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US20050199367A1 - Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device - Google Patents

Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device
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Publication number
US20050199367A1
US20050199367A1US10/522,349US52234905AUS2005199367A1US 20050199367 A1US20050199367 A1US 20050199367A1US 52234905 AUS52234905 AUS 52234905AUS 2005199367 A1US2005199367 A1US 2005199367A1
Authority
US
United States
Prior art keywords
heat
mobile radio
metal foil
present
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/522,349
Inventor
Jorg Romahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AGfiledCriticalSiemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFTreassignmentSIEMENS AKTIENGESELLSCHAFTASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: ROMAHN, JORG
Publication of US20050199367A1publicationCriticalpatent/US20050199367A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

The present invention relates to a method for heat dissipation in mobile radio devices, with heat-radiating electrical components, whereby the heat-radiating components are brought into heat-dissipating contact with a metal film. The present invention further relates to a mobile radio device with heat-radiating electrical components, whereby each component is in effective heat-dissipating contact with a metal film.

Description

Claims (4)

US10/522,3492002-07-232003-07-16Method for heat dissipation in mobile radio devices, and a corresponding mobile radio deviceAbandonedUS20050199367A1 (en)

Applications Claiming Priority (3)

Application NumberPriority DateFiling DateTitle
DE10234500.72002-07-23
DE10234500ADE10234500A1 (en)2002-07-232002-07-23Heat extraction in mobile radio equipment involves bringing electrical components into heat extraction contact with metal film with corrugated and/or honeycomb structure in contact with cooling body
PCT/DE2003/002441WO2004017697A1 (en)2002-07-232003-07-16Method for heat dissipation in mobile radio devices and a corresponding mobile radio device

Publications (1)

Publication NumberPublication Date
US20050199367A1true US20050199367A1 (en)2005-09-15

Family

ID=30469148

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US10/522,349AbandonedUS20050199367A1 (en)2002-07-232003-07-16Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device

Country Status (7)

CountryLink
US (1)US20050199367A1 (en)
EP (1)EP1523870A1 (en)
JP (1)JP2005534197A (en)
CN (1)CN1669376A (en)
AU (1)AU2003250308A1 (en)
DE (1)DE10234500A1 (en)
WO (1)WO2004017697A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20050105584A1 (en)*2002-03-202005-05-19Ngk Insulators LtdMethod of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en)*2007-01-092007-07-12Lockheed Martin CorporationHigh Performance Large Tolerance Heat Sink
CN105141727A (en)*2015-10-132015-12-09太仓市和准电子科技有限公司Mobile phone shell
US20160320815A1 (en)*2008-06-272016-11-03Hewlett-Packard Development Company, L.P.Dissipating heat within housings for electrical components
CN107305292A (en)*2016-04-202017-10-31佳能株式会社Head mounted display and grasping device
US20190289745A1 (en)*2018-03-132019-09-19Rosemount Aerospace Inc.Flexible heat sink for aircraft electronic units

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
KR20090009911A (en)2006-04-272009-01-23교세라 가부시키가이샤 Electronics
JP2007300222A (en)*2006-04-272007-11-15Kyocera Corp Electronics
KR101390082B1 (en)2007-08-012014-05-28삼성전자주식회사Mobile communication terminal with projector
DE102015207893B3 (en)*2015-04-292016-10-13Robert Bosch Gmbh Electronic assembly, in particular for a transmission control module
DE102020005527A1 (en)*2020-09-102022-03-10Daimler Ag Cooling arrangement and battery arrangement with a flat structure surrounded by thermal paste for thermal coupling

Citations (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4246597A (en)*1979-06-291981-01-20International Business Machines CorporationAir cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en)*1986-04-141987-12-08Thermalloy IncorporatedHeat sink clip assembly
US5020138A (en)*1989-04-031991-05-28Sony CorporationRadio communication apparatus having cooling means
US5030793A (en)*1990-05-071991-07-09Motorola Inc.Integrated EMI filter and thermal heat sink
US5175612A (en)*1989-12-191992-12-29Lsi Logic CorporationHeat sink for semiconductor device assembly
US5323294A (en)*1993-03-311994-06-21Unisys CorporationLiquid metal heat conducting member and integrated circuit package incorporating same
US5369879A (en)*1992-06-051994-12-06Eaton CorporationMethod of mounting a semiconductor device to a heat sink
US5548090A (en)*1995-08-211996-08-20Northern Telecom LimitedHeat sink and printed circuit board combination
US5582240A (en)*1994-09-191996-12-10Motorola, Inc.Pneumatically coupled heat sink assembly
US5783862A (en)*1992-03-201998-07-21Hewlett-Packard Co.Electrically conductive thermal interface
US6121680A (en)*1999-02-162000-09-19Intel CorporationMesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6131646A (en)*1998-01-192000-10-17Trw Inc.Heat conductive interface material
US6257328B1 (en)*1997-10-142001-07-10Matsushita Electric Industrial Co., Ltd.Thermal conductive unit and thermal connection structure using the same
US6545352B1 (en)*2002-02-152003-04-08Ericsson Inc.Assembly for mounting power semiconductive modules to heat dissipators

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3694699A (en)*1970-03-301972-09-26Nat Beryllia CorpCeramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
JP2794154B2 (en)*1993-06-041998-09-03ダイヤモンド電機 株式会社 heatsink
US5812374A (en)*1996-10-281998-09-22Shuff; Gregg DouglasElectrical circuit cooling device
DE19734110C1 (en)*1997-08-071998-11-19Bosch Gmbh RobertElectrical device with heat sink mat for electronic component board
KR200239827Y1 (en)*1998-03-062001-09-25구자홍Radiating plate for television
US6031727A (en)*1998-10-262000-02-29Micron Technology, Inc.Printed circuit board with integrated heat sink
DE60035798T2 (en)*1999-12-012008-04-30Cool Options, Inc. STRUCTURE OF A HEAT-RELATED MATERIAL

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4246597A (en)*1979-06-291981-01-20International Business Machines CorporationAir cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en)*1986-04-141987-12-08Thermalloy IncorporatedHeat sink clip assembly
US5020138A (en)*1989-04-031991-05-28Sony CorporationRadio communication apparatus having cooling means
US5175612A (en)*1989-12-191992-12-29Lsi Logic CorporationHeat sink for semiconductor device assembly
US5030793A (en)*1990-05-071991-07-09Motorola Inc.Integrated EMI filter and thermal heat sink
US5783862A (en)*1992-03-201998-07-21Hewlett-Packard Co.Electrically conductive thermal interface
US5369879A (en)*1992-06-051994-12-06Eaton CorporationMethod of mounting a semiconductor device to a heat sink
US5323294A (en)*1993-03-311994-06-21Unisys CorporationLiquid metal heat conducting member and integrated circuit package incorporating same
US5582240A (en)*1994-09-191996-12-10Motorola, Inc.Pneumatically coupled heat sink assembly
US5548090A (en)*1995-08-211996-08-20Northern Telecom LimitedHeat sink and printed circuit board combination
US6257328B1 (en)*1997-10-142001-07-10Matsushita Electric Industrial Co., Ltd.Thermal conductive unit and thermal connection structure using the same
US6131646A (en)*1998-01-192000-10-17Trw Inc.Heat conductive interface material
US6121680A (en)*1999-02-162000-09-19Intel CorporationMesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6545352B1 (en)*2002-02-152003-04-08Ericsson Inc.Assembly for mounting power semiconductive modules to heat dissipators

Cited By (11)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20050105584A1 (en)*2002-03-202005-05-19Ngk Insulators LtdMethod of measuring thermal conductivity of honeycomb structure
US7682072B2 (en)*2002-03-202010-03-23Ngk Insulators, Ltd.Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en)*2007-01-092007-07-12Lockheed Martin CorporationHigh Performance Large Tolerance Heat Sink
US7995344B2 (en)*2007-01-092011-08-09Lockheed Martin CorporationHigh performance large tolerance heat sink
US20160320815A1 (en)*2008-06-272016-11-03Hewlett-Packard Development Company, L.P.Dissipating heat within housings for electrical components
US10234916B2 (en)*2008-06-272019-03-19Hewlett-Packard Development Company, L.P.Dissipating heat within housings for electrical components
CN105141727A (en)*2015-10-132015-12-09太仓市和准电子科技有限公司Mobile phone shell
CN107305292A (en)*2016-04-202017-10-31佳能株式会社Head mounted display and grasping device
EP3239762A1 (en)*2016-04-202017-11-01Canon Kabushiki KaishaHead-mounted display and gripping apparatus
US10477730B2 (en)2016-04-202019-11-12Canon Kabushiki KaishaHead-mounted display and gripping apparatus
US20190289745A1 (en)*2018-03-132019-09-19Rosemount Aerospace Inc.Flexible heat sink for aircraft electronic units

Also Published As

Publication numberPublication date
JP2005534197A (en)2005-11-10
AU2003250308A1 (en)2004-03-03
EP1523870A1 (en)2005-04-20
DE10234500A1 (en)2004-02-19
WO2004017697A1 (en)2004-02-26
CN1669376A (en)2005-09-14

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Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ROMAHN, JORG;REEL/FRAME:016718/0683

Effective date:20041126

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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