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US20050116245A1 - Hermetically sealed glass package and method of fabrication - Google Patents

Hermetically sealed glass package and method of fabrication
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Publication number
US20050116245A1
US20050116245A1US10/965,453US96545304AUS2005116245A1US 20050116245 A1US20050116245 A1US 20050116245A1US 96545304 AUS96545304 AUS 96545304AUS 2005116245 A1US2005116245 A1US 2005116245A1
Authority
US
United States
Prior art keywords
mole
doped
sealing glass
composition
glass plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/965,453
Inventor
Bruce Aitken
Paul Danielson
James Dickinson
Stephan Logunov
Robert Morena
Mark Powley
Kamjula Reddy
Joseph Schroeder
Alexander Streltsov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/414,653external-prioritypatent/US20040206953A1/en
Application filed by Corning IncfiledCriticalCorning Inc
Priority to US10/965,453priorityCriticalpatent/US20050116245A1/en
Assigned to CORNING INCORPORATEDreassignmentCORNING INCORPORATEDASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: REDDY, KAMJULA P., STRELTSOV, ALEXANDER, MORENA, ROBERT M., DANIELSON, PAUL S., POWLEY, MARK L., AITKEN, BRUCE G., DICKINSON, JAMES E., JR., LOGUNOV, STEPHAN L., SCHROEDER, JOSEPH F., III
Publication of US20050116245A1publicationCriticalpatent/US20050116245A1/en
Priority to CN2005800349632Aprioritypatent/CN101103429B/en
Priority to JP2007536728Aprioritypatent/JP4999695B2/en
Priority to KR1020127015352Aprioritypatent/KR101265812B1/en
Priority to PCT/US2005/035602prioritypatent/WO2006044184A2/en
Priority to EP20050802819prioritypatent/EP1805787A4/en
Priority to KR1020077010816Aprioritypatent/KR101276390B1/en
Priority to TW094135602Aprioritypatent/TWI302713B/en
Priority to US12/725,648prioritypatent/US8148179B2/en
Abandonedlegal-statusCriticalCurrent

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Abstract

A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

Description

Claims (57)

US10/965,4532003-04-162004-10-13Hermetically sealed glass package and method of fabricationAbandonedUS20050116245A1 (en)

Priority Applications (9)

Application NumberPriority DateFiling DateTitle
US10/965,453US20050116245A1 (en)2003-04-162004-10-13Hermetically sealed glass package and method of fabrication
KR1020077010816AKR101276390B1 (en)2004-10-132005-10-04Hermetically sealed glass package
EP20050802819EP1805787A4 (en)2004-10-132005-10-04 HERMETICALLY CLOSED GLASS PACKAGING AND METHOD OF MANUFACTURE
PCT/US2005/035602WO2006044184A2 (en)2004-10-132005-10-04Hermetically sealed glass package and method of fabrication
JP2007536728AJP4999695B2 (en)2004-10-132005-10-04 Hermetically sealed glass package and manufacturing method
CN2005800349632ACN101103429B (en)2004-10-132005-10-04 Hermetically sealed glass package and manufacturing method
KR1020127015352AKR101265812B1 (en)2004-10-132005-10-04Hermetically sealed glass package
TW094135602ATWI302713B (en)2004-10-132005-10-12Hermetically sealed glass package and method of fabrication
US12/725,648US8148179B2 (en)2003-04-162010-03-17Hermetically sealed glass package and method of fabrication

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US10/414,653US20040206953A1 (en)2003-04-162003-04-16Hermetically sealed glass package and method of fabrication
US10/965,453US20050116245A1 (en)2003-04-162004-10-13Hermetically sealed glass package and method of fabrication

Related Parent Applications (1)

Application NumberTitlePriority DateFiling Date
US10/414,653Continuation-In-PartUS20040206953A1 (en)2003-04-162003-04-16Hermetically sealed glass package and method of fabrication

Related Child Applications (1)

Application NumberTitlePriority DateFiling Date
US12/725,648ContinuationUS8148179B2 (en)2003-04-162010-03-17Hermetically sealed glass package and method of fabrication

Publications (1)

Publication NumberPublication Date
US20050116245A1true US20050116245A1 (en)2005-06-02

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Family Applications (2)

