本創作涉及一種可攜式電子裝置及其影像擷取模組與承載組件，特別是涉及一種用於縮減鏡頭組件的寬度的可攜式電子裝置及其影像擷取模組與承載組件。The present invention relates to a portable electronic device and an image capturing module and a bearing assembly thereof, and more particularly to a portable electronic device for reducing the width of the lens assembly, and an image capturing module and a bearing assembly thereof.
以現有技術來說，互補式金屬氧化半導體(Complementary Metal-Oxide-Semiconductor，CMOS)影像感測器的特殊利基在於「低電源消耗」與「小體積」的特點，因此CMOS影像感測器便於整合到有特殊需求的攜帶型電子產品內，例如CMOS影像感測器可便於整合到具有較小整合空間的行動電話及筆記型電腦等。然而，因為位於電路基板上的周邊電子元件分佈的關係，現有的影像擷取模組所使用的支架結構的寬度無法被縮減。In the prior art, the special advantage of Complementary Metal-Oxide-Semiconductor (CMOS) image sensor is "low power consumption" and "small volume", so CMOS image sensor is convenient. Integrated into portable electronic products with special needs, such as CMOS image sensors, it is easy to integrate into mobile phones and notebook computers with small integration space. However, due to the distribution of peripheral electronic components located on the circuit substrate, the width of the support structure used in the conventional image capture module cannot be reduced.
本創作所要解決的技術問題在於，針對現有技術的不足提供一種可攜式電子裝置及其影像擷取模組與承載組件。The technical problem to be solved by the present invention is to provide a portable electronic device and an image capturing module and a bearing component thereof for the deficiencies of the prior art.
為了解決上述的技術問題，本創作所採用的其中一技術方案是，提供一種影像擷取模組，所述影像擷取模組包括：一電路基板、一影像感測晶片、至少一電子元件、一點膠封裝體以及一鏡頭組件。所述電路基板具有一上表面以及一下表面。所述影像感測晶片電性連接於所述電路基板，其中，所述影像感測晶片具有一影像感測區域。至少一所述電子元件設置在所述電路基板的所述下表面且電性連接於所述電路基板。所述點膠封裝體設置在所述電路基板的所述下表面以覆蓋至少一所述電子元件。所述鏡頭組件包括一設置在所述電路基板的上表面的支架結構以及一被所述支架結構所承載且對應於所述影像感測區域的鏡頭結構。In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide an image capturing module, the image capturing module comprising: a circuit substrate, an image sensing chip, at least one electronic component, A plastic package and a lens assembly. The circuit substrate has an upper surface and a lower surface. The image sensing chip is electrically connected to the circuit substrate, wherein the image sensing wafer has an image sensing area. At least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the circuit substrate. The dispensing package is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components. The lensThe assembly includes a support structure disposed on an upper surface of the circuit substrate and a lens structure carried by the support structure and corresponding to the image sensing area.
為了解決上述的技術問題，本創作所採用的另外一技術方案是，提供一種承載組件，所述承載組件包括：一電路基板、一點膠封裝體以及一支架結構。所述電路基板用於承載至少一電子元件，其中，所述電路基板具有一上表面以及一下表面，且至少一所述電子元件設置在所述電路基板的所述下表面且電性連接於所述電路基板。所述點膠封裝體設置在所述電路基板的所述下表面以覆蓋至少一所述電子元件。所述支架結構設置在所述電路基板的所述上表面。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a load bearing assembly, which includes: a circuit substrate, a plastic package, and a bracket structure. The circuit substrate is configured to carry at least one electronic component, wherein the circuit substrate has an upper surface and a lower surface, and at least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the The circuit board is described. The dispensing package is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components. The bracket structure is disposed on the upper surface of the circuit substrate.
為了解決上述的技術問題，本創作所採用的另外再一技術方案是，提供一種可攜式電子裝置，所述可攜式電子裝置使用一影像擷取模組，其特徵在於，所述影像擷取模組包括：一電路基板、一影像感測晶片、至少一電子元件、一點膠封裝體以及一鏡頭組件。所述電路基板具有一上表面以及一下表面。所述影像感測晶片電性連接於所述電路基板，其中，所述影像感測晶片具有一影像感測區域。至少一所述電子元件設置在所述電路基板的所述下表面且電性連接於所述電路基板。所述點膠封裝體設置在所述電路基板的所述下表面以覆蓋至少一所述電子元件。所述鏡頭組件包括一設置在所述電路基板的上表面的支架結構以及一被所述支架結構所承載且對應於所述影像感測區域的鏡頭結構。In order to solve the above technical problem, another technical solution adopted by the present invention is to provide a portable electronic device, wherein the portable electronic device uses an image capturing module, wherein the image is The module includes: a circuit substrate, an image sensing chip, at least one electronic component, a dot plastic package, and a lens assembly. The circuit substrate has an upper surface and a lower surface. The image sensing chip is electrically connected to the circuit substrate, wherein the image sensing wafer has an image sensing area. At least one of the electronic components is disposed on the lower surface of the circuit substrate and electrically connected to the circuit substrate. The dispensing package is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components. The lens assembly includes a bracket structure disposed on an upper surface of the circuit substrate and a lens structure carried by the bracket structure and corresponding to the image sensing region.
