US20020104369A1 - Electronic pressure sensitive transducer apparatus and method for manufacturing same - Google Patents
Electronic pressure sensitive transducer apparatus and method for manufacturing sameDownload PDFInfo
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- US20020104369A1 US20020104369A1US10/067,952US6795202AUS2002104369A1US 20020104369 A1US20020104369 A1US 20020104369A1US 6795202 AUS6795202 AUS 6795202AUS 2002104369 A1US2002104369 A1US 2002104369A1
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- circuit board
- printed circuit
- traces
- pressure sensitive
- contact area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
- H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2201/00—Contacts
- H01H2201/022—Material
- H01H2201/032—Conductive polymer; Rubber
- H01H2201/036—Variable resistance
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2203/00—Form of contacts
- H01H2203/02—Interspersed fingers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2239/00—Miscellaneous
- H01H2239/01—Miscellaneous combined with other elements on the same substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
- H05K3/249—Finish coating of conductors by using conductive pastes, inks or powders comprising carbon particles as main constituent
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49007—Indicating transducer
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Definitions
- the Present inventionrelates to transducer systems for sensing pressure.
- Pressure sensitive transducersgenerate a signal indicative of the amount of pressure applied to a flexible membrane. Such transducers may also generate a signal based on the location of pressure applied to the flexible membrane. Such pressure sensitive transducers provide inputs for a wide variety of applications such as remote controls, game controllers, mouse pads, tactile sensors, and the like. Pressure sensitive transducers are typically coupled with electronics that condition and amplify pressure signals.
- FSRsforce sensing resisters
- Various FSRshave been disclosed, such as those described in commonly assigned U.S. Pat. Nos. 4,314,227; 4,314,228; and 4,489,302; each of which is hereby incorporated by reference in its entirety.
- an FSRis composed of three parts, a rigid base, a spacer, and a resistive membrane.
- Conductive tracesare typically arranged in separated interdigitated sets on the base. These traces may be configured in a single zone or in multiple zones to allow, for example, pointing devices as described in commonly assigned U.S. Pat. Nos.
- the flexible resistive membraneis spaced apart from the base layer by a spacer, which is typically a ring of material around the outer edge of the conductive traces.
- the spaceris also typically coated with adhesive to hold the device together.
- the flexible top membranemay be made of a polymer coated on its inner face with semi-conductive or resistive ink, giving the FSR force sensing properties. This ink is described in commonly owned U.S. Pat. Nos. 5,296,837 and 5,302,936, each of which is hereby incorporated by reference in its entirety.
- the FSRmust be connected to sensing and conditioning electronics in order to effectively operate.
- One way this may be accomplishedis by connecting the FSR to a printed circuit board containing the electronics with a multi-conductor cable.
- Another way of connecting the FSR to support electronicsis to adhere the FSR base directly to the circuit board containing the electronics. Electrical connection may be made between traces on the FSR and corresponding traces on the printed circuit board using z-tape, which only conducts in a direction perpendicular to the tape surface. While either method is effective, both have unnecessary manufacturing steps and require unnecessary components, thus increasing the cost of a pressure sensitive transducer system as well as increasing the likelihood of system failure. What is needed is a pressure sensitive transducer and a method for making such a transducer that requires fewer components and fewer manufacturing steps without sacrificing transducer performance.
- the present inventiondecreases the cost and complexity of an electronic pressure sensitive transducer by constructing such a transducer directly on a printed circuit board containing support electronics.
- An electronic pressure sensitive transducer producing an electrical signal indicative of applied pressureincludes a printed circuit board accepting a plurality of electronic elements for processing the transducer electrical signal. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer substantially surrounds the contact area. The adhesive spacer attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. The resistive layer contacts at least two of the traces in response to pressure applied to the flexible substrate to produce the electrical signal indicative of applied pressure.
- At least one resistive layeris made with resistive ink.
- a pedestalis formed on the printed circuit board substantially around the contact area.
- the pedestalreceives the adhesive spacer for attaching the flexible substrate.
- the pedestalincreases the space between resistive layers on the substrate and conductive traces on the printed circuit board.
- the pedestalmay be formed by coating traces on the printed circuit board with a non-conductive material such as soldermask.
- the conductive tracesinclude a plurality of sets of traces. Each set of traces is interconnected within a zone of the contact area. An interconnected set of contact traces extends into each zone. At least one of the interconnected set of traces may be connected to the electronic elements for processing the transducer signal via a through-hole in the printed circuit board. The through-hole may be within the contact area.
- conductive tracesare arranged in sets of interconnected traces. At least two sets of traces are interdigitated.
- conductive tracescomprise copper traces covered with an oxidation preventing conductive material.
- conductive tracescomprise screen printed carbon ink.
- a method of forming an electronic pressure sensitive transducer on a printed circuit boardis also provided.
- the printed circuit boardaccepts electronic components for producing signals generated by the pressure sensitive transducer.
- a plurality of conductive tracesare formed on the printed circuit board to form a contact area.
- At least one resistive layeris deposited on an inner side of a flexible substrate.
- the flexible substrateis assembled on the printed circuit board such that the flexible substrate resistive layer is facing the printed circuit board conductive traces.
- the flexible substrateis held to the printed circuit board by an adhesive substantially surrounding at least a portion of the contact area.
- a transducer systemis also provided.
- the systemincludes a printed circuit board having a plurality of conductive traces. At least two of these traces define contact areas.
- the printed circuit boardis constructed to accept electronic elements for processing electrical signals produced by a plurality of transducers. Each of these signals is indicative of pressure applied to at least one of the transducers.
- the systemalso includes at least one flexible substrate having an inner surface facing each contact area. At least one adhesive spacer substantially surrounds each contact layer to attach at least one flexible substrate to the printed circuit board. At least one resistive layer is deposited on a flexible substrate inner surface. Each resistive layer contacts at least two of the traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
- the contact areas, at least one flexible substrate, at least one adhesive spacer and at least one resistive layerform the plurality of transducers, each transducer constructed on the printed circuit board.
- a method of forming an electronic pressure sensitive transducer on a printed circuit board supporting electronic elementsis also provided.
- a portion of conductive material on a printed circuit boardis selectively removed to define traces in a contact area, traces connecting the electronic elements to the contact area, and at least a portion of a pedestal.
- FIG. 1is an exploded cross-sectional view illustrating a conceptualized pressure sensitive transducer according to an embodiment of the present invention
- FIG. 2is a top view of a printed circuit board illustrating a four-zone contact area according to an embodiment of the present invention
- FIG. 3is a top view of a printed circuit board illustrating carbon traces according to an embodiment of the present invention
- FIG. 4is a top view of a pressure sensitive transducer constructed using the printed circuit board of FIG. 2 or 3 according to an embodiment of the present invention
- FIG. 5is an exploded view illustrating conceptualized multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention.
- FIG. 6is a top view of a printed circuit board implementing multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention.
- FIG. 1an exploded cross-sectional view illustrating a conceptualized pressure sensitive transducer according to an embodiment of the present invention is shown.
- An electronic pressure sensitive transducershown generally by 20 , produces an electrical signal indicative of applied pressure.
- Pressure transducer 20includes printed circuit board 22 accepting a plurality of electronic elements, not shown for clarity, for processing the transducer electrical signal.
- Conductive traces 24are formed on printed circuit board 22 to define contact area 26 .
- Flexible substrate 28has inner surface 30 which faces contact area 26 when pressure transducer 20 is assembled.
- At least one resistive layer 32is deposited on inner surface 30 .
- Adhesive spacer 34substantially surrounds contact area 26 .
- Adhesive spacer 34attaches flexible substrate 28 to printed circuit board 22 . When assembled, resistive layer 32 contacts at least two traces 24 in response to pressure applied to flexible substrate 28 to produce electrical signals indicative of applied pressure.
- Flexible substrate 28 with resistive layer 32 together with traces 24 on printed circuit board 22implement a force sensing resistor (FSR), shown generally by 36 .
- FSR 36force sensing resistor
- Integrating FSR 36 directly onto printed circuit board 22creates a pressure sensor transducer which may be referred to as “sensor on board” (SOB).
- SOBsensor on board
- any printed circuit board 22can be adapted to receive FSR 36 according to the present invention, providing that sufficient surface space is available for FSR 36 .
- Conductive traces 24 on printed circuit board 22may be formed by any suitable means known in the art.
- traces 24may be formed by depositing conductive material on printed circuit board 22 then selectively removing a portion of the conductive material to define traces 24 .
- Dimensions for conductive traces 24depend on the dimensions of FSR 36 , material and construction for flexible substrate 28 , material and construction for resistive layers 32 , and the like. Typical line thicknesses for conductive traces 24 range between 0.010 inches (0.25 mm) and 0.060 inches (1.5 mm).
- Typical line spacing between conductive traces 24ranges between 0.010 inches (0.25 mm) and 0.060 inches (1.5 mm). Positional tolerance of FSR 36 on printed circuit board 22 varies as well, with ⁇ 0.015 inches ( ⁇ 0.4 mm) typical.
- Two sets of interconnected traces 24may be used to form a single zone within contact area 26 . Multiple zones within contact area 26 permit location of pressure on flexible substrate 28 to be determined. Multiple zones may be obtained by using a plurality of sets of interconnected traces 24 and one interconnected set of common traces 24 extending into each zone. Alternatively, each zone may be defined by two or more separate sets of traces 24 . Preferably, the sets of traces 24 in each zone are interdigitated.
