本新型涉及一種發光裝置，特別是指一種燈具。The invention relates to a lighting device, in particular to a lamp.
習知的燈具一般由燈座、燈罩、光源及燈頭組成的。光源安裝於燈座上，並與燈頭導電連接。燈罩固定於燈座上並密封住光源。然而，對於一些對熱量比較敏感的光源，例如發光二極體等，由於光源被密封於燈罩內，導致燈罩內的熱量不易從燈罩內散發出去，影響到此類光源的正常工作。Conventional luminaires generally consist of a lamp holder, a lamp cover, a light source and a lamp holder. The light source is mounted on the lamp holder and electrically connected to the lamp cap. The lamp cover is fixed to the lamp holder and seals the light source. However, for some light sources that are sensitive to heat, such as light-emitting diodes, etc., since the light source is sealed in the lamp cover, the heat in the lamp cover is not easily dissipated from the lamp cover, which affects the normal operation of such a light source.
因此，有必要提供一種散熱效率高的燈具。Therefore, it is necessary to provide a luminaire with high heat dissipation efficiency.
一種燈具，包括燈頭、與燈頭連接的燈座、安裝於燈座上的光源及罩設光源的燈罩，燈罩開設供光源發出的光線出射的開孔，所述多個開孔包括至少兩種不同的尺寸。A lamp includes a lamp cap, a lamp holder connected to the lamp cap, a light source mounted on the lamp socket, and a lamp cover covering the light source, the lamp cover opening an opening for the light emitted by the light source, the plurality of openings comprising at least two different size of.
由於燈罩上設有開孔，因此光源所發出的熱量可經由燈罩的開孔直接向外散發，從而提升整個燈具的散熱效率。Since the lamp cover is provided with an opening, the heat generated by the light source can be directly radiated outward through the opening of the lamp cover, thereby improving the heat dissipation efficiency of the entire lamp.
10‧‧‧燈具10‧‧‧Lighting
20‧‧‧燈頭20‧‧‧ lamp holder
22‧‧‧側壁22‧‧‧ side wall
220‧‧‧螺紋220‧‧‧ thread
24‧‧‧接點24‧‧‧Contacts
26‧‧‧絕緣帶26‧‧‧Insulation tape
30‧‧‧燈座30‧‧‧ lamp holder
300‧‧‧空間300‧‧‧ space
32‧‧‧基板32‧‧‧Substrate
320‧‧‧頂面320‧‧‧ top surface
322‧‧‧底面322‧‧‧ bottom
324‧‧‧穿孔324‧‧‧Perforation
34‧‧‧套筒34‧‧‧ sleeve
342‧‧‧底面342‧‧‧ bottom
36‧‧‧套接部36‧‧‧ Sockets
360‧‧‧螺紋360‧‧‧Thread
38‧‧‧凸緣38‧‧‧Flange
380‧‧‧頂面380‧‧‧ top surface
382‧‧‧底面382‧‧‧ bottom
40‧‧‧光源40‧‧‧Light source
42‧‧‧發光二極體42‧‧‧Lighting diode
44‧‧‧電路板44‧‧‧ boards
50‧‧‧燈罩50‧‧‧shade
52‧‧‧殼體52‧‧‧ housing
520‧‧‧開孔520‧‧‧Opening
521‧‧‧第一開孔521‧‧‧First opening
522‧‧‧第二開孔522‧‧‧Second opening
54‧‧‧折邊54‧‧‧Folding
60‧‧‧驅動模組60‧‧‧Drive Module
70‧‧‧導線70‧‧‧ wire
圖1示出了本新型第一實施例的燈具的立體圖。Fig. 1 is a perspective view showing a lamp of the first embodiment of the present invention.
圖2為圖1的燈具的倒置圖。2 is an inverted view of the luminaire of FIG. 1.
圖3為圖1的燈具的分解圖，其中光源被移去以方便觀察。3 is an exploded view of the luminaire of FIG. 1 with the light source removed for ease of viewing.
