US20010040647A1 - Liquid crystal display devices - Google Patents
Liquid crystal display devicesDownload PDFInfo
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- US20010040647A1 US20010040647A1US09/804,350US80435001AUS2001040647A1US 20010040647 A1US20010040647 A1US 20010040647A1US 80435001 AUS80435001 AUS 80435001AUS 2001040647 A1US2001040647 A1US 2001040647A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
Definitions
- the present inventionrelates to liquid crystal displays and manufacturing methods thereof, more specifically to liquid crystal displays having electrode arrays for applying electric fields parallel to substrates and thin film transistors as switching elements and manufacturing methods thereof.
- LCDliquid crystal display
- IPS modein-plane switching mode
- the IPS mode LCD of Kondo et al.has two substrates opposite each other and a liquid crystal layer therebetween. Two kinds of electrodes for generating electric field, common electrodes and pixel electrodes are formed on one of the substrates. An alignment layer is coated on the electrodes.
- the surface of the alignment layermay not be flat, and this causes non-uniform rubbing which may result in light leakage.
- the liquid crystal display of Kondo et al.in particular, transistors of the liquid crystal display are easily defected by the electrostatic discharge because the two electrodes are formed together on a single substrate.
- the thickness of the single conductive layer forming a pixel electrodemay be equal to or less than 1,000 ⁇ . It is more preferable that the thickness of the single conductive layer is equal to or less than 500 ⁇ .
- the double layer forming a data linemay include a lower layer, which is the same as the pixel electrode, and an upper layer having a low resistivity of 15 ⁇ cm or less.
- the single layer or the lower layer of the double layermay be formed using a metal having a low resistivity of 15 ⁇ cm or less, and the upper layer may be formed by a pad material which is not easily broken in the manufacturing process.
- a passivation layer which is thick relative to the pixel wiremay have relatively flat surface since the pixel wire is relatively thin.
- the flat surfacemay give rise to uniform rubbing and thus the light leakage may be reduced.
- a common signal wire and a gate wireincluding a gate line, a gate electrode, a gate pad and a gate line connector on a substrate, forming a gate insulating layer over the common signal wire and the gate wire, forming a channel layer and an ohmic contact layer thereon, forming a pixel electrode and a data wire including a source and a drain electrodes, a data line, a data pad and a data line connector using a first conductive layer, forming a passivation layer on the data wire and the pixel electrode, forming a redundant data wire including a redundant data line, a redundant data pad and a redundant data line connector, a redundant gate pad and a redundant gate line connector using a second conductive layer.
- the redundant data wireis electrically connected to the data wire through the contact holes formed in the passivation layer.
- the redundant gate pad and the redundant gate line connectorare connected to the gate pad and the gate line connector respectively through the contact holes formed in the gate insulating layer and the passivation layer.
- the redundant gate line connector and the redundant data line connectorare connected with each other to short-circuit the gate lines and the data lines on the substrate.
- an alignment layeris printed and rubbed, and the gate line connector and the data line connector are removed by cutting out the edge of the panel.
- the pixel electrodemay be formed in the step of forming redundant data wire using the second conductive layer instead of the first conductive layer, and the thickness of the pixel electrode may be equal to or less than 500 ⁇ .
- the redundant data wiremay be formed as a single or a double layer, and the single layer or the upper layer of the double layer may be formed using a pad material which is not easily broken in the manufacturing process.
- FIG. 1is a layout view of a panel for a liquid crystal display according to the first embodiment of the present invention.
- FIG. 2shows a cross-sectional view of the panel illustrated in FIG. 1 taken along the line II-II′.
- FIGS. 3 A- 3 Dare cross-sectional views of the intermediate structures of the panel shown in FIGS. 1 and 2 in the manufacturing steps.
- FIG. 4is a schematic diagram of the LCD panel according to the second embodiment of the present invention.
- FIG. 5shows a layout view of a panel for a liquid crystal display according to the second embodiment of the present invention.
- FIGS. 6 - 10are cross-sectional views of the panel shown in FIG. 5 taken along the lines VI-VI′, VII-VII′, VIII-VIII′, IX-IX′ and X-X′ respectively.
- FIGS. 11 A- 14 Eare cross-sectional views of the intermediate structures of the panel shown in FIGS. 4 - 10 in the manufacturing steps.
- FIGS. 15 A- 17 Eare cross-sectional views of the intermediate structures of the panel for a liquid crystal display according to another embodiment of the present invention.
- FIG. 18shows a layout view of a panel for liquid crystal display according to another embodiment of the present invention.
- FIGS. 19 - 23are cross-sectional views of the panel shown in FIG. 18 taken along the lines XIX-XIX′, XX-XX′, XXI-XXI′, XXII-XXII′ and XXIII -XXIII′ respectively.
- FIG. 1is a layout view of a panel
- FIG. 2is a cross-sectional view of the panel illustrated in FIG. 1 taken along the line II-II′.
- a gate wire including a transverse gate line 200 and a gate electrode 210 which is a branch of the gate line 200is formed on a substrate 100 .
- a common signal wire including a common signal line 300 parallel to the gate line 200 and a plurality of linear common electrodes 310 connected to the common signal line 300is also formed on the substrate 100 .
- the common electrodes 310extend toward the gate line 200 , and they are spaced apart from each other and parallel to each other.
- a gate insulating layer 400is formed over the gate wire 200 and 210 and the common signal wire 300 and 310 .
- a channel layer 800 and an ohmic contact layer 910 and 920are sequentially formed on a portion of the gate insulating layer 400 over the gate electrode 210 .
- the ohmic contact layerhas two portions 910 and 920 separated from each other with respect to the gate electrode 210 .
- a longitudinal data line 500are formed on the gate insulating layer 300 , and a source electrode 510 , a branch of the data line 500 extending to the gate electrode 210 , is formed on one portion 910 of the ohmic contact layer.
- the data line 500intersects the gate line 200 near the gate electrode 210 , and has a double-layered structure including a lower chromium layer 501 of about 500 ⁇ and an upper aluminum layer 502 of about 2,000 ⁇ , while the source electrode 210 has a single chromium layer.
- a pixel wire including a transverse pixel electrode line 600 and a plurality of pixel electrodes 610 which are branches of the pixel electrode line 600 extending toward the common signal line 300is also formed between the gate line 20 and the common electrode line 300 .
- the pixel electrodes 610 and the common electrodes 310are parallel and spaced apart.
- a drain electrode 620which is connected to an end portion of the pixel electrode line 600 , is formed on the other portion 920 of the ohmic contact layer.
