US20050139980A1 - High density integrated circuit module - Google Patents

Abstract

The present invention provides a method and apparatus for fabricating densely stacked ball-grid-array packages into a three-dimensional multi-package array. Integrated circuit packages are stacked on one another to form a module. Lead carriers provide an external point of electrical connection to buried package leads. Lead carriers are formed with apertures that partially surround each lead and electrically and thermally couple conductive elements or traces in the lead carrier to each package lead. Optionally thin layers of thermally conductive adhesive located between the lead carrier and adjacent packages facilitates the transfer of heat between packages and to the lead carrier. Lead carriers may be formed of custom flexible circuits having multiple layers of conductive material separated by a substrate to provide accurate impedance control and providing high density signal trace routing and ball-grid array connection to a printed wiring board.

Description

CROSS-REFERENCE TO RELATED APPLICATION
• This application is a continuation-in-part of application Ser. No. 08/774,699, filed Dec. 26, 1996 and a Continuing Prosecution Application filed Feb. 11, 1998, pending, which is a continuation of 08/497,565, filed Jun. 30, 1995, now issued as U.S. Pat. No. 5,631,193, which is a continuation of application Ser. No. 07/990,334, filed Dec. 11, 1992, now issued as U.S. Pat. No. 5,484,959.
BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• This invention relates to a high density, integrated circuit module, which includes a plurality of vertically or horizontally stacked individual surface mount or ball-grid-array integrated circuit packages.
• 2. Brief Description of the Related Technology
• An example of a fabrication method and apparatus for high density lead-on-package modules by laminating one or more lead frames to standard integrated circuit packages is disclosed in U.S. Pat. No. 5,484,959, assigned to the common assignee of the present invention and incorporated herein by reference. Other methods for providing high density, stacked modules are disclosed in U.S. Pat. Nos. 5,279,029, 5,367,766, 5,455,740, 5,450,959 and 5,592,364, all of which are assigned to the common assignee of the present invention and incorporated herein by reference. The general methods and apparatus disclosed in the referenced patents can be applied to the fabrication of stacked configurations comprised of individual ball-grid-array or surface mount packages. However, the characteristic lead orientation, lead shape and lead content of ball-grid-array or surface mount packages impose a different set of parameters not adequately provided for by prior methods and assemblies.
SUMMARY OF THE INVENTION
• The present invention provides a novel method and apparatus for manufacturing three-dimensional, high density, integrated circuit modules from standard ball-grid-array or other surface mount integrated circuit packages which provides improved space efficiency and heat dissipation. One way to increase space efficiency is to stack individual packages. Generally speaking, higher density generates more localized heat and thus increases the need for efficient heat dissipation. Improving the thermal transfer characteristics of the individual integrated circuit packages results in better heat dissipation for the module, and improves reliability and durability.
• The present invention provides a novel method of fabricating a three-dimensional module formed of stacked and aligned surface mount or ball-grid-array packages. Ball-Grid-Array (BGA) integrated circuit packages typically have leads that extend from the bottom surface of a rectangular solid resin casing in a two-dimensional grid pattern. The external portion of each lead finished with a ball of solder. Package leads provide electrical and thermal coupling to one or more integrated circuit dies that are embedded within the protective casing. Typically, the protective casing completely surrounds the embedded die but, in some BGA packages, the protective casing does not cover the inactive top surface of the die. Near-chip scale packages provide 1.0 mm center-to-center lead spacing. Chip scale packaging such as MICRO_BGA™ have center-to-center lead spacing of 0.5 mm. Chip scale packaging offers excellent electrical characteristics including low capacitance and thermal design.
• Connectivity to the leads of individual packages in a module is provided by thin substantially planar lead carriers located between adjacent packages. Lead carriers are adhered to adjacent packages with a thermally conductive but electrically insulating adhesive. A lead carrier is comprised of elongated electrically and thermally conductive elements formed in one or more thin planes of conductive material that are separated by high-dielectric material. Typically, each conductive element has at least one aperture, adapted to receive and electrically couple to an individual package ball and at least one interconnect lead that extends away from the module to provide external circuit connectivity to package leads. Preferably, the lead carriers are formed from custom flexible circuits commercially available from 3M™ or other manufacturers. These well known flexible circuits are typically comprised of one or more thin layers of conductive material that are die cut and drilled to form ground planes, signal traces, pads and apertures. The conductive layers are typically embedded in and between electrically-insulating, high-dielectric material such as polyamide, polyester or teflon which results in circuits that are flexible, have dense trace, and provide accurate impedance control.
• The present invention utilizes standard manufactured packages to form the multi-package module. Such packages typically have ball irregularities or inconsistencies, particularly ball length and solder coating variations. These variations make automated assembly problematic since the tolerances necessary to accommodate variation in ball length and excess solder, for example, do not permit the packages to be assembled within the more stringent requirements for automated assembly of the module. According to one aspect of the present invention, the leads of the ball-grid-array packages are scythed prior to assembly or as an automated step during the assembly. Scything is a method where a hot razor knife skims off a layer from the distal end of all the leads of a ball-grid-array package, reducing random excess lead length and providing a uniform, closely tolerant lead length. The step of scything allows multiple packages to be added to the module prior to a final heating step where the solder for all the packages is flowed. This method also has the advantage of increasing the minimal tolerances for positioning of ball-grid-array package on the lead carrier. An alternative method that may also be used to compensate for excess solder from the leads is to provide channels formed in the walls or edges of each aperture of the lead carrier that receives the ball so the excess solder, when heated, flows into the channels A channel is a void area in a conductive element which merges into the void area of an aperture. An edge of the channel is in close proximity to the package leads and the void area extends away from the leads. Channels take advantage of the surface tension of molten solder which will pull molten solder away from leads to fill the channel.
• Another object of the present invention is to provide an assembly which effectively dissipates heat generated during normal operation. Efficient thermal management increases the operational life of the module, and improves reliability by eliminating the effects of elevated temperature on the electrical characteristics of the integrated circuit and packaging. When packages are not stacked, heat from the embedded integrated circuits, generated through normal operation, is primarily dissipated by convection from the package's external surfaces to the surrounding air. When modules are formed by stacking packages, the buried packages have reduced surface area exposed to the air. The use of thermally conductive adhesive facilitates the transmission of heat between adjacent packages and is an effective method of taking advantage of the exposed surfaces for removing heat from buried packages.
• In the module of the present invention, the package leads are thermally coupled to the lead carrier and provide a path for heat from the embedded integrated circuits. Thermally conductive adhesive also facilitates transfer of heat from packages to the lead carrier.
• In applications where it is desirable to reduce the package and module height, or where package or module warping is a concern, each package may be constructed using any of the various techniques described in U.S. Pat. Nos. 5,369,056, 5,369,058 and 5,644,161, each of which is assigned to the common assignee of the present invention and incorporated herein by reference. These patents describe methods for constructing thin, durable packages and modules with enhanced heat dissipation characteristics and minimal warpage.
• A common application of a stacked configuration is memory modules. Most of the leads of each package are electrically connected to corresponding leads of adjacent packages. A method is required to select the individual memory package being read, written or refreshed. One method is to provide a custom manufactured lead carrier for each package. A more cost-effective method is to use a common lead carrier design with extra package interconnect leads which is then modified by clipping off or no-connecting selected interconnect leads to make each lead carrier in a stacked configuration unique. Methods for connecting a unique bit of a data word per package and for uniquely addressing each package in a stacked configuration are described in U.S. Pat. Nos. 5,279,029 and 5,371,866, both which are assigned to the common assignee of the present invention and incorporated herein by reference. While the apparatus and methods of the present invention are described herein with reference to standard, single-size packages, it will be appreciated by those of ordinary skill in the art, that those methods and apparatus are equally applicable to multiple-die packages.
