US20030183373A1 - Video game console cooler - Google Patents

Abstract

A heat dissipation structure for electronics including a first heat sink for dissipating heat produced by a first processing unit (e.g., a Central Processing Unit (CPU)), a second heat sink for dissipating heat produced by a second processing unit (e.g., a Graphics Processing Unit (GPU)) and, a heat pipe interconnecting the first and second heat sinks. By connecting the CPU and GPU heat sinks, heat generated by the GPU can be transferred to the CPU where it can be more effectively cooled.

Description

FIELD OF THE INVENTION
• The present invention relates to a method and apparatus for cooling an electronic unit, and in particular, a method and apparatus for cooling a video game console.[0001]
DESCRIPTION OF THE RELATED ART
• A basic heat pipe comprises a closed or sealed envelope or a chamber containing an isotropic liquid-transporting wick and a working fluid capable of having both a liquid phase and a vapor phase within a desired range of operating temperatures. When one portion of the chamber is exposed to relatively high temperature it functions as an evaporator section. The working fluid is vaporized in the evaporator section causing a slight pressure increase forcing the vapor to a relatively lower temperature section of the chamber defined as a condenser section. The vapor is condensed in the condenser section and returned through the liquid-transporting wick to the evaporator section by capillary pumping action.[0002]
• Because it operates on the principle of phase changes rather than on the principles of conduction or convection, a heat pipe is theoretically capable of transferring heat at a much higher rate than conventional heat transfer systems. Consequently, heat pipes have been utilized to cool various types of high heat-producing apparatus, such as electronic equipment (See, e.g., U.S. Pat. Nos. 5,884,693, 5,890,371, and 6,076,595).[0003]
• However, there is presently no available heat pipe system, for efficiently cooling a video game console. Due to the demand for superior graphics, most modern video game consoles include both a Central Processing Unit (CPU) and a Graphics Processing Unit (GPU). Video game manufacturers (e.g., Sony, Sega, Nintendo) are constantly improving their hardware (e.g., Playstation II, Dreamcast, N64) to improve performance and graphics quality. Often times, and increase in performance results in increased heat loads (from the CPU and GPU). With video game consoles, heat dissipation is made more difficult by aesthetic concerns such as making the console housing smaller, the need to limit noise (such as cooling fans), and the need to operate in high temperature environments (such as an enclosed home entertainment center).[0004]
• For example, FIG. 1 shows a top plan view of a[0005]circuit board10 of a conventional video game console. Thecircuit board10 includes, among other circuits and elements, aCPU20 and aGPU30. Due to manufacturing and aesthetic constraints, theCPU20 is fan-cooled by afan mechanism40, however, theGPU30 is not fan-cooled. Although not explicitly shown in FIG. 1, both the CPU and GPU may have heat sinks including fins disposed thereon for increasing heat dissipation. Presuming that theCPU20 continually generates 20 Watts of power, and theGPU30 continually generates 15 Watts of power, the CPU is always kept cooler due to the passage of air generated by thefan40. Thus, operating theGPU30 at higher processing speeds (generating higher power outputs) may not be possible due to the fact that the GPU cannot be effectively cooled. This inability to operate the GPU at higher processing speeds severely limits the overall performance of the console. One solution might be to move theGPU30 to a position in front of the fan, however, this solution is not possible while maintaining the overall aesthetic of the console.
• Therefore, there is currently a need for a heat pipe system for effectively keeping cool, and cooling, both the CPU and the GPU of a video game console.[0006]
SUMMARY OF THE INVENTION
• The present invention is a heat dissipation structure for electronics comprising a first heat sink for dissipating heat produced by a first processing unit, a second heat sink for dissipating heat produced by a second processing unit and, a heat pipe interconnecting the first and second heat sinks.[0007]
• The above and other advantages and features of the present invention will be better understood from the following detailed description of the exemplary embodiments of the invention which is provided in connection with the accompanying drawings.[0008]
BRIEF DESCRIPTION OF THE DRAWINGS
• FIG. 1 shows a top plan view of a circuit board of a conventional video game console.[0009]
• FIG. 2 is an overhead isometric view of a heat dissipation structure according to an exemplary embodiment of the present invention.[0010]
• FIG. 3 shows a top plan view of a circuit board of a video game console according to an exemplary embodiment of the present invention, and including the heat dissipation structure shown in FIG. 2.[0011]
DETAILED DESCRIPTION
• Referring to FIG. 2, there is shown a[0012]heat dissipation structure100 according to an exemplary embodiment of the present invention. Theheat dissipation structure100 includes a first heat sink110 (hereinafter referred to as Central Processing Unit (CPU) heat sink110), a second heat sink120 (hereinafter referred to as Graphics Processing Unit (CPU) heat sink120), and aheat pipe130 interconnecting the CPU and GPU heat sinks. TheCPU heat sink110 comprises amain body111 with a plurality offins112 and a connection area113. The CPU heat sink is preferably made of metal such as Copper (Cu), but may be made of any suitable heat-conducting material. TheGPU heat sink120 also comprises amain body121 with a plurality offins122 and aconnection area123. As with theCPU heat sink110, the GPU heat sink is preferably made of metal such as Copper (Cu), but may be made of any suitable heat-conducting material. It will be noted that theGPU heat sink120 has substantially similar structure to theCPU heat sink110, except that it includes fewer fins.
• Although both the CPU and[0013]GPU heat sinks110,120 are shown in the exemplary embodiment including a plurality offins112,122, these fins are optional, and not necessary to the proper operation of the present invention. As is well known in the art, fins provide for increased heat dissipation by increasing the surface area of the heat sink. Accordingly, it is preferable in most cases to utilize heat sinks which include fins (to increase heat dissipation), however, such a construction is not necessary to the present invention.
• The[0014]connection areas113 and123 of the CPU andGPU heat sinks110,120 includechannels115,125 for accepting theheat pipe130. Once theheat pipe130 is placed in each of thechannels115,125, the channels may be crimped (by pliers or otherwise) to tightly hold the heat pipe.
• The[0015]heat pipe130 is comprised of atubular body member131 which extends between the CPU andGPU heat sinks110,120. In the preferred embodiment thetubular member131 is U-shaped so as to connect aCPU heat sink110 and aGPU heat sink120 which are situated side by side, however, if the CPU and GPU heat sinks were oriented differently, those of ordinary skill in the art will realize that the configuration of the tubular member may be altered accordingly (e.g., to be straight, S-shaped, etc.).
• The[0016]heat pipe130 includes anevaporator section132 disposed at a first end of thetubular member131. Theevaporator section132 serves to evaporate a working liquid (e.g., Water, etc.) disposed inside theheat pipe130, as is well known. Theheat pipe130 also includes acondenser section134 disposed at a second end thereof. Liquid vapor generated in theevaporator sections132 traverses thetubular member131 to thecondenser section134, where it again condenses to liquid form.
• It will be noted that the evaporator end of the[0017]heat pipe130 is disposed at theGPU heat sink120 so that heat generated by a GPU coupled to the GPU heat sink can be efficiently moved to the condenser end of the heat pipe (disposed at the CPU heat sink110), where the heat is fan-cooled as explained below.
• FIG. 3 shows a top plan view of a[0018]circuit board200 of a video game console according to an exemplary embodiment of the present invention, including the above-describedheat dissipation structure100. As will be understood by those skilled in the art, theheat dissipation structure100 contacts and overlies theCPU20 andGPU30. By connecting theGPU30 to the fan-cooledCPU20, the GPU can be efficiently cooled without changing its relative position on the circuit board.
• Thus, the above-described[0019]heat dissipation structure100 permits the efficient cooling of two pieces of electronic equipment (e.g., a CPU and GPU), where only one of the pieces of electronic equipment is otherwise cooled, such as by a fan. By coupling the CPU and the GPU to one another, heat generated by the not otherwise cooled GPU is transferred to the CPU which is fan-cooled. This heat dissipation structure is particularly useful for a video game console, as it allows the basic arrangement of the console to remain the same, thereby maintaining the console's aesthetic appearance, while still permitting significant heat reduction.
• Although the above discussion is directed toward a[0020]heat dissipation structure100 for cooling a CPU and a GPU of a video game console, it will be noted that the heat dissipation structure may be utilized to cool any two electronics units (e.g., two CPUs, etc.) of any electronics console (e.g., laptop computer console, etc.) Additionally, the principles of the present invention taught above may be used to manufacture a heat dissipation structure which includes more than two interconnected heat sinks (i.e., three or more heat sinks interconnected by a heat pipe or heat pipes is within the scope of the present invention).
• Although the invention has been described in terms of exemplary embodiments, it is not limited thereto. Rather, the appended claims should be construed broadly, to include other variants and embodiments of the invention which may be made by those skilled in the art without departing from the scope and range of equivalents of the invention.[0021]

Claims (20)

What is claimed is:

1. A heat dissipation structure for electronics comprising:

a first heat sink for dissipating heat produced by a first processing unit;

a second heat sink for dissipating heat produced by a second processing unit; and,

a heat pipe interconnecting the first and second heat sinks.

2. The heat dissipation structure ofclaim 1, wherein the first processing unit comprises a central processing unit.

3. The heat dissipation structure ofclaim 2, wherein the second processing unit comprises a graphics processing unit.

4. The heat dissipation structure ofclaim 1, wherein the first heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

5. The heat dissipation structure ofclaim 1, wherein the second heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

6. The heat dissipation structure ofclaim 4, wherein the first heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

7. The heat dissipation structure ofclaim 5, wherein the second heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

8. A electronics console comprising:

a first processing unit;

a second processing unit;

a first heat sink for dissipating heat produced by the first processing unit;

a second heat sink for dissipating heat produced by the second processing unit; and,

a heat pipe interconnecting the first and second heat sinks.

9. The electronics console ofclaim 8, wherein the first processing unit comprises a central processing unit.

10. The electronics console ofclaim 9, wherein the second processing unit comprises a graphics processing unit.

11. The electronics console ofclaim 8, wherein the first heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

12. The electronics console ofclaim 8, wherein the second heat sink comprises a substantially flat body member with at least one slot therein for receiving the heat pipe.

13. The electronics console ofclaim 11, wherein the first heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

14. The electronics console ofclaim 12, wherein the second heat sink includes at least one heat dissipating fin extending substantially orthogonally from said substantially flat body member.

15. The electronics console ofclaim 8, wherein said first heat sink is disposed on a face of said first processing unit.

16. The electronics console ofclaim 15, wherein said second heat sink is disposed on a face of said second processing unit.

17. The electronics console ofclaim 8, further comprising:

a fan disposed in proximity to said first processing unit and said first heat sink, wherein said first processing unit and said first heat sink are in an air path of said fan and are cooled thereby.

18. A method for cooling an electronics console, comprising the steps of:

connecting a heat pipe between first and second heat sinks of the electronics console.

19. The method ofclaim 18, comprising the further steps of:

disposing a fan in proximity to said first heat sink, wherein said fan provides a cooling airflow to said first heat sink.

20. A video game console, comprising:

a first processing unit;

a second processing unit;

a first heat sink for dissipating heat produced by the first processing unit;

a second heat sink for dissipating heat produced by the second processing unit; and,

a heat pipe interconnecting the first and second heat sinks.

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