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US20050045310A1 - Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit - Google Patents

Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit
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Publication number
US20050045310A1
US20050045310A1US10/847,246US84724604AUS2005045310A1US 20050045310 A1US20050045310 A1US 20050045310A1US 84724604 AUS84724604 AUS 84724604AUS 2005045310 A1US2005045310 A1US 2005045310A1
Authority
US
United States
Prior art keywords
heat
end portion
radiating
container
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/847,246
Inventor
Isao Okutsu
Satoshi Ooka
Hiroki Haba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IndividualfiledCriticalIndividual
Assigned to KABUSHIKI KAISHA TOSHIBAreassignmentKABUSHIKI KAISHA TOSHIBAASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).Assignors: HABA, HIROKI, OKUTSU, ISAO
Publication of US20050045310A1publicationCriticalpatent/US20050045310A1/en
Abandonedlegal-statusCriticalCurrent

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Abstract

According to one embodiment of the invention, a heat pipe features a pipe-shaped container in which an operating fluid is sealed, and a wick provided inside the container. The container has a flat heat-receiving end portion, a heat-radiating end portion being flattened in a direction different from that of the heat-receiving end portion, and a middle portion connecting the heat-receiving end portion and the heat-radiating end portion. The middle portion has a circular cross section.

Description

Claims (29)

11. A heat pipe comprising:
a sealed container including an operating fluid, the container comprises a heat-receiving end portion having a cross section elongated in a first direction, a heat-radiating end portion having a cross section elongated in a second direction different than the first direction, and a middle portion coupling the heat-receiving end portion and the heat-radiating end portion, the heat-receiving end portion, the heat-radiating end portion and the middle portion are arranged in-line, each of the heat-receiving end portion and the heat-radiating end portion has two surfaces substantially in parallel, and the middle portion includes a first pair of non-parallel surfaces coupled to the two respective surfaces of the heat-receiving end portion and a second pair of non-parallel surfaces coupled to the two respective surfaces of the heat-radiating end portion; and
a wick provided inside the container.
22. A cooling unit comprising:
a heat-receiving portion adapted to be thermally connected to a heat generating component;
a heat-radiating portion adapted to radiate heat from the heat generating component; and
a heat pipe for conveying the heat of the heat generating component from the heat-receiving portion to the heat-radiating portion, the heat pipe comprising a container formed as a sealed conduit including a heat-conveying operating fluid and a wick inside the container, the container comprises a flat heat-receiving end portion having a cross section elongated in a first direction, a flat heat-radiating end portion having a cross section elongated in a second direction different than the first direction, and a middle portion connecting the heat-receiving end portion and the heat-radiating end portion and having a circular cross section, the middle portion bent into an arc.
24. A cooling unit comprising:
a heat-receiving portion thermally connected to a heat generating component;
a heat-radiating portion adapted to radiate heat from the heat generating component; and
a heat pipe which conveys heat from the heat-receiving portion to the heat-radiating portion, the heat pipe comprising a sealed, pipe-shaped container including a heat-conveying operating fluid and a wick housed inside the container, the container comprises a flat heat-receiving end portion with a cross section elongated in a first direction, a flat heat-radiating end portion having a cross section elongated in a second direction differing from the first direction, and a middle portion connecting the heat-receiving end portion and the heat-radiating end portion, the heat-receiving end portion, the heat-radiating end portion and the middle portion are arranged in-line, each of the heat-receiving end portion and the heat-radiating end portion has two surfaces substantially in parallel, and the middle portion has a first pair of non-parallel surfaces coupled to the two respective surfaces of the heat-receiving end portion, and a second pair of non-parallel surfaces coupled to the two respective surfaces of the heat-radiating end portion.
26. An electronic apparatus comprising:
a housing having a heat generating component;
a heat-receiving portion contained in the housing and thermally connected to the heat generating component;
a heat-radiating portion adapted to radiate heat from the heat generating component; and
a heat pipe which conveys the heat from the heat-receiving portion to the heat-radiating portion, the heat pipe comprising a pipe-shaped container in which a heat-conveying operating fluid is sealed, and a wick provided inside the container, the container comprises a flat heat-receiving end portion, a heat-radiating end portion being flattened in a direction different from that of the heat-receiving end portion, and a middle portion connecting the heat-receiving end portion and the heat-radiating end portion and having a circular cross section.
29. An electronic apparatus comprising:
a housing including a heat generating component and a heat-receiving portion thermally connected to the heat generating component;
a heat-radiating portion to radiate heat of the heat generating component; and
a heat pipe which conveys the heat from the heat-receiving portion to the heat-radiating portion, the heat pipe comprises a pipe-shaped container in which a heat-conveying operating fluid is sealed, and a wick provided inside the container, the container having a flat heat-receiving end portion, a heat-radiating end portion being flattened in a direction different from that of the heat-receiving end portion, and a middle portion connecting the heat-receiving end portion and the heat-radiating end portion, the heat-receiving end portion, the heat-radiating end portion and the middle portion are arranged in-line, each of the heat-receiving end portion and the heat-radiating end portion has two surfaces substantially in parallel, and the middle portion has two first non-parallel surfaces connecting with the two respective surfaces of the heat-receiving end portion, and two second non-parallel surfaces connecting with the two respective surfaces of the heat-radiating end portion.
US10/847,2462003-08-292004-05-17Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unitAbandonedUS20050045310A1 (en)

Applications Claiming Priority (2)

Application NumberPriority DateFiling DateTitle
JP2003307423AJP2005079325A (en)2003-08-292003-08-29Heat pipe, cooling device having heat pipe and electronic apparatus equipped with the cooling device
JP2003-3074232003-08-29

Publications (1)

Publication NumberPublication Date
US20050045310A1true US20050045310A1 (en)2005-03-03

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ID=34214132

Family Applications (1)

Application NumberTitlePriority DateFiling Date
US10/847,246AbandonedUS20050045310A1 (en)2003-08-292004-05-17Heat pipe, cooling unit having the heat pipe, and electronic apparatus having the cooling unit

Country Status (4)

CountryLink
US (1)US20050045310A1 (en)
JP (1)JP2005079325A (en)
CN (1)CN1592567A (en)
TW (1)TW200508845A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070121291A1 (en)*2005-11-302007-05-31Inventec CorporationHeat sink module of a notebook computer
US20070240869A1 (en)*2006-04-142007-10-18Fujitsu LimitedElectronic apparatus and cooling component
US20080112114A1 (en)*2006-11-132008-05-15Asustek Computer Inc.Portable electronic device
US20110067844A1 (en)*2009-09-242011-03-24Celsia Technologies Taiwan, Inc.Planar heat pipe
US20130027881A1 (en)*2011-07-252013-01-31Panasonic CorporationElectronic Device
US20140182818A1 (en)*2012-12-292014-07-03Hon Hai Precision Industry Co., Ltd.Heat sink
US20170167799A1 (en)*2015-12-142017-06-15At&S Austria Technologie & Systemtechnik AktiengesellschaftHeat pipe and method to embed a heat pipe in a product
US20190035713A1 (en)*2017-07-282019-01-31Qualcomm IncorporatedSystems and methods for cooling an electronic device
US10485135B2 (en)*2017-06-302019-11-19Dell Products, L.P.Storage device cooling utilizing a removable heat pipe
US20220136778A1 (en)*2020-11-052022-05-05Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd.Heat pipe and heat dissipation structure
US11425842B2 (en)*2020-09-142022-08-23Hewlett Packard Enterprise Development LpThermal design of an access point
US20220369512A1 (en)*2021-05-122022-11-17Lenovo (Singapore) Pte. Ltd.Electronic apparatus, cooling device, and method for manufacturing cooling device
US20230247808A1 (en)*2020-07-312023-08-03Lg Innotek Co., Ltd.Power converter
US20240093946A1 (en)*2022-09-162024-03-21Asia Vital Components Co., Ltd.Thermal module
USD1073040S1 (en)*2021-09-022025-04-29Delta Electronics, Inc.Fan

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
CN100437005C (en)*2005-07-082008-11-26富准精密工业(深圳)有限公司Flat type heat-pipe
JP2007094648A (en)*2005-09-282007-04-12Toshiba CorpElectronic equipment
CN100561107C (en)*2006-03-032009-11-18超众科技股份有限公司Method for manufacturing heat pipe with expansion part
TWI413887B (en)2008-01-072013-11-01Compal Electronics IncHeat pipe structure
CN101493294B (en)*2008-01-212010-10-13仁宝电脑工业股份有限公司Heat pipe structure
JP5592019B1 (en)*2013-03-082014-09-17株式会社東芝 Electronics
TWI840730B (en)*2022-01-042024-05-01尼得科超眾科技股份有限公司Irregular-shaped heat pipe and method of manufacturing thereof

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US4442459A (en)*1979-03-031984-04-10Canon Kabushiki KaishaFacsimile transceiver
US5349131A (en)*1990-09-031994-09-20Furukawa Electric Co., Ltd.Electrical wiring material and transformer
US5451989A (en)*1989-07-281995-09-19Canon Kabushiki KaishaInk jet recording apparatus with a heat pipe for temperature stabilization
US6113212A (en)*1998-04-162000-09-05Eastman Kodak CompanyMethod and apparatus for thermal control of LED printheads
US6166907A (en)*1999-11-262000-12-26Chien; Chuan-FuCPU cooling system
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US6408934B1 (en)*1998-05-282002-06-25Diamond Electric Mfg. Co., Ltd.Cooling module
US6519147B2 (en)*2000-12-192003-02-11Hitachi, Ltd.Notebook computer having a liquid cooling device
US6650540B2 (en)*2001-11-292003-11-18Kabushiki Kaisha ToshibaCooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit

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* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US4273100A (en)*1979-02-161981-06-16W. R. Grace & Co.Passive solar heating and cooling panels
US4442459A (en)*1979-03-031984-04-10Canon Kabushiki KaishaFacsimile transceiver
US5451989A (en)*1989-07-281995-09-19Canon Kabushiki KaishaInk jet recording apparatus with a heat pipe for temperature stabilization
US5349131A (en)*1990-09-031994-09-20Furukawa Electric Co., Ltd.Electrical wiring material and transformer
US6113212A (en)*1998-04-162000-09-05Eastman Kodak CompanyMethod and apparatus for thermal control of LED printheads
US6408934B1 (en)*1998-05-282002-06-25Diamond Electric Mfg. Co., Ltd.Cooling module
US6366460B1 (en)*1998-07-272002-04-02Compaq Computer CorporationHeat dissipation structure for electronic apparatus component
US6166907A (en)*1999-11-262000-12-26Chien; Chuan-FuCPU cooling system
US6313990B1 (en)*2000-05-252001-11-06Kioan CheonCooling apparatus for electronic devices
US6519147B2 (en)*2000-12-192003-02-11Hitachi, Ltd.Notebook computer having a liquid cooling device
US6519148B2 (en)*2000-12-192003-02-11Hitachi, Ltd.Liquid cooling system for notebook computer
US6650540B2 (en)*2001-11-292003-11-18Kabushiki Kaisha ToshibaCooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit

Cited By (21)

* Cited by examiner, † Cited by third party
Publication numberPriority datePublication dateAssigneeTitle
US20070121291A1 (en)*2005-11-302007-05-31Inventec CorporationHeat sink module of a notebook computer
US20070240869A1 (en)*2006-04-142007-10-18Fujitsu LimitedElectronic apparatus and cooling component
US7663877B2 (en)*2006-04-142010-02-16Fujitsu LimitedElectronic apparatus and cooling component
US20080112114A1 (en)*2006-11-132008-05-15Asustek Computer Inc.Portable electronic device
US20110067844A1 (en)*2009-09-242011-03-24Celsia Technologies Taiwan, Inc.Planar heat pipe
US20130027881A1 (en)*2011-07-252013-01-31Panasonic CorporationElectronic Device
US8902581B2 (en)*2011-07-252014-12-02Panasonic CorporationElectronic device
US20140182818A1 (en)*2012-12-292014-07-03Hon Hai Precision Industry Co., Ltd.Heat sink
US20170167799A1 (en)*2015-12-142017-06-15At&S Austria Technologie & Systemtechnik AktiengesellschaftHeat pipe and method to embed a heat pipe in a product
US10883769B2 (en)*2015-12-142021-01-05At&S Austria Technologie & Systemtechnik AktiengesellschaftHeat pipe and method to embed a heat pipe in a product
US10485135B2 (en)*2017-06-302019-11-19Dell Products, L.P.Storage device cooling utilizing a removable heat pipe
US10622282B2 (en)*2017-07-282020-04-14Qualcomm IncorporatedSystems and methods for cooling an electronic device
US20190035713A1 (en)*2017-07-282019-01-31Qualcomm IncorporatedSystems and methods for cooling an electronic device
US20230247808A1 (en)*2020-07-312023-08-03Lg Innotek Co., Ltd.Power converter
US11425842B2 (en)*2020-09-142022-08-23Hewlett Packard Enterprise Development LpThermal design of an access point
US20220136778A1 (en)*2020-11-052022-05-05Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd.Heat pipe and heat dissipation structure
US11774180B2 (en)*2020-11-052023-10-03Vast Glory Electronics & Hardware & Plastic(Hui Zhou) Ltd.Heat pipe and heat dissipation structure
US20220369512A1 (en)*2021-05-122022-11-17Lenovo (Singapore) Pte. Ltd.Electronic apparatus, cooling device, and method for manufacturing cooling device
US11963333B2 (en)*2021-05-122024-04-16Lenovo (Singapore) Pte. Ltd.Electronic apparatus, cooling device, and method for manufacturing cooling device
USD1073040S1 (en)*2021-09-022025-04-29Delta Electronics, Inc.Fan
US20240093946A1 (en)*2022-09-162024-03-21Asia Vital Components Co., Ltd.Thermal module

Also Published As

Publication numberPublication date
CN1592567A (en)2005-03-09
JP2005079325A (en)2005-03-24
TW200508845A (en)2005-03-01

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Legal Events

DateCodeTitleDescription
ASAssignment

Owner name:KABUSHIKI KAISHA TOSHIBA, JAPAN

Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OKUTSU, ISAO;HABA, HIROKI;REEL/FRAME:015344/0922;SIGNING DATES FROM 20040421 TO 20040428

STCBInformation on status: application discontinuation

Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION


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