Application NumberTitlePriority DateFiling Date
US10/965,453AbandonedUS20050116245A1 (en)2003-04-162004-10-13Hermetically sealed glass package and method of fabrication
US12/725,648Expired - Fee RelatedUS8148179B2 (en)2003-04-162010-03-17Hermetically sealed glass package and method of fabrication

Family Applications After (1)

Application NumberTitlePriority DateFiling Date
US12/725,648Expired - Fee RelatedUS8148179B2 (en)2003-04-162010-03-17Hermetically sealed glass package and method of fabrication

Country Status (7)

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US (2)US20050116245A1 (en)
EP (1)EP1805787A4 (en)
JP (1)JP4999695B2 (en)
KR (2)KR101276390B1 (en)
CN (1)CN101103429B (en)
TW (1)TWI302713B (en)
WO (1)WO2006044184A2 (en)

Cited By (29)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20060187213A1 (en)*2005-02-212006-08-24Au Optronics Corp.Electroluminescence display with touch panel
WO2006044184A3 (en)*2004-10-132007-09-27Corning IncHermetically sealed glass package and method of fabrication
US20080048556A1 (en)*2006-08-242008-02-28Stephan Lvovich LogunovMethod for hermetically sealing an OLED display
US20080168801A1 (en)*2007-01-122008-07-17Paul Stephen DanielsonMethod of sealing glass
US20080211408A1 (en)*2004-08-172008-09-04Hiroyuki YamakitaPlasma Display Panel and Method for Manufacturing Same
US20090100872A1 (en)*2007-10-172009-04-23Daniel Warren HawtofMethod for laminating glass, glass-ceramic, or ceramic layers
US20090205371A1 (en)*2008-02-202009-08-20Dongmin ChenLaser Processing of Glass Frit For Sealing Applications
US20100206006A1 (en)*2007-07-162010-08-19Grzybowski Richard RMicroalignment using laser-softened glass bumps
US20100296291A1 (en)*2009-05-202010-11-25Samsung Mobile Display Co., Ltd.Light radiating device and method of fabricating organic light emitting diode display device using the same
US20110037744A1 (en)*2009-08-142011-02-17Samsung Mobile Display Co., Ltd.Organic light emitting diode display device and method of driving the same
US20110057174A1 (en)*2009-09-092011-03-10Samsung Mobile Display Co., Ltd.Sealing material and display device using the same
US20110308279A1 (en)*2009-05-012011-12-22Guardian Industries Corp.Vacuum insulating glass unit including infrared meltable glass frit, and/or method of making the same
US20120007137A1 (en)*2010-07-122012-01-12Samsung Mobile Display Co., Ltd.Organic light-emitting apparatus and method of manufacturing the same
US20120138961A1 (en)*2010-12-072012-06-07Faraday Technology Corp.Semiconductor package structure and manufacturing method thereof
US20120211146A1 (en)*2011-02-222012-08-23Guardian Industries Corp.Materials and/or method of making vacuum insulating glass units including the same
WO2013160119A1 (en)*2012-04-262013-10-31Osram Opto Semiconductors GmbhOptoelectronic component and method for producing an optoelectronic component
US20140151742A1 (en)*2012-11-302014-06-05Corning IncorporatedGlass sealing with transparent materials having transient absorption properties
WO2014049052A3 (en)*2012-09-282014-10-02Osram Opto Semiconductors GmbhOptoelectronic component and method for producing an optoelectronic component
WO2014201315A1 (en)*2013-06-142014-12-18Corning IncorporatedLaminated sealing sheet
KR20150045763A (en)*2013-10-212015-04-29삼성디스플레이 주식회사Display device
WO2015164241A1 (en)*2014-04-212015-10-29Corning IncorporatedLaser welding of high thermal expansion glasses and glass-ceramics
CN105576152A (en)*2014-11-112016-05-11上海和辉光电有限公司Laser sintering method and method for encapsulating display device using method
US9515286B2 (en)2013-05-102016-12-06Corning IncorporatedLaser welding transparent glass sheets using low melting glass or thin absorbing films
US20170158498A1 (en)*2015-12-082017-06-08Robert Bosch GmbhTargeted control of the absorption behavior during laser resealing
US10457595B2 (en)2014-10-312019-10-29Corning IncorporatedLaser welded glass packages
GB2583090A (en)*2019-04-122020-10-21Spi Lasers Uk LtdMethod for joining a first substrate to a second substrate
US20220206157A1 (en)*2019-04-262022-06-30Agc Glass EuropeProtective housing for a sensing device
TWI790177B (en)*2015-09-042023-01-11美商康寧公司Devices comprising transparent seals and methods for making the same
US11800760B2 (en)2017-11-152023-10-24Samsung Display Co., Ltd.Display device having reduced occupied cell seal and realized narrow bezel structure

