off with an acousto-optical modulator (AOM). An example of a commercially available direct write laser system is the ALTA 3000® laser writer available from ETEC Systems, Inc., Hayward, Calif. Direct write e-beam systems are often used to manufacture complex reticles since they produce finer line resolution than laser systems. In addition, direct write e-beam systems can also write larger die sizes than laser systems. Examples of commercially available direct write e-beam systems include the MEBES 4500 and 5000 systems available from ETEC Systems, Inc.

As used herein, the term “wafer” generally refers to substrates formed of a semiconductor or non-semiconductor material. Examples of such a semiconductor or non-semiconductor material include, but are not limited to, monocrystalline silicon, gallium arsenide, and indium phosphide. Such substrates may be commonly found and/or processed in semiconductor fabrication facilities. A wafer may include one or more layers formed upon a substrate. For example, such layers may include, but are not limited to, a resist, a dielectric material, and a conductive material. Many different types of such layers are known in the art, and the term wafer as used herein is intended to encompass a wafer including all types of such layers.

One or more layers formed on a wafer may be patterned or unpatterned. For example, a wafer may include a plurality of dies, each having repeatable pattern features. Formation and processing of such layers of material may ultimately result in completed devices. Many different types of devices may be formed on a wafer, and the term wafer as used herein is intended to encompass a wafer on which any type of device known in the art is being fabricated. Although the embodiments are described herein with respect to integrated circuits, it is to be understood that the embodiments described herein may be used for reticle layout data for any device known in the art.

As used herein, the term “lithography system” is used to generally refer to any lithography system that prints images of a reticle onto a wafer using light. The lithography system may include a scanning projection system or a step and scan system, which are both commonly referred to as a “scanner” or a step-and-repeat system, also called a “stepper.” The lithography system may include any exposure system known in the art such as systems commercially available from Nikon, ASM Lithography, Canon, or Integrated Solutions, Inc. The terms “lithography system,” “scanner,” and “stepper” are used interchangeably herein.

Resolution enhancement technologies (RET) such as OPC and Phase Shift Masks (PSM) are increasingly being applied to integrated circuit designs in order to print features on device wafers which are smaller than the wavelength of light used as the exposure source. These RETs often involve the addition of extra features to the design including sub-resolution assist features (SRAF) and serifs with the result that the layout of the design on the photomask or reticle becomes extremely complex. Verifying that the RET features will print correctly on the wafer and that the SRAFs will not print but will cause the main features to print correctly becomes a difficult task that is beyond the simple logical tests performed by design rule check (DRC) or optical rule check (ORC) software.

The following description includes methods having three general parts, which may be performed separately or in some combination thereof. The methods described herein are advantageous in that they can be used to 1) ensure that the design, including all RET features, can actually be written on the photomask in a manner that will replicate the designer intent at the reticle plane; 2) ensure that the design, including all RET features, can be written on the reticle in a manner that will be inspectable (i.e., that the features as printed on the reticle can be compared to either a database of the desired features or to another instance of the desired features within the design with sufficient discrimination so that errors in the pattern fidelity can be detected), and 3) ensure that the reticle pattern, including all RET features, will print at the wafer level in a manner that will replicate the designer intent and yield the appropriate pattern on the wafer. Therefore, the methods described herein can be used to determine if RET enhanced reticle layout data, or any other reticle layout data, is manufacturable, inspectable, and/or transferable to the wafer level.

Turning now to the drawings,FIG. 1 illustrates a method that has previously been used for reticle inspection. The method starts withreticle layout data10, which defines the circuit layout that is to be formed on a reticle. The reticle layout data may be in the form of a MEBES jobdeck, a GDSII file, or OASIS data, which are standard file types for reticle writing tools. The method also includes making the mask, as shown instep12. Making the mask may be performed as described above.

As shown instep14, the method includes inspecting or verifying the mask. Inspecting the mask in this method may be performed using any reticle inspection tool known in the art. For example, the inspection tool may be configured to generate images of the reticle. Detecting defects on the reticle includes comparing data generated by the reticle inspection withsimulated mask data16.Simulated mask data16 may be generated usingmask making model18 withreticle layout data10 as input. Such a mask inspection may be commonly referred to as a “die-to-database inspection” since the data generated by inspection is compared to data generated from a database.

The features as printed on the reticle will differ from the features as defined in the reticle layout data. Therefore, the mask making model is used to modify the reticle layout data to account for differences in the patterned features of the reticle as defined in the reticle layout data versus how they will be printed on the reticle. In one particular example, the features as printed on the reticle will generally have somewhat rounded corners particularly in comparison to the features in the reticle layout data. In this example, the mask making model may account for corner rounding of features. As such, using the simulated image as a comparison to the inspection data decreases the number of nuisance defects that will be detected on the reticle thereby increasing the accuracy of the inspection.

Any suitable technique may be used to perform a simulation of the effects of a particular process on reticle layout data. There are several software tools that simulate effects of a particular reticle generation process including, for example, ProBEAM, which is commercially available from KLA-Tencor, San Jose, Calif. Examples of an apparatus and methods for generating an inspection reference pattern are illustrated in U.S. Pat. No. 6,691,052 to Maurer, which is incorporated by reference as if fully set forth herein. Additional examples of methods and systems for inspecting reticles using aerial imaging and die-to-database detection are illustrated in U.S. patent application Ser. No. 10/679,857 by Stokowski et al., which is also incorporated by reference as if fully set forth herein. Further examples of methods for generating a reference image of a reticle are illustrated in U.S. patent application Ser. No. 10/793,599 by Howard et al., which is incorporated by reference as if fully set forth herein.