- Flexible substrate 28may be constructed from any suitably flexible material such as, for example, Mylar.
- the thickness of substrate 28varies depending on the application and dimensions of FSR 36 .
- Preparing substrate 28 for resistive layers 32entails cutting material for substrate 28 into sheets or other shapes suitable for printing or other methods of depositing resistive layers 32 .
- One or more resistive layers 32are deposited on substrate 28 by conventional means such as, for example, by screen printing resistive ink onto substrate 28 . Resistive layers 32 may be printed over the entire substrate 28 or only over that portion which will cover operative traces 24 on printed circuit board 22 . Resistive layers 32 may also be deposited such that several distinct regions are formed over that portion of substrate 28 which will cover operative traces 24 on printed circuit board 22 .
- Adhesive 34is used to attach flexible substrate 28 to printed circuit board 22 .
- Adhesive 34also provides spacing between resistive layers 32 on substrate 28 and traces 24 on printed circuit board 22 .
- Adhesive 34may be applied to printed circuit board 22 , to flexible substrate 28 , or to both as suits manufacturability of FSR 36 .
- Adhesive 34may be applied to either surface in a conventional manner such as, for example, by depositing a bead of adhesive 34 around some or all of the perimeter of contact area 26 .
- adhesive layer 34comprises an adhesive ink screen printed onto substrate 28 .
- Adhesive inks that may be usedinclude product numbers SP-7533 from 3M or ML25184 from Acheson Industries, Inc. of Port Huron, Mich.
- a protective release linermay be cut or positioned over adhesive 34 to prevent inadvertent adhesion to other surfaces or airborne materials.
- Substrate 28may be formed into strips and kiss cut, or partially cut, into the desired final shape. Individual substrates 28 may then be easily separated by hand or machine immediately prior to assembly onto printed circuit board 22 . Preferably, this final assembly step occurs after electronic components have been mounted on printed circuit board 22 to prevent heat damage to substrate 28 from soldering operations.
- a pedestalshown generally by 38 , may be formed on printed circuit board 22 in regions where substrate 28 is adhered to printed circuit board 22 .
- Pedestal 38increases the distance that substrate 28 must be depressed prior to contact between resistive layer 22 and traces 24 on printed circuit board 22 .
- Pedestal 38may be formed in a variety of manners. First, printed circuit board 22 may be manufactured with additional thickness to form pedestal 38 . Second, one or more layers of conductive traces 40 may be built on printed circuit board 22 to form pedestal 38 . Pedestal 38 is then covered with a non-conducting material 42 , such as soldermask, to prevent inadvertent short circuits between traces 40 and resistive layer 32 .
- a non-conducting material 42such as soldermask
- pedestal 38a polymer thick film may be deposited on printed circuit board 22 to form pedestal 38 .
- a sheet of materialmay be adhered to printed circuit board 22 to form pedestal 38 .
- pedestal 38many constructions for pedestal 38 are possible.
- Printed circuit board 22includes traces 24 within contact area 26 forming four zones, each shown generally by 50 .
- Each zone 50includes one set of traces 24 interconnected by line 52 which extends out of contact area 26 to through-hole 54 .
- Through-hole 54permits traces 24 to be connected to electronics mounted on the bottom side of circuit board 22 by soldering processes known in the art.
- Traces 52may also connect traces 24 to electronic elements on the same side of printed circuit board 22 as traces 24 .
- Each zone 50may also share a common set of interconnected traces joined to electronics on the back side of circuit board 22 via through-hole 56 in the center of contact area 26 .
- Traces 24may be formed by any means which presents a conductive surface to resistive layer 32 . Since air typically fills the gap between printed circuit board 22 and flexible substrate 28 , traces 30 should resist corrosion. Traces 24 may be constructed, for example, by plating or coating copper traces with an oxidation preventing conductive material such as gold, silver, solder, carbon ink, and the like. Alternatively, traces 24 may be constructed by screen printing carbon, silver, or other conductive inks onto printed circuit board 22 .
- Traces 24 and at least a portion of pedestal 38may be fabricated at the same time and of the same materials. This may result in traces 24 and the base of pedestal 38 extending the same height above board 22 .
- the height of pedestal 38may be increased by the addition of solder mask or similar material and adhesive spacer 34 . This typically will result in a distance between traces 24 and flexible substrate 28 sufficient to prevent inadvertent contact between resistive layer 32 and conductive traces 24 . Simultaneous cofabrication of pedestal 38 and traces 24 together with the remainder of circuit board 22 results in very low incremental cost to circuit board 22 .
- Printed circuit board 22includes screen printed carbon ink traces 24 within contact area 26 forming four zones 50 . Due to the high resistivity of screen printed carbon ink, traces 24 are printed over copper pads 60 located just outside of contact area 26 . Copper traces 62 connect pads 60 to through holes 54 or to electrical components on the same side of printed circuit board 22 as traces 24 .
- FIG. 4a top view of a pressure sensitive transducer constructed using the printed circuit board of FIGS. 2 or 3 according to an embodiment of the present invention is shown.
- Flexible substrate 28is shown adhered to pedestal 38 on printed circuit board 22 . This results in FSR 36 directly constructed on printed circuit board 22 .
- FIG. 5an exploded view illustrating multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention is shown.
- Six FSRsare shown.
- Each contact area 26includes two sets of interdigitated contacts 24 .
- Spacer 38in this example a thin plastic sheet coated with adhesive on both sides, is adhered to printed circuit board 22 .
- Spacer 38includes an opening for each contact area 26 .
- Flexible substrate 28is then adhered to spacer 38 .
- the entire inner surface 30 of flexible substrate 28may be coated with one or more resistive layers 32 .
- separate disconnected resistive layers 32 corresponding with each contact area 26may be formed on flexible substrate 28 .
- Printed circuit board 22includes six contact areas 26 with traces 24 formed by screen printing carbon ink onto printed circuit board 22 . Copper pedestal 38 surrounds contact areas 26 . Pedestal 38 may have a wide variety of shapes, but typically mirrors the outline of flexible substrate 28 , not shown for clarity. Soldermask 42 covers much of circuit board 22 while leaving contact areas 26 exposed to contact resistive layer 32 on flexible substrate 28 .
- Printed circuit board 22also contains electronic components, shown generally by 70 , soldered to printed circuit board 22 for receiving electrical signals from traces 24 indicative of pressure applied to the FSRs.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
Description
- This application claims the benefit of U.S. provisional application Ser. No. 60/267,455 filed Feb. 8, 2001 which is incorporated herein by reference.[0001]
- 1. Field of the Invention[0002]
- The Present invention relates to transducer systems for sensing pressure.[0003]
- 2. Background Art[0004]
- Pressure sensitive transducers generate a signal indicative of the amount of pressure applied to a flexible membrane. Such transducers may also generate a signal based on the location of pressure applied to the flexible membrane. Such pressure sensitive transducers provide inputs for a wide variety of applications such as remote controls, game controllers, mouse pads, tactile sensors, and the like. Pressure sensitive transducers are typically coupled with electronics that condition and amplify pressure signals.[0005]
- Various constructions for pressure sensitive transducers are possible. One type includes one or more force sensing resisters (FSRs). Various FSRs have been disclosed, such as those described in commonly assigned U.S. Pat. Nos. 4,314,227; 4,314,228; and 4,489,302; each of which is hereby incorporated by reference in its entirety. Typically, an FSR is composed of three parts, a rigid base, a spacer, and a resistive membrane. Conductive traces are typically arranged in separated interdigitated sets on the base. These traces may be configured in a single zone or in multiple zones to allow, for example, pointing devices as described in commonly assigned U.S. Pat. Nos. 5,659,334 and 5,828,363, each of which is hereby incorporated by reference in its entirety. The flexible resistive membrane is spaced apart from the base layer by a spacer, which is typically a ring of material around the outer edge of the conductive traces. The spacer is also typically coated with adhesive to hold the device together. The flexible top membrane may be made of a polymer coated on its inner face with semi-conductive or resistive ink, giving the FSR force sensing properties. This ink is described in commonly owned U.S. Pat. Nos. 5,296,837 and 5,302,936, each of which is hereby incorporated by reference in its entirety.[0006]
- In most practical applications, the FSR must be connected to sensing and conditioning electronics in order to effectively operate. One way this may be accomplished is by connecting the FSR to a printed circuit board containing the electronics with a multi-conductor cable. Another way of connecting the FSR to support electronics is to adhere the FSR base directly to the circuit board containing the electronics. Electrical connection may be made between traces on the FSR and corresponding traces on the printed circuit board using z-tape, which only conducts in a direction perpendicular to the tape surface. While either method is effective, both have unnecessary manufacturing steps and require unnecessary components, thus increasing the cost of a pressure sensitive transducer system as well as increasing the likelihood of system failure. What is needed is a pressure sensitive transducer and a method for making such a transducer that requires fewer components and fewer manufacturing steps without sacrificing transducer performance.[0007]
- The present invention decreases the cost and complexity of an electronic pressure sensitive transducer by constructing such a transducer directly on a printed circuit board containing support electronics.[0008]
- An electronic pressure sensitive transducer producing an electrical signal indicative of applied pressure is provided. The transducer includes a printed circuit board accepting a plurality of electronic elements for processing the transducer electrical signal. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer substantially surrounds the contact area. The adhesive spacer attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. The resistive layer contacts at least two of the traces in response to pressure applied to the flexible substrate to produce the electrical signal indicative of applied pressure.[0009]
- In an embodiment of the present invention, at least one resistive layer is made with resistive ink.[0010]
- In another embodiment of the present invention, a pedestal is formed on the printed circuit board substantially around the contact area. The pedestal receives the adhesive spacer for attaching the flexible substrate. The pedestal increases the space between resistive layers on the substrate and conductive traces on the printed circuit board. The pedestal may be formed by coating traces on the printed circuit board with a non-conductive material such as soldermask.[0011]
- In yet another embodiment of the present invention, the conductive traces include a plurality of sets of traces. Each set of traces is interconnected within a zone of the contact area. An interconnected set of contact traces extends into each zone. At least one of the interconnected set of traces may be connected to the electronic elements for processing the transducer signal via a through-hole in the printed circuit board. The through-hole may be within the contact area.[0012]
- In still another embodiment of the present invention, conductive traces are arranged in sets of interconnected traces. At least two sets of traces are interdigitated.[0013]
- In a further embodiment of the present invention, conductive traces comprise copper traces covered with an oxidation preventing conductive material.[0014]
