US20050224932A1 - Electrically conductive wire - Google Patents

Abstract

A method of soldering comprises disposing first and second balls of solder adjacent one another on a wire; disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls; disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and melting the first and second balls of solder and flux and soldering the wire to the conductor.

Description

• This is a divisional of divisional application Ser. No. 10/011,741, filed Dec. 11, 2001 which is a divisional of application Ser. No. 08/752,865, filed Nov. 20, 1996 now U.S. Pat. No. 6,410,544. The entire disclosure of the above-referenced prior applications is considered as being part of the disclosure of the accompanying divisional application and is hereby incorporated by reference there in.
BACKGROUND OF THE INVENTION
• The invention relates to an electrically conductive wire having a solder ball thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate by means of a soldering process.
SUMMARY OF THE INVENTION
• For circuit connection across both surfaces of a substrate, a through-hole substrate is known from EP-A-O 126 164. For making the circuit connection an electrically conductive wire having a solder ball thereon is used. The wire is inserted in the through-hole of the substrate. The substrate has electrically conductive members on both surfaces and the conductive members are arranged on the perimeters of the through-hole. The solder ball on the wire is positioned on one of the conductive members. By means of a soldering process, like dipping or flow soldering, one or both ends of the wire are soldered to a conductive member at one surface of the substrate, whereas at the same time heat generated during the soldering process is transferred through the wire to the solder ball at the opposite surface of the substrate in order to melt the solder ball for making a soldering connection between the wire and the conductive member at the opposite surface of the substrate. In this way the circuit connection between the conductive members on both surfaces of the substrate is made.
• In practice it has turned out that to make a circuit connection with the use of a single solder ball on it as described hereinbefore, often leads to a bad connection between the conductive members.
• Therefore many manufacturers use a separate soldering robot for making such circuit connections. However, this method is rather expensive and results in a limitation in design, logistics, maintenance and process control.
• The object of the invention is to provide an electrically conductive wire means for making a reliable circuit connection between electrically conductive members on opposite surfaces of a substrate.
• The present invention provides an electrically conductive wire having a solder ball thereon for making a circuit connection between electrically conductive members on opposite surfaces of a substrate, characterized in that the wire comprises two spaced apart solder balls on it and flux in the space between the solder balls.
• Using this kind of wires for making circuit connections across both surfaces of a substrate results in a good and reliable connection. The wires are very suitable for use in an automatic soldering process, like reflow or wave soldering. The wire can be inserted in the through-hole of a substrate during the process of placing other components with the same machine. In one of the subsequent operation steps the components are soldered at their required position. At the same time the wires can be soldered in the same soldering process. So, the most important advantage is that the wires can be soldered during existing automatic soldering processes of other components. Preferably the solder balls are composed of tin, lead and bismuth instead of tin and lead only as usually used. The addition of bismuth reduces the melting temperature of the solder.
BRIEF DESCRIPTION OF THE DRAWINGS
• The present invention will now be described, by way of example, with reference to the accompanying drawings, wherein:
• FIG. 1 shows the conductive wire,
• FIG. 2 shows the wires packed in a tape, and
• FIG. 3 shows schematically a wave soldering process for a substrate with inserted conductive wires.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
• The electricallyconductive wire1, usually a copper wire, is provided with two solder balls ordots2 fixedly secured thereon. The solder balls are spaced apart. Thesmall space3 between the balls are filled with aflux4. The wires can be packed in atape5 in well known manner (seeFIG. 2) for use in a feeder of, for example, a component placement machine. In a component placement machine the wires are inserted in through-holes7 of asubstrate6 or printed circuit board in such a manner that theends8 of a wire make contact with or are close to aconductive track9 provided on one of thesurfaces10 of the substrate and thesolder balls2 withflux4 between them make contact with or are close to aconductive track11 provided on theopposite surface12 of the substrate. Usually other components are also placed on the substrate as well. For electrically connecting the wires and components, the substrate is transported through, for example, awave soldering machine13, as shown inFIG. 3. Thesurface10 of the substrate faces thehot solder14. The hot solder touches theends8 of thewire1, which are then soldered to their respectiveconductive tracks9. The heat of thehot solder14 is also transferred through thewire2 to thesolder balls2 situated at theopposite surface12 of the substrate. The solder balls melt and the conductive track surfaces to be wetted by solder are cleaned by means of the flux, so that a reliable connection is obtained. By using a composition of solder with tin, lead and bismuth, such as Sn43PB43Bi14, the melting temperature is reduced, resulting in a better electrical connection.

Claims (12)

1-6. (canceled)

7. A soldered product comprising:

a solderable assembly on a substrate,

the solderable assembly comprising an electrically conductive wire, a first solder ball fixed on said wire and a second solder ball fixed on said wire,

the first and second solder ball being disposed on a single contact,

the electrically conductive wire being placed on the substrate such that an end of the electrically conductive wire protrudes through the substrate onto an opposite side of the substrate from the first and second solder balls.

8. The soldered product ofclaim 7 wherein the wire further comprises a second conductive end protruding beyond the second solder ball, wherein the second end is inserted through the substrate for soldering from said opposite side.

9. The soldered product ofclaim 7, wherein the solder balls are composed of tin, lead and bismuth.

10. The soldered product ofclaim 7, wherein said first and second solder balls are each centered substantially around said wire.

11. A substrate on which a solderable assembly is placed, the assembly comprising: (i) an electrically conductive wire, (ii) a first solder ball fixed on said wire, and (iii) a second solder ball fixed on said wire;

said second ball being joined to said first ball in an area separating said first and second solder balls and solder from the first and second solder balls substantially filling a space between the first and second solder balls;

wherein an end of the electrically conductive wire protrudes through the substrate onto an opposite side of the substrate from the first and second solder balls and the flux, and

the first and second solder balls being disposed on a single contact.

12. The substrate ofclaim 11 wherein the wire further comprises a second conductive end protruding beyond the second solder ball, which second end is inserted through the substrate for soldering from said opposite side.

13. The soldered product ofclaim 11, wherein the solder balls are composed of tin, lead and bismuth.

14. The soldered product ofclaim 11, wherein said first and second solder balls are each centered substantially around said wire.

15. A system for manufacture of electronic components comprising:

means for disposing first and second balls of solder located adjacent one another on a wire;

means for disposing the wire on a substrate so that the first and second balls of solder are configured to be melted in soldering to contact a single conductor on the substrate;

means for melting the first and second balls of solder and flux and soldering the wire to the conductor.

16. The system ofclaim 15 wherein the means for melting comprises a wave soldering machine.

17. A substrate comprising:

first and second balls of solder located adjacent one another on a wire;

flux on the wire between and in contact with the first and second solder balls, substantially filling a space between the first and second solder balls;

the wire being configured to be attached to the substrate at a single conductor on the substrate.

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