As further shown inFIG. 1, based on the results of the reticle inspection, the method may include determining if the reticle passes or fails qualification, as shown instep20. Determining if the reticle passes or fails qualification generally includes evaluating defects detected on the reticle to determine characteristics of the defects such as how many defects are detected on the wafer, how many defects of a particular size are detected on the wafer, the location of defects on the wafer, number of “killer” defects on the wafer, etc. The qualification standards are generally defined by the customer or the integrated circuit designer.

If the reticle passes qualification, the reticle may be released to production, as shown instep22. Alternatively, if the reticle has failed qualification, then another mask may be made with the same reticle layout data.

Although the above-described method has some advantages such as decreasing the number of nuisance defects that are detected on the reticle, this method is also lacking in some respects. For example, the method does not include evaluating the reticle layout data to determine if the reticle layout data can be manufactured reproducibly. Of course, it would be possible to roughly estimate the manufacturability of the reticle layout data from the inspection data, for example, if entire features are simply missing. However, it is not possible in this method to get even a rough estimate of the manufacturability of the reticle layout data without actually manufacturing the reticle. Therefore, the method requires the relatively expensive reticle manufacturing to be performed while providing only a rough estimate of the manufacturability.

In addition, since the mask making model simply alters the reticle layout data to account for changes in the features due to the mask making process, portions of the reticle layout data that cannot be manufactured properly may be “defective” in the reference image. Therefore, portions of the mask that are not manufacturable may have substantially the same characteristics in the inspection and reference images. As such, defects in the fabricated mask due to non-manufacturability in the reticle layout data may not even be detected by the reticle inspection.

The method shown inFIG. 1 also does not account for any non-inspectable features of the reticle. For example, certain features that were fabricated on the reticle may be too small to be imaged by the inspection system. As such, certain features of the reticle layout data may not be inspectable. Therefore, it is impossible to ascertain whether or not these features have been printed on the reticle at all, whether or not these features have been printed within design limits, and whether or not these features affect the qualification status of the reticle.

Furthermore, the method shown inFIG. 1 does not account for any-nonprintable features of the reticle or features that will not print with adequate accuracy on a wafer. In particular, the method does not include evaluating the reticle layout data to determine how the reticle layout data will print on a wafer. In addition, in determining if the reticle passes qualification standards, the method does not take into consideration how the features on the reticle will print on the wafer. Since the inspection may be substantially inaccurate due to non-inspectable features as described above, it is conceivable that the features of the reticle will not print on a wafer as the integrated circuit designer had intended. In the worst case scenario, the reticle could be erroneously qualified, wafers could be printed with the reticle in production, and the defects in the integrated circuit could be detected at final test.

FIGS. 2-5 illustrate various embodiments of a computer-implemented method for evaluating reticle layout data that provide substantial improvements over the method shown inFIG. 1. In particular, the methods shown inFIGS. 2-5 can be used to determine the manufacturability, inspectability, and/or printability of reticle layout data. It is noted that the steps shown inFIGS. 2-5 are not essential to practice of the method. One or more steps may be omitted or added to the methods illustrated inFIGS. 2-5, and the methods can still be practiced within the scope of these embodiments.

As shown inFIG. 2, one embodiment of the method includes generatingsimulated image24 of a mask usingreticle layout data26 as input to model28 of a reticle manufacturing process. The reticle layout data may be in the form of a MEBES jobdeck, a GDSII file, or OASIS data, which are standard file types for reticle writing tools. The reticle layout data may include data relating to RET features. For example, the reticle layout data may include OPC feature data, aberration correction feature data, phase shift feature data, or a combination thereof. The reticle layout data may also include data for any other RET features known in the art.Model28 may include any suitable model known in the art. Preferably, the model takes into account a number of process parameters of the reticle manufacturing process such as the type of mask writing tool that will be used for manufacture of the reticle, characteristics of the mask writing tool, characteristics of a resist to be used in the reticle manufacturing process, etc.

The simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process. In one embodiment, the reticle layout data including the RET features is rendered by software to simulate how the features in the reticle layout data will be printed on the reticle. In addition, the simulated image may illustrate how all of the features of the reticle layout data will be formed on the reticle. As such, the method described herein is unlike methods for classifying and analyzing defects detected on a reticle that include simulating how a reticle defect will print on a wafer in that such methods generate a simulated image for only the portion of the reticle proximate the defect. However, since the methods described herein are concerned with any reticle features that may compromise the manufacturability of the reticle layout data, the methods described herein generate substantially different simulated images.

The method described herein is also different from methods that generate a simulated image of reticle layout data that will be used as a reference image for reticle inspection in that such methods do not include determining the manufacturability of the reticle layout data. In contrast, as shown instep30, the method described herein includes determining manufacturability of the reticle layout data using the simulated image. The manufacturability is a measure of how accurately the features will be formed on the reticle. For example, the simulated image can be compared to the reticle layout data, and any defects (e.g., areas which can not be written properly on the reticle) in the reticle layout data are identified. In another example, the manufacturability may be determined by applying design rule checks to the simulated image.

In an additional example, the manufacturability of the reticle layout data may be determined by analyzing different portions of the simulated image based on designer intent data associated with the different portions. Designer intent data may be generally defined as the criticality associated with different portions of reticle layout data. For example, features that will be used to form gate electrodes of the integrated circuit may be flagged as critical while features that will be used to form field oxide regions of the integrated circuit may be flagged as non-critical. The designer intent data may include designations identifying different types of regions of the reticle, different types of features on the reticle, and/or different portions of features on the reticle. The different types of regions, features, or portions of features may include, for example, critical and non-critical regions, features, or portions of features as described in more detail herein. The designations may vary depending upon the circuit pattern database generated from the IC design.

A circuit pattern database may include designations as described above. The designations may include, for example, flags or tags associated with different types of regions, features, or portions of features on the reticle. The designations, however, may include any indicia suitable to distinguish one type of region, feature, or portion of a feature from another type. Each region, feature, or portion of a feature, or only some of the regions, features, or portions of features, on the reticle may be associated with a designation. Data in the circuit pattern database representing a layout of a reticle may be separate from data in the circuit pattern database representing the designations. In addition, different types of designations may be separated in the circuit pattern database. For example, the circuit pattern database may include a first set of data that includes designations for critical regions, features, or portions of features on the reticle and a second set of data that includes designations for non-critical regions, features, or portions of features on the reticle. Alternatively, different designations may be combined into a single set of data.

Additional examples of designer intent data and methods of use for reticle inspection are illustrated in U.S. Pat. No. 6,529,621 to Glasser et al. and PCT Application No. WO 00/36525 by Glasser et al., which are incorporated by reference as if fully set forth herein. A system or method as described herein may also include any of the elements or steps illustrated by Glasser et al. The designer intent data may be provided directly to a system as described further herein.

In an additional step (not shown), the method may include altering the reticle layout data by applying any mask processing biases to the reticle layout data before the. simulated image is generated and the manufacturability is determined. The mask processing biases are the changes to the reticle layout data that are usually performed by the mask manufacturer to account for known effects of the reticle manufacturing processes on characteristics of the reticle features. For example, often a mask manufacturer will increase the size of features in the reticle layout data prior to manufacturing to account for reductions in the features sizes formed on the reticle due to an etch process. As such, the reticle manufacturability analysis can be performed on the sized data.

As shown instep32, the method may include determining whether or not the reticle layout data meets qualification standards. The qualification standards may define an acceptable number of defects, acceptable types of defects, acceptable sizes of defects, and the like. In this manner, the qualification standards may also define acceptable manufacturability standards for the reticle layout data. The qualification standards may be set by the designer or the customer. If the data meets qualification standards, then the mask may be manufactured as shown instep34 with the reticle layout data and the reticle manufacturing process. The reticle may be fabricated as described above.

If the reticle layout data does not meet qualification standards, then the method may include alteringreticle layout data26. Preferably, the reticle layout data is altered to improve the manufacturability of the reticle layout data. In one embodiment, the method may include allowing a user to review the defects that are detected instep32 and to alter the reticle layout data to correct the defects. In this manner, the computer-implemented method may be configured for “manual” defect correction. For example, a system configured to perform one or more of the computer-implemented methods described herein may be coupled to one or more of the EDA tools used to create the OPC patterns to provide immediate feedback and correction before the mask is made. Errors due to the manufacturability, inspectability, and/or printability could be flagged and displayed on the EDA screen. The user could then change the layout or OPC corrections and recheck the data to ensure that the pattern will pass before committing the design to the mask making process.

In a different embodiment, the computer-implemented method includes altering the reticle layout data to correct the defects. As such, this embodiment of the computer-implemented method is configured for “automatic” defect correction. In one implementation, this correction could be done automatically by software in a closed loop method with no user intervention. In one embodiment, after the data is altered, another simulated image may be generated as described above, and the manufacturability of the altered reticle layout data may be determined.

In some embodiments, the method includes instep30 determining inspectability of the reticle layout data using the simulated image generated instep24. For example, software used by the method may include an inspection model (not shown) that simulates how the inspection tool will “see” the reticle. In one embodiment, determining the inspectability includes determining an approximate signal-to-noise ratio that data produced by inspection of the reticle will have. In particular, the method can include determining if there will be an adequate signal-to-noise ratio to correctly disposition relatively small defects. In another embodiment, the inspectability is determined by determining the smallest defect size that an inspection tool could detect on the reticle. In some embodiments, determining the inspectability includes analyzing different portions of the simulated image based on designer intent data associated with the different portions.

In one embodiment, a simulated image is generated for different parameters of the reticle manufacturing process, and the inspectability is performed on the different simulated images generated with the different parameters. For example, the model may include a range of expected reticle process variations that can be used to determine if the design will result in an inspectable pattern over the expected range of reticle process conditions. The different parameters may also include different reticle writing tools. Therefore, this procedure can also be performed with different models for each (or one or more) of the different reticle writing tools available to the user. Based on the results of this inspectability check, the method may include selecting one of the different reticle writing tools that could produce reticles with higher inspectability than another of the different reticle writing tools. In some embodiments, the user may select the writing tool that has the best tolerance for producing an inspectable pattern for the given design. However, the reticle writing tool may be selected automatically.

The inspectability of the reticle layout data may be determined for each version of the reticle layout data that is generated. For example, each time the reticle layout data is altered as described above to improve the manufacturability of the data, the inspectability may be determined. Alternatively, the inspectability of the reticle layout data may be determined for the reticle layout data that passes the manufacturability qualification standards. Therefore, the reticle layout data may be altered several times to meet the manufacturability qualification standards before inspectability is determined.

In addition, or alternatively, the method may include instep30 determining printability of the reticle layout data using the simulated image generated instep24. For example, the method may use software that includeswafer simulation model36, or “lithography process model” which is configured to predict how the reticle layout data will appear when printed at the wafer level. The wafer simulation model may include parameters that account for variations in the lithography process as well as a resist. The resist model may include any suitable resist model known in the art, and a specific resist model may be generated using any method known in the art.

In particular, the method may use the simulated image that illustrates how the reticle layout data will be formed on the reticle as input to generate an additional simulated image that illustrates how the features of the reticle will be printed on a wafer by a lithography process. Therefore, since the printability of the reticle layout data is based on how the features of the reticle will actually be manufactured on the reticle and “seen” by the wafer, the printability assessments performed as described herein will be more accurate than printability assessments performed using any other method.

Determining the printability of the reticle layout data may include applying DRC and/or ORC to the additional simulated image. For example, the traditional DRC and ORC checks which were typically performed at the reticle level can be applied instead at the wafer level to determine if any design rule violations will occur. In another embodiment, determining the printability of the reticle layout data includes comparing the additional simulated image to an ideal image of the features. The ideal image may be generated directly from the reticle layout data and will generally be representative of how the integrated circuit designer would like the features to be formed on the wafer. However, since the ideal image will not include images of the RET features, the RET features may be removed from the reticle layout data before the ideal image is generated. Such an embodiment may also include locating errors in the additional simulated image by comparing edge placement of individual features in the additional simulated image to edge placement of corresponding features in the ideal image. In some embodiments, the printability is determined by analyzing different portions of the additional simulated image based on designer intent data associated with the different portions.

The printability checks can be run at best focus and exposure conditions, or they can be run across the full range of expected dose/focus conditions commonly referred to as the “process window” to see if any rule violations will occur. For example, in one embodiment, determining the printability of the reticle layout data includes generating additional simulated images that illustrate how the features of the reticle will be printed on a wafer by a lithography process at different process parameters. In one such embodiment, the different process parameters include different types of lithography exposure tools. Therefore, the method may include, in some embodiments, determining the lithography exposure tool that provides the best printability for the reticle layout data.

The printability of the reticle layout data may be determined for each version of the reticle layout data that is generated. For example, each time the reticle layout data is altered as described above to improve the manufacturability and/or the inspectability of the data, the printability may be determined. Alternatively, the printability of the reticle layout data may be determined for the reticle layout data that passes the manufacturability, and optionally the inspectability, qualification standards. Therefore, the reticle layout data may be altered several times to meet the manufacturability and/or inspectability qualification standards before printability is determined.

As shown inFIG. 2, the method may also include inspecting or verifying the reticle, as shown instep38, after it has been fabricated. Inspecting the mask in this method may be performed using any reticle inspection tool known in the art. For example, the inspection tool may be configured to generate images of the reticle. The inspection tool may be further configured as described herein. In addition, the method may include generatingsimulated mask40 frommask making model28. The simulated mask may be used to detect defects on the reticle by comparison to data generated by the reticle inspection. Such a mask inspection may be commonly referred to as a “die-to-database inspection” since the data generated by inspection is compared to data generated from a database.Simulated mask40 may be generated usingmask making model28 with the reticle layout data as input. In particular, the mask making model may be used to generatesimulated mask40 using as input the reticle layout data that is actually used for manufacturing the reticle. In this manner, the reticle layout data that is used to generate the simulated mask may have been altered to meet manufacturability standards for the reticle.

The mask making model is used to modify the reticle layout data to account for differences in the patterned features on the reticle as defined in the reticle layout data versus how they will be printed on the reticle. For example, the features as printed on the reticle will differ from the features as defined in the reticle layout data. In one particular example, the features as printed on the reticle will have somewhat rounded corners particularly in comparison to the features in the reticle layout data. In this example, the mask making model may account for corner rounding of features. As such, using the simulated image as a comparison to the inspection data decreases the number of nuisance defects that will be detected on the reticle thereby increasing the accuracy of the inspection.

As further shown inFIG. 2, based on the results of the reticle inspection, the method may include determining if the reticle passes or fails qualification, as shown instep42. Determining if the reticle passes or fails qualification generally includes evaluating defects detected on the reticle to determine characteristics of the defects such as how many defects are detected on the wafer, how many defects of a particular size are detected on the wafer, the location of defects on the wafer, number of “killer” defects on the wafer, etc. The qualification standards are generally defined by the customer or the integrated circuit designer.

If the reticle passes qualification, the reticle may be released to production, as shown instep44. In addition, the method may include altering the model of the reticle manufacturing process using data measured on reticles fabricated using the reticle manufacturing process. For example, as shown inFIG. 2, if the reticle passes qualification,mask making model28 may be updated with the experimental information about the reticle that was generated during inspection. The updated mask making model may then be used to generate additional simulated images of the reticle layout data and simulated images of other reticle layout data. In this manner, the mask process model could be calibrated using inspection data generated as described herein or any other external source of data, such as SEM images, or by linking the model updating function to the built-in calibration function that is available on KLA-Tencor die-to-database reticle inspection tools.

Alternatively, if the reticle has failed qualification, then another mask may be made with the same reticle layout data. In addition, if the reticle fails qualification, then the reticle layout data may be stored indatabase46 of previous integrated circuit designs.Database46 may also provide previous integrated circuit designs to mask makingmodel28 andmask making step34. In yet another alternative, the reticle layout data may be modified based on the inspection data, and the modified reticle layout data may be used to fabricate another mask. In a further example, the qualification failure may indicate a problem with the reticle writing tool. Therefore, the method may include altering one or more parameters of the reticle writing tool.

