| TABLE 1 | |||
| Raw material powder | |||
| composition | Average Particle | Oxygen | |
| Specimen | (atomic %) | Size (μm) | (ppm) |
| 1 | Co—20Cr—10Pt—11B | 45 | 36 |
| 2 | Co—20Cr—10Pt—15B | 42 | 34 |
| 3 | Co—20Cr—10Pt—20B | 40 | 32 |
| 4 | Co—20Cr—10Pt—25B | 38 | 30 |
| 5 | Co—20Cr—10Pt | 113 | 118 |
| 6 | Co—20Cr—10Pt—2Ta—11B | 40 | 39 |
| 7 | Co—20Cr—10Pt—2Ta—15B | 38 | 38 |
| 8 | Co—20Cr—10Pt—2Ta—20B | 37 | 37 |
| 9 | Co—20Cr—10Pt—2Ta—25B | 35 | 33 |
| 10 | Co—20Cr—10Pt—2Ta | 101 | 175 |
| TABLE 2 | |||
| Target composition | O* | ||
| Specimen | (atomic %) | (ppm) | Remarks |
| 1 | Co—20Cr—10Pt—11B | 38 | Invention Example |
| 2 | Co—20Cr—10Pt—15B | 37 | Invention Example |
| 3 | Co—20Cr—10Pt—20B | 35 | Invention Example |
| 4 | Co—20Cr—10Pt—25B | 33 | Invention Example |
| 5 | Co—20Cr—10Pt | 124 | Comparative |
| Example | |||
| 6 | Co—20Cr—10Pt—2Ta—11B | 42 | Invention Example |
| 7 | Co—20Cr—10Pt—2Ta—15B | 41 | Invention Example |
| 8 | Co—20Cr—10Pt—2Ta—20B | 40 | Invention Example |
| 9 | Co—20Cr—10Pt—2Ta—25B | 37 | Invention Example |
| 10 | Co—20Cr—10Pt—2Ta | 179 | Comparative |
| Example | |||
| TABLE 3 | |||
| Raw material powder | Av. Particle | Oxygen | |
| Specimen | composition (atomic %) | Size (μm) | (ppm) |
| 21 | Co—22.2Cr—22.2B | 35 | 30 |
| 22 | Co—22.2Cr—27.8B | 32 | 28 |
| 23 | Co—22.2Cr | 115 | 114 |
| 24 | Co—22.2Cr—2.2Ta—22.2B | 37 | 36 |
| 25 | Co—22.2Cr—2.2Ta—27.8B | 35 | 33 |
| 26 | Co—22.2Cr—2.2Ta | 97 | 171 |
| 27 | Pure Pt | 131 | 134 |
| TABLE 4 | |||
| Target composition | O* | ||
| Specimen | (atomic %) | (ppm) | Remarks |
| 21 | Co—20Cr—10Pt—20B | 52 | Invention Example |
| 22 | Co—20Cr—10Pt—25B | 49 | Invention Example |
| 23 | Co—20Cr—10Pt | 136 | Comparative |
| Example | |||
| 24 | Co—20Cr—10Pt—2Ta—20B | 56 | Invention Example |
| 25 | Co—20Cr—10Pt—2Ta—25B | 55 | Invention Example |
| 26 | Co—20Cr—10Pt—2Ta | 193 | Comparative |
| Example | |||
| TABLE 5 | |||
| Raw material powder | Av. Particle | Oxygen | |
| Specimen | composition (atomic %) | Size (μm) | (ppm) |
| 31 | Co—20Cr—10Pt—10Ni—15B | 45 | 42 |
| 32 | Co—20Cr—10Pt—10Ni | 96 | 125 |
| 33 | Co—20Cr—10Pt—5Ti—15B | 41 | 51 |
| 34 | Co—20Cr—10Pt—5Ti | 89 | 143 |
| 35 | Co—20Cr—10Pt—5Nb—15B | 41 | 59 |
| 36 | Co—20Cr—10Pt—5Nb | 90 | 155 |
| 37 | Co—20Cr—10Pt—5Mo—15B | 51 | 45 |
| 38 | Co—20Cr—10Pt—5Mo | 108 | 130 |
| 39 | Co—20Cr—10Pt—5Cu—15B | 56 | 42 |
| 40 | Co—20Cr—10Pt—5Cu | 114 | 130 |
| 50 | Co—20Cr—10Pt—5Ru—15B | 53 | 47 |
| 51 | Co—20Cr—10Pt—5Ru | 111 | 133 |
| 52 | Co—20Cr—10Pt—5Tb—15B | 39 | 78 |
| 53 | Co—20Cr—10Pt—5Tb | 77 | 192 |
| TABLE 6 | |||
| Target composition | O* | ||
| Specimen | (at %) | (ppm) | Remarks |
| 31 | Co—20Cr—10Pt—10Ni—15B | 50 | Invention Ex. |
| 32 | Co—20Cr—10Pt—10Ni | 135 | Comparative Ex. |
| 33 | Co—20Cr—10Pt—5Ti—15B | 58 | Invention Ex. |
| 34 | Co—20Cr—10Pt—5Ti | 149 | Comparative Ex. |
| 35 | Co—20Cr—10Pt—5Nb—15B | 63 | Invention Ex. |
| 36 | Co—20Cr—10Pt—5Nb | 156 | Comparative Ex. |
| 37 | Co—20Cr—10Pt—5Mo—15B | 51 | Invention Ex. |
| 38 | Co—20Cr—10Pt—5Mo | 137 | Comparative Ex. |
| 39 | Co—20Cr—10Pt—5Cu—15B | 48 | Invention Ex. |
| 40 | Co—20Cr—10Pt—5Cu | 136 | Comparative Ex. |
| 50 | Co—20Cr—10Pt—5Ru—15B | 52 | Invention Ex. |
| 51 | Co—20Cr—10Pt—5Ru | 137 | Comparative Ex. |
| 52 | Co—20Cr—10Pt—5Tb—15B | 87 | Invention Ex. |
| 53 | Co—20Cr—10Pt—5Tb | 201 | Comparative Ex. |
