FIELD OF THE INVENTIONThe present invention generally relates to filters for purification of fluids. More particularly, the present invention relates to a micro-fluidic anti-microbial filter.[0001]
BACKGROUND OF THE INVENTIONMEMS technology integrates electrical components and mechanical components on a common silicon substrate by using micro-fabrication technology. Integrated circuit (IC) fabrication processes, such as photolithography processes and other microelectronic processes, form the electrical components. The IC fabrication processes typically use materials such as silicon, glass, and polymers. Micro-machining processes, compatible with the IC processes, selectively etch away areas of the IC or add new structural layers to the IC to form the mechanical components. The integration of silicon-based microelectronics with micro-machining technology permits complete electro-mechanical systems to be fabricated on a single chip. Such single chip systems integrate the computational ability of microelectronics with the mechanical sensing and control capabilities of micro-machining to provide smart devices.[0002]
One type of MEMS is a micro-fluidic system. Micro-fluidic systems include components such as channels, reservoirs, mixers, pumps, valves, chambers, cavities, reaction chambers, heaters, fluidic interconnects, diffusers, nozzles, and other micro-fluidic components. These micro-fluidic components typically have dimensions between a few micrometers and a few hundreds of micrometers. These small dimensions minimize the physical size, the power consumption, the response time and the waste of the micro-fluidic system. Such micro-fluidic systems may provide wearable miniature devices located either outside or inside a human body or an animal body.[0003]
Applications for micro-fluidic systems include genetic, chemical, biochemical, pharmaceutical, biomedical, chromatography, IC cooling, ink-jet printer head, medical, radiological, environmental, as well as any devices that require liquid or gas filled cavities for operation. Such application may involve processes related to analysis, synthesis and purification. The medical applications include diagnostic and patient management such as implanted drug dispensing systems. The environmental applications include detecting hazardous materials or conditions such as air or water pollutants, chemical agents, biological organisms or radiological conditions. The genetic applications include testing and/or analysis of DNA.[0004]
An anti-microbial filter is a device that filters out microorganisms in a fluidic system. Anti-microbial filters are typically used for fluid purification, such as in air, water and drug delivery systems. In drug delivery systems, anti-microbial filters are used to prevent microorganisms in a human or an animal body from reaching the fluid source of the drug delivery. Some anti-microbial filters are made with holes that are large enough to permit fluid to flow through the filter in one direction, but small enough to prevent the microorganisms from moving through the filter in the opposite direction. Anti-microbial filters may also have a coating, such as silver, disposed on the downstream side of the filter that prevents some microorganisms from adhering to the filter and kills other microorganisms that contact the coating. Some anti-microbial filters have a long, narrow, winding path, otherwise known as a torturous path, which permits fluid to flow in one direction through the path while inhibiting the flow of microorganisms in the opposite direction. Anti-microbial filters have been made on a macro scale. However, making anti-microbial filters on a micro scale presents special challenges, such as the construction of very small holes with precision while being cost effective, manufacturable and reliable.[0005]
Accordingly, it would be desirable to have an anti-microbial filter that is small enough to be used in a micro-fluidic system. The anti-microbial filter would be constructed using micro-machining processes to permit it to be integrated into a micro-fluidic system. The micro-machining process would be precise and cost effective. Thus, the anti-microbial filter would be easy to manufacture and of high quality.[0006]
SUMMARY OF THE INVENTIONAccording to one aspect of the present invention, an anti-microbial filter adapted for a micro-fluidic system includes a filter membrane formed of a silicon-based material having a plurality of holes formed therein.[0007]
According to another aspect of the present invention, a support structure is connected to and extends from a first side of the filter membrane.[0008]
According to another aspect of the present invention, an anti-microbial coating is disposed between the holes on the filter membrane.[0009]
According to another aspect of the present invention, the micro-fluidic system includes a fluid source adapted to contain fluid, a fluid sink fluidly connected to the fluid source and adapted to receive the fluid, and the anti-microbial filter fluidly connected to the fluid source and the fluid sink.[0010]
According to another aspect of the present invention, the micro-fluidic system further includes an upstream channel fluidly connecting the fluid source to the anti-microbial filter and a downstream channel fluidly connecting the fluid sink to the anti-microbial filter.[0011]
According to another aspect of the present invention, a method for making an anti-microbial filter includes the steps of providing a substrate, forming the filter membrane on the substrate, forming the plurality of holes in the filter membrane, and removing at least a portion of the substrate to expose the plurality of holes in the filter membrane.[0012]
According to another aspect of the present invention, the step of forming the filter membrane further includes the step of diffusing filter material into a predetermined depth of the substrate, wherein the predetermined depth of the diffusion of the filter material into the substrate corresponds to a predetermined thickness of the filter membrane.[0013]
According to another aspect of the present invention, the step of forming the filter membrane further includes the step of depositing the filter membrane on the substrate.[0014]
According to another aspect of the present invention, the step of forming the plurality of holes in the filter membrane further includes the steps of providing a filter mask, having a plurality of holes, over the filter membrane, and forming the plurality of holes in the filter membrane corresponding to the plurality of holes in the filter mask.[0015]
According to another aspect of the present invention, the step of providing the filter mask further comprises the steps of depositing a plurality of spacers on the filter material, wherein a part of the plurality of spacers contacts the filter material, depositing filter mask material partially around the spacers and on the filter material, wherein the part of the plurality of spacers that contacts the surface of the filter material prevents the filter mask material from coming between the part of the plurality of spacers and the filter material, and removing the plurality of spacers to form the plurality of holes in the filter mask, wherein each spacer that contacts the filter material corresponds to each hole in the filter mask.[0016]
According to another aspect of the present invention, the step of removing the plurality of spacers further comprises the step of dissolving the plurality of spacers.[0017]
According to another aspect of the present invention, the step of removing the plurality of spacers further includes the step of disintegrating the plurality of spacers.[0018]
According to another aspect of the present invention, the step of forming the plurality of holes in the filter membrane further comprises the step of etching the filter membrane through the holes in filter mask.[0019]
According to another aspect of the present invention, the step of removing at least a portion of the substrate further comprises the step of removing portions of the substrate from the filter membrane, wherein the remaining portions of the substrate that contact the filter membrane provide the support structure for the filter membrane.[0020]
According to another aspect of the present invention, the step of removing at least a portion of the substrate further comprises the step of removing the entire substrate from the filter membrane.[0021]
According to another aspect of the present invention, an anti-microbial coating is deposited between the holes on the filter membrane.[0022]
These and other aspects of the present invention are further described with reference to the following detailed description and the accompanying figures, wherein the same reference numbers are assigned to the same features or elements illustrated in different figures. Note that the figures may not be drawn to scale. Further, there may be other embodiments of the present invention explicitly or implicitly described in the specification that are not specifically illustrated in the figures and vise versa.[0023]
BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 illustrates a micro-fluidic system having an anti-microbial filter in accordance with a preferred embodiment of the present invention.[0024]
FIGS.[0025]2A-K illustrate, in a sequence of cross-sectional views, a micro-machined fabrication process for making the anti-microbial filter of FIG. 1 according to the present invention.
FIG. 3 illustrates a flowchart describing a method for making the anti-microbial filter using the micro-machined fabrication process of FIGS.[0026]2A-2K.
FIG. 4 is a top plan view of the anti-microbial filter of FIG. 1.[0027]
FIG. 5 is a front elevation view of the anti-microbial filter of FIG. 1.[0028]
FIG. 6 is a right side elevation view of the anti-microbial filter of FIG. 1.[0029]
FIG. 7 is a plan view of the bottom of the anti-microbial filter of FIG. 1.[0030]
FIG. 8 illustrates an elevation view of a semiconductor construction for the upstream channel, the anti-microbial filter and the downstream channel according to a first embodiment of the present invention.[0031]
FIG. 9 illustrates an elevation view of a semiconductor construction for the fluid source and the anti-microbial filter according to a second embodiment of the present invention.[0032]
FIG. 10 illustrates an elevation view of a semiconductor construction for the anti-microbial filter and the fluid sink according to a third embodiment of the present invention.[0033]
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTSFIG. 1 illustrates a[0034]micro-fluidic system100 having ananti-microbial filter105 in accordance with a preferred embodiment of the present invention. Themicro-fluidic system100 is constructed using the MEMS technology described above. Themicro-fluidic system100 generally includes afluid source101, anupstream channel103, theanti-microbial filter105, adownstream channel107, afluid sink109, andfluid113. Thefluid source101 is fluidly connected to thefluid sink109 through theupstream channel103 and thedownstream channel107. The direction offluid flow111 in themicro-fluidic system100 is from thefluid source101 to thefluid sink109. Theanti-microbial filter105 filters out microorganisms in the micro-fluidic system. In the preferred embodiment of the present invention, theanti-microbial filter105 prevents microorganisms from moving from thedownstream channel107 or thefluid sink109 to theupstream channel103 or thefluid source101. Theanti-microbial filter105 may filter fluid flowing between two micro-fluidic components. Preferably, theanti-microbial filter105 filters fluid flowing between theupstream channel103 and thedownstream channel107. Alternatively, theanti-microbial filter105 may filter fluid flowing between thefluid source101 and theupstream channel103, or between thedownstream channel107 and thefluid sink109, or between thefluid source101 and thefluid sink109 without theupstream channel103 or thedownstream channel107.
The[0035]fluid source101 contains thefluid113 and represents any of the micro-fluidic components described above, including but not limited to reservoirs, mixers, and chambers. Similarly, thefluid sink109 receives the fluid113 and generically represents any of the micro-fluidic components described above.
The[0036]upstream channel103 and thedownstream channel107 carry the fluid113 between thefluid source101 and thefluid sink109. Theupstream channel103 and thedownstream channel107 may be formed as two separate channels connected by theanti-microbial filter105 or as one integral channel having theanti-microbial filter105 disposed therein. The fluid113 flows from thefluid source101 to thefluid sink109 responsive to pressure exerted on thefluid113. The pressure exerted on the fluid113 may be supplied from an external source or an internal source relative to themicro-fluidic system100. Examples of the external source of pressure include, without limitation, gravity and rotating mechanisms. An example of the internal source of pressure includes, without limitation, a pump. Preferably, the pump is also a component of themicro-fluidic system100.
The[0037]fluid113 may have any appropriate state that permits fluid flow, such as a liquid state or a gas state. The fluid113 represents any composition of matter appropriate for applications of themicro-fluidic system100, as described above. Examples offluids113 include, without limitation, chemical, bodily, hazardous, biological, and radiological fluids. Biological fluids may be any biologically derived analytical sample, including, without limitation, blood, plasma, serum, lymph, saliva, tears, cerebrospinal fluid, urine, sweat, semen, and plant and vegetable extracts.
The[0038]micro-fluidic system100 in FIG. 1 represents a relative simple system for the sake of clarity. In practice, themicro-fluidic system100 may be a very complex system having many and/or duplicated micro-fluidic components, such as multipleanti-microbial filters105. Themicro-fluidic system100, performing complex or parallel functions, typically needs manyanti-microbial filters105, such as greater than tenanti-microbial filters105, to filter thefluids113 moving throughout different parts of themicro-fluidic system100 at the same time or different times. Therefore, it is desirable for theanti-microbial filters105 to be compact, reliable, simple to fabricate, and easily integrated with the rest of themicro-fluidic system100.
FIGS.[0039]2A-2K illustrate, in a sequence of cross-sectional views, a micro-machined fabrication process for making theanti-microbial filter105 of FIG. 1 in accordance with the preferred embodiment of the present invention. The FIGS.2A-2K illustrate various materials being added or being removed to create the features of theanti-microbial filter105. FIG. 3 illustrates a flowchart describing a method for making theanti-microbial filter105 using the micro-machined fabrication process, as shown in FIGS.2A-2K. The method includes a sequence of steps302-312, inclusive. The steps302-312 shown in FIG. 3 correspond to the cross-sectional views of FIGS.2A-2K, respectively. Next, each of the steps in FIG. 3 and the corresponding cross-sectional view in FIGS.2A-2K are described in detail.
At[0040]step302 in FIG. 3, corresponding to FIG. 2A, asubstrate211 is provided. Thesubstrate211 may be formed of any material that is compatible with the micro machined fabrication process. Preferably, thesubstrate211 is made of silicon. Thesubstrate211 is constructed using methods that are well known in the art of semiconductor manufacturing processing. Thesubstrate211 generally provides the foundation or platform on which to build theanti-microbial filter105. Thesubstrate211 may have a thickness in the range of one to hundreds of microns, and is preferably 3 micrometers thick. In the preferred embodiment of the present invention, thesubstrate211 also provides structural support for theanti-microbial filter105, as a finished device, in the MEMS.
At[0041]step303 in FIG. 3, corresponding to FIG. 2B,substrate mask material200 is deposited on the first, preferably bottom, side of thesubstrate211. Thesubstrate mask material200 may be formed of any material that is compatible with the micro machined fabrication process. Preferably, thesubstrate mask material200 is silicon dioxide. Preferably, the substrate202 and thesubstrate mask material200 are provided together as a manufactured wafer. Thesubstrate mask material200 may be deposited on thesubstrate211 using a variety of methods that are well known in the art of semiconductor manufacturing processing. Thesubstrate mask material200 may have a thickness in the range of hundreds to thousands of angstroms thick, and is preferably 1000 angstroms thick. The substrate mask material may be deposited on thesubstrate211 using a variety of methods that are well known in the art of semiconductor manufacturing processes. Thesubstrate mask material200 is used later in the micro-machining process to form asubstrate mask212 for thesubstrate211.
At[0042]step304 in FIG. 3, corresponding to FIG. 2C,filter material201 is formed on the second, top side of thesubstrate211. Thefilter material201 may be formed of any material that is compatible with the micro machined fabrication process. In the preferred embodiment, thefilter material201 is deposited on thesubstrate211 using deposition processes such as electrochemical, ultrasonic spray, aerosol, or spin-on, that are well known in the art of semiconductor processing. Alternatively, thefilter material201 may be formed on the surface of thesubstrate211 by doping the top surface of thesubstrate211 with a silicon compatible material, such as boron. In this case, the thickness of the filter material corresponds to the depth of penetration of thefilter material201 into the surface of thesubstrate211. When thefilter material201 is deposited, preferably, thefilter material201 is polysilicon, but may also be nitride, epitaxy, and the like. Thefilter material201 may have a thickness in the range of 0.1-100 micrometers, and is preferably 3-5 micrometers thick. Thefilter material201 is used later in the micro-machining process to form afilter membrane213 for theanti-microbial filter105, as a finished device, in the MEMS.
At[0043]step305 in FIG. 3, corresponding to FIG. 2D,openings220 are formed in thesubstrate mask material200 to form thesubstrate mask212. Theopenings220 may otherwise be known as recesses, wells, cavities, and the like. Theopenings220 are formed in thesubstrate mask material200 using a variety of methods, such as photo-resist with an etch process, that are well known in the art of semiconductor processing. Theopenings220 extend through thesubstrate mask material200 to the bottom surface of thesubstrate211 so that portions of the bottom surface of the substrate are exposed. Theopenings220 formed in thesubstrate mask212 define areas on the bottom side of thesubstrate211 that are removed later to form the filter supports. Theopenings220 may be formed after any step in the method in FIG. 3 or after any sequence in FIGS.2B-2K that is appropriate or desirable because the formation of the openings is not dependent on another step. However, theopenings220 need to be formed in the substrate mask material before theopenings224 can be formed in thesubstrate211 to form the filter supports (see FIG. 2I).
At[0044]step306 in FIG. 3, corresponding to in FIG. 2E,spacers214 are deposited on the top surface of the filter material. Thespacers214 may be formed of any material that is compatible with the micro machined fabrication process. Preferably, the spacers are formed of polystyrene, but may also be formed of silica, polymeric, carboxylate (COOH) polystyrene, and the like. Thespacers214 may have any shape and size. Preferably, thespacers214 are spheres having a diameter in the submicron range. Alternatively, thespacers214 may be cubes, ovals, and irregular or random shapes. Thespacers214 may be solid or hollow. Thespacers214 deposited on the filter material preferably each have the same or nearly similar shapes and sizes, but may also have different shapes and sizes. In the preferred embodiment of the present invention, thespacers214 are spheres having part number P0002100N from Bangs Lab, 9025 Technology Drive, Fishers, Ind. 46038-2886. In the preferred embodiment, thespacers214 are deposited on thesubstrate211 using deposition process such as electrochemical, ultrasonic spray, aerosol, or spin-on, that are well known in the art of semiconductor processing. Thespacers214 are preferably deposited as a single layer ofspacers214 arranged in a side-by-side relationship, but may also be deposited as multiple layers if desired and appropriate. Thespacers214 may be deposited in a random or predetermined pattern, as desired and appropriate. Preferably, thespacers214 are carried in a liquid during the deposition process, leaving only thespacers214 when the liquid dries. Thespacers214 naturally adhere to the surface of thefilter material201 made of polysilicon, but may be made to be attracted to the filter material by using the electrophoresis deposition process, described above, which also increases the density of thespacers214. Thespacers214 may have any diameter or thickness in the range of 0.05-0.5 micrometers, and are preferably 0.2 micrometers thick. As best seen in FIG. 7H, thespacers214 are used later in the micro-machining process to formholes222 in afilter mask215 for theanti-microbial filter105. Generally, the diameter of thespacers214 corresponds to the diameter of theholes222 in thefilter mask215 that, in turn, correspond to theholes218 in thefilter membrane213 of theanti-microbial filter105. Therefore, special consideration should be given to the size of thespacers214 because the size of eachspacer214 indirectly relates to the size of the microorganisms that need to be filtered.
At[0045]step307 in FIG. 3, corresponding to FIG. 2F, filter mask material is deposited around thespacers214 on the filter material. Preferably, the filter mask material does not completely cover thespacers214. Further, the filter mask material does not come between thespacers214 and thefilter material201 where thespacers214 contact the filter material. In practice, the filter mask material extends about one-half way underneath the spheres because of the curved shape of the spheres against the relatively flat surface of the substrate and the method of deposition used. This relatively imprecise application of the filter mask material is acceptable because the end goal is to haveholes218 in thefilter membrane213 that correspond to the diameter of thespacers214, as is described later with the remaining steps. Thefilter mask215 may be formed of any material that is compatible with the micro machined fabrication process. In the preferred embodiment, the filter mask material is deposited on thefilter material201 using deposition processes such as electrochemical, ultrasonic spray, aerosol, or spin-on, that are well known in the art of semiconductor processing. Preferably, thefilter mask215 is formed of material that does not permit ions to pass through it. Hence, thefilter mask215 may be formed from most refractory metals such as titanium, chrome, tungsten, platinum, nickel, and the like. The filter mask material may have a thickness in the range of 0.05-0.3 micrometers, and is preferably 0.05 micrometers thick. The filter mask material is used later in the micro-machining process to form afilter mask215 for theanti-microbial filter105.
At[0046]step308 in FIG. 3, corresponding to FIG. 2G, thespacers214 are removed to formholes222 in the filter mask material to provide thefilter mask215, otherwise called a filter template. Thespacers214 may be removed using any method that is compatible with the micro machined fabrication process. Preferably, thespacers214 are removed by dissolving thespacers214 with solutions, such as an acid solution, a base solution or an oxidizing solution. For example, hydrogen peroxide and sulfuric acid each dissolve spacers214 formed of a polymeric material. Also, for example, acetone can dissolvespacers214 formed of organics. Alternatively, thespacers214 may be removed by disintegrating thespacers214 using processes, including but not limited to ultrasound, ethylenediamine-pyrocatechol-water (EDP), and the like. In practice, since the filter mask material extends about one-half way underneath thespacers214, as described instep307, theholes222 in the filter mask material have a diameter of about one-half the diameter of thespacers214. In the preferred embodiment of the present invention, it is interesting to note that the process forms theholes222 in thefilter mask215 by removing an element (i.e., the spacers214), formed of one material, from the filter mask material, formed of a different material. This preferred method of forming the holes in thefilter mask215 is in contrast to more expensive, time consuming and less precise methods of forming holes in a filter mask, such as by an electron beam, deep ultraviolet light, x-ray, or photolithography.
At[0047]step309 in FIG. 3, corresponding to FIG. 2H, holes218 are formed in the filter material using thefilter mask215 to form thefilter membrane213. Theholes218 extend through the thickness of the filter material. Theholes218 may be formed using any process that is compatible with semiconductor manufacturing processing. In the preferred embodiment of the present invention, a directionally controlled etching process is used to form theholes218. Preferably, a reactive ion etching (RIE) process is used, but other processes such as ion beam milling may also be used. During the RIE process, ions bombard thefilter mask215. Because of the material of thefilter mask215, as described above instep307, the ions bounce off thefilter mask215. However, theholes222 formed in thefilter mask215, as described instep308, permit the ions to pass through theholes222 to reach the filter material on the opposite side of the filter mask. The ions react with the filter material to cause the filter material to be selectively removed, as is well known in the art of semiconductor manufacturing processing, to create theholes218 in the filter material. The speed of formation of theholes218 and depth of theholes218 is dependent upon factors such as the intensity and duration of the ion bombardment as well as the filter material. Theholes218 formed in thefilter membrane213 tend to be a little larger than theholes222 in thefilter mask215 by about one-half the dimension of thespacers214 due to a bleed through or fringe effect of the ions passing through theholes222 in thefilter mask215. Since, theholes222 formed in thefilter mask215, have a diameter about one-half the diameter of thespacers214, theholes218 in the filter material having a dimension approximately equal to the dimension of thespacers214. Theholes218 in the filter material are sized appropriately to effectively filter out unwanted microorganisms.
At[0048]step310 in FIG. 3, corresponding to FIG. 2I, holes224 are formed in thesubstrate211 to form the filter supports. The use of filter supports is optional and depends on the structural and material integrity of thefilter membrane213, as well as the construction and material of the MEMS that thefilter membrane213 is integrated with. Theholes224 may be formed using any process that is compatible with semiconductor manufacturing processing, as is well known in the art. Theholes224 extend through the thickness of thesubstrate211 and correspond to theopenings220 formed in thesubstrate mask material200, as described instep305. Theholes224 in thesubstrate211 expose theholes218 in thefilter membrane213. By selectively removing the substrate material to form theholes224, the substrate material that remains forms the filter supports. The number and location of the filter supports may vary as desired and appropriate.
At[0049]step311 in FIG. 3, corresponding to FIG. 2J, the filter mask material and the substrate mask material are removed using methods that are well known in the art of semiconductor manufacturing processing.
At[0050]step312 in FIG. 3, corresponding to FIG. 2K, acoating216 is deposited on the side of thefilter membrane213 that is remote from the filter supports. Thecoating216, otherwise known as a film, may be deposited using any process that is compatible with semiconductor manufacturing processing, such as electrochemical, ultrasonic spray, aerosol, or spin-on, that are well known in the art of semiconductor processing. Preferably, thecoating216 is formed of a material that does not permit microorganisms to adhere to it and/or kills microorganisms that contact thecoating216. Preferably, thecoating216 is formed of silver. Thecoating216 may have a thickness in the range of 0.05 to several microns thick, and is preferably 0.1 micrometers thick. Preferably, thecoating216 is deposited on the downstream side of thefilter membrane213. When fluid flows through thefilter membrane213, the pressure of the fluid typically keeps the microorganisms from moving upstream against the pressure of the fluid to reach the fluid source. However, when or if the pressure of the fluid flow stops, the microorganisms may try to move, by migration or diffusion, upstream through thefilter membrane213. In this case, thecoating216 prevents or inhibits such movement. Depending on the application for thefilter membrane213, thecoating216 is optional.
The steps described above advantageously produce an[0051]anti-microbial filter105 that is small enough to be used in themicro-fluidic system100. Theanti-microbial filter105 is constructed using micro-machining processes to permit it to be integrated into themicro-fluidic system100. Theanti-microbial filter105 has precisely defined hole sizes that are cost effective and easy to manufacture. Thefilter105 reliably filters out unwanted microorganisms. In the preferred embodiment of the present invention, theanti-microbial filter105 is used in miniature or micro-sized intravenous or implanted drug delivery systems.
FIGS.[0052]4-7 illustrate the top, front, right and bottom views of theanti-microbial filter105 respectively. FIGS. 5 and 6 show thecoating216 disposed on thefilter membrane213 that is formed on thesubstrate211. FIGS. 4 and 7 show theholes218 formed in theanti-microbial filter105. FIG. 7 shows thesubstrate211 formed as filter supports comprising a wall along the perimeter of thefilter105 and six posts inside the perimeter of thefilter105. FIG. 4 shows the filter supports with dashed lines because they are hidden in this view.
The size and shape of the[0053]anti-microbial filter105, as viewed in the FIG. 4 and FIG. 7, may vary as desired and appropriate for a particular application. The shape of theanti-microbial filter105, as viewed in FIGS. 4 and 7, may be square, rectangular, round, oval, a shape having any number of sides, as well as any irregular shape. In the preferred embodiment of the present invention, the size of theanti-microbial filter105, as viewed in FIGS. 4 and 7, is in the range of tens of microns to several millimeters and is preferably 1 mm×1 mm. In the preferred embodiment of the present invention, the thickness of theanti-microbial filter105, as viewed in the elevation views FIGS. 5 and 6, is in the range of 0.1 and 50 micrometers and is preferably 3 micrometers.
Next, FIGS. 8, 9 and[0054]10 are described together. FIG. 8 illustrates an elevation view of a semiconductor construction for theupstream channel103, theanti-microbial filter105 and thedownstream channel107 in accordance with one embodiment of the present invention. FIG. 9 illustrates an elevation view of a semiconductor construction for thefluid source101 and theanti-microbial filter105, in accordance with another embodiment of the present invention. FIG. 10 illustrates an elevation view of a semiconductor construction for theanti-microbial filter105 and thefluid sink109, in accordance with another embodiment of the present invention.
Generally, in FIGS. 8, 9 and[0055]10, theupstream channel103, thedownstream channel107, theanti-microbial filter105, thefluid source101 and thefluid sink109 are formed using micro-machining processes and materials compatible with semiconductor construction. Preferably, the semiconductor construction is planar to permit theupstream channel103, thedownstream channel107, theanti-microbial filter105, thefluid source101 and thefluid sink109 to be assembled in a stacked arrangement using known assembly processes and materials. Any of the individual elements may be integrated with each other, if desired and appropriate for a particular application. Thecoating216 on theanti-microbial filter105 is orientated to be on the downstrearn side of theanti-microbial filter105 to prevent microorganisms from moving upstream through thefilter105.
In FIG. 8, the[0056]upstream channel103 and thedownstream channel107 represent a fluid channel, preferably formed in semiconductor material, using micro-machining techniques. Preferably, the fluid flows into the right side of theupstream channel103, but may alternatively flow into the left side of the upstream channel103 (as shown by dashed lines) or into both the right and left sides of theupstream channel103. Likewise, the fluid flows out of the left side of thedownstream channel107, but may alternatively flow out of the right side of the downstream channel107 (as shown by dashed lines) or out of both the left and right sides of thedownstream channel107. Theanti-microbial filter105 is disposed between theupstream channel103 and thedownstream channel107. Thesubstrate211 forming the filter support contacts theupstream channel103. Thecoating216 on thefilter membrane213 contacts thedownstream channel107.
In FIG. 9, the[0057]fluid source101 directly contacts theanti-microbial filter105, without having theupstream channel103 disposed between thefluid source101 and theanti-microbial filter105. In this case, thesubstrate211 forming the filter support contacts thefluid source101.
In FIG. 10, the[0058]fluid sink109 directly contacts theanti-microbial filter105, without having thedownstream channel107 disposed between thefluid sink107 and theanti-microbial filter105. In this case, thecoating216 contacts thefluid sink107.
Hence, while the present invention has been described with reference to various illustrative embodiments thereof, the present invention is not intended that the invention be limited to these specific embodiments. Those skilled in the art will recognize that variations, modifications and combinations of the disclosed subject matter can be made without departing from the spirit and scope of the invention as set forth in the appended claims.[0059]