US11981501B2

Movatterモバイル変換

Info

Publication number: US11981501B2
Application number: US17/433,342
Authority: US
Inventors: Sungjin Kim; Youngho RHO; Jincheol Kim; Byungkyu JANG
Original assignee: Absolics Inc
Current assignee: Absolics Inc
Priority date: 2019-03-12
Filing date: 2020-03-12
Publication date: 2024-05-14
Also published as: CN113424304B; KR102537005B1; WO2020185020A1; CN113424304A; KR20210068578A; US20220048699A1

Abstract

An embodiment relates to a loading cassette and a target substrate loading method to which same is applied. The loading cassette according to the embodiment comprises: an upper plate; a lower plate facing the upper plate while having a space therebetween; an edge support part for connecting the upper plate to the lower plate and supporting the left and right edges of a target substrate; and a rear surface support part for connecting the upper plate to the lower plate and supporting the center and the rear surface-edge of the target substrate.

Description

CROSS-REFERENCE TO RELATED APPLICATION

This application is a U.S. National Stage Application of International Application No. PCT/KR2020/003480, filed on Mar. 12, 2020 which has the benefit of priority to US Provisional Patent Application No. 62/816,984, filed on Mar. 12, 2019, U.S. Provisional Patent Application No. 62/816,995, filed on Mar. 12, 2019, U.S. Provisional Patent Application No. 62/826,105, filed on Mar. 29, 2019, U.S. Provisional Patent Application No. 62/826,122, filed on Mar. 29, 2019, and U.S. Provisional Patent Application No. 62/826,144, filed on Mar. 29, 2019, and all content of the basis application of the above priority is incorporated by the content of this application.

FIELD

An embodiment relates to a loading cassette of a substrate including glass and a method of loading a substrate applied with the same.

A glass substrate for semiconductor packaging is utilized for a high-end packaging substrate, and forms multiple vias in a thin glass substrate for utilizing as a packaging substrate. A glass substrate with a comparatively thin thickness may be fragile to vibration or impact due to its properties, and in a case of a glass substrate with a large area, a sag may occur in a high possibility inside a cassette due to own weight and this may accelerate damage of the glass substrate.

The background art described above is a technical information which has been kept by inventors for deriving example embodiments, or found in a process of deriving example embodiments, and is not necessarily a known art opened to general public before the present application.

RELATED ART DOCUMENTSPatent Documents

Model Utility Right No. 20-0266536 (2002.02.19.)

Korean Patent Publication No. 10-2001-0107033 (2001.12.07.)

DISCLOSURETechnical Problem

Objectives of an embodiment is to provide a loading cassette minimizing impact transmitted to a substrate including glass and particularly being suitable for loading and moving of a glass substrate with a large area, and a method of loading a substrate applied with the same.

Technical Solution

To achieve the above objectives, a loading cassette according to one embodiment includes

an upper plate,

a lower plate facing to the upper plate with an interval,

a loading space between the upper plate and the lower plate and a target substrate being disposed in,

an edge supporting unit for connecting the upper plate and the lower plate and supporting left and right edges of the target substrate, and

a rear supporting unit for connecting the upper plate and the lower plate and supporting a rear edge of the target substrate,

wherein the rear supporting unit includes

a rear frame being connecting the upper plate and the lower plate in a rear surface and

a middle supporting member being protruding to the front direction from the rear frame,

the target substrate is a substrate including a glass substrate which includes or does not include a through hole, and

the middle supporting member controls a maximum sag of the target substrate based on the edge supporting unit (as 0 mm) within 3 mm.

In one embodiment, when a thickness (mm) of the target substrate is expressed as GT, D1 is a distance (mm) between one side of the edge supporting member and the middle supporting unit and the D1 may satisfy below Condition (1) or Condition (2);
When 0.1<GT≤0.5,150≤D1≤275 Condition (1):
When 0.5<GT≤1.5,220≤D1≤330. Condition (2):

In one embodiment, the middle supporting member may include a middle supporting bar, wherein the middle bearing member is disposed at one part of the middle supporting member and the rear frame is near to other part of the middle supporting member, the middle bearing member may be disposed to have gradient to be higher than the other part.

In one embodiment, the edge supporting unit may include

a side frame being connecting the upper plate and the lower plate in both left and right sides respectively, and

an edge supporting member forming a side slot disposed in the rear frame to support the left and right edges of the target substrate and not allowing the target substrate to contact the side frame,

the side slot may be formed in plurality along an up-and-down direction of the side frame with having intervals.

In one embodiment, the middle supporting member may include

a connecting block combined with the rear frame, and

a middle supporting bar being protruding to the front from the connecting block, wherein the left-and-right width of the middle supporting bar is narrower as being distant from the connecting block,

wherein the middle bearing member may be disposed in the middle supporting bar in a number of one, two, or more.

In one embodiment, a length of the middle supporting bar may be ⅓ to ⅔ of the back-and-forth length of the loading space.

In one embodiment, the rear supporting unit may include

a rear frame being connecting the upper plate and the lower plate at the rear surface and having rear inserting slots formed in a left-and-right direction,

a middle supporting member being protruding to the front direction from the rear frame and being combined with the rear inserting slots and having a first area portion and a second area portion, and

a middle bearing member being protruding from the upper surface of the middle supporting member and directly connecting the target substrate to control sag of the target substrate,

wherein the first area portion may be connected to the rear frame and the area of the second area portion may be narrower than the area of the first area portion.

To achieve the above objectives, a method of loading a target substrate according to one embodiment includes

an entering step for carrying in a target substrate to a loading space of a loading cassette;

a supporting step for moving the entire target substrate by fixing at a loading carrier to the loading space with left and right edges of the target substrate placed on an edge supporting unit of the loading cassette according toclaim1 and controlling a maximum sag of the target substrate to be within 3 mm based on the edge supporting unit (as 0 mm) by supporting the target substrate with a middle supporting member in at least one point or more of the middle; and

a completing step for releasing the fixation of the loading carrier and the target substrate,

wherein the target substrate includes a glass substrate with or without a through hole, and

when the thickness (mm) of the target substrate is expressed as GT, D1 which is a distance (mm) between one side of the edge supporting member and the middle supporting member may satisfy below Condition (1) or Condition (2);
When 0.1<GT≤0.5,150≤D1≤275 Condition (1):
When 0.5<GT≤1.5,220≤D1≤330. Condition (2):

To achieve the above objectives, a method of loading a target substrate according to other embodiment includes

a carry-in step for allowing the entire target substrate to enter and be disposed inside a loading space, in which the target substrate is polygonal having L as the length (mm) and W as the width (mm) is carried in the loading space of a cassette, by applying a loading carrier having two or more hands with maintaining variation (D) indicated by below Formula (1) within −15 to +10 mm;

a support step for controlling a maximum sag of the target substrate to be within 3 mm based on the edge supporting unit (as 0 mm) by supporting the target substrate with a middle supporting member in at least one point or more of the middle; and

a completion step of releasing the fixation of the loading carrier and the target substrate and then taking out the loading carrier to the external of the loading cassette,

wherein the target substrate is a glass substrate having many through holes or a substrate for semiconductor packaging in which an electrical conductive pattern and an insulating layer are laminated to the glass substrate, and

when a thickness (mm) of the target substrate is GT, the hands have one or more hand forks respectively and Wa2 (mm) is the shortest interval between hand forks placed on different hands; and below Condition (1) or Condition (2) may be satisfied;
Variation (D)=Inside Height of Target Substrate (Hin,mm)−Outside Height of Target Substrate (Hout,mm) Equation (1):
When 0.1<GT≤0.5,(W/3.4)≤Wa2≤(W/1.8) Condition (1):
When 0.5<GT≤1.5,(W/2.3)≤Wa2≤(W/1.6). Condition (2):

In one embodiment, when the thickness (mm) of the target substrate is GT, Dh (mm) which is an interval between the edge supporting units neighboring to each other in up and down may satisfy below Formula (2);

EFFECTS

According to example embodiments of present application, a cassette which can load a target substrate without occurring a sag of a target substrate and a problem of damage in a substrate due to the sag can be provided, as minimizing damage which can occur during loading, moving, and carrying out of glass even though the target substrate including a glass substrate of a large area with or without a through hole. In addition, a target substrate placed in a loading space can stably keep a loaded state through being supported by an edge supporting unit and a rear supporting unit, and can be protected from impact which can occur during loading, impact added from the external, and the like.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG.1 is a perspective view for showing a loading cassette according to an embodiment of the present application;

FIG.2 is a schematic view for showing a state of a glass substrate loaded in a loading cassette ofFIG.1;

FIG.3 is a cross sectional view cut along a III-III line fromFIG.2;

FIG.4 is an enlarged view of A portion ofFIG.3;

FIG.5 is an enlarged view of a center supporting unit ofFIG.3;

FIG.6 is a perspective view for showing a loading cassette according to one embodiment of the present application;

FIG.7 is a schematic view for showing a glass substrate loaded in a loading cassette ofFIG.6;

FIG.8 is a cross sectional view cut along a VI-VI line fromFIG.7;

FIG.9 is an enlarged view of A portion ofFIG.8;

FIG.10 is an enlarged view of a center supporting unit ofFIG.8;

FIG.11 is a side view for showing a center supporting unit ofFIG.10; and

FIG.12 is a schematic view for showing a state of a center supporting unit ofFIG.11 supporting a glass substrate.

FIG.13 is a conceptual view for illustrating a fork test conducted in the present application;

FIGS.14A and14B are conceptual views for illustrating a loading carrier and a target substrate of the present application, and a sag observed at a-a′, respectively;

FIG.15 is a conceptual view for illustrating a process for a target substrate placed on a loading carrier to be inserted into a loading space;

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that they can be easily practiced by those skilled in the art to which the present disclosure pertains. The embodiments may, however, be embodied in many different forms and is not to be construed as being limited to the embodiments set forth herein. Same reference numerals are designated to similar elements throughout the specification.

Throughout the present specification, the phrase “combination(s) thereof” included in a Markush-type expression denotes one or more mixtures or combinations selected from the group consisting of components stated in the Markush-type expression, that is, denotes that one or more components selected from the group consisting of the components are included.

Throughout the present specification, terms such as “first,” “second,” “A,” or “B” are used to distinguish the same terms from each other. The singular forms “a,” “an,” and “the” include the plural form unless the context clearly dictates otherwise.

In the present specification, the term “X-based” may mean that a compound includes a compound corresponding to X or a derivative of X.

In the present specification, “B being disposed on A” means that B is disposed in direct contact with A or disposed over A with another layer interposed therebetween and thus should not be interpreted as being limited to B being disposed in direct contact with A.

In the present specification, “B being connected to A” means that B is connected to A directly or through another element therebetween, and thus should not be interpreted as being limited to B being directly connected to A, unless otherwise noted.

In the present specification, a singular form is contextually interpreted as including a plural form as well as a singular form unless specially stated otherwise.

In this application, sag is evaluated for a position of a sagged portion from the reference position by mm unit, and expressed in a positive number.

Loading Cassette

1

A loading cassette according to one embodiment will be described with reference toFIGS.1 to5.

FIG.1 is a perspective view for showing a loading cassette according to an embodiment of the present application,FIG.2 is a schematic view for showing a state of a glass substrate loaded in a loading cassette ofFIG.1,FIG.3 is a cross sectional view cut along a III-III line fromFIG.2,FIG.4 is an enlarged view of A portion ofFIG.3, andFIG.5 is an enlarged view of a center supporting unit ofFIG.3.

With reference toFIGS.1 to5, aloading cassette1 according to the present embodiment supports a loaded target substrate G and the like, and comprises anupper plate10, alower plate20, anedge supporting unit40, and arear supporting unit50.

Theloading cassette1 may further comprise afront stopper60.

Theupper plate10 and thelower plate20 have a predetermined area and are apart from each other in an up-and-down direction. Thelower plate20 may be formed by many frames connected in breadth and length directions.

Theupper plate10 and thelower plate20 have an interval maintained by anedge supporting unit40 and arear supporting unit50. And, among them, aloading space30 where a target substrate G is loaded is formed. Here, a loading capacity of theloading space30 may be changed depending on the sizes of theupper plate10 and thelower plate20; and the up-and-down direction lengths of theedge supporting unit40 and therear supporting unit50. The loading capacity, in particularly the sizes of theupper plate10 and thelower plate20 may be changed depending on the standard of the target substrate G.

The target substrate G may be a substrate with a large area, and may be a glass substrate whose thickness is 1 mm or less, or a substrate in which an insulating layer and/or an electrical conductive layer are formed on the glass substrate (or glass substrate having through vias).

The target substrate G may substantially have a quadrangle plate form whose one side is 400 mm or more, but its shape is not limited to a quadrangle plate form.

A target substrate G may have a first surface and a second surface facing each other.

A target substrate G may have a plurality a core via penetrating through the first surface and the second surface.

The core via may include a first opening part in contact with the first surface; a second opening part in contact with the second surface; and a minimum inner diameter part having the smallest inner diameter in the entire core via from the first opening part to the second opening part.

An average diameter of the minimum inner diameter part may be 50 μm to 95 μm.