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 is a cross-sectional view of two adjacent packages of a module of the present invention;
• FIG. 2 is a top planar view of a typical lead carrier of the present invention;
• FIG. 3aillustrates the preferred embodiment for an aperture for connection with a package lead of the present invention;
• FIG. 3billustrates an alternative embodiment of an aperture for connection with a package lead of the present invention;
• FIG. 4 illustrates a horizontally stacked module of the present invention;
• FIG. 5 illustrates a vertically stacked module of the present invention;
• FIG. 6 illustrates an alternative embodiment of a horizontally stacked module of the present invention; and
• FIG. 7 illustrates an alternative embodiment of horizontally stacked module of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
• Other and further objects, features and advantages will be apparent from the following description of the preferred embodiments of the invention, given for the purpose of disclosure and taken in conjunction with the accompanying drawings.
• The letter of a reference character containing numerics followed by a letter, either identifies the relative placement of the numeric reference within a stacked module or it identifies a specific embodiment.
• Referring now toFIG. 1, a typical ball-grid-array package50 is comprised of anintegrated circuit51 surrounded by an essentially rectangularsolid resin casing55. Package leads52 extend from thebottom surface54 of the casing in a two-dimensional grid pattern providing electrical and thermal coupling to one or more integrated circuit die51 that are embedded within the protective casing. The external portion of eachpackage lead52 includes a coating of solder having a semi-spherical shape. Typically, theprotective casing55 completely surrounds the embedded die but, in some ball-grid-array packages50, theprotective casing55 does not cover the inactivetop surface53 of the die. Near-chip scale packages50 provide 1.0 mm center-to-center spacing between leads52. Chip scale packaging such as MICRO_BGA™ have center-to-center lead spacing of 0.5 mm. Chip scale packaging offers excellent electrical characteristics including low capacitance and thermal design.
• FIGS. 4 through 7 show various specific embodiments of stacked module M of the present invention. The letter M designates the module M formed of a plurality of ball-grid-array packages50. Typically, thepackages50 are aligned as shown inFIGS. 4, 5 and7 where the bottom surfaces54 of eachpackage50 are facing the same direction. Alternately, thepackages50 may be aligned where one or more of thepackages50 are inverted in relation to theother packages50 as shown inFIG. 6. In this embodiment, thetop package50dis inverted with respect to thebottom package50e; thetop surface53 of thetop package50dis in substantially full contact with the adhesive70 on thetop surface53 of thelower package50e.
• A typical application of one aspect of the present invention is shown inFIG. 1 which illustrates a partial cross-section of any twoadjacent packages50 that comprise a module M. The internals ofpackage50bare not shown for simplicity.FIG. 1 shows twopackages50aand50bmounted on opposite sides of alead carrier60 comprised of a single thin copper plane. Interconnect leads64 extend away from the module M to provide external circuit connectivity to package leads52 of thetop package50a. External connectivity may be provided in different configurations as described in detail below with reference toFIGS. 4-7. A typical layout of a singleplane lead carrier60 is shown inFIG. 2. Thelead carrier60 is made to be flexible for increased reliability and ease of assembly. Alead carrier60 can be comprised of elongatedconductive elements65 formed from a thermally and electrically conductive thin planer material such as beryllium copper alloy C3 having a thickness of about 3 mils. Eachconductive element65 is defined to include a trace, interconnect pad, via and any other conductive feature of the lead carrier that are electrically coupled. Other preferred alloys for the lead-carrier-conductive elements62 are full hard or hard copper alloys (110 or 197) or olin copper alloy 1094. Preferably, thelead carrier60 is formed from custom flexible circuits from 3M™ and other manufacturers. These well known flexible circuits are typically comprised of one or more thin (1.4 mils thick) layers of conductive material that are die cut and drilled to formapertures66, ground planes andconductive elements65 which include traces, mounting pads and leads. The conductive layers typically are flanked by a thin (typically 1 to 11 mill thick) layer of electrically-insulating, high-dielectric materials such at polyamide, polyester or teflon which results in circuit composites that are flexible. The material and thickness of individual layers that comprise thelead carriers60 as well as spacing betweenconductive elements65 and the width ofconductive elements65 can be precisely controlled to provide a accurate and consistent impedance control in selectconductive elements65. Leadcarriers60 formed from custom flexible-circuits can have vias for connectingtraces65 located on different planes and conductive pads (or leads), with solder coating having footprints that are compatible with standards for ball-grid array packages50 for electrical and mechanical coupling to a printedwiring board80.
