CROSS REFERENCE TO RELATED APPLICATIONThis application claims the benefit of U.S. Provisional Patent Application No.60/297,453, filed Jun. 13, 2001, the disclosure of which is incorporated by reference in its entirety.[0001]
FIELD OF THE INVENTIONThe present invention generally relates to multiple laser beam positioning and energy deliver systems, and more particularly to laser micro-machining systems employed to form holes in electrical circuit substrates.[0002]
BACKGROUND OF THE INVENTIONVarious laser machining devices are used to micro-machine patterns in substrates. Such systems typically are used in the manufacture of electrical circuit boards. Electrical circuit board manufacture comprises depositing conductive elements, such as conductive lines and pads, on a non-conductive, typically dielectric, substrate. Several such substrates are adhered together to form an electrical circuit board. In order to provide electrical interconnection between the various layers of an electrical circuit board, holes, called vias, are drilled through selected substrate layers and plated with a conductor. Electrical circuit boards typically include tens of thousands of vias, and as many as several hundred thousand vias.[0003]
SUMMARY OF INVENTIONThe present invention seeks to provide an improved laser micro-machining apparatus, such apparatus being particularly useful to form vias in electrical circuit boards.[0004]
The present invention still further seeks to provide an improved laser beam positioning system operative to provide generally simultaneous independent positioning of a plurality of laser beams.[0005]
The present invention still further seeks to provide laser micro-machining apparatus employing a laser beam positioning system operative to provide simultaneous independent positioning of a plurality of laser beams.[0006]
The present invention still further seeks to provide laser micro-machining system operative to independently position a plurality of pulsed laser beams, with a minimal loss in laser energy.[0007]
The present invention still further seeks to provide laser micro-machining apparatus that efficiently utilizes laser energy supplied by a pulsed laser, such as a solid state Q-switched laser, to generate vias in electrical circuit substrates.[0008]
The present invention still further seeks to provide laser micro-machining apparatus that controls an energy property of a laser beam by splitting an input laser beam into at least one output beams that are used to micro-machine a substrate. The at least one output beams may be a single beam or a plurality of beams.[0009]
The present invention still further seeks to provide a dynamic beam splitter operative to split an input laser beam into a selectable number of output sub-beams.[0010]
The present invention still further seeks to provide a dynamic beam splitter operative to selectably split an input laser beam into a plurality of sub-beams having a generally uniform energy property.[0011]
The present invention still further seeks to provide a system for selectably deflecting a pulsed beam to a selectably positionable beam reflector pre-positioned in an orientation to suitable for delivering energy to a selectably location on a substrate. Deflection of the beam may be performed at a duty cycle which is at least as fast as a pulse repetition of the laser beam. Positioning of the reflector is performed at a duty cycle which is slower than the pulse repetition rate.[0012]
The present invention still further seeks to provide a dynamic beam splitter operative to split an input laser beam into a plurality of output laser beams, each of which is directed in a selectable direction. In accordance with an embodiment of the invention, each of the output laser beams is emitted from a different spatial section of the beam splitter.[0013]
The present invention still further seeks to provide a laser beam diverter operative to receive a plurality of laser beams generally propagating in a common plane, and to divert each of the laser beams to a location in a two-dimensional array of locations outside the plane.[0014]
In accordance with a general aspect of an embodiment of the present invention, a laser beam positioning system, useful for example, to micro-machine substrates, is operative to provide a plurality of sub-beams which are dynamically deflected in a selectable direction. Each sub-beam is deflected so as to impinge on a deflector, located in an array of independently positionable deflector, whereat the sub-beams are further deflected by the deflectors to impinge on a substrate at a selectable location. In accordance with an embodiment of the invention, the plurality of sub-beams is generated from a single input beam by a dynamically controllable beam splitter.[0015]
In accordance with a general aspect of an embodiment of the invention, a system for delivering energy to a substrate, includes a dynamically directable source of radiant energy providing a plurality of beams of radiation, propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.[0016]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of radiant energy providing a beam of radiation, a beam splitter operative to split the beam into a plurality of sub-beams, each sub-beam propagating in a selectable direction, and a plurality of independently positionable beam steering elements, some of which receive the plurality of sub-beams and direct them to selectable locations on the substrate.[0017]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of radiant energy providing a beam of radiation and a dynamically configurable beam splitter disposed between the source of radiant energy and the substrate.[0018]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of radiant energy providing a beam of radiation and an opto-electronic multiple beam generator disposed between the source of radiant energy and the substrate. The multiple beam generator is operative to generate at least two sub-beams from the beam and to select an energy density characteristic of each sub-beam.[0019]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of pulsed radiant energy providing a pulsed beam of radiation along an optical axis, the pulsed beam including multiple pulses separated by a temporal pulse separation, and a multiple beam, selectable and changeable angle output beam splitter disposed between the source of radiant energy and the substrate. The selectable and changeable angle output beam splitter is operative to output a plurality of sub-beams at a selected angle relative to the optical axis. The angle is changeable in an amount of time that is less than the temporal pulse separation.[0020]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of pulsed radiant energy providing a pulsed beam of radiation, the pulsed beam including multiple pulses separated by a temporal pulse separation, a beam splitter disposed between the source of radiant energy and a substrate, the beam splitter being operative to output a plurality of sub-beams at selectable angles which are changeable, and a plurality of selectable spatial orientation deflectors. The deflectors are operative to change a spatial orientation in an amount of time that is greater than the temporal pulse separation. Some of the spatial orientation deflectors are arranged to receive the sub-beams and to direct the sub-beams to the substrate.[0021]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of radiant energy providing a beam of radiation, a beam splitter operative to split the beam into a selectable number of output beams, the output beams having an energy property functionally related to the selectable number, a beam steering element receiving an output beam and directing the output beam to micro-machine a portion of a substrate.[0022]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of radiant energy providing a plurality of beams of radiation propagating in a plane and a plurality of deflectors receiving the plurality of beams and deflecting at least some of the beams to predetermined locations outside the plane.[0023]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one source of radiant energy providing a beam of radiation, a beam splitter operative to receive the beam and to output a plurality of sub-beams propagating in a plane, and a plurality of deflectors receiving the plurality of sub-beams and deflecting at least some of the plurality of sub-beams to predetermined locations outside the plane.[0024]
In accordance with another general aspect of an embodiment of the invention a method for delivering energy to a substrate comprises directing a first plurality of beams of radiation onto a first plurality of selectably positionable deflectors during a first time interval for directing the first plurality of beams onto a first plurality of locations, during the first time interval, selectably positioning a second plurality of selectably positionable deflectors, and during a second time interval, directing the first plurality of beams of radiation onto the second plurality of selectable positionable deflectors for directing the first plurality of beams onto a second plurality of locations.[0025]
In accordance with another general aspect of an embodiment of the invention a system for delivering energy to a substrate comprises at least one radiant beam source providing at least one beam of radiation and at least first and second deflectors disposed to receive the at least one beam to deliver the beam to respective at least first and second at least partially overlapping locations on the substrate.[0026]
In accordance with another general aspect of an embodiment of the invention a laser micro-machining apparatus includes at least one radiant beam source providing a plurality of radiation beams, a plurality of independently positionable deflectors disposed between the at least one radiant beam source and a substrate to be micro-machined, the plurality of independently positionable deflectors being operative to independently deliver the at least one radiation beam to selectable locations on the substrate, and a focusing lens disposed between the at least one radiant beam source and the substrate, the focusing lens receiving the plurality of radiation beams and being operative to simultaneously focus the beams onto the selectable locations on the substrate.[0027]