As further shown inFIG. 2, after the reticle is released to production, the reticle may be used to print wafers, as shown instep48. The wafers may be printed using any lithography process and tool(s) known in the art. In addition, the wafers may be printed using the best known process parameters (e.g., focus, exposure, etc.) of the lithography process to print the wafers. The method may also include usingwafer making model36 to generate simulated images of how the reticle will print on the wafer, as shown instep50. The simulated images of the printed wafers may be compared to images of the printed wafers. Such comparisons may be used to verify the wafer model, as shown instep52. For example, experimental data generated by inspection and/or metrology of the printed wafers may be compared to the simulated images generated instep50. Any differences between the printed wafers and the simulated images may be analyzed to determine if the differences indicate an inaccuracy in the model. The differences between the printed images and the simulated images may then be used to correct this and any other inaccuracies. Therefore, the method may include altering a lithography process model using data measured on wafers printed using the lithography process. The method shown inFIG. 2 may include any other step(s) described herein.

FIG. 3 illustrates another embodiment of a computer-implemented method for evaluating reticle layout data. The method shown inFIG. 3 includes several steps that are also included in the method shown inFIG. 2. Those steps that can be the same inFIGS. 2 and 3 have been indicated with the same reference numerals and will not be described again in reference toFIG. 3 for the sake of brevity.FIG. 3 also includes additional steps that are not included in the method ofFIG. 2 and which are described below.

For example, as shown inFIG. 3, this method includes using multiplemask making models54 to generate multiplesimulated images24 ofreticle layout data26. In this manner, the method may include evaluating the manufacturability, inspectability, and/or printability as described above for different reticle manufacturing processes. The multiple mask making models may be configured to simulate completely different processes or the same process but with different process parameters. The different process parameters may include, for example, the exposure dose and focus, different types of mask writing tools, different types of resist, the etch chemistry, and the like.

The multiple mask making models may be generated by altering one or more parameters of a reticle manufacturing process to generate one or more revised reticle manufacturing processes. A model may be generated for each of the revised reticle manufacturing processes. Each model may then be used to generate a simulated image corresponding to a revised reticle manufacturing process. In addition, the manufacturability, inspectability, and/or printability may be determined as described above for each of the reticle manufacturing processes.

The method may further include determining which of the one or more revised reticle manufacturing processes provides the largest improvement in, or the best, manufacturability of the reticle layout data. In one particularly advantageous embodiment, the method may include performing the simulations and evaluations with different models for each of the different reticle writing tools that are available to the user. Based on the results of this manufacturability check, the user may select the writing tool with the best tolerance for producing a defect free pattern for the given reticle design. In addition, as shown inFIG. 3, the method may include selecting the reticle manufacturing process model that produces the best manufacturability of the reticle layout data, as shown instep56. In this manner, the best tool/process combination could be selected to manufacture each design. In some instances, the method may include determining appropriate changes to the reticle manufacturing process to create a manufacturable mask which will replicate the desired pattern at both the mask and wafer levels. The method also includes making the mask, as shown instep58, using the reticle manufacturing process that corresponds to this model. The method shown inFIG. 3 may include any other step(s) described herein.

FIG. 4 illustrates another embodiment of a computer-implemented method for evaluating reticle layout data. The method shown inFIG. 4 includes several steps that are also included in the method shown inFIG. 2. Those steps that can be the same inFIGS. 2 and 4 have been indicated with the same reference numerals and will not be described again in reference toFIG. 4 for the sake of brevity.FIG. 4 also includes additional steps that are not included in the method ofFIG. 2 and which are described below.

For example,FIG. 4 includes determining the manufacturability, inspectability, and/or printability for multiplewafer simulation models60. The wafer simulation models can include different retical enhancement techniques such as different OPC features. In addition, one of the wafer simulation models may include best known focus and exposure conditions. Other wafer simulation models may include other dose/focus conditions that are expected to be within the process window. The wafer simulation models may be used for determining the printability of the reticle layout data at different process parameters. In one such embodiment, the different process parameters may include different types of lithography exposure tools and/or any other lithography process parameters known in the art.

The results of the different wafer simulation models can be used to make certain decisions about the reticle layout data and/or the wafer making process. For instance, the results may be used to determine which of the lithography exposure tools provides the best printability for the reticle layout data. In another example, the results may be used to determine the approximate process window for specific reticle layout data. In a further example, the results may be used to determine the RET features such as OPC features that will produce the best printability for the reticle layout data. In this manner, as shown instep62, the method may include selecting the best wafer making model that produces the best printability and identifying the RET/OPC features associated with that model. These RET/OPC features may then be added to the reticle layout data that is used to fabricate the reticle. The method may include fabricating the reticle, as shown instep64, using this reticle layout data. The reticle may be manufactured as described above. The method shown inFIG. 4 may include any other step(s) described herein.

FIG. 5 illustrates yet another method for evaluating reticle layout data. The method shown inFIG. 5 is essentially a combination of the methods shown inFIGS. 3 and 4. The method shown inFIG. 5 includes several steps that are also included in the methods shown inFIGS. 3 and 4. Those steps that can be the same in these figures have been indicated with the same reference numerals and will not be described again in reference toFIG. 5 for the sake of brevity. For example, the method shown inFIG. 5 may include using multiplemask making models54 to generate multiplesimulated images24 ofreticle layout data26, as described above. In this manner, the method may include evaluating the manufacturability, inspectability, and/or printability as described above for different reticle manufacturing processes. Each model may then be used to generate a simulated image corresponding to a revised reticle manufacturing process. In addition, as shown inFIG. 5, the method may include selecting the reticle manufacturing process model that produces the best manufacturability, inspectability, and/or printability of the reticle layout data, as shown instep66. The method also includes making the mask, as shown instep68, using the reticle manufacturing process that corresponds to this selected model.

Step

66 of the method shown inFIG. 5 may also include determining the best RET/OPC features and/or wafer making model prior to manufacturing the mask. For example, the method shown inFIG. 5 may include determining the printability for multiplewafer simulation models60 as described above. The wafer simulation models can include different retical enhancement techniques such as different OPC features as described above. The wafer simulation models may be used for determining the printability of the reticle layout data at different process parameters. In one such embodiment, the different process parameters may include different types of lithography exposure tools.

The results of the different wafer simulation models can be used to make certain decisions about the reticle layout data and/or the wafer making process. For instance, the results may be used to determine a lithography exposure tool, an approximate process window, and/or the RET features such as OPC features that will produce the best printability for the reticle layout data. In this manner, as shown instep66, the method may include selecting the best wafer making model that produces the best printability and identifying the RET/OPC features associated with that model. The method shown inFIG. 5 may include any other step(s) described herein.

The methods described herein are, therefore, unique at least in that the concepts described herein have not been applied to the full reticle design and from mask manufacturing to wafer pattern transfer for arbitrary designs and processes. In addition, the design rule checks are moved from the reticle level to the wafer level. Furthermore, unlike other methods, the full reticle manufacturing offsets may be included in the simulations of the reticle layout data before the design rule checks are applied. Moreover, the methods described herein are unique at least in that different design rules may be used for manufacturability, inspectability, and printability analyses.

In addition, the methods described herein provide the unique advantage of linking the simulation of the mask making and wafer manufacturing processes to actual measured masks and wafers to ensure that the models are valid to within the required tolerances. Each design that is verified and approved by this process can be used to manufacture masks and wafers which can then be scanned by the appropriate tools. The data collected from the mask inspection and/or metrology tools and the wafer inspection and/or metrology tools can then be compared to the model predictions. The model can be constantly updated to ensure that it represents the most current status of both the mask and wafer processes. Monitoring techniques can be applied to identify cases in which the actual mask or wafer results fail to agree with the model predictions, and the model can be updated accordingly, or the process retuned, to restore the correct correlation between prediction and actual results.

The three types of checks described herein which are applied to the data for manufacturability, inspectability, and/or transferability to the wafer level can be performed in several ways. At the most basic level, simple rules can be written and processed on an edge by edge basis. In a more complex embodiment, models can be created of the three different process steps (reticle writing, reticle inspection, and pattern transfer to the wafer level) and the checks can be performed on modeled data. For example, in the case of reticle writing, a list of rules can be applied directly to the data files (such as GDSII data) of the OPC enhanced design, or how the data will be written can be modeled and errors can be identified by comparing the simulated data back to the decorated data file to determine if any features are missing, oversized, or distorted in an unacceptable manner. Similarly, the inspectability check can be simple runs applied to the data file, or the modeled mask could be compared to the data file using different inspection algorithms to locate faults where the inspection is unable to discern if the reticle pattern is within the specification range. At the wafer printability level, again a simple set of rules can be applied to the modeled wafer level pattern, or the modeled wafer level pattern can be compared to the modeled ideal pattern, and errors can be identified by comparing edge placement of each individual feature.

As described above, the data could also be segmented based on designer intent, and different levels of checks could be applied based on how critical a given area is to the functioning of the device. These different care regions could be evaluated with different sensitivity for all three rule checks. For example, the reticle manufacturability check could be set to allow very difficult, but not impossible, features to be included in the most electrically critical parts of the circuit, but not in less critical regions. Similarly, the inspectability checks could allow some very difficult-to-inspect patterns in some areas, but not in others. This approach could be used to minimize the number of difficult features and increase the yield of good reticles and devices.

The proposed methods and systems greatly reduce the time to fabrication of good reticles and good devices from the complete manufacturing cycle by reducing costly delays and “re-spins.” A re-spin is the worst case scenario in which the reticles are made, wafers are processed, and then defects are detected at final test which render the devices unworkable. The entire design must then be reworked, new reticles made, and new wafers produced, all at great cost and with serious delays in time-to-market. The methods and systems described herein reduce excessive reticle write time trying to write unprintable images, reduce costly delays in inspection, and reduce the chance of the final chips failing to function properly due to errors in the pattern layout.

The proposed methods and systems also have several advantages in terms of design for manufacturing. For example, the system operates on the final database just prior to mask writing. Therefore, every modification of the original design, including OPC and mask process offsets, is included in the data. The methods and systems described herein can also be calibrated to reflect the actual mask process either through the use of external data (SEM images), or by sharing data with the existing calibration schemes employed by die-to-database reticle inspection tools. This approach allows the user to simulate and test how the mask will appear if it were written using different mask writing tools or processes, and the best process could be selected for each design.

For all of the process steps described herein (reticle writing, reticle inspection, and pattern transfer to the wafer level), it is also possible to create auto-correlation software which redraws the RET features so that they do pass the desired rules, thus automating the correction process. The computer-implemented methods could be implemented as software that could be operated either on a computer system or a local network of computers, or it could be operated over a remote connection such as a web based Internet connection. This mode could be especially useful for fabless semiconductor companies who send their designs out to foundries for manufacturing. By checking their design before shipping the data to the foundry, errors can be caught and corrected quickly, thereby greatly reducing the cost and cycle time of the manufacturing process.