The minimum inner diameter and satisfies the condition ofEquation 1 below.
0.83×D₉₀≤D₅₀≤1.25×D₁₀ [Equation 1]
In theEquation 1, D₅₀is a value corresponding to 50% in the diameter distribution of the minimum inner diameter, D₉₀is a value corresponding to 90% in the diameter distribution of the minimum inner diameter, and D₁₀is a value corresponding to 10% in the diameter distribution of the minimum inner diameter.

An average diameter of the minimum inner diameter may be 55 μm to 85 μm, or 60 μm to 70 μm.

In further detail, the minimum inner part may satisfy the condition of Equation 1-1 below.
0.83×D₉₀≤D₅₀≤1.25×D₁₀ [Equation 1-1]

In the Equation 1-1, D₅₀is a value corresponding to 50% in the diameter distribution of the minimum inner part, D₉₀is a value corresponding to 90% in the diameter distribution of the minimum inner part, and D₁₀is a value corresponding to 10% in the diameter distribution of the minimum inner part.

In detail, a target opening part which is a larger one between the first surface opening part diameter and the second surface opening part diameter, may have an average diameter of 70 μm to 120 μm.

In detail, a target opening part which is a larger one between the first surface opening part diameter and the second surface opening part diameter may satisfy the condition ofEquation 2 below.
0.9×D₉₀≤D₅₀≤1.1×D₁₀ [Equation 2]

In theEquation 2, D₅₀is a value corresponding to 50% in the diameter distribution of a target opening part, D₉₀is a value corresponding to 90% in the diameter distribution of a target opening part, and D₁₀is a value corresponding to 10% in the diameter distribution of a target opening part.

In detail, a target opening part which is a larger one between the first surface opening part diameter and the second surface opening part diameter, may have an average diameter of 80 μm to 105 μm.

In detail, a target opening part which is a larger one between the first surface opening part diameter and the second surface opening part diameter may satisfy the condition of Equation 2-1 below.
0.92×D₉₀≤D₅₀≤1.08×D₁₀ [Equation 2-1]

In the core via, an average diameter of a target opening part which is a larger one between the first surface opening part diameter—which is a diameter at an opening part in contact with the first surface—and the second surface opening part diameter—which is a diameter at an opening part in contact with the second surface—may have a larger value than D₅₀, which is a value corresponding to 50% in the diameter distribution of a target opening part.

The diameter distribution described above, is evaluated based on a diameter which is observed and measured by microscope in the cross-section, after dividing prepared samples into 9 compartments (3×3), and processing of cutting the samples of 5 areas (top left, bottom left, center, top right, bottom right).

Aloading cassette1 according to an embodiment may load stably a target substrate which has a core via with the above-described diameter distribution and diameter.

In addition, the point at which the minimum inner diameter part is located, when the entire length of the core via is 100%, may be a point of 40% to 60% from the first opening part, and may be a point of 45% to 55%. When the minimum inner diameter part is at the position described above, based on the entire length of core via, the design of electrically conductive layer of packaging substrate and the process of forming electrically conductive layer may be easier. And a loading cassette according to an embodiment can load this fragile target substrate stably.

The core via may be disposed in the number of 100 to 3000, or 100 to 2500, or 225 to 1024 based on a unit area (1 cm×1 cm) of the target substrate. The core via may be disposed at the target substrate in a pitch of 1.2 mm or less, may be disposed in a pitch of 0.12 to 1.2 mm, may be disposed in a pitch of 0.3 to 0.9 mm.

When the core via satisfies the above pitch condition, the formation of an electric conductive layer, etc., and the performance of a packaging substrate can be improved. And a loading cassette according to an embodiment can load this fragile target substrate stably.

The target substrate G may be a stress-controlled glass substrate.

The target substrate G may have a stress difference value (P) according to the below Formula (1) of 1.5 MPa or less; between a stress measured at a plain line which is a line linking places where the core via is not formed, and a stress measured at a via line which is a line linking places where the core via is formed.
P=Vp−Np Formula (1)

In the Formula (1), the P is a stress difference value measured at the same glass substrate, the Vp is a difference between the maximum value and the minimum value of stress measured at a via line, and the Np is a difference between the maximum value and the minimum value of stress measured at a plain line.

The P value may be 1.35 MPa or less, 1.2 MPa or less, or 1.1 MPa or less. Also, the P value may be 0.01 MPa or more, or 0.1 MPa or more.

As a glass substrate in which core vias having a stress difference value (P) in these ranges are formed is applied as a substrate for semiconductor packaging, it is possible to manufacture a packaging substrate having more stable mechanical properties, and a loading cassette according to an embodiment can load this fragile target substrate stably.

The Vp value may be 2.5 MPa or less, or 2.3 MPa or less, and the Vp value may be 2.0 MPa or less, or 1.8 MPa or less. Also, the Vp value may be 0.2 MPa or more, or 0.4 MPa or more.

When a difference (Vp) between the maximum value and the minimum value of stress measured at a via line is in these ranges, and a glass substrate where core vias are formed is applied as a substrate for semiconductor packaging, it is possible to manufacture a packaging substrate having more stable mechanical properties. And a loading cassette according to an embodiment can load this fragile target substrate stably.

The Np value may be 1.0 MPa or less, 0.9 MPa or less, or 0.8 MPa or less. Also, the Np value may be 0.1 MPa or more, or 0.2 MPa or more.

When a difference (Np) between the maximum value and the minimum value of stress measured at a plain line is in these ranges, and a glass substrate where core vias are formed is applied as a substrate for semiconductor packaging, it is possible to manufacture a packaging substrate having more stable mechanical properties. And a loading cassette according to an embodiment can load this fragile target substrate stably.

The glass substrate may satisfy a condition that a stress difference ratio (K) according to below Formula (2) is 6 or less.
K=Lp/La Formula (2):

In the Formula (2), the K is stress difference ratio measured at the same plane of the same glass substrate, the Lp is a difference of the maximum value and the minimum value of stress measured at a target line, and the La is an average value of stress measured at the target line, wherein the target line is selected one from a plain line which is a line linking places where a core via is not formed and a via line which is a line linking places where a core via is formed.

In detail, the K value may be 5 or less, 4.5 or less, or 4 or less. When the K value is in this range, and a target substrate where core vias are formed is applied as a substrate for semiconductor packaging, it is possible to manufacture a packaging substrate having more stable mechanical properties. And a loading cassette according to an embodiment can load this fragile target substrate stably.

The stress difference ratio (K) which is measured at the plain line may have a value of 2 or less. In detail, the stress difference ratio (Kn) of a plain line may be 1.8 or less, more than 0.3, or more than 0.5.

The stress difference ratio (K) which is measured at the via line may have a value of 6 or less, or 5 or less. The stress difference ratio (Kv) of a via line may be 4.5 or less, or 3 or less. Also, the stress difference ratio of a via line may be 0.5 or more, 1.0 or more, or 1.5 or more.

When the stress difference ratio (K) is in these ranges, and a target substrate where core vias are formed is applied as a substrate for semiconductor packaging, it is possible to manufacture a packaging substrate having more stable mechanical properties. And a loading cassette according to an embodiment can load this fragile target substrate stably.

The stress is analyzed by applying a birefringence 2D evaluation device. In detail, the birefringence 2D dispersion evaluation device may be WPA-200 device of NPM (NIPPON PULSE KOREA CO., LTD). In detail, when data are read on a glass substrate along to a stress measuring route by a probe, measured values such as a birefringence value are inputted by the device, and stress at a measuring route is presented by pressure unit (ex. MPa) through a predetermined calculation process. In this time, stress can be measured by inputting a stress-optical coefficient and a thickness of a measuring target, and 2.4 is applied as the stress-optical coefficient in the present disclosure.

Theedge supporting units40 are arranged in a back-and-forth direction (Y) at both left and right sides of theupper plate10 and thelower plate20, and connect theupper plate10 and thelower plate20. And theedge supporting units40 support the edges of both left and right sides of the target substrate G.

Theedge supporting unit40 may comprise a buffer covering layer placed in at least a part of its surface.

Therear supporting unit50 connects theupper plate10 and thelower plate20 by being disposed at the rear of theupper plate10 and thelower plate20.

Therear supporting unit50 is disposed with having a certain distance with the center of the rear or theedge supporting unit40, and thereby controls the target substrate G loaded in theloading space30 not to be sagged by its own weight. In detail, therear supporting unit50 supports at least a part of the target substrate G and thereby prevents the target substrate G overall from sagging.

Thefront stopper60 blocks the target substrate G loaded in theloading space30 not to fall off to the external of theloading space30 at the front of theloading space30.

Thefront stopper60 may comprise a buffer covering layer placed in at least a part of its surface.

The target substrate G of theloading space30 can maintain a stable loaded state by theedge supporting unit40 and therear supporting unit50. And the target substrate G of the loading space can be protected stably from impact which may occur during loading, impact added from external, and the like. Accordingly, damage of the target substrate G which may occur during loading and moving of the target substrate could be minimized.

Theedge supporting unit40 comprises aside frame41, and anedge supporting member42.

Theside frame41 has a predetermined length, its upper side is combined with a side surface of theupper plate10 and its lower side is combined with a side surface of thelower plate20.

Theside frame41 is combined with a fastening means (not shown) like a bolt.

Theside frame41 may be formed with aluminum coated or not coated by a protecting layer or the like. A material of theside frame41 is not limited to aluminum.

Theedge supporting member42 is connected to theside frame41.

Theedge supporting members42 are arranged along an up-and-down direction (Z) of theside frame41 with intervals. Accordingly, aside slot421 is formed between theedge supporting members42 neighboring to each other. A target substrate G inserted to theside slot421 is placed in an upper surface of theedge supporting member42. On the other hand, neighboringedge supporting members42 are connected from each other and their sides are not allowed to contact theside frame41 when the target substrate G is loaded. And theedge supporting member42 may comprise a buffer covering layer in at least a part of the surface thereof.

Therear supporting unit50 may comprise arear frame51, amiddle supporting member52, amiddle bearing member53 and arear stopper54.

Therear frame51 has a predetermined length, its upper side is combined with the rear surface of theupper plate10 and its lower side is combined with the rear surface of thelower plate20.

Therear frame51 is also combined through a fastening means and may be formed with aluminum coated or not coated by a protecting layer or the like.

Therear frame51 may comprise a rearmain bar511 in which holding slots where the connecting blocks are placed are formed along an up-and-down length direction, and astopper combining bar512 which is extended from both sides of the rear main bar to both left and right sides and combined with the rear stopper.

The rearmain bar511 may comprise a holding slot511aconnected to aloading space30. The holding slot511amay be formed along an up-and-down length direction (Z) of the rearmain bar511, and the area of the holding slot511amay become wider in a direction from the inner surface to the opened front.

Thestopper combining bar512 is extended in a left-and-right direction (X) from both sides of the rearmain bar511 and has a preset area.

Thestopper combining bar512 has a plane.

Thestopper combining bar512 is composed in one body with the rearmain bar511 and made with aluminum or the like which is coated or not coated.

Themiddle supporting member52 may comprise a connectingblock521 and amiddle supporting bar522.

The connectingblock521 is placed in a holding slot511aand fixed with a fastening means (not shown).

The connectingblock521 may be not dislocated from the holding slot511a. That is, the connectingblock512 may be placed inside the connectingblock521.

Themiddle supporting bar522 has a preset length, is connected to the rearmain bar511 by the connectingblock521, and protrudes from the connectingblock521 to the front.

The length of themiddle supporting bar522 is equal to or shorter than the length of theloading space30 in a back-and-forth direction Y, and in detail may be formed to be shorter. In detail, the length of the middle supporting bar may be ⅓ to ⅔, or ⅖ to ⅘ of the length from the front to the rear.

Themiddle supporting bar522 supports a target substrate G from at least one or more points, and the supporting point is exemplified as amiddle bearing member53 described in below, but may support the target substrate by oneself.

The position of themiddle supporting bar522 may become gradually high as being far from a connectingblock522, and thereby the height at one point where amiddle supporting bar522 and a target substrate G meet may be higher compared to aside slot421 placed in a position neighboring to each other.

This is considered that a middle supporting bar itself may sag slightly as some of the own weight of a target substrate is added to amiddle supporting bar522 at one point where themiddle supporting bar522 meets the target substrate. Additionally, when themiddle supporting bar522 itself is equipped to have a higher height than aside slot421 placed in a position corresponding to this without such a gradient applied, it may increase a possibility of occurring damage or stain of a target substrate because a contact with amiddle supporting bar522 is caused even in a portion where sag is comparatively small in a target substrate.

That is, some of the own weight of a target substrate is harmoniously dispersed by themiddle supporting bar522 in this manner, and a sag of the target substrate can be more alleviated.

When themiddle supporting bar522 supports a target substrate G from at least one point or more, the variation of the height thereof can be controlled within 3 mm compared to when themiddle supporting bar522 does not support a target substrate G.

For controlling sag to occur within the degree of variation of the height described above in themiddle supporting bar522, the thickness of themiddle supporting bar522 can be modified, and the angle can be modified.

In detail, themiddle supporting bar522 may have a shape in which the area in one side which meets the target substrate is narrower and the area becomes wider as being close to a connectingblock521.

In detail, themiddle supporting bar522 itself or the upper surface thereof may be gradient in a certain angle. The upper surface of themiddle supporting member52 may have an angle at a point which a line from one end combined with the connectingblock521 to the other end contacting with the target substrate and a line parallel to the upper plate or the lower plate meet, and the angle may be 0.1 to 5 degree, or 0.1 to 3 degree. In such a case, a sag of amiddle supporting bar522 can be controlled and a sag of a target substrate G can be more efficiently controlled.

Themiddle supporting members52 may be made with aluminum or the like which is coated or not coated, and are being arranged in an up-and-down direction (Z) in aloading space30. The arranging interval ofmiddle supporting members52 may be substantially the same with the arranging interval ofedge supporting members42.

Themiddle bearing member53 is arranged in an upper surface of amiddle supporting bar522 to protrude to an upper portion and in contact with the center portion of a target substrate G.

Themiddle bearing members53 may be arranged in 1, 2, or more with having intervals along a length direction (Y) of amiddle supporting bar522.

Themiddle bearing member53 may comprise a buffer covering layer placed on at least a part of the surface thereof.

Themiddle supporting member53 may support some of a target substrate of aloading space30 on amiddle supporting member52 along a length direction (Y) thereof, and the target substrate G may control sag of the target substrate which may occur in aloading space30.

When a thickness of a target substrate is GT, D1 which is a distance (mm) between one side of the edge supporting member and the middle supporting member can satisfy a below Condition (1) or Condition (2).
When 0.1<GT≤0.5,150≤D1≤275 Condition (1):
When 0.5<GT≤1.5,220≤D1≤330 Condition (2):

In further detail when the thickness (mm) of the target substrate is GT, D1 which is a distance (mm) between one side of the edge supporting member and the middle supporting member can satisfy a below Condition (1-1) or Condition (2-1).
When 0.2<GT≤0.5,200≤D1≤275 Condition (1-1):
When 0.5<GT≤1.2,230≤D1≤300 Condition (2-1):

Themiddle supporting member52 can control the maximum sag of the target substrate based on the edge supporting unit (0 mm) within 3 mm.

A sag which occurs when themiddle supporting member52 supports the target substrate can be controlled within 3 mm based on when themiddle supporting member52 does not support the target substrate (0 mm).

In further detail, the target substrate G may be a glass substrate or a glass substrate in which a through hole is formed, and a thickness of it may be 0.25 to 0.45 mm D1 as a distance between one end within theedge supporting member42 and themiddle supporting member52 may be applied to be 200 to 275 mm. In such a case, a sag of a target substrate may be controlled within 2 mm, and the target substrate may be stored and moved more stably.

In further detail, the target substrate may be a glass substrate with through holes which has a metal plating layer and/or an insulting layer formed on at least one surface, and the total average thickness may of the target substrate be 0.3 to 1.2 mm, or 0.5 to 0.9 mm D1 as a distance between one end within the edge supporting member and the middle supporting member may be applied to be 230 to 300 mm. In such a case, sag of the target substrate may be controlled within 1 mm, and the target substrate may be stored and moved more stably.

In further detail, the target substrate G may be a glass substrate having a cavity structure or a glass substrate having a cavity structure and through holes, and the thickness of a thick portion not having a cavity structure may be 0.4 to 1 mm, or 0.5 to 0.9 mm. Also, D1 as a distance between one end of the edge supporting member and the middle supporting member may be applied to be 200 to 275 mm. In such a case, a sag of a target substrate may be controlled within 2 mm, and the target substrate may be stored and moved more stably.

In further detail, the target substrate G may be a glass substrate having the cavity structure in which a metal plating layer and/or an insulting layer is formed on at least one surface, and the total average thickness of the target substrate may be 0.5 to 1.3 mm, or 0.7 to 1.2 mm D1 as a distance between one end within theedge supporting member42 and themiddle supporting member52 may be applied to be 230 to 300 mm. In such a case, a sag of a target substrate may be controlled within 1 mm, and the target substrate may be stored and moved more stably.

Arear stopper54 is disposed in aloading space30 and connected to astopper combining bar512.

Therear stoppers54 are arranged along to an up-and-down length direction (Z) of astopper combining bar512. Between neighboringrear stoppers54, arear slot541 where a target substrate G is inserted is prepared, and the neighboringrear stoppers54 are connected from each other. Here, an edge of a rear portion of a target substrate G may be disposed on an upper surface of arear stopper54. In addition, the neighboringrear stoppers54 are connected from each other. Accordingly, the rear part of a target substrate G disposed in arear slot541 is not in contact with astopper combining bar512. Therear stopper54 may comprise a buffer covering layer in at least a part of the surface thereof.

Afront stopper60 may comprise abar member61, aspacer62, arod member63, and astopper member64.

Thespacer62 is protruding to the front by being connected to anedge supporting unit40 placed in the front.

Thespacers62 may be arranged along an up-and-down direction (Z) of theedge supporting unit40.

Thebar member61 has a predetermined length and is being connected to thespacer62.

Thebar member61 faces to theedge supporting unit40 with having an interval by aspacer62.

Therod member63 is being extended to the front from thebar member61 to the edge supporting unit supporting a target substrate G.

Thestopper member64 faces the front (a thickness surface) of a target substrate G placed in theedge supporting member42 with protruding to an up-and-down direction (Z) from an end portion of therod member63. The front of the target substrate G placed in theedge supporting member42 is caught by thestopper member64 and not to be fallen off to the front.

Thefront stopper60 may be arranged along an up-and-down direction of theedge supporting unit40.

Thefront stopper60 may comprise a buffer covering layer placed in at least a part of the surface thereof.

The buffer covering layer may be overall placed in portions contacting with a target substrate G loaded in aloading space30, so that damage of the target substrate G, which can occur in loading or carrying our procedure, can be minimized. Also, when cassette is migrated with taking the target substrate G placed in aloading space30, a movement or damage of the target substrate G could not occur substantially. Accordingly, a loadability of the target substrate G can be increased and a reliability of the loading cassette can be increased.

The buffer covering layer may comprise PTFE (Poly Tetra Fluoro Ethylene), FEP (Flourinated Ethylene Prophylene), PFA (Per Fluoro Alkoxy), or PEEK (polyaryletherketone), and specifically may comprise PEEK (polyaryletherketone).

Theloading cassette1 according to the present disclosure may further comprise aloading carrier70 for loading a target substrate G in aloading space30, or pulling the loaded target substrate G out.

Theloading cassette1 may be one cassette alone, or may be a cassette unit (not shown) formed by stacking theloading cassette1 in a side direction and/or up-and-down direction. When the cassette unit is formed to be applied to storage and migration of a target substrate, a fixing means (not shown) for fixing the loading cassettes neighboring to each other may be further applied, and the fixing means can be applied without limit if it does not disturb insertion and storage of the target substrate.

Theloading carrier70 is being connected to a robot arm (not shown) or the like, and can fix a target substrate G by an absorption method.

Theloading carrier70 allows the target substrate G to be inserted in aside slot421 and places it on anedge bearing member43. On the contrary to this, a target substrate G placed on theedge bearing member43 is lifted for the loaded target substrate G to be carried out from theloading space30.

When theloading carrier70 makes a target substrate G be placed on a depressurizing pad and after that the target substrate G be absorbed, fixed, and moved. For being detached subsequently, a method of releasing a pressure of the depressurizing pad can allow the target substrate G to be separated. In this time, when the depressing pad and the target substrate is not separated properly, compressed air may be added to the depressurizing pad to separate the depressurizing pad and the target substrate more easily.

Loading Cassette

2

With reference toFIGS.6 to12, another embodiment of theloading cassette2 will be described.

FIG.6 is a perspective view for showing a loading cassette according to one embodiment of the present application,FIG.7 is a schematic view for showing a target substrate loaded in a loading cassette ofFIG.6,FIG.8 is a cross sectional view cut along a VIII-VIII line fromFIG.7,FIG.9 is an enlarged view of A portion ofFIG.8,FIG.10 is an enlarged view of a rear supporting unit ofFIG.8, andFIG.11 is an side view for showing a rear supporting unit ofFIG.10.FIG.12 is a schematic view for showing a state of a rear supporting unit ofFIG.11 supporting a target substrate.

With reference toFIGS.6 to12, aloading cassette2 according to another example embodiment comprises anupper plate10, alower plate20, anedge supporting unit40 and arear supporting unit50. Here, theupper plate10 and thelower plate20 is same as an upper plate and a lower plate of aloading cassette1 described above according toFIGS.1 to7, and thus the further description is omitted.

Anedge supporting unit40 comprises aside frame41, anedge supporting member42, and anedge bearing member43. And arear supporting unit50 comprises arear frame51, amiddle supporting member52, and amiddle bearing member53.

Theside frame41 connects theupper plate10 and thelower plate20. And a surface of theside frame41 connected to aloading space30,side inserting slots411 are formed in a back-and-forth direction (Y). Theside inserting slots411 are formed in plurality with having intervals along an up-and-down length direction (Z) of aside frame41.

Theedge supporting member42 is combined to theside inserting slots411 and protruding to aloading space30.

An upper surface and a side surface of theedge supporting member42 faces to a target substrate G.

Theedge bearing member43 protrudes from the upper surface of theedge supporting member42 to an upper portion.

Theedge bearing members43 are arranged along a length direction (Y) of theedge supporting member42.

Theedge bearing member43 may comprise a buffer covering layer placed in at least a part of the surface thereof. Theedge supporting member42 may also comprise a buffer covering layer placed in at least a part of the surface thereof.

Such anedge supporting unit40 has a composition and an acting effect corresponding to the edge supporting unit according to embodiments ofFIGS.1 to7 and thus the further description is omitted.

Arear supporting unit50 may comprise arear frame51, amiddle supporting member52, and amiddle bearing member53.

Therear frame51 connects anupper plate10 and alower plate20. In a surface of therear frame51 connected to aloading space30,rear inserting slots513 may be formed in a left-and-right direction (X). Here, aside inserting slot411 and arear inserting slot513 may be formed in the same position based on thelower plate20.

Themiddle supporting member52 is combined with the rear insertingslot513 and protrudes in a front direction from therear frame51.

Themiddle supporting member52 may face to a sagged portion of a target substrate G, and for example, may face to the center portion.

Themiddle supporting member52 may have afirst area portion523 and asecond area portion524 whose area is narrower than thefirst area portion523. Here, the length of thesecond area portion524 may be longer than the length of thefirst area portion523.

The total length of themiddle supporting member52 may be one-half or more of the front-and-rear length of atarget space30.

The gradient of themiddle supporting member52 may be gradient in a lower direction from thesecond area portion524 to thefirst area portion523. That is, themiddle supporting member52 may have a gradually gradient shape to a lower direction from the front to the rear. In this case, even though a sag of a target substrate occurs, a portion directly contacting with themiddle supporting member52 can be reduced, and the possibility of occurring damage of the target substrate can be reduced.

The upper surface of themiddle supporting member52 may have gradient in a certain angle. In detail, the upper surface of themiddle supporting member52 may have an angle at a point where a line one end combined with the rear insertingslot513 and the other end contacting with the target substrate and a line parallel to the upper plate or the lower plate meet, and the angle may be 0.1 to 10 degree, 0.1 to 5 degree, or 0.1 to 3 degree.

Themiddle bearing member53 is protruding from an upper surface of themiddle supporting member52.

Themiddle bearing members53 are being arranged with having intervals along a length direction (Y) of themiddle supporting member52.

Themiddle bearing member53 may contact a target substrate G and thereby directly support the center portion of the target substrate G.

Themiddle bearing member53 can support the center portion of a target substrate G through themiddle supporting member52 and thereby prevent the center portion of a target substrate G from sag by the own weight.

Various characteristics found in embodiments illustrated inFIGS.1 to5 also can be applied to the present embodiment.

The loading cassettes (1 or2) may further comprise a protecting housing (not shown) for surrounding the edge supporting unit.

The protecting housing may have a shape of surrounding at least one between the upper plate and the lower plate, and the edge supporting unit.

The protecting housing may be an overall rectangular shape in which one surface is opened and may be covered on the loading cassette.

The protecting housing may further comprise a housing opening and shutting part (not shown) which allows a glass substrate to enter and can be opened and shut in a part or the whole within a surface surrounding the edge supporting unit.

The protecting housing may serve as preventing function from foreign material to be mixed when the loading cassette moves in a state of loading glass substrates and blocking the possibility of being damaged by flow of the fluid in a glass substrate.

Additionally, the protecting housing may serve as a preventing role being damaged of the inside of another loading cassette or the loaded glass substrate even though some glass substrate of any one loading cassette is damaged when many loading cassettes have been loaded to be moved or stacked.

As a material of the protecting housing, a material which is excellent in impact resistance, heat resistance, acid resistance, and so on and endures the weight of a glass substrate and a cassette, specifically a polycarbonate material which is clear or non-clear may be applied, and this case is advantageous in having a sufficient strength and excellent dimensional stability.

Loading Method of a Target Substrate

A method of loading a target substrate according to another embodiment comprises a carry-in step; a support step; and a completion step.

A method of loading a target substrate is performed through the above described a loading cassette (1 or2) and aloading carrier70 below.

The carry-in step is a step that a target substrate G is moved by applying aloading carrier70 having two ormore hands72.

The target substrate G may be a glass substrate having many through holes or a substrate for semiconductor packaging in which an electrically conductive pattern and an insulating layer are laminated to the glass substrate.

The target substrate G generally has a thin thickness (in general, 1500 μm or less) and thereby can be easily bended or curved. Also, because a glass substrate in which a through hole (core via) is formed in the predetermined size and position is applied as a target substrate, stress is concentrated in some section, imbalanced stress may occur in the glass substrate overall, and this may induce degradation of mechanical strength of the substrate. Accordingly, it is required to transfer and store a target substrate stably with minimizing sag or bending of the target substrate. And this is more important when applying a substrate with a larger area.

The target substrate G may be a polygonal glass substrate having L as the length (mm) and W as the width (mm). The L and W may be respectively 400 mm or more, and the target substrate may, for example, comprise a glass substrate in a quadrangle shape.

In the carry-in step, a target substrate G is moved with controlling to occur variation predetermined or less. In detail, the variation is calculated by below Equation (1) (refer toFIG.1).
Variation (D)=Inside Height of Target Substrate (Hin,mm)−Outside Height of Target Substrate (Hout,mm) Equation (1):

The inside height and the outside height of the target substrate is applied by measuring height at the same reference line (B).

The variation (D) may be within −15 to +10 mm, −10 to 7 mm, or −10 to 4 mm A variation in this range may be adjusted by changing the number of hands to be applied, and the position and the interval of the hand fork.

Thehands72 respectively have one ormore hand forks72aand may have Wa2 (mm) as the shortest interval betweenhand forks72aplaced in thehands72 which respectively satisfies below Condition (1) or Condition (2). GT refers to the thickness (mm) of the target substrate.
When 0.1<GT≤0.5,(W/3.4)≤Wa2≤(W/1.8) Condition (1):
When 0.5<GT≤1.5,(W/2.3)≤Wa2≤(W/1.6) Condition (2):

Also, the Wa2 (mm) may respectively satisfy below Condition (1-1) or Condition (2-1).
When 0.1<GT≤0.5,(W/2.5)≤Wa2≤(W/1.9) Condition (1-1):
When 0.5<GT≤1.5,(W/2.2)≤Wa2≤(W/1.8). Condition (2-1):

When the thickness (mm) of the target substrate is expressed as GT, Wa1 value which is an interval betweenhand forks72aplaced on thesame hand72 may satisfy below Condition (3) or Condition (4).
When 0.1<GT≤0.5,(L/3.4)≤Wa1≤(L/1.8) Condition (3):
When 0.5<GT≤1.5,(W/2.3)≤Wa1≤(W/1.6). Condition (4):

Also, the Wa1 value may satisfy below Condition (3-1) or Condition (4-1).
When 0.1<GT≤0.5,(L/2.5)≤Wa1≤(L/1.9) Condition (3-1):
When 0.5<GT≤1.5,(L/2.2)≤Wa1≤(L/1.8) Condition (4-1):

When these interval conditions of thehand forks72aare satisfied, it is possible to move a target substrate more stably.

The target substrate G is carried in aloading space30 of a loading cassette (1 or2) with maintaining the variation (D) within a range described above, and the left and right edges of the target substrate is placed on theedge supporting unit40 of the loading cassettes, thereby allowing the entire target substrate to enter and be placed inside theloading space30. This entrance may be controlled by a loading carrier and hands moving along a predetermined moving route.

For example, the result of a fork test performed with a glass substrate in which has through vias will be disclosed. The glass substrate had a size of 508×508 (length×width, mm) and a thickness of 0.3 to 0.7 mm was formed.

It was confirmed that, when a fork interval is 220 mm based on a glass substrate with through vias, a variation (inside height-outside height) is 4.7 mm; when a fork interval is 260 mm based on a glass substrate with through vias, a variation is −0.6 mm; when a fork interval is 270 mm, a variation is −1 mm; when a fork interval is 320 mm, a variation is −11 mm; and when a fork interval is 420 mm, a variation is −27.5 mm.

On the other hand, the result of a test based on a glass substrate in which a through via is not formed was; when a fork interval is 220 mm, a variation (inside height-outside height) is 4.9 mm; when a fork interval is 270 mm, a variation is −0.4 mm; when a fork interval is 320 mm, a variation is −5.1 mm; and when a fork interval is 420 mm, a variation is −17.1 mm.

Considering the above, it is confirmed that a glass substrate in which has through via occurs a larger sag and a variation of the sag is rapidly increased according to applying a larger fork interval, compared to a glass substrate in which a through via is not formed. Additionally, it is thought that a main occurring reason of the increased variation is originated in variation of inside height, and this is thought to originate in changing of various causes such as weight of a glass substrate, area moment of inertia, and so on. However, the above results are the results of tests targeting a glass substrate which has core vias. An electrically conductive layer such as a metal pattern or an insulating layer may be formed to the glass substrate asymmetrically depending on a design, and in this case a result slightly different to the above.

The support step is a step of controlling a maximum sag of a target substrate G within 3 mm by supporting the target substrate in at least one point or more of the middle thereof by amiddle supporting member52. A sag is determined by an interval from an edge supporting unit40 (basement, 0 mm) The maximum sag may be negative, but it is expressed by converting to be positive.

In the support step, a maximum sag of the target substrate may be controlled by adjusting D1. The D1 is a distance between one side of theedge supporting member42 and amiddle supporting member52

In detail, when a thickness of a target substrate is GT, D1 can satisfy below condition (5) or (6).
When 0.1<GT≤0.5,150≤D1≤275 Condition (5):
When 0.5<GT≤1.5,220≤D1≤330 Condition (6):

In further detail when the thickness (mm) of the target substrate is GT, D1 can satisfy below conditions (5-1) to (6-1).
When 0.2<GT≤0.5,200≤D1≤275 Condition (5-1):
When 0.5<GT≤1.2,230≤D1≤300 Condition (6-1):

When applying amiddle supporting member52, it is advantageous to control a maximum sag of a target substrate within 3 mm based on the edge supporting member (0 mm).

Themiddle supporting member52 may comprise amiddle supporting bar522. Themiddle supporting bar522 has one portion which amiddle bearing member53 may be placed at and the other portion which is placed close to therear frame51. And themiddle supporting bar522 have a gradient, which the one portion is placed to be higher than the other portion. Also, in the support step, the height of the middle bearing member may be changed within 3 mm based on a height compared to not supporting the target substrate (0 mm) It may bring it to conduct a stabler supporting role.

The completion step is for releasing the fixation of theloading carrier70 with the target substrate G and carrying out the loading carrier to external of the loading cassette (1 or2.)

Ahand72 of the loading carrier has ahand fork72aplaced in a portion directly contacting with the target substrate, and the hand fork may have a pressure adjusting mean (not shown) selectively. In detail the hand fork may be adjusted to inhale or exhale air by being connected to a pressure controlling device (not shown) separately prepared through the hand. For example, in a case for fixing the target substrate, the target substrate can be fixed on a hand by depressurizing with letting the hand fork contact with the target substrate and inhale air. In the completion case, a force of fixing the target substrate is removed from the hand fork by relieving depressurizing state and the hand fork is allowed to exhale air temporarily to separate the hand fork and the target substrate easily.

The loading cassette (1 or2) comprise multipleedge supporting units40. When the thickness of the target substrate is expressed as GT (unit: mm), a distance between the edge supporting units neighboring up and down to each other is Dh (unit: mm) Dh may satisfy below Equation (2).
25+(GT−0.8)*8≤Dh Equation (2):
The Dh may be 40 mm or less, or 35 mm or less for efficiency of loading.

Loading Method of a Target Substrate

A method of loading a target substrate according to another embodiment comprises, an entering step for carrying in a target substrate comprising a glass substrate with or without a through hole to a loading space of a loading cassette;

a supporting step for moving the entire target substrate to be placed inside the loading space and have left and right edges of the target substrate being placed on the edge supporting unit of the loading cassette by fixing the target substrate to a loading carrier, wherein at least one point or more of the middle of the target substrate supports at least a part of own weight of the target substrate though being placed on the middle supporting member; and a completing step for releasing the fixation of the loading carrier and the target substrate.

In the supporting step and the completing step, the maximum sag of the target substrate based on the edge supporting unit (0 mm) is controlled within 3 mm.

In detail, the method of loading the target substrate loads the target substrate by comprising an entering step for carrying in a target substrate fixed on a depressurizing pad (not shown) to a loading space to be placed in anedge supporting unit40; and a supporting step for releasing pressure of the depressurizing pad and letting the left and right edges of the target substrate to be placed in theedge supporting unit40, wherein at least one point or more of the middle of the target substrate is supported by the middle supportingmember supporting member52.

The target substrate is the same as above description in that it is a substrate comprising a glass substrate with or without a through hole.

When the thickness (mm) of the target substrate is expressed as GT, D1 which is a distance (mm) between one side of the edge supporting member and the middle supporting member may satisfy below Condition (1) or Condition (2).
When 0.1<GT≤0.5,150≤D1≤275 Condition (1):
When 0.5<GT≤1.5,220≤D1≤330 Condition (2):

Themiddle supporting member52 can control the maximum sag of a target substrate based on the edge supporting unit (0 mm) within 3 mm.

The target substrate G may be supported by at least one surface contacting the gradientmiddle supporting member52 from at least one point.

In the supporting step, sag occurring when themiddle supporting member52 supports the target substrate can be controlled within 3 mm based on when themiddle supporting member52 does not support the target substrate (0 mm).

The middle supporting member may comprise a middle supporting bar. The middle supporting bar has one portion which a middle bearing member may be placed at and the other portion which is placed close to the rear frame. And themiddle supporting bar522 has a gradient, which the one portion is placed to be higher than the other portion. Also, in the support step, the height of the middle bearing member may be changed within 3 mm based on a height compared to not supporting the target substrate (0 mm.)

Hereinafter, while embodiments of the present disclosure will be described in more detail with reference to the accompanying examples, it should be noted that examples are not limited to the following.

Comparative Example—Loading of a Glass Substrate Formed Through Vias Using a Loading Cassette without a Middle Supporting Member

As a target substrate, a glass substrate G was prepared, whose length and breadth were 500 mm respectively, thickness was about 0.4 mm, and the glass substrate was formed through vias as diameter of 100 μm and their pits of 1 mm.

Next, as a loading cassette, comprising

- an upper plate;
- a lower plate facing to the upper plate with an interval;
- a loading space between the upper plate and the lower plate and a target substrate being disposed in,
- an edge supporting unit for connecting the upper plate and the lower plate and supporting left and right edges of the target substrate, and
- a rear supporting unit for connecting the upper plate and the lower plate and supporting a rear edge of the target substrate,
- was prepared.

And then, the prepared glass substrate was carried into the loading space through a loading carrier, and stayed for 24 hours.

In this case, both left and right edges of the glass substrate were supported by edge supporting members, not applying middle supporting members, and a sag at the center of the glass substrate as a target substrate was occurred 30 mm or more.

Example—Loading of a Glass Substrate Formed Through Vias Using a Loading Cassette

As a glass substrate G, the same one applied in the comparative example were prepared.

Next, as a loading cassette, comprising

- anupper plate10;
- alower plate20 facing to the upper plate with an interval;
- aloading space30 between the upper plate and the lower plate and a target substrate being disposed in,
- anedge supporting unit40 for connecting the upper plate and the lower plate and supporting left and right edges of the target substrate, and
- arear supporting unit50 for connecting the upper plate and the lower plate and supporting a rear edge of the target substrate,
- wherein therear supporting unit50 comprises arear frame51 being connecting theupper plate10 and thelower plate20 in a rear surface and amiddle supporting member52 being protruding to the front direction from the rear frame, was prepared.

And then, the prepared glass substrate was carried into the loading space through aloading carrier70, and stayed for 24 hours.

In this case, at both a space between left right edge of the glass substrate and the middle supporting member; and a space between the middle supporting member and right edge of the glass substrate were occurred sages of the glass substrate, the degree occurred sages were confirmed as about 0.9 mm and about 1 mm, respectively. Therefore, it was confirmed that the seg of the glass substrate is controlled well.

Although the preferable exemplary embodiments have been described in detail, the scope of the embodiment is not limited thereto, and modifications and alterations made by those skilled in the art using the basic concept of the embodiment defined in the following claims fall within the scope of the embodiment.

DESCRIPTION OF FIGURE NUMBERS


	1, 2: loading cassette	10: upper plate
	20: lower plate	30: loading space
	40: edge supporting unit	41: side frame
	411: side inserting slot	42: edge supporting member
	421: side slot	43: edge bearing member
	50: rear supporting unit	51: rear frame
	511: rear main bar	511a: holding slot
	512: stopper combining bar	513: rear inserting slot
	52: middle supporting member	521: connecting block
	522: middle supporting bar	523: first area portion
	524: second area portion	53: middle bearing member
	54: rear stopper	541: rear slot
	60: front stopper	61: bar member
	62: spacer	63: rod member
	64: stopper member	70: loading carrier