US20060042785A1 - Pumped fluid cooling system and method - Google Patents
Pumped fluid cooling system and methodDownload PDFInfo
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- US20060042785A1 US20060042785A1US10/927,800US92780004AUS2006042785A1US 20060042785 A1US20060042785 A1US 20060042785A1US 92780004 AUS92780004 AUS 92780004AUS 2006042785 A1US2006042785 A1US 2006042785A1
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- fluid
- interface layer
- cooling system
- pumped
- heat exchanger
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0263—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry or cross-section of header box
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
Definitions
- the present inventionrelates generally to the field of cooling systems. More specifically, the present invention relates to the field of pumped fluid cooling systems.
- the total “temperature budget,” or the difference between the peak device temperature (T Device, peak ) and the temperature of the cold fluid inlet (T fluid inlet )is consumed by the total heat power (q(W)) flowing through four separate resistances.
- FIG. 1illustrates such a resistance model for an exemplary pumped fluid cooling system.
- the device/attach resistances(R Device and attach ) dissipate a significant amount of q(W).
- the spreading resistance(R spread ) accounts for spreading the heat from a small device into a larger heat exchanger (hx).
- the R spreadincreases with the ratio of the hx to device area.
- the convection resistance(R convention ) accounts for conducting the heat into the fluid from the hx walls. It is equal to 1/hA, where h is the convection coefficient and A is the total wetted surface area within the hx. This resistance increases strongly with increasing values of the minimum feature size of the hydraulic diameter (d).
- the advection resistanceaccounts for the heating of the fluid as it transverses the hx, and is approximately equal to C/mc, where m is the mass flowrate and c is the specific heat capacity per unit mass and C is a constant near 0.5.
- Traditional heat exchangersuse relatively large dimensions ranging in size from two times to four times the size of the area of the device being cooled. These dimensions result in relatively large values of R spread .
- Traditional heat exchangersalso have large internal features, usually 0.3 mm or larger. These dimensions result in relatively large values of R convection . These relatively large values of R spread and R convection result in an inefficient pumped fluid system.
- FIG. 2a resistance model of a current pumped fluid system 20 of the prior art is illustrated.
- current pumped fluid systems 20utilize heat exchangers that are two to four times the size of the device being cooled.
- This current designtherefore includes a large spreading resistance 22 , which continues to increase as the surface area ratio of (hx/device being cooled) increases.
- current pumped fluid systems 20have large hydraulic diameters (d). Referring back to the R convection formula 1/hA, as the hx d increases the total wetted surface area A decreases, thus according to 1/hA, causing a relatively large convection resistance 24 .
- the current pumped fluid systems 20have large values of d (and very small values of A), a great deal of the temperature budget is used in this part of the resistance chain. To stay within the total temperature budget at this point requires the current pumped fluid system 20 to have a very small advection resistance 26 . Therefore, referring back to the R advection formula C/cm, the R advection may be reduced significantly by creating very large mass flow rates m. Of course, this puts large demands on the pump requirements for a pumped fluid system 20 .
- pumped fluid cooling systems of the prior artrequire specific fluids to operate effectively with the system, e.g., to avoid freezing at low temperatures.
- Such fluidsinclude those with high concentrations of ethylene glycol or propylene glycol, or similar substances.
- the characteristics of such fluidsinclude a low heat capacity and a high viscosity and do not function well in a system having a reduced flowrate.
- the present inventionis a pumped fluid cooling system and method.
- the pumped fluid cooling system and methodincludes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system.
- the pumped fluid cooling system and methodalso includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mass increases.
- a pumped fluid cooling system for cooling a devicecomprises a heat exchanger, the heat exchanger including an interface layer coupled to the device for cooling the device and a fluid pumped through the interface layer of the heat exchanger, the fluid having an inlet temperature and an outlet temperature, wherein the pumped fluid cooling system is configured such that the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
- the pumped fluid cooling systemfurther comprises a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.
- the plurality of microchannelshave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the pumped fluid cooling systemfurther comprises a plurality of pillars configured in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.
- the plurality of pillarshave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the pumped fluid cooling systemfurther comprises a microporous structure disposed on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.
- the plurality of pores of the microporous structurehave a surface to volume ratio greater than 1000 m ⁇ 1 .
- a first surface area of the interface layer that is coupled to the deviceis less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
- the viscosity of the fluid at its average temperature in the heat exchangeris less than 150% of the viscosity of water.
- the heat capacity per unit mass of the fluid at its average temperature in the heat exchangeris greater than 80% of the heat capacity per unit mass of water.
- the fluidconsists of at least 90% water by mass.
- a method of efficiently cooling a device in a pumped fluid cooling systemcomprises decreasing a spread resistance between an interface layer of a heat exchanger and the device, decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature, increasing an advection resistance and adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity, wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
- the step of decreasing the convention resistanceincludes configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.
- the plurality of microchannelshave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the step of decreasing the convection resistanceincludes configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.
- the plurality of pillarshave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the step of decreasing the convection resistanceincludes disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.
- the plurality of pores of the microporous structurehave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the step of decreasing the spread resistanceincludes reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
- the step of adjusting the composition of the fluidincludes decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water.
- the step of adjusting the composition of the fluidincludes increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water.
- the fluidconsists of at least 90% water by mass.
- a pumped fluid cooling system for cooling a devicecomprises means for decreasing a spread resistance between an interface layer of a heat exchanger and the device, means for decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature, means for increasing an advection resistance and means for adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity, wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
- the means for decreasing the convention resistanceincludes means for configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.
- the plurality of microchannelshave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the means for decreasing the convection resistanceincludes means for configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.
- the plurality of pillarshave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the means for decreasing the convection resistanceincludes means for disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.
- the plurality of pores of the microporous structurehave a surface to volume ratio greater than 1000 m ⁇ 1 .
- the means for decreasing the spread resistanceincludes means for reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
- the means for adjusting the composition of the fluidincludes means for decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water.
- the means for adjusting the composition of the fluidincludes means for increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water.
- the fluidconsists of at least 90% water by mass.
- an apparatus for cooling an integrated circuitcomprises a heat exchanger including an interface layer coupled to the integrated circuit, wherein a first surface area of the interface layer that is coupled to the integrated circuit is less than or equal to 150% of a second surface area of the integrated circuit that is coupled to the interface layer, such that a spread resistance between the interface layer and the integrated circuit is decreased, a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 1000 m ⁇ 1 , such that a convection resistance is decreased and a fluid pumped through the heat exchanger, such that a flowrate of the fluid increases an advection resistance, wherein the fluid consists of at least 90% water by mass.
- the viscosity of the fluid at its average temperature in the heat exchangeris less than 150% of the viscosity of water.
- the heat capacity per unit mass of the fluid at its average temperature in the heat exchangeris greater than 80% of the heat capacity per unit mass of water.
- a pumped fluid cooling system for cooling a devicecomprises a spread resistance, wherein the spread resistance is decrease when a heat exchanger including an interface layer is coupled to the device, further wherein a first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer, a convection resistance, wherein the convection resistance is decreased when a plurality of microchannels is configured in a predetermined pattern along the interface layer, and further wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 1000 m ⁇ 1 and an advection resistance, wherein the advection resistance is increased when a fluid is pumped through the heat exchanger, such that a flowrate of the fluid decreases, wherein the fluid consists of at least 90% water by mass.
- the pumped fluid cooling system as claimed in claim 37wherein the fluid is water.
- FIG. 1is a graphical representation illustrating an exemplary temperature budget resistance model.
- FIG. 2is a graphical representation illustrating a temperature budget resistance model according to the prior art.
- FIG. 3is a graphical representation illustrating a temperature budget resistance model according to an embodiment of the present invention.
