US20060016784A1 - Etching with electrostatically attracted ions - Google Patents

Abstract

A technique comprises directing a plasma having at least first and second gasses at a substrate. The substrate is at least partially covered with at least the first and second layers. Ions of the first gas are electrostatically attracted towards the substrate. The second gas selectively etches the first layer relative to the second layer.

Description

BACKGROUND
• Etching apertures in materials such as silicon involves the use of etchants that usually lack etch-directionality, and thereby etch in all direction at the same rate within the etched silicon. As such, it is difficult to etch high aspect ratio apertures in silicon.
BRIEF DESCRIPTION OF THE DRAWINGS
• The same numbers are used throughout the drawings to reference similar features and components:
• FIGS. 1a,1b,1c, and1dare side cross-sectional views showing different respective views of one embodiment of the fabrication of one or more metal vias.
• FIG. 2 shows a graph of etch rate versus time in one embodiment of a higher directionality etching process, according to an example embodiment.
• FIG. 3 is a photograph of one embodiment of a metal via formed in a silicon layer of one embodiment of the present invention.
• FIG. 4 is a side cross-sectional view of one embodiment of another embodiment of metal via.
DETAILED DESCRIPTION
• This disclosure provides a number of techniques to form metal vias. Within this disclosure, the term “metal via” is inclusive of support metal vias as described with respect toFIGS. 1a,1b,1c, and1d, and interconnect metal vias as described with respect toFIG. 4. Metal vias are formed in via apertures of asilicon layer702. Interconnect metal vias extend vertically through a non-sacrificial,silicon layer702 which remains following processing. Thesilicon layer702 of the interconnect metal vias therefore exists within the final electronic device.
• The “support metal vias” are formed in a sacrificial silicon layer. After the support metal vias are formed by metallizing apertures formed in the silicon layer, then the sacrificial silicon layer is removed by etching. The support metal vias remain as free-standing metallized structures that support such micro-electromechanical (MEM) devices as fully-reflective or partially reflective plates for optical modulators. Optical modulators and/or MEM devices that use metal vias can be used in such diverse technologies as display or projector devices, and communication systems.
• Any metal via that extends through and is formed at least partially within a silicon layer (the sacrificial layer being sacrificial or non-sacrificial) is within the intended scope of one embodiment of the present disclosure, whether the metal via is an interconnect metal via, a support metal via, or any other type of metal via. A silicon wafer process can be used to process the substrate to produce metal vias in silicon.
• The techniques to form metal vias disclosed herein may be used to form devices other than micro-mirror devices.
• Exemplary Metal Via Fabrication
• This disclosure describes in one embodiment with respect toFIGS. 1ato1dis a fabrication technique that is used to form a high aspect ratio via aperture in a silicon layer. The fabrication technique can be used to form support metal vias, interconnect metal vias, and any other type of via. After forming the via aperture as an aperture formed in a silicon layer, a via such as a support metal via24 ofFIG. 1dcan be formed by metallization of the surface area around the via aperture. The outer periphery of the via is formed/defined by a wall forming the via aperture. While the embodiment ofFIGS. 1a,1b,1c, and1dis described with respect to fabricating the support metal via, it is envisioned that these concepts can be applied to fabricating the interconnect via as described with respect toFIG. 4, or any other metal via that is formed in a via aperture within a silicon layer.
• FIG. 1ashows a cross-sectional view of awafer200 formed from a number of layers including asilicon substrate202, an electrically conductive layer such as an integrated circuit (IC)metal layer204, and asilicon layer206. During processing, themetal layer204 is deposited as a planar layer on thesilicon substrate202, and thepatterned metal layer204 is etched and patterned to form IC circuitry in the desired configuration using techniques that are generally known in Ultra Large Scale Integrated Circuits (ULSI). Themetal layer204 is formed from a metal such as Aluminum Copper (AlCu) that forms a conductive patternable layer. Within this disclosure, themetal layer204 is formed from any metal that resists etching by a plasma, wherein the plasma is used to form the silicon via aperture.
