US20030075795A1 - Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device - Google Patents
Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing deviceDownload PDFInfo
- Publication number
- US20030075795A1 US20030075795A1US10/303,829US30382902AUS2003075795A1US 20030075795 A1US20030075795 A1US 20030075795A1US 30382902 AUS30382902 AUS 30382902AUS 2003075795 A1US2003075795 A1US 2003075795A1
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- US
- United States
- Prior art keywords
- tape carrier
- join
- manufacturing
- identification marks
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
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Images
Classifications
- B—PERFORMING OPERATIONS; TRANSPORTING
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- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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Definitions
- the present inventionrelates to a semiconductor device and tape carrier, and a method of manufacturing the same, to a circuit board, an electronic instrument, and a tape carrier manufacturing device.
- a semiconductor device fabricated with the application of conventional TAB technologyhas outer leads as external electrodes, whereas in CSP, solder balls are used as external electrodes.
- a method which exploits the features of TAB technology, while efficiently providing solder ballshas not yet been developed.
- the present inventionsolves these problems, and has as its object the provision of a method of efficiently manufacturing a semiconductor device, a semiconductor device manufactured by this method, a tape carrier used in this method and a method of manufacture thereof, a circuit board, an electronic instrument, and a tape carrier manufacturing device.
- a method of manufacturing a tape carrier as one aspect of the present inventioncomprises:
- an examination stepin which a tape carrier having a bonding portion formed in a matrix form and at least one type of identification mark is examined;
- a step of forming a join markdelimiting a matrix in which a join formed in the joining step is positioned.
- a bonding portionrefers to the portion to which an individual semiconductor chip is connected.
- itmay include lands for connecting the electrodes of the semiconductor chip, lands for forming external electrodes, and interconnects connecting these lands.
- a plurality of bonding portionsis formed in a row, and therefore in the width direction a plurality of semiconductor chips can be mounted, and the semiconductor device can be fabricated in quantity.
- the manufacturing processcan be advanced for each matrix delimited by the identification mark.
- the join markmay be formed by punching out the identification mark.
- the identification markmay be formed simultaneously with the bonding portion, the identification mark being formed of the same material and by the same method as the bonding portion.
- the identification markcan be formed simply, without increasing the number of steps.
- the tape carriermay have at least two types of the identification mark of different forms which are detected by different examination means.
- a method of manufacturing a semiconductor device as another aspect of the present inventioncomprises:
- an examination stepin which a tape carrier having a plurality of bonding portions formed in a matrix form and at least two types of identification marks is examined;
- a plurality of bonding portionsis formed in a row.
- a semiconductor chipis mounted on each bonding portion, so that a plurality of semiconductor chips are mounted in the width direction, and the semiconductor device can be fabricated in quantity.
- the manufacturing processcan be advanced for each matrix delimited by the identification marks.
- This method of manufacturing a semiconductor devicemay further comprise:
- a plurality of external electrodesis formed simultaneously for each of the plurality of semiconductor chips.
- the adaptability to quantity productionis improved. This step is carried out excluding the region delimited by the join mark. Therefore, flowing of the solder balls by the adhesive tape or the like provided on the join can be prevented. In this way, efficient quantity production of the semiconductor device is possible.
- the forms of the at least two types of identification marksmay be different, and the identification marks may be detected by different examination means.
- a tape carrier as further aspect of the present inventionhas bonding portions formed in a matrix form on a substrate, and identification marks which delimit the bonding portions regularly in pluralities of rows and columns are formed.
- a plurality of bonding portionsis formed in a row, and in the width direction a plurality of semiconductor chips can be mounted, and the semiconductor device can be fabricated in quantity.
- the manufacturing processcan be advanced for each matrix delimited by the identification marks.
- a joinmay be formed by connecting together remaining portions caused by cutting
- a join markmay be formed in a delimited portion including the join.
- a defective location discovered by the examination of the tape carrieris cut out from the tape carrier, thus tape carrier is separated.
- the separated tape carrieris then rejoined, so that a join is formed in the tape carrier.
- the matrix in which the join is positionedis indicated by a join mark. Therefore, by carrying out subsequent processes excluding the matrix delimited by the join mark, flowing of the solder balls by the adhesive tape or the like provided on the join can be prevented. In this way, efficient quantity production of the semiconductor device is possible.
- the join markmay be formed by punching out any of the identification marks.
- join markcan be formed easily, and the identification marks and join marks can be recognized simultaneously.
- the tape carrier of this aspect of the present inventionthere may be at least two types of the identification marks of different forms, and the identification marks may be detected by different examination means.
- a semiconductor device as yet further aspect of the present inventionis manufactured by the above-described method.
- a circuit board as yet further aspect of the present inventionhas the above-described semiconductor device which is mounted thereon.
- An electronic instrument as yet further aspect of the present inventionhas the above-described circuit board.
- a tape carrier manufacturing device as yet further aspect of the present inventioncomprises:
- the plurality of detection meansare detection devices detecting the identification marks by different detection methods.
- one of the plurality of detection meansmay be a detection device for detecting by means of light.
- one of the plurality of detection meansmay be a detection device for detecting by means of image processing.
- identificationcan be possible by means of an identification mark capable of visual recognition.
- one of the plurality of detection meansmay be a detection device for detecting by means of a pin.
- identificationcan be possible by means of an identification mark capable of mechanical recognition.
- FIG. 1shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 2shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 3shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 4shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 5shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 6shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 7shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIGS. 8A and 8Bshows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 9shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 10shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 11shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 12shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention
- FIG. 13shows a circuit board on which the semiconductor device of the embodiment of the present invention is mounted.
- FIG. 14shows an electronic instrument equipped with the circuit board on which the semiconductor device of the embodiment of the present invention is mounted.
- the present inventionis now described in terms of a preferred embodiment, with reference to the drawings.
- the present embodimentrelates to the method of manufacturing a semiconductor device to which the present invention is applied, and is described divided into the process up to the fabrication of a tape carrier and the process after the fabrication of a tape carrier.
- FIGS. 1 to 6show steps in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device to which the present invention is applied.
- FIG. 1is a tape carrier 10 shown in FIG. 1 .
- FIG. 2is a section along the line II-II in FIG. 1
- FIG. 3is a section along the line III-III in FIG. 1.
- the thickness and size of materialsare not shown to scale, for the purposes of description, and the present invention is not limited by their proportions.
- the tape carrier 10comprises a substrate 12 in a strip or tape form, and a plurality of bonding portions 14 formed on at least one surface of the substrate 12 , and is provided wound around a reel not shown in the drawings.
- the tape carrier 10may equally be a three-layer tape, in which the bonding portions 14 are formed by etching or the like after adhering a conductive foil such as copper foil or the like to the substrate 12 with adhesive, or a two-layer tape in which adhesive is not used.
- a conductive film of copper or the likeis deposited on the substrate by sputtering or the like. Then this is etched to form the bonding portions 14 , or alternatively, on a conductive foil such as a copper foil, a varnish such as a polyimide resin to form the substrate is applied and cured, after which the bonding portions 14 are formed.
- the substrate 12can be formed from an organic or resin material as generally used for a tape carrier, but the material is not limited as long as it has flexibility. Rather than a three-layer tape, a two-layer tape with no adhesive generally has superior flexibility. Further, to increase the flexibility, by utilizing TAB processing or the like, partial punching, overhang, or the like may be added.
- sprocket holes 16are formed along continuously in the longitudinal direction.
- the sprocket holes 16are arranged so as to mesh with sprockets not shown in the drawings when the tape carrier 10 is wound up or fed out.
- through holes 18are formed in the substrate 12 .
- a part of the solder balls formed on the opposite surface to that on which the bonding portions 14 are formedenters the through hole, providing an electrical conductivity between the bonding portions 14 , and the solder balls and second surface on which the solder balls are exposed.
- an electrically conducting material 19such as gold or copper is plated, and in the opening the bonding portions 14 may be electrically connected to the electrically conducting material 19 .
- solder balls 38may be formed on the second surface. Together with this, bonding portions and lands to receive solder balls may also be formed on the second surface, thus adopting a double-sided substrate.