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7800303B2 (en)*2006-11-072010-09-21Corning IncorporatedSeal for light emitting display device, method, and apparatus
US8115326B2 (en)*2006-11-302012-02-14Corning IncorporatedFlexible substrates having a thin-film barrier
US7815480B2 (en)*2007-11-302010-10-19Corning IncorporatedMethods and apparatus for packaging electronic components
JP5308718B2 (en)2008-05-262013-10-09浜松ホトニクス株式会社 Glass welding method
JP5535652B2 (en)2008-06-112014-07-02浜松ホトニクス株式会社 Glass welding method
DE112009001456T5 (en)2008-06-232011-05-19Hamamatsu Photonics K.K., Hamamatsu-shi Glass fusing method
US8257603B2 (en)*2008-08-292012-09-04Corning IncorporatedLaser patterning of glass bodies
JP5481167B2 (en)2009-11-122014-04-23浜松ホトニクス株式会社 Glass welding method
JP5567319B2 (en)2009-11-252014-08-06浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5466929B2 (en)2009-11-252014-04-09浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5535590B2 (en)2009-11-252014-07-02浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5535589B2 (en)2009-11-252014-07-02浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5481172B2 (en)2009-11-252014-04-23浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5481173B2 (en)2009-11-252014-04-23浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5535588B2 (en)*2009-11-252014-07-02浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
JP5525246B2 (en)2009-11-252014-06-18浜松ホトニクス株式会社 Glass welding method and glass layer fixing method
CN101894687A (en)*2010-06-242010-11-24彩虹集团公司Dye-sensitized solar cell encapsulation method
KR101041603B1 (en)*2010-12-312011-06-15(주)알가 Vacuum glass panel and its manufacturing method
KR20120077470A (en)*2010-12-302012-07-10삼성모바일디스플레이주식회사Organic light emitting diode display and fabricating method of the same
US8358066B1 (en)*2011-08-102013-01-22General Electric CompanyOrganic light emitting diode package with energy blocking layer
US9346710B2 (en)2012-05-292016-05-24Corning IncorporatedSheet glass product fabrication with growth-limited glass bump spacers
TWI558039B (en)*2012-06-062016-11-11法國聖戈本玻璃公司Pane with an electrical connection element,method for producing the same,and use of the same
JP2014105117A (en)*2012-11-262014-06-09Nippon Electric Glass Co LtdComposite sealing material, composite sealing material wound body, and method for sealing two glass substrates
US8829507B2 (en)*2012-12-062014-09-09General Electric CompanySealed organic opto-electronic devices and related methods of manufacturing
CN103910491B (en)*2013-01-072016-10-19中国建筑材料科学研究总院 Lead-containing sealing glass powder with spectrally selective absorption characteristics and its manufacturing method
CN103078064B (en)*2013-01-302015-09-09四川虹视显示技术有限公司OLED panel packaging structure and packaging method
CN103466921A (en)*2013-08-282013-12-25深圳市华星光电技术有限公司Package method of glass substrates
KR102194824B1 (en)2014-03-172020-12-24삼성디스플레이 주식회사Display device
KR102250042B1 (en)2014-03-172021-05-11삼성디스플레이 주식회사Display device
KR101549406B1 (en)*2014-04-042015-09-03코닝정밀소재 주식회사Substrate for color conversion of led and method of fabricating threof
US10513455B2 (en)2014-10-302019-12-24Corning IncorporatedMethod and apparatus for sealing the edge of a glass article
US9484469B2 (en)2014-12-162016-11-01International Business Machines CorporationThin film device with protective layer
KR200481964Y1 (en)2015-07-272016-12-01석대환Core bit For Core Drill
CN106252289B (en)*2016-09-292019-02-01山东盛品电子技术有限公司A kind of plastic package envelope product and preparation method improving air-tightness
EP3541763A1 (en)2016-11-182019-09-25Corning Optical Communications LLCLaser bonded transparent glass-based articles and methods of making the same
US10781129B2 (en)2017-01-192020-09-22Corning IncorporatedFusing glass articles
US10340481B2 (en)*2017-08-172019-07-02Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Manufacturing method of OLED display panel
CN107651853A (en)*2017-10-112018-02-02福州大学A kind of seal glass mixed outside di-iron trioxide nickel oxide and preparation method thereof
KR102566338B1 (en)*2018-04-132023-08-11삼성디스플레이 주식회사Display device and method for manufacturing display device
CN108828848B (en)*2018-07-132022-03-01张家港康得新光电材料有限公司Frame sealing glue curing method and frame sealing glue curing device
CN109390498A (en)*2018-11-292019-02-26云谷(固安)科技有限公司Display panel and preparation method thereof
US11422310B2 (en)2019-05-242022-08-23Corning IncorporatedMethods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same
EP4066031B1 (en)2019-11-262025-02-19Corning Research & Development CorporationMethods for laser bonding optical elements to substrates and optical assemblies fabricated by the same
KR102772788B1 (en)2020-02-262025-02-26삼성디스플레이 주식회사Display device
US11712753B2 (en)*2020-04-092023-08-01Jenoptik Optical Systems GmbhMethod for making a thermally stable connection between a glass element and a support element, method for producing an optical device, and optical device

