US20030199226A1 - Roll format polishing process for optical devices - Google Patents

Abstract

Embodiments of the invention provide methods and apparatuses to process optical subsystems. In one aspect, the optical subsystems are polished using an orbital polishing apparatus adapted to polish and clean an optical subsystem interconnect surface. The orbital polishing apparatus is adapted to incrementally advance a movable web of polishing material to provide polishing uniformity and consistent polishing performance device to device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS
• The present application is a Continuation of co-pending U.S. Utility patent application Ser. No. 09/957,719, filed Sep. 21, 2001 by the inventors herein and entitled “Roll Format Polishing Process for Optical Devices,” now U.S. Pat. No. 6,572,450.[0001]
BACKGROUND OF THE INVENTION
• 1. Field of the Invention[0002]
• Embodiments of the invention relate to methods and apparatuses for processing optical subsystems.[0003]
• 2. Background of the Related Art[0004]
• In the fabrication of fiber optic communication systems, optical interconnects, fiber optics, and other components are assembled to form various interconnected optical subsystems. Typically, optical components are integrated into an optical subsystem that is collectively used to create, for example an optical switch. As the communication industry's need for optical communication bandwidth has increased, the ability for interconnect surfaces to provide a precise connection between optical subsystems is becoming critical, especially with regard to optical transmission modes that use multiple wavelengths of light to transmit information such as Dense Wavelength Division Multiplexing (DWDM). DWDM is a fiber-optic transmission technique that employs multiple light wavelengths to transmit data parallel-by-bit or serial-by-character. DWDM is a major component of optical networks that allows the transmission of email, video, multimedia, data, and voice—carried in Internet protocol (IP), asynchronous transfer mode (ATM), and synchronous optical network/synchronous digital hierarchy (SONET/SDH), respectively, over fiber optic communication systems.[0005]
• Generally, fiber optic interconnections include two optical connections mated together to provide a continuous optical path. Conventionally, to form an optical interconnect interface, a fiber optic cable is generally terminated into an optical interconnection called a ferrule that is adapted to connect to optical systems or mating optical interconnects. Ideally, optical interconnects such as ferrules are manufactured with precisely polished and dimensionally optimized interconnect surfaces to provide low insertion loss and to prevent cross talk. Typically, ferrules are polished in batch mode where several ferrules are polished simultaneously with one polishing surface, and often are polished by hand. Unfortunately, as polishing pressure, type of polishing material, and direction of polishing between the surface of the optical components being polished and the polishing surface vary, the conventional batch process often leads to manufacturing issues such as specification repeatability, and undesirable interface aberrations affecting insertion loss, light polarization, extinction ratio, return loss performance, etc. Moreover, as polishing is done in a generally rotating fashion, particles embedded within the polishing material provided can form other aberrations such as scratches, nicks, undercuts, abrasions, etc., that can adversely affect the optical clarity of the interconnect surface and, thus, the optical transmission efficiency.[0006]
• Typically, interconnection inefficiencies are overcome by additional equipment such as repeaters. Repeaters amplify the optical signal to overcome insertion loss and signal attenuation, thereby extending the optical signal broadcast range. Additionally, testing equipment such as an interferometer is used to precisely test for example, the radius of curvature and apex offset. The radius of curvature is the radius of the interconnect surface and is critical for the proper mating of interconnect surfaces. The apex offset is the measure of the interconnect optical path alignment and is critical for the proper alignment of the optical paths between two optical interconnect surfaces. Unfortunately, testing each interconnection for parameters such as radius of curvature and apex offset increases the manufacturing time and, thus, the cost of the optical subassemblies. Further, for large fiber optic communication systems employing thousands of interconnections, using equipment such as repeaters designed to overcome the interconnect inefficiencies may lead to an overall increase in the cost of the fiber optic communication system. Thus, having optical interface aberrations that affect the transmission of light can adversely affect information flow, reduce the bandwidth, reduce the efficiency of fiber optic communication systems, increase equipment costs, and generally increase the cost of the communication system.[0007]
• Therefore, there is a need for a method and apparatus to provide a system for polishing optical component interfaces in a simple, repeatable, efficient, and cost effective manner.[0008]
SUMMARY OF THE INVENTION
• Aspects of the invention generally provide a method and apparatus for polishing optical component interfaces used in interconnecting optical subassemblies. In one embodiment, the invention provides an apparatus for processing optical components, including a polishing apparatus having a polishing table and a polishing material supply apparatus adapted to supply polishing material proximate the polishing table, an orbital actuator rotatably coupled to the polishing apparatus and adapted to rotate the polishing apparatus in an orbital motion, and a component support adapted to position an optical component in contact with polishing material adjacent the polishing table.[0009]
• In another embodiment the invention provides an apparatus for processing optical components, including an orbital actuator rotatably and flexibly coupled to a polishing apparatus having a polishing table, and a polishing material supply apparatus and a polishing material receiver coupled to the polishing apparatus wherein the polishing material supply apparatus is adapted to provide a web of polishing material to the polishing material receiver to define a renewable polishing surface adjacent the polishing table.[0010]
• In another embodiment the invention provides a method of processing optical components, including rotating a polishing apparatus comprising a polishing table thereon and a polishing material supply apparatus in an orbital direction, providing from the polishing material apparatus a renewable web of polishing material positioned adjacent the polishing table, maintaining a polishing pressure of a surface of an optical component against the web of polishing material and against the polishing table, and polishing the surface.[0011]
BRIEF DESCRIPTION OF THE DRAWINGS
• A more particular description of aspects of the invention, briefly summarized above, may be had by reference to the embodiments thereof, which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.[0012]
• FIG. 1 is a perspective view of an optical-subsystem polishing tool.[0013]
• FIG. 2 is a substantially front perspective view of the optical-subsystem polishing tool of FIG. 1.[0014]
• FIG. 3 is a substantially side perspective view of an optical-subsystem polishing tool of FIG. 1.[0015]
• FIG. 4 is a substantially back view of the optical-subsystem polishing tool of FIG. 1.[0016]
• FIG. 5 is an exploded view of the optical-subsystem polishing tool of FIG. 1 illustrating the eccentric shaft and polishing orbital assembly.[0017]
• FIG. 6 is a front view of an optical component support.[0018]
• FIG. 7 is a partial-section al view of an optical component sup port.[0019]
• FIG. 8 is a side view of an optical component support.[0020]
• FIG. 9 is a flow diagram illustrating a polishing process using the polishing tool of FIG. 2.[0021]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
• FIG. 1 is a perspective view of one embodiment of a staged optical[0022]component polishing system100. The staged opticalcomponent polishing system100 is a self-contained system having the necessary processing utilities supported on amainframe structure101 which can be easily installed and which provides a quick start up for operation. The opticalcomponent processing system100 shown generally includes threepolishing apparatuses108 that provide three optical component polishing stages, namely, acoarse polishing stage102 where optical components are given an initial coarse polish, afine polishing stage104 where optical components are given a finer polish than the initial coarse polish, and afinish polishing stage106 where optical components are given a final finish polish. The optical components are polished at each stage using a web of polishing material having a polishing surface thereon including materials such as silicon-carbide, diamonds, silicon-dioxide, and the like. In one aspect, after the coarse and fine polishing stages, the component is cleaned with de-ionized water. Subsequently, an inert pressurized gas such as CO₂is used as a cleaning agent to remove the fine residue adhering to the optical surfaces produced during the polishing process. Thesubstrate processing system100 also includes a back end (not shown) which houses the support utilities needed for operation of thesystem100, such as compressed air used to power portions of thesystem100, de-ionized water used for cleaning, vacuum, and electrical power distribution. While the processing system illustrates three polishing stages, the arrangement and combination of the individual polishing stages may be altered for purposes of performing specific polishing steps. For example, the coarse polishing stage may be configured to provide a finish polish step.