圖4為圖3的燈具的倒置圖。4 is an inverted view of the luminaire of FIG.
圖5為圖1的燈具的剖面圖。Figure 5 is a cross-sectional view of the luminaire of Figure 1.
圖6為本新型第二實施例的燈具的剖面圖。Figure 6 is a cross-sectional view of a lamp of a second embodiment of the present invention.
圖7為本新型第三實施例的燈具的剖面圖。Figure 7 is a cross-sectional view of a lamp of a third embodiment of the present invention.
請參閱圖1及圖5，示出本新型第一實施例的燈具10。燈具10包括一燈頭20、一燈座30、一光源40及一燈罩50。Referring to Figures 1 and 5, a luminaire 10 of a first embodiment of the present invention is illustrated. The lamp 10 includes a lamp cap 20, a lamp holder 30, a light source 40, and a lamp cover 50.
請一併參閱圖2-4，燈座30由導熱且絕緣的材料製成，如陶瓷、導熱塑膠等。本實施例中，燈座30由陶瓷一體成型。燈座30包括一基板32、一從基板32周緣向下延伸的套筒34及一形成於套筒34底端的套接部36。基板32呈圓盤狀，其包括一頂面320及與頂面320平行的底面322。基板32上開設有從其頂面320貫穿至底面322的四穿孔324。該四穿孔324均勻分佈於基板32上，且靠近基板32外側周緣。套筒34自基板32的外側周緣向下垂直延伸而出。本實施例中，套筒34呈圓筒形，其厚度大於基板32的厚度。套筒34在其外側周面靠近底部的位置處形成一外凸的凸緣38。該凸緣38呈圓環形，其頂面380低於基板32頂面320，其底面382高於套筒34的底面342。並且，凸緣38的頂面380與基板32頂面320的間距大於凸緣38底面382與套筒34底面342的間距。本實施例中，凸緣38的底面382呈傾斜狀，其朝向套筒34的底面342呈漸縮的錐形。套筒34的內逕自上至下保持一致，套筒34在高於凸緣38位置處的外徑大於低於凸緣38位置處的外徑。套接部36連接套筒34的底端。套接部36的內徑與套筒34的內徑相同，外徑小於套筒34的最小外徑。套接部36的內側周面、套筒34的內側周面及基板32的底面322共同圍設出一圓柱形空間300，用於收容一驅動模組60。該空間300通過基板32的四穿孔324與基板32上方的空間連通。套接部36的外側周面上形成螺紋360，用於與燈頭20螺接。Please refer to FIG. 2-4 together. The lamp holder 30 is made of a heat-conductive and insulating material such as ceramics and heat-conductive plastic. In this embodiment, the socket 30 is integrally formed of ceramic. The lamp holder 30 includes a substrate 32, a sleeve 34 extending downward from the periphery of the substrate 32, and a sleeve portion 36 formed at the bottom end of the sleeve 34. The substrate 32 has a disk shape and includes a top surface 320 and a bottom surface 322 parallel to the top surface 320. The substrate 32 is provided with four through holes 324 extending from the top surface 320 thereof to the bottom surface 322. The four through holes 324 are evenly distributed on the substrate 32 and close to the outer periphery of the substrate 32. The sleeve 34 extends vertically downward from the outer periphery of the substrate 32. In the present embodiment, the sleeve 34 has a cylindrical shape with a thickness greater than the thickness of the substrate 32. The sleeve 34 is formed with a convex flange 38 at a position where its outer peripheral surface is close to the bottom. The flange 38 is annular in shape with a top surface 380 that is lower than the top surface 320 of the substrate 32 and a bottom surface 382 that is higher than the bottom surface 342 of the sleeve 34. Moreover, the spacing of the top surface 380 of the flange 38 from the top surface 320 of the substrate 32 is greater than the spacing of the bottom surface 382 of the flange 38 from the bottom surface 342 of the sleeve 34. In the present embodiment, the bottom surface 382 of the flange 38 is inclined and tapered toward the bottom surface 342 of the sleeve 34. The inner diameter of the sleeve 34 is uniform from top to bottom, and the outer diameter of the sleeve 34 at a position higher than the flange 38 is greater than the outer diameter at a position lower than the flange 38. The ferrule 36 connects the bottom end of the sleeve 34. The inner diameter of the socket portion 36 is the same as the inner diameter of the sleeve 34, and the outer diameter is smaller than the minimum outer diameter of the sleeve 34. The inner circumferential surface of the socket portion 36, the inner circumferential surface of the sleeve 34, and the bottom surface 322 of the substrate 32 collectively define a cylindrical space 300 for receiving a driving module 60. The space 300 communicates with the space above the substrate 32 through the four perforations 324 of the substrate 32. A thread 360 is formed on the outer circumferential surface of the socket portion 36 for screwing with the base 20.