Citations (18)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3885974A (en)*1972-10-091975-05-27Hoya Glass Works LimitedSealing glass for laser glass
US4279785A (en)*1978-11-281981-07-21Itt Industries, Inc.Glass encapsulation of semiconductor devices
US4297004A (en)*1978-09-201981-10-27Technical Research of Citizen Watch Co., Ltd.Liquid crystal display cell
US5304518A (en)*1988-11-151994-04-19Asahi Glass Company Ltd.Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate
US5747396A (en)*1996-02-291998-05-05Tdk CorporationGlass and ceramic substrate using the same
US6103648A (en)*1998-05-282000-08-15Circon CorporationBulk conducting glass compositions and fibers
US20020035852A1 (en)*2000-09-272002-03-28Wang Yei-Ping (Mimi) H.Vacuum IG window unit with edge seal at least partially diffused at temper and completed via microwave curing, and corresponding method of making the same
US6383664B2 (en)*1999-05-112002-05-07The Dow Chemical CompanyElectroluminescent or photocell device having protective packaging
US6383961B1 (en)*1999-05-182002-05-07Lg Electronics Inc.Composition of dielectric for plasma display panel
US20030107315A1 (en)*2001-12-102003-06-12Lai-Cheng ChenPackaging structure for a display device
US20030114291A1 (en)*2000-03-062003-06-19Akihiro KoyamaFlat glass having high transmittance
US20030193289A1 (en)*2002-04-102003-10-16Tdk CorporationThin-film EL device and composite substrate
US20030203205A1 (en)*1997-07-212003-10-30Xiangxin BiNanoparticle production and corresponding structures
US20040104673A1 (en)*2001-11-292004-06-03Takehiro HosokawaElectroluminescence display
US20040159849A1 (en)*2003-02-142004-08-19Cree, Inc.Light emitting device incorporating a luminescent material
US20040206953A1 (en)*2003-04-162004-10-21Robert MorenaHermetically sealed glass package and method of fabrication
US6914371B2 (en)*2000-03-072005-07-05Saint-Gobain Glass FranceGlass spacer
US7148624B2 (en)*2002-05-072006-12-12Osram Opto Semiconductors (Malaysia) Sdn. BhdUniform deposition of organic layer

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3217088A (en)*1962-11-301965-11-09Owens Illinois Glass CoJoining glass members and encapsulation of small electrical components
NL6905675A (en)1969-04-121970-10-14
NL7908501A (en)*1979-11-221981-06-16Philips Nv BODIES COMPOSED OF AT LEAST TWO PARTS, CONNECTING GLASS AND METHOD FOR ATTACHING PARTS TOGETHER.
GB8623214D0 (en)*1986-09-261986-10-29Pilkington Brothers PlcGlass compositions
JPS6437532A (en)*1987-07-311989-02-08Toyota Motor CorpProduction of liquid crystal cell
US4859637A (en)*1987-12-171989-08-22Ferro CorporationLead-free U.V. absorbing glass
JPH01225140A (en)1988-03-031989-09-08Nec CorpManufacture of semiconductor device
JPH02112196A (en)1988-10-191990-04-24Nippon Sheet Glass Co LtdElectroluminescence panel
JPH02120259A (en)*1988-10-281990-05-08Toshiba Corp Glass sealed bonded body and manufacturing method thereof
JPH02149446A (en)*1988-11-291990-06-08Matsushita Electric Ind Co Ltd Sealing composition and crystal resonator
US5489321A (en)*1994-07-141996-02-06Midwest Research InstituteWelding/sealing glass-enclosed space in a vacuum
DE69708058T2 (en)*1996-02-212002-05-16Corning Inc., Corning GLASS WITH STRONG UV ABSORPTION
JPH1074583A (en)*1996-08-301998-03-17Sanyo Electric Co Ltd Organic EL display and method of manufacturing organic EL display
JP3900617B2 (en)*1997-09-172007-04-04カシオ計算機株式会社 LIGHT EMITTING ELEMENT AND PROTECTIVE MATERIAL FOR LIGHT EMITTING ELEMENT
US5998037A (en)*1997-12-221999-12-07Ferro CorporationPorcelain enamel composition for electronic applications
US6124224A (en)*1998-09-022000-09-26Ferro CorporationHigh temperature sealing glass
JP2000113976A (en)*1998-10-072000-04-21Tdk Corp Organic EL device
JP3421284B2 (en)*1998-10-232003-06-30株式会社オハラ Negatively heat-expandable glass ceramics and method for producing the same
JP2001118674A (en)*1999-10-192001-04-27Auto Network Gijutsu Kenkyusho:Kk Organic EL display
JP2001319775A (en)*2000-05-102001-11-16Auto Network Gijutsu Kenkyusho:Kk Sealing method and sealing structure for organic EL display device
US7255823B1 (en)2000-09-062007-08-14Institute Of Materials Research And EngineeringEncapsulation for oled devices
JP2003170290A (en)*2001-12-102003-06-17Japan Science & Technology Corp Laser light transmission welding method and apparatus
US20050116245A1 (en)*2003-04-162005-06-02Aitken Bruce G.Hermetically sealed glass package and method of fabrication
US6998776B2 (en)*2003-04-162006-02-14Corning IncorporatedGlass package that is hermetically sealed with a frit and method of fabrication
JP2005209413A (en)*2004-01-202005-08-04Sanyo Electric Co Ltd Display panel manufacturing method and display panel

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US3885974A (en)*1972-10-091975-05-27Hoya Glass Works LimitedSealing glass for laser glass
US4297004A (en)*1978-09-201981-10-27Technical Research of Citizen Watch Co., Ltd.Liquid crystal display cell
US4279785A (en)*1978-11-281981-07-21Itt Industries, Inc.Glass encapsulation of semiconductor devices
US5304518A (en)*1988-11-151994-04-19Asahi Glass Company Ltd.Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate
US5747396A (en)*1996-02-291998-05-05Tdk CorporationGlass and ceramic substrate using the same
US20030203205A1 (en)*1997-07-212003-10-30Xiangxin BiNanoparticle production and corresponding structures
US6103648A (en)*1998-05-282000-08-15Circon CorporationBulk conducting glass compositions and fibers
US6383664B2 (en)*1999-05-112002-05-07The Dow Chemical CompanyElectroluminescent or photocell device having protective packaging
US6383961B1 (en)*1999-05-182002-05-07Lg Electronics Inc.Composition of dielectric for plasma display panel
US20030114291A1 (en)*2000-03-062003-06-19Akihiro KoyamaFlat glass having high transmittance
US6914371B2 (en)*2000-03-072005-07-05Saint-Gobain Glass FranceGlass spacer
US20020035852A1 (en)*2000-09-272002-03-28Wang Yei-Ping (Mimi) H.Vacuum IG window unit with edge seal at least partially diffused at temper and completed via microwave curing, and corresponding method of making the same
US20040104673A1 (en)*2001-11-292004-06-03Takehiro HosokawaElectroluminescence display
US20030107315A1 (en)*2001-12-102003-06-12Lai-Cheng ChenPackaging structure for a display device
US20030193289A1 (en)*2002-04-102003-10-16Tdk CorporationThin-film EL device and composite substrate
US7148624B2 (en)*2002-05-072006-12-12Osram Opto Semiconductors (Malaysia) Sdn. BhdUniform deposition of organic layer
US20040159849A1 (en)*2003-02-142004-08-19Cree, Inc.Light emitting device incorporating a luminescent material
US20040206953A1 (en)*2003-04-162004-10-21Robert MorenaHermetically sealed glass package and method of fabrication

Cited By (60)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US8148179B2 (en)2003-04-162012-04-03Corning IncorporatedHermetically sealed glass package and method of fabrication
US20080211408A1 (en)*2004-08-172008-09-04Hiroyuki YamakitaPlasma Display Panel and Method for Manufacturing Same
WO2006044184A3 (en)*2004-10-132007-09-27Corning IncHermetically sealed glass package and method of fabrication
US20060187213A1 (en)*2005-02-212006-08-24Au Optronics Corp.Electroluminescence display with touch panel
US20080048556A1 (en)*2006-08-242008-02-28Stephan Lvovich LogunovMethod for hermetically sealing an OLED display
EP2102897A4 (en)*2007-01-122011-11-02Corning Inc GLASS SEALING PROCESS
WO2008085226A1 (en)*2007-01-122008-07-17Corning IncorporatedMethod of sealing glass
US20080168801A1 (en)*2007-01-122008-07-17Paul Stephen DanielsonMethod of sealing glass
US20100206006A1 (en)*2007-07-162010-08-19Grzybowski Richard RMicroalignment using laser-softened glass bumps
US8291729B2 (en)*2007-07-162012-10-23Corning IncorporatedMicroalignment using laser-softened glass bumps
US20090100872A1 (en)*2007-10-172009-04-23Daniel Warren HawtofMethod for laminating glass, glass-ceramic, or ceramic layers
US20090205371A1 (en)*2008-02-202009-08-20Dongmin ChenLaser Processing of Glass Frit For Sealing Applications
US8424343B2 (en)*2008-02-202013-04-23Miradia, Inc.Laser processing of glass frit for sealing applications
US20110308279A1 (en)*2009-05-012011-12-22Guardian Industries Corp.Vacuum insulating glass unit including infrared meltable glass frit, and/or method of making the same
US8763427B2 (en)*2009-05-012014-07-01Guardian Industries Corp.Vacuum insulating glass unit including infrared meltable glass frit, and/or method of making the same
US8590343B2 (en)2009-05-012013-11-26Guardian Industries Corp.Vacuum insulating glass unit including infrared meltable glass frit, and/or method of making the same
US8848749B2 (en)2009-05-202014-09-30Samsung Display Co., Ltd.Light radiating device and method of fabricating organic light emitting diode display device using the same
US20100296291A1 (en)*2009-05-202010-11-25Samsung Mobile Display Co., Ltd.Light radiating device and method of fabricating organic light emitting diode display device using the same
US20110037744A1 (en)*2009-08-142011-02-17Samsung Mobile Display Co., Ltd.Organic light emitting diode display device and method of driving the same
US8610437B2 (en)*2009-08-142013-12-17Samsung Display Co., Ltd.Organic light emitting diode display device and method of driving the same
US20110057174A1 (en)*2009-09-092011-03-10Samsung Mobile Display Co., Ltd.Sealing material and display device using the same
US20120007137A1 (en)*2010-07-122012-01-12Samsung Mobile Display Co., Ltd.Organic light-emitting apparatus and method of manufacturing the same
US9105870B2 (en)*2010-07-122015-08-11Samsung Display Co., Ltd.Organic light-emitting apparatus and method of manufacturing the same
US20120138961A1 (en)*2010-12-072012-06-07Faraday Technology Corp.Semiconductor package structure and manufacturing method thereof
US8404501B2 (en)*2010-12-072013-03-26Faraday Technology Corp.Semiconductor package structure and manufacturing method thereof
US8733128B2 (en)*2011-02-222014-05-27Guardian Industries Corp.Materials and/or method of making vacuum insulating glass units including the same
US20120211146A1 (en)*2011-02-222012-08-23Guardian Industries Corp.Materials and/or method of making vacuum insulating glass units including the same
WO2013160119A1 (en)*2012-04-262013-10-31Osram Opto Semiconductors GmbhOptoelectronic component and method for producing an optoelectronic component
DE102012206967B4 (en)2012-04-262025-04-10Pictiva Displays International Limited Optoelectronic component and method for producing an optoelectronic component
CN104379521A (en)*2012-04-262015-02-25欧司朗Oled股份有限公司Optoelectronic component and method for producing an optoelectronic component