- the bonding portions 14are formed with a plurality in the width direction of the substrate 12 , repeatedly in the longitudinal direction of the substrate 12 .
- a semiconductor chip 32(see FIG. 8A) is connected to each bonding portion 14 .
- the bonding portions 14are portions for connecting individual semiconductor chips 32 , and for example, include lands for connecting electrodes 34 of a semiconductor chip 32 , lands for forming external electrodes 38 (see FIG. 10), and interconnects connecting these lands. It should be noted that in FIG. 1, are shown only the region in which bonding portions 14 are formed, and further detail is omitted. Each of these bonding portions 14 has an interconnect pattern and lands formed for individual semiconductor chips 32 (see FIG. 8A).
- a plurality of the bonding portions 14is formed in the width direction of the substrate 12 , a plurality of the semiconductor chips 32 is mounted in the width direction of the substrate 12 . Since the bonding portions 14 are formed repeatedly in the longitudinal direction of the substrate 12 , the semiconductor chips 32 are mounted repeatedly in the longitudinal direction of the substrate 12 .
- positioning holes 20are formed for the purpose of identifying the positions of the bonding portions 14 .
- the bonding portions 14are aligned in a row in the width direction of the substrate 12 , and the positioning holes 20 are formed further on the outside of both of the outermost of these bonding portions 14 .
- Adjacent to two corners of a bonding portion 14is formed a pair of the positioning holes 20 .
- pairs of identification marks 22are formed on the substrate 12 , as shown in FIG. 1, pairs of identification marks 22 are formed.
- the identification marks 22are arranged to delimit a matrix 13 formed of a plurality of rows and a plurality of columns of the bonding portions 14 , to allow identification.
- four in the longitudinal direction of the substrate 12and five in the width direction of the substrate 12 , that is, 4 ⁇ 5 of the bonding portions 14 form the matrix 13 .
- a pair of L-shaped identification marks 22is formed to delimit the matrix 13 .
- identification marks 22can be detected visually (by imaging), but may be unsuitable for detection by a detecting device.
- identification marks 27which can be mechanically identified, may be formed.
- identification marks 27which can be mechanically identified, may be formed.
- the presence of the identification marks 27can be detected by detection pins or the passage of a light beam.
- a tape carrier manufacturing devicepreferably includes a carrying means for carrying the tape carrier 10 (for example the reel 24 shown in FIG. 4), a examination device for identifying the identification marks 22 by image processing (for example a camera 25 ), pins 29 for detecting the identification marks 27 , an examination device for optically detecting the identification marks 27 (for example a photoreceptor element 31 ), and so forth.
- a pair of identification marks 22delimits a matrix 13 in a regularly repeated manner. For example, a pair of identification marks 22 skips a row of the bonding portions 14 extending in the width direction of the substrate 12 , to delimit the matrix 13 . In other words, between the matrix 13 delimited by a pair of identification marks 22 and the adjacent matrix 13 delimited by another pair of identification marks 22 , a row of the bonding portions 14 extending in the width direction remains. Taking any row of the bonding portions 14 in the width direction of the tape carrier 10 as the reference point, the rows of the bonding portions 14 in the width direction which are outside this section are those rows numbered a natural number n multiplied by a constant k in the longitudinal direction. For example, in the present embodiment shown in FIG. 1:
- the rows of bonding portions 14 numbered 5 , 10 , 15 , 20 , and so on in the longitudinal directionare outside the delimit of the pairs of identification marks 22 .
- the number of bonding portions 14 configuring the matrix 13 delimited by a pair of the identification marks 22 and the form of the identification marks 22can be determined freely.
- the identification marks 22can be formed at the same time as the formation of bonding portions 14 , of the same material as the bonding portions 14 .
- the above-described tape carrier 10is subjected to an examination process.
- this examination processdefective bonding portions 14 and so forth are detected. Then when a tape carrier defect spanning a number of products is detected, the defective locations are cut out.
- FIG. 4shows the process of cutting out a defective location which has been discovered in the examination.
- the tape carrier 10is wound around a reel 24 .
- the tape carrier 10is unwound from the reel 24 , and by means of a cutting tool 26 such as a cutter, a defective location 28 is cut out.
- a cutting tool 26such as a cutter
- FIG. 5is shown the step in which the defective location 28 is removed from the tape carrier 10 .
- the defective locationmay be removed in a single operation using two cutting tools, or equally a single cutting tool may be used twice to remove the defective location.
- the tape carrier 10is cut.
- the cuttingis carried out so that when the tape carrier 10 , which has been cut, is joined back together, the regular repetition of the matrix 13 is preserved. That is to say, when the tape carrier 10 is cut in two locations in order to remove the defective location 28 , the tape carrier 10 is cut so that the identification mark 22 closest to one cut edge and the identification mark 22 closest to the other cut edge delimit the above-described matrix 13 .
- a row of the bonding portions 14is disposed between adjacent matrices 13 .
- the tape carrier 10which has been cut, is joined.
- the defective location 28 shown in FIG. 5is removed out from the tape carrier 10 .
- the edges of the remaining portions of the tape carrier 10are joined together, by applying an adhesive tape (not shown) or the like.
- an adhesive tape(not shown) or the like.
- join marks 23are formed.
- the join marks 23can be formed, for example, by punching out identification marks 22 .
- the join marks 23also function as identification marks 22 .
- the join marks 23may be formed after the tape carrier 10 which has been cut has be joined, or may be formed first. For example, as shown in FIG. 5, after the defective location 28 has been cut away from the tape carrier 10 , before the tape carrier 10 is joined back together, join marks 23 may be formed. Alternatively, in the examination process, after a defective location has been found and before cutting, the position of the join may be determined and the join marks 23 may be formed.
- join marks 23By attaching the join marks 23 in this way, and detecting the join marks 23 with for example an optoelectric sensor, and in subsequent processes the joins 21 can be automatically and mechanically detected. In other words, a matrix, which cannot be used for mounting, can be recognized.
- the tape carrier 10which has been joined back together has the matrix 13 positioned at a join 21 similar to the other matrices 13 , with a 4 ⁇ 5 array of the bonding portions 14 . Further, the formation of one row of the bonding portions 14 between two adjacent matrices 13 ensures that no irregular intervals are formed. That is to say, the tape carrier 10 is exactly the same as the tape carrier 10 shown in FIG. 1, except that the joins 21 connected by adhesive tape or the like are formed, and the presence of these joins 21 is shown by join marks 23 being formed.
- the tape carrier 10may employ, in place of the above-described two-layer or three-layer tape, a double-sided interconnect tape, a built-up interconnect tape, a glass-epoxy tape, or any other means, provided that it is capable of being supplied from a reel.
- a double-sided interconnect tapea built-up interconnect tape
- a glass-epoxy tapeor any other means, provided that it is capable of being supplied from a reel.
- any materialcan be used as long as the material of the tape has sufficient flexibility to be wound around a reel and is a material such that the interconnects can be formed.
- FIGS. 7 to 13show steps in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device to which the present invention is applied.
- FIG. 7shows the step of providing the anisotropic conductive film on the tape carrier.
- the tape carrier 10as shown in FIG. 7, is wound around a reel 24 , to be taken up on another reel 24 . That is to say, in the present embodiment, a reel-to-reel process is used. Then between the two reels 24 , an anisotropic conductive film 30 is adhered to the tape carrier 10 .
- the anisotropic conductive film 30is preferably provided in tape form, wound around a reel 124 . Then when the anisotropic conductive film 30 has been continuously applied to the tape carrier 10 , the tape carrier 10 is temporarily wound up.
- the anisotropic conductive film 30is an adhesive (binder) in which conductive particles (conductive filler) are dispersed, and may also include a dispersant additive.
- the anisotropic conductive film 30may first be made into sheet form, then adhered to the tape carrier 10 , or may be applied in liquid form. It should be noted that a thermosetting adhesive is commonly used as the adhesive of the anisotropic conductive film 30 .
- the anisotropic conductive film 30is provided at least on the bonding portions 14 .
- the anisotropic conductive film 30may be provided to avoid the bonding portions 14 constituting a matrix 13 for which presence of a join 21 is indicated by join marks 23 .