本創作的其中一有益效果在於，本創作所提供的一種可攜式電子裝置及其影像擷取模組與承載組件，其能通過“至少一所述電子元件設置在所述電路基板的所述下表面且電性連接於所述電路基板，且所述點膠封裝體設置在所述電路基板的所述下表面以覆蓋至少一所述電子元件”以及“所述支架結構設置在所述電路基板的所述上表面”的技術方案，以縮小所述支架結構在水平方向的寬度或者尺寸。One of the beneficial effects of the present invention is that the portable electronic device and the image capturing module and the carrying assembly thereof provided by the present invention can be provided by the at least one of the electronic components disposed on the circuit substrate. a lower surface and electrically connected to the circuit substrate, and the dispensing package is disposed on the lower surface of the circuit substrate to cover at least one of the electronic components" and "the bracket structure is disposed in the circuit A technical solution of the upper surface of the substrate to reduce the width or size of the stent structure in the horizontal direction.
為使能更進一步瞭解本創作的特徵及技術內容，請參閱以下有關本創作的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本創作加以限制。In order to further understand the features and technical contents of this creation, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and description only, and are not intended to limit the creation.
P‧‧‧可攜式電子裝置P‧‧‧Portable electronic device
S‧‧‧承載組件S‧‧‧Loading components
M‧‧‧影像擷取模組M‧‧‧Image Capture Module
1‧‧‧電路基板1‧‧‧ circuit substrate
100‧‧‧貫穿開口100‧‧‧through opening
101‧‧‧上表面101‧‧‧ upper surface
1010‧‧‧無電子元件區域1010‧‧‧No electronic component area
102‧‧‧下表面102‧‧‧lower surface
103‧‧‧接地區103‧‧‧Contact area
2‧‧‧影像感測晶片2‧‧‧Image sensing wafer
200‧‧‧影像感測區域200‧‧‧Image sensing area
3‧‧‧電子元件3‧‧‧Electronic components
4‧‧‧點膠封裝體4‧‧‧ Dispensing package
400‧‧‧平整表面400‧‧‧Flat surface
40‧‧‧環繞延伸部40‧‧‧Circle extension
5‧‧‧鏡頭組件5‧‧‧ lens assembly
51‧‧‧支架結構51‧‧‧Support structure
52‧‧‧鏡頭結構52‧‧‧ lens structure
6‧‧‧濾光元件6‧‧‧ Filter elements
7‧‧‧導電體7‧‧‧Electrical conductor
700‧‧‧下表面700‧‧‧ lower surface
8‧‧‧散熱結構8‧‧‧heating structure
9‧‧‧圍繞狀限位框9‧‧‧Restricted frame
C1‧‧‧電連接器C1‧‧‧ electrical connector
C2‧‧‧導電結構C2‧‧‧Electrical structure
H1、H2‧‧‧厚度H1, H2‧‧‧ thickness
圖1為本創作第一實施例的影像擷取模組的示意圖。FIG. 1 is a schematic diagram of an image capturing module according to a first embodiment of the present invention.
圖2為本創作第一實施例的點膠封裝體的環繞延伸部覆蓋影像感測晶片的全部底面時的示意圖。2 is a schematic view showing the surrounding extension of the dispensing package of the first embodiment of the present invention covering the entire bottom surface of the image sensing wafer.
圖3為本創作第一實施例的點膠封裝體被圍繞狀限位框所圍繞且限位的示意圖。FIG. 3 is a schematic diagram of the dispensing package of the first embodiment of the present invention surrounded by a surrounding limiting frame and limited.
圖4為本創作第一實施例的影像擷取模組的電路基板被切割前的示意圖。4 is a schematic view of the circuit substrate of the image capturing module of the first embodiment before being cut.
圖5為本創作第一實施例的影像擷取模組的電路基板被切割後的示意圖。FIG. 5 is a schematic diagram of the circuit substrate of the image capturing module of the first embodiment of the present invention after being cut.
圖6為本創作第二實施例的影像擷取模組的示意圖。FIG. 6 is a schematic diagram of an image capturing module according to a second embodiment of the present invention.
圖7為本創作第三實施例的影像擷取模組的示意圖。FIG. 7 is a schematic diagram of an image capturing module according to a third embodiment of the present invention.
圖8為本創作的承載組件的示意圖。Figure 8 is a schematic diagram of the load bearing assembly of the present invention.
圖9為本創作第四實施例的影像擷取模組的示意圖。FIG. 9 is a schematic diagram of an image capturing module according to a fourth embodiment of the present invention.
圖10為本創作第五實施例的影像擷取模組的示意圖。FIG. 10 is a schematic diagram of an image capturing module according to a fifth embodiment of the present invention.
圖11為本創作第六實施例的影像擷取模組的示意圖。FIG. 11 is a schematic diagram of an image capturing module according to a sixth embodiment of the present invention.
圖12為本創作第七實施例的影像擷取模組的示意圖。FIG. 12 is a schematic diagram of an image capturing module according to a seventh embodiment of the present invention.
圖13為本創作第八實施例的可攜式電子裝置的示意圖。FIG. 13 is a schematic diagram of a portable electronic device according to an eighth embodiment of the present invention.
以下是通過特定的具體實施例來說明本創作所公開有關“可攜式電子裝置及其影像擷取模組與承載組件”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本創作的構思下進行各種修改與變更。另外，本創作的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容，但所公開的內容並非用以限制本創作的保護範圍。The following is a specific embodiment to explain the implementation of the "portable electronic device and its image capturing module and carrying component" disclosed in the present disclosure. Those skilled in the art can understand the creation by the content disclosed in the present specification. The advantages and effects. The present invention can be implemented or applied in various other specific embodiments. The details of the present specification can also be variously modified and changed without departing from the concept of the present invention. In addition, the drawings of this creation are only simpleThe explanation is not stated in advance according to the actual size. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the scope of protection of the present invention.
[第一實施例][First Embodiment]
請參閱圖1所示，本創作第一實施例提供一種影像擷取模組M，其包括：一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5。As shown in FIG. 1 , the first embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a dot plastic package 4 , and A lens assembly 5.
首先，電路基板1具有一上表面101以及一下表面102。更進一步來說，電路基板1具有一連接於上表面101與下表面102之間的貫穿開口100。舉例來說，電路基板1可以採用PCB硬板(如BT、FR4、FR5材質)、軟硬結合板或者陶瓷基板等，然而本創作不以此舉例為限。First, the circuit substrate 1 has an upper surface 101 and a lower surface 102. Furthermore, the circuit substrate 1 has a through opening 100 connected between the upper surface 101 and the lower surface 102. For example, the circuit substrate 1 may be a PCB hard board (such as BT, FR4, FR5 material), a soft and hard bonding board or a ceramic substrate, but the present invention is not limited by this example.
再者，影像感測晶片2電性連接於電路基板1，並且影像感測晶片2具有一影像感測區域200。更進一步來說，影像感測晶片2設置在電路基板1的下表面102上，並且影像感測晶片2的影像感測區域200會面向電路基板1的貫穿開口100。舉例來說，影像感測晶片2可為一種互補式金屬氧化半導體(CMOS)感測器或者任何具有影像擷取功能的感測器，然而本創作不以此舉例為限。Furthermore, the image sensing chip 2 is electrically connected to the circuit substrate 1 , and the image sensing wafer 2 has an image sensing area 200 . Furthermore, the image sensing wafer 2 is disposed on the lower surface 102 of the circuit substrate 1, and the image sensing region 200 of the image sensing wafer 2 faces the through opening 100 of the circuit substrate 1. For example, the image sensing wafer 2 can be a complementary metal oxide semiconductor (CMOS) sensor or any sensor having an image capturing function, but the present invention is not limited by this example.
此外，至少一電子元件3設置在電路基板1的下表面102且電性連接於電路基板1。舉例來說，電子元件3可以是電容、電阻、驅動IC或者電子抹除式可複寫唯讀記憶體(EEPROM)等被動元件，然而本創作不以此舉例為限。Further, at least one electronic component 3 is disposed on the lower surface 102 of the circuit substrate 1 and electrically connected to the circuit substrate 1. For example, the electronic component 3 may be a passive component such as a capacitor, a resistor, a driver IC, or an electronic erasable rewritable read-only memory (EEPROM). However, the present invention is not limited by this example.
另外，點膠封裝體4設置在電路基板1的下表面102以覆蓋至少一電子元件3。舉例來說，點膠封裝體4具有一覆蓋影像感測晶片2的全部或者一部分底面的環繞延伸部40，或者點膠封裝體4也可以省略環繞延伸部40，而使得影像感測晶片2的全部底面都不會被點膠封裝體4所覆蓋。再舉例來說，點膠封裝體4可為一種由epoxy或者silicon通過點膠(dispensing)的方式所形成的點膠基座，並且點膠封裝體4能通過精細研磨而具有一微米等級的平整表面400，然而本創作不以此舉例為限。In addition, the dispensing package 4 is disposed on the lower surface 102 of the circuit substrate 1 to cover at least one electronic component 3. For example, the dispensing package 4 has a surrounding extension 40 that covers all or a portion of the bottom surface of the image sensing wafer 2, or the dispensing package 4 can also omit the surrounding extension 40, such that the image sensing wafer 2 All of the bottom surfaces are not covered by the dispensing package 4. For another example, the dispensing package 4 can beA dispensing base formed by dispensing epoxy or silicon, and the dispensing package 4 can have a flat surface 400 of one micron level by fine grinding, however, the present invention is not limited by this example. .
值得一提的是，由於點膠封裝體4設置在電路基板1的下表面102，所以電路基板1的結構強度就可以通過點膠封裝體4的輔助支撐而得到加強，進而使得電路基板1的硬度被提升而不易產生翹曲(warpage)。It is worth mentioning that, since the dispensing package 4 is disposed on the lower surface 102 of the circuit substrate 1, the structural strength of the circuit substrate 1 can be strengthened by the auxiliary support of the dispensing package 4, thereby making the circuit substrate 1 The hardness is increased without being prone to warpage.
再者，鏡頭組件5包括一設置在電路基板1的上表面101的支架結構51以及一被支架結構51所承載且對應於影像感測區域200的鏡頭結構52。舉例來說，支架結構51可以是普通的底座或者任何種類的音圈馬達(Voice Coil Motor，VCM)，並且鏡頭結構52可以是由多個鏡片所組成，然而本創作不以此舉例為限。另外，舉例來說，支架結構51能通過黏著膠體(圖未示)而設置在電路基板1的上表面101，然而本創作不以此舉例為限。Furthermore, the lens assembly 5 includes a holder structure 51 disposed on the upper surface 101 of the circuit substrate 1 and a lens structure 52 carried by the holder structure 51 and corresponding to the image sensing area 200. For example, the support structure 51 can be a conventional base or any kind of voice coil motor (VCM), and the lens structure 52 can be composed of a plurality of lenses, however, the present invention is not limited by this example. In addition, for example, the bracket structure 51 can be disposed on the upper surface 101 of the circuit substrate 1 by an adhesive (not shown), but the present invention is not limited by this example.
舉例來說，電路基板1的上表面101具有一被支架結構51所圍繞且未被任何其它電子元件所佔領的無電子元件區域1010。也就是說，全部的電子元件3都會被安置在電路基板1的下表面102，所以電路基板1的上表面101的無電子元件區域1010上就不會有任何的電子元件，藉此支架結構51就能夠直接被放置在電路基板1的上表面101的無電子元件區域1010所涵蓋的範圍內。然而，本創作不以此舉例為限，例如電路基板1的上表面101與下表面102都可以設置相關的被動元件。For example, the upper surface 101 of the circuit substrate 1 has an electronic component free area 1010 surrounded by the support structure 51 and not occupied by any other electronic components. That is, all of the electronic components 3 are disposed on the lower surface 102 of the circuit substrate 1, so that there is no electronic component on the electronic component-free region 1010 of the upper surface 101 of the circuit substrate 1, whereby the support structure 51 It can be placed directly in the range covered by the electronic component-free region 1010 of the upper surface 101 of the circuit substrate 1. However, the present invention is not limited by this example, and for example, the upper surface 101 and the lower surface 102 of the circuit substrate 1 may be provided with related passive components.
值得一提的是，影像擷取模組M還進一步包括：一濾光元件6，濾光元件6能夠設置在影像感測晶片2與電路基板1兩者其中之一上，並且濾光元件6設置在影像感測晶片2與鏡頭結構52之間。舉例來說，濾光元件6可以直接設置在影像感測晶片2上(如圖1所示)，或者濾光元件6可以被多個柱狀物(圖未示)撐高而設置在影像感測晶片2的上方。另外，濾光元件6可以是鍍膜玻璃，也可以是非鍍膜玻璃，然而本創作不以此舉例為限。It is to be noted that the image capturing module M further includes: a filter element 6 , and the filter element 6 can be disposed on one of the image sensing chip 2 and the circuit substrate 1 , and the filter element 6 It is disposed between the image sensing wafer 2 and the lens structure 52. For example, the filter element 6 can be directly disposed on the image sensing wafer 2 (as shown in FIG. 1), or the filter element 6 can be supported by a plurality of pillars (not shown) to provide an image sense. The top of the wafer 2 is measured. In addition, the filter element 6 can be coated glassGlass can also be uncoated glass, however this creation is not limited by this example.
值得一提的是，點膠封裝體4的外表面可以另外增設一層保護層。舉例來說，點膠封裝體4的外表面具有一防塵鍍膜層，以用於降低微粒(particle)的附著，然而本創作不以此舉例為限。It is worth mentioning that an additional protective layer may be additionally added to the outer surface of the dispensing package 4. For example, the outer surface of the dispensing package 4 has a dust-proof coating layer for reducing the adhesion of particles, but the present invention is not limited by this example.
綜上所言，由於支架結構51與電子元件3會設置在電路基板1的兩相反表面上，所以支架結構在水平方向的寬度或者尺寸就能夠被縮減。也就是說，由於支架結構51是直接設置在電路基板1的上表面101的無電子元件區域1010上而不用特別去避開電子元件3，所以支架結構51在水平方向(X方向或者Y方向)的寬度就能夠被縮減，藉此以縮小支架結構51在水平方向的尺寸。In summary, since the bracket structure 51 and the electronic component 3 are disposed on opposite surfaces of the circuit board 1, the width or size of the bracket structure in the horizontal direction can be reduced. That is, since the holder structure 51 is directly disposed on the electronic component-free region 1010 of the upper surface 101 of the circuit substrate 1 without particularly avoiding the electronic component 3, the stent structure 51 is in the horizontal direction (X direction or Y direction). The width can be reduced, thereby reducing the size of the bracket structure 51 in the horizontal direction.
值得一提的是，如圖2所示，當點膠封裝體4的環繞延伸部40覆蓋影像感測晶片2的全部底面時，由於點膠封裝體4也可以由散熱膠所形成，所以點膠封裝體4將有助於提升影像感測晶片2的散熱效能。It should be noted that, as shown in FIG. 2, when the surrounding extending portion 40 of the dispensing package 4 covers the entire bottom surface of the image sensing wafer 2, since the dispensing package 4 can also be formed by a heat dissipating glue, The glue package 4 will help to improve the heat dissipation performance of the image sensing wafer 2.
值得一提的是，如圖3所示，點膠封裝體4可以被一設置在電路基板1的下表面102上的圍繞狀限位框9所圍繞且限位。也就是說，當點膠封裝體4所使用的膠材的黏滯係數(viscosity)較低時，圍繞狀限位框9可做為一種環繞狀障礙物(dam)，以限制點膠封裝體4的成形範圍。當然，點膠封裝體4也可採用具有較高黏滯係數的膠材，如此也可省略圍繞狀限位框9的使用(如圖1或圖2所示)。It is worth mentioning that, as shown in FIG. 3, the dispensing package 4 can be surrounded and limited by a surrounding limiting frame 9 disposed on the lower surface 102 of the circuit substrate 1. That is to say, when the viscosity of the glue used in the dispensing package 4 is low, the surrounding limiting frame 9 can be used as a surrounding dam to limit the dispensing package. The forming range of 4. Of course, the dispensing package 4 can also adopt a rubber material having a higher viscosity coefficient, so that the use of the surrounding limiting frame 9 can be omitted (as shown in FIG. 1 or FIG. 2).
值得一提的是，配合圖4與圖5所示，本創作可預先使用承載面積較大的電路基板1。當影像擷取模組M製作完成後(如圖4所示)，可以沿著A-A切割面來切割電路基板1，以得到所需尺寸的影像擷取模組M，也就是尺寸較小的影像擷取模組M(如圖5所示)。藉此，影像擷取模組M在水平方向(X方向或者Y方向)的寬度就能夠被縮減。It is worth mentioning that, as shown in FIG. 4 and FIG. 5, the circuit substrate 1 having a large carrying area can be used in advance in the present creation. After the image capturing module M is completed (as shown in FIG. 4), the circuit substrate 1 can be cut along the AA cutting surface to obtain an image capturing module M of a desired size, that is, a small-sized image. Capture module M (as shown in Figure 5). Thereby, the width of the image capturing module M in the horizontal direction (X direction or Y direction) can be reduced.
[第二實施例][Second embodiment]
請參閱圖6所示，本創作第二實施例提供一種影像擷取模組M，其包括：一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5。由圖6與圖1的比較可知，本創作第二實施例與第一實施例最大的不同在於：第二實施例的影像擷取模組M還進一步包括至少一導電體7，並且至少一導電體7設置在電路基板1的下表面102且電性連接於電路基板1。Referring to FIG. 6 , a second embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a dot plastic package 4 , and A lens assembly 5. The comparison between FIG. 6 and FIG. 1 shows that the second embodiment of the present invention is the most different from the first embodiment in that the image capturing module M of the second embodiment further includes at least one electrical conductor 7 and at least one conductive The body 7 is disposed on the lower surface 102 of the circuit board 1 and is electrically connected to the circuit board 1 .
承上所言，至少一導電體7的一部分會被點膠封裝體4所覆蓋，以使得至少一導電體7的一下表面700被裸露在點膠封裝體外。舉例來說，至少一導電體7可以電性連接於電路基板1的接地區103，所以電路基板1的接地區103就可以通過至少一導電體7，以電性連接於應用系統(圖未示)的接地區，藉此本創作的影像擷取模組M能夠符合靜電放電(Electrostatic Discharge，ESD)以及電磁干擾(Electromagnetic Disturbance，EMI)等相關的要求。另外，至少一導電體7可以是銅柱、錫球、電子零件等導電元件，然而本創作不以此舉例為限。As stated above, at least one portion of the electrical conductor 7 is covered by the dispensing package 4 such that the lower surface 700 of at least one of the electrical conductors 7 is exposed outside the dispensing package. For example, the at least one electrical conductor 7 can be electrically connected to the connection region 103 of the circuit substrate 1. Therefore, the connection region 103 of the circuit substrate 1 can be electrically connected to the application system through at least one electrical conductor 7 (not shown). The image capturing module M of the present invention can meet the requirements of Electrostatic Discharge (ESD) and Electromagnetic Disturbance (EMI). In addition, at least one of the electrical conductors 7 may be a conductive member such as a copper pillar, a solder ball, or an electronic component. However, the present invention is not limited by this example.
值得注意的是，點膠封裝體4設置在電路基板1的下表面102且圍繞影像感測晶片2，並且點膠封裝體4的厚度H1會大於影像感測晶片2的厚度H2。藉此，由於點膠封裝體4的厚度H1會大於影像感測晶片2的厚度H2，所以點膠封裝體4的頂端相對於電路基板1的下表面102的距離會大於影像感測晶片2的頂端相對於電路基板1的下表面102的距離。因此，影像感測晶片2能夠得到點膠封裝體4的保護而不易碰撞到外物。It should be noted that the dispensing package 4 is disposed on the lower surface 102 of the circuit substrate 1 and surrounds the image sensing wafer 2, and the thickness H1 of the dispensing package 4 is greater than the thickness H2 of the image sensing wafer 2. Therefore, since the thickness H1 of the dispensing package 4 is greater than the thickness H2 of the image sensing wafer 2, the distance between the top end of the dispensing package 4 and the lower surface 102 of the circuit substrate 1 is greater than that of the image sensing wafer 2. The distance of the top end with respect to the lower surface 102 of the circuit substrate 1. Therefore, the image sensing wafer 2 can be protected from the dispensing package 4 without being easily collided with foreign objects.
當然，第二實施例也可以依據第一實施例的圖2、圖3或者圖4至圖5的方式來製作影像擷取模組M。Of course, the second embodiment can also create the image capturing module M according to the manner of FIG. 2, FIG. 3 or FIG. 4 to FIG. 5 of the first embodiment.
[第三實施例][Third embodiment]
請參閱圖7所示，本創作第三實施例提供一種影像擷取模組M，其包括：一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5。由圖7與圖6的比較可知，本創作第三實施例與第二實施例最大的不同在於：在第三實施例中，濾光元件6可以直接設置在電路基板1上而與影像感測晶片2彼此分離。Please refer to FIG. 7 , the third embodiment of the present invention provides an image capturing module.M, comprising: a circuit substrate 1, an image sensing chip 2, at least one electronic component 3, a dot plastic package 4, and a lens assembly 5. It can be seen from the comparison between FIG. 7 and FIG. 6 that the third embodiment of the present invention differs greatly from the second embodiment in that, in the third embodiment, the filter element 6 can be directly disposed on the circuit substrate 1 and sensed by the image. The wafers 2 are separated from each other.
也就是說，本創作可依據不同的設計需求，而將濾光元件6設置在影像感測晶片2上(如圖1所呈現的第一實施例)或者電路基板1上(如圖7所呈現的第三實施例)。That is to say, the present invention can set the filter element 6 on the image sensing wafer 2 (as shown in the first embodiment of FIG. 1) or on the circuit substrate 1 according to different design requirements (as shown in FIG. 7). Third embodiment).
值得一提的是，請參閱圖8所示，本創作還進一步提供一種承載組件S，其包括：一電路基板1、一點膠封裝體4以及一支架結構51。電路基板1用於承載至少一電子元件3，並且至少一電子元件3設置在電路基板1的下表面102且電性連接於電路基板1。點膠封裝體4設置在電路基板1的下表面102以覆蓋至少一電子元件3。支架結構51設置在電路基板1的上表面101。It is to be noted that, as shown in FIG. 8 , the present invention further provides a carrier component S comprising: a circuit substrate 1 , a plastic package 4 , and a support structure 51 . The circuit substrate 1 is used to carry at least one electronic component 3, and at least one electronic component 3 is disposed on the lower surface 102 of the circuit substrate 1 and electrically connected to the circuit substrate 1. The dispensing package 4 is disposed on the lower surface 102 of the circuit substrate 1 to cover at least one electronic component 3. The holder structure 51 is provided on the upper surface 101 of the circuit substrate 1.
也就是說，圖8所提供的承載組件S不限定只能用於承載影像感測晶片2與鏡頭結構52(例如第一實施例至第三實施例一樣)。That is, the carrier assembly S provided in FIG. 8 is not limited to be used only for carrying the image sensing wafer 2 and the lens structure 52 (for example, the first embodiment to the third embodiment).
當然，第三實施例也可以依據第一實施例的圖2、圖3或者圖4至圖5的方式來製作影像擷取模組M。Of course, the third embodiment can also create the image capturing module M according to the manner of FIG. 2, FIG. 3 or FIG. 4 to FIG. 5 of the first embodiment.
[第四實施例][Fourth embodiment]
請參閱圖9所示，本創作第四實施例提供一種影像擷取模組M，其包括：一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5。由圖8與圖6的比較可知，本創作第四實施例與第二實施例最大的不同在於：第四實施例的影像擷取模組M還進一步包括一散熱結構8，並且散熱結構8設置在點膠封裝體4的平整表面400上且接觸至少一導電體7的下表面700。As shown in FIG. 9 , the fourth embodiment of the present invention provides an image capturing module M, including: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , and a plastic package 4 . A lens assembly 5. The comparison between the fourth embodiment and the second embodiment is that the image capturing module M of the fourth embodiment further includes a heat dissipation structure 8 and the heat dissipation structure 8 is disposed. On the flat surface 400 of the dispensing package 4 and in contact with the lower surface 700 of at least one of the electrical conductors 7.
承上所言，影像感測晶片2可通過導熱膠(未標號)以貼附在散熱結構8上，藉此以提升影像感測晶片2的散熱效能。另外，點膠封裝體4的平整表面400會與至少一導電體7的下表面700齊平，所以散熱結構8就能以平整表面400做為一承載基準面而設置其上。舉例來說，散熱結構8可以是鋼片、銅片或者銅箔等導電元件，然而本創作不以此舉例為限。As can be said, the image sensing wafer 2 can be attached to the heat dissipation structure 8 by a thermal conductive adhesive (not labeled), thereby improving the heat dissipation performance of the image sensing wafer 2. In addition, the flat surface 400 of the dispensing package 4 is flush with the lower surface 700 of the at least one electrical conductor 7, so that the heat dissipating structure 8 can be disposed with the flat surface 400 as a load bearing reference surface. For example, the heat dissipation structure 8 may be a conductive member such as a steel sheet, a copper sheet or a copper foil. However, the present invention is not limited by this example.
值得一提的是，至少一導電體7可以電性連接於電路基板1的接地區103，所以電路基板1的接地區103就可以依序通過至少一導電體7與散熱結構8，以電性連接於應用系統(圖未示)的接地區，藉此本創作的影像擷取模組M能夠符合靜電放電(Electrostatic Discharge，ESD)以及電磁干擾(Electromagnetic Disturbance，EMI)等相關的要求。It is worth mentioning that at least one of the electrical conductors 7 can be electrically connected to the connection region 103 of the circuit substrate 1. Therefore, the connection region 103 of the circuit substrate 1 can pass through at least one of the electrical conductors 7 and the heat dissipation structure 8 in order to be electrically It is connected to the connection area of the application system (not shown), so that the image capturing module M of the present invention can meet the requirements of Electrostatic Discharge (ESD) and Electromagnetic Disturbance (EMI).
當然，第四實施例也可以依據第一實施例的圖2、圖3或者圖4至圖5的方式來製作影像擷取模組M。Of course, the fourth embodiment can also create the image capturing module M according to the manner of FIG. 2, FIG. 3 or FIG. 4 to FIG. 5 of the first embodiment.
[第五實施例][Fifth Embodiment]
請參閱圖10所示，本創作第五實施例提供一種影像擷取模組M，其包括：一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5。由圖10與圖6的比較可知，本創作第五實施例與第二實施例最大的不同在於：在第五實施例中，電路基板1上可以另外增設一電連接器C1，以使得影像擷取模組M可以通過電連接器C1以與後端電子模組(圖未示)電性連接。As shown in FIG. 10 , the fifth embodiment of the present invention provides an image capturing module M, which includes: a circuit substrate 1 , an image sensing chip 2 , at least one electronic component 3 , a dot plastic package 4 , and A lens assembly 5. It can be seen from the comparison between FIG. 10 and FIG. 6 that the fifth embodiment of the present invention is different from the second embodiment in that: in the fifth embodiment, an electrical connector C1 can be additionally added to the circuit substrate 1 to enable the image to be imaged. The module M can be electrically connected to the back end electronic module (not shown) through the electrical connector C1.
當然，第五實施例也可以依據第一實施例的圖2、圖3或者圖4至圖5的方式來製作影像擷取模組M。Of course, the fifth embodiment can also create the image capturing module M according to the manner of FIG. 2, FIG. 3 or FIG. 4 to FIG. 5 of the first embodiment.
[第六實施例][Sixth embodiment]
請參閱圖11所示，本創作第六實施例提供一種影像擷取模組M，其包括：一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5。由圖11與圖6的比較可知，本創作第六實施例與第二實施例最大的不同在於：在第六實施例中，影像擷取模組M可以通過一導電結構C2(例如Hot Bar或者ACF)而與一軟性電路板(未標號)電性搭接在一起，以使得影像擷取模組M能與後端電子模組(圖未示)電性連接。藉此，影像擷取模組M通過導電結構C2而與不同的軟性電路板電性搭配，進而提升本創作的影像擷取模組M的共用性。Referring to FIG. 11 , a sixth embodiment of the present invention provides an image capturing module.M, comprising: a circuit substrate 1, an image sensing chip 2, at least one electronic component 3, a dot plastic package 4, and a lens assembly 5. It can be seen from the comparison between FIG. 11 and FIG. 6 that the sixth embodiment is different from the second embodiment in that: in the sixth embodiment, the image capturing module M can pass through a conductive structure C2 (for example, Hot Bar or ACF) is electrically connected to a flexible circuit board (not labeled) so that the image capturing module M can be electrically connected to the back end electronic module (not shown). Thereby, the image capturing module M is electrically matched with different flexible circuit boards through the conductive structure C2, thereby improving the commonality of the image capturing module M of the present invention.
當然，第六實施例也可以依據第一實施例的圖2、圖3或者圖4至圖5的方式來製作影像擷取模組M。Of course, the sixth embodiment can also create the image capturing module M according to the manner of FIG. 2, FIG. 3 or FIG. 4 to FIG. 5 of the first embodiment.
[第七實施例][Seventh embodiment]
請參閱圖12所示，本創作第七實施例提供兩個影像擷取模組M。由圖12與圖6的比較可知，本創作第七實施例與第二實施例最大的不同在於：第七實施例可以同時使用兩個影像擷取模組M(也就是雙鏡頭模組)，並且兩個影像擷取模組M可以共用同一個電路基板1。當然，依據不同的設計需求，兩個影像擷取模組M也可以共用同一個點膠封裝體4以及同一個導電體7。Referring to FIG. 12, the seventh embodiment of the present invention provides two image capturing modules M. It can be seen from the comparison between FIG. 12 and FIG. 6 that the seventh embodiment of the present invention is different from the second embodiment in that the seventh embodiment can simultaneously use two image capturing modules M (ie, a dual lens module). And the two image capturing modules M can share the same circuit substrate 1. Of course, the two image capturing modules M can share the same dispensing package 4 and the same electrical conductor 7 according to different design requirements.
當然，第七實施例也可以依據第一實施例的圖2、圖3或者圖4至圖5的方式來製作影像擷取模組M。Of course, the seventh embodiment can also create the image capturing module M according to the manner of FIG. 2, FIG. 3 or FIG. 4 to FIG. 5 of the first embodiment.
[第八實施例][Eighth Embodiment]
請參閱圖13所示，本創作第八實施例提供一種可攜式電子裝置P，並且可攜式電子裝置P可以使用第一至第七實施例中的任何一影像擷取模組M。舉例來說，影像擷取模組M可以應用於手機、筆記型電腦或者平板電腦，然而本創作不以此舉例為限。如圖13所示，影像擷取模組M可以做為可攜式電子裝置P的後鏡頭，並且影像擷取模組M可以包括一電路基板1、一影像感測晶片2、至少一電子元件3、一點膠封裝體4以及一鏡頭組件5，然而本創作不以此舉例為限。Referring to FIG. 13 , the eighth embodiment of the present invention provides a portable electronic device P, and the portable electronic device P can use any of the image capturing modules M of the first to seventh embodiments. For example, the image capture module M can be applied to a mobile phone, a notebook computer, or a tablet computer. However, the present invention is not limited by this example. As shown in FIG. 13 , the image capturing module M can be used as a rear lens of the portable electronic device P, and the image capturing module M can include a circuit substrate 1 and an image sensing crystal.The sheet 2, the at least one electronic component 3, the dot plastic package 4, and a lens assembly 5, however, the present invention is not limited by this example.
[實施例的有益效果][Advantageous Effects of Embodiments]
本創作的其中一有益效果在於，本創作所提供的一種可攜式電子裝置P及其影像擷取模組M與承載組件S，其能通過“至少一電子元件3設置在電路基板1的下表面102且電性連接於電路基板1，且點膠封裝體4設置在電路基板1的下表面102以覆蓋至少一電子元件3”以及“支架結構51設置在電路基板1的上表面101”的技術方案，以縮小支架結構51在水平方向的寬度或者尺寸。也就是說，由於支架結構51是直接設置在電路基板1的上表面101而不用特別去避開電子元件3，所以支架結構51就不用避開電子元件3而能在水平方向(X方向或者Y方向)的寬度就能夠被縮減，藉此以縮小支架結構51在水平方向的尺寸。One of the beneficial effects of the present invention is that the portable electronic device P and its image capturing module M and the carrying component S are provided by the present invention, which can be disposed under the circuit substrate 1 by "at least one electronic component 3". The surface 102 is electrically connected to the circuit substrate 1, and the dispensing package 4 is disposed on the lower surface 102 of the circuit substrate 1 to cover at least one electronic component 3" and "the bracket structure 51 is disposed on the upper surface 101 of the circuit substrate 1" The technical solution is to reduce the width or size of the bracket structure 51 in the horizontal direction. That is, since the bracket structure 51 is directly disposed on the upper surface 101 of the circuit substrate 1 without particularly avoiding the electronic component 3, the bracket structure 51 can be horizontally oriented (X direction or Y without avoiding the electronic component 3). The width of the direction can be reduced, thereby reducing the size of the bracket structure 51 in the horizontal direction.
值得一提的是，由於點膠封裝體4設置在電路基板1的下表面102，所以電路基板1的結構強度就可以通過點膠封裝體4的輔助支撐而得到加強，進而使得電路基板1的硬度被提升而不易產生翹曲(warpage)。It is worth mentioning that, since the dispensing package 4 is disposed on the lower surface 102 of the circuit substrate 1, the structural strength of the circuit substrate 1 can be strengthened by the auxiliary support of the dispensing package 4, thereby making the circuit substrate 1 The hardness is increased without being prone to warpage.
值得一提的是，當點膠封裝體4的環繞延伸部40覆蓋影像感測晶片2的全部底面時，由於點膠封裝體4也可以由散熱膠所形成，所以點膠封裝體4將有助於提升影像感測晶片2的散熱效能。It is worth mentioning that when the surrounding extension 40 of the dispensing package 4 covers the entire bottom surface of the image sensing wafer 2, since the dispensing package 4 can also be formed by a thermal adhesive, the dispensing package 4 will have Helps improve the heat dissipation performance of the image sensing chip 2.
值得一提的是，點膠封裝體4可以被一設置在電路基板1的下表面102上的圍繞狀限位框9所圍繞且限位。也就是說，當點膠封裝體4所使用的膠材的黏滯係數較低時，圍繞狀限位框9可做為一種環繞狀障礙物，以限制點膠封裝體4的成形範圍。當然，點膠封裝體4也可採用具有較高黏滯係數的膠材，如此也可省略圍繞狀限位框9的使用。It is worth mentioning that the dispensing package 4 can be surrounded and limited by a surrounding limiting frame 9 disposed on the lower surface 102 of the circuit substrate 1. That is to say, when the viscosity coefficient of the rubber material used for the dispensing package 4 is low, the surrounding limiting frame 9 can be used as a surrounding obstacle to limit the forming range of the dispensing package 4. Of course, the dispensing package 4 can also adopt a rubber material having a higher viscosity coefficient, so that the use of the surrounding limiting frame 9 can be omitted.
值得一提的是，本創作可預先使用承載面積較大的電路基板1。當影像擷取模組M製作完成後，可以通過切割電路基板而得到所需尺寸的影像擷取模組M，也就是尺寸較小的影像擷取模組M。藉此，影像擷取模組M在水平方向(X方向或者Y方向)的寬度就能夠被縮減。It is worth mentioning that this creation can pre-use a circuit board with a large carrying area.1. After the image capturing module M is completed, the image capturing module M of a desired size, that is, the image capturing module M having a smaller size, can be obtained by cutting the circuit substrate. Thereby, the width of the image capturing module M in the horizontal direction (X direction or Y direction) can be reduced.
以上所公開的內容僅為本創作的優選可行實施例，並非因此侷限本創作的申請專利範圍，所以凡是運用本創作說明書及圖式內容所做的等效技術變化，均包含於本創作的申請專利範圍內。The above disclosure is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, any equivalent technical changes made by using the present specification and the content of the schema are included in the application for this creation. Within the scope of the patent.
M‧‧‧影像擷取模組M‧‧‧Image Capture Module
1‧‧‧電路基板1‧‧‧ circuit substrate
100‧‧‧貫穿開口100‧‧‧through opening
101‧‧‧上表面101‧‧‧ upper surface
1010‧‧‧無電子元件區域1010‧‧‧No electronic component area
102‧‧‧下表面102‧‧‧lower surface
2‧‧‧影像感測晶片2‧‧‧Image sensing wafer
200‧‧‧影像感測區域200‧‧‧Image sensing area
3‧‧‧電子元件3‧‧‧Electronic components
4‧‧‧點膠封裝體4‧‧‧ Dispensing package
400‧‧‧平整表面400‧‧‧Flat surface
40‧‧‧環繞延伸部40‧‧‧Circle extension
5‧‧‧鏡頭組件5‧‧‧ lens assembly
51‧‧‧支架結構51‧‧‧Support structure
52‧‧‧鏡頭結構52‧‧‧ lens structure
6‧‧‧濾光元件6‧‧‧ Filter elements
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106207292UTWM550941U (en) | 2017-05-22 | 2017-05-22 | Portable electronic device and its image capturing module and carrying component |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106207292UTWM550941U (en) | 2017-05-22 | 2017-05-22 | Portable electronic device and its image capturing module and carrying component |
| Publication Number | Publication Date |
|---|---|
| TWM550941Utrue TWM550941U (en) | 2017-10-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106207292UTWM550941U (en) | 2017-05-22 | 2017-05-22 | Portable electronic device and its image capturing module and carrying component |
| Country | Link |
|---|---|
| TW (1) | TWM550941U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI661361B (en)* | 2018-04-10 | 2019-06-01 | 鴻海精密工業股份有限公司 | Sensing module and electronic devices thereof |
| TWI674445B (en)* | 2018-04-28 | 2019-10-11 | 鴻海精密工業股份有限公司 | Lens module and method for assembling the same |
| TWI730682B (en)* | 2019-06-26 | 2021-06-11 | 同欣電子工業股份有限公司 | Chip packaging structure and manufacturing method thereof |
| TWI730441B (en)* | 2019-10-08 | 2021-06-11 | 群光電子股份有限公司 | Camera module |
| TWI810857B (en)* | 2022-03-22 | 2023-08-01 | 新煒科技有限公司 | Packaging structure, lens module, and electronic device |
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI661361B (en)* | 2018-04-10 | 2019-06-01 | 鴻海精密工業股份有限公司 | Sensing module and electronic devices thereof |
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| TWI674445B (en)* | 2018-04-28 | 2019-10-11 | 鴻海精密工業股份有限公司 | Lens module and method for assembling the same |
| TWI730682B (en)* | 2019-06-26 | 2021-06-11 | 同欣電子工業股份有限公司 | Chip packaging structure and manufacturing method thereof |
| TWI730441B (en)* | 2019-10-08 | 2021-06-11 | 群光電子股份有限公司 | Camera module |
| US11445092B2 (en) | 2019-10-08 | 2022-09-13 | Chicony Electronics Co., Ltd. | Camera module |
| TWI810857B (en)* | 2022-03-22 | 2023-08-01 | 新煒科技有限公司 | Packaging structure, lens module, and electronic device |
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