US9478761B2 (en)2012-04-262016-10-25Osram Oled GmbhOptoelectronic component having a UV-protecting substrate and method for producing the same
WO2014049052A3 (en)*2012-09-282014-10-02Osram Opto Semiconductors GmbhOptoelectronic component and method for producing an optoelectronic component
US20140151742A1 (en)*2012-11-302014-06-05Corning IncorporatedGlass sealing with transparent materials having transient absorption properties
US10011525B2 (en)2012-11-302018-07-03Corning IncorporatedGlass sealing with transparent materials having transient absorption properties
US9666763B2 (en)*2012-11-302017-05-30Corning IncorporatedGlass sealing with transparent materials having transient absorption properties
US10069104B2 (en)2013-05-102018-09-04Corning IncorporatedLaser welding transparent glass sheets using low melting glass or thin absorbing films
US12268046B2 (en)2013-05-102025-04-01Corning IncorporatedSealed devices comprising transparent laser weld regions
US9515286B2 (en)2013-05-102016-12-06Corning IncorporatedLaser welding transparent glass sheets using low melting glass or thin absorbing films
US11711938B2 (en)2013-05-102023-07-25Corning IncorporatedSealed devices comprising transparent laser weld regions
US10283731B2 (en)2013-05-102019-05-07Corning IncorporatedLaser welding transparent glass sheets using low melting glass or thin absorbing films
US9741963B2 (en)2013-05-102017-08-22Corning IncorporatedSealed devices comprising transparent laser weld regions
US9761828B2 (en)2013-05-102017-09-12Corning IncorporatedLaser welding transparent glass sheets using low melting glass or thin absorbing films
US9902138B2 (en)2013-06-142018-02-27Corning IncorporatedLaminated sealing sheet
WO2014201315A1 (en)*2013-06-142014-12-18Corning IncorporatedLaminated sealing sheet
KR102145389B1 (en)2013-10-212020-08-19삼성디스플레이 주식회사Display device
KR20150045763A (en)*2013-10-212015-04-29삼성디스플레이 주식회사Display device
US9252195B2 (en)2013-10-212016-02-02Samsung Display Co., Ltd.Display device
WO2015164241A1 (en)*2014-04-212015-10-29Corning IncorporatedLaser welding of high thermal expansion glasses and glass-ceramics
US10297787B2 (en)*2014-04-212019-05-21Corning IncorporatedLaser welding of high thermal expansion glasses and glass-ceramics
US10457595B2 (en)2014-10-312019-10-29Corning IncorporatedLaser welded glass packages
US10858283B2 (en)2014-10-312020-12-08Corning IncorporatedLaser welded glass packages
CN105576152A (en)*2014-11-112016-05-11上海和辉光电有限公司Laser sintering method and method for encapsulating display device using method
TWI790177B (en)*2015-09-042023-01-11美商康寧公司Devices comprising transparent seals and methods for making the same
TWI789335B (en)*2015-09-042023-01-11美商康寧公司Devices comprising transparent seals and methods for making the same
US9914640B2 (en)*2015-12-082018-03-13Robert Bosch GmbhTargeted control of the absorption behavior during laser resealing
US20170158498A1 (en)*2015-12-082017-06-08Robert Bosch GmbhTargeted control of the absorption behavior during laser resealing
US11800760B2 (en)2017-11-152023-10-24Samsung Display Co., Ltd.Display device having reduced occupied cell seal and realized narrow bezel structure
US12096668B2 (en)2017-11-152024-09-17Samsung Display Co., Ltd.Display device and method of manufacturing display device
GB2583090A (en)*2019-04-122020-10-21Spi Lasers Uk LtdMethod for joining a first substrate to a second substrate
US20220206157A1 (en)*2019-04-262022-06-30Agc Glass EuropeProtective housing for a sensing device

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KR20120088842A (en)2012-08-08
EP1805787A2 (en)2007-07-11
TW200629349A (en)2006-08-16
KR101276390B1 (en)2013-06-20
TWI302713B (en)2008-11-01
JP4999695B2 (en)2012-08-15
US8148179B2 (en)2012-04-03
CN101103429B (en)2010-05-12
US20100186449A1 (en)2010-07-29
WO2006044184A2 (en)2006-04-27
JP2008516409A (en)2008-05-15
KR20070085336A (en)2007-08-27
KR101265812B1 (en)2013-05-20
WO2006044184A3 (en)2007-09-27
EP1805787A4 (en)2011-02-02
CN101103429A (en)2008-01-09

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