Although the methods described herein have been described with reference to printability on the wafer, it is to be understood that the methods may also be applied to other pattern transfer processes. For example, the term “pattern transfer” can be used to indicate the wafer printing process (lithography) alone, or it could include etch, polish, and other wafer level processes which result in the final patterned structures at the wafer level. In one such example, the methods may be used to determine etch-ability of the reticle layout data by using the simulated images illustrating how the reticle layout data will be printed on a wafer as input to an etch process model. The etch process model may include any appropriate etch model known in the art. In addition, an etch process model may be created and/or updated as described herein (using experimental data).

Another method relates to a carrier medium that includes program instructions executable on a computer system for performing a method for evaluating reticle layout data. The method includes generating a simulated image using the reticle layout data as input to a model of a reticle manufacturing process. The simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process. In addition, the method includes determining manufacturability of the reticle layout data using the simulated image. The manufacturability is a measure of how accurately the features will be formed on the reticle. The method may include any other step(s) described herein.

Program instructions implementing methods such as those described herein may be transmitted over or stored on a carrier medium. The carrier medium may be a transmission medium such as a wire, cable, or wireless transmission link. The carrier medium may also be a storage medium such as a read-only memory, a random access memory, a magnetic or optical disk, or a magnetic tape.

An additional embodiment relates to a system configured to evaluate reticle layout data. The system includes a computer system. The computer system includes one or more processors. In an embodiment, the computer system may be configured to execute program instructions to perform a computer-implemented method according to the above embodiments. In one particular embodiment, the system may include a computer platform with high speed processing and software, either as a standalone or a networked tool, which would accept RET enhanced design data and un-decorated design data as inputs and predict one or more of the following outputs: 1) areas in which the pattern will not be printed correctly on the reticle; 2) areas in which the reticle will be uninspectable to ensure that the pattern has been printed correctly; and 3) areas in which the pattern on the wafer will not be printed properly. The software could simply report these errors or possibly correct them in a closed loop mode.

The computer system may take various forms, including a personal computer system, mainframe computer system, workstation, network appliance, Internet appliance, or other device. In general, the term “computer system” may be broadly defined to encompass any device having one or more processors, which executes instructions from a memory medium.

The program instructions may be implemented in any of various ways, including procedure-based techniques, component-based techniques, and/or object-oriented techniques, among others. For example, the program instructions may be implemented using ActiveX controls, C++ objects, JavaBeans, Microsoft Foundation Classes (“MFC”), or other technologies or methodologies, as desired.

FIG. 6 illustrates one embodiment of a system that can be used to perform one or more of the methods described herein. The system includes a computer system. The computer system includesprocessor70. The processor may include any suitable processor known in the art. For example, the processor may be an image computer or a parallel processor. The system may also include more than one processor. The system also includescarrier medium72. The carrier medium may be configured as described above. For example,carrier medium72 includesprogram instructions74, which are executable onprocessor70. The program instructions may be executable for performing any of the embodiments of the methods described above. The program instructions may be further configured as described above.

In some embodiments, the system may also include reticle inspection and/ormetrology tool76. Reticle inspection and/ormetrology tool76 may be configured to detect defects (not shown) onreticle78 and/or to measure one or more characteristics of features (not shown) formed onreticle78. Reticle inspection and/ormetrology tool76 may be coupled toprocessor70. For example, one or more components oftool76 may be coupled toprocessor70 by a transmission medium (not shown). The transmission medium may include “wired” and “wireless” portions. In another example,detector80 oftool76 may be configured to generateoutput82. The output may be transmitted across a transmission medium fromdetector80 toprocessor70. In addition,detector84 oftool76 may be configured to generateoutput86, which may be transmitted across a transmission medium fromdetector84 toprocessor70. In some embodiments,

output

82 and86 may also be transmitted through one or more electronic components coupled between the detectors and the processor. Therefore,

output

82 and86 are transmitted fromtool76 to the processor.

Output

82 and86 may include inspection data and/or metrology data.Program instructions74 may be executable on the processor to perform one or more of the computer-implemented methods described herein usingoutput82 and/or86.

Reticle inspection and/ormetrology tool76 includesstage88 upon whichreticle78 may be disposed during inspection and/or measurements. The stage may include any suitable mechanical or robotic assembly known in the art. Reticle inspection and/ormetrology tool76 also includeslight source90.Light source90 may include any appropriate light source known in the art. In addition, the tool may includebeam splitter92, which is configured to direct light fromlight source90 ontoreticle78 at angles that are approximately normal to an upper surface ofreticle78. The beam splitter may include any suitable beam splitter known in the art. Alternatively, the light source may be configured such that the light is directed at an oblique angle of illumination to the surface ofreticle78.Detector80 is configured to detect light reflected from the upper surface ofreticle78 and transmitted bybeam splitter92.Detector80 is also configured to generateoutput82.Detector84 is configured to detect light transmitted byreticle78.Detector84 also generatesoutput86. In this manner,tool76 may be configured to detect defects on the reticle using reflected and/or transmitted light. The detectors may include any suitable detectors known in the art.

Although one general configuration of a reticle inspection and/or metrology tool is shown inFIG. 6, it is to be understood that the tool may have any suitable configuration known in the art. For example, the tool may include one of the 8250, 8250-R, or 8450 tools that are commercially available from KLA-Tencor. In addition, the tool may have various configurations such as optical imaging systems, ellipsometer-based systems, scatterometer-based systems or e-beam systems such as a CD SEM.