• In one aspect, the polishing processes are controlled by a[0023]process controller105 such as programmable logic controller (PLC) or other suitable device coupled to the threeoptical polishing apparatuses108 via input/output (I/O)cable90. In general, theprocessing system controller105 includes, or is coupled to, a central processing unit (CPU), and a memory. The memory contains a polishing control program that, when executed on the CPU, instructs thepolishing apparatuses108 to perform a polishing process. The polishing control program conforms to any one of a number of different programming languages. For example, the program code can be written in programmable logic controller (PLC) code (e.g., ladder logic), C, C++, BASIC, Pascal, or a number of other languages.
• FIGS. 2, 3, and[0024]4, are a substantially front, side, and back perspective views, respectively, illustrating one embodiment of apolishing apparatus108. Thepolishing apparatus108 may be used to polish the interconnect surfaces of optical components such as ferrules. The term ferrule is used herein to denote a fiber-optic cable connector. Ferrules generally have three parts, a flange portion usually made of a rigid material such as stainless steel to allow the ferrule to be mechanically coupled to an optical subassembly, a body, and an optical transmission portion having a small center opening used to receive a fiber optic cable therein. The body of the ferrule is typically made of materials such as zirconia, alumina, and the like, adapted to support the fiber optic cable. Ferrule connectors are available in several different light transmission modes such as single mode used to transmit one signal per fiber, or multimode used to transmit many signals per fiber, depending on the number of wavelengths contained within the transmission.
• The[0025]polishing apparatus108 includes abody112, asupport118, and a mountingplate115. In one aspect, thebody112,support118,frame101, and mountingplate115 are mounted to each other using conventional fasteners such as screws, bolts, nuts, and the like, and in another aspect may be a single component. While in one aspect, thesupport118 is vertically mounted on the mountingplate115 to define a vertical polishing position for anorbital assembly120 to help in the removal of polishing debris, it is contemplated that theorbital assembly120 may mounted in any position to perform the same polishing function. In one aspect, acollection tray160 is disposed under theorbital assembly120 to collect debris and fluids during processing. Thetray160 is coupled to adrain161 that is fluidly coupled to a waste collection system or container (not shown).
• The[0026]orbital assembly120 includes a polishingassembly130 and aspacer132 flexibly coupled to the polishingassembly130 and rigidly mounted to thesupport118. The polishingassembly130 is positioned to allow the optical component to be polished at generally an orthogonal direction relative thesupport118. The polishingassembly130 includes a right and leftside plate134,136, respectively, adapted to support a polishing table138, a polishingmaterial supply apparatus140, and a polishingmaterial receiver142. In one aspect, the polishing table138 is formed from a rigid material having a low coefficient of friction such as Teflon® impregnated aluminum, stainless steel, or other materials having a low friction surface thereon. In another aspect, the low friction surface may be applied to the polishing table138 as a coating thereon. The polishing table138 also includes a polishingsurface recess139 formed therein. In operation, a web of polishingmaterial165 is disposed over the polishing table138 proximate therecess139 and between the polishingmaterial supplier140 and polishingmaterial receiver142.
• In one aspect, a sub-pad[0027]156 typically composed of a flexible material such as rubber, vinyl, resin, plastic, and the like, that provides a flexible but firm polishing surface, is disposed in therecess139. The sub-pad156 is also adapted to provide a desired amount of flexure and resistance under the polishingmaterial165 against the component to form a desired radius of curvature for the optical surface being polished. In one aspect, the sub-pad156 is adapted to form a radius of curvature dependant upon the pressure developed between the surfaces being polished, polishingmaterial165, and the sub-pad156. For example, a lighter pressure between an optical component being polished, polishingmaterial165, and the sub-pad156 provides for a flatter (i.e., smaller) radius of curvature whereas a greater pressure provides for a rounder (i.e., larger) radius of curvature. In another aspect, to provide for a greater polishing pressure to form a desired radius of curvature while decreasing the polishing time required, the sub-pad156 includes a firmer surface having more flexure resistance thereon. It is contemplated that the compliance and resilience of the sub-pad156 may be selected to provide any desired radius of curvature, flexure, and processing time.
• In one aspect, the polishing[0028]material supply apparatus140 is adapted to support a roll of polishingmaterial165 thereon and includes abrake152. Thebrake152 applies a frictional force to the polishingmaterial supply apparatus140 which keeps the roll of polishingmaterial165 taught. The polishingmaterial supply apparatus140 further includes asupply clutch154 to control the dispensing of the polishingmaterial165 from the polishingmaterial supply apparatus140. The polishingmaterial receiver142 is coupled to areceiver clutch164 mounted to theleft side plate136. Thereceiver clutch164 constrains the web of polishing material movement to only one direction from the polishingmaterial supply apparatus140 to the polishingmaterial receiver142. The polishingmaterial receiver142 is rotated by adrive linkage166 coupled to adrive apparatus143 to take up and thereby advance the polishingmaterial165 across the polishing table138 andsub-pad156. In one aspect, thesupply clutch154, thereceiver clutch164, and brake152 are operated together to control the advancement of the web of polishingmaterial165 while maintaining a taught web of polishingmaterial165 across the polishing table andsub-pad156.
• An air inlet/[0029]outlet147 is disposed on theright side plate134, in communication with the polishing table138, and coupled to air conduction channels (not shown) that extend through the polishing table138. The air conduction channels are coupled toholes151 disposed around therecess139 within agroove158. A vacuum pressure may be provided to thegroove158 via the air inlet/outlet147 through theholes151 to hold the web of polishingmaterial165 to the sub-pad156 and polishing table138 during a polish process. In one aspect, theholes151 may be distributed throughout therecess139 and/or thegroove158 to allow therecess139 under vacuum to hold the web of polishingmaterial165 to the sub-pad156 and polishing table138. In another aspect, air pressure may be provided from the air inlet/outlet147 to theholes151 during a polish material cleaning/renewing process to force the polishingmaterial165 away from the polishing table138 releasing debris and/or allowing the polishingmaterial165 to be dispensed from the polishingmaterial supply apparatus140 to the polishingmaterial receiver142.
• A[0030]component support182, used to support optical components during processing, is mounted by asupport175 to a polishingforce apparatus144. The polishingforce apparatus144 is used to position and force optical components held by thecomponent support182 against the polishingmaterial165 andsub-pad156. The polishingforce apparatus144 may be any apparatus such as a motor driven actuator adapted to move thecomponent support182 generally perpendicular toward and away from the polishing table138, and as needed, during a polishing operation, maintains pressure of the optical component against the polishingmaterial165 andsub-pad156. The polishingforce apparatus144 may be slidably mounted to apolishing position apparatus146 which is mounted to anupper end122 of thesupport118. The polishingposition apparatus146 may be any apparatus such as a motor driven actuator adapted to laterally move thecomponent support182 generally parallel to the polishing table138 and across the surface of the polishingmaterial165. In one aspect, thecomponent support182 is independently mounted to theframe101 to provide vibration isolation from the polishingassembly130. In another aspect, the polishingforce apparatus144 and polishingposition apparatus146 are mounted to thesupport118 via flexible mounting fasteners such as rubber, vinyl, plastic, nylon, and the like, adapted to provide vibration damping therebetween.
• In one aspect, the[0031]component support182 includes afluid nozzle185 that is mounted to thesupport175. Thefluid nozzle185 receives fluids such as polishing slurries, de-ionized water, and the like, from a fluid supply (not shown) and delivers the fluids through anozzle extension186. Thenozzle extension186 is aligned to spray a stream of fluids upon the surface of the polishingmaterial165.
• In one aspect, the[0032]component support182 further includes asensor assembly188, adapted to measure the polishing pressure of the optical component against the polishingmaterial165 during a polishing process and provide a signal to theprocess controller105 indicative of the polishing pressure. In operation, the polishingforce apparatus144,sensor assembly188, andprocess controller105 form a polishing pressure feedback system to maintain a generally constant pressure between the optical component, polishingmaterial165, and the polishing table138 throughout the polishing process.
• FIG. 5 is an exploded view of the[0033]polishing apparatus108 of FIG. 2 illustrating theeccentric shaft176 and polishingassembly130. FIGS.1-4 are referenced as needed in the discussion of FIG. 5.
• The polishing[0034]assembly130 is coupled to anorbital actuator170 to move the polishingassembly130 in an orbital motion about a polishing plane that is generally orthogonal to the surface of the optical component being polished. Theorbital actuator170 includes adrive frame180 supporting amotor174 coupled to aneccentric shaft176 extending generally perpendicular through thesupport118. Thesupport118 includes acentral opening205 therein for receiving theeccentric shaft176 therethrough. Thecentral opening205 is sized to allow theeccentric shaft176 to move in an orbital motion within thecentral opening205 without touching thesupport118. One end of theeccentric shaft176 is rotatably coupled to the polishingassembly130 via abearing172. An opposite end of theeccentric shaft176 is coupled to the shaft of themotor174 via aflexible coupling198. One or more counter balances178 are disposed on theeccentric shaft176 to offset the centrifugal and centripetal forces developed by the non-uniform mass distribution of the polishingassembly130 during operation, thereby minimizing vibration.
• As the[0035]eccentric shaft176 axially spins, it orbitally rotates about amotor shaft center215. As thebearing172 generally provides some rotational friction, the polishingassembly130 is rotationally urged about theshaft176 in the direction of the shaft rotation. To rotationally constrain the polishingassembly130, while allowing the polishingassembly130 to simultaneously move with the orbital rotation of theeccentric shaft176, fourflexible supports210A-D are rotatably mounted on one end to thespacer132 and on an opposite end to the polishingassembly130. Thespacer132 andsupport118 form acounterbalance cavity230 to hold the one ormore counterbalances178 therein. Thus, in operation, the polishingassembly130 moves in an orbital fashion about theshaft176 while maintaining a generally parallel position with respect to thesupport118.
• FIGS. 6 and 7 are front views illustrating one embodiment of the[0036]component support182 comprising a pair of grippers184 (e.g., jaws) adapted to hold theoptical component227 to be polished in a desired position generally orthogonal to the polishing table138. In one aspect, thegrippers184 include twoblades220A and220B adapted to hold anoptical component227 therebetween. The twoblades220A,220B include acomponent notch179A and179B that when brought together form acomponent groove225 sized to hold various types of optical components therein and is adapted to hold the central axis of the optical component in a polishing position. In another aspect, thegrippers184 are operated pneumatically. In another aspect, theblades220A and220B include anair nozzle177 to provide air pressure to clean the optical component and polishingmaterial165 of residue. FIG. 8 is a side view of thegrippers184 illustrating thegrippers184 holding anoptical component227 proximate the polishing table138 andsub-pad156.
• Operation[0037]
• FIG. 9 is a flow diagram illustrating one embodiment of a method[0038]900 of a polishing sequence. FIGS.1-8 are referenced as needed in the following discussion of FIG. 9.
• The method[0039]900 begins when, for example, a polishing process is initiated atstep902. Atstep904, the method900 initializes the polishingapparatus108. Atstep906, the method900 checks to see if the polishingmaterial165 is available, sets the polishing table vacuum on to hold the polishingmaterial165 securely to the polishing table138 using thegroove156, and starts the optical component pick up sequence by retrieving the settings for the polishingforce apparatus144 and the polishingposition apparatus146 from, for example, theprocess controller105 viadata line90. Subsequently, atstep908, method900 determines if the polishing table vacuum (not shown) is working to supply a vacuum togrove158. If the polishing table vacuum is not working then the method900 aborts the operation atstep914. If the polishing table vacuum is working properly, then the method900 proceeds to step910. Atstep910, thegrippers184 are opened. Atstep912, the method900 determines if thegrippers184 are opened sufficiently to hold the optical component. If thegrippers184 are not open sufficiently then method900 aborts atstep914. If thegrippers184 are open sufficiently then method900 proceeds to step916. Atstep916, the method900 sets the polishingforce apparatus144 and the polishingposition apparatus146 to an optical component pickup position and closes thegrippers184 around the optical component. Atstep920, the method900 determines if thegrippers184 are closed sufficiently to allow picking up the optical component. If thegrippers184 are not closed sufficiently, then method900 aborts the process atstep914. If thegrippers184 are closed sufficiently to pickup and hold the optical component, the optical component is picked up. In one aspect, the gripper tension is determined by the amount of air-pressure used to close thegrippers184 around the component. Atstep922, the method900 retrieves the polishing sequence from theprocess controller105 and sets the polishing time, polishing force for the polishingforce apparatus144, orbital rotation speed of theorbital actuator170, de-ionized water fluid flow rate, and the stroke speed of the polishingposition apparatus146. Atstep924, themotor174 and liquid dispensers (not shown) are started. In one aspect, themotor174 spins theeccentric shaft176 at about 2000 rpm to about 4000 rpm. At step726, the method700 moves thegrippers184 holding the optical component to the position generally orthogonal the polishing table138 and using the polishingforce apparatus144 forces the component surface being polished against the polishing surface of the polishingmaterial165 and the sub-pad156, to establish the appropriate polishing force. In one aspect, the polishing force includes a minimum and maximum value whereby if the minimum or maximum values are exceeded the process controller alarms the system to abort the polish process. The polishingposition apparatus146 is set to a beginning position. In one aspect, the optical component is then polished for a predetermined time between about zero and two minutes while the polishingposition apparatus146 is advanced generally parallel to and proximate the polishingmaterial165, exposing the surface of the optical component being polished to a new portion of the orbiting polishing surface. At step728, the polishing sequence is ended. The method700 retracts thegrippers184 from the polishing position, sets the liquid dispensing to off, stops themotor174, turns on an air blow throughholes151 to clean the surface of the polishing table138 and release the polishingmaterial165. The method700 then places thegrippers184 into a unload component position to unload the optical component. Once the optical component has reached an appropriate delivery location, thegrippers184 are opened to deliver the optical component to a receiving tray (not shown). Subsequently, the polishingapparatus108 is prepared for the next component atstep930. Atstep930, the method900 advances the polishingmaterial165 via the polishingmaterial receiver142 to provide a clean polishing surface for the next optical component. Once the polishingmaterial165 is advanced, the polishing table vacuum is initiated to hold the material to the polishing table138 andair jets177 are activated to clean the polishing material surface of contaminates. Thus, the polishingapparatus108 is set to polish the next optical component.
• Staged Polish Process[0040]
• The process regime from FIG. 9 can be used for one or more stages of polishing. In one aspect, as illustrated in FIG. 1, three stages of polishing are established by mounting three polishing[0041]apparatuses108 in series to provide three stages of polishing. The first stage of polishing may be a coarse stage whereby the polishingmaterial165 used includes a more abrasive polishing surface relative to the subsequent polishing stages. The second stage of polishing receives the optical component polished by the first stage and polishes the optical component surface use a markedly less abrasive polishing surface than the first stage. The final stage of polishing accepts the optical component from the second stage and polishes the component with a markedly less abrasive surface than the second stage. Thus, each stage represents one polishing process that when combined provides a precisely polished optical component surface. In one aspect, a transfer carrier and transfer system (not shown) are used to shuttle the optical components between stages.
• Although various embodiments which incorporate the teachings of the invention have been shown and described in detail herein, those skilled in the art can readily devise many other varied embodiments within the scope of the invention. For example, it is contemplated that the polishing[0042]apparatus108 may be configured with polishingmaterial165 that has different polishing surfaces thereon. Therefore, by adjusting the polishingmaterial165, asingle polishing apparatus108 may be adapted to perform more than one type of polishing process. For example, a coarse polish surface may be on a first section of polish material, a fine on a second section of polish material, and a finish polish surface on a third section of the polish material. In addition, the various polish surfaces may be set side-by-side so that as the optical component is incrementally moved by the polishingposition apparatus146, theoptical component165 moves through each polishing process in a single stroke. In another aspect, the sub-pad156 can be adapted to have several areas of differing radius of curvature for the same pressure. For example, the sub-pad156 may have four quadrants whereby each quadrant provides for a different radius of curvature with the same pressure applied between the optical surface being polished, the polishingmaterial165, andsub-pad156. Thus, by matching optical components to a quadrant having the desired radius of curvature for a given pressure and process time, the same polishing apparatus may be used to maintain an optimal throughput while polishing any number of different optical surfaces requiring different radiuses of curvature. In another aspect, the sub-pad156 and the polishingmaterial165 are adapted to polish a multi-connector cable where the body of the ferrule includes a plurality of individual optical surfaces, each having their own radius of curvature requirements. The sub-pad156 is adapted to receive the individual optical surfaces thereon.
• While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.[0043]

Claims (44)

1. An apparatus for processing optical components, comprising:

a polishing apparatus comprising a polishing table and a polishing material supply apparatus adapted to supply a web of polishing material proximate the polishing table wherein the polishing material supply apparatus is coupled to a polishing material receiver having a web of polishing material and comprises a drag apparatus adapted to provide drag and tension to the web of polishing material;

an orbital actuator rotatably coupled to the polishing apparatus and adapted to rotate the polishing apparatus in an orbital motion; and

a component support adapted to position a surface of an optical component in contact with polishing material adjacent the polishing table.

2. The apparatus ofclaim 1, wherein the polishing table comprises at least one groove therein proximate the polishing material wherein the groove comprises at least one air passage therein.

3. The apparatus ofclaim 2, wherein the air passage defines a vacuum inlet coupled to plurality of vacuum holes disposed within the groove to provide a vacuum pressure between the polishing table and the web of polishing material.

4. The apparatus ofclaim 2, wherein the air passage defines an air outlet coupled to plurality of air holes disposed within the groove to provide air pressure between the polishing table and the polishing material.

5. The apparatus ofclaim 2, wherein the polishing table comprises a low friction surface proximate the polishing material.

6. The apparatus ofclaim 5, wherein the polishing table comprises materials selected from aluminum, Teflon impregnated aluminum, stainless steel, and combinations thereof.

7. The apparatus ofclaim 5, wherein the low friction surface comprises materials selected from aluminum, Teflon impregnated aluminum, stainless steel, and combinations thereof.

8. The apparatus ofclaim 2, wherein the groove defines a perimeter of a polishing area comprising a flexible material therein having a resilient surface thereon proximate to and in slidable contact with the polishing material.

9. The apparatus ofclaim 8, wherein the resilient surface comprises a deformable surface thereon adapted to provide a radius of curvature to the surface of the optical component being polished.

10. The apparatus of,claim 1, wherein the drag apparatus comprises a drag brake.

11. The apparatus ofclaim 1, wherein the polishing material receiver comprises an advancement apparatus adapted to advance the polishing material from the polishing material supplier to the polishing material receiver.

12. The apparatus ofclaim 11, wherein the advancement apparatus comprises a drive apparatus adapted to advance the web of polishing material from the polishing material supply apparatus to the polishing material receiver.

13. The apparatus ofclaim 11, wherein the advancement apparatus comprises a clutch.

14. The apparatus ofclaim 1, wherein the orbital actuator comprises a motor coupled to an eccentric shaft rotatably coupled to the polishing apparatus.

15. The apparatus ofclaim 14, wherein the eccentric shaft comprises at least one counterbalance positioned on the shaft and sized to offset the centripetal and centrifugal forces generated during the orbital motion of the polishing apparatus.

16. The apparatus ofclaim 1, wherein the component support comprises a pair of jaws adapted to hold an optical component therebetween.

17. The apparatus ofclaim 16, wherein the component support comprises a polishing force apparatus adapted to move a surface of the optical component against the web of polishing material and polishing table.

18. The apparatus ofclaim 16, wherein the component support comprises a polishing position apparatus adapted to move a surface of the optical component across the web of polishing material.

19. The apparatus ofclaim 1, further comprising a pressure feedback system adapted to detect and maintain an optical component polishing pressure against the web of polishing material.

20. The apparatus ofclaim 19, wherein the pressure feedback system comprises a pressure sensor coupled to the component support.

21. The apparatus ofclaim 20, wherein the pressure feedback system further comprises a process controller coupled to and responsive to the pressure sensor.

22. An apparatus for processing optical components, comprising:

an orbital actuator flexibly coupled to a polishing apparatus comprising a polishing table; and

a polishing material supply apparatus and a polishing material receiver wherein the polishing material receiver is adapted to receive a web of polishing material from the polishing material supply apparatus to define a renewable polishing surface adjacent the polishing table and wherein the polishing material supply apparatus comprises a drag apparatus adapted to provide drag and tension to the web of polishing material.

23. The apparatus ofclaim 22, further comprising a component support adapted to position the surface of an optical component in contact with the web of polishing material and polishing table.

24. The apparatus ofclaim 22, wherein the orbital actuator comprises a motor coupled to an eccentric shaft rotatably coupled to the polishing apparatus.

25. The apparatus ofclaim 22, wherein the polishing table comprises a low coefficient of friction surface.

26. The apparatus ofclaim 22, further comprising a polishing force apparatus adapted to position a surface of an optical component against the web of polishing material.

27. The apparatus ofclaim 22, further comprising a polishing position apparatus adapted to move a surface of an optical component from one polishing position to a second polishing position during a polishing process.

28. The apparatus ofclaim 22, wherein the polishing table comprises a recess having a flexible material therein.

29. The apparatus ofclaim 28, wherein the flexible material is comprised of rubber, vinyl, resin, plastic, and combinations thereof.

30. A method of processing optical components, comprising:

rotating a polishing apparatus comprising a polishing table thereon and a polishing material supply apparatus in an orbital direction, wherein a web of polishing material is supported in the polishing material supply apparatus in a manner to provide drag and tension to the web of polishing material;

providing from the polishing material apparatus a renewable web of polishing material positioned adjacent the polishing table;

maintaining a polishing pressure of a surface of an optical component against the web of polishing material and against the polishing table; and

polishing the surface.

31. The method ofclaim 30, wherein the polishing apparatus is disposed generally orthogonal to the surface being polished.

32. The method ofclaim 30, wherein aligning the renewable web of polishing material received from the polishing material apparatus on the polishing table comprises aligning the polishing table to define a polishing plane generally aligned and orthogonal to the surface.

33. The method ofclaim 30, wherein polishing the surface comprises providing a flexible polishing surface on the polishing table and pressing the surface against the web of polishing material supported by the flexible polishing surface.

34. The method ofclaim 33, further comprising forming the radius of curvature in response to the pressure of the surface against the web of polishing material supported by the flexible polishing surface.

35. The apparatus ofclaim 33, wherein at least one radius of curvature is defined by the amount of deflection of the flexible polishing surface in response to pressure thereon wherein a greater deflection defines a greater radius of curvature and a lesser deflection defines a lesser radius of curvature.

36. The method ofclaim 30, wherein maintaining the polishing pressure of a surface of an optical component against the web of polishing material and against the polishing table further comprises detecting and adjusting the polishing pressure.

37. The method ofclaim 36, wherein detecting and adjusting the polishing pressure comprises receiving a signal from a pressure sensor wherein the signal is indicative of the pressure of the surface against the web of polishing material and polishing table, processing the signal at a process controller, and adjusting the pressure of the surface against the web of polishing material and polishing table to a desired polishing pressure.

38. The method ofclaim 30, further comprises moving the surface laterally across the web of polishing material during the polishing process.

39. The method ofclaim 38, wherein moving the surface across the web of polishing material comprises, positioning the surface at a first polishing position, then, while polishing the surface, moving the surface to a second polishing position while maintaining contact the web of polishing material.

40. The method ofclaim 30, further comprising advancing the web of polishing material to provide a new portion of the web of polishing material to the surface.

41. The method ofclaim 40, wherein the polishing material supply apparatus comprises a polishing material receiver to take up the web of polishing material and a drag apparatus to keep the web of polishing material taught across the polishing table.

42. The method ofclaim 40, wherein the polishing material supply apparatus comprises a polishing material advancement apparatus for advancing the web of polishing material.

43. The method ofclaim 42, wherein the polishing material advancement apparatus comprises a clutch apparatus for controlling the advancement of the web of polishing material.

44. The method ofclaim 30, further comprising subsequent to aligning a renewable web of polishing material received from the polishing material apparatus adjacent the polishing table, forming a vacuum between the web of polishing material and the polishing table to secure the web of polishing material thereon.

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