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US20050189331A1 - Laser ablation nozzle assembly - Google Patents

Laser ablation nozzle assembly
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Publication number
US20050189331A1
US20050189331A1US10/673,856US67385603AUS2005189331A1US 20050189331 A1US20050189331 A1US 20050189331A1US 67385603 AUS67385603 AUS 67385603AUS 2005189331 A1US2005189331 A1US 2005189331A1
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US
United States
Prior art keywords
nozzle
window
laser beam
nozzle assembly
channel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US10/673,856
Inventor
Ian Millard
Karl Pichler
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Individual
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Individual
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Publication date
Application filed by IndividualfiledCriticalIndividual
Priority to US10/673,856priorityCriticalpatent/US20050189331A1/en
Publication of US20050189331A1publicationCriticalpatent/US20050189331A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A laser ablation system includes a first embodiment of a nozzle assembly where a laser beam is emitted through the nozzle assembly to remove materials on a target. The nozzle assembly includes a nozzle having a top end, and a window placed on the top end of the nozzle. The window includes one or more apertures and the laser beam is emitted through one of those apertures. Another laser ablation system includes a second embodiment of a nozzle assembly where a laser beam is emitted through the nozzle assembly to remove materials on a target. The nozzle assembly includes a nozzle having one or more channels at a top end of the nozzle. The nozzle assembly also includes a window that is placed on the one or more channels. A gas flows through the one or more channels and that gas flow reduces debris deposition on the window. Yet another laser ablation system includes a third embodiment of a nozzle assembly that includes a nozzle that has a central channel aligned longitudinally through which said laser beam travels from a top end of said nozzle to a bottom end of said nozzle. In this embodiment, the central channel of the nozzle is threaded.

Description

Claims (11)

US10/673,8562002-12-202003-09-29Laser ablation nozzle assemblyAbandonedUS20050189331A1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US10/673,856US20050189331A1 (en)2002-12-202003-09-29Laser ablation nozzle assembly

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US10/325,066US6683277B1 (en)2002-12-202002-12-20Laser ablation nozzle assembly
US10/673,856US20050189331A1 (en)2002-12-202003-09-29Laser ablation nozzle assembly

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US10/325,066DivisionUS6683277B1 (en)2002-12-202002-12-20Laser ablation nozzle assembly

Publications (1)

Publication NumberPublication Date
US20050189331A1true US20050189331A1 (en)2005-09-01

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ID=30115411

Family Applications (3)

Application NumberTitlePriority DateFiling Date
US10/325,066Expired - LifetimeUS6683277B1 (en)2002-12-202002-12-20Laser ablation nozzle assembly
US10/673,856AbandonedUS20050189331A1 (en)2002-12-202003-09-29Laser ablation nozzle assembly
US10/673,588Expired - LifetimeUS6797919B1 (en)2002-12-202003-09-29Laser ablation nozzle assembly

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Application NumberTitlePriority DateFiling Date
US10/325,066Expired - LifetimeUS6683277B1 (en)2002-12-202002-12-20Laser ablation nozzle assembly

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Application NumberTitlePriority DateFiling Date
US10/673,588Expired - LifetimeUS6797919B1 (en)2002-12-202003-09-29Laser ablation nozzle assembly

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US20070278195A1 (en)*2004-11-102007-12-06Synova SaMethod and Device for Generating a Jet of Fluid for Material Processing and Fluid Nozzle for Use in Said Device
US20100252541A1 (en)*2009-03-312010-10-07Ats Automation Tooling Systems Inc.Laser processing nozzle
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US20110220143A1 (en)*2008-04-182011-09-15Plasmatreat GmbhDevice for Treating an Inner Surface of a Work Piece
US20130104827A1 (en)*2010-05-272013-05-02Pascal WoernerLaser-induced spark ignition for an internal combustion engine
US11298772B2 (en)*2018-09-262022-04-12Kabushiki Kaisha ToshibaWelding apparatus and nozzle device
US11465238B2 (en)*2019-02-132022-10-11Bystronic Laser AgGas guide, laser cutting head and laser cutting machine
WO2022266534A1 (en)*2021-06-182022-12-22Ipg Photonics CorporationMaterial processing functionality in handheld laser system

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US7379483B2 (en)*2003-03-182008-05-27Loma Linda University Medical CenterMethod and apparatus for material processing
US7286223B2 (en)*2003-03-182007-10-23Loma Linda University Medical CenterMethod and apparatus for detecting embedded rebar within an interaction region of a structure irradiated with laser light
US7880116B2 (en)*2003-03-182011-02-01Loma Linda University Medical CenterLaser head for irradiation and removal of material from a surface of a structure
US7060932B2 (en)2003-03-182006-06-13Loma Linda University Medical CenterMethod and apparatus for material processing
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SG11201504874QA (en)2013-04-172015-07-30Fluidigm Canada IncSample analysis for mass cytometry
KR20150102180A (en)2014-02-272015-09-07삼성디스플레이 주식회사Laser beam irradiation apparatus and manufacturing method of organic light emitting display apparatus using the same
JP5663776B1 (en)*2014-03-272015-02-04福井県 Suction method, suction device, laser processing method, and laser processing device
JP6334235B2 (en)*2014-04-072018-05-30株式会社ディスコ Laser processing equipment
US10328523B2 (en)*2014-07-112019-06-25Rolls-Royce CorporationFluted additive manufacturing deposition head design
JP7071118B2 (en)*2014-08-192022-05-18ルミレッズ ホールディング ベーフェー Sapphire collector to reduce mechanical damage during die-level laser lift-off
US9945253B2 (en)2015-01-292018-04-17Rohr, Inc.Collecting / removing byproducts of laser ablation
EP3295479B1 (en)*2015-05-132018-09-26Lumileds Holding B.V.Sapphire collector for reducing mechanical damage during die level laser lift-off
JP6516624B2 (en)*2015-08-112019-05-22株式会社ディスコ Laser processing equipment
KR102606823B1 (en)*2016-04-202023-11-28삼성디스플레이 주식회사Laser etching apparatus and method of laser etching using the same
CA3032861A1 (en)2016-08-022018-02-08Fluidigm Canada Inc.Laser ablation system
US10328530B2 (en)2016-09-272019-06-25The Boeing CompanyFlexible and local laser shroud
KR102402998B1 (en)*2017-05-222022-05-30삼성디스플레이 주식회사Deposition mask manufacturing method and manufacturing apparatus thereof
US11813671B2 (en)2020-01-272023-11-14Rolls-Royce CorporationMicrotextured nozzle for directed energy deposition with greater than 100 features per square millimeter

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US4025787A (en)*1974-06-241977-05-24Kraftwerk Union AktiengesellschaftSeparation of mixtures of gaseous isotopes
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US4740692A (en)*1985-06-131988-04-26Mitsubishi Denki Kabushiki KaishaLaser mass spectroscopic analyzer and method
US4785815A (en)*1985-10-231988-11-22Cordis CorporationApparatus for locating and ablating cardiac conduction pathways
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Cited By (14)

* Cited by examiner, † Cited by third party
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US7302309B2 (en)*2004-04-262007-11-27Hewlett-Packard Development Company, L.P.Laser micromachining methods and systems
US20050240299A1 (en)*2004-04-262005-10-27Graeme ScottLaser micromachining methods and systems
US20070278195A1 (en)*2004-11-102007-12-06Synova SaMethod and Device for Generating a Jet of Fluid for Material Processing and Fluid Nozzle for Use in Said Device
US10016845B2 (en)*2004-11-102018-07-10Synova SaMethod and device for generating a jet of fluid for material processing and fluid nozzle for use in said device
US20110220143A1 (en)*2008-04-182011-09-15Plasmatreat GmbhDevice for Treating an Inner Surface of a Work Piece
US20100252541A1 (en)*2009-03-312010-10-07Ats Automation Tooling Systems Inc.Laser processing nozzle
US8642919B2 (en)2009-03-312014-02-04Ats Automation Tooling Systems Inc.Laser processing nozzle
US8241945B2 (en)2010-02-082012-08-14Suniva, Inc.Solar cells and methods of fabrication thereof
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US20130104827A1 (en)*2010-05-272013-05-02Pascal WoernerLaser-induced spark ignition for an internal combustion engine
US11298772B2 (en)*2018-09-262022-04-12Kabushiki Kaisha ToshibaWelding apparatus and nozzle device
US11465238B2 (en)*2019-02-132022-10-11Bystronic Laser AgGas guide, laser cutting head and laser cutting machine
WO2022266534A1 (en)*2021-06-182022-12-22Ipg Photonics CorporationMaterial processing functionality in handheld laser system
EP4355522A4 (en)*2021-06-182024-12-18IPG Photonics CorporationMaterial processing functionality in handheld laser system

Also Published As

Publication numberPublication date
US6683277B1 (en)2004-01-27
US6797919B1 (en)2004-09-28

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