- a plurality of the semiconductor chips 32are mounted on the anisotropic conductive film 30 .
- bonding portions 14are formed in a plurality of rows and a plurality of columns to constitute a matrix 13 , and on each bonding portion 14 is mounted an individual semiconductor chip 32 .
- the semiconductor chips 32are not mounted on bonding portions 14 constituting a matrix 13 delimited by join marks 23 .
- the semiconductor chips 32On the semiconductor chips 32 are provided a plurality of electrodes 34 , and the surface 36 on which the electrodes 34 are provided is mounted on the anisotropic conductive film 30 .
- the bonding portions 14are formed to correspond to the layout of the electrodes 34 , and the electrodes 34 are positioned for mounting the semiconductor chip 32 .
- the positioning holes 20can be utilized.
- landsare preferably formed with greater width than other portions.
- the semiconductor chips 32may be mounted one at a time, or a plurality of the semiconductor chips 32 may be mounted simultaneously. For example, the number of semiconductor chips 32 corresponding to the plurality of bonding portions 14 constituting the matrix 13 may be mounted simultaneously.
- the semiconductor chips 32may be such as to have electrodes 34 formed on two edges only, or may be formed to have electrodes 34 formed on four edges.
- the electrodes 34commonly employ projections of gold or solder or the like provided on aluminum pads, but projections may be provided on the bonding portions 14 , or the bonding portions 14 may be etched to form projections.
- a jig 40is pressed against the surface opposite to the surface 36 of the semiconductor chip 32 on which the electrodes 34 are formed, and the semiconductor chip 32 is pressed in the direction of the bonding portions 14 .
- the jig 40has an internal heater, not shown in the drawings, and heats the semiconductor chip 32 . It should be noted that as shown in the drawing, a plurality of the semiconductor chips 32 may be pressed in a single operation, or each semiconductor chip 32 may be pressed individually.
- the electrodes 34 of the semiconductor chip 32 and the bonding portions 14are electrically connected by the interposition of the conductive particles of the anisotropic conductive film 30 .
- the bonding portions 14 and electrodes 34are electrically connected by the anisotropic conductive film 30 .
- filling between the semiconductor chip 32 and substrate 12 with a resinis simultaneously carried out.
- a semiconductor devicecan be fabricated by a method having superior reliability and manufacturability.
- the adhesive of the anisotropic conductive film 30is cured at least in the contact region 36 of the semiconductor chip 32 with the surface. This assumes, however, that a thermosetting adhesive is used. If the curing mechanism of the anisotropic conductive film 30 is different, a means for applying the appropriate form of energy is used to realize the anisotropic conductivity.
- FIG. 9shows the tape carrier 10 on which the semiconductor chips 32 are mounted.
- no semiconductor chips 32are mounted on the bonding portions 14 constituting the matrix 13 where join marks 23 indicate the position of join 21 .
- join marks 23indicate the position of join 21 .
- no semiconductor chips 32are mounted on one row of the bonding portions 14 in the width direction of the substrate 12 . In this state, the tape carrier 10 is wound around the reel 24 and proceeds to the next step.
- solder balls 38are used as the external electrodes.
- the solder balls 38are mounted on through holes 18 on the surface of the substrate 12 of the tape carrier 10 opposite to that of the bonding portions 14 , and are electrically connected to an electrically conducting material 19 formed on the internal surfaces of the through holes 18 .
- the positioning holes 20the positioning of the solder balls 38 can be carried out.
- lands connected to the electrically conducting material 19may be formed on the surface on which the solder balls 38 are mounted.
- the solder balls 38 of the corresponding plurality of the semiconductor chips 32are mounted simultaneously. That is to say, all of the solder balls 38 for the 4 ⁇ 5 bonding portions 14 forming the matrix 13 are mounted simultaneously. By this means, the time required for mounting the solder balls 38 is reduced, and the adaptability to quantity production can be improved.
- solder balls 38are mounted for each of the matrices 13 . But on the join 21 shown in FIG. 9, solder balls 38 cannot be mounted because of the presence of adhesive tape and the like. It is possible to consider mounting the solder balls 38 so as to avoid only the vicinity of the join 21 , but in this case, processing cannot be performed for each of the matrices 13 .
- solder balls 38are not mounted.
- solder balls 38are mounted for the matrix 13 other than the matrix 13 , in which the join 21 is positioned.
- cream soldermay be provided by a printing method.
- the tape carrier 10 with the solder balls 38 provided as external electrodesis wound around the reel 24 and advances to the next step. It should be noted that as necessary, after forming the solder balls 38 , cleaning, marking and curing are carried out. In these steps also, as necessary, the positioning holes 20 can be used for carrying out positioning.
- the semiconductor chips 32 for each of the bonding portions 14are mounted on the tape carrier 10 .
- the electrodes 34 of the semiconductor chip 32 and the bonding portions 14are electrically connected by the anisotropic conductive film 30 .
- the solder balls 38are provided, electrically connected to the bonding portions 14 by the electrically conducting material 19 on the inside surfaces of the through holes 18 . Therefore, each of the plurality of rows and plurality of columns of the semiconductor chips 32 , has solder balls 38 electrically connected to the electrodes 34 . Therefore, in respect of each semiconductor chip 32 , a semiconductor device is constituted. Therefore, when the tape carrier 10 is cut for each individual semiconductor chip 32 , it forms a completed individual semiconductor device. When cutting out the tape carrier 10 , the positioning holes 20 can be used to carry out positioning.
- FIG. 12shows the step of cutting out the tape carrier 10 .
- a fixed jig 44such as a fixed blade is fixed to straddle around the periphery of each semiconductor chip 32 on the substrate 12 .
- a movable jig 46such as a movable blade is used to punch out the periphery of the semiconductor chip 32 . In this way, individual semiconductor devices 50 are obtained.
- the semiconductor devices 50may as necessary be subjected to visual examination, electrical characteristic testing examination, burn-in, and so forth.
- the bonding portions 14are electrically connected to the electrodes 34 by the anisotropic conductive film 30 , the semiconductor devices 50 can be fabricated by a method having superior reliability and manufacturability.
- a plurality of bonding portions 14are sequentially formed in the width direction of the tape carrier 10 , and a semiconductor chip 32 is connected for each bonding portion 14 . Therefore, since a plurality of the semiconductor chips 32 is mounted in a matrix, the present embodiment is suitable for quantity production of the semiconductor devices 50 .
- the tape carrier 10is provided wound around the reel 24 , and application of the anisotropic conductive film 30 , the mounting and pressing of the semiconductor chips 32 , the formation of the external electrodes 38 , and the cutting out of individual devices is carried out reel-to-reel. It should be noted that instead of all of these steps being carried out reel-to-reel, at some point the tape carrier 10 may be cut into rectangular sheets. The timing of this cutting may be, for example, any of the following: after the anisotropic conductive film 30 is provided and before mounting the semiconductor chips 32 , after mounting the semiconductor chips 32 and before pressing the semiconductor chips 32 , after pressing the semiconductor chips 32 and before mounting the solder balls 38 , after mounting the solder balls 39 and before cutting out individual devices. A row of bonding portions 14 in the width direction formed between adjacent matrices 13 may be selected as a position for cutting into rectangular sheets.
- the fabrication processcan be advanced for each matrix 13 delimited by identification marks 22 .
- a plurality of solder balls 38can be formed simultaneously for the plurality of semiconductor chips 32 .
- the adaptability to quantity productionis improved.
- this processalso can be carried out eliminating the matrix 13 delimited by the join marks 23 . Therefore, flowing of the solder balls 38 by the adhesive tape and the like provided on the join 21 can be prevented. In this way, the semiconductor devices 50 can be efficiently produced in quantity.
- FIG. 13In FIG. 13 is shown a circuit board 1000 on which is mounted a semiconductor device 1100 fabricated by the method of the above-described embodiment.
- An organic substratesuch as a glass epoxy substrate is generally used for the circuit board.
- a bonding portion of for example copperis formed to constitute a desired circuit. This bonding portion and external electrodes of the semiconductor device 1100 are mechanically connected, to achieve the electrical conduction.
- the semiconductor device 1100can be made as small in surface area as to be mounted as a bare chip on the mounting surface, the electronic instrument can be made compact by using the circuit board 1000 as the electronic instrument. Further, within the same area, more mounting space can be made available, and higher functionality can be achieved.
- FIG. 14shows a notebook personal computer 1200 .
- electronic componentsfor example, may be cited resistors, capacitors, coils, oscillators, filters, temperature sensors, thermistors, varistors, variable resistors, and fuses.
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Abstract
Description
- 1. Field of the Invention[0001]
- The present invention relates to a semiconductor device and tape carrier, and a method of manufacturing the same, to a circuit board, an electronic instrument, and a tape carrier manufacturing device.[0002]
- 2. Description of Related Art[0003]
- In recent years, with the increasingly compact nature of electronic instruments, there has been a large demand for compact semiconductor devices in which CSP (Chip Scale/Size Package) technology is applied. For the manufacture of such compact semiconductor devices, TAB (Tape Automated Bonding) technology can be applied. Since TAB technology can be carried out using a tape carrier in a reel-to-reel process, it is appropriate to quantity production of semiconductor devices.[0004]
- However, TAB technology was not developed with semiconductor devices as compact as those of today in mind, and there is therefore further room for improvement.[0005]
- For example, a semiconductor device fabricated with the application of conventional TAB technology has outer leads as external electrodes, whereas in CSP, solder balls are used as external electrodes. A method which exploits the features of TAB technology, while efficiently providing solder balls has not yet been developed.[0006]
- If there should be a fault in a part of the tape carrier, which requires a very fine interconnect pattern, it is necessary to remove the bad portion and join the remainder together. On a tape carrier with a dense interconnect pattern, the cutting must be carried out on the interconnect pattern, and at the join, adhesive tape or the like is provided for the joining. Therefore, the mounting of a semiconductor chip or the formation of solder balls cannot be carried out at the join, but a reel-to-reel process is carried out continuously, and as a result it has not been possible to avoid just this area.[0007]
- The present invention solves these problems, and has as its object the provision of a method of efficiently manufacturing a semiconductor device, a semiconductor device manufactured by this method, a tape carrier used in this method and a method of manufacture thereof, a circuit board, an electronic instrument, and a tape carrier manufacturing device.[0008]
- (1) A method of manufacturing a tape carrier as one aspect of the present invention comprises:[0009]
- an examination step in which a tape carrier having a bonding portion formed in a matrix form and at least one type of identification mark is examined;[0010]
- a step of removing a portion which includes a defective location detected in the examination step, and then joining together remaining portions of the tape carrier after the removal; and[0011]
- a step of forming a join mark delimiting a matrix in which a join formed in the joining step is positioned.[0012]
- In this aspect of the present invention, to one bonding portion, one semiconductor chip is connected. A bonding portion refers to the portion to which an individual semiconductor chip is connected. For example, it may include lands for connecting the electrodes of the semiconductor chip, lands for forming external electrodes, and interconnects connecting these lands.[0013]
- According to this aspect of the present invention, in the width direction of the tape carrier, a plurality of bonding portions is formed in a row, and therefore in the width direction a plurality of semiconductor chips can be mounted, and the semiconductor device can be fabricated in quantity. The manufacturing process can be advanced for each matrix delimited by the identification mark.[0014]
- Further, in this aspect of the present invention, a defective location discovered by the examination of the tape carrier is cut out from the tape carrier, thus tape carrier is separated. The separated tape carrier is then rejoined again. As a result, a join is formed in the tape carrier, but the matrix in which this join is positioned is shown by a join mark. Therefore, by carrying out subsequent processes excluding the matrix delimited by the join mark, flowing of the solder balls by the adhesive tape or the like provided on the join can be prevented. In this way, efficient quantity production of the semiconductor device is possible.[0015]
- (2) In this manufacturing method, the join mark may be formed by punching out the identification mark.[0016]
- (3) In this manufacturing method, the identification mark may be formed simultaneously with the bonding portion, the identification mark being formed of the same material and by the same method as the bonding portion.[0017]
- By this means, the identification mark can be formed simply, without increasing the number of steps.[0018]
- (4) In this manufacturing method, the tape carrier may have at least two types of the identification mark of different forms which are detected by different examination means.[0019]
- (5) A method of manufacturing a semiconductor device as another aspect of the present invention comprises:[0020]
- an examination step in which a tape carrier having a plurality of bonding portions formed in a matrix form and at least two types of identification marks is examined;[0021]
- a step of removing a portion which includes a defective location detected in the examination step, and then joining together remaining portions of the tape carrier after the removal;[0022]
- a step of forming a join mark delimiting a matrix in which a join formed in the joining step is positioned; and[0023]
- a step of electrically connecting each of the plurality of bonding portions to a corresponding of a plurality of semiconductor chips, excluding a region delimited by the join mark.[0024]
- According to this aspect of the present invention, in the width direction of the tape carrier, a plurality of bonding portions is formed in a row. A semiconductor chip is mounted on each bonding portion, so that a plurality of semiconductor chips are mounted in the width direction, and the semiconductor device can be fabricated in quantity.[0025]
- The manufacturing process can be advanced for each matrix delimited by the identification marks.[0026]
- In this aspect of the present invention, a defective location discovered by the examination of the tape carrier is cut out from the tape carrier, thus tape carrier is separated. The separated tape carrier is then rejoined. As a result, a join is formed in the tape carrier, but the matrix in which this join is positioned, is indicated by a join mark. Then, excluding the matrix delimited by the join mark, a semiconductor chip is mounted on each bonding portion.[0027]
- (6) This method of manufacturing a semiconductor device may further comprise:[0028]
- a step of excluding the region delimited by the join mark, and forming a plurality of external electrodes simultaneously for the plurality of semiconductor chips for each matrix.[0029]
- By means of this, for each matrix, a plurality of external electrodes is formed simultaneously for each of the plurality of semiconductor chips. By forming the external electrodes simultaneously for the plurality of semiconductor chips, the adaptability to quantity production is improved. This step is carried out excluding the region delimited by the join mark. Therefore, flowing of the solder balls by the adhesive tape or the like provided on the join can be prevented. In this way, efficient quantity production of the semiconductor device is possible.[0030]
- (7) In this method of manufacturing a semiconductor device, the forms of the at least two types of identification marks may be different, and the identification marks may be detected by different examination means.[0031]
- (8) A tape carrier as further aspect of the present invention has bonding portions formed in a matrix form on a substrate, and identification marks which delimit the bonding portions regularly in pluralities of rows and columns are formed.[0032]
- According to this aspect of the present invention, in the width direction of the tape carrier, a plurality of bonding portions is formed in a row, and in the width direction a plurality of semiconductor chips can be mounted, and the semiconductor device can be fabricated in quantity. The manufacturing process can be advanced for each matrix delimited by the identification marks.[0033]
- (9) In the tape carrier of this aspect of the present invention,[0034]
- a join may be formed by connecting together remaining portions caused by cutting; and[0035]
- a join mark may be formed in a delimited portion including the join.[0036]
- Further, in this aspect of the present invention, a defective location discovered by the examination of the tape carrier is cut out from the tape carrier, thus tape carrier is separated. The separated tape carrier is then rejoined, so that a join is formed in the tape carrier. The matrix in which the join is positioned is indicated by a join mark. Therefore, by carrying out subsequent processes excluding the matrix delimited by the join mark, flowing of the solder balls by the adhesive tape or the like provided on the join can be prevented. In this way, efficient quantity production of the semiconductor device is possible.[0037]
- (10) In the tape carrier of this aspect of the present invention, the join mark may be formed by punching out any of the identification marks.[0038]
- By this means, a join mark can be formed easily, and the identification marks and join marks can be recognized simultaneously.[0039]
- (11) In the tape carrier of this aspect of the present invention, there may be at least two types of the identification marks of different forms, and the identification marks may be detected by different examination means.[0040]
- (12) A semiconductor device as yet further aspect of the present invention is manufactured by the above-described method.[0041]
- (13) A circuit board as yet further aspect of the present invention has the above-described semiconductor device which is mounted thereon.[0042]
- (14) An electronic instrument as yet further aspect of the present invention has the above-described circuit board.[0043]
- (15) A tape carrier manufacturing device as yet further aspect of the present invention comprises:[0044]
- carrying means for carrying a tape carrier having a plurality of identification marks; and[0045]
- a plurality of detection means for detecting the plurality of identification marks,[0046]
- wherein the plurality of detection means are detection devices detecting the identification marks by different detection methods.[0047]
- (16) In this tape carrier manufacturing device:[0048]
- one of the plurality of detection means may be a detection device for detecting by means of light.[0049]
- (17) In this tape carrier manufacturing device:[0050]
- one of the plurality of detection means may be a detection device for detecting by means of image processing.[0051]
- By means of this, identification can be possible by means of an identification mark capable of visual recognition.[0052]
- (18) In this tape carrier manufacturing device:[0053]
- one of the plurality of detection means may be a detection device for detecting by means of a pin.[0054]
- By means of this, identification can be possible by means of an identification mark capable of mechanical recognition.[0055]
- FIG. 1 shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0056]
- FIG. 2 shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0057]
- FIG. 3 shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0058]
- FIG. 4 shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0059]
- FIG. 5 shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0060]
- FIG. 6 shows a step in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0061]
- FIG. 7 shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0062]
- FIGS. 8A and 8B shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0063]
- FIG. 9 shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0064]
- FIG. 10 shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0065]
- FIG. 11 shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0066]
- FIG. 12 shows a step in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device of the present invention;[0067]
- FIG. 13 shows a circuit board on which the semiconductor device of the embodiment of the present invention is mounted; and[0068]
- FIG. 14 shows an electronic instrument equipped with the circuit board on which the semiconductor device of the embodiment of the present invention is mounted.[0069]
- The present invention is now described in terms of a preferred embodiment, with reference to the drawings. The present embodiment relates to the method of manufacturing a semiconductor device to which the present invention is applied, and is described divided into the process up to the fabrication of a tape carrier and the process after the fabrication of a tape carrier.[0070]
- Process Up to the Fabrication of a Tape Carrier:[0071]
- FIGS.[0072]1 to6 show steps in the process up to the fabrication of a tape carrier in the method of manufacturing a semiconductor device to which the present invention is applied.
- In the present embodiment, a[0073]
tape carrier 10 shown in FIG. 1 is used. FIG. 2 is a section along the line II-II in FIG. 1, and FIG. 3 is a section along the line III-III in FIG. 1. In the drawings, the thickness and size of materials are not shown to scale, for the purposes of description, and the present invention is not limited by their proportions. - The[0074]
tape carrier 10 comprises asubstrate 12 in a strip or tape form, and a plurality ofbonding portions 14 formed on at least one surface of thesubstrate 12, and is provided wound around a reel not shown in the drawings. It should be noted that thetape carrier 10 may equally be a three-layer tape, in which thebonding portions 14 are formed by etching or the like after adhering a conductive foil such as copper foil or the like to thesubstrate 12 with adhesive, or a two-layer tape in which adhesive is not used. In a two-layer tape, a conductive film of copper or the like is deposited on the substrate by sputtering or the like. Then this is etched to form thebonding portions 14, or alternatively, on a conductive foil such as a copper foil, a varnish such as a polyimide resin to form the substrate is applied and cured, after which thebonding portions 14 are formed. - The[0075]
substrate 12 can be formed from an organic or resin material as generally used for a tape carrier, but the material is not limited as long as it has flexibility. Rather than a three-layer tape, a two-layer tape with no adhesive generally has superior flexibility. Further, to increase the flexibility, by utilizing TAB processing or the like, partial punching, overhang, or the like may be added. - At both side edges of the[0076]
substrate 12 in the width direction, sprocket holes16 are formed along continuously in the longitudinal direction. The sprocket holes16 are arranged so as to mesh with sprockets not shown in the drawings when thetape carrier 10 is wound up or fed out. - As shown in enlargement in FIG. 2, through[0077]
holes 18 are formed in thesubstrate 12. Normally, a part of the solder balls formed on the opposite surface to that on which thebonding portions 14 are formed (the second surface) enters the through hole, providing an electrical conductivity between thebonding portions 14, and the solder balls and second surface on which the solder balls are exposed. As another example, as shown in FIG. 2, on the inside surfaces of the throughholes 18 an electrically conductingmaterial 19 such as gold or copper is plated, and in the opening thebonding portions 14 may be electrically connected to theelectrically conducting material 19. By this means, an electrical connection is obtained from thebonding portions 14 formed on the one surface of thesubstrate 12 through theelectrically conducting material 19 of the throughholes 18, and solder balls38 (see FIG. 10) may be formed on the second surface. Together with this, bonding portions and lands to receive solder balls may also be formed on the second surface, thus adopting a double-sided substrate. - The[0078]
bonding portions 14 are formed with a plurality in the width direction of thesubstrate 12, repeatedly in the longitudinal direction of thesubstrate 12. To each bondingportion 14, a semiconductor chip32 (see FIG. 8A) is connected. Thebonding portions 14 are portions for connectingindividual semiconductor chips 32, and for example, include lands for connectingelectrodes 34 of asemiconductor chip 32, lands for forming external electrodes38 (see FIG. 10), and interconnects connecting these lands. It should be noted that in FIG. 1, are shown only the region in whichbonding portions 14 are formed, and further detail is omitted. Each of thesebonding portions 14 has an interconnect pattern and lands formed for individual semiconductor chips32 (see FIG. 8A). Therefore, in the present embodiment, since a plurality of thebonding portions 14 is formed in the width direction of thesubstrate 12, a plurality of the semiconductor chips32 is mounted in the width direction of thesubstrate 12. Since thebonding portions 14 are formed repeatedly in the longitudinal direction of thesubstrate 12, the semiconductor chips32 are mounted repeatedly in the longitudinal direction of thesubstrate 12. - On the[0079]
substrate 12, as shown in FIG. 3, positioning holes20 are formed for the purpose of identifying the positions of thebonding portions 14. In more detail, thebonding portions 14 are aligned in a row in the width direction of thesubstrate 12, and the positioning holes20 are formed further on the outside of both of the outermost of thesebonding portions 14. Adjacent to two corners of abonding portion 14 is formed a pair of the positioning holes20. By means of the thus-formed positioning holes20, the position of thebonding portions 14 aligned in a row in the width direction of thesubstrate 12 can be identified. - On the[0080]
substrate 12, as shown in FIG. 1, pairs of identification marks22 are formed. The identification marks22 are arranged to delimit amatrix 13 formed of a plurality of rows and a plurality of columns of thebonding portions 14, to allow identification. In the present embodiment, four in the longitudinal direction of thesubstrate 12, and five in the width direction of thesubstrate 12, that is, 4×5 of thebonding portions 14 form thematrix 13. To delimit thematrix 13, a pair of L-shaped identification marks22 is formed. - The above-described identification marks[0081]22 can be detected visually (by imaging), but may be unsuitable for detection by a detecting device. In this case, identification marks27, which can be mechanically identified, may be formed. For example, by means of holes, identification marks27, which can be mechanically identified, may be formed. In this case, the presence of the identification marks27 can be detected by detection pins or the passage of a light beam.
- A tape carrier manufacturing device preferably includes a carrying means for carrying the tape carrier[0082]10 (for example the
reel 24 shown in FIG. 4), a examination device for identifying the identification marks22 by image processing (for example a camera25), pins29 for detecting the identification marks27, an examination device for optically detecting the identification marks27 (for example a photoreceptor element31), and so forth. - A pair of identification marks[0083]22 delimits a
matrix 13 in a regularly repeated manner. For example, a pair of identification marks22 skips a row of thebonding portions 14 extending in the width direction of thesubstrate 12, to delimit thematrix 13. In other words, between thematrix 13 delimited by a pair of identification marks22 and theadjacent matrix 13 delimited by another pair of identification marks22, a row of thebonding portions 14 extending in the width direction remains. Taking any row of thebonding portions 14 in the width direction of thetape carrier 10 as the reference point, the rows of thebonding portions 14 in the width direction which are outside this section are those rows numbered a natural number n multiplied by a constant k in the longitudinal direction. For example, in the present embodiment shown in FIG. 1: - k=5[0084]
- Therefore, based on any one row of the[0085]
bonding portions 14, the rows ofbonding portions 14 numbered5,10,15,20, and so on in the longitudinal direction are outside the delimit of the pairs of identification marks22. - These rows of the[0086]
bonding portions 14 outside the delimits can be used as cutting regions, but in the present embodiment, this is not in particular necessary. Therefore, thematrices 13 may be delimited without skipping rows ofbonding portions 14. - The number of[0087]
bonding portions 14 configuring thematrix 13 delimited by a pair of the identification marks22 and the form of the identification marks22 can be determined freely. When a two-layer tape is used, the identification marks22 can be formed at the same time as the formation ofbonding portions 14, of the same material as thebonding portions 14. - Next, the above-described[0088]
tape carrier 10 is subjected to an examination process. In this examination process,defective bonding portions 14 and so forth are detected. Then when a tape carrier defect spanning a number of products is detected, the defective locations are cut out. - FIG. 4 shows the process of cutting out a defective location which has been discovered in the examination. As shown in this figure, the[0089]
tape carrier 10 is wound around areel 24. Then thetape carrier 10 is unwound from thereel 24, and by means of acutting tool 26 such as a cutter, adefective location 28 is cut out. In FIG. 5 is shown the step in which thedefective location 28 is removed from thetape carrier 10. As shown in FIG. 5, the defective location may be removed in a single operation using two cutting tools, or equally a single cutting tool may be used twice to remove the defective location. - In this cutting process, within the region delimited by a pair of identification marks[0090]22, the
tape carrier 10 is cut. In more detail, the cutting is carried out so that when thetape carrier 10, which has been cut, is joined back together, the regular repetition of thematrix 13 is preserved. That is to say, when thetape carrier 10 is cut in two locations in order to remove thedefective location 28, thetape carrier 10 is cut so that theidentification mark 22 closest to one cut edge and theidentification mark 22 closest to the other cut edge delimit the above-describedmatrix 13. Moreover, in the present embodiment, a row of thebonding portions 14 is disposed betweenadjacent matrices 13. By this means, while the regular repetition of thematrix 13 is maintained, the subsequent regular processes, in particular the tape-to-reel process can be carried out. - Next, as shown in FIG. 6, the[0091]
tape carrier 10, which has been cut, is joined. In more detail, thedefective location 28 shown in FIG. 5 is removed out from thetape carrier 10. The edges of the remaining portions of thetape carrier 10 are joined together, by applying an adhesive tape (not shown) or the like. By joining the remaining portions without overlapping, and applying adhesive tape to at least either the front or back surface, no step is created in thesubstrate 12 of thetape carrier 10. In general, the location where the adhesive tape is applied and the surroundings thereof no longer function as a mounting substrate. - With a[0092]
tape carrier 10 joined in this way, joins21 are formed. In the present embodiment, in order to make the joins21 easier to identify, joinmarks 23 are formed. The join marks23 can be formed, for example, by punching out identification marks22. In this case, the join marks23 also function as identification marks22. It should be noted that the join marks23 may be formed after thetape carrier 10 which has been cut has be joined, or may be formed first. For example, as shown in FIG. 5, after thedefective location 28 has been cut away from thetape carrier 10, before thetape carrier 10 is joined back together, joinmarks 23 may be formed. Alternatively, in the examination process, after a defective location has been found and before cutting, the position of the join may be determined and the join marks23 may be formed. - By attaching the join marks[0093]23 in this way, and detecting the join marks23 with for example an optoelectric sensor, and in subsequent processes the joins21 can be automatically and mechanically detected. In other words, a matrix, which cannot be used for mounting, can be recognized.
- The[0094]
tape carrier 10 which has been joined back together has thematrix 13 positioned at ajoin 21 similar to theother matrices 13, with a 4×5 array of thebonding portions 14. Further, the formation of one row of thebonding portions 14 between twoadjacent matrices 13 ensures that no irregular intervals are formed. That is to say, thetape carrier 10 is exactly the same as thetape carrier 10 shown in FIG. 1, except that the joins21 connected by adhesive tape or the like are formed, and the presence of these joins21 is shown byjoin marks 23 being formed. - It should be noted that the[0095]
tape carrier 10 may employ, in place of the above-described two-layer or three-layer tape, a double-sided interconnect tape, a built-up interconnect tape, a glass-epoxy tape, or any other means, provided that it is capable of being supplied from a reel. In other words, as long as the material of the tape has sufficient flexibility to be wound around a reel and is a material such that the interconnects can be formed, any material can be used. - Process After the Fabrication of a Tape Carrier[0096]
- Next, FIGS.[0097]7 to13 show steps in the process after the fabrication of a tape carrier in the method of manufacturing a semiconductor device to which the present invention is applied.
- First, on the[0098]
tape carrier 10 which has, as described above, been subject to examination, removal of defective locations28 (see FIG. 5), and rejoining, an anisotropic conductive film is provided. - FIG. 7 shows the step of providing the anisotropic conductive film on the tape carrier. The[0099]
tape carrier 10, as shown in FIG. 7, is wound around areel 24, to be taken up on anotherreel 24. That is to say, in the present embodiment, a reel-to-reel process is used. Then between the tworeels 24, an anisotropicconductive film 30 is adhered to thetape carrier 10. In this case, the anisotropicconductive film 30 is preferably provided in tape form, wound around areel 124. Then when the anisotropicconductive film 30 has been continuously applied to thetape carrier 10, thetape carrier 10 is temporarily wound up. - Here the anisotropic[0100]
conductive film 30 is an adhesive (binder) in which conductive particles (conductive filler) are dispersed, and may also include a dispersant additive. The anisotropicconductive film 30 may first be made into sheet form, then adhered to thetape carrier 10, or may be applied in liquid form. It should be noted that a thermosetting adhesive is commonly used as the adhesive of the anisotropicconductive film 30. The anisotropicconductive film 30 is provided at least on thebonding portions 14. The anisotropicconductive film 30 may be provided to avoid thebonding portions 14 constituting amatrix 13 for which presence of ajoin 21 is indicated by join marks23. - Next, as shown in FIG. 8A, on the anisotropic[0101]
conductive film 30, a plurality of the semiconductor chips32 are mounted. As described above, on thetape carrier 10,bonding portions 14 are formed in a plurality of rows and a plurality of columns to constitute amatrix 13, and on eachbonding portion 14 is mounted anindividual semiconductor chip 32. However, the semiconductor chips32 are not mounted onbonding portions 14 constituting amatrix 13 delimited by join marks23. - On the semiconductor chips[0102]32 are provided a plurality of
electrodes 34, and thesurface 36 on which theelectrodes 34 are provided is mounted on the anisotropicconductive film 30. Thebonding portions 14 are formed to correspond to the layout of theelectrodes 34, and theelectrodes 34 are positioned for mounting thesemiconductor chip 32. For this positioning, the positioning holes20 can be utilized. It should be noted that on thebonding portions 14, at positions corresponding to theelectrodes 34, lands are preferably formed with greater width than other portions. on the anisotropicconductive film 30, the semiconductor chips32 may be mounted one at a time, or a plurality of the semiconductor chips32 may be mounted simultaneously. For example, the number ofsemiconductor chips 32 corresponding to the plurality ofbonding portions 14 constituting thematrix 13 may be mounted simultaneously. - It should be noted that the semiconductor chips[0103]32 may be such as to have
electrodes 34 formed on two edges only, or may be formed to haveelectrodes 34 formed on four edges. Theelectrodes 34 commonly employ projections of gold or solder or the like provided on aluminum pads, but projections may be provided on thebonding portions 14, or thebonding portions 14 may be etched to form projections. - By means of the above process, between the[0104]
surface 36 of thesemiconductor chip 32 on which theelectrodes 34 are formed and the surface of the rectangular substrate on which thebonding portions 14 are formed is interposed with the anisotropicconductive film 30. Even when the semiconductor chips32 are mounted one at a time, it is preferable to proceed to the next step in the process after all of the semiconductor chips32 have been mounted. It is preferable to proceed to the next step in the process once the above steps are completed, and after thetape carrier 10 has been wound around thereel 24. - Next, as shown in FIG. 8B, a[0105]
jig 40 is pressed against the surface opposite to thesurface 36 of thesemiconductor chip 32 on which theelectrodes 34 are formed, and thesemiconductor chip 32 is pressed in the direction of thebonding portions 14. Thejig 40 has an internal heater, not shown in the drawings, and heats thesemiconductor chip 32. It should be noted that as shown in the drawing, a plurality of the semiconductor chips32 may be pressed in a single operation, or eachsemiconductor chip 32 may be pressed individually. - In this way, the[0106]
electrodes 34 of thesemiconductor chip 32 and thebonding portions 14 are electrically connected by the interposition of the conductive particles of the anisotropicconductive film 30. According to the present embodiment, at the same time that thebonding portions 14 andelectrodes 34 are electrically connected by the anisotropicconductive film 30, filling between thesemiconductor chip 32 andsubstrate 12 with a resin is simultaneously carried out. As a result, a semiconductor device can be fabricated by a method having superior reliability and manufacturability. - Since the[0107]
semiconductor chip 32 is heated by thejig 40, the adhesive of the anisotropicconductive film 30 is cured at least in thecontact region 36 of thesemiconductor chip 32 with the surface. This assumes, however, that a thermosetting adhesive is used. If the curing mechanism of the anisotropicconductive film 30 is different, a means for applying the appropriate form of energy is used to realize the anisotropic conductivity. - FIG. 9 shows the[0108]
tape carrier 10 on which the semiconductor chips32 are mounted. In this figure, as described above, nosemiconductor chips 32 are mounted on thebonding portions 14 constituting thematrix 13 where join marks23 indicate the position ofjoin 21. Betweenadjacent matrices 13, nosemiconductor chips 32 are mounted on one row of thebonding portions 14 in the width direction of thesubstrate 12. In this state, thetape carrier 10 is wound around thereel 24 and proceeds to the next step. - In this step, in locations where rejoining has taken place, for the purposes of step examination, semiconductor chips may be mounted, or with all of these locations as defective locations, semiconductor chips may not be mounted, or all defective semiconductor chips may be mounted. In any case, a means for detecting the join marks[0109]23 is first provided, and when the join marks23 are detected the procedure determines the action to be taken.
- Next, as shown in FIG. 10, external electrodes are formed on the[0110]
tape carrier 10.Solder balls 38 are used as the external electrodes. Thesolder balls 38 are mounted on throughholes 18 on the surface of thesubstrate 12 of thetape carrier 10 opposite to that of thebonding portions 14, and are electrically connected to an electrically conductingmaterial 19 formed on the internal surfaces of the through holes18. In this case, using the positioning holes20, the positioning of thesolder balls 38 can be carried out. It should be noted that on thetape carrier 10, lands connected to theelectrically conducting material 19 may be formed on the surface on which thesolder balls 38 are mounted. - In the present embodiment, for each[0111]
matrix 13 delimited by the identification marks22 shown in FIG. 9, thesolder balls 38 of the corresponding plurality of the semiconductor chips32 are mounted simultaneously. That is to say, all of thesolder balls 38 for the 4×5bonding portions 14 forming thematrix 13 are mounted simultaneously. By this means, the time required for mounting thesolder balls 38 is reduced, and the adaptability to quantity production can be improved. - Thus in the present[0112]
embodiment solder balls 38 are mounted for each of thematrices 13. But on thejoin 21 shown in FIG. 9,solder balls 38 cannot be mounted because of the presence of adhesive tape and the like. It is possible to consider mounting thesolder balls 38 so as to avoid only the vicinity of thejoin 21, but in this case, processing cannot be performed for each of thematrices 13. - Tn the present embodiment, for the[0113]
matrix 13 positioned at thejoin 21, a means for detecting the join marks23 is provided in the process, and solder balls are not mounted, not only on thebonding portions 14 positioned at thejoin 21, but also on the whole of thematrix 13 defined by thejoin mark 23. That is to say, for thematrix 13 delimited by the join marks23 shown in FIG. 9,solder balls 38 are not mounted. Then for thematrices 13 other than thematrix 13, in which thejoin 21 is positioned,solder balls 38 are mounted. By this means, the mounting ofsolder balls 38 on the adhesive tape and the like provided on thejoin 21 can be avoided. As a result, flowing of thesolder balls 38 onto other portions, causing short-circuiting of thebonding portions 14 can be prevented. - It should be noted that as external electrodes in place of the[0114]
solder balls 38, for example, cream solder may be provided by a printing method. - Thus, the[0115]
tape carrier 10 with thesolder balls 38 provided as external electrodes is wound around thereel 24 and advances to the next step. It should be noted that as necessary, after forming thesolder balls 38, cleaning, marking and curing are carried out. In these steps also, as necessary, the positioning holes20 can be used for carrying out positioning. - As a result of the above process, as shown in FIG. 11, on the[0116]
tape carrier 10 are mounted the semiconductor chips32 for each of thebonding portions 14. Theelectrodes 34 of thesemiconductor chip 32 and thebonding portions 14 are electrically connected by the anisotropicconductive film 30. On the opposite surface of thesubstrate 12 from thebonding portions 14, thesolder balls 38 are provided, electrically connected to thebonding portions 14 by theelectrically conducting material 19 on the inside surfaces of the through holes18. Therefore, each of the plurality of rows and plurality of columns of the semiconductor chips32, hassolder balls 38 electrically connected to theelectrodes 34. Therefore, in respect of eachsemiconductor chip 32, a semiconductor device is constituted. Therefore, when thetape carrier 10 is cut for eachindividual semiconductor chip 32, it forms a completed individual semiconductor device. When cutting out thetape carrier 10, the positioning holes20 can be used to carry out positioning. - FIG. 12 shows the step of cutting out the[0117]
tape carrier 10. In this figure, a fixedjig 44 such as a fixed blade is fixed to straddle around the periphery of eachsemiconductor chip 32 on thesubstrate 12. Then amovable jig 46 such as a movable blade is used to punch out the periphery of thesemiconductor chip 32. In this way,individual semiconductor devices 50 are obtained. - The[0118]
semiconductor devices 50 may as necessary be subjected to visual examination, electrical characteristic testing examination, burn-in, and so forth. - According to the present embodiment, since the[0119]
bonding portions 14 are electrically connected to theelectrodes 34 by the anisotropicconductive film 30, thesemiconductor devices 50 can be fabricated by a method having superior reliability and manufacturability. A plurality ofbonding portions 14 are sequentially formed in the width direction of thetape carrier 10, and asemiconductor chip 32 is connected for eachbonding portion 14. Therefore, since a plurality of the semiconductor chips32 is mounted in a matrix, the present embodiment is suitable for quantity production of thesemiconductor devices 50. - The[0120]
tape carrier 10 is provided wound around thereel 24, and application of the anisotropicconductive film 30, the mounting and pressing of the semiconductor chips32, the formation of theexternal electrodes 38, and the cutting out of individual devices is carried out reel-to-reel. It should be noted that instead of all of these steps being carried out reel-to-reel, at some point thetape carrier 10 may be cut into rectangular sheets. The timing of this cutting may be, for example, any of the following: after the anisotropicconductive film 30 is provided and before mounting the semiconductor chips32, after mounting the semiconductor chips32 and before pressing the semiconductor chips32, after pressing the semiconductor chips32 and before mounting thesolder balls 38, after mounting the solder balls39 and before cutting out individual devices. A row ofbonding portions 14 in the width direction formed betweenadjacent matrices 13 may be selected as a position for cutting into rectangular sheets. - According to the present embodiment, the fabrication process can be advanced for each[0121]
matrix 13 delimited by identification marks22. For example, for eachmatrix 13, a plurality ofsolder balls 38 can be formed simultaneously for the plurality ofsemiconductor chips 32. By forming thesolder balls 38 simultaneously for the plurality ofsemiconductor chips 32, the adaptability to quantity production is improved. By providing a means for detecting the join marks23, this process also can be carried out eliminating thematrix 13 delimited by the join marks23. Therefore, flowing of thesolder balls 38 by the adhesive tape and the like provided on thejoin 21 can be prevented. In this way, thesemiconductor devices 50 can be efficiently produced in quantity. - In FIG. 13 is shown a[0122]
circuit board 1000 on which is mounted asemiconductor device 1100 fabricated by the method of the above-described embodiment. An organic substrate such as a glass epoxy substrate is generally used for the circuit board. On thecircuit board 1000, a bonding portion of for example copper is formed to constitute a desired circuit. This bonding portion and external electrodes of thesemiconductor device 1100 are mechanically connected, to achieve the electrical conduction. - It should be noted that since the[0123]
semiconductor device 1100 can be made as small in surface area as to be mounted as a bare chip on the mounting surface, the electronic instrument can be made compact by using thecircuit board 1000 as the electronic instrument. Further, within the same area, more mounting space can be made available, and higher functionality can be achieved. - As an electronic instrument provided with this[0124]
circuit board 1000, FIG. 14 shows a notebookpersonal computer 1200. It should be noted that regardless of whether active components or passive components, the present invention can be applied to various surface-mounted electronic components. As electronic components, for example, may be cited resistors, capacitors, coils, oscillators, filters, temperature sensors, thermistors, varistors, variable resistors, and fuses.
Claims (20)
1. A method of manufacturing a tape carrier comprising:
an examination step in which a tape carrier having a bonding portion formed in a matrix form and at least one type of identification mark is examined;
a step of removing a portion which includes a defective location detected in said examination step, and then joining together remaining portions of said tape carrier after the removal; and
a step of forming a join mark delimiting a matrix in which a join formed in said joining step is positioned.
2. The method of manufacturing a tape carrier as defined inclaim 1 , wherein said join mark is formed by punching out said identification mark.
3. The method of manufacturing a tape carrier as defined inclaim 1 , wherein said identification mark is formed simultaneously with said bonding portion, said identification mark being formed of the same material and by the same method as said bonding portion.
4. The method of manufacturing a tape carrier as defined inclaim 1 , wherein said tape carrier has at least two types of said identification mark of different forms which are detected by different examination means.
5. A method of manufacturing a semiconductor device comprising:
an examination step in which a tape carrier having a plurality of bonding portions formed in a matrix form and at least two types of identification marks is examined;
a step of removing a portion which includes a defective location detected in said examination step, and then joining together remaining portions of said tape carrier after the removal;
a step of forming a join mark delimiting a matrix in which a join formed in said joining step is positioned; and
a step of electrically connecting each of said plurality of bonding portions to a corresponding of a plurality of semiconductor chips, excluding a region delimited by said join mark.
6. The method of manufacturing a semiconductor device as defined inclaim 5 , further comprising:
a step of excluding the region delimited by said join mark, and forming a plurality of external electrodes simultaneously for the plurality of semiconductor chips for each matrix.
7. The method of manufacturing a semiconductor device as defined inclaim 5 , wherein the forms of said at least two types of identification marks are different, and said identification marks are detected by different examination means.
8. A tape carrier having bonding portions formed in a matrix form on a substrate, wherein identification marks which delimit said bonding portions regularly in pluralities of rows and columns are formed.
9. The tape carrier as defined inclaim 8 , wherein:
a join is formed by connecting together remaining portions caused by cutting; and
a join mark is formed in a delimited portion including said join.
10. The tape carrier as defined inclaim 9 , wherein said join mark is formed by punching out any of said identification marks.
11. The tape carrier as defined inclaim 8 , having at least two types of said identification marks of different forms which are detected by different examination means.
12. The tape carrier as defined inclaim 9 , having at least two types of identification marks of different forms, said identification marks being detected by different examination means.
13. The tape carrier as defined inclaim 10 , having at least two types of identification marks of different forms, said identification marks being detected by different examination means.
14. A semiconductor device manufactured by the method as defined inclaim 5 .
15. A circuit board on which is mounted the semiconductor device as defined inclaim 14 .
16. An electronic instrument having the circuit board as defined inclaim 15 .
17. A tape carrier manufacturing device, comprising:
carrying means for carrying a tape carrier having a plurality of identification marks; and
a plurality of detection means for detecting said plurality of identification marks,
wherein said plurality of detection means are detection devices detecting said identification marks by different detection methods.
18. The tape carrier manufacturing device as defined inclaim 17 , wherein one of said plurality of detection means is a detection device for detecting by means of light.
19. The tape carrier manufacturing device as defined inclaim 17 , wherein one of said plurality of detection means is a detection device for detecting by means of image processing.
20. The tape carrier manufacturing device as defined inclaim 17 , wherein one of said plurality of detection means is a detection device for detecting by means of a pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/303,829US20030075795A1 (en) | 1998-07-31 | 2002-11-26 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23034298 | 1998-07-31 | ||
| JP10-230342 | 1998-07-31 | ||
| JP15827999AJP3536728B2 (en) | 1998-07-31 | 1999-06-04 | Semiconductor device, tape carrier, manufacturing method thereof, circuit board, electronic device, and tape carrier manufacturing apparatus |
| JP11-158279 | 1999-06-04 | ||
| US09/358,537US6200824B1 (en) | 1998-07-31 | 1999-07-22 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
| US09/768,165US6506980B2 (en) | 1998-07-31 | 2001-01-24 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
| US10/303,829US20030075795A1 (en) | 1998-07-31 | 2002-11-26 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/768,165DivisionUS6506980B2 (en) | 1998-07-31 | 2001-01-24 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20030075795A1true US20030075795A1 (en) | 2003-04-24 |
Family
ID=26485452
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/358,537Expired - LifetimeUS6200824B1 (en) | 1998-07-31 | 1999-07-22 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
| US09/768,165Expired - LifetimeUS6506980B2 (en) | 1998-07-31 | 2001-01-24 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
| US10/303,829AbandonedUS20030075795A1 (en) | 1998-07-31 | 2002-11-26 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/358,537Expired - LifetimeUS6200824B1 (en) | 1998-07-31 | 1999-07-22 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
| US09/768,165Expired - LifetimeUS6506980B2 (en) | 1998-07-31 | 2001-01-24 | Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6200824B1 (en) |
| JP (1) | JP3536728B2 (en) |
| KR (2) | KR100509299B1 (en) |
| CN (1) | CN1171299C (en) |
| TW (2) | TW452946B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7884634B2 (en) | 1999-05-27 | 2011-02-08 | Verigy (Singapore) Pte, Ltd | High density interconnect system having rapid fabrication cycle |
| US7403029B2 (en) | 1999-05-27 | 2008-07-22 | Nanonexus Corporation | Massively parallel interface for electronic circuit |
| US7772860B2 (en) | 1999-05-27 | 2010-08-10 | Nanonexus, Inc. | Massively parallel interface for electronic circuit |
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| US7247035B2 (en) | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
| US7621761B2 (en) | 2000-06-20 | 2009-11-24 | Nanonexus, Inc. | Systems for testing and packaging integrated circuits |
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| US8242615B2 (en)* | 2007-02-27 | 2012-08-14 | Oki Semiconductor Co., Ltd. | Semiconductor chip on film package with dummy patterns and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW452946B (en) | 2001-09-01 |
| KR20000012108A (en) | 2000-02-25 |
| JP3536728B2 (en) | 2004-06-14 |
| CN1244028A (en) | 2000-02-09 |
| US20010039076A1 (en) | 2001-11-08 |
| KR100555337B1 (en) | 2006-02-24 |
| US6200824B1 (en) | 2001-03-13 |
| KR20050024471A (en) | 2005-03-10 |
| US6506980B2 (en) | 2003-01-14 |
| TW535267B (en) | 2003-06-01 |
| KR100509299B1 (en) | 2005-08-18 |
| CN1171299C (en) | 2004-10-13 |
| JP2000106387A (en) | 2000-04-11 |
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| Date | Code | Title | Description |
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| STCB | Information on status: application discontinuation | Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |