本新型是有關於一種預形體(preform)，特別是指一種被動元件的預形體。The present invention relates to a preform, and more particularly to a preform of a passive component.
目前市面上的被動元件以電感器(inductor)舉例來說，主要可分為薄膜式(thin film)、積層式(multilayer)及繞線式(wire wound)。如台灣第TW 201440090 A早期公開號發明專利案(以下稱前案1)所公開的一種積層式電感器1(見圖1)及其製造方法(見圖2至圖7)。Passive components currently on the market, for example, are mainly classified into a thin film, a multilayer, and a wire wound. A laminated inductor 1 (see FIG. 1) and a method of manufacturing the same (see FIGS. 2 to 7) disclosed in Taiwan Patent Publication No. TW 201440090 A (hereinafter referred to as the first example).
該積層式電感器1的製造方法，包含以下步驟：(A)由下而上依序積層壓接一第一電路陶瓷母片110、一第二電路陶瓷母片120、一第三電路陶瓷母片130，及一第四電路陶瓷母片140(如圖2所示)；(B)令一表面塗佈有一焊墊電極(bonding pad)1501陣列的載膜150，面向該第一電路陶瓷母片110的一第一預定電路圖案1120陣列設置(如圖3所示)；(C)將該焊墊電極1501陣列轉印至該第一電路陶瓷母片110上的第一預定電路圖案1120陣列從而構成一第一電路圖案112陣列(如圖4所示)；(D)剝離該載膜150(如圖5所示)；(E)燒結該等電路陶瓷母片110、120、130、140以構成一集合基板100(如圖6所示)；及(F)以一刻劃具160對該集合基板100施予刻劃，令該集合基板100被分割成多數個積層體10，且令集合基板100內的第一電路圖案112陣列被分割成多數個第一電路圖案112並構成如圖1所示的積層式電感器1。The manufacturing method of the laminated inductor 1 includes the following steps: (A) sequentially laminating a first circuit ceramic mother substrate 110, a second circuit ceramic mother substrate 120, and a third circuit ceramic mother from bottom to top. a chip 130, and a fourth circuit ceramic mother chip 140 (shown in FIG. 2); (B) a surface coated with a carrier film 150 of an array of bonding pads 1501 facing the first circuit ceramic mother A first predetermined circuit pattern 1120 of the chip 110 is arranged in an array (as shown in FIG. 3); (C) an array of the pad electrode 1501 is transferred to the first predetermined circuit pattern 1120 on the first circuit ceramic mother substrate 110. Thereby forming an array of first circuit patterns 112 (as shown in FIG. 4); (D) stripping the carrier film 150 (as shown in FIG. 5); (E) sintering the circuit ceramic mother chips 110, 120, 130, 140 To form a collection substrate 100 (as shown in FIG. 6); and (F) to draw at a momentThe collective substrate 100 is scribed, and the collective substrate 100 is divided into a plurality of laminated bodies 10, and the array of the first circuit patterns 112 in the collective substrate 100 is divided into a plurality of first circuit patterns 112 and configured. The laminated inductor 1 shown in FIG.
如圖1所示，經該步驟(F)所刻劃出的該積層式電感器1由下而上依序包含：一第一電路陶瓷片11、一第二電路陶瓷片12、一第三電路陶瓷片13，及一第四電路陶瓷片14。該第一電路陶瓷片11具有一非磁性體111，及該配置於該第一電路陶瓷片11之非磁性體111中的第一電路圖案112。該第二電路陶瓷片12與該第三電路陶瓷片13分別具有一磁性體121、131，及一分別配置於其磁性體121、131中的第二電路圖案122與第三電路圖案132。該第四電路陶瓷片14具有一非磁性體141，及一配置於該第四電路陶瓷片14之非磁性體141中的第四電路圖案142。As shown in FIG. 1 , the laminated inductor 1 delineated by the step (F) is sequentially included from bottom to top: a first circuit ceramic piece 11, a second circuit ceramic piece 12, and a third. The circuit ceramic piece 13, and a fourth circuit ceramic piece 14. The first circuit ceramic piece 11 has a non-magnetic body 111 and a first circuit pattern 112 disposed in the non-magnetic body 111 of the first circuit ceramic piece 11. The second circuit ceramic piece 12 and the third circuit ceramic piece 13 respectively have a magnetic body 121, 131, and a second circuit pattern 122 and a third circuit pattern 132 respectively disposed in the magnetic bodies 121, 131 thereof. The fourth circuit ceramic piece 14 has a non-magnetic body 141 and a fourth circuit pattern 142 disposed in the non-magnetic body 141 of the fourth circuit ceramic piece 14.