- FIG. 4Ais a graphical representation illustrating a top view of a manifold layer of a heat exchanger in accordance with the present invention.
- FIG. 4Bis a graphical representation illustrating an exploded view of a heat exchanger with a manifold layer in accordance with the present invention.
- FIG. 5is a graphical representation illustrating a perspective view of an interface layer having a micro-pin layer and a foam layer in accordance with the present invention.
- FIG. 6is a flowchart illustrating a method of efficiently cooling a device in a pumped fluid cooling system in accordance with the present invention.
- FIG. 3is a graphical representation of the preferred embodiment of the present invention.
- the preferred embodiment of the present inventionincludes new relative magnitudes of the advection 36 , convection 34 , and spreading 32 components of the resistance for a pumped fluidic system (PFS) 30 , which enable lower pump flowrates and, consequently, pumps that are smaller and consume less power.
- the new relative magnitudes of these resistancesare enabled by a micro hx as described below with feature sizes in the range of 15-300 microns. Still referring to FIG. 3 , this micro hx of the PFS 30 of the preferred embodiment of the present invention allows for a smaller spread resistance 32 and smaller convection resistance 34 , thereby conserving the temperature budget. This conservation allows for a higher advection 36 component.
- the micro hx of the present inventiondecreases the spreading 32 component by reducing the size of the cooling surface of the micro hx such that it is less than or equal to 150% of the size of the surface of the device that is being cooled by the micro hx.
- the convection 34 componentis again equal to 1/hA, where h is the convection coefficient and A is the total wetted surface area of the micro hx.
- This convection 34 componentis decreased as the wetted surface area in the micro hx is greatly increased relative to current pumped fluidic systems.
- the wetted surface area of the micro hxis increased by incorporating pillars, foam and/or channels having internal feature sizes in the range of 15-300 microns and surface to volume ratios greater than 1000 m ⁇ 1 .
- the structure of the micro hxis explained in greater detail below.
- a heat exchangercaptures thermal energy generated from a heat source by passing fluid through selective areas of the interface layer which is preferably coupled to the heat source.
- the fluidis directed to specific areas in the interface layer to cool the hot spots and areas around the hot spots to generally create temperature uniformity across the heat source while maintaining a small pressure drop within the heat exchanger.
- the heat exchangerutilizes a plurality of apertures, channels and/or fingers in the manifold layer as well as conduits in the intermediate layer to direct and circulate fluid to and from selected hot spot areas in the interface layer.
- the heat exchangerincludes several ports which are specifically disposed in predetermined locations to directly deliver fluid to and remove fluid from the hot spots to effectively cool the heat source.
- FIG. 4Aillustrates a top view of an exemplary manifold layer 106 of the present invention.
- the manifold layer 106includes four sides as well as a top surface 130 and a bottom surface 132 .
- the top surface 130is removed in FIG. 4A to adequately illustrate and describe the workings of the manifold layer 106 .
- the manifold layer 106has a series of channels or passages 116 , 118 , 120 , 122 as well as ports 108 , 109 formed therein.
- the fingers 118 , 120extend completely through the body of the manifold layer 106 in the Z-direction, as shown in FIG. 4B .
- the fingers 118 and 120extend partially through the manifold layer 106 in the Z-direction and have apertures as shown in FIG. 4A .
- passages 116 and 122extend partially through the manifold layer 106 .
- the remaining areas between the inlet and outlet passages 116 , 120designated as 107 , extend from the top surface 130 to the bottom surface 132 and form the body of the manifold layer 106 .
- the fluidenters the manifold layer 106 via the inlet port 108 and flows along the inlet channel 116 to several fingers 118 which branch out from the channel 116 in several X and Y directions to apply fluid to selected regions in the interface layer 102 .
- the fingers 118are preferably arranged in different predetermined directions to deliver fluid to the locations in the interface layer 102 corresponding to the areas at and near the hot spots in the heat source. These locations in the interface layer 102 are hereinafter referred to as interface hot spot regions.
- the fingersare configured to cool stationary interface hot spot regions as well as temporally varying interface hot spot regions. As shown in FIG.
- the channels 116 , 122 and fingers 118 , 120are disposed in the X and Y directions in the manifold layer 106 and extend in the Z direction to allow circulation between the manifold layer 106 and the interface layer 102 .
- the various directions of the channels 116 , 122 and fingers 118 , 120allow delivery of fluid to cool hot spots in the heat source 99 and/or minimize pressure drop within the heat exchanger 100 .
- the arrangement as well as the dimensions of the fingers 118 , 120are determined in light of the hot spots in the heat source 99 that are desired to be cooled.
- the locations of the hot spots as well as the amount of heat produced near or at each hot spotare used to configure the manifold layer 106 such that the fingers 118 , 120 are placed above or proximal to the interface hot spot regions in the interface layer 102 .
- the manifold layer 106allows one phase and/or two-phase fluid to circulate to the interface layer 102 without allowing a substantial pressure drop from occurring within the heat exchanger 100 .
- the fluid delivery to the interface hot spot regionscreates a uniform temperature at the interface hot spot region as well as areas in the heat source adjacent to the interface hot spot regions.
- the dimensions as well as the number of channels 116 and fingers 118depend on a number of factors.
- the inlet and outlet fingers 118 , 120have the same width dimensions.
- the inlet and outlet fingers 118 , 120have different width dimensions.
- the width dimensions of the fingers 118 , 120are within the range of and including 0.25-1.00 millimeters.
- the inlet and outlet fingers 118 , 120have the same length and depth dimensions.
- the inlet and outlet fingers 118 , 120have different length and depth dimensions.
- the inlet and outlet fingers 118 , 120have varying width dimensions along the length of the fingers.
- the length dimensions of the inlet and outlet fingers 118 , 120are within the range of and including 0.5 millimeters to three times the size of the heat source length.
- the fingers 118 , 120have a height or depth dimension within the range and including 0.25-1.00 millimeters.
- less than 10 or more than 30 fingers per centimeterare disposed in the manifold layer 106 . However, it is apparent to one skilled in the art that between 10 and 30 fingers per centimeter in the manifold layer is also contemplated.
- the geometries of the fingers 118 , 120 and channels 116 , 122are in non-periodic arrangement to aid in optimizing hot spot cooling of the heat source.
- the spatial distribution of the heat transfer to the fluidis matched with the spatial distribution of the heat generation.
- the fluidflows along the interface layer 102 , its temperature increases and as it begins to transform to vapor under two-phase conditions.
- the fluidundergoes a significant expansion which results in a large increase in velocity.
- the efficiency of the heat transfer from the interface layer to the fluidis improved for high velocity flow.
- a particular fingercan be designed for a heat source where there is higher heat generation near the inlet.
- a fingercan be designed to start out with a small cross sectional area at the inlet to cause high velocity flow of fluid.
- the particular finger or channelcan also be configured to expand to a larger cross-section at a downstream outlet to cause a lower velocity flow. This design of the finger or channel allows the heat exchanger to minimize pressure drop and optimize hot spot cooling in areas where the fluid increases in volume, acceleration and velocity due to transformation from liquid to vapor in two-phase flow.
- the fingers 118 , 120 and channels 116 , 122can be designed to widen and then narrow again along their length to increase the velocity of the fluid at different places in the microchannel heat exchanger 100 .
- the manifold layer 106includes one or more apertures 119 in the inlet fingers 118 .
- the fluid flowing along the fingers 118flows down the apertures 119 to the intermediate layer 104 .
- the manifold layer 106includes apertures 121 in the outlet fingers 120 .
- the fluid flowing from the intermediate layer 104flows up the apertures 121 into the outlet fingers 120 .
- the inlet and outlet fingers 118 , 120are open channels which do not have apertures.
- the bottom surface 103 of the manifold layer 106abuts against the top surface of the intermediate layer 104 in the three tier exchanger 100 or abuts against the interface layer 102 in the two tier exchanger.
- fluidflows freely to and from the intermediate layer 104 and the manifold layer 106 .
- the fluidis directed to and from the appropriate interface hot spot region by conduits 105 the intermediate layer 104 . It is apparent to one skilled in the art that the conduits 105 are directly aligned with the fingers, as described below or positioned elsewhere in the three tier system.
- FIG. 4Bshows the three tier heat exchanger 100 with the manifold layer
- the heat exchanger 100is alternatively a two layer structure which includes the manifold layer 106 and the interface layer 102 , whereby fluid passes directly between the manifold layer 106 and interface layer 102 without passing through the interface layer 104 .
- the configuration of the manifold, intermediate and interface layers shownare for exemplary purposes and is thereby not limited to the configuration shown.
- the intermediate layer 104includes a plurality of conduits 105 which extend therethrough.
- the inflow conduits 105direct fluid entering from the manifold layer 106 to the designated interface hot spot regions in the interface layer 102 .
- the apertures 105also channel fluid flow from the interface layer 102 to the exit fluid port(s) 109 .
- the intermediate layer 104also provides fluid delivery from the interface layer 102 to the exit fluid port 109 where the exit fluid port 108 is in communication with the manifold layer 106 .
- the conduits 105are positioned in the interface layer 104 in a predetermined pattern based on a number of factors including, but not limited to, the locations of the interface hot spot regions, the amount of fluid flow needed in the interface hot spot region to adequately cool the heat source 99 and the temperature of the fluid.
- the conduitshave a width dimension of 100 microns, although other width dimensions are contemplated up to several millimeters.
- the conduits 105have other dimensions dependent on at least the above mentioned factors. It is apparent to one skilled in the art that each conduit 105 in the intermediate layer 104 has the same shape and/or dimension, although it is not necessary. For instance, like the fingers described above, the conduits alternatively have a varying length and/or width dimension.
- conduits 105may have a constant depth or height dimension through the intermediate layer 104 .
- the conduits 105have a varying depth dimension, such as a trapezoidal or a nozzle-shape, through the intermediate layer 104 .
- the intermediate layer 104is horizontally positioned within the heat exchanger 100 with the conduits 105 positioned vertically. Alternatively, the intermediate layer 104 is positioned in any other direction within the heat exchanger 100 including, but not limited to, diagonal and curved forms. Alternatively, the conduits 105 are positioned within the intermediate layer 104 in a horizontally, diagonally, curved or any other direction. In addition, the intermediate layer 104 preferably extends horizontally along the entire length of the heat exchanger 100 , whereby the intermediate layer 104 completely separates the interface layer 102 from the manifold layer 106 to force the fluid to be channeled through the conduits 105 .
- a portion of the heat exchanger 100does not include the intermediate layer 104 between the manifold layer 106 and the interface layer 102 , whereby fluid is free to flow therebetween.
- the intermediate layer 104alternatively extends vertically between the manifold layer 106 and the interface layer 102 to form separate, distinct intermediate layer regions.
- the intermediate layer 104does not fully extend from the manifold layer 106 to interface layer 102 .
- FIG. 4Billustrates a perspective view of the interface layer 102 in accordance with the present invention.
- the interface layer 102includes a bottom surface 103 and a plurality of microchannel walls 110 , whereby the area in between the microchannel walls 110 channels or directs fluid along a fluid flow path.
- the bottom surface 103is flat and has a high thermal conductivity to allow sufficient heat transfer from the heat source 99 .
- the bottom surface 103includes troughs and/or crests designed to collect or repel fluid from a particular location.
- the microchannel walls 110are preferably configured in a parallel configuration, as shown in FIG. 4B , whereby fluid flows between the microchannel walls 110 along a fluid path.
- the microchannel walls 110have non-parallel configurations.
- microchannel walls 110are alternatively configured in any other appropriate configuration depending on the factors discussed above.
- the microchannel walls 110have dimensions which minimize the pressure drop or differential within the interface layer 102 .
- any other features, besides microchannel walls 110are also contemplated, including, but not limited to, pillars 203 ( FIG. 5 ), roughed surfaces, and a micro-porous structure, such as sintered metal and silicon foam 213 ( FIG. 5 ) or a combination.
- An alternative interface layer 202 incorporating both pillars 203 and foam microporous 213 insertsis depicted in FIG. 5 .
- the parallel microchannel walls 110 shown in FIG. 4Bis used to describe the interface layer 102 in the present invention.
- the top surface of the manifold layer 106is cut away to illustrate the channels 116 , 122 and fingers 118 , 120 within the body of the manifold layer 106 .
- the locations in the heat source 99 that produce more heatare hereby designated as hot spots, whereby the locations in the heat source 99 which produce less heat are hereby designated as warm spots.
- the heat source 99is shown to have a hot spot region, namely at location A, and a warm spot region, namely at location B.
- the areas of the interface layer 102 which abut the hot and warm spotsare accordingly designated interface hot spot regions.
- the interface layer 102includes interface hot spot region A, which is positioned above location A and interface hot spot region B, which is positioned above location B.
- fluidinitially enters the heat exchanger 100 through one inlet port 108 .
- the fluidthen flows to one inlet channel 116 .
- the heat exchanger 100includes more than one inlet channel 116 .
- fluid flowing along the inlet channel 116 from the inlet port 108initially branches out to finger 118 D.
- the fluid which continues along the rest of the inlet channel 116flows to individual fingers 118 B and 118 C and so on.
- fluidis supplied to interface hot spot region A by flowing to the finger 118 A, whereby fluid preferably flows down through finger 118 A to the intermediate layer 104 .
- the fluidthen flows through the inlet conduit 105 A, positioned below the finger 118 A, to the interface layer 102 , whereby the fluid undergoes thermal exchange with the heat source 99 .
- the fluidtravels along the microchannels 110 as shown in FIG. 4B , although the fluid may travel in any other direction along the interface layer 102 .
- the heated liquidthen travels upward through the conduit 105 B to the outlet finger 120 A.
- fluidflows down in the Z-direction through fingers 118 E and 118 F to the intermediate layer 104 .
- the fluidthen flows through the inlet conduit 105 C down in the Z-direction to the interface layer 102 .
- the heated fluidthen travels upward in the Z-direction from the interface layer 102 through the outlet conduit 105 D to the outlet fingers 120 E and 120 F.
- the heat exchanger 100removes the heated fluid in the manifold layer 106 via the outlet fingers 120 , whereby the outlet fingers 120 are in communication with the outlet channel 122 .
- the outlet channel 122allows fluid to flow out of the heat exchanger through one outlet port 109 .
- each outlet finger 120is preferably configured to be positioned closest to a respective inlet finger 119 for a particular interface hot spot region to minimize pressure drop therebetween.
- fluidenters the interface layer 102 via the inlet finger 118 A and travels the least amount of distance along the bottom surface 103 of the interface layer 102 before it exits the interface layer 102 to the outlet finger 120 A. It is apparent that the amount of distance which the fluid travels along the bottom surface 103 adequately removes heat generated from the heat source 99 without generating an unnecessary amount of pressure drop.
- the comers in the fingers 118 , 120are curved to reduce pressure drop of the fluid flowing along the fingers 118 .
- the configuration of the manifold layer 106 shown in FIGS. 4A and 4Bis only for exemplary purposes.
- the configuration of the channels 116 and fingers 118 in the manifold layer 106depend on a number of factors, including but not limited to, the locations of the interface hot spot regions, amount of flow to and from the interface hot spot regions as well as the amount of heat produced by the heat source in the interface hot spot regions. Any other configuration of channels 116 and fingers 118 is contemplated.
- the preferred embodiment of the present inventionincludes microchannels 110 in the interface layer 102 .
- the internal feature size of the microchannels 110are in the range of 15-300 microns, and the surface to volume ratios of the microchannels are greater than 1000 m ⁇ 1 .
- the present inventioncontemplates further embodiments contemplating microchannels not entirely within the stated ranges.
- FIG. 5further embodiments also contemplate utilizing alternatives to the microchannels 110 ( FIG. 4B ) of the preferred embodiment such as pillars 203 , roughed surfaces or a micro-porous structure, such as sintered metal and silicon foam 213 .
- any of these alternativescould be used instead of the microchannels 110 , or they could be used in combination as an alternative interface layer 202 .
- these alternativesmay be used in any conceivable combination with the microchannels 110 .
- any alternative listed above or combination thereofhas internal features sizes and a surface to volume ration that conforms to those set out in the preferred embodiment of the present invention.
- the fluid composition used in the pumped fluid system on the preferred embodiment of the present inventionis also critical in achieving the desired relative resistance levels. Specifically, the heat capacity and viscosity become important when the desired relative resistance levels are achieved. Using micro dimensions as those described in the preferred embodiment can dramatically increase the pumping pressure drop. Using low fluid flowrates makes the performance highly sensitive to the fluid heat capacity per unit mass, which governs its heat absorbing properties.
- fluid with very high heat capacity per unit mass (enabling high absorption) and low viscosity (enabling low pressure drop in a micro hx)are required.
- a fluid at its average temperature in the heat exchanger, having a viscosity, greater than 150% of the viscosity of water and a heat capacity greater than 80% of wateris required.
- the fluidconsists of at least 90% of water by mass.
- FIG. 6depicts a method of efficiently cooling a device in a pumped fluid cooling system 400 of the preferred embodiment of the present invention.
- the method 400starts in step 410 , by decreasing the relative spread resistance in a pumped fluid system. This is achieved by limited the size of the cooling surface of the micro hx relative to the surface of the device being cooled. Preferably, to equal to or less than 150% of the surface of the device being cooled.
- the relative convection resistance of the pumped fluid systemis decreased by increasing the total wetted surface area in the micro hx. This is accomplished by reducing the internal feature sizes of the micochannels in the micro hx, preferably to a size in the range of 15-300 microns, with a surface to volume ratio of 1000 m ⁇ 1 .
- step 430the relative advection resistance for the pumped fluid system is increased. This is preferably done by decreasing the flowrate m, where the advection resistance equals C/mc, where C is a constant near 0.5 and c is the specific heat capacity per unit mass.
- the last step in this method 400is step 440 , by adjusting the fluid composition in the pumped fluid system such that the fluid has a relatively high heat capacity and a low viscosity.
- the viscosity of the fluid at its average temperature in the heat exchangeris less than 150% of the viscosity of water and the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water. This is preferably achieved by adjusting the fluid such that it consists of at least 90% water by mass.
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- The present invention relates generally to the field of cooling systems. More specifically, the present invention relates to the field of pumped fluid cooling systems.
- In current pumped fluid cooling systems as depicted in
FIG. 1 , the total “temperature budget,” or the difference between the peak device temperature (TDevice, peak) and the temperature of the cold fluid inlet (Tfluid inlet) is consumed by the total heat power (q(W)) flowing through four separate resistances. FIG. 1 illustrates such a resistance model for an exemplary pumped fluid cooling system. The device/attach resistances (RDevice and attach) dissipate a significant amount of q(W). However, the device/attach resistances are not related to the present invention and need no further explanation. The spreading resistance (Rspread) accounts for spreading the heat from a small device into a larger heat exchanger (hx). The Rspreadincreases with the ratio of the hx to device area. The convection resistance (Rconvention) accounts for conducting the heat into the fluid from the hx walls. It is equal to 1/hA, where h is the convection coefficient and A is the total wetted surface area within the hx. This resistance increases strongly with increasing values of the minimum feature size of the hydraulic diameter (d).- Still referring to
FIG. 1 , the advection resistance (Radvection) accounts for the heating of the fluid as it transverses the hx, and is approximately equal to C/mc, where m is the mass flowrate and c is the specific heat capacity per unit mass and C is a constant near 0.5. Traditional heat exchangers use relatively large dimensions ranging in size from two times to four times the size of the area of the device being cooled. These dimensions result in relatively large values of Rspread. Traditional heat exchangers also have large internal features, usually 0.3 mm or larger. These dimensions result in relatively large values of Rconvection. These relatively large values of Rspreadand Rconvectionresult in an inefficient pumped fluid system. - Referring now to
FIG. 2 , a resistance model of a current pumpedfluid system 20 of the prior art is illustrated. As stated earlier, current pumpedfluid systems 20 utilize heat exchangers that are two to four times the size of the device being cooled. This current design therefore includes a large spreadingresistance 22, which continues to increase as the surface area ratio of (hx/device being cooled) increases. Furthermore, current pumpedfluid systems 20 have large hydraulic diameters (d). Referring back to the Rconvectionformula 1/hA, as the hx d increases the total wetted surface area A decreases, thus according to 1/hA, causing a relativelylarge convection resistance 24. - Because the current pumped
fluid systems 20 have large values of d (and very small values of A), a great deal of the temperature budget is used in this part of the resistance chain. To stay within the total temperature budget at this point requires the current pumpedfluid system 20 to have a verysmall advection resistance 26. Therefore, referring back to the Radvectionformula C/cm, the Radvectionmay be reduced significantly by creating very large mass flow rates m. Of course, this puts large demands on the pump requirements for a pumpedfluid system 20. - It should also be noted that pumped fluid cooling systems of the prior art require specific fluids to operate effectively with the system, e.g., to avoid freezing at low temperatures. Such fluids include those with high concentrations of ethylene glycol or propylene glycol, or similar substances. The characteristics of such fluids include a low heat capacity and a high viscosity and do not function well in a system having a reduced flowrate.
- The present invention is a pumped fluid cooling system and method. The pumped fluid cooling system and method includes new relative magnitudes of advection, convection and spreading components of the resistance for a pumped fluid system. The pumped fluid cooling system and method also includes adjusting the chemical composition of the working fluid, specifically adjusting the composition and viscosity as the sensitivity to the fluid heat capacity per unit mass increases.
- In one aspect of the present invention, a pumped fluid cooling system for cooling a device comprises a heat exchanger, the heat exchanger including an interface layer coupled to the device for cooling the device and a fluid pumped through the interface layer of the heat exchanger, the fluid having an inlet temperature and an outlet temperature, wherein the pumped fluid cooling system is configured such that the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
- The pumped fluid cooling system further comprises a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns. The plurality of microchannels have a surface to volume ratio greater than 1000 m−1. The pumped fluid cooling system further comprises a plurality of pillars configured in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns. The plurality of pillars have a surface to volume ratio greater than 1000 m−1.
- The pumped fluid cooling system further comprises a microporous structure disposed on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns. The plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m−1. A first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer. The viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water. The heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water. The fluid consists of at least 90% water by mass.
- In another aspect of the present invention, a method of efficiently cooling a device in a pumped fluid cooling system comprises decreasing a spread resistance between an interface layer of a heat exchanger and the device, decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature, increasing an advection resistance and adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity, wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
- The step of decreasing the convention resistance includes configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns. The plurality of microchannels have a surface to volume ratio greater than 1000 m−1. The step of decreasing the convection resistance includes configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns. The plurality of pillars have a surface to volume ratio greater than 1000 m−1.
- The step of decreasing the convection resistance includes disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns. The plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m−1. The step of decreasing the spread resistance includes reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer. The step of adjusting the composition of the fluid includes decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water. The step of adjusting the composition of the fluid includes increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water. The fluid consists of at least 90% water by mass.
- In yet another aspect of the present invention, a pumped fluid cooling system for cooling a device comprises means for decreasing a spread resistance between an interface layer of a heat exchanger and the device, means for decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature, means for increasing an advection resistance and means for adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity, wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
- The means for decreasing the convention resistance includes means for configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns. The plurality of microchannels have a surface to volume ratio greater than 1000 m−1. The means for decreasing the convection resistance includes means for configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns. The plurality of pillars have a surface to volume ratio greater than 1000 m−1.
- The means for decreasing the convection resistance includes means for disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns. The plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m−1. The means for decreasing the spread resistance includes means for reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
- The means for adjusting the composition of the fluid includes means for decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water. The means for adjusting the composition of the fluid includes means for increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water. The fluid consists of at least 90% water by mass.
- In yet another aspect of the present invention, an apparatus for cooling an integrated circuit comprises a heat exchanger including an interface layer coupled to the integrated circuit, wherein a first surface area of the interface layer that is coupled to the integrated circuit is less than or equal to 150% of a second surface area of the integrated circuit that is coupled to the interface layer, such that a spread resistance between the interface layer and the integrated circuit is decreased, a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 1000 m−1, such that a convection resistance is decreased and a fluid pumped through the heat exchanger, such that a flowrate of the fluid increases an advection resistance, wherein the fluid consists of at least 90% water by mass. The viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water. The heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water.
- In yet another aspect of the present invention, a pumped fluid cooling system for cooling a device comprises a spread resistance, wherein the spread resistance is decrease when a heat exchanger including an interface layer is coupled to the device, further wherein a first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer, a convection resistance, wherein the convection resistance is decreased when a plurality of microchannels is configured in a predetermined pattern along the interface layer, and further wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 1000 m−1and an advection resistance, wherein the advection resistance is increased when a fluid is pumped through the heat exchanger, such that a flowrate of the fluid decreases, wherein the fluid consists of at least 90% water by mass. The pumped fluid cooling system as claimed in claim37 wherein the fluid is water.
FIG. 1 is a graphical representation illustrating an exemplary temperature budget resistance model.FIG. 2 is a graphical representation illustrating a temperature budget resistance model according to the prior art.FIG. 3 is a graphical representation illustrating a temperature budget resistance model according to an embodiment of the present invention.FIG. 4A is a graphical representation illustrating a top view of a manifold layer of a heat exchanger in accordance with the present invention.FIG. 4B is a graphical representation illustrating an exploded view of a heat exchanger with a manifold layer in accordance with the present invention.FIG. 5 is a graphical representation illustrating a perspective view of an interface layer having a micro-pin layer and a foam layer in accordance with the present invention.FIG. 6 is a flowchart illustrating a method of efficiently cooling a device in a pumped fluid cooling system in accordance with the present invention.FIG. 3 is a graphical representation of the preferred embodiment of the present invention. The preferred embodiment of the present invention includes new relative magnitudes of theadvection 36,convection 34, and spreading32 components of the resistance for a pumped fluidic system (PFS)30, which enable lower pump flowrates and, consequently, pumps that are smaller and consume less power. The new relative magnitudes of these resistances are enabled by a micro hx as described below with feature sizes in the range of 15-300 microns. Still referring toFIG. 3 , this micro hx of thePFS 30 of the preferred embodiment of the present invention allows for asmaller spread resistance 32 andsmaller convection resistance 34, thereby conserving the temperature budget. This conservation allows for ahigher advection 36 component.- Referring back to the advection formula once again, C/mc where m is the flowrate, reducing the flowrate m will cause the
advection 36 component to increase. This increase in theadvection 36 component may continue until the total temperature budget is spent. Therefore, in effect, the decrease spreading32 andconvection 34 components allow for a micro hx having a smaller flowrate m andhigher advection 36 component, thereby resulting in less work for the pump, and thus a moreefficient PFS 30. - The micro hx of the present invention decreases the spreading32 component by reducing the size of the cooling surface of the micro hx such that it is less than or equal to 150% of the size of the surface of the device that is being cooled by the micro hx. The
convection 34 component is again equal to 1/hA, where h is the convection coefficient and A is the total wetted surface area of the micro hx. Thisconvection 34 component is decreased as the wetted surface area in the micro hx is greatly increased relative to current pumped fluidic systems. The wetted surface area of the micro hx is increased by incorporating pillars, foam and/or channels having internal feature sizes in the range of 15-300 microns and surface to volume ratios greater than 1000 m−1. The structure of the micro hx is explained in greater detail below. - In order to better understand the description of the preferred embodiment of the present invention described above, it is necessary to also understand the structure and operation of a micro hx according to an embodiment of the present invention. However, it should be understood that the description of the heat exchanger below represents but one design applicable to the present invention, and it has been contemplated that the system and method of the present invention may be applied to any heat exchanger having the requisite dimensions of the preferred embodiment of the present invention.
- Generally, a heat exchanger captures thermal energy generated from a heat source by passing fluid through selective areas of the interface layer which is preferably coupled to the heat source. In particular, the fluid is directed to specific areas in the interface layer to cool the hot spots and areas around the hot spots to generally create temperature uniformity across the heat source while maintaining a small pressure drop within the heat exchanger. As discussed in the different embodiments below, the heat exchanger utilizes a plurality of apertures, channels and/or fingers in the manifold layer as well as conduits in the intermediate layer to direct and circulate fluid to and from selected hot spot areas in the interface layer. Alternatively, the heat exchanger includes several ports which are specifically disposed in predetermined locations to directly deliver fluid to and remove fluid from the hot spots to effectively cool the heat source.
FIG. 4A illustrates a top view of anexemplary manifold layer 106 of the present invention. In particular, as shown inFIG. 4B , themanifold layer 106 includes four sides as well as atop surface 130 and abottom surface 132. However, thetop surface 130 is removed inFIG. 4A to adequately illustrate and describe the workings of themanifold layer 106. As shown inFIG. 4A , themanifold layer 106 has a series of channels orpassages ports fingers manifold layer 106 in the Z-direction, as shown inFIG. 4B . Alternatively, thefingers manifold layer 106 in the Z-direction and have apertures as shown inFIG. 4A . In addition,passages manifold layer 106. The remaining areas between the inlet andoutlet passages top surface 130 to thebottom surface 132 and form the body of themanifold layer 106.- As shown in
FIG. 4A , the fluid enters themanifold layer 106 via theinlet port 108 and flows along theinlet channel 116 toseveral fingers 118 which branch out from thechannel 116 in several X and Y directions to apply fluid to selected regions in theinterface layer 102. Thefingers 118 are preferably arranged in different predetermined directions to deliver fluid to the locations in theinterface layer 102 corresponding to the areas at and near the hot spots in the heat source. These locations in theinterface layer 102 are hereinafter referred to as interface hot spot regions. The fingers are configured to cool stationary interface hot spot regions as well as temporally varying interface hot spot regions. As shown inFIG. 4A , thechannels fingers manifold layer 106 and extend in the Z direction to allow circulation between themanifold layer 106 and theinterface layer 102. Thus, the various directions of thechannels fingers heat source 99 and/or minimize pressure drop within theheat exchanger 100. - The arrangement as well as the dimensions of the
fingers heat source 99 that are desired to be cooled. The locations of the hot spots as well as the amount of heat produced near or at each hot spot are used to configure themanifold layer 106 such that thefingers interface layer 102. Themanifold layer 106 allows one phase and/or two-phase fluid to circulate to theinterface layer 102 without allowing a substantial pressure drop from occurring within theheat exchanger 100. The fluid delivery to the interface hot spot regions creates a uniform temperature at the interface hot spot region as well as areas in the heat source adjacent to the interface hot spot regions. - The dimensions as well as the number of
channels 116 andfingers 118 depend on a number of factors. In one embodiment, the inlet andoutlet fingers outlet fingers fingers outlet fingers outlet fingers outlet fingers outlet fingers fingers manifold layer 106. However, it is apparent to one skilled in the art that between 10 and 30 fingers per centimeter in the manifold layer is also contemplated. - It is contemplated within the present invention to tailor the geometries of the
fingers channels heat source 99, the spatial distribution of the heat transfer to the fluid is matched with the spatial distribution of the heat generation. As the fluid flows along theinterface layer 102, its temperature increases and as it begins to transform to vapor under two-phase conditions. Thus, the fluid undergoes a significant expansion which results in a large increase in velocity. Generally, the efficiency of the heat transfer from the interface layer to the fluid is improved for high velocity flow. Therefore, it is possible to tailor the efficiency of the heat transfer to the fluid by adjusting the cross-sectional dimensions of the fluid delivery andremoval fingers channels heat exchanger 100. This effect will also be realized in single phase flow. - For example, a particular finger can be designed for a heat source where there is higher heat generation near the inlet. In addition, it may be advantageous to design a larger cross section for the regions of the
fingers channels - In addition, the
fingers channels microchannel heat exchanger 100. Alternatively, it may be appropriate to vary the finger and channel dimensions from large to small and back again many times over in order to tailor the heat transfer efficiency to the expected heat dissipation distribution across theheat source 99. It should be noted that the above discussion of the varying dimensions of the fingers and channels also apply to the other embodiments discussed and is not limited to this embodiment. - Alternatively, as shown in
FIG. 4A , themanifold layer 106 includes one or more apertures119 in theinlet fingers 118. In a threetier heat exchanger 100, the fluid flowing along thefingers 118 flows down the apertures119 to theintermediate layer 104. In addition, as shown inFIG. 4A . themanifold layer 106 includesapertures 121 in theoutlet fingers 120. In the threetier heat exchanger 100, the fluid flowing from theintermediate layer 104 flows up theapertures 121 into theoutlet fingers 120. - The inlet and
outlet fingers manifold layer 106 abuts against the top surface of theintermediate layer 104 in the threetier exchanger 100 or abuts against theinterface layer 102 in the two tier exchanger. Thus, in the three-tier heat exchanger 100, fluid flows freely to and from theintermediate layer 104 and themanifold layer 106. The fluid is directed to and from the appropriate interface hot spot region by conduits105 theintermediate layer 104. It is apparent to one skilled in the art that the conduits105 are directly aligned with the fingers, as described below or positioned elsewhere in the three tier system. - Although
FIG. 4B shows the threetier heat exchanger 100 with the manifold layer, theheat exchanger 100 is alternatively a two layer structure which includes themanifold layer 106 and theinterface layer 102, whereby fluid passes directly between themanifold layer 106 andinterface layer 102 without passing through theinterface layer 104. It is apparent to one skilled in the art that the configuration of the manifold, intermediate and interface layers shown are for exemplary purposes and is thereby not limited to the configuration shown. - As shown in
FIG. 4B , theintermediate layer 104 includes a plurality of conduits105 which extend therethrough. The inflow conduits105 direct fluid entering from themanifold layer 106 to the designated interface hot spot regions in theinterface layer 102. Similarly, the apertures105 also channel fluid flow from theinterface layer 102 to the exit fluid port(s)109. Thus, theintermediate layer 104 also provides fluid delivery from theinterface layer 102 to theexit fluid port 109 where theexit fluid port 108 is in communication with themanifold layer 106. - The conduits105 are positioned in the
interface layer 104 in a predetermined pattern based on a number of factors including, but not limited to, the locations of the interface hot spot regions, the amount of fluid flow needed in the interface hot spot region to adequately cool theheat source 99 and the temperature of the fluid. The conduits have a width dimension of100 microns, although other width dimensions are contemplated up to several millimeters. In addition, the conduits105 have other dimensions dependent on at least the above mentioned factors. It is apparent to one skilled in the art that each conduit105 in theintermediate layer 104 has the same shape and/or dimension, although it is not necessary. For instance, like the fingers described above, the conduits alternatively have a varying length and/or width dimension. Additionally, the conduits105 may have a constant depth or height dimension through theintermediate layer 104. Alternatively, the conduits105 have a varying depth dimension, such as a trapezoidal or a nozzle-shape, through theintermediate layer 104. - The
intermediate layer 104 is horizontally positioned within theheat exchanger 100 with the conduits105 positioned vertically. Alternatively, theintermediate layer 104 is positioned in any other direction within theheat exchanger 100 including, but not limited to, diagonal and curved forms. Alternatively, the conduits105 are positioned within theintermediate layer 104 in a horizontally, diagonally, curved or any other direction. In addition, theintermediate layer 104 preferably extends horizontally along the entire length of theheat exchanger 100, whereby theintermediate layer 104 completely separates theinterface layer 102 from themanifold layer 106 to force the fluid to be channeled through the conduits105. Alternatively, a portion of theheat exchanger 100 does not include theintermediate layer 104 between themanifold layer 106 and theinterface layer 102, whereby fluid is free to flow therebetween. Further, theintermediate layer 104 alternatively extends vertically between themanifold layer 106 and theinterface layer 102 to form separate, distinct intermediate layer regions. Alternatively, theintermediate layer 104 does not fully extend from themanifold layer 106 tointerface layer 102. FIG. 4B illustrates a perspective view of theinterface layer 102 in accordance with the present invention. As shown inFIG. 4B , theinterface layer 102 includes a bottom surface103 and a plurality ofmicrochannel walls 110, whereby the area in between themicrochannel walls 110 channels or directs fluid along a fluid flow path. The bottom surface103 is flat and has a high thermal conductivity to allow sufficient heat transfer from theheat source 99. Alternatively, the bottom surface103 includes troughs and/or crests designed to collect or repel fluid from a particular location. Themicrochannel walls 110 are preferably configured in a parallel configuration, as shown inFIG. 4B , whereby fluid flows between themicrochannel walls 110 along a fluid path. Alternatively, themicrochannel walls 110 have non-parallel configurations.- It is apparent to one skilled in the art that the
microchannel walls 110 are alternatively configured in any other appropriate configuration depending on the factors discussed above. In addition, themicrochannel walls 110 have dimensions which minimize the pressure drop or differential within theinterface layer 102. It is also apparent that any other features, besidesmicrochannel walls 110 are also contemplated, including, but not limited to, pillars203 (FIG. 5 ), roughed surfaces, and a micro-porous structure, such as sintered metal and silicon foam213 (FIG. 5 ) or a combination. Analternative interface layer 202 incorporating bothpillars 203 and foam microporous213 inserts is depicted inFIG. 5 . However, for exemplary purposes, theparallel microchannel walls 110 shown inFIG. 4B is used to describe theinterface layer 102 in the present invention. - Referring back to the assembly in
FIG. 4B , the top surface of themanifold layer 106 is cut away to illustrate thechannels fingers manifold layer 106. The locations in theheat source 99 that produce more heat are hereby designated as hot spots, whereby the locations in theheat source 99 which produce less heat are hereby designated as warm spots. As shown inFIG. 4B , theheat source 99 is shown to have a hot spot region, namely at location A, and a warm spot region, namely at location B. The areas of theinterface layer 102 which abut the hot and warm spots are accordingly designated interface hot spot regions. As shown inFIG. 4B , theinterface layer 102 includes interface hot spot region A, which is positioned above location A and interface hot spot region B, which is positioned above location B. - As shown in
FIGS. 4A and 4B , fluid initially enters theheat exchanger 100 through oneinlet port 108. The fluid then flows to oneinlet channel 116. Alternatively, theheat exchanger 100 includes more than oneinlet channel 116. As shown inFIGS. 4A and 4B , fluid flowing along theinlet channel 116 from theinlet port 108 initially branches out tofinger 118D. In addition, the fluid which continues along the rest of theinlet channel 116 flows toindividual fingers - In
FIG. 4B , fluid is supplied to interface hot spot region A by flowing to thefinger 118A, whereby fluid preferably flows down throughfinger 118A to theintermediate layer 104. The fluid then flows through theinlet conduit 105A, positioned below thefinger 118A, to theinterface layer 102, whereby the fluid undergoes thermal exchange with theheat source 99. The fluid travels along themicrochannels 110 as shown inFIG. 4B , although the fluid may travel in any other direction along theinterface layer 102. The heated liquid then travels upward through theconduit 105B to theoutlet finger 120A. Similarly, fluid flows down in the Z-direction throughfingers intermediate layer 104. The fluid then flows through theinlet conduit 105C down in the Z-direction to theinterface layer 102. The heated fluid then travels upward in the Z-direction from theinterface layer 102 through theoutlet conduit 105D to the outlet fingers120E and120F. Theheat exchanger 100 removes the heated fluid in themanifold layer 106 via theoutlet fingers 120, whereby theoutlet fingers 120 are in communication with theoutlet channel 122. Theoutlet channel 122 allows fluid to flow out of the heat exchanger through oneoutlet port 109. - The inflow and outflow conduits105 are also positioned directly or nearly directly above the appropriate interface hot spot regions to directly apply fluid to hot spots in the
heat source 99. In addition, eachoutlet finger 120 is preferably configured to be positioned closest to a respective inlet finger119 for a particular interface hot spot region to minimize pressure drop therebetween. Thus, fluid enters theinterface layer 102 via theinlet finger 118A and travels the least amount of distance along the bottom surface103 of theinterface layer 102 before it exits theinterface layer 102 to theoutlet finger 120A. It is apparent that the amount of distance which the fluid travels along the bottom surface103 adequately removes heat generated from theheat source 99 without generating an unnecessary amount of pressure drop. In addition, as shown inFIGS. 4A and 4B , the comers in thefingers fingers 118. - It is apparent to one skilled in the art that the configuration of the
manifold layer 106 shown inFIGS. 4A and 4B is only for exemplary purposes. The configuration of thechannels 116 andfingers 118 in themanifold layer 106 depend on a number of factors, including but not limited to, the locations of the interface hot spot regions, amount of flow to and from the interface hot spot regions as well as the amount of heat produced by the heat source in the interface hot spot regions. Any other configuration ofchannels 116 andfingers 118 is contemplated. - Referring to
FIG. 4B , the preferred embodiment of the present invention includesmicrochannels 110 in theinterface layer 102. In order to achieve the desired decrease in convection resistance as described previously, the internal feature size of themicrochannels 110 are in the range of 15-300 microns, and the surface to volume ratios of the microchannels are greater than 1000 m−1. Of course, the present invention contemplates further embodiments contemplating microchannels not entirely within the stated ranges. - Referring now to
FIG. 5 , further embodiments also contemplate utilizing alternatives to the microchannels110 (FIG. 4B ) of the preferred embodiment such aspillars 203, roughed surfaces or a micro-porous structure, such as sintered metal and silicon foam213. Furthermore, any of these alternatives could be used instead of themicrochannels 110, or they could be used in combination as analternative interface layer 202. Furthermore, these alternatives may be used in any conceivable combination with themicrochannels 110. Of course, any alternative listed above or combination thereof has internal features sizes and a surface to volume ration that conforms to those set out in the preferred embodiment of the present invention. - Also critical in achieving the desired relative resistance levels is the fluid composition used in the pumped fluid system on the preferred embodiment of the present invention. Specifically, the heat capacity and viscosity become important when the desired relative resistance levels are achieved. Using micro dimensions as those described in the preferred embodiment can dramatically increase the pumping pressure drop. Using low fluid flowrates makes the performance highly sensitive to the fluid heat capacity per unit mass, which governs its heat absorbing properties.
- Therefore, in order for the system to operate properly with the desired relative resistance levels, fluid with very high heat capacity per unit mass (enabling high absorption) and low viscosity (enabling low pressure drop in a micro hx) are required. Preferably, a fluid at its average temperature in the heat exchanger, having a viscosity, greater than 150% of the viscosity of water and a heat capacity greater than 80% of water is required. Also in the preferred embodiment of the present invention, the fluid consists of at least 90% of water by mass.
FIG. 6 depicts a method of efficiently cooling a device in a pumpedfluid cooling system 400 of the preferred embodiment of the present invention. Themethod 400 starts instep 410, by decreasing the relative spread resistance in a pumped fluid system. This is achieved by limited the size of the cooling surface of the micro hx relative to the surface of the device being cooled. Preferably, to equal to or less than 150% of the surface of the device being cooled. Instep 420, the relative convection resistance of the pumped fluid system is decreased by increasing the total wetted surface area in the micro hx. This is accomplished by reducing the internal feature sizes of the micochannels in the micro hx, preferably to a size in the range of 15-300 microns, with a surface to volume ratio of 1000 m−1.- Still referring to
FIG. 6 , instep 430 the relative advection resistance for the pumped fluid system is increased. This is preferably done by decreasing the flowrate m, where the advection resistance equals C/mc, where C is a constant near 0.5 and c is the specific heat capacity per unit mass. The last step in thismethod 400 isstep 440, by adjusting the fluid composition in the pumped fluid system such that the fluid has a relatively high heat capacity and a low viscosity. Preferably, the viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water and the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water. This is preferably achieved by adjusting the fluid such that it consists of at least 90% water by mass. - The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that modifications can be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention. Specifically, it will be apparent to one of ordinary skill in the art that the device of the present invention could be implemented in several different ways and have several different appearances.
Claims (38)
1. A pumped fluid cooling system for cooling a device, the pumped fluid cooling system comprising:
a. a heat exchanger, the heat exchanger including an interface layer coupled to the device for cooling the device; and
b. a fluid pumped through the interface layer of the heat exchanger, the fluid having an inlet temperature and an outlet temperature,
wherein the pumped fluid cooling system is configured such that the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
2. The pumped fluid cooling system as claimed inclaim 1 further comprising a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.
3. The pumped fluid cooling system as claimed inclaim 2 wherein the plurality of microchannels have a surface to volume ratio greater than 1000 m−1.
4. The pumped fluid cooling system as claimed inclaim 1 further comprising a plurality of pillars configured in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.
5. The pumped fluid cooling system as claimed inclaim 4 wherein the plurality of pillars have a surface to volume ratio greater than 1000 m−1.
6. The pumped fluid cooling system as claimed inclaim 1 further comprising a microporous structure disposed on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.
7. The pumped fluid cooling system as claimed inclaim 6 wherein the plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m−1.
8. The pumped fluid cooling system as claimed inclaim 1 wherein a first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
9. The pumped fluid cooling system as claimed inclaim 1 wherein the viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water.
10. The pumped fluid cooling system as claimed inclaim 1 wherein the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water.
11. The pumped fluid cooling system as claimed inclaim 1 wherein the fluid consists of at least 90% water by mass.
12. A method of efficiently cooling a device in a pumped fluid cooling system, the method comprising:
a. decreasing a spread resistance between an interface layer of a heat exchanger and the device;
b. decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature;
c. increasing an advection resistance; and
d. adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity,
wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
13. The method as claimed inclaim 12 wherein the step of decreasing the convention resistance includes configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.
14. The method as claimed inclaim 13 wherein the plurality of microchannels have a surface to volume ratio greater than 1000 m−1.
15. The method as claimed inclaim 12 wherein the step of decreasing the convection resistance includes configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.
16. The method as claimed inclaim 15 wherein the plurality of pillars have a surface to volume ratio greater than 1000 m−1.
17. The method as claimed inclaim 12 wherein the step of decreasing the convection resistance includes disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.
18. The method as claimed inclaim 17 wherein the plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m−1.
19. The method as claimed inclaim 12 wherein the step of decreasing the spread resistance includes reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
20. The method as claimed inclaim 12 wherein the step of adjusting the composition of the fluid includes decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water.
21. The method as claimed inclaim 12 wherein the step of adjusting the composition of the fluid includes increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water.
22. The method as claimed inclaim 12 wherein the fluid consists of at least 90% water by mass.
23. A pumped fluid cooling system for cooling a device, the pumped fluid cooling system comprising:
a. means for decreasing a spread resistance between an interface layer of a heat exchanger and the device;
b. means for decreasing a convection resistance between a fluid and the interface layer of the heat exchanger, wherein the fluid is pumped through the interface layer, and further wherein the fluid has an inlet temperature and an outlet temperature,
c. means for increasing an advection resistance; and
d. means for adjusting the composition of the fluid to increase the heat capacity per unit mass and decrease the viscosity,
wherein the difference between the fluid outlet temperature and the fluid inlet temperature is at least 30% of the difference between a hottest temperature of the fluid in the heat exchanger and the fluid inlet temperature.
24. The pumped fluid cooling system as claimed inclaim 23 wherein the means for decreasing the convention resistance includes means for configuring a plurality of microchannels in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns.
25. The pumped fluid cooling system as claimed inclaim 24 wherein the plurality of microchannels have a surface to volume ratio greater than 1000 m−1.
26. The pumped fluid cooling system as claimed inclaim 23 wherein the means for decreasing the convection resistance includes means for configuring a plurality of pillars in a predetermined pattern along the interface layer wherein the plurality of pillars have an internal feature size in the range of 15-300 microns.
27. The pumped fluid cooling system as claimed inclaim 26 wherein the plurality of pillars have a surface to volume ratio greater than 1000 m−1.
28. The pumped fluid cooling system as claimed inclaim 23 wherein the means for decreasing the convection resistance includes means for disposing a microporous structure on the interface layer wherein a plurality of pores in the microporous structure have an internal feature size in the range of 15-300 microns.
29. The pumped fluid cooling system as claimed inclaim 28 wherein the plurality of pores of the microporous structure have a surface to volume ratio greater than 1000 m−1.
30. The pumped fluid cooling system as claimed inclaim 23 wherein the means for decreasing the spread resistance includes means for reducing a first surface area of the interface layer that is coupled to the device such that the first surface area is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer.
31. The pumped fluid cooling system as claimed inclaim 23 wherein the means for adjusting the composition of the fluid includes means for decreasing the viscosity of the fluid at its average temperature in the heat exchanger, such that the viscosity is less than 150% of the viscosity of water.
32. The pumped fluid cooling system as claimed inclaim 23 wherein the means for adjusting the composition of the fluid includes means for increasing the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger, such that the heat capacity per unit mass is greater than 80% of the heat capacity per unit mass of water.
33. The pumped fluid cooling system as claimed inclaim 23 wherein the fluid consists of at least 90% water by mass.
34. An apparatus for cooling an integrated circuit, the apparatus comprising:
a. a heat exchanger including an interface layer coupled to the integrated circuit, wherein a first surface area of the interface layer that is coupled to the integrated circuit is less than or equal to 150% of a second surface area of the integrated circuit that is coupled to the interface layer, such that a spread resistance between the interface layer and the integrated circuit is decreased;
b. a plurality of microchannels configured in a predetermined pattern along the interface layer wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 1000 m−1, such that a convection resistance is decreased; and
c. a fluid pumped through the heat exchanger, such that a flowrate of the fluid increases an advection resistance,
wherein the fluid consists of at least 90% water by mass.
35. The apparatus as claimed inclaim 34 wherein the viscosity of the fluid at its average temperature in the heat exchanger is less than 150% of the viscosity of water.
36. The apparatus as claimed inclaim 34 wherein the heat capacity per unit mass of the fluid at its average temperature in the heat exchanger is greater than 80% of the heat capacity per unit mass of water.
37. A pumped fluid cooling system for cooling a device, the pumped fluid cooling system comprising:
a. a spread resistance, wherein the spread resistance is decrease when a heat exchanger including an interface layer is coupled to the device, further wherein a first surface area of the interface layer that is coupled to the device is less than or equal to 150% of a second surface area of the device that is coupled to the interface layer;
b. a convection resistance, wherein the convection resistance is decreased when a plurality of microchannels is configured in a predetermined pattern along the interface layer, and further wherein the plurality of microchannels have an internal feature size in the range of 15-300 microns and a surface to volume ration greater than 10000 m−1; and
c. an advection resistance, wherein the advection resistance is increased when a fluid is pumped through the heat exchanger, such that a flowrate of the fluid decreases,
wherein the fluid consists of at least 90% water by mass.
38. The pumped fluid cooling system as claimed inclaim 37 wherein the fluid is water.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/927,800US20060042785A1 (en) | 2004-08-27 | 2004-08-27 | Pumped fluid cooling system and method |
| DE112005002015TDE112005002015T5 (en) | 2004-08-27 | 2005-08-24 | Cooling system with a pumped fluid and method |
| JP2007530175AJP2008511995A (en) | 2004-08-27 | 2005-08-24 | Fluid pumping cooling system and cooling method |
| PCT/US2005/030465WO2006026460A2 (en) | 2004-08-27 | 2005-08-24 | Pumped fluid cooling system and method |
| TW094129151ATW200610483A (en) | 2004-08-27 | 2005-08-25 | Pumped fluid cooling system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/927,800US20060042785A1 (en) | 2004-08-27 | 2004-08-27 | Pumped fluid cooling system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20060042785A1true US20060042785A1 (en) | 2006-03-02 |
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ID=35941406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/927,800AbandonedUS20060042785A1 (en) | 2004-08-27 | 2004-08-27 | Pumped fluid cooling system and method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20060042785A1 (en) |
| JP (1) | JP2008511995A (en) |
| DE (1) | DE112005002015T5 (en) |
| TW (1) | TW200610483A (en) |
| WO (1) | WO2006026460A2 (en) |
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| US9170060B2 (en) | 2008-01-22 | 2015-10-27 | Lawrence Livermore National Security, Llc | Rapid microfluidic thermal cycler for nucleic acid amplification |
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| US11440015B2 (en) | 2018-08-08 | 2022-09-13 | Lawrence Livermore National Security, Llc | Integrated solid-state rapid thermo-cycling system |
| US11806719B2 (en) | 2018-08-08 | 2023-11-07 | Lawrence Livermore National Security, Llc | Integrated solid-state rapid thermo-cycling system |
| TWI865215B (en)* | 2022-12-30 | 2024-12-01 | 大陸商珠海越亞半導體股份有限公司 | Embedded package heat dissipation structure and manufacturing method thereof and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006026460A3 (en) | 2007-11-29 |
| TW200610483A (en) | 2006-03-16 |
| DE112005002015T5 (en) | 2007-08-16 |
| JP2008511995A (en) | 2008-04-17 |
| WO2006026460A2 (en) | 2006-03-09 |
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