US20030116552A1 - Heating element for microfluidic and micromechanical applications - Google Patents

Abstract

An integrated heater formed as a field effect transistor in a semiconductor substrate, with the transistor having source and drain regions with a channel region extending therebetween to conduct current. The channel region has a resistance when conducting current to generate heat above a selected threshold. A dielectric layer is disposed on the channel region and a gate electrode is disposed on the dielectric layer to control the current of the channel region. A thermally insulating barrier may be formed in the semiconductor material extending about the transistor. The object to be heated is positioned to receive the heat generated by the resistance of the channel region; the object may be a fluid chamber.

Description

BACKGROUND OF THE INVENTION
• 1. Field of the Invention[0001]
• The present invention relates to microchip heaters for microfluidic and micromechanical applications, such as integrated chemical microreactors for decomposition and detection of bioorganic compounds such as DNA, ink-jet printer heaters for firing ink for printing purposes, optical switching based on vapor bubble formation to deflect a light beam, and optical switching based on liquid crystals.[0002]
• 2. Description of the Related Art[0003]
• As is known, some fluids are processed at temperatures that should be regulated in an increasingly more accurate way, for example, when chemical or biochemical reactions are involved. In such situations, there is often also a need to use very small quantities of fluid, owing to the cost of the fluid, or to low availability.[0004]
• This is the case, for example, of the DNA amplification process (PCR, i.e., Polymerase Chain Reaction process), wherein accurate temperature control in the various steps (repeated predetermined thermal cycles are carried out), the need to avoid as far as possible thermal gradients where fluids react (to obtain here a uniform temperature), and also reduction of the used fluid (which is very costly), are of importance in obtaining good reaction efficiency, or even to make reaction successful. Microchip heaters are particularly suited for this application.[0005]
• Other examples of fluid processing with the above-described characteristics are associated for example with implementation of chemical and/or pharmacological analyses, and biological examinations. Other situations that require a miniaturized heater that is one or more of more accurate, quicker reacting, more durable, longer-lived, more controllable and less expensive to manufacture include ink-jet printers heaters and optical switching heaters to name a few.[0006]
• At present, various techniques allow thermal control of chemical or biochemical reagents. In particular, from the end of the 1980s, miniaturized devices were developed, and thus had a reduced thermal mass, which could reduce the times necessary to complete the DNA amplification process. Recently, monolithic integrated devices of semiconductor material have been proposed, able to process small fluid quantities with a controlled reaction, and at a low cost (see, for example, U.S. patent application Ser. Nos. 09/779,980, filed on Feb. 8, 2001; 09/874,382 filed on Jun. 4, 2001; and 09/965,128, filed Sep. 26, 2001; all assigned to STMicroelectronics, S.r.l. and incorporated herein by reference).[0007]
• These devices comprise a semiconductor material body accommodating buried channels that are connected, via an input trench and an output trench, to an input reservoir and an output reservoir, respectively, to which the fluid to be processed is supplied, and from which the fluid is collected at the end of the reaction. Above the buried channels, heating elements and thermal sensors are provided to control the thermal conditions of the reaction (which generally requires different temperature cycles, with accurate control of the latter), and, in the output reservoir, detection electrodes are provided for examining the reacted fluid. The heat is generated by supplying electric current to a metal heating element formed on a wafer comprising a semiconductor body with contact regions in electrical contact with the two opposite ends of the heating element and connected to a drive transistor, typically a MOSFET formed on the same wafer.[0008]
• Current inkjet technology relies on placing a small amount of ink within an ink chamber, rapidly heating the ink and ejecting it to provide an ink drop at a selected location on an adjacent surface, such as a sheet of paper. Traditionally, ohmic resistors which heat up rapidly when current is passed therethrough have been used to provide the necessary temperature increase of the ink. See, for example, a detailed discussion of ink ejection in an article titled “Thermodynamics and Hydrodynamics of Thermal Ink Jets,” by Allen et al.,[0009]Hewlett-Packard Journal, May 1985, pp. 20-27, incorporated herein by reference.
• Microchips are highly suited for miniaturized heater applications. Generally, present techniques for generating local heating in a microchip are based on ohmic resistors made of metal alloys, such as TaAl, HfB, ternary alloys, etc., or polycrystalline semiconductors. The heating resistor is driven by external circuitry or an integrated power MOSFET. In existing applications, such as thermal ink-jet printers, the heating resistor value is preferably higher than the MOSFET channel resistance (R[0010]_ONor R_DS) to minimize the parasitic effects and dissipate power in the heating resistor only. Normally, each power MOSFET occupies a large percentage of the chip area to minimize its R_ON.
