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US20050061013A1 - Method and apparatus for cooling devices that in use generate unwanted heat - Google Patents

Method and apparatus for cooling devices that in use generate unwanted heat
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Publication number
US20050061013A1
US20050061013A1US10/937,017US93701704AUS2005061013A1US 20050061013 A1US20050061013 A1US 20050061013A1US 93701704 AUS93701704 AUS 93701704AUS 2005061013 A1US2005061013 A1US 2005061013A1
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US
United States
Prior art keywords
ambient air
cooler
enclosed space
outlet
inlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/937,017
Inventor
Richard Bond
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University of Washington
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Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to US10/937,017priorityCriticalpatent/US20050061013A1/en
Publication of US20050061013A1publicationCriticalpatent/US20050061013A1/en
Assigned to WASHINGTON, UNIVERSITY OFreassignmentWASHINGTON, UNIVERSITY OFASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: BOND, RICHARD C.
Abandonedlegal-statusCriticalCurrent

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Abstract

A cooler comprising coils and passageways defined by and between the coils through which ambient air moves, from the inlet of the cooler to the outlet of the cooler, is positioned with its outlet in register with an ambient air inlet for an enclosed space. A device that in use generates heat is positioned within the enclosed space. The enclosed space includes an ambient air inlet and an outlet through which ambient air from the ambient air inlet to the outlet. The cooler is used to cool the ambient air that is immediately forwardly of the ambient air inlet for the enclosed space. An air mover in the enclosed space, or thermal flow, is used for moving the cooled ambient air into the ambient air inlet, through the enclosed space, and out from the outlet of the enclosed space.

Description

Claims (12)

1. For use with an enclosed space that contains at least one device that in use generates heat, and which includes an ambient air inlet and, an outlet in which ambient air moves through the space from the ambient air inlet to the outlet, an ambient air cooler comprising:
an inlet for ambient air, an inner space, an outlet from the inner space, and a device in the inner space that is adapted for removing heat from the ambient air as the ambient air passes through the inner space from the inlet to the outlet;
wherein said cooler is adapted to be positioned with its outlet in register with the ambient air inlet for the enclosed space, so that the ambient air that is moved through the enclosed space is ambient air that has been cooled by the cooler; and
wherein the cooler is adapted to remove heat from the ambient air in an amount sufficient such that while in the enclosed space the cooled ambient air will remove a desired amount of the heat that is generated by the device in the enclosed space.
5. For use with an enclosed space that includes a plurality of compartments, each said compartment containing at least one device that in use generates heat, and which includes an ambient air inlet for each compartment, an outlet for each compartment, and in which ambient air moves through the compartment from the inlet of the compartment to the outlet of the compartment, an ambient air cooler comprising:
inlet for ambient air, an inner space, an outlet from the inner space, and the device in the inner space which is adapted for removing heat from the ambient air as the ambient air passes through the inner space from the inlet to the outlet;
wherein said cooler is adapted to be positioned with its outlet in register with ambient air inlet for at least one compartment of the enclosed space, so that the ambient air that is moved through at least one compartment of the enclosed space is ambient air that has been cooled by the cooler; and
wherein the cooler is adapted to remove heat from the ambient air in an amount sufficient such that while in the at least one compartment of the enclosed space the cooled ambient air will remove a desired amount of the heat that is generated by the device in the compartment.
9. A method of removing heat from a device that in use generates heat, comprising:
positioning the device that in use generates heat inside of an enclosed space that includes an ambient air inlet, an outlet and through which ambient air moves from the ambient air inlet to the outlet;
providing an ambient air cooler that comprises an inlet for ambient air, an inner space, an outlet from the inner space, and a device in the inner space that is adapted for removing heat from the ambient air as the ambient air passes through the inner space from the inlet to the outlet;
positioning the cooler with its outlet in register with the ambient air inlet for the enclosed space, so that the ambient air that is moved through the enclosed space is ambient air that has been cooled by the cooler; and
removing the heat from the ambient air in an amount sufficient so that while it is in the enclosed space the cooled ambient air will remove a desired amount of heat that is generated by the device in the enclosed space.
US10/937,0172003-09-102004-09-09Method and apparatus for cooling devices that in use generate unwanted heatAbandonedUS20050061013A1 (en)

Priority Applications (1)

Application NumberPriority DateFiling DateTitle
US10/937,017US20050061013A1 (en)2003-09-102004-09-09Method and apparatus for cooling devices that in use generate unwanted heat

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
US50190603P2003-09-102003-09-10
US10/937,017US20050061013A1 (en)2003-09-102004-09-09Method and apparatus for cooling devices that in use generate unwanted heat

Publications (1)

Publication NumberPublication Date
US20050061013A1true US20050061013A1 (en)2005-03-24

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Application NumberTitlePriority DateFiling Date
US10/937,017AbandonedUS20050061013A1 (en)2003-09-102004-09-09Method and apparatus for cooling devices that in use generate unwanted heat

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US (1)US20050061013A1 (en)

Cited By (35)

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US20040112571A1 (en)*2002-11-012004-06-17Cooligy, Inc.Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
US20070044493A1 (en)*2005-08-232007-03-01International Business Machines CorporationSystems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene
EP1662851A3 (en)*2004-11-302007-05-23Liebert Hiross S.p.A.Conditioning apparatus particularly for racks for electrical, electronic, telecommunications instruments or the like
US20080158812A1 (en)*2006-12-272008-07-03Hakan ErturkMethod and system to cool memory
US20080180908A1 (en)*2007-01-232008-07-31Peter WexlerIn-row air containment and cooling system and method
US20080198549A1 (en)*2006-01-192008-08-21American Power Conversion CorporationCooling system and method
US20080273306A1 (en)*2007-05-042008-11-06International Business Machines CorporationSystem and method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US20090046423A1 (en)*2007-08-072009-02-19James HomInternal access mechanism for a server rack
US20090122483A1 (en)*2007-11-132009-05-14International Business Machines CorporationWater-assisted air cooling for a row of cabinets
US7836597B2 (en)2002-11-012010-11-23Cooligy Inc.Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US20110103009A1 (en)*2008-06-022011-05-05Audrey Julien-RouxComputer bay cooling device and computer equipment comprising same
US20110185758A1 (en)*2010-02-042011-08-04Hitachi Plant Technologies, Ltd.Cooling system for electronic apparatus
US20120075806A1 (en)*2009-12-282012-03-29Wormsbecher Paul AContainer-based data center having greater rack density
US8157001B2 (en)2006-03-302012-04-17Cooligy Inc.Integrated liquid to air conduction module
US20120155027A1 (en)*2010-12-162012-06-21Broome John PPortable computer server enclosure
US8254422B2 (en)2008-08-052012-08-28Cooligy Inc.Microheat exchanger for laser diode cooling
US8322155B2 (en)2006-08-152012-12-04American Power Conversion CorporationMethod and apparatus for cooling
US8327656B2 (en)2006-08-152012-12-11American Power Conversion CorporationMethod and apparatus for cooling
US8424336B2 (en)2006-12-182013-04-23Schneider Electric It CorporationModular ice storage for uninterruptible chilled water
US8464781B2 (en)2002-11-012013-06-18Cooligy Inc.Cooling systems incorporating heat exchangers and thermoelectric layers
US8672732B2 (en)2006-01-192014-03-18Schneider Electric It CorporationCooling system and method
US8688413B2 (en)2010-12-302014-04-01Christopher M. HealeySystem and method for sequential placement of cooling resources within data center layouts
US8701746B2 (en)2008-03-132014-04-22Schneider Electric It CorporationOptically detected liquid depth information in a climate control unit
US20150076975A1 (en)*2012-05-232015-03-19Huawei Technologies Co., Ltd.Container data center
WO2015043791A1 (en)*2013-09-242015-04-02Weiss Klimatechnik GmbhArrangement and method for cooling a space
US9504189B1 (en)2015-08-122016-11-22International Business Machines CorporationThermoelectric-enhanced, inlet air-cooled thermal conductors
US9568206B2 (en)2006-08-152017-02-14Schneider Electric It CorporationMethod and apparatus for cooling
US9629286B2 (en)2015-07-062017-04-18International Business Machines CorporationThermoelectric-enhanced, inlet air cooling for an electronics rack
US20170127559A1 (en)*2015-07-302017-05-04Dell Products L.P.Chassis external wall cooling system
US20170229846A1 (en)*2014-05-272017-08-10Friedrich Luetze GmbhAir conditioning arrangement
US9830410B2 (en)2011-12-222017-11-28Schneider Electric It CorporationSystem and method for prediction of temperature values in an electronics system
US9952103B2 (en)2011-12-222018-04-24Schneider Electric It CorporationAnalysis of effect of transient events on temperature in a data center
US9996659B2 (en)2009-05-082018-06-12Schneider Electric It CorporationSystem and method for arranging equipment in a data center
US10986753B2 (en)2007-11-132021-04-20International Business Machines CorporationWater-assisted air cooling for a row of cabinet
US11076507B2 (en)2007-05-152021-07-27Schneider Electric It CorporationMethods and systems for managing facility power and cooling

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US5528454A (en)*1994-12-291996-06-18Compuserve IncorporatedCooling device for electronic components arranged in a vertical series and vertical series of electronic devices containing same
US5982618A (en)*1995-10-021999-11-09Telefonaktiebolaget Lm EricssonArrangement in cooling electronic equipment
US5731954A (en)*1996-08-221998-03-24Cheon; KioanCooling system for computer
US6167714B1 (en)*1998-11-122001-01-02Do Enterprises, LlcPortable cooling and heating unit using reversible refrigerant circuit
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Cited By (57)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US7836597B2 (en)2002-11-012010-11-23Cooligy Inc.Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US8464781B2 (en)2002-11-012013-06-18Cooligy Inc.Cooling systems incorporating heat exchangers and thermoelectric layers
US20040112571A1 (en)*2002-11-012004-06-17Cooligy, Inc.Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
EP1662851A3 (en)*2004-11-302007-05-23Liebert Hiross S.p.A.Conditioning apparatus particularly for racks for electrical, electronic, telecommunications instruments or the like
US20070044493A1 (en)*2005-08-232007-03-01International Business Machines CorporationSystems and methods for cooling electronics components employing vapor compression refrigeration with selected portions of expansion structures coated with polytetrafluorethylene
US9451731B2 (en)2006-01-192016-09-20Schneider Electric It CorporationCooling system and method
US20080198549A1 (en)*2006-01-192008-08-21American Power Conversion CorporationCooling system and method
US20090259343A1 (en)*2006-01-192009-10-15American Power Conversion CorporationCooling system and method
US8672732B2 (en)2006-01-192014-03-18Schneider Electric It CorporationCooling system and method
US8157001B2 (en)2006-03-302012-04-17Cooligy Inc.Integrated liquid to air conduction module
US9568206B2 (en)2006-08-152017-02-14Schneider Electric It CorporationMethod and apparatus for cooling
US8322155B2 (en)2006-08-152012-12-04American Power Conversion CorporationMethod and apparatus for cooling
US8327656B2 (en)2006-08-152012-12-11American Power Conversion CorporationMethod and apparatus for cooling
US9115916B2 (en)2006-08-152015-08-25Schneider Electric It CorporationMethod of operating a cooling system having one or more cooling units
US8424336B2 (en)2006-12-182013-04-23Schneider Electric It CorporationModular ice storage for uninterruptible chilled water
US9080802B2 (en)2006-12-182015-07-14Schneider Electric It CorporationModular ice storage for uninterruptible chilled water
US20080158812A1 (en)*2006-12-272008-07-03Hakan ErturkMethod and system to cool memory
US7457116B2 (en)*2006-12-272008-11-25Intel CorporationMethod and system to cool memory
US8425287B2 (en)*2007-01-232013-04-23Schneider Electric It CorporationIn-row air containment and cooling system and method
US20080180908A1 (en)*2007-01-232008-07-31Peter WexlerIn-row air containment and cooling system and method
US20090122487A1 (en)*2007-05-042009-05-14International Business Machines CorporationSystem of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US7660121B2 (en)*2007-05-042010-02-09International Business Machines CorporationSystem of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US20080273306A1 (en)*2007-05-042008-11-06International Business Machines CorporationSystem and method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US7477514B2 (en)*2007-05-042009-01-13International Business Machines CorporationMethod of facilitating cooling of electronics racks of a data center employing multiple cooling stations
US11503744B2 (en)2007-05-152022-11-15Schneider Electric It CorporationMethods and systems for managing facility power and cooling
US11076507B2 (en)2007-05-152021-07-27Schneider Electric It CorporationMethods and systems for managing facility power and cooling
US7746634B2 (en)*2007-08-072010-06-29Cooligy Inc.Internal access mechanism for a server rack
US7660117B2 (en)2007-08-072010-02-09Cooligy Inc.Deformable duct guides that accommodate electronic connection lines
US20090046429A1 (en)*2007-08-072009-02-19Werner Douglas EDeformable duct guides that accommodate electronic connection lines
US20090046423A1 (en)*2007-08-072009-02-19James HomInternal access mechanism for a server rack
US20090122483A1 (en)*2007-11-132009-05-14International Business Machines CorporationWater-assisted air cooling for a row of cabinets
US10986753B2 (en)2007-11-132021-04-20International Business Machines CorporationWater-assisted air cooling for a row of cabinet
US8701746B2 (en)2008-03-132014-04-22Schneider Electric It CorporationOptically detected liquid depth information in a climate control unit
US8587941B2 (en)*2008-06-022013-11-19Bull SasComputer bay cooling device and computer equipment comprising same
US20110103009A1 (en)*2008-06-022011-05-05Audrey Julien-RouxComputer bay cooling device and computer equipment comprising same
US9066452B2 (en)2008-06-022015-06-23Bull SasComputer bay cooling device and computer equipment comprising same
US8299604B2 (en)2008-08-052012-10-30Cooligy Inc.Bonded metal and ceramic plates for thermal management of optical and electronic devices
US8254422B2 (en)2008-08-052012-08-28Cooligy Inc.Microheat exchanger for laser diode cooling
US10614194B2 (en)2009-05-082020-04-07Schneider Electric It CorporationSystem and method for arranging equipment in a data center
US9996659B2 (en)2009-05-082018-06-12Schneider Electric It CorporationSystem and method for arranging equipment in a data center
US8953316B2 (en)*2009-12-282015-02-10Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Container-based data center having greater rack density
US20120075806A1 (en)*2009-12-282012-03-29Wormsbecher Paul AContainer-based data center having greater rack density
US20110185758A1 (en)*2010-02-042011-08-04Hitachi Plant Technologies, Ltd.Cooling system for electronic apparatus
US8947879B2 (en)*2010-12-162015-02-03Smartcube, LlcPortable computer server enclosure
US20120155027A1 (en)*2010-12-162012-06-21Broome John PPortable computer server enclosure
US8688413B2 (en)2010-12-302014-04-01Christopher M. HealeySystem and method for sequential placement of cooling resources within data center layouts
US9952103B2 (en)2011-12-222018-04-24Schneider Electric It CorporationAnalysis of effect of transient events on temperature in a data center
US9830410B2 (en)2011-12-222017-11-28Schneider Electric It CorporationSystem and method for prediction of temperature values in an electronics system
US20150076975A1 (en)*2012-05-232015-03-19Huawei Technologies Co., Ltd.Container data center
WO2015043791A1 (en)*2013-09-242015-04-02Weiss Klimatechnik GmbhArrangement and method for cooling a space
US20170229846A1 (en)*2014-05-272017-08-10Friedrich Luetze GmbhAir conditioning arrangement
US10236666B2 (en)*2014-05-272019-03-19Friedrich Luetze GmbhAir conditioning arrangement
US9686891B2 (en)2015-07-062017-06-20International Business Machines CorporationThermoelectric-enhanced, inlet air cooling for an electronics rack
US9629286B2 (en)2015-07-062017-04-18International Business Machines CorporationThermoelectric-enhanced, inlet air cooling for an electronics rack
US10433465B2 (en)*2015-07-302019-10-01Dell Products L.P.Chassis external wall cooling system
US20170127559A1 (en)*2015-07-302017-05-04Dell Products L.P.Chassis external wall cooling system
US9504189B1 (en)2015-08-122016-11-22International Business Machines CorporationThermoelectric-enhanced, inlet air-cooled thermal conductors

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Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:WASHINGTON, UNIVERSITY OF, WASHINGTON

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BOND, RICHARD C.;REEL/FRAME:017548/0283

Effective date:20041209

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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