• In one embodiment, eachmetal layer204 is formed using fabrication techniques that produce a combination of aluminum metal traces, polysilicon gatelines, and silicon. Eachmetal layer204 performs electronic operations based on the configuration, structure, and control of the application of electricity to the selected locations of the metal layer. In certain embodiments that are not shown, there can be a number ofmetal layers204 that are vertically spaced within thewafer200 by one or more interconnect metal vias at desired locations.
• In one embodiment, each one of a lowerdiffusion barrier layer220 and an upperdiffusion barrier layer222 are made from titanium nitride (TiN). After theuppermost metal layer204 is formed, a lowerdiffusion barrier layer220 is deposited on themetal layer204. The lowerdiffusion barrier layer220 is located between thesilicon layer206 and themetal layer204. An upperdiffusion barrier layer222 is located on top of amorphous silicon of thesilicon layer206. Thediffusion barrier layers220 and222 are optional, and act to reduce the diffusion of the metal (e.g., aluminum) that are contained within therespective metal layers42 and204 into thesilicon layer206. Depending upon the particular processing, either or bothdiffusion barrier layers220 and222 may remain following processing in the finalmicro-mirror device10 as shown inFIG. 1d.
• Thesilicon layer206 is deposited above themetal layer204 and the lowerdiffusion barrier layer220 using metal deposition techniques such as chemical vapor deposition (CVD). Following the deposition of thesilicon layer206, anupper surface210 of thesilicon layer206 may be planarized such as by chemical metallization polishing (CMP). The upperdiffusion barrier layer222 is then deposited on the upper planarized surface of thesilicon layer206. A planarlower surface41 of thereflective element42 forms as a result of the planarizedupper surface210 of the silicon layer.
• In one embodiment, the chemistry of the plasma allows selective etching of the via apertures through: a) the upperdiffusion barrier layer222, b) thesilicon layer206, and c) the lowerdiffusion barrier layer220 relative to themetal layer204. Within this disclosure, selective etching of the silicon layer relative to the metal layer means that the process can etch through the entire silicon layer, while etching a lower percentage of the metal layer. In the embodiment ofFIG. 1b, thevia apertures212 are formed in the silicon of thesacrificial silicon layer206. In this disclosure, each viaaperture212 represents a void surrounded by walls that are etched in the silicon substrate. To form a via in any via aperture, metal is deposited on a surface such as thediffusion barrier layer220 that contains an opening to the via aperture. The outer surface of the via conforms to the shape of the wall of the via aperture. After thesupport metal vias24 are formed by metallization in thesacrificial silicon layer206, the sacrificial silicon layer is etched away. While this disclosure describes particularly etching via apertures in silicon that are used to form vias, the concepts described herein can be used to etch any aperture in silicon.
• This etching through thesilicon layer206 can be performed to form the via aperture down to themetal layer204, with relatively little etching in the metal layer. This etching thereby defines the outline of the via formed in thevia aperture212 that extends through thesilicon layer206 downward to themetal layer204. By forming the via down to but not through themetal layer204, an electrically conductive path is formed from the metal layer through the metallized via formed using the via aperture. When thevia aperture212 is metallized, the metal forming the metal via24 provides an electrical conductor from the upper surface (such as from themetal reflector element42 as shown inFIG. 1d) down to themetal layer204. In certain embodiments where thesilicon layer206 is removed following the formation of the via (e.g., the silicon layer is a sacrificial silicon layer), the metal via24 also provides support for thereflective element42 with respect to themetal layer204. The electrically-conductive metal of the metal via provides the functionality of the conductive via.
• Themetal layer204 ofFIGS. 1a,1b,1c, and1dmay be formed as either a continuous or discontinuous member. As such, the twosupport metal vias24 as shown inFIG. 1dcan be in electrical communication with a separate portion of themetal layer204, and may be held at different potentials without shorting as a result of the integrated circuit structure of themetal layer204.
• Chlorine chemistries such as BCl₃work well to etch TiN and silicon; however such chemistries when used alone may overetch downwardly through the metal of themetal layer204 when acting alone. As described with respect toFIG. 1b, thevia aperture212 is etched primarily in a vertical direction within the silicon of thesilicon layer206 downwardly in the general direction of thesubstrate202 to themetal layer204. Additionally, since it is uncertain how much etching is necessary to etch down to the metal layer when BCl₃is used alone, the etching will etch more in the horizontally direction to provide a relatively wide via aperture which has a low aspect ratio. The viaaperture212 ofFIG. 1bdefines the outline in which to form the outer surface of the metal via24 ofFIG. 1d. It is beneficial in many instances to form the metal via24 with a high aspect ratio (i.e., the height divided by the width of the via) and/or a more consistent cross-section. As such, in many instances, it is also desirable to form viaapertures212 that form the metal vias with a high aspect ratio and/or a more consistent cross-section.
• Within this disclosure, the term “etch directionality” indicates that the etchant can etch primarily in a single direction within the material being etched (e.g., the silicon layer206), instead of etching in all directions that the etchant contacts the material being etched. More particularly the etching of the viaaperture212 as shown inFIG. 1bis directed substantially downwardly towards the substrate instead of a combination of downwardly and horizontally, as a result of the electrostatic attraction of ions contained in the etchant that are attracted in a substantially downward direction. In one embodiment, the viaaperture212 is formed more cylindrically so that the metal via has a more consistent cross-section, as compared to the more frustro-conical shape that occurs when more horizontal etching occurs near the top of the aperture then near the bottom of the aperture. With a more uniform cross section, the bending operation of the via that, for example, results in the tilting of themicro-mirror device10 as shown inFIG. 1d, is more predictable and consistent between different devices. In addition, such uniformity of cross-sectional configuration reduces the formation of curves and shoulders in the via formed within the via aperture that result in increased stress concentration areas being produced in the metal via24 (resulting from varying structural dimensions). By using an etchant that etches through thesilicon layer206 with a high degree of directionality, the cross sectional dimension of the viaaperture212 can be formed more uniformly through thesilicon layer206 with an increased aspect ratio.
• In one embodiment, the viaaperture212 is etched in thesilicon layer206 using a plasma formed from combined chemistries of a first gas and a second gas. During fabrication, the first gas contains ions and provides etch directionality in a direction towards an oppositely-charged or grounded material of thesilicon wafer200 or thesilicon substrate202. In this disclosure, certain embodiments of the first gas include, but are not limited to, tricholorborane (BCl₃) or argon. The second gas of the plasma causes the etchant to selectively etch the silicon relative to the metal layer wherein in one embodiment, the viaapertures212 are etched through the silicon, and the etching is stopped on the metal layer with no or little etching of the metal layer. Certain embodiments of the second gas include, but are not limited to, gasses that have fluorine as a precursor, flouro-carbo type etch gasses, and more particularly sulfur hexafluoride (SF₆), NF₃, CF₄, CHF₃, or C₃F₈. Within this disclosure, the first gas is described as BCl₃and the second gas is described as SF₆, even though any of these other gasses are within the intended scope of the present disclosure.
• The chemistry of this plasma improves the selectivity of the silicon layer relative to the AlCu forming the electrically conductive or themetal layer204 as compared to chlorine and BCl₃chemistries. As such, the plasma formed from the BCl₃and the SF₆etches quite efficiently through the silicon of thesilicon layer206 to form the apertures, but does not etch as rapidly through themetal layer204. The chemistry enables etching of a film stack composed of a TiN refractory metal or similar refractory barrier material and the silicon of thesilicon layer206. Since the etching process allows relatively quick and efficient etching through the silicon layer but not through the metal layer, the duration of the etching is reduced, and the resulting horizontal etching within the aperture is reduced. By reducing the horizontal etching, the aspect ratio of the resultant vias is improved.
• This etching process as described herein also permits stopping the etching as a metal film layer, such as when themetal layer204, is reached. This ending of the etching on themetal layer204 reduces over-etching in which the material below the metal layer is etched. By stopping etching when the metal layer is reached as detected by an increased etch rate as described with respect toFIG. 2, the amount of outward etching within the viaaperture212 above the metal layer is also reduced.
• The etching process enables more precise etching different sizes of metal vias, and etching vias in different thicknesses of silicon on the same wafer without significantly over-etching through themetal layer204. The etching process occurs during a single plasma etch step under vacuum promoting desirable profiles and reduces the possibility of corrosion from residual chlorides. The described process also has good selectivity to photoresist such that small metal vias can be etched with desirable profile for subsequent sputtered metal deposition.
• The addition of BCl₃into the plasma provides directionality to the etching associated with using SF₆only. The directionality of the etching using BCl₃is achieved by the formation of positive ions within the plasma. The gas, SF₆, typically does not form positive ions in a plasma so when using this gas, the etch is isotropic or non-directional in nature. The addition of BCl₃in the plasma creates positive ions, BCl₃⁺ and BCl₂⁺. These positive ions are then accelerated downwardly into the silicon material being etched towards the grounded or electrically biased material of thewafer200 or thesubstrate204 because thewafer200 or substrate material is either grounded, or held at a negative voltage bias during the etching. The majority of the volume of thesubstrate202 is located physically below the material of thesilicon layer206 that is being etched. As such, biasing thesubstrate202 acts to propel the ions within the plasma in a generally downward direction towards the oppositely-charged or neutral substrate. Any portion of thewafer200 that is located below thesilicon layer206 may also be oppositely or neutrally charged relative to the ions contained in the plasma to drive the ions downwardly through thesilicon layer206, and thereby be used to etch the silicon layer to provide etch directionality in a generally downward direction. As such, the term “substrate” as referenced in this disclosure as202 may apply to any element within thewafer200 that is generally below thesilicon layer206. For example, in another embodiment, theentire wafer200 whose center is below that of thesilicon layer206 can be grounded or held at a negative voltage bias relative to the ions in the plasma. The resulting ion bombardment that provide etch directionality from these dominant ions towards thewafer200 or suitable substrate material, such as quartz glass, results in etch directionality using the plasma that is not achieve with a SF₆plasma alone. As such, the addition of the ions of the BCl₃gas to the plasma including SF₆is viewed as providing etch directionality that allows the etchant to etch in a direction towards the oppositely or neutrally charged material of thesubstrate202 down to themetal layer204.
• The material of thesubstrate202 acts to attract the ions in the plasma. For a given pair of charges in the substrate and the plasma material, closer spacing results in an increased attraction force. While it is true that many portions of thesubstrate202 and thewafer200 are not located exactly below the portion of the silicon layer that is being etched with the plasma, there is some horizontal component offset effect to material that is located on opposite lateral sides of the substrate202 (or the wafer). The charged or grounded materials that are equally offset in lateral directions within the substrate tend to cancel horizontal component of forces being applied to the ions in the plasma, thereby providing a generally downward force to the ions in the plasma into the silicon layer206 (that also provides for the generally downward etch directionality).
• This disclosure provides etching processes that provide etch directionality, largely as a result of the electrostatic attraction of the ions contained in the etchant of the plasma. Additionally, the etching process makes it possible to stop the etching on a metal layer. Combining the SF₆with the chlorine-based BCl₃reduces the possibility of etching through the metal layer as would occur with etching with BCl₃alone, and is thereby considered to causes the etchant to selectively etch the silicon relative to the metal layer.
• FIG. 1cshows one embodiment of depositing electrically conductive material on top of thesacrificial silicon layer206, and in electrical contact with the metal via24 that is formed as described with respect toFIG. 1b. Thesacrificial silicon layer206 is still in position such that both the metal via24 and thereflective element42 are formed using thesacrificial silicon layer206. The reflective elements of an entire array of reflective elements can be formed from depositing layers of the materials of the desired electrical, reflective, and structural characteristics. The deposited planar layers are etched by patterning to form horizontally-extending arrays of reflective elements such as micro-mirrors. Eachreflective element42 in the array of reflective elements that are formed from the deposited layer of materials can be individually actuated.
• FIG. 1dshows thesacrificial silicon layer206 being removed by etching to leave a free-standing and fully-functional micro-mirror device10. During fabrication, thereflective element42 is provided with a flexibility with respect to themetal layer204 that allows each reflective element to be displaced (often using electrical biasing to exert a force to the reflective element) with respect to other reflective elements. Any etching technique that etches silicon while not etching metal in those instances where the deposited layers of material to form thereflective element42, the metal via23, and themetal layer204 are each metal may be used to remove the sacrificial silicon layer. Further processing steps are used to form the glass transparent plate (not shown) that acts as a packaging portion to protect the mirror during normal operations.
• FIG. 2 outlines one embodiment of a higherdirectionality etching process300 that is used to etch the viaaperture212 within the silicon layer.FIG. 2 is known as an endpoint trace, and is an optical emission of theetching process300.FIG. 2 is illustrative in nature based on a particular plasma and silicon configuration, and is not intended to be limiting in scope. The particular etch-rates, as shown in Table 1 below, are exemplary for theetching process300. The higherdirectionality etching process300 starts at302 with clearing the upperdiffusion barrier layer222 as described with respect toFIG. 1aat one measured rate that can be measured in Angstroms per minute. The higherdirectionality etching process300 continues its etching at304 by clearing through the amorphous silicon forming thesilicon layer206. The higherdirectionality etching process300 continues to clear the lowerdiffusion barrier layer220 at306. During306, the etch rate differs (is slightly lower, though the etch rate is not shown inFIG. 2) from the etch rate of304. This variation in the etch rate is detectable by a skilled operator and/or a microprocessor-based controller. As such, the detected slight change in the etch rate can be used to determine when the etching down to the metal layer is complete. The etching of the lowerdiffusion barrier layer220 can be detected using, e.g., optical-emission spectroscopy as being slightly different than that of thesilicon layer206. An over-etch into themetal layer204 would occur at308 at a slower rate than that for the lowerdiffusion barrier layer220, but the etching is ended prior to the over-etching.
• As such, when the etch rate drops following the etching of the lowerdiffusion barrier layer220 as determined by the optical-emission spectroscopy, then the etching process should be completed because themetal layer204 is exposed through the via aperture. As soon as the metal layer is exposed, then the higherdirectionality etching process300 is complete and the further processing can be performed.
• One embodiment of the process involves using two different types of etch tools to form the plasma that can improve the degree of directionality of the etching in thesilicon layer206 down to themetal layer204. For example, the plasma uses the silicon and metal etch characteristics of the Cl₂chemistry along with the directionality of the BCl₃chemistry to form the plasma that is used to etch through the TiN barrier diffusion layers222,220 and thesilicon layer206 down to themetal layer204. A different etch tool is then used with a high selectivity to metal. This technique minimizes the over etch into themetal layer204 as shown in the photograph ofFIG. 3. This technique provides for stopping the etch process at a consistent etch depth with respect to the upper surface of themetal layer204. The etch rate through the TiNdiffusion barrier layer220 at the bottom of the metal via is slow and maintaining adequate resist for deep metal vias is difficult. As shown in the photograph ofFIG. 3, the etched side walls of the viaaperture212 are etched to have walls that are mostly vertical due to the relative high degree of directionality of the etchant in a downward direction.
• The plasma as provided in this disclosure provides for reasonably good etch rate of silicon and TiN or similar refractive metal barrier film with good selectivity to themetal layer204. The plasma as described provides for etching of silicon down to and stopping on theintegrated metal layer204 using one etching tool and a continuous etching process. An illustrative via etching process that is described with respect to Table 1 is shown inFIG. 2. In general, the two-to-one concentration of BCl₃with respect to SF₆is applied in TABLE 1 and has been found to be effective. Any other relative concentration of BCl₃and SF₆is within the intended scope of the present disclosure. As the relative concentration of SF₆is increased and/or the relative concentration of BCl₃is reduced, the walls of the via apertures212 generally angle more from vertical due to a decrease in etch directionality, and more horizontal etching near the top of the aperture. This etching technique using the plasma as described with respect to Table 1 allows flexibility to etch silicon in an etcher for metal.

  TABLE 1
  Exemplary Plasma Etching Recipe

  Etching with a Metal Etcher, such as the 9600SE Process Chamber that

  is commercially available from LAM Research of Fremont CA.

  Amorphous Silicon etch rate 6000-4800 Å/min

  Photoresist etch rate ˜3000-5000 Å/min

  Titanium Nitride (TiN) etch rate 3600 Å/min

  Aluminum etch rate ˜175 Å/min

  Pressure: 7.5 mTorr

  Power applied to upper electrode in chamber: 350 W

  Power applied to lower electrode in chamber that connects to thesilicon

  substrate

  202 or other portion of the wafer: 75 W or less of opposite

  polarity of upper electrode.

  Note: power levels applied to upper and lower electrodes in process

  chamber represent one effective applied value, other ranges can be

  determined by experimentation.

  N2: 0-20 standard cubic centimeters per minute (sccm)

  BCl3: 40 sccm

  SF6: 20-40 sccm

  Cl2: 0 sccm

  He: 8 Torr

  Time: 110-300 seconds

  In one embodiment, the gasses are kept in separate containers to the

  formation of the plasma, and are combined at a nozzle assembly to

  form the plasma. During etching, the etchants can be heated to a

  desired level within the processing chamber.

• Example Interconnect Metal Vias
• The embodiment of etching techniques that are used to etch the support metal via24 as described with respect toFIGS. 1d,2, and3 can also be used to etch an interconnect metal via700 as described with respect toFIG. 4. While the sacrificial silicon layer that the support metal via is formed therein is ultimately removed in the embodiment of support metal via fabrication as described with respect toFIGS. 1a,1b,1c, and1d; the silicon layer that is used to form the interconnect metal via700 remains following processing. The support metal via24 is a structural component that provides electrical conductivity to the reflector plate, and also physically supports the reflector plate. The interconnect metal via700 ofFIG. 4 only provides electrical conductivity betweenmultiple metal layers204aand204b, and does not have to provide support which is instead provided by the silicon layer. The uniformity of the etching of the via aperture that allows for the support metal via having a more uniform cross-sectional configuration as a result of the etching with the plasma as described above allows for more consistent and predictable electrical characteristics of the interconnect metal vias.
• While there are twometal layers204aand204bshown inFIG. 4 that are interconnected by one or moreinterconnect metal vias700, it is envisioned that there may be a larger number of metal layers that are formed in vertical relation to each other with adjacent layers being interconnected by a different one or more interconnect metal via700. The techniques by which the selected plasma reduces over-etching as described with respect to the support metal vias are applicable to reducing over-etching in the interconnect metal vias. By reducing the over-etching in the interconnect metal vias as described with respect toFIG. 1b, the possibility of an interconnect metal via extending unintentionally through multiple metal layers to create an undesired electrical connection is greatly reduced. One or more interconnect metal vias can be formed in the same IC as one or more support metal vias.
CONCLUSION
• Although the invention is described in language specific to structural features and methodological steps, it is to be understood that the invention defined in the appended claims is not necessarily limited to the specific features or steps described. Rather, the specific features and steps disclosed represents preferred forms of implementing the claimed invention.

Claims (27)

1. A method of etching, comprising

directing a plasma having at least first and second gasses at a substrate, wherein the substrate is at least partially covered with at least first and second layers; and

electrostatically attracting ions of the first gas towards the substrate, wherein the second gas selectively etches the first layer relative to the second layer.

2. The method of etching ofclaim 1, wherein the first gas at least includes tricholorborane (BCl₃).

3. The method ofclaim 1, wherein the second gas is selected from the group of SF₆, NF₃, CF₄, CHF₃, and C₃F₈.

4. The method of etching ofclaim 1, wherein the first layer comprises silicon.

5. The method of etching ofclaim 1, wherein the second layer comprises an electrically conductive material.

6. The method of etching ofclaim 1, wherein the second gas includes a fluorine precursor.

7. The method of etching ofclaim 1, further comprising grounding the substrate.

8. The method of etching ofclaim 1, further comprising applying an electrical bias to the substrate.

9. The method of etching ofclaim 1, wherein the first gas has a chlorine chemistry.

10. The method of etching ofclaim 1, further comprising:

metallizing an aperture formed in the first layer by the etching to form a metal via that extends down to the second layer, wherein the second layer is an electrically conductive material, and wherein the silicon is a sacrificial silicon that is removed following the formation of the metal via that electrically contacts the metal layer.

11. The method of etching ofclaim 1, wherein the electrostatically attracting ions of the first gas towards the substrate provides for etch directionality.

12. A method of making a micro-mirror device, comprising:

directing a plasma having at least first and second gasses at a substrate having at least a first layer and a second layer; and

etching the silicon layer by electrostatically attracting ions of the first gas into the first layer towards the substrate, wherein the second gas selectively etches the first layer relative to the second layer, and wherein the first layer is a sacrificial layer that is removed following the formation of the metal via that electrically contacts the second layer;

metallizing the first layer to form a metal via in an aperture formed during the etching that extends through the first layer and is connected to the second layer; and

forming a reflective plate that is physically attached to the metal via, wherein the metal via physically connects and electrically couples the second layer and the reflective plate.

13. The method of etching ofclaim 12, wherein the first gas at least includes tricholorborane (BCl3).

14. The method ofclaim 12, wherein the second gas is selected from the group of SF₆, NF₃, CF₄, CHF₃, and C₃F₈.

15. The method of etching ofclaim 12, wherein the first layer comprises silicon.

16. The method of etching ofclaim 12, wherein the second layer comprises an electrically conductive material.

17. The method of etching ofclaim 12, wherein the second gas includes a fluorine precursor.

18. The method of etching ofclaim 12, further comprising grounding the substrate.

19. The method of etching ofclaim 12, further comprising applying an electrical bias to the substrate.

20. The method of etching ofclaim 12, wherein the first gas has a chlorine chemistry.

21. The method of etching ofclaim 12, wherein the electrostatically attracting ions of the first gas towards the substrate provides for etch directionality.

22. An etchant, comprising:

a first gas capable of selectively etching a first layer relative to a second layer, wherein the second layer is located between the first layer and a charged member; and

a second gas capable of electrostatic attraction towards the charged member.

23. The etchant ofclaim 22, wherein the first gas has a chlorine chemistry.

24. The etchant ofclaim 22, wherein the first gas comprises tricholorborane (BCl₃).

25. The etchant ofclaim 22, wherein the first gas comprises tricholorborane (BCl₃).

26. The etchant ofclaim 22, wherein the second gas is selected from the group of SF₆, NF₃, CF₄, CHF₃, and C₃F₈.

27. The etchant ofclaim 22, wherein the first gas comprises tricholorborane (BCl₃) and the second gas is selected from the group of SF₆, NF₃, CF₄, CHF₃, and C₃F₈.

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