| TABLE 7 | ||
| Specimen | Process | Remarks |
| 41 | Co—20Cr—10Pt—15B (at %) | Invention Example |
| atomized powder → sintering | ||
| 42 | Co—22.2Cr—16.7B (at %) | Invention Example |
| atomized powder + Pt | ||
| powder → sintering | ||
| 43 | Co—22.2Cr—16.7B (at %) | Invention Example |
| atomized powder + Pt | ||
| powder → sintering → diffusion | ||
| treatment | ||
| 44 | Co—23.5Cr—11.8Pt (at %) | Comparative Example |
| atomized powder + B | ||
| powder → sintering | ||
| 45 | Melting and casting | Comparative Example |
| TABLE 8 | ||||
| Specimen | O* (ppm) | Remarks | ||
| 41 | 36 | Invention Example | ||
| 42 | 53 | Invention Example | ||
| 43 | 53 | Invention Example | ||
| 44 | 185 | Comparative Example | ||
| 45 | 25 | Comparative Example | ||
| TABLE 9 | ||
| Coercive force (Hc) | ||
| FMT | FMT | FMT | FMT | FMT | |
| Specimen | 1 hour | 2 hours | 3 hours | 4 hours | 5 hours |
| 41 | 100 | 100 | 100 | 101 | 100 |
| 42 | 101 | 99 | 102 | 100 | 99 |
| 43 | 100 | 100 | 99 | 99 | 100 |
| 44 | 88 | 95 | 90 | 98 | 90 |
| 45 | 101 | 100 | 104 | 99 | 103 |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-366639 | 2000-12-01 | ||
| JP2000366639 | 2000-12-01 |
| Publication Number | Publication Date |
|---|---|
| US20020106297A1true US20020106297A1 (en) | 2002-08-08 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/995,567AbandonedUS20020106297A1 (en) | 2000-12-01 | 2001-11-29 | Co-base target and method of producing the same |
| Country | Link |
|---|---|
| US (1) | US20020106297A1 (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6827826B2 (en) | 2000-08-07 | 2004-12-07 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
| US20050175287A1 (en)* | 2002-03-16 | 2005-08-11 | Tao Pan | Mode size converter for a planar waveguide |
| US20050249981A1 (en)* | 2004-05-10 | 2005-11-10 | Heraeus, Inc. | Grain structure for magnetic recording media |
| US20050277002A1 (en)* | 2004-06-15 | 2005-12-15 | Heraeus, Inc. | Enhanced sputter target alloy compositions |
| US20060042938A1 (en)* | 2004-09-01 | 2006-03-02 | Heraeus, Inc. | Sputter target material for improved magnetic layer |
| US20060234091A1 (en)* | 2005-04-19 | 2006-10-19 | Heraeus, Inc. | Enhanced multi-component oxide-containing sputter target alloy compositions |
| US20060286414A1 (en)* | 2005-06-15 | 2006-12-21 | Heraeus, Inc. | Enhanced oxide-containing sputter target alloy compositions |
| EP1746586A1 (en)* | 2005-07-19 | 2007-01-24 | Heraeus, Inc. | Enhanced sputter target alloy compositions |
| US20070017803A1 (en)* | 2005-07-22 | 2007-01-25 | Heraeus, Inc. | Enhanced sputter target manufacturing method |
| US7205662B2 (en) | 2003-02-27 | 2007-04-17 | Symmorphix, Inc. | Dielectric barrier layer films |
| US7238628B2 (en) | 2003-05-23 | 2007-07-03 | Symmorphix, Inc. | Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides |
| US20070253103A1 (en)* | 2006-04-27 | 2007-11-01 | Heraeus, Inc. | Soft magnetic underlayer in magnetic media and soft magnetic alloy based sputter target |
| WO2008050644A1 (en)* | 2006-10-19 | 2008-05-02 | Asahi Glass Company, Limited | Sputtering target used for production of reflective mask blank for euv lithography |
| US7378356B2 (en) | 2002-03-16 | 2008-05-27 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US7404877B2 (en) | 2001-11-09 | 2008-07-29 | Springworks, Llc | Low temperature zirconia based thermal barrier layer by PVD |
| US20080202916A1 (en)* | 2007-02-22 | 2008-08-28 | Heraeus Incorporated | Controlling magnetic leakage flux in sputtering targets containing magnetic and non-magnetic elements |
| US7469558B2 (en) | 2001-07-10 | 2008-12-30 | Springworks, Llc | As-deposited planar optical waveguides with low scattering loss and methods for their manufacture |
| US20090064861A1 (en)* | 2004-11-15 | 2009-03-12 | Nippon Mining & Metals Co., Ltd. | Hydrogen Separation Membrane, Sputtering Target for forming said Hydrogen Separation Membrane, and Manufacturing Method Thereof |
| US20090139858A1 (en)* | 2004-11-15 | 2009-06-04 | Nippon Mining & Metals Co., Ltd. | Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof |
| US7826702B2 (en) | 2002-08-27 | 2010-11-02 | Springworks, Llc | Optically coupling into highly uniform waveguides |
| US7838133B2 (en) | 2005-09-02 | 2010-11-23 | Springworks, Llc | Deposition of perovskite and other compound ceramic films for dielectric applications |
| US7959769B2 (en) | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
| US7993773B2 (en) | 2002-08-09 | 2011-08-09 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US8021778B2 (en) | 2002-08-09 | 2011-09-20 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US8062708B2 (en) | 2006-09-29 | 2011-11-22 | Infinite Power Solutions, Inc. | Masking of and material constraint for depositing battery layers on flexible substrates |
| US8197781B2 (en) | 2006-11-07 | 2012-06-12 | Infinite Power Solutions, Inc. | Sputtering target of Li3PO4 and method for producing same |
| US8236443B2 (en) | 2002-08-09 | 2012-08-07 | Infinite Power Solutions, Inc. | Metal film encapsulation |
| CN102652184A (en)* | 2009-12-11 | 2012-08-29 | 吉坤日矿日石金属株式会社 | Magnetic material sputtering target |
| US8260203B2 (en) | 2008-09-12 | 2012-09-04 | Infinite Power Solutions, Inc. | Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof |
| US8268488B2 (en) | 2007-12-21 | 2012-09-18 | Infinite Power Solutions, Inc. | Thin film electrolyte for thin film batteries |
| US8350519B2 (en) | 2008-04-02 | 2013-01-08 | Infinite Power Solutions, Inc | Passive over/under voltage control and protection for energy storage devices associated with energy harvesting |
| US8394522B2 (en) | 2002-08-09 | 2013-03-12 | Infinite Power Solutions, Inc. | Robust metal film encapsulation |
| US8404376B2 (en) | 2002-08-09 | 2013-03-26 | Infinite Power Solutions, Inc. | Metal film encapsulation |
| US8431264B2 (en) | 2002-08-09 | 2013-04-30 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
| US8445130B2 (en) | 2002-08-09 | 2013-05-21 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
| US8508193B2 (en) | 2008-10-08 | 2013-08-13 | Infinite Power Solutions, Inc. | Environmentally-powered wireless sensor module |
| US8518581B2 (en) | 2008-01-11 | 2013-08-27 | Inifinite Power Solutions, Inc. | Thin film encapsulation for thin film batteries and other devices |
| US8599572B2 (en) | 2009-09-01 | 2013-12-03 | Infinite Power Solutions, Inc. | Printed circuit board with integrated thin film battery |
| US8636876B2 (en) | 2004-12-08 | 2014-01-28 | R. Ernest Demaray | Deposition of LiCoO2 |
| KR101384111B1 (en) | 2009-01-09 | 2014-04-10 | 주식회사 에스앤에스텍 | A Blank Mask, A Photomask using the Same and Method of Fabricating the Same |
| US8728285B2 (en) | 2003-05-23 | 2014-05-20 | Demaray, Llc | Transparent conductive oxides |
| US8906523B2 (en) | 2008-08-11 | 2014-12-09 | Infinite Power Solutions, Inc. | Energy device with integral collector surface for electromagnetic energy harvesting and method thereof |
| CN104263999A (en)* | 2014-10-11 | 2015-01-07 | 上海大学兴化特种不锈钢研究院 | Novel high-plasticity medical cobalt-based alloy |
| US8932444B2 (en) | 2008-03-28 | 2015-01-13 | Jx Nippon Mining & Metals Corporation | Sputtering target of nonmagnetic-particle-dispersed ferromagnetic material |
| US9103023B2 (en) | 2009-03-27 | 2015-08-11 | Jx Nippon Mining & Metals Corporation | Nonmagnetic material particle-dispersed ferromagnetic material sputtering target |
| US9334557B2 (en) | 2007-12-21 | 2016-05-10 | Sapurast Research Llc | Method for sputter targets for electrolyte films |
| US9634296B2 (en) | 2002-08-09 | 2017-04-25 | Sapurast Research Llc | Thin film battery on an integrated circuit or circuit board and method thereof |
| US20180019389A1 (en)* | 2015-03-04 | 2018-01-18 | Jx Nippon Mining & Metals Corporation | Magnetic material sputtering target and method for producing same |
| RU2647955C1 (en)* | 2017-07-11 | 2018-03-21 | Юлия Алексеевна Щепочкина | Sintered cobalt-based antifriction material |
| US10680277B2 (en) | 2010-06-07 | 2020-06-09 | Sapurast Research Llc | Rechargeable, high-density electrochemical device |
| CN111621753A (en)* | 2020-07-29 | 2020-09-04 | 江苏集萃先进金属材料研究所有限公司 | Target blank and manufacturing method thereof |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5468305A (en)* | 1993-10-25 | 1995-11-21 | Kabushiki Kaisha Kobe Seiko Sho | Method of lowering permeability of difficult-to-work Co alloy |
| US6406600B1 (en)* | 1999-03-29 | 2002-06-18 | Hitachi Metals, Ltd. | CoPt-base sputtering target, method of making same, magnetic recording film and Co-Pt-base magnetic recording medium |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5468305A (en)* | 1993-10-25 | 1995-11-21 | Kabushiki Kaisha Kobe Seiko Sho | Method of lowering permeability of difficult-to-work Co alloy |
| US6406600B1 (en)* | 1999-03-29 | 2002-06-18 | Hitachi Metals, Ltd. | CoPt-base sputtering target, method of making same, magnetic recording film and Co-Pt-base magnetic recording medium |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6827826B2 (en) | 2000-08-07 | 2004-12-07 | Symmorphix, Inc. | Planar optical devices and methods for their manufacture |
| US7469558B2 (en) | 2001-07-10 | 2008-12-30 | Springworks, Llc | As-deposited planar optical waveguides with low scattering loss and methods for their manufacture |
| US7404877B2 (en) | 2001-11-09 | 2008-07-29 | Springworks, Llc | Low temperature zirconia based thermal barrier layer by PVD |
| US7378356B2 (en) | 2002-03-16 | 2008-05-27 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US20050175287A1 (en)* | 2002-03-16 | 2005-08-11 | Tao Pan | Mode size converter for a planar waveguide |
| US8045832B2 (en) | 2002-03-16 | 2011-10-25 | Springworks, Llc | Mode size converter for a planar waveguide |
| US8105466B2 (en) | 2002-03-16 | 2012-01-31 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US7413998B2 (en) | 2002-03-16 | 2008-08-19 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US7544276B2 (en) | 2002-03-16 | 2009-06-09 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US7381657B2 (en) | 2002-03-16 | 2008-06-03 | Springworks, Llc | Biased pulse DC reactive sputtering of oxide films |
