US11974833B2 - Wearable device for noninvasive body temperature measurement - Google Patents

Abstract

A wearable device for a noninvasive measurement of a user's body temperature can include a housing, a first substrate coupled to the housing and having an opening, a second substrate coupled to the first substrate and configured to secure to skin of a user, a mounting frame enclosed by the housing and the first substrate, a circuit board secured by the mounting frame, a temperature sensor coupled to the circuit board and configured to determine a body temperature of the user, and a thermally conductive probe. The thermally conductive probe is secured by the mounting frame and positioned proximate to the first temperature sensor. The thermally conductive probe extends at least partially through the opening in the first substrate and transmits a thermal energy from a portion of the user's skin to the first temperature sensor.

Description

INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. § 119(e) to U.S. Patent Application No. 63/106,273, entitled “WEARABLE DEVICE FOR NONINVASIVE BODY TEMPERATURE MEASUREMENT,” filed Oct. 27, 2020, U.S. Patent Application No. 63/056,925, entitled “WEARABLE DEVICE FOR NONINVASIVE BODY TEMPERATURE MEASUREMENT,” filed Jul. 27, 2020, U.S. Patent Application No. 63/065,961, entitled “HEALTH SCREENING AND MONITORING SYSTEM,” filed Aug. 14, 2020, U.S. Patent Application No. 63/049,478, entitled “REMOTE PATIENT MANAGEMENT AND MONITORING SYSTEMS AND METHODS,” filed Jul. 8, 2020, U.S. Patent Application No. 62/992,808, entitled “REMOTE PATIENT MANAGEMENT AND MONITORING,” filed Mar. 20, 2020, U.S. Patent Application No. 62/992,779, entitled “OPIOID OVERDOSE MONITORING USER INTERFACE,” filed Mar. 20, 2020, and U.S. Patent Application No. 63/010,669, entitled “REMOTE PATIENT MANAGEMENT AND MONITORING,” filed Apr. 15, 2020. All of the above-mentioned applications are hereby incorporated by reference herein in their entireties. Any and all applications for which a foreign or domestic priority claim is identified in the Application Data Sheet as filed with the present application are hereby incorporated by reference under 37 CFR 1.57.

TECHNICAL FIELD

The present disclosure relates to devices, methods, and/or systems for monitoring a subject's physiological information. More specifically, the present disclosure describes, among other things, a wearable device that measures a subject's body temperature.

BACKGROUND

Core body temperature is an important vital sign used by clinicians to monitor and/or manage the condition of a subject (for example, a patient). Core body temperature is the internal temperature of a subject. Internal body temperatures are typically maintained within a specific range in order for the body to carry out essential functions. Variations in core body temperature can be indicative of a deteriorating condition of a subject and can negatively impact the body's ability to maintain critical life-sustaining functions. Despite the importance of core body temperature as a vital sign, some commonly employed devices, methods, and/or systems for estimating core body temperature based on skin surface or peripheral measurements are lacking. Skin surface temperature, typically measured using single point measurement devices or heat flux measurement devices, can vary dramatically from core body temperature in some cases, depending on, for example, physiology of the subject (for example, skin thickness), environment of the user, perfusion, and/or other conditions. “Clinical temperature” measurements—temperature measurements typically obtained with a thermometer at a subject's periphery (such as at the subject's armpit, rectum, or under a subject's tongue)—do not represent a true measurement of internal body temperature, but rather, simply an approximation. There is a great need for improved devices, methods, and systems for non-invasively measuring (continuously or periodically) and/or transmitting (for example, wirelessly) a subject's core body temperature.

SUMMARY

Various implementations of the wearable devices disclosed herein provide improved devices, methods, and systems for non-invasively measuring (continuously or periodically) and/or transmitting (for example, wirelessly) a subject's core body temperature. Various embodiments of the disclosed wearable devices can be comfortably worn by a user over a long period of time (for example, 1 day, 2 days, 3 days, 4 days, 5 days, 6 days, 7 days, 8 days, 9 days, or 10 days), can monitor (continuously or periodically) the user's core body temperature alone or in combination with other physiological parameters, and can transmit (for example, wirelessly) such physiological information to separate devices (for example, a mobile device). Some embodiments of the disclosed wearable devices can be configured to be removed and reapplied/re-secured in order to position the devices in various locations on the user's body. Some embodiments of the disclosed wearable devices (or portions of such devices) can be disposable, which can reduce the risk of cross-contamination between multiple users. Some embodiments of the disclosed wearable devices (or portions of such devices) can be waterproof, thereby providing minimal disruption to ordinary activities of the user (for example, showering).

A wearable device configured for noninvasive measurement of a user's body temperature can comprise: a housing; a first substrate coupled to the housing and comprising an opening; a second substrate coupled to the first substrate and configured to secure to skin of a user when the wearable device is in use; a mounting frame enclosed by the housing and the first substrate; a circuit board secured by the mounting frame; a first temperature sensor coupled to the circuit board and configured to determine a body temperature of the user; and a thermally conductive probe secured by the mounting frame and positioned proximate to the first temperature sensor, the thermally conductive probe configured to extend at least partially through the opening in the first substrate and further configured to transmit a thermal energy from a portion of the user's skin to the first temperature sensor when the wearable device is in use. The wearable device can be configured to secure to skin of the user and/or can be configured for continuous noninvasive measurement of the user's body temperature. In some variants, the only type of physiological parameter measured and/or monitored by the wearable device is body temperature. In some variants, the only type of physiological parameter measured and/or monitored by the wearable device is body temperature. In some variants, the wearable device does not include an accelerometer, a gyroscope, a magnetometer, an oximetry sensor, a moisture sensor, an impedance sensor, an acoustic/respiration sensor, and/or an ECG sensor. In some variants, the first and second substrates are integrally formed with one another.

The circuit board can comprise a first surface, a second surface opposite the first surface, and one or more openings extending through the circuit board from the first surface to the second surface, the second surface positioned closer to the second substrate than the first surface. The thermally conductive probe can be positioned adjacent the one or more openings and the second surface of the circuit board. The first temperature sensor can be mounted to the first surface of the circuit board adjacent the one or more openings in the circuit board. The one or more openings of the circuit board can be configured to allow said thermal energy to pass through the circuit board to the first temperature sensor. The one or more openings of the circuit board can be filled with a thermally conductive material. The one or more openings of the circuit board can be not filled with a material. The one or more openings of the circuit board can comprise a plurality of openings. Each of the one or more openings of the circuit board can be circular. The first temperature sensor can be configured to determine the body temperature of the user in one minute intervals.

The wearable device can further comprise at least one thermally conductive material positioned between the one or more openings of the circuit board and the thermally conductive probe. The at least one thermally conductive material can comprise a first thermally conductive material and a second thermally conductive material, the first thermally conductive material comprising a thermal paste and the second thermally conductive material comprising a metallic material. The thermal paste can comprise zinc oxide. The metallic material can comprise at least one of gold and copper.

When the wearable device is secured to the user's skin via the second substrate, the second substrate can be positioned between the user's skin and the thermally conductive probe. In some variants, the thermally conductive probe does not contact the portion of the skin of the user when the wearable device is secured to the user's skin during use. An axis extending through a center of a cross-section of the thermally conductive probe and along a height of the thermally conductive probe can be oriented perpendicular with respect to a plane of the circuit board. The thermally conductive probe can comprise a width that is smaller than the height. The thermally conductive probe can comprise a first end, a second end opposite the first end, and a height extending between the first and second ends, and wherein the second end is configured to apply pressure to the portion of the skin of the user when the wearable device is secured to the user. When the wearable device is secured to the user's skin via the second substrate, the second substrate can be positioned between the user's skin and the second end of the thermally conductive probe.

The mounting frame can comprise one or more posts and the housing can comprise one or more cavities. Each of the one or more posts can be configured to secure within one of the one or more cavities. The one or more posts can comprise two posts positioned on opposite sides of the mounting frame and the one or more cavities can comprise two cavities. The circuit board can comprise one or more notches along one or more sides of the circuit board, the one or more notches sized and shaped to receive a portion of the one or more posts. The mounting frame can comprise a slot configured to receive and secure the thermally conductive probe. The slot can be configured to surround a portion of a perimeter of a cross-section of the thermally conductive probe. The slot can be configured to surround less than an entire perimeter of a cross-section of the thermally conductive probe. The thermally conductive probe can comprises a metallic material. The thermally conductive probe can comprise aluminum. The thermally conductive probe can be rigid.

The first substrate can comprise foam. The second substrate can comprise a fabric material and an adhesive material. The housing can comprise a main body and a rim extending around a perimeter of the main body, and the wearable device can further comprises a third substrate including an opening configured to receive the main body of the housing, wherein the third substrate is coupled to the first substrate, and wherein the rim of the housing is secured between the first and third substrates. The wearable device can further comprise a release liner configured to removably secure to the second substrate.

The opening in the first substrate can be sized and shaped to correspond to a size and shape of a perimeter of a cross-section of the thermally conductive probe. The opening in the first substrate and the cross-section of the thermally conductive probe can be circular.

The wearable device can further comprise a second temperature sensor coupled to the circuit board and spaced away from the first temperature sensor by a first distance, the second temperature sensor configured to measure an ambient temperature outside an interior of the housing. The wearable device can further comprise a thermally conductive material extending between the second temperature sensor and an interior surface of the housing, wherein the thermally conductive material is configured to transfer ambient thermal energy from the interior surface of the housing to the second temperature sensor. The second thermally conductive material can comprise a thermal putty configured to at least partially conform to a shape of a portion of the interior surface of the housing. The thermal putty can comprise a ceramic filled silicone sheet.

The wearable device can further comprise a wireless transceiver coupled to the circuit board and configured to wirelessly transmit one or more signals responsive to the determined body temperature over a wireless communication protocol. The wearable device can further comprise a third substrate positioned between the circuit board and the second substrate, wherein the third substrate is configured to reflect at least a portion of the one or more signals wirelessly transmitted from the wireless transceiver away from the user's skin when the wearable device is in use. The third substrate can comprise metallized polypropylene.

The wearable device can further comprise a near field communication (NFC) tag configured to communicate with an NFC reader of a separate computing device. The NFC tag can be secured to an interior surface of the housing. The wearable device can further comprise a battery configured to provide power to the circuit board. The wearable device can further comprise a battery holder configured to couple the battery to the circuit board.

A wearable device configured for noninvasive measurement of a user's body temperature can comprise: a housing; a circuit board; a temperature sensor coupled to the circuit board and configured to generate one or more signals responsive to a thermal energy of a user; a battery configured to provide power to the circuit board; and a mounting frame configured to secure the circuit board to the housing, the mounting frame comprising a first end and a second end opposite the first end, the second end positioned adjacent the battery. The mounting frame, the circuit board, the temperature sensor, and the battery can be at least partially enclosed by the housing. The second end of the mounting frame can be sized and shaped to conform to a size and shape of a portion of the battery, thereby maximizing a size of the battery within the housing of the wearable device.

The second end of the mounting frame can be sized and shaped to surround approximately half of a perimeter of the battery. The second end of the mounting frame can be sized and shaped to surround less than half of a perimeter of the battery. The battery can comprise a circular shape and wherein the second end of the mounting frame can at least partially comprise a half-circle shape configured to surround a portion of a perimeter of the battery. The wearable device can further comprise a battery holder configured to couple the battery to the circuit board, the battery holder comprising opposing arms configured to electrically connect to electrical contacts of the circuit board. The mounting frame can comprise notches at corners of the second end, the notches configured to facilitate alignment of the battery holder and the mounting frame.

A wearable device configured for noninvasive measurement of a user's body temperature can comprise: a housing; a circuit board at least partially enclosed by the housing, the circuit board comprising a first surface, a second surface opposite the first surface, and at least one hole extending through the circuit board from the first surface to the second surface; a first temperature sensor electrically coupled with the circuit board and positioned adjacent the first surface and the at least one hole of the circuit board; a thermally conductive probe comprising a first end and a second end opposite the first end, wherein the first end is positioned adjacent the second surface of the circuit board proximate the at least one hole and aligned with the first temperature sensor; a mounting frame configured to secure the thermally conductive probe and the circuit board to the housing; and one or more substrates operatively connected to the housing and configured to be positioned proximate skin of a user when the wearable device is in use, wherein at least one of the one or more substrates comprises an opening configured to allow at least a portion of the thermally conductive probe to pass at least partially therethrough. The second end of the thermally conductive probe can be configured to be positioned proximate to a portion of the skin of the user when the wearable device is secured to the user, the thermally conductive probe configured to transmit a thermal energy of the user to the first temperature sensor via the at least one hole extending through the circuit board, the first temperature sensor configured to determine a body temperature of the user based on said transmitted thermal energy.

The wearable device can further comprise a first thermally conductive material positioned between the first end of the thermally conductive probe and the first temperature sensor. The first thermally conductive material can comprise a thermal paste positioned between the first end of the thermally conductive probe and the second surface of the circuit board. The thermal paste can comprise zinc oxide. The wearable device can further comprise a second thermally conductive material positioned between the first end of the thermally conductive probe and the first temperature sensor. The first thermally conductive material can comprise a thermal paste positioned between the first end of the thermally conductive probe and the second surface of the circuit board. The second thermally conductive material can comprise a metallic material. The thermal paste can comprise zinc oxide. The metallic material can comprise at least one of gold and copper. The at least one hole of the circuit board can be filled with a thermally conductive material. The at least one hole of the circuit board can be not filled with a thermally conductive material. The at least one hole of the circuit board can comprise a plurality of holes. An axis extending through a center of a cross-section of the thermally conductive probe and along a height of the thermally conductive probe can be oriented perpendicular with respect to a plane of the circuit board. The one or more substrates can comprise a first substrate and a second substrate, said first substrate comprising said opening and coupled to the second substrate, said second substrate configured to secure to the skin of the user when the wearable device is in use. When the wearable device is secured to the user's skin via the second substrate, the second substrate can be positioned between the user's skin and the second end of the thermally conductive probe. The second end of the thermally conductive probe can be configured to apply pressure to the portion of the skin of the user when the wearable device is secured to the user. When the wearable device is secured to the user's skin via the second substrate, the second substrate can be positioned between the user's skin and the second end of the thermally conductive probe. The housing can comprise a main body and a rim extending around a perimeter of the main body. The wearable device can further comprise a third substrate including an opening configured to receive the main body of the housing. The third substrate can be coupled to the first substrate and the rim of the housing can be secured between the first and third substrates. The mounting frame can comprise a slot configured to receive and secure the thermally conductive probe. The slot can be configured to surround a portion of a perimeter of a cross-section of the thermally conductive probe. The slot can be configured to surround less than an entire perimeter of a cross-section of the thermally conductive probe. The thermally conductive probe can comprise a metallic material. The thermally conductive probe can comprise aluminum. The thermally conductive probe can rigid.

A wearable device configured for continuous and noninvasive measurement of a user's body temperature can comprise: a housing; a circuit board at least partially enclosed by the housing, the circuit board comprising a first surface, a second surface opposite the first surface, and at least one hole extending through the circuit board from the first surface to the second surface; a first temperature sensor electrically coupled with the circuit board and positioned adjacent the first surface and the at least one hole of the circuit board; a thermally conductive probe comprising a first end and a second end opposite the first end, wherein the first end is positioned adjacent the second surface of the circuit board proximate the at least one hole and aligned with the first temperature sensor; a first thermally conductive material positioned between the first end of the probe and the first temperature sensor; a mounting frame configured to secure the thermally conductive probe and the circuit board to the housing; and one or more substrates operatively connected to the housing and configured to be positioned proximate skin of the user when the wearable physiological sensor is in use, wherein at least one of the one or more substrates comprises an opening configured to allow at least a portion of the probe to pass therethrough. The second end of the thermally conductive probe can be positioned proximate to a portion of the skin of the user when the wearable physiological sensor is secured to the user during use. The thermally conductive probe can be configured to transmit a thermal energy of the user to the first temperature sensor, and the first temperature sensor can be configured to determine a body temperature of the user based on said received thermal energy.

A wearable device configured for continuous and noninvasive measurement of a user's body temperature can comprise: a housing; a circuit board at least partially enclosed by the housing; a first temperature sensor coupled to the circuit board; a thermally conductive probe vertically aligned with the first temperature sensor and comprising a first end and a second end opposite the first end, the first end positioned closer to the circuit board than the second end; a mounting frame configured to at least partially secure the thermally conductive probe and the circuit board to the housing; and one or more substrates coupled to the housing and configured to contact skin of a user when the wearable device is in use, wherein, when the one or more substrates contact the user's skin, the second end of the thermally conductive probe is positioned proximate to a portion of the skin. The thermally conductive probe can be configured to transmit a thermal energy of the user to the first temperature sensor and the first temperature sensor can be configured to determine a body temperature of the user based on said thermal energy.

For purposes of summarizing the disclosure, certain aspects, advantages, and novel features are discussed herein. It is to be understood that not necessarily all such aspects, advantages, or features will be embodied in any particular embodiment of the disclosure, and an artisan would recognize from the disclosure herein a myriad of combinations of such aspects, advantages, or features.

BRIEF DESCRIPTION OF THE DRAWINGS

Certain features of this disclosure are described below with reference to the drawings. The illustrated embodiments are intended to illustrate, but not to limit, the embodiments. Various features of the different disclosed embodiments can be combined to form further embodiments, which are part of this disclosure.

FIG.1 illustrates a top perspective view of a wearable device in accordance with aspects of this disclosure.

FIGS.2A and2B illustrate top perspective views of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2C illustrates a top view of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2D illustrates a bottom view of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2E illustrates a side view of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2F illustrates another side view of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2G illustrates a front view of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2H illustrates a back view of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIG.2I illustrates a schematic block diagram of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIGS.3A and3B illustrate top and bottom exploded perspective views of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIGS.4A and4B illustrate top and bottom perspective views of a housing of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIGS.5A and5B illustrate top and bottom perspective views of a portion of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIGS.5C and5D illustrate top and bottom exploded perspective views of the portion of the wearable device ofFIGS.5A and5B in accordance with aspects of this disclosure.

FIG.6A illustrates a top perspective view of a mounting frame of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIGS.6B and6C illustrate top and bottom views of the mounting frame ofFIG.6A in accordance with aspects of this disclosure.

FIG.7 illustrates a cross-section taken through a portion of the wearable device as shown inFIG.2C in accordance with aspects of this disclosure.

FIGS.8A and8B illustrate top and bottom perspective views of a portion of the wearable device ofFIG.1 in accordance with aspects of this disclosure.

FIGS.8C and8D illustrate top and bottom exploded perspective views of the portion of the wearable device ofFIGS.8A and8B in accordance with aspects of this disclosure.

FIGS.9A-10B illustrate various views of portions of a probe of the portion the wearable device illustrated inFIGS.8C-8D in accordance with aspects of this disclosure.

DETAILED DESCRIPTION

Various features and advantages of this disclosure will now be described with reference to the accompanying figures. The following description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. This disclosure extends beyond the specifically disclosed embodiments and/or uses and obvious modifications and equivalents thereof. Thus, it is intended that the scope of this disclosure should not be limited by any particular embodiments described below. The features of the illustrated embodiments can be modified, combined, removed, and/or substituted as will be apparent to those of ordinary skill in the art upon consideration of the principles disclosed herein.

FIG.1 illustrates a top perspective view of a wearable device10 (which may also be referred to herein as “physiological measurement device”, “physiological monitoring device”, “wearable physiological sensor”, “wearable physiological device”) that can measure and/or monitor one or more physiological parameters of a subject, as discussed further below. Thewearable device10 can secure to a portion of a subject's body, such as a torso, chest, back, arm, neck, leg, under the arm (e.g., armpit), among other portions of the subject's body. Thewearable device10 can secure (for example, removably secure) to skin of a subject and continuously and/or noninvasively measure the subject's temperature with one or more temperature sensors. Additionally, as discussed below, thewearable device10 can continuously or periodically wirelessly transmit temperature data of the subject to a separate device.FIG.7, which is discussed in more detail below, illustrates a cross-section taken through thewearable device10 when thewearable device10 is secured to skin of a subject. As illustrated inFIG.7 and as discussed further below, thewearable device10 can include a thermally conductive probe140 (or240) that extends toward the subject's skin and transmits thermal energy from the skin in a direction towards a temperature sensor of the wearable device10 (such astemperature sensor150adiscussed further below). As also discussed below, the thermally conductive probe140 (or thermally conductive probe240) can contact (for example, indirectly via substrate25) and/or apply pressure to the subject's skin, which can facilitate thermal transmissivity. In some variants, the thermallyconductive probe140 does not contact the subject's skin when thewearable device10 is secured to the subject. For example, thesubstrate25 can be positioned between the thermallyconductive probe140 and the subject's skin when thewearable device10 is secured to the subject.

FIGS.3A-3B illustrate exploded perspective views of thewearable device10.FIGS.2A-2H illustrate various views of thewearable device10 without a battery isolator18 (seeFIGS.3A-3B) attached to better illustrate aspects of thewearable device10.

FIG.21 illustrates an exemplary schematic block diagram of thewearable device10. As shown, thewearable device10 can include aprocessor11, astorage device12, awireless transceiver13, abattery14, aninformation element15, and/or one ormore temperature sensors16. Theprocessor11 can be configured, among other things, to process data, execute instructions to perform one or more functions, and/or control the operation of thewearable device10. For example, theprocessor11 can process physiological data obtained from thewearable device10 and can execute instructions to perform functions related to storing and/or transmitting such physiological data. For example, theprocessor11 can process data received from one ormore temperature sensors16 and/or one or more otherphysiological parameter sensors17 and can execute instructions to perform functions related to storing and/or transmitting such received data.

Thestorage device12 can include one or more memory devices that store data, including without limitation, dynamic and/or static random access memory (RAM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), and the like. Such stored data can be processed and/or unprocessed physiological data obtained from thewearable device10, for example. Thewireless transceiver13 can be configured to allow thewearable device10 to wirelessly communicate with other devices, systems, and/or networks over a communication protocol. Thewireless transceiver13 can be configured to use any of a variety of wireless communication protocols, such as Wi-Fi (802.11x), Bluetooth®, ZigBee®, Z-wave®, cellular telephony, infrared, RFID, satellite transmission, proprietary protocols, combinations of the same, and the like.

Thewearable device10 can include abattery14. Thebattery14 can provide power for the hardware components of thewearable device10 described herein. Thebattery14 can be, for example,battery110, described in more detail below. Thebattery14 can be, for example, a lithium battery. Additionally or alternatively, thewearable device10 can be configured to obtain power from a power source that is external to thewearable device10. For example, thewearable device10 can include or can be configured to connect to a cable which can itself connect to an external power source to provide power to thewearable device10.

Thewearable device10 can include aninformation element15. Theinformation element15 can be a memory storage element that stores, in non-volatile memory, information used to help maintain a standard of quality associated with thewearable device10. Illustratively, theinformation element15 can store information regarding whether thewearable device10 has been previously activated and whether thewearable device10 has been previously operational for a prolonged period of time, such as, for example, four hours. The information stored in theinformation element15 can be used to help detect improper re-use of thewearable device10, for example.

As shown inFIG.21, thewearable device10 can include one ormore temperature sensors16 that can continuously or periodically obtain temperature data of the subject. Advantageously, in some implementations, theprocessor11 can compare temperature data from more than onetemperature sensor16 to more accurately determine core body temperature of the subject. In some variants, thewearable device10 includes one ormore temperature sensors16 and also includes one or moreother sensors17, such as one or more of an accelerometer, a gyroscope, a magnetometer, an oximetry sensor, a moisture sensor, an impedance sensor, an acoustic/respiration sensor, and/or an ECG sensor. In some variants, thewearable device10 includes one ormore temperature sensors16 and does not include an accelerometer, a gyroscope, a magnetometer, an oximetry sensor, a moisture sensor, an impedance sensor, an acoustic/respiration sensor, or an ECG sensor, which can advantageously help conserve battery and processing power and preserve processing capabilities of thewearable device10 where continuous or periodic core body temperature values are being determined and/or transmitted. In some variants, the only type of physiological parameter measured and/or monitored by thewearable device10 is body temperature. The one ormore temperature sensors16 can be, for example, any oftemperature sensors150a,150b,150c,each of which are discussed in more detail below.

Theprocessor11 of thewearable device10 can be configured to process obtained physiological information. For example, theprocessor11 can be configured to determine a core body temperature of a user based on thermal energy obtained by one ormore temperature sensors16 of thewearable device10. Thewireless transceiver13 can be configured to wirelessly transmit the processed physiological information (and/or unprocessed physiological information) to a separate computing device, such as a patient monitor, a mobile device (for example, an iOS or Android enabled smartphone, tablet, laptop), a server or other computing or processing device for display and/or further processing, among other things. The computing device can be configured to store and/or further process the received physiological information, to display information indicative of or derived from the received physiological information, and/or to transmit information—including displays, alarms, alerts, and notifications—to computing devices or systems including a patient monitoring system associated with a hospital, a caregiver (for example, a primary provider), or a user (for example, an employer, a school, friends, family) that have permission to access the subject's (for example, patient's) data. As another example, thewireless transceiver13 of thewearable device10 can be configured to wirelessly transmit processed or unprocessed obtained physiological information to a mobile phone which can include one or more hardware processors configured to execute an application that generates a graphical user interface displaying information representative of the processed or unprocessed physiological information obtained from thewearable device10. In some variants, thewearable device10 is configured to measure and/or monitor only one type of physiological parameter, that being body temperature.

FIGS.3A and3B illustrate exploded views of thewearable device10. Thewearable device10 can include ahousing40 and one or more substrates, such as one or more ofsubstrates20,25,50,60,65,70, which are described in more detail below. As discussed above, thewearable device10 can include aprocessor11,storage device12,wireless transceiver13,battery14,information element15, and/or one ormore temperature sensors16. Theprocessor11,storage device12,wireless transceiver13,battery14,information element15, and/or one ormore temperature sensors16 can be mounted and/or coupled with a circuit layer of thewearable device10. The circuit layer can be enclosed or at least partially enclosed by the housing40 (and/or a portion of the housing40) and/or one or more ofsubstrates20,25,50,60,65,70. The circuit layer can be positioned between or at least partially between the housing40 (or a portion of the housing40) and one or more of the substrates of thewearable device10, such as any ofsubstrates20,25,50,60,65,70. The circuit layer can be, for example, a circuit board, such ascircuit board105 which is illustrated in at leastFIGS.3A-3B,5A-5D,7, and8A-8D. Thecircuit board105 can be a printed circuit board, for example. Thebattery14 can be, for example, thebattery110 shown in at leastFIGS.5A-5D and8A-8D and described elsewhere herein. As shown and as discussed further below, thebattery110 can be mechanically and/or electronically coupled with thecircuit board105, for example, via thebattery holder115.

Thewearable device10 can include a probe that acts as a conduit to transmit thermal energy from the subject to and/or toward one ormore temperature sensors16 of thewearable device10. The probe can be rigid or flexible. The probe can comprise thermally conductive material. For example, the probe can comprise a metallic material, such as aluminum. The probe can be theprobe140 or theprobe240 which are discussed in more detail below.

Thewearable device10 can include a mounting frame that secures one or more components of thewearable device10 to thehousing40. The mounting frame can be, for example, mountingframe130 shown in at leastFIGS.5A-5D and8A-8D and further discussed below. The mountingframe130 can secure thecircuit board105 and/or the probe140 (or probe240) to thehousing40 and/or to one or more ofsubstrates20,25,50,60,65,70. Where thebattery110 is coupled with thecircuit board105 via thebattery holder115 as described below, the mountingframe130 can secure thecircuit board105,battery holder115, and thebattery110 to thehousing40 and/or to one or more ofsubstrates20,25,50,60,65,70.

With reference toFIGS.3A-3B and5A-5D, thecircuit board105, theprobe140, the mountingframe130, thebattery110, thebattery holder115, and/or one or more temperature sensors coupled to the circuit board105 (such astemperature sensors150a,150b) can form an electronics assembly of thewearable device10, which is generally represented by the numeral “100” inFIGS.3A-3B. Theelectronics assembly100, and any or all of the above-listed components that can form theelectronics assembly100, can be enclosed (or partially enclosed) by the housing40 (or a portion thereof) and one or more ofsubstrates20,25,50,60,65,70. Theelectronics assembly100, and any or all of the above-listed components that can form theelectronics assembly100, can be positioned between or at least partially between the housing40 (or a portion of the housing40) and one or more ofsubstrates20,25,50,60,65,70. The use of the phrase “electronics assembly” or the reference numeral “100” in the present disclosure is not intended to be limiting, but rather, is merely intended as a convenient method to refer to one or more components of thewearable device10 which can be enclosed by thehousing40 and/or one or more ofsubstrates70,25,65,50,65, and/or20.

As discussed above, thewearable device10 can be configured to wirelessly communicate with a separate computing device. For example, thewearable device10 can be configured to wirelessly transmit and/or receive information from a separate computing device. As another example, thewearable device10 can be configured to wirelessly transmit processed and/or unprocessed physiological information obtained by thewearable device10. As discussed above, thewearable device10 can include awireless transceiver13. Thewireless transceiver13 can be coupled with (for example, mounted on a surface of) thecircuit board105. As discussed above, thewireless transceiver13 can be configured to use any of a variety of wireless protocols, such as Wi-Fi (802.11x), Bluetooth®, ZigBee®, Z-wave®, cellular telephony, infrared, RFID, satellite transmission, proprietary protocols, combinations of the same, and the like.

Thewearable device10 can include near field communication (NFC) functional capabilities (for example, RFID) that can enable thewearable device10 to interact and/or communicate with separate computing devices. Such NFC functional capabilities can enable thewearable device10 to, among other things: confirm or verify that it is and/or is made up of authentic components; transfer data (for example, physiological data obtained bywearable device10; and determine a lifespan of thewearable device10. Thewearable device10 can include an RFID tag (for example, in the form of a sticker, label, layer, and/or inlay) that can interact with an RFID reader of a separate computing device that emits a radio frequency. For example, with reference toFIGS.3A-3B, thewearable device10 can include aNFC tag30 that can communicate and/or interact with an NFC reader of a separate computing device. TheNFC tag30 can comprise a layer or inlay that can be secured to a portion of thewearable device10. For example, as discussed in more detail below, theNFC tag30 can be secured to a portion of thehousing40, such as to an interior surface of thehousing40. TheNFC tag30 can be secured to a portion of thehousing40 such that, when thewearable device10 is assembled (as shown inFIGS.1-2H), theNFC tag30 is positioned at or near a top portion of thewearable device10, such as atop portion41aof thehousing40 which is discussed below. Such positioning can advantageously facilitate communication between theNFC tag30 and an NFC reader of a separate computing device when brought in proximity to each other. TheNFC tag30 can be an active or passive RFID tag, for example. TheNFC tag30 can allow an NFC reader of a separate device to register, track, and/or determine information about thewearable device10 such as date and/or location of manufacture, among other things.

Thewearable device10 can include a battery isolator that can block electrical communication between thebattery110 and one or more electrical contacts on thecircuit board105. For example, as shown inFIGS.3A-3B, thewearable device10 can include battery isolator18 (which can also be referred to as a “battery isolator tab”). Thebattery isolator18 can be used to preserve battery power until thewearable device10 is ready for use. Thebattery isolator18 can be configured to block electrical connection between thebattery110 and thecircuit board105 until thebattery isolator18 is removed from thewearable device10. Thebattery isolator18 can be made of any material that possesses adequate flexibility to be slidably removed from its initial position and adequate dielectric properties so as to electrically isolate the battery110 (or a portion thereof) from thecircuit board105. For example, thebattery isolator18 can be made of plastic, polymer film, paper, foam, combinations of such materials, or the like. Thebattery isolator18 can extend through a slot of thehousing40 when thewearable device10 is assembled. For example, thebattery isolator18 can extend throughslot42 ofhousing40 discussed below with reference toFIGS.4A-4B. With reference toFIGS.3A-3B andFIG.5B, an end of thebattery isolator18 can be positioned between an electrical contact on a bottom surface of thebattery110 and a portion of thebattery holder115 which is electrically connected to thecircuit board105. Such positioning can allow thebattery isolator18 to block electrical communication between thebattery110 and thecircuit board105. In some variants, thebattery isolator18 is textured (for example, at or near an end thereof that is external to the housing40) to provide a frictional surface to aid a user in gripping and sliding thebattery isolator18 out of its original assembled position. Once thebattery isolator18 is removed, electrical communication between thebattery110 and thecircuit board105 can be initiated to energize the electronic components of thewearable device10.

With reference toFIGS.3A-3B and4A-4B, thebattery isolator18 can be secured (for example, partially secured) to a portion of thehousing40 with a securement tab35 (seeFIGS.3A-3B). For example, thesecurement tab35 can secure a portion of thebattery isolator18 to arim44 of the housing40 (seeFIGS.4A-4B), and/or can position thebattery isolator18 with respect to thehousing40. Thebattery isolator18 can be inserted through a slot of the housing40 (such asslot42 extending through arim44 of the housing40). Thesecurement tab35 can secure a portion of thebattery isolator18 to therim44 of thehousing40 proximate theslot42. For example, thesecurement tab35 can secure thebattery isolator18 to therim44 over and/or around theslot42. Thesecurement tab35 can be and/or comprise, for example, an adhesive tape on one or more sides of thesecurement tab35. Thesecurement tab35 can keep at least a portion of thebattery isolator18 in place (for example, stationary) with respect to thehousing40 until a sufficient force is applied to thebattery isolator18 which causes thesecurement tab35 and/or the portion of thebattery isolator18 secured to thehousing40 by thesecurement tab35 to “break free” (for example, move). Thesecurement tab35 can aid in maintaining a position of ends of thebattery isolator18 relative to thewearable device10. For example, thesecurement tab35 can advantageously help maintain a position of a first end of thebattery isolator18 in between thebattery110 and a portion of thebattery holder115 in electrical communication with thecircuit board105 and/or help maintain a position of a second end of thebattery isolator18 external to thehousing40 to facilitate visibility and/or grasping by a user.

Thewearable device10 can include one or more substrates that can secure and/or secure to other portions of thewearable device10 and/or that can allow thewearable device10 to secure to a subject (for example, skin of the subject). For example, with reference toFIGS.3A-3B, thewearable device10 can include one or more ofsubstrates20,50,60,65,25, and/or70.

Substrate20 can be configured to surround a portion of thehousing40. For example,substrate20 can include anopening22 through which thehousing40 fits during assembly. Theopening22 can be sized and/or shaped to match a size and/or shape of a portion of thehousing40. For example, theopening22 can be sized and/or shaped to match a size and/or shape of amain body41 of thehousing40 which can be interior to and/or within therim44 of thehousing40.Substrate50 can be positioned adjacent (for example, underneath) the housing40 (or a portion thereof) and/or between thesubstrate25 and the housing40 (or a portion thereof). Thesubstrates20,50 can sandwich a portion of thehousing40 therebetween. For example, when thewearable device10 is assembled, thesubstrates20,50 can sandwich therim44 of thehousing40. Such configuration can secure the housing40 (and other components of thewearable device10 that are directly or indirectly connected to the housing40) to thesubstrates20,50 and any other of thesubstrates70,25,65, and/or60 which can be incorporated in thewearable device10. As illustrated inFIG.3A, thesubstrates20,50 can have substantially similar shapes. For example,substrates20,50 can have substantially matching perimeters.Substrates20,50 can be made of foam material such as white polyethylene, polyurethane, or reticulated polyurethane foams, to name a few.Substrates20,50 can be made of medical-grade foam material.

With reference toFIGS.3A-3B and5A-5B,substrate50 can include anopening55 sized and/or shaped to match a size and/or shape of theprobe140, or probe240. For example, theopening55 can have a size and/or shape that matches a size and/or shape of a perimeter of a cross-section of the probe140 (or a portion of the probe140), or probe240 (or a portion of the probe240). As discussed further below, this can advantageously allow a portion of the probe140 (or probe240) to extend through at least a portion of theopening55 and be in closer proximity to a portion of the subject's skin surface when thewearable device10 is in use, which can allow the probe140 (or probe240) to transmit thermal energy from the subject near, to, and/or toward one or more temperature sensors of the wearable device10 (for example,temperature sensors150aand/or150c). Theopening55 can allow the probe140 (or a portion of the probe140), or probe240 (or a portion of the probe240) to extend through theopening55 to contact (directly or indirectly via substrate25) and/or apply pressure to a portion of the subject's skin surface, which can also increase thermal transmissibility.Opening55 can extend through a thickness ofsubstrate50 and/or can extend between opposing surfaces of the substrate50 (for example, top and bottom surfaces of the substrate50).Opening55 can be spaced from a perimeter of thesubstrate50.Substrate50 can include a first end, a second end opposite the first end, and first and second sides extending between the first and second ends and opposite one another. In such configurations, opening55 can be positioned closer to one of the first or second ends and/or can be positioned equidistantly or non-equidistantly from the first and second sides.

Any of the above mentionedsubstrates20,60,50,65,25 can be integrally formed with one or more of each other. For example, in some variants, substrate25 (described above) is integrally formed withsubstrate50,substrate60, and/orsubstrate65. In some variants,wearable device10 does not includesubstrate65 and/orsubstrate60. In some variants,wearable device10 does not include asubstrate25 but rather includes asubstrate50 that can include the features and/or characteristics described above with respect to substrate25 (for example,substrate50 can be configured to secure (e.g., adhere) to skin of a user).

Thewearable device10 can include a substrate configured to contact the subject and/or help secure (for example, removably secure) the wearable device10 (or portions thereof) to the subject. For example, with reference toFIGS.3A-3B, thewearable device10 can include asubstrate25 that can contact and/or secure to skin of a subject when thewearable device10 is in use.Substrate25 can be a bottommost one of the one or more substrates (and/or of the wearable device10) when thewearable device10 is in use (for example, after therelease liner70 is removed).Substrate25 can be or include a material configured to secure to skin of a user.Substrate25 can comprise a material configured to allow for removable securement of thewearable device10 to the user's skin. For example, thesubstrate25 can be coated with a high tack, medical-grade adhesive, which when in contact with the subject's skin, is suitable for long-term monitoring, such as, for example two days or longer, such as 3 days, 4 days, 5 days, 6 days, 7 days, 8 days, 9 days, or 10 days or longer. Additionally or alternatively, thesubstrate25 can be or include a soft, comfortable, and/or breathable material. For example,substrate25 can be or include fabric, such as non-woven fabric having holes or openings. Thesubstrate25 can be fabric and include an adhesive material or layer (such as adhesive tape) on one or both surfaces of thesubstrate25. Such configuration can allow thewearable device10 to comfortably secure to the user's skin.

Thewearable device10 can include a substrate that is arelease liner70. Therelease liner70 can secure to one or more of the above-described substrates (such as substrate25) and can be removed prior to securement of thewearable device10 to a user. For example,release liner70 can be removed from thesubstrate25 prior to placement and/or securement of thewearable device10 on the subject's skin.

As discussed above, thewearable device10 can include awireless transceiver13 that can transmit data to (and/or receive data from) a separate device over a wireless communication protocol. Advantageously, thewearable device10 can include one or more substrates positioned between the wireless transceiver13 (and/or the circuit board105) and the subject's skin (when thedevice10 is in use) that reflect wireless signal(s) transmitted from thewireless transceiver13 away from the subject's skin. Such configuration can, among other things, help to amplify the emitted signal (for example, in a direction away from the subject's skin), which may be important especially where the wireless communication protocol utilizes a relatively short range (for example, Bluetooth® wireless communication protocols).

For example, with reference toFIGS.3A-3B, thewearable device10 can include asubstrate60 that is configured to reflect such wireless signal(s) transmitted from thewireless transceiver13 away from the subject's skin.Substrate60 can be positioned between the circuit board105 (and a wireless transceiver mounted to the circuit board105) andsubstrate50.Substrate60 can be positioned between the circuit board105 (and a wireless transceiver mounted to the circuit board105) and any ofsubstrates50,25,65, and/or therelease liner70.Substrate60 can be adhered to a surface ofsubstrate50 and/or one or more of thebattery110, thebattery holder115, and/or the mounting frame130 (seeFIG.3B and5B). With reference toFIGS.3A-3B, in some variants, thesubstrate60 is sized and/or shaped to not cover theopening55 in thesubstrate50, which can allow the probe140 (or probe240) to extend through theopening44.Substrate60 can be a polypropylene film, such as a metalized propylene film, that is configured to reflect wireless signals (for example, transmitted over Bluetooth® wireless communication protocol) away from the subject's skin when thewearable device10 is in use.

Thewearable device10 can include asubstrate65 positioned between a surface of substrate25 (or a portion of a surface of substrate25) and a surface of the substrate50 (or a portion of a surface of the substrate50). For example, thesubstrate65 can be positioned between the opening55 in thesubstrate50 and a surface of thesubstrate25. Thesubstrate65 can include an adhesive material configured to secure the substrate50 (or a portion thereof) to the substrate25 (or a portion thereof).Substrate65 can be, for example a polypropylene film.Substrate65 can cover theopening55 when secured tosubstrate50. When an end (for example, bottom end) of the probe140 (or probe240) extends through theopening55 of thesubstrate50, thesubstrate65 can cover the end of the probe140 (or probe240) and/or “bulge” at and/or around the end, for example, as shown inFIG.7.Substrate65 can advantageously coveropening55 and prevent ingress of fluid (for example, sweat) throughopening55 and toward electrical components (for example, the circuit board105) of thewearable device10 when in use. Such configuration is especially beneficial wheresubstrate25 is permeable (for example, a fabric material) and sweat from the subject's skin is present around the perimeter of theprobe140 near theopening55.

One or more ofsubstrates60,65,25, or70 can be transparent or semi-transparent. For example,FIG.2D illustratessubstrates70,25,65 as being transparent such thatprobe140 can be seen inFIG.2D. However, any or all ofsubstrates60,65,25, or70 can be not transparent.

Any or all ofsubstrates25,50,20 can be made of a material that can provide thermal insulation and/or provide thermal conductivity. For example, when thewearable device10 is positioned on and/or secured to (for example, adhered to) a subject's skin surface, one or more of thesubstrates25,50,20 can act to insulate the skin surface at, around, and/or proximate to a point or region where temperature is measured and/or where thermal energy is transmitted from the skin surface of the subject to or near one or more temperature sensors of thewearable device10. For example, when thewearable device10 is positioned on and/or secured to (for example, adhered to) a subject's skin surface, thesubstrates25,50,20 can insulate the skin surface around theopening55 and/or around the probe140 (or probe240) which can act as a conduit for thermal energy to flow from the skin surface to and/or toward one or more temperature sensors of the wearable device10 (such astemperature sensor150a). In the human body, there is a natural heat flux between the body core and the skin surface because the body core temperature is typically at a higher temperature than that of the skin surface. Thus, heat flows from the body core to the skin. By insulating the skin surface at and around theopening55 and/or the probe140 (or probe240)—thereby preventing heat from escaping—the temperature gradient between the body core and the skin surface will decrease. The skin temperature, under the insulated area will rise until it reaches equilibrium with the warmest region (i.e., the body core) underneath the insulation, thereby approaching the body core temperature. When equilibrium is reached, the skin temperature is equal to the body core temperature. One or more ofsubstrates25,50,20, which can be in direct or indirect contact with the subject's skin around theopening55, probe140 (or probe240), and/or one or more temperature sensors of thewearable device10, can possess thermal insulation properties. In some configurations, thesubstrates20 and/or50 are made of thermally insulating materials including polyurethane foam, polystyrene foam, neoprene foam, neoprene rubber, polyester (Mylar), polytetrafluoroethylene (PTFE), silicone foam, silicone rubber, or the like, and thesubstrate25 is made of a fabric having an adhesive material configured to secure to a subject's skin.

As discussed above and as shown in at leastFIGS.3A-3B, thewearable device10 can include ahousing40 which can enclose, house, and/or protect various components of thewearable device10.FIGS.4A and4B illustrate top and bottom views of thehousing40, respectively. Thehousing40 can be made of any material that is capable of adequately protecting the electronic components of thewearable device10. Thehousing40 can be rigid or alternatively, flexible. Thehousing40 can be made of and/or include thermoplastics and/or thermosetting polymers. With reference toFIG.4A, thehousing40 can have amain body41 that can include (and/or that can be defined by) atop portion41aand one or more walls (or a single, continuous wall)41bextending outward from thetop portion41aand/or around a perimeter of thetop portion41a(or a portion of a perimeter of thetop portion41a). Themain body41 can include a height that can be defined by a height of the wall(s)41b.As discussed above, a portion of thehousing40 can be positioned within and/or extend through theopening22 of thesubstrate20. For example, themain body41 can be positioned within and/or can extend through theopening22. Themain body41 can be sized and/or shaped to be received in and/or through theopening22 of thesubstrate20. Themain body41 can be sized and/or shaped to create a tight fit when positioned within theopening22 of thesubstrate20.

As shown inFIGS.4A-4B, thehousing40 can include arim44 extending around a portion of a perimeter of themain body41. Therim44 can extend around an entire perimeter of themain body41 or a portion of the perimeter of themain body41. Therim44 can be connected to and/or can extend outward from the wall(s)41b.Therim44 can be used to secure thehousing40 in position relative to one or more substrates of thewearable device10. For example, as discussed above therim44 can be positioned and/or sandwiched between thesubstrates20,50 when thewearable device10 is assembled, which can allow thehousing40 to be secured to thesubstrates20,50 and/or anyother substrates60,65,25, and/or70 discussed above.

Thewearable device10 can include one or more indicators configured to indicate a status of thewearable device10, such as whether thewearable device10 is in an operational (“on”) mode, whether thewearable device10 is pairing or has paired with a separate device, whether an error has been detected, and/or a power level of thewearable device10. For example, with reference to at leastFIG.5A, thewearable device10 can include anemitter133 configured to emit light of one or more wavelengths to indicate a status of thewearable device10. Theemitter133 can be coupled to thecircuit board105. Theemitter133 can include one or more light-emitting diodes (LEDs). Theemitter133 can emit light of certain colors to indicate certain statuses of thewearable device10. For example, theemitter133 can emit a green light to indicate that thewearable device10 is powered “on” or a red light to indicate thewearable device10 is “off”. Thehousing40 can be configured to allow light emitted from theemitter133 to be visible from a location outside an interior of thehousing40. For example, the housing40 (or a portion thereof such as the main body41) can comprise a transparent or semi-transparent material that allows light emitted from theemitter133 to be seen from a location outside an interior of thehousing40. Additionally or alternatively, thehousing40 can include an opening or hole that allows light emitted from theemitter133 to pass through thehousing40. For example, as shown inFIGS.4A-4B, thehousing40 can include ahole46 that can allow light emitted from theemitter133 to pass through thehousing40. Thehole46 can be located on themain body41, for example, on thetop portion41aof themain body41 of thehousing40. However, thehole46 can be located in an alternative location, for example, on and/or along the wall(s)41bof thehousing40. Thehole46 can be aligned with theemitter133 to allow light emitted from theemitter133 to more easily pass through thehousing40. For example, thehole46 can be vertically aligned (or at least partially vertically aligned) with theemitter133 so as to allow the light from theemitter133 to pass through thehousing40.

As discussed previously, thehousing40 can include a slot through which thebattery isolator18 can be inserted during assembly. As shown in at leastFIGS.4A-4B, theslot42 can be positioned on and/or can extend through therim44. However, the location of theslot42 is not so limited. Theslot42 can be positioned on and/or can extend through a different portion of thehousing40, for example, themain body41 or a portion thereof.

With reference toFIG.4B, thehousing40 can include one or more features that can help secure, align, and/or position thehousing40 with respect to one or more other components of thewearable device10. Such features can also assist assembly of thewearable device10. For example, thehousing40 can include one or more features that can secure, align, and/or position thehousing40 with respect to the mountingframe130 and/orcircuit board105. With reference toFIGS.4B and5A-6B, thehousing40 can comprise one ormore cavities49a,49bconfigured to receive, retain, and/or secure one ormore posts135a,135bof the mountingframe130. Thehousing40 can include one, both, or none ofcavities49a,49b.Thecavities49a,49bcan be defined and/or formed by a wall having a cylindrical shape (seeFIG.4B), among other shapes. Such wall which can define and/or form thecavities49a,49bcan extend from (for example, perpendicularly from) an interior surface of thetop portion41aof thehousing40. Thecavities49a,49bcan be positioned at or near the wall(s)41bof thehousing40. Thecavities49a,49bcan be positioned at or near opposingwalls41bor other portions of thehousing40. Thecavities49a,49bcan be sized and/or shaped to receive, retain, and/or secure the one ormore posts135a,135bof the mountingframe130 so as to prevent movement of the mounting frame130 (and/or other components coupled to the mountingframe130 such as thecircuit board105 and/or theprobe140,240) with respect to thehousing40 and/or the one or more substrates. Thecavities49a,49bcan be located opposite one another along portions of thehousing40, for example, at or near opposite sides of the housing40 (and/or main body41). While the figures illustrate thehousing40 having twocavities49a,49b,thehousing40 can have an alternative amount of cavities, such as less than or more than twocavities49a,49b.The number ofcavities49a,49bcan correspond with the number ofposts135a,135bon the mountingframe130.

With continued reference toFIG.4B, thehousing40 can include a recess43 (which can also be referred to as a “recessed portion”). Therecess43 can be located on a portion of themain body41 of thehousing40, for example, on and/or along an interior surface of atop portion41aof themain body41. Therecess43 can align with one or more temperature sensors of thewearable device10 that can be mounted to thecircuit board105. For example, with reference toFIGS.3A-3B,4B,5A, and7, therecess43 can be aligned (for example, vertically aligned), withtemperature sensor150a.Therecess43 can advantageously provide more spacing and/or distance between thetemperature sensor150aand the housing40 (such as thetop portion41aof the housing40) to prevent thetemperature sensor150afrom being influenced by a temperature of thehousing40 and/or by ambient temperature surrounding thehousing40 and/orwearable device10. Therecess43 can be circular, among other shapes. Therecess43 can gradually transition from the interior surface of thetop portion41aof themain body41 at, near, and/or around a perimeter the recess43 (seeFIG.4B and7). With reference toFIG.7, therecess43 can be recessed a given depth Di from portions of the interior surface of the housing40 (such as interior surface of thetop portion41a). The depth D₁of therecess43 can be less than a thickness T₁of thehousing40 or a portion thereof (such as a thickness of thetop portion41aof the housing40). Therecess43 can be larger than thetemperature sensor150a.For example, therecess43 can have a width, length, and/or diameter that is larger than a width, length, and/or diameter of thetemperature sensor150a(seeFIG.7).

As discussed previously, thewearable device10 can include anNFC tag30 that can allow thewearable device10 to interact with a separate computing device (such as an NFC reader of a separate device). As also discussed previously, theNFC tag30 can be secured to a portion of thehousing40. With reference toFIG.4B, thehousing40 can include analignment feature45 configured to align, position, retain, and/or secure theNFC tag30. Thealignment feature45 can be located on an interior surface of thehousing40, such as on thetop portion41aof themain body41. Thealignment feature45 can be formed by aprotrusion45aextending outward from an interior surface of the housing40 (such as an interior surface of thetop portion41aof the housing40) and extending continuously or intermittently along a portion of such interior surface. Theprotrusion45acan have a height smaller than a height of the wall(s)41bof thehousing40, for example. Thealignment feature45 can have a size and/or shape that matches a size and/or shape of theNFC tag30. Thealignment feature45 can be configured to receive theNFC tag30, for example, during assembly of thewearable device10. Thealignment feature45 can comprise a rectangular shape where theNFC tag30 comprises a rectangular shape. However, other shapes are possible for thealignment feature45 and/or theNFC tag30. Thealignment feature45 can comprise aprotrusion45aextending outward from and along an interior surface of thehousing40 in a rectangular shape. In some variants, therecess43 interrupts a perimeter of the rectangular shape defined by theprotrusions45a.

Thehousing40 can include one or more indicators configured to assist in the positioning and/or placement of thebattery isolator18 with respect to thehousing40 during assembly of thewearable device10. For example, as shown inFIG.4B, thehousing40 can include one or more ofindicators47a,47bon therim44 of thehousing40. Theindicators47a,47bcan be straight and/or parallel lines and can be spaced apart from one another. During assembly, a portion of thebattery isolator18 can be placed through theslot42 of thehousing40 and a width of thebattery isolator18 can be aligned with respect to a distance between the twoindicators47a,47b.In some cases, the distance between the twoindicators47a,47bcan match a width of thebattery isolator18. In some cases, an end of thebattery isolator18 can be positioned between the twoindicators47a,47bprior to removal of thebattery isolator18 from thehousing40 and/orwearable device10. Such positioning can advantageously allow thebattery isolator18 to be properly positioned between an electrical contact of thebattery110 and thebattery holder115 which can be in electrical communication with thecircuit board105. For example, such positioning can ensure that a portion of thebattery isolator18 is positioned between aprong115cof thebattery holder115 which can be in a middle portion of thebattery holder115 between two opposingarms115a,115bof thebattery holder115.

FIGS.5A-5D show different views of a portion of thewearable device10. As shown, thewearable device10 can include acircuit board105, abattery110, abattery holder115, a mountingframe130, and aprobe140. Thecircuit board105 can mechanically support and electrically connect various electrical components of thewearable device10 to facilitate the performance of various functions of thewearable device10. Such electrical components can include without limitation, theprocessor11,storage device12,wireless transceiver13, and one or more temperature sensors16 (such astemperature sensors150a,150b). Thecircuit board105 can be double sided, having electronic components mounted on a first and/or second side or surface thereof. Thecircuit board105 can include one or moreelectrical contacts107 which can be electrically coupled (for example, soldered) to the battery holder115 (or portions thereof). While the figures illustrate acircuit board105 which can be, for example, a rigid circuit board (such as a rigid, printed circuit board), thewearable device10 can alternatively include a flexible circuit that can electrically connect various electrical components of thewearable device10.

Thecircuit board105 or portions thereof can be sized and/or shaped to interact with the mountingframe130. For example, thecircuit board105 or portions thereof can be sized and/or shaped to be secured to, be retained by, and/or be positioned by and/or with respect to, the mountingframe130. As discussed in more detail below, a size and/or shape of anend105aof thecircuit board105 can be configured to fit within a slot defined by one or more walls of the mountingframe130. For example, theend105aof thecircuit board105 can have a width that is sized to fit within a slot defined betweenwalls133c,133dof the mountingframe130. Additionally, as discussed further below, thecircuit board105 can include one ormore openings111 that are sized and/or shaped to receive the one ormore posts135a,135bor portions thereof (such as a portion of a perimeter of theposts135a,135b). Theopenings111 can be notches, for example, and can be positioned along sides or edges of thecircuit board105. Thecircuit board105 can have anend105aand anend105bopposite theend105a.As shown in at leastFIGS.5C-5D, theend105bof thecircuit board105 can be curved. The curvature of theend105bcan match a curvature of a portion of thebattery110 and/or housing40 (for example, themain body41 of the housing), for example.

As illustrated inFIGS.5A-5D, thebattery holder115 can be attached toelectrical contacts107 on two sides and/or edges of thecircuit board105. Thebattery holder115 can form a support structure for thebattery110 and can hold thebattery110 in a stationary position relative to thecircuit board105. Thebattery holder115 can be made of electrically conductive material. Thebattery110 can provide power to the hardware components of thewearable device10 which are described herein. Thebattery110 can be a coin cell battery (such as a lithium coin cell battery). Thebattery110 can have a cathode on a first (top) side and an anode on a second (bottom) side opposite the first side. As shown in at leastFIG.5C, thebattery holder115 can include two opposingarms115a,115bwhich can be electrically connected (for example, soldered) toelectrical contacts107 of thecircuit board105 and can also include aprong115cthat can contact the anode on the bottom side of thebattery110. Theprong115ccan biased and/or can extend upward from a portion of thebattery holder115 so as to apply pressure to a portion of thebattery110 when thebattery110 is secured to thebattery holder115. During assembly and prior to use, thebattery isolator18 can be inserted between the anode of thebattery110 and theprong115cto block electrical contact between thebattery110 and thecircuit board105. As shown inFIG.5D, thecircuit board105 can include anelectrical contact157 configured to contact the cathode on the top side of thebattery110. Theelectrical contact157 can be a gold plated copper pad.

As shown in at leastFIGS.5A-5D and as discussed above, thewearable device10 can include a mountingframe130.FIGS.6A-6C illustrate various views of the mountingframe130. The mountingframe130 can secure the circuit board105 (and electrical components mounted to the circuit board105) and/or theprobe140 to thehousing40 and/or the mountingframe130 can operably position the circuit board105 (and electrical components mounted to the circuit board105) and/or theprobe140 to thehousing40. Additionally, because thebattery holder115 andbattery110 can be secured to thecircuit board105 as discussed above, the mountingframe130 can secure thebattery110 and/orbattery holder115 to thehousing40.

With continued reference toFIGS.6A-6C, the mountingframe130 can have afirst end130a,asecond end130bopposite thefirst end130a,aside130c,and aside130dopposite theside130c.The mountingframe130 can be sized and/or shaped to conform to a size and/or shape of thebattery110 or a portion thereof. For example, with reference toFIGS.5A-5D and6A-6C, theend130aof the mounting frame130 (or a portion of theend130a) can be curved to conform to a portion of a perimeter of thebattery110. Theend130a(or a portion of theend130a) can comprise a half-moon shape, among other shapes. The curvature of theend130acan match or partially match a curvature of thebattery110 or a portion thereof. Theend130acan be curved inward toward theend130bof the mountingframe130. A surface of theend130athat faces away from theend130bcan be concave, for example. At least a portion of theend130 can be sized and/or shaped to surround a portion of thebattery110, such as a portion of a perimeter of thebattery110. For example, at least a portion of theend130 can be sized and/or shaped to surround less than an entire perimeter of thebattery110, less than ½ of a perimeter of thebattery110, greater than ⅛ of a perimeter of thebattery110, greater than 2/8 of a perimeter of thebattery110, greater than ⅜ of a perimeter of thebattery110, between ⅛ and ⅞ of a perimeter of thebattery110, between ⅛ and 6/8 of a perimeter of thebattery110, between ⅛ and ⅝ of a perimeter of thebattery110, between ⅛ and ½ of a perimeter of thebattery110, approximately ½ of a perimeter of thebattery110, among other values or ranges.

Advantageously, where theend130ais sized and/or shaped to conform to a size and/or shape of the battery110 (or a portion of the battery110) and/or where theend130ais sized and/or shaped to surround a portion of thebattery110 as described above, such configuration can allow thewearable device10 to have smaller dimensions while maximizing the size of thebattery110. Minimizing overall dimensions of thewearable device10 can increase comfort and reduce the bulkiness of thewearable device10 when placed on a subject and/or handled by a user. Additionally, maximizing the size of thebattery110 in such manner can allow thewearable device10 to have a longer service life, for example, more than 1 day, more than 2 days, more than 3 days, more than 4 days, more than 5 days, more than 6 days, or more than 7 days.

The mountingframe130 or a portion thereof can be sized and/or shaped to interact with, secure, retain, and/or position thecircuit board105. For example, the mountingframe130 can include one ormore posts135a,135bwhich are configured to fit within one ormore openings111 in thecircuit board105. With reference toFIGS.5A-6B, the one ormore posts135a,135bcan fit within a space defined byopenings111 in thecircuit board105. While the figures illustrate the mountingframe130 having twoposts135a,135b,the mountingframe130 can have an alternative amount ofposts135a,135b.The mountingframe130 can have one, two, three, four, five, or six ormore posts135a,135bconfigured to interact with a corresponding number ofopenings111 in thecircuit board105. The one ormore posts135a,135bcan be positioned proximate oradjacent sides130c,130dof the mountingframe130, for example, where thecircuit board105 includesopenings111 on opposite sides and/or edges thereof. The one ormore posts135a,135bcan be positioned in an alternative location, however. The one ormore posts135a,135bcan be positioned closer to theend130athan to theend130bof the mounting frame130 (seeFIG.6B). The one ormore posts135a,135bcan be at least partially retained within theopenings111 and can limit or prevent movement of thecircuit board105 relative to the mountingframe130 in one or more directions. For example, the one ormore posts135a,135b,when positioned within theopenings111, can limit or prevent movement of thecircuit board105 relative to the mountingframe130 in one or more directions along a plane of thecircuit board105. Such plane can extend along and/or be defined by one or more surfaces of the circuit board105 (for example, opposite surfaces of the circuit board105). The one ormore posts135a,135bcan have a size and/or shape that corresponds to a size and/or shape of the openings111 (or a portion thereof). For example, the one ormore posts135a,135bcan have a cylindrical shape that allows positioning within half-circle shapedopenings111. The one ormore posts135a,135bcan extend outward from asurface131aof the mounting frame130 (seeFIGS.6A-6B). For example, the one ormore posts135a,135bcan extend transverse (for example, perpendicular) to surface131aof the mountingframe130.

The one ormore posts135a,135bcan secure to a portion of thehousing40, as discussed above. For example, the one ormore posts135a,135bcan be sized and/or shaped to secure to and/or within the one ormore cavities49a,49bof thehousing40. Accordingly, via interaction with the one ormore openings111 of thecircuit board105 and the one ormore cavities49a,49bof thehousing40, the one ormore posts135a,135bcan secure the circuit board105 (and components coupled thereto) and the mountingframe130 to thehousing40. Where the mountingframe130 is configured to secure the probe140 (or probe240) as discussed further below, the one ormore posts135a,135bcan additionally secure the probe140 (or probe240) to thehousing40. The securement of the one ormore posts135a,135bto the one ormore cavities49a,49bcan be a friction fit, for example. As another example, the one ormore posts135a,135bcan comprise a smaller cross-section than the one ormore cavities49a,49b,allowing theposts135a,135bto be received within thecavities49a,49band reduce lateral movement of the mountingframe130 andhousing40 relative to one another, but also allowing theposts135a,135bto more easily be inserted and/or removed from thecavities49a,49b(for example, during assembly of the wearable device10).

The mountingframe130 can include alternative or additional features that facilitation interaction with, securement and/or retaining of, and/or positioning of thecircuit board105. For example, the mountingframe130 can include one or more raised portions and/or one or more walls which can extend from asurface131aof the mountingframe130 and can retain a portion or portions of thecircuit board105. For example, with reference toFIGS.6A-6C, the mountingframe130 can include one or both of raisedportions133a,133band/or one or both ofwalls133c,133d.The raisedportions133a,133band/orwalls133c,133dcan be positioned proximate or adjacent theend130bof the mountingframe130. Thewalls133c,133dcan be spaced apart from one another by a distance that is sized to match a portion of thecircuit board105. For example, thewalls133c,133dcan be spaced apart from one another by a width Wi that is sized to receive a width of anend105aof the circuit board. The width of theend105acan be smaller than a width of theopposite end105bof thecircuit board105 and/or smaller than a width of another portion of the circuit board105 (seeFIG.5C). Advantageously, such configuration can allow theend105aof thecircuit board105 to be retained between thewalls133c,133dand can limit or prevent movement of thecircuit board105 relative to the mountingframe130 in one or more directions along a plane of the circuit board105 (and/or mounting frame130). Such plane can extend along and/or be defined by one or more surfaces of the circuit board105 (for example, opposite surfaces of the circuit board105). With reference toFIGS.6A-6B and5A, the raisedportions133a,133bcan provide additional or alternative securement between portions of thecircuit board105 and the mountingframe130, for example, portions of thecircuit board105 between theopenings111 and theend105a.Interaction between the raisedportions133a,133b,and/orwalls133c,and theend105aof thecircuit board105 can limit or prevent rotation of thecircuit board105 relative to the mountingframe130, for example, about an axis extending perpendicular to a surface of the circuit board105 (for example, a top and/or bottom surface of the circuit board105). Additionally or alternatively, interaction between the one ormore posts135a,135band theopenings111 of thecircuit board105 can limit or prevent rotation of thecircuit board105 relative to the mountingframe130, for example, about an axis extending perpendicular to a surface of the circuit board105 (for example, a top and/or bottom surface of the circuit board105).

As shown in at leastFIGS.6A-6C, one or both ofsides130c,130d(or portions thereof) can be curved and/or rounded. For example, one or both of surfaces of thesides130c,130dcan be convex. Alternatively, one or both ofsides130c,130dcan be straight. Where the mountingframe130 includes one or more of raisedportions133a,133b, one or both of the raisedportions133a,133bcan be adjacent thesides130c,130dand can be curved similarly as thesides130c,130d(seeFIG.6B).

With reference toFIG.6B, the mountingframe130 can include one or both ofnotches138a,138bat corners where theend130ajoins thesides130c,130d.Thenotches138a,138bcan interact with the opposingarms115a,115bof thebattery holder115 to facilitate alignment, positioning, and/or engagement between the mountingframe130 and the battery holder115 (seeFIGS.5A-5B andFIG.6B).

As discussed elsewhere herein and as shown in at leastFIGS.5A-5D, thewearable device10 can include aprobe140 that can be configured to transmit thermal energy from the subject to, toward, and/or near one or more temperature sensors of thewearable device10. The mountingframe130 can be configured to secure theprobe140 and/or operably position theprobe140 with respect a subject's skin. For example, the mountingframe130 can include an opening sized and/or shaped to receive and/or secure theprobe140 or a portion thereof. The opening can extend through a thickness or depth of the mountingframe130. The opening can be positioned adjacent or proximate to end130a,end130b,side130c,and/or130d.The opening can be a slot, for example, theslot132 shown in at leastFIGS.5C-6C. As shown, theslot132 can be positioned at and/or alongend130bof the mountingframe130. Theslot132 can be sized and/or shaped to receive and/or secure a portion of theprobe140. For example, theslot132 can be shaped and/or sized to match a size and/or shape of a portion of a cross-section and/or exterior surface or perimeter of theprobe140. Theslot132 can comprise a circular or partially circular shape, for example, where theprobe140 has a cylindrical shape. Theslot132 can be positionedadjacent end130bso as to allow theprobe140 to be inserted into theslot132 along a direction that is transverse (for example, perpendicular) to an axis extending through a center of theslot132. Additionally or alternatively, theslot132 can be sized, shaped, and/or positioned to allow the probe140 (or a portion thereof) to be inserted into theslot132 along a direction that is parallel to such axis extending through a center of theslot132. Theslot132 can be sized and/or shaped to surround a portion of theprobe140. For example, theslot132 can be sized and/or shaped to surround a portion of a cross-section and/or exterior surface or perimeter of theprobe140. For example, the mountingframe130 and/or theslot132 can be configured such that, when theprobe140 is secured to the mountingframe130, the mountingframe130 surrounds less than an entire perimeter of a cross-section of theprobe140, greater than ¼ of a perimeter of a cross-section of theprobe140, greater than ½ of a perimeter of a cross-section of theprobe140, greater than ¾ of a perimeter of a cross-section of theprobe140, approximately ½ of a perimeter of a cross-section of theprobe140, approximately ¾ of a perimeter of a cross-section of theprobe140, or any value therebetween, or any range bounded by any combination of these values, although values and ranges outside these values or ranges can be used in some cases.

As discussed in more detail below, theprobe140 can have abody144 having a recessedportion146 which has a cross-section that is smaller than a cross-section of thebody144 of theprobe140. Theslot132 can be sized and/or shaped to receive a size and/or shape of the recessedportion146 of theprobe140, for example. Theslot132 can have a depth (oriented vertically in the view ofFIGS.5C-5D) that is less than, equal to, or greater than a height (oriented vertically in the view ofFIGS.5C-5D) of the recessedportion146 of theprobe140 which extends along a portion of a height of thebody144 of theprobe140. With reference toFIGS.6A-6C, theslot132 can include one ormore protrusions139 extending along the depth of the slot132 (or a portion of the depth of the slot132). For example, theslot132 can include, one, two, three, four, five, or six ormore protrusions139. The one ormore protrusions139 can be spaced from one another, equidistantly or non-equidistantly, along a length (or width) of the slot132 (seeFIGS.6A-6C). Theprotrusions139 can extend outward from (for example, perpendicular to) a surface of theslot132. Theprotrusions139 can be rigid or alternatively, non-rigid (for example, flexible). Theprotrusions139 can engage a portion of theprobe140 when theprobe140 is positioned within theslot132. For example, theprotrusions139 can engage the recessedportion146 of theprobe140 when theprobe140 is positioned within theslot132. Theslot132 can secure theprobe140 in a friction-fit engagement and/or snap-fit engagement, or other type of engagement for example.

When theprobe140 is secured within theslot132, the probe140 (and/or an axis extending through a center of the probe140) can be oriented transverse (for example, perpendicular) to a plane and/or surface of the mountingframe130. For example, when theprobe140 is secured within theslot132, theprobe140 can be oriented perpendicular to thesurface131aof the mountingframe130. Additionally or alternatively, when theprobe140 is secured within theslot132 of the mountingframe130, theprobe140 can be oriented perpendicular to the circuit board105 (and/or a surface or plane of the circuit board105). Such positioning can help theprobe140 make contact with (whether direct, or indirect viasubstrates65 and/or25) and/or apply pressure to a portion of the subject's skin to facilitate transmission of thermal energy through theprobe140 to and/or near other portions of the wearable device10 (such as towardtemperature sensor150a).

With reference toFIGS.6A-6B, the mountingframe130 can include a recessedportion137 that can be recessed fromsurface131aof the mountingframe130. The recessedportion137 can be positioned proximate oradjacent end130bof the mountingframe130. The recessedportion137 can be positioned around theslot132. A perimeter of the recessedportion137 can be larger than a perimeter of theslot132. The perimeter of the recessedportion137 can be spaced outward from the perimeter of the slot132 (seeFIG.6B). The recessedportion137 can be recessed from thesurface131aa depth (oriented vertically in the view ofFIGS.5C-6A) that is sized to correspond to a height of a portion of theprobe140. For example, the recessedportion137 can be recessed from thesurface131aa depth that is sized to correspond to a height (oriented vertically in the view ofFIGS.5C-5D) of atop portion148 of theprobe140 which is discussed in more detail below. Such configuration can allow a height of thetop portion148 of theprobe140 to fit within the depth of the recessedportion137 when theprobe140 is secured within theslot132.

As discussed elsewhere herein and as illustrated inFIG.7, thewearable device10 can include aprobe140 that can act as a conduit to transmit thermal energy from the subject's skin to, toward, and/or near one or more temperature sensors of thewearable device10. As shown in at leastFIGS.5C-5D, theprobe140 can comprise afirst end142a,asecond end142bopposite thefirst end142a,and abody144. The probe140 (and/orbody144 of probe140) can include a height extending between the first and second ends142a,142b.Theprobe140 can comprise a variety of shapes and/or sizes. Theprobe140 can comprise a cylindrical shape among others. As shown, thebody144 can comprise a recessedportion146 extending along a portion of thebody144 of theprobe140. The recessedportion146 can be recessed from an outer surface of thebody144. The recessedportion146 can assist theprobe140 in securing to and/or within theslot132 of the mountingframe130. For example, a height of the recessedportion146 can be sized to correspond to a depth of theslot132 of the mountingframe130 so as to allow portions of thebody144 proximate the recessedportion146 to engage top and bottom surfaces of the mounting frame (and/or recessedportion137 of the mounting frame130) when theprobe140 is received within theslot132. As discussed above, theslot132 can include one ormore protrusions139 along a width of theslot132. The recessed depth of the recessedportion146 of theprobe140 can be sized to fit a distance that the one ormore protrusions139 extend outward from the surface of theslot132. Additionally or alternatively, the height of the recessedportion146 of theprobe140 can be sized to fit a height of the one ormore protrusions139. For example, the one ormore protrusions139 can extend outward from a surface of the slot132 a given distance that corresponds to a depth of the recessed portion146 (with respect to the outer surface of body144). As another example, the one ormore protrusions139 can have a height extending along a depth of theslot132 that corresponds to a height of the recessedportion146. The height of the recessedportion146 can extend along a portion of the height of the probe140 (“vertically” given the orientation shown inFIGS.5C-5D).

As discussed above, thewearable device10 can include one or more temperature sensors.FIGS.5A,5C, and5D illustrate atemperature sensor150apositioned on a first surface of thecircuit board105. When theprobe140 is secured to the mountingframe130, theprobe140 can be aligned with and/or positioned proximate to thetemperature sensor150a.For example, with respect toFIGS.5A-5B, when theprobe140 is secured to the mounting frame130 (for example, within the slot132), theprobe140 can be vertically aligned with thetemperature sensor150a.For example, an axis extending through a center of theprobe140 can extend through thetemperature sensor150a,and such axis can be perpendicular to a surface or plane of thecircuit board105. When theprobe140 is secured to the mounting frame130 (for example, within the slot132), theend142aof theprobe140 can be positioned proximate or adjacent a surface (for example, bottom surface) of thecircuit board105 proximate thetemperature sensor150a.As another example, when theprobe140 is secured to the mounting frame130 (for example, within the slot132), theend142aof theprobe140 can be positioned adjacent a first surface (for example, bottom surface) of thecircuit board105 and thetemperature sensor150acan be positioned adjacent a second surface (for example, a top surface) of thecircuit board105 and theprobe140 and thetemperature sensor150acan be aligned. As another example, when theprobe140 is secured to the mounting frame130 (for example, within the slot132), thecircuit board105 can be positioned between theprobe140 and thetemperature sensor150a.

Thewearable device10 can include a thermally conductive material and/or layer between theend142aof theprobe140 and a surface of thecircuit board105. For example, with reference toFIGS.5C-5D, thewearable device10 can include athermal paste173 positioned between theend142aof theprobe140 and a surface of the circuit board105 (for example, a bottom surface of thecircuit board105 given the orientation shown inFIGS.5C-5D). Thethermal paste173 can be aligned (for example, vertically aligned) with theprobe140 and/or thetemperature sensor150a.Thethermal paste173 can comprise zinc oxide, for example. Thethermal paste173 can be silicone free. Thethermal paste173 can comprise a circular shape, among other shapes. For example, thethermal paste173 can be in the form of a disc. Thethermal paste173 can conform to a shape of theprobe140 and/or can deform when positioned between thecircuit board105 and theprobe140. Thethermal paste173 can reduce or prevent air gaps betweenend142aof theprobe140 and thecircuit board105 and thus increase thermal transmissivity.

With reference toFIG.5D, thecircuit board105 can include one ormore openings159 extending through thecircuit board105. For example, the one ormore openings159 can extend through a thickness of thecircuit board105 and/or between opposing surfaces (for example, top and bottom surfaces) of thecircuit board105. The one ormore openings159 can be located adjacent to thetemperature sensor150a,thethermal paste173, and/or the probe140 (for example, end142aof the probe140). The one ormore openings159 can allow thermal energy to flow from theprobe140 and/orthermal paste173 through thecircuit board105 to thetemperature sensor150a.In such configuration, the one ormore openings159 can provide a passageway by which such thermal energy can flow from theprobe140 and/orthermal paste173 through thecircuit board105 and to thetemperature sensor150a.The circuit board150 can include one, two, three, four, five, six, seven, eight, nine, or ten ormore openings159. The circuit board150 can include between one and twentyopenings159, between one and tenopenings159, between one and fiveopenings159, for example. Thecircuit board105 can include a plurality ofopenings159, for example, more than two, more than three, more than four, more than five, more than six, more than seven, or more than eightopenings159. Thecircuit board105 can include a plurality ofopenings159 arranged in an array and/or pattern. For example, thecircuit board105 can include a plurality ofopenings159 arranged in an array having a rectangular shape (seeFIG.5D), square shape, circular shape, among others. The plurality ofopenings159 can be spaced equidistantly from one another in some cases.

Wheresuch openings159 are arranged in an array, dimensions of the array can correspond to dimensions of theprobe140 to ensure that thermal energy flowing through theend142aof theprobe140 is conveyed through thecircuit board105 to thetemperature sensor150aefficiently. For example, where theprobe140 has a circular cross-section, thecircuit board105 can include a plurality ofopenings159 arranged in a circular array having a diameter that is less than, equal to, or greater than a diameter of the circular cross-section of theprobe140. As another example, where theprobe140 has a circular cross-section, thecircuit board105 can include a plurality ofopenings159 arranged in a non-circular array (e.g., a square or rectangular array) whose length and/or width dimensions are less than, equal to, or greater than a diameter of the circular cross-section of theprobe140. As another example, where theprobe140 has a cross-section having a length and width, a length and/or width of an array of the plurality ofopenings159 can be less than, equal to, or greater than such length and/or width of the cross-section of theprobe140.

In some variants, the one ormore openings159 include (for example, are filled with) a thermally conductive material, such as gold and/or copper, to increase thermal transmissivity through thecircuit board105. When thewearable device10 is assembled, the one or more openings159 (and/or an array formed by a plurality of the openings159) can align with thetemperature sensor150a,thethermal paste173, the probe140 (for example, an axis extending through a height of the probe140), theslot132 of the mountingframe130, and/or theopening55 ofsubstrate50. In some implementations, an axis extending through a center of an array defined by a plurality ofopenings159 can align with thetemperature sensor150a,thethermal paste173, the probe140 (for example, an axis extending through a height of the probe140), theslot132 of the mountingframe130, and/or theopening55 ofsubstrate50. Each of the one ormore openings159 can be smaller than opening55 ofsubstrate50 and/or smaller thanslot132 in mountingframe130, each of which are discussed elsewhere herein. Where thecircuit board105 includes a plurality ofopenings159 arranged in an array, the region or area defining and/or forming the boundary of such array can be smaller than opening55 ofsubstrate50 and/or smaller thanslot132 in mountingframe130.

With continued reference toFIGS.5C-5D, thethermal paste173 can be positioned between the one ormore openings159 of thecircuit board105 and the thermallyconductive probe140. Thethermal paste173 can be positioned between a surface of thecircuit board105 and the thermallyconductive probe140. Thethermal paste173 can be positioned betweenend142aof the thermallyconductive probe140 and a surface of thecircuit board105. Thethermal paste173 can be positioned betweenend142aof the thermallyconductive probe140 and the one ormore openings159 of thecircuit board105.

With continued reference toFIG.5D, thewearable device10 can include a thermallyconductive pad155 positioned adjacent to the one ormore openings159 and a surface (for example, a bottom surface) of thecircuit board105. The thermallyconductive pad155 can be positioned between the one ormore openings159 and thethermal paste173 and/or theprobe140. The thermallyconductive pad155 can increase thermal transmissivity of thermal energy from theprobe140 and thethermal paste173 to the one ormore openings159 through thecircuit board105 and to thetemperature sensor150a.The thermallyconductive pad155 can be metallic. For example, the thermallyconductive pad155 can include gold and/or copper.

FIG.7 illustrates a cross-section view taken along a portion of the assembled view of thewearable device10 shown inFIG.2C when placed adjacent skin of a subject. As shown, when theprobe140 is secured to the mounting frame130 (for example, within the slot132) and the mountingframe130 is secured to thehousing40, theend142bof theprobe140 can be positioned in proximity to the subject's skin. As also shown, theprobe140 can apply pressure to and/or press against a portion of the skin of a subject when thewearable device10 is placed on and/or secured to the subject. Where thewearable device10 includessubstrates65 and/or25 coupled with the housing40 (for example, via securement to substrate50), thesubstrates65,25 can be positioned between theend142bof theprobe140 and the skin of the subject when thewearable device10 is secured to the user. As discussed previously, the substrate50 (which can comprise foam), can include anopening55 that is sized and/or shaped to allow a portion of theprobe140 to extend therethough.

In some implementations, theprobe140 extends throughopening55 and beyond a surface of substrate50 (for example, a “bottom” surface of substrate50) a distance that is equal to or greater than approximately 0.01 inch, approximately 0.02 inch, approximately 0.03 inch, approximately 0.04 inch, approximately 0.05 inch, approximately 0.06 inch, approximately 0.07 inch, approximately 0.08 inch, approximately 0.09 inch, approximately 0.1 inch, approximately 0.2 inch, approximately 0.3 inch, approximately 0.4 inch, or approximately 0.5 inch, or any value or range between any of these values, or any value or range bounded by any combination of these values. In some implementations, theprobe140 extends throughopening55 and beyond a surface of substrate50 (for example, a “bottom” surface of substrate50) a distance that is between approximately 0.01 inch and approximately 0.5 inch, for example, between approximately 0.02 inch and approximately 0.4 inch, between approximately 0.03 inch and approximately 0.3 inch, between approximately 0.04 inch and approximately 0.2 inch, between approximately 0.05 inch and approximately 0.1 inch, between approximately 0.06 inch and approximately 0.09 inch, between approximately 0.07 inch and approximately 0.08 inch, between approximately 0.05 inch and approximately 0.2 inch, or between approximately 0.09 inch and approximately 0.2 inch, or any value or range between any of these values or ranges, or any value or range bounded by any combination of these values. Alternatively, in some implementations, theprobe140 does not extend beyond the bottom surface of thesubstrate50. For example, in some implementations, theprobe140 extends through theopening55 but terminates at the bottom surface of thesubstrate50 such that a plane of theend142bof theprobe140 is generally parallel to a plane of the bottom surface of thesubstrate50.

When thewearable device10 is assembled and placed and/or secured to the subject's skin and theend142bof theprobe140 extends through theopening55 ofsubstrate50, thesubstrate65 and/orsubstrate25 can be positioned between the subject's skin surface and theend142bof theprobe140. Accordingly, in such configuration, the probe140 (for example, theend142bof the probe140) can indirectly contact a portion of the subject's skin. As discussed above, thesubstrate65 can cover theopening55 and theend142bof theprobe140 and prevent fluid (for example, sweat) ingress through theopening55 and to an interior of thehousing40, for example, to and/or toward electrical components of thewearable device10. As also discussed above,substrate25 can comprise a thermally conductive material and/or can be configured to allow thermal energy to pass from the subject's skin to theend142bof theprobe140. As also discussed above, any ofsubstrates25,65,50, and/or20 can advantageously insulate portions of the subject's skin. When a portion of theprobe140 is positioned through the opening55 (for example, theend142bthrough theopening55 of the substrate55), thesubstrates25,20,65, and/or50 can insulate portions of the subject's skin around and/or underneath theend142bof theprobe140, which can allow theprobe140 to transmit thermal energy indicative of the subject's core body temperature, as discussed previously.

Theprobe140 can comprise thermally conductive material that allows theprobe140 to transmit and/or act as a conduit for thermal energy of the subject. Thus, thermal energy from the subject's skin can pass throughsubstrates25 and/or65, and theprobe140. As discussed above, theprobe140 can comprise aluminum, for example, among other thermally conductive materials. As also discussed above, theprobe140 can be rigid, which can allow theprobe140 to apply pressure to a portion of the subject's skin. Such application of pressure to a portion of the subject's skin can allow theprobe140 to better receive thermal energy from the subject. For example, theprobe140 can be not compressible and/or not extendible (for example, not compressible and/or not extendible relative to a longitudinal axis extending along a height of the probe140). As another example, theprobe140 can be not compressible and/or not extendible relative to a longitudinal axis extending through a center of a cross-section of theprobe140.

As discussed above and as illustrated inFIG.7, theend142aof theprobe140 can be positioned adjacent a first surface of the circuit board105 (for example, a “bottom” surface of the circuit board105) and thetemperature sensor150acan be positioned adjacent a second surface of the circuit board105 (for example, a “top” surface of the circuit board105). As also discussed above, athermal paste173 can be positioned between theend142aof theprobe140 and the circuit board150. As also discussed above, a thermallyconductive pad155 can be positioned between one ormore openings159 in thecircuit board105 and thethermal paste173 and/or theprobe140. The one ormore openings159 can allow thermal energy to pass through thecircuit board105 to thetemperature sensor150a.

As thermal energy is transmitted to thetemperature sensor150a,thetemperature sensor150acan determine a body temperature of the subject and/or can generate and transmit one or more signals responsive to the thermal energy to theprocessor11 of thewearable device10. Thetemperature sensor150acan be or include, a thermocouple and/or a thermistor, for example. Thetemperature sensor150acan be a chip that is electrically and mechanically coupled with thecircuit board105. Thetemperature sensor150acan be configured to generate one or more signals responsive to detected thermal energy, determine body temperature, and/or transmit such generated one or more signals and/or such determined body temperature to theprocessor11 of thewearable device10 continuously and/or intermittently. For example,temperature sensor150acan be configured to generate one or more signals responsive to detected thermal energy, determine body temperature, and/or transmit such generated one or more signals and/or such determined body temperature every 0.5 seconds, 1 second, 2 second, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 30 seconds, 1 minute, 2 minute, 3 minutes, 4 minutes, 5 minutes, or at other intervals.

In addition totemperature sensor150a,thewearable device10 can include one or more additional temperature sensors. For example, with reference toFIG.5C, thewearable device10 can includetemperature sensor150b.Similar totemperature sensor150a,temperature sensor150bcan be electrically and/or mechanically coupled to thecircuit board105.Temperature sensor150bcan be spaced away from thetemperature sensor150a.Temperature sensor150bcan be used to detect a temperature within an interior of thehousing40 and/or proximate thecircuit board105, for example.Temperature sensor150bcan be used to measure an ambient temperature, for example, a temperature outside the interior of thehousing40.

In some implementations, thetemperature sensor150bis surrounded by a material in order to isolate thetemperature sensor150bfrom nearby electrical components and/or to prevent thetemperature sensor150bfrom being thermally influenced by the temperature of the interior of thehousing40 so that thetemperature sensor150bcan better measure ambient temperatures outside thehousing40. For example, with reference toFIGS.5A and5C, thewearable device10 can include athermal putty120 which can be positioned around and/or adjacent to thetemperature sensor150b.Thermal putty120 can be positioned between thetemperature sensor150band an interior surface of thetop portion41aof the housing40 (seeFIGS.5A,5C, and4B). For example, thethermal putty120 can extend from a surface of thecircuit board105 around thetemperature sensor150boutward (for example, “upward” given the view shown inFIGS.5A and5C) to the interior surface of thetop portion41aof thehousing40. Advantageously, thethermal putty120 can transmit thermal energy from the surface of the housing40 (which is in thermal contact with ambient) to thetemperature sensor150b.Thethermal putty120 can deform and/or conform to a shape of a portion of the interior surface of thetop portion41aof thehousing40 in order to better facilitate the transfer of thermal energy from the interior surface (and ambient) to thetemperature sensor150b.Thetemperature sensor150bcan be configured to generate one or more signals based on received thermal energy, whether from the interior of thehousing40 or from ambient (for example, via the thermal putty120). Thethermal putty120 can be a ceramic filled silicone sheet, for example.

Thetemperature sensor150bcan be configured to generate one or more signals responsive to detected thermal energy, determine temperature, and/or transmit such generated one or more signals and/or such determined temperature to theprocessor11 of thewearable device10 continuously and/or intermittently. For example,temperature sensor150bcan be configured to generate one or more signals responsive to detected thermal energy, determine temperature, and/or transmit such generated one or more signals and/or such determined temperature every 0.5 seconds, 1 second, 2 second, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 30 seconds, 1 minute, 2 minute, 3 minutes, 4 minutes, 5 minutes, or at other intervals. Such generated one or more signals, determined temperature, and/or transmission of such generated one or more signals and/or determined temperature can be simultaneous or non-simultaneous with the generated one or more signals, determined body temperature, and/or transmitted one or more signals and/or determined body temperature fromtemperature sensor150a.

Advantageously, incorporating both oftemperature sensors150a,150bcan allow thewearable device10 to more accurately determine a core body temperature of the user. For example, theprocessor11 can utilize temperature data from thetemperature sensor150bin order to adjust or “correct” temperature data received from thefirst temperature sensor150ain order to more accurately determine a subject's core body temperature. For example, theprocessor11 can compare temperature data received from both of thetemperature sensors150a,150band determine a corrected body temperature based on such comparison. Theprocessor11 can apply weight factors to one or both of temperature data received fromtemperature sensors150a,150band/or otherwise compare such received data to determine a corrected body temperature.

As discussed above and with continued reference toFIG.7, thehousing40 can include arecess43 that is recessed a depth D₁from portions of the interior surface of the housing40 (such as interior surface of thetop portion41a) which is less than a thickness T₁of the housing40 (such as a thickness of thetop portion41aof the housing40). Therecess43, depth D₁, and thickness T₁are illustrated inFIG.7. As discussed above, therecess43 can advantageously provide more spacing and/or distance between thetemperature sensor150aand the housing40 (such as thetop portion41aof the housing40) to prevent thetemperature sensor150afrom being influenced by the temperature of thehousing40 and/or ambient temperature surrounding thehousing40 and/orwearable device10.

FIGS.8A-8D illustrate an alternative design for anelectronics assembly200 that can be incorporated within thewearable device10. Theelectronics assembly200 can be the same in some or many respects to theelectronics assembly100 discussed above. More specifically, some or many of the components that can form and/or be part of theelectronics assembly100 as discussed above can also form and/or be part of theelectronics assembly200. For example, theelectronics assembly200 can be formed from thecircuit board105,battery110,battery holder115, mountingframe130,temperature sensor150a,thermal putty120,temperature sensor150b,thermal paste173, thermallyconductive pad155, one ormore openings159, and/oremitter133, along with one or more other components that are discussed below with reference toFIGS.8A-10B. Accordingly, the discussion above with reference to any or all of these components and/or other components discussed above is equally applicable to theelectronics assembly200 and components that can form theelectronics assembly200. As mentioned above, the use of the phrase “electronics assembly” or the reference numeral “200” in the present disclosure is not intended to be limiting, but rather, is merely intended as a way to refer to one or more components of thewearable device10, for example, which can be enclosed by thehousing40 and/or one or more ofsubstrates70,25,65,50,65, and/or20.

FIGS.8A-8D illustrate an alternative design for aprobe240.FIGS.8A-8B illustrate an assembled view whereprobe240 is secured to the mounting frame130 (and other components of the wearable device10) andFIGS.5C-5D illustrate an exploded view of theprobe240 along with other components of thewearable device10.FIGS.8A-8D also illustrate aflexible circuit230 and atemperature sensor150cwhich can be coupled to a portion of theflexible circuit230. Theflexible circuit230 can include a first end orportion232 which can be coupled totemperature sensor150aand/or thecircuit board105 proximate a first surface of the circuit board105 (for example, a “top” surface of the circuit board105) and a second end orportion234 that can be coupled with and/or can support thetemperature sensor150c.Theflexible circuit230 can include astem236 which can be connected to the first and second portions (or ends)232,234 of theflexible circuit230.

Similar to as discussed with respect to probe140, theprobe240 can be rigid. For example, theprobe240 can be not compressible and/or not extendible (for example, not compressible and/or not extendible relative to a longitudinal axis extending along a height of the probe240). As another example, theprobe240 can be not compressible and/or not extendible relative to a longitudinal axis extending through a center of a cross-section of theprobe240.

FIGS.9A-10B together illustrate theprobe240. Theprobe240 can include a receptacle260 (FIGS.9A-9B) and an insert250 (FIGS.10A-10B) configured to be received within a portion of the receptacle260 (which can also be referred to as a “housing260”). Theinsert250 can include afirst end252, asecond end254 opposite thefirst end252, abody258, and ahead256. Thebody258 can comprise a cylindrical shape, among others. Thehead256 of theinsert250 can be flared outward around a portion of thebody258. Thehead256 of theinsert250 can be tapered. Thehead256 of theinsert250 can extend around a portion of a perimeter of thebody258 and/or can be positioned at or near theend252. Thehead256 can have a cross-section that increases from a region where thehead256 connects to thebody258 to theend252. Thehead256 can have a frustoconical shape, as illustrated inFIGS.10A-10B. As discussed below, thebody258 can be sized and/or shaped to fit within acavity268 of thereceptacle260. As also discussed below, thehead256 can be sized and/or shaped to fit within atapered recess265 of thereceptacle260.

Thereceptacle260 can include afirst end260a,a second end opposite thefirst end260b,and abody262. Thereceptacle260 can include ahead264 which extends outward from thebody262 and/or which has a cross-section that is greater than a cross-section of thebody262. Thehead264 can be located at or near theend260aof thereceptacle260. Thebody262 can be cylindrical, among other shapes, similar to the shape of the body of theprobe140, for example. Thehead264 can be sized and/or shaped to fit within the recessedportion137 of the mountingframe130 discussed above with reference toFIGS.6A-6C. Thehead264 can comprise a square or rectangular shape, for example, and thehead264 can have rounded corners. A height (or thickness) of thehead264 can be sized to match a depth of the recessedportion137 of the mountingframe130 so as to allow thehead264 to fit within the space defined by the recessedportion137. Such configuration can allow the receptacle260 (and the probe240) to be at least partially secured to the mountingframe130. Similar to thebody144 of theprobe140, thebody262 of thereceptacle260 can be sized and/or shaped to fit within theslot132 of the mountingframe130. Accordingly, the discussion above with reference to the securement and/or positioning of theprobe140 within theslot132 of the mountingframe130 is equally applicable to the probe240 (and receptacle260).

Thereceptacle260 can include aprotrusion269 extending outward from a portion of a surface of the body262 (seeFIGS.9A-9B). Theprotrusion269 can extend outward from the surface of thebody262 and have a flat or planar end which can provide a flat surface by which thestem236 of theflexible circuit230 can rest against and/or contact, which can help with alignment and/or positioning of thestem236 andflexible circuit230 with respect to thereceptacle260 and theprobe240. Theprotrusion269 can be circular shaped, for example, or another shape.

Thereceptacle260 can include acavity268 extending through a portion of a height of the receptacle260 (for example, the body262). Thecavity268 can extend along an axis aligned with a height of thereceptacle260 and/or extending through a center of a cross-section of thereceptacle260. Thereceptacle260 can additionally include anopening266 positioned along an outer surface of thebody262. Theopening266 can extend inward from the outer surface of thebody262 towards an interior of thebody262. Theopening266 can meet and/or join thecavity268 within an interior of thebody262. An axis extending through the opening266 (e.g., a center of the opening266) can be transverse (for example, perpendicular) to an axis extending through the cavity268 (e.g., a center of the cavity268). Theopening266 can be positioned proximate theend260bof thereceptacle260. Theopening266 can be positioned closer to theend260bthan to theend260aof thereceptacle260.

Thecavity268 can be sized and/or shaped to receive theinsert250 or a portion thereof. For example, thecavity268 can be sized and/or shaped to receive thebody258 of theinsert250. Thecavity258 can be cylindrical, among other shapes, for example. Thehead264 of thereceptacle260 can include atapered recess265 around thecavity268. Thetapered recess265 can be sized and/or shaped to receive thehead256 of theinsert250 such that, when thebody258 is positioned within thecavity268, theend252 of theinsert250 sits “flush” (for example, on the same plane) with a surface of theend260aand/or thehead264 of thereceptacle260.

With reference toFIGS.8C-8D, thetemperature sensor150ccan be coupled to theend234 of theflexible circuit230 which can be positioned within theopening266 of thereceptacle260. Theinsert250 can be positioned within thecavity268 of thereceptacle260 such that theend254 of theinsert250 is positioned proximate or adjacent (for example, above) thetemperature sensor150c.For example, when theinsert250 is positioned within thecavity268 of thereceptacle260, theend254 of theinsert250 can contact thetemperature sensor150c.When theprobe240 is secured to the mountingframe130, for example, via securement of thereceptacle260 within theslot132 of the mountingframe130, theprobe240 can transmit thermal energy from a subject in a similar manner as theprobe140 described above. For example, theend260bof theprobe240 can be positioned adjacent skin of the subject when thewearable device10 is secured to the subject. Similar to theend142bof theprobe140, theend260bcan contact (for example, indirectly viasubstrates25 and/or65), apply pressure to, and/or press into the subject skin. Where thewearable device10 includes one or more ofsubstrates25 and/or65, thesubstrates25 and/or65 can be positioned between theend260bof theprobe240 and the subject's skin when thewearable device10 is secured to or placed on the subject's skin. Theprobe240 or portions thereof (such as thereceptacle260 and/or the insert250) can comprise thermally conductive material similar to that described with reference to theprobe140. For example, theprobe240 or portions thereof (such as thereceptacle260 and/or the insert250) can comprise a metallic material, such as aluminum.

Similar to that discussed with reference to probe140, a portion of the probe240 (for example, a portion of the receptacle260) can be positioned through anopening55 in thesubstrate50. The discussion above with reference to the extent to whichprobe140 can extend throughopening55 and/or beyond a surface of thesubstrate50 is equally applicable to probe240. In such configuration, when portions of thesubstrate25 and/or65 are secured to the subject's skin around theprobe240, theend260bcan apply pressure to and/or press into a portion of the skin, which can allow theprobe240 to better transmit thermal energy from within the skin. Thermal energy from the skin surface, which can be insulated and/or isolated by one or more ofsubstrates25,50,65 and/or20, can be transmitted through theend260bto thetemperature sensor150cpositioned within theopening266. Thetemperature sensor150ccan determine a body temperature of the subject and/or can generate and transmit one or more signals responsive to the detected thermal energy to theprocessor11, for example, via theflexible circuit230. The thermal energy from the subject's skin surface can also be transmitted from theend260bthrough thereceptacle260 and/or insert250 to thetemperature sensor150a.Such transmitted thermal energy can be transmitted through thethermal paste173, through the thermallyconductive pad155, and the one ormore openings159 in thecircuit board105 similar to as discussed above with reference toFIG.5D.

Thetemperature sensor150ccan be configured to generate one or more signals responsive to detected thermal energy, determined body temperature, and/or transmit such generated one or more signals and/or such determined body temperature to theprocessor11 of thewearable device10 continuously and/or intermittently. For example,temperature sensor150ccan be configured to generate one or more signals responsive to detected thermal energy, determine body temperature, and/or transmit such generated one or more signals and/or such determined temperature every 0.5 seconds, 1 second, 2 second, 3 seconds, 4 seconds, 5 seconds, 10 seconds, 30 seconds, 1 minute, 2 minute, 3 minutes, 4 minutes, 5 minutes, or at other intervals. Such temperature data can be measured and/or transmitted simultaneous of non-simultaneous with temperature data measure and/or transmitted bytemperature sensor150aand/or150bwhich is discussed elsewhere herein.

Incorporating both oftemperature sensor150aand150ccan advantageously provide more robust measurements of core body temperature. As shown,temperature sensor150ccan be aligned (for example, vertically aligned withtemperature sensor150aand spaced fromtemperature sensor150aalong an axis that extends parallel to a height of theprobe240. Similar totemperature sensor150a,temperature sensor150ccan be spaced away from thetemperature sensor150b.Because thetemperature sensor150cis positioned closer to the subject's skin surface and also closer to theend260bof the probe than thetemperature sensor150a,the difference or gradient of detected temperature values fromsensors150a,150ccan be used by theprocessor11 for purposes of comparison. Additionally, where thewearable device10 includes all oftemperature sensors150a,150b,150c,theprocessor11 can determine a core body temperature of the subject based on comparisons of temperature data measured by each of thetemperature sensors150a,150b,150c.Theprocessor11 can apply weight factors to any or all of temperature data received fromtemperature sensors150a,150b,150cand/or otherwise compare such received data to determine a corrected body temperature.

The various devices, methods, and/or systems discussed above can be used for monitoring a subject's physiological information. For example, as discussed above, thewearable device10 can be used to measure a subject's temperature, among other things, over time. As discussed above, thewearable device10 can be configured to wirelessly communicate with (for example, via awireless transceiver13 of the wearable device10) a separate computing device, such as a patient monitor and/or a mobile device (e.g., smart phone). Thewearable device10 can wirelessly transmit physiological data (such as temperature data) over time (continuously or periodically) to such separate computing device for display, among other things. As also discussed above, thewearable device10 can wirelessly transmit processed or unprocessed obtained physiological information to a mobile phone (for example) which can include one or more hardware processors configured to execute an application that generates a graphical user interface displaying information representative of the processed or unprocessed physiological information obtained from thewearable device10. Such graphical user interfaces can display continuous and/or periodic measurements obtained from thewearable device10, display and/or issue various types of alerts, display physiological trend information (for example, temperature trends), among other things. Features or aspects displayed by such graphical user interfaces can include, without limitation, a splash screen, onboarding, device setup, instructions (for example, both visual/graphical and textual) for securing thewearable device10 to a subject and/or pairing thewearable device10 to the separate computing device, temperature data and/or trending dashboard, user scenarios, notes (such as medication notes and reminders as well as other user activity notes), temperature trending data and information, user settings and profiles, app settings, and alerts and push notifications.

Any and all of the wearable devices discussed herein can be utilized in systems and/or methods for monitoring and managing health status, exposure levels, and/or risk state of one or more users in relation to a variety of infections or illnesses, such as those described in co-pending U.S. patent application Ser. No. 17/206,794, filed on Mar. 19, 2021, titled “HEALTH MONITORING SYSTEM FOR LIMITING THE SPREAD OF AN INFECTION IN AN ORGANIZATION,” which is hereby incorporated by reference in its entirety.

Any and all of the wearable devices discussed herein can be utilized in systems and/or methods for remote patient care and monitoring of one or more users in relation to a variety of infections or illnesses, such as those described in co-pending U.S. patent application Ser. No. 17/207,469, filed on Mar. 19, 2021, titled “REMOTE PATIENT MANAGEMENT AND MONITORING SYSTEMS AND METHODS,” which is hereby incorporated by reference in its entirety.

Additional Considerations and Terminology

Although this invention has been disclosed in the context of certain preferred embodiments, it should be understood that certain advantages, features and aspects of the systems, devices, and methods may be realized in a variety of other embodiments. Additionally, it is contemplated that various aspects and features described herein can be practiced separately, combined together, or substituted for one another, and that a variety of combination and subcombinations of the features and aspects can be made and still fall within the scope of the invention. Furthermore, the systems and devices described above need not include all of the modules and functions described in the preferred embodiments.

Conditional language used herein, such as, among others, “can,” “could,” “might,” “may,” “e.g.,” and the like, unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain features, elements, and/or steps are optional. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required or that one or more embodiments necessarily include logic for deciding, with or without other input or prompting, whether these features, elements, and/or steps are included or are to be always performed. The terms “comprising,” “including,” “having,” and the like are synonymous and are used inclusively, in an open-ended fashion, and do not exclude additional elements, features, acts, operations, and so forth. Also, the term “or” is used in its inclusive sense (and not in its exclusive sense) so that when used, for example, to connect a list of elements, the term “or” means one, some, or all of the elements in the list. Further, the term “each,” as used herein, in addition to having its ordinary meaning, can mean any subset of a set of elements to which the term “each” is applied.

Conjunctive language such as the phrase “at least one of X, Y, and Z,” unless specifically stated otherwise, is otherwise understood with the context as used in general to convey that an item, term, etc. may be either X, Y, or Z. Thus, such conjunctive language is not generally intended to imply that certain embodiments require the presence of at least one of X, at least one of Y, and at least one of Z.

Language of degree used herein, such as the terms “approximately,” “about,” “generally,” and “substantially” as used herein represent a value, amount, or characteristic close to the stated value, amount, or characteristic that still performs a desired function or achieves a desired result. For example, the terms “approximately”, “about”, “generally,” and “substantially” may refer to an amount that is within less than 10% of, within less than 5% of, within less than 1% of, within less than 0.1% of, and within less than 0.01% of the stated amount. As another example, in certain embodiments, the terms “generally parallel” and “substantially parallel” refer to a value, amount, or characteristic that departs from exactly parallel by less than or equal to 10 degrees, 5 degrees, 3 degrees, or 1 degree. As another example, in certain embodiments, the terms “generally perpendicular” and “substantially perpendicular” refer to a value, amount, or characteristic that departs from exactly perpendicular by less than or equal to 10 degrees, 5 degrees, 3 degrees, or 1 degree.

Although certain embodiments and examples have been described herein, it will be understood by those skilled in the art that many aspects of the systems and devices shown and described in the present disclosure may be differently combined and/or modified to form still further embodiments or acceptable examples. All such modifications and variations are intended to be included herein within the scope of this disclosure. A wide variety of designs and approaches are possible. No feature, structure, or step disclosed herein is essential or indispensable.

Any methods disclosed herein need not be performed in the order recited. The methods disclosed herein may include certain actions taken by a practitioner; however, they can also include any third-party instruction of those actions, either expressly or by implication.

The methods and tasks described herein may be performed and fully automated by a computer system. The computer system may, in some cases, include multiple distinct computers or computing devices (e.g., physical servers, workstations, storage arrays, cloud computing resources, etc.) that communicate and interoperate over a network to perform the described functions. Each such computing device typically includes a processor (or multiple processors) that executes program instructions or modules stored in a memory or other non-transitory computer-readable storage medium or device (e.g., solid state storage devices, disk drives, etc.). The various functions disclosed herein may be embodied in such program instructions, and/or may be implemented in application-specific circuitry (e.g., ASICs or FPGAs) of the computer system. Where the computer system includes multiple computing devices, these devices may, but need not, be co-located. The results of the disclosed methods and tasks may be persistently stored by transforming physical storage devices, such as solid state memory chips and/or magnetic disks, into a different state. The computer system may be a cloud-based computing system whose processing resources are shared by multiple distinct business entities or other users.

Depending on the embodiment, certain acts, events, or functions of any of the processes or algorithms described herein can be performed in a different sequence, can be added, merged, or left out altogether (for example, not all described operations or events are necessary for the practice of the algorithm). Moreover, in certain embodiments, operations or events can be performed concurrently, e.g., through multi-threaded processing, interrupt processing, or multiple processors or processor cores or on other parallel architectures, rather than sequentially.

Various illustrative logical blocks, modules, routines, and algorithm steps that may be described in connection with the disclosure herein can be implemented as electronic hardware (e.g., ASICs or FPGA devices), computer software that runs on general purpose computer hardware, or combinations of both. Various illustrative components, blocks, and steps may be described herein generally in terms of their functionality. Whether such functionality is implemented as specialized hardware versus software running on general-purpose hardware depends upon the particular application and design constraints imposed on the overall system. The described functionality can be implemented in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the disclosure.

Moreover, various illustrative logical blocks and modules that may be described in connection with the disclosure herein can be implemented or performed by a machine, such as a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor can be a microprocessor, but in the alternative, the processor can be a controller, microcontroller, or state machine, combinations of the same, or the like. A processor can include electrical circuitry configured to process computer-executable instructions. A processor can include an FPGA or other programmable device that performs logic operations without processing computer-executable instructions. A processor can also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration. Although described herein primarily with respect to digital technology, a processor may also include primarily analog components. For example, some or all of the rendering techniques described herein may be implemented in analog circuitry or mixed analog and digital circuitry. A computing environment can include any type of computer system, including, but not limited to, a computer system based on a microprocessor, a mainframe computer, a digital signal processor, a portable computing device, a device controller, or a computational engine within an appliance, to name a few.

The elements of any method, process, routine, or algorithm described in connection with the disclosure herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module can reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of a non-transitory computer-readable storage medium. An exemplary storage medium can be coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium can be integral to the processor. The processor and the storage medium can reside in an ASIC. The ASIC can reside in a user terminal. In the alternative, the processor and the storage medium can reside as discrete components in a user terminal.

While the above detailed description has shown, described, and pointed out novel features, it can be understood that various omissions, substitutions, and changes in the form and details of the devices or algorithms illustrated can be made without departing from the spirit of the disclosure. As can be recognized, certain portions of the description herein can be embodied within a form that does not provide all of the features and benefits set forth herein, as some features can be used or practiced separately from others. The scope of certain embodiments disclosed herein is indicated by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims (8)

What is claimed is:

1. A wearable device configured for noninvasive measurement of a user's body temperature, the wearable device comprising:

a housing;

a first substrate coupled to the housing and comprising an opening;

a second substrate covering said opening of the first substrate and at least a portion of the first substrate, said second substrate configured to secure to skin of a user when the wearable device is in use;

a mounting frame enclosed by the housing and the first substrate;

a circuit board secured by the mounting frame and comprising a first surface, a second surface, and at least one opening extending through the circuit board between the first and second surfaces;

a first temperature sensor mounted to the first surface of the circuit board and configured to determine a body temperature of the user; and

a thermally conductive probe secured by the mounting frame and comprising a first end and a second end opposite said first end, said first end arranged adjacent to the second surface and the at least one opening of the circuit board, the thermally conductive probe configured to extend at least partially through the opening in the first substrate and further configured to transmit thermal energy from the user's skin towards the at least one opening of the circuit board and the first temperature sensor when the wearable device is in use;

wherein said wearable device is configured such that said second substrate is positioned between said thermally conductive probe and the user's skin when the wearable device is in use.

2. The wearable device ofclaim 1, wherein the mounting frame comprises a slot configured to receive and secure the thermally conductive probe, wherein the slot is configured to surround less than an entire perimeter of a cross-section of the thermally conductive probe.

3. The wearable device ofclaim 1, wherein the thermally conductive probe is rigid.

4. The wearable device ofclaim 1, wherein the opening in the first substrate is sized and shaped to correspond to a size and shape of a perimeter of a cross-section of the thermally conductive probe.

5. The wearable device ofclaim 1, wherein the wearable device is configured to wirelessly transmit one or more body temperature values of the user to a separate computing device.

6. The wearable device ofclaim 1, wherein the first temperature sensor is mounted to the first surface of the circuit board adjacent the at least one opening in the circuit board.

7. The wearable device ofclaim 6, wherein the at least one opening of the circuit board is filled with a thermally conductive material.

8. The wearable device ofclaim 6, wherein the at least one opening of the circuit board comprises a plurality of openings.

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