- the pixel wire 600 and 610 and the drain electrode 620are formed of a single chromium layer of about 500 ⁇ .
- a passivation layer 700is formed over the pixel wire 600 and 610 , the data line 500 , the source and the drain electrodes 510 and 620 .
- the data line 500has a double-layered structure, although the pixel wire 600 and 610 is relatively thin, for example, has thickness of around 500 ⁇ , the data line 500 may not be easily opened. Accordingly, the passivation layer 700 which is thick relative to the pixel wire 600 and 610 may have relatively flat surface. The flat surface may give rise to uniform rubbing and thus the light leakage may be reduced.
- the measured contrast ratio of the liquid crystal display according to the first embodiment of the present inventionis about 120, while that in the conventional liquid crystal displays is about 60.
- the thickness of the pixel wire 600 and 610may be equal to or less than 1,000 ⁇ , and that of the passivation layer 700 may be 2,000-4,000 ⁇ such that the passivation layer 700 has a relatively flat surface. It is more preferable that the thickness of the pixel wire 600 and 610 is equal to or less than 500 ⁇ . Although the small thickness of the pixel wire 600 and 610 may cause relatively large resistance, it may be allowed for the LCD.
- the lower layer 501 and the upper layer 502 forming the data line 500are not restricted to chromium and aluminum respectively.
- the lower layer 501may be made of a conductive material having low resistivity of 15 ⁇ cm or less, and the upper layer 502 may be made of a pad material which is not easily broken in the manufacturing process.
- FIGS. 3 A- 3 Dare cross-sectional views of the intermediate structures of the panel shown in FIGS. 1 and 2 in the manufacturing steps.
- a metal layeris deposited and patterned to form a gate wire 200 and 210 and a common signal wire 300 and 310 , as shown in FIG. 3A.
- a gate insulating layer 400 , an intrinsic amorphous silicon layer 800 and a doped amorphous silicon layer 900are deposited in sequence, and as shown in FIG. 3B, the intrinsic and the doped amorphous silicon layers are patterned together.
- a chromium layer 600 of around 500 ⁇ and an aluminum layer of around 2,000 ⁇are deposited in sequence.
- the aluminum layeris patterned to form an upper layer 502 of a data line 500 .
- the chromium layer 600is patterned to form a lower layer 501 of the data line 500 , a source electrode 510 , a drain electrode 620 and a pixel wire 600 and 610 .
- the doped amorphous silicon layer 900is etched to form an ohmic contact layer 910 and 920 using the source and the drain electrodes 510 and 620 and the data line 500 as a mask.
- a passivation layer 700is deposited thereon, as shown in FIG. 2.
- a pixel wire and a data wirehave small thickness and a relatively thick redundant data pattern connected to the data wire is provided on a passivation layer.
- FIG. 4is a schematic diagram of the LCD panel according to the second embodiment.
- a plurality of gate lines 20 extending in a transverse directionare formed on a substrate 100 , and a plurality of common signal lines 10 on the substrate 100 are arranged parallel to the gate lines 20 .
- a plurality of gate pads 22which are connected to external gate drivers (not shown), are formed to be connected to the ends of the gate lines 20 .
- a gate line connector 24is formed in a longitudinal direction and connected to the gate pads 22 via its branches.
- a plurality of data lines 60 extending in the longitudinal directionintersect and are insulated from the gate lines 20 and the common signal lines 10 .
- a plurality of data pads 63which are connected to external data drivers (not shown), are formed to be connected to the ends of the data lines 60 .
- a data line connector 64is formed in the transverse direction and connected to the data pads 63 via its branches.
- the gate line connector 24 and the data line connector 64are connected to each other so that all the wires including the gate lines 20 and the data lines 60 on the substrate 100 are short-circuited.
- This structurecauses the electrostatic charges generated during the manufacturing process to be spread over the substrates, thereby protecting thin film transistors effectively.
- the wiresare separated by cutting out the gate and the data line connectors 24 and 64 along the dotted line 200 in FIG. 4.
- a pixel regionis defined by the gate lines 20 and the data lines 60 , and the substrate 100 includes a plurality of pixels.
- a linear pixel electrode and a linear common electrode, not shown in FIG. 4,are formed alternately in the pixel region, and a thin film transistor connected to the gate line, the data line and the pixel electrode is also formed in the pixel region.
- FIG. 5shows a layout view of a panel for a liquid crystal display according to the second embodiment of the present invention.
- FIGS. 6 10are cross-sectional views of the panel shown in FIG. 5 taken along the lines VI-VI′, VII-VII′, VIII-VIII′, IX-IX′ and X-X′ respectively.
- a plurality of gate lines 20 extending in a transverse directionare formed on a transparent insulating substrate 100 .
- the end portions of the gate lines 20are enlarged to form gate pads 22 , and several portions of the gate lines 20 serve as gate electrodes 21 .
- a gate line connector 24 extending in a longitudinal directionis formed on the substrate 100 and connected to the gate pads 22 via its branches.
- a pair of common signal lines 10 and a plurality of spaced apart linear common electrodes 11 connected to both the common signal lines 10are formed between the gate lines 20 on the substrate 100 .
- the common electrodes 11extend in the longitudinal direction and are parallel to each other.
- a gate insulating layer 30 made of insulator such as silicon nitrideis formed over a gate wire 20 , 21 , 22 and 24 and a common signal wire 10 and 11 .
- a plurality of channel layers 40 made of semiconductor such as amorphous siliconare formed on portions of the gate insulating layer 30 over the gate electrodes 21 .
- a plurality of ohmic contact layers 51 and 52 made of a material reducing the contact resistance between the channel layers 40 and wires thereon such as heavily doped amorphous siliconare formed on the amorphous silicon layers 40 , and each ohmic contact layer is divided into two portions 51 and 52 with respect to the gate electrode 21 .
- a plurality of data lines 60are formed on the gate insulating layer 30 and extend longitudinally. The end portions of the data lines 60 are enlarged to form a plurality of data pads 63 .
- a plurality of source electrodes 61 connected to the data lines 60 and drain electrodes 62are formed on the respective portions of the ohmic contact layers 51 and 52 .
- a pair of the pixel electrode lines 66are formed on the gate insulating layer 30 and overlap the common signal lines 10 .
- Linear pixel electrodes 65 connected to both the pixel electrode lines 66are also formed on the gate insulating layer 30 and each pixel electrode 65 is placed between adjacent two of the common electrodes 11 .
- a transverse data line connector 64is formed on the gate insulating layer 30 and connected to the data pads 63 via its branches.
- the gate electrode 21 , the gate insulating layer 30 , the amorphous silicon layer 40 , the ohmic contact layer 51 and 52 , and the source and the drain electrodes 61 and 62form a thin film transistor for switching the display signals from the data line 60 responsive to the scanning signal from the gate line 10 .
- the source electrode 61is U-shaped while the drain electrode 62 is linear. The end of the drain electrode 62 is placed pointing towards the convex part of the source electrode 61 . This arrangement of the source and the drain electrodes 61 and 62 enlarge the on current of the TFT.
- a passivation layer 70 made of silicon nitride or the likeis formed over the thin film transistor and the remaining data wire 60 , 63 , 64 and 65 .
- the passivation layer 70has contact holes 71 , 73 and 75 which expose the midportions of the data line 60 , the data pad 63 and the data line connector 64 respectively.
- the passivation layer 70 and the gate insulating layerhave contact holes 72 and 74 exposing the pate pads 22 and the gate line connector 24 .
- a conductor pattern 80 and 83 which has the similar shape to the data wire 60 and 63is formed on the passivation layer 70 and connected to the data wire 60 and 63 through the contact holes 71 and 73 in the passivation layer 70 . Therefore, the conductor pattern 80 and 83 functions as a redundant data wire.
- Another conductor pattern having a transverse portion 85 and a longitudinal portion 84 connected to each otheris formed on the passivation layer 70 .
- the transverse portion 85has branches connected to the conductor pattern 83 and connected to the data line connector 64 via the contact holes 75 , and the longitudinal portion 84 is connected to the gate line connector 24 through the contact holes 74 .
- Conductor patters 82are also formed on the passivation layer 70 and connected to the gate pads 22 through the contact holes 72 .
- FIGS. 11 A- 14 Eare cross-sectional views of the intermediate structures of the panel shown in FIGS. 4 - 10 in the manufacturing steps.
- the manufacturing method according to the second embodimentuses 5 masks.
- the figures having the view numbers including the capital letters A, B, C, D and E following Arabic numeralscorrespond to the FIGS. 6 - 10 , respectively.
- a metal layer of 3,000 ⁇is deposited and patterned using a first mask to form a gate wire including a gate line 20 , a gate electrode 21 , a gate pad 22 and a gate line connector 24 and a common signal wire including a common signal line 10 and common electrodes 11 .
- the gate wire and the common signal wiremay be a single layer of chromium, aluminum, aluminum alloy, or molybdenum, etc., or may have a double-layered structure composed of two metal layers.
- a gate insulating layer 30made of silicon nitride or organic insulating material, etc., a hydrogenated amorphous silicon layer 40 and an n+ hydrogenated amorphous silicon layer 50 heavily doped with n type impurities such as phosphorous are deposited in sequence.
- the thickness of the three layersare 3,000-5,000 ⁇ , 500-2,000 ⁇ and 500 ⁇ , respectively.
- the doped amorphous silicon layer 50 and the intrinsic amorphous silicon layer 40are photo etched using a second mask to have an island shape on the gate electrode 21 .
- the gate pad and the data padare also covered with the gate insulating layer 30 .
- a metal layer made of chromium, aluminum alloy or molybdenum having thickness of around 500 ⁇ or lessis deposited, and etched using a third mask to form a data wire including a data line 60 , a source and a drain electrodes 61 and 62 , a data pad 63 and a data line connector 64 and a pixel wire including pixel electrodes line 66 (in FIG. 5) and pixel electrodes 65 .
- the exposed portions of the doped amorphous silicon layer 50are removed using the data wire as an etch mask to expose the intrinsic amorphous silicon layer 40 .
- a silicon nitride or an organic insulating material layeris deposited to a thickness of 1,500-2,500 ⁇ to form a passivation layer 70 , and the passivation layer 70 is patterned to form contact holes 71 , 73 and 75 exposing the data line 60 , the data pad 63 and the data line connector 64 respectively.
- Contact holes 72 and 74are also formed by removing portions of the gate insulating layer 30 and the passivation layer 70 on both of the gate pad 22 and the gate line connector 24 .
- a metal layer of 2,000-2,500 ⁇ made of molybdenum, molybdenum alloy or aluminum alloyis deposited and patterned to form conductor patterns 80 , 83 , 85 , 82 and 84 .
- the conductor patterns 80 , 83 , 85 , 82 and 84may have a double-layered structure.
- An alignment layeris coated on the substrate and rubbed.
- the gate line connector and the data line connectorare removed by cutting off their branches.
- the thickness of the pixel electrodeis preferably about 500 ⁇ or less, and that of the redundant data wire is preferably about 2,000-2,500 ⁇ .
- the thin pixel electrodeenables the passivation layer to have flat surface and thus reduces the light leakage due to the non-uniform rubbing.
- the thick redundant data wirehas relatively small resistance, and thus it reduces the resistance of the data wire as well as prevents the open of the data wire.
- the redundant data wireforms an upper layer of the pad region
- a pad material which is not easily broken in the manufacturing processmay be used for the redundant data wire in order to improve the contact characteristic between the pad and the external driving integrated circuits.
- ITOindium tin oxide
- the redundant wiremay have a double-layered structure including an upper ITO layer, such that the contact characteristic between the pad and the external driving integrated circuits is much more improved.
- the pixel wiremay be formed of the same layer as the redundant data wire.
- a gate wire including a gate line 20 , a gate electrode 21 , a gate pad 22 and a gate line connector 24 and a common signal wire including a common signal line 10 and common electrodes 11are formed.
- a gate insulating layer 30 , a hydrogenated amorphous silicon layer 40 and an n+ hydrogenated amorphous silicon layer 50are deposited in sequence.
- the doped amorphous silicon layer 50 and the intrinsic amorphous silicon layer 40are photo etched.
- a data wire 60 , 61 , 62 and 63is formed on the gate insulating layer 30 , and a passivation layer 70 having a contact hole 76 exposing the drain 500 ⁇ or less.
- the pixel wire and the redundant data wiresare preferably formed of a material suitable for pad such as chromium, molybdenum or molybdenum alloy.
- both the gate line connector and the data fine connectorare formed to have redundant wires, and the redundant gate line connector (or the longitudinal portion of the conductor pattern) and the redundant data line connector (or the transverse portion of the conductor pattern) which are formed of the same layer are short-circuited.
- the redundant gate line connector and the redundant data line connectormay not be formed, and a conductor pattern connecting the data line connector and the gate line connector may be formed when the redundant data wire is formed.
- the data wiremay have a open-free structure by forming the data wire as a double-layered structure or forming the redundant data wire.
- the manufacturing processis simple since only 5 masks are used.
- the contact characteristic between the driver IC (integrated circuit) and the padsis improved by using a pad material, which is not broken easily in the manufacturing process, as the pad or the redundant pad.
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Abstract
Description
- (a) Field of the Invention[0001]
- The present invention relates to liquid crystal displays and manufacturing methods thereof, more specifically to liquid crystal displays having electrode arrays for applying electric fields parallel to substrates and thin film transistors as switching elements and manufacturing methods thereof.[0002]
- (b) Description of the Related Art[0003]
- A liquid crystal display (LCD) having an electrode array for generating an electric field which is parallel to substrates (IPS mode; in-plane switching mode) is disclosed in U.S. Pat. No. 5,598,285 of Kondo et al.[0004]
- The IPS mode LCD of Kondo et al. has two substrates opposite each other and a liquid crystal layer therebetween. Two kinds of electrodes for generating electric field, common electrodes and pixel electrodes are formed on one of the substrates. An alignment layer is coated on the electrodes.[0005]
- However, since the two kinds of electrodes are made of different layers and have different thickness, the surface of the alignment layer may not be flat, and this causes non-uniform rubbing which may result in light leakage.[0006]
- Moreover, the liquid crystal display of Kondo et al., in particular, transistors of the liquid crystal display are easily defected by the electrostatic discharge because the two electrodes are formed together on a single substrate.[0007]
- For electrostatic discharge protection, all wires may be short-circuited during the manufacturing process and separated after the manufacture of the panel is completed. However, this method is complicated.[0008]
- In view of the above, it is an object of the present invention to reduce the light leakage of IPS mode liquid crystal displays.[0009]
- It is another object of the present invention to prevent thin film transistors from being destroyed by the electrostatic discharge.[0010]
- It is another object of the present invention to simplify the manufacturing process of IPS mode liquid crystal displays.[0011]
- It is another object of the present invention to decrease the opening of wires.[0012]
- It is another object of the present invention to increase the reliability of the contacts between pads and drivers.[0013]
- These and other objects, features and advantages are provided, according to the present invention, by forming a pixel electrode using a thin single conductive layer, and a data line is formed as a double layer.[0014]
- The thickness of the single conductive layer forming a pixel electrode may be equal to or less than 1,000 Å. It is more preferable that the thickness of the single conductive layer is equal to or less than 500 Å. The double layer forming a data line may include a lower layer, which is the same as the pixel electrode, and an upper layer having a low resistivity of 15 μΩcm or less. The single layer or the lower layer of the double layer may be formed using a metal having a low resistivity of 15 μΩcm or less, and the upper layer may be formed by a pad material which is not easily broken in the manufacturing process.[0015]
- A passivation layer which is thick relative to the pixel wire may have relatively flat surface since the pixel wire is relatively thin. The flat surface may give rise to uniform rubbing and thus the light leakage may be reduced.[0016]
- These and other objects, features and advantages are also provided, according to the present invention, by forming a common signal wire and a gate wire including a gate line, a gate electrode, a gate pad and a gate line connector on a substrate, forming a gate insulating layer over the common signal wire and the gate wire, forming a channel layer and an ohmic contact layer thereon, forming a pixel electrode and a data wire including a source and a drain electrodes, a data line, a data pad and a data line connector using a first conductive layer, forming a passivation layer on the data wire and the pixel electrode, forming a redundant data wire including a redundant data line, a redundant data pad and a redundant data line connector, a redundant gate pad and a redundant gate line connector using a second conductive layer. The redundant data wire is electrically connected to the data wire through the contact holes formed in the passivation layer. The redundant gate pad and the redundant gate line connector are connected to the gate pad and the gate line connector respectively through the contact holes formed in the gate insulating layer and the passivation layer. The redundant gate line connector and the redundant data line connector are connected with each other to short-circuit the gate lines and the data lines on the substrate.[0017]
- After forming the panel, an alignment layer is printed and rubbed, and the gate line connector and the data line connector are removed by cutting out the edge of the panel.[0018]
- The pixel electrode may be formed in the step of forming redundant data wire using the second conductive layer instead of the first conductive layer, and the thickness of the pixel electrode may be equal to or less than 500 Å.[0019]
- The redundant data wire may be formed as a single or a double layer, and the single layer or the upper layer of the double layer may be formed using a pad material which is not easily broken in the manufacturing process.[0020]
- FIG. 1 is a layout view of a panel for a liquid crystal display according to the first embodiment of the present invention.[0021]
- FIG. 2 shows a cross-sectional view of the panel illustrated in FIG. 1 taken along the line II-II′.[0022]
- FIGS.[0023]3A-3D are cross-sectional views of the intermediate structures of the panel shown in FIGS. 1 and 2 in the manufacturing steps.
- FIG. 4 is a schematic diagram of the LCD panel according to the second embodiment of the present invention.[0024]
- FIG. 5 shows a layout view of a panel for a liquid crystal display according to the second embodiment of the present invention.[0025]
- FIGS.[0026]6-10 are cross-sectional views of the panel shown in FIG. 5 taken along the lines VI-VI′, VII-VII′, VIII-VIII′, IX-IX′ and X-X′ respectively.
- FIGS.[0027]11A-14E are cross-sectional views of the intermediate structures of the panel shown in FIGS.4-10 in the manufacturing steps.
- FIGS.[0028]15A-17E are cross-sectional views of the intermediate structures of the panel for a liquid crystal display according to another embodiment of the present invention.
- FIG. 18 shows a layout view of a panel for liquid crystal display according to another embodiment of the present invention.[0029]
- FIGS.[0030]19-23 are cross-sectional views of the panel shown in FIG. 18 taken along the lines XIX-XIX′, XX-XX′, XXI-XXI′, XXII-XXII′ and XXIII -XXIII′ respectively.
- The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the present invention are shown. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity.[0031]
- First, the structure of a panel for a liquid crystal display according to the first embodiment of the present invention will be described. FIG. 1 is a layout view of a panel, and FIG. 2 is a cross-sectional view of the panel illustrated in FIG. 1 taken along the line II-II′.[0032]
- A gate wire including a[0033]
transverse gate line 200 and agate electrode 210 which is a branch of thegate line 200 is formed on asubstrate 100. A common signal wire including acommon signal line 300 parallel to thegate line 200 and a plurality of linearcommon electrodes 310 connected to thecommon signal line 300 is also formed on thesubstrate 100. Thecommon electrodes 310 extend toward thegate line 200, and they are spaced apart from each other and parallel to each other. - A[0034]
gate insulating layer 400 is formed over thegate wire common signal wire - A[0035]
channel layer 800 and anohmic contact layer gate insulating layer 400 over thegate electrode 210. The ohmic contact layer has twoportions gate electrode 210. Alongitudinal data line 500 are formed on thegate insulating layer 300, and asource electrode 510, a branch of thedata line 500 extending to thegate electrode 210, is formed on oneportion 910 of the ohmic contact layer. Thedata line 500 intersects thegate line 200 near thegate electrode 210, and has a double-layered structure including alower chromium layer 501 of about 500 Å and anupper aluminum layer 502 of about 2,000 Å, while thesource electrode 210 has a single chromium layer. On thegate insulating layer 400, a pixel wire including a transversepixel electrode line 600 and a plurality ofpixel electrodes 610 which are branches of thepixel electrode line 600 extending toward thecommon signal line 300 is also formed between thegate line 20 and thecommon electrode line 300. Thepixel electrodes 610 and thecommon electrodes 310 are parallel and spaced apart. Adrain electrode 620, which is connected to an end portion of thepixel electrode line 600, is formed on theother portion 920 of the ohmic contact layer. Thepixel wire drain electrode 620 are formed of a single chromium layer of about 500 Å. - A[0036]
passivation layer 700 is formed over thepixel wire data line 500, the source and thedrain electrodes - Since the[0037]
data line 500 has a double-layered structure, although thepixel wire data line 500 may not be easily opened. Accordingly, thepassivation layer 700 which is thick relative to thepixel wire - The thickness of the[0038]
pixel wire passivation layer 700 may be 2,000-4,000 Å such that thepassivation layer 700 has a relatively flat surface. It is more preferable that the thickness of thepixel wire pixel wire - The[0039]
lower layer 501 and theupper layer 502 forming thedata line 500 are not restricted to chromium and aluminum respectively. Thelower layer 501 may be made of a conductive material having low resistivity of 15 μΩcm or less, and theupper layer 502 may be made of a pad material which is not easily broken in the manufacturing process. - Now, a manufacturing method of the panel according to the first embodiment of the present invention will be described. FIGS.[0040]3A-3D are cross-sectional views of the intermediate structures of the panel shown in FIGS. 1 and 2 in the manufacturing steps.
- A metal layer is deposited and patterned to form a[0041]
gate wire common signal wire - A[0042]
gate insulating layer 400, an intrinsicamorphous silicon layer 800 and a dopedamorphous silicon layer 900 are deposited in sequence, and as shown in FIG. 3B, the intrinsic and the doped amorphous silicon layers are patterned together. - A[0043]
chromium layer 600 of around 500 Å and an aluminum layer of around 2,000 Å are deposited in sequence. As shown in FIG. 3C, the aluminum layer is patterned to form anupper layer 502 of adata line 500. Next, as shown in FIG. 3D, thechromium layer 600 is patterned to form alower layer 501 of thedata line 500, asource electrode 510, adrain electrode 620 and apixel wire amorphous silicon layer 900 is etched to form anohmic contact layer drain electrodes data line 500 as a mask. Apassivation layer 700 is deposited thereon, as shown in FIG. 2. - Now, the second embodiment of the present invention is described, where a pixel wire and a data wire have small thickness and a relatively thick redundant data pattern connected to the data wire is provided on a passivation layer.[0044]
- First, the structure of the panel for a liquid crystal display according to the second embodiment will be described. FIG. 4 is a schematic diagram of the LCD panel according to the second embodiment.[0045]
- As shown in FIG. 4, a plurality of[0046]
gate lines 20 extending in a transverse direction are formed on asubstrate 100, and a plurality ofcommon signal lines 10 on thesubstrate 100 are arranged parallel to the gate lines20. A plurality ofgate pads 22, which are connected to external gate drivers (not shown), are formed to be connected to the ends of the gate lines20. Agate line connector 24 is formed in a longitudinal direction and connected to thegate pads 22 via its branches. A plurality ofdata lines 60 extending in the longitudinal direction intersect and are insulated from the gate lines20 and the common signal lines10. A plurality ofdata pads 63, which are connected to external data drivers (not shown), are formed to be connected to the ends of the data lines60. Adata line connector 64 is formed in the transverse direction and connected to thedata pads 63 via its branches. Thegate line connector 24 and thedata line connector 64 are connected to each other so that all the wires including the gate lines20 and the data lines60 on thesubstrate 100 are short-circuited. - This structure causes the electrostatic charges generated during the manufacturing process to be spread over the substrates, thereby protecting thin film transistors effectively. When manufacture of the panel is completed, the wires are separated by cutting out the gate and the[0047]
data line connectors line 200 in FIG. 4. - In the meantime, a pixel region is defined by the gate lines[0048]20 and the data lines60, and the
substrate 100 includes a plurality of pixels. A linear pixel electrode and a linear common electrode, not shown in FIG. 4, are formed alternately in the pixel region, and a thin film transistor connected to the gate line, the data line and the pixel electrode is also formed in the pixel region. - Now, the structure of the panel according to the second embodiment will be more fully described. FIG. 5 shows a layout view of a panel for a liquid crystal display according to the second embodiment of the present invention. FIGS.[0049]610 are cross-sectional views of the panel shown in FIG. 5 taken along the lines VI-VI′, VII-VII′, VIII-VIII′, IX-IX′ and X-X′ respectively.
- As shown in FIGS.[0050]5-10, a plurality of
gate lines 20 extending in a transverse direction are formed on a transparent insulatingsubstrate 100. The end portions of the gate lines20 are enlarged to formgate pads 22, and several portions of the gate lines20 serve asgate electrodes 21. Agate line connector 24 extending in a longitudinal direction is formed on thesubstrate 100 and connected to thegate pads 22 via its branches. A pair ofcommon signal lines 10 and a plurality of spaced apart linearcommon electrodes 11 connected to both thecommon signal lines 10 are formed between the gate lines20 on thesubstrate 100. Thecommon electrodes 11 extend in the longitudinal direction and are parallel to each other. - A[0051]
gate insulating layer 30 made of insulator such as silicon nitride is formed over agate wire common signal wire - A plurality of channel layers[0052]40 made of semiconductor such as amorphous silicon are formed on portions of the
gate insulating layer 30 over thegate electrodes 21. A plurality of ohmic contact layers51 and52 made of a material reducing the contact resistance between the channel layers40 and wires thereon such as heavily doped amorphous silicon are formed on the amorphous silicon layers40, and each ohmic contact layer is divided into twoportions gate electrode 21. - A plurality of[0053]
data lines 60 are formed on thegate insulating layer 30 and extend longitudinally. The end portions of the data lines60 are enlarged to form a plurality ofdata pads 63. A plurality ofsource electrodes 61 connected to the data lines60 anddrain electrodes 62 are formed on the respective portions of the ohmic contact layers51 and52. A pair of thepixel electrode lines 66 are formed on thegate insulating layer 30 and overlap the common signal lines10.Linear pixel electrodes 65 connected to both thepixel electrode lines 66 are also formed on thegate insulating layer 30 and eachpixel electrode 65 is placed between adjacent two of thecommon electrodes 11. A transversedata line connector 64 is formed on thegate insulating layer 30 and connected to thedata pads 63 via its branches. - The[0054]
gate electrode 21, thegate insulating layer 30, theamorphous silicon layer 40, theohmic contact layer drain electrodes data line 60 responsive to the scanning signal from thegate line 10. Thesource electrode 61 is U-shaped while thedrain electrode 62 is linear. The end of thedrain electrode 62 is placed pointing towards the convex part of thesource electrode 61. This arrangement of the source and thedrain electrodes - A[0055]
passivation layer 70 made of silicon nitride or the like is formed over the thin film transistor and the remainingdata wire passivation layer 70 has contact holes71,73 and75 which expose the midportions of thedata line 60, thedata pad 63 and thedata line connector 64 respectively. In addition, thepassivation layer 70 and the gate insulating layer havecontact holes pate pads 22 and thegate line connector 24. - A[0056]
conductor pattern data wire passivation layer 70 and connected to thedata wire passivation layer 70. Therefore, theconductor pattern transverse portion 85 and alongitudinal portion 84 connected to each other is formed on thepassivation layer 70. Thetransverse portion 85 has branches connected to theconductor pattern 83 and connected to thedata line connector 64 via the contact holes75, and thelongitudinal portion 84 is connected to thegate line connector 24 through the contact holes74. Conductor patters82 are also formed on thepassivation layer 70 and connected to thegate pads 22 through the contact holes72. - A manufacturing method of a panel for a liquid crystal display according to the second embodiment of the present invention will be now described. FIGS.[0057]11A-14E are cross-sectional views of the intermediate structures of the panel shown in FIGS.4-10 in the manufacturing steps. The manufacturing method according to the second embodiment uses 5 masks. The figures having the view numbers including the capital letters A, B, C, D and E following Arabic numerals correspond to the FIGS.6-10, respectively.
- First, as shown in FIGS.[0058]11A-11E, a metal layer of 3,000 Å is deposited and patterned using a first mask to form a gate wire including a
gate line 20, agate electrode 21, agate pad 22 and agate line connector 24 and a common signal wire including acommon signal line 10 andcommon electrodes 11. The gate wire and the common signal wire may be a single layer of chromium, aluminum, aluminum alloy, or molybdenum, etc., or may have a double-layered structure composed of two metal layers. - As shown in FIGS.[0059]12A-12E, a
gate insulating layer 30 made of silicon nitride or organic insulating material, etc., a hydrogenatedamorphous silicon layer 40 and an n+ hydrogenatedamorphous silicon layer 50 heavily doped with n type impurities such as phosphorous are deposited in sequence. The thickness of the three layers are 3,000-5,000 Å, 500-2,000 Å and 500 Å, respectively. The dopedamorphous silicon layer 50 and the intrinsicamorphous silicon layer 40 are photo etched using a second mask to have an island shape on thegate electrode 21. As shown in FIGS. 12C and 12D, the gate pad and the data pad are also covered with thegate insulating layer 30. - As shown in FIGS.[0060]13A-13E, a metal layer made of chromium, aluminum alloy or molybdenum having thickness of around 500 Å or less is deposited, and etched using a third mask to form a data wire including a
data line 60, a source and adrain electrodes data pad 63 and adata line connector 64 and a pixel wire including pixel electrodes line66 (in FIG. 5) andpixel electrodes 65. Then, the exposed portions of the dopedamorphous silicon layer 50 are removed using the data wire as an etch mask to expose the intrinsicamorphous silicon layer 40. - As shown in FIGS.[0061]14A-14E, a silicon nitride or an organic insulating material layer is deposited to a thickness of 1,500-2,500 Å to form a
passivation layer 70, and thepassivation layer 70 is patterned to form contact holes71,73 and75 exposing thedata line 60, thedata pad 63 and thedata line connector 64 respectively. Contact holes72 and74 are also formed by removing portions of thegate insulating layer 30 and thepassivation layer 70 on both of thegate pad 22 and thegate line connector 24. - As shown in FIGS.[0062]6-10, a metal layer of 2,000-2,500 Å made of molybdenum, molybdenum alloy or aluminum alloy is deposited and patterned to form
conductor patterns conductor patterns - An alignment layer is coated on the substrate and rubbed. The gate line connector and the data line connector are removed by cutting off their branches.[0063]
- The liquid crystal display according to the second embodiment of the present invention, the thickness of the pixel electrode is preferably about 500 Å or less, and that of the redundant data wire is preferably about 2,000-2,500 Å. The thin pixel electrode enables the passivation layer to have flat surface and thus reduces the light leakage due to the non-uniform rubbing. The thick redundant data wire has relatively small resistance, and thus it reduces the resistance of the data wire as well as prevents the open of the data wire.[0064]
- In the meantime, since the redundant data wire forms an upper layer of the pad region, a pad material which is not easily broken in the manufacturing process may be used for the redundant data wire in order to improve the contact characteristic between the pad and the external driving integrated circuits. ITO (indium tin oxide) is an example of a pad material.[0065]
- The redundant wire may have a double-layered structure including an upper ITO layer, such that the contact characteristic between the pad and the external driving integrated circuits is much more improved.[0066]
- The pixel wire may be formed of the same layer as the redundant data wire.[0067]
- That is, as shown in FIGS.[0068]15A-16E. A gate wire including a
gate line 20, agate electrode 21, agate pad 22 and agate line connector 24 and a common signal wire including acommon signal line 10 andcommon electrodes 11 are formed. Agate insulating layer 30, a hydrogenatedamorphous silicon layer 40 and an n+ hydrogenatedamorphous silicon layer 50 are deposited in sequence. The dopedamorphous silicon layer 50 and the intrinsicamorphous silicon layer 40 are photo etched. Adata wire gate insulating layer 30, and apassivation layer 70 having acontact hole 76 exposing thedrain 500 Å or less. In this case, the pixel wire and the redundant data wires are preferably formed of a material suitable for pad such as chromium, molybdenum or molybdenum alloy. - In the above embodiments of the present invention, several small portions of the passivation layer on the data wire are removed, and the data wire and the redundant data wire are electrically connected through the removed portions. However, as shown in FIGS.[0069]18-23, a portion of the
passivation layer 70 on thedata wire redundant data wire data wire - In the second embodiment of the present invention, both the gate line connector and the data fine connector are formed to have redundant wires, and the redundant gate line connector (or the longitudinal portion of the conductor pattern) and the redundant data line connector (or the transverse portion of the conductor pattern) which are formed of the same layer are short-circuited. However, one or both of the redundant gate line connector and the redundant data line connector may not be formed, and a conductor pattern connecting the data line connector and the gate line connector may be formed when the redundant data wire is formed.[0070]
- Since the pixel electrode is formed thin in the liquid crystal displays according to the embodiments of the present invention, the height difference of the upper surfaces of the pixel electrodes and of the common electrodes is compensated by the relatively thick passivation layer formed on the pixel electrode. Therefore, the surfaces of the passivation layer and of the alignment layer thereon are flat and thus the uniform rubbing is possible. Accordingly, the contrast ratio increases due to the decrease of the light leakage. The data wire may have a open-free structure by forming the data wire as a double-layered structure or forming the redundant data wire. The manufacturing process is simple since only 5 masks are used. The contact characteristic between the driver IC (integrated circuit) and the pads is improved by using a pad material, which is not broken easily in the manufacturing process, as the pad or the redundant pad.[0071]
- In the drawings and specification, there have been disclosed typical preferred embodiments of the invention and, although specific terms are employed, they are used in a generic and descriptive sense only and not for purposes of limitation, the scope of the invention being set forth in the following claims.[0072]
Claims (38)
1. A liquid crystal display comprising:
a substrate;
a gate wire which is formed on the substrate and includes a gate line and a gate electrode connected to the gate line;
a common signal wire which is formed on the substrate and includes a common signal line separated from the gate line and a common electrode connected to the common signal line;
a gate insulating layer formed over the gate wire and the common signal wire;
a channel layer formed on a portion of the gate insulating layer over the gate electrode;
a pixel electrode formed spaced apart from the common electrode on the gate insulating layer;
a source and a drain electrodes formed on the channel layer and separated from each other;
a data line which is formed on the gate insulating layer and has a thickness larger than a thickness of the pixel electrode; and
a passivation layer covering the pixel electrode, the source and the drain electrodes and the data line.
2. The liquid crystal display of
claim 1
3. The liquid crystal display of
claim 2
the second conductive layer is made of a pad material.
4. The liquid crystal display of
claim 2
5. The liquid crystal display of
claim 4
6. The liquid crystal display of
claim 5
7. The liquid crystal display of
claim 5
8. The liquid crystal display of
claim 7
9. A manufacturing method of a liquid crystal display comprising the steps of:
forming a gate wire and a common signal wire on a substrate;
forming a gate insulating layer over the gate wire and the common wire;
forming a semiconductor layer on the gate insulating layer;
forming a pixel electrode and a data line on the gate insulating layer wherein the thickness of the pixel electrode is smaller than the thickness of the data line; and
forming a passivation layer over the pixel electrode and the data line.
10. The method of
claim 9
11. The method of
claim 10
the second conductive layer is made of a pad material.
12. The method of
claim 10
13. The method of
claim 12
14. The method of
claim 12
15. The method of
claim 14
16. The method of
claim 15
17. A liquid crystal display comprising:
a transparent substrate;
a plurality of gate fines formed on the substrate;
a plurality of main data lines which intersect the gate lines and are insulated from the gate lines, wherein the gate lines and the main data lines define a pixel region;
a common electrode and a pixel electrode which are spaced apart from each other and formed in the pixel region;
an insulating layer which is in contact with the main data line and has a first contact hole;
a redundant data line which overlaps the main data line via the insulating layer and is electrically connected to the main data line through the first contact hole in the insulating layer.
18. The liquid crystal display of
claim 17
a main data pad connected to an end portion of the main data line; and
a redundant data pad formed of the same layer as the redundant data line,
wherein the insulating layer has a second contact hole and the main data pad; and
the redundant data pad are electrically connected through the second contact hole in the insulating layer.
19. The liquid crystal display of
claim 18
20. The liquid crystal display of
claim 17
a main gate pad connected to an end portion of the gate line; and
a redundant gate pad formed of the same layer as the redundant data line and electrically connected to the main gate pad.
21. The liquid crystal display of
claim 20
22. The liquid crystal display of
claim 17
a main gate line connector connecting the gate tines to each other;
a main data line connector connecting the data lines to each other;
a redundant gate line connector which is electrically connected to the main gate line connector and made of the same layer as the redundant data line; and
a redundant data line connector which is electrically connected to the main data line connector and the redundant gate line connector and made of the same layer as the redundant data line.
23. The liquid crystal display of
claim 17
24. The liquid crystal display of
claim 23
25. A liquid crystal display comprising:
a substrate;
a gate line formed on the substrate;
a gate electrode which is formed on the substrate and connected to the gate line;
a common electrode which is formed on the substrate and separated from the gate line;
a gate insulating layer formed over the gate line, the gate electrode and the common electrode;
a channel layer formed on a portion of the gate insulating layer over the gate electrode;
an ohmic contact layer which are formed on the channel layer and has two portions separated from each other respect to the gate electrode;
a source and a drain electrodes formed on respective portions of the ohmic contact layer;
a main data line formed on the gate insulating layer and connected to the source electrode;
a pixel electrode which is formed spaced apart from the common electrode on the gate insulating layer in a pixel region defined by the gate line and the main data line, and connected to the drain electrode;
a passivation layer which covers the source and the drain electrodes, the main data line and the pixel electrode and has a first contact hole exposing the main data line; and
a redundant data line which is formed on the passivation layer and electrically connected to the main data line through the first contact hole,
wherein each pixel has at least one pixel electrode and at least one common electrode.
26. The liquid crystal display of
claim 25
a main data pad connected to an end portion of the main data line; and
a redundant data pad formed of the same layer as the redundant data line,
wherein the passivation layer has a second contact hole; and
the main data pad is electrically connected to the redundant data pad through the second contact hole in the passivation layer.
27. The liquid crystal display of
claim 26
28. The liquid crystal display of
claim 25
a main gate pad connected to an end portion of the gate line; and
a redundant gate pad formed of the same layer as the redundant data line,
wherein the gate insulating layer and the passivation layer has a third contact hole exposing the main gate pad; and
the main gate pad is electrically connected to the redundant gate pad through the third contact hole in the gate insulating layer and the passivation layer.
29. The liquid crystal display of
claim 28
30. The liquid crystal display of
claim 25
a main gate line connector connecting the gate pads to each other;
a redundant gate line connector formed of the same layer as the redundant data line,
wherein the gate insulating layer and the passivation layer has a fourth contact hole exposing the main gate line connector; and
the main gate line connector is electrically connected to the redundant gate line connector through the fourth contact hole in the gate insulating layer and the passivation layer.
31. The liquid crystal display of
claim 30
a main data line connector connecting the data pads to each other; and
a redundant data line connector formed of the same layer as the redundant data line,
wherein the passivation layer has a fifth contact hole;
the main data line connector is electrically connected to the redundant data line connector through the fifth contact hole in the passivation layer; and
the redundant data line connector is connected to the redundant gate line connector.
32. The liquid crystal display of
claim 25
33. A manufacturing method of a liquid crystal display comprising the steps of:
forming a common signal wire and a gate wire which includes a gate line, a gate electrode, a main gate pad and a main gate line connector;
forming a gate insulating layer over the common signal wire and the gate wire;
forming a channel layer and an ohmic contact layer sequentially on the gate insulating layer;
depositing a first conductive layer;
patterning the first conductive layer to form a pixel electrode and a main data wire which includes a source electrode, a drain electrode, a main data line, a main data pad and a main data line connector;
depositing a passivation layer on the pixel electrode and the main data wire;
forming a first and a second contact holes respectively exposing the main data line and the main data pad in the passivation layer;
depositing a second conductive layer; and
patterning the second conductive layer to form a redundant data wire including a redundant data line, a redundant data pad and a redundant data line connector.
34. The method of
claim 33
forming a third and a fourth contact holes respectively exposing the main gate pad and the main gate line connector in the passivation layer and the gate insulating layer; and
forming a redundant gate pad and a redundant gate line connector by patterning the second conductive layer.
35. The method of
claim 34
36. A manufacturing method of a liquid crystal display comprising the steps of:
forming a common signal wire and a gate wire which includes a gate line, a gate electrode, a main gate pad and a main gate line connector;
forming a gate insulating layer over the common signal wire and the gate wire;
forming a channel layer and an ohmic contact layer sequentially on the gate insulating layer;
depositing a first conductive layer;
patterning the first conductive layer to form a main data wire including a source electrode, a drain electrode, a main data line, a main data pad and a main data line connector;
depositing a passivation layer on the main data wire;
forming a first and a second contact holes respectively exposing the main data line and the main data pad in the passivation layer;
depositing a second conductive layer; and
patterning the second conductive layer to form a pixel electrode and a redundant data wire which includes a redundant data line, a redundant data pad and a redundant data line connector.
37. The method of
claim 36
forming a third and a fourth contact holes respectively exposing the main gate pad and the main gate line connector in the passivation layer and the gate insulating layer; and
forming a redundant gate pad and a redundant gate line connector by patterning the second conductive layer.
38. The method of
claim 37
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/804,350US6411358B2 (en) | 1997-11-20 | 2001-03-12 | Liquid crystal display devices |
| US10/140,139US6856372B2 (en) | 1997-11-20 | 2002-05-07 | Liquid crystal display (LCD) devices having redundant patterns |
| US10/891,117US7961263B2 (en) | 1997-11-20 | 2004-07-15 | Liquid crystal displays and manufacturing methods thereof |
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970061456AKR100477142B1 (en) | 1997-11-20 | 1997-11-20 | LCD and its manufacturing method |
| KR97-61456 | 1997-11-20 | ||
| KR98-4562 | 1998-02-16 | ||
| KR1019980004562AKR100277501B1 (en) | 1998-02-16 | 1998-02-16 | LCD and its manufacturing method |
| US09/106,226US6215541B1 (en) | 1997-11-20 | 1998-06-29 | Liquid crystal displays and manufacturing methods thereof |
| US09/804,350US6411358B2 (en) | 1997-11-20 | 2001-03-12 | Liquid crystal display devices |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US09/106,226ContinuationUS6215541B1 (en) | 1997-11-20 | 1998-06-29 | Liquid crystal displays and manufacturing methods thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/140,139ContinuationUS6856372B2 (en) | 1997-11-20 | 2002-05-07 | Liquid crystal display (LCD) devices having redundant patterns |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| US20010040647A1true US20010040647A1 (en) | 2001-11-15 |
| US6411358B2 US6411358B2 (en) | 2002-06-25 |
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| US09/804,350Expired - LifetimeUS6411358B2 (en) | 1997-11-20 | 2001-03-12 | Liquid crystal display devices |
| US10/140,139Expired - LifetimeUS6856372B2 (en) | 1997-11-20 | 2002-05-07 | Liquid crystal display (LCD) devices having redundant patterns |
| US10/891,117Expired - Fee RelatedUS7961263B2 (en) | 1997-11-20 | 2004-07-15 | Liquid crystal displays and manufacturing methods thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| US09/106,226Expired - LifetimeUS6215541B1 (en) | 1997-11-20 | 1998-06-29 | Liquid crystal displays and manufacturing methods thereof |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US10/140,139Expired - LifetimeUS6856372B2 (en) | 1997-11-20 | 2002-05-07 | Liquid crystal display (LCD) devices having redundant patterns |
| US10/891,117Expired - Fee RelatedUS7961263B2 (en) | 1997-11-20 | 2004-07-15 | Liquid crystal displays and manufacturing methods thereof |
Country Status (2)
| Country | Link |
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| US (4) | US6215541B1 (en) |
| TW (1) | TWI266923B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI266923B (en) | 2006-11-21 |
| US20020126232A1 (en) | 2002-09-12 |
| US20040257511A1 (en) | 2004-12-23 |
| US6411358B2 (en) | 2002-06-25 |
| US6856372B2 (en) | 2005-02-15 |
| US6215541B1 (en) | 2001-04-10 |
| US7961263B2 (en) | 2011-06-14 |
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