• Typically, eachconductive element65 in alead carrier60 has at least oneaperture66, adapted to receive anindividual package lead52 and at least oneinterconnect portion64 that extends away from the module to provide an external point of electrical connection to package leads52.Interconnect portions64 preferably have a spring-like resiliency for increased reliability.Apertures66 have about the same diameter as apackage lead52 allowing eachpackage lead52 to extend through theaperture66 and for thelead carrier60 to have substantial contact with thebottom surface54 of apackage50. The application of heat (about 175 degrees centigrade) that is sufficient to cause the solder comprising the package leads52 to flow will cause the solder to adhere to a thin area of aconductive element65 on the surface of thelead carrier60 facing away from thepackage50 that surrounds eachaperture66 to formflange55 that provides excellent electrical and mechanical coupling between package leads52 and thelead carrier60.FIG. 3aillustrates the preferredsemi-circle shape66afor theaperture66 where theconductive element65 partially surrounds thepackage ball52. The semicircle shape66a, as opposed to a full-circle shape, enables an increased space for routing theconductive elements65 of thelead carrier60.
• The present invention utilizes standard manufacturedpackages50 to form the multi-package module M. Such packages50 typically havepackage lead52 irregularities or inconsistencies, particularly, lead length and solder coating variations. These variations make automated assembly problematic since the tolerances necessary to accommodate variation inlead52 length, for example, do not permit thepackages50 to be assembled within the more stringent requirements for automated assembly of the module M. The package leads52 typically have excess solder that can cause electrical shorts between package leads52. According to one aspect of the present invention, theleads52 of the ball-grid-array packages50 are scythed prior to assembly or as an automated step during the assembly after thelead carrier60 is attached. Scything is the preferred method of reducing the length by which package leads52 extend from thepackage50. Scything is a method where a hot razor knife skims off the distal portion of all package leads52.
• Referring again toFIG. 1, leadcarriers60 are adhered toadjacent packages50 with a thermally conductive but electrical-insulatingadhesive70. The adhesive70 may be epoxy, such as Rogers Corp. R/flex 8970 which is B-staged phenolic butyryl epoxy, that may be laminated at a temperature of 130 degrees centigrade and cured at a temperature of about 175 degrees centigrade. The preferred method is to use a 2 mil thick sandwich ofpolyamide film70, such as Kapton™ which includes a 0.5 mil thick layer of adhesive on both sides (a three-layer system). A thermally conductive filled adhesive70 may be used to enhance the transfer of heat betweenadjacent packages50, and between thepackages50 andcarrier60.
• Referring now toFIG. 4, a horizontally oriented embodiment of the present invention is illustrated. Typically, a module M is preassembled and then attached to aPWB80 or other circuit carrying substrate. Alternately, the preassembled module M may be inserted into an integrated circuit socket.
• InFIG. 4, a plurality of integrated circuit packages50, each with an attachedlead carrier65, are stacked in a horizontally-oriented module M. In this configuration, eachlead carrier65 has anexternal interconnect portion64 which extends from both sides of the module M to provide interconnection to an electrically and thermally conductiveexternal interconnect structure40.Structure40 provides mechanical rigidity to the module M and is adhered to the upper surface41 of theuppermost package50.Structure40 also includes circuitboard interconnection portions43 which may be formed for industry-standard socketability with an electrical socket carried incircuit board substrate80.
• A vertically-oriented configuration of module M is illustrated inFIG. 5. In this embodiment,lead carriers60 are formed withexternal interconnect portions64 all extending to one side which requires theconductive elements65 to be more densely spaced. In this embodiment,external interconnect portions64 are spaced in row and column configuration for socketing or soldering to circuit connections oncircuit board substrate80.
• Another embodiment of module M is illustrated with reference toFIG. 6. In this embodiment, module M is formed in a two-high stack comprised ofpackages50eand50d. In this embodiment,package50ehas its package leads52 mounted directly to corresponding array of external circuit connect pads carried insubstrate80.Upper package50dis inverted with respect to package50eand mounted to package50dwith thermally conductiveadhesive layer70.Surface54 ofpackage50dincludes package leads52. Alead carrier60, formed as described above, is adhered to surface54 ofpackage50dwith thermallyconductive adhesive70. Externalcircuit interconnect portions64 provide electrical connectivity forupper package50dto circuit connection pads carried insubstrate80.
• Referring now toFIG. 7, module M is shown in an alternative three-high configuration comprised ofindividual packages50a,50band50c. Alead carrier60 is adhered to thepackage lead surface54 of each package. For clarity, package leads52 are not shown as topackages50aand50b. Leadcarriers60 forpackages50aand50binclude external circuit connectportions64bwhich are formed to nest together to provide mechanical rigidity and electrical and thermal conductivity for the moduleM. Lower package50chas lead carrier60cadhered to itslower surface54 in the manner described above with thermally conductivity, electrically insulating adhesive. In this embodiment,circuit connection portions64aof lead carrier60care selectively interconnected toconnection portions64b. Package leads52 oflower package50care connected to external circuit connections carried insubstrate80 in a standard ball-grid-array pattern.
• According to one specific method of the present invention, a method for manufacture a module M involves the following steps: (1) mounting an adhesive70ato thebottom surface56 of apackage50; (2) aligning and mounting alead carrier60 to the adhesive70 whereinapertures66 receive the package leads52; (3) scything of the distal end of all package leads52; (4) applying heat (about 175 degrees centigrade) to cure adhesive70 and flow thepackage lead52 solder coating; (5) mounting a second thin layer of adhesive70bto thelead carrier60; and (6) mounting anotherpackage50 to the adhesive70b, wherein thetop surface56 of thepackage50 has substantial contact with the adhesive. Steps1 though6 are repeated for eachpackage50 added to the module, except steps5 and6 are not repeated for thelast package50. For reliability and remanufacturability, it may be desirable to test eachpackage50 as it is added to the module M.
• The preferred method replaces the steps of applying adhesive70aand70bwith the preliminary step of applying double-sidedadhesive tape70 to both upper and lower surfaces of eachlead carrier60 prior to assembly. The step of applying heat to causesolder53 to flow and to cure adhesive66 after each step of mounting apackage50 is eliminated if the leads52 of thepackage50 are reduced in height prior to assembly and a thin area of the second layer of adhesive70baround eachaperture66 is left void to allow the package leads52 to form a flange when heat is applied. The module M may be assembled using a suitably formed manufacturing jig provided to holdindividual packages50 in alignment as they are stacked together with interspacedlead carriers60 and adhesive carryingtape70. In this embodiment, the entire module M may be preassembled and a single heating event applied to flow the solder and cure the adhesive70 as pressure is exerted on the module M to compress the layers.
• Referring now toFIG. 3b, an alternative embodiment which compensates for excess solder steps utilizeschannels66cformed in eachaperture66b.FIG. 3billustrates one shape of anaperture66bwithmultiple channels66c. Achannel66cis a void area in aconductive element65 which merges into the void area of anaperture66. When apackage lead52 is inserted into theaperture66b, an edge of eachchannel66cis in close proximity to the package leads52. The void area of thechannel66cextends away from theball52. When heat is applied such that the solder coating the package leads52 becomes molten, excess solder is pulled by the inherent surface tension of molten solder to fill the voided area.
• Communication between individual integrated circuits embedded withinpackages50 and signals external to the modules are provided by various methods for implementing an external structure. Methods and apparatus of such structures are described in U.S. Pat. Nos. 5,279,029 and 5,367,766. Alternatively, theexternal structure40 may be formed integral to theleads64 extending from the lead carrier61 as shown inFIGS. 6 and 7. In the embodiment shown inFIG. 7, theleads64bare formed such to electrically and thermally connect directly to selectedadjacent leads64b. Leads64 may be formed with asubstrate mounting portion65 that may have a standard “gull-wing,” “J-lead” shape.
• The foregoing disclosure and description of the invention are illustrative and explanatory of the preferred embodiments. Changes in the size, shape, materials and individual components used, elements, connections and construction may be made without departing from the spirit of the invention.

Claims (11)

1-41. (canceled)

42. A high density circuit module comprising:

first and second BGA packages, each having a body exhibiting a bottom surface, a top surface, a plurality of BGA contacts arranged in a grid along the bottom surface and first and second opposing lateral sides;

a flexible circuit having a first side with a first BGA-connecting portion including a plurality of electrical contacts arranged in a grid, and a second side, the first BGA-connecting portion of the first side of the flexible circuit being disposed below the body of the first BGA package and connected through the plurality of electrical contacts to the plurality of BGA contacts of the first BGA, the flexible circuit having a second portion having a second portion set of contacts for connecting to a circuit board and a third portion having a third portion set of contacts for connecting to the circuit board, the second portion being disposed partially beside the first lateral side of the second BGA package and the third portion being disposed partially beside the second lateral side of the second BGA package to dispose the second portion set of contacts and the third portion set of contacts below the level of a plane defined by the bottom surface of the body of the second BGA package.

43. The high density circuit module ofclaim 42 in which the flexible circuit comprises two or more planes of conductive material separated by high dielectric material.

44. The high density circuit module ofclaim 42 in which the plurality of electrical contacts are each formed having an aperture adapted to receive one of the BGA contacts.

45. The high density circuit module ofclaim 42 in which the flexible circuit is adhesively connected to the top surface of the second selected BGA package.

46. A high density circuit module comprising:

a first BGA package having a body with a bottom surface, a top surface, a plurality of BGA contacts arranged in a grid along the bottom surface, and first and second opposing lateral sides that define a vertical extent of body;

a first flexible circuit having a first portion disposed above the top surface of the first BGA package, the first portion having a grid of electrical contacts, a second portion disposed beside the first lateral side of the first BGA package, a third portion disposed beside the second lateral side of the first BGA package, a fourth portion disposed adjacent to the second portion and below the vertical extent of the body of the first BGA package, the fourth portion having a first set of contacts for connecting to a circuit board, a fifth portion disposed adjacent to the third portion and below the vertical extent of the body of the first BGA package, the fifth portion having a second set of contacts for connecting to the circuit board;

a second BGA package having a body with a bottom surface, a top surface, a plurality of BGA contacts arranged in a grid along the bottom surface, and first and second opposing lateral sides that define a vertical extent of body, the second BGA package being mounted to the grid of electrical contacts, the second BGA package being above the first BGA package.

47. The high density circuit module ofclaim 46 in which the first flexible circuit comprises two or more planes of conductive material separated by high dielectric material.

48. The high density circuit module ofclaim 46 further comprising:

a second flexible circuit having a first portion disposed above the top surface of the second BGA package, the first portion having a grid of electrical contacts, a second portion disposed beside the first lateral side of the second BGA package, a third portion disposed beside the second lateral side of the second BGA package, a fourth portion disposed adjacent to the second portion and below the vertical extent of the body of the second BGA package, the fourth portion having a first set of contacts for connecting to the first flexible circuit, a fifth portion disposed adjacent to the third portion and below the vertical extent of the body of the second BGA package, the fifth portion having a second set of contacts for connecting to the first flexible circuit;

a third BGA package having a body with a bottom surface, a top surface, a plurality of BGA contacts arranged in a grid along the bottom surface, and first and second opposing lateral sides that define a vertical extent of body, the third BGA package being mounted to the grid of electrical contacts of the second flexible circuit, the third BGA package being above the second BGA package.

49. The high density circuit module ofclaim 46 in which the grid of electrical contacts are each formed having an aperature adapted to receive one of the BGA contacts.

50. The high density circuit module ofclaim 46 in which the flexible circuit is adhesively connected to the top surface of the second selected BGA package.

51. The high density circuit module ofclaim 46 in which the flexible circuit is adhesively connected to the top surface of the second selected BGA package.

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