Furthermore, although the processor of the computer system is shown inFIG. 6 coupled to a reticle inspection and/or metrology tool, it is to be understood that the computer system may be configured as a stand alone tool in another embodiment. For example, the computer system may include one or more components that are specifically designed (and optionally dedicated) to performing one or more of the methods described herein. The computer system may also be configured to perform any other method(s) such as a method for generating an integrated circuit design.

Further modifications and alternative embodiments of various aspects of the invention may be apparent to those skilled in the art in view of this description. For example, methods, systems, and carrier media for evaluating reticle layout data are provided. Accordingly, this description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the general manner of carrying out the invention. It is to be understood that the forms of the invention shown and described herein are to be taken as the presently preferred embodiments. Elements and materials may be substituted for those illustrated and described herein, parts and processes may be reversed, and certain features of the invention may be utilized independently, all as would be apparent to one skilled in the art after having the benefit of this description of the invention. Changes may be made in the elements described herein without departing from the spirit and scope of the invention as described in the following claims.

Claims

1. A computer-implemented method for evaluating reticle layout data, comprising:

generating a simulated image using the reticle layout data as input to a model of a reticle manufacturing process, wherein the simulated image illustrates how features of the reticle layout data will be formed on a reticle by the reticle manufacturing process; and

determining manufacturability of the reticle layout data using the simulated image, wherein the manufacturability is a measure of how accurately the features will be formed on the reticle.

2. The method ofclaim 1, wherein said determining comprises applying design rule checks to the simulated image.

3. The method ofclaim 1, wherein said determining comprises comparing the simulated image to the reticle layout data.

4. The method ofclaim 1, wherein said determining comprises analyzing different portions of the simulated image based on designer intent data associated with the different portions.

5. The method ofclaim 1, further comprising altering the reticle layout data with reticle processing biases prior to said generating.

6. The method ofclaim 1, wherein the model is specific to a reticle writing tool that will be used to perform the reticle manufacturing process.

7. The method ofclaim 1, further comprising altering the model using data measured on reticles fabricated using the reticle manufacturing process.

8. The method ofclaim 1, further comprising determining inspectability of the reticle layout data using the simulated image.

9. The method ofclaim 8, wherein said determining the inspectability comprises determining an approximate signal-to-noise ratio that data produced by inspection of the reticle will have.

10. The method ofclaim 8, wherein said determining the inspectability comprises determining a defect size that is the smallest that an inspection tool could detect on the reticle.

11. The method ofclaim 8, wherein said determining the inspectability comprises analyzing different portions of the simulated image based on designer intent data associated with the different portions.

12. The method ofclaim 8, further comprising performing said generating for different parameters of the reticle manufacturing process, wherein said determining the inspectability is performed for different simulated images generated with the different parameters.

13. The method ofclaim 12, wherein the different parameters comprise different reticle writing tools.

14. The method ofclaim 13, further comprising selecting one of the different reticle writing tools that could produce reticles with higher inspectability than another of the different reticle writing tools.

15. The method ofclaim 1, further comprising determining printability of the reticle layout data using the simulated image.

16. The method ofclaim 15, wherein said determining the printability comprises generating an additional simulated image that illustrates how the features of the reticle will be printed on a wafer by a lithography process.

17. The method ofclaim 16, wherein said determining the printability further comprises applying design rule checks to the additional simulated image.

18. The method ofclaim 16, wherein said determining the printability further comprises applying optical rule checks to the additional simulated image.

19. The method ofclaim 16, wherein said determining the printability further comprises comparing the additional simulated image to an ideal image of the features and locating errors in the additional simulated image by comparing edge placement of individual features in the additional simulated image to edge placement of corresponding features in the ideal image.

20. The method ofclaim 16, wherein said determining the printability further comprises analyzing different portions of the additional simulated image based on designer intent data associated with the different portions.

21. The method ofclaim 15, wherein said determining the printability comprises generating additional simulated images that illustrate how the features of the reticle will be printed on a wafer by a lithography process at different process parameters.

22. The method ofclaim 21, wherein the different process parameters comprise different types of lithography exposure tools.

23. The method ofclaim 15, wherein said determining the printability comprises generating an additional simulated image that illustrates how the features of the reticle will be printed on a wafer by a lithography process using the simulated image as input to a lithography process model, the method further comprising altering the lithography process model using data measured on wafers printed using the lithography process.

24. The method ofclaim 1, wherein the simulated image further illustrates how all of the features of the reticle layout data will be formed on the reticle.

25. The method ofclaim 1, wherein the reticle layout data comprises optical proximity correction feature data, aberration correction feature data, phase shift feature data, or a combination thereof.

26. The method ofclaim 1, further comprising altering one or more parameters of the reticle manufacturing process to generate one or more revised reticle manufacturing processes, performing said generating and said determining for the one or more revised reticle manufacturing processes, and determining which of the one or more revised reticle manufacturing processes provides the largest improvement in the manufacturability of the reticle layout data.

27. The method ofclaim 26, wherein the one or more parameters comprise different types of mask writing tools.

28. The method ofclaim 1, wherein said determining comprises identifying defects in the reticle layout data based on the simulated image.

29. The method ofclaim 28, further comprising allowing a user to review the defects and to alter the reticle layout data to correct the defects.

30. The method ofclaim 28, further comprising altering the reticle layout data to correct the defects.

31. A carrier medium, comprising program instructions executable on a computer system for performing a method for evaluating reticle layout data, wherein the method comprises:

32. A system configured to evaluate reticle layout data, comprising:

a computer system; and

a carrier medium comprising program instructions executable on the computer system for: