US20060033095A1 - Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow - Google Patents

Abstract

A non-planar tri-gate p-MOS transistor structure with a strained channel region and a non-planar tri-gate integrated strained complimentary metal-oxide-semiconductor (CMOS) structure are described. A relaxed Si_1-xGe_xlayer is formed on the silicon-on-isolator (SOI) substrate. The relaxed Si_1-xGe_xlayer is patterned and subsequently etched to form a fin on the oxide. The compressively stressed Si_1-yGe_ylayer, having the Ge content y higher than the Ge content x in the relaxed Si_1-xGe_xlayer, is epitaxially grown on the fin. The Si_1-yGe_ylayer covers the top and two sidewalls of the fin. The compressive stress in the Si_1-yGe_ylayer substantially increases the hole mobility in a channel of the non-planar tri-gate p-MOS transistor structure.

Description

BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• This invention relates to the field of semiconductor manufacturing, and more specifically, to a semiconductor transistor and its manufacture.
• 2. Discussion of Related Art
• Various techniques are used to improve performance of a metal-oxide-semiconductor (MOS) transistor. Transistors have continuously been scaled down, thus increasing their density, and accordingly, their switching speeds.
• Another way to increase the speed of the transistor, is to create a transistor channel with a high mobility of the carriers by, for example, growing a strained silicon (Si) layer on a relaxed silicon germanium (“Si_1-xGe_x”) layer thereby increasing mobility of electrons. The tensile strain in the Si layer, however, does not increase the hole mobility. Therefore, for a p-MOS transistor structure, the channel formed from the Si layer under tensile stress cannot provide increased hole mobility. In addition, the tensile strained Si layer is grown on a planar substrate, which limits the density of the transistors and increases intrinsic capacitance.
BRIEF DESCRIPTION OF THE DRAWINGS
• The invention is described by way of example with reference to the accompanying drawings, wherein:
• FIG. 1A is a perspective view of a semiconductor structure having a Silicon-On-Isolator (SOI) substrate for a non-planar strained p-MOS transistor structure fabrication according to one embodiment of the invention;
• FIG. 1B is a view similar toFIG. 1A, after a strained Si_1-xGe_xlayer and an intrinsic Si layer are formed on the SOI substrate;
• FIG. 1C is a view similar toFIG. 1B, after annealing to form a relaxed Si_{1-x Gex}layer;
• FIG. 1D is a view similar toFIG. 1C, after forming a tri-gate fin from the relaxed Si_1-xGe_xlayer according to one embodiment of the invention;
• FIG. 1E is a view similar toFIG. 1D, after a strained Si_1-yGe_ylayer is epitaxially formed on the relaxed Si_1-xGe_xtri-gate fin;
• FIG. 1F is a cross-sectional view of the semiconductor structure after a high-k dielectric layer is formed on the strained Si_1-yGe_ytri-gate fin according to one embodiment of the invention;
• FIG. 1G is a cross-sectional view of the semiconductor structure after a tri-gate electrode is formed on the high-k dielectric layer according to one embodiment of the invention;
• FIG. 1H is a perspective view of a tri-gate p-MOS semiconductor structure according to one embodiment of the invention;
• FIG. 2A is a cross-sectional side view of a semiconductor structure for a non-planar tri-gate CMOS fabrication with tri-gate fins according to one embodiment of the invention;
• FIG. 2B is a view similar toFIG. 2A, after covering an n-MOS portion of the semiconductor structure by a protection layer, leaving a p-MOS portion exposed;
• FIG. 2C is a view similar toFIG. 2B, after epitaxially forming a strained Si_1-yGe_ylayer on a tri-gate fin of the p-MOS portion of the semiconductor structure;
• FIG. 2D is a view similar toFIG. 2C, after a protection oxide layer is formed on the strained Si_1-yGe_ylayer covering the tri-gate fin of the p-MOS portion of the semiconductor structure;
• FIG. 2E is a view similar toFIG. 2D, after removing the protection layer from the n-MOS portion of the semiconductor structure;
• FIG. 2F is a view similar toFIG. 2E, after forming a strained Si layer on a tri-gate fin of the n-MOS portion of the semiconductor structure;
• FIG. 2G is a view similar toFIG. 2F, after forming a protection pad oxide layer on the strained Si layer covering the tri-gate fin of the n-MOS portion of the semiconductor structure;
• FIG. 2H is a view similar toFIG. 2G, after removing the protection oxide layers from the n-MOS and p-MOS portions of the semiconductor structure;
• FIG. 2I is a view similar toFIG. 2H, after forming a high-k dielectric layer on the strained Si layer and Si_1-yGe_ylayer;
• FIG. 2J is a view similar toFIG. 2I, after forming a tri-gate gate electrode on the high-k dielectric layer; and
• FIG. 2K is a perspective view of the strained CMOS structure according to one embodiment of the invention.
DETAILED DESCRIPTION OF THE INVENTION
• A non-planar strained p-MOS transistor structure and a non-planar integrated strained complementary metal-oxide-semiconductor (CMOS) structure with respective processes of their fabrication are described herein. A relaxed Si_1-xGe_xlayer is formed on the silicon-on-isolator (SOI) substrate. The relaxed Si_1-xGe_xlayer is patterned, and subsequently, etched to form a tri-gate fin on the SOI substrate. Further, a Si_1-yGe_ylayer, having a Ge content y higher than a Ge content x in the relaxed Si_1-xGe_xlayer, is epitaxially formed on the tri-gate fin formed from the etched relaxed Si_1-xGe_xlayer on the SOI substrate. The Si_1-yGe_ylayer covers two opposing sidewalls and a top surface of the tri-gate fin. Due to the higher Ge content, the lattice of the Si_1-yGe_ylayer has a larger spacing than the spacing of the lattice of the underlying relaxed Si_1-xGe_xlayer. The larger spacing of the Si_1-yGe_ystrains the Si_1-yGe_ylayer, resulting in the compressive stress in the latter. A compressively stressed Si_1-yGe_ylayer epitaxially grown on the top surface and the two opposing sidewalls of the tri-gate fin formed from the relaxed Si_1-xGe_xlayer, which rests on the SOI substrate, is used to form a strained channel between a source and drain region of the non-planar p-MOS transistor structure. Compressive stress in Si_1-yGe_ylayer substantially increases the hole mobility in the transistor channel of the non-planar p-MOS transistor structure improving current-voltage (I-V) characteristics. The I-V characteristics are improved, for example, by increasing a saturation drain current (I_DSAT) and a linear drain current (I_DLIN) of a non-planar p-MOS transistor, as a result of increased hole mobility in the transistor channel.
• FIG. 1A of the accompanying drawings illustrates a semiconductor structure for a non-planar strained p-MOS transistor structure fabrication according to one embodiment of the invention. As shown inFIG. 1A,semiconductor structure400 includes an insulatinglayer402, which is sandwiched between asilicon layer403 and a bulkmonocrystalline silicon substrate401 forming a silicon-on-isolator (SOI) substrate. Generally, devices are formed in and on the layer ofsilicon403. The insulatinglayer402 may serve to reduce capacitance between the devices formed in thesilicon layer403 and thesubstrate401, resulting in less power consumption and greater circuit speed. In one embodiment, the insulatinglayer402 is a buried oxide layer, for example, SiO₂, and the like. In alternative embodiments, the insulatinglayer402 may be any one, or a combination of, sapphire, silicon dioxide, silicon nitride, or other insulating materials. The thickness of thesilicon layer403 may be in the approximate range of 2.5 nanometers (“nm”) to 7.5 nm. The thickness of the insulatinglayer402 may be in the approximate range of 500 angstroms (“Å”) to 1500 Å. More specifically, the thickness of the silicon layer formed on top surface of the buried oxide layer resting on the monocrystalline Si substrate, is about 5 nm and the thickness of the buried oxide layer is about 1000 Å. The SOI substrate may be formed by any one of the techniques known in the art, for example, separation by implantation of oxygen (SIMOX), hydrogen implantation and separation approach (also called SmartCut®), and the like.
• FIG. 1B illustrates asemiconductor structure400 after a strained Si_1-xGe_xlayer and an intrinsic Si layer are formed on the SOI substrate. The strained Si_1-xGe_xlayer404 and anintrinsic Si layer405 are subsequently formed on theSi layer403. The Si_1-xGe_xlayer404 is epitaxially grown on theSi layer403. Generally, Si_1-xGe_xmaterial has a lattice structure substantially the same as a monocrystalline Si lattice structure. Because of the presence of Ge atoms, the Si_1-xGe_xlattice spacing is substantially larger than the Si lattice spacing. Ge atoms of the Si_1-xGe_xlayer404 are diagrammed as large circles, whereas Si atoms are diagrammed as small circles inFIG. 1B. The lattice spacing of the Si_1-xGe_xincreases with increasing the Ge content x in the Si_1-xGe_x. The larger lattice spacing strains the Si_1-xGe_xlayer404 formed on theSi layer403 and generates the compressive stress in the Si_1-xGe_xlayer404. In one embodiment, anintrinsic Si layer405 is epitaxially grown on the strained Si_1-xGe_xlayer404 to become a capping layer for the Si_1-xGe_xlayer404. In one embodiment, the Ge content x in the Si_1-xGe_xlayer404 formed on theSi layer403 is in the approximate range of 0.05 to 0.2 (that is of 5% to 20%). In more specific embodiment, the Ge content x in the Si_1-xGe_xlayer404 on theSi layer403 is about 0.15 that is equivalent to 15%. Generally, the thickness of the strained Si_1-xGe_xlayer404 depends on the ultimate device geometry. In one embodiment, to form a non-planar tri-gate transistor structure, the strained Si_1-xGe_xlayer404 may have the thickness in the approximate range of 15-25 nm and theintrinsic Si layer405 may have the thickness in the approximate range between 3 nm to 15 nm. In another embodiment, the strained Si_1-xGe_xlayer404 may have the thickness about 20 nm. In yet another embodiment, to form, for example, a double-gate device, the strained Si_1-xGe_xlayer404 may be about 100 nm thick.
• The heat treatment, or annealing, of thesemiconductor structure400 is carried out to reduce strain of the Si_1-xGe_xlayer404. Annealing results in diffusion of the Ge atoms from Si_1-xGe_xlayer404 into theunderlying Si layer403 and upperintrinsic Si layer405, as illustrated inFIG. 1B. The diffusion of the Ge atoms relaxes the strain in the Si_1-xGe_xlayer404, such that the relaxed Si_1-xGe_xlayer406 is formed, as illustrated inFIG. 1C. In one embodiment, the annealing temperature to relax the strained Si_1-xGe_xlayer404 is in the approximate range of 1000 to 1100 C, and more specifically, about 1050 C.
• FIG. 1C is a view of thesemiconductor structure400 after annealing. As shown inFIG. 1C, thesemiconductor structure400, after annealing, comprises a relaxed Si_1-xGe_xlayer406 formed from the strained Si_1-xGe_xlayer404, theSi layer403 and theintrinsic Si layer405. The relaxed Si_1-xGe_xlayer406 rests on top surface of the buriedoxide layer402 covering thesilicon substrate401. In one embodiment, the total thickness of the relaxed Si_1-xGe_xlayer406 may be in the approximate range of 20 nm to 100 nm.
• Thesemiconductor structure400 is patterned to expose portions of the relaxed Si_1-xGe_xlayer406. The exposed portions of the relaxed Si_1-xGe_xlayer406 are subsequently etched and removed so that tri-gate fins in the relaxed Si_1-xGe_xlayer406 are formed.FIG. 1D shows thesemiconductor structure400 with a tri-gate fin formed from relaxed Si_1-xGe_xlayer on the oxide layer according to one embodiment of the invention. Thetri-gate fin407 stands above the insulatinglayer402, the insulatinglayer402 covers theSi substrate401. In one embodiment, patterning of the relaxed Si_1-xGe_xlayer406 to form thetri-gate fin407 may be performed by using a well known in the art photolithographic technique. Etching the portions of the relaxed Si_1-xGe_xlayer406 can be performed with an anisotropic etchant, which selectively removes the exposed portions of the relaxed Si_1-xGe_xlayer406 over the other exposed materials of the structure, generating thetri-gate fin407 with vertical sidewalls. In one embodiment, thewidth421 of thetri-gate fin407 is in the approximate range of 20 nm to 120 nm.
• FIG. 1E illustrates a strained Si_1-yGe_y408 selectively grown on thetri-gate fin407. The strained Si_1-yGe_ylayer408 covers the top surface and two opposing sidewalls of thetri-gate fin407, but does cover the insulatinglayer402. Because the Si_1-yGe_ylayer408 has the same lattice structure as the relaxed Si_1-xGe_xlayer406 comprising thetri-gate fin407, it can be epitaxially grown on the relaxed Si_1-xGe_xlayer. In one embodiment, the Si_1-yGe_ylayer, which is selectively grown by epitaxy on the relaxed Si_1-xGe_xtri-gate fin, has the Ge content y approximately from 0.10 to 0.50 (10% to 50%) higher than the Ge content x in the underlying relaxed Si_1-xGe_xfin. In another embodiment, the Ge contenty of the Si_1-yGe_ylayer epitaxially grown on the relaxed Si_1-0.15Ge_0.15tri-gate fin is about 0.3 (30%) higher than the Ge content x in the underlying relaxed Si_1-xGe_xfin. In yet another embodiment, the Ge content y of the Si_1-yGe_ylayer epitaxially grown on the relaxed Si_1-0.15Ge_0.15tri-gate fin is about 0.3 (30%). Generally, the higher Ge content means larger lattice spacing of the Si_1-yGe_ylayer relative to the relaxed Si_1-xGe_xlayer. Larger lattice spacing creates compressive stress in the Si_1-yGe_ylayer covering the top surface and two opposing sidewalls of the relaxed Si_1-xGe_xtri-gate fin. The compressive stress in the Si_1-yGe_ylayer reduces the effective mass of the p-type carriers (holes) that substantially increases the hole mobility in a channel of the non-planar PMOS transistor, wherein the channel is formed in the strained Si_1-yGe_ylayer408. In one embodiment, the hole mobility enhancement factor in the channel formed in the strained Si_1-yGe_ylayer408 is in the approximate range of 1.2 to 5.
• In one embodiment, the strained Si_1-yGe_ylayer408 may be epitaxially grown on thetri-gate fin407 by a low pressure chemical vapour deposition (CVD) technique including Silane (SiH4) and Germane (GeH₄) gases. For another embodiment, the strained Si_1-yGe_ylayer408 may be epitaxially grown on the relaxed Si_1-xGe_xtri-gate fin407 by a low pressure chemical vapour deposition (CVD) technique including DichloroSilane (SiCl₂H₂) and Germane (GeH₄) gases. In one embodiment, the pressure in the reactor may be in the approximate range of 1 torr to 400 torr and the temperature may be in the approximate range of 300 C to 900 C. In one embodiment, the thickness of the strained Si_1-yGe_ylayer selectively grown by epitaxy on the relaxed Si_1-xGe_xtri-gate fin is in the approximate range of 50 Å to 200 Å. More specifically, the thickness of the strained Si_1-yGe_ylayer is about 100 Å. Further, a n-type dopant, for example, arsenic (“As”), phosphorus (“P”), and the like, is added to the relaxed Si_1-xGe_xtri-gate fin407 covered by the strained Si_1-yGe_ylayer408 to form a n-well. The n-type dopant may be added by using, for example, the ion implantation technique. The concentration of the n-type dopants is in the approximate range of 2×10¹⁶cm⁻³to 2×10¹⁹cm⁻³.
• As illustrated inFIG. 1F, a dielectric layer is formed on the strained Si_1-yGe_ylayer. Thedielectric layer409 covers the top surface and two opposing sidewalls of thetri-gate fin407 with the strained Si_1-yGe_ylayer408. Thedielectric layer409 forms a gate dielectric of the tri-gate transistor structure. In one embodiment, thedielectric layer409 may be blanket deposited, patterned, and etched into the gate dielectric utilizing known photolithographic and etching techniques. In one embodiment, the dielectric layer may include oxide of a transition metal. In one embodiment, thedielectric layer409 may include a high-k dielectric, for example, zirconium oxide(“ZrO₂”). For alternative embodiments, thedielectric layer409 may include of any one of a hafnium oxide(“HFO₂”) and lanthanum oxide (“La₂O₄”). The thickness of thedielectric layer409 may be between 10 Å and 40Å.
• FIG. 1G is a cross-sectional view of thesemiconductor structure400 after a tri-gate electrode layer is formed on the high-k dielectric layer according to one embodiment of the invention. Thetri-gate electrode layer411 is formed on thedielectric layer409 covering the top surface and the sidewalls of thetri-gate fin407, as illustrated inFIG. 1G. In one embodiment, the thickness of thetri-gate electrode layer411 is in the approximate range of 500 Å to 1500 Å. In one embodiment, thetri-gate electrode layer411 may be formed by blanket deposition of polysilicon and patterning the polysilicon into the tri-gate electrode utilizing known photolithographic techniques. For an embodiment, thetri-gate electrode layer411 and theunderlying dielectric layer409 may be subsequently patterned and etched to a predetermined width. In another embodiment, thetri-gate electrode layer411 includes a metal underlayer under the polysilicon. In yet another embodiment, thetri-gate electrode layer411 is a metal.
• FIG. 1H is a perspective view of a tri-gate p-MOS semiconductor structure400 according to one embodiment of the invention. Thestructure400 has asource region413 and a drain region414 formed in the fin structure (“fin body”)418 at opposite sides of thegate electrode421. Thegate electrode421 withunderlying dielectric429 has apredetermined width415 and covers a portion of the fin body418. For an embodiment, the fin body418 includes atri-gate fin407 formed from relaxed Si_1-xGe_xlayer covered by the strained Si_1-yGe_ylayer408. The fin body418 is formed on top surface of the insulatinglayer402. The insulatinglayer402 rests on thesilicon substrate401. In one embodiment, thewidth415 of thegate electrode421 is in the approximate range of 80 nm to 120 nm, the thickness416 of the fin body418 is in the approximate range of 20 nm to 120 nm, and the width417 of the fin body418 is in the approximate range of 20 nm to 120 nm. For an embodiment, to form thesource region413 and the drain region414 of the p-MOS transistor structure400, a p-type dopant, for example, boron (“B”) is added to the fin body418 at the opposite sides of thegate electrode421, for example, by ion implantation. For an embodiment, the concentration of the p-type dopants is in the approximate range of 10¹⁸cm⁻³to 10²¹cm⁻³.
• FIGS. 2A-2K illustrate an exemplary process to fabricate a strained non-planar tri-gate CMOS structure, according to one embodiment of the invention.FIG. 2A illustrates a cross-sectional view of thesemiconductor structure500 for tri-gate CMOS fabrication with twotri-gate fins503N and503P formed from a relaxed Si_1-xGe_xlayer. As shown inFIG. 2A, thetri-gate fins503N and503P formed from a relaxed Si_1-xGe_xlayer are located on anoxide layer502, which covers aSi substrate501. One of thetri-gate fins503N belongs to an n-MOS portion520 of the semiconductor structure, whereas the othertri-gate fin503P belongs to a p-MOS portion530 of the CMOS structure.Semiconductor structure500 havingtri-gate fins503N and503P formed from the relaxed Si_1-xGe_xlayer may be fabricated using the process described presently. Next, before forming the p-MOS portion530, the n-MOS portion520 is covered by a first protection layer to protect the n-MOS portion during p-MOS portion formation.
• FIG. 2B is a cross-sectional view of thesemiconductor structure500 after covering the n-MOS portion by a first protection layer. The p-MOS portion530 of thestructure500 is uncovered, while thefirst protection layer505 covers the top surface and sidewalls of thetri-gate fin503N that belongs to the n-MOS portion520. For an embodiment, thefirst protection layer505 may be formed, for example, by depositing a silicon nitride (“Si₃N₄”) layer on the wafer, forming a resist on the Si₃N₄layer, patterning the resist to expose portions of the Si₃N₄layer covering the p-MOS portion530, etching the silicon nitride layer on the p-MOS portion530 to expose p-MOS portion530, and then ashing the resist producing the structure inFIG. 2B. In alternative embodiments, other implant mask materials may be used as afirst protection layer505. Next, to form a strained channel in the p-MOS portion530 of thesemiconductor structure500, a strained Si_1-yGe_ylayer is selectively formed on thetri-gate fin503P of the p-MOS portion530.
• FIG. 2C shows a cross-sectional view of thesemiconductor structure500 after epitaxially forming a strained Si_1-yGe_ylayer on the tri-gate fin of the p-MOS portion. The n-MOS portion520 is covered by thefirst protection layer505. The strained Si_1-yGe_ylayer504 covers the top surface and two opposing sidewalls of thetri-gate fin503P of the p-MOS portion530 of thestructure500 leaving theoxide layer502 uncovered. In one embodiment, the strained Si_1-yGe_ylayer504 is selectively epitaxially grown on the top surface and two opposing sidewalls of thetri-gate fin503P of the p-MOS portion530. More specifically, the strained Si_1-yGe_ylayer504 is grown by low pressure CVD technique with a flow including SiH₄and GeH₄gases. For another embodiment, the strained Si_1-yGe_ylayer504 may be epitaxially grown by a low-pressure chemical vapour CVD with a flow including of SiCl₂H₂and GeH₄gases. The pressure in the reactor may be in the approximate range of 1 torr to 400 torr and the temperature may be in the approximate range of 300 C to 900 C.
• The strained Si_1-yGe_ylayer504 has a Ge content y approximately 15% higher than the Ge content x of the relaxed Si_1-xGe_xlayer of thetri-gate fin503P and a lattice spacing substantially larger than the lattice spacing of the Si_1-xGe_xlayer of thetri-gate fin503P that results in a compressive stress in the strained Si_1-yGe_ylayer504 along the top surface and two opposing sidewalls of thetri-gate fin503P of the p-MOS portion530. In one embodiment, the strained Si_1-yGe_ylayer504 has the Ge content y about 10% to 50% higher than the relaxed Si_1-xGe_xlayer of thetri-gate fin503P. In one embodiment, the strained Si_1-yGe_ylayer504 has the Ge content y about 0.3 (30%) and the relaxed Si_1-xGe_xlayer of thetri-gate fin503P has the Ge content x of about 0.15 (15%). The compressive stress increases the hole mobility in the strained Si_1-yGe_ylayer504. In one embodiment, the hole mobility enhancement factor in the channel formed in the strained Si_1-yGe_ylayer408 is in the approximate range of 1.2 to 5. In one embodiment, the thickness of the strained Si_1-yGe_ylayer504 is in the approximate range of 50 Å to 200 Å, and more specifically, about 100 Å. Further, to form a n-well, a n-type dopant is added to thetri-gate fin503N covered by the strained Si_1-yGe_ylayer504. The n-type dopant may be any one of As, P, and the like. The n-type dopant may be added, for example, by the ion implantation technique. For an embodiment, the concentration of the dopants is in the approximate range of 2×10¹⁷cm⁻³to 2×10¹⁹cm⁻³. In one embodiment, before the ion implantation, the strained Si_1-yGe_ylayer504 may be covered by a second protection layer to protect the surface of the strained Si_1-yGe_ylayer504 from unnecessary damage.
• FIG. 2D is a cross-sectional view of thesemiconductor structure500 having asecond protection layer506 formed on the strained Si_1-yGe_ylayer. Thesecond protection layer506 is deposited on the strained Si_1-yGe_ylayer504 along the top surface and two opposing sidewalls of thetri-gate fin503P of the p-MOS portion530. For an embodiment, thesecond protection layer506 may be a silicon oxide layer formed by the epitaxial growth and the subsequent oxidation of silicon. For another embodiment, thesecond protection layer506 may be a second silicon nitride layer formed by patterning and etching technique, which is known to one of ordinary skill in the art of semiconductor fabrication. For example, theprotection layer506 may be formed by repeating the deposition of silicon nitride layer on the wafer, lithographically patterning the silicon nitride layer to leave a resist on the p-MOS portion530, etching the silicon nitride layer off the n-MOS portion520, and then stripping off the resist.
• Thesecond protection layer506 also protects the p-MOS portion530 from, for example, unnecessary deposition of Si during the strained channel formation at the n-MOS portion520 of thesemiconductor structure500. The thickness of thesecond protection layer506 may be in the approximate range of 30 Å to 100 Å. Next, to form a n-MOS portion, thefirst protection layer505 is removed from the n-MOS portion520 of thesemiconductor structure500.
• FIG. 2E is a cross-sectional view of thesemiconductor structure500, after removing thefirst protection layer505 from the n-MOS portion of thesemiconductor structure500. For an embodiment, thefirst protection layer505 may be removed by, for example, wet etching using a hot phosphoric acid. Further, to form a strained channel, the strained Si layer is epitaxially grown on thetri-gate fin503N of the n-MOS portion520.
• FIG. 2F is a cross-sectional view of the semiconductor structure after forming a strained Si layer on the tri-gate fin of the n-MOS portion. Thestrained Si layer507 covers the top surface and two opposing sidewalls of the fin tri-gate503N of the n-MOS portion520 of thesemiconductor structure500 and does not cover theoxide layer502. For an embodiment, thestrained Si layer507 may be formed by the epitaxy. Because of presence of Ge atoms, the Si_1-xGe_xlayer of thetri-gate fin503N has substantially larger lattice spacing, than the lattice spacing of the Si layer, resulting in a tensile strain in the Si layer along the top surface and two opposing sidewalls of thetri-gate fin503N of the n-MOS portion520. The tensile strain increases the electron mobility in thestrained Si layer507 of the n-MOS portion520 of thesemiconductor structure500. In one embodiment, the electron mobility enhancement factor in the channel formed in thestrained Si layer507 is in the approximate range of 1.2 to 5. In one embodiment, the thickness of thestrained Si layer507 is in the approximate range of 50 Å to 200 Å, and more specifically, about 100 Å.
• Further, a p-well is formed in the n-MOS portion520. For an embodiment, to form a p-well, a p-type dopant, for example, B, and the like, is added to thetri-gate fin503N covered by thestrained Si layer507 by the ion implantation technique. For an embodiment, before the ion implantation, to protect the surface of the channel during the ion implantation, the pad oxide layer is formed on the strained Si layer, covering the top surface and two opposing sidewalls of thetri-gate fin503N. The concentration of p-dopants is in the approximate range of 2×10¹⁷cm⁻³to 2×10¹⁹cm⁻³.
• FIG. 2G is a cross-sectional view of thesemiconductor structure500 after forming a pad oxide layer. Thepad oxide layer508 is formed on thestrained Si layer507 covering thetri-gate fin503N of the n-MOS portion530. Thepad oxide layer508 covers thestrained Si layer507 along the top surface and two opposing sidewalls of thetri-gate fin503N. In one embodiment, thepad oxide layer508 is a silicon oxide. Next, thesecond protection layer506 and thepad oxide layer508 are removed from the n-MOS portion520 and the p-MOS530 portion, respectively.
• FIG. 2H is a cross-sectional view of thesemiconductor structure500 after removing the oxide layers from the n-MOS and p-MOS portions. In one embodiment, thesecond protection layer506 and thepad oxide layer508 may be removed by, for example, wet etching. Next, a dielectric layer is formed on the strained Si and Si_1-yGe_ylayers.
• FIG. 2I is a cross-sectional view ofsemiconductor structure500 after forming a dielectric layer on the strained Si layer and Si_1-yGe_ylayer, which respectively covers the tri-gate fins of each of the n-MOS and p-MOS portions. Thedielectric layer509 is deposited on thestrained Si layer507 and the strained Si_1-yGe_ylayer504, covering the top surface and two opposing sidewalls of thetri-gate fins503N and503P of the n-MOS portion520 and the p-MOS530 portion respectively, as illustrated inFIG. 21. In one embodiment, thedielectric layer509 may be blanket deposited, patterned, and etched into the gate dielectric using known photolithographic and etching techniques. For an embodiment, thedielectric layer509 is a high-k dielectric. For an embodiment, thedielectric layer509 may include an oxide For another embodiment, thedielectric layer509 may include an oxide of transition metal. For alternative embodiments, thedielectric layer509 may be made of ZrO₂, HFO₂, or La₂O₅or any combination thereof. For an embodiment, thedielectric layer509 may be formed to the thickness in the approximate range of 10 Å to 40 Å. Next, the tri-gate electrode layer is formed on thedielectric layer509.
• FIG. 2J is a cross-sectional view of thesemiconductor structure500, after forming a tri-gate electrode layer. Thetri-gate electrode layer510 is formed on thegate dielectric layer509 covering the top surface and two opposing sidewalls of each of thetri-gate fins503N and503P of the n-MOS520 portion and the p-MOS portion530. For an embodiment, the thickness of thetri-gate electrode layer510 is in the approximate range of 500 Å to 1500 Å. For an embodiment, thetri-gate electrode layer510 may be formed by blanket deposition of polysilicon. Then, thetri-gate electrode layer510 may be patterned and etched into the tri-gate electrode using known in the art photolithographic and etching techniques. For an embodiment, thetri-gate electrode layer510 with theunderlying dielectric layer509 are patterned and etched to a predetermined width.
• FIG. 2K is a perspective view of the non-planar tri-gate CMOS structure600 according to one embodiment of the invention. The CMOS structure600 has the n-MOS portion520 and the p-MOS portion530. The n-MOS portion520 has asource region523 and adrain region524 formed in the portions of n-MOS fin structure (“n-MOS fin body”)525 at opposite sides of thegate electrode521. The n-MOS gate electrode521 with theunderlying dielectric layer509 has thewidth542 and covers the top surface and two opposing sidewalls of the n-MOS fin body525. The n-MOS fin body525 is formed on top surface of theoxide layer502. Theoxide layer502 covers thesilicon substrate501. For an embodiment, the n-MOS fin body525 includes a relaxed Si_1-xGe_xlayer covered by the tensile strained Si layer. A strained channel of the n-MOS portion527 is formed in the tensile strained Si layer under thedielectric layer509 along the top surface and the two opposing sidewalls of thefin body525. For an embodiment, to form thesource region523 and thedrain region524 of the n-MOS portion of the CMOS structure, a n-type dopant, for example, arsenic (“As”) is added into thefin body525 on the opposite sides of thegate electrode521 on the n-MOS portion520 of the CMOS structure600. The n-type dopant may be added by, for example, the ion implantation. For an embodiment, the concentration of n-dopants maybe in the approximate range of 10¹⁸cm⁻³to 10²¹cm⁻³.
• The p-MOS portion530 has asource region533 and adrain region534 formed in the p-MOS fin body535 on opposite sides of the gate electrode531. The p-MOS gate electrode531 with underlyingdielectric layer509 has the predeterminedwidth542 and covers the top surface and the two opposing sidewalls of the p-MOS fin body535. The p-MOS fin body535 is formed on top surface of theoxide layer502. Theoxide layer502 covers thesilicon substrate501. For an embodiment, the p-MOS fin body535 of the p-MOS portion includes the relaxed Si_1-xGe_xlayer, wherein the top surface and two opposing sidewalls of the relaxed Si_1-xGe_xlayer are covered by the compressively strained Si_1-yGe_ylayer. Astrained channel537 of the p-MOS portion530 is formed in the compressively strained Si_1-yGe_ylayer under thegate dielectric layer509 along the top surface and the two opposing sidewalls of the p-MOS fin body535. For an embodiment, to form the p-MOS source region533 and the p-MOS drain region534 of the CMOS structure600, a p-type dopant, for example, boron (“B”) is added into the p-MOS fin body535 at the opposite sides of the gate electrode531 on the p-MOS portion530 of the CMOS structure600. The p-type dopant may be added by, for example, the ion implantation. For an embodiment, the concentration of p-dopants may be in the approximate range of 10¹⁸cm⁻³to 10²¹cm⁻³.
• For an embodiment, thewidth542 of the n-MOStri-gate electrode521 and the p-MOS tri-gate electrode531 with theunderlying dielectric509 may be in the approximate range of 30 nm to 120 nm each. Thewidth541 of the n-MOS fin body525 and the p-MOS fin body535 may be in the approximate range of 30 nm to 120 nm each. Thethickness543 of the n-MOS fin body525 and the p-MOS fin body535 may be in the approximate range of 20 nm to 120 nm each.
• While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this invention is not restricted to the specific constructions and arrangements shown and described since modifications may occur to those ordinarily skilled in the art. It may, for example, be possible to create similar structures utilizing materials other than Si and SiGe.

Claims (12)

1.-6. (canceled)

7. A method of forming a semiconductor structure, comprising:

forming an insulating layer;

forming a first layer of a first material on the insulating layer, the first layer having a first lattice spacing;

forming a fin having a top surface and opposing sidewalls from the first layer; and

forming a second layer of a second material on the fin, wherein the second layer of the second material covers the top surface and the opposing sidewalls of the fin and has a second lattice spacing, which is larger than the first lattice spacing.

8. The method ofclaim 7, further comprising:

forming a gate dielectric layer on the second layer;

forming a gate electrode on the gate dielectric layer; and

forming a source region and a drain region on opposing sides of the gate electrode.

9. The method ofclaim 7, wherein forming the second layer of the second material on the fin comprises an epitaxial growth.

10. The method ofclaim 7, wherein the second layer covering the fin is under compressive stress.

11. The method ofclaim 7, wherein the first layer is a relaxed SiGe layer and the second layer is a compressively strained SiGe layer.

12.-15. (canceled)

16. A method of forming a semiconductor transistor structure, comprising:

forming a first layer of a first material on an insulating layer on a substrate, the first layer having a first lattice spacing;

forming a first and a second fin from the first layer, the first fin being on a first portion and the second fin being on a second portion of a semiconductor transistor structure;

protecting a first portion of the semiconductor transistor structure with a first protective layer;

forming a second layer of a second material having a second lattice spacing substantially larger than the first lattice spacing on the second fin;

removing the first protective layer from the first portion of the semiconductor transistor structure and protecting the second portion of the semiconductor transistor structure with a second protective layer; and

forming a third layer of a third material having a third lattice spacing substantially smaller than the first lattice spacing on the first fin.

17. The method ofclaim 16, further comprising:

forming gate dielectrics on the second layer of the second material and on the third layer of the third material;

forming gate electrodes on each of the gate dielectrics; and

forming a source region and a drain region at opposing sides of each of the first and the second gate electrodes.

18. The method ofclaim 16, wherein the second material comprises silicon germanium and the third material comprises silicon.

19. The method ofclaim 16, wherein forming the second layer and the third layer comprises epitaxial growth.

20. The method ofclaim 19, wherein the second layer covers a top and two opposing sidewalls of the second fin and the third layer covers a top and two opposing sidewalls of the first fin.

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