光源40包括一電路板44及安裝於電路板44上的一發光二極體42。電路板44優選為金屬基電路板(即以金屬作為基底，然後依次在金屬基底上形成絕緣層及電路層)，以提供較強的導熱能力。發光二極體42的晶片(圖未示)直接安裝於電路板44(chip on Board)上，由此，晶片工作時所產生的熱量可直接傳導至電路板44上，從而提升傳熱效率。發光二極體42的晶片優選為由氮化鎵、氮化銦鎵、氮化鋁銦鎵等半導體發光材料製成，其在受到電流激發下將發出藍色的光線。晶片的二電極通過二導線或者通過倒裝技術直接連接於電路板44的二電極(圖未示)上，從而與電路板44電導通。發光二極體42還包括覆蓋晶片的封裝層(圖未示)。封裝層優選由透光性材料製成，如環氧樹脂、矽膠等等。封裝層內進一步摻雜有螢光粉。螢光粉可由釔鋁石榴石、矽酸鹽、氧化物、氮氧化物等螢光材料製成，其可在晶片藍光的激發下發出黃光，進而與藍光混合成白光。電路板44的二電極通過穿過基板32穿孔324的導線70與驅動模組60連接，從而為晶片提供電能。The light source 40 includes a circuit board 44 and a light emitting diode 42 mounted on the circuit board 44. The circuit board 44 is preferably a metal-based circuit board (i.e., a metal is used as a substrate, and then an insulating layer and a circuit layer are sequentially formed on the metal substrate) to provide a strong thermal conductivity. The wafer (not shown) of the light-emitting diode 42 is directly mounted on the chip on board 44, whereby heat generated during operation of the wafer can be directly conducted to the circuit board 44, thereby improving heat transfer efficiency. The wafer of the light-emitting diode 42 is preferably made of a semiconductor light-emitting material such as gallium nitride, indium gallium nitride or aluminum indium gallium nitride, which emits blue light when excited by current. The two electrodes of the wafer are directly connected to the two electrodes (not shown) of the circuit board 44 through two wires or by flip chip technology, thereby being electrically connected to the circuit board 44. The LED 42 further includes an encapsulation layer (not shown) covering the wafer. The encapsulating layer is preferably made of a light transmissive material such as epoxy resin, silicone rubber or the like. The encapsulation layer is further doped with phosphor powder. The phosphor powder can be made of a fluorescent material such as yttrium aluminum garnet, citrate, oxide, oxynitride, etc., which can emit yellow light under excitation of the blue light of the wafer, and then mix with blue light to form white light. The two electrodes of circuit board 44 are coupled to drive module 60 by wires 70 that pass through holes 324 in substrate 32 to provide electrical energy to the wafer.
燈罩50由金屬材料一體形成。優選地，本新型採用鋁作為燈罩50的材料，以使燈罩50具有較高的散熱能力。燈罩50的厚度小於基板32的厚度。燈罩50包括一殼體52及形成於殼體52底端的一折邊54。折邊54從殼體52底部豎直向下延伸。折邊54呈圓環狀，其內徑大於或等於套筒34位於凸緣38上方的外徑。由此，折邊54可套設於套筒34外側周面上，從而將燈罩50卡接於燈座30上。折邊54的外徑小於凸緣38的外徑，因此，折邊54在套設於套筒34上之後，將會抵接於凸緣38的頂面380，從而防止整個燈座30陷入燈罩50內。由於燈罩50可直接通過折邊54卡接於燈座30上，因而燈罩50與燈座30之間的組裝十分方便，從而簡化整個燈具10的組裝過程。殼體52的上半部分呈半球狀，下半部分呈朝下漸縮的錐形。殼體52上均勻開設多個開孔520，這些開孔520至少有兩種不同的尺寸。這些開孔520可以為相同的形狀，例如都為圓形、橢圓形、三角形等。這些開孔520的尺寸可以是每一行開孔520的尺寸與與其相鄰的兩行之間的開孔520的尺寸均不同，例如，可以沿預定方向逐漸增大或縮小，即，開孔520的尺寸自殼體52的頂部至底部逐漸減小，也就是說位於殼體52的頂部的開孔520的尺寸最大，位於殼體52的底部的開孔520的尺寸最小。本實施例中，這些開孔520的尺寸自殼體52的頂部至殼體52的底部逐漸減小。由於位於殼體52頂部的開孔520的尺寸最大，從而允許燈具10更多的正向出射光線從頂部尺寸較大的開孔520出射，因此提高燈具10正向出光強度，形成較為集中的正向出光光場。這些開孔520從殼體52的頂部延伸至靠近殼體52底部的位置處。這些開孔520呈多行環設於殼體52的整個外側周面上。其中，最上面一行的開孔520的數量最少，其尺寸也最大，各行開孔520的數量從殼體52頂部朝向殼體52中部逐漸增多，並從殼體52中部朝向殼體52底部又逐漸減少。換句話說，各行開孔520的數量與殼體52的外徑保持一致的變化趨勢。本實施例中，基板32的高度與最下面一行的開孔520的高度齊平。因此，在燈罩50與燈座30組裝之後，發光二極體42要高於位於最下面一行的開孔520，並大致與下面倒數第二行的開孔520齊平。當然，考慮到安全原因，發光二極體42的高度還可以低於最下面一行開孔520(如圖6所示)，從而避免從開孔520中直接看到發光二極體42。The globe 50 is integrally formed of a metal material. Preferably, the present invention uses aluminum as the material of the lamp cover 50 to provide the lamp cover 50 with a high heat dissipation capability. The thickness of the globe 50 is less than the thickness of the substrate 32. The lamp cover 50 includes a housing 52 and a flange 54 formed at a bottom end of the housing 52. The hem 54 extends vertically downward from the bottom of the housing 52. The hem 54 is annular and has an inner diameter greater than or equal to the outer diameter of the sleeve 34 above the flange 38. Thus, the flange 54 can be sleeved on the outer circumferential surface of the sleeve 34 to engage the lamp cover 50 with the socket 30. The outer diameter of the flange 54 is smaller than the outer diameter of the flange 38. Therefore, after the sleeve 54 is sleeved on the sleeve 34, it will abut against the top surface 380 of the flange 38, thereby preventing the entire socket 30 from falling into the lampshade. Within 50. Since the lamp cover 50 can be directly engaged with the lamp holder 30 through the flange 54, the assembly between the lamp cover 50 and the lamp holder 30 is very convenient, thereby simplifying the assembly process of the entire lamp 10. The upper half of the housing 52 has a hemispherical shape, and the lower half has a tapered shape that tapers downward. A plurality of openings 520 are uniformly formed in the housing 52, and the openings 520 have at least two different sizes. These openings 520 may be of the same shape, for example, both circular, elliptical, triangular, and the like. The size of the openings 520 may be such that the size of each row of openings 520 is different from the size of the openings 520 between two rows adjacent thereto, for example, may gradually increase or decrease in a predetermined direction, that is, the opening 520 The dimensions taper from the top to the bottom of the housing 52, that is, the opening 520 at the top of the housing 52 is the largest, and the opening 520 at the bottom of the housing 52 is the smallest. In this embodiment, the size of the openings 520 gradually decreases from the top of the housing 52 to the bottom of the housing 52. Since the size of the opening 520 located at the top of the casing 52 is the largest, thereby allowing more positive outgoing light of the lamp 10 to exit from the opening 520 having a larger top size, the positive light intensity of the lamp 10 is increased, and a more concentrated positive is formed. To the light field. These openings 520 extend from the top of the housing 52 to a position near the bottom of the housing 52. These openings 520 are arranged in a plurality of rows on the entire outer circumferential surface of the casing 52. Wherein, the number of the openings 520 of the uppermost row is the smallest, and the size thereof is also the largest. The number of the openings 520 of each row gradually increases from the top of the casing 52 toward the middle of the casing 52, and gradually increases from the middle of the casing 52 toward the bottom of the casing 52. cut back. In other words, the number of rows of openings 520 is consistent with the outer diameter of the housing 52. In this embodiment, the height of the substrate 32 is flush with the height of the opening 520 of the lowermost row. Therefore, after the lampshade 50 is assembled with the lamp holder 30, the light-emitting diode 42 is higher than the opening 520 located at the lowermost row and is substantially flush with the opening 520 of the penultimate row below. Of course, for safety reasons, the height of the LED 42 can also be lower than the lower row of openings 520 (as shown in FIG. 6), thereby avoiding direct viewing of the LED 42 from the opening 520.
如圖7所示，為本新型的第三實施例，這些開孔520還可以包括尺寸不同的第一開孔521和第二開孔522，第一開孔521和第二開孔522均為圓形，第一開孔521的直徑大於第二開孔522的直徑。第一開孔521在殼體52上的“M”字形的區域內排布，在其他區域均勻分佈有直徑較小的第二開孔522。當這些尺寸不同的開孔520在不同區域呈現不同的排布方式時，燈具10在呈“M”字形的開口處發出光線形成的光場呈現“M”字形，在其他區域內呈現均勻的光場，不但使燈具10呈現不同的光照效果，還能夠從外形上使燈具10具有一定的標誌性和辨識度，以利於不同的品牌採用這種燈具作為自己的特色照明燈具，有較大的市場前景。此外，開孔520還可以包含三種甚至多種不同的尺寸，且可根據實際的需求排布在燈罩50不同的位置，組成不同的圖案或者文字。As shown in FIG. 7 , in the third embodiment of the present invention, the openings 520 may further include a first opening 521 and a second opening 522 having different sizes, and the first opening 521 and the second opening 522 are both The diameter of the first opening 521 is larger than the diameter of the second opening 522. The first opening 521 is arranged in the "M" shaped area on the housing 52, and the second opening 522 having a smaller diameter is evenly distributed in other areas. When the openings 520 having different sizes exhibit different arrangement modes in different regions, the light field formed by the light emitted by the lamp 10 at the opening of the "M" shape exhibits an "M" shape, and uniform light is emitted in other regions. The field not only makes the luminaire 10 exhibit different illumination effects, but also can make the luminaire 10 have certain symbolicity and recognition from the appearance, so that different brands can use the luminaire as their own characteristic lighting fixture, and there is a larger market. prospect. In addition, the opening 520 can also include three or more different sizes, and can be arranged at different positions of the lamp cover 50 according to actual needs to form different patterns or characters.
由於燈罩50是由金屬製成，因而其內側壁面具備較高的反射率。發光二極體42發出的一部分光線會直接從燈罩50的開孔520中出射，還有一部分光線會直接照射至燈罩50的內側壁面，然後經由內側壁面的反射從燈罩50的開孔520出射。由於燈罩50內側壁面的反射率較高，因而光線在反射過程中損耗較少，從而使最終的出光效率得到提升。並且，由於開孔520是基本遍佈於整個殼體52上的，再加上光線在殼體52內側壁面上的各方向的反射，因此，從開孔520中射出的光可朝向各個角度及方位出射，從而使整個燈具10獲得近乎360度的全景照明效果。此外，為了增加燈罩50內表面的反射效率，可在燈罩50的內表面進一步塗鍍反射膜。由於開孔520的尺寸大小不同，當光線通過這些尺寸不相同的開孔520時，經過尺寸較大的開孔520所形成的光場效果與經過尺寸較小的開孔520所形成的光場效果不同，該兩種不同效果的光場相疊加，從而使燈具10最終的光場效果不同於僅採用相同尺寸的開孔的燈具。再者，燈罩50是金屬製造並直接套設於燈座30上的，因此發光二極體42產生熱量可通過燈座30傳輸至燈罩50上，然後經由燈罩50散發至外界環境當中，從而提升整個燈具10的散熱效率。當然，由於燈座30本身也是採用導熱性材料製造，並且也是直接暴露於外界環境當中，因此發光二極體42傳導至燈座30的熱量也可以直接從燈座30散發至外界環境當中。最後，由於燈罩50的內部空間是通過開孔520與外界環境連通的，因此發光二極體42所產生的熱量還可直接散發到發光二極體42周圍的空氣當中，然後這部分被加熱的空氣經由開孔520直接對流至外界環境當中。即是說，本新型的燈具10至少有三條散熱路徑：第一條是經由燈座30傳遞至燈罩50向外散熱，第二條是直接由燈座30向外散熱，第三條是由燈罩50內的空氣通過開孔520與燈罩50外的空氣對流散熱。Since the lamp cover 50 is made of metal, its inner wall surface has a high reflectance. A part of the light emitted from the LED 42 is directly emitted from the opening 520 of the lamp cover 50, and a part of the light is directly incident on the inner wall surface of the lamp cover 50, and then is emitted from the opening 520 of the lamp cover 50 through the reflection of the inner wall surface. Since the reflectance of the inner side wall surface of the lamp cover 50 is high, the light is less lost during the reflection process, so that the final light extraction efficiency is improved. Moreover, since the opening 520 is substantially distributed over the entire casing 52, and the light is reflected in various directions on the inner wall surface of the casing 52, the light emitted from the opening 520 can be directed to various angles and orientations. The exit is such that the entire luminaire 10 achieves a nearly 360 degree panoramic illumination effect. Further, in order to increase the reflection efficiency of the inner surface of the globe 50, a reflective film may be further coated on the inner surface of the globe 50. Due to the different sizes of the openings 520, when the light passes through the openings 520 having different sizes, the light field effect formed by the larger opening 520 and the light field formed by the smaller opening 520 are formed. The effect is different, the light fields of the two different effects are superimposed, so that the final light field effect of the luminaire 10 is different from that of the luminaire using only the same size opening. Moreover, the lamp cover 50 is made of metal and directly sleeved on the lamp holder 30. Therefore, heat generated by the LED body 42 can be transmitted to the lamp cover 50 through the lamp holder 30, and then radiated to the external environment via the lamp cover 50, thereby lifting The heat dissipation efficiency of the entire luminaire 10. Of course, since the lamp holder 30 itself is also made of a heat conductive material and is also directly exposed to the external environment, the heat conducted by the light emitting diode 42 to the lamp holder 30 can also be directly radiated from the lamp holder 30 to the external environment. Finally, since the inner space of the lamp cover 50 is in communication with the external environment through the opening 520, the heat generated by the light-emitting diode 42 can be directly radiated into the air around the light-emitting diode 42, and then this portion is heated. Air is directly convected through the opening 520 to the outside environment. That is to say, the lamp 10 of the present invention has at least three heat dissipation paths: the first piece is radiated to the lamp cover 50 via the lamp holder 30, the second piece is directly radiated to the outside of the lamp holder 30, and the third piece is covered by the lamp cover. The air in 50 passes through the opening 520 to convect heat with the air outside the lamp cover 50.
燈頭20為一通用的燈泡型燈頭，其可與習知的燈泡插座(圖未示)匹配。燈頭20包括一環狀的側壁22、一接點24及一連接接點24及側壁22的絕緣帶26。側壁22的外側周面及內側周面形成對應的螺紋220。側壁22套設於燈座30的套接部36上，其內螺紋220與套接部36的螺紋360干涉配合，從而將燈頭20與燈座30固定。側壁22的外螺紋220用於與習知的燈泡插座的內螺紋配合，從而將燈具10與燈泡插座固定連接。側壁22及接點24均採用金屬材料製成，絕緣帶26連接側壁22及接點24而將二者絕緣。驅動模組60通過二導線70分別連接側壁22及接點24，從而接收自燈頭20輸入的電能。由於燈座30是採用絕緣的陶瓷材料製造，因此金屬燈罩50可與燈頭20通過燈座30絕緣，從而避免燈罩50帶電。The base 20 is a universal bulb-type base that can be mated with conventional bulb sockets (not shown). The base 20 includes an annular side wall 22, a contact 24, and an insulating strip 26 connecting the contacts 24 and the side walls 22. The outer circumferential surface and the inner circumferential surface of the side wall 22 form corresponding threads 220. The side wall 22 is sleeved on the sleeve portion 36 of the socket 30, and the internal thread 220 is interference-fitted with the thread 360 of the socket portion 36 to fix the base 20 to the socket 30. The external threads 220 of the side walls 22 are adapted to mate with the internal threads of a conventional bulb socket to securely attach the luminaire 10 to the bulb socket. Both the side wall 22 and the contact 24 are made of a metal material, and the insulating tape 26 is connected to the side wall 22 and the contact 24 to insulate the two. The driving module 60 is connected to the side wall 22 and the contact 24 through the two wires 70 to receive the electric energy input from the lamp cap 20. Since the lamp holder 30 is made of an insulating ceramic material, the metal lamp cover 50 can be insulated from the lamp cap 20 by the lamp holder 30, thereby preventing the lamp cover 50 from being charged.
本新型之技術內容及技術特點已揭示如上，然而熟悉本項技術之人士仍可能基於本新型之教示及揭示而作種種不背離本新型精神之替換及修飾。因此，本新型之保護範圍應不限於實施例所揭示者，而應包括各種不背離本新型之替換及修飾，並為以下之申請專利範圍所涵蓋。The technical content and technical features of the present invention have been disclosed as above, but those skilled in the art can still make various substitutions and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should not be limited by the scope of the invention, but should be construed as being included in the appended claims.
10‧‧‧燈具10‧‧‧Lighting
20‧‧‧燈頭20‧‧‧ lamp holder
30‧‧‧燈座30‧‧‧ lamp holder
50‧‧‧燈罩50‧‧‧shade
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201603187UCN203231131U (en) | 2013-04-02 | 2013-04-02 | lamps |
| Publication Number | Publication Date |
|---|---|
| TWM493635Utrue TWM493635U (en) | 2015-01-11 |
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102206434UTWM493635U (en) | 2013-04-02 | 2013-04-10 | Lamp |
| Country | Link |
|---|---|
| CN (1) | CN203231131U (en) |
| TW (1) | TWM493635U (en) |
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104696772A (en)* | 2013-12-09 | 2015-06-10 | 欧普照明股份有限公司 | Lamp and optical module thereof |
| CN103883972A (en)* | 2014-04-04 | 2014-06-25 | 江苏达伦电子股份有限公司 | Lampshade |
| CN104456220A (en)* | 2014-12-10 | 2015-03-25 | 欧普照明股份有限公司 | Illuminating device |
| Publication number | Publication date |
|---|---|
| CN203231131U (en) | 2013-10-09 |
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| MM4K | Annulment or lapse of a utility model due to non-payment of fees |