該積層式電感器1是利用該等電路陶瓷片11、12、13、14的電路圖案112、122、132、142以共同構成一內繞式的線圈。然而，詳細地來說，於執行該步驟(A)之前，是依序對多數陶瓷母片(圖未示)貫孔以於各陶瓷母片形成多數通孔、於各通孔內填置導電糊以形成多數導通導體，以及在各陶瓷母片上塗置導電糊以形成各電路圖案等多道程序，才可製得各電路陶瓷母片110、120、130、140。此外，在執行完該步驟(E)的燒結處理與該步驟(F)之刻畫後才可取得各積層式電感器1之積層體10的外觀面。就製程面來說，前案1的程序相當繁瑣，使製造成本提升。另外，因為積層體10是經堆疊燒結該等電路陶瓷母片110、120、130、140並施予刻劃後所取得，使該積層式電感器1體積也隨之提高，而不利於安排至電路板上的布局。The laminated inductor 1 is formed by using the circuit patterns 112, 122, 132, and 142 of the circuit ceramic sheets 11, 12, 13, and 14 to form an inner winding type coil. However, in detail, before performing this step (A), a plurality of ceramic mother sheets (not shown) are sequentially formed to form a plurality of through holes for each ceramic mother sheet, and conductive holes are filled in the respective through holes. Each of the circuit ceramic mother sheets 110, 120, 130, 140 can be produced by forming a plurality of conductive conductors and applying a conductive paste on each of the ceramic mother sheets to form a plurality of circuit patterns. Further, the appearance surface of the laminated body 10 of each laminated inductor 1 can be obtained after the sintering process of the step (E) and the drawing of the step (F) are performed. As far as the process surface is concerned, the procedure of the previous case 1 is rather cumbersome, which increases the manufacturing cost. In addition,Since the laminated body 10 is obtained by stacking and sintering the circuit ceramic mother chips 110, 120, 130, and 140, the volume of the laminated inductor 1 is also increased, which is unfavorable for arranging to the circuit board. The layout on the top.
經上述說明可知，簡化被動元件之外觀面的製作方法以降低製作成本，是此技術領域的相關技術人員所待突破的難題。It can be seen from the above description that simplifying the manufacturing method of the appearance surface of the passive component to reduce the manufacturing cost is a difficult problem to be solved by those skilled in the technical field.
因此，本新型之目的，即在提供一種被動元件的預形體。Therefore, the object of the present invention is to provide a preform of a passive component.
於是，本新型被動元件的預形體，是連接於一基板的一基座，該基座具有一輪廓面，且該基座之輪廓面包括相反設置的一第一側緣及一第二側緣。該被動元件的預形體包含：一主體部與至少一連接部。Therefore, the preform of the passive component of the present invention is a base connected to a substrate, the base has a contoured surface, and the contoured surface of the base includes a first side edge and a second side edge disposed oppositely . The preform of the passive component comprises: a body portion and at least one connecting portion.
該主體部具有一輪廓面，該主體部之輪廓面包括相反設置的一第一側緣及一第二側緣。該連接部具有一輪廓面，該連接部的輪廓面包括相反設置的一第一端與一第二端。該連接部的第一端與第二端是分別連接於該基座的第二側緣與該主體部的第一側緣，以令該連接部的輪廓面銜接於該主體部的輪廓面與該基座的輪廓面。在本新型中，該主體部與該連接部是由一相同於該基板的材質所構成，且該主體部與該連接部為一體者(unity)。The main body portion has a contoured surface, and the contoured surface of the main body portion includes a first side edge and a second side edge disposed oppositely. The connecting portion has a contoured surface, and the contoured surface of the connecting portion includes a first end and a second end disposed oppositely. The first end and the second end of the connecting portion are respectively connected to the second side edge of the base and the first side edge of the main body portion, so that the contour surface of the connecting portion is coupled to the contour surface of the main body portion and The contoured surface of the base. In the present invention, the main body portion and the connecting portion are formed of a material similar to the substrate, and the main body portion is united with the connecting portion.
本新型之功效在於，藉由該被動元件的預形體預先成形於該基板，無須機械刻畫，並利用該等連接部連接於各基座，使各主體部便於被折斷，因而有利於量產化且製程簡化。另外，相較多層陶瓷母片燒結，該被動元件的預形體為一體結構，因而具有較高的結構穩定度。The utility model has the advantages that the preform of the passive component is pre-formed on the substrate without mechanical drawing, and the connecting portions are connected to the pedestals, so that the main body portions are easily broken, thereby facilitating mass production.And the process is simplified. In addition, since a plurality of ceramic mother sheets are sintered, the preform of the passive component has an integral structure and thus has high structural stability.