In accordance with another general aspect of an embodiment of the invention an acousto-optical device includes an optical element receiving a beam of radiation along an optical axis, and a transducer associated with the optical element, the transducer forming in the optical element an acoustic wave simultaneously having different acoustic frequencies, the optical element operative to output a plurality of sub-beams at different angles with respect to the optical axis.[0028]
In accordance with another general aspect of an embodiment of the invention a method for micro-machining a substrate includes providing a laser beam to a beam splitter device, splitting the laser beam into a first number of output beams and directing the first number of output beams to form at least one opening in a first layer of a multi-layered substrate, and then splitting the laser beam into a second number of output beams and directing ones of the second number of output beams to remove selected portions of a second layer of the multi-layered substrate via the at least one opening.[0029]
Additional features and aspects of the invention include various combinations of one or more of the following:[0030]
The source of radiant energy comprises a pulsed source of radiant energy outputting a plurality of beams each defined by pulses of radiant energy.[0031]
The pulsed source of radiant energy comprises at least one Q-switched laser.[0032]
A dynamically directable source of radiant energy comprises a beam splitter operative to receive a beam of radiant energy and splitting the beam into a selectable number of sub-beams.[0033]
A dynamically directable source of radiant energy comprises a beam splitter operative to receive a beam of radiant energy, to split the beam into a plurality of sub-beams and to direct the sub-beams each selectable directions.[0034]
The beam splitter comprises an acousto-optical deflector whose operation is governed by a control signal.[0035]
The beam splitter comprises an acousto-optical deflector having an acoustic wave generator controlled by a control signal, the acoustic wave generator generating an acoustic wave which determines the number of sub-beams output by the acousto-optical deflector.[0036]
The beam splitter comprises acousto-optical deflector having an acoustic wave generator controlled by a control signal, the acoustic wave generator generating an acoustic wave which determines the selectable directions of the sub-beams.[0037]
The acoustic wave in the acousto-optical deflector includes a plurality of spatially distinct acoustic wave segments, each spatially distinct acoustic wave segment being defined by a portion of the control signal having a distinct frequency.[0038]
Each spatially distinct acoustic wave segment in the acoustic wave determines a corresponding spatially distinct direction of a corresponding sub-beam, which is a function of the frequency of the portion of the control signal corresponding to the acoustic wave segment.[0039]
The number of spatially distinct acoustic wave segments determines the number of corresponding sub-beams.[0040]
The dynamically directable source of radiant energy comprises a dynamically configurable beam splitter receiving a beam of radiant energy and splitting the beam into a selectable number of sub-beams. The dynamically configurable beam splitter is capable of changing at least one of the number and direction of the sub-beams within a reconfiguration time duration, and the pulses of radiant energy are separated from each other in time by a time separation which is greater than the reconfiguration time duration.[0041]
The plurality of independently positionable beam steering elements is capable of changing the direction of the sub-beams within a redirection time duration, and the pulses of radiant energy are separated from each other in time by a time separation which is less than the redirection time duration.[0042]
Each of the beam steering elements includes a reflector mounted on at least one selectably tilting actuator. The actuator comprises a piezoelectric device or a MEMs device.[0043]
The number of beam steering devices exceeds the number of sub-beams included in the plurality of sub-beams. At least some of the plurality of sub-beams are directed to at least some of the plurality of beam steering devices while others of the plurality of the beam steering devices are being repositioned.[0044]
The selectable number of sub-beams all lie in a plane, a two dimensional array of beam steering elements lies outside the plane, and an array of fixed deflectors optically interposed between the at least one dynamically directable source of radiant energy and the plurality of independently positionable beam steering elements is operative direct the beams lying in a plane to locations outside the plane.[0045]
BRIEF DESCRIPTION OF DRAWINGSThe present invention will be understood and appreciated more fully from the following detailed description, taken in conjunction with the drawings in which:[0046]
FIG. 1A is a simplified partially pictorial, partially block diagram illustration of a system and functionality for fabricating an electrical circuit constructed and operative in accordance with a preferred embodiment of the present invention;[0047]
FIG. 1B is a timing graph of laser pulses output by a laser used in the system and functionality of FIG. 1;[0048]
FIG. 2 is a somewhat more detailed partially pictorial, partially block diagram illustration of part of an apparatus for micro-machining electrical substrates in the system and functionality of FIG. 1A;[0049]
FIG. 3 is a somewhat more detailed partially pictorial, partially block diagram illustration of an aspect of operation of part of the system and functionality of FIG. 2;[0050]
FIG. 4 is a flow diagram of a method for manufacturing electrical circuits in accordance with an embodiment of the invention;[0051]
FIG. 5 is an illustration showing the result of varying the number and angle of laser beams produced by a dynamic beam splitter in the system and functionality of FIGS. 1A and 2;[0052]
FIG. 6 is an illustration showing the result of varying the angle of multiple laser beams produced by a dynamic beam splitter in the system and functionality of FIGS. 1A and 2;[0053]
FIG. 7 is an illustration showing the result of varying the angles of multiple at least partially superimposed laser beams produced by a dynamic beam splitter produced by modulation control signals including multiple at least partially superimposed different frequency components in the system and functionality of FIGS. 1A and 2;[0054]
FIG. 8 is an illustration showing the result of varying the energy distribution among multiple laser beams produced by a dynamic beam splitter in the system and functionality of FIGS. 1A and 2;[0055]
FIGS. 9A and 9B are illustrations showing the result of varying the number of uniform diameter laser beams produced by a dynamic beam splitter in the system and functionality of FIGS. 1A and 2; and[0056]
FIGS. 10A and 10B are illustrations showing the result of varying the number of uniform diameter laser beams produced by a dynamic beam splitter as shown in FIGS. 9A and 9B in accordance with a preferred embodiment of the present invention.[0057]
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTSReference is now made to FIG. 1A, which is a simplified partially pictorial, partially block diagram, illustration of a system and functionality for fabricating an electrical circuit, constructed and operative in accordance with a preferred embodiment of the present invention, and to FIG. 1B which is a timing graph of laser pulses output by a laser used in the system and functionality of FIG. 1A. The system seen in FIG. 1A includes laser[0058]micro-machining apparatus10, which also includes the functionality of delivering energy to a substrate.
[0059]Apparatus10 is particularly useful in the context of micro-machining holes, such asvias12, in printedcircuit board substrates14, during the fabrication of printed circuit boards.Apparatus10 may also be used in other suitable fabrication processes employing micro-machining, including without limitation, the selective annealing of amorphous silicon in flat panel displays and the removal of solder masks on electrical circuits. Accordingly, although the invention is described in the context of micro-machining printed circuit boards, the scope of the invention should not be limited solely to this application..
Printed circuit board substrates, such as a[0060]substrate14, which are suitable to be micro-machined using systems and methods described hereinbelow, typically include dielectric substrates, for example epoxy glass, having one or more electrical circuit layers, each electrical circuit layer having selectively formed thereon aconductor pattern16. The substrates may be formed of a single layer or of a laminate formed of several substrate layers adhered together. Additionally, the outermost layer of thesubstrate14 may comprise theconductor pattern16 formed thereon, as seen in FIG. 1A. Alternatively, the outermost layer ofsubstrate14 may comprise, for example, a metal foil substantially overlaying a continuous portion of the outer surface of thesubstrate14, for example as shown by the region indicated byreference numeral17.
In an embodiment of the invention, as seen in FIG. 1A,[0061]laser micro-machining apparatus10 includes apulsed laser20 outputting a pulsed laser beam22. Pulsed laser beam22 is defined by a stream of light pulses, schematically indicated bypeaks24 in laser pulse graph26 (FIG. 1B). In accordance with an embodiment of the invention pulsedlaser20 is a frequency tripled Q-switched YAG laser providing a pulsed a UV laser beam22 at a pulse repetition rate of between 10-50 KHz, and preferably at about 10-20 KHz. Suitable Q-switched lasers are presently available, for example, from Spectra Physics, Lightwave Electronics and Coherent, Inc. all of California, U.S.A. Other commercially available pulsed lasers, that suitably interact with typical materials employed to manufacture printed circuit boards, may also be used.
Another laser suitable for use as[0062]pulsed laser20, operative to output a pulsed UV laser beam particularly suitable for micro-machining substrates containing glass, is described in the present Applicants' copending U.S. patent application No. ______, filed concurrently herewith and claiming the benefit of U.S.provisional patent application 60/362,084, the disclosures of which are incorporated by reference in their entirety.
In the embodiment seen in FIG. 1A, which is a highly simplified schematic representation of laser[0063]micro-machining apparatus10, pulsed laser beam22 impinges on afirst lens28, which preferably is a cylindrical lens operative to flatten beam22 at an image plane (not seen) in a first variable deflector assembly, such as an acousto-optical deflector (AOD)30. PreferablyAOD30 includes atransducer element32 and atranslucent crystal member34 formed of quartz or other suitable crystalline material.
[0064]Transducer32 receives acontrol signal36 and generates anacoustic wave38 that propagates throughcrystal member34 ofAOD30.Control signal36 preferably is an RF signal provided by anRF modulator40, preferably driven by a direct digital synthesizer (DDS)42, or other suitable signal generator, for example a voltage controlled oscillator (VCO). Asystem controller44, in operative communication withDDS42 and alaser driver47, is provided to coordinate between generation of thecontrol signal36 andlaser pulses24 defining pulsed laser beam22 so that portions ofsubstrate14 are removed, e.g. by ablation, in accordance with a desired design pattern of an electrical circuit to be manufactured. Such design pattern may be provided, for example, by a CAM data file46 or other suitable computer file representation of an electrical circuit to be manufactured.
As known in the art, the presence of the
[0065]acoustic wave38 in
crystal member34, when beam
22 impinges thereon causes beam
22 to be deflected at an angle θ
nwhich is a function of the frequency f
nof
wave26 according to the formula:
Where:[0066]
Δf[0067]n=fn−f0;
λ=wavelength of beam[0068]22
υ[0069]s=speed of sound in thecrystal34 ofAOD30, and
n is an integer representing the index number of a laser sub-beam, as described hereinbelow.[0070]
In accordance with an embodiment of the invention,[0071]AOD30 is operative to function as a dynamic beam splitter and which governs at least one of a number segments into which beam22 is split and its angle of deflection.Signal36 may be selectably provided so as to causeacoustic wave38 to propagate at a uniform frequency throughcrystal member34. Alternatively, signal36 may be selectably provided so as to cause theacoustic wave38 to propagate at different frequencies through thecrystal member34.
Various aspects of the structure, function and operation of[0072]AOD30 as a dynamic beam splitter are described hereinbelow with reference to FIGS.5-7. The structure and operation of another type of AOD, configured and arranged to function as a dynamic beam splitter and deflector is described in the present Applicants' copending provisional patent application No. ______, filed concurrently herewith, entitled: “Dynamic Multi-Pass, Acousto-Optic Beam Splitter and Deflector”.
In accordance with an embodiment of the invention, signal[0073]36 causes theacoustic wave38 to be generated inAOD30 with different frequencies such that at a moment in time theacoustic wave38 interacts with thelaser pulse24, theacoustic wave38 comprises at least two different frequencies. By generating anacoustic wave38 with more than one frequency, beam22 is split into more than one segment. Typically, the different frequencies are spatially separated inAOD30 at the time at which a laser pulse impinges thereon. Alternatively, the different frequencies are superimposed in a complex waveform.
Thus, when the[0074]acoustic wave38 is propagated throughcrystal member32 in a non-uniform waveform and interacts with the laser beam22, the beam22 is segmented intoseveral beam segments50, or sub-beams. Each of the segments is deflected at an angle θnwhich is a function of an acoustic wave frequency, or frequencies, of theacoustic wave38 incrystal member34 at the time the laser beam22, represented by peak24 (FIG. 1B), impinges thereon.
In accordance with an embodiment of the invention,[0075]AOD30 operates at a duty cycle, which is less than the pulse repetition rate of laser beam22. In other words, the time required to reconfigure theacoustic wave38 inAOD30 to comprise a different composition of frequencies when impinged upon by alaser pulse24, so as to change at least one of the number ofsub-beams50 and the respective directions thereof at the output fromAOD30, is less than the time separation betweensequential pulses24 in beam22.
Each one of[0076]beam segments50, whether a single segment provided e.g. by a uniform acoustic wave, or several segments as seen in FIG. 1, is directed towards a secondvariable deflector assembly52. The secondvariable deflector assembly52 is formed of a plurality of independently tiltable beam steeringreflector elements54.
In accordance with an embodiment of the invention, second[0077]variable deflector assembly52 comprises an optical MEMs device, or is formed as an array of mirrors tiltable by suitable piezo-electric motors, or is formed as an array of galvanometers, or comprises any other suitable array of independently tiltable reflector devices. In the configuration of secondvariable deflector assembly52 seen in FIG. 1A, a 6×6 array ofreflector elements54 elements is provided. Any other suitable quantity of independentlytiltable reflector elements54 may be used.
A suitable optical MEMs device providing an array of independently controllable digital light switches is employs technologies used in a Digital Micromirror Device (DMD™) available from Texas Instruments of Dallas, U.S.A. Alternatively, a suitable array of[0078]reflector elements54 may be constructed in accordance with fabrication principles of the DMD™ described in detail in Mignardi et. al.,The Digital Micromirror Device—a Micro-Optical Electromechanical Device for Display Applications, presented in MEMS and MOEMS Technology and Applications (Rai-Choudhury, editor), SPIE Press, 2000, the disclosures of which are incorporated herein by reference.
Each of the[0079]reflector elements54 is operative to separately and independently steer abeam segment50 impinging thereon to impinge on thesubstrate14 at a selectable location in atarget region55 so as to micro-machine, drill or otherwise remove a portion ofsubstrate14 at the required location.
As seen in FIG. 1A, operation of[0080]reflector elements54 may be controlled, for example, by aservo controller57 in operative communication withsystem controller44 to ensure thatreflector elements54 suitablydirect beam segments50 to impinge onsubstrate14 at a required location, in accordance with a desired design pattern of an electrical circuit to be manufactured. Such design pattern may be provided, for example, by the CAM data file46 or other suitable computer file representation of an electrical circuit to be manufactured.
Each of the[0081]reflector elements54 is configured so that a beam impinging thereon may be steered to a selectable location in a corresponding region of coverage. In accordance with an embodiment of the invention, the regions of coverage, corresponding to at least some of thereflector elements54, at least partially mutually overlap.
In accordance with an embodiment of the invention, the number of[0082]reflector elements54 in the secondvariable deflector assembly52 exceeds the maximum number ofbeam segments50 output byAOD30.Reflector elements54 typically operate at a duty cycle which is slower than the pulse repetition rate of laser beam22. In other words, the time required to redirect a givenreflector element54 so that abeam segment50 impinging thereon may be redirected to a new location onsubstrate14, is greater than the time separation betweensequential pulses24 in beam22.
Because of the redundancy in[0083]reflector elements54, for any givenpulse24 in beam22,beam segments50 are impinging on only some of the reflector elements54., but not on others. Thus,reflector elements54, which are not receiving a sub-beam50, may be repositioned to a new spatial orientation, in preparation for receiving a sub-beam50 from asubsequent laser pulse24, while at generally the same timeother reflector elements54 are directingbeam segments50 to impinge onsubstrate14.
As seen in FIG. 1A, a[0084]folding mirror62, a focusinglens63 and atelecentric imaging lens64 are interposed between secondvariable deflector assembly52 andsubstrate14 to deliverbeam segments50 to the surface ofsubstrate14. It is appreciated that the optical design oflenses63 and64 should accommodatebeam segments50 which propagate along optical axes extending in mutually different directions.
It is further appreciated that as a function of system geometry and engineering design, a[0085]single folding mirror62, no folding mirror or multiple folding mirrors may be provided. Additionally focusinglens63 andtelecentric lens64 may be combined into a single optical element, or alternatively each oflenses62 and64 may comprise multiple lens elements. Moreover,system10 may include a zoom lens (not shown) operative to govern a cross sectional dimension of one ormore beam segments50, for example in order to form holes and vias onsubstrate14 having different diameters. Alternatively zoom optics may be employed to accommodate and make uniform a diameter of beam-segments50 which may be output by AOD with different diameters.
In accordance with an embodiment of the invention, the angles en at which[0086]beam segments50 are deflected byAOD30 relative to the optical axis of the incoming beam22 typically are very small, in the order of 10−2radians. In order to provide for a more compact system, a beam angle expander, such as a telescoping optical element, schematically represented bylens56, operative to increase the mutual angular divergence ofbeam segments50, preferably is provided downstream ofAOD30.
[0087]AOD30 generally is operative to deflect sub-beams50 so that the optical axes ofbeam segments50 generally lie in a plane. As seen in FIG. 1A, secondvariable deflector assembly52 comprises a two dimensional array that lies outside the plane of the optical axes ofbeam segments50. As seen in FIG. 1A, a linear to 2-dimensional mapping assembly58 is located betweenAOD30 and the secondvariable deflector assembly52.Mapping assembly58 receivesbeam segments50, propagating in the same plane, and redirects thebeam segments50 to a two dimensional array of locations outside the plane of the sub-beams50.
In accordance with an embodiment of the invention,[0088]mapping assembly58 comprises a plurality of mappedsections60 each of which are positioned in a suitable spatial orientation so that abeam segment50 output byAOD30 which impinges on a given mappedsection60 is directed to areflector element54, to which it is mapped.
The following is a simplified general description of the operation and functionality of system[0089]10: The acoustic wave is38 is generated incrystal34 in synchronization with thepulses24 of beam22 such that a desired acoustic wave structure is present incrystal member34 at the time a first laser beam pulse impinges thereupon. Theacoustic wave38 may have a uniform frequency throughoutcrystal34, which produces asingle beam segment50. Alternatively, acoustic wave may have several different frequencies. Typically, the different frequencies may be, for example, at various spatial segments along the length ofacoustic wave38 to produce several somewhat spaced apartbeam segments50. In accordance with an embodiment of the invention, the duty cycle ofAOD30 is sufficiently fast such that it can be dynamically reconfigured to selectably and differently split or deflect eachpulse24 in a beam22. In a preferred embodiment of the invention, dynamic reconfiguration of the beam splitter is accomplished by forming acoustic waves having mutually different structures inAOD30 at the moment eachpulse24 defining beam22 impinges onAOD30.
The different frequencies in[0090]acoustic wave38 cause eachbeam segment50 to be deflected at a selectable angle θnto impinge on a selected mappedsection60 ofmapping assembly58, preferably after passing throughbeam expander lens56. Eachbeam segment50 is directed by an appropriate mappedsection60 to a corresponding location on one ofreflector elements54 at secondvariable deflector assembly52. Thereflector element54 is suitably tilted so that thebeam segment50 is subsequently further directed to a location onsubstrate14 for micro-machining or drilling a required location of thesubstrate14.
In accordance with an embodiment of the invention, although[0091]AOD30 operates at a duty cycle which generally is faster than the pulse repetition rate of laser beam22, the deflection that it provides is relatively limited in that it deflectsbeam segments50 by relatively small angles of deflection. Thebeam segments50 typically all lie in the same plane.
Conversely, the time required to position[0092]individual reflector elements54 in secondvariable deflector assembly52 typically is greater than the time separation between subsequent pulses defining laser beam22. However, since eachreflector element54 may be tilted over a relatively large range of angles, preferable in at least 2-dimensions, alaser sub-beam50 impinging on thereflector element54 may be delivered to cover a relatively large spatial region.
In accordance with an embodiment of the invention, each of[0093]reflector elements54 is suitably tiltable so as thatadjacent reflector elements54 are operable to deliverbeam segments50 to cover mutually overlapping regions on the surface ofsubstrate14. Moreover, thereflector elements54 in secondvariable deflector assembly52 are able to deliverbeam segments50 to substantially any location in the field ofview68 of thelenses63 and64.
After micromachining the desired[0094]portions55 in the field ofview68,substrate14 andapparatus10 are mutually displaced relative tosystem10 so that the field ofview68 covers a different portion of thesubstrate14.
In accordance with an embodiment of the invention, the number of[0095]reflector elements54 inassembly52 typically exceeds the number ofbeam segments50 into which laser beam22 is split byAOD30. During an initial time interval,beam segments50 impinge on a first plurality of thereflector elements54, but not onother reflector elements54. The initial time interval is used to reposition theother reflector elements54 which do not receive abeam segment50, as described hereinbelow.
During a subsequent second time interval,[0096]beam segments50 are deflected byAOD30 to impinge on at least some of thereflector elements54 which did not receivebeam segments50 during the previous time interval. Thereflector elements54 employed in the second time interval are now suitably repositioned to deflect the sub-beam50 to thesubstrate14. During the second time interval at least some of the reflector elements that are not impinged on by abeam segment50, possibly including reflector elements that were used in the first time interval, are repositioned for use in a subsequent time interval. This process of repositioningreflector elements54 that are not used during a given time interval is repeated.
Stated generally, it may be said that concurrent to[0097]beam segments50 from a first laser pulse impinging on selectedreflector elements54, other reflectors are concurrently repositioned to receivebeam segments50 from subsequent beam pulses.
Typically the time required to position a[0098]single reflector element54 is in the order of between 1-10 milliseconds, corresponding to about between 20-200 pulses of a 20 KHz Q-switched laser. The length of time, which exceeds the duty cycle of thelaser pulses24, used to positionreflectors54, ensures stabilized beam pointing accuracy. Additionally, the use ofmultiple reflectors54 ensures a redundancy which minimizes the loss of pulses while repositioningreflector54 following micromachining of a location onsubstrate14. It is appreciated that in order to the increase the speed of theapparatus10, and to provide a controlled dosage of energy in eachbeam segment50, it may be necessary for more than onebeam segment50 to simultaneously impinge on the surface ofsubstrate14 at the same location. In such an arrangement,multiple beam segments50 are each individually deflected to impinge onseparate reflectors54, which are each oriented to direct the sub-beams50 to impinge onsubstrate14 at the same location.
Reference is now made to FIG. 2 which is a somewhat more detailed partially pictorial, partially block diagram illustration of part of an[0099]apparatus110 for micro-machining electrical circuits in the system and functionality of FIG. 1. In general,laser machining apparatus110, may be thought of as a system for delivering energy to a substrate.
In an embodiment of the invention, as seen in FIG. 1,[0100]laser micro-machining apparatus110 includes apulsed laser120 outputting apulsed laser beam122.Pulsed laser beam122 is defined by a stream of light pulses. In accordance with an embodiment of the invention pulsedlaser20 is a frequency tripled Q-switched YAG laser providing a pulsed aUV light beam122 at a pulse repetition rate of between 10-50 KHz, and preferably between about 10-20 KHz. Suitable Q-switched lasers are presently available, for example, from Spectra Physics, Lightwave Electronics and Coherent, Inc. all of California, U.S.A. Other commercially available pulsed lasers, that suitably interact with typical materials employed to manufacture printed circuit boards, may also be used.
Another laser suitable for use as[0101]pulsed laser120, operative to output a pulsed UV laser beam particularly suitable for micro-machining substrates containing glass, is described in the present Applicants' copending U.S. patent application No. ______, filed concurrently herewith and claiming the benefit of U.S.provisional patent application 60/362,084, the disclosures of which are incorporated by reference in their entirety.
In the embodiment seen in FIG. 2, which is a highly simplified schematic representation a preferred embodiment of laser[0102]micro-machining apparatus110, apulsed laser beam122 impinges on afirst lens128, which preferably is a cylindrical lens operative to flattenbeam122 at an image plane (not seen) on a first variable deflector assembly, such as an acousto-optical deflector (AOD)130. PreferablyAOD130 includes atransducer element132 and atranslucent crystal member134 formed of quartz or any other suitable crystalline material.
[0103]Transducer132 is controlled by a control signal (not shown), corresponding to controlsignal36 in FIG. 1A, and is operative to generateacoustic waves138 that propagate throughcrystal member134 ofAOD130, similarly as described with reference to FIG. 1A. Theacoustic waves138 are operative to interact withlaser beam122 incrystal member134 to dynamically and selectably split and deflect pulses inlaser beam122, tooutput beam segments150 orsub-beams150.
[0104]AOD130 is thus operative to function as a dynamic beam splitter which controls, by forming a suitableacoustic wave138 having a selectable wave configuration, at least one of anumber segments150 into whichbeam122 is split and a direction at which the resulting beam segments are directed.
Various aspects of the structure, function and operation of[0105]AOD130 as a dynamic beam splitter are described hereinbelow with reference to FIGS.5-7. The structure and operation of another type of AOD configured and arrange to function as a dynamic beam splitter is described in the present Applicants' copending provisional patent application No. ______, filed concurrently herewith, entitled: “Dynamic Multi-Pass, Acousto-Optic Beam Splitter and Deflector”.
In accordance with an embodiment of the invention,[0106]acoustic wave138 may be formed inAOD30 with several different frequencies such that at a moment in time at which theacoustic wave138 interacts with thelaser beam122, theacoustic wave138 comprises at least two different frequencies. By forming anacoustic wave138 with more than one frequency,beam122 is split into more than onesegments150. The different frequencies may be spatially separated inAOD130 at the time at which a laser pulse impinges thereupon. Alternatively, the different frequencies may be superimposed in a complex waveform.
Thus when[0107]acoustic wave138 is propagated throughcrystal member132 in a non-uniform waveform,beam122 may be segmented intoseveral beam segments150, or sub-beams. Each of thebeam segments150 is deflected at an angle on which is a function of an acoustic wave frequency, or frequencies, ofacoustic wave138 incrystal member134 at the time a laser pulse inlaser beam122 impinges thereon.
In accordance with an embodiment of the invention,[0108]AOD30 operates at a duty cycle which is shorter than the pulse repetition rate oflaser beam122. Thus, the time required to reconfigure anacoustic wave138 inAOD130 to comprise a different composition of frequencies when interacting with a laser pulse inlaser beam122, so as to change at least one of the number and respective directions ofsub-beams150, is less than the time separation between sequential pulses inlaser beam122.
Each one of[0109]beam segments150, whether a single segment provided e.g. by a uniform acoustic wave, or several segments as seen in FIG. 2, is directed to a first selectable target located at a secondvariable deflector assembly152. The secondvariable deflector assembly152 is formed of a plurality of independently tiltable beam steeringreflector elements154.
Each of the[0110]reflector elements154 also operates to further separately and independently steer abeam segment150, impinging thereon, to impinge onsubstrate14, as described with reference to FIG. 1A, and subsequently to micro-machine, drill or otherwise remove a portion ofsubstrate14 at such location.
In accordance with an embodiment of the invention, each[0111]reflector element154 comprises amirror240, or another suitable reflective element, mounted on apositioner assembly242 comprising abase244, amirror support246, at least oneselectable actuator248,3 actuators are shown assembled in a starlike arrangement, and a biasing spring (not shown). Each of theselectable actuators248 is, for example, a piezoelectric actuator, such as a TORQUE-BLOCK™ actuator available from Marco Systemanalyse und Entwicklung GmbH of Germany, independently providing an up and down positioning as indicated byarrows249 so as to selectively tiltmirror240 into a desired spatial orientation for receiving abeam segment150 and subsequently to direct thebeam segment150 to impinge on a desired location on the surface ofsubstrate14.
As appreciated from FIG. 2, considered along with FIG. 1A, each of the[0112]actuators248 is operatively connected to aservo controller57 which in turn is operatively connected to and controlled bysystem controller44 as described hereinabove with respect to FIG. 1A. Thus, it is appreciated that in correspondence to the a pattern design, for example of a pattern of vias in an printed circuit board, contained in CAM data file46, the relative spatial orientation, or tilt, ofreflector elements154 is independently controlled in synchronization with the laserpulses defining beam122 and with the generation of control signal controlling the operation ofAOD130 to dynamically split and deflectlaser beam122. Abeam segment150 is deflected to a desiredreflector element154, which in turn is suitably oriented so that thebeam segment150 ultimately impinges onsubstrate14 at a desired location.
In accordance with an embodiment of the invention, each of the[0113]reflector elements154 is configured so that a sub-beam150 may be steered to a selectable location in a corresponding region of coverage onsubstrate14. The regions of coverage corresponding to at least some of thereflector elements154 at least partially mutually overlap.
The number of[0114]reflector elements154 in secondvariable deflector assembly152 typically exceeds the maximum number ofbeam segments150 output byAOD130. Thus as seen in FIG. 2, second variable deflector assembly includes36 reflector elements, while6sub-beams150 are output byAOD130.Reflector elements154 typically operate at a duty cycle which is less than the pulse repetition rate oflaser beam122. Thus, the time required to mechanically reposition areflector element154, so that abeam segment150 impinging thereupon may be redirected to a new location onsubstrate14 is greater than the time separation between sequentialpulses defining beam122.
Because of the redundancy in[0115]reflector elements154 over the respective ofbeam segments150, for any given pulse inbeam122,beam segments150 are deflected to impinge on somereflector elements154, but not on otherreflective elements154. Thus, somereflector elements170 which are not receiving abeam segment150 may be repositioned to a new spatial orientation, in preparation for receiving asubsequent laser pulse24, while at the same timeother reflector elements172, which are receiving abeam segment150, are directing thebeam segments150 to impinge downstream, onsubstrate14.
In accordance with an embodiment of the invention, the angles en at which[0116]beam segments150 are deflected byAOD130 relative to the optical axis of theincoming beam122 typically are very small, in the order of 10−2radians. In order to provide for a more compact system, a beam angle expander, such as a telescoping optical element, schematically represented bylens156, operates to increase the mutual angular divergence ofbeam segments150, preferably is provided downstream ofAOD130.
[0117]AOD130 generally is operative to deflectbeams50 so that the optical axes ofbeam segments150 generally lie in the same plane, while secondvariable deflector assembly152, comprising a two dimensional array that lies outside the plane of the optical axes ofbeam segments150.
A 2-dimensional mapping assembly[0118]180 is interposed betweenAOD130 and the secondvariable deflector assembly152. Mapping assembly180 receivesbeam segments150, all generally propagating in a plane, and redirects thebeam segments150 to a two dimensional array of locations outside the plane of the sub-beams150.
In accordance with an embodiment of the invention, mapping assembly[0119]180 comprises an array ofsupport members182 which comprise a plurality of opticallytransmissive portions184, through whichbeam segments150 can pass, and a plurality ofreflective portions186 operative to reflectbeam segments150, which impinge thereupon.
As seen in FIG. 2, the[0120]reflective portions186 generally are spaced apart on eachsupport member182, and the respective locations ofreflective portions186 are preferably mutually laterally staggered amongsupport members182. Eachreflective portion186 is generally mapped to acorresponding reflector element154. Consequently, eachbeam segment150 entering assembly180 is received by the respectivereflective portion186 on afirst support member187, or passes through one or more support members until it is received by areflective portion186 on one of theother support members182.
Assembly[0121]180 thus provides a means for redirectingbeam segments150, which propagate along optical axes lying in a plane of beam propagation, to impinge on a two dimensional array of locations lying outside the plane of propagation.AOD130 selectively deflects abeam segment150 to impinge on one of thereflective portions186 formed on one of thesupport members182 in assembly180. Becausereflective portions186 intersect the plane of propagation at mutually staggered locations, along both an X axis and a Y axis in the plane of propagation, the angle at which abeam segment150 is selectably deflected byAOD130 determines thereflective portion186 on which it impinges. Thus, a location in a two dimensional array of selectable locations, such as at secondvariable deflector assembly152, lies outside the plane of propagation.
Reference is now made to FIG. 3 which is a somewhat more detailed partially pictorial, partially block diagram illustration of an aspect of operation of part of the system and functionality of FIG. 2.[0122]Laser pulses224 in a laser pulse timing graph226 are designated234,236 and238 respectively.Laser122 typically compriseslaser pulses224 which are spaced time. Control signals244,246 and248 are shown belowlaser pulses234,236 and238 respectively. The control signals244-248, for controlling the generation of thepulse138 are shown being fed into atransducer252 associated with anAOD260.AOD260 typically corresponds toAOD130 in FIG. 2. Acoustic wave, corresponding to control signals264-268 are shown inAOD260.Acoustic wave264 corresponds to controlsignal244,acoustic wave266 corresponds to controlsignal246 andacoustic wave268 corresponds to controlsignal244. For the purposes of simplicity of illustration, only a part ofAOD260 is shown for each oflaser pulses224.
At a moment in time, corresponding to the emission of a[0123]laser pulse224, aninput laser beam270 impinges on theAOD260. The acoustic waves264-268 respectively causelaser beam270 to be segmented into beam segments, generally designated250, each of which is deflected at an angle of deflection which is functionally related to corresponding frequencies in acoustic waves264-268.
First, second and third reflector elements,[0124]280,282 and284 respectively, corresponding to beam steeringreflector elements154 in FIG. 2, are shown below each of theAODs260. At a time corresponding to eachlaser pulse224, abeam segment250 is deflected to impinge on one of thereflector elements280,282 and284.
FIG. 3 also shows with particularity the timing relationship between[0125]laser pulses224, operation ofAOD260 as a dynamic beam deflector having a duty cycle which is faster than the pulse repetition rate represented bypulses224, and operation ofreflector elements280,282 and284, having a duty cycle which is slower than the pulse repetition rate
As previously noted, the reconfiguration time required to introduce a different acoustic wave into[0126]AOD260 is less than the time separation betweenpulses234. Thus, the respective waveforms of control signals244-248, and the respective waveforms of acoustic waves264-268 are each different thereby resulting in the selectable deflection ofbeam segments250 for each ofpulses224. It is noted however, that in the sequentially providedcontrol signals244 and246, and corresponding sequentially providedacoustic waves264 and266, the frequency in a firstspatial wave segment290 changes, while the frequency in a secondspatial wave segment292 remains unchanged.
For both[0127]pulses234 and236, afirst beam segment294, corresponding to the secondspatial wave segment292, impinges onthird reflector element284.Reflector element284 is held stationary to receive thefirst beam segment294 for each ofpulses234 and236 respectively.
A[0128]second beam segment296 is deflected in a first direction by firstspatial segment290 ofacoustic wave264, while athird beam segment298 is deflected in a different direction by firstspatial segment290 inacoustic wave266.
Moreover, for[0129]pulses234 and236, neither of thebeam segments250 impinge on first andsecond deflector elements280 and282 respectively, but rather are directed to other deflector elements which are not shown. The time interval betweenpulses234 and236 is utilized to spatially reposition the first andsecond reflector elements280 and282.
A new wave form of[0130]acoustic wave268 is formed inAOD260 to selectably split and deflectbeam270 atpulse238. As seen belowpulse238, none of thebeam segments250 impinge onfirst reflector element280 orthird reflector element284.
A[0131]fourth beam segment300 impinges ondeflector element282.Beam segment300 is deflected in a direction that is functionally related to the frequency ofacoustic wave268 in secondspatial segment292. It is noted that the frequency in the secondspatial segment292 ofacoustic wave268 has been changed relative to theacoustic waves264 and266. Afifth beam segment302 is deflected in a direction that is functionally related to the frequency ofacoustic wave268 in firstspatial segment290.
It is thus noted from the foregoing that the repositioning time of reflector elements[0132]280-284, such as beam steeringreflector elements154, is slower than a time separation betweenpulses224. Nevertheless, because the reconfiguration time of dynamic beam splitter is less than the time separation between pulses, any redundant reflector elements can be repositioned over a time interval greater than the separation between pulses. A reflector element that is in a suitable position can then be selected in a time interval that is less than the time separation between pulses.
Reference is now made to FIG. 4 which is a flow diagram[0133]320 of a methodology for manufacturing electrical circuits in accordance with an embodiment of the invention. The methodology is described in the context of a process for forming micro vias in a multi layered printed circuit board substrate having a metal foil layer overlaying a dielectric substrate.
The presently described methodology for manufacturing electrical circuits employs at least one dynamically directable source of radiant energy providing a plurality of beams of radiation, each beam propagating in a dynamically selectable direction. The beams are selectably directed to a plurality of independently positionable beam steering elements. Some of the beam steering elements receive the beams and direct them to selectable locations on a printed circuit board substrate to be micro-machined.[0134]
Suitable apparatus for generating a plurality of beams propagating in dynamically selectable directions is the[0135]laser micro-machining apparatus10 is described with reference to FIG. 1A, and lasermicro-machining apparatus110 described with reference to FIG. 2. Thus beams propagating in dynamically selectable directions may be produced, for example, by passing one or more beams output by at least one Q-switched laser through at least one dynamic beam splitting and deflecting device. Optionally, several separately generated beams may be treated separately or in combination.
In accordance with an embodiment of the invention, the dynamic deflector device is operable to selectably provide at least one metal machining beam-segment. In an embodiment of the invention, a beam splitting functionality is provided by the dynamic deflector, although a separate beam splitting device providing a selectable beam splitting function may be provided. The metal-machining beam-segment has an energy density that is suitable to remove a portion of the metal foil layer, for example by burning or by ablation.[0136]
Each metal machining beam segment is dynamically deflected to impinge on a beam steering device, such as a[0137]tiltable reflector element154 in FIG. 2. The beam steering device is suitably positioned so that the metal machining beam segment is steered to a selectable location on a PCB substrate whereat a portion of the metal foil is removed to expose the underlying dielectric substrate.
While a metal machining beam is removing a portion of the metal foil at a first location, beam steering devices which are not being presently used may be suitably repositioned for removal of metal foil at other selectable locations. Thus, each subsequent pulse may be deflected by the dynamic beam deflector to impinge on an already positioned beam steering device.[0138]
Removal of portions of the metal foil continues at selectable locations until metal foil is removed for a desired plurality of locations.[0139]
In a subsequent operation, the dynamic deflector device is provide at least one dielectric machining beam-segment having an energy property that is different from the metal machining beam-segment. A beam splitting functionality may be provided, for example by the dynamic deflector or by a suitable beam splitter device. For example, dielectric machining beam segment has a lower energy density than a metal machining beam-segment. The energy property of the dielectric machining beam segment is suitable to remove a portion of the dielectric layer, for example by burning or by ablation, but is not suitable to remove a portion of the metal foil.[0140]
In accordance with an embodiment of the invention, the respective energy densities of[0141]beam segments50 and150 are controlled by splittinglaser beam22 and122 into a selectable number ofbeam segments50 and150, and by maintaining the diameter of the resultingbeam segment150 irrespective of the number of beam segments.
Each dielectric machining beam segment is dynamically deflected to impinge on a beam steering device, such as a[0142]tiltable reflector element154 in FIG. 2. The beam steering device is suitably positioned so that each dielectric machining beam segment is steered to a selectable location whereat a portion of the metal foil has already been removed, to expose of the dielectric layer, and a desired portion of the dielectric is removed.
While a dielectric machining beam is removing a portion of the dielectric at a first set of locations, beam steering devices which are not being presently used may be suitably repositioned for removal of dielectric at other selectable locations. Thus, each subsequent pulse may be deflected by the dynamic beam deflector to impinge on an already positioned beam steering device. It is appreciated that because a reduced energy density is required to remove dielectric,[0143]beam122 may be divided into a greater number of dielectric machining beam segments, resulting in a greater system throughput for removing dielectric as compared to removing metal foil.
Removal of dielectric continues at selectable locations until the dielectric is removed for substantially all of the locations at which metal foil was previously removed. Once this operation is completed, a substrate can be repositioned for micro-machining of a subsequent portion thereof.[0144]
As noted above, in accordance with an embodiment of the present invention, an AOD is configured and operative to dynamically and selectably split an incoming beam of radiation into a selectable number of beam segments, each of which is dynamically directed in a selectable direction.[0145]
Reference is now made to FIG. 5, which is an illustration of varying the number and angle of laser beams produced by a dynamic beam splitter in the system and functionality of FIGS. 1 and 2.[0146]Laser pulses424 in a laserpulse timing graph426 are designated434,436 and438 respectively.Laser pulses424 define, for example,beam122 in FIG. 2 and are mutually separated in time.
Control signals[0147]444,446 and448 are shown above laserpulse timing graph426, corresponding topulses434,436 and438 respectively. The control signals444-448 are shown being fed into atransducer452 associated with anAOD460, corresponding toAOD130 in FIG. 2. Acoustic waves,464,466 and468, corresponding to control signals444-448 are shown inAOD460.Acoustic wave464 corresponds to controlsignal444,acoustic wave466 corresponds to controlsignal446 andacoustic wave468 corresponds to controlsignal448.
At a moment in time corresponding to the emission of a[0148]laser pulse424, aninput laser beam470 impinges on the onAOD460. The acoustic waves464-468 respectively causelaser beam470 to be segmented into a selectable number of beam segments, generally designated450. Each of thebeam segments450 is deflected at an angle of deflection which is functionally related to a corresponding frequency in a portion of acoustic waves464-468.
FIG. 5 shows with particularity the timing relationship between[0149]laser pulses424 and operation ofAOD460 as a dynamic beam splitter which is operative to split aninput beam470 into a selectable number ofbeam segments450 at a duty cycle which is less than the pulse repetition rate represented bypulses424.
A[0150]control signal444 having a generally uniform frequency generates anacoustic wave464 inAOD460 also having a generally uniform frequency. When thebeam470 associated withpulse434 impinges onAOD460, a single beam-segment480 is output. It is noted that a part ofbeam470 may not be deflected. This is ignored for the purposes of simplicity of illustration.
A[0151]control signal446 having a six spatially distinct segments482-492, each segment having a generally uniform frequency and a frequency which is different from a neighboring segment, generates anacoustic wave466 inAOD460 also having six spatiallydistinct segments502,504,506,508,510 and512. Each of the spatially distinct segments502-512 respectively has a generally uniform acoustic frequency and an acoustic frequency which is different from a neighboring segment. When thebeam470 associated withpulse436 impinges onAOD460, six distinct beam-segments522-532 are output. It is noted that a part ofbeam470 may not be deflected. This is ignored for the purposes of simplicity of illustration.
A[0152]control signal448 having a two spatiallydistinct segments542 and544, each segment having a generally uniform frequency and a frequency which is different from its neighboring segment, generates anacoustic wave468 inAOD460 also having two spatiallydistinct segments562 and564. Each of the spatiallydistinct segments562 and564 respectively has a generally uniform acoustic frequency and an acoustic frequency which is different from its neighboring segment. When thebeam470 associated withpulse438 impinges onAOD460, two distinct beam-segments572 and574 are output. It is noted that a part ofbeam470 may not be deflected. This is ignored for the purposes of simplicity of illustration.
In the embodiment seen in FIG. 5, the division of a[0153]beam470 into different numbers of beam-segments450 results inbeam segments450 each having different a different width. In such embodiment it may be desirable to provide suitable optics downstream ofAOD460 in order to control the size of a spot impinging on asubstrate14, resulting from each different number of beam-segments450, for example to ensure a uniform diameter.
Reference is now made to FIG. 6, which is an illustration of varying the angle of multiple laser beams produced by a dynamic beam deflector in the system and functionality of FIGS. 1A and 2.[0154]Laser pulses624 in a laserpulse timing graph626 are designated634 and636 respectively.Laser pulses624 define, for example, beam22 in FIG. 1 andbeam122 in FIG. 2, and are mutually separated in time.
Control signals[0155]644 and646 are shown above laserpulse timing graph626, corresponding topulses634 and636 respectively. The control signals644 and646 are shown being fed into atransducer652 associated with anAOD660, corresponding toAOD30 in FIG. 1 andAOD130 in FIG. 2. Acoustic waves, corresponding to controlsignals644 and646 are shown inAOD660.Acoustic wave664 corresponds to controlsignal644, andacoustic wave666 corresponds to controlsignal646.
At a moment in time corresponding to the emission of a[0156]laser pulse624, aninput laser beam670 impinges on the onAOD660. Theacoustic waves664 and666 respectively causelaser beam670 to be segmented into a selectable number of beam segments, generally designated650, as described with reference to FIG. 5. Each of thebeam segments650 is deflected at an angle of deflection which is functionally related to a corresponding frequency in a portion ofacoustic waves664666.
FIG. 6 shows with particularity the timing relationship between[0157]laser pulses634 and operation ofAOD660 as a dynamic beam splitter which is operative to split theinput beam670 into a selectable number ofbeam segments650, and to separately deflect thebeam segments650 at distinct angles of deflection, all at a duty cycle which is less than the pulse repetition rate represented bypulses624.
A[0158]control signal644 having a six spatially distinct segments682-692, each segment having a generally uniform frequency and a frequency which is different from a neighboring segment, generates anacoustic wave664 inAOD660 also having six spatiallydistinct segments702,704,706,708,710 and712. Each of the spatially distinct segments702-712 respectively has a generally uniform acoustic frequency and an acoustic frequency which is different from a neighboring segment. When thebeam670 associated withpulse634 impinges onAOD660, six distinct beam-segments722-732 are output. It is noted that the respective frequencies in each of segments702-712 progressively increases, relative to the previous segment, and as a result the angle at which beams722-732 are deflected increases in a corresponding manner.
A[0159]control signal646 having a six spatially distinct segments742-752, each segment having a generally uniform frequency and a frequency which is different from a neighboring segment, generates anacoustic wave666 inAOD660 also having six spatiallydistinct segments762,764,766,768,770, and772 respectively. Each of the spatially distinct segments762-772 respectively has a generally uniform acoustic frequency and an acoustic frequency which is different from a neighboring segment. When thebeam670 associated withpulse636 impinges onAOD660, six distinct beam-segments782-790 are output, in which beam-segment782 corresponds toacoustic wave segment762, beam-segment784 corresponds toacoustic wave segment764, beam-segment786 corresponds toacoustic wave segment766, beam-segment788 corresponds toacoustic wave segment768, beam-segment790 corresponds toacoustic wave segment770, and beam-segment792 corresponds to acoustic wave segment792.
It is seen that the arrangement of respective frequencies in each of acoustic wave segments[0160]762-772 does not change in an orderly manner. As a result some of beams782-790 overlap. This enables beams782-790 to be selectably deflected to impinge, for example on a mapping element60 (FIG. 1). It is further noted that the change in angles occurring in beams782-792, relative to beams722-732 results from the reconfiguration of the acoustic wave inAOD660. Accordingly, the change in configuration of the acoustic wave, fromacoustic wave664 toacoustic wave666, is carried out in a period of time that is less than the time separation betweenpulses634 and636,
Reference is now made to FIG. 7 which is an illustration of varying the angles of multiple at least partially superimposed laser beams produced by a dynamic beam splitter, by modulating, for example control signals[0161]36, including multiple at least partially superimposed different frequency components, in the system and functionality of FIGS. 1A and 2. Acontrol signal844 is shown being fed into atransducer852, associated with anAOD860, corresponding toAOD30 in FIG. 1 andAOD130 in FIG. 2. Anacoustic wave864, corresponding to controlsignal844 is shown inAOD860.
[0162]Control signal844 corresponds to a mutual superimposition of three control signals (not shown) each having a different frequency. It is noted that a greater or lesser number of control signals may be superimposed, and that superimposition of three control signals is chosen merely for the purposes of simplicity of illustration.
At a moment in time corresponding to the emission of a laser pulse in a[0163]pulsed laser beam22 or122, aninput laser beam870 impinges on the onAOD860 and is split into threebeam segments880,882 and884. Each of the beam segments880-884 has a generally uniform width generally related to the width ofacoustic wave864 inAOD860. Each of thebeam segments880,882 and884 is deflected at an angle functionally related to one of the frequency components isacoustic wave864, and at least partially mutually overlap.
Reference is now made to FIG. 8 which is an illustration of varying the energy distribution among multiple laser beam segments produced by a dynamic beam splitter in the system and functionality of FIGS. 1A and 2. Typically, due to the Gaussian energy profile of typical laser beams, a uniform spatial splitting of the beam results in beam segments, such as[0164]beam segments150 in FIG. 2, which do not have a uniform energy property. It is appreciated, that a beam shaping element, located upstream of the dynamic beam splitter, may be provided to form a beam, such asbeam22 or122, which has a non-Gaussian, preferably top-hat shaped energy profile. In accordance with an embodiment of the invention, presently described, sub-beams having a generally uniform energy characteristic that is formed without using an external beam shaping element. Additionally, an energy characteristic of the sub beams may be changed in a time which is less than a separation time between pulses in a pulsed laser.
In FIG. 8,[0165]laser pulses924 in a laserpulse timing graph926 are designated934 and936 respectively.Laser pulses924 define, for example,beam122 in FIG. 2 and are mutually separated in time. Aninput energy graph940 indicates a typical Gaussian energy characteristic, in one dimension, of a laser beam such asbeam122.
Control signals[0166]944 and946 are shown above laserpulse timing graph926, and correspond topulses934 and936 respectively. The control signals944 and946 are shown being fed into atransducer952 associated with anAOD960, corresponding toAOD30 in FIG. 1 andAOD130 in FIG. 2. Acoustic waves, corresponding to controlsignals944 and946 are shown inAOD960.Acoustic wave964 corresponds to controlsignal944 andacoustic wave966 corresponds to controlsignal946.
At a moment in time corresponding to the emission of a[0167]laser pulse924, aninput laser beam970 impinges on theAOD960. Theacoustic waves964 and966 respectively causelaser beam970 to be segmented into a selectable number of beam segments, generally designated950. Each of thebeam segments950 is deflected at an angle of deflection which is functionally related to a corresponding distinct frequency in a portion ofacoustic waves964 and966, and the width of beam segments is related to the width of a portion ofacoustic waves964 and966 which has a distinct frequency.
It is seen in FIG. 8 that signal[0168]944 is divided into sixsegments945 which are not of equal width. The resultingacoustic wave964 thus is likewise formed of six segments which are not of equal width. Moreover, the respective widths of the resulting beam segments972-982 are also not equal.
It is appreciated that the respective widths of[0169]segments945, can be dynamically arranged and modified to produce beam segments, which, although having different spatial widths, have a generally uniform energy characteristic. Thus the selectable division ofacoustic wave964 intonon-uniform segments945 produces a selectable energy characteristic of each beam972-982, indicated by the area underoutput energy graph984. For example, the dynamic splitting ofbeam970 can be such that a relatively small spatial section of a high energy portion ofbeam970 is used to producebeam segments976 and978, a relatively large spatial section of a low energy portion ofbeam970 is used to producebeam segments972 and982, and an intermediate size spatial portion ofbeam970 is used to producebeam segments974 and980. Energy uniformity is seen inhistogram990.
Thus, energy uniformity of output beam segments may be controlled and made generally uniform by distributing energy among beam segments[0170]972-982, generally without attenuating the energy ofinput beam970. Moreover, energy uniformity may be controlled independently of the number ofbeam segments984 into whichbeam970 is split, or the direction of deflection of respective beam segments. In accordance with an embodiment of the invention, suitable optics (not shown) are provided downstream ofAOD960 in order to accommodate and control the respective diameters of beam-segments972-982, each of which have a different width, but generally uniform energy distribution.
In FIG. 8 it is also seen that the energy distribution among beam segments[0171]972-982 may be varied betweenpulses924. Thus in the graphs associated withpulse936,segments1005 ofcontrol signal946 have been made generally uniform. As a result, the spatial width of each of thebeam segments950 resulting fromacoustic wave966 is generally uniform, however the energy distribution among the beam segments resulting from interaction ofacoustic wave966 andbeam970 is not uniform, as shown byhistogram1010.
Uniformity of an energy characteristic among beam segments formed by an[0172]acoustic wave966 may be improved, for example by providing a beam shaping element (not shown) external toAOD960 and operative to shape the energy profile ofinput beam970. Alternatively, the power ofacoustic wave966 atvarious segments1015, represented by convention as an amplitude, may be varied. In generally an increase power ofacoustic wave966 results in a higher transmissivity through an AOD, namely a relatively greater portion of energy passes throughAOD960. Thus in order to providesub-beams950, and972-982 having a generally uniform energy characteristic, an energy characteristic of beam segments which are formed from a spatial portion of970 having a relatively high energy level may be attenuated by reducing thereat the power ofacoustic wave966.
FIGS. 9A and 9B are illustrations of varying the number of uniform diameter laser beams produced by a dynamic beam splitter in the system and functionality of FIGS. 1 and 2. As seen in FIGS. 9A and 9B a[0173]beam size modifier1120 is provided to selectably change the size of aninput beam1170 impinging on anAOD1130. The beam size modifier may be, for example, a beam expander, zoom lens or cylindrical telescope.
As seen in FIG. 9A, a modified[0174]size beam1172 is output frombeam size modifier1120. In the example seen in FIG. 9A, the modifiedsize beam1172 impinges on only a portion ofAOD1130, thereby reducing an operative portion ofAOD1130. Acontrol signal1136 is provided to form anacoustic wave1138 inAOD1130, which in turn is operative to selectably split modifiedsize beam1172 into twobeam segments1150 each having, for example, a standardized modular size.
As seen in FIG. 9B, a modified[0175]size beam1182 is output frombeam size modifier1120. In the example seen in FIG. 9B, the size ofbeam1182 is different frombeam1172, is substantially not modified respective ofbeam1170 and impinges on substantially and entire operative portion ofAOD1130. Acontrol signal1146 is provided to form anacoustic wave1148 inAOD1130, which in turn is operative to selectably splitbeam1182 into sixbeam segments1190. Each of beam segments have, for example, a standardized modular size corresponding to the size ofbeam segments1150.
FIGS. 10A and 10B are an illustration of varying the number of uniform diameter laser beams produced by a dynamic beam splitter as shown in FIG. 9 in accordance with a preferred embodiment of the present invention. An[0176]array1200 of partially transmissive beam splitter elements1202-1212 is provided in cascade to produce a plurality of separated beam segments, which are provided to adynamic beam deflector1230.
The transmissivity of each beam splitter element is determined as a function of its location relative to a last beam splitter element in the array. Thus, as seen in FIGS. 10A and 10B, a first[0177]beam splitter element1202 deflects 16.7% of the input beam, a secondbeam splitter element1204 deflects 20% of the input beam reaching it, a thirdbeam splitter element1206 deflects 25% of the input beam reaching it, a fourthbeam splitter element1208 deflects 33.3% of the input beam reaching it, a fifthbeam splitter element1210 deflects 50% of the input beam reaching it, and a sixth and lastbeam splitter element1212 deflects 100% of the input beam reaching it.
As seen in FIG. 10A, all of the beam splitter elements[0178]1202-1212 are positioned in line to receive alaser input beam1222, and a plurality of sixdistinct beam segments1224, each having about 16.7% of the total energy ininput beam1222, are output to impinge on adynamic beam deflector1230. A spatially sectioned acoustic wave1238 is formed inAOD1230 and is operative to dynamically deflect each ofbeam segments1222, generally as described hereinabove.
As seen in FIG. 10B, beam splitter elements[0179]1202-1208 are out of the optical path oflaser input beam1222, such thatbeam1222 first impinges onbeam splitter element1210. Only twodistinct beam segments1226, each having about 50% of the total energy ininput beam1222, are output to impinge on adynamic beam deflector1230. A spatially sectioned acoustic wave1238 is formed inAOD1230 and is operative to dynamically deflect each ofbeam segments1222, generally as described hereinabove.
It is noted, from the foregoing description with respect to FIGS.[0180]5-10B, that an a dynamic deflector comprises an AOD and is operative to perform at least on of the following functionalities: selectably split an input beam into a selectable number of output beams, to select an energy characteristic of the output beams, and to direct the output beams each at a selectable angle.
It is appreciated by persons skilled in the art that the present invention is not limited by what has been particularly shown and described hereinabove. Rather the present invention includes modifications and variations thereof which would occur to a person of skill in the art upon reading the foregoing description and which are not in the prior art.[0181]