US20040101421A1 - Micro-fabricated electrokinetic pump with on-frit electrode - Google Patents

Abstract

An electroosmotic pump and method of manufacturing thereof. The pump having a porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first second layers coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate. The continuous layer of electrically conductive porous material is preferably a thin film electrode, although a multi-layered electrode, screen mesh electrode and beaded electrode are alternatively contemplated. The thickness of the continuous layer is in range between and including 200 Angstroms and 10,000 Angstroms.

Description

RELATED APPLICATIONS
• This Patent Application is a continuation-in-part of co-pending U.S. patent application Ser. No. 10/366,121, filed Feb. 12, 2003 which claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Serial No. 60/413,194 filed Sep. 23, 2002, and entitled “MICRO-FABRICATED ELECTROKINETIC PUMP”. In addition, this Patent Application claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Serial No. 60/442,383, filed Jan. 24, 2003, and entitled “OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING”. The co-pending patent application Ser. No. 10/366,211 as well as the two co-pending Provisional Patent Applications, Serial Nos. 60/413,194 and 60/422,383 are also hereby incorporated by reference.[0001]
FIELD OF THE INVENTION
• The present invention relates to an apparatus for cooling and a method thereof. In particular, the present invention is directed to a frit based pump or electroosmotic pump with on-frit electrode and method of manufacturing thereof.[0002]
BACKGROUND OF THE INVENTION
• High density integrated circuits have evolved in recent years including increasing transistor density and clock speed. The result of this trend is an increase in the power density of modern microprocessors and an emerging need for new cooling technologies. At Stanford, research into 2-phase liquid cooling began in 1998, with a demonstration of closed-loop systems capable of 130 W heat removal. One key element of this system is an electrokinetic pump, which was capable of fluid flow on the order of ten of ml/min against a pressure head of more than one atmosphere with an operating voltage of 100V.[0003]
• This demonstration was carried out with liquid-vapor mixtures in the microchannel heat exchangers, because there was insufficient liquid flow to capture all the generated heat without boiling the liquid. Conversion of some fraction of the liquid to vapor imposes a need for high-pressure operation, and increases the operational pressure requirements for the pump. Furthermore, two phase flow is less stable during the operation of a cooling device and can lead to transient fluctuations and difficulties in controlling the chip temperature.[0004]
• In such small electrokinetic pumps, the position as well as the distance of the electrodes in relation to the porous structure is very important. Inconsistency in the distances between electrodes on each side of the porous structure pump result in variations in the electric field across the porous structure. These variations in the electric field affect the flow rate of the fluid through the pump and cause the pump to operate inefficiently. In prior art[0005]electroosmotic pumps10 as shown in FIG. 6, the electrodes12,14 are spaced apart periodically along the top andbottom surface18,20 of the pump. Voltage provided to the electrodes12,14 from a power source (not shown) creates an electric field across thepump10, whereby the electrical field generated by the electrodes12,14 forces the fluid to travel through the channels from the bottom side to the top side. Thus, variations in the electric field causes the porous structure to pump more fluid in areas where there is a stronger electric field and pump less fluid through areas where the electric field is weaker.
• Periodically spaced electrodes[0006]12,14 along thesurfaces18,20 of thepump10 can create a non-uniform electric field across theporous structure10. As shown in FIG. 6,cathodes12A-12F are placed apart from one another on thetop surface18 of thepump10, whereasanodes14B-14F are placed apart from one another on the bottom surface of thepump10. However, as shown in FIG. 6, theanode14B is directly below the cathode12B, but not directly below thecathode12A. Thus, an electric field is generated between theelectrodes12A and14B as well as theelectrodes12B and14B. It is well known that the electric field in between a pair of electrodes becomes greater as the distance between the pair of electrodes becomes smaller. Thus, the electrical field is dependent on the distance between electrodes12,14. In the pump shown in FIG. 6, the distance betweenelectrodes12A and14B is greater than the distance betweenelectrodes12B and14B. Therefore, the electrical field between theelectrodes12A and14B is weaker than the electrical field between theelectrodes12B and14B. Since, the variation in the electrical field across theporous structure10 causes inconsistencies in the amount of fluid pumped through different areas of thepump10 more fluid will be pumped through the areas of thepump10 where the electrical field is greater than the areas in thepump10 where the electrical field is weaker. For instance,electrodes12E and14C are located directly across thepump10 from one another and have a high electrical field therebetween. However, theelectrode12D is located proximal to, but not directly above, theanode14C, whereby current passes betweenanode14C andcathode12D and the voltage generates an electrical field therebetween. However, there may be little or no electrical field in theporous structure10 betweencathode12D andanode14E. The absence or lack of electrical field between theelectrodes12D and14E leaves the areas betweenelectrodes12D and14E of thepump10 with less current passing therethrough. As a result, less fluid is pumped through the portion betweenelectrodes12D and12E in thepump10.
• What is needed is an electrokinetic or electroosmotic pumping element that provides a relatively large flow and pressure within a compact structure and offers better uniformity in pumping characteristics across the pumping element.[0007]
SUMMARY OF THE INVENTION
• In one aspect of the invention, an electroosmotic pump comprises at least one porous structure which pumps fluid therethrough. The porous structure preferably has a first roughened side and a second roughened side. The porous structure has a first continuous layer of electrically conductive material with an appropriate first thickness disposed on the first side as well as a second continuous layer of electrically conductive material with a second thickness disposed on the second side. The first and second thicknesses is within the range between and including 200 Angstroms and 10,000 Angstroms. At least a portion of the first layer and the second layer allows fluid to flow therethrough. The pump also includes means for providing electrical voltage to the first layer and the second layer, thereby producing an electrical field therebetween. The providing means is coupled to the first layer and the second layer. The pump also includes an external means for generating power that is sufficient to pump fluid through the porous structure at a desired rate. The means for generating is coupled to the means for providing.[0008]
• In another aspect of the invention, an electroosmotic porous structure is adapted to pump fluid therethrough. The porous structure preferably includes a first rough side and a second rough side and a plurality of fluid channels therethrough. The first side has a first continuous layer of electrically conductive material that is deposited thereon. The second side has a second continuous layer of electrically conductive material that is deposited thereon. The first layer and the second layer are coupled to an external power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate.[0009]
• In yet another aspect of the invention, a method of manufacturing electroosmotic pump comprises the steps of forming at least one porous structure which preferably has a first rough side and a second rough side and a plurality of fluid channels therethrough. The method includes the step of depositing a first continuous layer of electrically conductive material of appropriate thickness to the first side which is adapted to pass fluid through at least a portion of the first layer. The method also includes the step of depositing a second continuous layer of electrically conductive material of appropriate thickness to the second side adapted to pass fluid through at least a portion of the second layer. The method further comprises the steps of coupling a power source to the first continuous layer and the second continuous layer and applying an appropriate amount of voltage to generate a substantially uniform electric field across the porous structure.[0010]
• In one embodiment, the electrically conductive material is disposed as a thin film electrode. Alternatively, the electrically conductive material is disposed as a screen mesh which has an appropriate electrically conductivity. Each individual fiber in the screen mesh is separated by a distance that is smaller or larger than a cross-sectional width of the porous structure. Alternatively, the electrically conductive material includes a plurality of conductive beads which have a first diameter and are in contact with one another to pass electrical current therebetween. In an alternative embodiment, at least one of the plurality of beads has a second diameter that is larger than the first diameter beads. Alternatively, a predetermined portion of the continuous layer of electrically conductive material has a third thickness, whereby the predetermined portion of the continuous layer is disposed on the surface of the porous structure in one or more patterns. In an alternative embodiment, at least a portion of an non-porous outer region of the porous structure is made of borosilicate glass, Quartz, Silicon Dioxide, or porous substrates with other doping materials. The electrically conductive material is preferably made of Platinum, but is alternatively made of other materials. In one embodiment, the first layer and the second layer are made of the same electrically conductive material. In another embodiment, the first layer and the second layer are made of different electrically conductive materials. The electrically conductive material is applied by variety of methods, including but not limited to: evaporation; vapor deposition; screen printing; spraying; sputtering; dispensing; dipping; spinning; using a conductive ink; patterning; and shadow masking.[0011]
• Other features and advantages of the present invention will become apparent after reviewing the detailed description of the preferred embodiments set forth below.[0012]
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1A illustrates a perspective view of the pumping element in accordance with the present invention.[0013]
• FIG. 1B illustrates a perspective view of the pumping element in accordance with the present invention.[0014]
• FIG. 2 illustrates a cross sectional view of the pump in accordance with the present invention.[0015]
• FIG. 3 illustrates the preferred embodiment frit having non-parallel pore apertures in accordance with the present invention.[0016]
• FIG. 4 illustrates a closed system loop including the pump of the present invention.[0017]
• FIG. 5A illustrates a schematic of an embodiment of the pump including the applied electrode layer in accordance with the present invention.[0018]
• FIG. 5B illustrates a schematic of an alternative embodiment of the pump including the applied electrode layer in accordance with the present invention.[0019]
• FIG. 5C illustrates a perspective view of the alternative embodiment of the pump including the applied electrode layer in accordance with the present invention.[0020]
• FIG. 5D illustrates a schematic view of an alternative embodiment of the pump including the applied electrode layer in accordance with the present invention.[0021]
• FIG. 5E illustrates a perspective view of the alternative embodiment of the pump including the applied electrode layer shown in FIG. 5D.[0022]
• FIG. 5F illustrates a perspective view of an alternative embodiment of the pump including the applied electrode layer in accordance with the present invention.[0023]
• FIG. 6 illustrates a schematic of a prior art pump having spaced apart electrodes.[0024]
• FIG. 7 illustrates a flow chart detailing a method of manufacturing the pump of the present invention.[0025]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
• Reference will now be made in detail to the preferred and alternative embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the preferred embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which are included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it should be noted that the present invention is able to be practiced without these specific details. In other instances, well known methods, procedures, components, and circuits have not been described in detail as not to unnecessarily obscure aspects of the present invention.[0026]
• The basic performance of an electrokinetic or electro-osmotic pump is modeled by the following relationships:[0027]$\begin{array}{cc}Q=\frac{\Psi \zeta }{\tau }\frac{\varepsilon \mathrm{VA}}{\mu L}\left(1-\frac{2\lambda I_1\left(a/{\lambda }_D\right)}{{\mathrm{aI}}_o\left(a/{\lambda }_D\right)}\right)& \left(1\right)\\ \Delta P=\frac{8\varepsilon \zeta V}{a^2}\left(1-\frac{2\lambda I_1\left(a/{\lambda }_D\right)}{{\mathrm{aI}}_o\left(a/{\lambda }_D\right)}\right)& \left(2\right)\end{array}$

  
• As shown in equations (1) and (2), Q is the flow rate of the liquid flowing through the pump and ΔP is the pressure drop across the pump and the variable a is the diameter of the pore aperture. In addition, the variable ψ is the porosity of the pore apertures, ζ is the zeta potential, ε is the permittivity of the liquid, V is the voltage across the pore apertures, A is the total Area of the pump, τ is the tortuosity, μ is the viscosity and L is the thickness of the pumping element. The terms in the parenthesis shown in equations (1) and (2) are corrections for the case in which the pore diameters approach the size of the charged layer, called the Debye Layer, λ[0028]_D, which is only a few nanometers. For pore apertures having a diameter in the 0.1 micrometer to 0.1 mm range, these expressions simplify to be approximately:$\begin{array}{cc}Q=\frac{\Psi \zeta }{\tau }\frac{\varepsilon \mathrm{VA}}{\mu L}& \left(3\right)\\ \Delta P=\frac{8V}{a^2}& \left(4\right)\end{array}$

  
• As shown in equations (3) and (4). The amount of flow and pressure are proportional to the amount of voltage potential that is present. However, other parameters are present that affect the performance of the pump. For example, the tortuosity (τ) describes the length of a channel relative to the thickness of the pumping element and can be large for pumps with convoluted, non-parallel channel paths. The length (L) is the thickness of the pumping element. As shown in equations (3) and (4), the tortuosity τ and thickness L of the pumping element are inversely proportional to the flow equation (4) without appearing at all in the pressure equation (4). The square of the diameter a of the pore apertures is inversely proportional to the pressure equation (4) without appearing at all in the flow equation (3).[0029]
• FIG. 1A illustrates one embodiment of the[0030]pump100 in accordance with the present invention. It should be noted the individual features of thepump100 shown in the figures herein are exaggerated and are for illustrative purposes. Thepump100 includes a pumping element orbody102 and asupport element104. Thepumping element102 includes a thin layer of silicon with a dense array of cylindrical holes, designated aspore apertures110. Alternatively, thepumping element102 is made of any other appropriate material. The pumping element has a thickness range of 10 microns to 10 millimeters and thepore apertures110 have a diameter of 0.1-2.0 microns. In addition, thepumping element102 includeselectrode118 on its surface, whereby the electrodes on either sides of thepumping element102 drive the fluid through thepumping element102. In particular, the voltage applied to thepumping element102 causes the negatively electrically charged ions in the liquid to be attracted to the positive voltage applied to the top surface of thepumping element102. Therefore, the voltage potential between the top and bottom surface of the pumping element drives the liquid through thepore apertures110 to the top surface, whereby the liquid leaves thepump100 at substantially the same temperature as the liquid entering the pump.
• As shown in FIGS. 1 and 2, the[0031]pumping element102 is alternatively supported by thesupport element104 having a less dense array of much larger holes orsupport apertures108. It should be noted that thesupport element104 is not required, whereby thepump100 is operational without thesupport element104. Theoptional support element104 provides mechanical support to thepumping element102. Theoptional support element104 made of Silicon has a thickness of 400 microns. The support apertures108 are at least 100 microns in diameter. It is apparent to one skilled in the art that other thicknesses and diameters are contemplated. The illustration of thesupport structures108 in FIG. 1A is only one type of configuration and it should be noted that other geometric structures is alternatively used to balance mechanical strength with ease of fabrication. Such alternative structures include a honeycomb lattice of material, a square lattice of material, a spiderweb-lattice of material, or any other structural geometry that balances mechanical strength with ease of fabrication. FIG. 1B illustrates an example of asquare lattice structure100′.
• FIG. 2 illustrates a cross sectional view of the[0032]pump100 of the present invention. As shown in FIG. 2, thepumping element102 includes a dense array ofpore apertures110 and thesupport element104 attached to thepumping element102, whereby thesupport element104 includes an array ofsupport structures106. Thepore apertures110 pass through thepumping element102 between itsbottom surface114 to itstop surface112. In particular, thepore apertures110 channel liquid from thebottom surface114 to thetop surface112 of thepumping element102 and are substantially parallel to each other, as shown in FIG. 2. The liquid used in thepump100 of the present invention is water with an ionic buffer to control the pH and conductivity of the liquid. Alternatively, other liquids are used including, but not limited to, acetone, acetonitrile, methanol, alcohol, ethanol, water having other additives, as well as mixtures thereof. It is contemplated that any other suitable liquid is contemplated in accordance with the present invention.
• The[0033]support structures106 are attached to thepumping element102 at predetermined locations of thebottom surface114 of thepumping element102. These predetermined locations are dependent on the required strength of thepump100 in relation to the pressure differential and flow rate of the liquid passing through thepumping element102. In between eachsupport structure106 is asupport aperture108, whereby the liquid passes from thesupport apertures108 into thepore apertures110 in thebottom surface114 of thepumping element102. The liquid then flows from thebottom pore apertures110 through the channels of each pore apertures and exits through thepore apertures110 opening in thetop surface112 of thepumping element102. Though the flow is described as liquid moving from thebottom surface114 to thetop surface112 of thepumping element102, it will be apparent that reversing the voltage will reverse the flow of the liquid in the other direction.
• The liquid passes through the[0034]pumping element102 under the process of electo-osmosis, whereby an electrical field is applied to thepumping element102 in the form of a voltage differential. As shown in FIG. 2, electrode layers116,118 are disposed on thetop surface112 andbottom surface114 of thepumping element102, respectively. The voltage differential supplied by theelectrodes118,116 between thetop surface112 and thebottom surface114 of thepumping element102 drives the liquid from the area withinsupport apertures108 up through thepore apertures110 and out throughtop surface112 of thepumping element102. Although the process of electro-osmosis is briefly described here, the process is well known in the art and will not be described in any more detail.
• FIG. 3 illustrates a preferred embodiment of the pumping element of the present invention. Preferably, the[0035]pumping element300 shown in FIG. 3 includes a body having atop surface308 and abottom surface306. Thebody302 includespore apertures316 in thetop surface308 and poreapertures314 in thebottom surface306. Thebody302 includes severalnon-parallel conduits304 that channel fluid from thepore apertures314 in thebottom surface306 to thepore apertures316 in thetop surface308. In one embodiment, thepore apertures314 and thepore apertures316 are not evenly spaced to be aligned across the height dimension of thepump body302. In another embodiment, thepore apertures314 and316 are aligned across the height dimension of thepump body302.
• In one embodiment, at least one of the[0036]conduits304 has a uniform diameter between thepore apertures314,316. In another embodiment, at least one of theconduits304 has a varying diameter between thepore apertures314,316. In another embodiment, two ormore conduits305 in thepump body302 are cross connected, as shown in FIG. 3. Thepump structure300 in FIG. 3 is advantageous, because it is manufacturable at a very low cost using a glass sintering process which is well known in the art. Once the basicporous glass body302 has been produced, it is possible to deposit or form theelectrodes312,310 directly on the top andbottom surfaces308,306 of thepumping structure300 using any appropriate method as discussed below.
• FIG. 5A illustrates a schematic view of the[0037]pump500 having the electrode layer applied thereto in accordance with the present invention. Thepump500 includes thepump body502 with a dense array ofpore apertures501 in thebottom surface506 and poreapertures503 in thetop surface508. Thepump body502 includesconduits504 which channel fluid from thebottom side506 and thetop side508 of thebody502. Thepump500 in FIG. 5A is shown to have straight andparallel pore apertures504 for exemplary purposes. However, as stated above, thepump500 preferably has a pump body which includes non-parallel and non straight pore apertures and conduits, as shown in FIG. 3.
• A layer of the[0038]electrode510 is disposed upon thebottom side506 of thebody502. In addition, a layer of theelectrode512 is applied to the top side of thebody502. Thepump500 is coupled to anexternal power source514 and anexternal control circuit516 by a pair ofwires518A and518B. Alternatively, any other known methods of coupling thepower source514 andcircuit516 to thepump500 are contemplated. The power source is any AC or DC power unit which supplies the appropriate current and voltage to thepump500. Thecontrol circuit516 is coupled to thepower source514 and variably controls the amount of current and voltage applied to thepump500 to operate the pump at a desired flowrate.
• The[0039]electrode layer510 on thetop surface508 is a cathode electrode and theelectrode layer512 on thebottom surface506 is an anode electrode. The electrode layers510,512 are made of a material which is highly conductive and has porous characteristics to allow fluid to travel therethrough. The porosity of the electrode layers510,512 are dependent on the type of material used. The electrode layers510,512 also have a sufficient thickness which generate the desired electrical field across thepump500. In addition, the thickness and composition of material in the electrode layers510,512 allow the electrode layers510,512 to be applied to the pump body surfaces506,508 which have a particular roughness. Alternatively, the pump body surfaces506,508 are smooth, whereby the electrode layers510,512 are applied to thesmooth surfaces506,508. The electrode layers510,512 preferably provide a uniform surface along both sides of thepump body502 to generate a uniform electric field across thepump500.
• The electrode layers[0040]510,512 are disposed on thesurfaces506,508 of thepump body502 as a thin film, as shown in FIG. 5A. Alternatively, the electrode layers510,512 are disposed on thesurfaces506,508 as a stratum of multiple layers of film, as shown in FIG. 5B. In another embodiment, the electrode layers510,512 include a several small spheres aligned along the surface and in contact with one another, as shown in FIG. 5D. It should be noted that other configurations of the electrode layers are contemplated by one skilled in the art, wherein the electrode layer generates a substantially uniform electrical field and allows fluid to pass therethrough.
• As shown in FIG. 5A, the thin film of electrode has an even, consistent thickness along the entire surfaces of the[0041]pump body502. In one embodiment, the thin film is continuous along the entire surface of thepump body502, whereby there are no breaks, cracks, or discontinuity in thefilms510,512. In one embodiment, the thin films ofelectrodes510,512 are evenly spaced apart from each other across thepump body502. In addition, the thin films ofelectrodes510,512 have the same thickness so that the electrode layers510,512, when charged, generate a uniform electric field across thepump body502. Thethin film electrodes510,512 have a thickness such that the electrode is continuous over thepump body502 surface and also allows fluid to travel through thepump body502. The thickness of the electrode is within the range of and including 200 and 100,000 Angstroms and preferably has a thickness of 1000 Angstroms. However, it is preferred that theelectrodes510,512 has a thickness to provide a modest resistance path, such as less than 100 ohms, from one edge of the pumping element to the other edge.
• Alternatively, the[0042]pump body502 is configured with multiple layers of electrodes618,620 as shown in FIG. 5B. FIG. 5C illustrates a perspective view of thepump600 shown in FIG. 5B. As shown in FIG. 5C, thepump500 has a disk shape. However, it is contemplated that thepump500 alternatively has any other shape and is not limited to the shape shown in FIG. 5C. Thepump600 in FIG. 5B is shown to have straight andparallel pore apertures604 for exemplary purposes. However, as stated above, thepump600 includes non-parallel and non straight pore apertures, as shown in FIG. 3.
• The[0043]pump600 includes athin film electrode612 disposed on thetop surface608 as well as anotherthin film electrode610 disposed on thebottom surface606. In addition, as shown in FIGS. 5B and 5C, thepump600 includes a second electrode layer618,620 disposed on top of thethin film electrode610,612. The combinedthin film electrode612 and additional electrode layer thereby forms a multi-layer electrode618,620. In one embodiment, the additional electrode layer applied to thethin film electrode610,612 is made of the same material, thereby forming a homogeneous multi-layer electrode618,620. Alternatively, the additional electrode layer applied to thethin film electrode610,612 is made of a different material, thereby forming a composite multi-layer electrode618,620.
• The multi-layer electrodes[0044]618,620 are disposed at predetermined locations along the top andbottom surfaces610,612 of thepump600. As shown in FIG. 5B, themulti-layer electrodes618B,620B disposed on thebottom surface606 of thepump600 are disposed to be in the same location opposite of themulti-layer electrodes618A,620A. Alternatively, themulti-layer electrodes618B,620B on thebottom surface606 are disposed not to be in the same location opposite from themulti-layer electrodes618A,620A.
• As shown in FIG. 5C, the multi-layer electrodes are disposed as two concentric rings or[0045]circles618A,618B,620A,620B on thetop surface608 and the bottom surface606 (FIG. 5B). It is apparent to one skilled in the art that the multi-layer electrodes618,620 are alternatively disposed as any number of concentric circles. Alternatively, any number of concentric circles are contemplated on the top andbottom surfaces608,606 of thepump600. It is apparent to one skilled in the art that it is not necessary that the multi-layered electrodes618,620 be disposed as concentric circles, and alternatively have any other appropriate design or configuration. In addition, the electrode layers disposed on top of thethin film electrodes610,612 are shown in FIGS. 5B and 5C as having a semi-circular cross section. However, the additional electrode layers disposed on thethin film610,612 alternatively have any other cross-sectional shape, including but not limited to square, rectangular, triangular and spherical.
• In one embodiment, the additional electrode layer is disposed on the surface of the pump as a circular ring with respect to the center. Alternatively, the additional electrode layer is disposed along the surface of the[0046]pump700 in any other configuration, including, but not limited to, cross-hatches, straight line patterns and parallel line patterns. In another embodiment, thepump600 alternatively has the multi layer electrodes618,620 which cover a substantial area of thepump surface606,608, whereby thethin film electrodes610,612 form notches or indents into the multi layer electrode surfaces618,620. Thus, a smaller electrical field is present proximal to the locations of the notches, whereas a larger electrical field is present elsewhere across thepump body600.
• In comparison to the[0047]thin film electrodes610,612, the multilayer electrodes618 are capable of distributing larger total currents without generating large voltage drops. In some cases, these currents are as large as 500 mA, whereby the total resistance of the electrode is less than 10 ohms. The multilayer electrodes618 provide a number of very low-resistance current paths from one edge of the pumping element to other locations on the surface of the pumping element. The thicker electrodes in this design will block a portion of the pores within the pump body, thereby preventing fluid to flow through the pump at those pore locations. It should be noted that all of the pores are not blocked, however. In one embodiment, the thicker electrode regions occupy no more than 20% of the total area of the pumping element. Therefore, at least 80% of the pores in the pumping element are not blocked and are available to pump the fluid therethrough.
• FIG. 5D illustrates another alternative embodiment of the pump of the present invention. The[0048]electrode layer710,712 include several spherical beads in contact with the top andbottom surface708,706 of thepump700 as well as in contact with one another. Thepower source714 andcontrol circuit706 are coupled to thebeaded electrode layer711 to supply current and voltage thereto. Thepump700 in FIG. 5D is shown to have straight andparallel pore apertures701,703 and conduits704 for exemplary purposes. However, as stated above, thepump700 alternatively includes non-parallel and non straight pore apertures, as shown in FIG. 3. As shown in FIG. 5D, a pair of connectingwires718A,718B are coupled to the beaded electrode layers, whereby the connectingwires718A,718B deliver current to electrode layers711. Thewires718A,718B are coupled to anexternal power source714 as well as acontrol circuit716.
• The[0049]beads711 are made of an electrically conductive material and are in contact with one another along the entire surface of thepump body702. Alternatively, thebeaded electrode layer711 is disposed partially on the surface of thepump body702. Thebeads711 allow electrical current to pass along the top andbottom surface712,710 of thepump body702 to form a voltage potential across thepump700. Thebeads711 are spherical and have a diameter range in between and including 1 micron and 500 microns. In one embodiment, the diameter of thebeads711 is 100 microns such that the beads do not block the pores in the pumping element while providing uniform distribution of the electric field and current which is larger than 1 millimeter in area. Thebeads711 in the electrode layers710,712 are in contact with the corresponding top andbottom surfaces708,706 of thepump body702. Due to the spherical shape of thebeads711, small gaps or openings are formed in between thebeads711 when placed in contact with one another. Fluid is thereby able to flow through thepump body702 by flowing through the gaps in between thebeads711 in the bottom andtop electrode layers710,712. It is preferred that thebeads711 are securely attached to the top andbottom surfaces706,708 of thepump body702 and do not detach from thepump body702 due to the force from the fluid being pumped therethrough. However, it is understood that thebeads711 are alternatively placed in any other appropriate location with respect to thepump body702. For instance, thebeads711 are not attached tosurfaces706,708, but are alternatively packed tightly within an enclosure (not shown), such as a glass pump housing, which houses thepump body702.
• Alternatively, the[0050]beaded electrode layer711 is configured to have a predetermined number oflarger diameter beads713 among the smaller diameter beads in thebeaded electrode layer711. Thelarger beads713 are within the range and including 100 microns and 500 microns, whereas the smaller beads (not shown) are within the range and including 1 micron and 25 microns. With respect to the surface of the pump body, thelarger diameter beads713 will present a thicker electrode layer than the smaller diameter beads. As with the multi-layer electrodes618,620 (FIG. 5C), thelarger diameter beads713 are placed in predetermined locations of thepump body702 such that the fluid is able to sufficiently flow through thepump body702. As shown in FIG. 5E, thelarger beads713 are disposed in a circular ring among thesmaller beads711. Alternatively, thelarger beads713 are disposed along the surface of thepump700 in any other configuration. It should be noted that thespherical beads711 are alternatively disposed on thethin film electrodes510,512 in FIG. 5A.
• In the above figures, the[0051]cathode electrode512 andanode electrodes510 are charged by supplying voltage from thepower source514 to theelectrodes510,512. As shown in FIGS. 5A and 5D, the power source is coupled to thepump500 by a pair ofwires518A,518B, whereby thewires518A,518B are physically in contact with the electrode layers510,512. Alternatively, as shown in FIG. 5B, the outer perimeter of the pump in FIG. 5B is made of solid fused-glass622, whereby thewires624A,624B are physically coupled to the conducting surface on the fusedglass portion622 and provide electrical current to theelectrodes610,612 through the conducting surface on fusedglass portion622.
• The fused[0052]glass portion622 of thepump600 provides one or more rigid non-porous surfaces to attach thepump600 to a pump housing (not shown) or other enclosure. The fusedglass portion622 is attached to one or more desired surfaces by soldering, thereby avoiding the use of solder wicking through the frit and shorting out thepump600. It is apparent to one skilled in the art that other methods of attaching the fusedglass portion622 to the desired surfaces are contemplated. The fused glass is preferably made of borosilicate glass. Alternatively, other glasses or ceramics are used in the outer perimeter of the pump including, but not limited to Quartz, pure Silicon Dioxide and insulating ceramics. In one embodiment, thepump600 includes the fusedglass portion622 along the entire outer perimeter. In another embodiment, thepump600 includes the fusedglass portion622 along one side of thepump body602. In addition, it is contemplated that the fusedglass portion622 is not limited to the embodiment in FIG. 5B, and are also be applied to the other pump embodiments.
• It is apparent to one skilled in the art that other electrode layer configurations are contemplated in accordance with the present invention. For instance, as shown in FIG. 5F, the[0053]pump800 includes a dense screen orwire mesh804 coupled thereto. In particular, thescreen electrode804 is made or treated to be electrically conductive and is coupled to the top and/orbottom surface812 of thepump body802. In one embodiment, thescreen electrode804 is mechanically coupled to thesurface812 of thepump body802. In another embodiment, thescreen electrode804 is coupled to the surface of thepump body802 by anadhesive material814. Alternatively, thescreen electrode804 is disposed on the thin film electrode (FIG. 5A). As shown in FIG. 5F, thescreen electrode804 includes several apertures within the lattice configuration of fibers, whereby the fluid flows through the apertures. In one embodiment, the individual fibers in thescreen electrode804 are separated by a distance smaller than the distance in between the top812 andbottom surfaces810 of thepump body802. In another embodiment, the individual fibers in thescreen electrode804 are separated by a distance larger than or equal to the distance in between the top812 andbottom surfaces810 of thepump body802.
• The method of manufacturing the pump of the present invention will now be discussed. The pumping structure is formed initially by any appropriate method, as in[0054]step200 in FIG. 7. The pump of the present invention is manufacturable several different ways. Preferably, non-parallel, complex shaped pore apertures511 shown in FIG. 3 in the frit pump are fabricated by sintering or pressing powders into the pump element material. For example, sintered borosilicate glass disks are fabricated for industrial water filtration applications, and are suitable for this application. Other sintered powders including but not limited to Silicon Nitride, Silicon Dioxide, Silicon Carbide, ceramic materials such as Alumina, Titania, Zirconia are alternatively used. In these cases, the pores are irregular and nonuniform, but the fabrication process is extremely inexpensive. Alternatively, the pump is made by a series of lithographic/etching steps, such as those used in conventional integrated circuit manufacturing, to make parallel pore apertures (FIGS.5A-5D) or non-parallel pore apertures511 (FIG. 3). Details of these manufacturing steps are discussed in co-pending U.S. patent application Ser. No. 10/366,121, filed Feb. 12, 2003 and entitled, “MICRO-FABRICATED ELECTROKINETIC PUMP,” which is hereby incorporated by reference.
• Once the pumping element is formed by any of the above processes, the electrodes are formed onto the pump. Referring to FIGS.[0055]5A-5D, theelectrodes510,512 are fabricated from materials that do not electrically decompose during the operation of the pump. The electrode layers are preferably made from Platinum. Although the electrodes are made from other materials including, but not limited to, Palladium, Tungsten, Nickel, Copper, Gold, Silver, Stainless Steel, Niobium, Graphite, any appropriate adhesive materials and metals or a combination thereof. It is preferred that thecathode electrodes512 are made from the same material as theanode electrodes510, although it is not necessary. For instance, in some pumped fluid chemistries, the cathode electrodes and anode electrodes are made of different materials to properly support operation of the pump.
• In the preferred embodiment, the[0056]electrode layer312 is formed on thetop surface308 of thepumping element body302 as instep202. In addition, theelectrode layer314 is formed on thebottom surface306 of thepumping element body302 as instep204. Some application methods of the electrode layer onto the pump include but are not limited to: sputtering, evaporating, screen printing, spraying, dispensing, dipping, spinning, conductive ink printing, chemical vapor deposition (CVD), plasma vapor deposition (PVD) or other patterning processes.
• The multi-layer electrodes described in relation to FIGS. 5B and 5C are applied to the pump by disposing additional electrode layers at desired locations on the surface or surfaces of the pumping structure as in[0057]step206 in FIG. 7. Additional electrode layers are applied to thepump600 by depositing metal or silver epoxy onto thethin film electrode610,612. Other conventional methods include, but are not limited to, using conductive ink, screen printing, patterning, shadow masking, and dipping.
• In relation to FIGS. 5D and 5E, the beaded electrode layers[0058]710,712 are applied to thepump700 using a variety of conventional methods, including, but not limited to, screen printing, sputtering, evaporating, dispensing, dipping, spinning, spraying or dense packing in the package. The above mentioned methods are well known in the art and are not discussed in detail herein. It should be noted that the electrodes coupled to the pumping element of the present invention are not limited to the methods described above and encompass other appropriate methods known in the art.
• Relating back to FIG. 3, once the[0059]electrodes310,312 are formed onto thepump300, theelectrical connectors318A,318B are coupled to theelectrodes310,312 respectively, as instep208. Preferably, the electrical connectors are318A,318B are placed in physical contact with the electrode layers310,312. Alternatively, theelectrical connectors318A,318B are coupled to the conducting surface on the fusedglass portion622 of the pump body (FIG. 5B). Following, thepower source314 is coupled to the electrode layers310,312, as instep210, whereby thecontrol circuit320 controls the amount of current and voltage supplied to the electrode layers310,312.
• FIG. 4 illustrates a cooling system for cooling a fluid passing through a heat emitting device, such as a microprocessor. As shown in FIG. 4, the system is a closed loop whereby liquid travels to an element to be cooled, such as a[0060]microprocessor602, whereby heat transfer occurs between the processor and the liquid. After the leaving themicroprocessor602, the liquid is at an elevated temperature of more than 55° C. and enters theheat exchanger604, wherein the liquid is cooled to less than 45° C. The liquid then enters thepump600 of the present invention at a lower temperature. Again, referring to FIG. 2, within thepump100, the cooled liquid enters thesupport apertures108 and is pumped through thepore apertures110 by the osmotic process described above.
• The present invention has been described in terms of specific embodiments incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that modifications may be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention.[0061]

Claims (76)

What is claimed is:

1. A electroosmotic pump comprising:

a. at least one porous structure for pumping fluid therethrough, the porous structure having a first side and a second side and having a first continuous layer of electrically conductive porous material having an appropriate first thickness disposed on the first side and a second continuous layer of electrically conductive porous material having a second thickness disposed on the second side, wherein at least a portion of the porous structure is configured to channel flow therethrough; and

b. means for providing electrical voltage to the first layer and the second layer to produce an electrical field therebetween, wherein the means for providing is coupled to the first layer and the second layer.

2. The electroosmotic pump according toclaim 1 further comprising means for generating power sufficient to pump fluid through the porous structure at a desired rate, wherein the means for generating is coupled to the means for providing.

3. The electroosmotic pump according toclaim 1 wherein the porous structure includes a plurality of fluid channels extending between the first side and the second side.

4. The electroosmotic pump according toclaim 1 wherein the first side and the second side are roughened.

5. The electroosmotic pump according toclaim 3 wherein the plurality of fluid channels are in a straight parallel configuration.

6. The electroosmotic pump according toclaim 3 wherein the plurality of fluid channels are in a non-parallel configuration.

7. The electroosmotic pump according toclaim 3 wherein at least two of the plurality of fluid channels are cross connected.

8. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is disposed as a thin film electrode.

9. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is disposed as a screen mesh having an appropriate electrically conductivity.

10. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material includes a plurality of conductive beads having a first diameter in contact with one another to pass electrical current.

11. The electroosmotic pump according toclaim 10 wherein at least one of the plurality of beads has a second diameter larger than the first diameter.

12. The electroosmotic pump according toclaim 1 wherein a predetermined portion of the continuous layer of electrically conductive porous material has a third thickness.

13. The electroosmotic pump according toclaim 12 wherein the predetermined portion of the continuous layer is disposed on the surface of the porous structure in one or more desired patterns.

14. The electroosmotic pump according toclaim 13 wherein at least one of the desired patterns further comprises a circular shape.

15. The electroosmotic pump according toclaim 13 wherein at least one of the desired patterns further comprises a cross-hatched shape.

16. The electroosmotic pump according toclaim 13 wherein at least one of the desired patterns further comprises a plurality of parallel lines.

17. The electroosmotic pump according toclaim 1 wherein at least a portion of an outer region of the porous structure is made of fused non-porous glass.

18. The electroosmotic pump according toclaim 1 wherein the first thickness is within the range between and including 200 Angstroms and 10,000 Angstroms.

19. The electroosmotic pump according toclaim 1 wherein the second thickness is within the range between and including 200 Angstroms and 10,000 Angstroms.

20. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is Platinum.

21. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is Palladium.

22. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is Tungsten.

23. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is Copper.

24. The electroosmotic pump according toclaim 1 wherein the electrically conductive porous material is Nickel.

25. The electroosmotic pump according toclaim 1 further comprising an adhesion material disposed in between the electrically conductive porous material and the porous structure.

26. The electroosmotic pump according toclaim 1 wherein the first layer and the second layer is made of the same electrically conductive porous material.

27. The electroosmotic pump according toclaim 1 wherein the first layer and the second layer is made of different electrically conductive porous materials.

28. An electroosmotic porous structure adapted to pump fluid therethrough, the porous structure comprising a first side and a second side, the porous structure having a plurality of fluid channels therethrough, the first side having a first continuous layer of electrically conductive porous material deposited thereon and the second side having a second continuous layer of electrically conductive porous material deposited thereon, the first layer and the second layer coupled to a power source, wherein the power source supplies a voltage differential between the first layer and the second layer to drive fluid through the porous structure at a desired flow rate.

29. The electroosmotic porous structure according toclaim 28 wherein the plurality of fluid channels extend from the first side to the second side in a straight parallel configuration.

30. The electroosmotic porous structure according toclaim 28 wherein the plurality of fluid channels extend from the first side to the second side in a non-parallel configuration.

31. The electroosmotic porous structure according toclaim 28 wherein at least two of the plurality of fluid channels are cross connected.

32. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material is a thin film electrode.

33. The electroosmotic porous structure according toclaim 28 wherein the first layer of electrically conductive porous material is a screen mesh.

34. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material further comprises a plurality of conductive beads having a first diameter in contact with one another to pass electrical current.

35. The electroosmotic porous structure according toclaim 34 wherein at least one of the plurality of beads has a second diameter larger than the first diameter.

36. The electroosmotic porous structure according toclaim 28 wherein a predetermined portion of the continuous layer of electrically conductive porous material has a third thickness.

37. The electroosmotic porous structure according toclaim 36 wherein the predetermined portion of the continuous layer is disposed on the surface of the porous structure in one or more desired patterns.

38. The electroosmotic porous structure according toclaim 28 wherein at least a portion of an outer region of the porous structure is made of fused non-porous glass.

39. The electroosmotic porous structure according toclaim 28 wherein the continuous layer has a thickness within the range between and including 200 Angstroms and 10,000 Angstroms.

40. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material is Platinum.

41. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material is Palladium.

42. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material is Tungsten.

43. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material is Nickel.

44. The electroosmotic porous structure according toclaim 28 wherein the electrically conductive porous material is Copper.

45. The electroosmotic porous structure according toclaim 28 further comprising an adhesion material disposed in between the electrically conductive porous material and the porous structure.

46. A method of manufacturing an electroosmotic pump comprising the steps of:

a. forming at least one porous structure having a first side and a second side and a plurality of fluid channels therethrough;

b. depositing a first continuous layer of electrically conductive porous material of appropriate first thickness to the first side adapted to pass fluid through at least a portion of the portion of the first layer; and

c. depositing a second continuous layer of electrically conductive porous material of appropriate second thickness to the second side adapted to pass fluid through at least a portion of the second layer.

47. The method according toclaim 46 wherein the plurality of fluid channels extend from the first side to the second side in a straight parallel configuration.

48. The method according toclaim 46 wherein the plurality of fluid channels extend from the first side to the second side in a non-parallel configuration.

49. The method according toclaim 46 further comprising the steps of:

a. coupling a power source to the first continuous layer and the second continuous layer; and

b. applying an appropriate amount of voltage to generate a substantially uniform electric field across the at least one porous structure.

50. The method according toclaim 49 wherein the power source is coupled to the first and second continuous layers via a pair of wires.

51. The method according toclaim 46 wherein the layer of electrically conductive porous material is a thin film.

52. The method according toclaim 46 wherein the electrically conductive porous material is a screen mesh.

53. The method according toclaim 52 further comprising the step of mechanically clamping the screen mesh to the porous structure.

54. The method according toclaim 46 wherein the layer of electrically conductive porous material includes a plurality of conductive beads in contact with one another.

55. The method according toclaim 46 wherein a predetermined portion of the layer of electrically conductive porous material has a third thickness.

56. The method according toclaim 46 wherein at least a portion of an outer region of the porous structure is made of fused non-porous glass.

57. The method according toclaim 46 wherein the first thickness is within the range between and including 200 Angstroms and 10,000 Angstroms.

58. The method according toclaim 46 wherein the second thickness is within the range between and including 200 Angstroms and 10,000 Angstroms.

59. The method according toclaim 46 wherein the electrically conductive porous material is Platinum.

60. The method according toclaim 46 wherein the electrically conductive porous material is Copper.

61. The method according toclaim 46 wherein the electrically conductive porous material is Palladium.

62. The method according toclaim 46 wherein the electrically conductive porous material is Tungsten.

63. The method according toclaim 46 wherein the electrically conductive porous material is Nickel.

64. The method according toclaim 46 further comprising the step of depositing an adhesion material to a surface of the electrically conductive porous material.

65. The method according toclaim 46 further comprising an adhesion material disposed in between the electrically conductive porous material and the second side of the porous structure.

66. The method according toclaim 46 wherein the electrically conductive porous material is applied by an evaporation process.

67. The method according toclaim 46 wherein the electrically conductive porous material is applied by a vapor deposition process.

68. The method according toclaim 46 wherein the electrically conductive porous material is applied by a screen printing process.

69. The method according toclaim 46 wherein the electrically conductive porous material is applied by a spraying process.

70. The method according toclaim 46 wherein the electrically conductive porous material is applied by a sputtering process.

71. The method according toclaim 46 wherein the electrically conductive porous material is applied by a dispensing process.

72. The method according toclaim 46 wherein the electrically conductive porous material is applied by a dipping process.

73. The method according toclaim 46 wherein the electrically conductive porous material is applied by a spinning process.

74. The method according toclaim 46 wherein the electrically conductive porous material is applied as a conductive ink.

75. The method according toclaim 46 wherein the electrically conductive porous material is applied by a patterning process.

76. The method according toclaim 46 wherein the electrically conductive porous material is applied by a shadow masking process.

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