US20040189195A1 - Devices including, methods using, and compositions of reflowable getters - Google Patents

Abstract

Methods for protecting circuit device materials, optoelectronic devices, and caps using a reflowable getter are described. The methods, devices and caps provide advantages because they enable modification of the shape and activity of the getter after sealing of the device. Some embodiments of the invention provide a solid composition comprising a reactive material and a phase changing material. The combination of the reactive material and phase changing material is placed in the cavity of an electronic device. After sealing the device by conventional means (epoxy seal for example), the device is subjected to thermal or electromagnetic energy so that the phase changing material becomes liquid, and consequently: exposes the reactive material to the atmosphere of the cavity, distributes the getter more equally within the cavity, and provides enhanced protection of sensitive parts of the device by flowing onto and covering these parts, with a thin layer of material.

Description

FIELD OF THE INVENTION
• The invention relates generally to the field of microelectronics fabrication. More particularly, the invention relates to gettering of moisture, oxygen and other harmful species in encapsulated microelectronics devices.[0001]
BACKGROUND OF THE INVENTION
• Microelectronics devices including Organic Light Emitting Diodes (OLEDs) contain thin layers of materials very sensitive to oxygen and moisture. These devices are typically encapsulated, and a getter is usually placed in the cavity of these devices. The getter can be a zeolite tablet or powder, an oxide (BaO, CaO), or a reactive metal (such as Ba and its alloys with other metals such as Al). Once the zeolites have been activated at high temperature, they must be handled and processed under rigorously dry conditions. Reactive metals and oxides must also be handled under controlled conditions so they do not react or lose their activity.[0002]
• Various aspects of the invention will be better appreciated and understood when considered in conjunction with the following description and the accompanying drawings. It should be understood, however, that the following description, while indicating preferred embodiments of the invention and numerous specific details thereof, is given by way of illustration and not of limitation. Many changes and modifications may be made within the scope of the invention without departing from the spirit thereof, and the invention includes all such modifications.[0003]
BRIEF DESCRIPTION OF THE DRAWINGS
• A clear conception of the advantages and features constituting the invention, and of the components and operation of model systems provided with the invention, will become more readily apparent by referring to the exemplary, and therefore non-limiting, embodiments.[0004]
• FIG. 1A illustrates placement of an activated powder and molten wax getter composition within an encapsulated device prior to reflow, representing an embodiment of the invention.[0005]
• FIG. 1B illustrates placement of an activated getter and molten wax getter composition within an encapsulated device after reflow of the getter composition, representing an embodiment of the invention.[0006]
• FIG. 2A illustrates a prior art glass cap with a cavity.[0007]
• FIG. 2B illustrates a glass cap including an active getter, according to an embodiment of the invention.[0008]
• FIG. 2C illustrates a glass cap including an active getter and an adjacent binder layer, representing an embodiment of the invention.[0009]
• FIG. 3A illustrates a microelectronics device assembly including the cap of FIG. 2C, representing an embodiment of the invention.[0010]
• FIG. 3B illustrates a microelectronics device assembly after the inert layer has been removed from the active getter, representing an embodiment of the invention.[0011]
• FIG. 4A illustrates the placement of a reflowable getter composition onto a microelectronic device prior to encapsulation, representing an embodiment of the invention.[0012]
• FIG. 4B illustrates a microelectronic device assembly with the getter composition after encapsulation, and sealing,[0013]
• FIG. 4C illustrates a microelectronic device assembly after reflow of the getter composition so that the getter composition covers the entire active area of the microelectronic device.[0014]
DESCRIPTION OF PREFERRED EMBODIMENTS
• The invention and the various features and advantageous details thereof are explained more fully with reference to the embodiments that are illustrated in the accompanying drawings and detailed in the following description of preferred embodiments. Descriptions of well-known components and processing techniques are omitted so as not to unnecessarily obscure the invention in detail.[0015]
• The term coupled, as used herein, is defined as connected, although not necessarily directly, and not necessarily mechanically. The term substantially, as used herein, is defined as approximately (e.g., preferably within 10% of, more preferably within 1% of, most preferably within 0.1% of).[0016]
• Methods for Protecting Circuit Device Materials[0017]
• Some embodiments according to a first aspect of the invention provide a method for protecting circuit device materials. Examples of these embodiments are depicted in FIGS. 1A, 1B,[0018]3A,3B,4A,4B, and4C. The method comprises mixing areactive material12A with a comparativelyinert material12B to form agetter12; placing the getter in thedevice10; applying energy to the getter; and responsive to applying the energy, distributing the getter inside the device. The comparative inertness is relative to the reactive material. For some embodiments as shown in FIG. 1B, a reflowedgetter composition22 covers anactive OLED area14. The reflowed getter composition can also be used to cover active areas of other optoelectronic devices including light detector arrays or solar cell arrays. Theinert material12B can comprise a binder. The placing can be accomplished by automated means.
• In some embodiments, as depicted in FIGS. 1B, 3B and[0019]4C, the method for protecting circuit device materials further comprises sealing the device. For these embodiments, the device can comprise an optoelectronic device. The optoelectronic device can include asubstrate16 and anactive OLED area14.
• For some of these embodiments, placing the[0020]getter12 can include placing the getter on a surface of acap18, sealing the device includes joining the cap to the substrate. Distributing thegetter12 can include transferring at least a portion of the getter to cover theactive OLED area14. Transferring at least a portion of thegetter12 to cover theactive OLED area14 can include heating the getter to a temperature in the range of 75 to 300 degrees Celsius, and can provide an encapsulated device after reflow of thegetter20 as shown in FIG. 1B. The portion of thegetter12 transferred to cover theactive OLED area14 can be greater than approximately eighty percent. Theactive OLED area14 can include a central portion and a periphery. Distributing thegetter12 can include covering at least 50% of the periphery of theactive OLED area14. The distributing can occur after final assembly of an encapsulated device before reflow of thegetter10 as shown in FIG. 1A.
• Some embodiments according to a second aspect of the invention provide a method for protecting circuit device materials. Examples of these embodiments are depicted in FIGS. 3A and 3B. The method comprises placing a[0021]reactive material12A on an interior surface of thedevice10; placing ameltable material12B upon the reactive material to substantially cover the reactive material; and in response to an application of energy to the meltable material, removing at least a portion of the meltable material, the removing exposing at least a portion of the reactive material. The circuit device can comprise an optoelectronic device including anactive OLED area14. The removing step can include heating themeltable material12B to a temperature in the range of 75 to 300 degrees Celsius. The removing step can further comprise covering substantially all of theactive OLED area14 with themeltable material12B. The method can further comprise sealing the device.
• The methods for protecting circuit devices according to some embodiments of this invention provide more flexible handling of the[0022]getter12 during fabrication of optoelectronic devices. The comparative size and shape of agetter12 with respect to the size and shape of the encapsulating cavity has an impact on the performance of the getter, and thus potentially the degradation of the optoelectronic device. For example, for large area but very thin devices such as flat panel displays, the permeation of water vapor and other potentially harmful gaseous species through theseal19 may cause some non-uniform degradation of the display at the periphery of the device if thegetter12 is placed only at the center of the device. The present invention enables modification of the shape and activity of thegetter12 after sealing of the device.
• Optoelectronic Devices[0023]
• Some embodiments according to a third aspect of the invention provide an optoelectronic device. Examples of these embodiments are depicted in FIGS. 1B, 3B and[0024]4C. The optoelectronic device comprises asubstrate16; an active device area placed on the substrate; and agetter12. Thegetter12 includes afirst material12B and areactive material12A. Thefirst material12B can be adapted to respond to energy input by at least one of: melting, phase change, or morphological change. An example of the active device area is shown in FIG. 3B as anactive OLED area14.
• The optoelectronic device can further comprise a[0025]seal19 joining thesubstrate16 to acap18. The at least one of: melting, phase change, and morphological change can result in reflowing of thefirst material12B. Prior to the reflowing, thegetter12 can be disposed on a recessed surface of thecap18. After the reflowing, thegetter12 can be disposed to cover a substantial portion of theactive OLED area14.
• The[0026]first material12B can comprise at least one of paraffin wax, low-density polyethylene, or Elvax® resin. Alternatively, thefirst material12B can comprise a binder, and thereactive material12A can be substantially dispersed within the binder.
• Cap[0027]
• Some embodiments according to a fourth aspect of the invention provide a[0028]cap18 for enclosing an optoelectronic device. Examples of these embodiments are depicted in FIG. 2C. Thecap18 comprises areactive material12A disposed on a cap surface; and aninert material12B placed to cover more than approximately fifty percent of the reactive material. Theinert material12B can be adapted to flow in response to application of energy to the inert material. Thecap18 can include an interior surface having a recessed portion. Theinert material12B can cover at least some of the recessed portion. In response to the application of energy, theinert material12B can melt. Theinert material12B can cover less than the entire recessed portion thereby leaving a cavity between the inert material and at least onesidewall18D of the recessed portion.
• Getter Composition[0029]
• Some embodiments according to a fifth aspect of the invention provide a getter composition. Examples of these embodiments are depicted in FIGS. 1B, 2C,[0030]3A, and4C. As shown in FIG. 1B, thereflowable getter composition12 can be formed as areactive material12A dispersed within aninert binder12B. As shown in FIG. 2C, the getter composition can comprise: areactive material12A disposed in an encapsulateddevice10, and aninert material12B disposed in the encapsulated device. Thereactive material12A is more reactive than at least one device material to desorbed matter and matter from a space within the device. The desorbed matter can be desorbed from at least one of: a substrate, a film disposed upon the substrate, and an encapsulation surface. Theinert material12B can be adapted to respond to energy input by at least one of: melting, phase change, or morphological change. Thereactive material12A can comprise an activated powder containing at least one of activated alumina, silica, zeolite, barium oxide, calcium oxide, calcium, and barium. Theinert material12B can comprise at least one of paraffin wax, low-density polyethylene, or Elvax® resin. Theinert material12B can comprise a binder, and thereactive material12A, e.g. activated powder can be mixed with the binder so that the reactive material is substantially dispersed in the binder.
• In some embodiments, the[0031]inert material12B responds to energy input by melting. Upon removal of the energy, theinert material12B solidifies. In some of these embodiments, each device material is adapted to provide enhanced performance of an optoelectronic device.
• Preparation of the Getter[0032]
• Preparation of the getter according to some embodiments of the invention, as exemplified in FIGS. 1A, 1B,[0033]1C,4A,4B and4C, is as follows:
• A[0034]getter12 comprised of anreactive material12A (activated powder) mixed with ainert material12B (binder) is selected to provide an equilibrium minimum humidity level lower than a humidity level to which the OLED device is sensitive when sealingly enclosed by an enclosure containing the getter;
• The activated powder can have a particle size range of about 0.1 to about 200 micrometers.[0035]
• The binder can be chosen for dispersing the selected activated powder therein. The[0036]inert material12B (binder) can be chosen from various classes of materials so that the binder can have a low moisture absorption rate; e.g., if the binder is selected from non polar hydrocarbons such as waxes, paraffins, polyolefins. Alternatively, theinert material12B (binder) can have a higher moisture absorption rate if selected from more polar materials such as low molecular weight acrylates, polyurethanes, polyamides. During reflow of theinert material12B, the moisture absorption rate of the binder may change.
• The[0037]inert material12B can be selected so that a blend can be formed of thereactive material12A (activated powder) and theinert material12B (e.g., wax) in a preferred weight fraction of the activated powder in the blend in a range of approximately 10% to 90%.
• A measured amount of the[0038]getter12 blend can then be applied on a portion of the upper interior surface of aglass cap18 by dispensing a measured amount of thegetter12 blend above the blend's melting point with a heated syringe dispensing system until the dispensed blend has spread along the interior surface to form areflowable getter layer12. However, because the blend can be re-melted after final assembly of the device, the dispensed blend can have any shape (such as a droplet), so that there is no need to initially dispense the blend uniformly onto the surface of the enclosure. The layer is then cooled to about room temperature until it solidifies to form asolid getter12 layer, so that the getter layer has the desired getter layer thickness (t) and covers the desired surface. Alternatively, thegetter12 composition can be shaped as a thin pellet whose shape and dimension are such that the pellet can fit in the cavity of the device to be protected, and this pellet can be placed inside the device cavity. The pellet can be placed directly on top of theactive OLED area14, or in thecap18. The placement can be accomplished either manually or through use of automatic pick-and-place equipment.
• The preparation of the[0039]getter12 according to other embodiments of the invention, as shown in FIGS. 2C, 3A, and3B, is as follows:
• A[0040]reactive material12A, e.g., an active getter, is selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive when sealingly enclosed by an enclosure containing the active getter.
• The[0041]reactive material12A can be a reactive metal such as barium.Reactive material12A can be deposited onto thecap18 by physical vapor deposition techniques, e.g., thermal evaporation or sputter deposition; or by chemical vapor deposition techniques. For some embodiments,reactive material12A can be a finely-divided powder of a reactive metal or an alkaline metal oxide and has a preferred particle size range of about 0.1 to about 200 micrometers. In some embodiments the particle size range is from 0.3 to 50 micrometers.
• A meltable[0042]inert material12B, e.g., a molten wax, can be chosen for coating thereactive material12A before reflow, and for coating theactive OLED area14 after reflow.
• A measured amount of the[0043]reactive material12A can be applied on a portion of the recessed interior surface of thecap18, for example by evaporation of a reactive metal, until thereactive material12A has formed a layer along the desired area of the recessed portion of the interior surface of the cap. Prior to placement of thereactive material12A on thecap18, the cap has apre-getter placement cavity18A. In some embodiments the portion of the recessed interior surface covered by thereactive material12A is in a range of 25% to 90%. Depending on the permeation rate of theseal19, the permeation rate of theinert material12B, the reaction rate of thereactive material12A, and the reaction rate of theactive area14 to be protected, the portion of the inner surface covered by thereactive material12A can be in the range of 10% to 99%. As shown in FIG. 2C and FIG. 3A, a volume of space underneath the cap after application ofreactive material12A is bounded by acap sidewall18D and the lateral extent of theinert material12B, and is referred to as thepre-reflow cavity18B. As shown in FIG. 3B,inert material12B has transferred to theactive OLED area14, the remainingreactive material12A extends towards thesidewall18D, and the volume of space underneath cap is referred to as thepost re-flow cavity18C. In some embodiments, thereactive material12A layer has a thickness in the range of about 0.1 micron to 10 microns.
• Under controlled conditions (e.g., low moisture atmosphere) a measured amount of[0044]inert material12B, e.g., meltable material, is then placed upon thereactive material12A (active getter). The meltableinert material12B covers substantially all of thereactive material12A, and in some embodiments also extends to cover a portion of the recessed portion of the interior surface of thecap18. Typically, the meltableinert material12B does not cover the entire length of the recessed portion of the interior surface. Once thereactive material12A has been covered with the meltableinert material12B, the active getter layer becomes much less susceptible to deactivation by ambient conditions (i.e., the active getter layer is less susceptible to loss of gettering capacity due to reactions with ambient gases), and thus the caps can be easier to handle in a mass production process. Thereactive material12A can be uncovered by melting and displacing the meltableinert material12B as needed to regain its gettering function.
EXAMPLES
• Specific embodiments of the invention will now be further described by the following, non-limiting examples which will serve to illustrate in some detail various features of significance. The examples are intended merely to facilitate an understanding of ways in which the invention may be practiced and to further enable those of skill in the art to practice the invention. Accordingly, the examples should not be construed as limiting the scope of the invention.[0045]
Example 1
• As shown in FIGS. 1A and 1B, a[0046]reflowable getter composition12 can be made (under controlled conditions, e.g, using a glove box where the oxygen and moisture concentration can be reduced to a very low level when mixing areactive material12A (e.g., activated powder) with aninert material12B (e.g., molten wax). The activatedpowder12A can be activated silica gel, alumina, activated zeolite powder, barium oxide (BaO) or other alkaline earth metal oxides, or barium (Ba) powder or other alkaline metals or alkaline earth metals. Theinert material12B can be natural or synthetic waxes, paraffin waxes, microcrystalline waxes, polyolefin resin waxes such as polyethylene, polypropylene, polybutene, polyethylene oxide, polypropylene oxide and their copolymers such as Elvax® resin from DuPont; ester waxes, polyurethane waxes, silicone resin waxes. Thegetter composition12 can be shaped as a thin tablet and placed into the enclosure of the device to be protected, such as encapsulated device beforereflow10.
• The encapsulated device before[0047]reflow10 is then sealed. In some embodiments as shown in FIG. 1A, the sealed encapsulated device beforereflow10 includes:reflowable getter composition12, anactive OLED area14, anOLED substrate16, a glass cap with acavity18, and at least oneepoxy seal19.
• Upon further processing, for example heating, the[0048]reflowable getter composition12 can melt and distribute itself evenly inside the device to form an encapsulated device aftergetter reflow20, as shown in FIG. 1B. In some optoelectronic devices where the thickness of the cavity is very small compared to the width and length of the device such as a flat panel display, it may be preferable that the getter material be uniformly distributed on the entire inner surface of the device. It has been observed that the shape of the getter material is important to protect such a display from degradation. If the getter material is placed in the center of the display, some degradation is observed on the periphery of the active area of the display. If the getter composition can be melted so that it distributes itself evenly inside the cavity, the periphery of the active layers of the display will be better protected since any moisture of oxygen permeating inside the device through the epoxy seal on the periphery will react first with the getter material.
Example 2
• According to some embodiments of the invention and as shown in FIG. 2B, an[0049]reactive material12A can be deposited (by evaporation or other means) onto aglass cap18. The active getter can be a reactive metal, such as barium. As shown in FIG. 2C, thereactive material12A can then be protected with a thin film of a metlableinert layer12B, such as paraffin wax, so that thecap18 can be manufactured and handled easily.
• As shown in FIGS. 3A and 3B, the[0050]cap18 can then be used to encapsulate a device, using anepoxy seal19 or other conventional means. The assembly is then subjected to thermal, or other, energy so that the metlableinert layer12B melts, exposing thereactive material12A to the atmosphere of the device on the one hand, and further protecting the active parts of the device by covering the inside of the device with a thin layer of wax, as shown in FIG. 3B.
• Preparation and Sealing of OLEDs with Reflowable Getters[0051]
• The[0052]reflowable getter12 can be advantageously used in the production of OLEDs. An appropriate amount of thegetter12 composition as described in Example 1 can be dispensed as a hot liquid onto a glass or ametal cap18 with a heated syringe and cooled down to room temperature so that the liquid getter composition solidifies. Thesubstrate16 having theactive OLED area14 can then be sealed with thiscap18 using a sealant such as a UV-curable epoxy adhesive. Once cured, the OLED assembly can be heated above the melting point of theinert material12B (wax/binder), thus causing the reflowable getter composition to flow inside the entire inner cavity, and evenly distributing the getter particles inside the device cavity. For some embodiments, theinert material12B (e.g., wax or binder) can wet and spread itself inside the device cavity because of the inert material's low surface tension, especially where thegetter12, in its molten state, is reasonably fluid and does not behave as a thixotropic liquid. In addition, theinert material12B (e.g., wax) can provide additional protection to theactive OLED area14.
• Alternatively, the[0053]reflowable getter12 can be placed (as a liquid droplet or as a solid tablet) directly on top of theactive OLED area14, as shown in FIG. 4A. Thecap18 can then be placed onto the OLED device with the appropriate sealant such as a UV-curable epoxy. For some embodiments, the sealing surfaces in contact with the sealing material are preferably very clean and not contaminated with materials used in the manufacturing process of the active OLED area, such as photoresists, solvents, or organic light emitting materials. Typically, the sealing area is cleaned by an ablation process just before encapsulation. After assembly and sealing of the device, thereflowable getter12 can be heated above its melting point, causing the getter to flow inside the cavity up to the edge of the sealing area. Such edge coverage is otherwise difficult to achieve without the risk of contaminating the sealing area.
• The effectiveness of a[0054]getter12 in an OLED device can be evaluated by measuring the dimensions of the light emitting areas (pixels) after exposure to a testing environment, with respect to the initial light emitting areas. Typically, the shrinkage of the light emitting areas is more severe at the periphery of the OLED display, close to the sealing area, especially when the getter is placed at the center of the cap. Uniformly reflowing thegetter12 inside the OLED cavity, provides more uniform shrinkage of the light emitting areas. In addition, theinert binder material12B provides additional protection to the active OLED area, in the case where the inert binder material has been reflowed over theactive OLED area14, as shown in FIGS. 3B and 4C.
• Various additions, modifications and rearrangements of the features of the invention may be made without deviating from the spirit and scope of the underlying inventive concept. It is intended that the scope of the invention as defined by the appended claims and their equivalents cover all such additions, modifications, and rearrangements. The appended claims are not to be interpreted as including means-plus-function limitations, unless such a limitation is explicitly recited in a given claim using the phrase “means-for.” Expedient embodiments of the invention are differentiated by the appended subclaims.[0055]

Claims (24)

What is claimed is:

1. A method for protecting circuit device materials, comprising:

mixing an reactive material with a comparatively inert material to form a getter, the comparative inertness relative to the reactive material;

placing the getter in the device;

applying energy to the getter; and

responsive to applying the energy, distributing the getter inside the device.

2. The method according toclaim 1, further comprising sealing the device, and wherein:

the device comprises an optoelectronic device, the optoelectronic device including a substrate and an active OLED area;

placing the getter includes placing the getter on a surface of a cap; and

sealing the device includes joining the cap to the substrate.

3. The method according toclaim 2, wherein distributing the getter includes transferring at least a portion of the getter to cover the active OLED area.

4. The method according toclaim 2, wherein at least one of the shape and activity of the getter is modified after the sealing of the device.

5. The method according toclaim 3, wherein transferring at least a portion of the getter to cover the active OLED area includes heating the getter to a temperature in the range of 75 to 225 degrees Celsius, and the portion of the getter transferred is greater than approximately eighty percent.

6. The method according toclaim 3, wherein:

the active OLED area includes a central portion and a periphery; and

distributing the getter includes covering at least 50% of the periphery.

7. The method according toclaim 6, wherein the distributing occurs after final assembly of the device.

8. The method according toclaim 1, wherein the inert material comprises a binder.

9. The method according toclaim 1, wherein the placing is accomplished by automated means.

10. A method for protecting circuit device materials, comprising:

placing a reactive material on an interior surface of the device;

placing a meltable material upon the reactive material to substantially cover the reactive material; and

in response to an application of energy to the meltable material, removing at least a portion of the meltable material, the removing exposing at least a portion of the reactive material.

11. The method ofclaim 10 wherein:

the circuit device comprises an optoelectronic devices and includes an active area;

the removing step includes heating the meltable material to a temperature in the range of 75 to 300 degrees Celsius, and the removing step further comprises covering substantially all of the active area with the meltable material.

12. The method ofclaim 10 further comprising sealing the device and wherein at least one of the shape and activity of the getter is modified after the sealing of the device.

13. An optoelectronic device comprising:

a substrate;

an active device area placed on the substrate; and

a getter including:

a first material adapted to respond to energy input by at least one of: melting, phase change, and morphological change; and

a reactive material.

14. The optoelectronic device ofclaim 13, wherein the first material comprises at least one of paraffin wax, low-density polyethylene, or Elvax® resin.

15. The optoelectronic device ofclaim 13, wherein:

the first material comprises a binder; and

the reactive material is substantially dispersed within the first material.

16. The optoelectronic device ofclaim 13, further comprising a seal joining the substrate to a cap; and wherein:

the at least one of: melting, phase change, and morphological change results in reflowing of the first material, and

prior to the reflowing, the getter is disposed on a recessed surface of the cap.

17. The optoelectronic device ofclaim 16, wherein after the reflowing, the getter is disposed to cover a substantial portion of the active device area.

18. A cap including a getter, the cap comprising:

a reactive material disposed on a cap surface; and

an inert material placed to cover more than approximately fifty percent of the reactive material, the inert material adapted to flow in response to application of energy to the inert material.

19. The cap ofclaim 18, wherein the cap includes an interior surface having a recessed portion.

20. The cap ofclaim 19, wherein:

the inert material covers at least some of the recessed portion; and

in response to the application of energy, the inert material melts.

21. The cap ofclaim 19, wherein the inert material covers less than the entire recessed portion thereby leaving a cavity between the inert material and at least one sidewall of the recessed portion.

22. A getter composition, comprising:

a reactive material disposed in an encapsulated device, the reactive material substantially more reactive than at least one device material to: matter desorbed from at least one surface of the device, matter from a space within the device, and matter permeating into the space within the device from outside the device; and

an inert material disposed in the encapsulated device, the inert material adapted to respond to energy input by at least one of: melting, phase change, or morphological change.

23. The composition ofclaim 22 wherein:

the reactive material comprises an activated powder containing at least one of activated alumina, silica, zeolite, barium oxide, calcium oxide, calcium, and barium; and

the inert material comprises at least one of paraffin wax, low-density polyethylene, or Elvax® resin.

24. The composition ofclaim 23 wherein the inert material comprises a binder and the activated powder is mixed with the binder, the activated material substantially dispersed in the binder.

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