- In a still further embodiment of the present invention, conductive traces comprise screen printed carbon ink.[0015]
- A method of forming an electronic pressure sensitive transducer on a printed circuit board is also provided. The printed circuit board accepts electronic components for producing signals generated by the pressure sensitive transducer. A plurality of conductive traces are formed on the printed circuit board to form a contact area. At least one resistive layer is deposited on an inner side of a flexible substrate. The flexible substrate is assembled on the printed circuit board such that the flexible substrate resistive layer is facing the printed circuit board conductive traces. The flexible substrate is held to the printed circuit board by an adhesive substantially surrounding at least a portion of the contact area.[0016]
- A transducer system is also provided. The system includes a printed circuit board having a plurality of conductive traces. At least two of these traces define contact areas. The printed circuit board is constructed to accept electronic elements for processing electrical signals produced by a plurality of transducers. Each of these signals is indicative of pressure applied to at least one of the transducers. The system also includes at least one flexible substrate having an inner surface facing each contact area. At least one adhesive spacer substantially surrounds each contact layer to attach at least one flexible substrate to the printed circuit board. At least one resistive layer is deposited on a flexible substrate inner surface. Each resistive layer contacts at least two of the traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure. The contact areas, at least one flexible substrate, at least one adhesive spacer and at least one resistive layer form the plurality of transducers, each transducer constructed on the printed circuit board.[0017]
- A method of forming an electronic pressure sensitive transducer on a printed circuit board supporting electronic elements is also provided. A portion of conductive material on a printed circuit board is selectively removed to define traces in a contact area, traces connecting the electronic elements to the contact area, and at least a portion of a pedestal.[0018]
- The above objects and other objects, features, and advantages of the present invention are readily apparent from the following detailed description of the best mode for carrying out the invention when taken in connection with the accompanying drawings.[0019]
- FIG. 1 is an exploded cross-sectional view illustrating a conceptualized pressure sensitive transducer according to an embodiment of the present invention;[0020]
- FIG. 2 is a top view of a printed circuit board illustrating a four-zone contact area according to an embodiment of the present invention;[0021]
- FIG. 3 is a top view of a printed circuit board illustrating carbon traces according to an embodiment of the present invention;[0022]
- FIG. 4 is a top view of a pressure sensitive transducer constructed using the printed circuit board of FIG. 2 or[0023]3 according to an embodiment of the present invention;
- FIG. 5 is an exploded view illustrating conceptualized multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention; and[0024]
- FIG. 6 is a top view of a printed circuit board implementing multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention.[0025]
- Referring to FIG. 1, an exploded cross-sectional view illustrating a conceptualized pressure sensitive transducer according to an embodiment of the present invention is shown. An electronic pressure sensitive transducer, shown generally by[0026]20, produces an electrical signal indicative of applied pressure.
Pressure transducer 20 includes printedcircuit board 22 accepting a plurality of electronic elements, not shown for clarity, for processing the transducer electrical signal. Conductive traces24 are formed on printedcircuit board 22 to definecontact area 26.Flexible substrate 28 hasinner surface 30 which facescontact area 26 whenpressure transducer 20 is assembled. At least oneresistive layer 32 is deposited oninner surface 30.Adhesive spacer 34 substantially surroundscontact area 26.Adhesive spacer 34 attachesflexible substrate 28 to printedcircuit board 22. When assembled,resistive layer 32 contacts at least twotraces 24 in response to pressure applied toflexible substrate 28 to produce electrical signals indicative of applied pressure. - [0027]
Flexible substrate 28 withresistive layer 32 together withtraces 24 on printedcircuit board 22 implement a force sensing resistor (FSR), shown generally by36. IntegratingFSR 36 directly onto printedcircuit board 22 creates a pressure sensor transducer which may be referred to as “sensor on board” (SOB). Such a construction eliminates some of the materials and manufacturing steps previously required to manufacture a pressure sensitive transducer. - Virtually any printed[0028]
circuit board 22 can be adapted to receiveFSR 36 according to the present invention, providing that sufficient surface space is available forFSR 36. This includes both rigid and flexible circuit boards. Conductive traces24 on printedcircuit board 22 may be formed by any suitable means known in the art. For example, traces24 may be formed by depositing conductive material on printedcircuit board 22 then selectively removing a portion of the conductive material to define traces24. Dimensions forconductive traces 24 depend on the dimensions ofFSR 36, material and construction forflexible substrate 28, material and construction forresistive layers 32, and the like. Typical line thicknesses forconductive traces 24 range between 0.010 inches (0.25 mm) and 0.060 inches (1.5 mm). Typical line spacing betweenconductive traces 24 ranges between 0.010 inches (0.25 mm) and 0.060 inches (1.5 mm). Positional tolerance ofFSR 36 on printedcircuit board 22 varies as well, with ±0.015 inches (±0.4 mm) typical. - Two sets of[0029]
interconnected traces 24 may be used to form a single zone withincontact area 26. Multiple zones withincontact area 26 permit location of pressure onflexible substrate 28 to be determined. Multiple zones may be obtained by using a plurality of sets ofinterconnected traces 24 and one interconnected set ofcommon traces 24 extending into each zone. Alternatively, each zone may be defined by two or more separate sets oftraces 24. Preferably, the sets oftraces 24 in each zone are interdigitated. - [0030]
Flexible substrate 28 may be constructed from any suitably flexible material such as, for example, Mylar. The thickness ofsubstrate 28 varies depending on the application and dimensions ofFSR 36. Preparingsubstrate 28 forresistive layers 32 entails cutting material forsubstrate 28 into sheets or other shapes suitable for printing or other methods of depositingresistive layers 32. - One or more[0031]
resistive layers 32 are deposited onsubstrate 28 by conventional means such as, for example, by screen printing resistive ink ontosubstrate 28.Resistive layers 32 may be printed over theentire substrate 28 or only over that portion which will cover operative traces24 on printedcircuit board 22.Resistive layers 32 may also be deposited such that several distinct regions are formed over that portion ofsubstrate 28 which will cover operative traces24 on printedcircuit board 22. - [0032]
Adhesive 34 is used to attachflexible substrate 28 to printedcircuit board 22.Adhesive 34 also provides spacing betweenresistive layers 32 onsubstrate 28 and traces24 on printedcircuit board 22.Adhesive 34 may be applied to printedcircuit board 22, toflexible substrate 28, or to both as suits manufacturability ofFSR 36.Adhesive 34 may be applied to either surface in a conventional manner such as, for example, by depositing a bead of adhesive34 around some or all of the perimeter ofcontact area 26. In a preferred embodiment,adhesive layer 34 comprises an adhesive ink screen printed ontosubstrate 28. Adhesive inks that may be used include product numbers SP-7533 from 3M or ML25184 from Acheson Industries, Inc. of Port Huron, Mich. - If[0033]
adhesive 34 is applied tosubstrate 28 in advance of final assembly, a protective release liner may be cut or positioned over adhesive34 to prevent inadvertent adhesion to other surfaces or airborne materials. - [0034]
Substrate 28 may be formed into strips and kiss cut, or partially cut, into the desired final shape.Individual substrates 28 may then be easily separated by hand or machine immediately prior to assembly onto printedcircuit board 22. Preferably, this final assembly step occurs after electronic components have been mounted on printedcircuit board 22 to prevent heat damage tosubstrate 28 from soldering operations. - If additional space is required between printed[0035]
circuit board 22 andsubstrate 28, a pedestal, shown generally by38, may be formed on printedcircuit board 22 in regions wheresubstrate 28 is adhered to printedcircuit board 22.Pedestal 38 increases the distance thatsubstrate 28 must be depressed prior to contact betweenresistive layer 22 and traces24 on printedcircuit board 22.Pedestal 38 may be formed in a variety of manners. First, printedcircuit board 22 may be manufactured with additional thickness to formpedestal 38. Second, one or more layers ofconductive traces 40 may be built on printedcircuit board 22 to formpedestal 38.Pedestal 38 is then covered with anon-conducting material 42, such as soldermask, to prevent inadvertent short circuits betweentraces 40 andresistive layer 32. Third, a polymer thick film may be deposited on printedcircuit board 22 to formpedestal 38. Fourth, a sheet of material may be adhered to printedcircuit board 22 to formpedestal 38. As will be recognized by one of ordinary skill in the art, many constructions forpedestal 38 are possible. - Referring now to FIG. 2, a top view of a printed circuit board illustrating a four-zone contact area according to an embodiment of the present invention is shown. Printed[0036]
circuit board 22 includestraces 24 withincontact area 26 forming four zones, each shown generally by50. Eachzone 50 includes one set oftraces 24 interconnected byline 52 which extends out ofcontact area 26 to through-hole 54. Through-hole 54 permits traces24 to be connected to electronics mounted on the bottom side ofcircuit board 22 by soldering processes known in the art.Traces 52 may also connecttraces 24 to electronic elements on the same side of printedcircuit board 22 as traces24. Eachzone 50 may also share a common set of interconnected traces joined to electronics on the back side ofcircuit board 22 via through-hole56 in the center ofcontact area 26. - Traces[0037]24 may be formed by any means which presents a conductive surface to
resistive layer 32. Since air typically fills the gap between printedcircuit board 22 andflexible substrate 28, traces30 should resist corrosion.Traces 24 may be constructed, for example, by plating or coating copper traces with an oxidation preventing conductive material such as gold, silver, solder, carbon ink, and the like. Alternatively, traces24 may be constructed by screen printing carbon, silver, or other conductive inks onto printedcircuit board 22. - Traces[0038]24 and at least a portion of
pedestal 38 may be fabricated at the same time and of the same materials. This may result intraces 24 and the base ofpedestal 38 extending the same height aboveboard 22. The height ofpedestal 38 may be increased by the addition of solder mask or similar material andadhesive spacer 34. This typically will result in a distance betweentraces 24 andflexible substrate 28 sufficient to prevent inadvertent contact betweenresistive layer 32 and conductive traces24. Simultaneous cofabrication ofpedestal 38 and traces24 together with the remainder ofcircuit board 22 results in very low incremental cost tocircuit board 22. - Referring now to FIG. 3, a top view of a printed circuit board with carbon ink traces according to an embodiment of the present invention is shown. Printed[0039]
circuit board 22 includes screen printed carbon ink traces24 withincontact area 26 forming fourzones 50. Due to the high resistivity of screen printed carbon ink, traces24 are printed overcopper pads 60 located just outside ofcontact area 26. Copper traces62 connectpads 60 to throughholes 54 or to electrical components on the same side of printedcircuit board 22 as traces24. - Referring now to FIG. 4, a top view of a pressure sensitive transducer constructed using the printed circuit board of FIGS.[0040]2 or3 according to an embodiment of the present invention is shown.
Flexible substrate 28 is shown adhered topedestal 38 on printedcircuit board 22. This results inFSR 36 directly constructed on printedcircuit board 22. - Referring now to FIG. 5, an exploded view illustrating multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention is shown. Six FSRs are shown. Each[0041]
contact area 26 includes two sets ofinterdigitated contacts 24.Spacer 38, in this example a thin plastic sheet coated with adhesive on both sides, is adhered to printedcircuit board 22.Spacer 38 includes an opening for eachcontact area 26.Flexible substrate 28 is then adhered tospacer 38. The entireinner surface 30 offlexible substrate 28 may be coated with one or moreresistive layers 32. Alternatively, separate disconnectedresistive layers 32 corresponding with eachcontact area 26 may be formed onflexible substrate 28. - Referring now to FIG. 6, a top view of a printed circuit board implementing multiple single-zone FSRs in a pressure sensitive transducer according to an embodiment of the present invention is shown. Printed[0042]
circuit board 22 includes sixcontact areas 26 withtraces 24 formed by screen printing carbon ink onto printedcircuit board 22.Copper pedestal 38 surroundscontact areas 26.Pedestal 38 may have a wide variety of shapes, but typically mirrors the outline offlexible substrate 28, not shown for clarity.Soldermask 42 covers much ofcircuit board 22 while leavingcontact areas 26 exposed to contactresistive layer 32 onflexible substrate 28. Printedcircuit board 22 also contains electronic components, shown generally by70, soldered to printedcircuit board 22 for receiving electrical signals fromtraces 24 indicative of pressure applied to the FSRs. - While embodiments of the invention have been illustrated and described, it is not intended that these embodiments illustrate and describe all possible forms of the invention. Rather, the words used in the specification are words of description rather than limitation, and it is understood that various changes may be made without departing from the spirit and scope of the invention.[0043]
Claims (53)
1. An electronic pressure sensitive transducer producing an electrical signal indicative of applied pressure, the transducer comprising:
a printed circuit board accepting a plurality of electronic elements for processing the transducer electrical signal;
a plurality of conductive traces formed on the printed circuit board to define a contact area;
a flexible substrate having an inner surface positioned over the contact area;
an adhesive spacer substantially surrounding the contact area, the adhesive spacer attaching the flexible substrate to the printed circuit board; and
at least one resistive layer deposited on the flexible substrate inner surface, the resistive layer contacting at least two of the traces in response to pressure applied to the flexible substrate to produce the electrical signal indicative of applied pressure.
2. An electronic pressure sensitive transducer as inclaim 1 wherein at least one resistive layer comprises resistive ink.
3. An electronic pressure sensitive transducer as inclaim 1 further comprising a pedestal formed on the printed circuit board substantially around the contact area, the pedestal receiving the adhesive spacer.
4. An electronic pressure sensitive transducer as inclaim 3 wherein the pedestal comprises conductive traces covered with a non-conductive material.
5. An electronic pressure sensitive transducer as inclaim 1 wherein the plurality of conductive traces comprise:
a plurality of sets of traces, each set of traces interconnected within a zone of the contact area; and
an interconnected set of common traces extending into each zone.
6. An electronic pressure sensitive transducer as inclaim 5 wherein at least one interconnected set of traces is connected to the electronic elements for processing the transducer electrical signal via a through-hole in the printed circuit board.
7. An electronic pressure sensitive transducer as inclaim 6 wherein the through-hole is within the contact area.
8. An electronic pressure sensitive transducer as inclaim 1 wherein conductive traces are arranged in interconnected sets, with at least two sets of traces interdigitated.
9. An electronic pressure sensitive transducer as inclaim 1 wherein conductive traces comprise copper traces covered with an oxidation preventing conductive material.
10. An electronic pressure sensitive transducer as inclaim 1 wherein conductive traces comprise screen printed carbon ink.
11. A method of forming an electronic pressure sensitive transducer on a printed circuit board, the printed circuit board accepting a plurality of electronic components for processing signals generated by the pressure sensitive transducer, the method comprising:
forming a plurality of conductive traces on the printed circuit board to form a contact area;
depositing at least one resistive layer on an inner side of a flexible substrate; and
assembling the flexible substrate on the printed circuit board such that the flexible substrate resistive layer is facing the printed circuit board conductive traces, the flexible substrate held to the printed circuit board by an adhesive substantially surrounding at least a portion of the contact area.
12. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 wherein at least one resistive layer comprises resistive ink.
13. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 wherein assembling comprises screen printing the adhesive on at least one of the flexible substrate and the printed circuit board.
14. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 further comprising forming a pedestal on the printed circuit board substantially around the contact area, the adhesive contacting the pedestal when assembled.
15. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 14 wherein forming a pedestal comprises forming traces on the printed circuit board in the shape of the pedestal and covering the pedestal traces with a non-conducting material.
16. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 15 wherein the traces forming the pedestal are formed in the same process as the traces forming the contact area.
17. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 wherein the plurality of conductive traces are formed as a plurality of sets of zonal traces, each set of zonal traces interconnected within a zone of the contact area, and as an interconnected set of common traces extending into each zone.
18. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 wherein the plurality of conductive traces are formed in interconnected sets, with at least two sets of interconnected traces interdigitated within the contact area.
19. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 wherein forming a plurality of conductive traces comprises depositing an oxidation preventing conductive material over copper traces.
20. A method of forming an electronic pressure sensitive transducer on a printed circuit board as inclaim 11 wherein forming a plurality of conductive traces comprises screen printing a carbon ink.
21. A printed circuit board electronic pressure sensitive transducer assembly comprising:
a printed circuit board accepting a plurality of electronic elements for processing pressure transducer electrical signals;
a plurality of conductive traces formed on the printed circuit board to define a contact area;
a flexible substrate having an inner surface positioned over the contact area;
an adhesive spacer substantially surrounding the contact area, the adhesive spacer attaching the flexible substrate to the printed circuit board; and
at least one resistive layer comprising a resistive ink deposited on the flexible substrate inner surface, the resistive layer contacting at least two of the contact area conductive traces in response to pressure applied to the flexible substrate.
22. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 21 further comprising a pedestal formed on the printed circuit board, the pedestal substantially surrounding the contact area, the pedestal receiving the adhesive spacer.
23. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 22 wherein the pedestal comprises a conductive material coated with a non-conductive material, the conductive material formed on the printed circuit board.
24. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 21 wherein the plurality of conductive traces comprise:
a plurality of sets of traces, each set of traces interconnected within a zone of the contact area; and
an interconnected set of common traces extending into each zone.
25. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 24 wherein at least one interconnected set of traces is connected to the electronic elements for processing the transducer electrical signal via a through-hole in the printed circuit board.
26. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 25 wherein the through-hole is within the contact area.
27. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 21 wherein conductive traces are arranged in interconnected sets, with at least two sets of traces interdigitated.
28. An electronic pressure sensitive transducer as inclaim 21 wherein the adhesive spacer comprises adhesive ink.
29. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 21 wherein conductive traces comprise copper traces covered with an oxidation preventing conductive material.
30. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 21 wherein conductive traces comprise screen printed carbon ink.
31. A printed circuit board electronic pressure sensitive transducer assembly comprising:
a printed circuit board accepting a plurality of electronic elements for processing pressure transducer electrical signals;
a plurality of conductive traces formed on the printed circuit board to define a contact area;
a pedestal substantially surrounding the contact area, the pedestal forming a flat area higher than the conductive traces;
a flexible substrate having an inner surface positioned over the contact area;
an adhesive spacer substantially surrounding the contact area, the adhesive spacer attaching the flexible substrate to the pedestal; and
at least one resistive layer deposited on the flexible substrate inner surface, the resistive layer contacting at least two of the contact area conductive traces in response to pressure applied to the flexible substrate.
32. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 31 wherein the pedestal is formed by depositing a non-conductive layer over a conductive layer, the conductive layer formed on the printed circuit board.
33. An electronic pressure sensitive transducer as inclaim 31 wherein at least one resistive layer comprises resistive ink.
34. An electronic pressure sensitive transducer as inclaim 31 wherein the adhesive spacer comprises adhesive ink.
35. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 31 wherein the plurality of conductive traces comprise:
a plurality of sets of traces, each set of traces interconnected within a zone of the contact area; and
an interconnected set of common traces extending into each zone.
36. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 35 wherein at least one interconnected set of traces is connected to the electronic elements for processing the transducer electrical signal via a through-hole in the printed circuit board.
37. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 36 wherein the through-hole is within the contact area.
38. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 31 wherein conductive traces are arranged in interconnected sets, with at least two sets of traces interdigitated.
39. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 31 wherein conductive traces comprise copper traces coated with an oxidation preventing conductive material.
40. A printed circuit board electronic pressure sensitive transducer assembly as inclaim 31 wherein conductive traces comprise screen printed carbon ink.
41. A method of forming a printed circuit board electronic pressure sensitive transducer assembly comprising:
forming on the printed circuit board a plurality of conductive traces to form a contact area;
forming on the printed circuit board a plurality of conductive traces connecting the contact area with conductive pads for receiving electronic elements, the electronic elements processing pressure transducer signals;
soldering the electronic elements to the printed circuit board conductive pads;
printing a resistive layer on a flexible substrate;
printing an adhesive layer over a portion of the resistive layer; and
assembling the flexible substrate on the printed circuit board by contacting the adhesive with the printed circuit board such that the resistive layer faces the contact area.
42. A method of forming a printed circuit board electronic pressure sensitive transducer assembly as inclaim 41 further comprising forming a raised pedestal on the printed circuit board substantially surrounding the contact area, the pedestal contacting the adhesive layer.
43. A method of forming a printed circuit board electronic pressure sensitive transducer assembly as inclaim 42 wherein the pedestal is formed by forming conductive material on the printed circuit board and depositing non-conductive material on the conductive material.
44. A method of forming a printed circuit board electronic pressure sensitive transducer assembly as inclaim 43 wherein the traces forming the pedestal are formed in the same process as the traces forming the contact area.
45. A transducer system comprising:
a printed circuit board having a plurality of conductive traces, at least two of the traces defining each of a plurality of contact areas, the printed circuit board accepting electronic elements for processing electrical signals produced by a plurality of transducers, each signal indicative of pressure applied to at least one of the transducers;
at least one flexible substrate having an inner surface, one flexible substrate inner surface facing each contact area;
at least one adhesive spacer substantially surrounding each contact layer, each adhesive spacer attaching at least one flexible substrate to the printed circuit board; and
at least one resistive layer deposited on the at least one flexible substrate inner surface, each resistive layer contacting at least two of the traces in response to pressure applied to the at least one flexible substrate to produce the electrical signal indicative of the applied pressure;
wherein the plurality of contact areas, the at least one flexible substrate, the at least one adhesive spacer and the at least one resistive layer form the plurality of transducers, each transducer constructed on the printed circuit board.
46. A transducer system as inclaim 45 wherein the at least one flexible substrate is a single substrate.
47. A transducer system as inclaim 45 wherein the at least one adhesive spacer is a single adhesive spacer.
48. A transducer system as inclaim 45 further comprising at least one pedestal formed on the printed circuit board substantially around at least one contact areas, the pedestal receiving at least one adhesive spacer.
49. A transducer system as inclaim 48 wherein the at least one pedestal is a single pedestal formed substantially around all of the plurality of contact areas.
50. A transducer system as inclaim 48 wherein the at least one pedestal comprises conductive traces covered with a non-conductive material.
51. A transducer system as inclaim 45 wherein conductive traces defining at least one contact area comprise copper traces covered with an oxidation preventing conductive material.
52. A transducer system as inclaim 45 wherein conductive traces defining at least one contact area comprise screen printed carbon ink.
53. A method of forming an electronic pressure sensitive transducer on a printed circuit board supporting electronic elements, the transducer having a flexible substrate with at least one resistive layer on an inner side of the flexible substrate facing the printed circuit board, the resistive layer contacting conductive traces in a contact area on the printed circuit board when pressure is applied to an outer side of the flexible substrate, the transducer further having a pedestal formed substantially around the contact area, the printed circuit board further having conductive traces connecting the electronic elements to the contact area, the method comprising:
depositing conductive material on the printed circuit board; and
selectively removing a portion of the deposited conductive material to define the traces in the contact area, the traces connecting the electronic elements to the contact area, and at least a portion of the pedestal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/067,952US6909354B2 (en) | 2001-02-08 | 2002-02-05 | Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| US11/058,939US7213323B2 (en) | 2001-02-08 | 2005-02-16 | Method of forming an electronic pressure sensitive transducer on a printed circuit board |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26745501P | 2001-02-08 | 2001-02-08 | |
| US10/067,952US6909354B2 (en) | 2001-02-08 | 2002-02-05 | Electronic pressure sensitive transducer apparatus and method for manufacturing same |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US11/058,939DivisionUS7213323B2 (en) | 2001-02-08 | 2005-02-16 | Method of forming an electronic pressure sensitive transducer on a printed circuit board |
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| Publication Number | Publication Date |
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| US20020104369A1true US20020104369A1 (en) | 2002-08-08 |
| US6909354B2 US6909354B2 (en) | 2005-06-21 |
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| US10/067,952Expired - LifetimeUS6909354B2 (en) | 2001-02-08 | 2002-02-05 | Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| US11/058,939Expired - LifetimeUS7213323B2 (en) | 2001-02-08 | 2005-02-16 | Method of forming an electronic pressure sensitive transducer on a printed circuit board |
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| US11/058,939Expired - LifetimeUS7213323B2 (en) | 2001-02-08 | 2005-02-16 | Method of forming an electronic pressure sensitive transducer on a printed circuit board |
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| US (2) | US6909354B2 (en) |
| EP (1) | EP1364220A4 (en) |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20040239474A1 (en)* | 2003-05-30 | 2004-12-02 | Dunn Gregory J. | Polymer thick film resistor, layout cell, and method |
| US20050022616A1 (en)* | 2003-07-30 | 2005-02-03 | Delphi Technologies, Inc. | Pressure transducer |
| US20050057515A1 (en)* | 2003-09-16 | 2005-03-17 | Microsoft Corporation | Computer keyboard with quantitatively force-sensing keys |
| US20050057514A1 (en)* | 2003-09-16 | 2005-03-17 | Microsoft Corporation | Quantitatively force-sensing computer keyboard |
| US20050057521A1 (en)* | 2003-09-16 | 2005-03-17 | Microsoft Corporation | Method for processing data quantifying force applied to one or more keys of a computer keyboard |
| US20050131578A1 (en)* | 2003-09-30 | 2005-06-16 | Intrinsic Marks International Llc | Item monitoring system and methods |
| US20060007172A1 (en)* | 2004-06-23 | 2006-01-12 | Interlink Electronics, Inc. | Force sensing resistor with calibration element and method of manufacturing same |
| US20070146349A1 (en)* | 2005-12-27 | 2007-06-28 | Interlink Electronics, Inc. | Touch input device having interleaved scroll sensors |
| US20080018609A1 (en)* | 2006-07-20 | 2008-01-24 | Interlink Electronics, Inc. | Shape adaptable resistive touchpad |
| US20080314165A1 (en)* | 2005-06-16 | 2008-12-25 | Rosenberg Ilya D | Method for Manufacturing Long Force Sensors Using Screen Printing Technology |
| KR101162787B1 (en)* | 2004-02-10 | 2012-07-04 | 모토로라 모빌리티, 인크. | Electronic device with force sensing key |
| EP2571019A1 (en)* | 2011-08-30 | 2013-03-20 | Yamaha Corporation | Controller provided with touch detection device |
| US20140032136A1 (en)* | 2012-07-27 | 2014-01-30 | Tactonic Technologies, Llc | Method for Mechanical Sensing Utilizing Controlled Current |
| EP3050745A1 (en)* | 2015-01-27 | 2016-08-03 | Kendrion Kuhnke Automotive GmbH | Pneumatic control and measuring apparatus and seat comfort system |
| EP3246685A4 (en)* | 2015-01-14 | 2018-05-23 | Nippon Mektron, Ltd. | Pressure-sensitive element, pressure sensor, and method for manufacturing pressure-sensitive element |
| WO2018191738A1 (en) | 2017-04-14 | 2018-10-18 | Sensel, Inc. | Selectively adhered resistive force sensor |
| US10408691B2 (en)* | 2017-10-05 | 2019-09-10 | International Business Machines Corporation | Fracture ring sensor |
| US10928259B2 (en) | 2016-03-22 | 2021-02-23 | Nissha Co., Ltd. | Pressure sensor |
Families Citing this family (52)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6460170B1 (en)* | 2000-04-29 | 2002-10-01 | Hewlett Packard Company | Connection block for interfacing a plurality of printed circuit boards |
| JP2003075271A (en)* | 2001-09-04 | 2003-03-12 | Mitsumi Electric Co Ltd | Pressure-sensitive sensor |
| DE102004055469A1 (en)* | 2004-11-17 | 2006-05-24 | Siemens Ag | Sensor with deformation-dependent resistance value |
| US7903090B2 (en)* | 2005-06-10 | 2011-03-08 | Qsi Corporation | Force-based input device |
| US7337085B2 (en) | 2005-06-10 | 2008-02-26 | Qsi Corporation | Sensor baseline compensation in a force-based touch device |
| US20060284856A1 (en)* | 2005-06-10 | 2006-12-21 | Soss David A | Sensor signal conditioning in a force-based touch device |
| US20080170043A1 (en)* | 2005-06-10 | 2008-07-17 | Soss David A | Force-based input device |
| US7804970B2 (en)* | 2005-10-24 | 2010-09-28 | Sonosite, Inc. | Array interconnect for improved directivity |
| EP1785706A1 (en)* | 2005-11-15 | 2007-05-16 | IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. | Method for producing an electric circuit on a flexible substrate |
| JP5044974B2 (en)* | 2006-05-01 | 2012-10-10 | 横浜ゴム株式会社 | Pressure sensor for pressure measurement of unvulcanized tires |
| US20080030482A1 (en)* | 2006-07-31 | 2008-02-07 | Elwell James K | Force-based input device having an elevated contacting surface |
| US7688237B2 (en)* | 2006-12-21 | 2010-03-30 | Broadcom Corporation | Apparatus and method for analog-to-digital converter calibration |
| US20080303800A1 (en)* | 2007-05-22 | 2008-12-11 | Elwell James K | Touch-based input device providing a reconfigurable user interface |
| WO2010088922A1 (en)* | 2009-02-06 | 2010-08-12 | Abb Ag | Set of multiaxial force and torque sensor and assembling method |
| US8553389B1 (en)* | 2010-08-19 | 2013-10-08 | MCube Inc. | Anchor design and method for MEMS transducer apparatuses |
| JP5517154B2 (en)* | 2010-01-25 | 2014-06-11 | 株式会社オーディオテクニカ | Boundary microphone |
| US8587422B2 (en) | 2010-03-31 | 2013-11-19 | Tk Holdings, Inc. | Occupant sensing system |
| DE102011006448A1 (en) | 2010-03-31 | 2011-10-06 | Tk Holdings, Inc. | steering wheel sensors |
| US8983732B2 (en) | 2010-04-02 | 2015-03-17 | Tk Holdings Inc. | Steering wheel with hand pressure sensing |
| DE102011006649B4 (en) | 2010-04-02 | 2018-05-03 | Tk Holdings Inc. | Steering wheel with hand sensors |
| US20120090757A1 (en) | 2010-10-18 | 2012-04-19 | Qualcomm Mems Technologies, Inc. | Fabrication of touch, handwriting and fingerprint sensor |
| PL2583586T5 (en)* | 2011-10-18 | 2021-10-11 | Kesseböhmer Produktions GmbH & Co. KG | Device for detecting collisions and method |
| US9354748B2 (en) | 2012-02-13 | 2016-05-31 | Microsoft Technology Licensing, Llc | Optical stylus interaction |
| US9360893B2 (en) | 2012-03-02 | 2016-06-07 | Microsoft Technology Licensing, Llc | Input device writing surface |
| US9064654B2 (en) | 2012-03-02 | 2015-06-23 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
| US9460029B2 (en) | 2012-03-02 | 2016-10-04 | Microsoft Technology Licensing, Llc | Pressure sensitive keys |
| US9298236B2 (en) | 2012-03-02 | 2016-03-29 | Microsoft Technology Licensing, Llc | Multi-stage power adapter configured to provide a first power level upon initial connection of the power adapter to the host device and a second power level thereafter upon notification from the host device to the power adapter |
| US8873227B2 (en) | 2012-03-02 | 2014-10-28 | Microsoft Corporation | Flexible hinge support layer |
| US9075566B2 (en) | 2012-03-02 | 2015-07-07 | Microsoft Technoogy Licensing, LLC | Flexible hinge spine |
| US9870066B2 (en) | 2012-03-02 | 2018-01-16 | Microsoft Technology Licensing, Llc | Method of manufacturing an input device |
| USRE48963E1 (en) | 2012-03-02 | 2022-03-08 | Microsoft Technology Licensing, Llc | Connection device for computing devices |
| US9426905B2 (en) | 2012-03-02 | 2016-08-23 | Microsoft Technology Licensing, Llc | Connection device for computing devices |
| WO2013154720A1 (en) | 2012-04-13 | 2013-10-17 | Tk Holdings Inc. | Pressure sensor including a pressure sensitive material for use with control systems and methods of using the same |
| US9024910B2 (en) | 2012-04-23 | 2015-05-05 | Qualcomm Mems Technologies, Inc. | Touchscreen with bridged force-sensitive resistors |
| US20130300590A1 (en) | 2012-05-14 | 2013-11-14 | Paul Henry Dietz | Audio Feedback |
| US10031556B2 (en) | 2012-06-08 | 2018-07-24 | Microsoft Technology Licensing, Llc | User experience adaptation |
| US9019615B2 (en) | 2012-06-12 | 2015-04-28 | Microsoft Technology Licensing, Llc | Wide field-of-view virtual image projector |
| US8964379B2 (en) | 2012-08-20 | 2015-02-24 | Microsoft Corporation | Switchable magnetic lock |
| WO2014043664A1 (en)* | 2012-09-17 | 2014-03-20 | Tk Holdings Inc. | Single layer force sensor |
| US8952892B2 (en) | 2012-11-01 | 2015-02-10 | Microsoft Corporation | Input location correction tables for input panels |
| US9304549B2 (en) | 2013-03-28 | 2016-04-05 | Microsoft Technology Licensing, Llc | Hinge mechanism for rotatable component attachment |
| US10120420B2 (en) | 2014-03-21 | 2018-11-06 | Microsoft Technology Licensing, Llc | Lockable display and techniques enabling use of lockable displays |
| US10324733B2 (en) | 2014-07-30 | 2019-06-18 | Microsoft Technology Licensing, Llc | Shutdown notifications |
| US9424048B2 (en) | 2014-09-15 | 2016-08-23 | Microsoft Technology Licensing, Llc | Inductive peripheral retention device |
| US9898091B2 (en) | 2015-06-03 | 2018-02-20 | Oculus Vr, Llc | Virtual reality system with head-mounted display, camera and hand-held controllers |
| US9870052B2 (en) | 2015-06-11 | 2018-01-16 | Oculus Vr, Llc | Hand-held controller with pressure-sensing switch for virtual-reality systems |
| EP3147258A1 (en)* | 2015-09-22 | 2017-03-29 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Connection panel for electronic components |
| KR102423148B1 (en)* | 2015-11-26 | 2022-07-21 | 삼성전자주식회사 | Methode for obtaining user input and electronic device thereof |
| TWI627381B (en)* | 2016-10-21 | 2018-06-21 | 台灣艾華電子工業股份有限公司 | Bend sensor |
| DE202018006116U1 (en) | 2018-03-29 | 2019-04-08 | Ableton Ag | button |
| EP3547303B1 (en) | 2018-03-29 | 2020-05-13 | Ableton AG | Key with enhanced expressive possibilities |
| EP3726191A1 (en) | 2019-04-17 | 2020-10-21 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO | Pressure sensor |
Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4598181A (en)* | 1984-11-13 | 1986-07-01 | Gte Communication Systems Corp. | Laminate switch assembly having improved tactile feel and improved reliability of operation |
| US4652998A (en)* | 1984-01-04 | 1987-03-24 | Bally Manufacturing Corporation | Video gaming system with pool prize structures |
| US5302936A (en)* | 1992-09-02 | 1994-04-12 | Interlink Electronics, Inc. | Conductive particulate force transducer |
| US5357065A (en)* | 1992-07-10 | 1994-10-18 | Fujitsu Limited | Circuit unit for electronic instrument having key-pad arrangement |
| US5762552A (en)* | 1995-12-05 | 1998-06-09 | Vt Tech Corp. | Interactive real-time network gaming system |
| US5851149A (en)* | 1995-05-25 | 1998-12-22 | Tech Link International Entertainment Ltd. | Distributed gaming system |
| US6047127A (en)* | 1993-06-24 | 2000-04-04 | Nintendo Co. Ltd. | Electronic Entertainment and communications system |
| US6102802A (en)* | 1997-10-01 | 2000-08-15 | Armstrong; Brad A. | Game controller with analog pressure sensor(s) |
| US6115030A (en)* | 1997-12-18 | 2000-09-05 | International Business Machines Corporation | Trackpoint device |
| US6184124B1 (en)* | 1996-04-11 | 2001-02-06 | Mitsubishi Denki Kabushiki Kaisha | Method of making embedded wiring system |
| US6208271B1 (en)* | 1998-09-04 | 2001-03-27 | Brad A. Armstrong | Remote controller with analog button(s) |
| US6294982B1 (en)* | 1999-02-10 | 2001-09-25 | Symon Communications, Inc. | Visual messaging system for high speed networks |
| US20020007677A1 (en)* | 1999-12-17 | 2002-01-24 | Coates Joann M. | Printed circuit board inclinometer/accelerometer |
| US20020024503A1 (en)* | 1992-03-05 | 2002-02-28 | Armstrong Brad A. | Controller with variable sensor(s) |
| US20020055384A1 (en)* | 1992-03-05 | 2002-05-09 | Armstrong Brad A. | Proportional controls used with displayed imagery |
| US20020151363A1 (en)* | 2001-04-12 | 2002-10-17 | Howard Letovsky | Method and system for broadcast and control of a remotely located wagering device |
| US20020192939A1 (en)* | 1999-12-27 | 2002-12-19 | Hoya Corporation | Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board |
| US20030078103A1 (en)* | 2001-09-28 | 2003-04-24 | Igt | Game development architecture that decouples the game logic from the graphics logic |
| US20030083118A1 (en)* | 2000-04-14 | 2003-05-01 | Nelson David C. | Method, apparatus and system for an electronically distributed game of skill |
| US20030104856A1 (en)* | 2001-12-05 | 2003-06-05 | International Game Technology | Method for representing a game as a unique number |
| US20030109306A1 (en)* | 1999-06-18 | 2003-06-12 | Karmarkar Jayant S. | Restricted episode distribution with repeated biometric authentication |
| US6590177B2 (en)* | 2001-06-01 | 2003-07-08 | Fujikura Ltd. | Membrane switch and pressure sensitive sensor |
| US6756555B2 (en)* | 2001-12-21 | 2004-06-29 | Silitek Corporation | Portable keyboard |
| US20040130528A1 (en)* | 2003-01-07 | 2004-07-08 | Baker Jeffrey R. | Miniature highly manufacturable mouse pointing device |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5914728B2 (en)* | 1975-11-05 | 1984-04-05 | 日本電気株式会社 | EXIYO HIYOJI PANEL |
| US4079194A (en) | 1976-08-09 | 1978-03-14 | Victor Kley | Graphical data entry pad |
| US4071691A (en) | 1976-08-24 | 1978-01-31 | Peptek, Inc. | Human-machine interface apparatus |
| US4085302A (en)* | 1976-11-22 | 1978-04-18 | Control Data Corporation | Membrane-type touch panel |
| DE2902769C2 (en)* | 1979-01-25 | 1982-12-09 | Rudolf Schadow Gmbh, 1000 Berlin | Push button switch |
| US4315238A (en)* | 1979-09-24 | 1982-02-09 | Eventoff Franklin Neal | Bounceless switch apparatus |
| US4314227A (en) | 1979-09-24 | 1982-02-02 | Eventoff Franklin Neal | Electronic pressure sensitive transducer apparatus |
| US4314228A (en) | 1980-04-16 | 1982-02-02 | Eventoff Franklin Neal | Pressure transducer |
| US4489302A (en) | 1979-09-24 | 1984-12-18 | Eventoff Franklin Neal | Electronic pressure sensitive force transducer |
| US4296406A (en) | 1979-12-28 | 1981-10-20 | Sperry Corporation | Pressure sensitive switch structure |
| JPS5837784A (en) | 1981-08-28 | 1983-03-05 | Toshiba Corp | Coordinate input device |
| US4620062A (en) | 1983-10-11 | 1986-10-28 | Rdi Limited Partnership | Device for forming signals which are characteristic of the position of a point determined on a surface |
| US4752655A (en) | 1984-11-16 | 1988-06-21 | Nippon Telegraph & Telephone Corporation | Coordinate input device |
| US4623757A (en) | 1984-11-29 | 1986-11-18 | Interaction Systems, Inc. | Method and apparatus for electronic touch mapping |
| US4649784A (en)* | 1985-01-31 | 1987-03-17 | Robert G. Fulks | Method and apparatus for sensing activity for a keyboard and the like |
| US4687885A (en) | 1985-03-11 | 1987-08-18 | Elographics, Inc. | Electrographic touch sensor with Z-axis capability |
| DE3536539A1 (en)* | 1985-10-12 | 1987-04-16 | Preh Elektro Feinmechanik | KEY SWITCH DEVICE |
| US4739299A (en) | 1986-01-17 | 1988-04-19 | Interlink Electronics, Inc. | Digitizer pad |
| US4810992A (en) | 1986-01-17 | 1989-03-07 | Interlink Electronics, Inc. | Digitizer pad |
| GB2204131B (en) | 1987-04-28 | 1991-04-17 | Ibm | Graphics input tablet |
| JPH01282802A (en) | 1988-05-09 | 1989-11-14 | Toshiba Silicone Co Ltd | Pressure-sensitive resistance element |
| US5231386A (en)* | 1990-07-24 | 1993-07-27 | Home Row, Inc. | Keyswitch-integrated pointing assembly |
| US5008497A (en) | 1990-03-22 | 1991-04-16 | Asher David J | Touch controller |
| NZ239802A (en)* | 1990-09-21 | 1993-09-27 | Merrell Dow Pharma | A superior tasting pharmaceutical composition having porous particles produced through in situ gas generation and a process for its production |
| US5159159A (en) | 1990-12-07 | 1992-10-27 | Asher David J | Touch sensor and controller |
| US5227590A (en) | 1991-05-17 | 1993-07-13 | Ncr Corporation | Handwriting capture device |
| US5942733A (en) | 1992-06-08 | 1999-08-24 | Synaptics, Inc. | Stylus input capacitive touchpad sensor |
| US5296837A (en) | 1992-07-10 | 1994-03-22 | Interlink Electronics, Inc. | Stannous oxide force transducer and composition |
| US5431064A (en)* | 1992-09-18 | 1995-07-11 | Home Row, Inc. | Transducer array |
| US5659334A (en) | 1993-12-15 | 1997-08-19 | Interlink Electronics, Inc. | Force-sensing pointing device |
| US6087925A (en)* | 1995-06-29 | 2000-07-11 | Devolpi; Dean | Joystick pointing device |
| US5989700A (en) | 1996-01-05 | 1999-11-23 | Tekscan Incorporated | Pressure sensitive ink means, and methods of use |
| US6351205B1 (en)* | 1996-07-05 | 2002-02-26 | Brad A. Armstrong | Variable-conductance sensor |
| US5943044A (en) | 1996-08-05 | 1999-08-24 | Interlink Electronics | Force sensing semiconductive touchpad |
| US6137475A (en) | 1998-05-21 | 2000-10-24 | Cts Corporation | Pointing stick having an interposer connecting layer |
| LU90286B1 (en)* | 1998-09-11 | 2000-03-13 | Iee Sarl | Force transducer |
| US6331849B1 (en) | 1999-02-25 | 2001-12-18 | Cts Corporation | Integrated surface-mount pointing device |
| US6225814B1 (en) | 1999-04-13 | 2001-05-01 | Tekscan, Inc | Contact width sensors |
| US6404323B1 (en)* | 1999-05-25 | 2002-06-11 | Varatouch Technology Incorporated | Variable resistance devices and methods |
| US6323840B1 (en) | 1999-09-17 | 2001-11-27 | Cts Corporation | Surface-mount pointing device |
| US6121869A (en)* | 1999-09-20 | 2000-09-19 | Burgess; Lester E. | Pressure activated switching device |
| US6313731B1 (en) | 2000-04-20 | 2001-11-06 | Telefonaktiebolaget L.M. Ericsson | Pressure sensitive direction switches |
| JP3902134B2 (en)* | 2001-01-22 | 2007-04-04 | エランテック デバイシーズ コーポレイション | Stress sensor |
- 2002
- 2002-02-05USUS10/067,952patent/US6909354B2/ennot_activeExpired - Lifetime
- 2002-02-07AUAU2002243885Apatent/AU2002243885A1/ennot_activeAbandoned
- 2002-02-07JPJP2002562959Apatent/JP4261186B2/ennot_activeExpired - Fee Related
- 2002-02-07WOPCT/US2002/003675patent/WO2002063261A2/enactiveApplication Filing
- 2002-02-07EPEP02709401Apatent/EP1364220A4/ennot_activeWithdrawn
- 2005
- 2005-02-16USUS11/058,939patent/US7213323B2/ennot_activeExpired - Lifetime
Patent Citations (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4652998A (en)* | 1984-01-04 | 1987-03-24 | Bally Manufacturing Corporation | Video gaming system with pool prize structures |
| US4598181A (en)* | 1984-11-13 | 1986-07-01 | Gte Communication Systems Corp. | Laminate switch assembly having improved tactile feel and improved reliability of operation |
| US20020055384A1 (en)* | 1992-03-05 | 2002-05-09 | Armstrong Brad A. | Proportional controls used with displayed imagery |
| US20020024503A1 (en)* | 1992-03-05 | 2002-02-28 | Armstrong Brad A. | Controller with variable sensor(s) |
| US5357065A (en)* | 1992-07-10 | 1994-10-18 | Fujitsu Limited | Circuit unit for electronic instrument having key-pad arrangement |
| US5302936A (en)* | 1992-09-02 | 1994-04-12 | Interlink Electronics, Inc. | Conductive particulate force transducer |
| US6047127A (en)* | 1993-06-24 | 2000-04-04 | Nintendo Co. Ltd. | Electronic Entertainment and communications system |
| US5851149A (en)* | 1995-05-25 | 1998-12-22 | Tech Link International Entertainment Ltd. | Distributed gaming system |
| US5762552A (en)* | 1995-12-05 | 1998-06-09 | Vt Tech Corp. | Interactive real-time network gaming system |
| US6184124B1 (en)* | 1996-04-11 | 2001-02-06 | Mitsubishi Denki Kabushiki Kaisha | Method of making embedded wiring system |
| US6102802A (en)* | 1997-10-01 | 2000-08-15 | Armstrong; Brad A. | Game controller with analog pressure sensor(s) |
| US6115030A (en)* | 1997-12-18 | 2000-09-05 | International Business Machines Corporation | Trackpoint device |
| US6208271B1 (en)* | 1998-09-04 | 2001-03-27 | Brad A. Armstrong | Remote controller with analog button(s) |
| US6294982B1 (en)* | 1999-02-10 | 2001-09-25 | Symon Communications, Inc. | Visual messaging system for high speed networks |
| US20030109306A1 (en)* | 1999-06-18 | 2003-06-12 | Karmarkar Jayant S. | Restricted episode distribution with repeated biometric authentication |
| US20020007677A1 (en)* | 1999-12-17 | 2002-01-24 | Coates Joann M. | Printed circuit board inclinometer/accelerometer |
| US20020192939A1 (en)* | 1999-12-27 | 2002-12-19 | Hoya Corporation | Method of manufacturing a contract element and a multi-layered wiring substrate, and wafer batch contact board |
| US20030083118A1 (en)* | 2000-04-14 | 2003-05-01 | Nelson David C. | Method, apparatus and system for an electronically distributed game of skill |
| US20020151363A1 (en)* | 2001-04-12 | 2002-10-17 | Howard Letovsky | Method and system for broadcast and control of a remotely located wagering device |
| US6590177B2 (en)* | 2001-06-01 | 2003-07-08 | Fujikura Ltd. | Membrane switch and pressure sensitive sensor |
| US20030078103A1 (en)* | 2001-09-28 | 2003-04-24 | Igt | Game development architecture that decouples the game logic from the graphics logic |
| US20030104856A1 (en)* | 2001-12-05 | 2003-06-05 | International Game Technology | Method for representing a game as a unique number |
| US6756555B2 (en)* | 2001-12-21 | 2004-06-29 | Silitek Corporation | Portable keyboard |
| US20040130528A1 (en)* | 2003-01-07 | 2004-07-08 | Baker Jeffrey R. | Miniature highly manufacturable mouse pointing device |
Cited By (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040130528A1 (en)* | 2003-01-07 | 2004-07-08 | Baker Jeffrey R. | Miniature highly manufacturable mouse pointing device |
| US7050045B2 (en) | 2003-01-07 | 2006-05-23 | Interlink Electronics, Inc. | Miniature highly manufacturable mouse pointing device |
| US20040239474A1 (en)* | 2003-05-30 | 2004-12-02 | Dunn Gregory J. | Polymer thick film resistor, layout cell, and method |
| US7038571B2 (en)* | 2003-05-30 | 2006-05-02 | Motorola, Inc. | Polymer thick film resistor, layout cell, and method |
| US6874378B2 (en) | 2003-07-30 | 2005-04-05 | Delphi Technologies, Inc. | Pressure transducer |
| US20050022616A1 (en)* | 2003-07-30 | 2005-02-03 | Delphi Technologies, Inc. | Pressure transducer |
| US20050057521A1 (en)* | 2003-09-16 | 2005-03-17 | Microsoft Corporation | Method for processing data quantifying force applied to one or more keys of a computer keyboard |
| US7256768B2 (en) | 2003-09-16 | 2007-08-14 | Microsoft Corporation | Computer keyboard with quantitatively force-sensing keys |
| US8648812B2 (en) | 2003-09-16 | 2014-02-11 | Microsoft Corporation | Method for processing data quantifying force applied to one or more keys of a computer keyboard |
| US20050057514A1 (en)* | 2003-09-16 | 2005-03-17 | Microsoft Corporation | Quantitatively force-sensing computer keyboard |
| US20050057515A1 (en)* | 2003-09-16 | 2005-03-17 | Microsoft Corporation | Computer keyboard with quantitatively force-sensing keys |
| US7417626B2 (en) | 2003-09-16 | 2008-08-26 | Microsoft Corporation | Method for processing data quantifying force applied to one or more keys of a computer keyboard |
| US7123241B2 (en) | 2003-09-16 | 2006-10-17 | Microsoft Corporation | Quantitatively force-sensing computer keyboard |
| US7584016B2 (en)* | 2003-09-30 | 2009-09-01 | Intrinsic Marks International Llc | Item monitoring system and methods |
| US20050131578A1 (en)* | 2003-09-30 | 2005-06-16 | Intrinsic Marks International Llc | Item monitoring system and methods |
| KR101162787B1 (en)* | 2004-02-10 | 2012-07-04 | 모토로라 모빌리티, 인크. | Electronic device with force sensing key |
| US20060007172A1 (en)* | 2004-06-23 | 2006-01-12 | Interlink Electronics, Inc. | Force sensing resistor with calibration element and method of manufacturing same |
| US7113179B2 (en) | 2004-06-23 | 2006-09-26 | Interlink Electronics, Inc. | Force sensing resistor with calibration element and method of manufacturing same |
| US20080314165A1 (en)* | 2005-06-16 | 2008-12-25 | Rosenberg Ilya D | Method for Manufacturing Long Force Sensors Using Screen Printing Technology |
| US20090143174A1 (en)* | 2005-06-16 | 2009-06-04 | Brandt Richard A | Automated line calling system |
| US7984544B2 (en)* | 2005-06-16 | 2011-07-26 | Ilya D. Rosenberg | Method for manufacturing long force sensors using screen printing technology |
| US7791596B2 (en) | 2005-12-27 | 2010-09-07 | Interlink Electronics, Inc. | Touch input device having interleaved scroll sensors |
| US20070146349A1 (en)* | 2005-12-27 | 2007-06-28 | Interlink Electronics, Inc. | Touch input device having interleaved scroll sensors |
| US7573464B2 (en) | 2006-07-20 | 2009-08-11 | Interlink Electronics, Inc. | Shape adaptable resistive touchpad |
| US20080018609A1 (en)* | 2006-07-20 | 2008-01-24 | Interlink Electronics, Inc. | Shape adaptable resistive touchpad |
| US9130572B2 (en) | 2011-08-30 | 2015-09-08 | Yamaha Corporation | Controller provided with touch detection device including movable and fixed contact patterns |
| EP2571019A1 (en)* | 2011-08-30 | 2013-03-20 | Yamaha Corporation | Controller provided with touch detection device |
| CN103076885A (en)* | 2011-08-30 | 2013-05-01 | 雅马哈株式会社 | Controller provided with touch detection device |
| US20140032136A1 (en)* | 2012-07-27 | 2014-01-30 | Tactonic Technologies, Llc | Method for Mechanical Sensing Utilizing Controlled Current |
| US10527505B2 (en)* | 2012-07-27 | 2020-01-07 | Tactonic Technologies, Llc | Method for mechanical sensing utilizing controlled current |
| US20240272022A1 (en)* | 2012-07-27 | 2024-08-15 | Tactonic Technologies, Llc | Method for Mechanical Sensing Utilizing Controlled Current |
| EP3246685A4 (en)* | 2015-01-14 | 2018-05-23 | Nippon Mektron, Ltd. | Pressure-sensitive element, pressure sensor, and method for manufacturing pressure-sensitive element |
| EP3050745A1 (en)* | 2015-01-27 | 2016-08-03 | Kendrion Kuhnke Automotive GmbH | Pneumatic control and measuring apparatus and seat comfort system |
| CN105824327A (en)* | 2015-01-27 | 2016-08-03 | 康德瑞恩昆科汽车有限公司 | Pneumatic Control and Measuring Device as well as Seat Comfort System |
| US10073471B2 (en) | 2015-01-27 | 2018-09-11 | Kendrion Kuhnke Automotive GmbH | Pneumatic control and measuring device as well as seat comfort system |
| US10928259B2 (en) | 2016-03-22 | 2021-02-23 | Nissha Co., Ltd. | Pressure sensor |
| WO2018191738A1 (en) | 2017-04-14 | 2018-10-18 | Sensel, Inc. | Selectively adhered resistive force sensor |
| EP3610485A4 (en)* | 2017-04-14 | 2021-01-06 | Sensel, Inc. | Selectively adhered resistive force sensor |
| US11797119B2 (en) | 2017-04-14 | 2023-10-24 | Sensel, Inc. | Selectively adhered resistive force sensor |
| US10408691B2 (en)* | 2017-10-05 | 2019-09-10 | International Business Machines Corporation | Fracture ring sensor |
| US10883886B2 (en) | 2017-10-05 | 2021-01-05 | International Business Machines Corporation | Fracture ring sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002063261A3 (en) | 2002-10-17 |
| EP1364220A2 (en) | 2003-11-26 |
| AU2002243885A1 (en) | 2002-08-19 |
| WO2002063261A2 (en) | 2002-08-15 |
| US7213323B2 (en) | 2007-05-08 |
| US20050156705A1 (en) | 2005-07-21 |
| EP1364220A4 (en) | 2007-06-27 |
| US6909354B2 (en) | 2005-06-21 |
| JP4261186B2 (en) | 2009-04-30 |
| JP2004525360A (en) | 2004-08-19 |
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