• One drawback with this arrangement is that the resistance of such ohmic resistors is fixed and cannot be modulated, thus limiting their flexibility. Other drawbacks are that ohmic resistors are subject to material degradation (such as oxidation, segregation, etc.), and electromigration, especially at high temperatures. These phenomena limit their lifetime and are a concern for the reliability of devices that incorporate them into their design.[0011]
• Yet another drawback is power control. Ohmic resistors, which are either current or voltage driven, dissipate a power that is a quadratic function of the parameters. This results in poor control over their output, as small variations in current or voltage can cause significant fluctuations in power and temperature output.[0012]
• The present invention provides a miniaturized heater that provides the desired characteristics for many microfluidic and micromechanical applications, while overcoming the drawbacks noted above, while providing other related advantages.[0013]
BRIEF SUMMARY OF THE INVENTION
• The present invention resides in an integrated heater comprised of a semiconductor material, with at least one transistor formed in the semiconductor material and operable to generate heat, and an object to be heated positioned adjacent to the transistor to receive the heat generated by the transistor. In one embodiment disclosed, the object to be heated is a fluid chamber positioned adjacent to the semiconductor material. The object to be heated may be, but is not limited to, a fluid chamber formed in the semiconductor material.[0014]
• In some disclosed embodiments, the semiconductor material has a wall portion adjacent to the transistor to transmit heat generated by the transistor through the semiconductor wall portion. The heater further includes a body having wall portion positioned adjacent to and in sealing engagement with the semiconductor wall portion, such that the semiconductor wall portion and the body wall portion together define a fluid chamber as the object to be heated. The object to be heated may take forms other than a fluid chamber.[0015]
• In some disclosed embodiments, the integrated heater further includes a thermally insulating barrier formed in the semiconductor material extending about the transistor to limit transmission in the semiconductor material of the heat generated by the transistor beyond the insulating barrier.[0016]
• The heater may be manufactured with the semiconductor material extending laterally beyond the transistor to provide a lateral semiconductor portion, and the object to be heated may be positioned laterally adjacent to the transistor and adjacent to the lateral semiconductor portion to receive the heat generated by the transistor that is transmitted laterally to the lateral semiconductor portion. In at least one such embodiment, the heater has a dielectric layer extending over the semiconductor material with a window formed in a portion of the dielectric layer at a location adjacent to the lateral semiconductor portion, with the object to be heated positioned at the window to receive the heat generated by the transistor which passes through the window. The lateral semiconductor portion may have a wall portion to transmit heat to the object to be heated that is generated by the transistor and transmitted through the lateral semiconductor portion, and the heater may include a body with a wall portion positioned adjacent to and in sealing engagement with the lateral semiconductor wall portion, such that the lateral semiconductor wall portion and the body wall portion together define a fluid chamber as the object to be heated. In this embodiment, the thermally insulating barrier formed in the semiconductor material extends laterally outward of and about the transistor and the lateral semiconductor portion.[0017]
• The integrated heater may be manufactured using a plurality of transistors formed in the semiconductor material and selectively operable to generate heat.[0018]
• The integrated heater may be manufactured as a field effect transistor formed in a semiconductor substrate, with the transistor having a source region, a drain region and a channel region between the source and drain regions to conduct electric current, with the channel region having a resistance when conducting current to generate heat above a selected threshold. A dielectric layer is disposed on the channel region. A gate electrode is disposed on the dielectric layer to control the current conducted by the channel region. The object to be heated is positioned to receive the heat generated by the resistance of the channel region.[0019]
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)
• In order to assist understanding of the present invention, preferred embodiments are now described, purely by way of non-limiting example, with reference to the attached drawings, wherein:[0020]
• FIG. 1 is a side elevational, cross-sectional schematic drawing of a MOSFET heater according to the invention;[0021]
• FIG. 2 is a side elevational, cross-sectional schematic drawing of a first alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber;[0022]
• FIG. 3 is a side elevational, cross-sectional schematic drawing of a second alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber formed fully in the semiconductor material;[0023]
• FIG. 4 is a side elevational, cross-sectional schematic drawing of a third alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber;[0024]
• FIG. 5 is a side elevational, cross-sectional schematic drawing of a fourth alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber and a thermally insulating trench extending about the MOSFET;[0025]
• FIG. 6 is a side elevational, cross-sectional schematic drawing of a fifth alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber using a multiple source/drain MOSFET and a thermally insulating trench extending about the MOSFET;[0026]
• FIG. 7 is a side elevational, cross-sectional schematic drawing of a sixth alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber fed by a channel and a thermally insulating trench extending about the MOSFET;[0027]
• FIG. 8 is a side elevational, cross-sectional schematic drawing of a seventh alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber formed laterally offset from the MOSFET and on a front side of the MOSFET; and[0028]
• FIG. 9 is a side elevational, cross-sectional schematic drawing of an eighth alternative embodiment of the MOSFET heater of FIG. 1 with a fluid chamber formed on a front side of the MOSFET immediately thereover and a thermally insulating trench extending about the MOSFET.[0029]
DETAILED DESCRIPTION OF THE INVENTION
• As shown in the drawings for purposes of illustration, the present invention is embodied in an integrated heater, indicated generally by[0030]reference numeral10, formed on awafer11. As shown in FIG. 1, thewafer11 has asubstrate12 of monocrystalline semiconductor material, for example silicon. Thesubstrate12 has been processed using well-known MOSFET manufacturing techniques to form asource region14 and adrain region16 of a MOSFET in the substrate toward an upper side orsurface18 thereof. Achannel region20 of the MOSFET is formed in thesubstrate12 between the source and drainregions14 and16 to conduct electric current between the source and drain regions. Thechannel region20 has a resistance R_ONor R_DS, indicated schematically by resistor symbol, to electric current so as to generate heat, indicated byarrows22, when conducting electric current.
• A[0031]dielectric layer24, for example an oxide, is formed on the upper side of thesubstrate12 and extends across thechannel region20. Agate electrode26 of the MOSFET is formed on thedielectric layer24 above thechannel region20 to control the current conducted by the channel region. The gate electrode can be composed of any acceptable material, such as polysilicon, a polysilicon with a silicide layer thereon, or metal or any other conductive layer that is compatible with the process of the present invention. A metal silicide on top of a polysilicon is preferred in many instances because such a gate has a very low electrical resistivity with the advantage of a metal top layer for good thermal conductivity. The process technology and steps for forming such are well known. The MOSFET can be of any suitable type, such as LDMOS, VDMOS, etc.
• A lower side or[0032]surface28 of thesubstrate12 has a portion thereof below the channel region20 (at the back of the wafer11) etched away or otherwise removed to reduce the thickness of the substrate in this area and to form arecess29 in the substrate. Therecess29 defines at least in part forms achamber30 and serves as the object to be heated by theheat22 generated by thechannel region20. Thechamber30 may be sized and shaped to receive asubstance32 to which theheat22 transmitted into thechamber30 is transferred. Thechamber30 is positioned close to thechannel region20 to receive theheat22 generated by the channel resistance R_DSwhen the channel region is conducting electric current. Thesubstrate12 is removed when forming thechamber30 so as to leave only athin wall portion34 thereof remaining below thechannel region20 in order to have the heat source (i.e., the channel region) close to thesubstance32 to be heated.
• The[0033]lower side28 of thesubstrate12 hasdielectric layer36 formed thereon, such as by deposition or by being grown thereon. Thedielectric layer36 lines the portion of the lower side of the substrate that forms a part of thechamber30. If thesubstance32 to be received in thechamber30 for heating is a fluid, thedielectric layer36 may be selected as a material that provides protection to thesubstrate12 against any harmful effects the fluid may have on the substrate if direct contact occurred. In the case of a fluid, the fluid in thechamber30 can come into direct contact with the chamber walls and such is desirable to get the fluid close to thechannel region20 to have improved transfer of heat to the fluid. Theheat22 is transmitted through thedielectric layer36 to thechamber30 so the dielectric layer is selected with thermal properties sufficient to transfer the desired amount of heat. Theheater10 may be used to heat substances other than fluids, in which case thelower side28 of thesubstrate12 may be used as a heat transfer surface and shaped as appropriate to contact the object to be heated, whether it be a flat object or a contoured object, with or without an intervening protective or other layer or other material.
• As noted, the channel resistance R[0034]_DS(i.e., source-to-drain resistance) of thechannel region20 generates theheat22 and transfers that heat to thechamber30 where thesubstance32 is at least temporarily located so as to be heated. Thechannel region20 generates theheat22 when a sufficient voltage is applied to thegate electrode26 to cause conduction in thechannel region20 between the source and drainregions14 and16, in a manner conventional with MOSFETs. The amount ofheat22 generated in a particular application can be controlled by the amount of voltage applied to thegate electrode26 since the channel resistance R_DSin a MOSFET is a function of the gate voltage applied. A power MOSFET transistor can be used to achieve higher current conduction and an increased heating rating.
• The channel resistance R[0035]_DSof thechannel region20 can be easily selected during fabrication of the MOSFET to produce a particular resistance value desired for a specific application, such as by varying the length and/or width of the channel region, the silicon doping used and/or the design layout so that the desired power is dissipated through the channel resistance R_DSwhen the MOSFET is on. It is noted that more normally doping of thechannel region20 is done in normal MOSFET production for the purpose of reducing the channel resistance, however, when the MOSFET is used as a heater, the doping is conducted to enhance/increase the resistance of the channel. A particular channel resistance R_DSis selected such that when thechannel region20 is conducting electric current, heat above a selected threshold is generated and transferred to thechamber30 to heat thesubstance32 in the chamber. The threshold is selected to supply the amount of heat desired to be transferred to the object to be heated or necessary to raise the temperature of the object to be heated or a substance to at least a desired temperature.
• The MOSFET used in the[0036]heater10 may be fabricated using conventional techniques to produce a channel resistance R_DSthat may be from a few ohms to thousands of ohms, thus providing design flexibility. The operating temperature range of the channel resistance R_DSof the MOSFET can be between a few Celsius degrees and more than 1,000 Celsius degrees, thus providing sufficient heat for many microfluidic and micromechanical applications where local thermal gradients are required, such as to induce chemical reactions, or to produce mass and heat transportation such as to eject fluids or generate vapors. Thesubstance32 to which theheat22 transmitted into thechamber30 is transferred may be a fluid such as, but not limited to, ink, mixtures of organic materials, fluids for optical switching, and gases for environmental testing and medical applications, and the fluids mentioned in the Description of the Related Arts set forth herein, to name a few.
• The[0037]heater10 may be made easier and less expensively than known microchip heaters using ohmic resistors. Fewer mask processing steps are required and the expensive process control need to deposit and etch exotic resistor layers is eliminated. No expensive or exotic materials need be used. This results in simplified processing and less expense to fabricate theheater10. Further, the cost is reduced since significant chip size reduction is achieved by the fact that theheater10 does not require separate driving transistor and ohmic resistor assemblies be fabricated, both the driving transistor and the resistive element are combined together as the same element in theheater10.
• Increased reliability of performance for many applications will also be achieved using the[0038]heater10. The resistors currently used for inkjet and optical switching applications have limited lifetime and fail for electromigration or physical damage (such as from cavitation) after a few billions of cycles. The lifetime of thechannel region20 of theheater10 functioning to provide the channel resistance R_DSthat produces theheat22 should last for several years of operating conditions, which for inkjet printer applications is longer than the life of the printer. This is because the channel resistance R_DSis made from durable silicon crystal. This should allow the manufacture of inkjet printheads that are cheap and permanent, and do not need replacement during the normal lifetime of the inkjet printer.
• The performance will also be increased for many applications when using the[0039]heater10. This is in part due to the drastic reduction of parasitic resistance that is associated with the prior art microchip heaters using ohmic resistors. In the past when using prior art microchip heaters using ohmic resistors, the channel resistance of the driving MOSFET was a main contributor to the parasitic resistance realized, in addition to the parasitic resistance of the metal traces that drive the transistor. With theheater10, the “parasitic resistance” of the MOSFET becomes the heating element and parasitic effects are now primarily the low resistance metal traces that drive the MOSFET of the heater.
• Another performance increase is achieved because the MOSFET transistor used in the[0040]heater10 can be drawn as small as a few squared microns, thus allowing packing of a huge number of transistors on the same chip. For inkjet printers applications, this means that printheads can be manufactured which are capable of printing very high resolution pictures in one single pass.
• Yet another performance increase results from the fact that a power MOSFET can be designed in such a way that at operational current/voltage, any fluctuation in these parameters has an insignificant impact on the dissipated power. Thus, the[0041]heater10 is of particular interest for microreactor applications, such as chips for biological analysis, where lower temperatures and good temperature control are needed.
• A first alternative embodiment of the[0042]heater10 is shown in FIG. 2. Theheater10 of FIG. 2 has the same basic construction as the heater of FIG. 1 except that thechamber30 is in part formed by abody38 that has awall portion40 that extends about therecess29 in thesubstrate12 on the back of thewafer11. Thewall portion40 of thebody38 is positioned adjacent to and in sealing engagement with thesubstrate12 at itslower side28, with thedielectric layer36 positioned therebetween. Thewall portion40 defines an openinterior portion42 that mates with therecess29 to form thechamber30, and defines anorifice44 through which thesubstance32 can pass, which in FIG. 2 is shown as a fluid with ameniscus46.
• A second alternative embodiment of the[0043]heater10 is shown in FIG. 3. Theheater10 of FIG. 3 has the same basic construction as the heater of FIGS. 1 and 2 except that therecess29 formed in thesubstrate12 on the back of thewafer11 is shaped to form theentire chamber30, including anorifice48. If appropriate, thechamber30 can be lined with a protective layer.
• A third alternative embodiment of the[0044]heater10 is shown in FIG. 4. Theheater10 of FIG. 4 has a different construction than the heaters of FIGS.1-3 in that the MOSFET is made on a SOI (silicon on insulator)wafer11′ with the substrate12 (such as silicon) having itslower side28 engaging anoxide layer50. Theheat22 generated by thechannel region20 is transmitted through theoxide layer50 to thechamber30 so theoxide layer50 is selected with thermal properties sufficient to transfer the desired amount of heat to the chamber. The structure of FIG. 4 can be obtained by using two separate wafers, one for the heating device and one for thechamber30. The substrate for thechamber30 can be any acceptable material for the chamber, including silicon, an organic polymer, sapphire, or any other suitable material. Alayer50 of an insulator is grown thereon that the back side of thewafer12 is removed to a desired level and thewafer11′ is connected to thesubstrate12. There are many acceptable techniques for doing this, one of which is described in pending application 854063.663, incorporated herein by reference.
• In this third alternative embodiment, a[0045]body52 made of silicon with awall portion54 defines thechamber30 in conjunction with alower side56 of theoxide layer50. Thewall portion54 of thebody52 is positioned adjacent to and in sealing engagement with thelower side56 of theoxide layer50. Thewall portion54 defines anorifice58 through which thesubstance32 can pass (not shown in FIG. 4).
• A fourth alternative embodiment of the[0046]heater10 is shown in FIG. 5. Theheater10 of FIG. 5 has the same basic construction as the heater of FIG. 4, using theSOI wafer11′ approach, except that atrench60 is formed in thesubstrate12 which is located laterally outward of and extends fully about the source and drainregions14 and16 andchannel region20. Thetrench60 may be left empty or filled with an insulatingmaterial62 such as silicon oxide. Thetrench60 serves as a thermally insulating barrier to limit the lateral transfer of theheat22 generated by thechannel region20 in thesubstrate12, and as will be described below in greater detail, tends to contain the heat generated by the channel region and allow it to be better route the heat to the object to be heated. Thetrench60 also serves to electrically isolate the MOSFET. Thetrench60 projects fully between thedielectric layer24 and theoxide layer50.
• A fifth alternative embodiment of the[0047]heater10 is shown in FIG. 6. Theheater10 of FIG. 6 has the same basic SOI construction as the heater of FIG. 5 except that it uses a multiple finger, power MOSFET withmultiple source regions14 electrically connected together,multiple drain regions16 electrically connected together, andmultiple gate electrodes26 electrically connected together. There are, of course,multiple channel regions20 between the adjacent source and drain regions. Thetrench60 is located laterally outward of and extends fully about all of the source and drainregions14 and16 andchannel regions20 for the power MOSFET.
• A sixth alternative embodiment of the[0048]heater10 is shown in FIG. 7. Theheater10 of FIG. 7 has the same basic SOI construction as the heater of FIG. 5 except that thesubstrate12 and thebody52 extend laterally beyond the source and drainregions14 and16, thegate electrode26 and thechannel region20, and afluid channel63 is provided in thebody52 which extends between achannel entrance aperture63aand thechamber30. A fluid flow, shown by arrow65a, may enter theentrance aperture63aand flow to thechamber30 whereat theheat22 generated by thechannel region20 is transferred to the fluid. The heated fluid can then exit thechamber30 through theorifice58, shown byarrow65b. If theheater10 is used as an inkjet printhead, the exiting heated fluid ink can be sprayed onto the paper or other material to be printed. Thefluid channel63 may also have anadditional entrance aperture63bin fluid communication with the channels of neighboring heaters, if desired.
• A seventh alternative embodiment of the[0049]heater10 is shown in FIG. 8. Theheater10 of FIG. 8 uses the same basic SOI construction; however, there is no chamber formed by thesilicon body52, which is a slab in this embodiment. Further, thechamber30 is not located directly below thechannel region20 to receive theheat22 generated thereby. Instead, thechamber30 is located on the front of thewafer11′ and is laterally offset from the MOSFET, as will be described below.
• In particular, the[0050]substrate12 has alateral portion64 that extends laterally beyond the source and drainregions14 and16, thegate electrode26 and thechannel region20. Theheat22 generated by thechannel region20 is transmitted laterally to thelateral substrate portion64. In this seventh alternative embodiment, theoxide layer50 is selected with thermal insulating properties and thickness to limit the amount of theheat22 generated by thechannel region20 that is transferred through theoxide layer50, i.e., theoxide layer50 serves as a thermal barrier. The insulatingoxide layer50, in conjunction with thetrench60, serve as thermally insulating barriers to limit the transmission of theheat22 generated by thechannel region20 other than in the lateral direction to thelateral substrate portion64, thus containing the heat generated by the channel region and allowing it to be better route the heat to the object to be heated.
• In this seventh alternative embodiment of FIG. 8, the[0051]dielectric layer24 extends laterally over thelateral substrate portion64, and anoverlay dielectric layer66 extends over thedielectric layer50. Theoverlay dielectric layer66 is selected with thermal insulating properties to limit the amount of theheat22 generated by thechannel region20 that is transferred therethrough, and for passivation to protect thegate electrode26 and thecontacts14aand16aused for the source and drainregions14 and16. Awindow68 is formed in theoverlay dielectric layer66 at a location laterally offset from the MOSFET and corresponding to thelateral substrate portion64. Abody70 made of silicon with awall portion72 defines thechamber30 with aninward opening74 and anorifice76 through which thesubstance32 can pass, such as a fluid. Thewall portion72 of thebody70 is positioned adjacent to and in sealing engagement with theoverlay dielectric layer66, with theinward opening74 of thechamber30 in alignment with thewindow68 so that theheat22 generated by thechannel region20 which is transmitted laterally through thelateral substrate portion64 will pass through the window and into the chamber.
• An eighth alternative embodiment of the[0052]heater10 is shown in FIG. 9. Theheater10 of FIG. 9 has the same basic construction as the heater of FIG. 8 and has thechamber30 is located on the front of thewafer11′. However, instead of thesubstrate12 and thebody52 extending laterally and providing a window in theoverlay dielectric layer66, in this eighth alternative embodiment thechamber30 formed by thewall portion72 of thebody70 has theinward opening74 positioned immediately over the MOSFET. Further, theinward opening74 has sufficiently large lateral sized to span the source and drainregions14 and16, thegate electrode26 and thechannel region20, and terminates above thetrench60 formed in thesubstrate12 which is located laterally outward of and extends fully about the source and drainregions14 and16 andchannel region20. In such manner, theheat22 generated by thechannel region20 is thermally blocked by theoxide layer50 and thetrench60, and thus contained within thewall portion34 of the substrate12 inward of theoxide layer50 and thetrench60, and transmitted through thegate electrode26 and theoverlay dielectric layer66 around the gate electrode. Theheat22 is then passed through theinward opening74 and into thechamber30. In this embodiment, theoverlay dielectric layer66 is selected with thermal properties which allow sufficient amount of theheat22 generated by thechannel region20 to be transferred through the overlay dielectric layer as needed to supply the desired heat to thechamber30 and to whatever substance may be therein.
• To improve the efficiency of the[0053]heater10, thegate electrode26 used in this eighth alternative embodiment may be fabricated using a material that provides a desirable thermal conductivity for the application for which the heater is to be used. Also, the gate material may be selected to provide a long mechanical life. In an inkjet printhead, a material can be selected for thegate electrode26 that can withstand the high pressures encountered with heated ink and the cavitation effect that is so damaging to prior art inkjet printhead component. The gate material can also be selected to avoid damage that might come from contact of the fluid with thegate electrode26, should such occur. A metal, such as tantalum, tantalum alloy, aluminum and aluminum alloy are acceptable for thegate electrode26. In this invention, it may be desirable to use a metal gate electrode and have the appropriate thickness gate dielectric, whether an oxide or nitride or sandwich thereof, to provide reliable, long-term operation for many applications.
• The[0054]wafer11 or11′ on which theheater10, or more likely many heaters of the design desired for the application, may also contain MOSFETs or other circuitry that serves to control the heater MOSFETs as well as perform other functions. By putting the heater MOSFETs and the other MOSFETs on the same wafer or chip that is produced therefrom, cost savings and size advantages can be achieved. In such an arrangement, the heater MOSFETs and the other MOSFETs would be geometrically isolated from each other sufficiently that the channel regions of the two types of MOSFETs can be processed differently, with thechannel region20 of the heater MOSFETs being fabricated to enhance its channel resistance R_DSso as to produced the desired heat.
• From the foregoing it will be appreciated that, although specific embodiments of the invention have been described herein for purposes of illustration, various modifications may be made without deviating from the spirit and scope of the invention. Accordingly, the invention is not limited except as by the appended claims.[0055]

Claims (43)

1. An integrated heater comprising:

a semiconductor material;

at least one transistor formed in the semiconductor material and operable to generate heat above a selected threshold; and

an object to be heated positioned adjacent to the transistor to receive the heat generated by the transistor.

2. The integrated heater ofclaim 1 wherein the object to be heated is a fluid chamber positioned adjacent to the semiconductor material.

3. The integrated heater ofclaim 1 wherein the object to be heated is a fluid chamber formed in the semiconductor material.

4. The integrated heater ofclaim 1 wherein the semiconductor material has a wall portion adjacent to the transistor to transmit heat generated by the transistor through the semiconductor wall portion, and further including a body having wall portion positioned adjacent to and in sealing engagement with the semiconductor wall portion, such that the semiconductor wall portion and the body wall portion together define a fluid chamber as the object to be heated.

5. The integrated heater ofclaim 4, further including a dielectric layer extending over the semiconductor wall portion and facing toward the fluid chamber.

6. The integrated heater ofclaim 1, further including a thermally insulating barrier formed in the semiconductor material extending about the transistor to limit transmission in the semiconductor material of the heat generated by the transistor beyond the insulating barrier.

7. The integrated heater ofclaim 1 wherein the semiconductor material extends laterally beyond the transistor to provide a lateral semiconductor portion, and the object to be heated is positioned laterally adjacent to the transistor and adjacent to the lateral semiconductor portion to receive the heat generated by the transistor which is transmitted laterally to the lateral semiconductor portion.

8. The integrated heater ofclaim 7, further including a dielectric layer extending over the semiconductor material with a window formed in a portion of the dielectric layer at a location adjacent to the lateral semiconductor portion, and wherein the object to be heated is positioned at the window to receive the heat generated by the transistor which passes through the window.

9. The integrated heater ofclaim 7 wherein the object to be heated is a fluid chamber.

10. The integrated heater ofclaim 7 wherein the lateral semiconductor portion has a wall portion to transmit heat to the object to be heated that is generated by the transistor and transmitted through the lateral semiconductor portion, and further including a body having a wall portion positioned adjacent to and in sealing engagement with the lateral semiconductor wall portion, such that the lateral semiconductor wall portion and the body wall portion together define a fluid chamber as the object to be heated.

11. The integrated heater ofclaim 7, further including a thermally insulating barrier formed in the semiconductor material extending laterally outward of and about the transistor and the lateral semiconductor portion to limit transmission in the semiconductor material of the heat generated by the transistor laterally beyond the insulating barrier.

12. The integrated heater ofclaim 7, further including has a dielectric layer extending over a first face of the semiconductor material and a window formed in a portion of the dielectric layer over the lateral semiconductor portion, with the object to be heated positioned at the window to receive the heat generated by the transistor which passes through the window, and further including a thermally insulating barrier formed in the semiconductor material extending laterally outward of and about the transistor and the window to limit transmission in the semiconductor material of the heat generated by the transistor laterally beyond the insulating barrier.

13. The integrated heater ofclaim 12, further including a thermally insulating layer extending over a second face of the semiconductor material opposite the first face, and the insulating barrier is positioned between the dielectric layer and the insulating layer.

14. The integrated heater ofclaim 12 wherein the object to be heated is a fluid chamber.

15. The integrated heater ofclaim 12, further including a body having wall portion positioned adjacent to and in sealing engagement with the dielectric layer about the window, such that the body wall portion defines a fluid chamber as the object to be heated with the heat being supplied thereto through the window.

16. The integrated heater ofclaim 1, further including a dielectric layer extending over a first face of the semiconductor material with the object to be heated positioned adjacent to the dielectric layer on a side thereof opposite the transistor to receive the heat generated by the transistor.

17. The integrated heater ofclaim 16, further including a thermally insulating barrier formed in the semiconductor material to define a portion of the semiconductor material inward to the insulating barrier positioned to receive the heat generated by the transistor, the insulating barrier being of a material which limits transmission of the heat generated by the transistor and received by the inward portion of the semiconductor material beyond the insulating barrier.

18. The integrated heater ofclaim 16, further including a thermally insulating layer extending over a second face of the semiconductor material opposite the first face.

19. The integrated heater ofclaim 16, further including a body having a wall portion positioned adjacent to and in sealing engagement with the dielectric layer, such that the dielectric layer and the body wall portion together define a fluid chamber as the object to be heated.

20. The integrated heater ofclaim 1 wherein the object to be heated is a fluid.

21. An integrated heater comprising:

a semiconductor material;

a plurality of transistors formed in the semiconductor material and selectively operable to generate heat; and

an object to be heated positioned adjacent to the transistors to receive the heat generated by the transistors.

22. The integrated heater ofclaim 21 wherein the object to be heated is a fluid chamber positioned adjacent to the semiconductor material.

23. The integrated heater ofclaim 21, further including a thermally insulating barrier formed in the semiconductor material extending a perimeter about the transistors to limit transmission of the heat generated by the transistors beyond the insulating barrier.

24. An integrated heater comprising:

a semiconductor substrate;

a source region disposed in the semiconductor substrate;

a drain region disposed in the semiconductor substrate;

a channel region disposed in the semiconductor substrate between the source and drain regions to conduct electric current between the source and drain regions, the channel region having a resistance when conducting current to generate heat above a selected threshold;

a dielectric layer disposed on the channel region;

a gate electrode disposed on the dielectric layer to control the current conducted by the channel region; and

an object to be heated positioned to receive the heat generated by the resistance of the channel region.

25. The integrated heater ofclaim 24 wherein the object to be heated is a fluid chamber positioned adjacent to the semiconductor material.

26. The integrated heater ofclaim 24 wherein the object to be heated is a fluid chamber formed in the semiconductor substrate.

27. The integrated heater ofclaim 24, further including a thermally insulating barrier formed in the semiconductor substrate and extending at least partially about the channel region to define a portion of the semiconductor substrate inward to the insulating barrier positioned to receive the heat generated by the resistance of the channel region.

28. The integrated heater ofclaim 24 wherein the semiconductor substrate has a wall portion adjacent to the channel region to transmit the heat generated by the resistance of the channel region through the semiconductor wall portion, and further including a body having a wall portion positioned adjacent to the semiconductor wall portion and defining a fluid chamber as the object to be heated.

29. The integrated heater ofclaim 28, further including a heat transmitting dielectric layer positioned between the semiconductor wall portion and the body wall portion.

30. The integrated heater ofclaim 24, further including a body having a wall portion positioned adjacent to the dielectric layer and defining a fluid chamber as the object to be heated.

31. The integrated heater ofclaim 24, further including a thermally insulating layer positioned toward a side of the semiconductor substrate away from the dielectric layer.

32. The integrated heater ofclaim 31, further including a thermally insulating barrier formed in the semiconductor substrate to define an inward portion of the semiconductor substrate inward of the insulating barrier and positioned to receive the heat generated by the resistance of the channel region, the insulating barrier being of a material which limits transmission of the heat generated by the resistance of the channel region and received by the inward portion of the semiconductor material beyond the insulating barrier, the object to be heated being in thermal communication with the inward portion of the semiconductor material.

33. The integrated heater ofclaim 32 wherein the insulating barrier projects substantially fully between the dielectric layer and the insulating layer.

34. The integrated heater ofclaim 24, further including an overlay dielectric layer overlaying the gate electrode, the object to be heated being positioned adjacent to the overlay dielectric layer.

35. The integrated heater ofclaim 34, further including a body having a wall portion positioned adjacent to the overlay dielectric layer, across from the gate electrode, and defining a fluid chamber as the object to be heated.

36. The integrated heater ofclaim 35, further including a thermally insulating barrier formed in the semiconductor substrate and extending at least partially about the channel region to define a portion of the semiconductor substrate inward of the insulating barrier and adjacent to the fluid chamber such that the inward portion of the semiconductor substrate is in thermal communication with the fluid chamber.

37. The integrated heater ofclaim 36, further including a thermally insulating layer positioned toward a side of the semiconductor substrate away from the dielectric layer.

38. The integrated heater ofclaim 37 wherein the insulating barrier projects substantially fully between the dielectric layer and the insulating layer.

39. The integrated heater ofclaim 24 wherein the semiconductor substrate extends laterally beyond the source and drain regions to provide a lateral semiconductor substrate portion, and the object to be heated is positioned adjacent to the lateral semiconductor substrate portion to receive the heat generated by the resistance of the channel region which is transmitted laterally thereto through the lateral semiconductor substrate portion.

40. The integrated heater ofclaim 39, wherein the dielectric layer extends laterally over the lateral semiconductor substrate portion, and further including an overlay dielectric layer overlaying the gate electrode and a window formed in of the overlay dielectric layer at a location corresponding to the lateral semiconductor substrate portion, and wherein the object to be heated is positioned at the window to receive the heat transmitted laterally through the lateral semiconductor substrate portion generated by the resistance of the channel region and which passes through the window.

41. The integrated heater ofclaim 40, further including a body having a wall portion positioned adjacent to the window and defining a fluid chamber as the object to be heated with the heat being supplied thereto through the window.

42. The integrated heater ofclaim 24 wherein the gate electrode is metal.

43. The integrated heater ofclaim 24 wherein the object to be heated is a fluid.

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