| US9634296B2 (en) | 2002-08-09 | 2017-04-25 | Sapurast Research Llc | Thin film battery on an integrated circuit or circuit board and method thereof |
| US9793523B2 (en) | 2002-08-09 | 2017-10-17 | Sapurast Research Llc | Electrochemical apparatus with barrier layer protected substrate |
| US7993773B2 (en) | 2002-08-09 | 2011-08-09 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US8445130B2 (en) | 2002-08-09 | 2013-05-21 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
| US8431264B2 (en) | 2002-08-09 | 2013-04-30 | Infinite Power Solutions, Inc. | Hybrid thin-film battery |
| US8404376B2 (en) | 2002-08-09 | 2013-03-26 | Infinite Power Solutions, Inc. | Metal film encapsulation |
| US8394522B2 (en) | 2002-08-09 | 2013-03-12 | Infinite Power Solutions, Inc. | Robust metal film encapsulation |
| US8236443B2 (en) | 2002-08-09 | 2012-08-07 | Infinite Power Solutions, Inc. | Metal film encapsulation |
| US8535396B2 (en) | 2002-08-09 | 2013-09-17 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US8021778B2 (en) | 2002-08-09 | 2011-09-20 | Infinite Power Solutions, Inc. | Electrochemical apparatus with barrier layer protected substrate |
| US7826702B2 (en) | 2002-08-27 | 2010-11-02 | Springworks, Llc | Optically coupling into highly uniform waveguides |
| US7205662B2 (en) | 2003-02-27 | 2007-04-17 | Symmorphix, Inc. | Dielectric barrier layer films |
| US7262131B2 (en) | 2003-02-27 | 2007-08-28 | Symmorphix, Inc. | Dielectric barrier layer films |
| US8728285B2 (en) | 2003-05-23 | 2014-05-20 | Demaray, Llc | Transparent conductive oxides |
| US7238628B2 (en) | 2003-05-23 | 2007-07-03 | Symmorphix, Inc. | Energy conversion and storage films and devices by physical vapor deposition of titanium and titanium oxides and sub-oxides |
| US20050249981A1 (en)* | 2004-05-10 | 2005-11-10 | Heraeus, Inc. | Grain structure for magnetic recording media |
| EP1607940A3 (en)* | 2004-06-15 | 2006-02-15 | Heraeus, Inc. | Enhanced sputter target alloy compositions |
| US20050277002A1 (en)* | 2004-06-15 | 2005-12-15 | Heraeus, Inc. | Enhanced sputter target alloy compositions |
| US20060042938A1 (en)* | 2004-09-01 | 2006-03-02 | Heraeus, Inc. | Sputter target material for improved magnetic layer |
| US8663439B2 (en) | 2004-11-15 | 2014-03-04 | Jx Nippon Mining & Metals Corporation | Sputtering target for producing metallic glass membrane and manufacturing method thereof |
| US20090064861A1 (en)* | 2004-11-15 | 2009-03-12 | Nippon Mining & Metals Co., Ltd. | Hydrogen Separation Membrane, Sputtering Target for forming said Hydrogen Separation Membrane, and Manufacturing Method Thereof |
| US20090139858A1 (en)* | 2004-11-15 | 2009-06-04 | Nippon Mining & Metals Co., Ltd. | Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof |
| US8652399B2 (en) | 2004-11-15 | 2014-02-18 | Jx Nippon Mining & Metals Corporation | Sputtering target for producing metallic glass membrane and manufacturing method thereof |
| US7789948B2 (en) | 2004-11-15 | 2010-09-07 | Nippon Mining & Metals Co., Ltd | Hydrogen separation membrane, sputtering target for forming said hydrogen separation membrane, and manufacturing method thereof |
| US20100320085A1 (en)* | 2004-11-15 | 2010-12-23 | Nippon Mining & Metals Co., Ltd. | Sputtering Target for Producing Metallic Glass Membrane and Manufacturing Method Thereof |
| US7959769B2 (en) | 2004-12-08 | 2011-06-14 | Infinite Power Solutions, Inc. | Deposition of LiCoO2 |
| US8636876B2 (en) | 2004-12-08 | 2014-01-28 | R. Ernest Demaray | Deposition of LiCoO2 |
| US20060234091A1 (en)* | 2005-04-19 | 2006-10-19 | Heraeus, Inc. | Enhanced multi-component oxide-containing sputter target alloy compositions |
| US20060286414A1 (en)* | 2005-06-15 | 2006-12-21 | Heraeus, Inc. | Enhanced oxide-containing sputter target alloy compositions |
| KR100830619B1 (en) | 2005-07-19 | 2008-05-22 | 헤래우스 인코포레이티드 | Enhanced sputter target alloy compositions |
| EP1746586A1 (en)* | 2005-07-19 | 2007-01-24 | Heraeus, Inc. | Enhanced sputter target alloy compositions |
| US20070017803A1 (en)* | 2005-07-22 | 2007-01-25 | Heraeus, Inc. | Enhanced sputter target manufacturing method |
| EP1746173A3 (en)* | 2005-07-22 | 2007-05-09 | Heraeus, Inc. | Enhanced sputter target manufacturing method |
| US20080050263A1 (en)* | 2005-07-22 | 2008-02-28 | Heraeus, Inc. | Enhanced sputter target manufacturing method |
| US20070269330A1 (en)* | 2005-07-22 | 2007-11-22 | Heraeus, Inc. | Enhanced sputter target manufacturing method |
| US7838133B2 (en) | 2005-09-02 | 2010-11-23 | Springworks, Llc | Deposition of perovskite and other compound ceramic films for dielectric applications |
| US20070253103A1 (en)* | 2006-04-27 | 2007-11-01 | Heraeus, Inc. | Soft magnetic underlayer in magnetic media and soft magnetic alloy based sputter target |
| US8062708B2 (en) | 2006-09-29 | 2011-11-22 | Infinite Power Solutions, Inc. | Masking of and material constraint for depositing battery layers on flexible substrates |
| US7855036B2 (en) | 2006-10-19 | 2010-12-21 | Asahi Glass Company, Limited | Sputtering target used for production of reflective mask blank for EUV lithography |
| US20090130574A1 (en)* | 2006-10-19 | 2009-05-21 | Asahi Glass Company, Limited | Sputtering target used for production of reflective mask blank for euv lithography |
| KR101317981B1 (en) | 2006-10-19 | 2013-10-14 | 아사히 가라스 가부시키가이샤 | Sputtering target used for production of reflective mask blank for euv lithography |
| WO2008050644A1 (en)* | 2006-10-19 | 2008-05-02 | Asahi Glass Company, Limited | Sputtering target used for production of reflective mask blank for euv lithography |
| US8197781B2 (en) | 2006-11-07 | 2012-06-12 | Infinite Power Solutions, Inc. | Sputtering target of Li3PO4 and method for producing same |
| SG145613A1 (en)* | 2007-02-22 | 2008-09-29 | Heraeus Inc | Controlling magnetic leakage flux in sputtering targets containing magnetic and non-magnetic elements |
| US20080202916A1 (en)* | 2007-02-22 | 2008-08-28 | Heraeus Incorporated | Controlling magnetic leakage flux in sputtering targets containing magnetic and non-magnetic elements |
| US9334557B2 (en) | 2007-12-21 | 2016-05-10 | Sapurast Research Llc | Method for sputter targets for electrolyte films |
| US8268488B2 (en) | 2007-12-21 | 2012-09-18 | Infinite Power Solutions, Inc. | Thin film electrolyte for thin film batteries |
| US9786873B2 (en) | 2008-01-11 | 2017-10-10 | Sapurast Research Llc | Thin film encapsulation for thin film batteries and other devices |
| US8518581B2 (en) | 2008-01-11 | 2013-08-27 | Inifinite Power Solutions, Inc. | Thin film encapsulation for thin film batteries and other devices |
| US8936707B2 (en) | 2008-03-28 | 2015-01-20 | Jx Nippon Mining & Metals Corporation | Sputtering target of nonmagnetic-particle-dispersed ferromagnetic material |
| US8932444B2 (en) | 2008-03-28 | 2015-01-13 | Jx Nippon Mining & Metals Corporation | Sputtering target of nonmagnetic-particle-dispersed ferromagnetic material |
| US8350519B2 (en) | 2008-04-02 | 2013-01-08 | Infinite Power Solutions, Inc | Passive over/under voltage control and protection for energy storage devices associated with energy harvesting |
| US8906523B2 (en) | 2008-08-11 | 2014-12-09 | Infinite Power Solutions, Inc. | Energy device with integral collector surface for electromagnetic energy harvesting and method thereof |
| US8260203B2 (en) | 2008-09-12 | 2012-09-04 | Infinite Power Solutions, Inc. | Energy device with integral conductive surface for data communication via electromagnetic energy and method thereof |
| US8508193B2 (en) | 2008-10-08 | 2013-08-13 | Infinite Power Solutions, Inc. | Environmentally-powered wireless sensor module |
| KR101384111B1 (en) | 2009-01-09 | 2014-04-10 | 주식회사 에스앤에스텍 | A Blank Mask, A Photomask using the Same and Method of Fabricating the Same |
| US9103023B2 (en) | 2009-03-27 | 2015-08-11 | Jx Nippon Mining & Metals Corporation | Nonmagnetic material particle-dispersed ferromagnetic material sputtering target |
| US9532453B2 (en) | 2009-09-01 | 2016-12-27 | Sapurast Research Llc | Printed circuit board with integrated thin film battery |
| US8599572B2 (en) | 2009-09-01 | 2013-12-03 | Infinite Power Solutions, Inc. | Printed circuit board with integrated thin film battery |
| EP2511397A4 (en)* | 2009-12-11 | 2014-01-01 | Jx Nippon Mining & Metals Corp | TARGET FOR CATHODIC SPUTTERING OF MAGNETIC MATERIAL |
| US20120241316A1 (en)* | 2009-12-11 | 2012-09-27 | Jx Nippon Mining & Metals Corporation | Sputtering target of magnetic material |
| US9269389B2 (en)* | 2009-12-11 | 2016-02-23 | Jx Nippon Mining & Metals Corporation | Sputtering target of magnetic material |
| TWI480385B (en)* | 2009-12-11 | 2015-04-11 | Jx Nippon Mining & Metals Corp | Magnetic sputtering target |
| CN102652184A (en)* | 2009-12-11 | 2012-08-29 | 吉坤日矿日石金属株式会社 | Magnetic material sputtering target |
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| CN104263999A (en)* | 2014-10-11 | 2015-01-07 | 上海大学兴化特种不锈钢研究院 | Novel high-plasticity medical cobalt-based alloy |
| US20180019389A1 (en)* | 2015-03-04 | 2018-01-18 | Jx Nippon Mining & Metals Corporation | Magnetic material sputtering target and method for producing same |
| US10644230B2 (en)* | 2015-03-04 | 2020-05-05 | Jx Nippon Mining & Metals Corporation | Magnetic material sputtering target and method for producing same |
| EP3211116B1 (en)* | 2015-03-04 | 2020-10-21 | JX Nippon Mining & Metals Corporation | Magnetic-material sputtering target and method for producing same |
| RU2647955C1 (en)* | 2017-07-11 | 2018-03-21 | Юлия Алексеевна Щепочкина | Sintered cobalt-based antifriction material |
| CN111621753A (en)* | 2020-07-29 | 2020-09-04 | 江苏集萃先进金属材料研究所有限公司 | Target blank and manufacturing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment | Owner name:HITACHI METALS LTD., JAPAN Free format text:ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:UENO, TOMONORI;MURATA, HIDEO;TANIGUCHI, SHIGERU;AND OTHERS;REEL/FRAME:012337/0162 Effective date:20011019 | |
| STCB | Information on status: application discontinuation | Free format text:ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |