US20050060882A1 - Method to prevent damage to probe card - Google Patents

Abstract

Method of forming probe cards is configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Description

CROSS-REFERENCE TO RELATED APPLICATION
• This application is a divisional of application Ser. No. 09/888,689 filed Jun. 25, 2001, pending.
BACKGROUND OF THE INVENTION
• 1. Field of the Invention
• The present invention relates generally to probe cards for testing the electric characteristics of semiconductor dice. More specifically, the present invention relates to probe cards configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards.
• 2. Background of the Invention
• In the manufacture of semiconductor devices, a large number of semiconductor devices, also known as dice or integrated circuit chips (ICs or chips), are formed on a semiconductor wafer by using, for example, precision photolithographic technologies. These fabricated semiconductor devices are subjected to a series of test procedures in order to assess the electrical characteristics of the integrated circuits contained on the semiconductor devices. Semiconductor devices which have been found to be satisfactory by testing procedures are selectively transferred for subsequent processing such as die attach, wire bonding, and encapsulation. New integrated circuit designs and higher unit volumes are additional considerations that drive testing of ICs. Also, as IC devices become more complex, the need for high-speed and accurate testing becomes increasingly important.
• IC device testing procedures conventionally include “wafer-level probe testing” in which individual ICs or groups of ICs, while still on the wafer, are initially tested to determine functionality and/or speed. Wafer probing establishes a temporary electrical contact between the IC and the automatic test equipment and is a critical step for verifying design and performance of the IC and for sorting ICs before singulation and costly packaging. Other tests, such as speed testing and “burn-in” testing, are typically performed after the dice have been singulated from the wafer. IC testing further typically involves testing for various performance parameters while changing environmental conditions such as temperature, voltage and current.
• Typically, testing at the wafer level involves the use of probe cards and other test heads to electrically test ICs by making electrical connection interfaces with groups of ICs or a single IC at a time. If the wafer has a yield of ICs which indicates that the quality and quantity of functional ICs is likely to be good, the individual ICs are singulated or “diced” from the wafer with a wafer saw. Each individual die may be assembled in a package to form an IC device, or may be bumped with solder (usually prior to separation from the wafer) for direct flip-chip bonding to a semiconductor substrate. Other various packaging means may also be used, as is known to those of skill in the art.
• The test signals can include specific combinations of voltages and/or currents transmitted through the probe card to the ICs on the wafer. During the test procedure, response signals such as voltage, current and frequency are analyzed and compared to required values by a test controller. Thus, by applying the appropriate voltages and/or currents and monitoring the device response, a computer program running the testing apparatus determines the functionality of the die. The integrated circuits that do not meet specification can be marked or mapped in software. Following testing, defective circuits in the ICs may be repaired by actuating fuses (or anti-fuses) to inactivate the defective circuitry and substitute redundant circuitry.
• Conventional probe cards can be generally classified into two categories: needle-type probe cards and membrane-type probe cards. Needle-type probe cards are the most common type of probe card and include elongated probe needles mounted on an annular ring. A typical probe needle is a pointed needle-like element of small size, with a tip that tapers down into a sharp point. When mounted on the annular ring, the probe needles typically have their free ends pointing downward and are carefully aligned with the ends of all the other probe needles to be in a single plane. An exemplary probe needle configuration is disclosed in U.S. Pat. No. 5,532,613 to Nagasawa et al., which includes a probe needle having a pointed or conical tip. Probe needles are typically made of tungsten, but materials such as beryllium copper, palladium, and rhenium tungsten are also used.
• The probe needles are typically secured to the annular ring by epoxy or are bonded, as by welding, to a blade and are adapted to make temporary electrical connections between contact locations on the dice (e.g., bond pads, fuse pads, test pads) and external test circuitry. The annular ring, in turn, is attached to a printed circuit board (PCB) substrate. The PCB substrate typically includes electrical traces in electrical communication with the probe needles. An exemplary probe card having probe needles is described in U.S. Pat. No. 4,757,256 to Whann et al.
• Membrane-type probe cards are typically formed as having tungsten contact bumps disposed on a thin, flexible dielectric material, such as polyimide, as the membrane. Membrane-type probe cards commonly employ a multilayer, flexible PCB interconnection structure configured with fine pitch traces leading to low inductance bump array structures aligned with the location of the pads of the device under test (e.g., a semiconductor die being tested). In a conventional membrane probing system, contact bumps of the bump array structures are pressed down via an elastic body interposed between the contact bumps and the membrane, such that any height variation among the contact bumps can be absorbed by the flexible thickness of the elastic body. Exemplary membrane-type probe cards are disclosed in U.S. Pat. No. 4,906,920 to Huff et al. and in U.S. Pat. No. 6,181,145 to Tomita et al.
• Needle-type probe cards and membrane-type probe cards may be further configured to meet the needs of the particular devices under test. In this regard, the probe cards may be specially configured as vertical contact probe cards (used, for example, to test LOGIC devices of a C4 type), cantilever-type probe cards (generally used to test inner-leads of LCD drivers with super fine-pitch (e.g., 40 micron-pitch) bumps), probe cards for wafer level burn-in, probe cards configured to test high-speed microprocessor units (MPUs) with high pin counts, as well as various other types of probe cards known in the art.
• In all types of probe cards, the testing voltage current is carried from an external test circuit to the pad connecting sections (probe elements) of the probe cards through conductive traces or wiring in electrical communication therewith.
• One concern in the art is over the application of excessive voltage to the IC chip under test. In this regard, U.S. Pat. No. 6,127,837 to Yamamoto et al. (“Yamamoto”) describes a series of resistance, transistor and capacitance structures formed on a probe wafer between a test bump and a shared power/signal line. According to Yamamoto, the resistance, transistor and capacitance structures prevent overshoot or undershoot of signals supplied to the bump and also prevent the application of excessive voltage or current to the chip. Yamamoto, however, does not disclose methods or apparatus for protection of the probe wafer and further does not describe a probe card configured to carry the current-regulating structures.
• The delivery of excessive voltage during probe testing to an IC may also result in damage to the probe card. In Japanese Patent Application 61174771, a small fuse is provided on the back side surface of a probe card in order to prevent the end of a probe needle connected to a grounding pad from seizing due to an overcurrent delivered to a short-circuited IC. Japanese Patent Application 0115367 discloses a thermal fuse fixed between a probe needle and power source which generates heat and becomes fused before a probe pin generates heat and is fused. Each of these patent applications, however, is drawn to means for preventing seizing and fusing of a probe needle routed to ground and power and does not address the limitation of current through the probe card in general or through any probe needle which might otherwise cause that probe needle to become nonfunctional.
• Japanese Patent Application 04265541 discloses an array of easily exchanged fuses interposed between corresponding probes on a probe card and a power supply. The apparatus disclosed therein, however, is relatively bulky in that the fuses are vertically disposed over the probe card and the apparatus includes a fuse body for holding the fuses.
• Accordingly, what is needed in the art is a probe card configuration designed to limit current to a plurality of varying probe elements, not just ground and power. It would also be advantageous to provide a probe card with one or more fuses that are self-resetting, or readily replaceable and/or repairable. Fuses which can be fabricated simultaneously with other components on the probe card using processes which are well known in the semiconductor arts are also desirable. A probe card thus manufactured would extend the life of the probe card, therefore, saving time, materials, and costs for those involved in semiconductor dice testing operations.
BRIEF SUMMARY OF THE INVENTION
• In accordance with one aspect of the invention, a method of forming a probe card is provided. The method comprises providing a substrate having a first surface and a second surface; disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface; providing a plurality of probe elements in electrical communication with the plurality of conductive traces; and providing a plurality of fuse elements in respective electrical communication with at least some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent at least one of the first surface and the second surface. Additionally, the fuse elements may be passive or active fuse elements, and the fuse elements may further be configured to be self-resetting, repairable and/or replaceable. In a preferred embodiment, substantially all of the conductive traces are provided with a respective fuse element.
• A method of fabricating a probe card is also provided. The method comprises providing a probe card substrate; providing a plurality of conductive traces over a surface of the probe card substrate; providing a plurality of probe elements in electrical communication with the plurality of conductive traces wherein at least one of the probe elements is configured for supplying a test signal to at least one semiconductor die and wherein a second probe element is configured for receiving a test signal from the at least one semiconductor die; and providing at least one repairable or replaceable component in electrical communication with at least some of the plurality of conductive traces.
• In a still further embodiment, a method of using a probe card for testing at least one semiconductor die is disclosed. The method comprises providing a probe card having a plurality of probe elements connected thereto, the probe elements configured for supplying test signals to the at least one semiconductor die; providing a fuse in electrical communication with at least some of the probe elements; and testing the at least one semiconductor die by supplying test signals.
• In accordance with another aspect of the invention, a probe card is provided. The probe card includes a substrate having a first surface and a second surface; a plurality of conductive traces disposed adjacent at least one of the first surface and the second surface; a plurality of probe elements in respective electrical communication with the conductive traces; and a plurality of fuses in respective electrical communication with the conductive traces.
• In yet another embodiment of the invention, a semiconductor die testing system is disclosed. The semiconductor die testing system comprises a probe card including a substrate having a first surface and a second surface; a plurality of conductive traces disposed adjacent at least one of the first surface and the second surface; a plurality of probe elements in electrical communication with the conductive traces; a plurality of fuses in electrical communication with the conductive traces; and semiconductor device testing apparatus linkable with the probe card, the semiconductor device testing apparatus configured for sending test signals through the probe card.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
• The foregoing and other advantages of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
• FIG. 1 is a schematic view of a probe card according to an embodiment of the present invention;
• FIGS. 2 and 3 are perspective views of fuse embodiments of the present invention;
• FIGS. 4A and 4B are schematic views of fuse embodiments according to the present invention;
• FIGS. 5A and 5B are simplified perspective views of active fuse embodiments of the present invention;
• FIGS. 6A-6D are simplified diagrams of other active fuse embodiments of the present invention;
• FIG. 7 is a simplified diagram of a test system in accordance with the present invention;
• FIG. 8 illustrates a still further embodiment of the present invention; and
• FIG. 9 shows a probe card embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION
• As noted throughout the disclosure, the present invention provides various advantages, including the ability to perform a multitude of tests, such as functional, parametric, burn-in, high frequency, and other tests, without risk of damage to the probe card. Performing IC testing according to the present invention provides significant cost savings in protecting and allowing reuse of probe cards which might otherwise be damaged by high test temperatures, electrical overloads, and various other sources of electrical failure or operator error during the testing process.
• As used herein, use of the term “IC testing” encompasses both “static” testing (where the IC is simply powered up) and “dynamic” testing (where the IC is powered up and is sent signals exercising some degree of functionality over the IC).
• Referring to drawingFIG. 1, anexemplary probe card30 configured in accordance with an embodiment of the present invention is shown in a schematic view. As described in more detail herein,probe card30 acts as an interface to an IC testing computer which produces appropriate test signals and senses the response of the ICs under test. Theprobe card30 includes asubstrate32, typically a PCB substrate, preferably formed of a rigid or semi-rigid material adapted to withstand the stresses associated with IC testing. Materials preferred for use in fabricatingsubstrate32 include FR-4 and other glass-filled and ceramic resins, silicon (including monocrystalline silicon, silicon-on-glass, silicon-on-sapphire), germanium, gallium arsenide, or other materials that are well-known in the art. In one aspect of the embodiment,substrate32 may be formed so as to have a coefficient of thermal expansion matching, or closely matching, the ICs to be tested.
• Substrate32 is configured with a plurality ofconductive traces34 formed on or adjacent to one or more surfaces thereof. As can be seen inFIG. 1, the conductive traces34 extend inwardly from a plurality oftest contacts36 towards a plurality ofprobe elements38. Whensubstrate32 is made of a semiconductor material, an electrically insulating layer, such as silicon dioxide, can be formed onsubstrate32 to provide an insulative surface forconductive traces34 andtest contacts36. The silicon dioxide layer can be formed by methods well-known in the art of silicon-based manufacturing including, for example, chemical vapor deposition (CVD) or exposing a silicon-based substrate to an oxidizing atmosphere for a short time.
• In accordance with recognized practices in the semiconductor art,conductive traces34 may also be formed as a metallization layer under one or more surface layers ofsubstrate32. Thus, in a second aspect of the embodiment,probe card30 may be constructed in multilayered fashion, withconductive traces34 located in intermediate layers ofsubstrate32. In the currently preferred configuration, the conductive traces34 are formed on atop surface35 and/orbottom surface37 of aprobe card30. Typically,probe card30 will include oneconductive trace34 in electrical communication with eachprobe element38, although more than oneconductive trace34 perprobe element38 is contemplated within the scope of the present invention. In other configurations (not shown), a singleconductive trace34 may provide electrical signals for more than oneprobe element38 during testing.
• By use of the term “in electrical communication with” it is meant that the subject electrical components are configured and positioned so as to complete an electrical circuit between one another when the components are supplied with power. Thus, components in electrical communication with one another will carry an electrical current originating from the same source when theprobe card30 is operational.
• As shown inFIG. 1,test contacts36 are preferably disposed on a periphery ofsubstrate32 for electrical interconnection with external testing equipment (not shown). The illustrated arrangement oftest contacts36, however, is not intended to be limiting of the present invention, andtest contacts36 may alternatively be disposed on one or both sides ofsubstrate32 and/or in a range of various locations, including locations in the area of a centermost portion ofsubstrate32. Conductive traces34, which are in electrical communication withtest contacts36, thus provide electrical paths for test circuitry to probeelements38. Conductive traces34 are preferably formed of a highly conductive, low resistivity metal, such as aluminum, copper, titanium, tantalum, molybdenum, or alloys of any thereof. Conductive traces34 may be fabricated according to conventional methods well known in the art, including, but not limited to, plating, thin film deposition processes (e.g., CVD, sputtering, photolithography processes and etching), and thick film processes (e.g., stenciling or screen printing).
• Various other types of conductive traces known in the art are also contemplated for use in the present invention. As a nonlimiting example, conductive traces34 may include nonmetallic conductive traces which may be formed of materials such as doped polysilicon. In this aspect of the embodiment, an LPCVD process may be used to form aconductive trace34 of phosphorous-doped polysilicon.
• Still referring toFIG. 1,probe elements38 are illustrated as a plurality of probe needles. The illustration, however, is not intended to be limiting of the present invention, and one of skill in the art will recognize the illustrated probe needles andprobe card30 configuration may be readily substituted for bumps, or other types of electrical contacts known in the art, which are configured for making temporary electrical connections with contact pads of ICs during IC testing.
• Probeelements38 ofprobe card30 are arranged in patterns corresponding to patterns of pads on ICs to be tested. For ease of illustration and simplicity in describing the embodiment, only a single pattern ofprobe elements38 for testing a single IC is shown. In practice, however,probe card30 will preferably be configured with a plurality of patterns ofprobe elements38, with each pattern forming a corresponding plurality of test sites for testing a plurality of respective ICs. As such,probe elements38 may be formed in varying arrays and densities corresponding to the pads of the IC devices to be tested. Eachprobe element38 interfaces with a surface portion ofsubstrate32 adjacent aconductive trace34 at a probe element-substrate interfacing portion33 ofprobe card30.
• Probeelements38 are shown mounted on aring40, preferably comprising epoxy, and extending inwardly from a center cutout portion ofsubstrate32. This illustrated arrangement, however, is not intended to be limiting of the present invention. Thus, probeelements38 may be configured onprobe card30 in a multitude of conventional or unconventional configurations. Probeelements38 may be formed of a variety of conductive materials, including, but not limited to, copper and tungsten. As is readily apparent to one of skill in the art, the diameter, taper, and material of theprobe elements38, when formed as probe needles, may be varied to determine the spring rate of the probe.
• With further reference to drawingFIG. 1, afuse42 is interposed in, or located adjacent to, eachconductive trace34. Preferably, fuses42 are interposed in, or located adjacent to, conductive traces34 in regions ofprobe card30 which are directly adjacent to one oftest contacts36 and probeelements38. One of skill in the art will recognize numerous specific locations forfuses42, including placement immediately adjacent to, and in electrical communication with, terminating ends of conductive traces34 (e.g., at interfaces withtest contacts36 and probe elements38).
• In a related aspect of the embodiment, fuses42 are further preferably disposed immediately adjacent at least one of a first surface and a second surface of substrate32 (e.g., atop surface35 and abottom surface37 of substrate32). By use of the phrase “disposed immediately adjacent” at least one of a first surface and a second surface ofsubstrate32, it is meant that afuse42 is located such that at least a portion of thefuse42 is in contact with (either over or under) a surface ofsubstrate32, or that afuse42 is in close proximity to a surface ofsubstrate32. Afuse42 that is in “close proximity” to a surface ofsubstrate32 may, for example, be surrounded by a fuse-holding body (not shown) that is in contact with a surface ofsubstrate32.
• In a preferred embodiment, fuses42 are interposed adjacently betweenconductive traces34 andtest contacts36 and disposed immediately adjacent at least one of a first surface or a second surface ofsubstrate32 in the case where the conductive traces34 are carrying signals and/or burn-in voltage into corresponding bond pads of a semiconductor device. In a related aspect of a preferred embodiment, fuses42 carrying signals or burn-in voltage away from corresponding bond pads of a semiconductor device are disposed immediately adjacent at least one of a first surface or a second surface ofsubstrate32 and between probe element-substrate interfacing portions33 ofprobe card30 and conductive traces34.
• In a most preferred embodiment of the present invention, fuses42 are configured to be self-resetting and/or easily repairable or replaceable, such that theprobe card30 may be readily reused for testing at a later time after one ormore fuses42 have been tripped. Preferably, fuses42 are configured to trip (i.e., provide an “open” in the conductive trace circuitry) at a current level below an absolute maximum current that theprobe card30 or the IC device under test can handle without being damaged. The current-carrying capacity for afuse42 may vary depending upon the particular test configuration involvingprobe card30. The current-carrying capacity forfuse42 typically will also vary in accordance with various individual components (e.g., resistors, transistors, capacitors,probe elements38, etc.) onprobe card30 and/or the particular IC device under test.
• Fuses42 for use in the present invention may be generally classified as active and/or passive fuses. As used herein, a “passive” fuse is a relatively thin conductor which may have its conductive properties disabled upon the application of a predetermined threshold of energy into it. In the context of the invention, the conductive properties of passive fuses may thus be disabled by passing a current of a higher-than-desired threshold through the fuse, thus causing resistive heating within the fuse that results in the fuse conductor melting, cracking, vaporizing, and/or becoming otherwise nonconductive. Preferably, passive fuses for use in the present invention include materials such as titanium tungsten and platinum silicide. Other materials for passive fuses, such as aluminum, copper, nichrome, doped polysilicon, metal silicide or various other conductive metal or alloys, are well known in the art of semiconductor device manufacturing and are also included in the scope of the present invention.
• In one aspect of a preferred embodiment of the invention, the passive fuses are formed of the same conductive material(s) as the conductive traces34 and/ortest contacts36 described herein. Using deposition processes well known in the art, each offuses42 may be formed at the same time (simultaneously) as the other fuses42. In a related aspect of the embodiment, the passive fuses may thus be constructed at the same time as the conductive traces34 and/or thetest contacts36 using the same deposition and/or other processing steps (e.g., CVD followed by photopatterning). These passive fuses are typically formed and/or repaired by patterning a deposited layer of the conductive material of the fuse over an insulating dielectric layer, typically silicon dioxide, ofsubstrate32.
• In other embodiments of passive fuses, the passive fuses may be prefabricated and placed in electrical communication with testing circuitry on at least one surface of aprobe card30 by mechanical means.
• It will be apparent to one of skill in the art that while preferred fuse embodiments are described below, the present invention is not intended to be limited by the described embodiments. In this regard, the present invention incorporates by reference the various embodiments of fuses for use with ICs as disclosed in U.S. Pat. No. 4,198,744 to Nicolay, U.S. Pat. No. 4,682,204 to Shiozaki et al. and U.S. Pat. No. 5,608,257 to Lee et al.
• In its simplest form, a passive fuse for use in the present invention may comprise two ends of aconductive trace34 joined by a “neck” having a width considerably smaller than the width of theconductive trace34. Referring now to drawingFIG. 2, a preferred configuration of apassive fuse42aof the present invention is illustrated withpassive fuse42ainterposed in aconductive trace34. Adielectric layer45 is shown disposed underconductive trace34 andpassive fuse42a.Passive fuse42aincludestrace interfacing portions44,46 in an aspect of the embodiment where thepassive fuse42ais formed of a material differing from that ofconductive trace34.Passive fuse42afurther includes a relatively thin (in comparison toconductive trace34 and/ortrace interfacing portions44,46) “neck” orwire portion48 configured to conduct current up to a predetermined current threshold.Trace interfacing portions44,46 are in electrical communication withtrace end portions50,52 ofconductive trace34, thetrace end portions50,52 otherwise being “open” in relation to one another (i.e., not in electrical communication with each other).
• In an embodiment where theconductive trace34 and thepassive fuse42aare formed of the same materials, it should be understood that separatetrace interfacing portions44,46 ofpassive fuse42aneed not be formed, andpassive fuse42amay simply comprise aneck portion48.
• Preferably, the predetermined current threshold ofpassive fuse42acorresponds to a current level nominally below an absolute maximum current that theprobe card30 or the IC device under test can handle without being damaged. Upon reaching the predetermined current level,passive fuse42atrips, disabling the circuit to whichpassive fuse42ais electrically connected.
• Passive fuses42amay be formed and/or repaired by conventional methods well known in the art, such as conductive layer deposition techniques, photopatterning processes, and etching techniques. As previously discussed,passive fuses42amay be formed concurrently with the deposition of other conductive structures on probe card30 (e.g., conductive traces34,test contacts36, bond pads for probe elements, etc.), orpassive fuses42amay be deposited or placed onprobe card30 in a separate processing step. Theneck portion48 of apassive fuse42amay be configured of varying widths dependent upon the nature of the application for which it will be used and the materials used in its construction. In a preferred aspect of the invention, apassive fuse42ais configured with aneck portion48 formed of a material selected from the group consisting of titanium tungsten, aluminum, copper, nichrome, doped polysilicon, platinum silicide, and alloys or combinations of any thereof. Further preferably, theneck portion48 is configured of a width ranging from about 0.3 micron to about 10.0 microns.
• A second preferred passive fuse configuration is shown in drawingFIG. 3. Here, apassive fuse42bis configured, in part, as a cutout of abond pad54, wherein thebond pad54 may be atest contact36 or a bonding interface for aconductive trace34 and a probe element (not shown). In this embodiment,passive fuse42bforms a conductive fuse-type link betweenbond pad54 and aconductive trace34 and is thus also referred to herein as a “linking fuse”42b. As can be seen inFIG. 3, linkingfuse42bis relatively narrower in width thanconductive trace34 such that linkingfuse42bwill trip in the manner previously described upon the application of an overcurrent into it. Linkingfuse42bmay be fabricated using a variety of techniques which typically involve deposition and photopatterning as previously described. Adielectric layer45 is disposed undertrace34 andpassive fuse42b.
• A third preferred embodiment of a passive fuse configuration for use in the present invention is shown in section in drawingFIG. 4A. In this embodiment, a passive fuse42cis shown as comprising a dual in-line pin header mounted in through-hole portions56 ofsubstrate32. Passive fuse42cis configured withpin portions60,62 which are made of conductive material. An insulated andremovable connector shell64 containing afuse conductor66 may be positioned onpin portions60,62 to carry current up to a predetermined threshold frompin portions60,62. In the illustrated embodiment, through-hole portions56 ofsubstrate32 are positioned so as to provide an “open” inconductive trace34. Through-hole portions56 are configured withinner contacts58 which are in electrical communication with conductive traces34. Whenpin portions60,62 of the dual in-line pin header passive fuse42care placed in through-hole portions56 ofsubstrate32,pin portions60,62 are configured to be in electrical communication withinner contacts58, thus completing a current-carrying circuit throughconductive trace34.
• As previously discussed, an overload of current sufficient to damage theprobe card30, components thereof, or an IC device under test will trip thefuse conductor66, thus disabling the circuit extending through passive fuse42c. Upon blowing passive fuse42c, anew connector shell64 and/ornew pin portions60,62 can be reinstalled in through-hole portions56 ofsubstrate32 to renderprobe card30 operational again.
• In a related embodiment, apassive fuse42dconfigured as a dual-in-line socket is shown in drawingFIG. 4B.Passive fuse42dcomprisespin portions68,70 with aninsulated connector shell72 at one end thereof.Pin portions68,70 are formed of a conductive material and are in electrical communication with afuse conductor74 residing withinconnector shell72. Similar to the embodiment shown inFIG. 4A, through-hole portions56 ofsubstrate32 are configured withinner contacts58 and positioned so as to provide an electrical “open” inconductive trace34. Whenpassive fuse42dis pressed into through-hole portions56 and the electrical circuit is completed wherein current can travel from one end portion of aconductive trace34 to a firstinner contact58, to afirst pin portion60, to fuseconductor74, to asecond pin portion60, to a secondinner contact58, and through to a second end portion of theconductive trace34. A current which is sufficiently high to trippassive fuse42dwill thus disable the circuit. To restore the circuit, the blownpassive fuse42dis removed, and a newpassive fuse42dmay simply be pressed into through-hole portions56.
• With regard topassive fuses42cand42d, one of skill in the art will readily ascertain that the pin portions of these fuses are adaptable for use with conductive traces that are in intermediate layers insubstrate32. In this regard, the pin portions ofpassive fuses42cand42dmay, for example, extend downwardly through through-hole portions56 insubstrate32 to contact conductive pads in electrical communication with a conductive trace in an intermediate layer, thus completing a circuit through the trace.
• Furthermore,passive fuses42cand42dare but two examples of discrete electrical components that may be used as protective fuses for purposes of the present invention. It will be readily apparent to one skilled in the art that various other conventional designs for discrete electrical components may be readily utilized herein. By use of the term “discrete electrical component” it is meant that the particular electrical component is manufactured separately from theprobe card30 and thus subsequently attached thereto or otherwise integrated therein.
• With reference toFIGS. 2, 3,4A and4B, each ofpassive fuses42a,42b,42cand42dis configured to conduct current under a threshold which will cause damage to probecard30 and to become disabled when a test current exceeds a threshold under the probe card's maximum current-carrying capacity. Typically, a higher than desired current in a conductive trace34 (and/or in other components in which apassive fuse42a,42b,42cor42dis placed) will cause thepassive fuse42a,42b,42cor42dto trip by resistive heating within the fuse, the resistive heating resulting in the fuse conductor (i.e., neck portion48) melting, cracking, vaporizing or the like. As previously discussed,passive fuses42a,42b,42cand42dmay be replaced or repaired such thatprobe card30 may be reused at a later time.
• “Active” fuses may also be used to protect probe cards and the components thereon in accordance with the principles of the present invention. “Active fuses,” as used herein, are electronic circuits configured to conduct current up to a predetermined level wherein once the predetermined level of current has been exceeded, active fuses are configured to stop conducting current, thus disabling the circuit to which the active fuses are connected. Unlike passive fuses, however, active fuses are configured to automatically reset upon removal of the current overload. Upon self-resetting, the active fuses are again operational to carry current to and from the probe elements on the probe card. Typically, the active fuses for use in the present invention are fast tripping surface mount-type fuses.
• In one aspect of the embodiment, a bimetallic switch may be used as an active fuse according to the present invention. The bimetallic switch as an active fuse may be interposed in, or located adjacent to, aconductive trace34 in order to limit undesirably high current levels potentially traveling through aprobe card30. A simplifiedbimetallic switch76 is shown inFIGS. 5A and 5B in electrical communication with portions of aconductive trace34 over adielectric layer45 of aprobe card30. As is well known in the art,bimetallic switch76 is formed of afirst metal conductor78 and asecond metal conductor80 having differing rates of thermal expansion.
• As shown inFIG. 5A,first metal conductor78 and asecond metal conductor80 are configured to be in contact with one another for conducting current up to a predetermined current threshold. When the current becomes excessive (e.g., potentially damaging to theprobe card30 and/or an IC device under test), the temperature offirst metal conductor78 andsecond metal conductor80 rises, causing first metal conductor78 (having a relatively higher rate of thermal expansion) to bend away fromsecond metal conductor80. Asfirst metal conductor78 andsecond metal conductor80 bend away from each other, the contact betweenfirst metal conductor78 andsecond metal conductor80 eventually opens, thus interrupting current flow in conductive trace34 (FIG. 5B). Eventually, the disruption of electrical current toconductive trace34 resulting from the “open contact” causes the temperature offirst metal conductor78 andsecond metal conductor80 to fall, thus allowing the contacts to reclose and permitting the current to flow again.
• A series of embodiments of an active fuse on a probe card is shown in drawingFIGS. 6A, 6B,6C and6D. Therein, the active fuse comprises a Polymer Positive Temperature Coefficient (PPTC) fuse as an overcurrent protection mechanism interposed in, or located adjacent to, aconductive trace34 on aprobe card30. Like components of each ofFIGS. 6A, 6B,6C and6D are referenced by the same reference characters.
• Various lead arrangements for PPTC fuses are shown inFIGS. 6A, 6C and6D. InFIG. 6A, a PPTCactive fuse82ais shown having a radial lead arrangement positioned in a through-hole portion56 ofsubstrate32 and in electrical communication withinner contacts58. InFIG. 6B, the PPTCactive fuse82aofFIG. 6A is shown in tripped condition. A PPTCactive fuse82bhaving an axial lead arrangement withterminals84,86 in electrical communication withconductive trace34 is shown inFIG. 6C. A PPTC active fuse82cin a surface mount configuration known in the art is shown inFIG. 6D.Fuses82band82cmay be electrically connected toconductive traces34 in a manner well known in the art, to include the use of conventional soldering techniques.
• Generally, the PPTCactive fuses82a,82band82cfor use in the present invention are constructed with highlyconductive carbon particles88 combined with anonconductive polymer90 that exhibits two phases. In a first phase, which occurs under a predetermined current threshold, thepolymer90 exhibits a crystalline or semi-crystalline structure in which the molecules form long chains and are arranged in a regular structure (FIG. 6A). In this phase, thecarbon particles88 are packed within the crystalline polymer structure, thus forming a conductive chain spanning between opposing electrodes of thePPTC fuse82a.
• When electricity is conducted through the crystalline structure, which has a low resistance configuration, the temperature increases within the PPTC fuse. At a predetermined temperature which is correlated with a current overload, this structure transitions by expanding to an amorphous phase which breaks the chain ofconductive particles88. The resulting random alignment ofcarbon particles88 caused by the phase change instantly opens the circuit (FIG. 6B).
• After the circuit has been opened for a certain period of time, thepolymer90 cools and returns to its normal crystalline state, thus allowing thecarbon particles88 to again touch and form conductive paths, upon which the circuit closes and the probe card can function properly. Thus, the PPTC fuses are advantageously self-resetting and do not have to be replaced as is the case with conventional passive fuses.
• Preferably, the PPTC fuses for use in the present invention will have trip times of just a few milliseconds. Such PPTC fuses are presently available from several commercial sources, including Raychem Corporation (Menlo Park, Calif.) and Bourns Incorporated (Ogden, Utah).
• It should be understood that while the above-described embodiments illustrate only a single fuse interposed in, or located adjacent to, a conductive trace on a probe card, the present invention contemplates a plurality of fuses interposed in, or located adjacent to, a plurality of respective conductive traces. The fuses may be passive fuses, active fuses, or combinations thereof. The use of an active fuse may be particularly desirable in the situation where a particular location of the fuse on the probe card renders the fuse not easily repairable or replaceable. Passive fuses may be particularly desirable in the situation where extremely short trip times are desirable and/or the location of the fuse renders it readily repairable or replaceable. For example, passive fuses may be preferable for placement in probe card conductive traces used for supplying relatively high voltages during IC testing (e.g., voltages supplied for burn-in testing of ICs).
• In the preferred embodiments, at least one fuse according to the present invention is interposed in, or located adjacent to, each conductive trace. In some contemplated configurations, however, some, but not all, of the conductive traces may include a fuse configured according to the present invention. For example, a fuse may not be needed in one or more conductive traces on a probe card where the one or more conductive traces will be transporting extremely low voltage signals to an IC device under test.
• Referring to drawingFIG. 7, a simplified diagram of atest system100 in accordance with the present invention is shown. Thetest system100 typically includes a wafer handler (not shown) for handling and positioning asemiconductor wafer112,test equipment114 for generating test signals, and aprobe card116 for making temporary electrical connections with thesemiconductor wafer112.Semiconductor wafer112 is configured with a plurality ofbond pads113 on an active surface thereof representing a plurality ofunsingulated ICs118.Probe card116 is configured with a plurality ofconductive traces120 over at least one surface thereof. Interposed in, and/or located adjacent to, at least some, and preferably all, of theconductive traces120 arefuses122 provided in accordance with the above-described principles of the present invention.
• A prober124 (shown as transparent for purposes of clarity) typically lowers theprobe card116 on thesemiconductor wafer112 untilprobe elements126 ofprobe card116 come in contact withbond pads113 onsemiconductor wafer112. Probeelements126 are shown as needles, but may alternatively be configured as bumps, or other types of electrical contacts known in the art for making temporary electrical connections withbond pads113 ofsemiconductor wafer112.Test equipment114 is in electrical communication with thetest contacts117 onprobe card116 and, upon activation, transmits test signals through thetest contacts117 andconductive traces120 to probeelements126. Alternately, thesemiconductor wafer112 may be raised into contact with theprobe elements126 ofprobe card116 of aprober124.
• Preferably, but not necessarily, thesemiconductor wafer112 or theprobe card116 is stepped so that unsingulated dice on thesemiconductor wafer112 are tested in groups of two or more at a time in sequence. Thetest system100 may also be configured to test all unsingulated dice onsemiconductor wafer112 at the same time. Uponprobe elements126 coming in contact withbond pads113 ofsemiconductor wafer112,test equipment114 applies test signals and/or a power source voltage throughprobe card116 tobond pads113 and analyzes the resulting signals therefrom. During the testing process, fuses122protect probe card116 and/or theICs118 onsemiconductor wafer112 from overcurrents and/or short circuits in theICs118.
• Thus, upon an overload of current sufficient to damage theprobe card116, components thereof, or an IC device onsemiconductor wafer112, one ormore fuses122 exposed to the current overload will trip, thus disabling the circuit extending throughprobe card116. If the one or more of the tripped fuses are configured as “active” fuses, the fuses will automatically reset after the fuse cools, thus renderingprobe card116 operational again. If the one or more tripped fuses are configured as “passive” fuses, theprobe card116 may be reused after the tripped fuses are repaired or replaced (depending upon the particular type of passive fuse used).
• The describedtest system100, however, is only exemplary, and the test apparatus may be configured for any of a variety of device tests onsemiconductor wafer112. Such testing may, for example, include basic parametric tests, low frequency functional testing, speed binning tests using specially designed test structures, boundary scan testing, and device testing at full operating frequency.
• It will be appreciated by those skilled in the art that the embodiments herein described, while illustrating certain embodiments, are not intended to so limit the invention or the scope of the appended claims. As such, the various embodiments are merely exemplary of the present invention and, thus, the specific features described herein are merely used to more easily describe such embodiments and to provide an overall understanding of the present invention.
• Those skilled in the art will also understand that various combinations or modifications of the preferred embodiments could be made without departing from the scope of the invention. For example, those skilled in the art will appreciate that a plurality of the fuses described herein may be interposed side by side in a conductive trace of a probe card.
• In yet another embodiment which is illustrative of the scope of the present invention, a plurality of protective fuses138 (provided in accordance with the principles of the present invention) can be configured as, interposed in, or placed adjacent to,pogo pin140 portions of a probe card assembly135 (drawingFIG. 8). As shown in drawingFIG. 8, pogo pins140 form an interface between testing circuitry (not shown) andtest contacts142 on aprobe card136. Once apprized of the present invention, methods of providingprotective fuses138 as interposed in, or placed adjacent to, apogo pin140 will be apparent to one skilled in the art. For example, pogo pins140 may be formed, in part, as a fuse body for holding one or moreprotective fuses138.
• In drawingFIG. 8, fuses138 are illustrated as forming a portion of pogo pins140. Pogo pins140 enable aprobe card136 to be electrically connected with test equipment (not shown). Thus, pogo pins140, including interposed fuses138, are electrically connected toconductive traces144 onprobe card136 viatest contacts142 residing on a probe card surface. Test signals are transmitted from the test equipment to probecard136 by way of pogo pins140 and fuses138.Fuses138 are configured to prevent excessive currents from being transmitted to probecard136, thus preventing damage to probecard136.Fuses138 further prevent excessive currents from traveling through probe needles146 to one or more IC devices undertest148. In a preferred aspect of the embodiment, fuses138 which have been tripped due to excessive current may be replaced by, for example, inserting anew fuse138 into apogo pin140 in the aspect of the embodiment where apogo pin140 is configured, in part, as a fuse body.
• Furthermore, the probe cards for use in the present invention may comprise any type of probe card susceptible to the introduction of one or more fuses for the electrical protection of the probe card and/or components thereof. Thus, the methods and apparatus described herein are contemplated in a wide ranging variety of probe card configurations, including, but not limited to, vertical contact probe cards, cantilever-type probe cards, and probe cards for wafer level burn-in.
• Additionally, the fuses described herein are suitable for use with a variety of other electrical components which may be found on a probe card. These components include resistors, transistors, capacitors, diodes, and the like.
• As a final example, this invention, while being primarily described with reference to a probe card configured with probe needles, has equal applicability to various other types of probe card configurations, including membrane-type probe cards. In this regard, a simplified schematic view of an exemplary membrane-type probe card150 is shown in drawingFIG. 9. Membrane-type probe card150 includes acarrier substrate151 supporting amembrane154 and a plurality of contact bumps152 connected through themembrane154 toconductive traces156. Conductive traces156 are in electrical communication withtest contacts158. Conductive traces156 thus carry test signals from multichannel testing equipment (not shown) to contact bumps152. In turn, contact bumps152 supply test signals from the testing equipment to contactpads162 on an IC device undertest164. Interposed in, or adjacent to,conductive traces156 arefuses160 configured in accordance with the principles of the present invention.
• Thus, while certain representative embodiments and details have been shown for purposes of illustrating the invention, it will be apparent to those skilled in the art that various changes to the invention disclosed herein may be made without departing from the scope of the invention, which is defined in the appended claims.

Claims (54)

1. A method of forming a probe card comprising:

providing a substrate having a first surface and a second surface;

disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface;

providing a plurality probe elements in electrical communication with the plurality of conductive traces; and

providing a plurality of fuse elements in respective electrical communication with at least some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent at least one of the first surface and the second surface.

2. The method ofclaim 1, wherein providing a plurality of fuse elements comprises providing a fuse element of the plurality of fuse elements in respective electrical communication with substantially each of the plurality of conductive traces.

3. The method ofclaim 1, wherein providing a plurality of fuse elements comprises providing at least one fuse element of the plurality of fuse elements configured to be replaceable or repairable after being tripped.

4. The method ofclaim 3, further comprising constructing at least some of the plurality of conductive traces and at least some of the plurality of fuse elements at substantially the same time and by a single deposition process.

5. The method ofclaim 3, further comprising providing a plurality of test contacts adjacent the at least one of the first surface and the second surface of the substrate, at least some of the plurality of test contacts in electrical communication with respective conductive traces of the plurality of conductive traces, and further comprising forming each of the plurality of conductive traces, the plurality of fuse elements, and the plurality of test contacts of the same materials.

6. The method ofclaim 1, wherein providing a plurality of fuse elements comprises inserting at least one of the plurality of fuse elements in through-hole portions configured in the at least one of the first surface and the second surface of the substrate.

7. The method ofclaim 1, wherein providing a plurality of fuse elements comprises providing at least one of the plurality of fuse elements configured as a dual in-line pin header fuse.

8. The method ofclaim 1, wherein providing a plurality of fuse elements comprises providing at least one of the plurality of fuse elements configured as a dual in-line socket fuse.

9. The method ofclaim 1, wherein at least one fuse element of the plurality of fuse elements is configured to be self-resetting after being tripped.

10. The method ofclaim 9, wherein the at least one fuse element is configured as a PPTC fuse.

11. The method ofclaim 9, wherein the at least one fuse element is configured as a bimetallic switch.

12. A method of fabricating a probe card comprising:

providing a probe card substrate;

providing a plurality of conductive traces adjacent a surface of the probe card substrate;

providing a plurality of probe elements in electrical communication with the plurality of conductive traces, at least one probe element of the plurality of probe elements configured for supplying a test signal to at least one semiconductor die; and

providing at least one repairable or replaceable fuse component in electrical communication with at least one of the plurality of conductive traces.

13. The method ofclaim 12, further comprising providing a test contact in electrical communication with at least one conductive trace of the plurality of conductive traces, and further comprising providing a pogo pin in electrical communication with the test contact, wherein the at least one repairable or replaceable fuse component is configured as a portion of the pogo pin.

14. The method ofclaim 12, wherein providing a plurality of probe elements comprises providing a plurality of probe elements in a configuration adapted to be temporarily electrically coupled with a semiconductor wafer having a plurality of electrical contacts thereon.

15. The method ofclaim 14, wherein providing a plurality of probe elements comprises arranging conductive tips of the plurality of probe elements in a mirror image of a pattern of the plurality of electrical contacts on the semiconductor wafer.

16. The method ofclaim 14, further comprising providing a probe card substrate with a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of the semiconductor wafer.

17. The method ofclaim 12, wherein providing at least one repairable or replaceable fuse component comprises providing an active fuse.

18. The method ofclaim 12, wherein providing at least one repairable or replaceable fuse component comprises providing a passive fuse.

19. The method ofclaim 18, further comprising providing a plurality of test contacts in electrical communication with respective conductive traces of the plurality of conductive traces, and wherein providing a passive fuse comprises providing a passive fuse configured as a cutout portion of at least one test contact of the plurality of test contacts.

20. A method of forming a probe card using a substrate having a first surface and a second surface comprising:

disposing a plurality of conductive traces adjacent at least one of the first surface and the second surface;

placing a plurality of probe elements in electrical communication with the plurality of conductive traces; and

placing a plurality of fuse elements in respective electrical communication with at least some of the plurality of conductive traces, at least some of the plurality of fuse elements disposed immediately adjacent at least one of the first surface and the second surface.

21. The method ofclaim 20, wherein placing a plurality of fuse elements comprises placing a fuse element of the plurality of fuse elements in respective electrical communication with substantially each of the plurality of conductive traces.

22. The method ofclaim 20, wherein placing a plurality of fuse elements comprises placing at least one fuse element of the plurality of fuse elements configured to be replaceable or repairable after being tripped.

23. The method ofclaim 22, further comprising constructing at least some of the plurality of conductive traces and at least some of the plurality of fuse elements at substantially the same time and by a single deposition process.

24. The method ofclaim 22, further comprising providing a plurality of test contacts adjacent the at least one of the first surface and the second surface of the substrate, at least some of the plurality of test contacts in electrical communication with respective conductive traces of the plurality of conductive traces, and further comprising forming each of the plurality of conductive traces, the plurality of fuse elements, and the plurality of test contacts of the same materials.

25. The method ofclaim 20, wherein placing a plurality of fuse elements comprises inserting at least one of the plurality of fuse elements in through-hole portions configured in the at least one of the first surface and the second surface of the substrate.

26. The method ofclaim 20, wherein placing a plurality of fuse elements comprises placing at least one of the plurality of fuse elements configured as a dual in-line pin header fuse.

27. The method ofclaim 20, wherein placing a plurality of fuse elements comprises placing at least one of the plurality of fuse elements configured as a dual in-line socket fuse.

28. The method ofclaim 20, wherein at least one fuse element of the plurality of fuse elements comprises a self-resetting fuse element after being tripped.

29. The method ofclaim 28, wherein the at least one fuse element comprises a PPTC fuse.

30. The method ofclaim 28, wherein the at least one fuse element comprises a bimetallic switch.

31. A method of fabricating a probe card using a probe card substrate comprising:

forming a plurality of conductive traces adjacent a surface of the probe card substrate;

providing a plurality of probe elements in electrical communication with the plurality of conductive traces, at least one probe element of the plurality of probe elements configured for supplying a test signal to at least one semiconductor die; and

providing at least one repairable or replaceable fuse component in electrical communication with at least one of the plurality of conductive traces.

32. The method ofclaim 31, further comprising providing a test contact in electrical communication with at least one conductive trace of the plurality of conductive traces, and further comprising providing a pogo pin in electrical communication with the test contact, wherein the at least one repairable or replaceable fuse component is configured as a portion of the pogo pin.

33. The method ofclaim 31, wherein providing a plurality of probe elements comprises providing a plurality of probe elements in a configuration adapted to be temporarily electrically coupled with a semiconductor wafer having a plurality of electrical contacts thereon.

34. The method ofclaim 33, wherein providing a plurality of probe elements comprises arranging conductive tips of the plurality of probe elements in a mirror image of a pattern of the plurality of electrical contacts on the semiconductor wafer.

35. The method ofclaim 33, further comprising providing a probe card substrate with a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of the semiconductor wafer.

36. The method ofclaim 31, wherein providing at least one repairable or replaceable fuse component comprises providing an active fuse.

37. The method ofclaim 31, wherein providing at least one repairable or replaceable fuse component comprises providing a passive fuse.

38. The method ofclaim 37, further comprising providing a plurality of test contacts in electrical communication with respective conductive traces of the plurality of conductive traces, and wherein providing a passive fuse comprises providing a passive fuse configured as a cutout portion of at least one test contact of the plurality of test contacts.

39. A method of fabricating a probe card using a probe card substrate comprising:

forming a plurality of conductive traces adjacent a surface of the probe card substrate;

installing a plurality of probe elements in electrical communication with the plurality of conductive traces, at least one probe element of the plurality of probe elements configured for supplying a test signal to at least one semiconductor die; and

providing at least one repairable or replaceable fuse component in electrical communication with at least one of the plurality of conductive traces.

40. The method ofclaim 39, further comprising providing a test contact in electrical communication with at least one conductive trace of the plurality of conductive traces, and further comprising providing a pogo pin in electrical communication with the test contact, wherein the at least one repairable or replaceable fuse component is configured as a portion of the pogo pin.

41. The method ofclaim 39, wherein installing a plurality of probe elements comprises installing a plurality of probe elements in a configuration adapted to be temporarily electrically coupled with a semiconductor wafer having a plurality of electrical contacts thereon.

42. The method ofclaim 41, wherein installing a plurality of probe elements comprises arranging conductive tips of the plurality of probe elements in a mirror image of a pattern of the plurality of electrical contacts on the semiconductor wafer.

43. The method ofclaim 41, further comprising installing a probe card substrate with a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of the semiconductor wafer.

44. The method ofclaim 41, wherein providing at least one repairable or replaceable fuse component comprises providing an active fuse.

45. The method ofclaim 41, wherein providing at least one repairable or replaceable fuse component comprises providing a passive fuse.

46. The method ofclaim 45, further comprising providing a plurality of test contacts in electrical communication with respective conductive traces of the plurality of conductive traces, and wherein providing a passive fuse comprises providing a passive fuse configured as a cutout portion of at least one test contact of the plurality of test contacts.

47. A method of fabricating a probe card using a probe card substrate comprising:

forming a plurality of conductive traces adjacent a surface of the probe card substrate;

forming a plurality of probe elements in electrical communication with the plurality of conductive traces, at least one probe element of the plurality of probe elements configured for supplying a test signal to at least one semiconductor die; and

providing at least one repairable or replaceable fuse component in electrical communication with at least one of the plurality of conductive traces.

48. The method ofclaim 47, further comprising providing a test contact in electrical communication with at least one conductive trace of the plurality of conductive traces, and further comprising providing a pogo pin in electrical communication with the test contact, wherein the at least one repairable or replaceable fuse component is configured as a portion of the pogo pin.

49. The method ofclaim 47, wherein forming a plurality of probe elements comprises forming a plurality of probe elements in a configuration adapted to be temporarily electrically coupled with a semiconductor wafer having a plurality of electrical contacts thereon.

50. The method ofclaim 49, wherein forming a plurality of probe elements comprises arranging conductive tips of the plurality of probe elements in a mirror image of a pattern of the plurality of electrical contacts on the semiconductor wafer.

51. The method ofclaim 49, further comprising forming a probe card substrate with a coefficient of thermal expansion which substantially matches a coefficient of thermal expansion of the semiconductor wafer.

52. The method ofclaim 47, wherein providing at least one repairable or replaceable fuse component comprises providing an active fuse.

53. The method ofclaim 47, wherein providing at least one repairable or replaceable fuse component comprises providing a passive fuse.

54. The method ofclaim 47, further comprising providing a plurality of test contacts in electrical communication with respective conductive traces of the plurality of conductive traces, and wherein providing a passive fuse comprises providing a passive fuse configured as a cutout portion of at least one test contact of the plurality of test contacts.

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