2‧‧‧被動元件的預形體2‧‧‧Preforms of passive components
20‧‧‧基板20‧‧‧Substrate
200‧‧‧基座200‧‧‧Base
201‧‧‧上表面201‧‧‧ upper surface
202‧‧‧下表面202‧‧‧lower surface
203‧‧‧輪廓面203‧‧‧ contour surface
204‧‧‧第一側緣204‧‧‧First side edge
205‧‧‧第二側緣205‧‧‧second side edge
21‧‧‧主體部21‧‧‧ Main body
210‧‧‧輪廓面210‧‧‧ contour surface
211‧‧‧第一側緣211‧‧‧ first side edge
212‧‧‧第二側緣212‧‧‧Second side edge
213‧‧‧溝槽213‧‧‧ trench
214‧‧‧穿孔214‧‧‧Perforation
22‧‧‧連接部22‧‧‧Connecting Department
220‧‧‧輪廓面220‧‧‧ contour surface
221‧‧‧第一端221‧‧‧ first end
222‧‧‧第二端222‧‧‧ second end
2221‧‧‧凹槽2221‧‧‧ Groove
3‧‧‧光阻層3‧‧‧ photoresist layer
31‧‧‧預定圖案31‧‧‧Prescribed pattern
310‧‧‧外觀形狀310‧‧‧ appearance shape
311‧‧‧基座部311‧‧‧Base section
312‧‧‧橋接部312‧‧ ‧Bridge
3121‧‧‧缺口3121‧‧ ‧ gap
313‧‧‧本體部313‧‧‧ Body Department
4‧‧‧第一電極層4‧‧‧First electrode layer
5‧‧‧介電層5‧‧‧Dielectric layer
6‧‧‧第二電極層6‧‧‧Second electrode layer
X‧‧‧第一方向X‧‧‧ first direction
Y‧‧‧第二方向Y‧‧‧second direction
本新型之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是一立體分解圖，說明由台灣第TW 201440090 A早期公開號發明專利案所公開的一種積層式電感器；圖2是一截面圖，說明該積層式電感器的製造方法的一步驟(A)；圖3是一截面圖，說明該積層式電感器的製造方法的一步驟(B)；圖4是一截面圖，說明該積層式電感器的製造方法的一步驟(C)；圖5是一截面圖，說明該積層式電感器的製造方法的一步驟(D)；圖6是一截面圖，說明該積層式電感器的製造方法的一步驟(E)；圖7是一截面圖，說明該積層式電感器的製造方法的一步驟(F)；圖8是一俯視示意圖，說明本新型被動元件的預形體的一第一實施例；圖9是一局部截面圖，說明以該第一實施例之被動元件之預形體所製作出的一電容器；圖10是一俯視示意圖，說明本新型被動元件的預形體的一第二實施例；圖11是一俯視示意圖，說明該第二實施例之被動元件之預形體之一主體部形成有複數溝槽的一態樣；圖12是一俯視示意圖，說明該第二實施例之被動元件之預形體之主體部形成有複數穿孔的另一態樣；圖13是一俯視示意圖，說明本新型被動元件的預形體的一第三實施例；圖14是一沿圖13的直線ⅩⅣ-ⅩⅣ所取得的剖視示意圖；圖15是一俯視示意圖，說明本新型被動元件的預形體之量產方法之一步驟(a)；圖16是一沿圖15的直線ⅩⅥ-ⅩⅥ所取得的剖視示意圖；圖17是一俯視示意圖，說明該量產方法的一步驟(b)；圖18是一沿圖17的直線ⅩⅧ-ⅩⅧ所取得的剖視示意圖；圖19是一俯視示意圖，說明該量產方法的一步驟(c)；圖20是一俯視示意圖，說明該量產方法的一步驟(d)。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is an exploded perspective view showing a layer disclosed by the Taiwan Patent Publication No. TW 201440090 A. Figure 2 is a cross-sectional view showing a step (A) of the method of manufacturing the laminated inductor; Figure 3 is a cross-sectional view showing a step (B) of the method of manufacturing the laminated inductor; 4 is a cross-sectional view showing a step (C) of the method of manufacturing the laminated inductor; FIG. 5 is a cross-sectional view showing a step (D) of the method of manufacturing the laminated inductor; A cross-sectional view illustrating a step (E) of the method of manufacturing the laminated inductor; FIG. 7 is a cross-sectional view illustrating a step (F) of the method of manufacturing the laminated inductor; and FIG. 8 is a top plan view illustrating A first embodiment of the preform of the passive component of the present invention; FIG. 9 is a partial cross-sectional view showing a capacitor fabricated by the preform of the passive component of the first embodiment; FIG. 10 is a top plan view illustrating Preform of the novel passive componentA second embodiment; FIG. 11 is a top plan view showing a state in which a main body portion of a passive component of the second embodiment is formed with a plurality of grooves; FIG. 12 is a top plan view illustrating the first The main body portion of the preform of the passive component of the second embodiment is formed with another aspect of the plurality of perforations; FIG. 13 is a top plan view showing a third embodiment of the preform of the passive component of the present invention; FIG. 15 is a top plan view showing one step (a) of the mass production method of the preform of the passive component of the present invention; FIG. 16 is a line XVI- along the line of FIG. FIG. 17 is a schematic plan view showing a step (b) of the mass production method; FIG. 18 is a cross-sectional view taken along line XVIII-XVIII of FIG. 17; FIG. A top plan view illustrates a step (c) of the mass production method; and FIG. 20 is a top plan view illustrating a step (d) of the mass production method.
在本新型被詳細描述之前，應當注意在以下的說明內容中，類似的元件是以相同的編號來表示。Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same reference numerals.
參閱圖8，本新型被動元件的預形體2的一第一實施例，是連接於一基板20的一基座200，該基座200具有一輪廓面203，且該基座200之輪廓面203包括相反設置的一第一側緣204及一第二側緣205。該被動元件的預形體2包含一主體部21與兩個連接部22。Referring to FIG. 8, a first embodiment of the preform 2 of the passive component of the present invention is a base 200 coupled to a substrate 20 having a contoured surface 203 and a contoured surface 203 of the base 200. A first side edge 204 and a second side edge 205 are provided oppositely. The preform 2 of the passive component comprises a body portion 21 and two connecting portions 22.
該主體部21具有一輪廓面210，該主體部21之輪廓面210包括相反設置的一第一側緣211及一第二側緣212。The body portion 21 has a contoured surface 210. The contoured surface 210 of the body portion 21 includes a first side edge 211 and a second side edge 212 disposed oppositely.
各連接部22具有一輪廓面220，各連接部22的輪廓面220包括相反設置的一第一端221與一第二端222。如圖8所示，各連接部22的第一端221與第二端222是分別連接於該基座200的第二側緣205與該主體部21的第一側緣211，以令各連接部22的輪廓面220銜接於該主體部21的輪廓面210與該基座200的輪廓面203。各連接部22的第一端221朝其第二端222定義出一第一方向X，且該等連接部22是沿一與該第一方向X夾一預定角度的第二方向Y彼此間隔設置。在本新型各實施例中，該預定角度以90度為例作說明，但不以此為限。Each of the connecting portions 22 has a contoured surface 220. The contoured surface 220 of each connecting portion 22 includes a first end 221 and a second end 222 disposed oppositely. As shown in FIG. 8 , the first end 221 and the second end 222 of each connecting portion 22 are respectively connected to the second side edge 205 of the base 200 and the first side edge 211 of the main body portion 21 to make each connection. The contoured surface 220 of the portion 22 engages the contoured surface 210 of the body portion 21 and the contoured surface 203 of the base 200. The first end 221 of each connecting portion 22 defines a first direction X toward the second end 222 thereof, and the connecting portions 22 are spaced apart from each other along a second direction Y that is a predetermined angle with the first direction X. . In the various embodiments of the present invention, the predetermined angle is exemplified by 90 degrees, but is not limited thereto.
更具體地來說，在本新型該第一實施例中，該基座200的輪廓面203是由如圖8所示之該基座200的一頂面區、一底面區、一左側面區、一右側面區、一前面區與一背面區所共同定義而成；該主體部21的輪廓面210是由如圖8所示之該主體部21的一頂面區、一底面區、一左側面區、一右側面區、一前面區與一背面區所共同定義而成；各連接部22的輪廓面220是由如圖8所示之各連接部22的一頂面區、一底面區、一前面區與一背面區所共同定義而成；此外，該主體部21與該連接部22是由一相同於該基板20的材質所構成。較佳地，該材質是選自一以矽為主的材料(Si-based material)或一金屬材料。更佳地，該以矽為主的材料可為石英(quartz)、矽晶圓(silicon wafer)、碳化矽(SiC)或氮化矽(Si3N4)。經前述說明可知，本新型該第一實施例之各連接部22的輪廓面220可銜接該基座200的輪廓面203與該主體部21的輪廓面210；此外，基於構成該基板20之該材質是選自該以矽為主的材料或該金屬材料，該主體部21與該等連接部22是由該相同於該基板20的材質所構成，且該主體部21與該連接部22為一體者，以致該預形體2之主體部21的整體結構強度高，不像圖1所示之積層式電感器1般，於該等電路陶瓷片11、12、13、14相鄰界面間存在有強度不足的問題。More specifically, in the first embodiment of the present invention, the contour surface 203 of the susceptor 200 is a top surface area, a bottom surface area, and a left side area of the susceptor 200 as shown in FIG. a right side area, a front area and a back area are defined together; the contour surface 210 of the main body portion 21 is a top surface area, a bottom surface area, and a bottom surface area of the main body portion 21 as shown in FIG. The left side area, the right side area, the front area and the back area are defined together; the contour surface 220 of each connecting portion 22 is a top surface and a bottom surface of each connecting portion 22 as shown in FIG. The area, a front area and a back area are defined together; in addition, the main body portion 21 and the connecting portion 22 are formed of a material similar to the substrate 20. Preferably, the material is selected from a Si-based material or a metal material. More preferably, the ruthenium-based material may be quartz, silicon wafer, tantalum carbide (SiC) or tantalum nitride (Si3 N4 ). According to the foregoing description, the contour surface 220 of each connecting portion 22 of the first embodiment of the present invention can engage the contour surface 203 of the base 200 and the contour surface 210 of the main body portion 21; further, based on the configuration of the substrate 20 The material is selected from the material mainly composed of bismuth or the metal material, and the main body portion 21 and the connecting portion 22 are made of the same material as the substrate 20, and the main body portion 21 and the connecting portion 22 are In one piece, the overall structural strength of the main body portion 21 of the preform 2 is high, unlike the laminated inductor 1 shown in FIG. 1, between the adjacent interfaces of the circuit ceramic sheets 11, 12, 13, and 14. There is a problem of insufficient strength.
整合本新型該第一實施例上述詳細說明，簡單地來說，本新型於上面所述之一體者，是被定義為一體結構。此外，所謂的一體結構，是指該主體部21是經由蝕刻一塊材(bulk matter)所成形取得，以致於該主體部21結構強度高，且內部不存在有層間剝離的問題。該塊材可以是一板狀的塊材，如，石英基板(quartz wafer)。The above detailed description of the first embodiment of the present invention is integrated. Briefly, the present invention is defined as an integral structure as described above. In addition, the so-called integral structure means that the main body portion 21 is formed by etching a bulk material, so that the main body portion 21 has high structural strength and there is no problem of interlayer peeling inside. The block may be a plate-like block such as a quartz wafer.
此處須補充說明的是，本新型被動元件的預形體2主要是透過微機電系統(MEMS)的製程來量產化。關於本新型被動元件之預形體2的相關量產方法，則容後說明。進一步地來說，本新型被動元件之預形體2也同樣可透過MEMS製程以簡易地於預形體2的主體部21上製作出被動元件所需的線路。以電容器舉例來說(參閱圖9)，圖9顯示有採用本新型該第一實施例之預形體2並透過MEMS製程所製成的一電容器。如圖9所示，將一第一電極層4、一介電層(dielectric layer)5及一第二電極層6依序鍍製於該主體部21之輪廓面210的頂面區上，以製作出該電容器。It should be added here that the preform 2 of the novel passive component is mainly mass-produced through a microelectromechanical system (MEMS) process. The related mass production method of the preform 2 of the novel passive component is described later.. Further, the preform 2 of the passive element of the present invention can also be permeable to the MEMS process to easily form the wiring required for the passive component on the main body portion 21 of the preform 2. By way of example for a capacitor (see Figure 9), Figure 9 shows a capacitor fabricated using the preform 2 of the first embodiment of the present invention and fabricated through a MEMS process. As shown in FIG. 9 , a first electrode layer 4 , a dielectric layer 5 , and a second electrode layer 6 are sequentially plated on the top surface area of the contour surface 210 of the main body portion 21 to The capacitor was fabricated.
參閱圖10，本新型被動元件的預形體的一第二實施例，大致相同於該第一實施例，其不同之處在於各連接部22的一寬度是自該第一端221朝第二端222(即，沿該第一方向X)遞減。本新型該第二實施例之預形體2中的各連接部22寬度沿該第一方向X遞減的目的，是配合本新型被動元件之預形體2的量產方法，其詳細目的與用途則容後說明。Referring to FIG. 10, a second embodiment of the preform of the passive element of the present invention is substantially the same as the first embodiment, except that a width of each connecting portion 22 is from the first end 221 toward the second end. 222 (ie, along the first direction X) is decremented. The purpose of reducing the width of each connecting portion 22 in the preform 2 of the second embodiment in the first direction X is to mass-produce the preform 2 of the passive element of the present invention, and the detailed purpose and use thereof are After the explanation.
參閱圖11與圖12，為了於該主體部21上進行特殊線路布局以構成電感元件，還能透過MEMS製程在該主體部21上形成複數自該主體部21之輪廓面210的頂面區延伸至其底面區的溝槽213(如圖11示)，或是複數貫穿該主體部21之輪廓面210的頂面區與底面區的穿孔214(如圖12所示)。以電感元件舉例來說，當構成該基板20的材質是石英時，該預形體2之主體部21在透過MEMS製程來完成繞線線路後，則可做為一用於高頻頻寬的空芯電感(air-core inductor)；例如，當構成該基板20的材質是選自該金屬材料的銅(Cu)時，該預形體2之主體部21在透過MEMS製程來完成繞線線路後，亦可做為該空芯電感器。但此處需補充說明的是，當構成該基板20之材質是選自該金屬材質的銅，且欲透過MEMS製程在該預形體2之主體部21的該等溝槽213或該等穿孔214上完成繞線線路時，則需在完成繞線線路前鍍覆上一絕緣層(insulator)以防止短路問題產生。Referring to FIG. 11 and FIG. 12, in order to form a special circuit layout on the main body portion 21 to form an inductance element, a top surface region extending from the contour surface 210 of the main body portion 21 may be formed on the main body portion 21 through a MEMS process. A groove 213 (shown in FIG. 11) to the bottom surface region thereof, or a plurality of perforations 214 (shown in FIG. 12) extending through the top and bottom regions of the contoured surface 210 of the body portion 21. For example, when the material constituting the substrate 20 is quartz, the main body portion 21 of the preform 2 can be used as a hollow core for high frequency bandwidth after completing the winding circuit through the MEMS process. An air-core inductor; for example, when the material constituting the substrate 20 is copper (Cu) selected from the metal material, the main body portion 21 of the preform 2 is transmitted throughAfter the MEMS process completes the winding circuit, it can also be used as the hollow core inductor. However, it should be additionally noted that when the material constituting the substrate 20 is copper selected from the metal material, the trenches 213 or the vias 214 of the main body portion 21 of the preform 2 are to be processed by the MEMS process. When the winding circuit is completed, it is necessary to plate an insulating layer before the winding circuit is completed to prevent the short circuit problem.
參閱圖13與圖14，本新型被動元件的預形體的一第三實施例，大致相同於該第二實施例，其不同之處在於各連接部22的第二端222具有至少一凹槽2221。各連接部22的凹槽2221是自各連接部22之輪廓面220的頂面區及其底面區兩者其中之一者向其頂面區及其底面區兩者其中另一者延伸，且是自各連接部22之輪廓面220之背面區沿該第二方向Y凹陷。在本新型該第一實施例中，各連接部22的凹槽2221數量是兩個，各連接部22之該兩凹槽2221之其中一者(見顯示於圖14之上方凹槽2221)是自其輪廓面220之頂面區朝其底面區延伸，且各連接部22的該兩凹槽2221之其中另一者(見顯示於圖14之下方凹槽2221)則是自其輪廓面220的底面區朝其頂面區延伸。Referring to FIG. 13 and FIG. 14, a third embodiment of the preform of the passive element of the present invention is substantially the same as the second embodiment, except that the second end 222 of each connecting portion 22 has at least one recess 2221. . The groove 2221 of each connecting portion 22 is extended from one of the top surface area of the contour surface 220 of each connecting portion 22 and the bottom surface area thereof to the other of the top surface area and the bottom surface area thereof, and is The back surface region of the contoured surface 220 of each of the connecting portions 22 is recessed in the second direction Y. In the first embodiment of the present invention, the number of the grooves 2221 of each connecting portion 22 is two, and one of the two grooves 2221 of each connecting portion 22 (see the groove 2221 shown in FIG. 14) is The top surface region of the contoured surface 220 extends toward the bottom surface region thereof, and the other of the two recesses 2221 of each connecting portion 22 (see the lower recess 2221 shown in FIG. 14) is from the contour surface 220 thereof. The bottom surface area extends toward the top surface area.
此處值得補充說明的是，於圖13中所顯示的各凹槽2221是沿該第二方向Y凹陷以貫穿各連接部22之輪廓面220的前面區與背面區，但該等凹槽2221並不限於圖13所示的態樣，各凹槽2221也可以是未貫穿各連接部22之輪廓面220的前面區與背面區。各凹槽2221的目的是配合本新型被動元件之預形體2的量產方法，因此，各凹槽2221的詳細目的與用途，亦容後說明。It should be additionally noted here that each of the grooves 2221 shown in FIG. 13 is recessed in the second direction Y to penetrate the front and back regions of the contoured surface 220 of each connecting portion 22, but the grooves 2221 Not limited to the embodiment shown in FIG. 13, each of the grooves 2221 may be a front area and a back area that do not extend through the contoured surface 220 of each of the connecting portions 22. The purpose of each groove 2221 is to cooperate with the mass production method of the preform 2 of the novel passive component, and therefore, each grooveThe detailed purpose and use of 2221 will also be explained later.
參閱圖15至圖18，本新型被動元件的預形體之一量產方法是以MEMS製程來實施，其依序包含一步驟(a)與一步驟(b)。Referring to FIG. 15 to FIG. 18, one of the preforms of the novel passive component is mass-produced by a MEMS process, which comprises a step (a) and a step (b) in sequence.
參閱圖15與圖16，該步驟(a)是於該基板20的一上表面201與一下表面202上各形成一具有一預定圖案31的光阻層3。各預定圖案31具有一覆蓋該基板20之上表面201或下表面202的陣列，各陣列具有複數外觀形狀310，且各外觀形狀310沿該第一方向X依序具有彼此連接的一基座部311、兩橋接部312與一本體部313。該等外觀形狀310之本體部313是沿該第一方向X或沿該第二方向Y彼此間隔排列，且該等外觀形狀310之基座部311是沿該第一方向X或沿該第二方向Y彼此連接。在本新型量產方法之該實施例中，各光阻層3之該等外觀形狀310是如圖15所示，沿該第一方向X彼此間隔排列，且該等光阻層3之預定圖案31的該等外觀形狀310是如圖16所示，彼此上下對準。該等外觀形狀310之本體部313是沿該第二方向Y彼此間隔排列，該等外觀形狀310之基座部311是沿該第二方向Y彼此連接；各外觀形狀310之橋接部312的一寬度是沿該第一方向X遞減，且各外觀形狀310之該等橋接部312是沿該第二方向Y彼此間隔設置。形成於該基板20之上表面201與下表面202的光阻層3之各外觀形狀310的各橋接部312於鄰近其本體部313處形成有一缺口3121，且各缺口3121是自其橋接部312的一周緣沿該第二方向Y凹陷，以令各橋接部312與各本體部313彼此斷開。簡單地來說，各外觀形狀310的圖形輪廓(即，基座部311、橋接部312與本體部313)，是相同於如圖13所示之該第三實施例之預形體2的基座200之輪廓面203的頂面區、預形體2之連接部22之輪廓面220的頂面區與預形體2之主體部21之輪廓面210的頂面區。Referring to FIG. 15 and FIG. 16, the step (a) is to form a photoresist layer 3 having a predetermined pattern 31 on an upper surface 201 and a lower surface 202 of the substrate 20. Each of the predetermined patterns 31 has an array covering the upper surface 201 or the lower surface 202 of the substrate 20, each array having a plurality of external shapes 310, and each of the external shapes 310 sequentially has a base portion connected to each other along the first direction X. 311, two bridges 312 and a body portion 313. The body portions 313 of the outer shape 310 are spaced apart from each other along the first direction X or along the second direction Y, and the base portion 311 of the outer shape 310 is along the first direction X or along the second The directions Y are connected to each other. In this embodiment of the novel mass production method, the appearance shapes 310 of the photoresist layers 3 are arranged along the first direction X as shown in FIG. 15, and the predetermined patterns of the photoresist layers 3 are arranged. These appearance shapes 310 of 31 are vertically aligned with each other as shown in FIG. The body portions 313 of the outer shape 310 are spaced apart from each other along the second direction Y. The base portions 311 of the outer shape shapes 310 are connected to each other along the second direction Y; and one of the bridge portions 312 of the outer shape shapes 310 The width is decreasing along the first direction X, and the bridge portions 312 of the respective appearance shapes 310 are spaced apart from each other along the second direction Y. Each of the bridge portions 312 of the respective outer shape 310 of the photoresist layer 3 formed on the upper surface 201 and the lower surface 202 of the substrate 20 is formed with a notch 3121 adjacent to the body portion 313 thereof, and each of the notches 3121 is from the bridge portion 312 thereof. The circumference of the second along the secondThe direction Y is recessed so that the bridge portions 312 and the body portions 313 are disconnected from each other. Briefly, the graphic outline of each of the external shapes 310 (i.e., the base portion 311, the bridge portion 312, and the body portion 313) is the same as the base of the preform 2 of the third embodiment as shown in FIG. The top surface area of the contoured surface 203 of 200, the top surface area of the contoured surface 220 of the connecting portion 22 of the preform 2, and the top surface area of the contoured surface 210 of the body portion 21 of the preform 2.
此處值得補充說明的是，當構成該基板20的材質是選自該以矽為主的材料時，為了進一步加強蝕刻時的保護效果，該量產方法還包含一於該步驟(a)之前的步驟(a’)，該步驟(a’)是至少於該基板20的上表面201或下表面202上形成一金屬保護層(圖未示)，且該步驟(a)的光阻層3是形成於該金屬保護層上。在該量產方法中，該步驟(a’)是於該基板20的上表面201及下表面202上分別形成該金屬保護層(圖未示)，且該步驟(a)的各光阻層3是形成於各金屬保護層(圖未示)上。It should be noted here that when the material constituting the substrate 20 is selected from the material mainly composed of ruthenium, in order to further enhance the protective effect during etching, the mass production method further includes before the step (a). Step (a'), wherein the step (a') is to form a metal protective layer (not shown) on at least the upper surface 201 or the lower surface 202 of the substrate 20, and the photoresist layer 3 of the step (a) It is formed on the metal protective layer. In the mass production method, the step (a') is to form the metal protective layer (not shown) on the upper surface 201 and the lower surface 202 of the substrate 20, and the photoresist layers in the step (a). 3 is formed on each metal protective layer (not shown).
再參閱圖16並配合參閱圖17與圖18，該步驟(b)是對該基板20進行濕式蝕刻或乾式蝕刻，以令裸露於該等光阻層3之預定圖案31之陣列外的基板20被移除掉，並從而形成複數基座200與複數對應連接於各基座200之如圖13所示之被動元件的預形體2。Referring to FIG. 16 and referring to FIG. 17 and FIG. 18, the step (b) is to wet-etch or dry-etch the substrate 20 to expose the substrate outside the array of predetermined patterns 31 of the photoresist layers 3. The 20 is removed and thereby forms a plurality of pedestals 200 and a plurality of preforms 2 corresponding to the passive elements of the susceptor 200 as shown in FIG.
再參閱圖18並配合參閱圖19與圖20，較佳地，於該步驟(b)後，還包含一步驟(c)與一步驟(d)。該步驟(c)是移除該等光阻層3，以於該基板20上留下如圖19所示之預形體2的陣列，與沿該第二方向Y彼此連接之基座200的陣列。該步驟(d)於該步驟(c)之後，且是於該等被動元件的預形體2的該等連接部22處，由上而下或由下而上分別施予一外力，使各被動元件的預形體2之連接部22的第二端222自各預形體2之主體部21的第一側緣211斷裂，從而令各被動元件的預形體2之主體部21自各連接部22脫離，以量產出該等預形體2之主體部21。Referring to FIG. 18 and referring to FIG. 19 and FIG. 20, preferably, after step (b), a step (c) and a step (d) are further included. The step (c) is to remove the photoresist layers 3 to leave an array of pre-forms 2 as shown in FIG. 19 on the substrate 20, and a susceptor 200 connected to each other along the second direction Y.Array. The step (d) is after the step (c), and at the connecting portions 22 of the preforms 2 of the passive components, an external force is applied from top to bottom or from bottom to top to make each passive The second end 222 of the connecting portion 22 of the pre-form 2 of the element is broken from the first side edge 211 of the main body portion 21 of each pre-form 2, so that the main body portion 21 of the preform 2 of each passive element is detached from each connecting portion 22, The body portion 21 of the preforms 2 is produced in an amount.
經前述量產方法的詳細說明可知，位於各光阻層3之外觀形狀310之橋接部312處該等缺口3121是用來使該基板20於執行步驟(b)之蝕刻後，可形成如圖13所顯示之各預形體2之連接部22的凹槽2221，而顯示於圖13中的凹槽2221其目的則是令該量產方法於執行該步驟(d)時，有利於受該外力所折斷以達量產化的效用。值得一提的是，各凹槽2221亦可於該步驟(b)形成出各預形體2的連接部22後，另以一切割器(scriber)或另外以蝕刻方式形成於各預形體2的連接部22上。According to the detailed description of the mass production method, the notch 3121 is located at the bridging portion 312 of the outer shape 310 of each photoresist layer 3, and is used to form the substrate 20 after performing the etching of step (b). The groove 2221 of the connecting portion 22 of each of the preforms 2 shown in Fig. 13 and the groove 2221 shown in Fig. 13 is intended to make the mass production method advantageous for the external force when performing the step (d). It is broken to achieve the utility of mass production. It should be noted that each of the grooves 2221 may be formed in the step (b) of the connecting portion 22 of each preform 2, and then formed in each of the preforms 2 by a scriber or another etching method. On the connecting portion 22.
此處需補充說明的是，雖然該量產方法是用來量產被動元件之預形體2，但就如同前述被動元件之預形體2之各實施例所說明般，該被動元件之預形體2可透過MEMS製程於其主體部21上製作出被動元件所需的線路；因此，該量產方法的步驟(d)亦可在形成完被動元件所需之線路後才實施。It should be additionally noted here that although the mass production method is used to mass-produce the preform 2 of the passive component, the preform of the passive component 2 is as described in the respective embodiments of the preform 2 of the passive component. The circuit required for the passive component can be fabricated on the main body portion 21 through the MEMS process; therefore, the step (d) of the mass production method can also be implemented after the circuit required for the passive component is formed.
詳細地來說，本新型被動元件之預形體2的量產方法，僅需透過該步驟(a)與該步驟(b)即可完成被動元件之預形體2的輪廓面，無需如同前案1所述般，各陶瓷母片尚需先經過貫孔、填置與塗佈導電糊等程序以形成電路陶瓷母片110、120、130、140後，並經過燒結處理與刻劃處理等程序後才可取得如圖7所示之各積層式電感器1之積層體10的外觀面。再者，本新型被動元件之預形體2中的主體部21與連接部22為一體者，主體部21的整體結構強度高，不像如圖1所示之積層式電感器1般，於該等電路陶瓷片11、12、13、14相鄰界面間存在有強度不足的問題。In detail, the mass production method of the preform 2 of the passive component of the present invention only needs to complete the contour surface of the preform 2 of the passive component through the step (a) and the step (b), without the prior case 1 As mentioned, each ceramic motherThe film still needs to pass through the through hole, filling and coating conductive paste and other procedures to form the circuit ceramic mother wafer 110, 120, 130, 140, and after the sintering process and scribing process, etc., can be obtained as shown in Fig. 7. The appearance surface of the laminated body 10 of each laminated inductor 1 is shown. Furthermore, the main body portion 21 of the preform 2 of the passive device of the present invention is integrated with the connecting portion 22, and the overall structural strength of the main body portion 21 is high, unlike the laminated inductor 1 shown in FIG. There is a problem of insufficient strength between adjacent interfaces of the circuit ceramic sheets 11, 12, 13, and 14.
綜上所述，本新型被動元件的預形體2可令呈陣列排列設置的該等連接部22連接於各基座200，且該等連接部22中的凹槽2221設計，令各主體部21在透過MEMS製程完成被動元件所需線路後，使各主體部21便於被折斷，有利於量產化且製程簡化；此外，該被動元件的預形體2之連接部22與主體部21為一體結構，因而主體部21的整體結構強度高，故確實能達成本新型之目的。In summary, the preform 2 of the passive component of the present invention can connect the connecting portions 22 arranged in an array to the bases 200, and the grooves 2221 in the connecting portions 22 are designed so that the main body portions 21 are provided. After the required line of the passive component is completed through the MEMS process, each main body portion 21 is easily broken, which is advantageous for mass production and simplified process; further, the connecting portion 22 of the preform 2 of the passive component is integrated with the main body portion 21. Therefore, the overall structural strength of the main body portion 21 is high, so that the object of the present invention can be achieved.
惟以上所述者，僅為本新型之實施例而已，當不能以此限定本新型實施之範圍，即大凡依本新型申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本新型專利涵蓋之範圍內。However, the above description is only for the embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent changes and modifications made by the present patent application scope and the contents of the patent specification are still It is within the scope of this new patent.
2‧‧‧被動元件的預形體2‧‧‧Preforms of passive components
20‧‧‧基板20‧‧‧Substrate
200‧‧‧基座200‧‧‧Base
203‧‧‧輪廓面203‧‧‧ contour surface
204‧‧‧第一側緣204‧‧‧First side edge
205‧‧‧第二側緣205‧‧‧second side edge
21‧‧‧主體部21‧‧‧ Main body
210‧‧‧輪廓面210‧‧‧ contour surface
211‧‧‧第一側緣211‧‧‧ first side edge
212‧‧‧第二側緣212‧‧‧Second side edge
22‧‧‧連接部22‧‧‧Connecting Department
220‧‧‧輪廓面220‧‧‧ contour surface
221‧‧‧第一端221‧‧‧ first end
222‧‧‧第二端222‧‧‧ second end
2221‧‧‧凹槽2221‧‧‧ Groove
X‧‧‧第一方向X‧‧‧ first direction
Y‧‧‧第二方向Y‧‧‧second direction
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104210222UTWM511120U (en) | 2015-06-25 | 2015-06-25 | Preform of passive component |
| CN201520594921.5UCN204884836U (en) | 2015-06-25 | 2015-08-10 | Preform for passive element |
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104210222UTWM511120U (en) | 2015-06-25 | 2015-06-25 | Preform of passive component |
| Publication Number | Publication Date |
|---|---|
| TWM511120Utrue TWM511120U (en) | 2015-10-21 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104210222UTWM511120U (en) | 2015-06-25 | 2015-06-25 | Preform of passive component |
| Country | Link |
|---|---|
| CN (1) | CN204884836U (en) |
| TW (1) | TWM511120U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI623247B (en)* | 2015-06-25 | 2018-05-01 | Wafer Mems Co Ltd | Mass production method of preform of passive component |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI623247B (en)* | 2015-06-25 | 2018-05-01 | Wafer Mems Co Ltd | Mass production method of preform of passive component |
| Publication number | Publication date |
|---|---|
| CN204884836U (en) | 2015-12-16 |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |