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US20050183848A1 - Coolant tray of liquid based cooling device - Google Patents

Coolant tray of liquid based cooling device
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Publication number
US20050183848A1
US20050183848A1US10/963,525US96352504AUS2005183848A1US 20050183848 A1US20050183848 A1US 20050183848A1US 96352504 AUS96352504 AUS 96352504AUS 2005183848 A1US2005183848 A1US 2005183848A1
Authority
US
United States
Prior art keywords
coolant
tray
pump
cooling device
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/963,525
Inventor
Ruei-Fu Cheng
Ts'ung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IndividualfiledCriticalIndividual
Publication of US20050183848A1publicationCriticalpatent/US20050183848A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A liquid based cooling device includes a pump for driving a coolant through a coolant tray that is positionable on a heat generating device and a radiator that dissipates the heat into the surrounding. The coolant tray includes a housing on which coolant inlet and outlet are formed for receiving the coolant from the pump and discharging the coolant to the radiator. The coolant tray also forms a recess in which a thermally conductive base forming a coolant channel is received in a liquid tight manner. The pump includes a casing in which coolant inlet and outlet are formed. The inlet of the coolant tray is integrally connected to the outlet of the pump and the housing of the coolant tray and the casing of the pump are integrally formed with each other with an integrally formed conduit connected therebetween. This simplifies the manufacturing of the cooling device and reduces the overall size of the cooling device.

Description

Claims (2)

1. In a liquid based cooling device comprising a pump for circulating a liquid coolant between a coolant tray that is positionable on a heat generating device to remove heat therefrom by the coolant flowing through the coolant tray and a radiator that dissipates heat carried by the coolant into the surrounding,
the pump comprising a casing forming a coolant outlet for guiding the coolant to the coolant tray; and
the coolant tray comprising a housing defining a recess receiving a thermally conductive base that defines a channel for the coolant, and the housing forming an inlet for receiving the coolant and an outlet through which the coolant flowing through the channel is discharged to the radiator;
wherein the inlet of the coolant tray is integrally connected to the outlet of the pump and the housing of the coolant tray and the casing of the pump are integrally formed with each other with an integrally formed conduit connected therebetween.
US10/963,5252004-02-252004-10-14Coolant tray of liquid based cooling deviceAbandonedUS20050183848A1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
TW093202697UTWM252981U (en)2004-02-252004-02-25Improved water basin structure of liquid cooler
TW0932026972004-02-25

Publications (1)

Publication NumberPublication Date
US20050183848A1true US20050183848A1 (en)2005-08-25

Family

ID=34571822

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US10/963,525AbandonedUS20050183848A1 (en)2004-02-252004-10-14Coolant tray of liquid based cooling device

Country Status (2)

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US (1)US20050183848A1 (en)
TW (1)TWM252981U (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20050186093A1 (en)*2004-02-252005-08-25Ruei-Fu ChengPump of liquid based cooling device
US20060005945A1 (en)*2004-07-082006-01-12Fujitsu LimitedCooling module
US20060185830A1 (en)*2005-02-182006-08-24Cooler Master Co. Ltd.Cooling plate module
US20060213645A1 (en)*2005-03-242006-09-28Wintersteen Douglas CIntegral liquid cooling unit for a computer
US20060249278A1 (en)*2005-05-072006-11-09Tay-Jian LiuLiquid cooling system suitable for removing heat from electronic components
US20070051500A1 (en)*2005-09-062007-03-08Sun Microsystems, Inc.Magneto-hydrodynamic heat sink
US20090145588A1 (en)*2007-12-102009-06-11Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with heat pipe
US20090218072A1 (en)*2005-05-062009-09-03Andre Sloth EriksenCooling system for a computer system
US20090314473A1 (en)*2006-09-192009-12-24Minoru YoshikawaCooling device
US20100326636A1 (en)*2003-11-072010-12-30Asetek A/SCooling system for a computer system
CN106642870A (en)*2017-01-242017-05-10武汉攀升鼎承科技有限公司Three-dimensional type water cooling heat dissipation device
US9795058B2 (en)*2015-06-112017-10-17Cooler Master Co., Ltd.Electronic device and liquid cooling heat dissipation device thereof
US9907207B1 (en)*2016-08-262018-02-27Auras Technology Co., Ltd.Liquid-cooling heat dissipating module
US9927181B2 (en)2009-12-152018-03-27Rouchon Industries, Inc.Radiator with integrated pump for actively cooling electronic devices
US10299406B2 (en)*2016-01-192019-05-21Cooler Master Co., Ltd.Liquid cooling heat sink device
JP2019186526A (en)*2018-03-302019-10-24日本電産株式会社Cooling device
JP2020109780A (en)*2018-12-282020-07-16日本電産株式会社Cooling apparatus
US20210199391A1 (en)*2019-01-312021-07-01Shenzhen APALTEK Co., Ltd.Fluid cooling device

Citations (8)

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Publication numberPriority datePublication dateAssigneeTitle
US4884630A (en)*1988-07-141989-12-05Microelectronics And Computer Technology CorporationEnd fed liquid heat exchanger for an electronic component
US5316077A (en)*1992-12-091994-05-31Eaton CorporationHeat sink for electrical circuit components
US5763951A (en)*1996-07-221998-06-09Northrop Grumman CorporationNon-mechanical magnetic pump for liquid cooling
US6263957B1 (en)*2000-01-132001-07-24Lucent Technologies Inc.Integrated active cooling device for board mounted electric components
US6324058B1 (en)*2000-10-252001-11-27Chieh-Jen HsiaoHeat-dissipating apparatus for an integrated circuit device
US6327145B1 (en)*2000-09-012001-12-04Intel CorporationHeat sink with integrated fluid circulation pump
US6600649B1 (en)*2002-05-242003-07-29Mei-Nan TsaiHeat dissipating device
US6832646B1 (en)*1999-02-262004-12-21Nippon Thermostat Co., Ltd.Cooler for electronic device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4884630A (en)*1988-07-141989-12-05Microelectronics And Computer Technology CorporationEnd fed liquid heat exchanger for an electronic component
US5316077A (en)*1992-12-091994-05-31Eaton CorporationHeat sink for electrical circuit components
US5763951A (en)*1996-07-221998-06-09Northrop Grumman CorporationNon-mechanical magnetic pump for liquid cooling
US6832646B1 (en)*1999-02-262004-12-21Nippon Thermostat Co., Ltd.Cooler for electronic device
US6263957B1 (en)*2000-01-132001-07-24Lucent Technologies Inc.Integrated active cooling device for board mounted electric components
US6327145B1 (en)*2000-09-012001-12-04Intel CorporationHeat sink with integrated fluid circulation pump
US6324058B1 (en)*2000-10-252001-11-27Chieh-Jen HsiaoHeat-dissipating apparatus for an integrated circuit device
US6600649B1 (en)*2002-05-242003-07-29Mei-Nan TsaiHeat dissipating device

Cited By (40)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20100326636A1 (en)*2003-11-072010-12-30Asetek A/SCooling system for a computer system
US9715260B2 (en)2003-11-072017-07-25Asetek Danmark A/SCooling system for a computer system
US10613601B2 (en)2003-11-072020-04-07Asetek Danmark A/SCooling system for a computer system
US8240362B2 (en)*2003-11-072012-08-14Asetek A/SCooling system for a computer system
US10078354B2 (en)2003-11-072018-09-18Asetek Danmark A/SCooling system for a computer system
US11287861B2 (en)2003-11-072022-03-29Asetek Danmark A/SCooling system for a computer system
US20100326634A1 (en)*2003-11-072010-12-30Asetek A/S.Cooling system for a computer system
US20050186093A1 (en)*2004-02-252005-08-25Ruei-Fu ChengPump of liquid based cooling device
US7241118B2 (en)*2004-02-252007-07-10Ruei-Fu ChengPump of liquid based cooling device
US20060005945A1 (en)*2004-07-082006-01-12Fujitsu LimitedCooling module
US7222661B2 (en)*2004-07-082007-05-29Fujitsu LimitedCooling module
US20060185830A1 (en)*2005-02-182006-08-24Cooler Master Co. Ltd.Cooling plate module
US20060213645A1 (en)*2005-03-242006-09-28Wintersteen Douglas CIntegral liquid cooling unit for a computer
US10078355B2 (en)2005-05-062018-09-18Asetek Danmark A/SCooling system for a computer system
US20090218072A1 (en)*2005-05-062009-09-03Andre Sloth EriksenCooling system for a computer system
US10599196B2 (en)2005-05-062020-03-24Asetek Danmark A/SCooling system for a computer system
US9733681B2 (en)2005-05-062017-08-15Asetek Danmark A/SCooling system for a computer system
US11287862B2 (en)2005-05-062022-03-29Asetek Danmark A/SCooling system for a computer system
US20060249278A1 (en)*2005-05-072006-11-09Tay-Jian LiuLiquid cooling system suitable for removing heat from electronic components
US7472743B2 (en)*2005-05-072009-01-06Foxconn Technology Co., Ltd.Liquid cooling system suitable for removing heat from electronic components
US20070051500A1 (en)*2005-09-062007-03-08Sun Microsystems, Inc.Magneto-hydrodynamic heat sink
US7516778B2 (en)*2005-09-062009-04-14Sun Microsystems, Inc.Magneto-hydrodynamic heat sink
US20090314473A1 (en)*2006-09-192009-12-24Minoru YoshikawaCooling device
JP5252204B2 (en)*2006-09-192013-07-31日本電気株式会社 Cooling system
US8432695B2 (en)2006-09-192013-04-30Nec CorporationCooling device
EP2065935A4 (en)*2006-09-192012-01-11Nec Corp COOLING APPARATUS
US20090145588A1 (en)*2007-12-102009-06-11Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with heat pipe
US7870890B2 (en)*2007-12-102011-01-18Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.Heat dissipation device with heat pipe
US9927181B2 (en)2009-12-152018-03-27Rouchon Industries, Inc.Radiator with integrated pump for actively cooling electronic devices
US9795058B2 (en)*2015-06-112017-10-17Cooler Master Co., Ltd.Electronic device and liquid cooling heat dissipation device thereof
US10299406B2 (en)*2016-01-192019-05-21Cooler Master Co., Ltd.Liquid cooling heat sink device
US9907207B1 (en)*2016-08-262018-02-27Auras Technology Co., Ltd.Liquid-cooling heat dissipating module
CN106642870A (en)*2017-01-242017-05-10武汉攀升鼎承科技有限公司Three-dimensional type water cooling heat dissipation device
JP2019186526A (en)*2018-03-302019-10-24日本電産株式会社Cooling device
JP7238401B2 (en)2018-03-302023-03-14日本電産株式会社 Cooling system
US11582883B2 (en)2018-12-282023-02-14Nidec CorporationCooling apparatus
JP7238400B2 (en)2018-12-282023-03-14日本電産株式会社 Cooling system
JP2020109780A (en)*2018-12-282020-07-16日本電産株式会社Cooling apparatus
US20210199391A1 (en)*2019-01-312021-07-01Shenzhen APALTEK Co., Ltd.Fluid cooling device
US11802741B2 (en)*2019-01-312023-10-31Shenzhen APALTEK Co., Ltd.Fluid cooling device

Also Published As

Publication numberPublication date
TWM252981U (en)2004-12-11

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Legal Events

DateCodeTitleDescription
STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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